WO2020082669A1 - 一种陶瓷制双界面交易卡及其陶瓷加工工艺 - Google Patents
一种陶瓷制双界面交易卡及其陶瓷加工工艺 Download PDFInfo
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- WO2020082669A1 WO2020082669A1 PCT/CN2019/078246 CN2019078246W WO2020082669A1 WO 2020082669 A1 WO2020082669 A1 WO 2020082669A1 CN 2019078246 W CN2019078246 W CN 2019078246W WO 2020082669 A1 WO2020082669 A1 WO 2020082669A1
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- ceramic
- transaction card
- chip
- groove
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Definitions
- the present invention belongs to the technical field of transaction cards, and particularly relates to a ceramic dual-interface transaction card and its ceramic processing technology.
- transaction cards are gradually interspersed in people's lives, such as bank cards, transportation cards, and membership cards.
- These cards are generally made of plastic or plastic.
- Metal but the general metal transaction card needs to be equipped with no electromagnetic signal shielding components in the card to avoid affecting the normal use of the transaction card; the transaction card of plastic material and metal material has low hardness and the card body is not resistant to wear; plastic material The strength of the transaction card made of metal is low, the card body is easy to bend and deform, and the service life of the transaction card is low.
- the present invention provides a ceramic dual-interface transaction card, which aims to solve the problem that the metal material transaction card in the prior art needs to be provided with no electromagnetic signal shielding components in the card, and the plastic material and metal material transaction card have low hardness and strength , Card body is not resistant to wear and easy to bend and deform.
- a ceramic dual-interface transaction card including a transaction card body, the transaction card body is provided with a ceramic substrate, the ceramic substrate is provided with a chip slot, the chip slot A chip is embedded, a ceramic picture board is provided on one side of the substrate, an opening is provided on the ceramic picture board, the opening is the same size as the chip, and a picture insertion slot is provided on both sides of the ceramic picture board, A clamping groove is provided on the other surface of the ceramic substrate, the clamping groove is in communication with the chip groove, a PCA circuit board is embedded in the clamping groove, and adhesive is also provided on the other surface of the ceramic substrate, the PCBA One side of the circuit board is attached to the clamping groove, and the other side is adhered to the adhesive, the adhesive is covered on the PCBA circuit board and the substrate, and the surface of the adhesive is provided with a magnetic stripe.
- glue is provided on the bonding surface of the ceramic picture board, and the ceramic picture board passes through the glue Bonded to the ceramic substrate.
- a dust suction pad is provided on the ceramic picture board, and the dust suction pad is located where the ceramic picture board and the ceramic substrate are attached.
- a convex groove is provided on an inner wall of the chip groove, and there are a plurality of convex grooves in total, and a plurality of the convex grooves are oppositely arranged on the inner wall of the chip groove.
- a chip sealant is provided at the bottom of the chip, and the chip is pasted on the plurality of convex grooves through the chip sealant.
- the depth of the clamping groove is the same as the thickness of the PCBA circuit board.
- the adhesive back is provided with a groove
- the magnetic strip is provided in the groove
- the depth of the groove is the same as the thickness of the magnetic strip.
- the present invention also provides a ceramic processing technology, including the following steps:
- the zirconite ore is crushed by a crusher to obtain zircon sand, and the zircon sand is refined.
- the content of the zircon sand after the refining is 66.40% zirconium dioxide, 0.13% titanium dioxide, 042 % Ferric oxide and 33.20% silica;
- the shaped ceramic is first cut to a certain shape by a CNC milling machine, and then further trimmed;
- the polished ceramic surface is plated with a film layer by a screen printing machine
- the refining method of zircon sand is a refining method combining pyrometallurgy and wet chemical method.
- the beneficial effects of the present invention Since the ceramic substrate and the ceramic picture board are provided, compared with the metal transaction card, no additional electromagnetic signal shielding components are needed, which makes the transaction card more sensitive when used; transactions with plastics and metals Compared with cards, ceramic transaction cards have higher hardness and the card body is more resistant to wear; compared with plastic and metal transaction cards, ceramics have higher strength, the card body is not easy to bend and deform, and is mainly composed of zirconium dioxide. The advantages of high ceramic hardness can further enhance the bending and abrasion resistance of ceramic transaction cards and increase the service life of ceramic transaction cards.
- FIG. 1 is an exploded view of an embodiment of a ceramic dual-interface transaction card provided by the present invention.
- FIG. 2 is a front view of a ceramic dual-interface transaction card provided by the present invention.
- FIG. 3 is a rear view of a ceramic dual-interface transaction card provided by the present invention.
- FIG. 4 is a side cross-sectional view of a ceramic dual-interface transaction card provided by the present invention.
- FIG. 5 is an enlarged view of A of FIG. 4 of the present invention.
- FIG. 6 is an exploded view of a second embodiment of a ceramic dual-interface transaction card provided by the present invention.
- a ceramic dual-interface transaction card includes a transaction card body 10, a ceramic substrate 3 is provided on the transaction card body 10, and a chip slot is provided on the ceramic substrate 3 7.
- the chip slot 7 is embedded with a chip 9
- a ceramic picture board 5 is provided on one surface of the substrate 3, an opening is provided on the ceramic picture board 5, the size of the opening is the same as the size of the chip 9, the ceramic picture
- the opening on the board 5 is used to expose the chip 9.
- the ceramic picture board 5 is provided with picture insertion grooves 12 on both sides for inserting pictures into the ceramic picture board 5.
- the other side of the ceramic substrate 3 is provided with a card A connecting slot 6, the clamping slot 6 communicates with a chip slot 7, the clamping slot 6 is embedded with a PCBA circuit board 2, the other surface of the ceramic substrate 3 is further provided with a glue 1, the PCB A circuit One side of the board 2 is bonded to the card connection groove 6, and the other side is bonded to the adhesive 1 that covers the PCBA circuit board 2 and the substrate 3.
- the ceramic substrate and the ceramic picture board are provided to make the transaction card When the PCBA circuit board 2 is set, there is no need to add additional components for shielding electromagnetic signals, and a transaction card is added.
- a magnetic stripe 13 is provided on the surface of the adhesive 1.
- the ceramic picture board 5 is adhered to the ceramic substrate 3 by glue; the dust suction pad 11 is provided on the ceramic picture board 5 The dust suction pad 11 is located at the place where the ceramic picture board 5 and the ceramic substrate 3 are attached; the inner wall of the chip slot 7 is provided with convex grooves 4, there are a plurality of convex grooves 4, a plurality of the convex grooves 4 It is relatively arranged on the inner wall of the chip slot 7, that is, several convex grooves 4 are arranged on the inner wall of the chip slot 7 toward the center of the chip slot 7; a chip sealant 8 is provided on the bottom of the chip 9, and the chip 9 passes through the chip The sealant 8 is pasted on the plurality of convex grooves 4, and the chip 9 is bonded to the convex groove 4 through the chip sealant 8, so that the chip 9 can be more stably placed in the chip groove 7, increasing the installation stability of the chip 9 ; The depth
- the second embodiment of the present invention is different from the first embodiment in that the PCBA circuit board 2 is bonded to the ceramic substrate 3 on one side, and the other side is bonded to the adhesive 1 on the PCBA circuit board 2 is provided between the ceramic substrate 3 and the adhesive 1.
- the present invention also provides a ceramic processing technology, including the following steps:
- the shaped ceramic is first cut to a certain shape by a CNC milling machine, and then further trimmed;
- the polished ceramic surface is coated with a film layer by a screen printing machine
- the refining method of zircon sand in the present invention is a refining method combining pyrometallurgy and wet chemical method.
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- Computer Hardware Design (AREA)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
本发明适用于交易卡技术领域，提供了一种陶瓷制双界面交易卡及其陶瓷加工工艺，包括交易卡本体，交易卡本体上设置有陶瓷基板，陶瓷基板上设置有芯片槽，芯片槽内嵌有芯片，基板一面上设置有陶瓷图片板，陶瓷图片板上设置有开口，开口大小与芯片大小相同，陶瓷图片板两侧设置有图片插接槽，陶瓷基板另一面上设置有卡接槽，卡接槽与芯片槽相通，卡接槽内嵌有PCBA电路板，本发明相比金属制交易卡，使用时感应更加灵敏；与塑料、金属制交易卡相比，陶瓷制交易卡硬度更高，卡身更耐磨损陶瓷制强度更高，卡身不易弯曲变形，由二氧化锆为主要成分的陶瓷硬度高的优点，能够进一步加强陶瓷制交易卡抗弯曲抗磨损性能，提高陶瓷制交易卡的使用寿命。
Description
说明书 发明名称:一种陶瓷制双界面交易卡及其陶瓷加工工艺 技术领域
[0001] 本发明属于交易卡技术领域， 尤其涉及一种陶瓷制双界面交易卡及其陶瓷加工 工艺。
背景技术
[0002] 随着社会发展， 在平常生活中， 交易卡逐渐穿插在人们的生活中， 例如是银行 卡、 交通卡、 会员卡， 这些卡片， 5见有技术中的交易卡一般材质为塑料或金属 ， 但一般金属材质的交易卡， 需要在卡片内设置无电磁信号屏蔽部件， 避免影 响交易卡的正常使用； 塑料材质和金属材质的交易卡硬度较低， 卡体不耐磨损 ； 塑料材质和金属材质的交易卡强度较低， 卡身易弯曲变形， 交易卡的使用寿 命低。
技术问题
[0003] 本发明提供一种陶瓷制双界面交易卡， 旨在解决现有技术中金属材质交易卡需 要在卡片内设置无电磁信号屏蔽部件， 塑料材质和金属材质的交易卡硬度、 强 度较低， 卡身不耐磨损易弯曲变形的问题。
问题的解决方案
技术解决方案
[0004] 本发明是这样实现的， 一种陶瓷制双界面交易卡， 包括交易卡本体， 所述交易 卡本体上设置有陶瓷基板， 所述陶瓷基板上设置有芯片槽， 所述芯片槽内嵌有 芯片， 所述基板一面上设置有陶瓷图片板， 所述陶瓷图片板上设置有开口， 所 述开口大小与芯片大小相同， 所述陶瓷图片板两侧设置有图片插接槽， 所述陶 瓷基板另一面上设置有卡接槽， 所述卡接槽与芯片槽相通， 所述卡接槽内嵌有 P CBA电路板， 所述陶瓷基板另一面上还设置有背胶， 所述 PCBA电路板一面与卡 接槽贴合， 另一面与背胶粘接， 所述背胶覆盖在 PCBA电路板和基板上， 所述背 胶表面设置有磁条。
[0005] 更进一步地， 所述陶瓷图片板贴合面上设置有胶水， 所述陶瓷图片板通过胶水
粘接在陶瓷基板上。
[0006] 更进一步地， 所述陶瓷图片板上设置有吸尘垫， 所述吸尘垫位于陶瓷图片板与 陶瓷基板相贴处。
[0007] 更进一步地， 所述芯片槽的内壁上设置有凸槽， 所述凸槽共有若干个， 若干个 所述凸槽在芯片槽内壁上相对设置。
[0008] 更进一步地， 所述芯片的底部设置有芯片封胶， 所述芯片通过芯片封胶粘贴在 若干个所述凸槽上。
[0009] 更进一步地， 所述卡接槽的深度与 PCBA电路板的厚度相同。
[0010] 更进一步地， 所述背胶上设置有凹槽， 所述磁条设置在凹槽内， 所述凹槽的深 度与磁条的厚度相同。
[0011] 本发明还提供一种陶瓷加工工艺， 包括以下步骤：
[0012] ( 1) 使用破碎机将锆英石矿石粉碎后得到锆英砂， 再将锆英砂进行提炼， 提 炼后的锆英砂成分为 66.40%的二氧化锆、 0.13%的二氧化钛、 042%的三氧化二 铁以及 33.20%的二氧化硅；
[0013] (2) 在提炼后的锆英砂中加入一定体积的有机溶液， 使锆英砂粘接成型；
[0014] (3) 成型后的锆英砂体在一定温度下保温一定时间后进行烧结成型；
[0015] (4) 成型后的陶瓷通过数控铣床先切削至一定形状， 然后再进一步修边；
[0016] (5) 完成修边的陶瓷通过数控钻床钻出一定大小的孔；
[0017] (6) 将钻孔后的陶瓷通过抛光设备依次进行粗抛光和精抛光；
[0018] (7) 通过丝印机将抛光后的陶瓷表面镀上膜层；
[0019] (8) 对镀膜后的陶瓷表面进行 AF处理。
[0020] 更进一步地， 锆英砂的提炼方式为火法冶金与湿化学法相结合的提炼方式。
发明的有益效果
有益效果
[0021] 本发明的有益效果： 由于设置了陶瓷基板和陶瓷图片板， 相比金属制交易卡， 无需额外增加无电磁信号屏蔽部件， 使得交易卡使用时感应更加灵敏； 与塑料 、 金属制交易卡相比， 陶瓷制交易卡硬度更高， 卡身更耐磨损； 与塑料、 金属 制交易卡相比， 陶瓷制强度更高， 卡身不易弯曲变形， 且由二氧化锆为主要成
分的陶瓷硬度高的优点， 能够进一步加强陶瓷制交易卡抗弯曲抗磨损性能， 提 高陶瓷制交易卡的使用寿命。
对附图的简要说明
附图说明
[0022] 图 1是本发明提供的一种陶瓷制双界面交易卡实施例一爆炸图。
[0023] 图 2是本发明提供的一种陶瓷制双界面交易卡正面图。
[0024] 图 3是本发明提供的一种陶瓷制双界面交易卡背面图。
[0025] 图 4是本发明提供的一种陶瓷制双界面交易卡侧剖图。
[0026] 图 5是本发明图 4中 A处放大图。
[0027] 图 6是本发明提供的一种陶瓷制双界面交易卡实施例二爆炸图。
[0028] 图中： 1-背胶； 2-PCBA电路板； 3 -陶瓷基板； 4 -凸槽； 5 -陶瓷图片板； 6 -卡接 槽； 7 -芯片槽； 8 -芯片封胶； 9 -芯片； 10-交易卡本体； 11-吸尘垫； 12 -图片插接 槽； 13 -磁条。 。
实施该发明的最佳实施例
本发明的最佳实施方式
[0029] 为了使本发明的目的、 技术方案及优点更加清楚明白， 以下结合附图及实施例 ， 对本发明进行进一步详细说明。 应当理解， 此处所描述的具体实施例仅仅用 以解释本发明， 并不用于限定本发明。
[0030] 如图 1-图 5所示， 一种陶瓷制双界面交易卡， 包括交易卡本体 10， 所述交易卡 本体 10上设置有陶瓷基板 3 , 所述陶瓷基板 3上设置有芯片槽 7 , 所述芯片槽 7内 嵌有芯片 9 , 所述基板 3—面上设置有陶瓷图片板 5 , 所述陶瓷图片板 5上设置有 开口， 所述开口大小与芯片 9大小相同， 陶瓷图片板 5上开口用于将芯片 9露出， 所述陶瓷图片板 5两侧设置有图片插接槽 12, 用于将图片插到陶瓷图片板 5中， 所述陶瓷基板 3另一面上设置有卡接槽 6 , 所述卡接槽 6与芯片槽 7相通， 所述卡 接槽 6内嵌有 PCBA电路板 2, 所述陶瓷基板 3另一面上还设置有背胶 1， 所述 PCB A电路板 2—面与卡接槽 6贴合， 另一面与背胶 1粘接， 所述背胶 1覆盖在 PCBA电 路板 2和基板 3上， 由于设置了陶瓷基板和陶瓷图片板， 使得交易卡在设置 PCBA 电路板 2时无需额外添加用于屏蔽电磁信号的部件， 增加了交易卡使用时感应的
灵敏度， 所述背胶 1表面设置有磁条 13。
[0031] 本发明中， 所述陶瓷图片板 5贴合面上设置有胶水， 所述陶瓷图片板 5通过胶水 粘接在陶瓷基板 3上； 所述陶瓷图片板 5上设置有吸尘垫 11， 所述吸尘垫 11位于 陶瓷图片板 5与陶瓷基板 3相贴处； 所述芯片槽 7的内壁上设置有凸槽 4, 所述凸 槽 4共有若干个， 若干个所述凸槽 4在芯片槽 7内壁上相对设置， 即若干个凸槽 4 芯片槽 7的内壁上均向芯片槽 7的中心延伸设置； 所述芯片 9的底部设置有芯片封 胶 8 , 所述芯片 9通过芯片封胶 8粘贴在若干个所述凸槽 4上， 芯片 9通过芯片封胶 8与凸槽 4上粘接， 能够将芯片 9更稳固的设置在芯片槽 7内， 增加芯片 9的安装稳 固性； 所述卡接槽 6的深度与 PCBA电路板 2的厚度相同， 由于卡接槽 6的深度与 P CBA电路板 2的厚度相同， 将 PCBA电路板 2设置在卡接槽 6内时， PCBA电路板 2 与陶瓷基板 3相平； 所述背胶 1上设置有凹槽， 所述磁条 13设置在凹槽内， 所述 凹槽的深度与磁条 13的厚度相同， 由于凹槽的深度与磁条 13的厚度相同， 将磁 条 13设置在背胶 1上的凹槽中时， 磁条 13与背胶 1表面平齐。
[0032] 实施例二
[0033] 如图 6所示， 本发明实施例二， 与实施例一不同的是， 所述 PCBA电路板 2—面 与陶瓷基板 3粘接， 另一面与背胶 1粘接， PCBA电路板 2设置在陶瓷基板 3与背胶 1之间。
[0034] 本发明还提供一种陶瓷加工工艺， 包括以下步骤：
[0035] ( 1) 使用破碎机将锆英石矿石粉碎后得到锆英砂， 再将锆英砂进行提炼， 提 炼后的锆英砂成分为 66.40%的二氧化锆、 0.13%的二氧化钛、 042%的三氧化二 铁以及 33.20%的二氧化硅；
[0036] (2) 在提炼后的锆英砂中加入一定体积的有机溶液， 使锆英砂粘接成型；
[0037] (3) 成型后的锆英砂体在一定温度下保温一定时间后进行烧结成型；
[0038] (4) 成型后的陶瓷通过数控铣床先切削至一定形状， 然后再进一步修边；
[0039] (5) 完成修边的陶瓷通过数控钻床钻出一定大小的孔；
[0040] (6) 将钻孔后的陶瓷通过抛光设备依次进行粗抛光和精抛光；
[0041] (7) 通过丝印机将抛光后的陶瓷表面镀上膜层；
[0042] (8) 对镀膜后的陶瓷表面进行 AF处理。
[0043] 本发明中锆英砂的提炼方式为火法冶金与湿化学法相结合的提炼方式。
[0044] 以上所述仅为本发明的较佳实施例而已， 并不用以限制本发明， 凡在本发明的 精神和原则之内所作的任何修改、 等同替换和改进等， 均应包含在本发明的保 护范围之内。
Claims
( 1) 使用破碎机将锆英石矿石粉碎后得到锆英砂， 再将锆英砂进行 提炼， 提炼后的锆英砂成分为 66.40%的二氧化锆、 0.13%的二氧化钛 、 042%的三氧化二铁以及 33.20%的二氧化硅；
(2) 在提炼后的锆英砂中加入一定体积的有机溶液， 使锆英砂粘接 成型；
(3) 成型后的锆英砂体在一定温度下保温一定时间后进行烧结成型
(4) 成型后的陶瓷通过数控铣床先切削至一定形状， 然后再进一步 修边；
(5) 完成修边的陶瓷通过数控钻床钻出一定大小的孔；
(6) 将钻孔后的陶瓷通过抛光设备依次进行粗抛光和精抛光；
(7) 通过丝印机将抛光后的陶瓷表面镀上膜层；
(8) 对镀膜后的陶瓷表面进行 AF处理。
[权利要求 9] 如权利要求 8所述的一种陶瓷制双界面交易卡的陶瓷加工工艺， 锆英 砂的提炼方式为火法冶金与湿化学法相结合的提炼方式。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811241549.4 | 2018-10-24 | ||
| CN201811241549.4A CN108960395A (zh) | 2018-10-24 | 2018-10-24 | 一种陶瓷制双界面交易卡及其陶瓷加工工艺 |
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| CN111816618B (zh) * | 2020-09-03 | 2020-12-15 | 捷德(中国)科技有限公司 | 识别卡及识别卡制备方法 |
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| CN107111766A (zh) * | 2014-11-03 | 2017-08-29 | 安全创造有限责任公司 | 含陶瓷的和陶瓷复合材料交易卡 |
| CN207489071U (zh) * | 2017-12-07 | 2018-06-12 | 谭剑辉 | 金属制双界面交易卡 |
| CN108960395A (zh) * | 2018-10-24 | 2018-12-07 | 东莞市世竣电子科技有限公司 | 一种陶瓷制双界面交易卡及其陶瓷加工工艺 |
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| US10783422B2 (en) * | 2014-11-03 | 2020-09-22 | Composecure, Llc | Ceramic-containing and ceramic composite transaction cards |
| CN206224551U (zh) * | 2016-10-31 | 2017-06-06 | 金邦达有限公司 | 一种刻有3d图案的交易卡 |
| CN107784350A (zh) * | 2017-12-07 | 2018-03-09 | 谭剑辉 | 金属制双界面交易卡 |
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| CN107111766A (zh) * | 2014-11-03 | 2017-08-29 | 安全创造有限责任公司 | 含陶瓷的和陶瓷复合材料交易卡 |
| CN207489071U (zh) * | 2017-12-07 | 2018-06-12 | 谭剑辉 | 金属制双界面交易卡 |
| CN108960395A (zh) * | 2018-10-24 | 2018-12-07 | 东莞市世竣电子科技有限公司 | 一种陶瓷制双界面交易卡及其陶瓷加工工艺 |
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| 材料工程基础 (FOUNDATIONS OF MATERIALS ENGINEERING), 30 April 2001 (2001-04-30), pages 233, 234, ISSN: 756390932 * |
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