WO2020083308A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

Info

Publication number
WO2020083308A1
WO2020083308A1 PCT/CN2019/112747 CN2019112747W WO2020083308A1 WO 2020083308 A1 WO2020083308 A1 WO 2020083308A1 CN 2019112747 W CN2019112747 W CN 2019112747W WO 2020083308 A1 WO2020083308 A1 WO 2020083308A1
Authority
WO
WIPO (PCT)
Prior art keywords
opening
substrate
display panel
encapsulation layer
layer
Prior art date
Application number
PCT/CN2019/112747
Other languages
English (en)
French (fr)
Inventor
王涛
张嵩
孙韬
张子予
秦成杰
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/652,519 priority Critical patent/US11233222B2/en
Publication of WO2020083308A1 publication Critical patent/WO2020083308A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure belongs to the field of display technology, and in particular relates to a display panel, a preparation method thereof, and a display device.
  • the implementation of the stretchable display panel includes the stretchability of the substrate, the stretchability of the thin film transistor (Thin Film Transistor; TFT), and the stretchability of the encapsulation layer.
  • TFT Thin Film Transistor
  • the display structure on the substrate is partitioned and encapsulated to separate the encapsulation layers in different regions, so that the encapsulation structure can better adapt to the stress received when the display panel is stretched.
  • a display panel including: a substrate; a plurality of display devices on one side of the substrate; a plurality of thin-film encapsulation layers on the side of the plurality of display devices away from the substrate and covering the A plurality of display devices; wherein, the orthographic projections of the plurality of thin film encapsulation layers on the substrate are discontinuous, and at least one of the plurality of thin film encapsulation layers covers at least one of the plurality of display devices Display device.
  • the display panel includes an axis of symmetry
  • the plurality of thin-film encapsulation layers are located on both sides of the axis of symmetry, and are along the edges of the display panel from the axis of symmetry
  • the symmetry axis is arranged perpendicular to the direction.
  • the orthographic projection of the plurality of thin-film encapsulation layers on the substrate has a rectangle extending along the axis of symmetry; and the plurality of thin-film encapsulation layers in a direction perpendicular to the axis of symmetry The width decreases sequentially away from the axis of symmetry.
  • the plurality of thin film encapsulation layers are arranged in an array; the orthographic projection of the plurality of thin film encapsulation layers on the substrate is discontinuous in a direction parallel to the axis of symmetry; the multiple The orthographic projection of each thin film encapsulation layer on the substrate is discontinuous in the direction perpendicular to the axis of symmetry; and the orthographic projection areas of the multiple thin film encapsulation layers on the substrate are equal.
  • the plurality of thin-film encapsulation layers are arranged around a center in an orthographic projection of the substrate, and are respectively arranged in a radial direction from the center to the edge of the display panel.
  • the orthographic projection of the plurality of thin-film encapsulation layers on the substrate is a plurality of circular rings, and the orthographic projection of two adjacent thin-film encapsulation layers on the substrate is in the radial direction The distance increases gradually away from the center.
  • each of the plurality of thin-film encapsulation layers is equally divided into a plurality of portions extending in the circumferential direction.
  • the thin-film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are sequentially provided along the direction from the substrate to the display device.
  • the second inorganic encapsulation layer completely covers both side walls of the organic encapsulation layer and a surface of the organic encapsulation layer away from the substrate.
  • the organic encapsulation layer and the second inorganic encapsulation layer are formed as a group, and multiple sets of organic encapsulation layers and the second inorganic encapsulation layer are sequentially stacked on the first inorganic layer away from the substrate Side.
  • the plurality of first opening groups are located in the plurality of thin film encapsulation layers, so that the orthographic projection of the plurality of thin film encapsulation layers on the substrate is discontinuous.
  • each first opening group includes a first opening, a second opening, and a third opening; the first opening is located in the first inorganic encapsulation layer, and the first opening is on the substrate Of the orthographic projection falls between two adjacent display devices adjacent to it; the second opening is located in the second inorganic encapsulation layer, and the orthographic projection of the second opening on the substrate falls into the The first opening is within the range defined by the orthographic projection on the substrate; the third opening is located in the organic encapsulation layer, the second opening corresponds to at least a portion of the third opening, and the second The orthographic projection of the opening on the substrate falls within the range defined by the orthographic projection of the third opening on the substrate.
  • the orthographic projection of the first opening on the substrate completely overlaps the orthographic projection of the second opening on the substrate.
  • a plurality of second opening groups are located in the plurality of thin-film encapsulation layers, so that each of the plurality of thin-film encapsulation layers is equally divided into a plurality of portions extending in the circumferential direction.
  • each second opening group includes a fourth opening, a fifth opening, and a sixth opening; the fourth opening is located in the first inorganic encapsulation layer, and the fourth opening is on the substrate Of the orthographic projection falls between two adjacent display devices adjacent to it; the fifth opening is located in the second inorganic encapsulation layer, the orthographic projection of the fifth opening on the substrate falls into the A fourth opening within a range defined by an orthographic projection on the substrate; the sixth opening is located in the organic encapsulation layer, the fifth opening corresponds to at least a portion of the sixth opening, and the fifth The orthographic projection of the opening on the substrate falls within the range defined by the orthographic projection of the sixth opening on the substrate.
  • the plurality of display devices are OLED display devices.
  • a display device including the above display panel.
  • a method for manufacturing a display panel including: forming a plurality of display devices on one side of a substrate; forming a first inorganic encapsulating material layer covering the plurality of display devices on the substrate; Forming an organic encapsulating material layer on the side of an inorganic encapsulating material layer away from the substrate; patterning the organic encapsulating material layer to form an organic encapsulating layer; forming a second on the side of the organic encapsulating layer away from the substrate An inorganic encapsulating material layer, the second inorganic encapsulating material layer covering the exposed surfaces of the organic encapsulating layer and the first inorganic encapsulating material layer; and the first inorganic encapsulating material layer and the second inorganic encapsulating material The layer performs an etching process to form an opening between adjacent display devices of the plurality of display devices.
  • FIG. 1 and 2 are schematic structural diagrams of a display panel according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural view of a display device formed in the method of manufacturing a display panel according to an embodiment of the present disclosure
  • FIG. 7 is a schematic structural view of forming a pre-encapsulated material layer in a method of manufacturing a display panel according to an embodiment of the present disclosure
  • FIG. 8 is a schematic structural view of an organic encapsulation layer forming a thin-film encapsulation group in a method of manufacturing a display panel according to an embodiment of the present disclosure
  • FIG. 9 is a schematic structural view of an inorganic encapsulation layer forming a thin-film-free encapsulation group in the method of manufacturing a display panel according to an embodiment of the present disclosure
  • FIG. 10 is a schematic structural view of forming a pre-encapsulation layer having a first opening and an inorganic encapsulation layer having a second opening in the method of manufacturing a display panel according to an embodiment of the present disclosure.
  • the encapsulation layer usually uses a metal mask to form a patterned encapsulation layer directly on the substrate through chemical vapor deposition and other methods.
  • a metal mask is used to prepare the encapsulation layer, there will be uneven areas with a width of 50um to 300um at the edge of the formed encapsulation layer. Since the size of the area is much larger than the size of the pixel unit, and the film thickness is uneven, the packaging effect of the display device in the area is not good, so that the reliability of the prepared display panel cannot be guaranteed. Therefore, the encapsulation layer in the prior art is still an entire layer structure covering the display panel, and this may easily cause the encapsulation layer to break when stretched, and the reliability of the display panel is greatly threatened.
  • FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • this embodiment provides a display panel, which is particularly suitable for a stretchable panel, which includes: a substrate 1; a plurality of display devices 2, which are located on the substrate 1 and arranged in an array, and are spaced apart from each other; A plurality of thin-film encapsulation layers are located on the side of the plurality of display devices away from the substrate and cover the plurality of display devices 1.
  • the orthographic projection of the plurality of thin-film encapsulation layers on the substrate 1 is discontinuous, and at least one of the plurality of thin-film encapsulation layers 4 covers at least one display device 1 of the plurality of display devices.
  • the thin film encapsulation layer includes a pre-encapsulation layer 3 (first inorganic encapsulation layer), an organic encapsulation layer 42 and an inorganic encapsulation layer that are sequentially arranged on the display panel in a direction perpendicular to the substrate 1 from the substrate 1 to the display device 2 41.
  • the above-mentioned thin-film encapsulation layer constitutes the encapsulation structure of this embodiment, so as to encapsulate each display device 2 on the display panel.
  • the encapsulation of the display device 2 is mainly realized by an inorganic encapsulation layer (that is, the pre-encapsulation layer 3 and the inorganic encapsulation layer 41), and the organic encapsulation layer 42 is mainly used to reduce the stress between two adjacent inorganic encapsulation layers 41, Therefore, the single-layer inorganic encapsulating layer 41 is less likely to be cracked in the thickness direction of the display panel.
  • a packaging structure in which an inorganic encapsulation layer and an organic encapsulation layer are overlapped can be formed on the substrate 1, and the layer structure (pre-encapsulation layer 3) closest to the substrate 1 in the packaging structure and The layer structure farthest from the substrate 1 (the inorganic encapsulation layer 41 farthest from the substrate 1) is an inorganic encapsulation layer, thereby ensuring the encapsulation effect on the display device 2.
  • the plurality of first opening groups are located in the plurality of thin film encapsulation layers, so that the orthographic projections of the plurality of thin film encapsulation layers on the substrate are discontinuous.
  • the first opening group includes a first opening, a second opening, and a third opening.
  • the pre-encapsulation layer 3 has a first opening, and the first opening corresponds to a space between adjacent display devices 2; in at least one group of thin film packaging groups, the inorganic encapsulation layer 41 has a second opening, and the second opening corresponds to an adjacent display The space between the devices 2; the organic encapsulation layer 42 has a third opening, the second opening corresponds to at least part of the third opening, and the orthographic projection of the second opening on the substrate 1 falls into its corresponding third opening on the substrate Within the range defined by the orthographic projection on 1.
  • the inorganic packaging layer is mainly used to encapsulate the display device 2 on the display panel. Therefore, in this embodiment, an opening is provided in at least one inorganic packaging layer in the packaging structure (that is, in the pre-encapsulation layer 3) The first opening in the second package and the second opening in the inorganic encapsulation layer 41), so that the encapsulation structure can better adapt to the stress received when the display panel is stretched, and it is not easy to generate cracks when the display panel is stretched, which improves the display device 2 Package reliability.
  • the shape of the opening is not limited, and can be any shape.
  • each opening in the inorganic encapsulation layer should correspond to the space between adjacent display devices 2 on the display panel. As shown in FIG. 1, on the display panel, the area between adjacent display devices 2 is a space.
  • the orthographic projection of the first opening on the substrate 1 should fall into its corresponding partition area, so that the orthographic projection of the pattern of the pre-encapsulation layer 3 on the substrate 1 can cover each display device 2 to ensure the display device 2 Encapsulation effect.
  • the orthographic projection of the second opening on the substrate 1 by the inorganic encapsulation layer 41 should also be smaller than and fall into the orthographic projection of the corresponding partition on the substrate 1.
  • the inorganic encapsulation layer 41 with an opening should cover the adjacent and located The organic encapsulation layer 42 on the side close to the substrate 1, for example, the inorganic encapsulation layer 41 completely covers both side walls of the organic encapsulation layer 42 and a surface away from the substrate 1 so that the organic encapsulation layer 42 will not be exposed (ie The inorganic encapsulation layer 41 in the same thin-film encapsulation group should cover the organic encapsulation layer 42 located below and in direct contact with it, so as to prevent external water and oxygen from entering the organic encapsulation layer 42 and affecting the product performance of the display panel.
  • the organic encapsulation layer 42 has a third opening, that is, by providing the third opening, the organic encapsulation layer 42 is not prone to cracks when the display panel is stretched. Specifically, as shown in FIG. 1, both the inorganic encapsulation layer 41 and the organic encapsulation layer 42 are provided with openings.
  • the organic encapsulation layer 42 has a third opening at a position corresponding to the second opening of the inorganic encapsulation layer 41, and the third opening in the organic encapsulation layer 42 is larger than the second opening in the inorganic encapsulation layer 41 (ie, organic (The orthographic projection of the third opening in the encapsulation layer 42 on the substrate 1 overlaps and is greater than the orthographic projection of the second opening in the inorganic encapsulation layer 41 on the substrate 1), so that each pattern of the inorganic encapsulation layer 41 covers the corresponding organic
  • the pattern of the encapsulation layer 42 is such that all sides of the display device 2 except the side close to the substrate 1 are covered by the inorganic encapsulation layer 41, thereby enhancing the encapsulation effect on the display device 2. It can be understood that, as shown in FIG. 1, a third opening may also be provided at a position covered by the inorganic encapsulation layer 41 in the organic encapsulation layer 42, which is not limited in this embodiment.
  • the inorganic encapsulation layer 41 of the thin film encapsulation group has the second opening
  • the organic encapsulation layer 42 has the third opening, the first opening and the second opening 3.
  • the third openings are set correspondingly (for example, one-to-one).
  • the orthographic projection of the first opening on the substrate 1 and the corresponding orthographic projection of the corresponding second opening on the substrate 1 overlap (for example, completely overlap, that is, the first opening and the second opening correspond to each other, and the shape and size are completely consistent ),
  • the orthographic projections of the first opening and the second opening on the substrate 1 fall (for example, completely fall) orthographic projections of the corresponding third openings on the substrate 1.
  • the pre-encapsulation material layer 3a, the patterned organic encapsulation layer 42, and the inorganic encapsulation material layer 41a of the thin-film encapsulation group can be prepared in sequence, and then the patterned pre The encapsulation layer 3 and the inorganic encapsulation layer 41 of the thin film encapsulation group, thereby simplifying the manufacturing process of the display panel.
  • FIG. 2 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • this embodiment provides a display panel, specifically a stretchable OLED panel.
  • the OLED panel has a row direction and a column direction, where the row direction refers to a horizontal direction and the column direction refers to a direction perpendicular to the horizontal direction Vertically.
  • the packaging structure includes a pre-encapsulation layer 3, an organic encapsulation layer, and an inorganic encapsulation layer, and the pre-encapsulation layer 3, the organic encapsulation layer, and the inorganic encapsulation layer are all provided with openings as an example to specifically describe this embodiment.
  • the display panel in this embodiment has a fixed end and a stretched end.
  • the display panel When the display panel is stretched, the display panel has a stretching direction from the fixed end to the stretched end.
  • the fixed end is not necessarily a fixed position of the display panel, and may also be a position where the display panel receives the least force when being stretched, and may specifically be a display that is subjected to stretching forces in different directions The stress center of the panel.
  • the stretched end may be the position where the display panel is subjected to the most stress when stretched. It can be understood that the fixed end may be a fixed point or a line or surface composed of multiple points, and the stretched end may be a fixed point or a line or surface composed of multiple points.
  • the fixed end is a line composed of the midpoints in the stretching direction of the display panel, and the stretched ends are the two sides of the display panel; when When the display panel is stretched with the same amount of force around the display panel, the fixed end is the center of the display panel, and the stretched end is the edge of the display panel.
  • the stretched end is the two sides of the display panel in the row direction (horizontal direction in FIG. 2; the arrow points to the stretched direction), and the fixed end is the axis of symmetry of the display panel (in FIG. 2 along the column direction) Vertical dotted line) is used as an example for description.
  • a plurality of OLED display devices arranged at intervals are arranged on the substrate 1, and a side including the pre-encapsulation layer 3, the organic encapsulation layer 42, and the inorganic encapsulation layer 41 are sequentially arranged on the side of the OLED display device facing away from the substrate 1 Multiple thin-film encapsulation layers.
  • the plurality of thin-film encapsulation layers are located on both sides of the axis of symmetry, and are arranged along a direction perpendicular to the axis of symmetry.
  • each thin-film encapsulation layer on the substrate has a rectangular shape and is arranged along the axis of symmetry (or along the column direction).
  • the pre-encapsulation layer 3 has a plurality of first openings, each of which corresponds to a space between adjacent display devices 2; the inorganic encapsulation layer 41 of the thin-film encapsulation group has a plurality of second openings, each second opening Corresponding to the space between adjacent display devices 2.
  • the pre-encapsulation layer 3 in this embodiment has a plurality of first openings, and the distance between adjacent first openings gradually decreases in the direction from the fixed end to the stretched end, for example, along the left
  • the distance between the first openings H1 and H2 is d1
  • the distance between the first openings H3 and H2 is d2
  • d1> d2 In the stretching direction to the right, the distance between the first openings H1 and H4 is d3
  • the distance between the first openings H4 and H5 is d4, and d3> d4.
  • the inorganic encapsulation layer 41 of the thin-film encapsulation group has a plurality of second openings, and the distance between adjacent second openings gradually decreases in the direction from the fixed end to the stretched end.
  • the pre-encapsulation layer 3 having the first opening as an example, as shown in FIG. 2, in the stretching direction of the display panel, one of the two adjacent first openings (H1 and H2) in the middle region of the pre-encapsulation layer 3
  • the distance d1 between them is greater than the distance d2 between the two adjacent first openings (H2 and H3) in the edge region, that is, the pattern between the two adjacent first openings (H1 and H2) in the middle region of the pre-encapsulation layer 3
  • the number of corresponding display devices 2 (for example, 3) is greater than the number of display devices 2 corresponding to the pattern between the adjacent two first openings (H2 and H3) of the edge region of the pre-encapsulation layer 3 (for example, 2).
  • the width of the plurality of thin-film encapsulation layers in the row direction decreases sequentially away from the axis of symmetry. Along the direction from the fixed end to the stretched end, the width of the plurality of thin film encapsulation layers in the row direction gradually decreases.
  • the reason for this setting is that: in practical applications, the size of the display device 2 is extremely small, and the opening accuracy to the mask plate is high, so in this embodiment, the first opening in the pre-encapsulation layer 3 corresponds only to all of the display panel A part of the partition area (that is, some of the partition areas are not provided with a first opening), thereby reducing the requirement on the opening accuracy of the mask plate and reducing the difficulty of preparing the display panel.
  • the stress is different at different positions. The closer to the stretched end (forced end), the greater the stress, and the more likely the film layer to crack there.
  • the design of the opening pitch makes the pre-encapsulation layer 3 more suitable for the tensile force received when the substrate is stretched, and reduces the risk of cracks.
  • the second opening of the inorganic encapsulation layer 41 in the thin-film encapsulation group can also be provided in the same manner, so as to achieve the effects of reducing the risk of cracks and reducing the opening accuracy requirements of the mask plate.
  • each first opening in the pre-encapsulation layer 3 corresponds in the column direction (for example, parallel), that is, the first opening between two adjacent display devices 2 is The upper and lower parts of the display panel are in communication; each second opening in the inorganic encapsulation layer 41 of the thin film encapsulation group corresponds in the column direction (for example, parallel), that is, between the second display device 2 adjacent to the second column The two openings communicate at the upper and lower parts of the display panel.
  • a plurality of openings adjacent in the vertical direction of the stretching direction communicate at the upper and lower portions of the display panel.
  • each first opening is arranged in the row direction and extends to the upper and lower portions of the display panel along the column direction.
  • the first opening corresponding to the space between two adjacent display devices 2 in the column direction may extend in the column direction to the upper and lower edges of the display area of the display panel, while in a plan view No opening is formed in the direction of the row. .
  • the pre-encapsulation layer 3 of the display panel is a stripe pattern divided by a plurality of openings, and each stripe pattern extends in the column direction to cover one or more columns of display devices 2.
  • the distance between the openings can be set according to the actual situation.
  • the pre-encapsulation layer 3 between two adjacent columns of first openings in the middle region on the display panel covers one column or For a plurality of columns of display devices 2, and toward the edge area, the number of columns of the display device 2 corresponding to the pre-encapsulation layer 3 between the first openings of two adjacent columns is smaller.
  • the specific number of columns of the display device 2 corresponding to the pre-encapsulation layer 3 between two columns of adjacent first openings can be set according to actual conditions, and is not limited herein.
  • FIG. 3 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure. As shown in FIG. 3, this embodiment provides a display panel, such as a stretchable OLED panel.
  • the packaging structure includes a pre-encapsulation layer 3, an organic encapsulation layer 42, and an inorganic encapsulation layer 41, and the pre-encapsulation layer 3, the organic encapsulation layer Both the 42 and the inorganic encapsulating layer 41 are provided with openings as an example to describe this embodiment in detail.
  • the display panel in this embodiment has a fixed end and a stretched end.
  • the display panel When the display panel is stretched, the display panel has a stretching direction from the fixed end to the stretched end.
  • the stretching direction may be multiple different directions.
  • the substrate 1 is provided with a plurality of spaced-apart OLED display devices arranged in an array, and a pre-encapsulation layer 3, an organic encapsulation layer 42, and an inorganic Encapsulation layer 41.
  • the orthographic projection of the plurality of thin-film encapsulation layers on the substrate is discontinuous in the direction parallel to the axis of symmetry; the orthographic projection of the plurality of thin-film encapsulation layers on the substrate is The direction perpendicular to the axis of symmetry is discontinuous.
  • the position of the space between every N rows of display devices 2 in the pre-encapsulation layer 3 has a first opening, where N is greater than or equal to 1 and less than half of the total number of rows, and every M columns of display devices 2
  • the positions of the interspaces all have a first opening, where M is greater than or equal to 1 and less than half of the total number of columns; the position of the interspace between adjacent display devices 2 in the inorganic encapsulation layer 41 corresponding to every N rows or every M columns
  • Each has a second opening.
  • the orthographic projections of the multiple thin-film encapsulation layers on the substrate are square.
  • M the orthographic projections of the multiple thin-film encapsulation layers on the substrate are rectangular.
  • the display devices arranged in a 2 * 2 array are encapsulated by a thin film encapsulation layer, and the display arranged in a 2 * 2 array on the right side of the display device arranged in a 2 * 2 array
  • the device is encapsulated by another thin-film encapsulation layer, and so on.
  • the orthographic projection of the thin-film encapsulation layer on the substrate is a square of equal area.
  • the display devices arranged in a 2 * 3 array are encapsulated by a thin film encapsulation layer, and the display devices arranged in a 2 * 3 array on the right side of the display devices arranged in a 2 * 3 array It is encapsulated by another thin-film encapsulation layer, and so on.
  • the orthographic projection of the thin-film encapsulation layer on the substrate is a rectangle of equal area.
  • an opening is formed between any two display devices adjacent in the row direction, and an opening is formed between any two display devices adjacent in the column direction, so that only one thin film encapsulation layer encapsulates Display device.
  • the pre-encapsulation layer 3 By providing openings in the pre-encapsulation layer 3, the organic encapsulation layer 42 and the inorganic encapsulation layer 41 at positions corresponding to any spaced regions, the pre-encapsulation layer 3, the organic encapsulation layer 42 and the inorganic encapsulation layer 41 can be adapted to the display panel to the greatest extent The stretching of the package improves the package reliability of the package structure and extends the life of the display panel.
  • the first opening of the pre-encapsulation layer 3 corresponding to the space between every M columns of display devices 2 communicates at the edge of the display panel, and the pre-encapsulation layer 3 corresponds to every N rows of display devices 2
  • the first opening of the spacer area communicates at the edge of the display panel;
  • the second opening of the spacer area between every M columns of the display device 2 of the inorganic encapsulation layer 41 communicates at the edge of the display panel,
  • the second opening of the space between the row display devices 2 communicates at the edge of the display panel.
  • a portion of the first opening extends along the row direction.
  • the first opening of the remaining portion extends along the column direction, and the first opening of the remaining portion and the first opening of the portion form a network orthogonal to each other.
  • as many openings as possible are formed between the display devices on the display panel corresponding to the encapsulation film layer to adapt to the tensile forces in different directions.
  • FIG. 4 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • this embodiment provides a display panel, which is particularly suitable for a stretchable display panel. Wherein, at least part of the outline of the display area of the display panel is arc-shaped in a plan view.
  • the shape of the display area is circular as an example for description.
  • the shape of the display panel may be a circle matching the display area.
  • the shape of the display panel may also be a square or other shapes, which is not limited herein.
  • the display panel in this embodiment has a fixed end and a stretched end.
  • the display panel When the display panel is stretched, the display panel has a stretched direction from the fixed end to the stretched end (the stretched direction is indicated by an arrow).
  • the fixed end is located at the edge of the display area
  • the stretched end is located at the center of the display area (the center of FIG. 4) as an example for description.
  • the display panel of this embodiment includes a multi-turn display device 2 arranged along the outline of the display area (for example, a circular arrangement); a pre-encapsulation layer on the side of the display device 2 facing away from the substrate and sequentially arranged in a direction away from the substrate 3.
  • the pre-encapsulation layer 3 has a first opening, the orthographic projection of the first opening on the substrate 1 falls into the space between the two adjacent display devices 2 corresponding to it; at least one inorganic encapsulation layer of the thin-film encapsulation group 41 has a second opening, the orthographic projection of the second opening on the substrate 1 falls into the space between the corresponding two adjacent display devices 2; the organic encapsulation layer 42 has a third opening, the second opening is at least A portion of the third opening corresponds, and the orthographic projection of the second opening on the substrate 1 falls within the range defined by the orthographic projection of the corresponding third opening on the substrate 1.
  • the display devices 2 on the display panel are evenly arranged with the center of the circle of the display area as the center, and the display device 2 forms a plurality of concentric rings on the display panel.
  • the first opening in the pre-encapsulation layer 3 corresponds to the space between the two adjacent display devices 2.
  • the stretch direction of the display panel is toward the center of the circle of the display panel (the fixed end is the edge of the display panel, and the stretched end is the center of the display panel), pass the first
  • the arrangement of the opening can make the pre-encapsulation layer 3 better adapt to the stress received when the display panel is stretched, and it is not easy to generate cracks when the display panel is stretched, thereby improving the packaging reliability of the display device 2.
  • the inorganic encapsulation layer 41 in the thin film encapsulation group can enhance its resistance to stretching through the arrangement of the second opening.
  • the inorganic encapsulation layer 41 has a second opening
  • the organic encapsulation layer 42 has a third opening. That is, the arrangement of the third opening makes it difficult for the organic encapsulation layer 42 to generate cracks when the display panel is stretched.
  • a third opening is necessarily provided at the second opening of the organic encapsulation layer 42 corresponding to the inorganic encapsulation layer 41, and the third opening in the organic encapsulation layer 42 is larger than the second opening in the inorganic encapsulation layer 41, thereby Each pattern of the inorganic encapsulation layer 41 is covered with the corresponding pattern of the organic encapsulation layer 42 so that all the sides of the display device 2 except the side close to the substrate 1 are provided with the inorganic encapsulation layer 41, thereby further enhancing the display device 2 Encapsulation. It can be understood that a third opening may also be provided in the position of the organic encapsulation layer 42 covered by the inorganic encapsulation layer 41, which is not limited in this embodiment.
  • the first opening, the second opening, and the third opening constitute a first opening group.
  • Each of the plurality of first opening groups extends in the circumferential direction of the display area to form an annular opening.
  • a plurality of annular openings are arranged concentrically around the center of the display panel.
  • the plurality of thin film encapsulation layers are arranged around the center in an orthographic projection of the substrate, and are respectively arranged in a radial direction from the center to the edge of the display panel.
  • the orthographic projection of the plurality of thin-film encapsulation layers on the substrate is a plurality of circular rings.
  • the stretch direction of the display panel is from the center of the display panel to the edge of the display panel, the center of the display panel is under a greater force, so in the radial direction of the display panel (from the center of the display panel to the edge of the display panel), adjacent
  • the separation distance between the two first openings can be gradually increased to make the packaging structure better adapt to the stretching of the display panel.
  • the distance of the orthographic projections of two adjacent thin-film encapsulation layers on the substrate in the radial direction gradually increases as they move away from the center.
  • each of the plurality of thin-film encapsulation layers is equally divided into a plurality of portions extending in the circumferential direction by the plurality of second opening groups.
  • a plurality of second opening groups are provided in the pre-encapsulation layer, the inorganic encapsulation layer, and the organic encapsulation layer.
  • the plurality of second opening groups respectively extend in a radial direction of the display area of the display panel, and intersect and communicate with each of the plurality of first opening groups to make the packaging structure better adapt to the display Panel stretch.
  • Each second opening group includes a fourth opening, a fifth opening, and a sixth opening.
  • the pre-encapsulation layer also has a fourth opening, and the orthographic projection of the fourth opening on the substrate falls into the space between the two adjacent display devices in the display device corresponding to the same circle. That is, as shown in FIG. 5, in addition to providing the first opening at a position between the two adjacent display devices 2 of the pre-encapsulation layer 3 corresponding to the adjacent turn, A fourth opening can also be provided at the position of the partition.
  • a plurality of first openings may intersect and communicate with each other through a fourth opening to form an annular opening. That is, a plurality of first openings adjacent in the circumferential direction of the circular display panel can communicate through each of the plurality of fourth openings to form a ring-shaped opening, so that a plurality of concentric ring-shaped openings can be formed on the display panel To enhance the tensile resistance of the pre-encapsulation layer 3 and reduce the difficulty of preparing the display panel.
  • the inorganic encapsulation layer 41 has a fifth opening.
  • the orthographic projection of the fifth opening on the substrate 1 falls into the space between the two adjacent display devices 2 in the same circle of display devices 2 corresponding thereto.
  • the orthographic projection of the fifth opening on the substrate falls within the range defined by the orthographic projection of the fourth opening on the substrate;
  • the organic encapsulation layer 42 has a sixth opening, the sixth opening and At least part of the fifth opening corresponds, and the orthographic projection of the fifth opening on the substrate 1 falls within the range defined by the orthographic projection of the corresponding sixth opening on the substrate 1.
  • the inorganic encapsulation layer 41 corresponding to the space between two adjacent display devices 2 in the same circle may also be provided with a fifth opening, and at the position corresponding to the fifth opening, the organic encapsulation layer 42 is also provided with a sixth opening, So as to better adapt to the stretching of the circular display panel.
  • the inorganic encapsulation layer 41 covers the organic encapsulation layer 42 and wraps the organic encapsulation layer 42 to ensure the encapsulation effect.
  • Multiple fourth openings may be provided, and accordingly, multiple fifth openings and multiple sixth openings may be provided.
  • the plurality of fourth openings are distributed along the circumferential direction of the display panel and extend along the radial direction of the display panel, so that the pre-encapsulation layer 3 can better adapt to the stretching of the display panel.
  • the plurality of fifth openings and the plurality of sixth openings are also distributed along the circumferential direction of the display panel and extend in the radial direction of the display panel.
  • An embodiment of the present disclosure provides a display device, including any one of the above display panels.
  • the display device in this embodiment is a stretchable OLED display device, which may specifically be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, an advertising screen, and the like.
  • the display device of this embodiment includes the display panel according to any one of the above embodiments, when the display device is stretched, the reliability of the pre-encapsulation layer 3, the inorganic encapsulation layer of the thin-film encapsulation layer, etc. is still very high Good, so the display device of this embodiment has better display performance and longer life span than the display device in the prior art.
  • the preparation method includes: forming a plurality of display devices 2 on a substrate 1, and sequentially forming a pre-encapsulation layer 3, an organic encapsulation layer, and an inorganic encapsulation layer on the substrate 1 on which the display device 2 is formed.
  • the pre-encapsulation layer 3 is an inorganic encapsulation layer.
  • the manufacturing method of the display panel of this embodiment includes: a step of forming a first opening in the pre-encapsulation layer 3; wherein, the first opening corresponds to a space between adjacent display devices 2; a second is formed in the inorganic encapsulation layer 41 Opening, a step of forming a third opening in the organic encapsulation layer 42; wherein, the orthographic projection of the third opening on the substrate 1 falls into the space between the corresponding adjacent display devices 2 and two adjacent display devices
  • the area between 2 is a space; the second opening corresponds to at least a part of the third opening, and the orthographic projection of the second opening on the substrate falls into (eg, completely falls into) its corresponding third opening on the substrate 1 Within the range defined by the orthographic projection above.
  • the positions of the openings correspond to the space between adjacent display devices 2 to avoid these openings from affecting the packaging effect of the display device 2.
  • a first opening is formed in the pre-encapsulation layer 3, and all of the inorganic encapsulation layers 41 are formed with In the second opening, a third opening is formed in the organic encapsulation layer 42, and the first opening, the second opening, and the third opening are correspondingly provided as an example for specific description.
  • the preparation method of the display panel includes:
  • a pixel defining layer and a display device 2 are formed on the substrate 1.
  • the pixel defining layer includes a plurality of accommodating portions to define the pixel unit.
  • the pixel-defining layer further includes a plurality of openings, which are divided into several parts to adapt it to the stretching of the display panel. These openings correspond to the space between adjacent receiving portions.
  • the above-mentioned accommodating portion and opening may be formed by an etching process.
  • an inverted trapezoidal pillar may be provided between adjacent display devices 2 so that the formed display devices 2 are separated from each other.
  • the substrate 1 is a flexible stretchable substrate 1 on which a pixel defining layer and an OLED display device 2 are formed.
  • a whole layer of pre-encapsulated material layer may be deposited by processes such as plasma enhanced atomic layer deposition (PEALD), magnetron sputtering coating (Sputter), plasma enhanced chemical vapor deposition (PECVD), etc. 3a.
  • the material of the pre-encapsulation material layer 3a may specifically be an inorganic insulating material, and may specifically be silicon dioxide.
  • an organic encapsulation layer 42 having a third opening can be prepared by flash evaporation, printing, screen printing, PECVD, and other processes.
  • step S4 similar to step S2, an entire layer of inorganic encapsulating material layer is formed on the substrate 1.
  • step S2 For the specific preparation process and material, refer to step S2, which will not be repeated here.
  • the covering surface of the inorganic encapsulating material layer 41a should be no less than the covered surfaces of the pre-encapsulating material layer 3a and the organic encapsulating layer 42 to avoid the exposed organic encapsulating layer 42 from affecting the packaging effect of the packaging structure.
  • a pre-encapsulation layer 3 having a first opening and an inorganic encapsulation layer 41 having a second opening are formed.
  • the etching process may specifically include dry etching, wet etching and other processes.
  • this step S5 part of the material of the pre-encapsulation material layer 3a and part of the material in the inorganic encapsulation layer are removed by an etching process, so that the pre-encapsulation layer 3 having the first opening is formed, and has Simultaneously with the second opening of the inorganic encapsulation layer 41, the manufacturing process of the display panel is simplified.
  • the first opening and the second opening correspond to a part of the third opening in the patterned organic encapsulation layer 42.
  • the pre-encapsulation layer corresponding to the third opening is in contact with the inorganic encapsulation layer.
  • two inorganic encapsulation layers ie, the pre-encapsulation layer and the inorganic Encapsulation layer, thereby forming a first opening of the pre-encapsulation layer and a second opening of the inorganic encapsulation layer.
  • the pre-encapsulation material layer 3a and the inorganic encapsulation layer are etched once.
  • first opening and the second opening are in one-to-one correspondence, and there is no need for one-to-one correspondence between the two and the third opening, only the portion of the pre-encapsulation material layer 3a and the inorganic encapsulation layer 41 can be removed corresponding to the position of the third opening s material.
  • the organic encapsulation layer 42 and the inorganic encapsulation layer 41 form a group.
  • the steps S3 and S4 may be repeated multiple times.
  • a plurality of groups of organic encapsulation layers 42 and inorganic encapsulation layers 41 are sequentially stacked in the direction from the base 1 to the display device 2, and each group of organic encapsulation layers 42 and inorganic encapsulation layers 41 includes one organic encapsulation layer 42 with a third opening and A layer of inorganic encapsulating material layer 41 is layered, and then step S5 is performed to form a pre-encapsulation layer 3 with a first opening and an inorganic encapsulation layer 41 with a second opening in each set of thin-film encapsulation layers through a patterning process.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开提供一种显示面板及其制备方法、显示装置。所述显示面板包括：基底；多个显示器件，位于所述基底的一侧；多个薄膜封装层，位于所述多个显示器件远离所述基底的一侧且覆盖所述多个显示器件；其中，所述多个薄膜封装层在所述基底的正投影不连续，且所述多个薄膜封装层中的至少一个薄膜封装层覆盖所述多个显示器件中的至少一个显示器件。

Description

显示面板及其制备方法、显示装置
相关申请的交叉引用
本申请要求2018年10月24日提交给中国专利局的第201811242862.X的中国专利申请的优先权，其全部内容通过引用合并于此。
技术领域
本公开属于显示技术领域，具体涉及一种显示面板及其制备方法、显示装置。
背景技术
随着柔性显示技术的发展，显示面板趋向于可拉伸化发展。其中，可拉伸显示面板的实现包括基板的可拉伸、薄膜晶体管(Thin Film Transistor；TFT)的可拉伸以及封装层的可拉伸等。其中，为了实现封装层的可拉伸，对基底上的显示结构进行分区封装，将不同区域的封装层分开，使封装结构更好地适应在显示面板拉伸时所受到的应力。
发明内容
一方面，提供一种显示面板，包括：基底；多个显示器件，位于所述基底的一侧；多个薄膜封装层，位于所述多个显示器件远离所述基底的一侧且覆盖所述多个显示器件；其中，所述多个薄膜封装层在所述基底的正投影不连续，且所述多个薄膜封装层中的至少一个薄膜封装层覆盖所述多个显示器件中的至少一个显示器件。
在一个实施例中，所述显示面板包含一对称轴，所述多个薄膜封装层位于所述对称轴的两侧，且沿着从所述对称轴向所述显示面板的边缘的与所述对称轴垂直的方向排列。
在一个实施例中，所述多个薄膜封装层在所述基底的正投影 具有沿着所述对称轴延伸的长方形；并且所述多个薄膜封装层在与所述对称轴垂直的方向上的宽度随着远离所述对称轴而依次减小。
在一个实施例中，所述多个薄膜封装层呈阵列排布；所述多个薄膜封装层在所述基底的正投影在平行于所述对称轴的方向上是不连续的；所述多个薄膜封装层在所述基底的正投影在垂直于所述对称轴的方向上是不连续的；且所述多个薄膜封装层在所述基底的正投影面积相等。
在一个实施例中，所述多个薄膜封装层在所述基底的正投影围绕一中心排列，分别从所述中心至所述显示面板的边缘的径向方向上排列。
在一个实施例中，所述多个薄膜封装层在所述基底的正投影为多个圆环形，相邻两个薄膜封装层在所述基底上的正投影在所述径向方向上的距离随着远离所述中心而逐渐增大。
在一个实施例中，所述多个薄膜封装层中的每个被等分为沿着圆周方向延伸的多个部分。
在一个实施例中，所述薄膜封装层包括沿从所述基底至所述显示器件的方向依次设置的第一无机装层、有机封装层和第二无机封装层。
在一个实施例中，所述第二无机封装层完全覆盖所述有机封装层的两个侧壁和所述有机封装层远离基底的一个表面。
在一个实施例中，所述有机封装层和所述第二无机封装层形成为一组，多组有机封装层和第二无机封装层顺序层叠在所述第一无机层的远离所述基底的一侧。
在一个实施例中，多个第一开口组位于所述多个薄膜封装层中，使得所述多个薄膜封装层在所述基底的正投影不连续。
在一个实施例中，每个第一开口组包括第一开口、第二开口和第三开口；所述第一开口位于所述第一无机封装层中，所述第一开口在所述基底上的正投影落入与其相邻的两个相邻显示器件之间；所述第二开口位于所述第二无机封装层中，所述第二开口 在所述基底上的正投影落入所述第一开口在所述基底上的正投影所限定的范围内；所述第三开口位于所述有机封装层中，所述第二开口与至少部分所述第三开口对应，且所述第二开口在所述基底上的正投影落入所述第三开口在所述基底上的正投影所限定的范围内。
在一个实施例中，所述第一开口在所述基底上的正投影与所述第二开口在所述基底上的正投影完全重叠。
在一个实施例中，多个第二开口组位于所述多个薄膜封装层中，使得所述多个薄膜封装层中的每个被等分为沿着圆周方向延伸的多个部分。
在一个实施例中，每个第二开口组包括第四开口、第五开口和第六开口；所述第四开口位于所述第一无机封装层中，所述第四开口在所述基底上的正投影落入与其相邻的两个相邻显示器件之间；所述第五开口位于所述第二无机封装层中，所述第五开口在所述基底上的正投影落入所述第四开口在所述基底上的正投影所限定的范围内；所述第六开口位于所述有机封装层中，所述第五开口与至少部分所述第六开口对应，且所述第五开口在所述基底上的正投影落入所述第六开口在所述基底上的正投影所限定的范围内。
在一个实施例中，所述多个显示器件为OLED显示器件。
一方面，提供一种显示装置，包括上述显示面板。
一方面，提供一种显示面板的制造方法，包括：在基底的一侧形成多个显示器件；在所述基底上形成覆盖所述多个显示器件的第一无机封装材料层；在所述第一无机封装材料层的远离所述基底的一侧形成有机封装材料层；对所述有机封装材料层图案化形成有机封装层；在所述有机封装层的远离所述基底的一侧形成第二无机封装材料层，所述第二无机封装材料层覆盖所述有机封装层和所述第一无机封装材料层的暴露表面；以及对所述第一无机封装材料层和所述第二无机封装材料层执行刻蚀处理，以在所述多个显示器件中的相邻显示器件之间形成开口。
附图说明
图1和图2为本公开的实施例的显示面板的结构示意图；
图3为本公开的实施例的显示面板的结构示意图；
图4为本公开的实施例的显示面板的结构示意图；
图5为本公开的实施例的显示面板的结构示意图；
图6为本公开的实施例的显示面板的制备方法中形成显示器件的结构示意图；
图7为本公开的实施例的显示面板的制备方法中形成预封装材料层的结构示意图；
图8为本公开的实施例的显示面板的制备方法中形成薄膜封装组的有机封装层的结构示意图；
图9为本公开的实施例的显示面板的制备方法中形成无薄膜封装组的无机封装层的结构示意图；
图10为本公开的实施例的显示面板的制备方法中形成具有第一开口的预封装层和具有第二开口的无机封装层的结构示意图。
具体实施方式
为使本领域技术人员更好地理解本公开的技术方案，下面结合附图和具体实施方式对本公开作进一步详细描述。
封装层通常利用金属掩膜板，通过化学气相沉积等方式直接在基底上形成图案化的封装层。而在使用金属掩膜板制备封装层时，所形成的封装层边缘会存在宽度为50um～300um的厚度不均匀的区域。由于该区域的尺寸远大于像素单元的尺寸，且膜厚不均匀，导致该区域中的显示器件的封装效果不佳，使得所制备的显示面板的可靠性无法得到保证。因此，现有技术中的封装层仍为覆盖显示面板的整层结构，而这样易导致封装层在被拉伸时发生断裂，显示面板的可靠性存在很大威胁。
图1为本公开的实施例的显示面板的结构示意图。如图1所 示，本实施例提供一种显示面板，特别适用于可拉伸面板，其包括：基底1；多个显示器件2，其位于基底1上、呈阵列排布、并且彼此间隔；多个薄膜封装层，位于所述多个显示器件远离所述基底的一侧且覆盖所述多个显示器件1。所述多个薄膜封装层在所述基底1的正投影不连续，且所述多个薄膜封装层中的至少一个薄膜封装层4覆盖所述多个显示器件中的至少一个显示器件1。
薄膜封装层包括显示面板上沿垂直于基底1从基底1至显示器件2的方向上顺序排布的预封装层3(第一无机封装层)、一层有机封装层42和一层无机封装层41。
上述薄膜封装层构成本实施例的封装结构，以实现对显示面板上的各显示器件2的封装。其中，对显示器件2的封装主要由无机封装层(即预封装层3和无机封装层41)实现，有机封装层42的主要用于减小相邻两层无机封装层41之间的应力，从而使单层无机封装层41在显示面板的厚度方向上不容易产生裂痕。本实施例中，通过上述薄膜封装层，能够在基底1上形成无机封装层与有机封装层交叠设置的封装结构，且该封装结构中最靠近基底1的层结构(预封装层3)和最远离基底1的层结构(距离基底1最远的无机封装层41)都为无机封装层，从而保证对显示器件2的封装作用。
本实施例中，多个第一开口组位于所述多个薄膜封装层中，使得所述多个薄膜封装层在所述基底的正投影不连续。所述第一开口组包括第一开口、第二开口和第三开口。
预封装层3具有第一开口，第一开口对应相邻的显示器件2之间的间隔区；至少一组薄膜封装组中，无机封装层41具有第二开口，第二开口对应相邻的显示器件2之间的间隔区；有机封装层42具有第三开口，第二开口与至少部分第三开口对应，且第二开口在基底1上的正投影落入其所对应的第三开口在基底1上的正投影所限定的范围内。
由于封装结构中主要由无机封装层实现对显示面板上的显示器件2的封装作用，故在本实施例中，在封装结构中的至少一层 无机封装层中设置开口(即预封装层3中的第一开口、无机封装层41中的第二开口)，从而使封装结构更好地适应在显示面板拉伸时所受到的应力，不易在显示面板拉伸时产生裂纹，提高对显示器件2的封装可靠性。其中，开口的形状不做限制，可以是任意形状的。
在此需要说明的是，无机封装层中的各开口的位置应当对应显示面板上相邻显示器件2之间的间隔区。如图1所示，显示面板上，相邻显示器件2之间的区域是一个间隔区。第一开口在基底1上的正投影应落入其所对应的间隔区内，从而使预封装层3的图案在基底1上的正投影能够覆盖每一个显示器件2，以保证对显示器件2的封装效果。同理，无机封装层41发第二开口在基底1上的正投影也应小于并且落入其所对应的间隔区在基底1上的正投影。
由于有机封装层42的封装功能较弱，其并不能很好地阻隔外界水氧对显示器件2的侵蚀，故本实施例中，具有开口的无机封装层41应覆盖与其相邻的，且位于该的靠近基底1一侧的有机封装层42，例如，无机封装层41完全覆盖有机封装层42的两个侧壁和远离基底1的一个表面，使该有机封装层42不会裸露出来(即同一薄膜封装组中无机封装层41应覆盖位于其下方并与其直接接触的有机封装层42)，从而避免外界水氧进入有机封装层42中而影响显示面板的产品性能。
本实施例中，有机封装层42具有第三开口，也即，通过设置第三开口使有机封装层42也不容易在显示面板拉伸时产生裂痕。具体的，如图1所示，无机封装层41和有机封装层42中均设置有开口。其中，有机封装层42的与无机封装层41的第二开口对应的位置处设置有第三开口，且有机封装层42中的第三开口大于无机封装层41中的第二开口(即，有机封装层42中的第三开口在基底1上的正投影重叠并且大于无机封装层41中的第二开口在基底1上的正投影)，从而使无机封装层41的各图案覆盖所对应的有机封装层42的图案，以使显示器件2的除靠近基底1的侧面 以外的所有侧面都被该无机封装层41覆盖，进而加强对显示器件2的封装作用。可以理解的是，如图1所示，有机封装层42中被无机封装层41覆盖的位置也可设置第三开口，本实施例中对此并不限制。
在一个实施例中，当预封装层3中具有第一开口，薄膜封装组的无机封装层41中具有第二开口，并且有机封装层42中具有第三开口时，第一开口、第二开口、第三开口三者对应(例如，一一对应)设置。第一开口在基底1上的正投影与所对应的第二开口在基底1上的正投影重叠(例如，完全重叠，即，第一开口和第二开口一一对应，且形状和尺寸完全一致)，第一开口和第二开口在基底1上的正投影落入(例如，完全落入)所对应的第三开口在基底1上的正投影。这样，在制备该显示面板的封装结构时，可先依次制备预封装材料层3a、图案化的有机封装层42、薄膜封装组的无机封装材料层41a，再通过一次构图工艺形成图案化的预封装层3和薄膜封装组的无机封装层41，从而简化显示面板的制备工艺。
图2为本公开的实施例的显示面板的结构示意图。如图2所示，本实施例提供一种显示面板，具体是可拉伸的OLED面板，OLED面板具有行方向和列方向，其中行方向是指水平方向，列方向是指与水平方向垂直的竖直方向。封装结构包括预封装层3、有机封装层和无机封装层，且预封装层3、有机封装层和无机封装层中都设置有开口为例对本实施例进行具体说明。
本实施例中的显示面板具有固定端和拉伸端，当对显示面板进行拉伸时，显示面板具有从固定端到拉伸端的拉伸方向。本实施例中，固定端并不一定是显示面板的保持位置不动的某一处，也可以为显示面板在拉伸时受力最小的位置，具体可为受不同方向的拉伸力的显示面板的受力中心。拉伸端可以为显示面板在拉伸时受力最大的位置。可以理解的是，固定端为可以为一个定点，也可以是由多个点组成的线或面，拉伸端可以是一个定点，也可 以是由多个点组成的线或面。具体的，当从显示面板的两侧边进行同等拉力大小的拉伸时，固定端为显示面板的拉伸方向上的中点组成的线，拉伸端为显示面板的两侧边；当从显示面板的四周以同一大小的力对显示面板进行拉伸时，固定端为显示面板的中心，拉伸端为显示面板的边缘。本实施例中以拉伸端为显示面板在行方向上(图2中的水平方向；箭头指向为拉伸方向)的两侧边，固定端为显示面板的对称轴(图2中沿列方向的竖直虚线)为例进行说明。
如图2所示，基底1上设置有多个间隔排布的OLED显示器件，在OLED显示器件背离基底1的一侧依次设置有包括预封装层3、有机封装层42、无机封装层41的多个薄膜封装层。
所述多个薄膜封装层位于对称轴的两侧，且沿着垂直于所述对称轴的方向排列。
每个薄膜封装层在所述基底的正投影具有长方形，沿着所述对称轴(或沿着所述列方向)排列。
预封装层3中具有多个第一开口，每个第一开口对应相邻显示器件2之间的间隔区；薄膜封装组的无机封装层41中具有多个第二开口，每个第二开口对应相邻显示器件2之间的间隔区。
如图2所示，本实施例中预封装层3具有多个第一开口，沿从固定端到拉伸端的方向，相邻的第一开口之间的间距逐渐减小，例如，沿向左的拉伸方向上，第一开口H1与H2之间的间距是d1，第一开口H3与H2之间的距离是d2，d1>d2。沿向右的拉伸方向上，第一开口H1与H4之间的距离是d3，第一开口H4与H5之间的距离是d4，d3>d4。
与预封装层3同样地，薄膜封装组的无机封装层41具有多个第二开口，沿从固定端到拉伸端的方向，相邻的第二开口之间的间距逐渐减小。
具体的，以预封装层3具有第一开口为例，如图2所示，在显示面板的拉伸方向上，预封装层3的中间区域的相邻两第一开口(H1和H2)之间的间距d1大于边缘区域的相邻两第一开口(H2 和H3)之间的间距d2，即预封装层3的中间区域的相邻两第一开口(H1和H2)之间的图案所对应的显示器件2的个数(例如，3个)大于预封装层3的边缘区域的相邻两第一开口(H2和H3)之间的图案所对应的显示器件2的个数(例如，2个)。
在一个实施例中，所述多个薄膜封装层在行方向上的宽度随着远离所述对称轴而依次减小。沿着从固定端到拉伸端的方向，多个薄膜封装层在行方向上的宽度逐渐减小。
之所以这样设置是因为：实际应用中，显示器件2的尺寸极小，对掩膜板的开口精度较高，故本实施例中令预封装层3中的第一开口只对应显示面板的所有间隔区中的一部分(也就是说，有些间隔区中没有设置第一开口)，从而降低对掩膜板的开口精度要求，降低显示面板的制备难度。同时，当显示面板在拉伸时，不同位置处受力不一样，越靠近拉伸端(施力端)的位置受力越大，该处的膜层越容易产生裂纹。故本实施例中在降低掩膜板的开口精度要求的同时，通过开口间距的设计使预封装层3更适应基板拉伸时所受的拉伸力，降低其产生裂纹的风险。同理，薄膜封装组中的无机封装层41的第二开口也可以相同方式设置，从而实现降低其产生裂纹的风险，以及降低掩膜板的开口精度要求的效果。
在一个实施例中，在俯视图中，预封装层3中的每个第一开口在列方向上对应(例如，平行)，即，位于两列相邻的显示器件2之间的第一开口在显示面板的上部和下部处连通；薄膜封装组的无机封装层41中的每个第二开口在列方向上对应(例如，平行)，即，位于两列相邻的显示器件2之间的第二开口在显示面板的上部和下部处连通。
如图2所示，当某一层结构(例如预封装层3)中具有开口时，沿拉伸方向的垂直方向相邻的多个开口在显示面板的上部和下部处连通。可以理解的是，当显示面板的拉伸方向与显示面板的行方向平行时，每个第一开口在行方向上布置，并且沿着列方向延伸至显示面板的上部和下部。与在列方向(左右相邻)上相 邻两显示器件2之间的间隔区所对应的第一开口可在列方向上延伸至显示面板的显示区的上边缘和下边缘，而在俯视图中的行方向上不形成开口。。
同时，当显示面板的拉伸方向仅与显示面板的行方向平行时，在垂直于该拉伸方向的方向(图2中显示面板的竖直方向或列方向)上，显示面板的各层结构并不受拉伸力，也就不会产生裂纹，故可只在对应显示面板的行方向上布置多个开口。如图2所示，显示面板的预封装层3为被多个开口分割的条状图案，每个条状图案沿列方向延伸，覆盖一列或者多列显示器件2。
可以理解的是，根据受力的具体方向，各开口之间的距离可以根据实际情况进行设置。如图2所示，当平行于沿显示面板的行方向由中间向两侧拉伸显示面板时，显示面板上的中间区域相邻两列第一开口之间的预封装层3对应覆盖一列或多列显示器件2，且越往边缘区域，相邻两列第一开口之间的预封装层3所对应显示器件2的列数越少。其中，两列相邻第一开口之间的预封装层3所对应显示器件2的具体列数可根据实际情况进行设置，在此不做限制。
图3为本公开的实施例的显示面板的结构示意图。如图3所示，本实施例提供一种显示面板，例如可拉伸的OLED面板，封装结构包括预封装层3、有机封装层42和无机封装层41，且预封装层3、有机封装层42和无机封装层41都设置有开口为例对本实施例进行具体说明。
与实施例2中相同，本实施例中的显示面板具有固定端和拉伸端，当对显示面板进行拉伸时，显示面板具有从固定端到拉伸端的拉伸方向。其中，当拉伸端为多个时，拉伸方向可为多个不同的方向。
本实施例的显示面板中，基底1上设置有多个间隔且呈阵列排布的OLED显示器件，在OLED显示器件背离基底1的一侧依次设置有预封装层3、有机封装层42、无机封装层41。
如图3所示，所述多个薄膜封装层在所述基底的正投影在平行于所述对称轴的方向上是不连续的；所述多个薄膜封装层在所述基底的正投影在垂直于所述对称轴的方向上是不连续的。
在一个实施例中，预封装层3中每N行显示器件2之间的间隔区的位置均具有第一开口，其中N大于等于1且小于总行数的一半，并且每M列显示器件2之间的间隔区的位置均具有第一开口，其中M大于等于1且小于总列数的一半；无机封装层41中对应每N行或每M列相邻显示器件2之间的间隔区的位置均具有第二开口。
在一个实施例中，当M＝N时，多个薄膜封装层在所述基底的正投影是正方形。当M不等于N时，多个薄膜封装层在所述基底上的正投影是长方形。
在一个实施例中，如图3所示，按照2*2阵列排布的显示器件被一个薄膜封装层封装，位于2*2阵列排布的显示器件右侧的2*2阵列排布的显示器件被另一个薄膜封装层封装，以此类推。在这种情况下，所述薄膜封装层在所述基底的正投影是面积相等的正方形。
在一个实施例中，可以理解的是，按照2*3阵列排布的显示器件被一个薄膜封装层封装，位于2*3阵列排布的显示器件右侧的2*3阵列排布的显示器件被另一个薄膜封装层封装，以此类推。在这种情况下，所述薄膜封装层在所述基底的正投影是面积相等的长方形。
在一个实施例中，在行方向上相邻的任意两个显示器件之间均形成开口，并且在列方向上相邻的任意两个显示器件之间均形成开口，使得一个薄膜封装层封装仅一个显示器件。
通过在预封装层3、有机封装层42以及无机封装层41中的对应任意间隔区的位置都设置开口，使预封装层3、有机封装层42以及无机封装层41能够最大程度地适应显示面板的拉伸，提高封装结构的封装可靠性，延长显示面板的寿命。
在一个实施例中，预封装层3的对应每M列显示器件2之间 的间隔区的第一开口在显示面板的边缘处连通，并且预封装层3的对应每N行显示器件2之间的间隔区的第一开口在显示面板的边缘处连通；无机封装层41的每M列显示器件2之间的间隔区的第二开口在显示面板的边缘处连通，无机封装层41的每N行显示器件2之间的间隔区的第二开口在显示面板的边缘处连通。
在一个实施例中，一部分的第一开口沿着所述行方向延伸。剩余部分的第一开口沿着所述列方向延伸，并且所述剩余部分的第一开口与所述一部分的第一开口彼此正交形成网络。如图3所示，在封装膜层对应显示面板上各显示器件之间形成尽可能多的开口，以适应不同方向上的拉伸力。
图4为本公开的实施例的显示面板的结构示意图，并且图5为本公开的实施例的显示面板的结构示意图。如图4和图5所示，本实施例提供一种显示面板，特别适用于可拉伸显示面板。其中，显示面板的显示区的至少部分轮廓在俯视图中为弧形。
本实施例中以显示区的形状为圆形为例进行说明。为了实现显示面板的窄边框，显示面板的形状可以是与显示区相适配的圆形。当然，显示面板的形状也可以是方形或者其它形状，在此不做限制。
本实施例中的显示面板具有固定端和拉伸端，当对显示面板进行拉伸时，显示面板具有从固定端到拉伸端的拉伸方向(拉伸方向如箭头所示)。具体的，本实施例中以固定端位于显示区的边缘，拉伸端位于显示区的中心(图4的中心)为例进行说明。
本实施例的显示面板包括沿显示区的轮廓排布(例如，环形排布)的多圈显示器件2；位于显示器件2背离基底的一侧，且沿背离基底的方向依次设置的预封装层3、有机封装层42和无机封装层41；其中，预封装层为无机封装层41。
预封装层3具有第一开口，第一开口在基底1上的正投影落入其所对应的相邻的两圈显示器件2之间的间隔区内；至少一组薄膜封装组的无机封装层41具有第二开口，第二开口在基底1上的正投影落入其所对应的相邻两圈显示器件2之间的间隔区内； 有机封装层42具有第三开口，第二开口与至少部分第三开口对应，且第二开口在基底1上的正投影落入其所对应的述第三开口在基底1上的正投影所限定的范围内。
以显示面板的预封装层3为例，如图4所示，显示面板上的显示器件2以显示区的圆心为中心均匀排列，并显示器件2在显示面板上构成多个同心圆环。预封装层3中的第一开口对应相邻的两圈显示器件2之间的间隔区。当显示面板的拉伸方向为朝向显示面板的圆心时(固定端为显示面板的边缘，拉伸端为显示面板的中心)，例如将圆面显示面板拉伸为球面显示面板时，通过第一开口的设置可使预封装层3更好地适应在显示面板拉伸时所受到的应力，不易在显示面板拉伸时产生裂纹，提高对显示器件2的封装可靠性。同理，薄膜封装组中的无机封装层41可通过第二开口的设置增强其抗拉伸能力。
本实施例的显示面板中，在一个薄膜封装组中，无机封装层41具有第二开口，并且有机封装层42具有第三开口。也即，通过第三开口的设置使有机封装层42也不容易在显示面板拉伸时产生裂痕。参照图4和图1，有机封装层42对应无机封装层41的第二开口处必然设置有第三开口，且有机封装层42中的第三开口大于无机封装层41中的第二开口，从而使无机封装层41的各图案覆盖所对应的有机封装层42的图案，以使显示器件2的除靠近基底1的侧面以外的所有侧面都设置有该无机封装层41，进而加强对显示器件2的封装作用。可以理解的是，有机封装层42中被无机封装层41覆盖的位置也可设置第三开口，本实施例中对此并不限制。
如图4所示，第一开口、第二开口、第三开口组成第一开口组。相邻两圈的显示器件2之间的第一开口可以为多个，即，在显示面板上设置多个第一开口组。所述多个第一开口组中的每个沿所述显示区的周向方向延伸形成一个环形开口。多个环形开口围绕显示面板的中心呈同心圆布置。
在一个实施例中，所述多个薄膜封装层在所述基底的正投影 围绕所述中心排列，分别从所述中心至所述显示面板的边缘的径向方向上排列。所述多个薄膜封装层在所述基底的正投影为多个圆环形。
当显示面板的拉伸方向为从显示面板的圆心朝向显示面板的边缘时，显示面板中心受力较大，故在显示面板的径向方向(由显示面板圆心指向显示面板边缘)上，相邻两第一开口之间的间隔距离可逐渐增大，以使封装结构更好地适应显示面板的拉伸。可替换地，相邻两个薄膜封装层在所述基底上的正投影在所述径向方向上的距离随着远离所述中心而逐渐增大。
在一个实施例中，当在显示面板的边缘多处拉伸显示面板时，显示面板在受到径向拉伸力的同时，其周向上也会受到一定的拉伸力。因此，本实施例的显示面板中，所述多个薄膜封装层中的每个被多个第二开口组等分为沿着圆周方向延伸的多个部分。
在一个实施例中，所述预封装层、所述无机封装层和所述有机封装层中设置有多个第二开口组。所述多个第二开口组分别沿所述显示面板的显示区的径向方向延伸，并且与所述多个第一开口组中的每个相交且连通，以使封装结构更好地适应显示面板的拉伸。
每个第二开口组包括第四开口、第五开口和第六开口。预封装层还具有第四开口，第四开口在基底上的正投影落入其所对应的同一圈显示器件中相邻两个显示器件之间的间隔区内。即如图5所示，除了在预封装层3对应相邻两圈显示器件2之间的位置设置第一开口外，在预封装层3对应同一圈的相邻两个显示器件2之间的间隔区的位置还可设置第四开口。
多个第一开口可通过第四开口相交且连通形成一个环形通口。即沿圆形显示面板的环向方向上相邻的多个第一开口可通过多个第四开口中的每个连通构成一个环形通口，从而可在显示面板上形成多个同心圆环开口，增强预封装层3的抗拉伸能力，降低显示面板的制备难度。
相似的，无机封装层41中具有第五开口，第五开口在基底1 上的正投影落入其所对应的同一圈显示器件2中相邻两个显示器件2之间的间隔区内，可替换地，所述第五开口在所述基底上的正投影落入所述第四开口在所述基底上的正投影所限定的范围内；有机封装层42具有第六开口，第六开口与至少部分第五开口对应，且第五开口在基底1上的正投影落入其所对应的第六开口在基底1上的正投影所限定的范围内。即对应同一圈的相邻两个显示器件2之间的间隔区的无机封装层41也可设置第五开口，且在对应该第五开口的位置，有机封装层42也设置有第六开口，从而更好地适应圆形显示面板的拉伸。无机封装层41覆盖有机封装层42，将有机封装层42包裹于内，以保证封装效果。
可以提供多个第四开口，相应地，可以提供多个第五开口和多个第六开口。所述多个第四开口沿显示面板的周向分布，并沿显示面板的径向延伸，以使预封装层3更好地适应显示面板的拉伸。所述多个第五开口和多个第六开口也沿显示面板的周向分布，并沿显示面板的径向延伸。
本公开的一个实施例提供一种显示装置，包括上述任意一种显示面板。本实施例中的显示装置为可拉伸的OLED显示装置，具体可以为：手机、平板电脑、电视机、显示器、笔记本电脑、广告屏等任何具有显示功能的产品或部件。
由于本实施例的显示装置包括根据上述实施例的任意一个中所述的显示面板，该显示装置在拉伸时，其中的预封装层3、薄膜封装层的无机封装层等的可靠性依旧很好，故相对现有技术中的显示装置，本实施例的显示装置的显示性能更好，寿命更长。
图6至图10为本公开的实施例的显示面板的制备方法，可用于制备本公开实施例中提供的任意一种显示面板。该制备方法包括：在基底1上形成多个显示器件2，并在形成有显示器件2的基底1上依次形成预封装层3、有机封装层和无机封装层。其中，预封装层3为无机封装层。
本实施例的显示面板的制备方法包括：在预封装层3中形成第一开口的步骤；其中，第一开口对应相邻的显示器件2之间的 间隔区；无机封装层41中形成第二开口，有机封装层42中形成第三开口的步骤；其中，第三开口在基底1上的正投影落入其所对应的相邻显示器件2之间的间隔区内，两个相邻显示器件2之间的区域是一个间隔区；第二开口与至少部分第三开口对应，且第二开口在基底上的正投影落入(例如，完全落入)其所对应的第三开口在基底1上的正投影所限定的范围内。即通过在显示面板的封装结构中的各层中设置开口，从而使其更好地适应在显示面板拉伸时所受到的应力，不易在显示面板拉伸时产生裂纹，提高封装结构对显示器件2的封装可靠性。其中，各开口(第一开口、第二开口、第三开口)的设置位置对应于相邻显示器件2之间的间隔区域，以避免这些开口影响对显示器件2的封装效果。
为了对本实施例的显示面板的制备方法进行更为具体地说明，下面以显示面板为可拉伸的OLED显示面板，在预封装层3中形成有第一开口，无机封装层41中均形成有第二开口，有机封装层42中均形成有第三开口，且第一开口、第二开口、第三开口三者对应设置为例进行具体说明。所述显示面板的制备方法包括：
S1、在基底1上形成像素界定层、显示器件2。
像素限定层包括多个容纳部，以限定出像素单元。本实施例中，像素限定层还包括多个开口，将其分为几部分，以使其适应显示面板的拉伸。这些开口对应相邻容纳部之间的间隔区。具体的，本步骤中可通过刻蚀工艺形成上述容纳部和开口。
如图6所示，在形成显示器件2时，为了在显示面板拉伸时各显示器件2仍能正常工作，需要将各显示器件2彼此分开。具体的，可在制备显示器件2时，在相邻显示器件2之间设置倒梯形柱，从而使所形成的显示器件2彼此分隔开来。
S2、在基底1上形成预封装材料层3a；
其中，基底1为柔性可拉伸基底1，其上形成有像素界定层、OLED显示器件2。
如图7所示，本步骤S2中，可通过等离子增强原子层沉积(PEALD)、磁控溅射镀膜(Sputter)、等离子增强化学气相沉积 (PECVD)等工艺沉积形成整层的预封装材料层3a。预封装材料层3a的材料具体可为无机绝缘材料，具体可为二氧化硅。
S3、在预封装材料层3a的远离基底1的一侧形成有机封装材料层，并通过构图工艺形成具有第三开口的有机封装层42。
如图8所示，本步骤S3中，可通过闪蒸、打印、丝网印刷、PECVD等工艺制备形成具有第三开口的有机封装层42。
S4、在有机封装层42的远离基底1的一侧形成无机封装材料层41a。
如图9所示，本步骤S4中，与步骤S2相似，在基底1上形成整层的无机封装材料层，具体制备工艺、材料可参考步骤S2，在此不再赘述。
其中，无机封装材料层41a覆盖面应不小于预封装材料层3a以及有机封装层42的被覆盖面，以避免有机封装层42裸露出来而影响封装结构的封装效果。
S5、通过一次刻蚀工艺，形成具有第一开口的预封装层3，以及具有第二开口的无机封装层41。
刻蚀工艺具体可包括干法刻蚀、湿法刻蚀等工艺。
如图10所示，本步骤S5中，通过一次刻蚀工艺去除预封装材料层3a的部分材料，以及无机封装层中的部分材料，从而在形成具有第一开口的预封装层3，以及具有第二开口的无机封装层41的同时，简化显示面板的制备工艺。
第一开口和第二开口对应于图案化的有机封装层42中的第三开口的一部分。本实施例中，对应第三开口处的预封装层与无机封装层接触，此时可以通过一次构图工艺刻蚀去除对应至少部分第三开口处的两层无机封装层(即预封装层与无机封装层)，从而形成预封装层的第一开口和无机封装层的第二开口。对预封装材料层3a和无机封装层刻蚀一次。当然，由于第一开口和第二开口是一一对应的，而二者与第三开口无需一一对应，即可只去除预封装材料层3a和无机封装层41的部分对应第三开口位置处的材料。
可以理解的是，本实施例中，有机封装层42和无机封装层41构成一组，当提供多组有机封装层42和无机封装层41时，可多次重复步骤S3和S4，在基底1上从基地1至显示器件2的方向上依次层叠多组有机封装层42和无机封装层41，并且每组有机封装层42和无机封装层41包括具有第三开口的一个有机封装层42和整层一层无机封装材料层41，之后执行步骤S5，通过一次构图工艺形成具有第一开口的预封装层3，以及各组薄膜封装层中的具有第二开口的无机封装层41。
本实施例中形成显示器件、预封装层、有机封装和无机封装层等的详细步骤可参考图6至图10所示的各个步骤，在此不再详述。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (18)

  1. 一种显示面板，包括：
    基底；
    多个显示器件，位于所述基底的一侧；
    多个薄膜封装层，位于所述多个显示器件远离所述基底的一侧且覆盖所述多个显示器件；
    其中，所述多个薄膜封装层在所述基底的正投影不连续，且所述多个薄膜封装层中的至少一个薄膜封装层覆盖所述多个显示器件中的至少一个显示器件。
  2. 根据权利要求1所述的显示面板，其中，
    所述显示面板包含一对称轴，
    所述多个薄膜封装层位于所述对称轴的两侧，且沿着垂直于所述对称轴的方向排列。
  3. 根据权利要求2所述的显示面板，其中，
    所述多个薄膜封装层在所述基底的正投影具有沿着所述对称轴延伸的长方形；并且
    所述多个薄膜封装层在与所述对称轴垂直的方向上的宽度随着远离所述对称轴而依次减小。
  4. 根据权利要求2所述的显示面板，其中，
    所述多个薄膜封装层呈阵列排布；
    所述多个薄膜封装层在所述基底的正投影在平行于所述对称轴的方向上是不连续的；
    所述多个薄膜封装层在所述基底的正投影在垂直于所述对称轴的方向上是不连续的；并且
    所述多个薄膜封装层在所述基底的正投影面积相等。
  5. 据权利要求1所述的显示面板，其中，
    所述多个薄膜封装层在所述基底的正投影围绕一中心排列，分别从所述中心至所述显示面板的边缘的径向方向上排列。
  6. 权利要求5所述的显示面板，其中，所述多个薄膜封装层在所述基底的正投影为多个圆环形，相邻两个薄膜封装层在所述基底上的正投影在所述径向方向上的距离随着远离所述中心而逐渐增大。
  7. 根据权利要求6所述的显示面板，其中
    所述多个薄膜封装层中的每个被等分为沿着圆周方向延伸的多个部分。
  8. 根据权利要求1-7中任一项所述的显示面板，其中
    所述薄膜封装层包括沿从所述基底至所述显示器件的方向依次设置的第一无机装层、有机封装层和第二无机封装层。
  9. 根据权利要求8所述的显示面板，其中
    所述第二无机封装层完全覆盖所述有机封装层的两个侧壁和所述有机封装层远离基底的一个表面。
  10. 根据权利要求8所述的显示面板，其中，
    所述有机封装层和所述第二无机封装层形成为一组，
    多组有机封装层和第二无机封装层顺序层叠在所述第一无机层的远离所述基底的一侧。
  11. 根据权利要求8所述的显示面板，还包括多个第一开口组，
    所述多个第一开口组位于所述多个薄膜封装层中，使得所述多个薄膜封装层在所述基底的正投影不连续。
  12. 根据权利要求11所述的显示面板，其中
    每个第一开口组包括第一开口、第二开口和第三开口；
    所述第一开口位于所述第一无机封装层中，所述第一开口在所述基底上的正投影落入与其相邻的两个相邻显示器件之间；
    所述第二开口位于所述第二无机封装层中，所述第二开口在所述基底上的正投影落入所述第一开口在所述基底上的正投影所限定的范围内；
    所述第三开口位于所述有机封装层中，所述第二开口与至少部分所述第三开口对应，且所述第二开口在所述基底上的正投影落入所述第三开口在所述基底上的正投影所限定的范围内。
  13. 根据权利要求12所述的显示面板，其中
    所述第一开口在所述基底上的正投影与所述第二开口在所述基底上的正投影完全重叠。
  14. 根据权利要求8所述的显示面板，还包括多个第二开口组，
    所述多个第二开口组位于所述多个薄膜封装层中，使得所述多个薄膜封装层中的每个被等分为沿着圆周方向延伸的多个部分。
  15. 根据权利要求14所述的显示面板，其中
    每个第二开口组包括第四开口、第五开口和第六开口；
    所述第四开口位于所述第一无机封装层中，所述第四开口在所述基底上的正投影落入与其相邻的两个相邻显示器件之间；
    所述第五开口位于所述第二无机封装层中，所述第五开口在所述基底上的正投影落入所述第四开口在所述基底上的正投影所限定的范围内；
    所述第六开口位于所述有机封装层中，所述第五开口与至少 部分所述第六开口对应，且所述第五开口在所述基底上的正投影落入所述第六开口在所述基底上的正投影所限定的范围内。
  16. 根据权利要求1所述的显示面板，其中，
    所述多个显示器件为OLED显示器件。
  17. 一种显示装置，包括权利要求1至16中任意一项所述的显示面板。
  18. 一种根据权利要求1所述的显示面板的制造方法，包括：
    在基底的一侧形成多个显示器件；
    在所述基底上形成覆盖所述多个显示器件的第一无机封装材料层；
    在所述第一无机封装材料层的远离所述基底的一侧形成有机封装材料层；
    对所述有机封装材料层图案化形成有机封装层；
    在所述有机封装层的远离所述基底的一侧形成第二无机封装材料层，所述第二无机封装材料层覆盖所述有机封装层和所述第一无机封装材料层的暴露表面；
    对所述第一无机封装材料层和所述第二无机封装材料层执行刻蚀处理，以在所述多个显示器件中的相邻显示器件之间形成开口。
PCT/CN2019/112747 2018-10-24 2019-10-23 显示面板及其制备方法、显示装置 WO2020083308A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/652,519 US11233222B2 (en) 2018-10-24 2019-10-23 Display panel, method for manufacturing the same and display apparatus having discontinuous thin film package layers over display devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811242862.X 2018-10-24
CN201811242862.XA CN109411625B (zh) 2018-10-24 2018-10-24 显示基板及其制备方法、显示装置

Publications (1)

Publication Number Publication Date
WO2020083308A1 true WO2020083308A1 (zh) 2020-04-30

Family

ID=65469071

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/112747 WO2020083308A1 (zh) 2018-10-24 2019-10-23 显示面板及其制备方法、显示装置

Country Status (3)

Country Link
US (1) US11233222B2 (zh)
CN (1) CN109411625B (zh)
WO (1) WO2020083308A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112331077A (zh) * 2020-11-04 2021-02-05 京东方科技集团股份有限公司 一种显示面板、制作方法及可拉伸显示装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109411625B (zh) * 2018-10-24 2021-01-29 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN110993790A (zh) * 2019-11-14 2020-04-10 武汉华星光电半导体显示技术有限公司 金属掩模板及柔性oled面板
CN110943180A (zh) * 2019-11-18 2020-03-31 武汉华星光电半导体显示技术有限公司 一种柔性oled器件封装结构及其封装方法
CN115458698A (zh) * 2021-06-08 2022-12-09 华为技术有限公司 显示面板及其制作方法和显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1744341A (zh) * 2004-09-01 2006-03-08 悠景科技股份有限公司 有机发光二极管显示面板元件及其制法
US20160181574A1 (en) * 2014-01-03 2016-06-23 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for manufacturing flexible oled (organic light emitting diode) panel
CN108615822A (zh) * 2018-04-28 2018-10-02 武汉华星光电半导体显示技术有限公司 柔性oled显示面板及其制备方法、显示装置
CN109411625A (zh) * 2018-10-24 2019-03-01 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN109545998A (zh) * 2018-10-15 2019-03-29 武汉华星光电半导体显示技术有限公司 显示面板及制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4988782B2 (ja) * 2009-03-02 2012-08-01 富士フイルム株式会社 封止された素子
DE102012214248A1 (de) * 2012-08-10 2014-02-13 Osram Opto Semiconductors Gmbh Bauelemente und verfahren zum herstellen eines bauelementes
WO2014041616A1 (ja) * 2012-09-11 2014-03-20 パイオニア株式会社 有機ｅｌ装置
TWI492436B (zh) * 2012-11-16 2015-07-11 Au Optronics Corp 可撓式顯示面板
KR102306003B1 (ko) * 2014-04-22 2021-09-28 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
KR102253531B1 (ko) * 2014-07-25 2021-05-18 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
WO2018198262A1 (ja) * 2017-04-27 2018-11-01 シャープ株式会社 フレキシブル表示装置
US20190165328A1 (en) * 2017-11-30 2019-05-30 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof
CN107863376B (zh) * 2017-12-11 2021-01-22 京东方科技集团股份有限公司 一种柔性显示基板、显示面板及显示装置
US11655536B2 (en) * 2018-03-20 2023-05-23 Sharp Kabushiki Kaisha Film forming mask and method of manufacturing display device using same
CN108598287B (zh) * 2018-06-29 2020-08-11 上海天马微电子有限公司 柔性触控显示面板及其制作方法、柔性触控显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1744341A (zh) * 2004-09-01 2006-03-08 悠景科技股份有限公司 有机发光二极管显示面板元件及其制法
US20160181574A1 (en) * 2014-01-03 2016-06-23 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for manufacturing flexible oled (organic light emitting diode) panel
CN108615822A (zh) * 2018-04-28 2018-10-02 武汉华星光电半导体显示技术有限公司 柔性oled显示面板及其制备方法、显示装置
CN109545998A (zh) * 2018-10-15 2019-03-29 武汉华星光电半导体显示技术有限公司 显示面板及制作方法
CN109411625A (zh) * 2018-10-24 2019-03-01 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112331077A (zh) * 2020-11-04 2021-02-05 京东方科技集团股份有限公司 一种显示面板、制作方法及可拉伸显示装置
CN112331077B (zh) * 2020-11-04 2022-11-04 京东方科技集团股份有限公司 一种显示面板、制作方法及可拉伸显示装置
US11696461B2 (en) 2020-11-04 2023-07-04 Boe Technology Group Co., Ltd. Display panel, manufacturing method and stretchable display device

Also Published As

Publication number Publication date
CN109411625B (zh) 2021-01-29
US20210226161A1 (en) 2021-07-22
CN109411625A (zh) 2019-03-01
US11233222B2 (en) 2022-01-25

Similar Documents

Publication Publication Date Title
WO2020083308A1 (zh) 显示面板及其制备方法、显示装置
CN110265583B (zh) 一种显示面板及其制备方法、显示装置
KR102615639B1 (ko) 유기 발광 디스플레이 장치, 이를 제조하기 위한 마스크, 및 이의 제조 방법
WO2020103900A1 (zh) Oled显示基板和显示面板
CN114420722A (zh) 显示基板及显示装置
US11956987B2 (en) Display panel and preparation method thereof, and display device
CN106373982B (zh) 显示基板及其制作方法、以及显示装置
US11239282B2 (en) Pixel structure and fabrication method thereof, display substrate and display apparatus
US11508933B2 (en) Display panel and display device
JP5524104B2 (ja) 有機発光表示装置
US10991884B2 (en) Mask plate, OLED display substrate, display device and manufacturing method thereof
WO2015113382A1 (zh) 有机电致发光显示面板及显示装置
WO2020228429A1 (zh) 显示基板、显示面板和显示装置
WO2019127685A1 (zh) 显示面板制备方法、显示面板及显示装置
CN108321178B (zh) 像素结构、掩膜板及显示装置
US20170277307A1 (en) Touch panel and manufacturing method thereof, and display device
US20200335712A1 (en) Flexible display panel, manufacturing method thereof and display device
US11258045B2 (en) Methods of forming stretchable encapsulation for electronic displays
KR20160122362A (ko) 박막 증착용 마스크 어셈블리
WO2020124791A1 (zh) 触控面板及其制造方法
WO2019196798A1 (zh) 像素界定层、像素结构、显示面板及显示装置
US10263055B2 (en) Pixel definition structure, organic light-emitting device, encapsulation method thereof, and display apparatus
CN111293155B (zh) 显示基板及其制备方法、显示装置
CN109950418A (zh) 显示面板及显示屏
CN113540197B (zh) 一种显示面板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19875472

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19875472

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 24-09-2021)

122 Ep: pct application non-entry in european phase

Ref document number: 19875472

Country of ref document: EP

Kind code of ref document: A1