WO2020087771A1 - 一种显示面板的修复方法及显示面板 - Google Patents

一种显示面板的修复方法及显示面板 Download PDF

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Publication number
WO2020087771A1
WO2020087771A1 PCT/CN2019/070035 CN2019070035W WO2020087771A1 WO 2020087771 A1 WO2020087771 A1 WO 2020087771A1 CN 2019070035 W CN2019070035 W CN 2019070035W WO 2020087771 A1 WO2020087771 A1 WO 2020087771A1
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WIPO (PCT)
Prior art keywords
area
display panel
protective layer
circuit board
welded
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Ceased
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PCT/CN2019/070035
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English (en)
French (fr)
Inventor
庄益壮
张小新
钟兴进
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Publication of WO2020087771A1 publication Critical patent/WO2020087771A1/zh
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Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the present invention relates to the field of display technology, and in particular, to a repair method of a display panel and a display panel.
  • the external signals of the display panel need to be passed into the display panel through the PCB, COF, and the bonding area connected to the display panel.
  • the bonding area has multiple gate lines that provide scanning signals and signal lines that provide data signals, such as
  • the bonding area structure includes a base substrate 11, a metal layer 12 with multiple connection lines, a protective layer 13, and a transparent conductive layer 14, wherein the protective layer 13 is provided with a plurality of via holes 101, The via hole 101 is filled with a transparent conductive layer 14, and the remaining transparent conductive layer 14 is located on the protective layer 13, and then a flexible circuit board (COF) is attached to connect the via hole 101 with the flexible circuit board.
  • COF flexible circuit board
  • the ITO in the via hole 101 of the binding area is easily contaminated by the outside world, causing the connection line to be damaged. And after the COF is attached, if the external corrosive liquid enters, it will still cause damage to the connection line. After the connection line is damaged, the signal conduction between the bonding area and the flexible circuit board cannot be conducted, which results in the inability to transmit external signals, which reduces the product yield, and at this time the product can only be scrapped, thereby increasing production costs.
  • the object of the present invention is to provide a repair method of a display panel and a display panel, which can improve the product yield and reduce the production cost.
  • the present invention provides a display panel, which includes:
  • the cross-sectional structure of the array substrate includes:
  • a metal layer provided on the base substrate
  • a first protective layer is provided on the metal layer, and a plurality of via holes are provided on the first protective layer;
  • a second protective layer is also provided thereon; when the connecting wire in the area to be soldered is damaged, the reserved area is electrically connected to the flexible circuit board, and the material of the second protective layer is an insulating material.
  • connection wire in the area to be soldered when the connection wire in the area to be soldered is damaged, the connection wire in the reserved area is electrically connected to the flexible circuit board through an anisotropic conductive adhesive film.
  • the metal layer includes at least two sub-metal layers, an insulating layer is provided between two adjacent sub-metal layers, and a plurality of the sub-metal layers are electrically connected.
  • the present invention provides a display panel, which includes:
  • the cross-sectional structure of the array substrate includes:
  • a metal layer provided on the base substrate
  • a first protective layer is provided on the metal layer, and a plurality of via holes are provided on the first protective layer;
  • the reserved area is close to the display area, and the to-be-welded area is far away from the display area.
  • the material of the second protective layer is an insulating material.
  • connection wire in the area to be soldered when the connection wire in the area to be soldered is damaged, the connection wire in the reserved area is electrically connected to the flexible circuit board through an anisotropic conductive adhesive film.
  • the metal layer includes at least two sub-metal layers, an insulating layer is provided between two adjacent sub-metal layers, and a plurality of the sub-metal layers are electrically connected.
  • the material of the second protective layer is an organic material or an inorganic material.
  • the invention also provides a repair method of the display panel, wherein the display panel includes:
  • the cross-sectional structure of the array substrate includes:
  • a metal layer provided on the base substrate
  • a first protective layer is provided on the metal layer, and a plurality of via holes are provided on the first protective layer;
  • the method includes:
  • the reserved area is electrically connected to the flexible circuit board.
  • the step of electrically connecting the flexible circuit board and the reserved area includes: attaching anisotropic conductivity to the transparent conductive layer located in the reserved area Glue film, and press the flexible circuit board with the reserved area.
  • the step of removing the second protective layer includes:
  • the second protective layer is removed by etching or laser.
  • the step of separating the area to be soldered from the flexible circuit board includes:
  • the reserved area is close to the display area, and the area to be soldered is away from the display area.
  • the material of the second protective layer is an organic material or an inorganic material.
  • the second protective layer is an organic material
  • a chemical etching method is used to remove the second protective layer.
  • the second protective layer is an inorganic material
  • the second protective layer is removed by laser.
  • the repair method and the display panel of the display panel of the present invention by connecting part of the binding area to the flexible circuit board, when the connection line of the part of the binding area is damaged, the remaining part of the binding area is electrically connected to the flexible circuit board In order to avoid the inability to input external signals into the display panel, the product yield is improved and the production cost is reduced.
  • FIG. 1 is a schematic structural diagram of a binding area of an existing display panel
  • FIG. 2 is a schematic structural diagram of a binding area of a display panel according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of the display panel of the present invention when the binding area is connected to a flexible circuit board;
  • FIG. 4 is a schematic structural diagram of the first step of the repair method of the display panel of the present invention.
  • FIG. 5 is a schematic structural diagram of a second step of the repair method of the display panel of the present invention.
  • FIG. 6 is a schematic structural diagram of a third step of the repair method of the display panel of the present invention.
  • FIG. 7 is a schematic structural diagram of a binding area of a display panel according to Embodiment 2 of the present invention.
  • FIG. 2 is a schematic structural diagram of a binding area of a display panel according to Embodiment 1 of the present invention.
  • the display panel of this embodiment includes an array substrate.
  • the cross-sectional structure of the array substrate includes: a base substrate 11, a metal layer 12, a first protective layer 13, and a transparent conductive layer 14.
  • the metal layer 12 is provided on the base substrate 11.
  • the metal layer 12 includes a plurality of connection lines. One end of the connection line is connected to the signal lines (data lines and scan lines) in the display area, and the other end is connected to the flexible circuit board connection.
  • the metal layer 12 has a single-layer structure.
  • the first protective layer 13 is provided on the metal layer 12.
  • the first protective layer 13 is provided with a plurality of vias 101, which are also via holes.
  • the transparent conductive layer 14 is located in the via 101 and on the first protective layer 13.
  • the array substrate has a display area (not shown in the figure) and a binding area, wherein the binding area includes a reserved area 201 and a to-be-welded area 202; the reserved area 201 and the to-be-welded area
  • the areas 202 all cover a plurality of the vias 101, that is, the reserved area 201 and the area to be welded 202 each have a plurality of connection lines, and the connection lines are scan connection lines or connection lines connected to data lines. That is, the connecting line is a scanning connecting line providing a scanning signal or a connecting line providing a data signal.
  • a second protective layer 15 is further provided on the transparent conductive layer 14 in the reserved area 201.
  • the reserved area 201 and the flexible circuit board Electrical connection For example, as shown in FIG. 3, in the initial state, the area to be soldered 202 is electrically connected to the flexible circuit board 20. The area to be soldered 202 is electrically connected to the flexible circuit board 20 through an anisotropic conductive adhesive film.
  • the reserved area 201 is electrically connected to the flexible circuit board 20.
  • the reserved area 201 is close to the display area, and the to-be-welded area 202 is far away from the display area. That is, the reserved area 201 is close to the inner side of the array substrate, and the to-be-welded area 202 is close to the edge of the array substrate.
  • the material of the second protective layer 15 is an insulating material.
  • the material of the second protective layer 15 is, for example, an organic material or an inorganic material.
  • the connecting wire in the to-be-welded area 202 when the connecting wire in the to-be-welded area 202 is damaged, the connecting wire of the reserved area 201 is electrically connected to the flexible circuit board 20 through an anisotropic conductive adhesive film .
  • the second protective layer 15 is removed, and an anisotropic conductive adhesive film (ACF) 21 is attached to the transparent conductive layer 14 of the reserved area 201, and the anisotropic conductive adhesive film 21 is mixed with Conductive particles, the conductive particles make the connection line of the reserved area and the pins of the flexible circuit board 20 conduct, please refer to the following for details.
  • ACF anisotropic conductive adhesive film
  • the display panel of the present invention may be a liquid crystal display panel or an organic light emitting diode display.
  • the invention also provides a method for repairing the above display panel, which is specifically used for repairing the binding area of the display panel.
  • the method includes:
  • the region to be soldered 202 is separated from the flexible circuit board 20, wherein this step includes: conducting anisotropy between the region to be soldered 202 and the flexible circuit board 20
  • the adhesive film is heated to soften the anisotropic conductive adhesive film, and the flexible circuit board 20 is peeled off.
  • the reserved area 201 and the to-be-welded area 202 are divided, for example, a gap is cut between the reserved area 201 and the to-be-welded area 202, so that the reserved area 201 and all The to-be-welded area 202 is disconnected to prevent the corrosion liquid from penetrating into the reserved area 201 after the to-be-welded area 202 is corroded and damaged.
  • the second protective layer 15 when the second protective layer 15 is an organic material, the second protective layer 15 may be removed using a chemical etching method.
  • the second protective layer 15 is an inorganic material
  • the second protective layer 15 can be removed by laser.
  • the reserved area 201 is electrically connected to the flexible circuit board 20.
  • the step of electrically connecting the flexible circuit board and the reserved area includes:
  • S1031 Attach an anisotropic conductive adhesive film on the transparent conductive layer in the reserved area, and press-fit the flexible circuit board with the reserved area.
  • an anisotropic conductive adhesive film is attached on the transparent conductive layer 14 of the reserved area 201 from which the second protective layer is removed, the anisotropic conductive adhesive film 21 is doped with conductive particles, and the conductive particles make the reserved area
  • the connection line of the flexible circuit board 20 is connected to the pins of the flexible circuit board 20, and then the flexible circuit board 20 and the reserved area 201 are pressed together, so that the pins of the flexible circuit board 20 and the reserved area 201 are connected Wired electrically to input external signals into the display panel.
  • part of the binding area is connected to the flexible circuit board, and a protective layer is provided above the remaining portion of the binding area, when the connection line of the part of the binding area is damaged, the part of the binding area and the flexible circuit board Separate, and then separate the binding area of the remaining part from the binding area of the part, and then remove the protective layer on the binding area of the remaining part, and then electrically connect the binding area of the remaining part and the flexible circuit board to avoid
  • the external signal cannot be input into the display panel, which improves the product yield and reduces the production cost.
  • FIG. 7 is a schematic structural diagram of a binding area of a display panel according to Embodiment 2 of the present invention.
  • the metal layer 12 of this embodiment has a multilayer structure.
  • the metal layer 12 includes two sub-metal layers 121, an insulating layer 16 is provided between two adjacent sub-metal layers 121, 122, and a plurality of the sub-metal layers 121, 122 are electrically connected .
  • both the insulating layer 16 and the first protective layer 13 are provided with via holes, so that the sub-metal layers 121 and 122 are electrically connected through the transparent conductive layer.
  • the metal layer may also include two or more sub-metal layers.
  • the repair method and the display panel of the display panel of the present invention by connecting part of the binding area to the flexible circuit board, when the connection line of the part of the binding area is damaged, the remaining part of the binding area is electrically connected to the flexible circuit board In order to avoid the inability to input external signals into the display panel, the product yield is improved and the production cost is reduced.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板的修复方法及显示面板，面板包括：依次设于衬底基板（11）上的金属层（12）、第一保护层（13）以及透明导电层（14）；第一保护层（13）上设置有多个过孔（101）；阵列基板具有覆盖多个过孔（101）的预留区（201）和待焊接区（202）；位于预留区（201）的透明导电层（14）上还设置有第二保护层（15）；当待焊接区（202）中的连接线损坏时，预留区（201）与柔性电路板（20）电性连接。

Description

一种显示面板的修复方法及显示面板 技术领域
本发明涉及显示技术领域，特别是涉及一种显示面板的修复方法及显示面板。
 背景技术
显示面板的外部信号需要通过PCB、COF以及与显示面板连接的绑定（bonding）区，传入到显示面板内，bonding区有多条提供扫描信号的栅线和提供数据信号的信号线，如图1所示，bonding区结构包括衬底基板11、具有多条连接线的金属层12、保护层13以及透明导电层14，其中保护层13上设置有多个通路孔（via hole）101，在通路孔101中填充有透明导电层14，其余部分透明导电层14位于保护层13上，之后再贴附柔性电路板（COF），使通路孔101与柔性电路板连接。
 技术问题
然而，在贴附COF之前，绑定区的通路孔101内的ITO容易受到外界的污染，造成连接线被破坏。且在COF贴附后，如果有外界腐蚀液体进入，仍会对连接线造成破坏。连接线破坏后，无法使bonding区与柔性电路板之间进行信号导通，造成无法传输外部信号，降低了产品良率，且此时产品只能报废处理，从而增大了生产成本。
 技术解决方案
本发明的目的在于提供一种显示面板的修复方法及显示面板，能够提高产品良率，降低生产成本。
为解决上述技术问题，本发明提供一种显示面板，其包括：
阵列基板的截面结构包括：
衬底基板；
金属层，设于所述衬底基板上；
第一保护层，设于所述金属层上，所述第一保护层上设置有多个过孔；
透明导电层，位于所述过孔内及所述第一保护层上；其中所述阵列基板具有显示区和绑定区，所述绑定区包括预留区和待焊接区；所述预留区靠近所述显示区，所述待焊接区远离所述显示区，所述预留区和所述待焊接区均覆盖多个所述过孔，位于所述预留区的所述透明导电层上还设置有第二保护层；当所述待焊接区中的连接线损坏时，所述预留区与柔性电路板电性连接，所述第二保护层的材料为绝缘材料。
在本发明的显示面板中，当所述待焊接区中的连接线损坏时，所述预留区的连接线通过异方性导电胶膜与所述柔性电路板电性连接。
在本发明的显示面板中，所述金属层包括至少两个子金属层，相邻两个所述子金属层之间设置有绝缘层，多个所述子金属层之间电性连接。
本发明提供一种显示面板，其包括：
阵列基板的截面结构包括：
衬底基板；
金属层，设于所述衬底基板上；
第一保护层，设于所述金属层上，所述第一保护层上设置有多个过孔；
透明导电层，位于所述过孔内及所述第一保护层上；其中所述阵列基板具有显示区和绑定区，所述绑定区包括预留区和待焊接区；所述预留区和所述待焊接区均覆盖多个所述过孔，位于所述预留区的所述透明导电层上还设置有第二保护层，当所述待焊接区中的连接线损坏时，所述预留区与所述柔性电路板电性连接。
在本发明的显示面板中，所述预留区靠近所述显示区，所述待焊接区远离所述显示区。
在本发明的显示面板中，所述第二保护层的材料为绝缘材料。
在本发明的显示面板中，当所述待焊接区中的连接线损坏时，所述预留区的连接线通过异方性导电胶膜与所述柔性电路板电性连接。
在本发明的显示面板中，所述金属层包括至少两个子金属层，相邻两个子金属层之间设置有绝缘层，多个所述子金属层之间电性连接。
在本发明的显示面板中，所述第二保护层的材料为有机材料或者无机材料。
本发明还提供一种显示面板的修复方法，其中显示面板包括：
阵列基板的截面结构包括：
衬底基板；
金属层，设于所述衬底基板上；
第一保护层，设于所述金属层上，所述第一保护层上设置有多个过孔；
透明导电层，位于所述过孔内及位于所述第一保护层上；其中所述阵列基板具有显示区和绑定区，所述绑定区包括预留区和待焊接区；所述预留区和所述待焊接区均覆盖多个所述过孔，位于所述预留区的所述透明导电层上还设置有第二保护层，当所述待焊接区中的连接线损坏时，所述预留区与所述柔性电路板电性连接；
所述方法包括：
将所述待焊接区与所述柔性电路板分离，并将所述预留区和所述待焊接区分割开；
去除所述第二保护层；
将所述预留区与所述柔性电路板电性连接。
在本发明的显示面板的修复方法中，所述将所述柔性电路板与所述预留区电性连接的步骤包括：将位于所述预留区的透明导电层上贴付异方性导电胶膜，并将所述柔性电路板与所述预留区进行压合。
在本发明的显示面板的修复方法中，所述去除所述第二保护层的步骤包括：
通过蚀刻或者激光去除所述第二保护层。
在本发明的显示面板的修复方法中，所述将所述待焊接区与所述柔性电路板分离的步骤包括：
对所述待焊接区与所述柔性电路板之间的异方性导电胶膜进行加热，使该异方性导电胶膜软化，将所述柔性电路板剥离。
在本发明的显示面板的修复方法中，所述预留区靠近所述显示区，所述待焊接区远离所述显示区。
在本发明的显示面板的修复方法中，所述第二保护层的材料为有机材料或者无机材料。
在本发明的显示面板的修复方法中，当所述第二保护层为有机物材料时，使用化学蚀刻方法去除第二保护层。
 有益效果
在本发明的显示面板的修复方法中，当第二保护层为无机材料时，采用激光去除第二保护层。
本发明的显示面板的修复方法及显示面板，通过将部分绑定区与柔性电路板连接，当该部分绑定区的连接线损坏时，使剩余部分的绑定区与柔性电路板电性连接，从而避免无法将外界信号输入显示面板内，提高了产品良率以及降低了生产成本。
 附图说明
图1为现有显示面板的绑定区的结构示意图；
图2为本发明实施例一的显示面板的绑定区的结构示意图；
图3为本发明显示面板的绑定区与柔性电路板连接时的结构示意图；
图4为本发明显示面板的修复方法的第一步的结构示意图；
图5为本发明显示面板的修复方法的第二步的结构示意图；
图6为本发明显示面板的修复方法的第三步的结构示意图；
图7为本发明实施例二的显示面板的绑定区的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。
请参照图2至6，图2为本发明实施例一的显示面板的绑定区的结构示意图。
如图2所示，本实施例的显示面板包括阵列基板，所述阵列基板的截面结构包括：衬底基板11、金属层12、第一保护层13以及透明导电层14。
其中金属层12设于所述衬底基板11上，该金属层12包括多条连接线，该连接线的一端与显示区的信号线（数据线、扫描线）连接，另一端与柔性电路板连接。该金属层12为单层结构。
第一保护层13设于所述金属层12上，所述第一保护层13上设置有多个过孔101，该过孔也即为通路孔。
透明导电层14位于所述过孔101内及所述第一保护层13上。
在俯视图下，该阵列基板具有显示区（图中未示出）和绑定区，其中所述绑定区包括预留区201和待焊接区202；所述预留区201和所述待焊接区202均覆盖多个所述过孔101，也即，预留区201和所述待焊接区202均具有多条连接线，该连接线为扫描连接线或者与数据线连接的连接线。也即该连接线为提供扫描信号的扫描连接线或者提供数据信号的连接线。
位于所述预留区201的所述透明导电层14上还设置有第二保护层15，当所述待焊接区202中的连接线损坏时，所述预留区201与所述柔性电路板电性连接。比如，如图3所示，初始状态下，所述待焊接区202与柔性电路板20电性连接。其中待焊接区202通过异方性导电胶膜与柔性电路板20电性连接。当所述待焊接区202中的连接线损坏时，预留区201与所述柔性电路板20电性连接。
其中，所述预留区201靠近所述显示区，所述待焊接区202远离所述显示区。也即，预留区201靠近阵列基板的内侧，所述待焊接区202靠近阵列基板的边缘。
在一实施方式中，所述第二保护层15的材料为绝缘材料。所述第二保护层15的材料比如为有机材料或者无机材料。
在一实施方式中，结合图6，当所述待焊接区202中的连接线损坏时，所述预留区201的连接线通过异方性导电胶膜与所述柔性电路板电性20连接。具体地，将第二保护层15去除，并在预留区201的透明导电层14上有贴附异方性导电胶膜（ACF）21，所述异方性导电胶膜21中参杂有导电粒子，导电粒子使预留区的连接线与柔性电路板20的引脚导通，具体请参见下文。
可以理解的，本发明的显示面板可以为液晶显示面板或者有机发光二极管显示器。
本发明还提供一种上述显示面板的修复方法，具体用于对显示面板的绑定区进行修复，该方法包括：
S101、将所述待焊接区与所述柔性电路板分离，并将所述预留区和所述待焊接区分割开；
例如，结合图3和4，将所述待焊接区202与所述柔性电路板20分离，其中该步骤包括：对所述待焊接区202与所述柔性电路板20之间的异方性导电胶膜进行加热，使该异方性导电胶膜软化，将所述柔性电路板20剥离。
之后，再将所述预留区201和所述待焊接区202分割开，比如在所述预留区201和所述待焊接区202之间切割一个缝隙，使得所述预留区201和所述待焊接区202断开，避免待焊接区202腐蚀破坏后，腐蚀液渗透到预留区201。
S102、去除所述第二保护层。
例如，如图5所示，当第二保护层15为有机物材料时，可以使用化学蚀刻方法去除第二保护层15。
第二保护层15为无机材料时，可以采用激光去除第二保护层15。
S103、将所述预留区与所述柔性电路板电性连接。
例如，如图6所示，将所述预留区201与所述柔性电路板20电性连接。
所述将所述柔性电路板与所述预留区电性连接的步骤包括：
S1031、将位于所述预留区的透明导电层上贴付异方性导电胶膜，并将所述柔性电路板与所述预留区进行压合。
例如，在去除第二保护层的预留区201的透明导电层14上贴付异方性导电胶膜，所述异方性导电胶膜21中参杂有导电粒子，导电粒子使预留区的连接线与柔性电路板20的引脚导通，之后再将所述柔性电路板20与所述预留区201进行压合，从而使得柔性电路板20的引脚与预留区201的连接线电性连接，以将外界信号输入显示面板内。
由于，将部分绑定区与柔性电路板连接，而在剩余部分的绑定区的上方设置保护层，因此当该部分绑定区的连接线损坏时，将该部分绑定区与柔性电路板分离，然后将剩余部分的绑定区与该部分绑定区分割开，之后将剩余部分的绑定区上的保护层去除，再使剩余部分的绑定区与柔性电路板电性连接，避免无法将外界信号输入显示面板内，提高了产品良率以及降低了生产成本。
请参照图7，图7为本发明实施例二的显示面板的绑定区的结构示意图。
本实施例的绑定区与上一实施例的区别在于，本实施例的金属层12为多层结构。如图7所示，所述金属层12包括两个子金属层121，相邻两个子金属层121、122之间设置有绝缘层16，多个所述子金属层121、122之间电性连接。比如，在绝缘层16和第一保护层13上均设置有过孔，以使子金属层121、122通过透明导电层电性连接。可以理解的，该金属层也可包括两层以上的子金属层。
本实施例的显示面板的具体修复方法与上一实施例相同，在此不再赘述。
本发明的显示面板的修复方法及显示面板，通过将部分绑定区与柔性电路板连接，当该部分绑定区的连接线损坏时，使剩余部分的绑定区与柔性电路板电性连接，从而避免无法将外界信号输入显示面板内，提高了产品良率以及降低了生产成本。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (17)

  1. 一种显示面板，其包括：
    阵列基板的截面结构包括：
    衬底基板；
    金属层，设于所述衬底基板上；
    第一保护层，设于所述金属层上，所述第一保护层上设置有多个过孔；
    透明导电层，位于所述过孔内及所述第一保护层上；其中所述阵列基板具有显示区和绑定区，所述绑定区包括预留区和待焊接区；所述预留区靠近所述显示区，所述待焊接区远离所述显示区，所述预留区和所述待焊接区均覆盖多个所述过孔，位于所述预留区的所述透明导电层上还设置有第二保护层；当所述待焊接区中的连接线损坏时，所述预留区与柔性电路板电性连接，所述第二保护层的材料为绝缘材料。
  2. 根据权利要求1所述的显示面板，其中
    当所述待焊接区中的连接线损坏时，所述预留区的连接线通过异方性导电胶膜与所述柔性电路板电性连接。
  3. 根据权利要求1所述的显示面板，其中
    所述金属层包括至少两个子金属层，相邻两个所述子金属层之间设置有绝缘层，多个所述子金属层之间电性连接。
  4. 一种显示面板，其包括：
    阵列基板的截面结构包括：
    衬底基板；
    金属层，设于所述衬底基板上；
    第一保护层，设于所述金属层上，所述第一保护层上设置有多个过孔；
    透明导电层，位于所述过孔内及所述第一保护层上；其中所述阵列基板具有显示区和绑定区，所述绑定区包括预留区和待焊接区；所述预留区和所述待焊接区均覆盖多个所述过孔，位于所述预留区的所述透明导电层上还设置有第二保护层；当所述待焊接区中的连接线损坏时，所述预留区与柔性电路板电性连接。
  5. 根据权利要求4所述的显示面板，其中
    所述预留区靠近所述显示区，所述待焊接区远离所述显示区。
  6. 根据权利要求4所述的显示面板，其中
    所述第二保护层的材料为绝缘材料。
  7. 根据权利要求4所述的显示面板，其中
    当所述待焊接区中的连接线损坏时，所述预留区的连接线通过异方性导电胶膜与所述柔性电路板电性连接。
  8. 根据权利要求4所述的显示面板，其中
    所述金属层包括至少两个子金属层，相邻两个所述子金属层之间设置有绝缘层，多个所述子金属层之间电性连接。
  9. 根据权利要求4所述的显示面板，其中
    所述第二保护层的材料为有机材料或者无机材料。
  10. 一种显示面板的修复方法，其中显示面板包括：
    阵列基板的截面结构包括：
    衬底基板；
    金属层，设于所述衬底基板上；
    第一保护层，设于所述金属层上，所述第一保护层上设置有多个过孔；
    透明导电层，位于所述过孔内及所述第一保护层上；其中所述阵列基板具有显示区和绑定区，所述绑定区包括预留区和待焊接区；所述预留区和所述待焊接区均覆盖多个所述过孔，位于所述预留区的所述透明导电层上还设置有第二保护层，当所述待焊接区中的连接线损坏时，所述预留区与所述柔性电路板电性连接；
    其中所述方法包括：
    将所述待焊接区与所述柔性电路板分离，并将所述预留区和所述待焊接区分割开；
    去除所述第二保护层；
    将所述预留区与所述柔性电路板电性连接。
  11. 根据权利要求10所述的显示面板的修复方法，其中所述将所述柔性电路板与所述预留区电性连接的步骤包括：将位于所述预留区的透明导电层上贴付异方性导电胶膜，并将所述柔性电路板与所述预留区进行压合。
  12. 根据权利要求10所述的显示面板的修复方法，其中所述去除所述第二保护层的步骤包括：
    通过蚀刻或者激光去除所述第二保护层。
  13. 根据权利要求10所述的显示面板的修复方法，其中所述将所述待焊接区与所述柔性电路板分离的步骤包括：
    对所述待焊接区与所述柔性电路板之间的异方性导电胶膜进行加热，使该异方性导电胶膜软化，将所述柔性电路板剥离。
  14. 根据权利要求10所述的显示面板的修复方法，其中所述预留区靠近所述显示区，所述待焊接区远离所述显示区。
  15. 根据权利要求10所述的显示面板的修复方法，其中
    所述第二保护层的材料为有机材料或者无机材料。
  16. 根据权利要求15所述的显示面板的修复方法，其中当所述第二保护层为有机物材料时，使用化学蚀刻方法去除第二保护层。
  17. 根据权利要求15所述的显示面板的修复方法，其中当第二保护层为无机材料时，采用激光去除第二保护层。
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CN112736055B (zh) * 2020-12-30 2023-11-24 合肥维信诺科技有限公司 显示面板及其制备方法、显示装置

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