WO2020077542A1 - Procédé et appareil d'élimination d'adhésif, et dispositif de commande - Google Patents

Procédé et appareil d'élimination d'adhésif, et dispositif de commande Download PDF

Info

Publication number
WO2020077542A1
WO2020077542A1 PCT/CN2018/110513 CN2018110513W WO2020077542A1 WO 2020077542 A1 WO2020077542 A1 WO 2020077542A1 CN 2018110513 W CN2018110513 W CN 2018110513W WO 2020077542 A1 WO2020077542 A1 WO 2020077542A1
Authority
WO
WIPO (PCT)
Prior art keywords
glue
residual glue
adhesive
adherend
residual
Prior art date
Application number
PCT/CN2018/110513
Other languages
English (en)
Chinese (zh)
Inventor
李军
白建伟
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2018/110513 priority Critical patent/WO2020077542A1/fr
Priority to CN201880097505.0A priority patent/CN112689540A/zh
Publication of WO2020077542A1 publication Critical patent/WO2020077542A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass

Definitions

  • the present application relates to the technical field of terminal equipment, in particular to a method, equipment and control device for removing glue.
  • the current methods of removing glue include freehand wiping, rollers, alcohol decomposition, etc.
  • the existing methods of removing glue take a long time and are not thorough.
  • the embodiments of the present application provide a glue removing method, equipment and a control device, which can improve the removal efficiency of the residual glue on the adherend.
  • an embodiment of the present application provides a method for removing glue, including: pasting an adhesive member on a residual glue of an adherend, wherein the viscosity of the adhesive member and the residual glue is greater than that of the residual glue and The stickiness of the adherend, and the tensile strength of the sticky piece is greater than a preset value; the residual glue is heated according to a preset heating temperature; the sticky piece is pulled to Under the action of adhesion, the residual glue is removed from the adherend.
  • the adhesive member is pasted on the residual glue of the adherend, and the residual glue is heated to reduce the adhesive force between the residual glue and the adhered member. Then, the adhesive member is pulled to remove the adhesive
  • the adhesion of the adhesive parts removes the residual glue from the adherend, thereby achieving the complete removal of the residual glue, and this method of removing glue does not cause any damage to the adherend, low cost, simple and easy to operate, strong operability, and consumption Short time, which improves the efficiency of removing glue.
  • the heating the residual glue according to the preset heating temperature includes: according to the preset heating temperature, the adhesive member and the residual glue adhered to the residual glue And the adherend is heated.
  • heating the adhesive parts, the residual glue, and the adherend can reduce the adhesion between the residual glue and the adherend, while increasing the adhesion between the residual glue and the adhesive.
  • pulling the adhesive parts it is easier to completely remove the residual glue from the adherend, further improving the efficiency of removing glue.
  • the heating the residual glue according to the preset heating temperature may further include: heating the residual glue and the adherend according to the preset heating temperature;
  • the above-mentioned sticking of the adhesive member to the residual glue of the adherend may include: sticking the adhesive member to the residual glue after heating.
  • the adhesive force between the adhesive member and the residual glue can be improved, and when the adhesive member is pulled, the residual glue can be easily removed from the adherend.
  • the pulling of the adhesive member may include: pulling the adhesive member according to a preset adhesive pulling angle, wherein the adhesive pulling angle is an angle between the adhesive member and the adherend .
  • the adhesive pulling angle is an angle between the adhesive member and the adherend .
  • the above-mentioned preset glue pulling angle is between 10 ° and 80 °.
  • the above-mentioned adhesive member is a pull-up glue.
  • the method may further include: detecting the residual glue to obtain parameter information of the residual glue; according to the parameter information of the residual glue , Select the sticky piece that meets the parameter information from multiple candidate sticky pieces, and then realize the fast and accurate determination of the sticky piece, and use the sticky piece to completely remove the residual glue on the adherend, further improving the removal of glue Efficiency and reliability, and can prevent damage to the adherend.
  • the above-mentioned determination of an adhesive piece conforming to the parameter information from a plurality of candidate adhesive pieces according to the parameter information of the residual glue may include: For the size parameter of the glue, select a viscous piece that meets the size parameter from a plurality of candidate viscous pieces.
  • the above-mentioned determination of a viscous piece conforming to the parameter information from a plurality of candidate viscous pieces based on the parameter information of the residual glue may include: according to the residual glue Viscosity parameter, select a viscous piece that meets the viscosity parameter from a plurality of candidate viscous pieces.
  • an embodiment of the present application provides a glue removing device, including: a glue machine, a glue pulling machine, and a heating device;
  • the adhesive machine is used for pasting an adhesive piece to the residual glue of an adherend, wherein the adhesive force of the adhesive piece and the residual glue is greater than the adhesive force of the residual glue and the adherend , And the tensile strength of the adhesive member is greater than a preset value;
  • the glue pulling machine is used to pull the adhesive member to remove the residual glue from the adherend under the action of adhesion of the adhesive member.
  • the above heating device is specifically configured to heat the adhesive member, the residual glue, and the adherend adhered to the residual glue according to the preset heating temperature.
  • the heating device is specifically used to heat the residual glue and the adherend according to the preset heating temperature
  • the viscose machine is specifically used for pasting the viscous piece on the residual glue after heating.
  • the glue pulling machine is specifically used to pull the adhesive member according to a preset glue pulling angle, wherein the glue pulling angle is an angle between the adhesive member and the adherend .
  • the above-mentioned preset glue pulling angle is between 10 ° and 80 °.
  • the adhesive member is a pull-up glue.
  • the above glue removal equipment further includes: a detection device, which is used to detect the residual glue before the adhesive machine sticks the adhesive member on the heated residual glue to obtain the Parameter information of the residual glue, and according to the parameter information of the residual glue, select a viscous piece conforming to the parameter information from a plurality of candidate viscous pieces.
  • a detection device which is used to detect the residual glue before the adhesive machine sticks the adhesive member on the heated residual glue to obtain the Parameter information of the residual glue, and according to the parameter information of the residual glue, select a viscous piece conforming to the parameter information from a plurality of candidate viscous pieces.
  • the above-mentioned detection device is specifically used to detect the size parameter of the residual glue, and according to the size parameter of the residual glue, select a viscous piece conforming to the size parameter from a plurality of candidate viscous pieces.
  • the above detection device is specifically configured to detect the viscosity parameter of the residual glue, and select a viscous piece conforming to the viscosity parameter from a plurality of candidate viscous pieces according to the viscosity parameter of the residual glue.
  • an embodiment of the present application provides a control device for a glue removing device, including:
  • Memory used to store computer programs
  • a processor is configured to execute the computer program to control the glue removing device to implement the glue removing method according to any one of the above-mentioned first aspects.
  • an embodiment of the present application provides an apparatus that exists in the form of a chip product.
  • the structure of the apparatus includes a processor and a memory.
  • the memory is used to couple with the processor and store necessary program instructions of the apparatus.
  • the processor is used to execute the program instructions stored in the memory, so that the device performs the function of the above-mentioned glue removal method.
  • an embodiment of the present application provides a computer storage medium, where the storage medium includes computer instructions, and when the instructions are executed by a computer, the computer realizes the glue removal according to any one of the first aspects method.
  • an embodiment of the present application provides a computer program product, where the program product includes a computer program, the computer program is stored in a readable storage medium, and at least one processor of the glue removing device can be read from the readable The storage medium reads the computer program, and the execution of the computer program by the at least one processor causes the glue removing device to perform the glue removing method according to any one of the first aspect.
  • the glue removing method, equipment and control device provided in the embodiments of the present application, by sticking the adhesive member to the residual glue of the adherend, the adhesive force of the adhesive member and the residual glue is greater than the adhesion of the residual glue and the adherend
  • the combined force, and the tensile strength of the adhesive member is greater than the preset value.
  • the preset heating temperature the residual glue is heated, and the adhesive member is pulled to remove the residual glue from the adherend under the action of the adhesion of the adhesive member, thereby achieving the complete removal of the residual glue, and this
  • the degumming method of the application example does not cause any damage to the adherend, has low cost, simple and easy operation, strong operability, and short time consumption, thereby improving the degumming efficiency.
  • 1 is a schematic diagram of residual glue on an adherend according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a mobile phone involved in an embodiment of this application.
  • FIG. 3 is a schematic flow chart of a method for removing glue provided by Embodiment 1 of the present application;
  • Example 4 is a partial schematic diagram of the degumming process involved in Example 1 of the present application.
  • Example 5 is a global schematic diagram of the degumming process involved in Example 1 of the present application.
  • Example 6 is a schematic flow chart of a method for removing glue provided by Example 2 of the present application.
  • FIG. 7 is a schematic flowchart of a method of removing glue provided by an embodiment of the present application.
  • Example 8 is a schematic structural diagram of a glue removing device provided in Example 1 of the present application.
  • Example 9 is a schematic structural diagram of a glue removing device provided in Example 2 of the present application.
  • FIG. 10 is a schematic structural diagram of a control device of a glue removing device according to an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of an apparatus provided by an embodiment of the present application.
  • FIG. 1 is a schematic diagram of residual glue on an adherend according to an embodiment of the present application.
  • a large amount of residual glue is adhered to the adherend. Due to the aging of the residual glue, the viscosity between the residual glue and the adherend is enhanced, and the cohesion inside the residual glue is reduced.
  • the residual glue is easily broken and cannot be completely Remove the residual glue on the adherend, which will affect the maintenance and reuse of the adherend.
  • the technical solution of this embodiment is applicable to any scene with adhesive backing that is difficult to clean.
  • it can be applied to mobile phones, tablet computers, computers, virtual reality (VR) terminal devices, augmented reality (Augmented Reality, AR) terminal devices, and industrial control (industrial control) terminal devices , Terminal equipment in self-driving (self driving), terminal equipment in remote medical (remote), terminal equipment in smart grid (smart), terminal equipment in transportation safety (transportation safety), smart city (smart The terminal equipment in the city), the terminal equipment in the smart home (smart home), etc. have adhesive bonding, and the products that are difficult to clean up the residual glue are not limited here.
  • the existing smart phone usually includes a touch screen 1, a steel sheet combination 2, a display screen 3, a main board 4, a middle frame 5, and a battery cover 6.
  • the main board 4 is fixed in the middle frame 5, and the main board 4 is installed with Camera, microphone, earpiece, fingerprint sensor, vibration motor and other devices.
  • the battery (not shown) is installed in the battery installation slot on the middle frame 5 and connected to the main board 4.
  • the battery In order to achieve the contact stability between the battery and the main board 4, the battery is usually adhered to the battery installation In the slot.
  • the display screen 3 is installed on the main board 4.
  • the display screen 3 may be adhered to the middle frame 5.
  • the steel sheet assembly 2 is covered on the display screen 3 and connected to the middle frame 5.
  • the touch screen 1 is adhered to the steel sheet assembly 2, and the battery cover 6 plate cover is provided on the lower surface of the battery and the middle frame 5.
  • the battery cover 6 is usually adhered to the middle frame 5 On the lower surface.
  • the existing full-screen mobile phones do not include the steel sheet assembly 2 but instead make the display screen 3 and the touch screen 1 as a whole to form a touch panel (Touch Panel, TP), which The panel is directly bonded to the upper surface of the middle frame 5.
  • Touch Panel TP
  • the touch panel needs to be removed from the middle frame 5, and / or the battery cover 6 is removed from the middle frame 5, and / or the battery is removed from the main board 4.
  • there will be residual glue on the adherends such as the touch panel, the middle frame 5, the battery cover 6, the battery, and the motherboard 4.
  • the embodiments of the present application provide a method and device for removing glue.
  • FIG. 3 is a schematic flowchart of the degumming method according to Embodiment 1 of the present application
  • FIG. 4 is a partial schematic diagram of the degumming process involved in Embodiment 1 of the present application
  • FIG. 5 is a global schematic view of the degumming process involved in Embodiment 1 of the present application .
  • the method of this embodiment may include:
  • the method of the embodiment of the present application can be used as a production guide to guide the operator to remove the residual glue on the adherend according to the method.
  • the method of the embodiment of the present application may be completed by a glue removing device, that is, the glue removing device automatically removes the residual glue on the adherend according to the glue removing method.
  • the adhesive member selected in the embodiment of the present application has the following characteristics: the adhesive force between the adhesive member and the residual glue is greater than the adhesive force between the residual glue and the adherend, and the tensile strength of the adhesive member is greater than the preset value.
  • the preset value is determined according to actual needs, for example, according to the adhesive force between the residual glue and the adherend to ensure that the adhesive piece will not break when the adhesive tape is removed from the adherend. The example does not limit the size of the preset value.
  • the embodiment of the present application does not limit the type of the adhesive member, and it may be an easy-pull glue, or a film material that adheres to the residual glue to meet the requirements, or other substrate-type adhesives.
  • the adherend in the embodiment of the present application may be any one of a battery cover, a battery, a touch panel, a frame on which the touch panel is installed, a display panel, a frame on which the display panel is installed, etc., and It can be other objects with residual glue.
  • the residual glue is heated. Specifically, the residual glue is heated according to a preset heating temperature to increase the adhesive force between the residual glue and the adhesive member, so that when the adhesive member is pulled, the residual glue can be more easily and thoroughly removed from the adherend On the peel.
  • the glue removing device of the embodiment of the present application has a heating function, which can heat the residual glue.
  • the glue removing device includes a heating device, and the residual glue is heated by the heating device.
  • the embodiment of the present application does not limit the execution sequence of S301 and S302, that is, S302 may be executed before S301, or S302 may be executed after S301.
  • S302 may include the following two methods.
  • Manner 1 According to the preset heating temperature, the adhesive member, the residual glue, and the adherend adhered to the residual glue are heated.
  • the adhesive member, the residual glue and the adherend are heated as a whole.
  • the adhesive, residual glue and adherend are placed in a heating device, and the adhesive, residual glue and adherend are heated according to a preset heating temperature. In this way, after heating, the adhesion between the adhesive and the residual glue increases, and the adhesion between the residual glue and the adherend decreases.
  • This method does not limit the heating temperature and heating time, it is determined according to actual needs, for example, according to the adhesion between the adhesive and the residual glue, the adhesion between the residual glue and the adherend, and the adhesive and The maximum temperature that the adherend can withstand and other conditions determine the heating temperature. That is to say, when the adhesive, residual glue and adherend are heated, the adhesion between the adhesive and the residual glue increases, while the adhesion between the residual glue and the adherend decreases. Ensure the integrity of sticky parts and adherends.
  • Manner 2 The residual glue and the adherend are heated according to the preset heating temperature.
  • this method first heats the residual glue and the adherend to reduce the adhesive force between the residual glue and the adherend, and then sticks an adhesive on the heated residual glue.
  • the residual glue and the adherend are placed in a heating device, and the residual glue and the adherend are heated according to a preset heating temperature, so that the adhesive force between the residual glue and the adherend is reduced. Remove the residual glue and the adherend from the heating device, and then stick the adhesive piece on the heated residual glue.
  • the temperature of the residual glue is higher than the temperature of the adhesive piece, the temperature between the adhesive piece and the residual glue can be increased.
  • Adhesion when pulling the adhesive, it is convenient to remove the residual glue from the adherend, and it can avoid heating the adhesive and causing the risk of failure of the adhesive.
  • this method does not limit the heating temperature and heating time, which is determined according to actual needs, for example, according to the adhesion between the residual glue and the adherend, and the maximum temperature that the adherend can withstand, etc. Heating temperature. That is to say, when the residual glue and the adherend are heated, the adhesive force between the residual glue and the adherend is reduced while ensuring the integrity of the adherend.
  • the adhesion between the adhesive member and the residual glue is tested, and at the same time, the adhesive piece and / or adherend is tested to ensure that when the adhesive piece and / or adherend is not damaged, It is possible to increase the adhesive force between the adhesive part and the residual glue to the greatest extent, and reduce the adhesive force between the residual glue and the adhered part.
  • the adhesive force between the adhesive member and the residual glue is greater than the adhesive force between the residual glue and the adherend, and the The tensile strength of the adhesive member is greater than the preset value.
  • the preset heating temperature the residual glue is heated, and the adhesive member is pulled to remove the residual glue from the adherend under the action of the adhesion of the adhesive member, thereby achieving the complete removal of the residual glue, and this
  • the degumming method of the application example does not cause any damage to the adherend, has low cost, simple and easy operation, strong operability, and short time consumption, thereby improving the degumming efficiency.
  • FIG. 6 is a schematic flow chart of a method for removing glue provided in Embodiment 2 of the present application. Based on the foregoing embodiment, if this embodiment includes multiple candidate adhesive members, the method in this embodiment may include:
  • S602 According to the parameter information of the residual glue, select a viscous piece that matches the parameter information from a plurality of candidate viscous pieces.
  • the degumming equipment includes a detection device, which can detect the residual glue to obtain parameter information such as the size information and / or viscosity parameters of the residual glue.
  • the embodiment of the present application involves multiple candidate adhesive pieces, according to the parameter information of the residual glue, select one of the multiple candidate adhesive pieces that meets the parameter information of the residual glue, and use the adhesive piece to bond the residual glue To peel off the residual glue from the adherend.
  • the residual glue on the adherend detects the residual glue on the adherend to obtain the parameter information of the residual glue.
  • the size information such as the surface area and thickness of the residual glue is detected, and / or the viscosity parameter of the residual glue, such as the type of the residual glue, the adhesion between the residual glue and the adherend, is detected.
  • the size information of the residual glue can be directly obtained by using the relevant size detection device.
  • the viscosity parameters of the residual glue can also be obtained by means of professional testing equipment.
  • the viscosity parameter of the residual glue can also be determined by the factory data of the residual glue and the material of the adherend. Since the material of the adherend is different, the adhesion between it and the residual glue will also be different. In this way, the adhesion between the residual glue and the adherend can be determined by detecting the material of the adherend. For example, testing the material of the adherend to determine whether the material of the adherend is plastic, glass, or metal, etc. Then, in the factory data of the residual glue, the correspondence between the adhesive force of the residual glue and different materials is obtained. And with the passage of time, the change of the adhesive force data can get the adhesive force between the residual glue and the adherend, and then obtain the viscosity parameter of the residual glue.
  • a viscous piece conforming to the parameter information is determined from a plurality of candidate viscous pieces.
  • the adhesive pieces that meet the parameter information are determined from a plurality of candidate adhesive pieces, Can include:
  • the size parameter of the residual glue select a viscous piece conforming to the size parameter from a plurality of candidate viscous pieces.
  • the size parameters of the plurality of candidate adhesive members may be different.
  • one adhesive member having a size parameter consistent with the size parameter of the residual glue may be selected from the plurality of candidate adhesive members.
  • the width of the residual glue detected in this embodiment is 3 mm
  • the plurality of candidate adhesive pieces in this embodiment are 3 different sizes of rollable glue, which are rollable glue 1, rollable glue 2, and rollable glue 3, respectively.
  • the width of the roll-top glue 2 is exactly 3mm, so you can choose the roll-top glue 2 as a sticky piece to remove the residual glue on the adherend.
  • the adhesive piece that matches the parameter information is determined from a plurality of candidate adhesive pieces according to the parameter information of the residual glue , which can include:
  • the viscosity parameter of the residual glue select a viscous piece that meets the viscosity parameter from a plurality of candidate viscous pieces.
  • the viscosity parameters of the plurality of candidate adhesive parts may be different.
  • one of the plurality of candidate adhesive pieces can be selected to be a viscosity member that matches the viscosity parameter of the residual glue, that is, the selected viscosity member
  • the adhesive force with the residual glue is greater than the adhesive force between the residual glue and the adherend.
  • the adhesive force between the residual glue and the adherend detected in this embodiment is 50N / 100m 2
  • the multiple candidate adhesive members in this embodiment are 3 types of easy-adhesive adhesives with different adhesive strengths, respectively Glue 1, Glue 2 and Glue 3, of which the adhesion between the Glue 2 and the residual glue is 50N / 100m 2 , so that the Glue 2 can be selected as the sticky piece to remove the Residual glue on stickies.
  • the adhesive pieces satisfying the requirements are obtained from a plurality of candidate adhesive pieces to remove the residual glue, thereby achieving the accuracy of the adhesive pieces , Quick determination, and further improve the efficiency of glue removal.
  • the embodiment of the present application can determine the good adhesive parts without contacting with the adherend by the above method, compared to pasting the candidate adhesive parts one by one on the residual glue, and pulling the test separately to determine the adhesive parts
  • the method can effectively reduce the damage to the adherend.
  • the residual glue and the adherend are heated first to reduce the adhesive force between the residual glue and the adherend, and then, the selected adhesive member is adhered to the residual glue.
  • the specific process please refer to the description of the above embodiment, which will not be repeated here.
  • S605 Pull the adhesive member to remove the residual glue from the adherend under the action of adhesion of the adhesive member.
  • any glue angle obtained by experience can be selected to pull the adhesive member.
  • the residual glue can be efficiently peeled off from the adherend, and the angle of the glue is determined in advance, wherein, as shown in FIG. 4, the angle of the glue is the distance between the viscous member and the adherend The angle ⁇ between.
  • the adherend is fixed, and the adhesive member is pulled according to the preset pulling angle to quickly and completely peel off the residual adhesive from the adherend under the action of adhesion of the adhesive member, and the adhesive member does not break.
  • the above-mentioned preset glue pulling angle may be between 10 ° and 80 °, which is determined according to actual requirements, for example, 45 °.
  • the parameter information of the residual glue is obtained, and according to the parameter information of the residual glue, a viscous piece matching the parameter information of the residual glue is selected from a plurality of candidate adhesive pieces.
  • the adhesive member can be quickly and accurately determined, and the adhesive member can be used to completely remove the residual glue on the adherend, which further improves the efficiency and reliability of removing glue, and can prevent damage to the adherend.
  • FIGS. 3 and 6 are described by taking the execution body as the degumming device as an example.
  • the degumming method provided by the embodiment of the present application can also be used as a guide book to instruct the operator to complete the degumming. 7 shown.
  • FIG. 7 is a schematic flowchart of a method for removing glue provided by an embodiment of the present application. As shown in FIG. 7, the method of this embodiment may include:
  • the operator uses a heating device to heat the residual glue according to a preset heating temperature.
  • the operator first sticks the adhesive piece to the residual glue of the adherend, and then, according to the preset heating temperature, uses a heating device to heat the residual glue, the adherend and the adhesive piece to increase the adhesive piece and The adhesive force between the residual glue and reduce the adhesive force between the residual glue and the adhered part; or, use the heating device to heat the residual glue and the adherend to increase the adhesion between the adhesive part and the residual glue Heli. Then, pull the adhesive piece to completely peel off the residual glue from the adherend, thereby improving the efficiency of removing glue.
  • the heating device of this embodiment has a heating accommodating cavity.
  • the operator may place the residual glue, the adherend and the viscous part in the heating accommodating cavity of the heating device for heating. Or, the operator places the residual glue and the adherend in the heating accommodating cavity of the heating device to heat.
  • the heating device in this embodiment may be a hot hair dryer.
  • the operator may use the hot hair dryer to heat the residual glue, the adherend and the sticky piece.
  • the operator uses a hot air blower to heat the residual glue and the adherend.
  • the operator sticks the adhesive piece to the residual glue of the adherend, and uses a heating device to heat the residual glue, and finally pulls the adhesive piece, so that the adhesion of the adhesive piece
  • the residual glue is removed from the adherend, so that the complete removal of the residual glue is achieved, and the whole process is simple, which improves the efficiency of the operator to remove the glue, and facilitates the maintenance and repair of the parts of the product where the adherend is located use.
  • the operator can also use the detection device to detect the residual glue to obtain the parameter information of the residual glue, so that the operator can select the viscosity that meets the parameter information from multiple candidate adhesive pieces according to the parameter information of the residual glue Pieces.
  • the operator sticks the selected adhesive piece to the residual glue of the adherend, and uses the heating device to heat the residual glue, and finally pulls the adhesive piece to remove the residual glue from the adhesive under the adhesion of the adhesive piece Remove the sticky matter, and then completely remove the residual glue.
  • the operator may also use a detection device to detect the residual glue, and the detection device may obtain the parameter information of the residual glue, and according to the parameter information of the residual glue, select from a plurality of candidate adhesive pieces in accordance with the parameter information
  • the sticky piece is displayed to the operator.
  • the operator sticks the selected adhesive piece to the residual glue of the adherend, and uses the heating device to heat the residual glue, and finally pulls the adhesive piece to remove the residual glue from the adhesive under the adhesion of the adhesive piece Remove the sticky matter, and then completely remove the residual glue.
  • the operator can use the detection device to detect the residual glue to select the adhesive pieces that meet the requirements from the multiple candidate adhesive pieces.
  • the specific process can refer to the embodiment shown in FIG. 6 above, which will not be repeated here.
  • FIG. 8 is a schematic structural diagram of a degumming device according to Embodiment 1 of the present application. Based on the foregoing embodiment, this embodiment also provides a degumming device 100.
  • the degumming device 100 can implement the above degumming method. step.
  • the glue removing apparatus 100 of this embodiment may include: a glue machine 110, a glue machine 120, and a heating device 130;
  • the viscose machine 110 is used to paste the viscous parts on the residual glue of the adherend;
  • the heating device 130 is configured to heat the residual glue according to a preset heating temperature
  • the glue pulling machine 120 is used to pull the adhesive member to remove the residual glue from the adherend under the adhesion of the adhesive member.
  • the glue removing device of the embodiment of the present application may be used to execute the technical solutions of the above method embodiments, and the implementation principles and technical effects are similar, and will not be repeated here.
  • the heating device 130 is specifically configured to perform the operation on the adhesive member, the adhesive residue, and the adherend adhered to the adhesive residue according to the preset heating temperature heating.
  • the heating device 130 is specifically configured to heat the residual glue and the adherend according to the preset heating temperature.
  • the above-mentioned glue machine 110 is specifically used for pasting the sticky piece on the residual glue after heating.
  • the glue removing device of this embodiment further includes: a detection device 140;
  • the detection device 140 is used to detect the residual glue before the adhesive machine 110 pastes the adhesive on the heated residual glue, obtain the parameter information of the residual glue, and according to the residual glue Parameter information, select a viscous piece that matches the parameter information from a plurality of candidate viscous pieces.
  • the detection device 140 is specifically configured to detect the size parameter of the residual glue, and according to the size parameter of the residual glue, select a viscous piece conforming to the size parameter from a plurality of candidate viscous pieces.
  • the detection device 140 is specifically configured to detect the viscosity parameter of the residual glue, and according to the viscosity parameter of the residual glue, select a viscous piece that meets the viscosity parameter from a plurality of candidate viscous pieces .
  • the above-mentioned glue pulling machine 120 is specifically used to pull the adhesive member according to a preset glue pulling angle, wherein the glue pulling angle is an angle between the adhesive member and the adherend .
  • the above-mentioned preset glue pulling angle is between 10 ° and 80 °.
  • the above-mentioned adhesive member may be roll-top glue.
  • the degumming equipment of the embodiments of the present application may be used to execute the technical solutions of the above method embodiments, and the implementation principles and technical effects are similar, and will not be repeated here.
  • FIG. 10 is a schematic structural diagram of a control device of a glue removing device according to an embodiment of the present application.
  • the control device 200 of the glue removing device of this embodiment includes:
  • the memory 210 is used to store a computer program
  • the processor 220 is configured to execute the computer program to control the glue removing device to implement the glue removing method shown in FIG. 3 and / or FIG. 6.
  • control device of the degumming equipment may be used to control the degumming equipment to execute the technical solutions of the foregoing method embodiments.
  • the implementation principles and technical effects are similar, and details are not described herein again.
  • the device 100 exists in the form of a chip product.
  • the structure of the device includes a processor 320 and a memory 310.
  • the memory 310 is used to couple with the processor 320.
  • the memory 310 stores necessary program instructions and data of the device.
  • the device 320 is used to execute the program instructions stored in the memory 310, so that the device performs the functions of the foregoing method embodiments.
  • the device of the embodiment of the present application may be used to execute the technical solution of the control device of the glue removing device in the above method embodiments, and its implementation principles and technical effects are similar, and will not be repeated here.
  • the present application also provides a computer storage medium.
  • the storage medium includes a computer program, and the computer program is used to implement the glue removing method in any of the embodiments shown in FIG. 3 and / or FIG. 6 described above.
  • the present application also provides a computer program product, the computer program product including computer program code, when the computer program code runs on a computer, causes the computer to perform any of the implementations shown in FIG. 3 and / or FIG. 6 described above Example of glue removal method.
  • the processors involved in the embodiments of the present application may be general-purpose processors, digital signal processors, application specific integrated circuits, field programmable gate arrays or other programmable logic devices, discrete gates or transistor logic devices, and discrete hardware components, which may be implemented or Perform the disclosed methods, steps, and logical block diagrams in the embodiments of the present application.
  • the general-purpose processor may be a microprocessor or any conventional processor.
  • the steps of the method disclosed in conjunction with the embodiments of the present application may be directly embodied and executed by a hardware processor, or may be executed and completed by a combination of hardware and software modules in the processor.
  • the memory involved in the embodiment of the present application may be a non-volatile memory, such as a hard disk (HDD) or a solid-state drive (SSD), etc., or a volatile memory (volatile memory), for example Random access memory (random-access memory, RAM).
  • the memory is any other medium that can be used to carry or store desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto.
  • the disclosed device and method may be implemented in other ways.
  • the device embodiments described above are only schematic.
  • the division of the units is only a division of logical functions.
  • there may be other divisions for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place or may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware, or in the form of hardware plus software functional units.
  • the computer program product includes one or more computer instructions.
  • the computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices.
  • the computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be from a website site, computer, server or data center Transmit to another website, computer, server or data center by wired (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.).
  • the computer-readable storage medium may be any available medium that can be accessed by a computer or a data storage device including a server, a data center, and the like integrated with one or more available media.
  • the available media may be magnetic media (eg, floppy disk, hard disk, magnetic tape), optical media (eg, DVD), or semiconductor media (eg, Solid State Disk (SSD)), and the like.

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne un procédé et un appareil d'élimination d'adhésif, et un dispositif de commande. Le procédé d'élimination d'adhésif peut comprendre les étapes consistant à : faire adhérer un élément adhésif sur un résidu adhésif d'un objet collé, la force d'adhérence entre l'élément adhésif et le résidu adhésif étant supérieure à la force d'adhérence entre le résidu adhésif et l'objet collé, et une résistance à la traction de l'élément adhésif étant supérieure à une valeur prédéfinie; chauffer le résidu adhésif à une température de chauffage prédéfinie; puis tirer sur l'élément adhésif, de façon à éliminer le résidu adhésif de l'objet collé sous l'action d'adhérence de l'élément adhésif, et effectuer l'élimination complète du résidu adhésif. Le procédé d'élimination d'adhésif n'entraîne pas de dommage sur l'objet collé, et son coût est faible; et le procédé est facilement mis en oeuvre, présente une haute efficacité fonctionnelle, et le temps de réalisation est court, ce qui améliore l'efficacité d'élimination de l'adhésif.
PCT/CN2018/110513 2018-10-16 2018-10-16 Procédé et appareil d'élimination d'adhésif, et dispositif de commande WO2020077542A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2018/110513 WO2020077542A1 (fr) 2018-10-16 2018-10-16 Procédé et appareil d'élimination d'adhésif, et dispositif de commande
CN201880097505.0A CN112689540A (zh) 2018-10-16 2018-10-16 除胶方法、设备与控制装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/110513 WO2020077542A1 (fr) 2018-10-16 2018-10-16 Procédé et appareil d'élimination d'adhésif, et dispositif de commande

Publications (1)

Publication Number Publication Date
WO2020077542A1 true WO2020077542A1 (fr) 2020-04-23

Family

ID=70283705

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/110513 WO2020077542A1 (fr) 2018-10-16 2018-10-16 Procédé et appareil d'élimination d'adhésif, et dispositif de commande

Country Status (2)

Country Link
CN (1) CN112689540A (fr)
WO (1) WO2020077542A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113426762A (zh) * 2021-06-08 2021-09-24 咸阳隆基乐叶光伏科技有限公司 一种高温布清洁装置及高温布的清洁方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113791503A (zh) * 2021-09-13 2021-12-14 信利光电股份有限公司 一种lcd盲孔内热熔胶的去除方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001078910A1 (fr) * 2000-04-17 2001-10-25 Dandy A/S Appareil pour nettoyer les surfaces de petites formations et utilisation de cet appareil
CN104690012A (zh) * 2015-02-12 2015-06-10 吴中区甪直渡岘工艺品厂 一种除胶机
CN205128522U (zh) * 2015-11-24 2016-04-06 昆山龙腾光电有限公司 一种自动清胶装置
CN105921465A (zh) * 2016-06-22 2016-09-07 京东方科技集团股份有限公司 清胶装置
CN205684430U (zh) * 2016-06-22 2016-11-16 京东方科技集团股份有限公司 清胶装置
CN205701717U (zh) * 2016-05-11 2016-11-23 深圳市优米佳自动化设备有限公司 一种除胶轮清洁装置及一种除胶机
CN107124486A (zh) * 2017-04-21 2017-09-01 奇酷互联网络科技（深圳）有限公司 一种移动终端的固定机构、装配方法以及移动终端
CN108816962A (zh) * 2018-07-16 2018-11-16 厦门长江电子科技有限公司 一种用于显示屏的清胶设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642550A (en) * 1994-02-28 1997-07-01 Ricoh Company, Ltd. Apparatus for removing image forming substance from image holding member
JPH08115896A (ja) * 1994-10-13 1996-05-07 Nitto Denko Corp 半導体ウエハに付着した異物の除去用粘着テ―プと除去方法
DE20109063U1 (de) * 2001-02-16 2001-08-30 Hermann Werner Vorrichtung zum Abziehen von Haftetiketten
JP2014036928A (ja) * 2012-08-16 2014-02-27 Citizen Holdings Co Ltd 異物除去装置
CN206416638U (zh) * 2017-01-05 2017-08-18 京东方科技集团股份有限公司 一种导电胶的剥离装置及贴附装置
CN107116069A (zh) * 2017-04-18 2017-09-01 志圣科技（广州）有限公司 一种刮胶预热装置
CN206935851U (zh) * 2017-09-08 2018-01-30 河南裕展精密科技有限公司 除胶机构
CN207817350U (zh) * 2018-01-05 2018-09-04 合肥京东方显示技术有限公司 一种剥胶设备及胶带贴附系统

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001078910A1 (fr) * 2000-04-17 2001-10-25 Dandy A/S Appareil pour nettoyer les surfaces de petites formations et utilisation de cet appareil
CN104690012A (zh) * 2015-02-12 2015-06-10 吴中区甪直渡岘工艺品厂 一种除胶机
CN205128522U (zh) * 2015-11-24 2016-04-06 昆山龙腾光电有限公司 一种自动清胶装置
CN205701717U (zh) * 2016-05-11 2016-11-23 深圳市优米佳自动化设备有限公司 一种除胶轮清洁装置及一种除胶机
CN105921465A (zh) * 2016-06-22 2016-09-07 京东方科技集团股份有限公司 清胶装置
CN205684430U (zh) * 2016-06-22 2016-11-16 京东方科技集团股份有限公司 清胶装置
CN107124486A (zh) * 2017-04-21 2017-09-01 奇酷互联网络科技（深圳）有限公司 一种移动终端的固定机构、装配方法以及移动终端
CN108816962A (zh) * 2018-07-16 2018-11-16 厦门长江电子科技有限公司 一种用于显示屏的清胶设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113426762A (zh) * 2021-06-08 2021-09-24 咸阳隆基乐叶光伏科技有限公司 一种高温布清洁装置及高温布的清洁方法
CN113426762B (zh) * 2021-06-08 2023-01-06 咸阳隆基乐叶光伏科技有限公司 一种高温布清洁装置及高温布的清洁方法

Also Published As

Publication number Publication date
CN112689540A (zh) 2021-04-20

Similar Documents

Publication Publication Date Title
WO2020077542A1 (fr) Procédé et appareil d'élimination d'adhésif, et dispositif de commande
TWI546708B (zh) 觸控顯示裝置的製造方法
CN104369900B (zh) 一种贴膜机
TW201327136A (zh) 伺服器測試系統及伺服器穩定性測試方法
WO2020258762A1 (fr) Procédé de liaison de panneau d'affichage incurvé
CN107608847B (zh) 电子设备及其控制方法和控制装置
CN101303463A (zh) 触摸屏显示装置及其制作方法
CN103345077B (zh) 液晶显示模组的质量检测装置及其使用方法
CN105183631A (zh) 设备测试方法及装置
CN104576990A (zh) 电池固定装置、电池可拆卸结构及终端
CN111239617A (zh) 充放电测试的控制方法、装置、存储介质及系统
CN204808278U (zh) 面板模块及触控屏
TW201113697A (en) Test device
TW201028698A (en) Testing device and automation method thereof
TW201346536A (zh) 開關機測試系統及方法
WO2017096950A1 (fr) Système et procédé d'assemblage de dispositif de terminal mobile
TWI410838B (zh) 臨界值補償方法
CN207817350U (zh) 一种剥胶设备及胶带贴附系统
CN106775105A (zh) 一种触显产品及其制作方法
JP6115334B2 (ja) 表示装置の製造方法および製造装置
CN112788640B (zh) 通信设备测试方法、装置、存储介质及终端
CN104582386B (zh) 电子装置与其元件拆卸方法
CN105430139A (zh) 一种电子设备及其应用的录音方法
CN104942527B (zh) 一种集成芯片拔除机及其使用方法
CN206411613U (zh) 便捷控制电脑开机功能的键盘

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18937519

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18937519

Country of ref document: EP

Kind code of ref document: A1