Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/50—Substrate holders
  • C23C14/505—Substrate holders for rotation of the substrates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Definitions

• Embodiments of the present disclosure relate to an in-line substrate processing system.
• Embodiments of the present disclosure particularly relate to a mask handling module for an in-line substrate processing system, a vacuum processing system for in-line processing of a substrate, and a method for mask transfer, e.g. in a method of in-line material deposition on a substrate or a method of substrate processing.
• OLED Organic light-emitting diodes
• the emissive layer includes a thin-film of certain organic compounds.
• OLEDs are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc. for displaying information.
• OLEDs can also be used for general space illumination.
• the range of colors and brightness possible with OLED displays is greater than that of traditional LCD displays because OLED material directly emit light.
• the energy consumption of OLED displays is considerably less than that of traditional LCD displays.
• a typical OLED display may include layers of organic material situated between two electrodes, for example electrodes from a metallic material.
• the OLED is typically placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein.
• the OLED can be encapsulated with thin film technology, e.g. with a barrier film.
• a process to manufacture OLED displays includes thermal evaporation of organic materials and deposition of organic materials on a substrate in a high vacuum. It is beneficial to complement this process with the use of a mask in order to pattern the organic layers onto the substrate during deposition.
• the mask is held close to the substrate during deposition of the organic layers and the substrate is typically arranged behind the mask during deposition and aligned relative to the mask.
• the need of the mask during the deposition of organic materials increases the complexity of an OLED display manufacturing process. For instance, before deposition of the organic materials, a mask has to be transferred into an OLED display manufacturing system, which is in a high vacuum. Further, as any particle generation can deteriorate the OLED display manufacturing system, the transfer of the mask into the OLED display manufacturing system has to be conducted with reduced or minimized particle generation. Yet, further mask handling in a processing system may significantly influence the cost of ownership of the system.
• a mask handling module for an in-line substrate processing system aims to simplify a transport of a clean, unused mask into an in-line substrate processing system. Therefore, the footprint of an in-line substrate processing system on the substrates is reduced. Further, the present disclosure aims to facilitate a reuse of a mask after deposition of materials, such as organic or metallic materials, on a substrate without interrupting an in-line substrate processing system. Furthermore, the present disclosure aims to ease the transport of a mask in an in-line substrate processing system. Additionally, the present disclosure aims to help in removing used masks from an in-line substrate processing system at regular time intervals, e.g. for cleaning the masks or for exchanging the masks.
• a mask handling module for an in line substrate processing system includes a vacuum rotation chamber provided within the in-line substrate processing system between a first vacuum chamber and a second vacuum chamber. Further, the mask handling module includes a rotation mechanism within the vacuum rotation chamber. Furthermore, the mask handling module includes a first mask stage having a first mask holder assembly and mounted to the rotation mechanism for rotation of the first mask stage. Moreover, the mask handling module includes a second mask stage having a second mask holder assembly and mounted to the rotation mechanism for rotation of the second mask stage. In addition, the mask handling module includes a mask handling assembly configured for a first mask transfer between the first mask stage and a mask handling chamber.
• the mask handling module includes a first substrate transportation track associated with the first mask stage and configured to support a first substrate carrier, the first mask holder assembly being configured for a second mask transfer between the first mask stage and the first substrate carrier. Furthermore, the mask handling module includes a second substrate transportation track associated with the second mask stage and configured to support a second substrate carrier.
• a vacuum processing system for in-line processing of a substrate.
• the vacuum processing system includes a mask handling module according to embodiments of the present disclosure, a substrate loading region, and a processing region.
• a method for mask transfer in a vacuum processing system includes transporting a first substrate carrier into a vacuum rotation chamber, transferring a first mask supported by a first mask holder assembly from a first mask stage to the first substrate carrier, transporting the first substrate carrier out of the vacuum rotation chamber, and rotating a rotation mechanism supporting the first mask stage in the vacuum rotation chamber by an angle of about 180°.
• a method for mask transfer in a vacuum processing system includes transporting a first substrate carrier into a vacuum rotation chamber along a first direction; transporting a second substrate carrier into the vacuum rotation chamber along a second direction opposite to the first direction; transferring a first mask supported by a first mask holder assembly from a first mask stage to the first substrate carrier; transferring a second mask supported by the second substrate carrier from the second substrate carrier to a second mask stage; transporting the first substrate carrier out of the vacuum rotation chamber along the first direction; and transporting the second substrate carrier out of the vacuum rotation chamber along the second direction.
• the methods for mask transfer in a vacuum processing system can be included in methods for substrate processing and/or methods for material deposition on a substrate, e.g. in a vacuum processing system.
• FIG. 1A shows a schematic cross-sectional top view of a mask handling module for an in- line substrate processing system according to embodiments described herein;
• FIG. 1B shows a schematic cross-sectional side view of a mask handling module for an in line substrate processing system according to embodiments described herein;
• FIG. 1C shows a schematic cross-sectional view of a section of a mask handling module for an in-line substrate processing system according to embodiments described herein
• FIGS. 2 shows a schematic cross-sectional top view of a mask handling module for an in line substrate processing system according to further embodiments described herein;
• FIG. 3 shows a flowchart illustrating a method for mask transfer and/or a method for an in-line material deposition on a substrate according to embodiments described herein;
• FIGS. 4 A to 4D show schematic cross-sectional top views of a section of a vacuum rotation chamber for an in-line substrate processing system during transport of a first substrate carrier and a second substrate carrier into a vacuum rotation chamber, transfer of a first mask from a first mask stage to the first substrate carrier, transfer of a second mask from the second substrate carrier to a second mask stage, and transport of the first and the second substrate carriers out of the vacuum rotation chamber according to embodiments described herein;
• FIG. 5 shows schematic cross-sectional top views of a section of a vacuum rotation chamber for an in-line substrate processing system during rotation of a rotation mechanism supporting a first mask stage in the vacuum rotation chamber by an angle of about 180° according to embodiments described herein;
• FIG. 6 shows schematic cross-sectional top views of a section of a vacuum rotation chamber for an in-line substrate processing system during rotation of a rotation mechanism supporting a first mask stage and a second mask stage in the vacuum rotation chamber by an angle of about 90° according to embodiments described herein;
• FIG. 7 shows a schematic top view of a vacuum processing system for in-line processing of a substrate according to embodiments described herein.
• a process to manufacture OLED displays can include thermal evaporation of organic materials and deposition of organic materials on a substrate in a high vacuum.
• the use of a mask for patterning the organic layers onto the substrate during deposition may be provided.
• OLED display manufacturing processes with the utilization of a mask may be complex, for instance, due to additional processes to be accomplished in order to transfer a mask into the OLED display manufacturing system, which is in a high vacuum.
• the transfer of the mask into the OLED display manufacturing system has to be conducted with reduced or minimized particle generation.
• Embodiments of the present disclosure relate to a mask handling module for an in line substrate processing system, a vacuum processing system for in-line processing of a substrate, and a method for mask transfer.
• the in-line substrate processing system can be a display manufacturing system or a part of a display manufacturing system, in particular an OLED display manufacturing system, and more particularly an OLED display manufacturing system for large area substrates.
• the transport of a mask or substrate carrier i.e. the movement of a substrate carrier through the in-line substrate processing system can inter alia be provided in a vertical orientation state of the substrate carrier.
• substrate carriers can be configured to hold a substrate, such as a glass plate, in a vertical orientation state.
• a mask may include a mask frame. Further, the mask may include a sheet with an opening or a plurality of openings that is held by the mask frame.
• the mask frame may be configured for supporting and holding the sheet which may particularly be a delicate component.
• the mask frame may surround the sheet.
• the sheet may be permanently fixed to the mask frame, e.g. by welding, or the sheet may be releasably fixed to the mask frame. A circumferential edge of the sheet may be fixed to the mask frame.
• a mask stage may be configured to hold a mask by any means e.g. through the use of a mechanical holder, an electromagnetic holder, and/or an electropermanent holder.
• the mask may include an opening or a plurality of openings which may be formed in a pattern for depositing a corresponding material pattern on a substrate by a masked deposition process.
• the mask may be arranged at a close distance in front of the substrate or in direct contact with the front surface of the substrate.
• the mask may be , e.g. an edge exclusion mask or a mask separating two or more devices manufactured on a large area display.
• the mask may be at least partially made of a metal, e.g. of a metal with a small thermal expansion coefficient such as invar.
• the mask may include a magnetic material so that the mask can be magnetically attracted toward the substrate during deposition.
• the mask and/or the mask frame may include a magnetic material so that the mask and/or the mask frame can be attracted to a mask stage or to a substrate carrier by magnetic forces.
• the substrate carriers can be configured for holding or supporting the substrate or the substrate and the mask in a substantially vertical orientation.
• a mask stage can be configured for holding or supporting the mask in a substantially vertical orientation.
• substantially vertical is understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction or orientation of ⁇ 20° or below, e.g. of ⁇ 10° or below. This deviation can be provided for example because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position. Further, fewer particles reach the substrate surface when the substrate is tilted forward.
• the substrate orientation e.g., during the deposition of materials, such as organic or metallic materials, on a substrate in a high vacuum, is considered substantially vertical, which is considered different from the horizontal substrate orientation, which may be considered as horizontal ⁇ 20° or below.
• a substrate carrier can be an electrostatic chuck (E-chuck) providing an electrostatic force for holding the substrate and optionally the mask at the substrate carrier, and particularly at the support surface.
• the substrate carrier includes an electrode arrangement configured to provide an attracting force acting on the substrate.
• the embodiments described herein can be utilized for deposition of materials, such as organic or metallic materials, on large area substrates, e.g., for OLED display manufacturing.
• the substrates for which the structures and methods according to embodiments described herein are provided may be large area substrates.
• a large area substrate can be GEN 4.5, which corresponds to a surface area of about 0.67 m 2 (0.73 x 0.92m), GEN 5, which corresponds to a surface area of about 1.4 m 2 (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m 2 (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m 2 (2.2 m x 2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m 2 (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of the GEN generations may also be provided in OLED display manufacturing.
• the substrate thickness can be from 0.1 to 1.8 mm.
• the substrate thickness can be about 0.9 mm or below, such as 0.5 mm.
• the term“substrate” as used herein may particularly embrace substantially inflexible substrates, e.g., a glass plate or other substrates. However, the present disclosure is not limited thereto and the term“substrate” may also embrace flexible substrates such as a web or a foil.
• the term“substantially inflexible” is understood to distinguish over“flexible”.
• a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.
• the mask handling module 100 may include a vacuum rotation chamber 110.
• the vacuum rotation chamber can be provided within the in-line substrate processing system between a first vacuum chamber 102 and a second vacuum chamber 104.
• the vacuum rotation chamber 110 can be configured to provide vacuum conditions in the chamber.
• the mask handling module 100 may include a rotation mechanism 112 within the vacuum rotation chamber 110.
• the rotation mechanism 112 may further include a rotating support 118. Furthermore, the rotation mechanism 112 may also include an actuator 120 configured to rotate the rotating support 118 within the vacuum rotation chamber 110.
• the actuator 120 may include a pole 114, such as a center pole including a rotation axis 170.
• the actuator 120 may include a motor 116 to rotate the rotating support 118 via the pole 114. Furthermore, the actuator 120 may actuate the pole 114 in response to energy. Examples of the actuator 120 may include an electric motor, pneumatic actuators, hydraulic actuators, and the like. In particular, the actuator 120 may be configured for providing a rotation of at least 40° of the rotating support 118 in a clockwise and/or an anti- clockwise direction. For example, the actuator 120 may be configured for providing a rotation of 180°.
• the mask handling module 100 may further include a first mask stage 122 and a second mask stage 124.
• the first mask stage 122 may have a first mask holder assembly 132.
• the second mask stage 124 may have a second mask holder assembly 132.
• the first mask holder assembly 132 and/or the second mask holder assembly 132 may include at least one clamp of the group: an electromagnetic clamp, an electropermanent magnetic clamp, and a mechanical clamp.
• the first mask holder assembly 132 may include at least a chucking or clamping device for chucking or clamping a mask to a holding surface of the first mask stage 122.
• the second mask holder assembly 132 may include at least a chucking or clamping device for chucking or clamping a mask to a holding surface of the second mask stage 124.
• the first mask holder assembly 132 may include at least a clamp, particularly a plurality of clamps, for clamping a mask 50 to the first mask stage 122.
• the second mask holder assembly 132 may include at least a clamp, particularly a plurality of clamps, for clamping a mask 50 to the second mask stage 124.
• the first mask holder assembly 132 may include a magnetic chuck for chucking the mask 50 to the first mask stage 122, e.g. an electropermanent magnet arrangement.
• the second mask holder assembly 132 may include a magnetic chuck for chucking the mask 50 to the second mask stage 124, e.g. an electropermanent magnet arrangement.
• the first mask holder assembly 132 and/or the second mask holder assembly 132 may include a clamp actuator configured to move the at least one clamp of the first mask holder assembly 132 and/or the second mask holder assembly 132, respectively, for example horizontally and/or vertically.
• the first mask stage 122 and/or the second mask stage 124 may be configured for supporting the mask 50 in a vertical orientation state.
• the first mask stage 122 may be mounted to the rotation mechanism 112 for rotation of the first mask stage 122.
• the first mask stage 122 may be coupled to the rotating support 118, i.e. may be fixed and/or stationary relative to the rotating support 118. Further, the first mask stage 122 may be mounted to the rotation support 118 in a vertical orientation state.
• the term’’mounted” refers to the state of being fixed or fastened to the rotation mechanism 112 and/or to the rotating support 118 by any fastening means e.g. through the use of a mechanical holder, an electromagnetic holder, and/or an electropermanent holder.
• the first mask stage 122 may be coupled to the rotating support 118 through mask stage supports 128.
• the mask stage supports 128 may be fastened to the rotating support 118 by a fixed mount, such as screws or bolts.
• the second mask stage 124 may be provided similar to the first mask stage.
• the mask handling module 100 may particularly include at least one connecting flange configured for connecting at least one vacuum chamber and/or a transit module.
• the different types of connecting flanges have a casing frame-like structure which may be configured for providing vacuum conditions inside the casing frame-like structure.
• the mask handling module 100 may also include a mask handling assembly 142.
• the mask handling assembly 142 may be positioned in a mask handling chamber 140 attached to the vacuum rotation chamber 110.
• the mask handling chamber 140 can be configured to provide vacuum conditions in the chamber.
• the mask handling assembly 142 may include a vacuum robot with one, two or more individually movable robot hands. Each robot hand may include a mask holding portion configured to grab or support a mask 50. Further, the mask holding portion may be configured to transfer the mask 50 between the vacuum rotation chamber 110 and one or more mask holders (e.g. mask shelfs) in the mask handling chamber 140.
• the mask handling chamber 140 can be configured to transfer a mask 50 from the rotation mechanism 112, e.g. from the first mask stage 122 or from the second mask stage 124. Furthermore, the mask handling chamber 140 can be configured to transfer a mask 50 to the rotation mechanism 112, e.g. to the first mask stage 122 or to the second mask stage 124.
• the vacuum robot may be provided with at least two individually movable mask holding portions. Accordingly, a second mask may be grabbed by the second mask holding portion while a first mask is being unloaded from the first mask stage 122 or loaded to the second mask stage 124 by the first mask holding portion.
• the robot hands may be movable in at least two directions, e.g. vertically and horizontally. For example, the robot hands may be movable up and down. Further, the robot hands may be extendable and retractable relative to a central robot body toward/from the first mask stage 122 or to the second mask stage 124.
• the vacuum robot may be positioned next to the vacuum rotation chamber 110, e.g. the rotation mechanism 112.
• the vacuum robot can be positioned next to the first mask stage 122 and/or to the second mask stage 124.
• the vacuum robot can include two or more robot hands which are rotatable around an axis and include a respective mask holding portion which is movable in a vertical and/or horizontal direction.
• the mask handling assembly 142 may be configured for a first mask transfer between the first mask stage 122 and the mask handling chamber 140.
• the mask handling chamber 140 in particular the mask handling assembly 142, can be configured for loading the mask 50 to the first mask stage 122.
• the mask handling chamber 140 in particular the mask handling assembly 142, can be configured to connect the mask 50 to the first mask stage 122.
• the mask handling chamber 140 in particular the mask handling assembly 142, can be configured to separate the mask 50 from the first mask stage 122.
• the mask handling module 100 may further include a first substrate transportation track 152 associated with the first mask stage 122.
• the first substrate transportation track 152 may be configured to support the first substrate carrier 156.
• the first mask holder assembly 132 may be configured for a second mask transfer between the first mask stage 122 and the first substrate carrier 156.
• the mask 50 may be loaded or transferred from the first mask stage 122 to the first substrate carrier 156.
• the mask handling module 100 may also include a second substrate transportation track 154 associated with the second mask stage 124.
• the second substrate transportation track 154 may be configured to support a second substrate carrier 158.
• the mask 50 may be carried back to the mask handling module 100, for example, to the first mask stage 122 or to the second mask stage 124 by a first substrate carrier 156 or a second substrate carrier 158, respectively. Thereafter, for example, a third mask transfer between the second mask stage 124 and the mask handling chamber 140 may be conducted. Accordingly, the second mask holder assembly 132 may be configured for a third mask transfer between the second mask stage 124 and the mask handling chamber 140. For instance, the mask 50 may be transferred to the mask handling chamber 140, in particular to the mask handling assembly 142, e.g. for cleaning.
• the second mask holder assembly 132 may be configured for a fourth mask transfer between the second mask stage 124 and the second substrate carrier 158.
• the mask 50 may be unloaded or transferred from the second substrate carrier 158 to the second mask stage 124, i.e. after deposition of material, such as an organic material or a metallic material, on a substrate 55 through the mask 50.
• the mask 50 may be subsequently reuse or transfer to the mask handling chamber 140, in particular to the mask handling assembly 142, e.g. for cleaning.
• unloading the mask 50 from the first substrate carrier 156 or the second substrate carrier 158 may include detaching the mask 50 from the first substrate carrier 156 or the second substrate carrier 158, e.g. by releasing a clamp which fixes the mask 50 to the first substrate carrier 156 or the second substrate carrier 158.
• a substrate transportation track can be configured for contactless transportation of a substrate carrier.
• the substrate transportation track can be a first substrate transportation track 152 and/or a second substrate transportation track 154.
• a substrate carrier can be a first substrate carrier 156 and/or a second substrate carrier 158.
• the first substrate transportation track 152 supports the first substrate carrier 156 and the second substrate transportation track 154 supports the second substrate carrier 158.
• the second substrate transportation track 154 can be configured for contactless transportation of a second substrate carrier 158.
• the first substrate transportation track 152 can be configured for contactless transportation of a first substrate carrier 156.
• the second substrate transportation track 154 can be configured for contactless transportation of a second substrate carrier 158.
• the contactless transportation may be a magnetic levitation system.
• the magnetic levitation system may be provided so that at least a part of the weight of the first substrate carrier 156 or the second substrate carrier 158 is carried by the magnetic levitation system.
• the first substrate carrier 156 or the second substrate carrier 158 can then be guided essentially contactlessly along the first substrate transportation track 152 or the second substrate transportation track 154, respectively, through the in-line substrate processing system.
• the first substrate transportation track 152 or the second substrate transportation track 154 may include a carrier holding structure 162 and carrier holding structure 164, respectively, and carrier driving structure 163 and carrier driving structure 165, respectively.
• a carrier holding structure can be configured for a contactless holding a substrate carrier.
• a carrier driving structure can be configured for a contactless translation of a substrate carrier, for example a first substrate carrier 156 or the second substrate carrier 158.
• a carrier holding structure, for instance carrier holding structure 162 and carrier holding structure 164 may include a magnetic levitation system for contactless holding of a substrate carrier.
• a carrier driving structure, for instance carrier driving structure 163 and carrier driving structure 165 may include a magnetic drive system for contactless driving of a substrate carrier.
• a carrier holding structure for instance the carrier holding structures 162 and carrier holding structure 164, can be provided with magnetic elements, such as active magnetic elements.
• the active magnetic elements may be arranged above a substrate carrier, for example, above the first substrate carrier 156 or the second substrate carrier 158.
• a carrier holding structure can pull the substrate carriers, for instance the first substrate carrier 156 or the second substrate carrier 158, from above.
• the active magnetic elements can be controlled to provide a gap between the carrier holding structures and the first substrate carrier 156 or a second substrate carrier 158. Contactless holding is provided.
• Carrier driving structures for instance carrier driving structure 163 and carrier driving structure 165, can be provided to provide a driving force for transporting the first substrate carrier 156 or the second substrate carrier 158 along the transport direction 103.
• the carrier driving structures can include further active magnetic elements providing a force on the first substrate carrier 156 or the second substrate carrier 158.
• Contactless driving can be provided.
• the active magnetic elements of the carrier holding structures can be arranged in a row extending in the first direction, i.e. a transportation direction 103.
• the carrier holding structures can be provided at or attached to the top wall of the rotation support 118.
• the carrier holding structures for instance carrier holding structure 162 and/or carrier holding structure 164, i.e. levitation boxes, can be mounted at the ceiling of the rotation support 118.
• the rotation mechanism 112 may be configured to rotate at least one of the first mask stage 122, the second mask stage 124, the first substrate transportation track 152 associated with the first mask stage 122, and the second substrate transportation track 154 associated with the second mask stage 124.
• the rotation mechanism 112 may be configured to rotate the first mask stage 122, the second mask stage 124, the first substrate transportation track 152 associated with the first mask stage 122, and the second substrate transportation track 154 associated with the second mask stage 124.
• a first substrate carrier 156 may be provided at the first substrate transportation track 152.
• a second substrate carrier 158 may be provided at the second substrate transportation track 154.
• the first substrate carrier 156, the second substrate carrier 158, and/or a mask 50 can be transferred to a neighboring connected vacuum chamber, e.g. process region. Accordingly, the orientation of the first mask stage 122, the second mask stage 124, the first substrate transportation track 152 associated with the first mask stage 122, and/or the second substrate transportation track 154 associated with the second mask stage 124 can be varied inside the vacuum rotation chamber 110.
• first mask stage 122, the second mask stage 124, the first substrate transportation track 152 associated with the first mask stage 122, and the second substrate transportation track 154 associated with the second mask stage 124 can be rotated in a position which enables the transfer of the mask 50 to one of the adjacent vacuum chambers 102 and 104 and, more particularly, to the mask handling chamber 140 of the in-line substrate processing system.
• the first substrate carrier 156 and/or the second substrate carrier 158 can be rotated while being levitated by a carrier holding structure. Furthermore, during rotation of the rotation mechanism 112, in particular during rotation of rotation support 118, the first substrate carrier 156 and/or the second substrate carrier 158 can be rotated while being mechanically supported by the rotation mechanism 112. The first substrate carrier 156 and/or the second substrate carrier 158 can be transported in a different direction after the rotation, for example, in a direction angled by 90° or 120° as compared to the direction before the rotation.
• FIG. 2 a cross- sectional top view of a mask handling module 100 is shown in FIG. 2.
• the mask handling module 100 may include chambers l40a, l40b, and/or l40c.
• the chambers l40a, l40b, and/or l40c may be attached to the vacuum rotation chamber 110.
• chamber l40a may be a mask chamber configured to stock used masks.
• a used mask may be a mask after deposition of materials, such as organic materials, on a substrate. The used mask may be stocked in order to conduct a posterior cleaning.
• chamber l40b may be a mask chamber configured to stock unused masks.
• an unused mask may be a mask before deposition of materials, , such as organic materials, on a substrate.
• chamber l40c may be a chamber configured to stock substrate carriers.
• chamber l40c may be a substrate carrier exchanger. The substrate carrier exchanger may be configured to transfer substrate carriers to or from the vacuum rotation chamber 110. For instance, a substrate carrier may be transfer to chamber l40c in order to clean or repair the substrate carrier.
• chamber l40c may be a chamber connected to a further vacuum rotation chamber, e.g. a vacuum chamber having a rotation mechanism 112 according to embodiments described herein.
• the further vacuum rotation chamber may be provided between a substrate loading chamber 712 and the vacuum rotation chamber 110 in a vacuum processing system, see e.g. FIG. 7.
• Chambers l40a, l40b, and/or l40c may also include a vacuum robot with one, two or more individually movable robot hands. Each robot hand may include a mask holding portion configured to grab a mask or a substrate carrier.
• an angle of transportation of components into or out of the chambers can be 90° or can be different than 90° relative to an in-line direction indicated by arrows in FIG. 2.
• an angle between adjacent transport directions into or out of the vacuum rotation chamber can be between 30° and 120°
• FIG. 3 shows a flowchart illustrating a method 300 for a mask transfer and/or an in line material deposition on a substrate, respectively, according to embodiments described herein.
• the method 300 can be implemented using the apparatuses and systems according to the present disclosure.
• the method 300 may include transporting the first substrate carrier 156 into the vacuum rotation chamber 110 (stage 302). Further, the method 300 may include transferring a first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304). The method 300 may also include transporting the first substrate carrier 156 out of the vacuum rotation chamber 110, in particular along the transport direction 103 (stage 306). Additionally, the method 300 may include rotating the rotation mechanism 112 supporting the first mask stage 122 in the vacuum rotation chamber 110 by an angle of about 180° (stage 308). Method 300 may conclude at end 310.
• the method 300 for mask transfer may further include an initial stage of grabbing a first mask from the mask handling chamber 140, particularly from the mask handling assembly 142, and more particularly from a mask holder (e.g. mask shelf). Further, the method may additionally include transferring the first mask to the vacuum rotation chamber 110, particularly to the rotation mechanism 112, and more particularly to the first mask stage 122. Furthermore, the method 300 may include rotating the rotation mechanism 112 supporting a mask stage, for example the first mask stage 122 and the second mask stage 124 in the vacuum rotation chamber 110, by an angle of about 180°.
• transporting the first substrate carrier 156 into the vacuum rotation chamber 110 may include rotating the rotating support 118 within the vacuum rotation chamber 110 to enable the transport of the first substrate carrier 156 into the vacuum rotation chamber 110, in particular along the first direction 103.
• the first substrate carrier 156 may support the first substrate.
• transporting the first substrate carrier 156 into the vacuum rotation chamber 110 may include rotating the rotating support 118 within the vacuum rotation chamber 110 so that the first substrate carrier 156 can be positioned along the first substrate transportation track 152.
• transporting the first substrate carrier 156 into the vacuum rotation chamber 110 may include rotating the rotating support 118 within the vacuum rotation chamber 110 to align the first substrate transportation track 152 with at least one of the transportation tracks of a neighboring connected vacuum chamber, e.g. process region.
• transferring a first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 may include horizontally moving the at least one clamp of the first mask holder assembly 132. Further, transferring a first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304) may include attaching the first mask in a substantially vertical orientation to the first substrate carrier 156. Furthermore, transferring a first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304) may include holding or supporting the first substrate and the first mask in a substantially vertical orientation.
• transferring a first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 may be conducted while contactless holding the first substrate carrier 156 in the vacuum rotation chamber 110, for example while contactless holding the first substrate carrier 156 parallel to the first mask stage 122 in the vacuum rotation chamber 110.
• transporting the first substrate carrier 156 out of the vacuum rotation chamber 110 may include rotating the rotating support 118 to align the first substrate transportation track 152 with at least one of the transportation tracks of a neighboring connected vacuum chamber, e.g. process region. Accordingly, the first substrate carrier 156 may support the first substrate and the first mask.
• the method 300 may further include transporting the second substrate carrier 158 into the vacuum rotation chamber 110 along a second direction opposite to the first direction 103. Accordingly, the second substrate carrier 158 may support a second substrate and a second mask. Further, the method 300 may include transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124. Furthermore, the method 300 may include transporting the second substrate carrier 158 out of the vacuum rotation chamber 110 along the second direction. Accordingly, the second substrate carrier 158 may support the second substrate.
• transporting the second substrate carrier 158 into the vacuum rotation chamber 110 along the second direction opposite to the first direction 103 may include rotating the rotating support 118 within the vacuum rotation chamber 110 to enable the transport of the second substrate carrier 158 into the vacuum rotation chamber 110, for example along the second direction opposite to the first direction 103. Accordingly, the second substrate carrier 158 may support the second substrate and the second mask. Further, transporting the second substrate carrier 158 into the vacuum rotation chamber 110 along the second direction opposite to the first direction 103 may include rotating the rotating support 118 within the vacuum rotation chamber 110. Accordingly, the second substrate carrier 158 can be positioned along the second substrate transportation track 154.
• transporting the second substrate carrier 158 into the vacuum rotation chamber 110 along the second direction opposite to the first direction 103 may include rotating the rotating support 118 within the vacuum rotation chamber 110. Accordingly, the second substrate transportation track 154 can be aligned with at least one of the transportation tracks of a neighboring connected vacuum chamber, e.g. process region.
• transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may include horizontally moving the at least one clamp of the second mask holder assembly 132. Further, transferring a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may include attaching the second mask in a substantially vertical orientation to the second mask stage 124. Furthermore, transferring a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may include holding or supporting the second substrate and the second mask in a substantially vertical orientation.
• transferring a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may be conducted while contactless holding the second substrate carrier 158 in the vacuum rotation chamber 110, for example while contactless holding the second substrate carrier 158 parallel to the second mask stage 124 in the vacuum rotation chamber 110.
• transporting the second substrate carrier 158 out of the vacuum rotation chamber 110 along the second direction may include rotating the rotating support 118 within the vacuum rotation chamber 110. Accordingly, the second substrate transportation track 154 can be aligned with at least one of the transportation tracks of a neighboring connected vacuum chamber, e.g. process region.
• transporting the first substrate carrier 156 into a vacuum rotation chamber 110, in particular along the first direction 103, and transporting the second substrate carrier 158 into a vacuum rotation chamber 110 along the second direction may be conducted simultaneously or independently. Further, transferring the first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 and transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may be conducted simultaneously or independently. Furthermore, transporting the first substrate carrier 156 out of the vacuum rotation chamber 110, in particular along the first direction 103, and transporting the second substrate carrier out of the vacuum rotation chamber 110 along the opposite direction, in particular opposite to the first direction 103, may be conducted simultaneously or singly.
• FIGS. 4 A to 4D show further schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system.
• FIG. 4A shows further schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system during transport of the first substrate carrier 156 along the first direction 103 and transport of the second substrate carrier 158 into a vacuum rotation chamber 110 along the second direction opposite to the first direction 103 according to embodiments described herein.
• the first substrate carrier 156 may support the first substrate.
• the second substrate carrier 158 may support the second substrate and the second mask.
• FIG. 4A shows further schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system during transport of the first substrate carrier 156 along the first direction 103 and transport of the second substrate carrier 158 into a vacuum rotation chamber 110 along the second direction opposite to the first direction 103 according to embodiments described herein.
• the first substrate carrier 156 may support the first substrate.
• FIG. 4B shows further schematic cross-sectional top views of a section of vacuum rotation chamber 110 for an in-line substrate processing system during transfer of the first mask supported by the first mask holder assembly 132 (not shown) from the first mask stage 122 to the first substrate carrier 156 according to embodiments described herein.
• FIG. 4C shows further schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system during transfer of the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 according to embodiments described herein.
• FIG. 4B shows further schematic cross-sectional top views of a section of vacuum rotation chamber 110 for an in-line substrate processing system during transfer of the first mask supported by the first mask holder assembly 132 (not shown) from the first mask stage 122 to the first substrate carrier 156 according to embodiments described herein.
• FIG. 4C shows further schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system during transfer of the second mask
• FIG. 4D shows further schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system during transport of the first substrate carrier 156 along the first direction 103 and transport of the second substrate carrier 158 out of the vacuum rotation chamber 110 along the second direction opposite to the first direction 103 according to embodiments described herein.
• the first substrate carrier 156 may support the first substrate and the first mask.
• the second substrate carrier 158 may support the second substrate.
• FIG.5 shows schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system during rotation of the rotation mechanism 112 supporting the first mask stage 122 and the second mask stage 124 in the vacuum rotation chamber 110 by an angle of about 180° according to embodiments described herein.
• the second mask stage 124 may become the first mask stage 122 and the second mask stage 124 may become the first mask stage 122. Therefore, after rotation, the first mask stage 122 may support the first mask.
• the method stage shown in FIG. 4A can be further implemented after this rotation.
• FIG. 6 shows schematic cross-sectional top views of a section of the vacuum rotation chamber 110 for an in-line substrate processing system during rotation of the rotation mechanism 112 supporting the first mask stage 122 and the second mask stage 124 in the vacuum rotation chamber 110 by an angle of about 90° according to embodiments described herein.
• the second mask stage 124 may support the second mask.
• a first mask may be grabbed from the mask handling chamber 140, in particular from the mask handling assembly 142.
• the mask may be loaded or transferred to the vacuum rotation chamber 110, typically to the rotation mechanism 112, and more typically to the first mask stage 122 or to the second mask stage 124.
• a second mask may be unloaded or transferred from the vacuum rotation chamber 110, typically from the rotation mechanism 112, and more typically from the first mask stage 122 or from the second mask stage 124 to the mask handling chamber 140, in particular the mask handling assembly 142, e.g. for cleaning.
• the mask handling chamber 140 in particular the mask handling assembly 142, is configured to connect the first mask to the first mask stage 122 or to the second mask stage 124.
• the mask handling chamber 140 in particular the mask handling assembly 142, is configured to separate the second mask from the first mask stage 122 or from the second mask stage 124, e.g. for cleaning.
• a further rotation of the rotation mechanism may be provided between unloading of used mask and loading of a new (fresh) mask, or vice versa.
• FIG. 7 shows a schematic top view of a vacuum processing system for in-line processing of a substrate according to embodiments described herein.
• the vacuum processing system for in-line processing of a substrate may include the mask handling module 100, a substrate loading region 702, and a processing region 706.
• the substrate loading region 702 may include a substrate loading chamber 712.
• the vacuum processing system for in-line processing of a substrate may include a transfer region 740 between the vacuum rotation chamber 110 and the mask handling chamber 140.
• the vacuum processing system for in-line processing of a substrate may include a transfer region 752 between the mask handling module 100 and the substrate loading region 702.
• the vacuum processing system for in-line processing of a substrate may include a transfer region 754 between the mask handling module 100 and the processing region 706.
• the transfer region 752 may be used to connect, disconnect and/or substitute a substrate loading region 702 from the vacuum processing system, e.g. for cleaning.
• the transfer region 754 may be used to connect, disconnect and/or substitute the vacuum rotation chamber 110 and a processing region 706 from the vacuum processing system, e.g. for cleaning.
• the substrate loading region chamber, the vacuum rotation chamber 110, and the processing region 706 may provide an in-line direction.
• the first mask transfer may be provided along a mask transfer direction different from the in-line direction.
• the processing region 706 may include a substrate rotation chamber 762 configured to provide a forward substrate processing direction and a backward substrate processing direction. Further, the processing region 706 may include one or more in-line processing chambers 760. The in-line processing chambers 760 may provide a main transportation path. Furthermore, the in-line processing chambers 760 may include deposition modules. For instance, a deposition module may be a chamber configured for depositing a material on a substrate.

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• 2018
  • 2018-09-19 KR KR1020217008312A patent/KR102553751B1/ko active IP Right Grant
  • 2018-09-19 WO PCT/EP2018/075374 patent/WO2020057738A1/en active Application Filing
  • 2018-09-19 CN CN201880097729.1A patent/CN112740391A/zh active Pending
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