WO2020082565A1 - 柔性显示面板、柔性显示装置和柔性显示面板的制备方法 - Google Patents

柔性显示面板、柔性显示装置和柔性显示面板的制备方法 Download PDF

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Publication number
WO2020082565A1
WO2020082565A1 PCT/CN2018/123071 CN2018123071W WO2020082565A1 WO 2020082565 A1 WO2020082565 A1 WO 2020082565A1 CN 2018123071 W CN2018123071 W CN 2018123071W WO 2020082565 A1 WO2020082565 A1 WO 2020082565A1
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Prior art keywords
encapsulation layer
layer
organic encapsulation
organic
flexible display
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English (en)
French (fr)
Inventor
林敏�
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/344,025 priority Critical patent/US11296302B2/en
Publication of WO2020082565A1 publication Critical patent/WO2020082565A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the technical field of liquid crystal display, in particular to a flexible display panel, a flexible display device and a method for preparing a flexible display panel.
  • OLED has the advantages of high contrast, fast response speed, self-luminous, wide temperature range, etc., so it has gradually become the darling of the small-size display industry.
  • LCD / QLED technology is also constantly improving, which brings many challenges to the development of OLED.
  • OLED is easier to achieve flexible display, which is also difficult to achieve by other technologies at present, therefore, the development of flexible OLED technology is imminent.
  • the biggest challenge of Flexible OLED is that each film layer and multiple film layers on the display element will not peel off each other during bending or folding. Once the film layer peels off, the organic material / active electrode in the OLED display device will quickly Oxidation will occur, forming dark spots that gradually expand, so the stress and adhesion of the film layer are critical.
  • the transistor Q and the organic light emitting diode 70 constitute an OLED light emitting unit
  • the reference numeral 200 is an organic packaging layer.
  • This organic encapsulation layer covers the light-emitting area regionally and is disconnected in the middle; above the organic encapsulation layer 200 is the first inorganic layer 310 which wraps the organic encapsulation layer 200 and is discontinuous, between the first inorganic layer 310 Above is the second inorganic layer 320, which wraps the first inorganic layer 310 and is discontinuous.
  • the third inorganic layer 330 which is a continuous film layer It wraps all the film layers underneath.
  • This thin film packaging method forms a concave pattern in the discontinuous area, but if there are foreign objects in the concave pattern location, then this thin film packaging method is likely to cause packaging failure.
  • reference numeral 100 in the drawing represents a flexible substrate
  • reference numeral 200 represents a thin film transistor
  • reference numeral 300 represents an organic emission layer
  • reference numeral 400 represents Thin film encapsulation layer
  • reference number 500 indicates the polarized layer
  • reference number 600 indicates the outer cover
  • the reference number 500 is removed at the bending area 2AA, which can reduce the thickness and increase the bending characteristics, but the chromaticity and 3AA in the 2AA display area Or there will be a significant difference between the chromaticity of the 1AA area, resulting in uneven chromaticity.
  • a flexible display panel needs to be provided to solve the above problems.
  • the object of the present invention is to provide a flexible display panel which can effectively relieve the stress of the flexible display panel during bending and prevent the film layer from breaking or by forming a graphical design on the encapsulation layer of the flexible display panel at the bend
  • the problem of component failure caused by peeling and can improve the uniformity of the chromaticity of the bending area.
  • the present invention provides a flexible display panel, which includes: a flexible substrate; a thin film transistor array, the thin film transistor array is located on the flexible substrate; a pixel isolation layer, the pixel isolation layer is formed On the thin film transistor array; organic light emitting layer, the organic light emitting layer is located on the pixel isolation layer; thin film encapsulation layer, the thin film encapsulation layer is located on the organic light emitting layer;
  • the thin-film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are sequentially stacked;
  • the organic encapsulation layer includes a first organic encapsulation layer and a second organic encapsulation layer;
  • the organic A light-emitting unit is provided in the light-emitting layer, and the flexible display panel further includes at least one bending region and a planar region; the first organic encapsulation layer is disposed in the bending region and corresponds to
  • the cross section of the first organic encapsulation layer is one of regular hexagon, regular octagon, circle, ellipse or rhombus.
  • the elastic modulus of the first organic encapsulation layer is less than or equal to the elastic modulus of the second organic encapsulation layer.
  • the organic encapsulation layer further includes a third organic encapsulation layer, the third organic encapsulation layer is disposed in the planar area and the second inorganic encapsulation layer covers the third organic encapsulation layer
  • the material of the third organic encapsulation layer is different from that of the first organic encapsulation layer, and the elastic modulus of the third organic encapsulation layer is greater than the elastic modulus of the first organic encapsulation layer.
  • the materials of the first organic encapsulation layer and the second organic encapsulation layer are the same.
  • the first organic encapsulation layer and the second organic encapsulation layer are made of one of the materials of acrylic series, epoxy resin series or silicone series.
  • the first organic encapsulation layers corresponding to the two adjacent light-emitting units are connected to each other.
  • the thickness of the first inorganic encapsulation layer is 0.5 ⁇ m to 1.5 ⁇ m.
  • the present invention also provides a flexible display device including the above-mentioned flexible display panel.
  • the present invention also provides a method for manufacturing a flexible display panel, which includes the following steps: (b) providing a flexible substrate; (b) forming a thin film transistor array on the flexible substrate; (c) forming the thin film transistor Forming a pixel defining layer on the array; (d) forming an organic light emitting layer on the pixel defining layer; (e) depositing and forming a first inorganic encapsulating layer on the organic light emitting layer; (f) on the first inorganic A first organic encapsulation layer is formed on the encapsulation layer, and the first organic encapsulation layer is patterned, and the patterned first organic encapsulation layer is disposed in a bending area of the flexible display panel and corresponds to the light emitting unit Position, wherein the flexible display panel includes an organic light-emitting layer, and a light-emitting unit is provided in the organic light-emitting layer; (g) the second organic layer is overlaid on the patterned first organic encapsulation layer and the
  • the advantage of the present invention is that the flexible display panel of the present invention forms a graphic design on the encapsulation layer at the bend of the flexible display panel and is distributed in pairs with pixels in the display area, thereby effectively reducing the encapsulation layer and OLED
  • the stress generated during the bending or folding process between the light-emitting layers can effectively improve the reliability of the flexible display device and improve the chromaticity uniformity of the bending region.
  • FIG. 1 is a schematic drawing of the prior art patent US20160028043;
  • FIG. 5 is a schematic structural view of a flexible display panel in an embodiment of the invention.
  • FIG. 6 is a schematic structural diagram of a flexible display panel in another embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a flexible display device of the present invention.
  • FIG. 8 is a flowchart of steps of a method for manufacturing a flexible display panel in the embodiment of the present invention.
  • 9A to 9H are process flowcharts of the method for manufacturing the flexible display panel in the embodiment of the present invention.
  • Embodiments of the present invention provide a flexible display panel, a preparation method thereof, and a flexible display device. Each will be described in detail below.
  • the present invention provides a flexible display panel 500, which can be integrated into a flexible display device, such as a mobile phone, a TV, and a tablet computer.
  • a flexible display device such as a mobile phone, a TV, and a tablet computer.
  • the flexible display panel 500 includes a flexible substrate 510, a thin film transistor array 520, a pixel isolation layer 530, an organic light emitting layer 540, and a thin film encapsulation layer (not labeled in the figure).
  • the flexible substrate 510 may be made of polyvinyl alcohol, polyimide, polyester and other materials.
  • the thin film transistor array 520 is located above the flexible substrate 510.
  • the structure of the thin film transistor array 520 is a structure well known to those skilled in the art, and may include film layers such as an active layer, a gate insulating layer, a gate, a passivation layer, and a source and drain, but is not limited thereto.
  • the pixel isolation layer 530 is formed on the thin film transistor array 520.
  • the pixel isolation layer 530 is also called a pixel definition layer (pixel definition layer) Layer (abbreviated as PDL), which is used to isolate the R / G / B three sub-pixels in the display panel to avoid mutual influence between pixels.
  • PDL pixel definition layer
  • the organic light emitting layer 540 is located above the pixel isolation layer 530.
  • the organic light emitting layer 540 includes a hole injection layer, a hole transport layer, an electron blocking layer, a light emitting unit, an electron transport layer, an electron injection layer, a cathode, and a capping layer (capping layer) and lithium fluoride (LiF) layer.
  • the thin-film encapsulation layer (not labeled in the figure) is located on the organic light-emitting layer 540; the thin-film encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer stacked; the flexible display panel 500 includes at least one bending region BA and plane area NA.
  • the thin film encapsulation layer further includes a first inorganic encapsulation layer 550, an organic encapsulation layer (not labeled in the figure) and a second inorganic encapsulation layer 580 that are sequentially stacked .
  • the organic encapsulation layer includes a first organic encapsulation layer 560 and a second organic encapsulation layer 570.
  • the first organic encapsulation layer 560 is disposed in the bending area (BA) and corresponds to a position of the light-emitting unit in the organic light-emitting layer 540; the second organic encapsulation layer 570 is disposed at The bending area BA and the planar area NA, and the second organic encapsulation layer 570 covers the first organic encapsulation layer 560.
  • the cross section of the first organic encapsulation layer located in the bending region is a regular top-bottom symmetrical figure shape.
  • the cross section of the first organic encapsulation layer may be one of regular hexagon, regular octagon, circle, ellipse or rhombus.
  • the cross section of the first organic encapsulation layer is a regular hexagon. Since the cross section of the first organic encapsulation layer 560 has the above-mentioned vertically symmetrical figure shape, it is helpful for the first organic encapsulation layer 560 to have good ductility.
  • the first organic encapsulation layer 560 When the bending area BA of the flexible display panel 500 is bent by an external force, the first organic encapsulation layer 560 has good ductility, which can avoid the failure of the encapsulation layer, thereby effectively improving the reliability of the bending area Sex.
  • the cross-sectional shape of the first organic encapsulation layer 560 adopting a regular hexagon is designed according to actual production conditions, so that it is easier to form the required first organic encapsulation layer 560.
  • the cross section of the first organic encapsulation layer 560 is in a regular up-down symmetrical pattern, and the first organic encapsulation layer 560 is disposed at a position corresponding to the light-emitting unit in the organic light-emitting layer 540, the bending can be effectively improved
  • the chromaticity of the area is uniform, thereby effectively solving the problem in the prior art: when the display panel is bent, uneven chromaticity is easy to occur, such as the patent US20150144921 involved in the background technology.
  • the first organic encapsulation layer 560 is disposed in the bending area BA of the flexible display panel 500 and corresponds to the light-emitting unit in the organic light-emitting layer 540
  • the second organic encapsulation layer 570 is disposed in the bending area BA and the planar area NA, and the second organic encapsulation layer 570 covers the first organic encapsulation layer 560.
  • the elastic modulus of the first organic encapsulation layer 560 is less than the elastic modulus of the second organic encapsulation layer 570.
  • the elastic modulus of the second organic encapsulation layer 570 is large, the second organic encapsulation layer 570 is easily extended, which can avoid the discontinuity in the prior art.
  • the position where the pattern is formed is likely to cause a packaging failure, which further improves the durable bending performance of the flexible display panel 500.
  • the elastic modulus here refers to Young's modulus.
  • the elastic modulus of the first organic encapsulation layer 560 may also be equal to the elastic modulus of the second organic encapsulation layer 570.
  • the material of the first organic encapsulation layer 560 and the material of the second organic encapsulation layer 570 are the same.
  • the cross-sectional shape of the first organic encapsulation layer 560 is a regular hexagon, and the adjacent first organic encapsulation layers 560 corresponding to the two light-emitting units are connected to each other, which can benefit the two adjacent first
  • the diffusion and transfer of stress between the organic encapsulation layers 560 effectively solves the problem of stress concentration on a thin film layer in the prior art, which may cause film layer breakage, such as the patent application US20160099433 in the background art.
  • the first inorganic encapsulation layer 550 and the second inorganic encapsulation layer 580 in the thin film encapsulation layer can be formed by vacuum evaporation, ion beam sputtering, chemical vapor deposition, etc.
  • the first inorganic encapsulation layer The manner of forming the layer 550 and the second inorganic encapsulation layer 580 is not limited.
  • the thickness of the first inorganic encapsulation layer 550 is 0.5 microns to 1.5 microns
  • the material of the first inorganic encapsulation layer 550 is one or more of SiNx, SiOx, SiONx, SiCNx, Al2O3, TiO2, ZrO2, etc. Combinations of different materials.
  • the material of the second inorganic encapsulating layer 580 may be the same as the material of the first inorganic encapsulating layer 550, or any combination of the above materials. It should be noted that in this embodiment, the second inorganic encapsulation layer 580 completely covers the first inorganic encapsulation layer 550 and the organic film layer, thereby effectively preventing the diffusion of the organic film layer and the first inorganic encapsulation layer 550 In order to relieve stress, this also avoids the situation where the island-like inorganic encapsulation layer does not completely protect the organic film layer, such as the patent application US9252395 in the background art.
  • the first organic encapsulation layer 560 and the second organic encapsulation layer 570 in the thin-film encapsulation layer can serve as a buffer, reducing the sputtering force and the stress of the inorganic encapsulation layer on the organic light-emitting layer 540 when forming the inorganic encapsulation layer influences.
  • the first organic encapsulation layer 560 and the second organic encapsulation layer 570 in the thin film encapsulation layer may be formed by inkjet printing, screen printing, plasma enhanced vapor deposition PEVCD, etc. The advantages of fast deposition speed and good uniformity have become the preferred method of thin film packaging process.
  • the material of the first organic encapsulation layer 560 and the second organic encapsulation layer 570 may be selected from one of acrylic series, epoxy series or silicone series.
  • the organic encapsulation layer serves to buffer the stress of the first inorganic encapsulation layer 550 and the second inorganic encapsulation layer 580 and cover the foreign matter inside the flexible display panel 500 to play a planarizing role. Therefore, the organic encapsulation layer has a certain thickness, of which the first The thickness of an organic encapsulation layer 560 is 1-3 microns, and the thickness of the second organic encapsulation layer 570 is 4-16 microns).
  • the thickness of the organic encapsulation layer is required to be as small as possible when performing inkjet printing to ensure the yield. Therefore, the thickness of the organic encapsulation layer is set within an appropriate range, which can ensure the buffering effect, the flattening effect, and the yield of the organic encapsulation layer in the bending area BA, and can achieve the effect of favoring bending.
  • the organic encapsulation layer further includes a third organic encapsulation layer 590, the third organic encapsulation layer 590 is disposed in the planar area NA and the first
  • the second organic encapsulation layer 570 covers the third organic encapsulation layer 590. That is, the second organic encapsulation layer 570 covers the first organic encapsulation layer 560 in the bending area BA, and the third organic encapsulation layer 590 in the planar area NA.
  • the thickness of the third organic encapsulation layer 590 is the same as the thickness of the first organic encapsulation layer 560.
  • the material of the third organic encapsulation layer 590 is different from the material of the first organic encapsulation layer 560, and the elastic modulus of the third organic encapsulation layer 590 is greater than the elastic modulus of the first organic encapsulation layer 560.
  • the flexible display panel 500 is more favorable for bending, and the film layer is not easy to break and extend.
  • the first organic encapsulation layer 560, the second organic encapsulation layer 570, and the third organic encapsulation layer 590 may be one of acrylic series, epoxy series, or silicone series Made of materials.
  • the material of the first organic encapsulation layer 560 is different from the material of the third organic encapsulation layer 590, and may be the same as the material of the second organic encapsulation layer 570.
  • the materials of the first organic encapsulation layer 560, the second organic encapsulation layer 570, and the third organic encapsulation layer 590 may all be different.
  • the present invention also provides a flexible display device.
  • the flexible display device includes the flexible display panel 500 according to any one of the foregoing embodiments, and may further include other components for supporting the normal operation of the flexible display device.
  • the flexible display device may be any product or component with a display function such as a mobile phone, a TV, a display, a digital photo frame, a navigator, and the like. Since the flexible display device 500 provided in this embodiment adopts the flexible display panel 500, the flexible display device also has the same beneficial effects as the flexible display panel 500.
  • the present invention also provides a method for manufacturing a flexible display panel, which includes the following steps:
  • step S810 providing a flexible substrate.
  • the flexible substrate 510 may be made of materials such as polyvinyl alcohol, polyimide, and polyester.
  • step S820 forming a thin film transistor array on the flexible substrate.
  • the thin film transistor array 520 is located above the flexible substrate 510.
  • the thin film transistor array 520 can be formed in a manner well known to those skilled in the art.
  • An amorphous silicon layer is formed on the substrate by plasma vapor deposition method, and then LTPS technology is used to form polysilicon, and then the polysilicon layer is patterned to form an active layer.
  • the first gate insulating layer is formed by the CVD method
  • the second gate insulating layer is formed by the plasma chemical vapor deposition method
  • the gate is formed on the second gate insulating layer.
  • a passivation layer is deposited and formed on the surface of the gate electrode and the exposed surface of the second gate insulating layer by the PECVD method.
  • a metal layer is deposited by a PVD method to form source and drain electrodes.
  • a flat layer can be formed on the surfaces of the passivation layer, the source electrode, and the drain electrode.
  • step S830 forming a pixel defining layer on the thin film transistor array.
  • a patterned pixel defining layer 530 may be formed thereon.
  • the pixel isolation layer or pixel definition layer is used to isolate the three R / G / B sub-pixels in the display panel to avoid mutual influence between pixels.
  • step S840 forming an organic light-emitting layer on the pixel defining layer.
  • An organic light emitting layer 540 is formed on the pixel defining layer 530.
  • the organic light emitting layer 540 is provided with a light emitting unit, and the light emitting unit is surrounded by the pixel defining layer 530.
  • step S850 deposit and form a first inorganic encapsulation layer on the organic light-emitting layer.
  • a first inorganic encapsulation layer 550 can be deposited and formed on the organic light-emitting layer 540 by chemical vapor deposition.
  • the thickness of the first inorganic encapsulation layer 550 is 0.5 ⁇ m to 1.5 ⁇ m.
  • the material of the first inorganic encapsulation layer 550 is a combination of one or more materials such as SiNx, SiOx, SiONx, SiCNx, Al2O3, TiO2, ZrO2, etc. .
  • the surface of the first inorganic encapsulation layer 550 is etched through a dry etching process to form a groove at a position corresponding to the light emitting unit, that is, a groove is formed at a position corresponding to the pixel area in the flexible display panel.
  • step S860 forming a first organic encapsulation layer on the first inorganic encapsulation layer, and patterning the first organic encapsulation layer, and the patterned first organic encapsulation layer is disposed on the flexible display A position within a bending area of the panel corresponding to the light-emitting unit, wherein the flexible display panel includes an organic light-emitting layer, and the light-emitting unit is disposed in the organic light-emitting layer.
  • a first organic encapsulation layer 560 is formed on the patterned first inorganic encapsulation layer 550, and it is patterned by imprinting to form a patterned first organic encapsulation in the groove Layer 560.
  • the cross-section of the first organic encapsulation layer 560 located in the bending region has a regular top-bottom symmetrical figure shape.
  • the cross section of the first organic encapsulation layer 560 may be one of regular hexagon, regular octagon, circle, ellipse or rhombus. In this embodiment, the cross section of the first organic encapsulation layer 560 is a regular hexagon.
  • the cross section of the first organic encapsulation layer 560 has a regular top-bottom symmetrical figure shape, which helps the first organic encapsulation layer 560 to have good ductility.
  • the first organic encapsulation layer 560 has good ductility, which can avoid the failure of the encapsulation layer, thereby effectively improving the reliability of the bending area.
  • the symmetrical hexagonal cross-sectional shape of the first organic encapsulation layer 560 is designed according to actual production conditions, so that it is easier to form the required first organic encapsulation layer 560.
  • the flexible display panel can be improved
  • the chromaticity and efficiency of the edge area of the device that is, the chromaticity uniformity of the bending area is effectively improved, thereby effectively solving the problems in the prior art and improving the uniformity of the entire flexible display panel.
  • step S870 covering the patterned first organic encapsulation layer and the exposed inorganic encapsulation layer with a second organic encapsulation layer 570.
  • a second organic encapsulation layer 570 is covered on the first organic encapsulation layer 560, and the second organic encapsulation layer 570 is formed in the bending area and the planar area of the flexible display panel.
  • a second organic encapsulation layer 570 is formed on the exposed surfaces of the first inorganic encapsulation layer 550 and the first organic encapsulation layer 560.
  • the materials of the first organic encapsulation layer 560 and the second organic encapsulation layer 570 may be the same or different.
  • the first organic encapsulation layer 560 and the second organic encapsulation layer 570 may be made of one of the materials of acrylic series, epoxy series or silicone series.
  • the elastic modulus of the first organic encapsulation layer 560 is less than the elastic modulus of the second organic encapsulation layer 570, that is to say, the material of the first organic encapsulation layer 560 is different from the second organic encapsulation layer 570 material.
  • the elastic modulus of the second organic encapsulation layer 570 is large, the second organic encapsulation layer 570 is easy to extend, thereby avoiding the formation of discontinuous regions in the prior art The location of the pattern is likely to cause packaging failure.
  • the elastic modulus of the first organic encapsulation layer 560 may also be equal to the elastic modulus of the second organic encapsulation layer 570.
  • the material of the first organic encapsulation layer 560 and the material of the second organic encapsulation layer 570 are the same. It should be noted that although the materials of the first organic encapsulation layer 560 and the second organic encapsulation layer 570 are the same, due to the inkjet printing method, the first organic encapsulation layer 560 and the second organic encapsulation layer 570 are formed After inkjet printing, the material changes from liquid to solid, and a boundary is formed between the first organic encapsulation layer 560 and the second organic encapsulation layer 570.
  • step S880 depositing and forming a second inorganic encapsulation layer on the second organic encapsulation layer.
  • a second inorganic encapsulation layer 580 is deposited and formed on the second organic encapsulation layer 570, and the second inorganic encapsulation layer 580 completely covers the first inorganic encapsulation layer 550, that is, the first inorganic encapsulation layer 550 and the second inorganic
  • the encapsulation layer 580 is in full contact to further ensure the encapsulation strength and effect.
  • the flexible display panel of the present invention forms a graphical design on the encapsulation layer at the bend of the flexible display panel and is distributed in pairs with pixels in the display area, thereby effectively reducing the bending between the encapsulation layer and the OLED light-emitting layer Or the stress generated in the folding process, and can effectively improve the reliability of the flexible display device and improve the chromaticity uniformity of the bending area.

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Abstract

本发明披露了一种柔性显示面板、柔性显示装置和柔性显示面板的制备方法。所述柔性显示面板通过在柔性显示面板弯折处的封装层上形成图形化设计，从而能够有效地缓解弯折时柔性显示面板的应力，防止膜层断裂或剥离导致的元件失效问题，而且可以提高弯折区域的色度均一性。

Description

柔性显示面板、柔性显示装置和柔性显示面板的制备方法 技术领域
本发明涉及液晶显示技术领域，尤其涉及一种柔性显示面板、柔性显示装置和柔性显示面板的制备方法。
 背景技术
OLED具有高对比度、快响应速度、自发光、温度适用范围广等优点，因此目前已经逐渐成为小尺寸显示行业的宠儿，然而随着人们对产品要求的不断提高，这些特点已经不能满足需求，同时LCD/QLED技术也在不断进步，这样就给OLED发展带来很多挑战。相对于其它显示技术，OLED更易实现flexible显示，这也是其他技术目前很难达到的，因此，发展flexible OLED技术迫在眉睫。Flexible OLED最大的挑战在于显示元件上每个膜层以及多膜层之间不会因为在弯曲或折叠过程中相互剥离，一旦发生膜层剥离，OLED显示器件中的有机材料/活泼电极很快就会发生氧化，形成逐渐扩大的黑斑，因此膜层的应力、粘结性等方面至关重要。
 技术问题
其中，三星公司在一篇美国专利文件US20160028043中公布了一种可伸展的薄膜封装结构，如图1所示，晶体管Q和有机发光二极管70构成OLED发光单元，标号200为一层有机封装层，这层有机封装层区域化覆盖发光区域，中间断开；在有机封装层200之上的是第一无机层310，这层无机层包裹有机封装层200且不连续，在第一无机层310之上的是第二无机层320，这层无机层包裹第一无机层310且不连续，在第二无机层320之上的是第三无机层330，第三无机层330是一连续的膜层，其包裹下面所有膜层，这种薄膜封装方式在不连续区域形成凹形图案，但是如果有异物存在该凹形图案位置之处，那么该种薄膜封装方式容易引起封装失败。
LG公司在一篇美国专利文件US20150144921中公布了一种弯曲OLED结构，如图2所示，附图中的标号100表示柔性基底，标号200表示薄膜晶体管，标号300表示有机发射层，标号400表示薄膜封装层，标号500表示极化层，标号600表示外盖，在弯折区域2AA处，将标号500去除，这样可以减少厚度，同时增加弯曲特性，但是，在2AA显示区域的色度与3AA或1AA区域的色度之间会出现明显的差别，导致色度不均匀现象。
三星公司在一篇美国专利文件US9252395中公布了关于孤立的薄膜封装结构，如图3所示，其中标号231表示第一电极，标号233表示OLED的发光层基本单元，标号235表示第二电极，标号311表示呈孤岛分离状的第一无机封装层，且第一无机封装层覆盖OLED发光元件，标号313表示第二无机封装层，并且覆盖第一无机封装层，该种结构能够有效地防止封装膜层缺陷的扩散，但是该种结构并未对有机膜层形成完全保护，容易失效。
另外，三星公司在一篇美国专利文件US20160099433中公开了一种弯曲OLED设计，如图4所示，其中，在柔性基底100上制作三角形或其他凹槽，这样在内弯的过程中，柔性基底100上的应力会显著减少，但是这种设计会将应力集中在第三薄膜层TFT上，这样会带来断裂的风险。
有鉴于此，需提供一种柔性显示面板以解决上述问题。
 技术解决方案
本发明的目的在于，提供一种柔性显示面板，其通过在柔性显示面板弯折处的封装层上形成图形化设计，从而能够有效地缓解弯折时柔性显示面板的应力，防止膜层断裂或剥离导致的元件失效问题，而且可以提高弯折区域的色度均一性。
为了解决上述问题，本发明提供了一种柔性显示面板，其包括：柔性衬底；薄膜晶体管阵列，所述薄膜晶体管阵列位于所述柔性衬底之上；像素隔离层，所述像素隔离层形成在所述薄膜晶体管阵列之上；有机发光层，所述有机发光层位于所述像素隔离层之上；薄膜封装层，所述薄膜封装层位于所述有机发光层之上；沿远离所述柔性衬底方向所述薄膜封装层包括依次层叠设置的第一无机封装层、有机封装层和第二无机封装层；所述有机封装层包括第一有机封装层和第二有机封装层；所述有机发光层中设置有发光单元，所述柔性显示面板还包括至少一弯折区和平面区；所述第一有机封装层设置在所述弯折区内且与所述发光单元相对应的位置；所述第二有机封装层设置在所述弯折区和所述平面区内，且所述第二有机封装层覆盖在所述第一有机封装层上；其中，位于所述弯折区内的所述第一有机封装层的截面为规则的上下对称的图形状。
在本发明的一实施例中，所述第一有机封装层的截面为正六边形、正八边形、圆形、椭圆形或菱形中的一种。
在本发明的一实施例中，所述第一有机封装层的弹性模量小于或等于所述第二有机封装层的弹性模量。
在本发明的一实施例中，所述有机封装层还包括第三有机封装层，所述第三有机封装层设置在所述平面区内且所述第二无机封装层覆盖第三有机封装层，所述第三有机封装层的材料与所述第一有机封装层的材料不同，且所述第三有机封装层的弹性模量大于所述第一有机封装层的弹性模量。
在本发明的一实施例中，所述第一有机封装层和所述第二有机封装层的材质是相同。
在本发明的一实施例中，所述第一有机封装层和所述第二有机封装层是由亚克力系列、环氧树脂系列或有机硅系列中的其中一种材质制成。
在本发明的一实施例中，相邻的两个所述发光单元分别对应的第一有机封装层之间彼此相连。
在本发明的一实施例中，所述第一无机封装层的厚度为0.5微米～1.5微米。
另外，本发明还提供一种柔性显示装置，所述柔性显示装置包括上述的柔性显示面板。
另外，本发明还一种柔性显示面板的制备方法，其包括以下步骤：（b）提供柔性衬底；（b）在所述柔性衬底上形成薄膜晶体管阵列；（c）在所述薄膜晶体管阵列上形成像素限定层；（d）在所述像素限定层上形成有机发光层；（e）在所述有机发光层上沉积并形成第一无机封装层；（f）在所述第一无机封装层上形成第一有机封装层，并且对第一有机封装层进行图形化，且图形化的第一有机封装层设置在所述柔性显示面板的一弯折区内且与发光单元相对应的位置，其中所述柔性显示面板包括有机发光层，在所述有机发光层中设置有发光单元；（g）在图形化的第一有机封装层和显露的第一无机封装层上覆盖第二有机封装层；（h）在所述第二有机封装层上沉积并形成第二无机封装层。
 有益效果
本发明的优点在于，本发明所述柔性显示面板通过在柔性显示面板的弯折处的封装层上形成图形化设计，并且与显示区域内的像素成对分布，从而有效地降低封装层和OLED发光层之间因弯曲或折叠过程中所产生的应力，而且能够有效地提高柔性显示器件的可靠性，以及提高弯折区域的色度均一性。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有技术的专利US20160028043的附图示意图；
图2是现有技术的专利US20150144921的附图示意图；
图3是现有技术的专利US9252395的附图示意图；
图4是现有技术的专利US20160099433的附图示意图；
图5是本发明一实施例中的一种柔性显示面板的结构示意图；
图6是本发明另一实施例中的柔性显示面板的结构示意图；
图7是本发明的一种柔性显示装置的结构示意图；
图8是本发明所述实施例中的柔性显示面板的制备方法步骤流程图；
图9A至图9H是本发明所述实施例中的柔性显示面板的制备方法的工艺流程图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的说明书和权利要求书以及上述附图中的术语“第一”、“第二”、“第三”等（如果存在）是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解，这样描述的对象在适当情况下可以互换。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含。
在本专利文档中，下文论述的附图以及用来描述本发明公开的原理的各实施例仅用于说明，而不应解释为限制本发明公开的范围。所属领域的技术人员将理解，本发明的原理可在任何适当布置的系统中实施。将详细说明示例性实施方式，在附图中示出了这些实施方式的实例。此外，将参考附图详细描述根据示例性实施例的终端。附图中的相同附图标号指代相同的元件。
本发明说明书中使用的术语仅用来描述特定实施方式，而并不意图显示本发明的概念。除非上下文中有明确不同的意义，否则，以单数形式使用的表达涵盖复数形式的表达。在本发明说明书中，应理解，诸如“包括”、“具有”以及“含有”等术语意图说明存在本发明说明书中揭示的特征、数字、步骤、动作或其组合的可能性，而并不意图排除可存在或可添加一个或多个其他特征、数字、步骤、动作或其组合的可能性。附图中的相同参考标号指代相同部分。
本发明实施例提供一种柔性显示面板及其制备方法和一种柔性显示装置。以下将分别进行详细说明。
参见图5，本发明提供了一种柔性显示面板500，所述柔性显示面板500可以集成于柔性显示装置中，例如手机、电视和平板电脑等。
所述柔性显示面板500包括：柔性衬底510、薄膜晶体管阵列520、像素隔离层530、有机发光层540和薄膜封装层（图中未标号）。
其中，所述柔性衬底510可以是由聚乙烯醇，聚酰亚胺，聚酯等材质制成。
所述薄膜晶体管阵列520位于所述柔性衬底510之上。所述薄膜晶体管阵列520的结构为本领域技术人员所熟知的结构，可以包括有源层、栅极绝缘层、栅极、钝化层、源极漏极等膜层，但不限于此。
所述像素隔离层530形成在所述薄膜晶体管阵列520之上。所述像素隔离层530或称为像素界定层（pixel definition layer，简称PDL），其用于将显示面板中的R/G/B三个子像素进行隔离，避免像素之间的相互影响。
所述有机发光层540位于所述像素隔离层530之上。在本实施例中，所述有机发光层540包括空穴注入层、空穴传输层、电子阻挡层、发光单元、电子传输层、电子注入层、阴极、覆盖层（capping layer）和氟化锂（LiF）层。
所述薄膜封装层（图中未标号）位于所述有机发光层540之上；所述薄膜封装层包括层叠设置的无机封装层和有机封装层；所述柔性显示面板500包括至少一弯折区BA和平面区NA。
在本实施例中，沿远离所述柔性衬底510方向，所述薄膜封装层进一步包括依次层叠设置的第一无机封装层550、有机封装层（图中未标号）和第二无机封装层580。所述有机封装层包括第一有机封装层560和第二有机封装层570。所述第一有机封装层560设置在所述弯折区（bending area, 即BA）内且与所述有机发光层540中的发光单元相对应的位置；所述第二有机封装层570设置在所述弯折区BA和所述平面区NA内，且所述第二有机封装层570覆盖在所述第一有机封装层560上。
位于所述弯折区内的所述第一有机封装层的截面为规则的上下对称的图形状。所述第一有机封装层的截面可以为正六边形、正八边形、圆形、椭圆形或菱形中的一种。在本实施例中，所述第一有机封装层的截面为正六边形。由于所述第一有机封装层560的截面具有上述上下对称的图形状，因此有助于所述第一有机封装层560具有良好的延展性。当所述柔性显示面板500的弯折区BA在受到外力而弯曲时，所述第一有机封装层560具有良好的延展性，这样可以避免封装层的失败，从而有效地提高弯折区域的可靠性。另外，采用所述第一有机封装层560的截面形状呈正六边形是根据实际生产情况而设计，这样比较容易形成所需的第一有机封装层560。
由于所述第一有机封装层560的截面呈规则的上下对称的图案状，且第一有机封装层560设置在与有机发光层540中的发光单元对应的位置，因此，能够有效地提高弯折区域的色度均一性，从而有效地解决现有技术中所存在的问题：当显示面板弯折时，容易出现色度不均匀的现象，如背景技术中所涉及的专利US20150144921。
另外，本实施例提供的柔性显示面板500，通过将所述第一有机封装层560设置在柔性显示面板500的弯折区BA内且与所述有机发光层540中的发光单元相对应的位置，所述第二有机封装层570设置在所述弯折区BA和所述平面区NA内，且所述第二有机封装层570覆盖在所述第一有机封装层560上。所述第一有机封装层560的弹性模量小于所述第二有机封装层570的弹性模量。当所述柔性显示面板500弯曲时，由于所述第二有机封装层570的弹性模量较大，于是所述第二有机封装层570容易延伸，从而能够避免现有技术中在不连续区域所形成图案的位置之处易引起封装失败的情况，进一步提高柔性显示面板500的耐用弯折性能。需说明的是，此处的弹性模量是指杨氏模量。
另外，所述第一有机封装层560的弹性模量也可以等于所述第二有机封装层570的弹性模量。此时，所述第一有机封装层560的材质与所述第二有机封装层570的材质为相同。
所述第一有机封装层560的截面形状呈正六边形，且相邻的两个所述发光单元分别对应的第一有机封装层560之间彼此相连，能够有利于相邻两个的第一有机封装层560之间的应力的扩散和转移，从而有效地解决现有技术中应力集中在某一薄膜层上而可能导致膜层断裂的问题，如背景技术中的专利申请US20160099433。
另外，所述薄膜封装层中的第一无机封装层550和第二无机封装层580的形成方式可以采用包括真空蒸镀、离子束溅射、化学气相沉积等，本实施例对第一无机封装层550和第二无机封装层580的形成方式不做限定。可选地，所述第一无机封装层550的厚度在0.5微米～1.5微米，所述第一无机封装层550的材质为SiNx、SiOx、SiONx、SiCNx、Al2O3、TiO2、ZrO2等一种或多种材质的组合。而第二无机封装层580的材质可以与第一无机封装层550的材质相同，或者是上述材质中的任意组合。需注意的是，在本实施例中，所述第二无机封装层580完全覆盖所述第一无机封装层550以及有机膜层，从而有效地阻止有机膜层和第一无机封装层550的扩散，缓解应力，这样也避免了孤岛状的无机封装层并未对有机膜层形成完全保护的情况，如背景技术中的专利申请US9252395。
所述薄膜封装层中的第一有机封装层560和第二有机封装层570可以起到缓冲的作用，降低形成无机封装层时溅射的作用力和无机封装层的应力对有机发光层540的影响。所述薄膜封装层中的第一有机封装层560和第二有机封装层570的形成方式可以包括喷墨打印、丝网打印、等离子体增强气相沉积法PEVCD等，其中喷墨打印的工艺方法因沉积速度快、均匀性好等优点，成为薄膜封装工艺的优选方法。所述第一有机封装层560和所述第二有机封装层570的材质可以选自亚克力系列、环氧树脂系列或有机硅系列中的其中一种。
有机封装层一方面用于缓冲第一无机封装层550和第二无机封装层580的应力及覆盖柔性显示面板500内部的异物起到平坦化作用，因此，有机封装层具有一定的厚度，其中第一有机封装层560的厚度为1-3微米，第二有机封装层570的厚度在4-16微米)，另外有机封装层在进行喷墨打印时要求其厚度尽量小，以保证良率。因此有机封装层的厚度设置在一合适的范围内，可以保证弯折区BA内有机封装层的缓冲作用、平坦化作用及喷墨打印时的良率，并且能够达到利于弯折的效果。
参见图6所示，在本发明的另一实施例中，所述有机封装层还包括第三有机封装层590，所述第三有机封装层590设置在所述平面区NA内且所述第二有机封装层570覆盖在所述第三有机封装层590之上。亦即，所述第二有机封装层570在弯折区BA内覆盖第一有机封装层560，在平面区NA内覆盖第三有机封装层590。在所述第三有机封装层590的厚度与所述第一有机封装层560的厚度为相同。
所述第三有机封装层590的材料与所述第一有机封装层560的材料不同，且所述第三有机封装层590的弹性模量大于所述第一有机封装层560的弹性模量。通过该结构的设计，使得柔性显示面板500更有利于弯折，且不易膜层断裂延伸。
在该实施例中，所述第一有机封装层560、所述第二有机封装层570、所述第三有机封装层590可以由亚克力系列、环氧树脂系列或有机硅系列中的其中一种材质制成。所述第一有机封装层560的材质与所述第三有机封装层590的材质为不同，且可以与所述第二有机封装层570的材质相同。当然，也可以第一有机封装层560、第二有机封装层570和第三有机封装层590的材质均不同。
参见图7，本发明还提供一种柔性显示装置，所述柔性显示装置包括上述任一实施例所述的柔性显示面板500，还可以包括用于支撑柔性显示装置正常工作其他部件。该柔性显示装置可以为手机、电视、显示器、数码相框、导航仪等任何具有显示功能的产品或部件。本实施例提供的柔性显示装置由于采用了上述柔性显示面板500，因此柔性显示装置同样具有上述柔性显示面板500相同的有益效果。
参见图8和图9A至图9H，本发明还提供一种柔性显示面板的制备方法，其包括以下步骤：
结合图9A，步骤S810：提供一柔性衬底。
所述柔性衬底510可以是由聚乙烯醇，聚酰亚胺，聚酯等材质制成。
结合图9B，步骤S820：在所述柔性衬底上形成一薄膜晶体管阵列。
所述薄膜晶体管阵列520位于所述柔性衬底510之上。所述薄膜晶体管阵列520的形成方式可以采用本领域技术人员所熟知的方式。通过等离子体气相沉积法在衬底上形成非晶硅层，再采用LTPS技术形成多晶硅，再图形化多晶硅层形成有源层。然后，在通过CVD方法形成第一栅极绝缘层，采用等离子体化学气相沉积法形成第二栅极绝缘层，并在第二栅极绝缘层上形成栅极。接着，通过PECVD方法在所述栅极表面及暴露的第二栅极绝缘层表面沉积并形成钝化层。接着再通过PVD方法沉积金属层以形成源极和漏极。再可以在钝化层、源极、漏极的表面形成平坦层。
结合图9C，步骤S830：在所述薄膜晶体管阵列上形成一像素限定层。
在形成薄膜晶体管阵列520之后，可以在其之上形成一图形化的像素限定层530。所述像素隔离层或称为像素界定层（pixel definition layer），其用于将显示面板中的R/G/B三个子像素进行隔离，避免像素之间的相互影响。
结合图9D，步骤S840：在所述像素限定层上形成一有机发光层。
在所述像素限定层530上形成一有机发光层540。有机发光层540设置有发光单元，且所述发光单元被所述像素限定层530包围。
结合图9E，步骤S850：在所述有机发光层上沉积并形成一第一无机封装层。
在本实施例中，可以采用化学气相沉积法在所述有机发光层540上沉积并形成一第一无机封装层550。所述第一无机封装层550的厚度在0.5微米～1.5微米，所述第一无机封装层550的材质为SiNx、SiOx、SiONx、SiCNx、Al2O3、TiO2、ZrO2等一种或多种材质的组合。
在此步骤中，通过干刻蚀工艺刻蚀第一无机封装层550的表面，在与发光单元对应的位置形成凹槽，即在柔性显示面板中的像素区域对应位置形成凹槽。
结合图9F，步骤S860：在所述第一无机封装层上形成一第一有机封装层，并且对第一有机封装层进行图形化，且图形化的第一有机封装层设置在所述柔性显示面板的一弯折区内且与发光单元相对应的位置，其中所述柔性显示面板包括有机发光层，在所述有机发光层中设置有发光单元。
通过喷墨打印方式，在图形化的第一无机封装层550上形成一第一有机封装层560，并且通过压印方式对其进行图形化，以在凹槽中形成图形化的第一有机封装层560。
当第一有机封装层560图形化后，位于所述弯折区内的所述第一有机封装层560的截面为规则的上下对称的图形状。所述第一有机封装层560的截面可以为正六边形、正八边形、圆形、椭圆形或菱形中的一种。在本实施例中，所述第一有机封装层560的截面为正六边形。
由于图形化第一有机封装层，使得所述第一有机封装层560的截面具有规则的上下对称的图形状，因此有助于所述第一有机封装层560具有良好的延展性。当所述柔性显示面板的弯折区在受到外力而弯曲时，所述第一有机封装层560具有良好的延展性，这样可以避免封装层的失败，从而有效地提高弯折区域的可靠性。另外，采用所述第一有机封装层560的截面形状呈对称六边形是根据实际生产情况而设计，这样比较容易形成所需的第一有机封装层560。
另外，由于所述第一有机封装层560的截面呈规则的上下对称的图形状，且第一有机封装层560设置在与有机发光层中的发光单元对应的位置，因此，能够提高柔性显示面板的边缘区域的色度和效率，即有效地提高弯折区域的色度均一性，从而有效地解决现有技术中所存在的问题，提高了整个柔性显示面板的均匀性。
结合图9G，步骤S870：在图形化的第一有机封装层和显露的一无机封装层上覆盖第二有机封装层570。
在所述第一有机封装层560上覆盖一第二有机封装层570，且所述第二有机封装层570形成在所述柔性显示面板的弯折区和平面区内。也就是说，在显露的第一无机封装层550和第一有机封装层560的表面覆盖并形成一第二有机封装层570。
在此步骤中，所述第一有机封装层560和所述第二有机封装层570的材质可以是相同或不同。所述第一有机封装层560和所述第二有机封装层570可以是由亚克力系列、环氧树脂系列或有机硅系列中的其中一种材质制成。
当所述第一有机封装层560的弹性模量小于所述第二有机封装层570的弹性模量，也就是说，所述第一有机封装层560的材质不同于所述第二有机封装层570的材质。当所述柔性显示面板弯曲时，由于所述第二有机封装层570的弹性模量较大，于是所述第二有机封装层570容易延伸，从而能够避免现有技术中在不连续区域所形成图案的位置之处易引起封装失败的情况。
所述第一有机封装层560的弹性模量也可以等于所述第二有机封装层570的弹性模量。此时，所述第一有机封装层560的材质与所述第二有机封装层570的材质为相同。需说明的是，尽管第一有机封装层560和第二有机封装层570的材质是相同的，但是由于采用喷墨打印的方式,因此，形成第一有机封装层560和第二有机封装层570的材质经喷墨打印后由液态变为固态，第一有机封装层560和第二有机封装层570之间会形成一界限。
结合图9H，步骤S880：在所述第二有机封装层上沉积并形成第二无机封装层。
在第二有机封装层570上沉积并形成一第二无机封装层580，且所述第二无机封装层580完全覆盖所述第一无机封装层550，即第一无机封装层550与第二无机封装层580充分接触，进一步保证封装强度和效果。
本发明所述柔性显示面板通过在柔性显示面板的弯折处的封装层上形成图形化设计，并且与显示区域内的像素成对分布，从而有效地降低封装层和OLED发光层之间因弯曲或折叠过程中所产生的应力，而且能够有效地提高柔性显示器件的可靠性，以及提高弯折区域的色度均一性。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (10)

  1. 一种柔性显示面板，其包括：
    一柔性衬底；
    一薄膜晶体管阵列，所述薄膜晶体管阵列位于所述柔性衬底之上；
    一像素隔离层，所述像素隔离层形成在所述薄膜晶体管阵列之上；
    一有机发光层，所述有机发光层位于所述像素隔离层之上；
    一薄膜封装层，所述薄膜封装层位于所述有机发光层之上；沿远离所述柔性衬底方向所述薄膜封装层包括依次层叠设置的第一无机封装层、有机封装层和第二无机封装层；所述有机封装层包括第一有机封装层和第二有机封装层；
    所述有机发光层中设置有发光单元，所述柔性显示面板还包括至少一弯折区和平面区；所述第一有机封装层设置在所述弯折区内且与所述发光单元相对应的位置；所述第二有机封装层设置在所述弯折区和所述平面区内，且所述第二有机封装层覆盖在所述第一有机封装层上；位于所述弯折区内的所述第一有机封装层的截面为规则的上下对称的图形状。
  2. 根据权利要求1所述的柔性显示面板，其中所述第一有机封装层的截面为正六边形、正八边形、圆形、椭圆形或菱形中的一种。
  3. 根据权利要求1所述的柔性显示面板，其中所述第一有机封装层的弹性模量小于或等于所述第二有机封装层的弹性模量。
  4. 根据权利要求1所述的柔性显示面板，其中所述有机封装层还包括一第三有机封装层，所述第三有机封装层设置在所述平面区内且所述第二无机封装层覆盖第三有机封装层，所述第三有机封装层的材料与所述第一有机封装层的材料不同，且所述第三有机封装层的弹性模量大于所述第一有机封装层的弹性模量。
  5. 根据权利要求1所述的柔性显示面板，其中所述第一有机封装层和所述第二有机封装层的材质相同。
  6. 根据权利要求1所述的柔性显示面板，其中所述第一有机封装层和所述第二有机封装层是由亚克力系列、环氧树脂系列或有机硅系列中的其中一种材质制成。
  7. 根据权利要求1所述的柔性显示面板，其中相邻的两个所述发光单元分别对应的第一有机封装层之间彼此相连。
  8. 根据权利要求1所述的柔性显示面板，其中所述第一无机封装层的厚度为0.5微米～1.5微米。
  9. 一种柔性显示装置，其中所述柔性显示装置包括权利要求1至8中任一项所述的柔性显示面板。
  10. 一种柔性显示面板的制备方法，其中包括以下步骤:
    （a）提供柔性衬底；
    （b）在所述柔性衬底上形成薄膜晶体管阵列；
    （c）在所述薄膜晶体管阵列上形成像素限定层；
    （d）在所述像素限定层上形成有机发光层；
    （e）在所述有机发光层上沉积并形成第一无机封装层；
    （f）在所述第一无机封装层上形成第一有机封装层，并且对第一有机封装层进行图形化，且图形化的第一有机封装层设置在所述柔性显示面板的一弯折区内且与发光单元相对应的位置，其中所述柔性显示面板包括有机发光层，在所述有机发光层中设置有发光单元；
    （g）在图形化的第一有机封装层和显露的第一无机封装层上覆盖第二有机封装层；以及
    （h）在所述第二有机封装层上沉积并形成第二无机封装层。
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