WO2020087802A1 - 触控感应组件及电子设备 - Google Patents

触控感应组件及电子设备 Download PDF

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Publication number
WO2020087802A1
WO2020087802A1 PCT/CN2019/075422 CN2019075422W WO2020087802A1 WO 2020087802 A1 WO2020087802 A1 WO 2020087802A1 CN 2019075422 W CN2019075422 W CN 2019075422W WO 2020087802 A1 WO2020087802 A1 WO 2020087802A1
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WO
WIPO (PCT)
Prior art keywords
area
touch sensing
block
binding
touch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/075422
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English (en)
French (fr)
Inventor
唐岳军
李雪云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/462,006 priority Critical patent/US20210325989A1/en
Publication of WO2020087802A1 publication Critical patent/WO2020087802A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers

Definitions

  • the present application relates to the field of display, and in particular to a touch sensing component and electronic equipment.
  • organic light emitting diode displays have attracted much attention as display devices for displaying images.
  • an organic light emitting diode display has self-luminous characteristics and does not use a separate light source, so it can be manufactured thinner and lighter than a display device using a single light source, is relatively easier to implement, and has achieved double-sided display, however
  • the double-sided organic light-emitting diode display needs to be studied to form a touch function on both sides. Most of them are implemented by separately setting a touch sensing layer on both sides, and the process is relatively complicated and the cost is high.
  • the purpose of this application is to provide a touch-sensing component and an electronic device, which have the beneficial effects of reducing process steps and saving costs.
  • This application provides a touch sensing component, including:
  • a base the base includes a first area, a bending area, a second area and a binding area;
  • a touch sensing layer is disposed on the substrate, the touch sensing layer includes a first touch sensing block, a second touch sensing block and a binding block, the first touch sensing The block is disposed on the first area, the second touch sensing block is disposed on the second area, and the binding block is disposed on the binding area;
  • the binding block is electrically connected to the first touch sensing block and the second touch sensing block, and is used to transmit the sensing signals of the first touch sensing block and the second touch sensing block to the touch Control chip
  • the touch sensing layer further includes a third touch sensing block, the third touch sensing The block is arranged on the bending area.
  • the binding area is disposed adjacent to the first area, and is sequentially disposed along the second direction.
  • the binding area is disposed adjacent to the second area, and is sequentially disposed along the second direction.
  • the first direction and the second direction are perpendicular to each other.
  • the first direction and the second direction are perpendicular to each other.
  • the binding area is disposed adjacent to the first area and the second area.
  • the binding area includes a first sub-binding area and a second sub-binding area, and the first sub-binding area is disposed adjacent to the first area, The second sub-binding area is arranged adjacent to the second area;
  • the binding block includes a first sub-binding block and a second sub-binding block, the first sub-binding block is set on the first sub-binding area, and the second sub-binding block is set on The second sub-binding area.
  • This application also provides a touch sensing component, including:
  • a base the base includes a first area, a bending area, a second area and a binding area;
  • a touch sensing layer is disposed on the substrate, the touch sensing layer includes a first touch sensing block, a second touch sensing block and a binding block, the first touch sensing The block is disposed on the first area, the second touch sensing block is disposed on the second area, and the binding block is disposed on the binding area;
  • the binding block is electrically connected to the first touch sensing block and the second touch sensing block, and is used to transmit the sensing signals of the first touch sensing block and the second touch sensing block to the touch Control chip.
  • the first area, the bending area, and the second area are sequentially arranged side by side along the first direction.
  • the binding area is disposed adjacent to the first area, and is sequentially disposed along the second direction.
  • the binding area is disposed adjacent to the second area, and is sequentially disposed along the second direction.
  • the first direction and the second direction are perpendicular to each other.
  • the binding area is disposed adjacent to the first area and the second area.
  • the binding area includes a first sub-binding area and a second sub-binding area, and the first sub-binding area is disposed adjacent to the first area, The second sub-binding area is arranged adjacent to the second area;
  • the binding block includes a first sub-binding block and a second sub-binding block, the first sub-binding block is set on the first sub-binding area, and the second sub-binding block is set on The second sub-binding area.
  • the touch sensing layer further includes a third touch sensing block, and the third touch sensing block is disposed on the bending area.
  • the present application also provides an electronic device, which includes a display screen body and the above-mentioned touch sensing component, and the base of the touch sensing component covers the display screen body, and the touch sensing of the touch sensing component
  • the layer is provided on the side of the substrate away from the display screen body.
  • the present application also provides an electronic device, which includes a display screen body and a touch sensing component, and the substrate of the touch sensing component covers the display screen body;
  • the touch sensing layer of the touch sensing component is disposed on the side of the substrate away from the display screen body; or the touch sensing layer of the touch sensing component is disposed on the side of the substrate close to the display screen body;
  • the touch sensing component includes:
  • a base the base includes a first area, a bending area, a second area and a binding area;
  • a touch sensing layer is disposed on the substrate, the touch sensing layer includes a first touch sensing block, a second touch sensing block and a binding block, the first touch sensing The block is disposed on the first area, the second touch sensing block is disposed on the second area, and the binding block is disposed on the binding area;
  • the binding block is electrically connected to the first touch sensing block and the second touch sensing block, and is used to transmit the sensing signals of the first touch sensing block and the second touch sensing block to the touch Control chip.
  • the first area, the bending area, and the second area are sequentially arranged side by side along the first direction.
  • the binding area is arranged adjacent to the first area, and is sequentially arranged along the second direction.
  • the binding area is arranged adjacent to the second area, and is sequentially arranged along the second direction.
  • the touch-sensing layer by manufacturing the touch-sensing layer on the foldable substrate, the touch-sensing layer can be folded and covered on both surfaces of the electronic device to form a double-sided touch function
  • the layer has the beneficial effects of reducing process steps and saving costs.
  • FIG. 1 is a first schematic structural diagram of a touch-sensing component in an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a second structure of the touch sensing component in the embodiment of the present application.
  • FIG. 3 is a third schematic structural diagram of a touch-sensing component in an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a fourth structure of the touch sensing component in the embodiment of the present application.
  • FIG. 5 is a fifth schematic structural diagram of a touch component in an embodiment of the present application.
  • FIG. 6 is a sixth structural schematic diagram of a touch component in an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a first structure of an electronic device in an embodiment of this application.
  • FIG. 8 is a second schematic structural diagram of an electronic device in an embodiment of this application.
  • FIG. 9 is a third schematic structural diagram of an electronic device in an embodiment of this application.
  • FIG. 10 is a fourth schematic structural diagram of an electronic device in an embodiment of this application.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • FIG. 1 is a schematic diagram of a first structure of a touch-sensing component in an embodiment of the present application.
  • the touch sensing component 100 includes a substrate 10 and a touch sensing layer 20.
  • the touch sensing layer 20 is disposed on the substrate 10.
  • the base 10 is made of a transparent flexible material.
  • the substrate 10 may be polymerized from one or more of the following materials: polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate , Polyaryl compounds and glass fiber reinforced plastics.
  • the touch sensing layer 20 is adopted but not limited to ITO material.
  • the substrate 10 includes a first region 11, a bending region 12, a second region 13 and a binding region 14.
  • the first region 11, the bending region 12 and the second region 13 are sequentially arranged side by side along the first direction, and the binding region 14 is disposed adjacent to the first region.
  • the first direction is the horizontal direction at this time.
  • the touch sensing layer 20 includes a first touch sensing block 21, a second touch sensing block 22 and a binding block 23.
  • the first touch sensing block 21 is disposed on the first area 11
  • the second touch sensing block 22 is disposed on the second area 13
  • the binding block 23 is disposed on the binding area 14.
  • the binding block 23 is electrically connected to the first touch sensing block 21 and the second touch sensing block 22 for connecting the first touch sensing block 21 and the second touch sensing block
  • the sensing signal of 22 is transmitted to the touch chip.
  • FIG. 2 is a second schematic structural diagram of a touch-sensing component in an embodiment of the present application.
  • the difference between the touch sensing device 200 shown in FIG. 2 and the touch sensing device 100 shown in FIG. 1 is that the binding area 14 and the second area 13 of the touch sensing device 200 shown in FIG. 2 are disposed adjacent to each other.
  • the substrate 10 includes a first area 11, a bending area 12, a second area 13 and a binding area 14.
  • the first region 11, the bending region 12 and the second region 13 are sequentially arranged side by side along the first direction, and the binding region 14 is disposed adjacent to the second region.
  • the touch sensing layer 20 includes a first touch sensing block 21, a second touch sensing block 22 and a binding block 23. Wherein, the first touch sensing block 21 is disposed on the first area 11, the second touch sensing block 22 is disposed on the second area 13, and the binding block 23 is disposed on the binding area 14.
  • FIG. 3 is a third schematic structural diagram of a touch-sensing component in an embodiment of the present application.
  • the difference between the touch sensing device 300 shown in FIG. 3 and the touch sensing device 100 shown in FIG. 1 is that the touch layer 20 of the touch sensing device 300 shown in FIG. 3 further includes a third touch sensing block 24.
  • the substrate 10 includes a first area 11, a bent area 12, a second area 13 and a binding area 14.
  • the first region 11, the bending region 12 and the second region 13 are sequentially arranged side by side along the first direction, and the binding region 14 is disposed adjacent to the second region.
  • the touch sensing layer 20 includes a first touch sensing block 21, a second touch sensing block 22, a binding block 23, and a third touch sensing block 24.
  • the first touch sensing block 21 is disposed on the first area 11
  • the second touch sensing block 22 is disposed on the second area 13
  • the binding block 23 is disposed on the binding area 14
  • the third touch sensing block 24 is provided on the bending region 12.
  • FIG. 4 is a fourth structural schematic diagram of the touch-sensing component in the embodiment of the present application.
  • the difference between the touch-sensing component 400 shown in FIG. 4 and the touch-sensing component 100 shown in FIG. 1 is that: the binding area 14 of the touch-sensing component 400 shown in FIG. 4 is the same as the first area 11 and the second area 13 adjacent.
  • the substrate 10 includes a first area 11, a bent area 12, a second area 13 and a binding area 14.
  • the first area 11, the bending area 12 and the second area 13 are sequentially arranged side by side along the first direction, and the binding area 14 is adjacent to the first area 11 and the second area 13. That is, the binding area 14 includes a first sub-binding area 141 and a second sub-binding area 142, the first sub-binding area 141 is adjacent to the first area 11, and the second sub-binding area 142 is connected to the second The areas 13 are arranged adjacently.
  • the first direction is the horizontal direction at this time.
  • the touch sensing layer 20 includes a first touch sensing block 21, a second touch sensing block 22 and a binding block 23.
  • the binding block 23 includes a first sub-binding block 231 and a second sub-binding block 232.
  • the first touch sensing block 21 is disposed on the first area 11
  • the second touch sensing block 22 is disposed on the second area 13
  • the binding block 23 is disposed on the binding area 14
  • the first sub-binding block 231 is disposed On the first sub-binding area 141
  • the second sub-binding block 232 is provided on the second sub-binding area 142.
  • FIG. 5 is a fifth schematic structural diagram of a touch component in an embodiment of the present application.
  • the difference between the touch sensing element 500 shown in FIG. 5 and the touch sensing element 100 shown in FIG. 1 is that the first area 11, the bending area 12 and the second area 13 of the touch sensing element 500 shown in FIG. 5 and The binding regions 14 are sequentially arranged along the second direction, where the second direction is perpendicular to the first direction.
  • the substrate 10 includes a first area 11, a bent area 12, a second area 13 and a binding area 14.
  • the first area 11, the bending area 12, the second area 13 and the binding area 14 are sequentially arranged along the second direction.
  • the second direction is the vertical direction at this time.
  • the touch sensing layer 20 includes a first touch sensing block 21, a second touch sensing block 22 and a binding block 23.
  • the first touch sensing block 21 is disposed on the first area 11
  • the second touch sensing block 22 is disposed on the second area 13
  • the binding block 23 is disposed on the binding area 14.
  • FIG. 6 is a sixth structural schematic diagram of the touch component in the embodiment of the present application.
  • the difference between the touch sensing element 600 shown in FIG. 6 and the touch sensing element 500 shown in FIG. 5 is that the touch layer 20 of the touch sensing element 600 shown in FIG. 6 further includes a third touch sensing block 24.
  • the substrate 10 includes a first area 11, a bending area 12, a second area 13 and a binding area 14. Among them, the first area 11, the bending area 12, the second area 13 and the binding area 14 are sequentially arranged along the second direction. It should be noted that the second direction is the vertical direction at this time.
  • the touch sensing layer 20 includes a first touch sensing block 21, a second touch sensing block 22, a binding block 23, and a third touch sensing block 24. Among them, the first touch sensing block 21 is disposed on the first area 11, the second touch sensing block 22 is disposed on the second area 13, the binding block 23 is disposed on the binding area 14, and the third touch sensing block Set on the bending area 12.
  • An embodiment of the present application further provides an electronic device, which includes: a display screen body and a touch sensing component.
  • the substrate of the touch sensing component covers the display screen body, and the touch sensing layer of the touch sensing component is disposed on the side of the substrate away from the display screen body.
  • the touch-sensing component may be the touch-sensing component 100 shown in FIG. 1, the touch-sensing component 200 shown in FIG. 2, the touch-sensing component 400 shown in FIG. 4, or the one shown in FIG. 5 'S touch sensing component 500. Taking the touch sensing component as shown in FIG. 1 as an example for description.
  • FIG. 7 is a first schematic structural diagram of an electronic device in an embodiment of the present application.
  • the electronic device 700 includes a display screen body 701 and a touch sensing component 100.
  • the display screen body 701 includes a first display surface 711, a second display surface 721, and a side surface 731 disposed between the first display surface 711 and the second display surface 721.
  • the touch sensing component 100 includes a substrate 10 and a touch sensing layer 20.
  • the substrate 10 covers the display body 701, and the touch sensing layer 20 is disposed on a surface of the substrate 10 away from the display body 701.
  • the touch sensing layer 20 includes a first touch sensing block 21 and a second touch sensing block 22, the first touch sensing block 21 is disposed on the first display surface 711, and the second touch sensing block 22 is disposed on the first Two on the display surface 721.
  • the touch sensing component may be the touch sensing component 300 shown in FIG. 3 or the touch sensing component 600 shown in FIG. 6. Taking the touch sensing component as the touch sensing component shown in FIG. 3 as an example for description.
  • FIG. 8 is a second schematic structural diagram of an electronic device in an embodiment of the present application.
  • the electronic device 800 includes a display screen body 701 and a touch sensing component 300.
  • the display screen body 701 includes a first display surface 711, a second display surface 721, and a side surface 731 disposed between the first display surface 711 and the second display surface 721.
  • the touch sensing assembly 300 includes a substrate 10 and a touch sensing layer 20.
  • the substrate 10 covers the display body 701, and the touch sensing layer 20 is disposed on a surface of the substrate 10 away from the display body 701.
  • the touch sensing layer 20 includes a first touch sensing block 21, a second touch sensing block 22, and a third touch sensing block 24.
  • the first touch sensing block 21 is disposed on the first display surface 711
  • the second The touch sensing block 22 is disposed on the second display surface 721, and the third touch sensing block 24 is disposed on the side surface 731.
  • An embodiment of the present application further provides an electronic device, which includes: a display screen body and a touch sensing component.
  • the substrate of the touch sensing component covers the display screen body, and the touch sensing layer of the touch sensing component is disposed on the side of the substrate close to the display screen body.
  • FIG. 9 is a third structural schematic diagram of an electronic device in an embodiment of the present application.
  • the difference between the electronic device 900 shown in FIG. 9 and the electronic device 700 shown in FIG. 7 is that the touch sensing layer 20 is disposed on a surface of the substrate 10 close to the display screen body 701.
  • the touch sensing layer 20 is disposed on a surface of the substrate 10 close to the display screen body 701.
  • FIG. 10 is a fourth schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the difference between the electronic device 1000 shown in FIG. 10 and the electronic device 800 shown in FIG. 8 is that the touch sensing layer 20 is disposed on a surface of the substrate 10 close to the display body 701.
  • the touch sensing layer 20 is disposed on a surface of the substrate 10 close to the display body 701.
  • the touch sensing layer can be bent to cover both surfaces of an electronic device to form a double-sided touch function layer, which has reduced process steps and saving Cost benefit.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • User Interface Of Digital Computer (AREA)

Abstract

本申请提供触控感应组件及电子设备，包括：基底，包括第一区域、弯折区域、第二区域、绑定区域；触控感应层，设置在基底上，包括第一触控感应块、第二触控感应块、及绑定块，第一触控感应块设置在第一区域上，第二触控感应块设置在第二区域上，绑定块设置在绑定区域上；绑定块与第一触控感应块以及第二触控感应块电连接。

Description

触控感应组件及电子设备 技术领域
本申请涉及显示领域，具体涉及一种触控感应组件及电子设备。
 背景技术
目前，有机发光二极管显示器作为用于显示图像的显示设备已备受关注。与液晶显示器设备不同，有机发光二极管显示器具有自发光特性，并且不采用单独的光源，因此可以被制造的比采用单独光源的显示设备薄和轻，相对更容易实现并已经实现双面显示，然而双面有机发光二极管显示器要想在两侧都形成触摸功能还待研究，大都是在双面分别单独设置触控感应层来实现，工艺流程比较复杂，成本较高。
因此，现有技术存在缺陷，急需改进。
 技术问题
本申请的目的是提供一种触控感应组件及电子设备，具有减小工艺步骤以及节约成本的有益效果。
 技术解决方案
本申请提供了一种触控感应组件，包括：
基底，所述基底包括第一区域、弯折区域、第二区域以及绑定区域；
触控感应层，所述触控感应层设置在所述基底上，所述触控感应层包括第一触控感应块、第二触控感应块以及绑定块，所述第一触控感应块设置在所述第一区域上，所述第二触控感应块设置在所述第二区域上，所述绑定块设置在所述绑定区域上；
所述绑定块与所述第一触控感应块以及所述第二触控感应块电连接，用于将所述第一触控感应块以及第二触控感应块的感应信号传输至触控芯片；
其中，所述第一区域、所述弯折区域以及所述第二区域沿着第一方向依次并排设置；所述触控感应层还包括第三触控感应块，所述第三触控感应块设置在所述弯折区域上。
在本申请所述的触控感应组件中，所述绑定区域与所述第一区域相邻设置，且沿第二方向依次设置。
在本申请所述的触控感应组件中，所述绑定区域与所述第二区域相邻设置，且沿第二方向依次设置。
在本申请所述的触控感应组件中，所述第一方向与所述第二方向互相垂直。
在本申请所述的触控感应组件中，所述第一方向与所述第二方向互相垂直。
在本申请所述的触控感应组件中，所述绑定区域均与所述第一区域以及所述第二区域相邻设置。
在本申请所述的触控感应组件中，所述绑定区域包括第一子绑定区域以及第二子绑定区域，所述第一子绑定区域与所述第一区域相邻设置，所述第二子绑定区域与所述第二区域相邻设置；
所述绑定块包括第一子绑定块和第二子绑定块，所述第一子绑定块设置在所述第一子绑定区域上，所述第二子绑定块设置在所述第二子绑定区域上。
本申请还提供了一种触控感应组件，包括：
基底，所述基底包括第一区域、弯折区域、第二区域以及绑定区域；
触控感应层，所述触控感应层设置在所述基底上，所述触控感应层包括第一触控感应块、第二触控感应块以及绑定块，所述第一触控感应块设置在所述第一区域上，所述第二触控感应块设置在所述第二区域上，所述绑定块设置在所述绑定区域上；
所述绑定块与所述第一触控感应块以及所述第二触控感应块电连接，用于将所述第一触控感应块以及第二触控感应块的感应信号传输至触控芯片。
在本申请所述的触控感应组件中，所述第一区域、所述弯折区域以及所述第二区域沿着第一方向依次并排设置。
在本申请所述的触控感应组件中，所述绑定区域与所述第一区域相邻设置，且沿第二方向依次设置。
在本申请所述的触控感应组件中，所述绑定区域与所述第二区域相邻设置，且沿第二方向依次设置。
在本申请所述的触控感应组件中，所述第一方向与所述第二方向互相垂直。
在本申请所述的触控感应组件中，所述绑定区域均与所述第一区域以及所述第二区域相邻设置。
在本申请所述的触控感应组件中，所述绑定区域包括第一子绑定区域以及第二子绑定区域，所述第一子绑定区域与所述第一区域相邻设置，所述第二子绑定区域与所述第二区域相邻设置；
所述绑定块包括第一子绑定块和第二子绑定块，所述第一子绑定块设置在所述第一子绑定区域上，所述第二子绑定块设置在所述第二子绑定区域上。
在本申请所述的触控感应组件中，所述触控感应层还包括第三触控感应块，所述第三触控感应块设置在所述弯折区域上。
本申请还提供一种电子设备，其包括显示屏本体以及以上所述的触控感应组件，且所述触控感应组件的基底覆盖所述显示屏本体，所述触控感应组件的触控感应层设置在基底远离所述显示屏本体的一侧。
本申请还提供一种电子设备，其包括显示屏本体以及触控感应组件，且所述触控感应组件的基底覆盖所述显示屏本体；
所述触控感应组件的触控感应层设置在基底远离所述显示屏本体的一侧；或者所述触控感应组件的触控感应层设置在基底靠近所述显示屏本体的一侧；
所述触控感应组件，其包括：
基底，所述基底包括第一区域、弯折区域、第二区域以及绑定区域；
触控感应层，所述触控感应层设置在所述基底上，所述触控感应层包括第一触控感应块、第二触控感应块以及绑定块，所述第一触控感应块设置在所述第一区域上，所述第二触控感应块设置在所述第二区域上，所述绑定块设置在所述绑定区域上；
所述绑定块与所述第一触控感应块以及所述第二触控感应块电连接，用于将所述第一触控感应块以及第二触控感应块的感应信号传输至触控芯片。
在本申请所述的电子设备中，所述第一区域、所述弯折区域以及所述第二区域沿着第一方向依次并排设置。
在本申请所述的电子设备中，所述绑定区域与所述第一区域相邻设置，且沿第二方向依次设置。
在本申请所述的电子设备中，所述绑定区域与所述第二区域相邻设置，且沿第二方向依次设置。
 有益效果
本申请实施例的触控感应组件及电子设备，通过在可折叠的基底上制造触控感应层，然后可以将该触控感应层弯折覆盖至电子设备的两表面，形成双面触控功能层，具有减小工艺步骤以及节约成本的有益效果。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例中的触控感应组件的第一种结构示意图。
图2为本申请实施例中的触控感应组件的第二种结构示意图。
图3为本申请实施例中的触控感应组件的第三种结构示意图。
图4为本申请实施例中的触控感应组件的第四种结构示意图。
图5为本申请实施例中的触控组件的第五种结构示意图。
图6为本申请实施例中的触控组件的第六种结构示意图。
图7为本申请实施例中的电子设备的第一种结构示意图。
图8为本申请实施例中的电子设备的第二种结构示意图。
图9为本申请实施例中的电子设备的第三种结构示意图。
图10为本申请实施例中的电子设备的第四种结构示意图。
 本发明的实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，图1为本申请实施例中的触控感应组件的第一种结构示意图。如图1所示，该触控感应组件100包括：基底10以及触控感应层20。触控感应层20设置在基底10上。
其中，基底10采用透明柔性材料制成。例如，基底10可以采用以下材料中的一种或多种聚合而成：聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物以及玻璃纤维增强塑料。触控感应层20的采用但是不限于ITO材料。
在一些实施例中，基底10包括第一区域11、弯折区域12、第二区域13以及绑定区域14。其中，第一区域11、弯折区域12以及第二区域13沿着第一方向依次并排设置，绑定区域14与第一区域相邻设置。需要说明的是，第一方向此时为水平方向。
触控感应层20包括第一触控感应块21、第二触控感应块22以及绑定块23。其中，第一触控感应块21设置在第一区域11上，第二触控感应块22设置在第二区域13上，绑定块23设置在绑定区域14上。
也即，在本申请实施例中，绑定块23与第一触控感应块21和第二触控感应块22电连接，用于将第一触控感应块21以及第二触控感应块22的感应信号传输至触控芯片。
在一些实施例中，请参阅图2，图2为本申请实施例中的触控感应组件的第二种结构示意图。图2所示的触控感应组件200与图1所示的触控感应组件100的区别在于：图2所示的触控感应组件200的绑定区域14与第二区域13相邻设置。
如图2所示，基底10包括第一区域11、弯折区域12、第二区域13以及绑定区域14。其中，第一区域11、弯折区域12以及第二区域13沿着第一方向依次并排设置，绑定区域14与第二区域相邻设置。需要说明的是，第一方向此时为水平方向。触控感应层20包括第一触控感应块21、第二触控感应块22以及绑定块23。其中，第一触控感应块21设置在第一区域11上，第二触控感应块22设置在第二区域13上，绑定块23设置在绑定区域14上。
在一些实施例中，请参阅图3，图3为本申请实施例中的触控感应组件的第三种结构示意图。图3所示的触控感应组件300与图1所示的触控感应组件100的区别在于：图3所示的触控感应组件300的触控层20还包括第三触控感应块24。
如图3所示，基底10包括第一区域11、弯折区域12、第二区域13以及绑定区域14。其中，第一区域11、弯折区域12以及第二区域13沿着第一方向依次并排设置，绑定区域14与第二区域相邻设置。需要说明的是，第一方向此时为水平方向。触控感应层20包括第一触控感应块21、第二触控感应块22、绑定块23以及第三触控感应块24。其中，第一触控感应块21设置在第一区域11上，第二触控感应块22设置在第二区域13上，绑定块23设置在绑定区域14上，第三触控感应块24设置在弯折区域12上。
在一些实施例中，请参阅图4，图4为本申请实施例中的触控感应组件的第四种结构示意图。图4所示的触控感应组件400与图1所示的触控感应组件100的区别在于：图4所示的触控感应组件400的绑定区域14均与第一区域11以及第二区域13相邻。
如图4所示，基底10包括第一区域11、弯折区域12、第二区域13以及绑定区域14。其中，第一区域11、弯折区域12以及第二区域13沿着第一方向依次并排设置，绑定区域14均与第一区域11以及第二区域13相邻设置。也即，绑定区域14包括第一子绑定区域141和第二子绑定区域142，第一子绑定区域141与第一区域11相邻设置，第二子绑定区域142与第二区域13相邻设置。需要说明的是，第一方向此时为水平方向。触控感应层20包括第一触控感应块21、第二触控感应块22以及绑定块23。其中，绑定块23包括第一子绑定块231和第二子绑定块232。第一触控感应块21设置在第一区域11上，第二触控感应块22设置在第二区域13上，绑定块23设置在绑定区域14上，第一子绑定块231设置在第一子绑定区域141上，第二子绑定块232设置在第二子绑定区域142上。
在一些实施例中，请参阅图5，图5为本申请实施例中的触控组件的第五种结构示意图。图5所示的触控感应组件500与图1所示的触控感应组件100的区别在于：图5所示的触控感应组件500的第一区域11、弯折区域12第二区域13以及绑定区域14沿着第二方向依次设置，其中第二方向与第一方向垂直。
如图5所示，基底10包括第一区域11、弯折区域12、第二区域13以及绑定区域14。其中，第一区域11、弯折区域12、第二区域13以及绑定区域14沿着第二方向依次设置。需要说明的是，第二方向此时为竖直方向。触控感应层20包括第一触控感应块21、第二触控感应块22以及绑定块23。其中，第一触控感应块21设置在第一区域11上，第二触控感应块22设置在第二区域13上，绑定块23设置在绑定区域14上。
在一些实施例中，请参阅图6，图6为本申请实施例中的触控组件的第六种结构示意图。图6所示的触控感应组件600与图5所示的触控感应组件500的区别在于：图6所示的触控感应组件600的触控层20还包括第三触控感应块24。
如图6所示，基底10包括第一区域11、弯折区域12、第二区域13以及绑定区域14。其中，第一区域11、弯折区域12、第二区域13以及绑定区域14沿着第二方向依次设置。需要说明的是，第二方向此时为竖直方向。触控感应层20包括第一触控感应块21、第二触控感应块22、绑定块23以及第三触控感应块24。其中，第一触控感应块21设置在第一区域11上，第二触控感应块22设置在第二区域13上，绑定块23设置在绑定区域14上，第三触控感应块设置在弯折区域12上。
本申请实施例还提供一种电子设备，其包括：显示屏本体以及触控感应组件。其中，触控感应组件的基底覆盖显示屏本体，触控感应组件的触控感应层设置在基底远离显示屏本体的一侧。
在一些实施例中，该触控感应组件可以为图1所示的触控感应组件100、图2所示的触控感应组件200、图4所示的触控感应组件400或者图5所示的触控感应组件500。以触控感应组件为图1所示的触控感应组件为例进行说明。
请参阅图7，图7为本申请实施例中的电子设备的第一种结构示意图。如图。结合图1、图7所示，该电子设备700包括显示屏本体701以及触控感应组件100。
显示屏本体701包括第一显示面711、第二显示面721以及设置在第一显示面711和第二显示面721之间的侧面731。触控感应组件100包括基底10以及触控感应层20。基底10覆盖显示屏本体701，触控感应层20设置在基底10远离显示屏本体701的一侧表面。其中，触控感应层20包括第一触控感应块21和第二触控感应块22，第一触控感应块21设置在第一显示面711上，第二触控感应块22设置在第二显示面721上。
在一些实施例中，该触控感应组件可以为图3所示的触控感应组件300或者图6所示的触控感应组件600。以触控感应组件为图3所示的触控感应组件为例进行说明。
请参阅图8，图8为本申请实施例中的电子设备的第二种结构示意图。结合图3、图8所示，该电子设备800包括显示屏本体701以及触控感应组件300。
显示屏本体701包括第一显示面711、第二显示面721以及设置在第一显示面711和第二显示面721之间的侧面731。触控感应组件300包括基底10以及触控感应层20。基底10覆盖显示屏本体701，触控感应层20设置在基底10远离显示屏本体701的一侧表面。其中，触控感应层20包括第一触控感应块21、第二触控感应块22以及第三触控感应块24，第一触控感应块21设置在第一显示面711上，第二触控感应块22设置在第二显示面721上，第三触控感应块24设置在侧面731上。
本申请实施例还提供一种电子设备，其包括：显示屏本体以及触控感应组件。其中，触控感应组件的基底覆盖显示屏本体，触控感应组件的触控感应层设置在基底靠近显示屏本体的一侧。
请参阅图9，图9为本申请实施例中的电子设备的第三种结构示意图。图9所示的电子设备900与图7所示的电子设备700的区别在于，触控感应层20设置在基底10靠近显示屏本体701的一侧表面。具体可参照图7所述，在此不做赘述。
请参阅图10，图10为本申请实施例中的电子设备的第四种结构示意图。图10所示的电子设备1000与图8所示的电子设备800的区别在于，触控感应层20设置在基底10靠近显示屏本体701的一侧表面。具体可参照图8所述，在此不做赘述。
本申请通过在可折叠的透明柔性基底上制造触控感应层，然后可以将该触控感应层弯折覆盖至电子设备的两表面，形成双面触控功能层，具有减小工艺步骤以及节约成本的有益效果。
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种触控感应组件，其包括：
    基底，所述基底包括第一区域、弯折区域、第二区域以及绑定区域；
    触控感应层，所述触控感应层设置在所述基底上，所述触控感应层包括第一触控感应块、第二触控感应块以及绑定块，所述第一触控感应块设置在所述第一区域上，所述第二触控感应块设置在所述第二区域上，所述绑定块设置在所述绑定区域上；
    所述绑定块与所述第一触控感应块以及所述第二触控感应块电连接，用于将所述第一触控感应块以及第二触控感应块的感应信号传输至触控芯片；
    其中，所述第一区域、所述弯折区域以及所述第二区域沿着第一方向依次并排设置；所述触控感应层还包括第三触控感应块，所述第三触控感应块设置在所述弯折区域上。
  2. 根据权利要求1所述的触控感应组件，其中，所述绑定区域与所述第一区域相邻设置，且沿第二方向依次设置。
  3. 根据权利要求1所述的触控感应组件，其中，所述绑定区域与所述第二区域相邻设置，且沿第二方向依次设置。
  4. 根据权利要求2所述的触控感应组件，其中，所述第一方向与所述第二方向互相垂直。
  5. 根据权利要求3所述的触控感应组件，其中，所述第一方向与所述第二方向互相垂直。
  6. 根据权利要求1所述的触控感应组件，其中，所述绑定区域均与所述第一区域以及所述第二区域相邻设置。
  7. 根据权利要求6所述的触控感应组件，其中，所述绑定区域包括第一子绑定区域以及第二子绑定区域，所述第一子绑定区域与所述第一区域相邻设置，所述第二子绑定区域与所述第二区域相邻设置；
    所述绑定块包括第一子绑定块和第二子绑定块，所述第一子绑定块设置在所述第一子绑定区域上，所述第二子绑定块设置在所述第二子绑定区域上。
  8. 一种触控感应组件，其包括：
    基底，所述基底包括第一区域、弯折区域、第二区域以及绑定区域；
    触控感应层，所述触控感应层设置在所述基底上，所述触控感应层包括第一触控感应块、第二触控感应块以及绑定块，所述第一触控感应块设置在所述第一区域上，所述第二触控感应块设置在所述第二区域上，所述绑定块设置在所述绑定区域上；
    所述绑定块与所述第一触控感应块以及所述第二触控感应块电连接，用于将所述第一触控感应块以及第二触控感应块的感应信号传输至触控芯片。
  9. 根据权利要求8所述的触控感应组件，其中，所述第一区域、所述弯折区域以及所述第二区域沿着第一方向依次并排设置。
  10. 根据权利要求9所述的触控感应组件，其中，所述绑定区域与所述第一区域相邻设置，且沿第二方向依次设置。
  11. 根据权利要求9所述的触控感应组件，其中，所述绑定区域与所述第二区域相邻设置，且沿第二方向依次设置。
  12. 根据权利要求10所述的触控感应组件，其中，所述第一方向与所述第二方向互相垂直。
  13. 根据权利要求11所述的触控感应组件，其中，所述第一方向与所述第二方向互相垂直。
  14. 根据权利要求9所述的触控感应组件，其中，所述绑定区域均与所述第一区域以及所述第二区域相邻设置。
  15. 根据权利要求14所述的触控感应组件，其中，所述绑定区域包括第一子绑定区域以及第二子绑定区域，所述第一子绑定区域与所述第一区域相邻设置，所述第二子绑定区域与所述第二区域相邻设置；
    所述绑定块包括第一子绑定块和第二子绑定块，所述第一子绑定块设置在所述第一子绑定区域上，所述第二子绑定块设置在所述第二子绑定区域上。
  16. 根据权利要求8所述的触控感应组件，其中，所述触控感应层还包括第三触控感应块，所述第三触控感应块设置在所述弯折区域上。
  17. 一种电子设备，其包括显示屏本体以及触控感应组件，且所述触控感应组件的基底覆盖所述显示屏本体；
    所述触控感应组件的触控感应层设置在基底远离所述显示屏本体的一侧；或者所述触控感应组件的触控感应层设置在基底靠近所述显示屏本体的一侧；
    所述触控感应组件，其包括：
    基底，所述基底包括第一区域、弯折区域、第二区域以及绑定区域；
    触控感应层，所述触控感应层设置在所述基底上，所述触控感应层包括第一触控感应块、第二触控感应块以及绑定块，所述第一触控感应块设置在所述第一区域上，所述第二触控感应块设置在所述第二区域上，所述绑定块设置在所述绑定区域上；
    所述绑定块与所述第一触控感应块以及所述第二触控感应块电连接，用于将所述第一触控感应块以及第二触控感应块的感应信号传输至触控芯片。
  18. 根据权利要求17所述的电子设备，其中，所述第一区域、所述弯折区域以及所述第二区域沿着第一方向依次并排设置。
  19. 根据权利要求18所述的电子设备，其中，所述绑定区域与所述第一区域相邻设置，且沿第二方向依次设置。
  20. 根据权利要求18所述的电子设备，其中，所述绑定区域与所述第二区域相邻设置，且沿第二方向依次设置。
PCT/CN2019/075422 2018-10-31 2019-02-19 触控感应组件及电子设备 Ceased WO2020087802A1 (zh)

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