WO2020069467A1 - Micro-dispositifs électroluminescents - Google Patents
Micro-dispositifs électroluminescents Download PDFInfo
- Publication number
- WO2020069467A1 WO2020069467A1 PCT/US2019/053694 US2019053694W WO2020069467A1 WO 2020069467 A1 WO2020069467 A1 WO 2020069467A1 US 2019053694 W US2019053694 W US 2019053694W WO 2020069467 A1 WO2020069467 A1 WO 2020069467A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- led
- leds
- flat region
- contact
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
Abstract
L'invention concerne des techniques, des dispositifs et des systèmes qui comprennent des DEL dotés d'une première région plate, à une première hauteur à partir d'une base de DEL et comprenant une pluralité de couches épitaxiales comprenant une première couche n, une première couche active et une première couche p. Une seconde région plate est pourvue, à une seconde hauteur à partir de la base de DEL et parallèle à la première région plate, et comprend au moins une seconde couche n. Une paroi latérale inclinée reliant la première région plate et la seconde région plate est pourvue et comprend au moins une troisième couche n, la première couche n étant plus épaisse qu'au moins une partie de la troisième couche n. Un contact p est formé sur la première couche p et un contact n formé sur la seconde couche n.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/144,751 | 2018-09-27 | ||
US16/144,751 US10811460B2 (en) | 2018-09-27 | 2018-09-27 | Micrometer scale light emitting diode displays on patterned templates and substrates |
EP18209260 | 2018-11-29 | ||
EP18209260.1 | 2018-11-29 | ||
US16/584,941 US10923628B2 (en) | 2018-09-27 | 2019-09-26 | Micrometer scale light emitting diode displays on patterned templates and substrates |
US16/584,941 | 2019-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020069467A1 true WO2020069467A1 (fr) | 2020-04-02 |
Family
ID=68208354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2019/053694 WO2020069467A1 (fr) | 2018-09-27 | 2019-09-27 | Micro-dispositifs électroluminescents |
Country Status (2)
Country | Link |
---|---|
TW (2) | TWI804685B (fr) |
WO (1) | WO2020069467A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112669715A (zh) * | 2020-12-24 | 2021-04-16 | 深圳市华星光电半导体显示技术有限公司 | 连接件、显示面板及其制作方法、显示装置 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040129929A1 (en) * | 2002-09-06 | 2004-07-08 | Hiroyuki Okuyama | Semiconductor light emitting device and fabrication method thereof, integral type semiconductor light emitting unit and fabrication method thereof, image display unit and fabrication method thereof, and illuminating unit and fabrication method thereof |
US20070200135A1 (en) * | 2006-01-12 | 2007-08-30 | National Institute Of Advanced Industrial Science And Technology | III-V group compound semiconductor light-emitting diode |
WO2008091846A2 (fr) * | 2007-01-22 | 2008-07-31 | Cree Led Lighting Solutions, Inc. | Systèmes d'éclairage employant des réseaux connectés de façon externe de dispositifs luminescents et procédé de fabrication de ces dispositifs |
US20090032799A1 (en) * | 2007-06-12 | 2009-02-05 | Siphoton, Inc | Light emitting device |
US20100264441A1 (en) * | 2009-04-16 | 2010-10-21 | Yu-Sik Kim | Light emitting element and fabricating method thereof |
US20120074441A1 (en) * | 2010-09-24 | 2012-03-29 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
WO2012059837A1 (fr) * | 2010-11-04 | 2012-05-10 | Koninklijke Philips Electronics N.V. | Dispositifs électroluminescents à semi-conducteur formés à partir de structures de configuration cristallographique lâche |
US20140166974A1 (en) * | 2012-12-14 | 2014-06-19 | Samsung Electronics Co., Ltd. | Nano-structured light-emitting devices |
US20160197232A1 (en) * | 2015-01-06 | 2016-07-07 | Apple Inc. | Led structures for reduced non-radiative sidewall recombination |
US20170012175A1 (en) * | 2015-07-06 | 2017-01-12 | Lextar Electronics Corporation | Light-emitting element and light-emitting device |
US20180182275A1 (en) * | 2016-12-23 | 2018-06-28 | Intel Corporation | Monolithic micro led display |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8794501B2 (en) * | 2011-11-18 | 2014-08-05 | LuxVue Technology Corporation | Method of transferring a light emitting diode |
-
2019
- 2019-09-27 WO PCT/US2019/053694 patent/WO2020069467A1/fr active Application Filing
- 2019-09-27 TW TW108135330A patent/TWI804685B/zh active
- 2019-09-27 TW TW112109705A patent/TW202329444A/zh unknown
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040129929A1 (en) * | 2002-09-06 | 2004-07-08 | Hiroyuki Okuyama | Semiconductor light emitting device and fabrication method thereof, integral type semiconductor light emitting unit and fabrication method thereof, image display unit and fabrication method thereof, and illuminating unit and fabrication method thereof |
US20070200135A1 (en) * | 2006-01-12 | 2007-08-30 | National Institute Of Advanced Industrial Science And Technology | III-V group compound semiconductor light-emitting diode |
WO2008091846A2 (fr) * | 2007-01-22 | 2008-07-31 | Cree Led Lighting Solutions, Inc. | Systèmes d'éclairage employant des réseaux connectés de façon externe de dispositifs luminescents et procédé de fabrication de ces dispositifs |
US20090032799A1 (en) * | 2007-06-12 | 2009-02-05 | Siphoton, Inc | Light emitting device |
US20100264441A1 (en) * | 2009-04-16 | 2010-10-21 | Yu-Sik Kim | Light emitting element and fabricating method thereof |
US20120074441A1 (en) * | 2010-09-24 | 2012-03-29 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
WO2012059837A1 (fr) * | 2010-11-04 | 2012-05-10 | Koninklijke Philips Electronics N.V. | Dispositifs électroluminescents à semi-conducteur formés à partir de structures de configuration cristallographique lâche |
US20140166974A1 (en) * | 2012-12-14 | 2014-06-19 | Samsung Electronics Co., Ltd. | Nano-structured light-emitting devices |
US20160197232A1 (en) * | 2015-01-06 | 2016-07-07 | Apple Inc. | Led structures for reduced non-radiative sidewall recombination |
US20170012175A1 (en) * | 2015-07-06 | 2017-01-12 | Lextar Electronics Corporation | Light-emitting element and light-emitting device |
US20180182275A1 (en) * | 2016-12-23 | 2018-06-28 | Intel Corporation | Monolithic micro led display |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112669715A (zh) * | 2020-12-24 | 2021-04-16 | 深圳市华星光电半导体显示技术有限公司 | 连接件、显示面板及其制作方法、显示装置 |
Also Published As
Publication number | Publication date |
---|---|
TW202030881A (zh) | 2020-08-16 |
TWI804685B (zh) | 2023-06-11 |
TW202329444A (zh) | 2023-07-16 |
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