TWI696302B - Light emitting diode array package structure with high thermal conductivity - Google Patents

Abstract

A light emitting diode (LED) array package structure with high thermal conductivity includes a package substrate, a light emitting diode array, a high thermal conductive color conversion layer and a transparent ceramic substrate. The high thermal conductive color conversion layer is made of a mixture of transparent optical resin, phosphor powder and transparent ceramic filler, and is directly dispensed on the LED array and the package substrate. The transparent ceramic substrate is in direct contact with the upper surface of the high thermal conductive color conversion layer. A portion of the transparent ceramic filler contacts the package substrate while another portion is in contact with the transparent ceramic substrate. The conduction and radiation heat generated by the high thermal conductive color conversion layer itself due to color conversion, and the conductive heating caused by the LED chips, both can be removed through either the package substrate or the transparent ceramic substrate, thereby improving the white light output power and being suitable for implementing with polymeric optical components to reduce glare and enhance luminous efficiency.

Description

Light-emitting diode array packaging structure with high heat conduction effect

The invention relates to a packaging structure of a light-emitting diode, in particular to a packaging structure of a light-emitting diode array capable of solving the problems of high temperature and glare at the same time.

If the conventional light-emitting diode lighting device uses a high-brightness white light-emitting diode light source with a brightness greater than 1000 lumens, the light source part usually needs to use a blue light-emitting diode array packaged in the form of a two-dimensional array, and The blue light emitting diode array is covered with a yellow fluorescent layer for conversion of light emitting color.

As shown in FIG. 1, a conventional chip on board (COB) structure 100 (chip on board, COB) of a light emitting diode array is disposed on a heat sink 300. The chip direct packaging structure 100 includes a packaging substrate 110, a plurality of blue light-emitting diode chips 122, and a yellow fluorescent layer 130. The packaging substrate 110 has a circuit layer 112 and an insulating layer 114. The insulating layer 114 is located above the circuit layer 112. Each two adjacent blue light-emitting diode chips 122 are connected by a bonding wire 124 or flip-chip bonding, and arranged into a two-dimensional blue light-emitting diode array 120. The blue light emitting diode array 120 is directly mounted on the insulating layer 114 of the packaging substrate 110 and electrically connected to the circuit layer 112. The yellow fluorescent layer 130 is a silicone layer containing dispersed fluorescent powder, directly covering each Above and around the blue light emitting diode chip 122. The heat flow path when the blue light emitting diode array 120 emits light is shown by arrows in FIG. 1. A part of the heat is directly conducted upward to the yellow fluorescent layer 130; the other part of the heat is conducted downward through the package substrate 110 and then conducted to the heat sink 300 to be removed.

In the direct chip packaging structure 100, a part of the blue light emitted by the blue light-emitting diode chip 122 is converted into yellow light with a longer wavelength by the yellow fluorescent layer 130, and another part of the unconverted blue light passes through the yellow fluorescent layer 130 Mixed with yellow light to make white light. The output of white light is generally affected by two factors: one is that the temperature of the yellow fluorescent layer 130 rises due to the conversion of the wavelength of light; the second is that the blue light-emitting diode chip 122 heats the surrounding yellow fluorescent layer 130.

The first factor is that the color conversion efficiency of the yellow fluorescent layer 130 is not 100%, so when the blue light is converted into yellow light through the yellow fluorescent layer 130, there will be a problem of heat generation. When the temperature of the yellow fluorescent layer 130 is higher, the color conversion The lower the efficiency. This heat generation problem also affects the light output of the blue light-emitting diode chip 122. In the conventional chip direct packaging structure 100, the heat generated by the yellow fluorescent layer 130 during color conversion is also conducted to the heat sink 300 for removal.

The second factor is that the blue light emitting diode chip 122 is packaged inside the yellow fluorescent layer 130, and the thickness of the yellow fluorescent layer 130 is about hundreds of μm, but the material of the yellow fluorescent layer 130 has a relatively low thermal conductivity. Therefore, when the blue light-emitting diode chip 122 generates heat, the temperature of the yellow fluorescent layer 130 itself may easily increase and the luminous efficiency may decrease. The temperature of the surface of the yellow fluorescent layer 130 will be greater than 150 when inputting 10W of power. To install secondary optical elements on its adjacent surface, a reflective lampshade or glass lens that can withstand high temperatures must be used. Polymer optics cannot be used. Material made of secondary optical components.

In view of this, if the small-sized package structure can be maintained, the above two factors affecting the white light output can be solved, and a polymer secondary optical element that could not be used can be used. High white light brightness and eliminating glare can improve the quality of white light output and have the advantage of low cost.

An object of the present invention is to provide a light-emitting diode array packaging structure with high thermal conductivity, which can simultaneously meet the requirements of small size, high brightness, anti-glare, heat dissipation and cost reduction.

In order to achieve the above object, the present invention provides a light emitting diode array packaging structure with high thermal conductivity, including a packaging substrate, a light emitting diode array, a high thermal conductivity color conversion layer, and a transparent thermal conductive substrate. The packaging substrate is disposed on a heat sink, and has a circuit layer and an insulating layer, the insulating layer is located above the circuit layer. The light-emitting diode array includes a plurality of light-emitting diode chips arranged in an array, wherein each light-emitting diode chip is directly mounted on the insulating layer of the packaging substrate and electrically connected to the circuit layer. The high thermal conductivity color conversion layer is directly filled on the light-emitting diode array and its packaging substrate, and includes transparent adhesive material, phosphor powder and transparent ceramic filler, wherein the phosphor powder and transparent ceramic filler are mixed into the transparent adhesive material, And a part of the transparent ceramic filler contacts the packaging substrate to form a heat conduction path. The transparent thermal conductive substrate directly covers and contacts the upper surface of the high thermal conductivity color conversion layer, and contacts another part of the transparent ceramic filler to form another thermal conduction path.

In one embodiment, the transparent ceramic filler is in powder form and its particle size is in the nanometer range. The weight percentage of the nano-grade transparent ceramic filler relative to the transparent adhesive material is, for example, greater than 0% and less than or equal to 10%; or greater than 0% and less than or equal to 20%. The materials of nano-scale transparent ceramic filler and transparent thermal conductive substrate can be selected from aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ), magnesium aluminum spinel (MgAl ₂ O ₄ , spinel), aluminum oxynitride (AlON, aluminum oxynitride), quartz and glass. Preferably, the materials of both the nano-grade transparent ceramic filler and the transparent heat-conducting substrate are the same.

In an embodiment, the above-mentioned LED array packaging structure with high thermal conductivity further includes: a first thermal conductive frame, a reflective polarizer, and a second thermal conductive frame. The first heat conducting frame connects the periphery of the transparent heat conducting substrate and the heat sink. The reflective polarizer is disposed above the transparent heat conductive substrate, and there is an air gap between the reflective polarizer and the transparent heat conductive substrate. The second heat conduction frame connects the periphery of the reflective polarizer and the heat sink. Each of the first heat conduction frame and the second heat conduction frame is fixed to the heat sink with a high heat conduction screw.

According to the structure of the present invention, both the radiation and conduction heat generated by the high thermal conductivity color conversion layer itself during color conversion, or the conduction heat generated by the high thermal conductivity color conversion layer by the light-emitting diode chip can be The transparent heat-conducting substrate and its heat-conducting frame, or the package substrate are transferred to the heat sink and removed, which can effectively reduce the temperature of the heat radiation and the color conversion layer reaching the space above the transparent heat-conducting substrate. Therefore, in addition to a glass substrate polarizer, a reflective polarizer made of a polymer material with a low thermal conductivity can be used above the transparent thermally conductive substrate of the present invention, thereby reducing costs, improving white light output efficiency, and reducing glare.

100: chip direct packaging structure

110: package substrate

112: circuit layer

114: Insulation

120: Blue light emitting diode array

122: Blue light emitting diode chip

124: Bonding wire

130: yellow fluorescent layer

200: LED array packaging structure

210: package substrate

212: Circuit layer

214: Insulation

220: LED array

222: LED chip

224: Bonding wire

230: High thermal conductivity color conversion layer

232: Transparent ceramic filler

234: phosphor powder

236: Transparent plastic

240: Transparent thermal conductive substrate

250: Thermal paste layer

260: Wall glue

270: The first heat conduction frame

272: High thermal conductivity screw

280: Second heat conduction frame

290: reflective polarizer

292: Air gap

300: radiator

C1: (surface temperature of COB LED when transparent heat conductive substrate is added) curve

C2: (COB LED surface temperature when no transparent heat conductive substrate is added) curve

FIG. 1 is a schematic diagram of a chip direct packaging structure of a conventional light emitting diode array.

2 is a schematic diagram of a light emitting diode array package structure with high thermal conductivity effect according to an embodiment of the present invention.

Fig. 2A is the luminous flux and surface temperature change curve of the 8W COB LED high thermal conductivity color conversion layer with and without the addition of a transparent thermal conductive substrate.

Figure 3 is an embodiment of the present invention, a light-emitting diode with high thermal conductivity and low glare effect Schematic diagram of the body array packaging structure.

4 is a schematic diagram of the heat conduction direction according to an embodiment of the invention.

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description with reference to one of the preferred embodiments of the drawings. Directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only used to refer to the directions of the accompanying drawings. Therefore, these directional terms are only used for illustration and not for limiting the present invention.

2 is an embodiment of the present invention, a light emitting diode array packaging structure 200 with high thermal conductivity effect includes a packaging substrate 210, a light emitting diode array 220, a high thermal conductivity color conversion layer 230 and a transparent thermal conductive substrate 240 . The light emitting diode array 220 is directly mounted on the packaging substrate 210. In particular, in this embodiment, the transparent ceramic filler 232 and the fluorescent powder 234 are mixed into the transparent adhesive 236 to form a modified composite fluorescent adhesive material. The modified composite fluorescent glue material is coated on the blue light-emitting diode array 220 to form a high thermal conductivity color conversion layer 230. A transparent thermal conductive substrate 240 is placed above the high thermal conductivity color conversion layer 230 to absorb and isolate the radiant heat and conduction heat generated by the phosphor 234 during the color conversion process. It should be noted that the present invention is not the same as the conventional "distance phosphor coating technology". The "distance phosphor coating technology" isolates the phosphor layer from the LED array, but In the present invention, the high thermal conductivity color conversion layer 230 containing phosphor 234 is directly filled on the light emitting diode array 220.

A circuit layer 212 and an insulating layer 214 are provided on the upper surface of the package substrate 210. The circuit layer 212 is connected to a source of electrical signals. The insulating layer 214 is located above the circuit layer 212. The light-emitting diode array 220 is composed of a plurality of light-emitting diode chips 222 arranged in an array, and a bonding wire 224 is connected between every two adjacent light-emitting diode chips 222. Each LED chip 222 is directly mounted on the package The insulating layer 214 of the mounting substrate 210 is electrically connected to the circuit layer 212. The high thermal conductivity color conversion layer 230 directly covers the light emitting diode array 220, so that a part of the transparent ceramic filler 232 contacts the lower package substrate 210, which can enhance the downward heat conduction effect; the other part of the transparent ceramic filler 232 is It is in contact with the transparent heat conductive substrate 240 above, which can enhance the upward heat conduction effect. The transparent heat conductive substrate 240 directly covers and contacts the upper surface of the high thermal conductivity color conversion layer 230 to absorb and isolate radiant heat and conduction heat. The wall glue 260 is disposed between the packaging substrate 210 and the transparent heat conductive substrate 240 and surrounds the light emitting diode array 220 to protect the light emitting diode array 220 and fix the high thermal conductivity color conversion layer 230.

In addition, the LED array packaging structure 200 is disposed on a heat sink 300. In order to increase the heat conduction efficiency between the package substrate 210 and the heat sink 300, a heat dissipation paste layer 250 is coated between the package substrate 210 and the heat sink 300, so that the heat is quickly led out of the package substrate 210 to enhance the high thermal conductivity color conversion layer The heat conduction effect of the lower surface of 230 to the heat sink 300 is heat dissipation. In this way, the transparent ceramic filler 232, the package substrate 210, the heat dissipation paste layer 250 and the heat sink 300 are connected to form a downward heat conduction path.

The periphery of the transparent heat-conducting substrate 240 is fixed by a heat-conducting frame 270 made of a high-heat-conducting material, and is connected to the heat sink 300 through the heat-conducting frame 270 to form another heat conduction path for directly conducting the radiant heat received to the heat sink 300 To strengthen the heat dissipation effect. The heat conductive frame 270 may provide the transparent heat conductive substrate 240 to directly dissipate heat to the heat sink 300 without passing through the package substrate 210 of the light emitting diode array 220.

In one embodiment, the light-emitting diode array 220 uses an array formed by a blue light-emitting diode chip 222. The high thermal conductivity color conversion layer 230 uses a silicone layer containing a mixture of yellow phosphor 234 and high thermal conductivity nano-level transparent ceramic filler 232. The characteristics and functions of the high thermal conductivity color conversion layer 230 are as follows: (1) Its refractive index is greater than that of the conventional transparent adhesive layer, so it can increase the blue light extraction efficiency, that is Reduce the total reflection effect on the surface of the blue light-emitting diode chip 222; (2) Its thermal conductivity is greater than that of the conventional fluorescent glue layer, so it can reduce the high temperature generated by the wavelength conversion effect caused by the absorption of blue light on the surface of the yellow phosphor 234, And reduce the heating effect of the blue light-emitting diode chip 222, so that the high temperature and heat radiation generated on the surface is lower than the conventional fluorescent glue layer.

In the high thermal conductivity color conversion layer 230, the material of the nano-grade transparent ceramic filler 232 may be aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ), magnesium aluminum spinel (MgAl ₂ O ₄ , spinel) , Aluminum oxynitride (AlON, aluminum oxynitride), or powder and granules of quartz and glass, etc., preferably aluminum nitride powder or aluminum oxynitride powder. The mixing ratio of the nano-grade transparent ceramic filler 232 to the transparent adhesive 236 is, for example, greater than 0% and less than or equal to 20%; preferably, it is greater than 0% and less than or equal to 10% by weight. For example: 2%, 5% or 7%.

The main material of the transparent thermal conductive substrate 240 is a ceramic that is highly transparent to light and has a high thermal conductivity, such as aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ), magnesium aluminum spinel (MgAl ₂ O ₄ , Spinel ), aluminum oxynitride (AlON, Aluminium oxynitride), etc., or quartz and glass, but not limited to these materials. In one embodiment, the transparent thermally conductive substrate 240 and the transparent ceramic filler 232 in the high thermal conductivity color conversion layer 230 may use the same material, for example, both use aluminum nitride material, and the contact with the same material can accelerate the thermal conductivity.

It is worth mentioning that the structure of the present invention can produce an effect that is difficult for those skilled in the art to anticipate. Generally speaking, "reducing the temperature of the light-emitting diode package structure" and "increasing the brightness of the light-emitting diode package structure" are difficult to balance. If the conventional technology is to maintain brightness, it is necessary to achieve a good temperature reduction effect; usually using high thermal conductivity thermal paste, cold plate (cold plate), heat pipe (heat pipe), high heat dissipation package substrate or forced convection cooling radiator, etc. It can greatly reduce the temperature of the light-emitting diode package structure and can reduce the occurrence of lumen depreciation, which will increase it Packaging cost, and the high temperature of the surface still cannot use the secondary optical element packaging of the polymer substrate. However, the present invention can not only greatly reduce the temperature of the light emitting diode array packaging structure 200 under low cost conditions, but also increase its brightness.

It is known to add other modified filler technology to the fluorescent layer, mostly to change the luminescent characteristics of the fluorescent layer, for example: adding transparent resin or polymethyl methacrylate (Polymethyl methacrylate, PMMA) makes the white light emitted by the light emitting diode more uniform, but this method usually makes the brightness of the light emitting diode packaging structure darker due to the light scattering relationship. In addition, placing a transparent substrate above the light source has the concern of lowering the brightness of the light emission. In view of the possibility of sacrificing brightness, those skilled in the art generally do not want to place the transparent substrate on top of the phosphor layer mixed with the modified filler to increase the heat dissipation path. However, in the present invention, the transparent ceramic filler 232 and the transparent adhesive 236 are mixed in a specific ratio, and then combined with the transparent thermal conductive substrate 240, the brightness of the LED array packaging structure 200 is not significantly reduced as generally expected. After the measurement, the brightness is increased compared to when the transparent thermal conductive substrate 240 is not added, and the surface temperature of the transparent thermal conductive substrate 240 is lower.

Referring to the measurement data of 8W COB LED surface temperature with time in FIG. 2A, curve C1 shows the surface temperature change curve when the structure of FIG. 2 is added with the transparent heat conductive substrate 240; curve C2 is the height of the structure of FIG. 2 after removing the transparent heat conductive substrate 240 The temperature change curve of the surface of the thermal conductive color conversion layer 230. Compared with the structure without the transparent heat conductive substrate 240, the surface temperature of the structure with the transparent heat conductive substrate 240 is lower, but the luminous flux is larger when the same light emitting time passes. Obviously, the structure of the present invention can compensate for the light scattering loss caused by the transparent ceramic filler 232 and further reduce the temperature.

The reason is that the thermal quenching effect of the phosphor 234 will cause the color conversion efficiency of the high thermal conductivity color conversion layer 230 to be attenuated at high temperature and the luminous efficiency of the blue light emitting diode chip 222 will increase with the high thermal conductivity color. The temperature of the conversion layer 230 increases and decreases. But the invention The structure can quickly remove the heat generated by the high thermal conductivity color conversion layer 230 and the blue light-emitting diode chip 222 to improve the luminous efficiency of blue light and yellow light, so the light output of the high thermal conductivity color conversion layer 230 can be increased. For the whole LED array packaging structure 200, the brightness of the air gap 292 above the transparent heat conductive substrate 240 is still increased.

FIG. 3 is a polymer optical element, such as a polymer reflective polarizer 290, mounted on the transparent heat conductive substrate 240 of the embodiment shown in FIG. 2 with an air gap 292 between them. The polymer reflective polarizer 290 is, for example, a reflective nano-wire grid polarizer made of cellulose triacetate (TAC) as a base material. The polymer reflective polarizer 290 is used to form polarized white light and reflect some unconverted blue light, so that the blue light passes down through the high thermal conductivity color conversion layer 230 covered with the transparent thermally conductive substrate 240 to be re-colored Conversion to increase the luminous efficiency of white light and reduce the phenomenon of excessive blue light, thereby increasing white light output and increasing the polarization ratio of white light, and greatly reducing glare.

The periphery of the reflective polarizer 290 is fixed by the thermally conductive frame 280 and connected to the heat sink 300 through the thermally conductive frame 280 to form another heat conduction path to directly conduct the radiant heat received to the heat sink 300. The two heat conducting frames 270 and 280 are made of a metal material with a high thermal conductivity, such as copper, and are fixedly connected to the heat sink 300 with a high heat conducting screw 272. In this embodiment, since the high temperature and thermal radiation generated on the surface of the high thermal conductivity color conversion layer 230 are lower than that of the conventional fluorescent adhesive layer, and the transparent thermal conductive substrate 240 is used to provide the thermal conduction path, the thermal radiation can be effectively prevented from being converted by the high thermal conductivity color The surface of the layer 230 damages the reflective polarizer 290 directly through the air gap 292.

Since the low-cost polymer reflective polarizer 290 used can only be heat-resistant <100°C, the heat-conducting frame 280 is fixed to the heat sink 300 with high heat-conducting screws 272. The heat transferred from the surface of the plate 240 to the polymer reflective polarizer 290 via thermal radiation is then conducted to the heat sink 300 to reduce the temperature of the polymer reflective polarizer 290.

In an embodiment, the contact surface of the package substrate 210 and the heat sink 300, the contact surface of the heat conductive frame 270 and the transparent heat conductive substrate 240, and the contact surface of the heat conductive frame 280 and the reflective polarizer 290 can be uniformly coated with a proper amount of heat dissipating paste, Used to quickly remove heat.

The arrows in FIG. 4 indicate the direction of heat conduction in the light emitting diode array packaging structure 200 of the present invention. There are two heat sources in the LED array packaging structure 200 of this embodiment: one is the heat generated by the blue light-emitting diode chip 222 during the light-emitting process; the second is the yellow phosphor 234 converting the blue light wavelength Radiation and conduction heat due to energy loss at the yellow light wavelength.

Regarding the heat conduction of the first heating source, part of the heat generated by the blue light-emitting diode chip 222 during the light-emitting process is conducted downward through the package substrate 210 to the heat sink 300 for removal, and the other part is conducted upward.

Regarding the heat conduction of the second heat source, the radiation and conduction heat generated by the energy loss during the conversion of the light wavelength of the yellow phosphor 234 is directly conducted to the heat conduction frame 270 through the transparent heat conduction substrate 240, and then is conducted to the heat dissipation by the heat conduction frame 270器300. In this embodiment, a part of the transparent ceramic filler 232 is in contact with the transparent heat-conducting substrate 240 to accelerate the heat transfer speed from the high heat-conducting color conversion layer 230 to the transparent heat-conducting substrate 240. Since most of the radiant heat is removed at the transparent heat-conducting substrate 240, heat can be prevented from radiating upward from the transparent heat-conducting substrate 240 to the reflective polarizer 290.

Then, the heat received by the reflective polarizer 290 is removed by the heat conduction frame 280. In this way, the temperature of the reflective polarizer 290 can be reduced to less than 100°C, which is a temperature range that the polymer plastic material can tolerate. Therefore, in addition to the glass substrate polarizer, this embodiment also allows the use of low Cost polymer reflective polarizer 290.

In this embodiment, the high thermal conductivity color conversion layer 230 and the transparent thermally conductive substrate 240 are combined with the polymer reflective polarizer 290, and the transparent thermally conductive substrate 240 and the polymer reflective polarizer 290 are fixed by two thermal conductive frames 270 and 280, respectively. The radiant heat received is directly transmitted to the heat sink 300 to achieve a white light emitting diode array package structure 200 with low glare and low surface temperature characteristics.

In summary, the advantages of the present invention are as follows:

1. The heat of the modified composite fluorescent glue layer itself is heated by the color conversion or heated by the blue light-emitting diode. The heat can be directly removed to the heat sink 300 through the transparent thermally conductive substrate 240 on the surface of the body and the thermally conductive frame 270, so as to reduce the surface temperature. A low-cost polymer reflective polarizer 290 is used.

2. The reflective polarizer 290 also directly removes heat to the heat sink 300 through its own heat conducting frame 280, reducing the surface temperature to extend the service life.

However, the above are only the preferred embodiments of the present invention, which should not be used to limit the scope of the implementation of the present invention, that is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the description of the invention, All of them are still covered by the patent of the present invention. In addition, any embodiment or scope of patent application of the present invention does not need to achieve all the objects, advantages, or features disclosed by the invention. In addition, the abstract part and title are only used to assist the search of patent documents, not to limit the scope of the present invention.

200: LED array packaging structure

210: package substrate

212: Circuit layer

214: Insulation

220: LED array

222: LED chip

224: Bonding wire

230: High thermal conductivity color conversion layer

232: Transparent ceramic filler

234: phosphor powder

236: Transparent plastic

240: Transparent thermal conductive substrate

250: Thermal paste layer

260: Wall glue

270: The first heat conduction frame

272: High thermal conductivity screw

280: Second heat conduction frame

300: radiator

Claims (10)

A light-emitting diode array packaging structure with high thermal conductivity effect, suitable for being mounted on a heat sink, includes: A packaging substrate, disposed on the heat sink, and having a circuit layer and an insulating layer, the insulating layer is located on the circuit layer; A light-emitting diode array, including a plurality of light-emitting diode chips arranged in an array, wherein each of the light-emitting diode chips is directly mounted on the insulating layer of the packaging substrate and electrically connected to the circuit Floor; A high thermal conductivity color conversion layer is directly filled on the light emitting diode array and the packaging substrate, the high thermal conductivity color conversion layer includes a transparent adhesive material, phosphor powder and transparent ceramic filler, wherein the phosphor powder and transparent The ceramic filler is mixed into the transparent adhesive material, and a part of the transparent ceramic filler contacts the packaging substrate to form a thermal conduction path; and a transparent thermal conductive substrate directly covers and contacts the upper surface of the high thermal conductivity color conversion layer, and Contact with another part of the transparent ceramic filler to form another thermal conduction path. The light emitting diode array packaging structure with high thermal conductivity effect as described in item 1 of the patent application range, in which the transparent ceramic filler is in powder form and its particle size is in the nanometer range. The light emitting diode array packaging structure with high thermal conductivity effect as described in Item 2 of the patent application scope, wherein the weight percentage of the nano-grade transparent ceramic filler relative to the transparent adhesive material is greater than 0% and less than or equal to 10%. The light emitting diode array packaging structure with high thermal conductivity effect as described in Item 2 of the patent application scope, wherein the weight percentage of the nano-grade transparent ceramic powder relative to the transparent adhesive material is greater than 0% and less than or equal to 20 %. The light emitting diode array packaging structure with high thermal conductivity effect as described in item 2 of the patent application scope, wherein the material of both the nano-grade transparent ceramic filler and the transparent thermal conductive substrate are selected from aluminum nitride (AlN) , Alumina (Al ₂ O ₃ ), magnesium aluminum spinel (MgAl ₂ O ₄ , Spinel), aluminum oxynitride (AlON), quartz and glass. The light emitting diode array packaging structure with high thermal conductivity effect as described in item 5 of the patent application range, wherein the material of the nano-level transparent ceramic filler and the transparent thermal conductive substrate are the same. The light emitting diode array packaging structure with high thermal conductivity as described in item 1 of the patent application scope further includes: A first heat-conducting frame connects the periphery of the transparent heat-conducting substrate to the heat sink. The light emitting diode array packaging structure with high thermal conductivity as described in item 1 of the patent application scope further includes: A reflective polarizer disposed above the transparent thermally conductive substrate, an air gap between the reflective polarizer and the transparent thermally conductive substrate; and A second heat conduction frame connects the peripheral edge of the reflective polarizer and the heat sink. The light emitting diode array packaging structure with high thermal conductivity effect as described in item 8 of the patent application range, wherein the reflective polarizer is selected from one of a glass substrate polarizer and a polymer reflective polarizer. The light emitting diode array packaging structure with high thermal conductivity effect as described in item 1 of the patent application scope, wherein the first thermal conductive frame and the second thermal conductive frame are each fixed to the heat sink with a high thermal conductive screw.

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