WO2020077751A1 - 柔性基板、该柔性基板的制备方法及显示面板 - Google Patents

柔性基板、该柔性基板的制备方法及显示面板 Download PDF

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Publication number
WO2020077751A1
WO2020077751A1 PCT/CN2018/118112 CN2018118112W WO2020077751A1 WO 2020077751 A1 WO2020077751 A1 WO 2020077751A1 CN 2018118112 W CN2018118112 W CN 2018118112W WO 2020077751 A1 WO2020077751 A1 WO 2020077751A1
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WO
WIPO (PCT)
Prior art keywords
flexible substrate
layer
area
bending
bendable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/118112
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English (en)
French (fr)
Inventor
尹炳坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
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Filing date
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Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/339,371 priority Critical patent/US20200144521A1/en
Publication of WO2020077751A1 publication Critical patent/WO2020077751A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/2419—Fold at edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y10T428/24653—Differential nonplanarity at margin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • the invention relates to the field of display devices, in particular to a flexible substrate, a method for preparing the flexible substrate, and a display panel.
  • FIG. 1 is a structure of a conventional display panel. Please refer to FIG. 1, the display panel has a display area A and a non-display area B. The non-display area B is bent toward the back of the display panel to form a bending area C. At the bending region C, the substrate 10 of the display panel is further provided with multiple functional film layers, for example, metal traces 11. When the non-display area B is bent to the back of the display panel, each of the functional film layers of the outer portion with respect to the center of curvature of curvature is stressed.
  • the interface between the substrate 10 and each functional film layer and the interface between adjacent functional film layers are generally planar, therefore, the interface is basically straight on the cross section where the bending direction is located shape. If the material of a functional film layer or the functional structure of a functional film layer in the outer part has high tensile strength or is not easily deformed, then the functional film material or functional structure will be generated in the bending zone C A large stress may cause the destruction of the functional film layer or functional structure and affect the display effect.
  • the technical problem to be solved by the present invention is to provide a flexible substrate, a preparation method of the flexible substrate, and a display panel, which can reduce the risk of breakage of each film layer of the flexible substrate during bending.
  • the present invention provides a flexible substrate including at least one non-bending area and at least one bendable area.
  • the flexible substrate has at least one bending portion, the bending The bending direction of the portion is the same as the bendable direction of the bendable area.
  • the curvature of the bending portion is the same as the curvature of the bendable area after bending.
  • the flexible substrate further includes a flexible substrate and a plurality of functional film layers disposed on the flexible substrate, at least part of the functional film layer extends to the bendable of the flexible substrate In the folding area, the flexible substrate and the functional film layer are in a curved shape at the curved portion.
  • the functional film layer extending to the bendable area is a metal trace layer.
  • the functional film layer includes a thin film transistor layer, and the thin film transistor layer is disposed in the non-bending region.
  • the flexible substrate includes two non-bending areas, and the bendable area is disposed between the two non-bending areas.
  • the present invention also provides a method for preparing the above-mentioned flexible substrate, which includes the following steps: providing a support plate, the support plate including at least a first area and at least a second area; Two regions form at least one protrusion with a curved shape; a flexible substrate layer is formed on one surface of the support plate and one surface of the protrusion, and the area corresponding to the first region of the flexible substrate layer is a non- A bending area, the area corresponding to the flexible substrate layer and the second area is a bendable area, and at the corresponding position of the protrusion, the flexible substrate layer forms the curved portion; removing the support plate and The protrusions form the flexible substrate.
  • a method of forming the protrusion in at least one curved form in the second area of the support plate is: applying a liner to the second area of the support plate; The pads form the protrusions.
  • the curvature of the bending portion is the same as the curvature of the bendable area after bending.
  • the step of forming the flexible substrate layer on a surface of the support plate and a surface of the protrusion further includes the following steps:
  • a plurality of functional film layers are formed on the flexible substrate layer, at least part of the functional film layer extends to the bendable region of the flexible substrate, and at the bent portion, the flexible substrate and the function
  • the film layers are all curved.
  • the functional film layer extending to the bendable area is a metal trace layer.
  • the functional film layer includes a thin film transistor layer, and the thin film transistor layer is disposed in the non-bending region.
  • the flexible substrate includes two non-bending areas, and the bendable area is disposed between the two non-bending areas.
  • the invention also provides a display panel comprising the above-mentioned flexible substrate, and a display layer is provided on the flexible substrate.
  • the display layer includes a liquid crystal layer and a color filter substrate, and the liquid crystal layer is disposed between the flexible substrate and the color filter substrate.
  • the display layer includes an organic light-emitting layer.
  • the advantage of the present invention is that a bending portion having a bending direction in the same direction as the bending direction of the bendable area is formed in the bendable area of the flexible substrate, which reduces the stress of the flexible substrate in the area and reduces bending The risk of each film layer of the flexible substrate breaking.
  • Figure 1 is a structure of an existing display panel
  • FIG. 2 is a schematic side view of an embodiment of the flexible substrate of the present invention.
  • FIG. 3 is a schematic top view of another embodiment of the flexible substrate of the present invention.
  • FIG. 4 is a schematic diagram of a flexible substrate of the present invention after being bent
  • FIG. 5 is a schematic side view of another embodiment of the flexible substrate of the present invention.
  • 6A-6E are process flow diagrams of an embodiment of a method for preparing a flexible substrate of the present invention.
  • FIG. 7 is a schematic structural view of an embodiment of the display panel of the present invention.
  • FIG. 8 is a schematic structural diagram of another embodiment of a display panel of the present invention.
  • the flexible substrate 20 of the present invention includes at least one non-bending area A and at least one bendable area B.
  • the non-bending area means that the flexible substrate 20 does not bend when an external force is applied in this area
  • the flexible area means that the flexible substrate 20 can bend when an external force is applied in this area.
  • the flexible substrate 20 includes two non-bending areas A and one bendable area B, and the bendable area B is located between the two non-bending areas A.
  • the flexible substrate 20 may include a plurality of non-bending areas A and a plurality of bendable areas B arranged alternately, which is not limited in the present invention.
  • the flexible substrate 20 includes three non-bending regions A and two bendable regions B arranged alternately, wherein FIG. 3 is the flexible substrate 20 Top schematic view.
  • the flexible substrate 20 has at least one bent portion 21.
  • the bending direction of the bending portion 21 is the same as the bending direction of the bendable area B.
  • the bendable direction of the bendable area B refers to the direction of stress transmission when the bendable area B bends. Since the bending direction of the bending portion 21 is the same as the bending direction of the bendable area B, when the bending operation is performed on the bendable area B, the flexible substrate can be reduced in this area The stress of 20 reduces the risk of breakage of each film layer of the flexible substrate 20 during bending.
  • the curved shape of the curved portion 21 includes but is not limited to an arc shape.
  • the flexible substrate 20 has a bent portion 21.
  • the curvature of the bending portion 21 is the same as the curvature of the bendable area B after being bent.
  • FIG. 4 is a schematic diagram of a flexible substrate of the present invention after being bent. Referring to FIG. 4, when performing a bending operation on the bendable area B, one end of the flexible substrate 20 is bent toward the back of the flexible substrate 20 with the center of the bending portion 21 as a bending axis , Thereby reducing the stress of each film layer of the flexible substrate 20 in the bendable area B.
  • the number of the curved portions 21 is not limited.
  • the flexible substrate 20 in the bendable area B, includes three bent portions 21. Then, when performing the bending operation on the bendable area B, it is preferable to bend one end of the flexible substrate 20 toward the back of the flexible substrate 20 with the centers of the three bending portions 21 as the bending axis, thereby The stress of each film layer of the flexible substrate 20 in the bendable area B is reduced.
  • the flexible substrate 20 of the present invention can be bent at various positions including the display area, so it can be used to manufacture flexible display panels; it can also be bent mainly at non-display areas such as edges, and thus can be used to manufacture narrow Display panel.
  • the flexible substrate 20 further includes a flexible substrate 200 and a plurality of functional film layers 201 disposed on the flexible substrate 200.
  • the flexible substrate 200 may be made of polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compound (PAR) or glass fiber reinforced plastic (FRP) and other polymer materials are prepared and formed.
  • the functional film layer 201 refers to various layers constructed to realize display functions such as an organic electroluminescent layer, a liquid crystal layer, a plasma layer, or an electronic ink layer, such as a driving circuit layer, a metal wiring layer, Gate layer, gate dielectric layer, source / drain layer, semiconductor material layer, passivation layer, etc.
  • the functional film layer 201 may be formed on the flexible substrate 200 by a semiconductor manufacturing process known to those skilled in the art, including but not limited to photolithography, etching, coating, sputtering, vapor deposition, doping, and the like.
  • the functional film layer 201 extends to the bendable region B of the flexible substrate 20.
  • the flexible substrate 200 and the functional film layer 201 are both in a curved shape.
  • the functional film layer 201 extending to the bendable area B of the flexible substrate 20 includes, but is not limited to, a metal wiring layer, a buffer layer, a passivation layer, and the like.
  • the functional film layer 201 extending to the bendable area B of the flexible substrate 20 is a metal trace layer 204.
  • the functional film layer 201 further includes a thin film transistor layer 202, and the thin film transistor layer 202 is disposed in the non-bending region A. Further, an alignment film layer 203 is further covered on the thin film transistor layer 202.
  • the functional film layer 201 is a conventional structure in the art and will not be repeated here.
  • the invention also provides a method for preparing the above flexible substrate.
  • 6A-6E are process flow diagrams of an embodiment of the method for manufacturing a flexible substrate of the present invention.
  • a support plate 600 is provided.
  • the support plate 600 includes at least a first area 601 and at least a second area 602.
  • the support plate 600 includes, but is not limited to, a support plate conventionally used in the display field such as a glass substrate.
  • the support plate 600 is divided into two first regions 601 and a second region 602, and the second region 602 is located between the two first regions 601.
  • the support plate 600 may also be divided into a plurality of the first regions 601 and the second regions 602 arranged alternately.
  • At least one protrusion 603 having a curved shape is formed in the second region 602 of the support plate 600.
  • a method of forming at least one curved shape of the protrusion 603 in the second area 602 of the support plate 600 is to apply a liner to the second area 602 of the support plate 600 and heat to cure The cushion forms the protrusion 603.
  • the shape of the protrusion 603 is the same as the shape of the bent portion 605 (shown in FIG. 6C) to be formed later.
  • a flexible substrate layer is formed on the surface of the support plate 600 and the surface of the protrusion 603.
  • the area corresponding to the flexible substrate layer and the first area 601 is a non-bending area A
  • the area corresponding to the flexible substrate layer and the second area 602 is a bendable area B.
  • the flexible substrate layer includes two non-bending areas A and one bendable area B, and the bendable area B is disposed between the two non-bending areas A.
  • the flexible substrate layer does not specifically refer to a one-layer structure, it may be a one-layer structure or a multi-layer structure.
  • the flexible substrate layer is a multilayer structure, which includes a flexible substrate layer 6041 and a plurality of functional film layers 606.
  • the functional film layer includes, but is not limited to, a thin film transistor layer 6061, an alignment film layer 6062, and a metal wiring layer 6063.
  • a thin film transistor layer 6061
  • an alignment film layer 6062 an alignment film layer 6062
  • metal wiring layer 6063 a metal wiring layer
  • the flexible substrate layer forms the bent portion 605.
  • the flexible substrate layer depends on the direction of the protrusion 603
  • the bent portion 605 is naturally formed at 603.
  • the method of forming the flexible substrate layer on the surface of the support plate 600 and the surface of the protrusion 603 includes the following steps:
  • the flexible substrate layer 6041 is formed on the surface of the support plate 600 and the surface of the protrusion 603.
  • the flexible substrate 6041 may be made of polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polynaphthalene dicarboxylic acid Polymer materials such as ethylene glycol ester (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP) are prepared.
  • the flexible substrate layer 6041 may be formed by coating a polyimide layer on the surface of the support plate 600 and the surface of the protrusion 603.
  • multiple functional film layers 606 are formed on the flexible substrate layer 6041. At least part of the functional film layer 606 extends to the bendable region B of the flexible substrate layer. At the bending portion 605, the flexible substrate and the functional film layer are both in a curved shape. That is, part of the functional film layer 606 is located in the non-bending area A, and part of the functional film layer 606 extends to the bendable area B. Specifically, in this embodiment, the thin film transistor layer 6061, the alignment film layer 6062 are located in the non-bending area A, and the metal trace layer 6063 extends to the bendable area B. In other embodiments, according to different uses of the flexible substrate of the present invention, other functional film layers may also be formed.
  • the support plate 600 and the protrusion 603 are removed to form the flexible substrate 610.
  • the support plate 600 and the protrusion 603 can be removed by laser peeling or the like to form a flexible substrate 610 having a bent portion 605.
  • a step of forming other structures is further included, wherein the supporting plate 600 plays a supporting role.
  • the flexible substrate 610 is used as an array substrate of a liquid crystal display device, before the step of removing the support plate 600 and the protrusion 603, a color filter substrate and the flexible substrate 610 are further formed
  • the steps of filling the liquid crystal and filling the liquid crystal box are normal steps and will not be repeated here.
  • the method for preparing a flexible substrate of the present invention can form a bent portion 605 in the bendable area B of the flexible substrate 610, which can further reduce the stress of the functional film layer 606 in this area and reduce the function films during bending Risk of layer 606 breaking.
  • the flexible substrate of the present invention can be applied to organic light emitting diode (Organic Light Emitting Diode, OLED) display devices and liquid crystal display devices (Liquid Crystal Display, LCD), plasma display device (Plasma Display Panel (PDP) or electronic ink display device and other display devices.
  • OLED Organic Light Emitting Diode
  • LCD Liquid Crystal Display
  • PDP Plasma Display Panel
  • the flexible substrate can be used as a carrier and driving unit for organic electroluminescent material, liquid crystal, plasma or electronic ink, and an organic electroluminescent material layer, liquid crystal layer, plasma layer or electronic ink layer can be formed on the functional film Layer to manufacture the corresponding display panel.
  • the flexible array substrate of the present invention may also be applied to other technical fields than the display technology field.
  • the functional film layer refers to various layers required to achieve other target functions.
  • the invention also provides a display panel.
  • 7 is a schematic structural diagram of an embodiment of a display panel of the present invention.
  • the display panel includes a flexible substrate 700 as described above, and a display layer 710 is provided on the flexible substrate 700.
  • the display layer 710 includes a liquid crystal layer 711 and a color film substrate 712.
  • the liquid crystal layer 711 is disposed between the flexible substrate 700 and the color filter substrate 712.
  • the display panel is an LCD display panel. At one end of the display panel, such as a lower frame, the flexible substrate 700 is bent toward the back of the display panel.
  • the flexible substrate 700 has a bent portion 701
  • the stress of the functional film layer located in this region is reduced, and the risk of breakage of each functional film layer is reduced.
  • the other structure of the display panel is a conventional structure and will not be described in detail.
  • the display panel includes a flexible substrate 800 as described above, and a display layer 810 is provided on the flexible substrate 800.
  • the display layer 810 includes an organic light-emitting layer 811.
  • the display panel is an OLED display panel.
  • the flexible substrate 800 is bent toward the back of the display panel. In the bending region C, since the flexible substrate 800 has a bent portion 801, the stress of the functional film layer located in this region is reduced, and the risk of breakage of each functional film layer is reduced.
  • the other structure of the display panel is a conventional structure and will not be described in detail.

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Abstract

提供一种柔性基板、该柔性基板的制备方法及包括该柔性基板的显示面板。该柔性基板（20）包括至少一非弯折区（A）及至少一可弯折区（B），在可弯折区，具有至少一弯曲部（21），弯曲部的弯曲方向与可弯折区的可弯折方向相同。对可弯折区实施弯折操作时，能够减小可弯折区的柔性基板的应力，降低弯折时柔性基板各个膜层断裂的风险。

Description

柔性基板、该柔性基板的制备方法及显示面板 技术领域
本发明涉及显示装置领域，尤其涉及一种柔性基板、该柔性基板的制备方法及显示面板。
 背景技术
当前的移动终端市场上，针对高屏占比的设计需求越来越高，如何在显示面板设计上压缩非显示区边框成为各家厂商设计的焦点。
现有的常规方法是将非显示区弯折至显示面板背面的设计，从而减小显示面板边框的宽度。图1是现有的显示面板的结构。请参阅图1，所述显示面板具有一显示区A及非显示区B。所述非显示区B向显示面板的背面弯折，形成一弯折区C。在弯折区C处，所述显示面板的衬底10上还设置有多层功能膜层，例如，金属走线11。在将非显示区B弯折至显示面板背面时，相对于弯曲曲率中心而言的外侧部分的各个所述功能膜层受到应力。
 技术问题
传统柔性阵列基板中，衬底10与各个功能膜层之间的界面以及相邻的各个功能膜层之间的界面，大体为平面，因此，该界面在弯折方向所在的截面上基本为直线的形状。如果外侧部分中的某个功能膜层的材料或者某个功能膜层的功能结构，其拉伸强度高或者不容易变形，那么，该功能膜层材料或功能结构在弯折区C就会产生很大的应力，可能导致该功能膜层或功能结构的破坏，影响显示效果。
 技术解决方案
本发明所要解决的技术问题是，提供一种柔性基板、该柔性基板的制备方法及显示面板，其能够降低弯折时柔性基板的各个膜层的断裂的风险。
为了解决上述问题，本发明提供了一种柔性基板，包括至少一非弯折区及至少一可弯折区，在所述可弯折区，所述柔性基板具有至少一弯曲部，所述弯曲部的弯曲方向与所述可弯折区的可弯折方向相同。
在一实施例中，所述弯曲部的曲率与所述可弯折区弯折后的曲率相同。
在一实施例中，所述柔性基板还包括一柔性衬底及设置在所述柔性衬底上的多个功能膜层，至少部分所述功能膜层延伸至所述柔性基板的所述可弯折区，在所述弯曲部，所述柔性衬底及所述功能膜层均呈弯曲形态。
在一实施例中，延伸至所述可弯折区的所述功能膜层为一金属走线层。
在一实施例中，所述功能膜层包括一薄膜晶体管层，所述薄膜晶体管层设置在所述非弯折区。
在一实施例中，所述柔性基板包括两个非弯折区，所述可弯折区设置在所述的两个非弯折区之间。
本发明还提供一种上述的柔性基板的制备方法，其包括如下步骤：提供一支撑板，所述支撑板包括至少一第一区及至少一第二区；在所述支撑板的所述第二区形成至少一弯曲形态的凸起；在所述支撑板的一表面及所述凸起的一表面形成一柔性基板层，所述柔性基板层与所述第一区对应的区域为一非弯折区，所述柔性基板层与所述第二区对应的区域为一可弯折区，在所述凸起对应处，所述柔性基板层形成所述弯曲部；去除所述支撑板及所述凸起，形成所述柔性基板。
在一实施例中，在所述支撑板的第二区形成至少一弯曲形态的所述凸起的方法是：在所述支撑板的所述第二区涂布一衬垫物；加热固化所述衬垫物，形成所述凸起。
在一实施例中，所述弯曲部的曲率与所述可弯折区弯折后的曲率相同。
在一实施例中，在所述支撑板的一表面及所述凸起的一表面形成所述柔性基板层的步骤还包括如下步骤：
在所述支撑板的一表面及所述凸起的一表面形成一柔性衬底层；
在所述柔性衬底层上形成多个功能膜层，至少部分所述功能膜层延伸至所述柔性基板的所述可弯折区，在所述弯曲部，所述柔性衬底及所述功能膜层均呈弯曲形态。
在一实施例中，延伸至所述可弯折区的所述功能膜层为一金属走线层。
在一实施例中，所述功能膜层包括一薄膜晶体管层，所述薄膜晶体管层设置在所述非弯折区。
在一实施例中，所述柔性基板包括两个非弯折区，所述可弯折区设置在所述的两个非弯折区之间。
本发明还提供一种显示面板，包括一上述的柔性基板，在所述柔性基板上设置有一显示层。
在一实施例中，所述显示层包括一液晶层及一彩膜基板，所述液晶层设置在所述柔性基板与所述彩膜基板之间。
在一实施例中，所述显示层包括一有机发光层。
 有益效果
本发明的优点在于，在柔性基板的可弯折区形成弯曲方向与所述可弯折区的可弯折方向同向的弯曲部，减小了该区域所述柔性基板的应力，降低弯折时柔性基板的各个膜层断裂的风险。
 附图说明
图1是现有的显示面板的结构；
图2是本发明柔性基板的一实施例的侧视示意图；
图3是本发明柔性基板的另一实施例的俯视示意图；
图4是本发明柔性基板一实施例弯折后的示意图；
图5是本发明柔性基板的另一实施例的侧视示意图；
图6A~图6E是本发明柔性基板的制备方法的一实施例的工艺流程图；
图7是本发明显示面板的一实施例的结构示意图；
图8是本发明显示面板的另一实施例的结构示意图。
 本发明的实施方式
下面结合附图对本发明提供的柔性基板、该柔性基板的制备方法及显示面板的具体实施方式做详细说明。
图2是本发明柔性基板的一实施例的结构示意图。请参阅图2，本发明柔性基板20包括至少一非弯折区A及至少一可弯折区B。所述非弯折区是指在该区域施加外力所述柔性基板20不发生弯折，所述可弯折区是指在该区域施加外力所述柔性基板20能够弯折。在本实施例中，所述柔性基板20包括两个非弯折区A及一个可弯折区B，所述可弯折区B位于所述的两个非弯折区A之间。
所述柔性基板20可以包括交替排列的多个非弯折区A及多个可弯折区B，本发明对此不进行限定。例如，请参阅图3，在本发明另一实施例中，所述柔性基板20包括交替排列的三个非弯折区A及两个可弯折区B，其中图3为所述柔性基板20的俯视示意图。
请继续参阅图2，在所述可弯折区B，所述柔性基板20具有至少一弯曲部21。所述弯曲部21的弯曲方向与所述可弯折区B的可弯折方向相同。所述可弯折区B的可弯折方向是指所述可弯折区B发生弯折时应力的传递方向。由于所述弯曲部21的弯曲方向与所述可弯折区B的可弯折方向同向，则在对所述可弯折区B实施弯折操作时，能够减小该区域所述柔性基板20的应力，降低弯折时柔性基板20的各个膜层的断裂的风险。其中，所述弯曲部21的弯曲形状包括但不限于弧形。
在本实施例中，所述柔性基板20具有一个弯曲部21。所述弯曲部21的曲率与所述可弯折区B弯折后的曲率相同。图4是本发明柔性基板一实施例弯折后的示意图。请参阅图4，在对所述可弯折区B实施弯折操作时，以所述弯曲部21的中心为弯折轴将所述柔性基板20的一端向所述柔性基板20的背面弯折，从而减小柔性基板20在可弯折区B的各个膜层的应力。
本发明对所述弯曲部21的数量不进行限定。例如，请参阅图5，在本发明另一实施例中，在所述可弯折区B，所述柔性基板20包括三个弯曲部21。则在对所述可弯折区B实施弯折操作时，优选地以三个弯曲部21的中心为弯折轴将所述柔性基板20的一端向所述柔性基板20的背面弯折，从而减小柔性基板20在可弯折区B的各个膜层的应力。
本发明柔性基板20既可以在包括显示区域在内的各种位置进行弯折，因此可以用来制造柔性显示面板；也可以主要在非显示区域例如边缘处弯折，因此可以例如用来制造窄边显示面板。
进一步，请继续参阅图2，在本实施例中，所述柔性基板20还包括一柔性衬底200及设置在所述柔性衬底200上的多个功能膜层201。
所述柔性衬底200可由聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR)或玻璃纤维增强塑料(FRP)等聚合物材料制备形成。所述功能膜层201是指为了使例如有机电致发光层、液晶层、等离子体层或者电子墨水层等显示层实现显示功能而构建的各种层，例如驱动电路层、金属走线层、栅极层、栅介质层、源/漏极层、半导体材料层、钝化层等等。所述功能膜层201可以通过本领域技术人员公知的半导体制造工艺形成在柔性衬底200上，包括但不限于光刻、刻蚀、涂覆、溅射、气相淀积、掺杂等等。
至少部分所述功能膜层201延伸至所述柔性基板20的可弯折区B，在所述弯曲部21，所述柔性衬底200及所述功能膜层201均呈弯曲形态。其中，延伸至所述柔性基板20的可弯折区B的功能膜层201包括但不限于金属走线层、缓冲层、钝化层等等。在本实施例中，延伸至所述柔性基板20的可弯折区B的功能膜层201为金属走线层204。在所述可弯折区B，由于所述柔性衬底200及所述功能膜层201在所述弯曲部21均呈弯曲形态，则在进行弯折操作时，能够减小位于该区域的所述功能膜层201的应力，降低弯折时各个功能膜层201断裂的风险。所述功能膜层201还包括薄膜晶体管层202，所述薄膜晶体管层202设置在所述非弯折区A。进一步，在所述薄膜晶体管层202上还覆盖一层配向膜层203。所述功能膜层201为本领域常规的结构，在此不再赘述。
本发明还提供一种上述柔性基板的制备方法。图6A~图6E是本发明柔性基板的制备方法的一实施例的工艺流程图。
请参阅图6A，提供一支撑板600，所述支撑板600包括至少一第一区601及至少一第二区602。所述支撑板600包括但不限于玻璃基板等显示领域常规使用的支撑板。在本实施例中，将所述支撑板600划分为两个第一区601及一个第二区602，所述第二区602位于所述的两个第一区601之间。在本发明其他实施例中，所述支撑板600也可以被划分为多个交替排列的所述第一区601及所述第二区602。
请参阅图6B，在所述支撑板600的第二区602形成至少一弯曲形态的凸起603。具体地说，在所述支撑板600的第二区602形成至少一弯曲形态的所述凸起603的方法为，在所述支撑板600的第二区602涂布一衬垫物，加热固化所述衬垫物，形成所述凸起603。其中所述凸起603的形状与后续需要形成的弯曲部605（绘示于图6C中）的形状相同。
请参阅图6C及图6D，在所述支撑板600的表面及所述凸起603的表面形成一柔性基板层。其中，所述柔性基板层与所述第一区601对应的区域为非弯折区A，所述柔性基板层与所述第二区602对应的区域为可弯折区B。在本实施例中，所述柔性基板层包括两个非弯折区A及一个可弯折区B，所述可弯折区B设置在所述的两个非弯折区A之间。
在本步骤中，所述柔性基板层并非特指一层结构，其可以为一层结构，也可以为多层结构。例如，在本实施例中，所述柔性基板层为多层结构，其包括柔性衬底层6041及多个功能膜层606。其中所述功能膜层包括但不限于薄膜晶体管层6061、配向膜层6062及金属走线层6063。所述功能膜层的描述请参见上文，在此不再赘述。
在所述凸起603对应处，所述柔性基板层形成所述弯曲部605。在该步骤中，由于所述支撑板600上的所述凸起603的存在，则在形成所述柔性基板层时，所述柔性基板层依据所述凸起603的走向，在所述凸起603处自然形成所述弯曲部605。
具体地说，在本实施例中，在所述支撑板600的表面及所述凸起603的表面形成所述柔性基板层的方法包括如下步骤：
（1）请参阅图6C，在所述支撑板600的表面及所述凸起603的表面形成所述柔性衬底层6041。具体地说，所述柔性衬底6041可由聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR)或玻璃纤维增强塑料(FRP)等聚合物材料制备形成。例如，在本实施例中，所述柔性衬底层6041可通过在所述支撑板600的表面及所述凸起603的表面涂覆一聚酰亚胺层而形成。
（2）请参阅图6D，在所述柔性衬底层6041上形成多个功能膜层606。至少部分所述功能膜层606延伸至所述柔性基板层的可弯折区B，在所述弯曲部605，所述柔性衬底及所述功能膜层均呈弯曲形态。即部分所述功能膜层606位于非弯折区A，部分所述功能膜层606延伸至所述可弯折区B。具体地说，在本实施例中，所述薄膜晶体管层6061、所述配向膜层6062位于非弯折区A，所述金属走线层6063延伸至可弯折区B。在其他实施例中，根据本发明柔性基板的不同用途，也可以形成其他功能膜层。
请参阅图6E，去除所述支撑板600及所述凸起603，形成所述柔性基板610。具体地说，可采用激光剥离等方法去除所述支撑板600及所述凸起603，从而形成具有弯曲部605的柔性基板610。
其中，可选地，根据本发明柔性基板610的不同用途，在去除所述支撑板600及所述凸起603之前还包括形成其他结构的步骤，其中所述支撑板600起到支撑作用。具体地说，若所述柔性基板610作为液晶显示装置的阵列基板，则在去除所述支撑板600及所述凸起603步骤之前，还包括一将一彩膜基板与所述柔性基板610成盒并灌装液晶等步骤，该些步骤为常规步骤，不再赘述。
采用本发明柔性基板的制备方法能够在所述柔性基板610的可弯折区B形成弯曲部605，进而能够减小位于该区域的所述功能膜层606的应力，降低弯折时各个功能膜层606断裂的风险。
本发明的柔性基板可以应用于有机发光二极管(Organic Light Emitting Diode，OLED)显示装置、液晶显示装置(Liquid Crystal Display，LCD)、等离子显示装置(Plasma Display Panel，PDP)或者电子墨水显示装置等多种显示装置。例如，柔性基板可以作为有机电致发光材料、液晶、等离子体或者电子墨水的载体和驱动单元，在功能膜层上面形成有机电致发光材料层、液晶层、等离子体层或者电子墨水层等显示层，从而制造出相应的显示面板。同时，本领域技术人员应该清楚，本发明的柔性阵列基板也可能应用在显示技术领域外的其他技术领域。这时，功能膜层是指为实现其他目标功能所需要的各种层。
本发明还提供一种显示面板。图7是本发明显示面板的一实施例的结构示意图。请参阅图7，所述显示面板包括一上述的柔性基板700，在所述柔性基板700上设置有显示层710。在本实施例中，所述显示层710包括一液晶层711及一彩膜基板712。所述液晶层711设置在所述柔性基板700与所述彩膜基板712之间。所述显示面板为LCD显示面板。在所述显示面板的一端，例如下边框，所述柔性基板700朝向所述显示面板的背面弯折。在弯折区C，由于所述柔性基板700具有弯曲部701，减小位于该区域的功能膜层的应力，降低各个功能膜层断裂的风险。所述显示面板的其他结构为常规结构，不再赘述。
图8是本发明显示面板的另一实施例的结构示意图。请参阅图8，所述显示面板包括一上述的柔性基板800，在所述柔性基板800上设置有显示层810。在本实施例中，所述显示层810包括一有机发光层811。在本实施例中，所述显示面板为OLED显示面板。在所述显示面板的一端，例如下边框，所述柔性基板800朝向所述显示面板的背面弯折。在弯折区C，由于所述柔性基板800具有弯曲部801，减小位于该区域的功能膜层的应力，降低各个功能膜层断裂的风险。所述显示面板的其他结构为常规结构，不再赘述。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (16)

  1. 一种柔性基板，其包括至少一非弯折区及至少一可弯折区，在所述可弯折区，所述柔性基板具有至少一弯曲部，所述弯曲部的弯曲方向与所述可弯折区的可弯折方向相同。
  2. 根据权利要求1所述的柔性基板，其中所述弯曲部的曲率与所述可弯折区弯折后的曲率相同。
  3. 根据权利要求1所述的柔性基板，其中所述柔性基板还包括一柔性衬底及设置在所述柔性衬底上的多个功能膜层，至少部分所述功能膜层延伸至所述柔性基板的所述可弯折区，在所述弯曲部，所述柔性衬底及所述功能膜层均呈弯曲形态。
  4. 根据权利要求3所述的柔性基板，其中延伸至所述可弯折区的所述功能膜层为一金属走线层。
  5. 根据权利要求3所述的柔性基板，其中所述功能膜层包括一薄膜晶体管层，所述薄膜晶体管层设置在所述非弯折区。
  6. 根据权利要求1所述的柔性基板，其中所述柔性基板包括两个非弯折区，所述可弯折区设置在所述的两个非弯折区之间。
  7. 一种如权利要求1所述的柔性基板的制备方法，其包括如下步骤：提供一支撑板，所述支撑板包括至少一第一区及至少一第二区；在所述支撑板的所述第二区形成至少一弯曲形态的凸起；在所述支撑板的一表面及所述凸起的一表面形成一柔性基板层，所述柔性基板层与所述第一区对应的区域为一非弯折区，所述柔性基板层与所述第二区对应的区域为一可弯折区，在所述凸起对应处，所述柔性基板层形成一弯曲部；以及去除所述支撑板及所述凸起，形成所述柔性基板。
  8. 根据权利要求7所述的柔性基板的制备方法，其中在所述支撑板的所述第二区形成至少一弯曲形态的所述凸起的方法是：在所述支撑板的所述第二区涂布一衬垫物；以及加热固化所述衬垫物，形成所述凸起。
  9. 根据权利要求7所述的柔性基板的制备方法，其中所述弯曲部的曲率与所述可弯折区弯折后的曲率相同。
  10. 根据权利要求7所述的柔性基板的制备方法，其中在所述支撑板的表面及所述凸起的表面形成所述柔性基板层的步骤还包括如下步骤：在所述支撑板的一表面及所述凸起的一表面形成一柔性衬底层；在所述柔性衬底层上形成多个功能膜层，至少部分所述功能膜层延伸至所述柔性基板的所述可弯折区，在所述弯曲部，所述柔性衬底及所述功能膜层均呈弯曲形态。
  11. 根据权利要求10所述的柔性基板的制备方法，其中延伸至所述可弯折区的所述功能膜层为一金属走线层。
  12. 根据权利要求10所述的柔性基板的制备方法，其中所述功能膜层包括一薄膜晶体管层，所述薄膜晶体管层设置在所述非弯折区。
  13. 根据权利要求7所述的柔性基板的制备方法，其中所述柔性基板包括两个非弯折区，所述可弯折区设置在所述的两个非弯折区之间。
  14. 一种显示面板，其包括一如权利要求1所述的柔性基板，在所述柔性基板上设置有一显示层。
  15. 根据权利要求14所述的显示面板，其中所述显示层包括一液晶层及一彩膜基板，所述液晶层设置在所述柔性基板与所述彩膜基板之间。
  16. 根据权利要求14所述的显示面板，其中所述显示层包括一有机发光层。
PCT/CN2018/118112 2018-10-19 2018-11-29 柔性基板、该柔性基板的制备方法及显示面板 Ceased WO2020077751A1 (zh)

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