WO2020087771A1 - Procédé de réparation d'écran d'affichage et écran d'affichage - Google Patents

Procédé de réparation d'écran d'affichage et écran d'affichage Download PDF

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Publication number
WO2020087771A1
WO2020087771A1 PCT/CN2019/070035 CN2019070035W WO2020087771A1 WO 2020087771 A1 WO2020087771 A1 WO 2020087771A1 CN 2019070035 W CN2019070035 W CN 2019070035W WO 2020087771 A1 WO2020087771 A1 WO 2020087771A1
Authority
WO
WIPO (PCT)
Prior art keywords
area
display panel
protective layer
circuit board
welded
Prior art date
Application number
PCT/CN2019/070035
Other languages
English (en)
Chinese (zh)
Inventor
庄益壮
张小新
钟兴进
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Publication of WO2020087771A1 publication Critical patent/WO2020087771A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of display technology, and in particular, to a repair method of a display panel and a display panel.
  • the external signals of the display panel need to be passed into the display panel through the PCB, COF, and the bonding area connected to the display panel.
  • the bonding area has multiple gate lines that provide scanning signals and signal lines that provide data signals, such as
  • the bonding area structure includes a base substrate 11, a metal layer 12 with multiple connection lines, a protective layer 13, and a transparent conductive layer 14, wherein the protective layer 13 is provided with a plurality of via holes 101, The via hole 101 is filled with a transparent conductive layer 14, and the remaining transparent conductive layer 14 is located on the protective layer 13, and then a flexible circuit board (COF) is attached to connect the via hole 101 with the flexible circuit board.
  • COF flexible circuit board
  • the ITO in the via hole 101 of the binding area is easily contaminated by the outside world, causing the connection line to be damaged. And after the COF is attached, if the external corrosive liquid enters, it will still cause damage to the connection line. After the connection line is damaged, the signal conduction between the bonding area and the flexible circuit board cannot be conducted, which results in the inability to transmit external signals, which reduces the product yield, and at this time the product can only be scrapped, thereby increasing production costs.
  • the object of the present invention is to provide a repair method of a display panel and a display panel, which can improve the product yield and reduce the production cost.
  • the present invention provides a display panel, which includes:
  • the cross-sectional structure of the array substrate includes:
  • a metal layer provided on the base substrate
  • a first protective layer is provided on the metal layer, and a plurality of via holes are provided on the first protective layer;
  • a second protective layer is also provided thereon; when the connecting wire in the area to be soldered is damaged, the reserved area is electrically connected to the flexible circuit board, and the material of the second protective layer is an insulating material.
  • connection wire in the area to be soldered when the connection wire in the area to be soldered is damaged, the connection wire in the reserved area is electrically connected to the flexible circuit board through an anisotropic conductive adhesive film.
  • the metal layer includes at least two sub-metal layers, an insulating layer is provided between two adjacent sub-metal layers, and a plurality of the sub-metal layers are electrically connected.
  • the present invention provides a display panel, which includes:
  • the cross-sectional structure of the array substrate includes:
  • a metal layer provided on the base substrate
  • a first protective layer is provided on the metal layer, and a plurality of via holes are provided on the first protective layer;
  • the reserved area is close to the display area, and the to-be-welded area is far away from the display area.
  • the material of the second protective layer is an insulating material.
  • connection wire in the area to be soldered when the connection wire in the area to be soldered is damaged, the connection wire in the reserved area is electrically connected to the flexible circuit board through an anisotropic conductive adhesive film.
  • the metal layer includes at least two sub-metal layers, an insulating layer is provided between two adjacent sub-metal layers, and a plurality of the sub-metal layers are electrically connected.
  • the material of the second protective layer is an organic material or an inorganic material.
  • the invention also provides a repair method of the display panel, wherein the display panel includes:
  • the cross-sectional structure of the array substrate includes:
  • a metal layer provided on the base substrate
  • a first protective layer is provided on the metal layer, and a plurality of via holes are provided on the first protective layer;
  • the method includes:
  • the reserved area is electrically connected to the flexible circuit board.
  • the step of electrically connecting the flexible circuit board and the reserved area includes: attaching anisotropic conductivity to the transparent conductive layer located in the reserved area Glue film, and press the flexible circuit board with the reserved area.
  • the step of removing the second protective layer includes:
  • the second protective layer is removed by etching or laser.
  • the step of separating the area to be soldered from the flexible circuit board includes:
  • the reserved area is close to the display area, and the area to be soldered is away from the display area.
  • the material of the second protective layer is an organic material or an inorganic material.
  • the second protective layer is an organic material
  • a chemical etching method is used to remove the second protective layer.
  • the second protective layer is an inorganic material
  • the second protective layer is removed by laser.
  • the repair method and the display panel of the display panel of the present invention by connecting part of the binding area to the flexible circuit board, when the connection line of the part of the binding area is damaged, the remaining part of the binding area is electrically connected to the flexible circuit board In order to avoid the inability to input external signals into the display panel, the product yield is improved and the production cost is reduced.
  • FIG. 1 is a schematic structural diagram of a binding area of an existing display panel
  • FIG. 2 is a schematic structural diagram of a binding area of a display panel according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of the display panel of the present invention when the binding area is connected to a flexible circuit board;
  • FIG. 4 is a schematic structural diagram of the first step of the repair method of the display panel of the present invention.
  • FIG. 5 is a schematic structural diagram of a second step of the repair method of the display panel of the present invention.
  • FIG. 6 is a schematic structural diagram of a third step of the repair method of the display panel of the present invention.
  • FIG. 7 is a schematic structural diagram of a binding area of a display panel according to Embodiment 2 of the present invention.
  • FIG. 2 is a schematic structural diagram of a binding area of a display panel according to Embodiment 1 of the present invention.
  • the display panel of this embodiment includes an array substrate.
  • the cross-sectional structure of the array substrate includes: a base substrate 11, a metal layer 12, a first protective layer 13, and a transparent conductive layer 14.
  • the metal layer 12 is provided on the base substrate 11.
  • the metal layer 12 includes a plurality of connection lines. One end of the connection line is connected to the signal lines (data lines and scan lines) in the display area, and the other end is connected to the flexible circuit board connection.
  • the metal layer 12 has a single-layer structure.
  • the first protective layer 13 is provided on the metal layer 12.
  • the first protective layer 13 is provided with a plurality of vias 101, which are also via holes.
  • the transparent conductive layer 14 is located in the via 101 and on the first protective layer 13.
  • the array substrate has a display area (not shown in the figure) and a binding area, wherein the binding area includes a reserved area 201 and a to-be-welded area 202; the reserved area 201 and the to-be-welded area
  • the areas 202 all cover a plurality of the vias 101, that is, the reserved area 201 and the area to be welded 202 each have a plurality of connection lines, and the connection lines are scan connection lines or connection lines connected to data lines. That is, the connecting line is a scanning connecting line providing a scanning signal or a connecting line providing a data signal.
  • a second protective layer 15 is further provided on the transparent conductive layer 14 in the reserved area 201.
  • the reserved area 201 and the flexible circuit board Electrical connection For example, as shown in FIG. 3, in the initial state, the area to be soldered 202 is electrically connected to the flexible circuit board 20. The area to be soldered 202 is electrically connected to the flexible circuit board 20 through an anisotropic conductive adhesive film.
  • the reserved area 201 is electrically connected to the flexible circuit board 20.
  • the reserved area 201 is close to the display area, and the to-be-welded area 202 is far away from the display area. That is, the reserved area 201 is close to the inner side of the array substrate, and the to-be-welded area 202 is close to the edge of the array substrate.
  • the material of the second protective layer 15 is an insulating material.
  • the material of the second protective layer 15 is, for example, an organic material or an inorganic material.
  • the connecting wire in the to-be-welded area 202 when the connecting wire in the to-be-welded area 202 is damaged, the connecting wire of the reserved area 201 is electrically connected to the flexible circuit board 20 through an anisotropic conductive adhesive film .
  • the second protective layer 15 is removed, and an anisotropic conductive adhesive film (ACF) 21 is attached to the transparent conductive layer 14 of the reserved area 201, and the anisotropic conductive adhesive film 21 is mixed with Conductive particles, the conductive particles make the connection line of the reserved area and the pins of the flexible circuit board 20 conduct, please refer to the following for details.
  • ACF anisotropic conductive adhesive film
  • the display panel of the present invention may be a liquid crystal display panel or an organic light emitting diode display.
  • the invention also provides a method for repairing the above display panel, which is specifically used for repairing the binding area of the display panel.
  • the method includes:
  • the region to be soldered 202 is separated from the flexible circuit board 20, wherein this step includes: conducting anisotropy between the region to be soldered 202 and the flexible circuit board 20
  • the adhesive film is heated to soften the anisotropic conductive adhesive film, and the flexible circuit board 20 is peeled off.
  • the reserved area 201 and the to-be-welded area 202 are divided, for example, a gap is cut between the reserved area 201 and the to-be-welded area 202, so that the reserved area 201 and all The to-be-welded area 202 is disconnected to prevent the corrosion liquid from penetrating into the reserved area 201 after the to-be-welded area 202 is corroded and damaged.
  • the second protective layer 15 when the second protective layer 15 is an organic material, the second protective layer 15 may be removed using a chemical etching method.
  • the second protective layer 15 is an inorganic material
  • the second protective layer 15 can be removed by laser.
  • the reserved area 201 is electrically connected to the flexible circuit board 20.
  • the step of electrically connecting the flexible circuit board and the reserved area includes:
  • S1031 Attach an anisotropic conductive adhesive film on the transparent conductive layer in the reserved area, and press-fit the flexible circuit board with the reserved area.
  • an anisotropic conductive adhesive film is attached on the transparent conductive layer 14 of the reserved area 201 from which the second protective layer is removed, the anisotropic conductive adhesive film 21 is doped with conductive particles, and the conductive particles make the reserved area
  • the connection line of the flexible circuit board 20 is connected to the pins of the flexible circuit board 20, and then the flexible circuit board 20 and the reserved area 201 are pressed together, so that the pins of the flexible circuit board 20 and the reserved area 201 are connected Wired electrically to input external signals into the display panel.
  • part of the binding area is connected to the flexible circuit board, and a protective layer is provided above the remaining portion of the binding area, when the connection line of the part of the binding area is damaged, the part of the binding area and the flexible circuit board Separate, and then separate the binding area of the remaining part from the binding area of the part, and then remove the protective layer on the binding area of the remaining part, and then electrically connect the binding area of the remaining part and the flexible circuit board to avoid
  • the external signal cannot be input into the display panel, which improves the product yield and reduces the production cost.
  • FIG. 7 is a schematic structural diagram of a binding area of a display panel according to Embodiment 2 of the present invention.
  • the metal layer 12 of this embodiment has a multilayer structure.
  • the metal layer 12 includes two sub-metal layers 121, an insulating layer 16 is provided between two adjacent sub-metal layers 121, 122, and a plurality of the sub-metal layers 121, 122 are electrically connected .
  • both the insulating layer 16 and the first protective layer 13 are provided with via holes, so that the sub-metal layers 121 and 122 are electrically connected through the transparent conductive layer.
  • the metal layer may also include two or more sub-metal layers.
  • the repair method and the display panel of the display panel of the present invention by connecting part of the binding area to the flexible circuit board, when the connection line of the part of the binding area is damaged, the remaining part of the binding area is electrically connected to the flexible circuit board In order to avoid the inability to input external signals into the display panel, the product yield is improved and the production cost is reduced.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

La présente invention concerne un procédé de réparation d'un écran d'affichage et un écran d'affichage. Le écran comprend : une couche métallique (12), une première couche de protection (13), et une couche conductrice transparente (14) disposée sur un substrat de base (11) en séquence. De multiples trous d'interconnexion (101) sont disposés sur la première couche de protection (13) ; le substrat de réseau a une région de réserve (201) et une région à souder (202) qui couvrent de multiples trous d'interconnexion (101) ; la couche conductrice transparente (14) dans la région de réserve (201) est en outre pourvue d'une seconde couche de protection (15) ; lorsqu'une ligne de connexion dans la région à souder (202) est endommagée, la région de réserve (201) est électriquement connectée à une carte de circuit souple (20).
PCT/CN2019/070035 2018-10-29 2019-01-02 Procédé de réparation d'écran d'affichage et écran d'affichage WO2020087771A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811271800.1A CN109407358B (zh) 2018-10-29 2018-10-29 一种显示面板的修复方法及显示面板
CN201811271800.1 2018-10-29

Publications (1)

Publication Number Publication Date
WO2020087771A1 true WO2020087771A1 (fr) 2020-05-07

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CN (1) CN109407358B (fr)
WO (1) WO2020087771A1 (fr)

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