WO2020057599A1 - Matériau de construction chauffant et son procédé de préparation - Google Patents

Matériau de construction chauffant et son procédé de préparation Download PDF

Info

Publication number
WO2020057599A1
WO2020057599A1 PCT/CN2019/106675 CN2019106675W WO2020057599A1 WO 2020057599 A1 WO2020057599 A1 WO 2020057599A1 CN 2019106675 W CN2019106675 W CN 2019106675W WO 2020057599 A1 WO2020057599 A1 WO 2020057599A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
heating
heat
conductive
insulating
Prior art date
Application number
PCT/CN2019/106675
Other languages
English (en)
Chinese (zh)
Inventor
杨敏
张伟
李永武
Original Assignee
光之科技(北京)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201811097360.2A external-priority patent/CN108909080A/zh
Priority claimed from CN201910284454.9A external-priority patent/CN111809816B/zh
Priority claimed from CN201910284447.9A external-priority patent/CN111809815A/zh
Priority claimed from CN201910284783.3A external-priority patent/CN111809817B/zh
Application filed by 光之科技(北京)有限公司 filed Critical 光之科技(北京)有限公司
Publication of WO2020057599A1 publication Critical patent/WO2020057599A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00—Electric heating systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D19/00—Details

Definitions

  • the invention name is "A heating building material and its preparation method", and the Chinese patent application number 2018110973602 filed on September 19, 2018;
  • the invention name is “Self-Heating Integrated Board and Preparation Method”, and the Chinese patent application number 2019102844479 filed on April 10, 2019;
  • the invention relates to a heating building material and a preparation method thereof, in particular to a heating building material used in the construction field and a preparation method thereof.
  • the heating floor for indoor heating generally uses the floor directly connected with the heating device, or installs the heating layer in the floor or is embedded under the floor, or uses a metal plate with heating wires. Forms that cooperate with ordinary floors.
  • the currently used heating floor does not meet the requirements of high thermal efficiency, low cost, safety and environmental protection of the heating floor.
  • the invention relates to a heating building material used in the construction field, which not only has the attributes of indoor building decoration materials, but also can satisfy the requirements of indoor heating, and has the characteristics of safety, health, energy saving and environmental protection, high heat efficiency and the like.
  • the heating building material is a new product based on heat radiation and heat conduction.
  • the film structure of the product includes a base material, a heat insulation layer, a reflection layer, a heat radiation layer, and an enamel finish layer from bottom to top;
  • the substrate is a common building material bearing material, including cement-based boards, tiles, and marble;
  • the thermal insulation layer is attached to a substrate
  • the heating radiation layer is attached on the reflective layer
  • the facing layer is covered on the heat radiation layer
  • the decorative layer has a transmittance of not less than 30% in the infrared band (0.8-15 ⁇ m).
  • the material of the heat-insulating layer is porous material, foam material, and fiber material, including asbestos, glass fiber, and aerogel felt.
  • the reflective layer includes a gold, silver, nickel, aluminum film, and a polyester or polyimide film with a metal film layer.
  • the heat radiation layer includes a heat radiation material, a conductive material, and an insulating material.
  • the heating radiation layer heating material includes graphite, graphene, nano-carbon, special ink, polymer conductive film, the heating radiation layer conductive material includes copper wire, copper foil, or nano-silver paste, and the insulating material is preferably PET polymer. Ester film, PCT, PE.
  • the thickness of the facing layer is 1 ⁇ m to 5 mm, and the film layer is uniform.
  • the facing layer higher than 500 ⁇ m, it can also generate heat radiation to the external environment.
  • the heating building materials may further include a buffer layer structure, which is located between the heat radiation layer and the enamel finish layer, and the buffer layer material includes ethylene-octene copolymer or ethylene-
  • the vinyl acetate copolymer plays a buffering support for the heat radiation layer and a certain insulation effect.
  • the film of the enamel finish layer maintains a high transmittance in the infrared wave band, and has a certain transmittance and absorption at 300-1000 nm.
  • the specific component is added or doped in the film, so that it has an absorptivity at a specific wavelength, so that the decorative layer has a rich color.
  • the heating building material product has the following properties:
  • the enamel is used as a decorative layer for heating building materials, which is light and easy to carry.
  • the enamel finish layer has high transmittance in the infrared wave band, thermal radiation easily penetrates the material, good thermal conductivity, and will not reduce the heating performance of the heating body layer.
  • the enamel prepared in this way can obtain a pattern with uniform thickness and beautiful appearance.
  • the surface flatness of this film is good, and local overheating will not cause damage to the heating layer structure.
  • the ceramic glaze layer used in the present invention has good water resistance, and will not cause the performance of the product to be dampened when the humidity is high.
  • the invention further provides a method for preparing the above-mentioned heating building material, including the following steps:
  • the invention also provides an electrothermal conversion layer with adjustable thermal conductivity and infrared radiation, which transforms ordinary building decoration materials (floor, tile, wallpaper, etc.) into an integrated material that can radiate infrared and heat sources to the outside without changing the original building.
  • the appearance and texture of the material thus altering existing heating methods.
  • the integrated heat transfer board provided by the present invention includes a conductive tape, a first insulating layer, an electrothermal conversion layer, and a second insulating layer.
  • the conductive tape is connected to the electrothermal conversion layer.
  • the first insulating layer, the electrothermal conversion layer, and the first Two insulating reflective layers are stacked in sequence; the contact resistance of the carbon microcrystalline layer and the conductive and charged connection is not higher than 900 ⁇ , and the average resistance value of the electrothermal conversion layer is 11-5000 ⁇ / ⁇ .
  • the range of the contact resistance is 400-900 ⁇ .
  • the contact resistance is more preferably in a range of 10-90 ⁇ , 90-180 ⁇ , 180-270 ⁇ , or 270-400 ⁇ .
  • the thickness of the electrothermal conversion layer may be selected from 1 to 800 micrometers.
  • the electrothermal conversion layer is a carbon microcrystalline layer.
  • the raw materials for preparing the electrothermal conversion layer include low-resistance carbon microcrystals with a resistance value of 10-300 ⁇ / ⁇ , medium-resistance carbon microcrystals with a resistance value of 300-1000 ⁇ / ⁇ , and One or more of the high-resistance carbon microcrystals having a resistance value of 1000 ⁇ / ⁇ or more.
  • the square resistance of the electrothermal conversion layer gradually increases or gradient increases in a direction away from the conductive strip toward the center line.
  • the thickness of the electrothermal conversion layer gradually increases or gradient increases in a direction away from the conductive strip toward the center line.
  • the gradient resistance is defined as follows: When x is defined as the ratio of the distance from one electrode to the distance between two electrodes, and R x is the resistance at the corresponding position, the carbon microcrystalline layer R 0 is 10-300 ⁇ / ⁇ , R 0.1 is 50-500 ⁇ / ⁇ , R 0.2 is 200-600 ⁇ / ⁇ , R 0.3 is 300-800 ⁇ / ⁇ , and R 0.4 is 600-1000 ⁇ / ⁇ .
  • the heat transfer integrated board includes a base material, and the base material may be a commercially available common building material, such as a floor, a tile, a wallpaper, a wooden board and the like.
  • the substrate should be treated so that the substrate is suitable for the preparation of an integrated heat transfer plate.
  • the substrate is treated in the following manner: the non-decorative surface of the substrate is polished and polished, and those skilled in the art understand that the non-decorative surface is usually a tile, template, or wallpaper. back.
  • Sanding and polishing is a routine operation in the field. Generally, this operation can achieve the following technical effects: the surface roughness is not greater than 0.8 microns.
  • the conductive tape can be selected from copper wires, copper foils, aluminum foils and other materials with better conductive properties.
  • the heat transfer integrated board includes a first waterproof layer, and the waterproof layer is located between the substrate and the first insulating layer.
  • the material of the waterproof layer is a polymer film or paint, and materials that can be selected include polyethylene (PE), polyethylene terephthalate (PET), polyimide (PI), and ethylene-tetrafluoro
  • PE polyethylene
  • PET polyethylene terephthalate
  • PI polyimide
  • ETFE ethylene copolymer
  • PTFE polytetrafluoroethylene
  • the thickness of the first waterproof layer is 1-30 micrometers.
  • the thickness of the first waterproof layer is 30-100 micrometers.
  • the thickness of the first waterproof layer is 100-200 microns.
  • the thickness of the first waterproof layer is 200-800 microns.
  • the integrated heat transfer plate includes a second waterproof layer, and the second waterproof layer is in direct contact with the second insulating layer.
  • the material of the second waterproof layer is a polymer film or coating, and materials that can be selected include polyethylene (PE), polyethylene terephthalate (PET), polyimide (PI), and ethylene-
  • PE polyethylene
  • PET polyethylene terephthalate
  • PI polyimide
  • ETFE tetrafluoroethylene copolymer
  • inorganic nano-ceramic coating diamond paint
  • polytetrafluoroethylene PTFE
  • the thickness of the second waterproof layer is 1-30 micrometers.
  • the thickness of the second waterproof layer is 30-100 micrometers.
  • the thickness of the second waterproof layer is 100-200 microns.
  • the thickness of the second waterproof layer is 200-800 microns.
  • the heat transfer integrated plate may further include a wear-resistant water-blocking layer.
  • the material of the wear-resistant water-blocking layer is a coating or a film.
  • the materials that can be selected include inorganic nano-ceramic coatings, diamond paint, wear-resistant paper, and polyurethane coatings. , Epoxy resin, and alumina coating, the thickness after film formation can be selected from 0.001-0.8mm.
  • the thickness of the wear-resistant and water-blocking layer is 1-30 micrometers.
  • the thickness of the abrasion-resistant and water-blocking layer is 30-100 micrometers.
  • the thickness of the abrasion-resistant and water-blocking layer is 100-200 microns.
  • the thickness of the abrasion-resistant and water-blocking layer is 200-800 microns.
  • the heat transfer integrated board may further include a heat insulation layer, the heat insulation layer is located between the second waterproof layer and the abrasion and water resistance layer, or the heat insulation layer may have a thermal conductivity lower than 0.2W / (m ⁇ K) consists of a thermal barrier film, and its thickness is not more than 0.5 mm.
  • the thickness of the thermal insulation layer is 1-50 micrometers.
  • the thickness of the heat insulation layer is 50-100 micrometers.
  • the thickness of the thermal insulation layer is 100-200 microns.
  • the thickness of the thermal insulation layer is 200-500 microns.
  • the integrated heat transfer plate may further include a reflective layer.
  • the reflective layer is a metal film, which can be selected from aluminum, silver, mercury, and nickel.
  • the metal film can reflect infrared rays. This structure can make infrared rays radiate in unexpected directions. Directional reflection to the desired direction.
  • At least 60% of the input power is radiated at a wavelength of 5-20 micrometers according to the power input power meter.
  • the invention also provides a method for preparing the integrated heat transfer plate, including:
  • a carbon microcrystalline layer having a resistance value of 11-5000 ⁇ / ⁇ is formed on the substrate, and then dried; the carbon microcrystalline layer is a low-resistance carbon containing a resistance value of 10-300 ⁇ / ⁇
  • the carbon microcrystalline layer is a low-resistance carbon containing a resistance value of 10-300 ⁇ / ⁇
  • a carbon microcrystalline region having a resistance value not higher than 90 ⁇ at the contact point is formed on the carbon microcrystalline layer, and a conductive band is provided.
  • the step of modifying the substrate may include the step of forming a first waterproof layer on the substrate.
  • the step of modifying the substrate may include a step of forming an insulating layer on the first waterproof layer.
  • the method further includes the step of forming a second insulating layer on the carbon microcrystalline layer.
  • the method further includes the step of forming a second waterproof layer on the second insulating layer.
  • the method further includes the step of forming a heat blocking layer on the second waterproof layer.
  • the method further includes the step of forming a reflective layer on the heat blocking layer.
  • the method further includes the step of forming a wear-resistant and water-blocking layer on the reflective layer.
  • the heating film layer obtained according to the above method has an approximate resistance value, and since the interface resistance at the contact is not higher than 90 ⁇ , the phenomenon of electric spark under normal use environment and installation environment is avoided.
  • the invention also provides another method for preparing the integrated heat transfer plate, including:
  • the conductivity band should be set in a carbon microcrystal region with a lower resistance value.
  • the corresponding carbon microcrystals have a lower block resistance, which can effectively avoid electric sparks.
  • the step of modifying the substrate may include the step of forming a first waterproof layer on the substrate.
  • the step of modifying the substrate may include a step of forming an insulating layer on the first waterproof layer.
  • the method further includes the step of forming a second insulating layer on the carbon microcrystalline layer.
  • the method further includes the step of forming a second waterproof layer on the second insulating layer.
  • the method further includes the step of forming a heat blocking layer on the second waterproof layer.
  • the method further includes the step of forming a reflective layer on the heat blocking layer.
  • the method further includes the step of forming a wear-resistant and water-blocking layer on the reflective layer.
  • the insulating reflective layer uses magnetron sputtering to deposit a metal dielectric to obtain a highly reflective infrared film.
  • the invention adopts the progressive resistance value to obtain a good ohmic contact between the heating carbon microcrystals and the copper electrode, which solves the industry pain point of the entire self-heating integrated board; at the same time, improves the electrothermal conversion efficiency and optimizes the proportion of heat radiation in the electrothermal conversion.
  • the invention also provides a self-heating integrated board.
  • the self-heating integrated board heating is not only comfortable and healthy, energy saving and environmental protection, but also takes the family as a heating unit.
  • the heating temperature, heating time and heating position can be selected according to the needs of the family, which effectively solves the heating problem in winter.
  • the self-heating integrated board provided by the present invention can emit far-infrared radiation waves with a wavelength of 1-20 micrometers, especially 5-15 micrometers after being energized, which is energy-saving, environmental-friendly and pollution-free, and meets the development requirements of energy-saving and emission reduction.
  • a self-heating integrated board provided by the present invention includes a substrate, a first insulating and waterproof film layer, a heating film layer, a second insulating and waterproof film layer, a surface layer, and an electrode.
  • the substrate includes a polished surface
  • the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer are sequentially stacked on the polished surface;
  • the electrode is disposed on a substrate and is electrically connected to the heating film layer;
  • the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 0.01-5 mm.
  • the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 0.01-0.5 mm.
  • the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 0.5-1 mm.
  • the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 1-3 mm.
  • the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 3-5 mm.
  • the self-heating integrated board further includes an infrared reflective film layer, and the infrared reflective film layer is located between the polished surface and the first insulating and waterproof film layer.
  • the self-heating integrated board further includes a wear-resistant layer, and the wear-resistant layer is disposed on the surface layer.
  • the material of the surface layer includes epoxy resin layer, ultraviolet curing adhesive layer, ceramic coating layer, cement layer, ceramic layer, glass layer, marble layer, and granite layer. One or more.
  • the surface layer contains a high-strength wear-resistant material, which has high strength and good abrasion resistance on the one hand, protects the inner-layer heating film from external forces, and on the other hand Various textures and patterns set on demand are drawn as expected, with decorative and beautiful effects.
  • the first and second waterproof and insulating film layers include an organic heat-resistant insulating material and / or an inorganic heat-resistant insulating material
  • the organic heat-resistant insulating material includes One or more of polyethylene terephthalate, polyimide, polyamideimide, polymaleimide, polydiphenyl ether, polytetrafluoroethylene
  • the inorganic heat-resistant insulation Materials include one or more of quartz, mica, glass, and ceramic.
  • the thickness of the first insulating waterproof film layer and the second waterproof film layer is 1 ⁇ m to 1 mm.
  • the heating film layer is a low-temperature radiant electric heating film
  • the low-temperature radiant electric heating film is a type of radiant electric heating film conforming to the JC / T286-2010 industry standard, especially a flexible electric heating film.
  • the heating film layer includes one or more of a carbon material, tourmaline, and far-infrared ceramic, and the carbon material includes one or more of nano-carbon crystals, carbon fibers, and graphene. Species.
  • the thickness of the heating film layer is 1 ⁇ m to 800 ⁇ m.
  • At least 55% of the input power is radiated by infrared rays with a wavelength of 1-20 ⁇ m according to the power input power meter.
  • the infrared reflective layer includes a metal film layer.
  • the thickness of the metal film layer is 0.05 ⁇ m to 500 ⁇ m.
  • the metal included in the infrared reflective layer may be aluminum, silver, mercury, nickel, or other materials.
  • the selected metal is aluminum, silver, or other metal materials that can be oxidized and corroded by water vapor as the infrared reflective film layer, it is necessary to do a waterproof treatment on the polished surface of the substrate, and then prepare an infrared reflective film layer.
  • the substrate is a high-strength low-thermal-conductivity plate, the compressive strength is not less than 10 MPa, and the thermal conductivity is less than 0.12 W / (m ⁇ K).
  • the substrate may optionally include a slate plate, a calcium-silicate plate, a silicate plate, and a rock plate.
  • the thickness of the substrate may be further 0.5 mm to 30 mm.
  • conductive metal tapes are attached to the power film on the two sides of the heating film layer near the edges, and the heating film layer is electrically connected to the electrodes through the metal tape.
  • the electrodes are arranged in the substrate, such as embedded in the four sides connected to the polished surface, or opposite sides of the polished surface; The contact with the outside, and the connection with the heating film layer is achieved through appropriate wires.
  • the invention also provides a method for preparing a self-heating integrated board, including:
  • An infrared reflective film layer, a first insulating and waterproof film layer, and a heating film layer are sequentially stacked or formed on the polished surface, and then a guide bar is provided on the heating film layer, and the guide bar and the electrode are formed.
  • a second insulating and waterproof film layer and a surface layer are sequentially stacked or formed on the heating film layer.
  • step 1) the polished surface should be the side that is expected to be functionalized.
  • step 2) the construction process of each layer may be directly bonding the layers of a certain size to obtain a self-heating integrated board, or forming a corresponding structure by casting, spraying, or the like.
  • step 2) an electrode that is in direct contact with the heating film layer can be provided to realize the omission of the guide bar.
  • the corresponding preparation step is: sequentially stacking or forming an infrared reflective film layer on the polished surface, and a first insulation and waterproofing. A film layer and a heating film layer, and then the heating film layer and the electrode are connected, and then a second insulating and waterproof film layer and a surface layer are sequentially stacked or formed on the heating film layer.
  • the infrared reflective film layer may be omitted.
  • the self-heating integrated board is prepared as follows:
  • the first insulating and waterproof film layer is prepared on the surface of the infrared reflective film layer by roller coating, for example, the thickness is 500 ⁇ m, and it is cured by being left at room temperature for 24 hours.
  • the second insulating and waterproof film layer is prepared by roller coating on the surface of the heating film layer; the thickness is 500 ⁇ m, and it is left to cure at room temperature for 24 hours.
  • the surface layer is prepared by liquid curing on the surface of the second insulating and waterproof film layer.
  • the thickness of the surface layer is 2 mm, and the surface layer is cured at 50 ° C. for 2 hours to complete the preparation of the self-heating integrated board.
  • the infrared reflective film layer may be omitted.
  • the self-heating integrated board has the following beneficial effects:
  • the self-heating integrated board can emit 1-20 microns, especially 5 ⁇ 15 ⁇ m far-infrared radiation light waves after being energized. Due to the use of mid-far infrared radiation for heating, the heating speed is fast, and the human body is sensitive to 5 ⁇ 15 ⁇ m infrared light induction, and warm Comfortable and healthy, low energy consumption, energy saving and environmental protection without pollution.
  • the heating integrated board uses the family as a heating unit.
  • the heating temperature, heating time and heating position can be selected according to the needs of the family, and it is energy-saving, environmentally friendly and pollution-free, which can effectively solve the heating problem in the winter in the south.
  • the self-heating integrated board can also be used in the north, replacing the central heating in the north, which is in line with the development direction of energy conservation and emission reduction in China.
  • the self-heating integrated board adopts an integrated design, and the functional layer is thinner than the traditional substrate. Compared with the traditional separated structure, the preparation cost is reduced.
  • the installation method is flexible and easy to install. It can be used as indoor floor and wall. Surface and roof.
  • the invention also provides a directional heat transfer integrated board with directional heat conduction and infrared radiation, which transforms ordinary building decoration materials (floor, tile, wallpaper, etc.) into an integrated building material that can directionally radiate infrared rays and a small amount of heat sources without changing. The appearance and texture of the original building materials.
  • the invention provides a directional heat transfer integrated board including a surface layer, a conductive tape, an electrothermal conversion layer, a heat insulation reflective layer, a first sealing layer, and a second sealing layer.
  • the heat-reflective reflective layer and the second sealing layer are stacked in sequence, and the transmittance of the surface layer to infrared rays having a wavelength of 5-18 microns is not less than 20%;
  • the total thickness of the electrothermal conversion layer, the heat-reflecting layer, and the sealing layer is 10-800 microns.
  • the surface layer is infrared glass, infrared transmissive polycarbonate, polymethyl methacrylate, or infrared transmissive resin having a transmittance of not less than 20%.
  • the directional heat transfer integrated board includes a base material, and the base material may be a commercially available general building material, such as a floor, a tile, a wallpaper, a wooden board, and the like.
  • the substrate should be treated so that the substrate is suitable for the preparation of an integrated heat transfer plate.
  • the substrate is processed as follows: the substrate is subjected to a polishing process. Sanding and polishing is a routine operation in the field. Generally, this operation can achieve the following technical effects: the surface roughness is not greater than 0.8 microns.
  • the directional heat transfer integrated board includes at least a waterproof layer, and the waterproof layer is located between the substrate and the electrothermal conversion layer; or the waterproof level of the sealing layer is greater than IP67.
  • the directional heat transfer integrated board includes a waterproof layer, and the waterproof layer is located between the substrate and the low-resistance carbon microcrystalline film.
  • a waterproof layer should be provided to ensure the normal operation of the directional heat transfer integrated board.
  • the directional heat transfer integrated board includes a waterproof layer, which is in direct contact with the sealing layer.
  • the material of the waterproof layer is a polymer film or paint, and materials that can be selected include polyethylene (PE), polyethylene terephthalate (PET), polyimide (PI), and ethylene-tetrafluoro
  • PE polyethylene
  • PET polyethylene terephthalate
  • PI polyimide
  • ETFE ethylene copolymer
  • PTFE polytetrafluoroethylene
  • the thickness of the waterproof layer is 1-30 micrometers.
  • the thickness of the waterproof layer is 30-100 micrometers.
  • the thickness of the waterproof layer is 100-200 microns.
  • the thickness of the waterproof layer is 200-800 microns.
  • a wear-resistant layer should be provided to provide protection for the heating components.
  • the material of the abrasion-resistant layer is paint or film.
  • Materials that can be selected include inorganic nano-ceramic paint, diamond paint, abrasion-resistant paper, polyurethane paint, epoxy resin, and alumina paint. 0.001-0.8mm.
  • the thickness of the wear-resistant layer is 1-30 microns.
  • the thickness of the wear-resistant layer is 30-100 micrometers.
  • the thickness of the wear-resistant layer is 100-200 microns.
  • the thickness of the wear-resistant layer is 200-800 microns.
  • At least 90% of the input power is radiated with infrared rays having a wavelength of 5-20 microns.
  • the raw materials for preparing the electrothermal conversion layer include low-resistance carbon microcrystals having a resistance value of 10-300 ⁇ / ⁇ , medium-resistance carbon microcrystals having a resistance value of 300-1000 ⁇ / ⁇ , and a resistance value One or more of the high-resistance carbon crystallites having a resistance of 1000 ⁇ / ⁇ or more.
  • the raw materials for preparing the electrothermal conversion film include low-resistance carbon microcrystals having a resistance value of 10-300 ⁇ / ⁇ , and the raw materials for preparing the carbon microcrystal film further include a resistance value of 300-1000 ⁇ / ⁇ .
  • the raw materials for preparing the carbon microcrystal film further include a resistance value of 300-1000 ⁇ / ⁇ .
  • the square resistance of the electrothermal conversion layer gradually increases or gradient increases in a direction away from the conductive strip toward the center line.
  • the thickness of the electrothermal conversion layer gradually increases or gradient increases in a direction away from the conductive strip toward the center line.
  • x is the ratio of the distance from one electrode to the distance between two electrodes or the conductive strip, and when R x is the resistance at the corresponding position, R 0 of the carbon microcrystalline film It is 0.01-30 ⁇ / ⁇ , R 0.1 is 50-500 ⁇ / ⁇ , R 0.2 is 200-600 ⁇ / ⁇ , R 0.3 is 300-800 ⁇ / ⁇ , and R 0.4 is 600-1000 ⁇ / ⁇ .
  • the directional heat transfer integrated board includes a heat-shielding reflection layer, the heat-shielding reflection layer contains a metal film layer, and the thickness of the metal film layer is 0.05 ⁇ m to 100 ⁇ m.
  • the plate is a PET film with an aluminum film, PET is an insulating material, and the aluminum film can reflect infrared rays. This structure can make the infrared line be oriented when it radiates in an unexpected direction. Reflect to the set direction.
  • the heat insulation layer may be a heat resistance film with a thermal conductivity lower than 0.2 W / (m ⁇ K), and the thickness is 0.5 mm.
  • the thickness of the thermal insulation layer is 1-50 micrometers.
  • the thickness of the heat insulation layer is 50-100 micrometers.
  • the thickness of the thermal insulation layer is 100-200 microns.
  • the thickness of the thermal insulation layer is 200-500 microns.
  • the sealing layer may be a waterproof coating, AB glue, ceramic coating, or the like, and has a thickness of 1-50 microns.
  • the thickness of the sealing layer is 1-10 microns.
  • the thickness of the sealing layer is 10-20 microns.
  • the thickness of the sealing layer is 20-36 microns.
  • the thickness of the sealing layer is 36-50 microns.
  • the invention also provides a preparation method for preparing the directional heat transfer integrated plate, including:
  • the step 2) includes a step of constructing or stacking a second sealing layer on the modified substrate.
  • the directional heat transfer integrated plate is prepared according to the following method:
  • a sealing layer, a heat-reflecting layer, an insulating layer, and an electrothermal conversion film are sequentially stacked or constructed on the substrate, and a conductive tape is provided on the electrothermal conversion film, and then an insulating sealing layer and a surface layer are stacked or constructed on the conductive tape .
  • the above step 1) may include a step of constructing a waterproof layer on the substrate.
  • a step of constructing a waterproof layer on the outermost side may be optionally included.
  • the insulating reflective layer is prepared by depositing a metal dielectric reflective film on PET by a magnetron sputtering method.
  • the directional heat transfer integrated plate is prepared according to the following method:
  • the directional heat transfer integrated plate is prepared according to the following method:
  • Nano-carbon microcrystals are coated on the insulating layer by screen printing, and the thickness of the carbon microcrystalline film layer gradually decreases from the outside to the inside, the resistance at the two ends is the smallest, and a conductive copper tape is implanted at both ends as Wire, and then prepare a medium-high resistance nano carbon microcrystalline material, and adopt the same method to sequentially prepare a heat-reflecting layer, an insulating layer, and a surface layer. Finally, a directional heat conduction integrated sheet with a radiant heating ratio of 92% was prepared.
  • the entire heating process is mainly radiant heating, accounting for 92%, supplemented by conduction and convection heating, and the heating material body is provided with a current introduction point, which is embedded into the directional heat conduction through an electrical connector In one board.
  • the back surface non-decorative surface
  • a waterproof layer and an insulating layer are sequentially prepared, and then a low-resistance nano-carbon microcrystalline layer and a low-resistance carbon micro-crystalline film are prepared.
  • the thickness of the layer is gradually reduced from the outside to the inside, and the resistance is minimized at both ends, and a wire is implanted at both ends, and then a low-resistance carbon microcrystal is prepared.
  • a medium- and high-resistance nano-carbon microcrystal material is sequentially prepared, and then insulated
  • An anti-infrared layer (prepared by depositing a metal dielectric reflective film on PET by a magnetron sputtering method), a heat insulation layer, a sealing waterproof layer and a wear-resistant layer.
  • an integrated board with a proportion of radiant heat of about 90% was prepared. In the entire heating process, radiant heating is the main part, which accounts for more than 90%, supplemented by conduction and convection heating, and the proportion is not more than 10%. There are several pairs of current introduction points on the edge of the heating material.
  • the electrical connector is embedded in an integrated plate.
  • the invention adopts magnetron sputtering to deposit a metal dielectric, obtain a highly reflective infrared film, and prepare a directional heat-conducting heating plate to concentrate the heat energy to a specified space (the infrared wave band is 5-15 microns, corresponding to the resonance frequency of water molecules) , which can cause it to resonate and convert to thermal energy), which greatly improves heating efficiency; and due to directional thermal conductivity, it gives ordinary building materials a function of directional radiation with a wavelength of 5-15 microns.
  • the present invention also provides another new electric heating integrated board, the electric heating integrated board includes a thermal insulation substrate, a heating film layer and a surface layer;
  • the thickness of the heating film layer is between 50 nm and 10 ⁇ m; and the square resistance of the heating film layer is between 10 and 1000 ⁇ / ⁇ .
  • the heating film layer is an oxide or an oxysulfide
  • the material of the heating film layer includes ZnO x S (1-x) , InO x S (1-x) , Sn x In (1-x) O, One or more of Zn x Mg (1-x) O and Zn x Al (1-x) O.
  • the heat-generating film layer is a oxycarbon compound, and the material of the heat-generating film layer includes SiO x C (1-x) .
  • the heat-generating film layer is a carbonitride, and the material of the heat-generating film layer includes SiC x N (1-x) .
  • the upper and lower surfaces of the heating film layer are provided with an upper insulation waterproof layer and a lower insulation waterproof layer; conductive metal strips are attached to the sides of the heating film layer near the edges as a power supply circuit.
  • the electrodes are electrically connected.
  • the materials of the above-mentioned lower insulation waterproof layer and the upper insulation waterproof layer are inorganic waterproof insulation materials or organic waterproof insulation materials;
  • the inorganic waterproof insulating material includes ceramic, enamel, glass, mica, quartz, and dielectric ceramic;
  • the organic waterproof insulating material includes polyimide, polyamideimide, polyimide, polymaleimide, polydiphenyl ether, modified epoxy, unsaturated polyester, and polyaramide.
  • the above-mentioned electrothermal integrated board further includes an infrared reflective film layer, and the infrared reflective film layer may be located between the substrate and the lower insulating and waterproof layer, and the infrared reflective layer is a metal-containing film layer.
  • the material and size of the heat-insulating substrate satisfy a compressive strength of not less than 10 MPa and a thermal conductivity of less than 0.5 W / (m ⁇ K).
  • the heat-preserving substrate material includes one or more of a calcium silicate board, a silicate board, a mica board, a porous ceramic board, and a porous ceramic board.
  • the material of the surface layer has a Mohs hardness of not less than 3 and abrasion resistance of not more than 500 mm 3 .
  • a method for preparing an electrothermal integrated board includes the following steps:
  • a vacuum coating method is used to prepare a heating film layer on the polished surface of the substrate, and then annealed at 100 to 450 ° C for 10 to 120 minutes;
  • a metal conductive tape is provided on the surface of the heating film layer, and the metal conductive tape is electrically connected to the built-in electrode;
  • a surface layer is provided on the surface of the heating film layer to complete the preparation of the low-voltage electric heating plate.
  • the electrothermal integrated board of the present invention uses an oxide film with a thickness of less than 10 ⁇ m as a heating material, which not only has a small amount of heating material and low production cost of the heating film layer, but also uses an oxide as the heating material, which has stable oxide performance and high heating efficiency.
  • the electric heating integrated board has a long service life, and the heating power attenuation is small during use.
  • the electrothermal integrated board uses vacuum coating to prepare the heating film layer. Not only can the thickness of the heating film layer be accurately controlled, but the vacuum coating can accurately control the composition of the heating material, which can effectively dope the heating material of the heating film layer. Doping improves the infrared emissivity of the heating material. On the other hand, the wavelength of the infrared radiation emitted by the heating material can be effectively adjusted by doping, so that the infrared wavelength emitted by the electrothermal integrated board matches the infrared absorption of the human body.
  • the invention further provides only a heat-generating building material, which can also have an air purification function, thereby reducing harmful substances such as formaldehyde and benzene in the indoor air.
  • Another object of the present invention is to provide a method for preparing the exothermic building material.
  • the present invention provides the following technical solutions:
  • One aspect of the present invention provides a heat-generating building material, the heat-generating building material comprising a heat-insulating layer, a heat-generating layer, and an air purification surface layer connected from top to bottom, the air purification surface layer containing 1 to 40% by weight of air purification material.
  • the heating building material of the present invention realizes the integrated design of heating, heat preservation and purification of building materials by adding air purification materials to the surface layer of the layered structure.
  • the harmful gas released by the heating of the building material itself can be purified, and the other Aspect can also absorb harmful gases in the external environment.
  • the electro-thermal radiation conversion efficiency of the heat-generating building material of the present invention is greater than 60%, and the amount of induced air negative ions can be greater than 1000 / (S ⁇ cm 2 ).
  • the air purification surface layer contains an air purification material
  • the air purification material is a negative ion release material and / or a photocatalyst material, wherein the negative ion release material is a natural inorganic mineral material and / or a synthetic material;
  • the natural inorganic mineral material is at least one selected from the group consisting of tourmaline, hexalite, opal, odd-ice stone, gemstone, seagull, vermiculite and ancient seabed minerals;
  • the artificially synthesized material is an anion powder.
  • the air purification material in the present invention can be selected from inorganic or organic negative ion release materials.
  • the negative ion release materials have multiple functions. In addition to removing harmful gases in the decoration environment, they can also play a role in eliminating odor and high-voltage electrostatic protection. Can play a bacteriostatic effect to a certain extent.
  • materials that can release negative ions, such as tourmaline also have high emissivity, so they can release far-infrared rays more, and far-infrared rays have multiple benefits to the human body. Therefore, the building materials of the present invention can not only purify the air, but also Can play a role in improving the environment and promoting health.
  • the photocatalyst material is selected from at least one of nano TiO 2 , nano ZnO, nano CdS, nano WO 3 , nano Fe 2 O 3 , nano PbS, nano SnO 2 , nano ZnS, nano SrTiO 3 and nano SiO 2 . Species.
  • Photocatalyst materials have the function of decomposing formaldehyde. As one of the main harmful substances brought by decoration, formaldehyde is extremely harmful to the human body. By adding photocatalyst materials to the surface layer of the board, the present invention can remove formaldehyde faster, so it is very Match the application scenarios of the decoration room.
  • the air purification material is uniformly distributed in the air purification surface layer in the form of particles, and the particle size of the air purification material is 0.005 to 500 ⁇ m.
  • the air purification surface layer is composed of a surface layer containing no air purification material and an air purification material layer, and the air purification material layer is located on a surface of the surface layer;
  • the thickness of the surface layer is 0.1 to 10 mm, and the thickness of the air purification material layer is 1 to 500 ⁇ m.
  • the air purification surface layer may be a single mixture layer or two independent layers.
  • the surface material matrix and the air purification material are mixed uniformly and solidified to form a single layer, or may be separate After the surface material is cured into a layer, an air purification layer is formed on the surface layer. Both forms have a strong air purification effect.
  • the thermal insulation layer is composed of a porous or fibrous thermal insulation material
  • the thermal insulation material is selected from the group consisting of a vacuum insulation board, a nano-silica aerogel, a foamed polyurethane, and an extruded polystyrene board, At least one of real gold plate, foamed ceramic, foamed cement, and foamed glass;
  • thermal insulation substrates can be used in the heating building materials of the present invention.
  • the thermal insulation materials used in the present invention should have the following characteristics: lightweight, loose, porous or fibrous, and there is no flowing air inside In order to block heat conduction.
  • the thermal insulation layer substrate of the present invention can be selected from organic, inorganic materials, or a mixture thereof.
  • Inorganic materials have the advantages of non-combustion and good chemical resistance.
  • Organic materials have the advantages of higher strength, lower water absorption, and better water resistance. .
  • the thickness of the thermal insulation layer is 1-10 cm.
  • the material of the heating layer is selected from at least one of carbon black heating material, graphene heating material, carbon fiber heating material, wire heating material, polymer heating material and semiconductor heating material;
  • the thickness of the heating layer is 10-200um.
  • an insulating waterproof layer is further provided between the heating layer and the air purification surface layer;
  • an insulating and waterproof layer is also provided between the thermal insulation layer and the hair;
  • the thickness of the insulating and waterproof layer is 0.1-500um.
  • a method for preparing a heat-generating building material comprising the following steps:
  • the method further comprises: providing an insulating waterproof layer with an electrode between the heat-insulating layer and the heat-generating layer, and connecting the electrode to the electrode joint;
  • the method further includes providing an insulating and waterproof layer between the heat generating layer and the air purification surface layer.
  • the baking temperature for baking curing is 100-170 ° C, and the curing time is 20-40 minutes.
  • the heat-generating building material of the present invention achieves true integration, which has both good mechanical properties and good thermal insulation properties, and has both the mechanical properties of the substrate and the thermal insulation properties of the thermal insulation material.
  • the present invention can fully purify indoor air by incorporating materials having an air purification function in or on the surface layer.
  • the heat-generating building material of the present invention can emit far-infrared rays when it is heated by electricity.
  • the emitted far-infrared rays can improve the activity of the air purification material in the surface layer, and make the air purification material more efficient in generating negative oxygen ions.
  • the building decoration material with room temperature curing function is coated on the electrothermal conversion layer, so that ordinary building decoration materials (floor, tile, wallpaper, etc.) can be converted into an external radiation and heat source. Materials without changing the appearance and texture of the original building materials, thereby changing existing heating methods.
  • the present invention provides a heat-generating integrated board, which comprises a substrate, a heat-generating layer, a metal current-carrying strip, and a wear-resistant water-blocking layer in order from top to bottom;
  • the heating layer is a conductive far-infrared heating material, and is uniformly printed on the substrate by screen printing;
  • the metal current-carrying strips are bonded to the heating layer and are located on both sides of the heating layer, and the metal current-carrying strips on both sides are respectively connected to the power source;
  • the abrasion-resistant and water-blocking layer is prepared by solidifying a liquid material.
  • the heating integrated board includes a substrate, a waterproof layer, a weather-resistant insulating layer, a nano-carbon crystal layer, a metal current-carrying strip, and a wear-resistant water-blocking layer in order from top to bottom;
  • the substrate includes glass, metal plate, cement-based plate, flexible plastic film, tile, tile blank, polyvinyl fluoride composite film, plywood, fiberboard, particle board, solid wood veneer, bamboo veneer, wood-plastic board, and inorganic fireproof board.
  • the waterproof layer is formed by coating and curing a waterproof paint
  • One side of the metal current-carrying strip is in contact with the nano-carbon crystal layer, the other side is in contact with the abrasion-resistant and water-blocking layer, and both ends are welded with the electric wire.
  • the abrasion-resistant and water-blocking layer is prepared by the following raw materials in parts by weight: 100 to 150 parts of modified epoxy resin, 50 to 100 parts of water-based polyurethane emulsion, 3 to 10 parts of basalt powder, and silicon 12 to 17 parts of fine powder, 20 to 30 parts of garnet powder, 1 to 2 parts of flame retardant, 1 to 2 parts of curing agent, 0.5 to 1 part of thickener, 0.05 to 0.1 part of preservative, and 15 to 20 part of deionized water Share
  • the modified epoxy resin is prepared by the following method:
  • step S3 Mill and mix the graphene oxide, nano-alumina, and nano-zinc oxide prepared in step S2 by a ball mill; add to the emulsion obtained in step S1, stir and mix well, add antimony trioxide and nickel oxide, and stir at high speed for 1 h Add polyamide and stir quickly for 2min to obtain modified epoxy resin;
  • the epoxy resin 6101 an amino-containing silane coupling agent, orthosilicate, methyltriethoxysilane, graphene oxide, nano-alumina, nano-zinc oxide, antimony trioxide, and nickel oxide
  • the mass ratio is 120: (7 to 10): (20 to 25): (3 to 5): (1 to 3): (3 to -5): (1 to 3): (0.5 to 1.5): ( 2 to 5);
  • the silane coupling agent having an amino group is selected from one of KH550, KH792, KH-602, WD-50, KBM-603, SI900, Z-6121, Z-6020, GF95, and SI902
  • the organic solvent is selected from one or more of ethyl acetate, acetone, dichloroethane, acetonitrile, ethanol, methanol, toluene, and pyridine.
  • the curing agent is selected from one of imidazole curing agents, organic acid anhydride curing agents, and amine curing agents; and the thickener is selected from carboxymethyl cellulose, hydroxyethyl cellulose , Methyl cellulose, hydroxypropyl methyl cellulose, sodium polyacrylate, organic bentonite, polyacrylamide, guar gum, xanthan gum, ZW raw powder, AT-70 thickener, PR-328 thickening Agent, TD-01 thickener, HEUR series polyurethane associative thickener, Rheoagent GC-2440 thickener, GD-8201 coating special thickener, DH series thickener and CH-718 series thickener One or more of the agents; the preservative is selected from 1,2 benzoisothiazolin-3-one, 2-methyl-4 isothiazolin-3-one, 5-chloro-2-methyl One or more of 4-4 isothiazolin-3-one and 2-methyl-4
  • the heat-generating layer preparation material includes a conductive heat-generating material, turpentine alcohol-permeability, and ethyl cellulose.
  • the conductive heating material includes one or more of nano-carbon crystal powder, graphene, carbon fiber, carbon nanotube, expanded graphite, lanthanum chromate, silicon carbide, molybdenum silicide, and barium titanate. combination.
  • the metal current-carrying strip can adapt to the requirements of different currents and voltages by changing the size of its cross-sectional area; the metal current-carrying strip can take a length direction or a width direction according to the requirements of use Two ways of paving.
  • the surface and surroundings of the heat-generating layer are covered with an insulating and waterproof film, so that it has the functions of insulation and waterproof.
  • a thermal storage layer is further included, and the thermal storage layer is disposed between the heating layer and the substrate and / or the metal current carrying bar and the wear-resistant water blocking layer.
  • the invention further protects a method for preparing the above-mentioned heat-generating integrated board, which includes the following steps: after polishing and grinding the back surface of the substrate, applying a heat-generating layer to the polished surface of the substrate by printing or coating, and then on the heat-generating layer
  • the metal current-carrying bars with different cross-sectional areas are laid in the length direction or width direction, and the two ends are connected with the connection plug; then the surface of the heating layer and the metal current-carrying bar is coated with a wear-resistant and water-blocking layer with a thickness of 1 ⁇ m to 5 mm.
  • the heat-generating integrated board is prepared; the two heat-generating integrated boards are connected through a connection plug, and the connection plug has a conductive function.
  • the invention adopts thin film integration technology, and coats the building decoration material with a normal temperature curing function on the electrothermal conversion layer, so that ordinary building decoration materials (floor, tile, wallpaper, etc.) are transformed into an integrated material that can radiate infrared and heat sources to the outside. Without changing the appearance and texture of the original building materials, thereby changing the existing heating method;
  • the back surface (non-decorative surface) is polished and polished to sequentially prepare the electrothermal conversion and the surface layer.
  • a radiant heating integrated sheet is prepared.
  • the edge of the heating material is provided with a current introduction point, which converts electrical energy into thermal energy, and heats the room mainly by radiant heating, supplemented by conduction and convection heating, thereby achieving long-term uniform heating and safe technology. effect;
  • the multi-mesh structure on the screen printing plate of the present invention allows the conductive heating material and paste to pass through the porous structure of the screen under the action of a scraper, thereby obtaining one or more uniform heating layers on the weather-resistant insulating layer.
  • a heat-generating layer with good thermal conductivity and uniform thermal conductivity is obtained.
  • the present invention uses a carbon-based material or a non-carbon material to prepare a heat-generating layer.
  • the heat-generating layer is in direct contact with a metal current carrying bar and has good electrical conductivity. Vibration heat, which is radiated into the room in the form of infrared rays, so as to achieve a good heat insulation effect, and its heat storage layer can further play a role in keeping warm;
  • the invention uses a silane coupling agent with an amino group to catalyze the ring-opening reaction of epoxy resin and the dehydration condensation reaction of ethyl orthosilicate, so that the silicon group is connected to the epoxy resin to achieve modification; methyl triethoxy group is added
  • the oxides such as graphene oxide, nano-alumina, nano-zinc oxide, antimony trioxide, and nickel oxide are connected to the epoxy polymer, thereby realizing the modification of the epoxy resin by inorganic oxides.
  • the epoxy resin has good abrasion resistance, chemical resistance and good hardness and toughness;
  • the preparation method of the invention is simple and has a wide range of applications. It can be applied to almost all substrates.
  • the raw materials are widely available.
  • the prepared heat-generating integrated board has superior mechanical properties, is convenient for transportation and storage, has uniform heat generation, is safe to use, and has a long service life. Broad application prospects.
  • the application also provides a heat generating component and a method for manufacturing the same to solve the problems of unreliable connection between the conductive element and the heat generating layer of the existing heat generating component and excessive contact resistance at the connection between the two.
  • the present application provides a heat generating component, including a heat generating layer and a lower bearing layer disposed below the heat generating layer, conductive elements are disposed at both ends of the lower bearing layer, and the heat generating layer is made of a conductive heat generating material.
  • the conductive heating material has a liquid and solid state or a form with a semi-solid and solid state;
  • the conductive heating material When the conductive heating material is in a liquid state or a semi-solid state, the conductive heating material is attached to the conductive element and the lower supporting layer, and the conductive heating material is cured with the conductive element and the lower portion, respectively.
  • the bearing layer is fixedly connected.
  • the contact resistance between the heating layer and the conductive element formed by curing of the conductive heating material does not exceed 900 ohms.
  • the conductive heat-generating material when the conductive heat-generating material is in a liquid or semi-solid state, the conductive heat-generating material is attached to the conductive element and the lower supporting layer by printing or coating.
  • the conductive heating material includes carbon paste and graphene
  • the conductive element includes copper foil, aluminum foil, and silver foil.
  • a top surface of the conductive element is flush with a top surface of the lower bearing layer.
  • the insulating and waterproof material is formed by compounding a base material and a reinforcing material;
  • the base material includes synthetic resin, rubber, and ceramic, and the reinforcing material includes glass fiber, boron fiber, aramid fiber, silicon carbide fiber, asbestos fiber, and whiskers.
  • it further comprises an upper bearing layer, which is disposed above the heating layer in the vertical direction (Z);
  • the upper bearing layer and the lower bearing layer are both made of an insulating and waterproof material.
  • it further comprises a base layer and a surface layer.
  • the surface layer, the upper load-bearing layer, the heat-generating layer, the lower load-bearing layer and the base layer are sequentially stacked from top to bottom. Settings.
  • the base layer is provided with a mounting groove, and the mounting groove is used for mounting a connection element electrically connected to the conductive element;
  • the base layer and the lower load-bearing layer are provided with mounting holes, the mounting holes communicate with the mounting grooves, and the mounting holes are used to pass through the conductive elements and The wire for the electrical connection of the connecting element.
  • a method for preparing a heating component includes steps:
  • the heating layer is formed on a conductive element and a lower supporting layer, and the conductive elements are disposed at both ends of the lower supporting layer.
  • the heating layer is made of a conductive heating material, and the conductive heating material has a liquid state and a solid state or Available in semi-solid and solid forms; where,
  • the conductive heating material When the conductive heating material is in a liquid or semi-solid state, the conductive heating material is attached to the conductive element and the lower supporting layer, and then the conductive heating material is cured to make the conductive heating material
  • the heat-generating layer formed after curing is fixedly connected to the conductive element and the lower carrier layer, respectively.
  • the method before forming the heating layer on the conductive element and the lower supporting layer in the step, the method further includes the step:
  • the base layer, the lower supporting layer, and the conductive element are laminated and molded.
  • the step of forming the heating layer on the conductive element includes: attaching the conductive heating material in a liquid or semi-solid form to the conductive element and the lower supporting layer by printing or coating. .
  • the method further includes the step:
  • the base layer, the lower supporting layer, the conductive element, the conductive heating material, and the upper supporting layer are laminated and formed.
  • the method further includes the following steps:
  • a surface layer is provided on the upper bearing layer.
  • the present application solves the existing heat generation by attaching a conductive heating material in a liquid or semi-solid form to the conductive element and the lower supporting layer, so that the conductive heating material is fixedly connected to the conductive element and the lower supporting layer respectively after curing.
  • FIG. 1 is the base material; 2 is the thermal insulation layer; 3 is the reflective layer; 4 is the heat radiation layer; 5 is the porcelain glaze decorative layer;
  • FIG. 3 is a schematic structural diagram of an integrated heat transfer plate obtained in Embodiment 3 of the present invention.
  • Embodiment 4 is a schematic structural diagram of an integrated heat transfer plate obtained in Embodiment 4 of the present invention.
  • FIG. 5 is a schematic structural diagram of a heat transfer integrated plate obtained in Embodiment 5 of the present invention.
  • FIGs. 3-5 are identified by 1, the substrate; 2, the first waterproof layer; 3, the insulating layer; 4, the electrothermal conversion layer; 5, the insulating layer; 6, the heat insulating layer; 7, the sealing layer; 8 Reflective layer; 9, wear-resistant and water-blocking layer; 10, wire;
  • FIG. 6 is a schematic structural diagram of a self-heating integrated board of the present invention (including an infrared reflective film layer);
  • FIG. 7 is a schematic structural diagram of a self-heating integrated board of the present invention (without an infrared reflective film layer);
  • FIG. 6-7 are: 1. Insulation substrate, 2. Infrared emitting film layer, 3. First insulating and waterproof film layer, 4. Heating film layer, 5. Second insulating and waterproof film layer, 6. Surface layer, 7. Conductive metal tape;
  • FIG. 8 is a schematic structural diagram of a directional heat transfer integrated plate obtained in Embodiment 17 of the present invention.
  • Embodiment 18 of the present invention is a schematic structural diagram of a directional heat transfer integrated plate obtained in Embodiment 18 of the present invention.
  • FIG. 10 is a schematic structural diagram of a directional heat transfer integrated plate obtained in Embodiment 19 of the present invention.
  • Figures 8-10 are marked as follows: 1. substrate; 2. waterproof layer; 3. insulating layer; 4. electrothermal conversion layer (composed of three carbon microcrystalline layers with different resistance values); 5. Insulation reflective layer; 6, heat insulation layer; 7, sealing layer; 8, second waterproof layer; 9, wear-resistant layer; 10, wire;
  • FIG. 11 is a cross-sectional view of an electrothermal integrated plate in Embodiment 21;
  • FIG. 12 is a flowchart of a method for preparing an electrothermal integrated board in Embodiment 21;
  • FIG. 13 is a schematic structural diagram of an embodiment of a heating building material according to Example 22;
  • FIG. 14 is a schematic structural diagram of a heating integrated board according to the present invention.
  • 15 is a schematic diagram of a distribution of a metal current carrying bar according to the present invention.
  • 16 is a schematic diagram of a connection end of a metal current carrying bar and a wire of the present invention.
  • FIG. 17 is a schematic structural diagram of a heating component provided by the present application.
  • FIG. 18 is a schematic flowchart of a method for preparing a heating element provided by the present application.
  • 1-surface layer 2-upper load-bearing layer; 3-heating layer; 4-lower load-bearing layer; 5-base layer; 51-mounting slot; 52-mounting hole; 61-conducting element; 62-connecting element; 63-wire.
  • FIG. 1 shows a new type of heating building material product.
  • the heating building material includes a base material 1, a heat insulation layer 2, a reflection layer 3, a heat radiation layer 4, and an enamel finish layer 5 (enamel film).
  • the material of the heat-insulating layer may be selected from porous materials, foam materials, and fiber materials, including asbestos, glass fiber, and aerogel felt.
  • the reflective layer material can be selected from gold, silver, nickel, aluminum foil, and metal-plated polyester and polyimide films.
  • the heating radiation layer includes a heating material and a conductive material, and may further include an insulating material.
  • the heating radiation layer heating material is graphite, graphene, nano-carbon, special ink, polymer conductive film
  • the heating radiation layer conductive material is copper wire, copper foil or nano silver paste
  • the heating radiation layer is insulated
  • the material is PET polyester film, PCT, PE.
  • the thickness of the enamel decorative layer is 1 ⁇ m to 5 mm. If the decorative layer is thin, the heating element layer has high heating efficiency, but it is difficult to form rich patterns with different colors. If the decorative layer is thick, the color is more abundant. However, there are higher requirements for the uniformity and thermal conductivity of the film.
  • the facing layer can be an enamel film, which can be used to design glossy glazes, semi-gloss glazes, matte glazes and shattered glazes for heating building material products, and different colors can be designed for the enamel film as required.
  • the protective layer should be as transparent as possible so that sunlight can pass through the maximum.
  • the enamel layer is introduced, and the enamel layer can be selectively colored, so that the heating building materials can be integrated into the surrounding environment. Provide more possibilities in interior decoration and architectural design.
  • the enamel film selected in the present invention is preferably an inorganic silicate material or an inorganic organic composite material, and its composition includes O, Na, Ga, Mg, S, Si, Al, Ca, Co, K, Zr, Ba, P, and A plurality of elements such as B can be formed by reacting a raw material (such as an oxide or a corresponding salt such as sodium silicate, magnesium hydroxide, potassium carbonate) containing these elements at a low temperature to form a glaze.
  • a raw material such as an oxide or a corresponding salt such as sodium silicate, magnesium hydroxide, potassium carbonate
  • the raw materials can also be selected from sodium titanate, quartz sand, feldspar powder, sodium carbonate, 3.7-4.0 parts of sodium nitrate, cryolite, zirconium dioxide, aluminum phosphate, cobalt nitrate, nickel nitrate, zinc oxide, barium carbonate, etc.
  • the raw material serves as a source of different oxides.
  • the abrasive is sintered at a high temperature (for example, 800-850 degrees Celsius), and is quenched and pulverized to obtain an enamel glaze.
  • the glaze can be ball-milled to obtain finer particles, which makes it suitable for inkjet printing or Spray directly.
  • glaze components that can be used can also be 0.06MgSO 4 ⁇ 0.10CaO ⁇ 0.12ZrO ⁇ 0.64Na 2 SiO 3 ⁇ 0.05Al 2 (SO 4 ) 3 ⁇ 0.03Co 2 O 3 , or 0.06BaSO 4 ⁇ 0.11CaO ⁇ 0.13TiO 2 ⁇ 0.65Na 2 SiO 3 ⁇ 0.04Al 2 (SO 4 ) 3 ⁇ 0.01Co 2 O 3 , 0.10BaSO 4 ⁇ 0.10TiO 2 ⁇ 0.75K 2 SiO 3 ⁇ 0.04Al 2 (SO 4 ) 3 ⁇ 0.01 Co 2 O, or 0.06MgSO 4 ⁇ 0.10TiO 2 ⁇ 0.12ZrO ⁇ 0.605K 2 SiO 3 ⁇ 0.085Al 2 (SO 4 ) 3 ⁇ 0.03CoCl 2 , or 0.08BaO ⁇ 0.10Ga 2 O 3 ⁇ 0.12ZrO ⁇ 0.565K 2 SiO 3 ⁇ 0.085
  • the so-called water-based glaze may be any of the above materials.
  • the film of the enamel finish layer maintains a high transmittance in the infrared wave band, and has a certain transmittance and absorption at 300-1000 nm.
  • the specific component is added or doped in the film, so that it has an absorptivity at a specific wavelength, so that the decorative layer has a rich color.
  • the ultraviolet light absorber is a benzotriazole ultraviolet absorber, which is selected from 2- (2 ⁇ -hydroxy-5 ⁇ -Methyl) -benzotriazole, 2- (2 ⁇ -hydroxy-3 ⁇ -tert-butyl-5 ⁇ -methyl) -5-chloro-benzotriazole, 2- (2 ⁇ -hydroxy-3 ⁇ 5 ⁇ -di-tert-butyl ) -5-chloro-benzotriazole, 2 '-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2fluorene- One or more of hydroxy-5 ⁇ -tert-octyl) -benzotriazole can achieve ultraviolet light absorption; adding indium tin oxide, tin antimony oxide, tungsten trioxide, molybdenum trioxide, tungsten
  • the glaze preparation includes 100 parts of glass powder, 60 parts of water and 60 parts of chemical raw materials. Chemical raw materials are calculated by mass fraction, including: Al (OH) 3 10 parts, NaOH 10 parts, K 2 CO 3 9 parts, MgSO 4 3 parts, Ba (OH) 2 2 parts, CaCO 3 12 parts, K 2 SO 4 1 part, TiO 2 0.5 part, polyacrylamide 0.4 part and water glass 0.4 part.
  • the mixed powder was ball milled for 10 h.
  • the heating building material uses marble as the base material, and asbestos is attached to it as a heat insulation layer, and a gold-plated polyimide film is used as a reflective layer.
  • the two are tightly connected by an adhesive.
  • the reflective layer is covered with a heat radiation layer, wherein the heat radiation layer includes an insulating layer, a heat generation layer, and a conductive layer.
  • the upper and lower insulation film layers are integrated by fusion technology.
  • a graphite heating layer is sandwiched in the insulation layer, and a copper wire conductive layer is connected to the external circuit at the top.
  • the different layers are firmly bonded together by adhesive.
  • the insulating film is made of PET polyester film, which has good insulation properties.
  • the conductive layer is made of copper wires, and the conductivity of copper is good.
  • a porcelain enamel finish layer was deposited on the upper layer of the heat radiation layer by a 3D printing device, and the heat radiation layer was set at a temperature of 40 ° C.
  • the 3D printing equipment includes: a cylinder, a propeller, a nozzle, a nozzle diameter of 0.5mm, controlling the 3D printing equipment, extruding the glaze from the nozzle, and accumulating a thickness of 5 ⁇ m according to the software output path.
  • the required pattern of glaze is printed.
  • the prepared pattern was beige.
  • the transmittance of the prepared enamel finish layer is shown in FIG. 2.
  • the glaze preparation includes 80 parts of glass powder, 50 parts of water and 70 parts of chemical raw materials.
  • Chemical raw materials are calculated by mass fraction, including: 15 parts of Al (OH) 3 , 12 parts of NaOH, 14 parts of K 2 CO 3 , 5 parts of MgSO 4 , 4 parts of Ba (OH) 2 , 18 parts of CaCO 3 , and K 2 SO 4 3 parts, 1 part of TiO 2 , 0.5 part of polyacrylamide, and 0.4 part of water glass.
  • the mixed powder was ball milled for 6h.
  • the heating building material uses a cement board as a base material, and glass fiber is attached thereon as a heat insulation layer, and a silver foil is plated on the upper surface of the heat insulation layer as a reflection layer.
  • the reflective layer is covered with a heat radiation layer, wherein the heat radiation layer includes an insulating layer, a heat generation layer, and a conductive layer.
  • the upper and lower insulating film layers are fused by fusion technology.
  • the insulating layer is sandwiched with a graphene heating layer, and the top is connected to the external circuit through a nano silver paste printed conductive layer.
  • the insulating film and the heating layer are firmly combined by an adhesive.
  • the insulating film is made of PET polyester film, which has good insulation
  • the conductive layer is made of nano silver paste, which has good conductivity.
  • the ceramic glaze layer was ultrasonically atomized on the heat radiation layer, and the heat radiation layer was set at 80 ° C.
  • An input atomizer was used, the ultrasonic frequency was 1.7 MHz, the atomization amount was 4 mL / min, argon gas was used as the carrier gas, the distance between the spray port and the substrate was 4 mm, and a ceramic glaze layer was prepared with a thickness of 10 ⁇ m.
  • the prepared pattern was purple.
  • the transmittance of the prepared ceramic glaze layer is shown in FIG. 2.
  • the glaze preparation includes 120 parts of glass powder, 50 parts of water and 50 parts of chemical raw materials.
  • Chemical raw materials are calculated by mass fraction, including: Al (OH) 3 18 parts, NaOH 14 parts, K 2 CO 3 18 parts, MgSO 4 8 parts, Ba (OH) 2 6 parts, CaCO 3 15 parts, K 2 SO 4 5 parts, 2 parts of TiO 2, 1 part of polyacrylamide and 0.8 part of water glass.
  • the mixed powder was ball milled for 8h.
  • the heating building material uses marble as a base material, and aerogel felt is attached to it as a heat insulation layer, and an aluminum foil is plated on the upper surface of the heat insulation layer as a reflection layer.
  • the reflective layer is covered with a heat radiation layer, wherein the heat radiation layer includes a heat generation layer and a conductive layer.
  • the polymer conductive film is used as a heating layer, and the top is connected to the external circuit through a copper wire.
  • the insulating film is made of PET polyester film, which has good insulation, and the conductive layer is made of copper wire, which has good conductivity.
  • the ceramic glaze layer is ultrasonically atomized on the heat radiation layer, and the heat radiation layer is set at 60 ° C.
  • An input atomizer was used, the ultrasonic frequency was 2.0 MHz, the atomization amount was 10 mL / min, air was used as the carrier gas, the distance between the spray port and the substrate was 5 mm, and a ceramic glaze layer was prepared with a thickness of 50 ⁇ m.
  • the prepared pattern was blue.
  • the transmittance of the prepared ceramic glaze layer is shown in FIG. 2.
  • Examples 4-6 further describe a method for preparing a heat transfer integrated plate to eliminate the phenomenon of electric spark.
  • a method for preparing a heat transfer integrated plate includes:
  • FIG. 3 shows a heating board prepared according to the method of Embodiment 1, which includes a substrate 1, a waterproof layer 2, an insulating layer 3, a carbon microcrystalline layer 4, an insulating reflective layer 5, and a heat insulating layer. 6.
  • the electrical performance test of the integrated heat transfer board was conducted in accordance with the normal use environment and testing, and no electric spark was found.
  • a method for preparing a heat transfer integrated plate includes:
  • a metal dielectric reflective film is prepared on the first PET waterproof layer to form a heat-reflective reflective layer having a thickness of 30 microns;
  • An insulating layer is prepared on the heat-reflecting layer, and its thickness is 10 microns;
  • FIG. 5 shows a heating board prepared according to the method of Example 4, which includes a substrate 1, a waterproof layer 2, a heat-reflective layer 3, an insulating layer 4, a carbon microcrystalline layer 5, and a waterproof seal.
  • the electrical performance test of the integrated heat transfer board was conducted in accordance with the normal use environment and testing, and no electric spark was found.
  • a method for preparing a heat transfer integrated plate includes:
  • a metal dielectric reflective film is prepared on the first PET waterproof layer to form a heat-reflective layer having a thickness of 3 microns;
  • An insulating layer is prepared on the heat-reflecting layer, and its thickness is 10 microns;
  • the low-resistance nano-carbon microcrystals (resistance value: 10-300 ⁇ / ⁇ ), medium-resistance nano-carbon microcrystal materials (resistance value: 300-1000 ⁇ / ⁇ , thickness: 200 microns) and high Nano carbon microcrystalline material with resistance (resistance greater than 1000 ⁇ / ⁇ , thickness of 200 microns), increasing in order along the electrode toward the center line, and baked at 180 degrees Celsius to form a carbon microcrystalline layer.
  • the cured carbon microcrystalline The layer is bonded to a self-adhesive tinned copper, and the contact resistance at the electrical connection is 889 ⁇ ;
  • FIG. 6 shows a heating board prepared according to the method of Embodiment 3, which includes a substrate 1, a waterproof layer 2, a heat-reflecting layer 3, an insulating layer 4, a graded carbon microcrystalline layer 5, The waterproof layer 6, the surface layer 7, and the lead wires 8 are sealed.
  • the electrical performance test of the integrated heat transfer board was conducted in accordance with the normal use environment and testing, and no electric spark was found.
  • Examples 7-16 are steps for preparing a self-heating integrated board.
  • the method for preparing a typical self-heating integrated board of the present invention includes the following steps:
  • An infrared reflective film layer, a first insulating and waterproof film layer, and a heating film layer are sequentially stacked or formed on the polished surface, and then a guide bar is provided on the heating film layer, and the guide bar and the electrode are formed.
  • a second insulating and waterproof film layer and a surface layer are sequentially stacked or formed on the heating film layer.
  • the electrothermal radiation conversion efficiency is tested according to the thermal image measurement method defined in GB / T7287-2008.
  • the conversion efficiency calculation formula is:
  • the first insulating and waterproof film layer is prepared by rolling on the surface of the infrared reflective film layer with an epoxy insulating paint, the thickness is 500 ⁇ m, and it is left to cure at room temperature for 24 hours.
  • the surface of the heat-generating film layer is prepared by roll-coating an epoxy insulating paint with a thickness of 500 ⁇ m, and it is cured by being left at room temperature for 24 hours.
  • the surface layer is prepared by cement curing on the surface of the second insulating and waterproof film layer, the thickness of the surface layer is 2mm, and the surface layer is cured at 50 ° C for 2h, and the self-heating integrated board is completed;
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Example 1, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 10 mm
  • the thickness of the infrared reflective film layer 2 is 2 ⁇ m
  • the thickness of the first insulating waterproof film layer 3 is 500 ⁇ m
  • the thickness of the heating film layer 4 is 10 ⁇ m
  • the thickness of the second insulating waterproof film layer 5 is 500 ⁇ m
  • the surface layer 6 The thickness is 2mm.
  • test results show that the ratio of 82% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • a 50 nm thick aluminum film is prepared on the surface of the substrate after cleaning by using a magnetron sputtering method as an infrared reflective film layer;
  • a layer of ZS-1091 high-temperature-resistant ceramic insulation coating is prepared on the surface of the infrared reflective film layer as a first insulating and waterproof film layer by spraying, and has a thickness of 1 ⁇ m.
  • a UV printing surface layer is used on the surface of the second insulating and waterproof film layer, and the thickness of the surface layer is 5 ⁇ m, and the self-heating integrated board is prepared.
  • the self-heating integrated board prepared in this embodiment is very thin and suitable for installation in indoor ceilings.
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Embodiment 8, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 0.5 mm
  • the thickness of the infrared reflective film layer 2 is 50 nm
  • the thickness of the first insulating waterproof film layer 3 is 1 ⁇ m
  • the thickness of the heating film layer 4 is 1 ⁇ m
  • the thickness of the second insulating waterproof film layer 5 is 1 ⁇ m
  • the surface layer 6 The thickness is 5 ⁇ m.
  • test results show that 95% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • a layer of PET is prepared on the surface of the infrared reflective film layer by hot pressing, and the thickness of the PET is 0.5 mm.
  • heating film layer is prepared by hand coating on the surface of the first insulating and waterproof film layer, and the heating layer uses a mixture of graphite and carbon black as a heating material, and is dried at 120 ° C. for 2 hours;
  • a 5 mm thick marble board is laminated and packaged on the surface of the second insulating and waterproof film layer as a surface layer, and the self-heating integrated board is prepared.
  • the self-heating integrated board prepared in this embodiment is thick and sturdy, and is suitable for installation on indoor floors.
  • test results show that the proportion of 76% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Embodiment 9, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 30 mm
  • the thickness of the infrared reflective film layer 2 is 0.1 mm
  • the thickness of the first insulating and waterproof film layer 3 is 0.5 mm
  • the thickness of the heating film layer 4 is 800 ⁇ m
  • the thickness of the second insulating and waterproof film layer 5 is 0.5 mm.
  • the thickness of the surface layer 6 is 5 mm.
  • a layer of PC is prepared on the surface of the infrared reflective film layer as a first insulating and waterproof film layer by hot pressing, and the thickness of the PC film layer is 1 mm.
  • a 500 ⁇ m thick heating film layer is prepared on the surface of the first insulating and waterproof film layer by coating, and the heating layer uses a mixture of graphite and carbon black as a heating material;
  • a ceramic plate with a thickness of 3 mm is laminated and packaged on the surface of the second insulating and waterproof film layer as a surface layer, thereby completing the preparation of the self-heating integrated board.
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Example 10, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 20 mm
  • the thickness of the infrared reflective film layer 2 is 0.1 mm
  • the thickness of the first insulating and waterproof film layer 3 is 1 mm
  • the thickness of the heating film layer 4 is 500 ⁇ m
  • the thickness of the second insulating and waterproof film layer 5 is 1 mm
  • the surface layer 6 The thickness is 3mm.
  • test results show that 81% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Example 11, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 12 mm
  • the thickness of the infrared reflective film layer 2 is 1 ⁇ m
  • the thickness of the first insulating waterproof film layer 3 is 100 ⁇ m
  • the thickness of the heating film layer 4 is 100 ⁇ m
  • the thickness of the second insulating waterproof film layer 5 is 100 ⁇ m
  • the surface layer 6 The thickness is 1mm.
  • test results show that the proportion of 87% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • a 30cm ⁇ 30cm rock plate is used as a thermal insulation substrate, the substrate thickness is 10mm, and one bottom surface is polished, cleaned and dried, and the polished surface of the substrate is waterproofed with a waterproof emulsion.
  • a layer of epoxy insulating paint is prepared on the surface of the infrared reflective film layer by a roll coating method as a first insulating waterproof film layer, and the thickness of the epoxy insulating paint is 300 ⁇ m.
  • a UV printing surface layer is used on the surface of the second insulating and waterproof film layer, and the thickness of the surface layer is 0.5 mm, and the self-heating integrated board is completed.
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Example 12, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 10 mm
  • the thickness of the infrared reflective film layer 2 is 100 ⁇ m
  • the thickness of the first insulating waterproof film layer 3 is 300 ⁇ m
  • the thickness of the heating film layer 4 is 50 ⁇ m
  • the thickness of the second insulating waterproof film layer 5 is 300 ⁇ m
  • the surface layer 6 The thickness is 0.5mm.
  • test results showed that the proportion of 89% of the input power was converted into infrared rays with a wavelength of 5-15 microns.
  • step (3) preparing the second insulating and waterproof film layer on the surface of the heat-generating film layer in the same manner as in step (3);
  • FIG. 7 shows a self-heating integrated board prepared according to the method of Embodiment 13 and includes a substrate 1, a first insulating and waterproof film layer 3, a heating film layer 4, and a second insulating and waterproof film layer 5.
  • the surface layer 6 and the conductive metal strip 7, wherein the heat-preserving substrate 1, the first insulating and waterproof film layer 3, the heating film layer 4, the second insulating and waterproof film layer 5, and the surface layer 6 are sequentially arranged to form an integrated structure.
  • the thickness of the substrate 1 is 12 mm
  • the thickness of the first insulating and waterproof film layer 3 is 200 ⁇ m
  • the thickness of the heating film layer 4 is 300 ⁇ m
  • the thickness of the second insulating and waterproof film layer 5 is 200 ⁇ m
  • the thickness of the surface layer 6 is 1 mm.
  • test results show that 85% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • a 500 ⁇ m-thick aluminum film is prepared as an infrared reflecting film layer on the polished surface of the substrate by evaporation after cleaning;
  • heating film layer with a thickness of 200 ⁇ m by screen printing on the surface of the first insulating and waterproof film layer, and the heating film layer uses carbon black and tourmaline fine powder as a heating material;
  • a ceramic plate with a thickness of 3 mm is laminated and packaged on the surface of the second insulating and waterproof film layer as a surface layer, thereby completing the preparation of the self-heating integrated board.
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Example 14, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 5 mm
  • the thickness of the infrared reflective film layer 2 is 300 ⁇ m
  • the thickness of the first insulating waterproof film layer 3 is 50 ⁇ m
  • the thickness of the heating film layer 4 is 200 ⁇ m
  • the thickness of the second insulating waterproof film layer 5 is 50 ⁇ m
  • the surface layer 6 The thickness is 3mm.
  • test results showed that the proportion of 79% of the input power was converted into infrared rays with a wavelength of 5-15 microns.
  • a 30cm ⁇ 30cm silicon-calcium plate is used as a thermal insulation substrate with a thickness of 12mm, and one bottom surface is polished, cleaned and dried, and the polished surface of the substrate is waterproofed with a waterproof emulsion.
  • a two-component polyurethane insulating layer is manually set on the surface of the infrared reflective film layer as the first insulating waterproof film layer, and the thickness of the polyurethane insulating paint is 100 ⁇ m.
  • a 50 ⁇ m heating film is laminated on the surface of the first insulating and waterproof film layer, and the heating film layer uses graphene and tourmaline fine powder as a heating material;
  • a 0.5 mm thick epoxy coating layer is laminated on the surface of the second insulating and waterproof film layer, and dried at 80 ° C. for 5 hours to be cured, thereby completing the preparation of the self-heating integrated board.
  • FIG. 6 shows a self-heating integrated board prepared according to the method of Example 15, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure.
  • the thickness of the substrate 1 is 12 mm
  • the thickness of the infrared reflective film layer 2 is 80 ⁇ m
  • the thickness of the first insulating waterproof film layer 3 is 100 ⁇ m
  • the thickness of the heating film layer 4 is 50 ⁇ m
  • the thickness of the second insulating waterproof film layer 5 is 100 ⁇ m
  • the surface layer 6 The thickness is 0.5mm.
  • test results show that the proportion of 91% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • the thickness of the polyurethane insulation paint is 100 ⁇ m.
  • a screen printing method is used to prepare a heating film layer with a thickness of 500 ⁇ m on the surface of the first insulating and waterproof film layer; the heating film layer uses nano-carbon crystals and far-infrared ceramics as heating materials;
  • step (3) preparing the second insulating and waterproof film layer on the surface of the heat-generating film layer in the same manner as in step (3);
  • a UV printing surface layer is used on the surface of the second insulating and waterproof film layer, and the thickness of the surface layer is 50 ⁇ m, which completes the preparation of the self-heating integrated board.
  • FIG. 7 shows a self-heating integrated board prepared according to the method of Example 16, which includes a substrate 1, a first insulating and waterproof film layer 3, a heating film layer 4, a second insulating and waterproof film layer 5, The surface layer 6 and the conductive metal strip 7, wherein the thermal insulation substrate 1, the first insulating and waterproof film layer 3, the heating film layer 4, the second insulating and waterproof film layer 5, and the surface layer 6 are sequentially arranged to form an integrated structure.
  • the thickness of the substrate 1 is 8 mm
  • the thickness of the first insulating waterproof film layer 3 is 100 ⁇ m
  • the thickness of the heating film layer 4 is 500 ⁇ m
  • the thickness of the second insulating waterproof film layer 5 is 100 ⁇ m
  • the thickness of the surface layer 6 is 50 ⁇ m.
  • test results show that 90% of the input power is converted into infrared rays with a wavelength of 5-15 microns.
  • Examples 17-20 illustrate methods for preparing a directional heat transfer integrated plate.
  • a typical method for preparing the directional heat transfer integrated plate includes:
  • the source of carbon microcrystals used to construct the carbon microcrystal film of the present invention is commercially available; for descriptions of its further properties, refer to CN106084989A, CN107949081A, CN208241914U.
  • the conductive tape can be selected from copper wire / tape, copper foil, aluminum foil and other materials.
  • a method for preparing a directional heat transfer integrated plate includes:
  • the waterproof coating PI to prepare the first waterproof layer uniformly by scraping on the back of the tile.
  • the thickness after curing is 1 micron, covered with a self-adhesive PET film over the first waterproof layer after curing to form a weather-resistant insulating layer with a thickness of 1 micron, and then screen-printed the low-resistance nano-carbon microcrystals (resistance 10 -300 ⁇ / ⁇ ) coated on the insulation layer with a thickness of 220 microns, and then implanted with a conductive copper strip, dried at 120 degrees Celsius to remove the solvent, and on this basis, the nano-carbon nanocrystalline material with medium resistance was prepared layer by layer.
  • a directional heat-conducting integrated sheet with a surface heating ratio of 92% was prepared.
  • radiant heating is the main component, accounting for 92%, supplemented by conduction and convection heating, and the heating material body is provided with a current introduction point, and the carbon microcrystalline film is electrically connected through conductive charging.
  • FIG. 8 shows a heating board prepared according to the method of Example 17, which includes a substrate 1, a waterproof layer 2, an insulating layer 3, an electrothermal conversion layer 4, an insulating reflective layer 5, a heat insulating layer 6, The sealing layer 7, the second waterproof layer 8, the wear-resistant layer 9, and the lead wires 10 drawn out.
  • a method for preparing a directional heat transfer integrated plate includes:
  • a metal dielectric reflective film is prepared on the first PET waterproof layer to form a heat-reflective reflective layer having a thickness of 30 microns;
  • An insulating layer is prepared on the heat-reflecting layer, and its thickness is 10 microns;
  • FIG. 9 shows a heating board prepared according to the method of Embodiment 18, which includes a substrate 1, a first waterproof sealing layer 2, a heat-reflecting layer 3, an insulating layer 4, an electrothermal conversion layer 5, a first Two sealing waterproof layers 6, surface layers 7, and lead wires 8 are drawn out.
  • a method for preparing a directional heat transfer integrated plate includes:
  • a metal dielectric reflective film is prepared on the first PET waterproof layer to form a heat-reflective reflective layer having a thickness of 30 microns;
  • An insulating layer is prepared on the heat-reflecting layer, and its thickness is 10 microns;
  • FIG. 10 illustrates a heating board prepared according to the method of Embodiment 17, which includes a substrate 1, a first waterproof sealing layer 2, a heat-reflecting layer 3, an insulating layer 4, an electrothermal conversion layer 5, a first Two sealing waterproof layers 6, surface layers 7, and lead wires 8 are drawn out.
  • a method for preparing a directional heat transfer integrated plate includes:
  • the first waterproof coating is scraped on the polished surface of the substrate, and its thickness is 30 microns after curing;
  • a metal dielectric reflective film is prepared on the first PET waterproof layer to form a heat-reflective layer having a thickness of 3 microns;
  • An insulating layer is prepared on the heat-reflecting layer, and its thickness is 9 microns;
  • FIG. 10 shows a heating board prepared according to the method of Example 20, which includes a substrate 1, a first waterproof sealing layer 2, a heat-reflecting layer 3, an insulating layer 4, an electrothermal conversion layer 5, a first Two sealing waterproof layers 6, surface layers 7, and lead wires 8 are drawn out.
  • an integrated electrothermal board includes an insulating substrate 1, a heating film layer 2-3, and a surface layer 3; the thickness of the heating film layer 2-3 is between 50 nm and 10 ⁇ m. The square resistance of the heating film is between 10 ⁇ 1000 ⁇ / ⁇ .
  • the heating film layer 2-3 is an oxide or an oxysulfide.
  • the material of the heating film layer 2-3 includes ZnO x S (1-x) , InO x S (1-x) , and Sn x In.
  • the heat-generating film layer 2-3 is a oxycarbon compound, and the material of the heat-generating film layer 2-3 includes SiO x C (1-x) .
  • the heating film layer 2-3 is a carbonitride, and the material of the heating film layer 2-3 includes SiC x N (1-x) .
  • an upper insulating waterproof layer 2-4 and a lower insulating waterproof layer 2-2 are provided on the two lower surfaces of the heating film layer 2-3;
  • the conductive metal strip 4 is used as a power supply circuit, and the metal strip 4 is electrically connected to a built-in electrode.
  • the materials of the above lower insulating waterproof layer 2-2 and the upper insulating waterproof layer 2-4 are inorganic waterproof insulating materials or organic waterproof insulating materials;
  • the inorganic waterproof insulating material includes ceramic, enamel, glass, mica, quartz, and dielectric ceramic;
  • the organic waterproof insulating material includes polyimide, polyamideimide, polyimide, polymaleimide, polydiphenyl ether, modified epoxy, unsaturated polyester, and polyaramide.
  • the above-mentioned electrothermal integrated board further includes an infrared reflective film layer 2-1.
  • the infrared reflective film layer 2-1 is located between the substrate 1 and the lower insulating and waterproof layer 2-2.
  • the infrared reflective layer 2-1 It is a metal-containing film layer.
  • the material and size of the heat-preserving substrate 1 satisfy a compressive strength of not less than 10 MPa and a thermal conductivity of less than 0.5 W / (m ⁇ K).
  • the material of the above-mentioned thermal insulation substrate 1 includes one or more of calcium silicate board, silicate board, mica board, porous ceramic board, and porous ceramic board.
  • the material of the surface layer 3 has a Mohs hardness of not less than 3 and abrasion resistance of not more than 500 mm 3 .
  • a method for preparing an integrated electrothermal board includes the following steps:
  • Step1 Take the insulation substrate 1, clean it and dry it;
  • Step2 Optionally, prepare a lower insulating and waterproof layer 2-2 on the polished surface of the heat-preserving substrate 1.
  • Step3 Prepare the heating film layer 2-3 on the surface of the lower insulation and waterproof layer 2-2 by vacuum coating method, and then anneal at 100 ⁇ 450 °C for 10 ⁇ 120min;
  • Step4 Set a metal conductive tape 4 on the surface of the heating film layer 2-3, and electrically connect the metal conductive tape 4 and the built-in electrode;
  • Step5 Optionally, prepare an insulating and waterproof layer 2-4 on the surface of the heating film layer 2-3;
  • Step6 A surface layer is provided on the surface of the upper insulation waterproof layer 2-4 to complete the preparation of the low-voltage electric heating plate.
  • the test was conducted in accordance with GB / T7287-2008.
  • test was conducted in accordance with GB / T7287-2008.
  • the integrated electrothermal board and the preparation method thereof according to the present invention adopt an oxide film having a thickness of less than 10 ⁇ m as a heating material, which not only uses a small amount of heating material, but also has a low production cost of the heating film layer. And because the oxide is used as a heating material, the performance of the oxide is stable and the heating efficiency is high, so the service life of the integrated electrothermal board is long, and the heating power attenuation is small during use.
  • the electrothermal integrated board adopts vacuum plating to prepare the heating film layer, which can accurately control the thickness of the heating film layer.
  • the thickness of the heating film layer is less than 10 ⁇ m, which can reduce the amount of heating material and reduce the cost of the heating film layer.
  • the composition of the heating material can be accurately controlled, and the heating material of the heating film layer can be effectively doped.
  • the infrared emission rate of the heating material can be improved by doping, and on the other hand, the heating can be effectively adjusted by doping.
  • the wavelength of the infrared radiation emitted by the material is made to match the wavelength of the infrared radiation emitted by the electrothermal integrated board with the infrared absorption of the human body.
  • Embodiments 22 to 25 relate to a heat-generating building material. See FIG. 13, which is a structural diagram of the heat-generating building material.
  • the heat-generating building material in the figure is composed of a heat-insulating layer, a heat-generating layer, and an air-purifying surface layer provided in order from bottom to top.
  • an insulating and waterproof layer may be further provided between each of the heat-preserving layer, the heat-generating layer, and the air-purifying surface layer.
  • an epoxy waterproof glass fiber cloth is used to prepare an insulating waterproof layer with electrodes, the thickness of the waterproof layer is 200 ⁇ m, and the electrodes are connected to the previously buried joints.
  • a carbon paste heating layer is printed on the insulating and waterproof layer in a manner of curing at 150 ° C for 30 minutes, and the thickness of the heating layer is 1000 ⁇ m.
  • An epoxy waterproof glass fiber cloth is used on the heating layer to prepare an insulating waterproof layer.
  • An air purification surface layer is prepared on the insulation waterproof layer prepared in step 4).
  • the specific steps are: mixing 1000 g of non-fired ceramic powder and 200 g of tourmaline powder and adding 300 g of water to stir uniformly, and coating the surface of the insulation waterproof layer. After being left for 24 hours, it was cured to form a surface layer with a thickness of 0.1 mm.
  • an unsaturated resin glass fiber cloth is used to prepare an insulating waterproof layer with electrodes.
  • the thickness of the waterproof layer is 500 ⁇ m, and the electrodes are connected to the previously buried joints.
  • a carbon paste heat-generating layer is printed on the insulating and waterproof layer in a manner of curing for 40 minutes at 130 ° C., and the thickness of the heat-generating layer is 1000 ⁇ m.
  • An unsaturated resin glass fiber cloth is used on the heat-generating layer to prepare an insulating waterproof layer with a thickness of 500 ⁇ m.
  • An air purification surface layer is prepared on the insulation and waterproof layer prepared in step 4).
  • the specific steps are: mixing 1000 g of non-fired ceramic powder and 100 g of anion powder and adding 300 g of water to stir uniformly, and coating on the surface of the insulation and waterproof layer. After standing for 24 hours, it was cured to form a surface layer, and the thickness of the surface layer was 1 mm.
  • a carbon paste heat-generating layer is printed on the insulating and waterproof layer in a manner of curing at 170 ° C. for 20 minutes, and the thickness of the heat-generating layer is 10 ⁇ m.
  • An air purification surface layer is prepared on the insulating and waterproof layer prepared in step 5).
  • the specific steps are: mixing 1000 g of non-fired ceramic powder and 10 g of nano-TiO 2 powder and adding 300 g of water to stir uniformly, and coating the insulating and waterproof layer.
  • the surface is cured after being left for 24 hours to form a surface layer, and the thickness of the surface layer is 10 mm.
  • an epoxy waterproof glass fiber cloth is used to prepare an insulating waterproof layer with electrodes, the thickness of the waterproof layer is 200 ⁇ m, and the electrodes are connected to the previously buried joints.
  • a carbon paste heating layer is printed on the insulating and waterproof layer in a manner of curing at 170 ° C. for 20 minutes, and the thickness of the heating layer is 800 ⁇ m.
  • a 200 ⁇ m thick insulating and waterproof layer is prepared on the heating layer using pet.
  • An air purification surface layer is prepared on the insulation and waterproof layer prepared in step 4).
  • the specific steps are that 1000 g of non-fired ceramic powder and 250 g of water are stirred and uniformly coated on the surface of the insulation and waterproof layer. After being left for 24 hours, the surface is cured to form a surface. Layer, the thickness of the surface layer is 5mm; subsequently, 200g of six-ring stone powder and 30g of water are evenly mixed, coated on the surface of the surface layer, and left to solidify, that is, the surface of the surface layer is cured again to obtain an air purification layer and the thickness of the air purification layer It was 200 ⁇ m.
  • the heat-generating building material was prepared according to the procedure of Example 22, with the difference that no air purification material was added in step 5).
  • GB / T10294-2008 was used to determine the thermal insulation performance of the building materials prepared in Examples 22-25 and Comparative Example 1, and the results are shown in Table 4.
  • JC / T2040-2010 was used to determine the air purification performance of the building materials prepared in Examples 22-25 and Comparative Example 1, and the results are shown in Table 5.
  • the heat-generating building materials of the present application comply with national standards in terms of various physical and chemical indicators, and can significantly play a role in purifying air.
  • a heating integrated board includes a substrate 1, a heating layer 2, a metal current carrying bar 3, and a wear-resistant water blocking layer 4 in order from top to bottom;
  • Substrate 1 is glass
  • the abrasion-resistant water-blocking layer 4 is prepared by the following raw materials in parts by weight: 100 parts of modified epoxy resin, 50 parts of water-based polyurethane emulsion, 3 parts of basalt powder, 12 parts of silicon micropowder, 20 parts of garnet powder, and flame retardant 1 Parts, 1 part of imidazole curing agent, 0.5 parts of hydroxypropyl methyl cellulose, 0.05 parts of hydroxypropyl methyl cellulose, and 15 parts of deionized water;
  • Modified epoxy resin is prepared by the following methods:
  • the improved Hummers method is used to prepare graphene oxide, which specifically includes the following steps:
  • step S3 1g of graphene oxide obtained in step S2, 3g of nano-alumina, and 1g of nano-zinc oxide are milled and mixed uniformly by a ball mill; add to the emulsion obtained in step S1, stir and mix well, add 0.5g of antimony trioxide and 2g Nickel oxide was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.
  • the heating layer 2 is a conductive far-infrared heating material, and is uniformly printed on the substrate 1 by screen printing;
  • the heating layer 2 is prepared from nano-carbon crystal powder, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: 1g of turpentine alcohol and 10g of ethyl cellulose are mixed, and the slurry is heated at 70 ° C in a water bath environment for 5 hours to obtain slurry 0.2g of nano-carbon crystal powder is added and mixed uniformly, and 1-20 layers of nano-carbon crystal colloid film are prepared on the weather-resistant insulating layer by screen printing process, and placed horizontally under normal temperature and pressure for 10 hours to prepare a heating layer 2.
  • a cross-sectional area of the metal current carrying bar 3 is 1 mm 2 ; the metal current carrying bar 3 is laid in a length direction.
  • the metal current-carrying strips 3 are bonded to the heat-generating layer 2 and are located on both sides of the heat-generating layer 2.
  • the metal current-carrying strips 3 on both sides are respectively connected to a power source.
  • a method for preparing a heat-generating integrated board includes the following steps:
  • polishing polishing the back surface of the substrate 1;
  • Coating the heating layer 2 coating nano carbon crystals on the back surface of the substrate 1 by a screen printing method
  • Pave metal current-carrying strips 3 Pave metal flow-carrying strips 3 of different cross-sectional areas on the heating layer 2 in a length direction or a width direction, and both ends are connected to the connection plug 5;
  • Coating abrasion-resistant and water-blocking layer 4 Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 1 ⁇ m. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.
  • a heating integrated board includes a substrate 1, a heating layer 2, a metal current carrying bar 3, and a wear-resistant water blocking layer 4 in order from top to bottom;
  • the substrate 1 is a particle board
  • the abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 150 parts of modified epoxy resin, 100 parts of water-based polyurethane emulsion, 10 parts of basalt powder, 17 parts of silicon micropowder, 30 parts of garnet powder, and flame retardant 2 Parts, 2 parts of organic acid anhydride curing agent, 1 part of AT-70 thickener, 0.1 parts of 5-chloro-2-methyl-4 isothiazolin-3-one, and 20 parts of deionized water;
  • Modified epoxy resin is prepared by the following methods:
  • the improved Hummers method is used to prepare graphene oxide, which specifically includes the following steps:
  • step S3 Mill 3g of graphene oxide obtained in step S2, 5g of nano-alumina, and 3g of nano-zinc oxide through a ball mill and mix them uniformly; add to the emulsion obtained in step S1, stir and mix well, add 1.5g of antimony trioxide and 5g Nickel oxide was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.
  • the heating layer 2 is a conductive far-infrared heating material, and is uniformly printed on the substrate 1 by screen printing;
  • the heating layer 2 is prepared from carbon nanotubes, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: mixing 1 g of turpentine alcohol and 10 g of ethyl cellulose, and heating the mixture in a 70 ° C water bath environment for 5 hours to obtain a slurry. Add 0.1g of carbon nanotubes at room temperature to mix and grind them uniformly. Prepare 1-20 layers of nanometer carbon crystal colloid film on the weather-resistant insulation layer by screen printing process, and place them horizontally for 10 hours at normal temperature and pressure to prepare a heating layer 2.
  • a cross-sectional area of the metal current carrying bar 3 is 2 mm 2 ; the metal current carrying bar 3 is laid in a width direction.
  • the metal current-carrying strips 3 are bonded to the heat-generating layer 2 and are located on both sides of the heat-generating layer 2.
  • the metal current-carrying strips 3 on both sides are respectively connected to a power source.
  • a method for preparing a heat-generating integrated board includes the following steps:
  • polishing polishing the back surface of the substrate 1;
  • Coating the heating layer 2 coating nano carbon crystals on the back surface of the substrate 1 by a coating method
  • Pave metal current-carrying strip 3 Pave metal flow-carrying strips 3 of different cross-sectional areas on the heating layer 2 in a length direction or a width direction, and both ends are welded to the wires 5;
  • Coating abrasion-resistant and water-blocking layer 4 Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 1 mm. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.
  • a heating integrated board includes a substrate 1, a heating layer 2, a metal current carrying bar 3, and a wear-resistant water blocking layer 4 in order from top to bottom;
  • Substrate 1 is an inorganic fireproof board
  • the abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 110 parts of modified epoxy resin, 60 parts of water-based polyurethane emulsion, 4 parts of basalt powder, 13 parts of fine silicon powder, 22 parts of garnet powder, and 1.2 of flame retardant 1.2 Parts, 1.1 parts of amine curing agent, 0.6 parts of organic bentonite, 0.06 parts of 2-methyl-4isothiazolin-3-one, and 16 parts of deionized water;
  • Modified epoxy resin is prepared by the following methods:
  • the improved Hummers method is used to prepare graphene oxide, which specifically includes the following steps:
  • step S3 2g of graphene oxide obtained in step S2, 4g of nano-alumina, and 2g of nano-zinc oxide are milled and mixed uniformly by a ball mill; added to the emulsion obtained in step S1, stirred and mixed uniformly, and added 1g of antimony trioxide and 3g of oxide Nickel was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.
  • the heating layer 2 is a conductive far-infrared heating material, and is uniformly printed on the substrate 1 by a printing method;
  • the heating layer 2 is prepared from barium titanate, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: mixing 1 g of turpentine alcohol and 10 g of ethyl cellulose, and heating the mixture in a water bath at 70 ° C. for 5 h to obtain a slurry. 0.5g of barium titanate was added at room temperature to mix and grind uniformly. A screen printing process was used to prepare 1-20 layers of nanometer carbon crystal colloid film on the weather-resistant insulating layer, and it was left to stand horizontally at normal temperature and pressure for 10 hours to prepare a heating layer 2.
  • the cross-sectional area of the metal current-carrying strip 3 is 1.5 mm 2 ; the metal current-carrying strip 3 is paved in the longitudinal direction.
  • a method for preparing a heat-generating integrated board includes the following steps:
  • polishing polishing the back surface of the substrate 1;
  • Coating the heating layer 2 coating nano carbon crystals on the back surface of the substrate 1 by a coating method
  • Pave metal current-carrying strip 3 Pave metal flow-carrying strips 3 of different cross-sectional areas on the heating layer 2 in a length direction or a width direction, and both ends are welded to the wires 5;
  • Coating abrasion-resistant and water-blocking layer 4 Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 5 mm. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.
  • a heating integrated board includes a substrate 1, a heating layer 2, a metal current carrying bar 3, and a wear-resistant water blocking layer 4 in order from top to bottom;
  • the substrate 1 is a wood plastic board
  • the abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 140 parts of modified epoxy resin, 90 parts of water-based polyurethane emulsion, 8 parts of basalt powder, 15 parts of silicon fine powder, 28 parts of garnet powder, and 1.8 parts of flame retardant 1.8 Parts, 1.8 parts of imidazole curing agent, 0.4 parts of xanthan gum, 0.5 parts of hydroxyethyl cellulose, 0.08 parts of 2-methyl-4isothiazolin-3-one, and 19 parts of deionized water;
  • Modified epoxy resin is prepared by the following methods:
  • the improved Hummers method is used to prepare graphene oxide, which specifically includes the following steps:
  • step S3 4g of graphene oxide obtained in step S2, 4g of nano-alumina, and 2g of nano-zinc oxide are milled and mixed uniformly by a ball mill; added to the emulsion obtained in step S1, stirred and mixed uniformly, and added 1g of antimony trioxide and 4g of oxide Nickel was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.
  • the heating layer 2 is a conductive far-infrared heating material, and is uniformly printed on the substrate 1 by screen printing;
  • the heating layer 2 is prepared from graphene, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: 1 g of turpentine alcohol and 10 g of ethyl cellulose are mixed, and stirred and heated in a 70 ° C water bath environment for 5 hours to obtain a slurry, room temperature 0.3g of graphene was added and mixed uniformly, and 1 to 20 nano-carbon crystal colloid films were prepared on the weather-resistant insulating layer by a screen printing process, and the layer was left horizontally at normal temperature and pressure for 10 hours to obtain a heating layer 2.
  • the cross-sectional area of the metal current-carrying strip 3 is 0.6 mm 2 ; the metal current-carrying strip is paved in the width direction.
  • the metal current-carrying strips 3 are bonded to the heat-generating layer 2 and are located on both sides of the heat-generating layer 2.
  • the metal current-carrying strips 3 on both sides are respectively connected to a power source.
  • a method for preparing a heat-generating integrated board includes the following steps:
  • polishing polishing the back surface of the substrate 1;
  • Coating the heating layer 2 coating nano carbon crystals on the back surface of the substrate 1 by a screen printing method
  • Pave metal current-carrying strip 3 Pave metal flow-carrying strips 3 of different cross-sectional areas on the heating layer 2 in a length direction or a width direction, and both ends are welded to the wires 5;
  • Coating abrasion-resistant and water-blocking layer 4 Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 0.5 mm. After curing, the heat-generating body is made. Board; the two heat-generating integrated boards are connected through a connection plug 5; the connection plugs 5 of the heat-generating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.
  • a heating integrated board includes a substrate 1, a heating layer 2, a metal current carrying bar 3, and a wear-resistant water blocking layer 4 in order from top to bottom;
  • Substrate 1 is a fiberboard
  • the abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 125 parts of modified epoxy resin, 70 parts of water-based polyurethane emulsion, 6 parts of basalt powder, 15 parts of silicon fine powder, 25 parts of garnet powder, and 1.5 of flame retardant Parts, 1.4 parts of amine curing agent, 0.7 parts of polyacrylamide, 0.07 parts of 5-chloro-2-methyl-4 isothiazolin-3-one, and 17 parts of deionized water;
  • Modified epoxy resin is prepared by the following methods:
  • the improved Hummers method is used to prepare graphene oxide, which specifically includes the following steps:
  • step S3 2g of graphene oxide obtained in step S2, 5g of nano-alumina, and 2g of nano-zinc oxide are milled and mixed uniformly by a ball mill; added to the emulsion obtained in step S1, stirred and mixed uniformly, and added 1g of antimony trioxide and 3g of oxide Nickel was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.
  • the heating layer 2 is a conductive far-infrared heating material, and is uniformly printed on the substrate 1 by screen printing;
  • the heating layer 2 is prepared from lanthanum chromate, silicon carbide, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: 1 g of turpentine alcohol and 10 g of ethyl cellulose are mixed, and the mixture is heated under stirring in a water bath at 70 ° C. for 5 h to obtain Add 0.3g of lanthanum chromate and 0.4g of silicon carbide to the slurry at room temperature and mix uniformly. Use screen printing to prepare 1-20 layers of nano-carbon crystal colloid film on the weather-resistant insulation layer, and place it horizontally for 10 hours at normal temperature and pressure. Prepared heat-generating layer 2.
  • the cross-sectional area of the metal current-carrying strip 3 is 0.3 mm 2 ; the metal current-carrying strip 3 is laid in a length direction.
  • the metal current-carrying strips 3 are bonded to the heat-generating layer 2 and are located on both sides of the heat-generating layer 2.
  • the metal current-carrying strips 3 on both sides are respectively connected to a power source.
  • a method for preparing a heat-generating integrated board includes the following steps:
  • polishing polishing the back surface of the substrate 1;
  • Coating the heating layer 2 coating nano carbon crystals on the back surface of the substrate 1 by a screen printing method
  • Pave metal current-carrying strip 3 Pave metal flow-carrying strips 3 of different cross-sectional areas on the heating layer 2 in a length direction or a width direction, and both ends are welded to the wires 5;
  • Coating abrasion-resistant and water-blocking layer 4 Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 30 ⁇ m. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.
  • Example 30 On the basis of Example 30, a heat storage layer was provided between the heat generating layer 2 and the substrate 1.
  • Example 30 On the basis of Example 30, a heat storage layer is provided between the heat generating layer 2 and the base material 1 and the metal current carrying bar 3 and the wear-resistant water blocking layer 4.
  • the temperature of the surface of the board at different times was measured using the heat-generating integrated board prepared in Examples 26-32 of the present invention and similar products on the market. The results are shown in Table 6.
  • Example 1 Example 2
  • Example 3 Example 4
  • Example 5 Example 6
  • Example 7 Commercially available 2min 47 49 51 51 48 45 46 twenty two 5min 49 50 50 52 50 51 52 35 10min 50 52 52 54 52 53 54 42 30min 52 51 53 55 51 54 56 49 60min 53 53 54 54 54 55 55 53 2h 54 55 55 52 56 55 55 57 6h 56 56 54 53 55 55 55 45 12h 55 54 56 57 54 55 55 39 24h 57 58 56 56 57 55 55 37
  • the heat-generating integrated board prepared in the embodiment of the present invention has good thermal conductivity, fast thermal conductivity, rapid heating, and rapid temperature rise within 2 minutes, which is significantly better than similar products on the market; Continuous working for 24 hours (or even longer) has little change in temperature stability, while similar products on the market have a noticeable temperature drop and thermal insulation is unstable.
  • the thermal insulation performance is more stable.
  • the heat-generating integrated board prepared in Examples 26-32 of the present invention has good thermal conductivity, fast thermal conductivity, good chemical resistance, wear resistance, superior mechanical properties, and long service life. Good application prospects.
  • the present invention adopts a thin film integration technology to coat a building decoration material with a normal temperature curing function on an electrothermal conversion layer, so that ordinary building decoration materials (floor, tile, wallpaper, etc.) can be converted to external radiation Integrated material of infrared and heat source, without changing the appearance and texture of the original building materials, thus changing the existing heating method;
  • the back surface non-decorative surface
  • the back surface is polished and polished to sequentially prepare the electrothermal conversion and the surface layer.
  • a radiant heating integrated sheet is prepared.
  • the edge of the heating material is provided with a current introduction point, and the thermal energy converted from electrical energy is mainly radiant heating, supplemented by conduction and convection heating to heat the room, thereby achieving long-term uniform heating and safe technical effects;
  • the multi-mesh structure on the screen printing plate of the present invention allows the conductive heating material and paste to pass through the porous structure of the screen under the action of a squeegee, so as to obtain one or more uniform heating layers on the substrate layer, thereby A heat-generating layer with good thermal conductivity and uniform heat conduction is obtained.
  • the invention uses a carbon-based material or a non-carbon material to prepare a heat-generating layer.
  • the heat-generating layer is in direct contact with a metal current carrying bar and has good electrical conductivity.
  • the heat is radiated into the room in the form of infrared rays, so as to have a good effect of heating and keeping warm, and its heat storage layer can further play a role in keeping warm;
  • the invention uses a silane coupling agent with an amino group to catalyze the ring-opening reaction of epoxy resin and the dehydration condensation reaction of ethyl orthosilicate, so that the silicon group is connected to the epoxy resin to achieve modification; methyl triethoxy group is added
  • the oxides such as graphene oxide, nano-alumina, nano-zinc oxide, antimony trioxide, and nickel oxide are connected to the epoxy polymer, thereby realizing the modification of the epoxy resin by inorganic oxides.
  • the epoxy resin has good abrasion resistance, chemical resistance and good hardness and toughness;
  • the preparation method of the invention is simple and has a wide range of applications. It can be applied to almost all substrates.
  • the raw materials are widely available.
  • the prepared heat-generating integrated board has superior mechanical properties, is convenient for transportation and storage, has uniform heat generation, is safe to use, and has a long service life. Broad application prospects.
  • the following example relates to a heat generating component and a method for manufacturing the same.
  • FIG. 17 is a schematic structural diagram of a heating component provided in the present application.
  • each film layer in FIG. 16 is only used to show its position connection relationship, and the thickness of each film layer cannot be as shown in FIG. 16. Proportions are obtained.
  • the heating component includes a surface layer 1, an upper bearing layer 2, a heating layer 3, a lower bearing layer 4 and a base layer 5 which are arranged in a vertical direction (Z) and stacked in order from top to bottom, wherein:
  • the surface layer 1 may be a floor or a floor tile formed by slurry curing.
  • the slurry may be an inorganic material or an organic material, for example, it may be a cured mother liquor, which may include a silicone emulsion, a silicate aqueous solution, and a polyurethane emulsion.
  • a silicone emulsion emulsion
  • a silicate aqueous solution e.
  • polyurethane emulsion e.
  • the slurry may further include a cementing agent MgO, and a water-soluble magnesium salt blending agent MgCl 2 ⁇ 6H 2 O.
  • the above slurry may further include one or more of Ca (OH) 2 or CaO, and silicon oxide.
  • the surface layer 1 can also be made of organic materials, such as UV glue.
  • the above-mentioned surface layer 1 is formed by printing the UV adhesive onto the upper carrying layer 2 by using a 3D printer and being cured, so as to have a certain abrasion resistance.
  • the upper bearing layer 2 and the lower bearing layer 4 are respectively provided on the upper and lower surfaces of the heating layer 3.
  • the upper bearing layer 2 and the lower bearing layer 4 are made of an insulating and waterproof material, so that the good insulation and resistance of the heating layer 3 can be guaranteed.
  • Humidity is a composite of a matrix material and a reinforcing material, wherein the matrix material includes synthetic resin, rubber, and ceramic, and the reinforcing material includes glass fiber, boron fiber, aramid fiber, silicon carbide fiber, asbestos fiber, and whiskers.
  • the insulating and waterproof material is made of epoxy resin glass fiber cloth and / or unsaturated resin glass fiber cloth, so that the upper load-bearing layer 2 and the lower load-bearing layer 4 have the characteristics of good weather resistance and high temperature resistance.
  • the upper bearing layer 2 and the lower bearing layer 4 are each provided with at least one layer. Since the upper bearing layer 2 is closer to the surface layer 1, preferably, the lower bearing layer 4 may be provided as one layer, and the upper bearing layer 4 The layer 2 is provided at least two layers, so that the waterproof effect of the upper bearing layer 2 is better.
  • the heating layer 3 and the lower carrier layer 4 are provided with conductive elements 61 at both ends.
  • the heating layer 3 is made of a conductive heating material.
  • the conductive heating material has a liquid and solid state or a semi-solid and solid state. In the liquid or semi-solid state, the conductive heat-generating material is attached to the conductive element 61 and the lower supporting layer 4, and the conductive heat-generating material is fixedly connected to the conductive element 61 and the lower supporting layer 4 respectively after curing.
  • This application solves the problem by attaching a conductive heating material in a liquid or semi-solid form to the conductive element 61 and the lower bearing layer 4 so that the conductive heating material is fixedly connected to the conductive element 61 and the lower bearing layer 4 respectively after curing, thereby solving the problem.
  • the contact resistance between the heat generating layer 3 and the conductive element 61 formed by curing the conductive heat generating material is 7.5 ohms. Within this range, the risk of fire from the heat generating layer 3 and the conductive element 61 is greatly reduced.
  • the top surface of the conductive element 61 is flush with the top surface of the lower carrier layer 4 (see FIG. 17), and then the conductive heating material in a liquid or semi-solid state is attached to the conductive surface.
  • the conductive heating material can be better adhered to the conductive element 61 and the lower carrier layer 4 (that is, a dense connection), which can also conduct electricity (compared to the soft connection in the prior art).
  • the contact resistance between the heating material and the conductive element 61 is reduced to 7.5 ohms, thereby reducing the risk of fire.
  • the conductive heating material provided in the present application is preferably a slurry (because the slurry has a liquid and solid state or a semi-solid and solid state), it can be understood that the liquid, semi-solid and solid states involved in this application are From the perspective of fluid mechanics (or flow), for example, when the solid phase component in a fluid is higher than a preset value, it can be called a semi-solid state, and when it is lower than the preset value, it can be called a liquid state. It can even be understood that: there is an overlapping part between the liquid and the semi-solid, this application intends to show that the liquid and the semi-solid are in a state in which there is a flow relative to the solid.
  • the above slurry may be, for example, a carbon slurry or a graphene slurry, and other metal powders or metal oxides may be blended in the slurry of the two.
  • the conductive element 61 may be a metal foil, for example, a copper foil, an aluminum foil, or the like, which is not specifically limited herein.
  • the heat generating layer may include many kinds of conductive heat generating materials, for example, it may be one of carbon black heat material, graphene heat material, metal heat material, polymer heat material, and semiconductor heat material, or Several.
  • conductive heating materials and conductive elements 61 are connected by conductive glue, or the conductive element 61 is laminated on the conductive heating material, and these connection methods are separate connections (that is, soft connections are used). Way), it cannot effectively form a unified whole, so there is a risk of unreliable connection.
  • a conductive heating material in a liquid or semi-solid form is attached to the conductive element 61 and the lower supporting layer 4 so that the conductive heating material is fixedly connected to the conductive element 61 and the lower supporting layer 4 respectively after curing, so that Solved the problem of unreliable connection mentioned above.
  • the conductive heating material when the conductive heating material is in a liquid or semi-solid state, the conductive heating material is attached to the conductive element 61 and the lower supporting layer 4 by printing or coating.
  • the printing methods include, but are not limited to, lithographic printing, gravure printing, letterpress printing, and stencil printing (ie, screen printing), and the coating methods include, but are not limited to, brush coating, wiping coating, blade coating, and spray coating.
  • the above types of printing and coating are all within the protection scope of the present application, and are not specifically limited herein.
  • the conductive heating material is carbon paste
  • the conductive element 61 is copper foil
  • the carbon paste is attached to the copper foil and the lower carrier layer 4 by screen printing, and the carbon paste is cured with the copper foil and the lower carrier layer 4 respectively after curing.
  • Fixed connection thus realizing a reliable fixed connection between the conductive heating material and the conductive element 61.
  • the carbon paste includes carbon black and resin. The carbon black is formed by bonding the resin to the carbon paste.
  • the carbon paste may be doped with other conductive materials, such as graphene, metal powder, or metal oxide.
  • the conductive element 61 is disposed between the heating layer 3 and the lower supporting layer 4.
  • the conductive heating material is attached to the conductive element 61 and the lower supporting layer 4, that is, the lower supporting layer 4 not only plays a role In order to support the conductive heating material, it also plays a waterproof role to facilitate the curing of the conductive heating material.
  • the conductive heat-generating material is fixedly connected to the conductive element 61 and the lower bearing layer 4 respectively after curing, so as to achieve the assembly molding of the heat-generating layer 3, the lower bearing layer 4 and the conductive element 61.
  • the base layer 5 may be selected from paper, fiberboard, wood board, cement board, ceramic tile, or marble, that is, the base layer 5 only plays a role of carrying other film layer structures, and the specific types thereof are not specifically limited in this application.
  • the base layer 5 is provided with a mounting groove 51.
  • the mounting groove 51 is used for mounting a connecting element 62 (such as an electrode) electrically connected to the conductive element 61.
  • the base layer 5 and the bottom The bearing layer 4 is provided with a mounting hole 52 that communicates with the mounting groove 51.
  • the mounting hole 52 is used to pass through a wire 63 that is electrically connected to the conductive element 61 and the connection element 62 respectively.
  • Multiple heating components can be spliced to each other, that is, multiple heating components are connected in series and / or in parallel to the external power source through the connecting element 62, so that if one of the heating components is damaged, it will not affect the normal operation of the other heating components. .
  • the installation manner of the installation groove 51 and the installation hole 52 greatly improves the space utilization ratio of the heating component, and does not affect the splicing of the heating component.
  • the splicing method of the heating component is preferably a splicing method of plugging, but the plugging and unplugging structure is not shown in this application, but it does not mean that this splicing method is not.
  • the present application also provides a method for preparing a heating element.
  • the heating element is preferably prepared by using the manufacturing method, and specifically includes the following steps:
  • At least one lower bearing layer 4 is provided on the base layer 5, and conductive elements 61 are respectively provided at both ends of the lower bearing layer 4:
  • grooves and holes are formed in the base layer 5 (that is, installation grooves 51 and installation holes 52 are opened), and the upper surface of the base layer 5 is cleaned and polished; the lower carrier layer 4 (using epoxy glass fiber cloth and / or Unsaturated resin glass fiber cloth) is set on the base layer 5, so as to ensure better weather resistance, high temperature resistance, insulation and humidity resistance of the heating component; finally, the conductive element 61 (such as copper foil) is set to the lower bearing layer 4 and put it into a vacuum laminator for vacuum lamination.
  • the vacuum degree of the laminator is less than the first preset pressure of 100 Pa, and then a second preset pressure of 0.5 MPa is applied to the surfaces of the base layer 5, the lower bearing layer 4, and the conductive element 61, and the base layer 5,
  • the lower carrier layer 4 and the conductive element 61 begin to heat; then, when the temperature rises to a preset temperature of 140 ° C, the conditions of the preset temperature and the second preset pressure are maintained for a period of time; finally, the heating is stopped and the temperature is reduced to room temperature.
  • the base layer 5, the lower carrier layer 4, and the conductive element 61 out of the laminator for use; after lamination, the top surface of the conductive element 61 is flush with the top surface of the lower carrier layer 4, so it is convenient to attach the conductive heating material to the conductive layer.
  • the element 61 and the lower carrier layer 4 are on. After testing, the contact resistance between the formed conductive heating material and the conductive element 61 can be reduced to 7.5 ohms, and it can be said that almost no ignition will occur.
  • the heating layer 3 is formed on the conductive element 61 and the lower supporting layer 4:
  • the heat-generating layer 3 is made of a conductive heat-generating material, and the conductive heat-generating material has a liquid and solid state or a semi-solid and solid form; wherein the conductive heat-generating material is attached to the conductive element 61 and On the lower supporting layer 4, the conductive heating material is cured, so that the heating layer 3 is fixedly connected to the conductive element 61 and the lower supporting layer 4, respectively.
  • the conductive heating material in a liquid or semi-solid form is attached to the conductive element 61 and the lower supporting layer 4 by printing or coating.
  • a stencil with a preset aperture is used to print a conductive heating material (such as a carbon paste) in a liquid or semi-solid form onto the lower supporting layer 4 and the conductive element 61.
  • a conductive heating material such as a carbon paste
  • Two upper supporting layers 2 (using epoxy glass fiber cloth and / or unsaturated resin glass fiber cloth) are provided on the conductive heat-generating material, and the whole is placed in a vacuum laminator for vacuum lamination.
  • the vacuum degree of the laminator is less than 100 Pa of the first preset pressure, and then a second preset pressure is applied on the surface of the base layer 5, the lower bearing layer 4, the conductive element 61, the conductive heating material, and the upper bearing layer 2. 0.5 MPa, and start heating the base layer 5, the lower bearing layer 4, the conductive element 61, the conductive heating material and the upper bearing layer 2.
  • the preset temperature and the second The condition of the preset pressure is maintained for a period of time; finally, the heating is stopped and the temperature is lowered to room temperature, and the base layer 5, the lower bearing layer 4, the conductive element 61, the conductive heating material and the upper bearing layer 2 are taken out of the laminator for use.
  • a 3D printer is used to print an inorganic material or an organic material (such as UV glue) onto the upper carrier layer 2, and after curing, the final finished product of the heating component is formed.
  • an inorganic material or an organic material such as UV glue
  • the method for preparing a heating element has the same beneficial effect as the heating element described above, that is, by attaching a conductive heating material in a liquid form to the conductive element 61, the conductive heating material is cured. It is fixedly connected to the conductive element 61, thereby solving the problem of unreliable connection between the conductive element and the heating layer of the existing heating component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)

Abstract

La présente invention concerne un matériau de construction chauffant et un procédé de préparation de celui-ci. Le matériau de construction chauffant intègre des fonctions multiples telles que l'isolation thermique, le chauffage, l'isolation électrique, l'étanchéité et la conduction thermique ; en outre, sa couche de surface a l'aspect et la texture de matériaux tels que le marbre, le granit et le bois. Par conséquent, ledit matériau de construction présente à la fois une fonction de chauffage et un effet décoratif. Le matériau de construction chauffant comprend un matériau de base (1), une couche d'isolation thermique (2), une couche réfléchissante (3), une couche de rayonnement chauffant (4), et une couche de revêtement d'émail (5) en séquence. Le procédé comprend : la fourniture d'un matériau de base ; l'impression ou l'application d'une couche chauffante sur la surface du matériau de base ; puis la fourniture d'une couche de revêtement sur la surface de la couche chauffante. Le matériau de construction chauffant préparé peut émettre des ondes lumineuses de rayonnement infrarouge lointain de 5 à 20 µm après avoir été excité, et est chaud, confortable, sain, économe en énergie, respectueux de l'environnement et exempt de pollution. Le matériau de construction chauffant adopte une conception structurelle intégrée, est structuré simplement, pratique à installer et facile à désassembler, et peut être utilisé en tant que plancher, mur et plafond intérieur.
PCT/CN2019/106675 2018-09-19 2019-09-19 Matériau de construction chauffant et son procédé de préparation WO2020057599A1 (fr)

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
CN201811097360.2A CN108909080A (zh) 2018-09-19 2018-09-19 一种采暖建材及其制备方法
CN201811097360.2 2018-09-19
CN201910284454.9A CN111809816B (zh) 2019-04-10 2019-04-10 定向传热一体板及其制备方法
CN201910284447.9A CN111809815A (zh) 2019-04-10 2019-04-10 自发热一体板及其制备方法
CN201910284454.9 2019-04-10
CN201910284447.9 2019-04-10
CN201910284783.3 2019-04-10
CN201910284783.3A CN111809817B (zh) 2019-04-10 2019-04-10 一种传热一体板及其制备方法
CN201910829200 2019-09-03
CN201910829200.0 2019-09-03
CN201910829640 2019-09-03
CN201910829647.8 2019-09-03
CN201910829185 2019-09-03
CN201910829647 2019-09-03
CN201910829185.X 2019-09-03
CN201910829640.6 2019-09-03

Publications (1)

Publication Number Publication Date
WO2020057599A1 true WO2020057599A1 (fr) 2020-03-26

Family

ID=69888298

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/106675 WO2020057599A1 (fr) 2018-09-19 2019-09-19 Matériau de construction chauffant et son procédé de préparation

Country Status (1)

Country Link
WO (1) WO2020057599A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111556595A (zh) * 2020-05-13 2020-08-18 陕西师范大学 基于类淀粉样蛋白质/还原氧化石墨烯的耐用速热多功能型电热膜

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188839B1 (en) * 1997-07-22 2001-02-13 Ronald J. Pennella Radiant floor heating system with reflective layer and honeycomb panel
KR20060101681A (ko) * 2005-03-21 2006-09-26 임영호 조립식 온돌패널 및 이를 이용한 시공방법
CN201443806U (zh) * 2009-03-19 2010-04-28 周长忠 低温辐射电地暖发热板
CN202818640U (zh) * 2012-09-19 2013-03-20 张永利 一种远红外负离子陶瓷电热基板
CN103470002A (zh) * 2013-09-16 2013-12-25 江西斯洛特石业有限公司 一种远红外地暖石砖
CN203757827U (zh) * 2014-01-03 2014-08-06 上海谦亿电器科技有限公司 一种碳晶采暖模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188839B1 (en) * 1997-07-22 2001-02-13 Ronald J. Pennella Radiant floor heating system with reflective layer and honeycomb panel
KR20060101681A (ko) * 2005-03-21 2006-09-26 임영호 조립식 온돌패널 및 이를 이용한 시공방법
CN201443806U (zh) * 2009-03-19 2010-04-28 周长忠 低温辐射电地暖发热板
CN202818640U (zh) * 2012-09-19 2013-03-20 张永利 一种远红外负离子陶瓷电热基板
CN103470002A (zh) * 2013-09-16 2013-12-25 江西斯洛特石业有限公司 一种远红外地暖石砖
CN203757827U (zh) * 2014-01-03 2014-08-06 上海谦亿电器科技有限公司 一种碳晶采暖模块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111556595A (zh) * 2020-05-13 2020-08-18 陕西师范大学 基于类淀粉样蛋白质/还原氧化石墨烯的耐用速热多功能型电热膜

Similar Documents

Publication Publication Date Title
CN101148939B (zh) 一种电热地板
CN207727900U (zh) 一种石墨烯热能地板
CN110948976B (zh) 一种发热一体板及其制备方法
WO2018166137A1 (fr) Corps chauffant planaire à infrarouge lointain en matériau composite en carbone à haute performance et son utilisation
WO2009055959A1 (fr) Panneau chauffant électrique, procédé de fabrication et utilisation de celui-ci
CN106313287A (zh) 多功能瓷砖及其制造方法
CN105368060A (zh) 有机硅发热层材料、红外辐射加热体及其制备方法
CN210670598U (zh) 一种安全石墨烯电热膜及用该电热膜的装修结构
WO2020057599A1 (fr) Matériau de construction chauffant et son procédé de préparation
CN108909080A (zh) 一种采暖建材及其制备方法
CN104179328A (zh) 一种纳米多层复合电热木地板及其制备方法
CN112443881A (zh) 一种电热一体板及其制备方法
CN110662313B (zh) 一种水性石墨烯远红外导电浆料的制备方法
CN101400192B (zh) 一种防潮取暖电热板及其制备方法
CN110901184A (zh) 一种电热一体板及制备方法
CN111473400A (zh) 一种石墨烯电热画的制备方法
CN111609454B (zh) 一种电热画及其制备方法
CN108620299B (zh) 一种具有远红外辐射加热功能的装饰板制作方法
CN106931491A (zh) 一种电热红外采暖辐射面板
CN208424819U (zh) 一种石墨烯远红外电热膜
CN205976096U (zh) 电加热复合墙板
CN211060225U (zh) 一种采用安全电压供电的发热板
CN206205330U (zh) 多功能瓷砖及多功能装饰画
CN201675527U (zh) 浴室取暖除雾镜
CN206277742U (zh) 一种电加热装饰玻璃板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19862692

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19862692

Country of ref document: EP

Kind code of ref document: A1