WO2020078190A1 - 一种cmp晶圆清洗设备、晶圆传输机械手及其晶圆翻转方法 - Google Patents

一种cmp晶圆清洗设备、晶圆传输机械手及其晶圆翻转方法 Download PDF

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Publication number
WO2020078190A1
WO2020078190A1 PCT/CN2019/108020 CN2019108020W WO2020078190A1 WO 2020078190 A1 WO2020078190 A1 WO 2020078190A1 CN 2019108020 W CN2019108020 W CN 2019108020W WO 2020078190 A1 WO2020078190 A1 WO 2020078190A1
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Prior art keywords
wafer
drying unit
cleaning
clamping arm
unit
Prior art date
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PCT/CN2019/108020
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English (en)
French (fr)
Inventor
沈凌寒
杨思远
臧志城
Original Assignee
杭州众硅电子科技有限公司
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Publication date
Priority claimed from CN201910842708.4A external-priority patent/CN110534472B/zh
Application filed by 杭州众硅电子科技有限公司 filed Critical 杭州众硅电子科技有限公司
Priority to US17/283,958 priority Critical patent/US11908720B2/en
Priority to SG11202103852YA priority patent/SG11202103852YA/en
Priority to KR1020217012688A priority patent/KR20210063423A/ko
Publication of WO2020078190A1 publication Critical patent/WO2020078190A1/zh

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    • H—ELECTRICITY
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    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • B08B7/026—Using sound waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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Definitions

  • the invention relates to the field of equipment for manufacturing semiconductor integrated circuit chips, in particular to a CMP wafer cleaning device, a wafer transfer robot, and a method for turning the wafer.
  • polishing technology is the product of the development of integrated circuits towards miniaturization, multi-layering, thinning and planarization.
  • it is also a necessary process technology for the wafer to transition from 200mm to 300mm or even larger diameters, to improve productivity, reduce manufacturing costs, and globally flatten the substrate.
  • the CMP equipment needs to be used with the cleaning equipment.
  • the configuration of mainstream cleaning equipment includes a wafer vertical mode and a wafer horizontal mode, and the configuration of the cleaning unit of each equipment is different.
  • the vertical cleaning unit can save equipment space, and the process consistency of megasonic cleaning and brushing is better.
  • the drying effect is not as good as the horizontal mode, and the horizontal cleaning unit is not conducive to pollutants in time. Remove the wafer surface.
  • this method needs to move the manipulator as a whole above the drying equipment, so that the jaw clamping arm can place the wafers with the wafer claw turned into the drying equipment.
  • This wafer transfer robot is located above the drying equipment. In the process of entering, it is easier to introduce foreign particles into the final drying process to reduce the cleanliness of the wafer.
  • the lateral stroke of the wafer transfer robot runs through the entire cleaning module, and the long stroke transfer also has a certain impact on the transfer efficiency.
  • One of the objectives of the present invention is to provide corresponding transmission methods for different configuration schemes of various cleaning units, and how to treat the polished wafers when the CMP wafer cleaning equipment fails during the existing wafer cleaning process
  • a solution is proposed to ensure safe storage, which can effectively solve the problem of safe storage of wafers between program conversions.
  • the second object of the present invention is to provide a wafer transfer manipulator and its wafer turning method to meet the process requirements of chemical mechanical planarization by realizing the conversion of wafers in the horizontal and vertical states, and exclude the drying In the process, it is possible to scatter the foreign particles on the moving parts of the wafer transfer robot onto the wafer.
  • the technical solution proposed by the present invention is a CMP wafer cleaning equipment, including a cleaning input unit, a megasonic cleaning unit, several brush cleaning units, a spin-drying unit arranged in sequence, and transmission transmission
  • the manipulator, the transfer manipulator is located above the cleaning equipment.
  • the transfer manipulator includes a horizontal movement axis, a vertical movement axis and a number of wafer gripping devices, which can transfer wafers between the units, close to the wafers on the side of the spin-drying unit
  • the grasping device has a wafer turning function, which can grasp and turn the wafer.
  • the above equipment also includes a polishing wafer channel, which is located between the cleaning input unit and the megasonic cleaning unit, so that the wafer before the CMP step passes through the cleaning equipment when it enters the polishing area.
  • the wafer trays in the polished wafer channel and the cleaning input unit can be moved out simultaneously or separately to facilitate wafer loading operations.
  • the above equipment also includes a buffer unit, which is located in front of the cleaning input unit and can temporarily store several wafers.
  • 2-10 wafers can be temporarily stored in the buffer unit.
  • a water spray device is provided in the buffer unit to prevent the wafer from drying without cleaning.
  • the wafer is in a vertical direction during cleaning and brushing, and the wafer is in a horizontal direction during spin-drying.
  • the wafers are in the vertical direction during the cleaning, brushing, and spin-drying processes.
  • the transfer robot includes a wafer grabbing device 1 and a wafer grabbing device 2 in the direction of cleaning the input unit to the spin-drying unit.
  • the CMP wafer cleaning equipment also includes an independent turning manipulator, so that the wafer grabbing device near the spin-drying unit side saves the wafer turning function and is used to convert the wafer The wafers in the round gripping device are grabbed and turned over.
  • the present invention has the following beneficial technical effects:
  • the buffer unit introduced by the present invention can make the entire cleaning equipment more fault-tolerant. During the wafer cleaning process, when the CMP wafer cleaning equipment fails, it can achieve safe storage for the polished wafers, and it can also be effective. Solve the problem of safe storage of wafers between program conversions.
  • the CMP wafer cleaning equipment may also include a polishing wafer channel, located between the cleaning input unit and the megasonic cleaning unit, which is convenient for the wafers before the CMP step to enter the polishing area. Cleaning equipment.
  • each cleaning unit can be in a vertical mode, or the spin-drying unit can be changed to a horizontal mode.
  • the transmission manipulator improves the transmission efficiency by adopting the design of integrating two sets of gripping devices on a set of horizontal motion shafts, and avoids the potential collision hazards that may exist in the design of multiple sets of horizontal shafts.
  • the present invention provides a wafer transfer robot for wafer transfer in a cleaning module of a chemical mechanical planarization device to complete cleaning of the wafer in the cleaning unit of the cleaning module in a vertical state Then take it out, and put it into the drying unit of the cleaning module in a horizontal state after turning over, which includes:
  • the horizontal transmission shaft is only on one side of the cleaning unit
  • the horizontal transmission carriage is arranged on the horizontal transmission axis and can move laterally along the horizontal transmission axis;
  • the first vertical lifting shaft is arranged on the lateral transmission carriage, and can perform vertical movement on the lateral transmission carriage;
  • a rotating table set on the first vertical lifting axis
  • the first jaw clamping arm is connected to the rotary table, and driven by the rotary table to perform a rotary motion for picking and placing wafers.
  • the cleaning unit and the drying unit are equipped with a switchable door for automatically opening or closing when the wafer transfer robot handles the wafer.
  • the cleaning unit includes: a pre-drying unit and other units of the cleaning module; the drying unit and other units of the cleaning module are located on both sides of the pre-drying unit; Work in straight direction; wafers in the unit before drying are transferred to the drying unit by the first jaw clamping arm; other units of the cleaning module are wafer transition unit, megasonic cleaning unit, and brushing unit One or more.
  • the wafer transfer manipulator further includes: at least one second vertical lifting shaft, which is arranged on the lateral transfer carriage and capable of vertical movement on the lateral transfer carriage ;
  • the first vertical lifting shaft is located between the second vertical lifting shaft and the drying unit; each of the second vertical lifting shaft is also provided with a second jaw clamping arm for the first The claw clamping arm cooperates to carry the wafer transfer from other units of the cleaning module to the unit before drying.
  • the present invention also provides a wafer turning method of the above wafer transfer robot, which includes a wafer placement step and a robot return step;
  • the step of placing the wafer includes: after the first jaw holding arm takes the wafer from the pre-drying unit of the cleaning unit, through a linkage or non-linkage action of three movement directions of horizontal, vertical, and rotation Realize the flip of the wafer from the vertical state to the horizontal state, and put the wafer into the drying unit;
  • the returning step of the manipulator includes: after the wafer is placed in the drying unit by the first jaw clamping arm, the horizontal state is returned to the vertical state through the linkage or non-linkage action of the three movement directions of horizontal, vertical, and rotation And return to the original position.
  • the step of placing the wafer specifically includes:
  • the first jaw clamping arm After the first jaw clamping arm removes the wafer from the pre-drying unit, it simultaneously moves in the following three directions: the lateral transport carriage drives the first jaw clamping arm away from the drying unit The horizontal movement in the direction, the rotary table drives the first jaw clamping arm to the side close to the drying unit until the wafer reaches the horizontal state, and the first vertical lifting shaft drives the first jaw clamping arm to move vertically to a certain position ;
  • the horizontal transport carriage drives the first jaw clamping arm to move laterally close to the drying unit until the wafer is above the drying unit;
  • the first vertical lifting shaft drives the first jaw clamping arm to move vertically downward Until the wafer is located in the designated mechanism inside the drying unit;
  • the first jaw clamping arm releases the wafer so that the wafer is located on the designated mechanism inside the drying unit.
  • the step of placing the wafer specifically includes: after the first jaw clamping arm takes the wafer from the pre-drying unit, the lateral transfer carriage drives The first jaw clamping arm moves laterally away from the drying unit; then the rotary table drives the first jaw clamping arm to rotate toward the side of the drying unit until the wafer reaches a horizontal state; then the first vertical The lifting shaft drives the first jaw clamping arm to move vertically to a certain position; then the lateral transport carriage drives the first jaw clamping arm to move laterally toward the drying unit until the wafer is above the drying unit; A vertical lifting shaft drives the first jaw clamping arm to move vertically downward until the wafer is located in the designated mechanism inside the drying unit; the first jaw clamping arm releases the wafer so that the wafer is located on the designated mechanism inside the drying unit.
  • the step of placing the wafer specifically includes: after the first jaw clamping arm takes the wafer from the pre-drying unit, the lateral transfer carriage drives The first jaw clamping arm moves laterally away from the drying unit; then the rotary table drives the first jaw clamping arm to rotate toward the side of the drying unit until the wafer reaches a horizontal state; then the lateral transport drag
  • the plate drives the first jaw clamping arm to move laterally close to the drying unit until the wafer is located above the drying unit;
  • the first vertical lifting shaft drives the first jaw clamping arm to move vertically downward until the wafer is located Designated mechanism inside the drying unit; the first jaw clamping arm releases the wafer so that the wafer is located on the designated mechanism inside the drying unit.
  • the step of placing the wafer specifically includes: after the first jaw holding arm takes the wafer from the pre-drying unit, the rotating table drives the first The jaw clamping arm rotates to the side close to the drying unit until the wafer reaches a horizontal state; then the lateral transport carriage drives the first jaw clamping arm to move laterally until the wafer is above the drying unit; the first vertical lifting axis The first jaw clamping arm is driven to move vertically downward until the wafer is located in the designated mechanism inside the drying unit; the first jaw clamping arm releases the wafer so that the wafer is located on the designated mechanism inside the drying unit.
  • the step of returning the robot specifically includes: after the wafer is placed in the drying unit, simultaneous movements in the following three directions are performed: the horizontal transfer carriage drives the first card The claw clamping arm moves laterally away from the drying unit; the rotary table drives the first claw clamping arm to rotate downward until the first claw clamping arm is in a vertical state; the first vertical lifting shaft drives the first The jaw clamping arm moves vertically up to a certain position.
  • the step of returning the robot specifically includes: after the wafer is placed in the drying unit, the first vertical lifting shaft drives the first jaw clamping arm to move vertically up to A certain position; then the horizontal transfer carriage drives the first jaw clamping arm to move laterally away from the drying unit to a certain position; then the rotary table drives the first jaw clamping arm to rotate down to the first jaw clamping The arm is upright.
  • the step of returning the robot specifically includes: after the wafer is placed in the drying unit, the lateral transfer carriage drives the first jaw clamping arm away from the drying unit The direction of the horizontal movement to a certain position; then the first vertical lifting shaft drives the first jaw clamping arm vertically upward to a certain position; then the rotary table drives the first jaw clamping arm to rotate down to the first jaw clamping The arm is upright.
  • the present invention has the following beneficial effects:
  • the wafer transfer robot provided by the present invention is installed in the cleaning module of the chemical mechanical planarization equipment, which can effectively meet the conversion of the wafer in the horizontal and vertical states, which meets the actual production needs, and the robot turning process does not need to be increased
  • the space can be turned over without interference to other organizations, and the space utilization rate is high.
  • the wafer transfer robot in the present invention enables the drying unit to select the wafer placement mode (vertical or horizontal placement) with the best effect as the goal, without the need to make the wafer placement mode of the drying unit for wafer transfer convenient.
  • the remaining units of the cleaning module are consistent.
  • FIG. 1 is a structural diagram of a wafer cleaning device of the present invention
  • Figure 2 is a perspective view of the wafer cleaning equipment
  • FIG. 3 is a perspective view of the first embodiment of the CMP wafer cleaning equipment of the present invention.
  • FIG. 4 is a perspective view of the second embodiment of the CMP wafer cleaning equipment of the present invention.
  • FIG. 5 is a perspective view of a third embodiment of the CMP wafer cleaning equipment of the present invention.
  • FIG. 6 is a schematic structural view of a preferred embodiment of a wafer transfer robot of the present invention.
  • Embodiment 7 is a schematic flowchart of Embodiment 1 of a wafer placement step in the wafer inversion method of the present invention.
  • Embodiment 8 is a schematic flowchart of Embodiment 2 of the wafer placement step in the wafer inversion method of the present invention.
  • Embodiment 9 is a schematic flowchart of Embodiment 3 of a wafer placement step in the wafer inversion method of the present invention.
  • Embodiment 4 is a schematic flowchart of Embodiment 4 of a wafer placement step in the wafer inversion method of the present invention.
  • the wafer cleaning device for post-CMP cleaning includes a buffer unit 8, a cleaning input unit 1, a polishing wafer channel 10, a megasonic cleaning unit 2, a brush cleaning unit 3, and a brush cleaning Unit 4, spin-drying unit 5, transmission manipulator 6 and turning manipulator 7.
  • the buffer unit 8, the cleaning input unit 1, the polishing wafer channel 10, the megasonic cleaning unit 2, the scrubbing unit 3, the scrubbing unit 4 and the spin-drying unit 5 in the CMP wafer cleaning apparatus are arranged in a row in sequence.
  • a group of transfer robots 6 is provided above the cleaning unit.
  • the transfer manipulator 6 includes a horizontal movement axis 601, a vertical movement axis 602, a wafer gripping device one 603 and a wafer gripping device two 604.
  • a polishing wafer channel 10 is provided in the cleaning unit.
  • the polished wafer needs to be cleaned immediately.
  • the wafer 9 to be cleaned is first put into the cleaning input unit 1.
  • the cleaning input unit 1 is designed with a water spray device.
  • the wafer picking device 2 604 of the transfer robot 6 picks up the wafer 9 in the cleaning input unit 1 along the vertical motion axis 602, and the wafer picking device 1 603 and The wafer picking device two 604 is transferred to the megasonic cleaning unit 2 along the horizontal motion axis 601, and the wafer picking device one 603 picks the wafer 9 in the megasonic cleaning unit 2 along the vertical motion axis 602.
  • the device two 604 places the wafer 9 into the megasonic cleaning unit 2 along the vertical movement axis 602.
  • the wafer picking device one 603 and the wafer picking device two 604 are transferred to the top of the brush cleaning unit 3 along the horizontal movement axis 601, and the wafer picking device two 604 is along the vertical movement axis 602 picks up the wafer 9 in the scrubbing unit 3, and the wafer picking device 603 places the wafer 9 into the scrubbing unit 3 along the vertical movement axis 602.
  • the wafer picking device one 603 and the wafer picking device two 604 are transferred along the horizontal movement axis 601 to the brush cleaning unit 4, and the wafer picking device one 603 is along the vertical movement axis 602 picks up the wafer 9 in the scrubbing unit 4, and the wafer picking device two 604 places the wafer 9 into the scrubbing unit 4 along the vertical movement axis 602.
  • the turning manipulator 7 grabs the wafer 9 in the grasping device 603 and turns it into the spin-drying unit 5. After the wafer 9 is processed in the spin-drying unit 5, the entire cleaning process is completed, and the wafer 9 is taken away by other equipment robots. In this way, the wafer 9 is cleaned.
  • the buffer unit 8 can be designed to accommodate 2 to 10 wafers 9.
  • the CMP wafer cleaning equipment of the present invention generally also integrates a CMP polishing equipment and an equipment front end unit module (EFEM). Between the CMP wafer cleaning device and the CMP polishing device, a robot hand for transferring wafers is provided.
  • EFEM equipment front end unit module
  • the wafer After the wafer is processed in the CMP polishing equipment, it is transferred by the robot to the cleaning input unit 1 of the present invention. With the participation of the transfer robot 6 and the flip robot 7, the wafer 9 passes through the megasonic cleaning unit 2 and the brush cleaning unit 3 in sequence The brushing unit 4 and the spin-drying unit 5 complete the entire cleaning process, and the robot in the EFEM finally removes the wafer 9 in the spin-drying unit 5.
  • the integrated CMP polishing device can simultaneously polish more than two wafers with different amounts. In order to prevent the CMP wafer cleaning device of the present invention from malfunctioning, the polished wafers cannot be safely stored.
  • a buffer unit 8 is designed in the cleaning equipment. According to the different processing capacity of the integrated CMP polishing equipment, the buffer unit 8 can temporarily store 2 to 10 wafers, and a water spray device is designed in the buffer unit 8 to prevent the wafers from drying without cleaning.
  • the cleaning input unit 1 and the polishing wafer channel 10 may be designed to be movable.
  • the wafer carrier 11 in the cleaning input unit 1 is moved out of the tank to perform the wafer loading operation. After the wafer carrier 11 loads the wafer, it returns to the cleaning input unit 1 .
  • the wafer to be polished is placed on the wafer carrier 12 in the polishing wafer channel 10 from the EFEM unit, and the wafer carrier 12 can be moved out a corresponding distance to facilitate the removal of the wafer by the robot of the CMP polishing device.
  • the movement of the cleaning wafer carrier 11 and the channel wafer carrier 12 may be simultaneous or may be designed to move independently of each other. This design can shorten the stroke of the manipulator in the CMP polishing equipment and reduce the area of the equipment.
  • the wafer pick-up device 603 can be designed to have a wafer turning function. This can save a flip manipulator, but the transmission time will increase. This example can be used if the cleaning capacity allows.
  • all cleaning units are designed in a vertical manner, so that the wafer 9 is prevented from turning over when entering the spin-drying unit 5.
  • the wafer transmission unit has a simple mechanical structure and high transmission efficiency. This embodiment can be used when the process requirements of vertical spin-drying can meet the processing requirements.
  • the wafer transfer robot provided by the present invention is used to transfer the wafer 9 in the cleaning module of the chemical mechanical planarization device to complete the cleaning of the wafer 9 in the cleaning unit of the cleaning module in a vertical state Then take it out and put it into the drying unit 21 of the cleaning module in a horizontal state after turning over.
  • the cleaning unit and the drying unit 21 are equipped with a switchable pneumatic door for automatically opening or closing when the wafer transfer robot handles the wafer 9.
  • the cleaning unit of the cleaning module includes: a pre-drying unit 20 and other units of the cleaning module; a drying unit 21 and other units of the cleaning module are located on both sides of the pre-drying unit 20; in some preferred embodiments, the pre-drying unit 20 may Select a brushing unit, in which the wafer 9 operates in a vertical direction; the other units of the cleaning module may be one or more of a wafer transition unit, a megasonic cleaning unit, and a brushing unit.
  • the specific settings of the cleaning unit can be freely combined according to the actual production needs to flexibly apply to various situations.
  • the wafer transfer robot provided by the present invention includes: a horizontal transfer shaft 13, a horizontal transfer carriage 14, a first vertical lifting shaft 15, a second vertical lifting shaft 17, and a first jaw clamping arm 19 And second jaw clamping arm 18.
  • the lateral transfer carriage 14 is disposed on the lateral transfer shaft 13 and can perform lateral movement along the lateral transfer shaft 13; the lateral transfer shaft 13 is only located on one side of the cleaning unit, so that the lateral transfer carriage 14 It does not run to the side of the drying unit 21, thereby eliminating the possibility that foreign particles on the moving parts of the wafer transfer robot will be scattered on the wafer 9 during the drying process.
  • the position of the horizontal transfer shaft 13 only needs to satisfy that the horizontal transfer carriage 14 will not run to the side of the drying unit, and the spatial relative position of the horizontal transfer shaft 13 and the cleaning unit is not particularly limited.
  • the lateral transfer shaft 13 can be lower than the cleaning unit, and only needs to satisfy that the wafer transfer robot can complete the pick and place of the wafer 9. More preferably, the lateral transmission shaft 13 is arranged above the washing unit to achieve a more optimal arrangement.
  • a first vertical lifting shaft 15 and a second vertical lifting shaft 17 are arranged side by side on the lateral transport carriage 14, and each can vertically move up and down independently on the lateral transport carriage 14.
  • the first vertical lifting shaft 15 is further provided with a rotating table 16 for driving the first jaw clamping arm 19 connected to it for rotational movement.
  • the driving form of the rotary table 16 is pneumatic or electric.
  • the second vertical lifting shaft 17 is directly connected to the second jaw clamping arm 18.
  • the first jaw clamping arm 19 is closer to the drying unit 21 than the second jaw clamping arm 18 for transferring the wafer 9 from the pre-drying unit 20 to the drying Unit 21.
  • the second jaw holding arm 18 is used to transfer the wafer 9 from other units of the cleaning module to the pre-drying unit 20.
  • the second jaw clamping arm 18 is provided for the wafer 9 to be processed to enter the pre-drying unit 20 immediately after the first jaw clamping arm 19 takes out the wafer 9 from the pre-drying unit 20 Operations to achieve higher production efficiency.
  • the second jaw clamping arm 18 is not provided, which does not affect the technical problem solved by the present invention and the technical effect achieved. Therefore, the number of the second jaw clamping arm 18 of the present invention There is no limit, and it can be formulated according to the actual production situation.
  • the horizontal transmission shaft 13 is arranged on the side of the unit 20 before drying, and other units of the cleaning module are placed under the horizontal transmission shaft 13 in the order shown in FIG. 6.
  • the second jaw clamping arm 18 can be raised and lowered in the Z-axis direction by the second vertical lifting shaft 17, the first jaw clamping arm 19 can be rotated clockwise or counterclockwise by the rotating table 16, and the rotating table 16 passes the first
  • the vertical lifting shaft 15 moves up and down in the Z-axis direction, and the horizontal transport carriage 14 moves in the X-axis direction through the horizontal transport shaft 13.
  • the pre-drying unit 20 and other units of the cleaning module are front-end process units for drying the wafer 9.
  • the function of the drying unit 21 is to dry and clean the cleaned wafer 9.
  • the role of the wafer transfer robot is to transport the wafer 9 to each unit of the cleaning module through the lateral movement, vertical movement, and rotational movement after clamping the wafer 9.
  • the invention also provides a method for turning the wafer 9 of the above-mentioned wafer transfer robot.
  • the method includes a step of placing the wafer 9 and a step of returning the robot.
  • the step of placing the wafer 9 includes: after the first jaw clamping arm 19 takes out the wafer 9 from the cleaning unit, it is realized by the linkage or non-linkage action of the three movement directions of horizontal, vertical, and rotation The wafer 9 is inverted from the vertical state to the horizontal state, and the wafer 9 is placed in the drying unit 21.
  • the returning step of the manipulator includes: after the first jaw clamping arm 19 places the wafer 9 in the drying unit 21, the horizontal state, the vertical state, and the rotational direction of the linkage or non- linkage action are restored from the horizontal state to the Stand upright and return to the original position.
  • the wafer 9 reversing method based on the wafer transfer robot provided by the present invention will be specifically described from the following seven embodiments.
  • the specific embodiment capable of implementing the above-mentioned wafer 9 turning method of the present invention is not limited to the following seven embodiments.
  • the carriage 14 is laterally transported Movement in the X + direction, while the rotating table 16 drives the wafer 9 to rotate clockwise along A +, and the first vertical lifting shaft 15 carries the first jaw clamping arm 19 downward in the Z- direction, and the first jaw clamping arm 19 Carry the wafer 9 in three directions of X +, A + and Z-, and coordinate to complete the state transition process of the wafer 9 from vertical to horizontal. As shown in part 3 of FIG. 7, the wafer 9 has reached the level status.
  • the designated mechanism inside the drying unit 21 is ready to place the wafer 9.
  • the lateral transfer carriage 14 drives the first jaw clamping arm 19 to move in the X-direction until the wafer 9 is located above the drying unit 21 (as shown in part 4 of FIG. 7).
  • the first jaw clamping arm 19 moves downward in the Z-direction until the wafer 9 is located in a designated mechanism inside the drying unit 21 (as shown in part 5 of FIG. 7), and the first jaw clamping arm 19 releases the wafer 9
  • the wafer 9 is located on a designated mechanism inside the drying unit 21.
  • the carriage 14 is laterally transported Move a certain distance in the X + direction, and then the rotary table 16 drives the first jaw clamping arm 19 to rotate clockwise along A + to a certain angle to bring the wafer 9 to a horizontal state (as shown in parts 3 and 4 of FIG. 8). Then, the first vertical lifting shaft 15 carries the first jaw clamping arm 19 to a certain position downward in the Z-direction. During the turning of the wafer 9, the designated mechanism inside the drying unit 21 is ready to place the wafer 9.
  • the lateral transfer carriage 14 drives the first jaw holding arm 19 to move in the X-direction until the wafer 9 is located above the drying unit 21 (as shown in part 5 of FIG. 8).
  • the first jaw clamping arm 19 moves downward in the Z-direction until the wafer 9 is located in a designated mechanism inside the drying unit 21 (as shown in part 6 of FIG. 8), and the first jaw clamping arm 19 releases the wafer 9
  • the wafer 9 is located on a designated mechanism inside the drying unit 21.
  • the carriage 14 After the first jaw holding arm 19 moves in the Z-axis direction to remove the wafer 9 from the pre-drying unit 20 (as shown in part 1 of FIG. 9), as shown in part 2 of FIG. 9, the carriage 14 is transported laterally Move a certain distance in the X + direction, and then the rotary table 16 drives the first jaw holding arm 19 to rotate clockwise along A + to a certain angle to bring the wafer 9 to a horizontal state (as shown in parts 3 and 4 of FIG. 9). Then, the horizontal transfer carriage 14 drives the first jaw clamping arm 19 to move in the X-direction (as shown in part 5 of FIG.
  • the first vertical lifting shaft 15 carries the first jaw clamping arm 19 to Z- The direction moves downward until the wafer 9 is located in the designated mechanism inside the drying unit 21 (as shown in part 6 of FIG. 9). Finally, the first jaw clamping arm 19 releases the wafer 9 which is located on the designated mechanism inside the drying unit 21.
  • the first jaw clamping arm 19 moves in the Z-axis direction to remove the wafer 9 from the pre-drying unit 20 (as shown in part 1 of FIG. 10)
  • the first jaw clamping arm 19 directly follows the A + Rotate the hour hand to a certain angle to make the wafer 9 reach the horizontal state (as shown in part 2 of Figure 10), and then move the lateral transport carriage 14 in the X + or X- direction according to the actual length of the different jaw clamping arms ( (Fine adjustment), so that the wafer 9 is directly above the drying unit 21, and then the first vertical lifting shaft 15 carries the first jaw clamping arm 19 downward in the Z-direction until the wafer 9 is located in the designated mechanism inside the drying unit 21. Finally, the first jaw clamping arm 19 releases the wafer 9 which is located on the designated mechanism inside the drying unit 21.
  • the manipulator After the wafer 9 is placed in the designated mechanism inside the drying unit 21, the manipulator will then return to the original state, and the solutions of the following embodiments 5-7 may be adopted to complete the entire cycle.
  • the action of placing the wafer 9 can be any of the solutions in Embodiments 1-4.
  • the robot will then return to its original state, and the lateral transfer carriage 14 moves in the X + direction ,
  • the rotary table 16 drives the wafer 9 to rotate clockwise along A-, the first vertical lifting shaft 15 carries the first jaw clamping arm 19 to the Z + direction, and the first jaw clamping arm 19 is at X +, A-, Z + They move together in three directions to coordinate and complete the process from horizontal to vertical.
  • the action of placing the wafer 9 can be any of the options in Embodiments 1-4.
  • the manipulator will then return to its original state, and the first jaw clamp The holding arm 19 first rises to a certain high position in the Z + direction, and then moves a certain distance in the X + direction, the first jaw clamping arm 19 rotates in the A- direction until it returns to the vertical state, completing the entire cycle.
  • the action of placing the wafer 9 can be any of the options in Embodiments 1-4.
  • the manipulator will then return to its original state, and the first jaw clamp After the arm 19 moves a certain distance in the X + direction, and then rises to a certain high position in the Z + direction, then the first jaw clamping arm 19 rotates in the A- direction until it returns to a vertical state, completing the entire cycle.
  • the placement of the wafer 9 may be linked or non-linked, and the return of the manipulator may be linked or non-linked.
  • Examples 1-4 regarding the placement of the wafer 9 and examples 5-7 regarding the return of the robot may be free according to actual needs Used in combination to adapt to various actual production environments.
  • the CMP wafer cleaning equipment provided by the present invention introduces a buffer unit.
  • the CMP wafer cleaning equipment fails, the polished wafers can be safely stored, and can effectively solve the problem of program conversion. Between the safe storage of wafers.
  • the wafer transfer robot provided by the present invention is installed in the cleaning module of the chemical mechanical planarization equipment, which can effectively meet the conversion of wafers in the horizontal and vertical states, which meets the actual production needs. It can be turned over without interference to other organizations, and the space utilization rate is high.
  • the wafer transfer robot in the present invention enables the drying unit to select the wafer placement mode (vertical or horizontal placement) with the best effect as the target, without the need for the wafer placement mode and cleaning module of the drying unit to facilitate wafer transfer The remaining units are consistent.
  • the horizontal transfer axis of the wafer transfer robot travels only until the unit before drying, the stroke is compact.
  • the horizontal transfer carriage will not run to the side of the drying unit, which excludes the drying In the process, the possibility that foreign particles on the moving parts of the wafer transfer robot will be scattered on the wafer.

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Abstract

一种CMP晶圆清洗设备、晶圆传输机械手（6）及其晶圆翻转方法，该晶圆传输机械手（6）包括：横向传输轴（13），仅位于所述清洗单元的一侧；横向传输拖板（14），设置在所述横向传输轴（13）上，并能够沿所述横向传输轴（13）做横向运动；第一垂直升降轴（15），设置在所述横向传输拖板（14）上，并能够在所述横向传输拖板（14）上做竖直运动；旋转台（16），设置在所述第一垂直升降轴（15）上；第一卡爪夹持臂（19），与所述旋转台（16）相连，并由所述旋转台（16）驱动做旋转运动。所述的CMP晶圆清洗设备，当CMP晶圆清洗设备发生故障时，对于抛光好的晶圆（9）就可以实现安全存储。所述晶圆传输机械手（6）排除了在干燥工艺中将晶圆传输机械手（6）运动部件上的杂质颗粒散落到晶圆（9）上的可能性。

Description

一种CMP晶圆清洗设备、晶圆传输机械手及其晶圆翻转方法 技术领域
本发明涉及半导体集成电路芯片制造的设备领域，具体涉及一种CMP晶圆清洗设备、晶圆传输机械手及其晶圆翻转方法。
背景技术
随着半导体产业的迅速发展，集成电路特征尺寸不断趋于微细化，半导体晶片不断地朝小体积、高电路密集度、快速、低耗电方向发展，集成电路现已进入超大规模集成电路(Ultra-Large-scale integration，ULSI)亚微米级的技术阶段。伴随着硅晶片直径的逐渐增大，元件内刻线宽度逐步缩小，金属层数的增多，因此半导体薄膜表面的高平坦化对器件的高性能、低成本、高成品率有着重要的影响，这导致对硅晶片表面的平整度要求将日趋严格。
目前，作为唯一能获得全局平面化效果的平整化技术化学机械抛光技术，化学机械平坦化(Chemical Mechanical Planarization，CMP)已经发展成集在线量测、在线终点检测、清洗等技术于一体的化学机械抛光技术，是集成电路向微细化、多层化、薄型化、平坦化工艺发展的产物。同时也是晶圆由200mm向300mm乃至更大直径过渡、提高生产率、降低制造成本、衬底全局平坦化所必需的工艺技术。
一方面，在晶圆进行CMP加工后，会在晶圆表面残留加工的移除物和抛光液，为了及时去除晶圆表面的污染物，CMP设备需要搭配清洗设备使用。目前，主流的清洗设备的配置有晶圆垂直方式和晶圆水平方式，每种设备的清洗单元配置又不相同。垂直方式的清洗单元可以节省设备空间，兆声清洗和刷洗的工艺一致性更好，但是甩干过程中由于受重力影响，干燥效果不如水平方式，而水平方式的清洗单元又不利于污染物及时移出晶圆表面。因此需要根据清洗单元和甩干单元的特性，综合考虑晶圆的放置方式，以及还要考虑晶圆放置方式的转换如何具体实现。另外，CMP晶圆清洗设备一旦发生 故障时，已经完成抛光程序的晶圆如何确保安全存储，不致晶圆表面的清洁度受到影响也是一个需要考虑和解决的问题。
另一方面，在干燥晶圆的工艺中，一个基本要求就是使晶圆干燥，并且杜绝原来附着在溶液中的任何颗粒重新附着至晶圆的可能。为了使整个清洗模块达到较好的清洗效果，可以采用干燥单元是水平放置而其他几个清洗单元均是竖直放置的配置。在此种配置下，为了使晶圆从竖直状态转换成水平状态，晶圆传输机械手需提供翻转功能以配合完成这一工作。现有的清洗机械手中，一些是卡爪夹持臂未有旋转功能，只能有Z轴上下运动的单个自由度，通过晶圆卡爪端实现晶圆的翻转。但是此种实现方法需将机械手整体移动到干燥设备上方，卡爪夹持臂才能将已经晶圆卡爪翻转的晶圆置入干燥设备中，这种晶圆传输机械手整体位于干燥设备上方的置入过程，较易给最后道干燥工艺引入杂质颗粒，降低晶圆的洁净度。且晶圆传输机械手的横向行程贯穿整个清洗模块，长行程传输对传输效率也有一定的影响。
发明的公开
本发明的目的之一在于针对各种清洗单元的不同配置方案，提供相应的传输方式，并对现有晶圆清洗过程中当CMP晶圆清洗设备发生故障时，对于已经完成抛光的晶圆如何确保安全存储的问题提出一种解决方案，可以有效解决位于程序转换之间的晶圆的安全存储问题。
本发明的目的之二在于提供一种晶圆传输机械手及其晶圆翻转方法，以通过实现晶圆在水平和竖直两种状态的转换来满足化学机械平坦化的工艺要求，并排除在干燥工艺中将晶圆传输机械手运动部件上的杂质颗粒散落到晶圆上的可能性。
为达到上述目的一，本发明提出的技术方案为一种CMP晶圆清洗设备，包括依次排列的清洗输入单元、兆声清洗单元、若干个刷洗单元、甩干单元，除此之外还包括传输机械手，传输机械手位于清洗设备的上方，传输机械手包括水平运动轴、垂直运动轴和若干晶圆抓取装置，可将晶圆在所述单元之间传输，靠近甩干单元侧的所述晶圆抓取装置自带晶圆翻转功能，可将晶圆抓取并翻转。
上述设备还包括抛光晶圆通道，其位于清洗输入单元和兆声清洗单元之 间，方便CMP步骤前的晶圆进入抛光区域时穿过清洗设备。
抛光晶圆通道和清洗输入单元中的晶圆托架均可以同时或单独移出，方便进行装载晶圆操作。
上述设备还包括缓冲单元，所述缓冲单元位于清洗输入单元的前方，可以临时存放若干片晶圆。
作为优选，在缓冲单元中可以临时存放2-10片晶圆。
在缓冲单元中设置喷水装置，防止晶圆未经清洗而干燥。
作为优选，清洗和刷洗过程中晶圆处于垂直方向，在甩干过程中晶圆处于水平方向。
当垂直甩干的工艺要求可以满足加工要求时，清洗、刷洗、甩干过程中晶圆均处于垂直方向。
传输机械手在清洗输入单元至甩干单元的方向上依次包括晶圆抓取装置一和晶圆抓取装置二。
在清洗容量允许的条件下，所述CMP晶圆清洗设备还包括独立的翻转机械手，以使靠近甩干单元侧的所述晶圆抓取装置省掉晶圆翻转功能，并用于将所述晶圆抓取装置中的晶圆抓取并翻转。
与现有技术相比，本发明具有以下有益技术效果：
1.本发明引进的缓冲单元可以让整个清洗设备容错能力更强，晶圆清洗过程中，当CMP晶圆清洗设备发生故障时，对于已经完成抛光的晶圆就可以实现安全存储，也可以有效解决位于程序转换之间的晶圆的安全存储问题。
2.本发明为更有效地利用设备的空间，CMP晶圆清洗设备还可以包括抛光晶圆通道，位于清洗输入单元和兆声清洗单元之间，方便CMP步骤前的晶圆进入抛光区域时穿过清洗设备。
3.根据晶圆清洗工艺要求的不同，各清洗单元可以全部为垂直方式，也可以将甩干单元变成水平方式。
4.传输机械手通过采用将两套抓取装置集成在一套水平运动轴上的设计，提高了传输效率，避免了多套水平轴的设计可能存在的相互碰撞的隐患。
为达到上述目的二，本发明提供了一种晶圆传输机械手，用于化学机械平坦化设备的清洗模块中的晶圆传输，以将晶圆以竖直状态在清洗模块的清洗单元中完成清洗后取出，再通过翻转后以水平状态置入清洗模块的干燥单 元，其包括：
横向传输轴，仅位于所述清洗单元的一侧；
横向传输拖板，设置在所述横向传输轴上，并能够沿所述横向传输轴做横向运动；
第一垂直升降轴，设置在所述横向传输拖板上，并能够在所述横向传输拖板上做竖直运动；
旋转台，设置在所述第一垂直升降轴上；
第一卡爪夹持臂，与所述旋转台相连，并由所述旋转台驱动做旋转运动，用于对晶圆进行取放。
上述的晶圆传输机械手，其中，所述清洗单元和所述干燥单元安装有可开关的门，用于所述晶圆传输机械手对晶圆进行取放时的自动打开或关闭。
上述的晶圆传输机械手，其中，所述清洗单元包括：干燥前单元和清洗模块其他单元；所述干燥单元和清洗模块其他单元位于所述干燥前单元的两侧；所述干燥前单元采用竖直方向作业；所述干燥前单元内的晶圆由所述第一卡爪夹持臂传输至所述干燥单元；所述清洗模块其他单元为晶圆过渡单元、兆声清洗单元、刷洗单元中的一个或多个。
上述的晶圆传输机械手，其中，所述晶圆传输机械手还包括：至少一个第二垂直升降轴，设置在所述横向传输拖板上，并能够在所述横向传输拖板上做竖直运动；所述第一垂直升降轴位于所述第二垂直升降轴和所述干燥单元之间；每个所述第二垂直升降轴上还设置有第二卡爪夹持臂，用于与第一卡爪夹持臂配合进行清洗模块其他单元到干燥前单元之间的晶圆传送。
本发明还提供了一种上述晶圆传输机械手的晶圆翻转方法，该方法包括晶圆置入步骤和机械手返回步骤；
所述晶圆置入步骤包括：所述第一卡爪夹持臂从所述清洗单元的干燥前单元中取出晶圆后，通过横向、竖直、旋转三个运动方向的联动或非联动动作实现晶圆从竖直状态翻转为水平状态，并将晶圆置入干燥单元；
所述机械手返回步骤包括：第一卡爪夹持臂将晶圆放置于所述干燥单元后，通过横向、竖直、旋转三个运动方向的联动或非联动动作由水平状态恢复为竖直状态，并返回原位置。
上述的晶圆传输机械手的晶圆翻转方法，其中，所述晶圆置入步骤具体 包括：
所述第一卡爪夹持臂从所述干燥前单元中取出晶圆后，同时进行以下三个方向上的运动：横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动，旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态，第一垂直升降轴带动第一卡爪夹持臂竖直运动至一定位置；
随后横向传输拖板带动第一卡爪夹持臂向靠近所述干燥单元的方向横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
上述的晶圆传输机械手的晶圆翻转方法，其中，所述晶圆置入步骤具体包括：所述第一卡爪夹持臂从所述干燥前单元中取出晶圆后，横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动；然后旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态；接着第一垂直升降轴带动第一卡爪夹持臂竖直运动至一定位置；随后横向传输拖板带动第一卡爪夹持臂向靠近所述干燥单元的方向横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
上述的晶圆传输机械手的晶圆翻转方法，其中，所述晶圆置入步骤具体包括：所述第一卡爪夹持臂从所述干燥前单元中取出晶圆后，横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动；然后旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态；随后横向传输拖板带动第一卡爪夹持臂向靠近所述干燥单元的方向横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
上述的晶圆传输机械手的晶圆翻转方法，其中，所述晶圆置入步骤具体包括：所述第一卡爪夹持臂从所述干燥前单元中取出晶圆后，旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态；随后横向 传输拖板带动第一卡爪夹持臂横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
上述的晶圆传输机械手的晶圆翻转方法，其中，所述机械手返回步骤具体包括：当晶圆被放置于干燥单元后，同时进行以下三个方向上的运动：横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动；旋转台带动第一卡爪夹持臂向下旋转至第一卡爪夹持臂呈竖直状态；第一垂直升降轴带动第一卡爪夹持臂竖直向上运动至一定位置。
上述的晶圆传输机械手的晶圆翻转方法，其中，所述机械手返回步骤具体包括：当晶圆被放置于干燥单元后，第一垂直升降轴带动第一卡爪夹持臂竖直向上运动至一定位置；然后横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向横向运动至一定位置；接着旋转台带动第一卡爪夹持臂向下旋转至第一卡爪夹持臂呈竖直状态。
上述的晶圆传输机械手的晶圆翻转方法，其中，所述机械手返回步骤具体包括：当晶圆被放置于干燥单元后，横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向横向运动至一定位置；然后第一垂直升降轴带动第一卡爪夹持臂竖直向上运动至一定位置；接着旋转台带动第一卡爪夹持臂向下旋转至第一卡爪夹持臂呈竖直状态。
相对于现有技术，本发明具有以下有益效果：
1.本发明所提供的晶圆传输机械手设置于化学机械平坦化设备的清洗模块中，可以切实有效满足晶圆在水平和竖直两种状态的转换，符合实际生产需求，机械手翻转过程无需增加空间以供翻转，也不会对其他机构产生干扰，空间利用率高。
2.本发明中晶圆传输机械手使干燥单元能够以作用效果最佳为目标来选择晶圆放置模式(竖直或水平放置)，无需为了便于晶圆传输而使干燥单元的晶圆放置模式与清洗模块其余各单元一致。
3.由于晶圆传输机械手的横向传输轴行程只到干燥前单元为止，行程紧凑，机械手翻转后向干燥单元置入晶圆过程中，横向传输拖板不会运行到干燥单元一侧，从而排除在干燥工艺中将晶圆传输机械手运动部件上的杂质颗粒散落到晶圆上的可能性。
附图的简要说明
图1为本发明晶圆清洗设备的结构图；
图2为晶圆清洗设备的立体效果图；
图3为本发明CMP晶圆清洗设备第一个实施例的立体效果图；
图4为本发明CMP晶圆清洗设备第二个实施例的立体效果图；
图5为本发明CMP晶圆清洗设备第三个实施例的立体效果图；
图6为本发明晶圆传输机械手一较佳实施例的结构示意图；
图7为本发明晶圆翻转方法中晶圆置入步骤实施例1的流程示意图；
图8为本发明晶圆翻转方法中晶圆置入步骤实施例2的流程示意图；
图9为本发明晶圆翻转方法中晶圆置入步骤实施例3的流程示意图；
图10为本发明晶圆翻转方法中晶圆置入步骤实施例4的流程示意图。
实现本发明的最佳方式
以下结合附图通过具体实施例对本发明作进一步的描述，这些实施例仅用于说明本发明，并不是对本发明保护范围的限制。
如图1和图2所示，本发明提供的用于CMP后清洗的晶圆清洗设备包括缓冲单元8、清洗输入单元1、抛光晶圆通道10、兆声清洗单元2、刷洗单元3、刷洗单元4、甩干单元5、传输机械手6和翻转机械手7。
CMP晶圆清洗设备中的缓冲单元8、清洗输入单元1、抛光晶圆通道10、兆声清洗单元2、刷洗单元3、刷洗单元4和甩干单元5依次排成一排。在清洗单元的上方设置一组传输机械手6。所述传输机械手6包括水平运动轴601、垂直运动轴602、晶圆抓取装置一603和晶圆抓取装置二604。
为方便CMP之前的晶圆进入抛光区域时容易穿过清洗单元，在清洗单元中设置有抛光晶圆通道10。抛光后的晶圆需要立即进行清洗，待清洗晶圆9首先被放至清洗输入单元1，为防止晶圆9在等待的过程中变干燥，清洗输入单元1中设计有喷水装置。
待下一个清洗单元兆声清洗单元2完成加工后，传输机械手6的晶圆抓取装置二604沿垂直运动轴602抓取清洗输入单元1中的晶圆9，晶圆抓取装置一603和晶圆抓取装置二604沿水平运动轴601传输到兆声清洗单元2 上方，晶圆抓取装置一603沿垂直运动轴602抓取兆声清洗单元2中的晶圆9，晶圆抓取装置二604沿垂直运动轴602放置晶圆9至兆声清洗单元2中。
待下一个清洗单元刷洗单元3完成加工后，晶圆抓取装置一603和晶圆抓取装置二604沿水平运动轴601传输到刷洗单元3上方，晶圆抓取装置二604沿垂直运动轴602抓取刷洗单元3中的晶圆9，晶圆抓取装置一603沿垂直运动轴602放置晶圆9至刷洗单元3中。
待下一个清洗单元刷洗单元4完成加工后，晶圆抓取装置一603和晶圆抓取装置二604沿水平运动轴601传输到刷洗单元4上方，晶圆抓取装置一603沿垂直运动轴602抓取刷洗单元4中的晶圆9，晶圆抓取装置二604沿垂直运动轴602放置晶圆9至刷洗单元4中。
待下一个清洗单元甩干单元5完成加工后，翻转机械手7将抓取装置603中的晶圆9抓取并翻转放置甩干单元5中。晶圆9在甩干单元5中加工完毕后完成整个清洗流程，晶圆9被其他设备机械手取走。如此循环，进行晶圆9的清洗加工。
当清洗单元中的某一个或多个单元出现故障时，清洗输入单元1中的晶圆9将由抓取装置604放至缓冲单元8中。根据抛光设备的容量，缓冲单元可以设计成可容纳2至10片晶圆9。
另外，本发明的CMP晶圆清洗设备一般还集成CMP抛光设备和设备前端单元模块(EFEM)。所述CMP晶圆清洗设备和CMP抛光设备之间设置有负责传输晶圆的机械手。
晶圆在CMP抛光设备中加工完成后，被机械手传输至本发明的清洗输入单元1中，在传输机械手6和翻转机械手7的参与下，晶圆9依次经过兆声清洗单元2、刷洗单元3、刷洗单元4和甩干单元5，完成整个清洗流程，EFEM中的机械手最后在甩干单元5中取走晶圆9。
所述集成的CMP抛光设备可同时抛光2片以上数量不等的晶圆，为了防止本发明的CMP晶圆清洗设备发生故障后，抛光后的晶圆无法安全存储，在本发明的CMP晶圆清洗设备中设计有缓冲单元8。根据集成的CMP抛光设备的加工容量不同，所述缓冲单元8中可以临时存放2片至10片晶圆，在缓冲单元8中设计有喷水装置，防止晶圆未经清洗而干燥。
作为实施例，如图3所示，清洗输入单元1和抛光晶圆通道10可以设 计成可以移动的方式。当CMP抛光设备中有晶圆需要清洗时，清洗输入单元1中的晶圆托架11移出槽体，进行装载晶圆操作，晶圆托架11装载晶圆后，回到清洗输入单元1中。同样的，需要进行抛光的晶圆，从EFEM单元放至抛光晶圆通道10中的晶圆托架12上，晶圆托架12可以移出相应距离，方便CMP抛光设备的机械手取走晶圆。清洗晶圆托架11和通道晶圆托架12的移动既可以是同时的，也可以设计成以相互独立方式移动。此种设计，可以缩短CMP抛光设备中机械手的行程，减少设备的占地面积。
作为第二个实施例，如图4所示，晶圆抓取装置一603可以设计成带晶圆翻转功能的方式。这样可以省掉一个翻转机械手，但是传输时间会有增加。在清洗容量允许的条件下可以采用此例。
作为第三个实施例，如图5所示，所有清洗单元设计成垂直方式，这样就避免了晶圆9在进入甩干单元5时进行翻转。晶圆传输单元机械结构简单，传输效率高。当垂直甩干的工艺要求可以满足加工要求时，可以采用此实施例。
如图6所示，本发明所提供的晶圆传输机械手用于化学机械平坦化设备的清洗模块中的晶圆9传输，以将晶圆9以竖直状态在清洗模块的清洗单元中完成清洗后取出，再通过翻转后以水平状态置入清洗模块的干燥单元21。在一些较佳的实施例中，所述清洗单元和所述干燥单元21安装有可开关的气动门，用于所述晶圆传输机械手对晶圆9进行取放时的自动打开或关闭。
清洗模块的清洗单元包括：干燥前单元20和清洗模块其他单元；干燥单元21和清洗模块其他单元位于干燥前单元20的两侧；在一些较佳的实施例中，所述干燥前单元20可以选择刷洗单元，在该单元中晶圆9采用竖直方向作业；所述清洗模块其他单元可以为晶圆过渡单元、兆声清洗单元、刷洗单元中的一个或多个。清洗单元的具体设置可以根据实际生产的需要进行自由组合，以灵活适用各种情况。
在该实施例中，本发明所提供的晶圆传输机械手包括：横向传输轴13、横向传输拖板14、第一垂直升降轴15、第二垂直升降轴17、第一卡爪夹持臂19及第二卡爪夹持臂18。
其中，横向传输拖板14设置在所述横向传输轴13上，并能够沿所述横向传输轴13做横向运动；横向传输轴13仅位于所述清洗单元一侧，以使得 横向传输拖板14不会运行到干燥单元21一侧，从而排除在干燥工艺中晶圆传输机械手运动部件上的杂质颗粒散落到晶圆9上的可能性。需要说明的是：横向传输轴13的位置仅需要满足横向传输拖板14不会运行到干燥单元一侧即可，至于横向传输轴13与清洗单元的空间相对位置并不做特别限定。横向传输轴13可以低于清洗单元，只需要满足晶圆传输机械手能够完成取放晶圆9即可。更优地，横向传输轴13布置于清洗单元的上方，以实现更优的布置方式。
横向传输拖板14上并排设置有第一垂直升降轴15和第二垂直升降轴17，能够在所述横向传输拖板14上各自单独做竖直上下运动。其中所述第一垂直升降轴15上还设置有旋转台16，用于驱动与其相连的第一卡爪夹持臂19做旋转运动。所述旋转台16的驱动形式为气动或电动。而所述第二垂直升降轴17直接与第二卡爪夹持臂18相连。所述第一卡爪夹持臂19与所述第二卡爪夹持臂18相比更靠近于所述干燥单元21，用于将晶圆9从所述干燥前单元20传输至所述干燥单元21。
而所述第二卡爪夹持臂18则用于将晶圆9从所述清洗模块其他单元传输至所述干燥前单元20。该实施例设置第二卡爪夹持臂18是为了在第一卡爪夹持臂19从干燥前单元20中取出晶圆9之后，立即可以有待加工的晶圆9进入干燥前单元20内进行作业，以实现更高的生产效率。但在一些实施例中没有该第二卡爪夹持臂18的设置，并不影响本发明所解决的技术问题以及所实现的技术效果，故本发明对第二卡爪夹持臂18的数量并没有限制，可以根据实际生产情况进行配制。
横向传输轴13布置在干燥前单元20一侧，清洗模块其他单元按图6所示顺序放置在横向传输轴13下方。第二卡爪夹持臂18可以通过第二垂直升降轴17进行Z轴方向的升降，第一卡爪夹持臂19可以通过旋转台16进行顺时针或者逆时针旋转，旋转台16通过第一垂直升降轴15进行Z轴方向的升降，横向传输拖板14通过横向传输轴13进行X轴方向的移动。干燥前单元20以及清洗模块其他单元都是干燥晶圆9的前道工艺单元，干燥单元21的作用是将清洗好的晶圆9进行表面干燥和洁净。晶圆传输机械手的作用是通过夹持晶圆9后的横向运动、竖直运动以及旋转运动来运送晶圆9到清洗模块各个单元中。
本发明还提供了一种上述晶圆传输机械手的晶圆9翻转方法，该方法包括晶圆9置入步骤和机械手返回步骤。
所述晶圆9置入步骤包括：所述第一卡爪夹持臂19从所述清洗单元中取出晶圆9后，通过横向、竖直、旋转三个运动方向的联动或非联动动作实现晶圆9从竖直状态翻转为水平状态，并将晶圆9置入干燥单元21。
所述机械手返回步骤包括：第一卡爪夹持臂19将晶圆9放置于所述干燥单元21后，通过横向、竖直、旋转三个运动方向的联动或非联动动作由水平状态恢复为竖直状态，并返回原位置。
关于本发明所提供的基于上述晶圆传输机械手的晶圆9翻转方法，将从以下7个实施例进行具体说明。当然地，能够实现本发明上述晶圆9翻转方法的具体实施方案并不局限于下述的7个实施例。
实施例1：
在第一卡爪夹持臂19沿Z轴方向运动从干燥前单元20中取出晶圆9后(如图7的①部分所示)，如图7的②部分所示，横向传输拖板14向X+方向运动，同时旋转台16带动晶圆9沿A+顺时针旋转，以及第一垂直升降轴15携第一卡爪夹持臂19向Z-方向向下运动，第一卡爪夹持臂19携晶圆9在X+、A+、Z-三个方向上共同运动，共同协调完成晶圆9从竖直到水平的状态转换过程，如图7的③部分所示，晶圆9已达到水平状态。在晶圆9翻转期间，干燥单元21内部指定机构已做好晶圆9放入的准备。随后横向传输拖板14带动第一卡爪夹持臂19向X-方向移动至晶圆9位于干燥单元21的上方(如图7的④部分所示)。第一卡爪夹持臂19在Z-方向向下运动至晶圆9位于干燥单元21内部指定机构(如图7的⑤部分所示)，第一卡爪夹持臂19松开晶圆9，晶圆9位于干燥单元21内部指定机构上。
实施例2：
在第一卡爪夹持臂19沿Z轴方向运动从干燥前单元20中取出晶圆9后(如图8的①部分所示)，如图8的②部分所示，横向传输拖板14向X+方向移动一段距离，然后旋转台16带动第一卡爪夹持臂19沿A+顺时针旋转至一定角度使晶圆9达到水平状态(如图8的③和④部分所示)。接着第一垂直升降轴15携第一卡爪夹持臂19向Z-方向向下运动一定的位置。在晶圆9翻转期间，干燥单元21内部指定机构已做好晶圆9放入的准备。随后横向传 输拖板14带动第一卡爪夹持臂19向X-方向移动至晶圆9位于干燥单元21的上方(如图8的⑤部分所示)。第一卡爪夹持臂19在Z-方向向下运动至晶圆9位于干燥单元21内部指定机构(如图8的⑥部分所示)，第一卡爪夹持臂19松开晶圆9，晶圆9位于干燥单元21内部指定机构上。以上步骤是各方向单独运动组合的结果。
实施例3：
在第一卡爪夹持臂19沿Z轴方向运动从干燥前单元20中取出晶圆9后(如图9的①部分所示)，如图9的②部分所示，横向传输拖板14向X+方向移动一段距离，然后旋转台16带动第一卡爪夹持臂19沿A+顺时针旋转至一定角度使晶圆9达到水平状态(如图9的③和④部分所示)。接着横向传输拖板14带动第一卡爪夹持臂19向X-方向运动(如图9的⑤部分所示)，随后第一垂直升降轴15携第一卡爪夹持臂19向Z-方向向下运动至晶圆9位于干燥单元21内部指定机构(如图9的⑥部分所示)。最后第一卡爪夹持臂19松开晶圆9，晶圆9位于干燥单元21内部指定机构上。
实施例4：
在第一卡爪夹持臂19沿Z轴方向运动从干燥前单元20中取出晶圆9后(如图10的①部分所示)，紧接着第一卡爪夹持臂19直接沿A+顺时针旋转至一定角度使晶圆9达到水平状态(如图10的②部分所示)，然后再根据不同卡爪夹持臂的实际长短，将横向传输拖板14进行X+或X-方向移动(微调)，使晶圆9处于干燥单元21的正上方，随后第一垂直升降轴15携第一卡爪夹持臂19向Z-方向向下运动至晶圆9位于干燥单元21内部指定机构。最后第一卡爪夹持臂19松开晶圆9，晶圆9位于干燥单元21内部指定机构上。
当晶圆9被放置于干燥单元21内部指定机构后，机械手接着将返回原状态，可以采用以下实施例5-7的方案，以完成整个循环。
实施例5：
放置晶圆9的动作可以选择实施例1-4中的任一方案，当晶圆9被放置于干燥单元21内部指定机构后，机械手接着将返回原状态，横向传输拖板14向X+方向运动，旋转台16带动晶圆9沿A-顺时针旋转，第一垂直升降轴15携第一卡爪夹持臂19向Z+方向上升，第一卡爪夹持臂19在X+、A-、Z+三个方向上共同运动，共同协调完成从水平到竖直状态的过程。
实施例6：
放置晶圆9的动作可以选择实施例1-4中的任一方案，当晶圆9被放置于干燥单元21内部指定机构后，机械手接着将返回原状态，被横置的第一卡爪夹持臂19先往Z+方向上升到一定高位，然后往X+方向移动一定距离后，第一卡爪夹持臂19向A-方向旋转直至恢复成竖直状态，完成整个循环。
实施例7：
放置晶圆9的动作可以选择实施例1-4中的任一方案，当晶圆9被放置于干燥单元21内部指定机构后，机械手接着将返回原状态，被横置的第一卡爪夹持臂19先往X+方向移动一定距离后，再往Z+方向上升到一定高位，然后第一卡爪夹持臂19向A-方向旋转直至恢复成竖直状态，完成整个循环。
总之，晶圆9置入可以是联动或非联动，机械手返回可以是联动或非联动，关于晶圆9置入的实施例1-4和关于机械手返回的实施例5-7可根据实际需要自由组合使用，以适应各种实际生产环境。
综上所述，本发明所提供的CMP晶圆清洗设备引进了缓冲单元，当CMP晶圆清洗设备发生故障时，对于抛光好的晶圆就可以实现安全存储，也可以有效解决位于程序转换之间的晶圆的安全存储问题。本发明所提供的晶圆传输机械手设置于化学机械平坦化设备的清洗模块中，可以切实有效满足晶圆在水平和竖直两种状态的转换，符合实际生产需求，机械手翻转过程无需增加空间以供翻转，也不会对其他机构产生干扰，空间利用率高。本发明中晶圆传输机械手使干燥单元能够以作用效果最佳为目标来选择晶圆放置模式(竖直或水平放置)，无需为了便于晶圆传输而使干燥单元的晶圆放置模式与清洗模块其余各单元一致。由于晶圆传输机械手的横向传输轴行程只到干燥前单元为止，行程紧凑，机械手翻转后向干燥单元置入晶圆过程中，横向传输拖板不会运行到干燥单元一侧，从而排除在干燥工艺中晶圆传输机械手运动部件上的杂质颗粒散落到晶圆上的可能性。

Claims (21)

  1. 一种CMP晶圆清洗设备，包括依次排列的清洗输入单元、兆声清洗单元、若干个刷洗单元、甩干单元，其特征在于，还包括传输机械手，传输机械手位于清洗设备的上方，传输机械手包括水平运动轴、垂直运动轴和若干晶圆抓取装置，可将晶圆在所述单元之间传输，靠近甩干单元侧的所述晶圆抓取装置自带晶圆翻转功能，可将晶圆抓取并翻转。
  2. 根据权利要求1所述的CMP晶圆清洗设备，其特征在于，包括抛光晶圆通道，位于所述清洗输入单元和所述兆声清洗单元之间，以方便待化学机械抛光的晶圆进入抛光区域时穿过清洗设备。
  3. 根据权利要求2所述的CMP晶圆清洗设备，其特征在于，抛光晶圆通道和清洗输入单元中的晶圆托架均可以同时或单独移出，方便进行装载晶圆操作。
  4. 根据权利要求1所述的CMP晶圆清洗设备，其特征在于，还包含缓冲单元，所述缓冲单元位于清洗输入单元的前方，可以临时存放若干片晶圆。
  5. 根据权利要求4所述的CMP晶圆清洗设备，其特征在于，在所述缓冲单元中设置喷水装置，防止晶圆未经清洗而干燥。
  6. 根据权利要求1所述的CMP晶圆清洗设备，其特征在于，清洗和刷洗过程中晶圆处于垂直方向，在甩干过程中晶圆处于水平方向。
  7. 根据权利要求1所述的CMP晶圆清洗设备，其特征在于，清洗、刷洗、甩干过程中晶圆均处于垂直方向。
  8. 根据权利要求1所述的CMP晶圆清洗设备，其特征在于，所述传输机械手包括晶圆抓取装置一和晶圆抓取装置二。
  9. 根据权利要求1所述的CMP晶圆清洗设备，其特征在于，所述CMP晶圆清洗设备还包括独立的翻转机械手，以使靠近甩干单元侧的所述晶圆抓取装置省掉晶圆翻转功能。
  10. 一种晶圆传输机械手，用于化学机械平坦化设备的清洗模块中的晶圆传输，以将晶圆以竖直状态在清洗模块的清洗单元中完成清洗后取出，再通过翻转后以水平状态置入清洗模块的干燥单元，其特征在于，包括：
    横向传输轴，仅位于所述清洗单元的一侧；
    横向传输拖板，设置在所述横向传输轴上，并能够沿所述横向传输轴做横向运动；
    第一垂直升降轴，设置在所述横向传输拖板上，并能够在所述横向传输拖板上做竖直运动；
    旋转台，设置在所述第一垂直升降轴上；
    第一卡爪夹持臂，与所述旋转台相连，并由所述旋转台驱动做旋转运动，用于对晶圆进行取放。
  11. 如权利要求10所述的晶圆传输机械手，其特征在于，所述清洗单元和所述干燥单元安装有可开关的门，用于所述晶圆传输机械手对晶圆进行取放时的自动打开或关闭。
  12. 如权利要求10所述的晶圆传输机械手，其特征在于，所述清洗单元包括：干燥前单元和清洗模块其他单元；所述干燥单元和清洗模块其他单元位于所述干燥前单元的两侧；所述干燥前单元采用竖直方向作业；所述干燥前单元内的晶圆由所述第一卡爪夹持臂传输至所述干燥单元；所述清洗模块其他单元为晶圆过渡单元、兆声清洗单元、刷洗单元中的一个或多个。
  13. 如权利要求12所述的晶圆传输机械手，其特征在于，所述晶圆传输机械手还包括：至少一个第二垂直升降轴，设置在所述横向传输拖板上，并能够在所述横向传输拖板上做竖直运动；所述第一垂直升降轴位于所述第二垂直升降轴和所述干燥单元之间；每个所述第二垂直升降轴上还设置有第二卡爪夹持臂，用于与第一卡爪夹持臂配合进行清洗模块其他单元到干燥前单元之间的晶圆传送。
  14. 一种如权利要求12或13所述的晶圆传输机械手的晶圆翻转方法，其特征在于，该方法包括晶圆置入步骤和机械手返回步骤；
    所述晶圆置入步骤包括：所述第一卡爪夹持臂从所述清洗单元的干燥前单元中取出晶圆后，通过横向、竖直、旋转三个运动方向的联动或非联动动作实现晶圆从竖直状态翻转为水平状态，并将晶圆置入干燥单元；
    所述机械手返回步骤包括：第一卡爪夹持臂将晶圆放置于所述干燥单元后，通过横向、竖直、旋转三个运动方向的联动或非联动动作由水平状态恢复为竖直状态，并返回原位置。
  15. 如权利要求14所述的晶圆传输机械手的晶圆翻转方法，其特征在于，所述晶圆置入步骤具体包括：
    所述第一卡爪夹持臂从所述干燥前单元中取出晶圆后，同时进行以下三个方向上的运动：横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动，旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态，第一垂直升降轴带动第一卡爪夹持臂竖直运动至一定位置；
    随后横向传输拖板带动第一卡爪夹持臂向靠近所述干燥单元的方向横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
  16. 如权利要求14所述的晶圆传输机械手的晶圆翻转方法，其特征在于，所述晶圆置入步骤具体包括：所述第一卡爪夹持臂从所述干燥前单元中取出晶圆后，横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动；然后旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态；接着第一垂直升降轴带动第一卡爪夹持臂竖直运动至一定位置；随后横向传输拖板带动第一卡爪夹持臂向靠近所述干燥单元的方向横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
  17. 如权利要求14所述的晶圆传输机械手的晶圆翻转方法，其特征在于，所述晶圆置入步骤具体包括：所述第一卡爪夹持臂从所述干燥前单元中取出晶圆后，横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动；然后旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态；随后横向传输拖板带动第一卡爪夹持臂向靠近所述干燥单元的方向横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
  18. 如权利要求14所述的晶圆传输机械手的晶圆翻转方法，其特征在于，所述晶圆置入步骤具体包括：所述第一卡爪夹持臂从所述干燥前单元中取出 晶圆后，旋转台带动第一卡爪夹持臂向靠近所述干燥单元一侧旋转至晶圆达到水平状态；随后横向传输拖板带动第一卡爪夹持臂横向运动至晶圆位于干燥单元的上方；第一垂直升降轴带动第一卡爪夹持臂竖直向下运动至晶圆位于干燥单元内部指定机构；第一卡爪夹持臂松开晶圆，使晶圆位于干燥单元内部指定机构上。
  19. 如权利要求14所述的晶圆传输机械手的晶圆翻转方法，其特征在于，所述机械手返回步骤具体包括：当晶圆被放置于干燥单元后，同时进行以下三个方向上的运动：横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向做横向运动；旋转台带动第一卡爪夹持臂向下旋转至第一卡爪夹持臂呈竖直状态；第一垂直升降轴带动第一卡爪夹持臂竖直向上运动至一定位置。
  20. 如权利要求14所述的晶圆传输机械手的晶圆翻转方法，其特征在于，所述机械手返回步骤具体包括：当晶圆被放置于干燥单元后，第一垂直升降轴带动第一卡爪夹持臂竖直向上运动至一定位置；然后横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向横向运动至一定位置；接着旋转台带动第一卡爪夹持臂向下旋转至第一卡爪夹持臂呈竖直状态。
  21. 如权利要求14所述的晶圆传输机械手的晶圆翻转方法，其特征在于，所述机械手返回步骤具体包括：当晶圆被放置于干燥单元后，横向传输拖板带动第一卡爪夹持臂向远离所述干燥单元的方向横向运动至一定位置；然后第一垂直升降轴带动第一卡爪夹持臂竖直向上运动至一定位置；接着旋转台带动第一卡爪夹持臂向下旋转至第一卡爪夹持臂呈竖直状态。
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