WO2020085709A1 - Heat-radiating device having heatsink and heat-generating body elastically forced against each other - Google Patents

Heat-radiating device having heatsink and heat-generating body elastically forced against each other Download PDF

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Publication number
WO2020085709A1
WO2020085709A1 PCT/KR2019/013541 KR2019013541W WO2020085709A1 WO 2020085709 A1 WO2020085709 A1 WO 2020085709A1 KR 2019013541 W KR2019013541 W KR 2019013541W WO 2020085709 A1 WO2020085709 A1 WO 2020085709A1
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heat
generating body
heating element
heat sink
heat transfer
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PCT/KR2019/013541
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French (fr)
Korean (ko)
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배태완
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(주)모일
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat dissipation device that discharges heat from the heating element to the outside by surface-contacting a plurality of heat sinks to the heating element. More specifically, the heat sink is more closely adhered to the heating element by using elasticity, and the tolerance of the heat sink thickness B. It relates to a heat sink having a structure in which the heat sink is in close contact with the heating element without shaking, even when the central portion of the fastening guide is sagging, and the like.
  • Electric and electronic products that use electricity generate heat during use, and the generated heat adversely affects the electric and electronic products, thereby reducing efficiency, shortening the lifespan, and in severe cases, causing malfunctions to stop the operation of electric and electronic products. .
  • the present inventor has proposed a "heat dissipation device with improved heat dissipation" of Patent No. 10-13895363 in order to more efficiently discharge heat generated from a heating element of an electrical and electronic product to the outside.
  • the registered patent No. 10-13895363 is a structure to increase heat dissipation efficiency through a plurality of flat 'L' type heat pipes that are in surface contact with the heating element and a fastening guide that guides the connection of the 'L' type heat pipes and the heating element. .
  • Heat pipes may differ slightly in thickness by product due to manufacturing tolerances. Therefore, in the registered patent No. 10-13895363, many heat pipes do not closely adhere to the heating element due to a slight difference in thickness.
  • the fastening guide has little deformation such as a warped or struck edge of the edge, but the central part is apt to be warped or struck. When warped or struck, the heatsink in the area cannot properly contact the heating element.
  • the present invention is an invention devised to solve the problems of the heat dissipation device according to the prior art, and the heat sink and the heat generating element are in close contact with each other, and the heat sink is in close contact with the coupling guide by elastically supporting and pushing the heat sink toward the heating element. It is an object of the present invention to provide a heat dissipation device in which the heat sink is in close contact with the heating element without shaking and has excellent heat dissipation efficiency even when there is a tolerance or sagging of the fastening guide, and the heat sink and the heat generating element that do not cause a defective connection are elastically close.
  • a plurality of flat plate heat sinks including a heat transfer portion in surface contact with the heating element and a radiating portion connected vertically to the heat transfer portion to discharge heat transferred through the heat transfer portion to the outside;
  • a fastening guide including a seating portion on which the heating element is seated, through holes formed at the bottom of the seating portion and through which the radiating portion of the heat sink passes, and supports provided on the bottom of the seating portion to support the heat transfer portion of the heat sink.
  • the support portion is characterized in that a tension portion that provides an elastic force to elastically support the heat transfer portion is formed.
  • the tension portion of the fastening guide is characterized in that the structure in which the upward convex portion and the downward convex portion are continuously connected at the central portion of the support portion,
  • the support portion is characterized in that it has an inclined structure, the inner side of which is connected to the tension portion is higher than the outer side.
  • the heat dissipation device in which the heat sink and the heating element according to the present invention are elastically in close contact with each other is excellent in heat dissipation efficiency because the heat sink and the heating element are in close contact, and the heat sink and the heating element and the coupling guide are stably fastened without shaking, and the thickness of the heat sink Is a product that can be fastened if it is within a certain range, and is a very beneficial invention for industrial development.
  • FIG. 1 is a view showing an LED luminaire to which a heat sink according to the present invention is applied with heat dissipation devices that elastically adhere.
  • Figure 2 is an exploded perspective view of the heating element, heat sink and fastening guide in Figure 1 as a main part.
  • Figure 3 is a perspective view showing the structure of the heat sink and the fastening guide.
  • Figure 4 is a cross-sectional view showing the coupling structure of the heating element, the heat sink and the fastening guide.
  • LED module 20 fastening guide
  • the drawing shows an LED luminaire as an electric product to which a heat sink according to the present invention and a heat radiator 10 are elastically adhered.
  • the LED luminaire includes a body 60, a fastening guide 20 coupled to an upper portion of the body 60, and an LED module seated on a seating portion of the fastening guide 20 ( 10), the LED module 10 is pressed against the fastening guide 20 so as to be seated so as to be seated 40, and the upper cover of the fastening guide 20 is coupled to cover the LED module 10 (50), a heat sink (30) coupled through the fastening guide (20), a bracket (80) for adjusting and fixing the angle of the body (60), and coupled to the bottom of the body (60) And a housing 70 in which a power supply for supplying power to the LED module 10 is built.
  • the heat dissipation device includes a heating element 10, 10, a heat sink 30, and a fastening guide 20.
  • the heating element 10 is an LED module 10, and the LED module 10 is composed of an LED and a PCB. At this time, it may be desirable to use a metal PCB to increase the thermal conductivity of the PCB.
  • the heat sink 30 is composed of an electric heating part 31 that is in surface contact with the heating element 10, and a radiating part 33 that is vertically connected to the heating part 31, and thus has an overall 'L' shape. It is made of, and has a thin plate-like structure.
  • the heat transfer portion 31 is the top surface is in contact with the lower surface of the heating element 10 to receive the heat of the heating element 10, the radiating portion 33 penetrates the fastening guide 20 to the outside Exposed to release the heat of the heat transfer portion 31 to the outside.
  • the fastening guide 20 is formed with a seating portion 21 on which the heating element 10 is seated, and a radiating portion 33 of the heat sink 30 is penetrated to the bottom of the seating portion 21. Through holes 23 and a support portion 25 in which the heat transfer part 31 of the heat sink 30 is supported are formed, and a tension portion 27 that provides elastic force is formed in the central portion of the support portion 25. .
  • a stepped portion 22 is formed in which the heating element 10 is seated in place.
  • the support portion 25 is formed with a weight loss hole 26 to facilitate material reduction and compression.
  • the support portion 25 has a structure in which the inside connected to the tension portion 27 is inclined higher than the outside.
  • the tension part 27 is formed at the central part of the support part 25. That is, support portions 25 are connected to both sides of the tension portion 27.
  • the tension portion 27 is made of a structure in which the convex upward convex portion 27a and the downward convex downward convex portion 27b are continuously connected, so that it can be lifted or stretched in the up and down direction, and stretchable in the left and right directions. By doing so, it exerts an elastic force to return to its original shape when deformed under external force.
  • the radiating portion 33 of the heat sink 30 is penetrated through the through hole 23 of the fastening guide 20 to connect the heat transfer part 31 of the heat sink 30 to the fastening guide 20.
  • the inside of the support portion 25 of the fastening guide 20 contacts and supports the heat transfer portion 31.
  • the heating element 10 is seated and pressed on the seating portion 21 of the fastening guide 20 (if the pressing plate 40 is fastened to the seating portion 21 of the fastening guide 20, the pressing plate 40 generates a heating element ( 10) is pressed), the heat transfer portion 30 of the heat sink 30 is pressed together while contacting the heating element 10, and then the support portion 25 of the fastening guide 20 is pressed down.
  • the tension part 27 provides elastic force to return to the original state, so that the support part 25 and the tension part 27 push the heat transfer part 31 of the heat sink 30 upward to be in close contact with the heating element 10.
  • the support portion 25 and the tension portion 27 of the fastening guide 20 continuously push the heat transfer portion 31 of the heat sink 30 upward with elastic force to return to the original state, so that the thickness of the heat sink 30 is increased. Even if it is not constant, the heat sink 30 is in close contact with the heating element 10, and the force pushing the heat transfer part 31 continuously acts, so that the heat sink 30 and the heating element 10 are connected to the fastening guide 20 without shaking. Is concluded.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat-radiating device having multiple heatsinks making surface contact with a heat-generating body so as to discharge heat out of the heat-generating body and, more specifically, to a heat-radiating device having a heatsink and a heat-generating body elastically forced against each other, the heat-radiating device having a structure such that the heatsink is forced against the heat-generating body more tightly by using elasticity, and the heatsink is forced against the heat-generating body without vibrating, in spite of a heatsink thickness tolerance, fastening guide center portion sagging, or the like. A heat-radiating device having a heatsink and a heat-generating body elastically forced against each other according to the present invention comprises: a heat-generating body; multiple flat plate-type heatsinks comprising heat transfer portions making surface contact with the heat-generating body and radiation portions connected perpendicularly to the heat transfer portions so as to outwardly discharge heat transferred through the heat transfer portions; and a fastening guide comprising a seating portion on which the heat-generating body is seated, through-holes formed through the bottom of the seating portion and penetrated by the radiation portions of the heatsinks, and support portions provided on the bottom of the seating portion so as to support the heat transfer portions of the heatsinks. The support portions have tension portions formed thereon so as to provide elastic force for elastically supporting the heat transfer portions.

Description

히트싱크와 발열체가 탄성으로 밀착되는 방열장치Heat dissipation device in which heat sink and heating element are in elastic contact
본 발명은 다수의 히트싱크를 발열체에 면접촉시켜서 발열체의 열을 외부로 방출시키는 방열장치에 관한 것으로서, 보다 상세하게는 탄성을 이용해 히트싱크가 발열체에 보다 긴밀하게 밀착되고, 히트싱크 두께의 공차나 체결가이드 중앙부의 처짐 등에도 히트싱크가 흔들림 없이 발열체에 밀착되는 구조를 갖는 히트싱크와 발열체가 탄성으로 밀착되는 방열장치에 관한 것이다.The present invention relates to a heat dissipation device that discharges heat from the heating element to the outside by surface-contacting a plurality of heat sinks to the heating element. More specifically, the heat sink is more closely adhered to the heating element by using elasticity, and the tolerance of the heat sink thickness B. It relates to a heat sink having a structure in which the heat sink is in close contact with the heating element without shaking, even when the central portion of the fastening guide is sagging, and the like.
전기를 사용하는 전기전자 제품은 사용중에 열이 발생되고, 발생되는 열은 전기전자 제품에 악영향을 미쳐 효율을 저하시키고, 수명을 단축시키고, 심한 경우에는 고장을 일으켜 전기전자 제품의 구동을 중지시킨다.Electric and electronic products that use electricity generate heat during use, and the generated heat adversely affects the electric and electronic products, thereby reducing efficiency, shortening the lifespan, and in severe cases, causing malfunctions to stop the operation of electric and electronic products. .
그래서 대부분의 전기전자 제품에는 발생되는 열을 외부로 방출시키는 방열장치가 구비된다.Therefore, most electric and electronic products are equipped with a heat dissipation device that discharges the generated heat to the outside.
본 발명자는 전기전자 제품의 발열체에서 발생되는 열을 보다 효율적으로 외부로 방출시키기 위해 등록특허 제10-13895363호 "방열성을 향상시킨 방열장치"를 제안하였다. The present inventor has proposed a "heat dissipation device with improved heat dissipation" of Patent No. 10-13895363 in order to more efficiently discharge heat generated from a heating element of an electrical and electronic product to the outside.
상기 등록특허 제10-13895363호는 발열체와 면접촉되는 평판형의 'L'형 히트파이프 복수개와, 'L'형 히트파이프들과 발열체의 체결을 가이드하는 체결가이드를 통해 방열효율을 높이는 구조이다. The registered patent No. 10-13895363 is a structure to increase heat dissipation efficiency through a plurality of flat 'L' type heat pipes that are in surface contact with the heating element and a fastening guide that guides the connection of the 'L' type heat pipes and the heating element. .
히트파이프는 제조시의 공차에 의해 제품마다 두께가 조금씩 다를 수 있다. 그래서 상기 등록특허 제10-13895363호에서 많은 히트파이트는 두께의 미세한 차이로 일부는 발열체에 밀착되지 못한다. Heat pipes may differ slightly in thickness by product due to manufacturing tolerances. Therefore, in the registered patent No. 10-13895363, many heat pipes do not closely adhere to the heating element due to a slight difference in thickness.
그리고 체결가이드는 테두리가 있는 가장자리는 뒤틀리거나 쳐지는 등의 변형이 거의 없지만, 중앙부는 뒤틀리거나 쳐지기 쉽다. 뒤틀리거나 쳐지게 되면 그 부위의 히트싱크는 발열체에 제대로 접촉되지 못한다. In addition, the fastening guide has little deformation such as a warped or struck edge of the edge, but the central part is apt to be warped or struck. When warped or struck, the heatsink in the area cannot properly contact the heating element.
다시 말해, 종래기술에서는 공차, 쳐짐 등의 요인으로 히트파이프와 발열체가 긴밀하게 밀착되지 못하여 방열 효율이 떨어지고, 히트싱크가 흔들려 방열장치의 제품 안정성이 떨어지는 문제가 있다. In other words, in the prior art, due to factors such as tolerance and sagging, there is a problem in that the heat pipe and the heating element do not closely contact each other, so that the heat dissipation efficiency decreases, and the heat sink shakes, resulting in poor product stability of the heat dissipation device.
본 발명은 이처럼 종래기술에 따른 방열장치가 갖는 문제를 해결하기 위해 안출된 발명으로서, 체결가이드가 히트싱크를 발열체를 향해 탄성지지하여 밀어줌으로써 히트싱크와 발열체가 긴밀하게 밀착되고, 히트싱크 두께의 공차나 체결가이드의 쳐짐 등이 있어도 히트싱크가 흔들림 없이 발열체에 긴밀하게 밀착되어 방열효율이 뛰어나고, 체결불량이 발생하지 않는 히트싱크와 발열체가 탄성으로 밀착되는 방열장치를 제공함을 목적으로 한다. The present invention is an invention devised to solve the problems of the heat dissipation device according to the prior art, and the heat sink and the heat generating element are in close contact with each other, and the heat sink is in close contact with the coupling guide by elastically supporting and pushing the heat sink toward the heating element. It is an object of the present invention to provide a heat dissipation device in which the heat sink is in close contact with the heating element without shaking and has excellent heat dissipation efficiency even when there is a tolerance or sagging of the fastening guide, and the heat sink and the heat generating element that do not cause a defective connection are elastically close.
이와 같은 목적을 달성하기 위한 본 발명에 따른 히트싱크와 발열체가 탄성으로 밀착되는 방열장치는 A heat dissipation device in which the heat sink and the heating element according to the present invention to achieve this purpose are elastically adhered
발열체;Heating element;
상기 발열체에 면접촉되는 전열부와, 상기 전열부에 수직하게 연결되며 전열부를 통해 전달되는 열을 외부로 방출시키는 방사부를 포함하는 다수의 평판형 히트싱크;A plurality of flat plate heat sinks including a heat transfer portion in surface contact with the heating element and a radiating portion connected vertically to the heat transfer portion to discharge heat transferred through the heat transfer portion to the outside;
상기 발열체가 안착되는 안착부와, 상기 안착부의 바닥에 형성되어서 상기 히트싱크의 방사부가 관통되는 관통홀들과, 상기 안착부의 바닥에 구비되어서 상기 히트싱크의 전열부가 지지되는 지지부들을 포함하는 체결가이드;를 포함하여 이루어지되, A fastening guide including a seating portion on which the heating element is seated, through holes formed at the bottom of the seating portion and through which the radiating portion of the heat sink passes, and supports provided on the bottom of the seating portion to support the heat transfer portion of the heat sink. Including, but,
상기 지지부에는 상기 전열부를 탄성으로 지지하도록 탄성력을 제공하는 텐션부가 형성되는 것을 특징으로 한다. The support portion is characterized in that a tension portion that provides an elastic force to elastically support the heat transfer portion is formed.
그리고 상기 체결가이드의 텐션부는 상기 지지부의 중앙부위에서 상향볼록부와 하향볼록부가 연속하여 연결되는 구조인 것을 특징으로 하고, And the tension portion of the fastening guide is characterized in that the structure in which the upward convex portion and the downward convex portion are continuously connected at the central portion of the support portion,
상기 지지부는 상기 텐션부와 연결되는 내측이 외측 보다 올라간 경사진 구조를 갖는 것을 특징으로 한다. The support portion is characterized in that it has an inclined structure, the inner side of which is connected to the tension portion is higher than the outer side.
본 발명에 따른 히트싱크와 발열체가 탄성으로 밀착되는 방열장치는 히트싱크와 발열체가 긴밀하게 밀착되어서 방열효율이 우수하고, 히트싱크와 발열체 및 체결가이드가 흔들림 없이 안정적으로 체결되고, 히트싱크의 두께가 일정범위 이내라면 모두 체결이 가능한 제품으로서, 산업발전에 매우 유익한 발명이다. The heat dissipation device in which the heat sink and the heating element according to the present invention are elastically in close contact with each other is excellent in heat dissipation efficiency because the heat sink and the heating element are in close contact, and the heat sink and the heating element and the coupling guide are stably fastened without shaking, and the thickness of the heat sink Is a product that can be fastened if it is within a certain range, and is a very beneficial invention for industrial development.
도 1 은 본 발명에 따른 히트싱크와 발열체가 탄성으로 밀착되는 방열장치가 적용된 LED 등기구를 도시한 도면. 1 is a view showing an LED luminaire to which a heat sink according to the present invention is applied with heat dissipation devices that elastically adhere.
도 2 는 도1에서 발열체, 히트싱크 및 체결가이드를 요부로 하는 분해 사시도. Figure 2 is an exploded perspective view of the heating element, heat sink and fastening guide in Figure 1 as a main part.
도 3 은 히트싱크와 체결가이드의 구조를 보여주는 사시도. Figure 3 is a perspective view showing the structure of the heat sink and the fastening guide.
도 4 는 발열체, 히트싱크 및 체결가이드의 결합구조를 보여주는 단면도.Figure 4 is a cross-sectional view showing the coupling structure of the heating element, the heat sink and the fastening guide.
[부호의 설명][Description of codes]
10 : LED모듈 20 : 체결가이드10: LED module 20: fastening guide
21 : 안착부 23 : 관통홀21: seating portion 23: through hole
25 : 지지부 27 : 텐션부25: support 27: tension
30 : 히트싱크 31 : 전열부30: heat sink 31: heating part
33 : 방사부 40 : 누름판33: radiating portion 40: pressing plate
50 : 커버 60 : 바디50: cover 60: body
70 : 하우징 80 : 브라켓70: housing 80: bracket
이하, 도면을 참조하여 본 발명에 따른 히트싱크와 발열체가 탄성으로 밀착되는 방열장치에 대하여 보다 상세하게 설명한다. Hereinafter, a heat dissipation device in which the heat sink and the heating element according to the present invention elastically adhere to each other will be described in detail with reference to the drawings.
본 발명에 따른 히트싱크와 발열체가 탄성으로 밀착되는 방열장치에 관하여 보다 구체적으로 설명하기에 앞서, Before explaining in more detail with respect to the heat sink according to the invention the heat sink and the heating element elastically in close contact,
본 발명은 다양한 변경을 가할 수 있고 여러 가지 형태를 가질 수 있는 바, 구현예(態樣, aspect)(또는 실시예)들을 본문에 상세하게 설명하고자 한다. 그러나 이는 본 발명을 특정한 개시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다. The present invention can be applied to a variety of changes and can have a variety of forms, the implementation (態 樣, aspect) (or embodiments) to be described in detail in the text. However, it is not intended to limit the present invention to a specific disclosure form, it should be understood to include all modifications, equivalents, or substitutes included in the spirit and scope of the present invention.
각 도면에서 동일한 참조부호, 특히 십의 자리 및 일의 자리 수, 또는 십의 자리, 일의 자리 및 알파벳이 동일한 참조부호는 동일 또는 유사한 기능을 갖는 부재를 나타내고, 특별한 언급이 없을 경우 도면의 각 참조부호가 지칭하는 부재는 이러한 기준에 준하는 부재로 파악하면 된다.The same reference numbers in each drawing, especially the number of tens and ones, or the same number of tens, ones and alphabets indicate the members having the same or similar functions, and each of the drawings unless otherwise specified. The member indicated by the reference numeral can be understood as a member conforming to these standards.
또 각 도면에서 구성요소들은 이해의 편의 등을 고려하여 크기나 두께를 과장되게 크거나(또는 두껍게) 작게(또는 얇게) 표현하거나, 단순화하여 표현하고 있으나 이에 의하여 본 발명의 보호범위가 제한적으로 해석되어서는 안 된다.In addition, in each drawing, the components are exaggeratedly large (or thick) or smallly (or thinly) or simplified to express the size or thickness in consideration of convenience, etc., thereby limiting the protection scope of the present invention. It should not be.
본 명세서에서 사용한 용어는 단지 특정한 구현예(태양, 態樣, aspect)(또는 실시예)를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 출원에서, ~포함하다~ 또는 ~이루어진다~ 등의 용어는 명세서 상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.The terminology used herein is only used to describe a specific embodiment (sun, 態 樣, aspect) (or embodiment), and is not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as ~ include ~ or ~ consist of ~ are intended to designate the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and one or more other features. It should be understood that the existence or addition possibilities of fields or numbers, steps, actions, components, parts or combinations thereof are not excluded in advance.
다르게 정의되지 않는 한, 기술적이거나 과학적인 용어를 포함해서 여기서 사용되는 모든 용어들은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미를 가지고 있다. 일반적으로 사용되는 사전에 정의되어 있는 것과 같은 용어들은 관련 기술의 문맥 상 가지는 의미와 일치하는 의미를 가지는 것으로 해석되어야 하며, 본 출원에서 명백하게 정의하지 않는 한, 이상적이거나 과도하게 형식적인 의미로 해석되지 않는다. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Terms such as those defined in a commonly used dictionary should be interpreted as having meanings consistent with meanings in the context of related technologies, and should not be interpreted as ideal or excessively formal meanings unless explicitly defined in the present application. Does not.
먼저, 도면은 본 발명에 따른 히트싱크와 발열체(10)가 탄성으로 밀착되는 방열장치가 적용된 전기제품으로 LED 등기구를 도시하고 있다. First, the drawing shows an LED luminaire as an electric product to which a heat sink according to the present invention and a heat radiator 10 are elastically adhered.
이하에서, 본 발명을 설명함에 있어서 방향은 도3과 도4를 기준으로 상하좌우로 구분함을 원칙으로 한다. Hereinafter, in describing the present invention, it is a principle that the direction is divided into up, down, left, and right based on FIGS. 3 and 4.
도1과 도2를 참조하면, LED 등기구는 바디(60)와, 상기 바디(60)의 상부에 결합되는 체결가이드(20)와, 상기 체결가이드(20)의 안착부에 안착되는 LED모듈(10)과, 상기 LED모듈(10)이 상기 체결가이드(20)에 밀착되어 안착되도록 눌러주는 누름판(40)과, 상기 체결가이드(20)의 상부에 결합되어 상기 LED모듈(10)을 덮는 커버(50)와, 상기 체결가이드(20)를 관통하여 결합되는 히트싱크(30)와, 상기 바디(60)의 각도를 조정하여 고정시키는 브라켓(80)과, 상기 바디(60)의 하부에 결합되고 내부에 LED모듈(10)에 전원을 공급하는 파워서플라이가 내장되는 하우징(70) 등을 포함하여 이루어진다. 1 and 2, the LED luminaire includes a body 60, a fastening guide 20 coupled to an upper portion of the body 60, and an LED module seated on a seating portion of the fastening guide 20 ( 10), the LED module 10 is pressed against the fastening guide 20 so as to be seated so as to be seated 40, and the upper cover of the fastening guide 20 is coupled to cover the LED module 10 (50), a heat sink (30) coupled through the fastening guide (20), a bracket (80) for adjusting and fixing the angle of the body (60), and coupled to the bottom of the body (60) And a housing 70 in which a power supply for supplying power to the LED module 10 is built.
이와 같이 구성되는 LED 등기구에 있어서 본 발명에 따른 방열장치는 발열체(10)(10), 히트싱크(30), 체결가이드(20)를 포함하여 이루어진다 In the LED luminaire configured as described above, the heat dissipation device according to the present invention includes a heating element 10, 10, a heat sink 30, and a fastening guide 20.
상기 발열체(10)는 LED모듈(10)이 되고, LED모듈(10)은 LED와 PCB로 구성된다. 이때 PCB는 열전도율을 높이기 위해 메탈PCB를 사용하는 것이 바람직할 수 있다. The heating element 10 is an LED module 10, and the LED module 10 is composed of an LED and a PCB. At this time, it may be desirable to use a metal PCB to increase the thermal conductivity of the PCB.
상기 히트싱크(30)는 상기 발열체(10)에 면접촉되는 전열부(31)와, 상기 전열부(31)에서 수직하게 연결되는 방사부(33)로 구성되어서, 전체적으로 'L'자형의 모양으로 이루어지고, 얇은 판형 구조를 갖는다. The heat sink 30 is composed of an electric heating part 31 that is in surface contact with the heating element 10, and a radiating part 33 that is vertically connected to the heating part 31, and thus has an overall 'L' shape. It is made of, and has a thin plate-like structure.
상기 전열부(31)는 상부면이 상기 발열체(10)의 하부면에 면접촉되어서 발열체(10)의 열을 전달받고, 상기 방사부(33)는 상기 체결가이드(20)를 관통하여 외부에 노출되어서 전열부(31)의 열을 외부로 방출시킨다. The heat transfer portion 31 is the top surface is in contact with the lower surface of the heating element 10 to receive the heat of the heating element 10, the radiating portion 33 penetrates the fastening guide 20 to the outside Exposed to release the heat of the heat transfer portion 31 to the outside.
상기 체결가이드(20)는 내부에 상기 발열체(10)가 안착되는 안착부(21)가 형성되고, 상기 안착부(21)의 바닥에는 상기 히트싱크(30)의 방사부(33)가 관통되는 관통홀(23)들과, 히트싱크(30)의 전열부(31)가 지지되는 지지부(25)가 형성되고, 상기 지지부(25)의 중앙부위에는 탄성력을 제공하는 텐션부(27)가 형성된다. The fastening guide 20 is formed with a seating portion 21 on which the heating element 10 is seated, and a radiating portion 33 of the heat sink 30 is penetrated to the bottom of the seating portion 21. Through holes 23 and a support portion 25 in which the heat transfer part 31 of the heat sink 30 is supported are formed, and a tension portion 27 that provides elastic force is formed in the central portion of the support portion 25. .
상기 안착부(21)의 가장자리에는 상기 발열체(10)가 제 위치에서 안착되어 걸리는 단턱(22)이 형성된다. At the edge of the seating portion 21, a stepped portion 22 is formed in which the heating element 10 is seated in place.
상기 지지부(25)에는 자재절감과 눌림이 용이하도록 살빼기홀(26)이 형성된다. 상기 지지부(25)는 상기 텐션부(27)와 연결되는 내측이 외측 보다 높은 경사진 구조를 갖는다. The support portion 25 is formed with a weight loss hole 26 to facilitate material reduction and compression. The support portion 25 has a structure in which the inside connected to the tension portion 27 is inclined higher than the outside.
상기 텐션부(27)는 상기 지지부(25)의 중앙부위에 형성된다. 즉, 상기 텐션부(27)의 양측에는 지지부(25)가 연결된다. The tension part 27 is formed at the central part of the support part 25. That is, support portions 25 are connected to both sides of the tension portion 27.
상기 텐션부(27)는 위로 볼록한 상향볼록부(27a)와 아래로 볼록한 하향볼록부(27b)가 연속하여 연결되는 구조로 이루어져서, 위아래 방향으로 들림이나 쳐짐이 가능하고, 좌우방향으로 신축이 가능하여, 외력을 받아 변형된 경우에 원상으로 복귀하려는 탄성력을 발휘한다. The tension portion 27 is made of a structure in which the convex upward convex portion 27a and the downward convex downward convex portion 27b are continuously connected, so that it can be lifted or stretched in the up and down direction, and stretchable in the left and right directions. By doing so, it exerts an elastic force to return to its original shape when deformed under external force.
도4에서 보는 바와 같이 히트싱크(30)의 방사부(33)를 체결가이드(20)의 관통홀(23)로 관통시켜 히트싱크(30)의 전열부(31)를 체결가이드(20)의 지지부(25)에 올려놓으면, 체결가이드(20)의 지지부(25)의 내측이 전열부(31)를 접촉하여 지지한다. As shown in FIG. 4, the radiating portion 33 of the heat sink 30 is penetrated through the through hole 23 of the fastening guide 20 to connect the heat transfer part 31 of the heat sink 30 to the fastening guide 20. When placed on the support portion 25, the inside of the support portion 25 of the fastening guide 20 contacts and supports the heat transfer portion 31.
다음으로, 체결가이드(20)의 안착부(21)에 발열체(10)를 안착시키고 누르면(체결가이드(20)의 안착부(21)에 누름판(40)을 체결시키면 누름판(40)이 발열체(10)를 누름), 히트싱크(30)의 전열부(31)가 발열체(10)에 접촉되면서 함께 눌리고, 그러면 체결가이드(20)의 지지부(25)가 아래로 눌려 쳐지게 된다. Next, the heating element 10 is seated and pressed on the seating portion 21 of the fastening guide 20 (if the pressing plate 40 is fastened to the seating portion 21 of the fastening guide 20, the pressing plate 40 generates a heating element ( 10) is pressed), the heat transfer portion 30 of the heat sink 30 is pressed together while contacting the heating element 10, and then the support portion 25 of the fastening guide 20 is pressed down.
이 상태에서는 텐션부(27)가 원상태로 복귀하려는 탄성력을 제공하여 지지부(25)와 텐션부(27)가 히트싱크(30)의 전열부(31)를 위로 밀어서 발열체(10)에 밀착시킨다. In this state, the tension part 27 provides elastic force to return to the original state, so that the support part 25 and the tension part 27 push the heat transfer part 31 of the heat sink 30 upward to be in close contact with the heating element 10.
상기 체결가이드(20)의 지지부(25)와 텐션부(27)가 원상태로 복귀하려는 탄성력으로 히트싱크(30)의 전열부(31)를 위로 지속적으로 밀게 되어서, 히트싱크(30)의 두께가 일정하지 않아도 히트싱크(30)는 발열체(10)에 밀착되고, 전열부(31)를 위로 미는 힘은 지속해서 작용함으로 히트싱크(30)와 발열체(10)는 흔들림 없이 체결가이드(20)에 체결된다. The support portion 25 and the tension portion 27 of the fastening guide 20 continuously push the heat transfer portion 31 of the heat sink 30 upward with elastic force to return to the original state, so that the thickness of the heat sink 30 is increased. Even if it is not constant, the heat sink 30 is in close contact with the heating element 10, and the force pushing the heat transfer part 31 continuously acts, so that the heat sink 30 and the heating element 10 are connected to the fastening guide 20 without shaking. Is concluded.
이상에서 본 발명을 설명함에 있어 첨부된 도면을 참조하여 특정 형상과 구조를 갖는 히트싱크와 발열체가 탄성으로 밀착되는 방열장치에 대해 설명하였으나 본 발명은 당업자에 의하여 다양한 변형 및 변경이 가능하고, 이러한 변형 및 변경은 본 발명의 보호범위에 속하는 것으로 해석되어야 한다.In the above description of the present invention with reference to the accompanying drawings, a heat sink having a specific shape and structure and a heat generating element elastically in contact with each other has been described, but the present invention can be variously modified and changed by those skilled in the art. Modifications and modifications should be construed as falling within the protection scope of the present invention.

Claims (3)

  1. 발열체;Heating element;
    상기 발열체에 면접촉되는 전열부와, 상기 전열부에 수직하게 연결되며 전열부를 통해 전달되는 열을 외부로 방출시키는 방사부를 포함하는 다수의 평판형 히트싱크;A plurality of flat plate heat sinks including a heat transfer portion in surface contact with the heating element and a radiating portion connected vertically to the heat transfer portion to discharge heat transferred through the heat transfer portion to the outside;
    상기 발열체가 안착되는 안착부와, 상기 안착부의 바닥에 형성되어서 상기 히트싱크의 방사부가 관통되는 관통홀들과, 상기 안착부의 바닥에 구비되어서 상기 히트싱크의 전열부가 지지되는 지지부들을 포함하는 체결가이드;를 포함하여 이루어지되, A fastening guide including a seating portion on which the heating element is seated, through holes formed at the bottom of the seating portion and through which the radiating portion of the heat sink passes, and supports provided on the bottom of the seating portion to support the heat transfer portion of the heat sink. Including, but,
    상기 지지부에는 상기 전열부를 탄성으로 지지하도록 탄성력을 제공하는 텐션부가 형성되는 것을 특징으로 하는 히트싱크와 발열체가 탄성으로 밀착되는 방열장치. A heat dissipation device in which the heat sink and the heating element are elastically in close contact with each other, wherein the support portion is formed with a tension portion providing elastic force to elastically support the heat transfer portion.
  2. 제 1 항에 있어서, According to claim 1,
    상기 체결가이드의 텐션부는 상기 지지부의 중앙부위에서 상향볼록부와 하향볼록부가 연속하여 연결되는 구조인 것을 특징으로 하는 히트싱크와 발열체가 탄성으로 밀착되는 방열장치. A heat dissipation device in which the heat sink and the heating element are elastically close to each other, characterized in that the tension portion of the fastening guide is a structure in which the upward convex portion and the downward convex portion are continuously connected at the central portion of the support portion.
  3. 제 2 항에 있어서, According to claim 2,
    상기 지지부는 상기 텐션부와 연결되는 내측이 외측 보다 올라간 경사진 구조를 갖는 것을 특징으로 하는 히트싱크와 발열체가 탄성으로 밀착되는 방열장치. The support portion heat dissipation device in which the heat sink and the heating element are elastically in contact with each other, characterized in that the inner side connected to the tension portion has an inclined structure that is higher than the outer side.
PCT/KR2019/013541 2018-10-23 2019-10-15 Heat-radiating device having heatsink and heat-generating body elastically forced against each other WO2020085709A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219238B1 (en) * 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
JP3095802U (en) * 2002-05-07 2003-08-22 デルタ エレクトロニクス インコーポレイテッド Fixing device
US20080232068A1 (en) * 2007-03-22 2008-09-25 Foxconn Technology Co., Ltd. Heat dissipation device having a fixing base
JP2016092346A (en) * 2014-11-11 2016-05-23 三菱電機株式会社 Power semiconductor device
KR20180105932A (en) * 2017-03-16 2018-10-01 (주)모일 Heat sink that plurality of cooling fin is individually allocate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395802U (en) * 1990-01-22 1991-09-30
US5276585A (en) * 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus
JPH0982860A (en) * 1995-09-08 1997-03-28 Akuteii:Kk Mounting frame for heat sink for semiconductor element use
US20080000618A1 (en) * 2006-06-28 2008-01-03 Robert Liang Heat Dissipating Module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219238B1 (en) * 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
JP3095802U (en) * 2002-05-07 2003-08-22 デルタ エレクトロニクス インコーポレイテッド Fixing device
US20080232068A1 (en) * 2007-03-22 2008-09-25 Foxconn Technology Co., Ltd. Heat dissipation device having a fixing base
JP2016092346A (en) * 2014-11-11 2016-05-23 三菱電機株式会社 Power semiconductor device
KR20180105932A (en) * 2017-03-16 2018-10-01 (주)모일 Heat sink that plurality of cooling fin is individually allocate

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