WO2020057599A1

WO2020057599A1 - Heating building material and preparation method therefor

Info

Publication number: WO2020057599A1
Application number: PCT/CN2019/106675
Authority: WO
Inventors: 杨敏; 张伟; 李永武
Original assignee: 光之科技(北京)有限公司
Priority date: 2018-09-19
Filing date: 2019-09-19
Publication date: 2020-03-26

Abstract

A heating building material and a preparation method therefor. The heating building material integrates multiple functions such as thermal insulation, heating, electric insulation, waterproofness, and heat conduction; moreover, the surface layer thereof has the appearance and texture of materials such as marble, granite and wood. Therefore, said building material has both a heating function and a decorative effect. The heating building material comprises a base material (1), a thermal insulation layer (2), a reflecting layer (3), a heating radiation layer (4), and an enamel facing layer (5) in sequence. The method comprises: taking a base material; printing or applying a heating layer onto the surface of the base material; and then, providing a facing layer on the surface of the heating layer. The prepared heating building material can emit 5-20 μm far-infrared radiation light waves after being energized, and is warm, confortable, healthy, energy-saving, environment-friendly, and pollution-free. The heating building material adopts integrated structural design, is simply structured, convenient to install and easy to disassemble, and can be used as indoor floor, wall and ceiling.

Description

Heating building material and preparation method thereof

This application claims priority from the following patent applications,

(1) The invention name is "A heating building material and its preparation method", and the Chinese patent application number 2018110973602 filed on September 19, 2018;

(2) The invention name is “Directed Heat Transfer Integral Plate and Preparation Method thereof”, and the Chinese patent application No. 2019102844549 filed on April 10, 2019;

(3) The invention name is “Self-Heating Integrated Board and Preparation Method”, and the Chinese patent application number 2019102844479 filed on April 10, 2019;

(4) An invention patent application with the name of the invention as "a heat transfer integrated plate and a preparation method thereof" and a Chinese patent application number 2019102847833 filed on April 10, 2019;

(5) An invention patent application with the name of the invention as "an electric heating integrated plate and a preparation method" and a Chinese patent application number 2019108292000 filed on September 3, 2019;

(6) An invention patent application with the name of the invention as "a heating building material and a preparation method thereof" and a Chinese patent application number 201910829185X filed on September 3, 2019;

(7) An invention patent application with the name of the invention as "a heating integrated board and a preparation method thereof" and a Chinese patent application number 2019108296478 filed on September 3, 2019;

(8) An invention patent application with the name of the invention as "a heating component and a method for preparing the same" and a Chinese patent application number 2019108296406 filed on September 3, 2019;

The above applications are incorporated herein by reference.

Technical field

The invention relates to a heating building material and a preparation method thereof, in particular to a heating building material used in the construction field and a preparation method thereof.

Background technique

At present, winter heating in our country usually adopts central heating, gas-fired boilers, air conditioners and other products. The central heating heating pipe network is complex, the heat loss during transportation is large, and the burning of fossil energy will cause a serious burden on the environment; according to the National Bureau of Statistics, the ratio of China's natural gas imports to domestic output in 2017 has reached 0.6: 1 , A high degree of external dependence. The air-conditioning heating is uncomfortable and consumes a large amount of energy. In extremely cold regions, the energy efficiency is low, and even it cannot be used normally. At present, an emerging direction in the field is electric heating. However, in the existing heating methods, there are no heating products that can simultaneously meet heating needs and have high efficiency, safety, health, energy saving and economical efficiency.

Taking heating floor as an example, the heating floor for indoor heating generally uses the floor directly connected with the heating device, or installs the heating layer in the floor or is embedded under the floor, or uses a metal plate with heating wires. Forms that cooperate with ordinary floors.

However, the above heating floor has the following disadvantages:

(1) Installation and maintenance are complicated, the cost is high, and the technical requirements for installation and layout are high;

(2) There are hidden dangers of safety and quality, and it is easy to cause problems such as cracks on the surface of the board, shortening the life of the functional layer and the conductive layer due to heating and heating too fast;

(3) There is a phenomenon of electric spark, which causes the safety performance to decrease;

(4) The overlap between the heating layer and the floor, using a large amount of organic cement, will release toxic and harmful gases to the outside during the heating process, which seriously threatens the user's health.

Therefore, the currently used heating floor does not meet the requirements of high thermal efficiency, low cost, safety and environmental protection of the heating floor.

Summary of the Invention

The invention relates to a heating building material used in the construction field, which not only has the attributes of indoor building decoration materials, but also can satisfy the requirements of indoor heating, and has the characteristics of safety, health, energy saving and environmental protection, high heat efficiency and the like. The heating building material is a new product based on heat radiation and heat conduction. The film structure of the product includes a base material, a heat insulation layer, a reflection layer, a heat radiation layer, and an enamel finish layer from bottom to top;

The substrate is a common building material bearing material, including cement-based boards, tiles, and marble;

The thermal insulation layer is attached to a substrate;

The heating radiation layer is attached on the reflective layer;

The facing layer is covered on the heat radiation layer;

The decorative layer has a transmittance of not less than 30% in the infrared band (0.8-15 μm).

As a better option for the above-mentioned heating building materials, the material of the heat-insulating layer is porous material, foam material, and fiber material, including asbestos, glass fiber, and aerogel felt.

As a better option for the above-mentioned heating building materials, the reflective layer includes a gold, silver, nickel, aluminum film, and a polyester or polyimide film with a metal film layer.

As a better choice for the above-mentioned heating building materials, the heat radiation layer includes a heat radiation material, a conductive material, and an insulating material. The heating radiation layer heating material includes graphite, graphene, nano-carbon, special ink, polymer conductive film, the heating radiation layer conductive material includes copper wire, copper foil, or nano-silver paste, and the insulating material is preferably PET polymer. Ester film, PCT, PE.

For the above-mentioned heating building materials, the thickness of the facing layer is 1 μm to 5 mm, and the film layer is uniform. For the facing layer higher than 500 μm, it can also generate heat radiation to the external environment.

As a better choice for the above-mentioned heating building materials, the heating building materials may further include a buffer layer structure, which is located between the heat radiation layer and the enamel finish layer, and the buffer layer material includes ethylene-octene copolymer or ethylene- The vinyl acetate copolymer plays a buffering support for the heat radiation layer and a certain insulation effect.

The film of the enamel finish layer maintains a high transmittance in the infrared wave band, and has a certain transmittance and absorption at 300-1000 nm. Those skilled in the art can further improve this according to requirements, such as The specific component is added or doped in the film, so that it has an absorptivity at a specific wavelength, so that the decorative layer has a rich color.

The heating building material product has the following properties:

1) The enamel is used as a decorative layer for heating building materials, which is light and easy to carry.

2) Using porcelain glaze as the decorative layer of heating building materials, the color of the glaze layer can be changed, beautiful and complex patterns can be prepared, and it can be used in indoor building walls and interior decoration.

3) The enamel finish layer has high transmittance in the infrared wave band, thermal radiation easily penetrates the material, good thermal conductivity, and will not reduce the heating performance of the heating body layer.

4) The enamel prepared in this way can obtain a pattern with uniform thickness and beautiful appearance. The surface flatness of this film is good, and local overheating will not cause damage to the heating layer structure.

5) The ceramic glaze layer used in the present invention has good water resistance, and will not cause the performance of the product to be dampened when the humidity is high.

The invention further provides a method for preparing the above-mentioned heating building material, including the following steps:

1) The substrate is cleaned, and a heat insulation layer, a reflection layer and a heat radiation layer are sequentially attached from bottom to top;

2) The upper surface of the heat radiation layer is cleaned;

3) Finally, a layer of enamel finish is coated on the heat radiation layer. After curing at room temperature, a light, thin, uniform, and thermally conductive finish is formed.

The heating building material has the following beneficial effects:

1) No vacuum system is required, and it can be prepared directly in the ordinary atmospheric environment without adding special equipment;

2) It is easy to produce on a large scale and has great cost advantages.

The invention also provides an electrothermal conversion layer with adjustable thermal conductivity and infrared radiation, which transforms ordinary building decoration materials (floor, tile, wallpaper, etc.) into an integrated material that can radiate infrared and heat sources to the outside without changing the original building. The appearance and texture of the material, thus altering existing heating methods.

The integrated heat transfer board provided by the present invention includes a conductive tape, a first insulating layer, an electrothermal conversion layer, and a second insulating layer. The conductive tape is connected to the electrothermal conversion layer. The first insulating layer, the electrothermal conversion layer, and the first Two insulating reflective layers are stacked in sequence; the contact resistance of the carbon microcrystalline layer and the conductive and charged connection is not higher than 900Ω, and the average resistance value of the electrothermal conversion layer is 11-5000Ω / □.

In some examples of the present invention, the range of the contact resistance is 400-900Ω.

In some examples of the present invention, the contact resistance is more preferably in a range of 10-90Ω, 90-180Ω, 180-270Ω, or 270-400Ω. By testing the heat transfer integrated board obtained in some examples, when the contact resistance is small, the corresponding electric spark phenomenon can be better eliminated.

As a better choice for the integrated heat transfer plate, the thickness of the electrothermal conversion layer may be selected from 1 to 800 micrometers.

In one example of the present invention, the electrothermal conversion layer is a carbon microcrystalline layer.

As a better choice for the integrated heat transfer plate, the raw materials for preparing the electrothermal conversion layer include low-resistance carbon microcrystals with a resistance value of 10-300Ω / □, medium-resistance carbon microcrystals with a resistance value of 300-1000Ω / □, and One or more of the high-resistance carbon microcrystals having a resistance value of 1000Ω / □ or more.

When it is agreed that the center line is at the middle of two electrodes or two conductive strips, in one example of the present invention, the square resistance of the electrothermal conversion layer gradually increases or gradient increases in a direction away from the conductive strip toward the center line.

When it is agreed that the center line is at the middle of two electrodes or two conductive strips, in one example of the present invention, the thickness of the electrothermal conversion layer gradually increases or gradient increases in a direction away from the conductive strip toward the center line.

In one embodiment of the present invention, the gradient resistance is defined as follows: When x is defined as the ratio of the distance from one electrode to the distance between two electrodes, and R _x is the resistance at the corresponding position, the carbon microcrystalline layer R ₀ is 10-300Ω / □, R _0.1 is 50-500Ω / □, R _0.2 is 200-600Ω / □, R _0.3 is 300-800Ω / □, and R _0.4 is 600-1000Ω / □.

The heat transfer integrated board includes a base material, and the base material may be a commercially available common building material, such as a floor, a tile, a wallpaper, a wooden board and the like.

Generally, the substrate should be treated so that the substrate is suitable for the preparation of an integrated heat transfer plate. In one practice of the present invention, the substrate is treated in the following manner: the non-decorative surface of the substrate is polished and polished, and those skilled in the art understand that the non-decorative surface is usually a tile, template, or wallpaper. back. Sanding and polishing is a routine operation in the field. Generally, this operation can achieve the following technical effects: the surface roughness is not greater than 0.8 microns.

As a better choice for the integrated heat transfer plate, the conductive tape can be selected from copper wires, copper foils, aluminum foils and other materials with better conductive properties.

In scenarios with high humidity, it is usually necessary to provide a waterproof layer to ensure the normal operation of the integrated heat transfer board. In one practice of the present invention, the heat transfer integrated board includes a first waterproof layer, and the waterproof layer is located between the substrate and the first insulating layer.

The material of the waterproof layer is a polymer film or paint, and materials that can be selected include polyethylene (PE), polyethylene terephthalate (PET), polyimide (PI), and ethylene-tetrafluoro The thickness of ethylene copolymer (ETFE), inorganic nano-ceramic coating, diamond paint, and polytetrafluoroethylene (PTFE) can be selected from 0.001 to 0.8 mm.

In one example of the present invention, the thickness of the first waterproof layer is 1-30 micrometers.

In one example of the present invention, the thickness of the first waterproof layer is 30-100 micrometers.

In one example of the present invention, the thickness of the first waterproof layer is 100-200 microns.

In one example of the present invention, the thickness of the first waterproof layer is 200-800 microns.

In scenarios where the joint side may be subject to water erosion, another waterproof layer should be provided to ensure the normal operation of the heat transfer integrated board. In one practice of the present invention, the integrated heat transfer plate includes a second waterproof layer, and the second waterproof layer is in direct contact with the second insulating layer.

The material of the second waterproof layer is a polymer film or coating, and materials that can be selected include polyethylene (PE), polyethylene terephthalate (PET), polyimide (PI), and ethylene- The thickness of tetrafluoroethylene copolymer (ETFE), inorganic nano-ceramic coating, diamond paint, and polytetrafluoroethylene (PTFE) can be selected from 0.001-0.8mm.

In one example of the present invention, the thickness of the second waterproof layer is 1-30 micrometers.

In one example of the present invention, the thickness of the second waterproof layer is 30-100 micrometers.

In one example of the present invention, the thickness of the second waterproof layer is 100-200 microns.

In one example of the present invention, the thickness of the second waterproof layer is 200-800 microns.

The heat transfer integrated plate may further include a wear-resistant water-blocking layer. The material of the wear-resistant water-blocking layer is a coating or a film. The materials that can be selected include inorganic nano-ceramic coatings, diamond paint, wear-resistant paper, and polyurethane coatings. , Epoxy resin, and alumina coating, the thickness after film formation can be selected from 0.001-0.8mm.

In one example of the present invention, the thickness of the wear-resistant and water-blocking layer is 1-30 micrometers.

In one example of the present invention, the thickness of the abrasion-resistant and water-blocking layer is 30-100 micrometers.

In one example of the present invention, the thickness of the abrasion-resistant and water-blocking layer is 100-200 microns.

In one example of the present invention, the thickness of the abrasion-resistant and water-blocking layer is 200-800 microns.

The heat transfer integrated board may further include a heat insulation layer, the heat insulation layer is located between the second waterproof layer and the abrasion and water resistance layer, or the heat insulation layer may have a thermal conductivity lower than 0.2W / (m · K) consists of a thermal barrier film, and its thickness is not more than 0.5 mm.

In one example of the present invention, the thickness of the thermal insulation layer is 1-50 micrometers.

In one example of the present invention, the thickness of the heat insulation layer is 50-100 micrometers.

In one example of the present invention, the thickness of the thermal insulation layer is 100-200 microns.

In one example of the present invention, the thickness of the thermal insulation layer is 200-500 microns.

As a better choice for the heating plate, the integrated heat transfer plate may further include a reflective layer. In one example of the present invention, the reflective layer is a metal film, which can be selected from aluminum, silver, mercury, and nickel. The metal film can reflect infrared rays. This structure can make infrared rays radiate in unexpected directions. Directional reflection to the desired direction.

In one example of the present invention, at least 60% of the input power is radiated at a wavelength of 5-20 micrometers according to the power input power meter.

The invention also provides a method for preparing the integrated heat transfer plate, including:

1) Provide a ground and polished substrate as the substrate, and modify the substrate;

2) A carbon microcrystalline layer having a resistance value of 11-5000Ω / □ is formed on the substrate, and then dried; the carbon microcrystalline layer is a low-resistance carbon containing a resistance value of 10-300Ω / □ One or more of microcrystals, medium-resistance carbon microcrystals with a resistance value of 300-1000Ω / □, and high-resistance carbon microcrystals with a resistance value of 1000Ω / □ or more;

3) A carbon microcrystalline region having a resistance value not higher than 90 Ω at the contact point is formed on the carbon microcrystalline layer, and a conductive band is provided.

As a better option of the above method, the step of modifying the substrate may include the step of forming a first waterproof layer on the substrate.

As a better option of the above method, the step of modifying the substrate may include a step of forming an insulating layer on the first waterproof layer.

As a better option of the above method, the method further includes the step of forming a second insulating layer on the carbon microcrystalline layer.

As a better alternative to the above method, the method further includes the step of forming a second waterproof layer on the second insulating layer.

As a better option of the above method, the method further includes the step of forming a heat blocking layer on the second waterproof layer.

As a better option for the above method, the method further includes the step of forming a reflective layer on the heat blocking layer.

As a better option for the above method, the method further includes the step of forming a wear-resistant and water-blocking layer on the reflective layer.

The heating film layer obtained according to the above method has an approximate resistance value, and since the interface resistance at the contact is not higher than 90Ω, the phenomenon of electric spark under normal use environment and installation environment is avoided.

The invention also provides another method for preparing the integrated heat transfer plate, including:

2) forming a plurality of carbon microcrystalline regions with different resistance values on the substrate, and the square resistance of the carbon microcrystalline regions gradually increases or gradient increases away from the electrode near the center line, and then the carbon microcrystalline regions are dried to obtain the carbon microcrystalline regions. Crystal layer

3) Provide a conductive tape.

In this way, a carbon microcrystalline layer having a progressive resistance value can be obtained.

As a common sense, the conductivity band should be set in a carbon microcrystal region with a lower resistance value. In this region, the corresponding carbon microcrystals have a lower block resistance, which can effectively avoid electric sparks.

As a better option for the above-mentioned preparation method, the insulating reflective layer uses magnetron sputtering to deposit a metal dielectric to obtain a highly reflective infrared film.

The invention adopts the progressive resistance value to obtain a good ohmic contact between the heating carbon microcrystals and the copper electrode, which solves the industry pain point of the entire self-heating integrated board; at the same time, improves the electrothermal conversion efficiency and optimizes the proportion of heat radiation in the electrothermal conversion.

The invention also provides a self-heating integrated board. The self-heating integrated board heating is not only comfortable and healthy, energy saving and environmental protection, but also takes the family as a heating unit. The heating temperature, heating time and heating position can be selected according to the needs of the family, which effectively solves the heating problem in winter.

The self-heating integrated board provided by the present invention can emit far-infrared radiation waves with a wavelength of 1-20 micrometers, especially 5-15 micrometers after being energized, which is energy-saving, environmental-friendly and pollution-free, and meets the development requirements of energy-saving and emission reduction.

A self-heating integrated board provided by the present invention includes a substrate, a first insulating and waterproof film layer, a heating film layer, a second insulating and waterproof film layer, a surface layer, and an electrode.

The substrate includes a polished surface;

The first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer are sequentially stacked on the polished surface;

The electrode is disposed on a substrate and is electrically connected to the heating film layer;

The total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 0.01-5 mm.

In an embodiment of the present invention, the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 0.01-0.5 mm.

In one embodiment of the present invention, the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 0.5-1 mm.

In an embodiment of the present invention, the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 1-3 mm.

In one embodiment of the present invention, the total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 3-5 mm.

In one embodiment of the present invention, the self-heating integrated board further includes an infrared reflective film layer, and the infrared reflective film layer is located between the polished surface and the first insulating and waterproof film layer.

In an embodiment of the present invention, the self-heating integrated board further includes a wear-resistant layer, and the wear-resistant layer is disposed on the surface layer.

As a better option for the self-heating integrated board, the material of the surface layer includes epoxy resin layer, ultraviolet curing adhesive layer, ceramic coating layer, cement layer, ceramic layer, glass layer, marble layer, and granite layer. One or more.

As a better choice for the self-heating integrated board, the surface layer contains a high-strength wear-resistant material, which has high strength and good abrasion resistance on the one hand, protects the inner-layer heating film from external forces, and on the other hand Various textures and patterns set on demand are drawn as expected, with decorative and beautiful effects.

As a better option for the self-heating integrated board, the first and second waterproof and insulating film layers include an organic heat-resistant insulating material and / or an inorganic heat-resistant insulating material, and the organic heat-resistant insulating material includes One or more of polyethylene terephthalate, polyimide, polyamideimide, polymaleimide, polydiphenyl ether, polytetrafluoroethylene, the inorganic heat-resistant insulation Materials include one or more of quartz, mica, glass, and ceramic. In an embodiment of the present invention, the thickness of the first insulating waterproof film layer and the second waterproof film layer is 1 μm to 1 mm.

In some embodiments of the present invention, the heating film layer is a low-temperature radiant electric heating film, and the low-temperature radiant electric heating film is a type of radiant electric heating film conforming to the JC / T286-2010 industry standard, especially a flexible electric heating film.

In some embodiments of the present invention, the heating film layer includes one or more of a carbon material, tourmaline, and far-infrared ceramic, and the carbon material includes one or more of nano-carbon crystals, carbon fibers, and graphene. Species. In one embodiment of the present invention, the thickness of the heating film layer is 1 μm to 800 μm.

As a better option for the self-heating integrated board, at least 55% of the input power is radiated by infrared rays with a wavelength of 1-20 μm according to the power input power meter.

As a better option for the self-heating integrated board, the infrared reflective layer includes a metal film layer. In one embodiment of the present invention, the thickness of the metal film layer is 0.05 μm to 500 μm. In some embodiments of the present invention, the metal included in the infrared reflective layer may be aluminum, silver, mercury, nickel, or other materials. When the selected metal is aluminum, silver, or other metal materials that can be oxidized and corroded by water vapor as the infrared reflective film layer, it is necessary to do a waterproof treatment on the polished surface of the substrate, and then prepare an infrared reflective film layer.

As a better choice for the self-heating integrated board, the substrate is a high-strength low-thermal-conductivity plate, the compressive strength is not less than 10 MPa, and the thermal conductivity is less than 0.12 W / (m · K). In some embodiments of the present invention, the substrate may optionally include a slate plate, a calcium-silicate plate, a silicate plate, and a rock plate. In an embodiment of the present invention, the thickness of the substrate may be further 0.5 mm to 30 mm.

As a better option for the above self-heating integrated board, conductive metal tapes are attached to the power film on the two sides of the heating film layer near the edges, and the heating film layer is electrically connected to the electrodes through the metal tape.

As a better option for the self-heating integrated board described above, the electrodes are arranged in the substrate, such as embedded in the four sides connected to the polished surface, or opposite sides of the polished surface; The contact with the outside, and the connection with the heating film layer is achieved through appropriate wires.

The invention also provides a method for preparing a self-heating integrated board, including:

1) Provide a substrate and polish one surface of the substrate;

2) An infrared reflective film layer, a first insulating and waterproof film layer, and a heating film layer are sequentially stacked or formed on the polished surface, and then a guide bar is provided on the heating film layer, and the guide bar and the electrode are formed. After being connected, a second insulating and waterproof film layer and a surface layer are sequentially stacked or formed on the heating film layer.

In step 1), the polished surface should be the side that is expected to be functionalized.

In step 2), the construction process of each layer may be directly bonding the layers of a certain size to obtain a self-heating integrated board, or forming a corresponding structure by casting, spraying, or the like.

In step 2), an electrode that is in direct contact with the heating film layer can be provided to realize the omission of the guide bar. The corresponding preparation step is: sequentially stacking or forming an infrared reflective film layer on the polished surface, and a first insulation and waterproofing. A film layer and a heating film layer, and then the heating film layer and the electrode are connected, and then a second insulating and waterproof film layer and a surface layer are sequentially stacked or formed on the heating film layer.

When the corresponding directional radiation is not considered, the infrared reflective film layer may be omitted.

In one embodiment of the present invention, the self-heating integrated board is prepared as follows:

(1) Provide a thermal insulation substrate with a thickness of 10mm, clean it and dry it;

(2) preparing a metal film as an infrared reflective film layer on the surface of the substrate after cleaning by evaporation;

(3) The first insulating and waterproof film layer is prepared on the surface of the infrared reflective film layer by roller coating, for example, the thickness is 500 μm, and it is cured by being left at room temperature for 24 hours.

(4) preparing the graphene heating film layer by screen printing on the surface of the first insulating and waterproof film layer and then drying it; or preparing an electric heating carbon paste layer; or directly stacking and preparing a heating film layer;

(5) Paste the conductive metal tape on the surface of the heated film layer near the edges after drying, and weld the conductive metal tape and the built-in electrode together;

(6) The second insulating and waterproof film layer is prepared by roller coating on the surface of the heating film layer; the thickness is 500 μm, and it is left to cure at room temperature for 24 hours.

(7) The surface layer is prepared by liquid curing on the surface of the second insulating and waterproof film layer. The thickness of the surface layer is 2 mm, and the surface layer is cured at 50 ° C. for 2 hours to complete the preparation of the self-heating integrated board.

Compared with the prior art, the self-heating integrated board has the following beneficial effects:

1) The self-heating integrated board can emit 1-20 microns, especially 5 ~ 15μm far-infrared radiation light waves after being energized. Due to the use of mid-far infrared radiation for heating, the heating speed is fast, and the human body is sensitive to 5 ~ 15μm infrared light induction, and warm Comfortable and healthy, low energy consumption, energy saving and environmental protection without pollution.

2) The heating integrated board uses the family as a heating unit. The heating temperature, heating time and heating position can be selected according to the needs of the family, and it is energy-saving, environmentally friendly and pollution-free, which can effectively solve the heating problem in the winter in the south. In addition, the self-heating integrated board can also be used in the north, replacing the central heating in the north, which is in line with the development direction of energy conservation and emission reduction in China.

3) The self-heating integrated board adopts an integrated design, and the functional layer is thinner than the traditional substrate. Compared with the traditional separated structure, the preparation cost is reduced. The installation method is flexible and easy to install. It can be used as indoor floor and wall. Surface and roof.

The invention also provides a directional heat transfer integrated board with directional heat conduction and infrared radiation, which transforms ordinary building decoration materials (floor, tile, wallpaper, etc.) into an integrated building material that can directionally radiate infrared rays and a small amount of heat sources without changing. The appearance and texture of the original building materials.

The invention provides a directional heat transfer integrated board including a surface layer, a conductive tape, an electrothermal conversion layer, a heat insulation reflective layer, a first sealing layer, and a second sealing layer. The surface layer, the first sealing layer, and the electrothermal conversion layer 2. The heat-reflective reflective layer and the second sealing layer are stacked in sequence, and the transmittance of the surface layer to infrared rays having a wavelength of 5-18 microns is not less than 20%;

The total thickness of the electrothermal conversion layer, the heat-reflecting layer, and the sealing layer is 10-800 microns.

In some embodiments of the present invention, the surface layer is infrared glass, infrared transmissive polycarbonate, polymethyl methacrylate, or infrared transmissive resin having a transmittance of not less than 20%.

The directional heat transfer integrated board includes a base material, and the base material may be a commercially available general building material, such as a floor, a tile, a wallpaper, a wooden board, and the like.

Generally, the substrate should be treated so that the substrate is suitable for the preparation of an integrated heat transfer plate. In one practice of the present invention, the substrate is processed as follows: the substrate is subjected to a polishing process. Sanding and polishing is a routine operation in the field. Generally, this operation can achieve the following technical effects: the surface roughness is not greater than 0.8 microns.

As a better choice for the directional heat transfer integrated board, the directional heat transfer integrated board includes at least a waterproof layer, and the waterproof layer is located between the substrate and the electrothermal conversion layer; or the waterproof level of the sealing layer is greater than IP67. In scenarios with high humidity, it is usually necessary to provide a waterproof layer to ensure the normal operation of the directional heat transfer integrated board. In one example of the present invention, the directional heat transfer integrated board includes a waterproof layer, and the waterproof layer is located between the substrate and the low-resistance carbon microcrystalline film. In scenarios where the joint side may be subject to water erosion, a waterproof layer should be provided to ensure the normal operation of the directional heat transfer integrated board. In one practice of the present invention, the directional heat transfer integrated board includes a waterproof layer, which is in direct contact with the sealing layer.

In one example of the present invention, the thickness of the waterproof layer is 1-30 micrometers.

In one example of the present invention, the thickness of the waterproof layer is 30-100 micrometers.

In one example of the present invention, the thickness of the waterproof layer is 100-200 microns.

In one example of the invention, the thickness of the waterproof layer is 200-800 microns.

In the scenario where the directional heat transfer integrated board may fail due to external forces, a wear-resistant layer should be provided to provide protection for the heating components.

The material of the abrasion-resistant layer is paint or film. Materials that can be selected include inorganic nano-ceramic paint, diamond paint, abrasion-resistant paper, polyurethane paint, epoxy resin, and alumina paint. 0.001-0.8mm.

In one example of the present invention, the thickness of the wear-resistant layer is 1-30 microns.

In one example of the present invention, the thickness of the wear-resistant layer is 30-100 micrometers.

In one example of the present invention, the thickness of the wear-resistant layer is 100-200 microns.

In one example of the present invention, the thickness of the wear-resistant layer is 200-800 microns.

In one embodiment of the present invention, according to the power input power meter, at least 90% of the input power is radiated with infrared rays having a wavelength of 5-20 microns.

In one embodiment of the present invention, the raw materials for preparing the electrothermal conversion layer include low-resistance carbon microcrystals having a resistance value of 10-300Ω / □, medium-resistance carbon microcrystals having a resistance value of 300-1000Ω / □, and a resistance value One or more of the high-resistance carbon crystallites having a resistance of 1000 Ω / □ or more.

In one embodiment of the present invention, the raw materials for preparing the electrothermal conversion film include low-resistance carbon microcrystals having a resistance value of 10-300Ω / □, and the raw materials for preparing the carbon microcrystal film further include a resistance value of 300-1000Ω / □. One or more of medium-resistance carbon microcrystals and high-resistance carbon microcrystals having a resistance value of 1000Ω / □ or more.

When it is agreed that the center line is at the middle of the two electrodes or the two conductive strips, in one example of the present invention, the thickness of the electrothermal conversion layer gradually increases or gradient increases in a direction away from the conductive strip toward the center line.

As a better choice for the directional heat transfer integrated plate, it is defined that x is the ratio of the distance from one electrode to the distance between two electrodes or the conductive strip, and when R _x is the resistance at the corresponding position, R _{0 of the} carbon microcrystalline film It is 0.01-30Ω / □, R _0.1 is 50-500Ω / □, R _0.2 is 200-600Ω / □, R _0.3 is 300-800Ω / □, and R _0.4 is 600-1000Ω / □.

As a better option for the directional heat transfer integrated board, the directional heat transfer integrated board includes a heat-shielding reflection layer, the heat-shielding reflection layer contains a metal film layer, and the thickness of the metal film layer is 0.05 μm to 100 μm. In one example of the present invention, the plate is a PET film with an aluminum film, PET is an insulating material, and the aluminum film can reflect infrared rays. This structure can make the infrared line be oriented when it radiates in an unexpected direction. Reflect to the set direction.

The heat insulation layer may be a heat resistance film with a thermal conductivity lower than 0.2 W / (m · K), and the thickness is 0.5 mm.

The sealing layer may be a waterproof coating, AB glue, ceramic coating, or the like, and has a thickness of 1-50 microns.

In one example of the present invention, the thickness of the sealing layer is 1-10 microns.

In one example of the present invention, the thickness of the sealing layer is 10-20 microns.

In one example of the present invention, the thickness of the sealing layer is 20-36 microns.

In one example of the present invention, the thickness of the sealing layer is 36-50 microns.

The invention also provides a preparation method for preparing the directional heat transfer integrated plate, including:

1) Provide a polished substrate as a substrate and modify the substrate;

2) Build or stack a heat-reflective layer and an electrothermal conversion film on the modified substrate, and set a conductive tape on the electrothermal conversion layer, and then stack or build the first sealing layer and surface layer on the conductive tape; or after modification A heat-reflecting layer, an insulating layer, and an electrothermal conversion film are constructed or stacked on the substrate of the substrate, and a conductive tape is provided on the electrothermal conversion layer, and then a first sealing layer and a surface layer are stacked or constructed on the conductive tape.

Preferably, the step 2) includes a step of constructing or stacking a second sealing layer on the modified substrate.

In one embodiment of the present invention, the directional heat transfer integrated plate is prepared according to the following method:

1) Provide a polished substrate as a base;

2) A sealing layer, a heat-reflecting layer, an insulating layer, and an electrothermal conversion film are sequentially stacked or constructed on the substrate, and a conductive tape is provided on the electrothermal conversion film, and then an insulating sealing layer and a surface layer are stacked or constructed on the conductive tape .

The above step 1) may include a step of constructing a waterproof layer on the substrate.

In the above step 2), a step of constructing a waterproof layer on the outermost side may be optionally included.

In the above step 2), the insulating reflective layer is prepared by depositing a metal dielectric reflective film on PET by a magnetron sputtering method.

In another embodiment of the present invention, the directional heat transfer integrated plate is prepared according to the following method:

Provide the treated substrate, and then laminate the second waterproof layer, insulation layer, and carbon material layer on the substrate in order, and lead out the wires, and then laminate the insulating reflective layer, heat insulation layer, sealing layer, first waterproof layer, Wear-resistant layer.

Nano-carbon microcrystals are coated on the insulating layer by screen printing, and the thickness of the carbon microcrystalline film layer gradually decreases from the outside to the inside, the resistance at the two ends is the smallest, and a conductive copper tape is implanted at both ends as Wire, and then prepare a medium-high resistance nano carbon microcrystalline material, and adopt the same method to sequentially prepare a heat-reflecting layer, an insulating layer, and a surface layer. Finally, a directional heat conduction integrated sheet with a radiant heating ratio of 92% was prepared. When energized, the entire heating process is mainly radiant heating, accounting for 92%, supplemented by conduction and convection heating, and the heating material body is provided with a current introduction point, which is embedded into the directional heat conduction through an electrical connector In one board.

In the present invention, commercially available ordinary building materials can be used, and the back surface (non-decorative surface) can be polished and polished, and then a waterproof layer and an insulating layer are sequentially prepared, and then a low-resistance nano-carbon microcrystalline layer and a low-resistance carbon micro-crystalline film are prepared. The thickness of the layer is gradually reduced from the outside to the inside, and the resistance is minimized at both ends, and a wire is implanted at both ends, and then a low-resistance carbon microcrystal is prepared. After curing, a medium- and high-resistance nano-carbon microcrystal material is sequentially prepared, and then insulated An anti-infrared layer (prepared by depositing a metal dielectric reflective film on PET by a magnetron sputtering method), a heat insulation layer, a sealing waterproof layer and a wear-resistant layer. Finally, an integrated board with a proportion of radiant heat of about 90% was prepared. In the entire heating process, radiant heating is the main part, which accounts for more than 90%, supplemented by conduction and convection heating, and the proportion is not more than 10%. There are several pairs of current introduction points on the edge of the heating material. The electrical connector is embedded in an integrated plate.

The invention adopts magnetron sputtering to deposit a metal dielectric, obtain a highly reflective infrared film, and prepare a directional heat-conducting heating plate to concentrate the heat energy to a specified space (the infrared wave band is 5-15 microns, corresponding to the resonance frequency of water molecules) , Which can cause it to resonate and convert to thermal energy), which greatly improves heating efficiency; and due to directional thermal conductivity, it gives ordinary building materials a function of directional radiation with a wavelength of 5-15 microns.

In view of the problem of wasting energy by the existing individual users in the south or centralized heating by users in the north, the present invention also provides another new electric heating integrated board, the electric heating integrated board includes a thermal insulation substrate, a heating film layer and a surface layer; The thickness of the heating film layer is between 50 nm and 10 μm; and the square resistance of the heating film layer is between 10 and 1000 Ω / □.

Preferably, the heating film layer is an oxide or an oxysulfide, and the material of the heating film layer includes ZnO _x S _(1-x) , InO _x S _(1-x) , Sn _x In _(1-x) O, One or more of Zn _x Mg _(1-x) O and Zn _x Al _(1-x) O.

Preferably, the heat-generating film layer is a oxycarbon compound, and the material of the heat-generating film layer includes SiO _x C _(1-x) .

Preferably, the heat-generating film layer is a carbonitride, and the material of the heat-generating film layer includes SiC _x N _(1-x) .

Preferably, the upper and lower surfaces of the heating film layer are provided with an upper insulation waterproof layer and a lower insulation waterproof layer; conductive metal strips are attached to the sides of the heating film layer near the edges as a power supply circuit. The electrodes are electrically connected.

Preferably, the materials of the above-mentioned lower insulation waterproof layer and the upper insulation waterproof layer are inorganic waterproof insulation materials or organic waterproof insulation materials;

The inorganic waterproof insulating material includes ceramic, enamel, glass, mica, quartz, and dielectric ceramic;

The organic waterproof insulating material includes polyimide, polyamideimide, polyimide, polymaleimide, polydiphenyl ether, modified epoxy, unsaturated polyester, and polyaramide.

Preferably, the above-mentioned electrothermal integrated board further includes an infrared reflective film layer, and the infrared reflective film layer may be located between the substrate and the lower insulating and waterproof layer, and the infrared reflective layer is a metal-containing film layer.

Preferably, the material and size of the heat-insulating substrate satisfy a compressive strength of not less than 10 MPa and a thermal conductivity of less than 0.5 W / (m · K).

Preferably, the heat-preserving substrate material includes one or more of a calcium silicate board, a silicate board, a mica board, a porous ceramic board, and a porous ceramic board.

Preferably, the material of the surface layer has a Mohs hardness of not less than 3 and abrasion resistance of not more than 500 mm ³ .

A method for preparing an electrothermal integrated board includes the following steps:

1) Take the insulation substrate, clean it and dry it;

2) A vacuum coating method is used to prepare a heating film layer on the polished surface of the substrate, and then annealed at 100 to 450 ° C for 10 to 120 minutes;

3) A metal conductive tape is provided on the surface of the heating film layer, and the metal conductive tape is electrically connected to the built-in electrode;

4) A surface layer is provided on the surface of the heating film layer to complete the preparation of the low-voltage electric heating plate.

The electric heating integrated board has the following advantages:

The electrothermal integrated board of the present invention uses an oxide film with a thickness of less than 10 μm as a heating material, which not only has a small amount of heating material and low production cost of the heating film layer, but also uses an oxide as the heating material, which has stable oxide performance and high heating efficiency. The electric heating integrated board has a long service life, and the heating power attenuation is small during use.

The electrothermal integrated board uses vacuum coating to prepare the heating film layer. Not only can the thickness of the heating film layer be accurately controlled, but the vacuum coating can accurately control the composition of the heating material, which can effectively dope the heating material of the heating film layer. Doping improves the infrared emissivity of the heating material. On the other hand, the wavelength of the infrared radiation emitted by the heating material can be effectively adjusted by doping, so that the infrared wavelength emitted by the electrothermal integrated board matches the infrared absorption of the human body.

The invention further provides only a heat-generating building material, which can also have an air purification function, thereby reducing harmful substances such as formaldehyde and benzene in the indoor air. Another object of the present invention is to provide a method for preparing the exothermic building material.

In order to achieve the above objective, the present invention provides the following technical solutions:

One aspect of the present invention provides a heat-generating building material, the heat-generating building material comprising a heat-insulating layer, a heat-generating layer, and an air purification surface layer connected from top to bottom, the air purification surface layer containing 1 to 40% by weight of air purification material.

The heating building material of the present invention realizes the integrated design of heating, heat preservation and purification of building materials by adding air purification materials to the surface layer of the layered structure. On the one hand, the harmful gas released by the heating of the building material itself can be purified, and the other Aspect can also absorb harmful gases in the external environment. In addition, the electro-thermal radiation conversion efficiency of the heat-generating building material of the present invention is greater than 60%, and the amount of induced air negative ions can be greater than 1000 / (S · cm ² ).

Preferably, the air purification surface layer contains an air purification material, the air purification material is a negative ion release material and / or a photocatalyst material, wherein the negative ion release material is a natural inorganic mineral material and / or a synthetic material;

Preferably, the natural inorganic mineral material is at least one selected from the group consisting of tourmaline, hexalite, opal, odd-ice stone, gemstone, seagull, vermiculite and ancient seabed minerals;

Preferably, the artificially synthesized material is an anion powder.

The air purification material in the present invention can be selected from inorganic or organic negative ion release materials. The negative ion release materials have multiple functions. In addition to removing harmful gases in the decoration environment, they can also play a role in eliminating odor and high-voltage electrostatic protection. Can play a bacteriostatic effect to a certain extent. In addition, materials that can release negative ions, such as tourmaline, also have high emissivity, so they can release far-infrared rays more, and far-infrared rays have multiple benefits to the human body. Therefore, the building materials of the present invention can not only purify the air, but also Can play a role in improving the environment and promoting health.

Preferably, the photocatalyst material is selected from at least one of nano TiO ₂ , nano ZnO, nano CdS, nano WO ₃ , nano Fe ₂ O ₃ , nano PbS, nano SnO ₂ , nano ZnS, nano SrTiO ₃ and nano SiO ₂ . Species.

Photocatalyst materials have the function of decomposing formaldehyde. As one of the main harmful substances brought by decoration, formaldehyde is extremely harmful to the human body. By adding photocatalyst materials to the surface layer of the board, the present invention can remove formaldehyde faster, so it is very Match the application scenarios of the decoration room.

Preferably, the air purification material is uniformly distributed in the air purification surface layer in the form of particles, and the particle size of the air purification material is 0.005 to 500 μm.

Preferably, the air purification surface layer is composed of a surface layer containing no air purification material and an air purification material layer, and the air purification material layer is located on a surface of the surface layer;

Preferably, the thickness of the surface layer is 0.1 to 10 mm, and the thickness of the air purification material layer is 1 to 500 μm.

In the building materials of the present invention, the air purification surface layer may be a single mixture layer or two independent layers. When a single layer is used, the surface material matrix and the air purification material are mixed uniformly and solidified to form a single layer, or may be separate After the surface material is cured into a layer, an air purification layer is formed on the surface layer. Both forms have a strong air purification effect.

Preferably, the thermal insulation layer is composed of a porous or fibrous thermal insulation material, the thermal insulation material is selected from the group consisting of a vacuum insulation board, a nano-silica aerogel, a foamed polyurethane, and an extruded polystyrene board, At least one of real gold plate, foamed ceramic, foamed cement, and foamed glass;

Commonly used thermal insulation substrates can be used in the heating building materials of the present invention. Preferably, the thermal insulation materials used in the present invention should have the following characteristics: lightweight, loose, porous or fibrous, and there is no flowing air inside In order to block heat conduction.

The thermal insulation layer substrate of the present invention can be selected from organic, inorganic materials, or a mixture thereof. Inorganic materials have the advantages of non-combustion and good chemical resistance. Organic materials have the advantages of higher strength, lower water absorption, and better water resistance. .

Preferably, the thickness of the thermal insulation layer is 1-10 cm.

Preferably, the material of the heating layer is selected from at least one of carbon black heating material, graphene heating material, carbon fiber heating material, wire heating material, polymer heating material and semiconductor heating material;

Preferably, the thickness of the heating layer is 10-200um.

Preferably, an insulating waterproof layer is further provided between the heating layer and the air purification surface layer;

Preferably, an insulating and waterproof layer is also provided between the thermal insulation layer and the hair;

Preferably, the thickness of the insulating and waterproof layer is 0.1-500um.

According to another aspect of the present invention, there is provided a method for preparing a heat-generating building material, the method comprising the following steps:

1) Obtaining a thermal insulation layer, setting a reserved wiring hole on the side of the thermal insulation layer and burying an electrode joint;

2) forming a heat generating layer above the heat insulation layer by baking and curing;

3) mixing the material used for preparing the air purification surface layer with water, coating it on the heating layer, and leaving it until the material is solidified;

Preferably, the method further comprises: providing an insulating waterproof layer with an electrode between the heat-insulating layer and the heat-generating layer, and connecting the electrode to the electrode joint;

Preferably, the method further includes providing an insulating and waterproof layer between the heat generating layer and the air purification surface layer.

Preferably, the baking temperature for baking curing is 100-170 ° C, and the curing time is 20-40 minutes.

The heating building material provided by the present invention has the following advantages:

1. The heat-generating building material of the present invention achieves true integration, which has both good mechanical properties and good thermal insulation properties, and has both the mechanical properties of the substrate and the thermal insulation properties of the thermal insulation material.

2. The present invention can fully purify indoor air by incorporating materials having an air purification function in or on the surface layer.

3. The heat-generating building material of the present invention can emit far-infrared rays when it is heated by electricity. The emitted far-infrared rays can improve the activity of the air purification material in the surface layer, and make the air purification material more efficient in generating negative oxygen ions.

3. Materials that can release negative ions, such as tourmaline, also have high emissivity, so they can release far infrared rays more, and thus promote human health.

In addition, in view of the lack of integrated heating products that can maintain uniform heat generation and ensure safe use for a long time in the prior art, and have replaced the existing heating methods, it cannot meet the shortcomings of energy-saving, high-efficiency, and environmentally-friendly heating requirements. One-piece board, through the use of thin film integration technology, the building decoration material with room temperature curing function is coated on the electrothermal conversion layer, so that ordinary building decoration materials (floor, tile, wallpaper, etc.) can be converted into an external radiation and heat source. Materials without changing the appearance and texture of the original building materials, thereby changing existing heating methods.

The present invention provides a heat-generating integrated board, which comprises a substrate, a heat-generating layer, a metal current-carrying strip, and a wear-resistant water-blocking layer in order from top to bottom;

The heating layer is a conductive far-infrared heating material, and is uniformly printed on the substrate by screen printing;

The metal current-carrying strips are bonded to the heating layer and are located on both sides of the heating layer, and the metal current-carrying strips on both sides are respectively connected to the power source;

The abrasion-resistant and water-blocking layer is prepared by solidifying a liquid material.

Preferably, the heating integrated board includes a substrate, a waterproof layer, a weather-resistant insulating layer, a nano-carbon crystal layer, a metal current-carrying strip, and a wear-resistant water-blocking layer in order from top to bottom;

The substrate includes glass, metal plate, cement-based plate, flexible plastic film, tile, tile blank, polyvinyl fluoride composite film, plywood, fiberboard, particle board, solid wood veneer, bamboo veneer, wood-plastic board, and inorganic fireproof board. One of natural stone and metal composite board;

The waterproof layer is formed by coating and curing a waterproof paint;

One side of the metal current-carrying strip is in contact with the nano-carbon crystal layer, the other side is in contact with the abrasion-resistant and water-blocking layer, and both ends are welded with the electric wire.

As a further improvement of the present invention, the abrasion-resistant and water-blocking layer is prepared by the following raw materials in parts by weight: 100 to 150 parts of modified epoxy resin, 50 to 100 parts of water-based polyurethane emulsion, 3 to 10 parts of basalt powder, and silicon 12 to 17 parts of fine powder, 20 to 30 parts of garnet powder, 1 to 2 parts of flame retardant, 1 to 2 parts of curing agent, 0.5 to 1 part of thickener, 0.05 to 0.1 part of preservative, and 15 to 20 part of deionized water Share

As a further improvement of the present invention, the modified epoxy resin is prepared by the following method:

S1. Dissolve the epoxy resin 6101 in an organic solvent, raise the temperature to 50-70 ° C, add the silane coupling agent with amino group and ethyl orthosilicate, stir at high speed, and discharge after constant temperature reaction for 5 hours. Add methyl triethyl Oxysilane, after stirring well, remove the solvent under reduced pressure to obtain an emulsion;

S2. Preparation of graphene oxide by improved Hummers method;

S3. Mill and mix the graphene oxide, nano-alumina, and nano-zinc oxide prepared in step S2 by a ball mill; add to the emulsion obtained in step S1, stir and mix well, add antimony trioxide and nickel oxide, and stir at high speed for 1 h Add polyamide and stir quickly for 2min to obtain modified epoxy resin;

The epoxy resin 6101, an amino-containing silane coupling agent, orthosilicate, methyltriethoxysilane, graphene oxide, nano-alumina, nano-zinc oxide, antimony trioxide, and nickel oxide The mass ratio is 120: (7 to 10): (20 to 25): (3 to 5): (1 to 3): (3 to -5): (1 to 3): (0.5 to 1.5): ( 2 to 5); the silane coupling agent having an amino group is selected from one of KH550, KH792, KH-602, WD-50, KBM-603, SI900, Z-6121, Z-6020, GF95, and SI902 The organic solvent is selected from one or more of ethyl acetate, acetone, dichloroethane, acetonitrile, ethanol, methanol, toluene, and pyridine.

As a further improvement of the present invention, the curing agent is selected from one of imidazole curing agents, organic acid anhydride curing agents, and amine curing agents; and the thickener is selected from carboxymethyl cellulose, hydroxyethyl cellulose , Methyl cellulose, hydroxypropyl methyl cellulose, sodium polyacrylate, organic bentonite, polyacrylamide, guar gum, xanthan gum, ZW raw powder, AT-70 thickener, PR-328 thickening Agent, TD-01 thickener, HEUR series polyurethane associative thickener, Rheoagent GC-2440 thickener, GD-8201 coating special thickener, DH series thickener and CH-718 series thickener One or more of the agents; the preservative is selected from 1,2 benzoisothiazolin-3-one, 2-methyl-4 isothiazolin-3-one, 5-chloro-2-methyl One or more of 4-4 isothiazolin-3-one and 2-methyl-4 isothiazolin-3-one.

As a further improvement of the present invention, the heat-generating layer preparation material includes a conductive heat-generating material, turpentine alcohol-permeability, and ethyl cellulose.

As a further improvement of the present invention, the conductive heating material includes one or more of nano-carbon crystal powder, graphene, carbon fiber, carbon nanotube, expanded graphite, lanthanum chromate, silicon carbide, molybdenum silicide, and barium titanate. combination.

As a further improvement of the present invention, the metal current-carrying strip can adapt to the requirements of different currents and voltages by changing the size of its cross-sectional area; the metal current-carrying strip can take a length direction or a width direction according to the requirements of use Two ways of paving.

As a further improvement of the present invention, the surface and surroundings of the heat-generating layer are covered with an insulating and waterproof film, so that it has the functions of insulation and waterproof.

As a further improvement of the present invention, a thermal storage layer is further included, and the thermal storage layer is disposed between the heating layer and the substrate and / or the metal current carrying bar and the wear-resistant water blocking layer.

The invention further protects a method for preparing the above-mentioned heat-generating integrated board, which includes the following steps: after polishing and grinding the back surface of the substrate, applying a heat-generating layer to the polished surface of the substrate by printing or coating, and then on the heat-generating layer The metal current-carrying bars with different cross-sectional areas are laid in the length direction or width direction, and the two ends are connected with the connection plug; then the surface of the heating layer and the metal current-carrying bar is coated with a wear-resistant and water-blocking layer with a thickness of 1 μm to 5 mm. After curing, the heat-generating integrated board is prepared; the two heat-generating integrated boards are connected through a connection plug, and the connection plug has a conductive function.

The invention has the following beneficial effects:

The invention adopts thin film integration technology, and coats the building decoration material with a normal temperature curing function on the electrothermal conversion layer, so that ordinary building decoration materials (floor, tile, wallpaper, etc.) are transformed into an integrated material that can radiate infrared and heat sources to the outside. Without changing the appearance and texture of the original building materials, thereby changing the existing heating method;

In the present invention, commercially available ordinary building materials are selected, and the back surface (non-decorative surface) is polished and polished to sequentially prepare the electrothermal conversion and the surface layer. Finally, a radiant heating integrated sheet is prepared. The edge of the heating material is provided with a current introduction point, which converts electrical energy into thermal energy, and heats the room mainly by radiant heating, supplemented by conduction and convection heating, thereby achieving long-term uniform heating and safe technology. effect;

The multi-mesh structure on the screen printing plate of the present invention allows the conductive heating material and paste to pass through the porous structure of the screen under the action of a scraper, thereby obtaining one or more uniform heating layers on the weather-resistant insulating layer. Thus, a heat-generating layer with good thermal conductivity and uniform thermal conductivity is obtained. The present invention uses a carbon-based material or a non-carbon material to prepare a heat-generating layer. The heat-generating layer is in direct contact with a metal current carrying bar and has good electrical conductivity. Vibration heat, which is radiated into the room in the form of infrared rays, so as to achieve a good heat insulation effect, and its heat storage layer can further play a role in keeping warm;

The invention uses a silane coupling agent with an amino group to catalyze the ring-opening reaction of epoxy resin and the dehydration condensation reaction of ethyl orthosilicate, so that the silicon group is connected to the epoxy resin to achieve modification; methyl triethoxy group is added After the silane, the oxides such as graphene oxide, nano-alumina, nano-zinc oxide, antimony trioxide, and nickel oxide are connected to the epoxy polymer, thereby realizing the modification of the epoxy resin by inorganic oxides. After the epoxy resin has good abrasion resistance, chemical resistance and good hardness and toughness;

The preparation method of the invention is simple and has a wide range of applications. It can be applied to almost all substrates. The raw materials are widely available. The prepared heat-generating integrated board has superior mechanical properties, is convenient for transportation and storage, has uniform heat generation, is safe to use, and has a long service life. Broad application prospects.

The application also provides a heat generating component and a method for manufacturing the same to solve the problems of unreliable connection between the conductive element and the heat generating layer of the existing heat generating component and excessive contact resistance at the connection between the two.

The present application provides a heat generating component, including a heat generating layer and a lower bearing layer disposed below the heat generating layer, conductive elements are disposed at both ends of the lower bearing layer, and the heat generating layer is made of a conductive heat generating material. The conductive heating material has a liquid and solid state or a form with a semi-solid and solid state;

When the conductive heating material is in a liquid state or a semi-solid state, the conductive heating material is attached to the conductive element and the lower supporting layer, and the conductive heating material is cured with the conductive element and the lower portion, respectively. The bearing layer is fixedly connected.

Preferably, the contact resistance between the heating layer and the conductive element formed by curing of the conductive heating material does not exceed 900 ohms.

Preferably, when the conductive heat-generating material is in a liquid or semi-solid state, the conductive heat-generating material is attached to the conductive element and the lower supporting layer by printing or coating.

Preferably, the conductive heating material includes carbon paste and graphene, and the conductive element includes copper foil, aluminum foil, and silver foil.

Preferably, in a vertical direction (Z), a top surface of the conductive element is flush with a top surface of the lower bearing layer.

Preferably, the insulating and waterproof material is formed by compounding a base material and a reinforcing material;

The base material includes synthetic resin, rubber, and ceramic, and the reinforcing material includes glass fiber, boron fiber, aramid fiber, silicon carbide fiber, asbestos fiber, and whiskers.

Preferably, it further comprises an upper bearing layer, which is disposed above the heating layer in the vertical direction (Z);

The upper bearing layer and the lower bearing layer are both made of an insulating and waterproof material.

Preferably, it further comprises a base layer and a surface layer. In a vertical direction (Z), the surface layer, the upper load-bearing layer, the heat-generating layer, the lower load-bearing layer and the base layer are sequentially stacked from top to bottom. Settings.

Preferably, in the horizontal direction (X), the base layer is provided with a mounting groove, and the mounting groove is used for mounting a connection element electrically connected to the conductive element;

In the vertical direction (Z), the base layer and the lower load-bearing layer are provided with mounting holes, the mounting holes communicate with the mounting grooves, and the mounting holes are used to pass through the conductive elements and The wire for the electrical connection of the connecting element.

A method for preparing a heating component includes steps:

The heating layer is formed on a conductive element and a lower supporting layer, and the conductive elements are disposed at both ends of the lower supporting layer. The heating layer is made of a conductive heating material, and the conductive heating material has a liquid state and a solid state or Available in semi-solid and solid forms; where,

When the conductive heating material is in a liquid or semi-solid state, the conductive heating material is attached to the conductive element and the lower supporting layer, and then the conductive heating material is cured to make the conductive heating material The heat-generating layer formed after curing is fixedly connected to the conductive element and the lower carrier layer, respectively.

Preferably, before forming the heating layer on the conductive element and the lower supporting layer in the step, the method further includes the step:

Providing at least one lower supporting layer on a base layer, and providing the conductive elements at two ends of the lower supporting layer, respectively;

The base layer, the lower supporting layer, and the conductive element are laminated and molded.

Preferably, the step of forming the heating layer on the conductive element includes: attaching the conductive heating material in a liquid or semi-solid form to the conductive element and the lower supporting layer by printing or coating. .

Preferably, after forming the heating layer on the conductive element and the lower supporting layer in the step, the method further includes the step:

Providing at least one upper carrying layer on the conductive heating material;

The base layer, the lower supporting layer, the conductive element, the conductive heating material, and the upper supporting layer are laminated and formed.

Preferably, after the step of laminating the base layer, the lower supporting layer, the conductive element, the conductive heating material, and the upper supporting layer, the method further includes the following steps:

A surface layer is provided on the upper bearing layer.

Beneficial effects:

The present application solves the existing heat generation by attaching a conductive heating material in a liquid or semi-solid form to the conductive element and the lower supporting layer, so that the conductive heating material is fixedly connected to the conductive element and the lower supporting layer respectively after curing. The problem of unreliable connection between the conductive element of the module and the heating layer; at the same time, the contact resistance between the conductive heating material and the conductive element can be reduced, thereby reducing the risk of fire.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1. Sectional structural diagram of a new type of heating building material product. In this figure, 1 is the base material; 2 is the thermal insulation layer; 3 is the reflective layer; 4 is the heat radiation layer; 5 is the porcelain glaze decorative layer;

Figure 2. Transmittance of different enamel finishes in the visible-infrared band;

FIG. 3 is a schematic structural diagram of an integrated heat transfer plate obtained in Embodiment 3 of the present invention; FIG.

4 is a schematic structural diagram of an integrated heat transfer plate obtained in Embodiment 4 of the present invention;

5 is a schematic structural diagram of a heat transfer integrated plate obtained in Embodiment 5 of the present invention;

The drawings in Figs. 3-5 are identified by 1, the substrate; 2, the first waterproof layer; 3, the insulating layer; 4, the electrothermal conversion layer; 5, the insulating layer; 6, the heat insulating layer; 7, the sealing layer; 8 Reflective layer; 9, wear-resistant and water-blocking layer; 10, wire;

6 is a schematic structural diagram of a self-heating integrated board of the present invention (including an infrared reflective film layer);

FIG. 7 is a schematic structural diagram of a self-heating integrated board of the present invention (without an infrared reflective film layer);

The figures in Figures 6-7 are: 1. Insulation substrate, 2. Infrared emitting film layer, 3. First insulating and waterproof film layer, 4. Heating film layer, 5. Second insulating and waterproof film layer, 6. Surface layer, 7. Conductive metal tape;

8 is a schematic structural diagram of a directional heat transfer integrated plate obtained in Embodiment 17 of the present invention;

9 is a schematic structural diagram of a directional heat transfer integrated plate obtained in Embodiment 18 of the present invention;

10 is a schematic structural diagram of a directional heat transfer integrated plate obtained in Embodiment 19 of the present invention;

Figures 8-10 are marked as follows: 1. substrate; 2. waterproof layer; 3. insulating layer; 4. electrothermal conversion layer (composed of three carbon microcrystalline layers with different resistance values); 5. Insulation reflective layer; 6, heat insulation layer; 7, sealing layer; 8, second waterproof layer; 9, wear-resistant layer; 10, wire;

11 is a cross-sectional view of an electrothermal integrated plate in Embodiment 21;

FIG. 12 is a flowchart of a method for preparing an electrothermal integrated board in Embodiment 21; FIG.

The drawings in Figure 11-12 are marked as follows: 1. Thermal insulation substrate; 2-1. Infrared reflective film layer; 2-2. Lower insulating and waterproof layer; 2-3. Heating film layer; 2-4. Upper insulating and waterproof Layer; 3. surface layer; 4. conductive metal strip;

FIG. 13 is a schematic structural diagram of an embodiment of a heating building material according to Example 22;

The figures in Figure 13 are identified as:

1. Thermal insulation layer; 2. Heating layer; 3. Air purification surface layer;

14 is a schematic structural diagram of a heating integrated board according to the present invention;

15 is a schematic diagram of a distribution of a metal current carrying bar according to the present invention;

16 is a schematic diagram of a connection end of a metal current carrying bar and a wire of the present invention;

The figures in Figures 14-16 are identified as

1. Base material; 2. Heating layer; 3. Metal current-carrying strip; 4. Wear-resisting and water-blocking layer; 5. Connection insert;

FIG. 17 is a schematic structural diagram of a heating component provided by the present application; FIG.

FIG. 18 is a schematic flowchart of a method for preparing a heating element provided by the present application.

Reference signs:

1-surface layer; 2-upper load-bearing layer; 3-heating layer; 4-lower load-bearing layer; 5-base layer; 51-mounting slot; 52-mounting hole; 61-conducting element; 62-connecting element; 63-wire.

detailed description

The present invention will be further explained and illustrated in the following with reference to the accompanying drawings, which are only used to explain the present invention and not limiting.

Please refer to FIG. 1, which shows a new type of heating building material product.

The heating building material includes a base material 1, a heat insulation layer 2, a reflection layer 3, a heat radiation layer 4, and an enamel finish layer 5 (enamel film).

The material of the heat-insulating layer may be selected from porous materials, foam materials, and fiber materials, including asbestos, glass fiber, and aerogel felt.

The reflective layer material can be selected from gold, silver, nickel, aluminum foil, and metal-plated polyester and polyimide films.

The heating radiation layer includes a heating material and a conductive material, and may further include an insulating material. Wherein, the heating radiation layer heating material is graphite, graphene, nano-carbon, special ink, polymer conductive film, the heating radiation layer conductive material is copper wire, copper foil or nano silver paste, and the heating radiation layer is insulated The material is PET polyester film, PCT, PE.

The thickness of the enamel decorative layer is 1 μm to 5 mm. If the decorative layer is thin, the heating element layer has high heating efficiency, but it is difficult to form rich patterns with different colors. If the decorative layer is thick, the color is more abundant. However, there are higher requirements for the uniformity and thermal conductivity of the film.

The facing layer can be an enamel film, which can be used to design glossy glazes, semi-gloss glazes, matte glazes and shattered glazes for heating building material products, and different colors can be designed for the enamel film as required. According to the common practice in the field, the protective layer should be as transparent as possible so that sunlight can pass through the maximum. In the present invention, the enamel layer is introduced, and the enamel layer can be selectively colored, so that the heating building materials can be integrated into the surrounding environment. Provide more possibilities in interior decoration and architectural design.

The enamel film selected in the present invention is preferably an inorganic silicate material or an inorganic organic composite material, and its composition includes O, Na, Ga, Mg, S, Si, Al, Ca, Co, K, Zr, Ba, P, and A plurality of elements such as B can be formed by reacting a raw material (such as an oxide or a corresponding salt such as sodium silicate, magnesium hydroxide, potassium carbonate) containing these elements at a low temperature to form a glaze.

Taking the preparation of the glaze 0.05MgSO ₄ · 0.05CaO · 0.15ZrO · 0.70Na ₂ SiO ₃ · 0.05Al ₂ (SO ₄ ) ₃ as an example, accurately weigh the various raw materials according to the above-mentioned glaze raw material composition ratio, add 30 -35wt% by weight of water, ball milling, ball milling time 36-40 hours, ball milling to a glaze fineness of 250 mesh sieve less than 0.015%, to obtain qualified glaze abrasive.

The raw materials can also be selected from sodium titanate, quartz sand, feldspar powder, sodium carbonate, 3.7-4.0 parts of sodium nitrate, cryolite, zirconium dioxide, aluminum phosphate, cobalt nitrate, nickel nitrate, zinc oxide, barium carbonate, etc. The raw material serves as a source of different oxides.

The abrasive is sintered at a high temperature (for example, 800-850 degrees Celsius), and is quenched and pulverized to obtain an enamel glaze. The glaze can be ball-milled to obtain finer particles, which makes it suitable for inkjet printing or Spray directly.

Other glaze components that can be used can also be 0.06MgSO ₄ · 0.10CaO · 0.12ZrO · 0.64Na ₂ SiO ₃ · 0.05Al ₂ (SO ₄ ) ₃ · 0.03Co ₂ O ₃ , or 0.06BaSO ₄ · 0.11CaO · 0.13TiO ₂ · 0.65Na ₂ SiO ₃ · 0.04Al ₂ (SO ₄ ) ₃ · 0.01Co ₂ O ₃ , 0.10BaSO ₄ · 0.10TiO ₂ · 0.75K ₂ SiO ₃ · 0.04Al ₂ (SO ₄ ) ₃ · 0.01 Co ₂ O, or 0.06MgSO ₄ · 0.10TiO ₂ · 0.12ZrO · 0.605K ₂ SiO ₃ · 0.085Al ₂ (SO ₄ ) ₃ · 0.03CoCl ₂ , or 0.08BaO · 0.10Ga ₂ O ₃ · 0.12ZrO · 0.565K ₂ SiO ₃ · 0.085Al ₂ (SO ₄ ) ₃ · 0.03CoCl ₂ · 0.02B ₂ O ₃ and the like.

In the following embodiments, the so-called water-based glaze may be any of the above materials.

Various dopants can be added to the above-mentioned film, so that it has transmittance in a specific wavelength range. For example, the ultraviolet light absorber is a benzotriazole ultraviolet absorber, which is selected from 2- (2ˊ-hydroxy-5ˊ -Methyl) -benzotriazole, 2- (2ˊ-hydroxy-3ˊ-tert-butyl-5ˊ-methyl) -5-chloro-benzotriazole, 2- (2ˊ-hydroxy-3ˊ5ˊ-di-tert-butyl ) -5-chloro-benzotriazole, 2 '-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2fluorene- One or more of hydroxy-5ˊ-tert-octyl) -benzotriazole can achieve ultraviolet light absorption; adding indium tin oxide, tin antimony oxide, tungsten trioxide, molybdenum trioxide, tungsten bronze or having oxygen deficiency One or more of the copper sulfides realize the regulation of near-infrared light; the fullerene derivative PC61BM or PC71BM (see CN106025080A) or other colored materials are used to achieve the regulation of visible light absorption.

Example 1.

The glaze preparation includes 100 parts of glass powder, 60 parts of water and 60 parts of chemical raw materials. Chemical raw materials are calculated by mass fraction, including: Al (OH) ₃ 10 parts, NaOH 10 parts, K ₂ CO ₃ 9 parts, MgSO ₄ 3 parts, Ba (OH) ₂ 2 parts, CaCO ₃ 12 parts, K ₂ SO ₄ 1 part, TiO ₂ 0.5 part, polyacrylamide 0.4 part and water glass 0.4 part. The mixed powder was ball milled for 10 h.

As shown in the figure, the heating building material uses marble as the base material, and asbestos is attached to it as a heat insulation layer, and a gold-plated polyimide film is used as a reflective layer. The two are tightly connected by an adhesive. The reflective layer is covered with a heat radiation layer, wherein the heat radiation layer includes an insulating layer, a heat generation layer, and a conductive layer. The upper and lower insulation film layers are integrated by fusion technology. A graphite heating layer is sandwiched in the insulation layer, and a copper wire conductive layer is connected to the external circuit at the top. The different layers are firmly bonded together by adhesive. The insulating film is made of PET polyester film, which has good insulation properties. The conductive layer is made of copper wires, and the conductivity of copper is good.

A porcelain enamel finish layer was deposited on the upper layer of the heat radiation layer by a 3D printing device, and the heat radiation layer was set at a temperature of 40 ° C. The 3D printing equipment includes: a cylinder, a propeller, a nozzle, a nozzle diameter of 0.5mm, controlling the 3D printing equipment, extruding the glaze from the nozzle, and accumulating a thickness of 5 μm according to the software output path. The required pattern of glaze is printed. The prepared pattern was beige. The transmittance of the prepared enamel finish layer is shown in FIG. 2.

Example 2.

The glaze preparation includes 80 parts of glass powder, 50 parts of water and 70 parts of chemical raw materials. Chemical raw materials are calculated by mass fraction, including: 15 parts of Al (OH) ₃ , 12 parts of NaOH, 14 parts of K ₂ CO ₃ , 5 parts of MgSO ₄ , ₄ parts of Ba (OH) ₂ , 18 parts of CaCO ₃ , and K ₂ SO ₄ 3 parts, 1 part of TiO ₂ , 0.5 part of polyacrylamide, and 0.4 part of water glass. The mixed powder was ball milled for 6h.

As shown in the figure, the heating building material uses a cement board as a base material, and glass fiber is attached thereon as a heat insulation layer, and a silver foil is plated on the upper surface of the heat insulation layer as a reflection layer. The reflective layer is covered with a heat radiation layer, wherein the heat radiation layer includes an insulating layer, a heat generation layer, and a conductive layer. The upper and lower insulating film layers are fused by fusion technology. The insulating layer is sandwiched with a graphene heating layer, and the top is connected to the external circuit through a nano silver paste printed conductive layer. The insulating film and the heating layer are firmly combined by an adhesive. The insulating film is made of PET polyester film, which has good insulation, and the conductive layer is made of nano silver paste, which has good conductivity.

The ceramic glaze layer was ultrasonically atomized on the heat radiation layer, and the heat radiation layer was set at 80 ° C. An input atomizer was used, the ultrasonic frequency was 1.7 MHz, the atomization amount was 4 mL / min, argon gas was used as the carrier gas, the distance between the spray port and the substrate was 4 mm, and a ceramic glaze layer was prepared with a thickness of 10 μm. The prepared pattern was purple. The transmittance of the prepared ceramic glaze layer is shown in FIG. 2.

Example 3.

The glaze preparation includes 120 parts of glass powder, 50 parts of water and 50 parts of chemical raw materials. Chemical raw materials are calculated by mass fraction, including: Al (OH) ₃ 18 parts, NaOH 14 parts, K ₂ CO ₃ 18 parts, MgSO ₄ 8 parts, Ba (OH) ₂ 6 parts, CaCO ₃ 15 parts, K ₂ SO ₄ 5 parts, ₂ parts of TiO _2, 1 part of polyacrylamide and 0.8 part of water glass. The mixed powder was ball milled for 8h.

As shown in the figure, the heating building material uses marble as a base material, and aerogel felt is attached to it as a heat insulation layer, and an aluminum foil is plated on the upper surface of the heat insulation layer as a reflection layer. The reflective layer is covered with a heat radiation layer, wherein the heat radiation layer includes a heat generation layer and a conductive layer. The polymer conductive film is used as a heating layer, and the top is connected to the external circuit through a copper wire. The insulating film is made of PET polyester film, which has good insulation, and the conductive layer is made of copper wire, which has good conductivity.

The ceramic glaze layer is ultrasonically atomized on the heat radiation layer, and the heat radiation layer is set at 60 ° C. An input atomizer was used, the ultrasonic frequency was 2.0 MHz, the atomization amount was 10 mL / min, air was used as the carrier gas, the distance between the spray port and the substrate was 5 mm, and a ceramic glaze layer was prepared with a thickness of 50 μm. The prepared pattern was blue. The transmittance of the prepared ceramic glaze layer is shown in FIG. 2.

Examples 4-6 further describe a method for preparing a heat transfer integrated plate to eliminate the phenomenon of electric spark.

Example 4

A method for preparing a heat transfer integrated plate includes:

1) Take a piece of 12mm thick wooden board and polish and polish the back surface (non-decorative surface) so that the surface roughness is 0.8 microns;

2) Take a polymer cement-based waterproof coating and uniformly prepare a first waterproof layer on the polished surface of the wooden board by scraping, and its thickness after curing is 1 micron;

3) Cover the first waterproof layer with a self-adhesive PET film after curing to form an insulating layer with a thickness of 25 microns;

4) Apply low-resistance nano-carbon microcrystals (resistance value: 10-300Ω / □) on the insulation layer by screen printing method, its thickness is 180 microns, and dry-removing the solvent at 120 ° C to obtain low-resistance Carbon microcrystalline layer

5) implanted conductive copper tape;

6) Preparation of nano-carbon nanocrystalline material with medium resistance (resistance value is 300-1000Ω / □, thickness is 100 microns), and then dried to remove the solvent;

7) Prepare high-resistance nano-carbon microcrystalline materials (resistance greater than 1000Ω / □, thickness is 50 microns), then dry to remove the solvent, and fire at 180 degrees Celsius to form a carbon microcrystalline layer. The contact resistance between the copper strips is 462Ω;

8) Cover the PET layer, and then deposit an aluminum film on the PET by magnetron sputtering with a thickness of 0.8 microns;

9) Form a seal waterproof layer (the material is PI, the thickness is 1 micron) and a wear-resistant layer (the material is alumina, the thickness is 0.1mm). Finally, a directional heat conduction integrated sheet with a radiant heat transfer ratio of 72% was prepared. In the entire heat transfer process, radiant heat transfer is dominant, accounting for 72%, supplemented by conduction and convective heating, and a current introduction point is provided on the heating material body, and the carbon microcrystalline layer is electrically connected through conductive charging.

Please refer to FIG. 3, which shows a heating board prepared according to the method of Embodiment 1, which includes a substrate 1, a waterproof layer 2, an insulating layer 3, a carbon microcrystalline layer 4, an insulating reflective layer 5, and a heat insulating layer. 6. The sealing layer 7, the second waterproof layer 8, the wear-resistant layer 9, and the lead-out wire 10.

The electrical performance test of the integrated heat transfer board was conducted in accordance with the normal use environment and testing, and no electric spark was found.

Example 5

A method for preparing a heat transfer integrated plate includes:

1) Take a 10mm thick rock plate as the substrate, and polish and polish the surface so that its surface roughness is not greater than 0.8 microns;

2) Take a PET self-adhesive film to prepare a first waterproof layer on the polished surface of the substrate, the thickness of which is 75 microns;

3) A metal dielectric reflective film is prepared on the first PET waterproof layer to form a heat-reflective reflective layer having a thickness of 30 microns;

4) An insulating layer is prepared on the heat-reflecting layer, and its thickness is 10 microns;

5) Apply low-resistance nano-carbon microcrystals (resistance value: 10-300Ω / □) on the insulation layer by screen printing method. The thickness is 200 microns. After drying the solvent at 120 ° C, low resistance is obtained. Carbon microcrystalline layer

6) Implanted conductive aluminum tape;

7) Preparation of nano-carbon nanocrystalline material with medium resistance (resistance value is 300-1000Ω / □, thickness is 150 microns), and then dried to remove the solvent;

8) Preparation of high-resistance nano-carbon microcrystalline materials (resistance greater than 1000Ω / □, thickness of 200 microns), then drying to remove the solvent, and baking at 180 degrees Celsius to form a carbon microcrystalline layer. The contact resistance between the aluminum strips is 589Ω;

9) Form a sealing waterproof layer (the material is PET, the thickness is 10 microns) and the surface layer (the material is silicon oxide, the thickness is 0.1mm). Finally, a directional heat conduction integrated sheet with a radiant heat transfer ratio of 92% was prepared. In the entire heating process, radiant heating is dominant, accounting for 92%, supplemented by conduction and convection heating, and a current introduction point is provided on the heating material body, and the carbon microcrystalline layer is electrically connected through conductive charging.

Please refer to FIG. 5, which shows a heating board prepared according to the method of Example 4, which includes a substrate 1, a waterproof layer 2, a heat-reflective layer 3, an insulating layer 4, a carbon microcrystalline layer 5, and a waterproof seal. Layer 6, surface layer 7, and lead wires 8.

Example 6

A method for preparing a heat transfer integrated plate includes:

1) Take a 11mm thick rock wall board as the substrate, and polish and polish the surface so that the surface roughness is not greater than 0.8 microns;

2) Take a PET self-adhesive film to prepare a first waterproof layer on the polished surface of the substrate, the thickness of which is 125 microns;

3) A metal dielectric reflective film is prepared on the first PET waterproof layer to form a heat-reflective layer having a thickness of 3 microns;

5) The low-resistance nano-carbon microcrystals (resistance value: 10-300Ω / □), medium-resistance nano-carbon microcrystal materials (resistance value: 300-1000Ω / □, thickness: 200 microns) and high Nano carbon microcrystalline material with resistance (resistance greater than 1000Ω / □, thickness of 200 microns), increasing in order along the electrode toward the center line, and baked at 180 degrees Celsius to form a carbon microcrystalline layer. The cured carbon microcrystalline The layer is bonded to a self-adhesive tinned copper, and the contact resistance at the electrical connection is 889Ω;

6) forming a sealing waterproof layer (the material is PET, the thickness is 10 microns) and the surface layer (the material is silicon oxide, the thickness is 0.1mm). Finally, a directional heat conduction integrated sheet with a radiant heat transfer ratio of 82% was prepared. In the whole heating process, radiant heating is the main type, accounting for 82%, supplemented by conduction and convection heating.

Please refer to FIG. 6, which shows a heating board prepared according to the method of Embodiment 3, which includes a substrate 1, a waterproof layer 2, a heat-reflecting layer 3, an insulating layer 4, a graded carbon microcrystalline layer 5, The waterproof layer 6, the surface layer 7, and the lead wires 8 are sealed.

Examples 7-16 are steps for preparing a self-heating integrated board. The method for preparing a typical self-heating integrated board of the present invention includes the following steps:

1) Provide a substrate and polish one surface of the substrate;

For the self-heating integrated board performance, the electrothermal radiation conversion efficiency is tested according to the thermal image measurement method defined in GB / T7287-2008. The conversion efficiency calculation formula is:

S is the area of the radiating surface; σ is the Stepan-Boltzmann constant; T _r is the average radiation temperature; T ₀ is the ambient temperature; P is the electric power.

Example 7

(1) Take a 30cm × 30cm fiber-reinforced silica-calcium sheet as a thermal insulation substrate, the substrate thickness is 10mm, and one side of the substrate is polished, cleaned and dried. The polishing here is a conventional operation, and the corresponding surface has a micron-level roughness according to the conventional practice; the polished surface of the substrate is treated with a waterproof emulsion for waterproofing.

(2) preparing a 2 μm-thick aluminum film as an infrared reflecting film layer on the surface of the substrate after cleaning by evaporation;

(3) The first insulating and waterproof film layer is prepared by rolling on the surface of the infrared reflective film layer with an epoxy insulating paint, the thickness is 500 μm, and it is left to cure at room temperature for 24 hours.

(4) preparing a graphene heating film layer by screen printing on the surface of the first insulating and waterproof film layer with a thickness of 10 μm, and then drying at 120 ° C for 30 minutes;

(5) Paste the conductive copper tape on the surface of the heating film layer that is close to the edge 8mm on both sides of the surface after drying, and the copper bandwidth is 10mm, and weld the conductive copper tape and the built-in electrode together;

(6) The surface of the heat-generating film layer is prepared by roll-coating an epoxy insulating paint with a thickness of 500 μm, and it is cured by being left at room temperature for 24 hours.

(7) The surface layer is prepared by cement curing on the surface of the second insulating and waterproof film layer, the thickness of the surface layer is 2mm, and the surface layer is cured at 50 ° C for 2h, and the self-heating integrated board is completed;

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Example 1, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 10 mm, the thickness of the infrared reflective film layer 2 is 2 μm, the thickness of the first insulating waterproof film layer 3 is 500 μm, the thickness of the heating film layer 4 is 10 μm, the thickness of the second insulating waterproof film layer 5 is 500 μm, and the surface layer 6 The thickness is 2mm.

The test results show that the ratio of 82% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Example 8

(1) Take a 30cm × 30cm mica plate as a heat-insulating substrate, the substrate thickness is 0.5mm, and polish one bottom surface, clean it and dry it. The polished surface of the substrate is waterproofed with a waterproof emulsion.

(2) A 50 nm thick aluminum film is prepared on the surface of the substrate after cleaning by using a magnetron sputtering method as an infrared reflective film layer;

(3) A layer of ZS-1091 high-temperature-resistant ceramic insulation coating is prepared on the surface of the infrared reflective film layer as a first insulating and waterproof film layer by spraying, and has a thickness of 1 μm.

(4) preparing a graphene heating film layer by screen printing on the surface of the first insulating and waterproof film layer, with a thickness of 1 μm, and drying at 120 ° C;

(5) Paste the conductive copper tape on the surface of the heating film layer that is close to the edge 8mm on both sides, the copper bandwidth is 10mm, and weld the conductive copper tape and the wire introduced from the back of the mica board;

(6) On the surface of the heat-generating film layer, prepare a second insulating and waterproof film layer in the same step (3);

(7) A UV printing surface layer is used on the surface of the second insulating and waterproof film layer, and the thickness of the surface layer is 5 μm, and the self-heating integrated board is prepared. The self-heating integrated board prepared in this embodiment is very thin and suitable for installation in indoor ceilings.

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Embodiment 8, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 0.5 mm, the thickness of the infrared reflective film layer 2 is 50 nm, the thickness of the first insulating waterproof film layer 3 is 1 μm, the thickness of the heating film layer 4 is 1 μm, the thickness of the second insulating waterproof film layer 5 is 1 μm, and the surface layer 6 The thickness is 5 μm.

The test results show that 95% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Example 9

(1) Take a 30cm × 30cm foamed ceramic plate as the thermal insulation substrate, the thickness of the substrate is 30mm, and one side of the substrate is polished, cleaned and dried, and the polished surface of the substrate is waterproofed with a waterproof emulsion.

(2) Paste a 0.1mm thick aluminum foil on the polished surface of the substrate after cleaning as the infrared reflective film layer;

(3) A layer of PET is prepared on the surface of the infrared reflective film layer by hot pressing, and the thickness of the PET is 0.5 mm.

(4) 800 μm thick heating film layer is prepared by hand coating on the surface of the first insulating and waterproof film layer, and the heating layer uses a mixture of graphite and carbon black as a heating material, and is dried at 120 ° C. for 2 hours;

(5) Paste the conductive aluminum tape on the surface of the heating film layer that is close to the edge 8mm on both sides of the surface after drying, and the aluminum bandwidth is 10mm, and electrically connect the conductive aluminum tape and the built-in electrode provided on the side of the substrate;

(7) A 5 mm thick marble board is laminated and packaged on the surface of the second insulating and waterproof film layer as a surface layer, and the self-heating integrated board is prepared. The self-heating integrated board prepared in this embodiment is thick and sturdy, and is suitable for installation on indoor floors.

The test results show that the proportion of 76% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Embodiment 9, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 30 mm, the thickness of the infrared reflective film layer 2 is 0.1 mm, the thickness of the first insulating and waterproof film layer 3 is 0.5 mm, the thickness of the heating film layer 4 is 800 μm, and the thickness of the second insulating and waterproof film layer 5 is 0.5 mm. The thickness of the surface layer 6 is 5 mm.

Example 10

(1) Take a 30cm × 30cm foamed glass plate as the thermal insulation substrate, the thickness of the substrate is 20mm, and polish the bottom surface, clean it and dry it. The polished surface of the substrate is waterproofed with a waterproof emulsion.

(2) Paste a 0.1 mm thick self-adhesive aluminum foil on the polished surface of the substrate after cleaning as the infrared reflective film layer;

(3) A layer of PC is prepared on the surface of the infrared reflective film layer as a first insulating and waterproof film layer by hot pressing, and the thickness of the PC film layer is 1 mm.

(4) A 500 μm thick heating film layer is prepared on the surface of the first insulating and waterproof film layer by coating, and the heating layer uses a mixture of graphite and carbon black as a heating material;

(7) A ceramic plate with a thickness of 3 mm is laminated and packaged on the surface of the second insulating and waterproof film layer as a surface layer, thereby completing the preparation of the self-heating integrated board.

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Example 10, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 20 mm, the thickness of the infrared reflective film layer 2 is 0.1 mm, the thickness of the first insulating and waterproof film layer 3 is 1 mm, the thickness of the heating film layer 4 is 500 μm, the thickness of the second insulating and waterproof film layer 5 is 1 mm, and the surface layer 6 The thickness is 3mm.

The test results show that 81% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Example 11

(1) Take a rock plate with a size of 30cm × 30cm as the thermal insulation substrate, the thickness of the substrate is 12mm, and polish and dry the bottom surface. The polished surface of the substrate is waterproofed with a waterproof emulsion.

(2) using a chemical plating method to prepare a silver film with a thickness of 1 μm as an infrared reflecting film layer on the polished surface of the substrate after cleaning;

(3) Prepare a layer of epoxy insulating paint as the first insulating waterproof film layer by manual brushing method on the surface of the infrared reflective film layer, and the thickness of the epoxy insulating paint is 100 μm.

(4) preparing nano carbon crystals as a heating film layer by screen printing on the surface of the first insulating and waterproof film layer with a thickness of 100 μm;

(7) Roll 1 mm thick epoxy coating on the surface of the second insulating and waterproof film layer, and dry it at 80 ° C. for 5 hours to cure, then the self-heating integrated board is prepared.

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Example 11, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 12 mm, the thickness of the infrared reflective film layer 2 is 1 μm, the thickness of the first insulating waterproof film layer 3 is 100 μm, the thickness of the heating film layer 4 is 100 μm, the thickness of the second insulating waterproof film layer 5 is 100 μm, and the surface layer 6 The thickness is 1mm.

The test results show that the proportion of 87% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Example 12

(1) A 30cm × 30cm rock plate is used as a thermal insulation substrate, the substrate thickness is 10mm, and one bottom surface is polished, cleaned and dried, and the polished surface of the substrate is waterproofed with a waterproof emulsion.

(2) 100 μm-thick aluminum is prepared as an infrared reflective film layer on the polished surface of the substrate by evaporation after cleaning;

(3) A layer of epoxy insulating paint is prepared on the surface of the infrared reflective film layer by a roll coating method as a first insulating waterproof film layer, and the thickness of the epoxy insulating paint is 300 μm.

(4) using a screen printing method to prepare a heating film layer with a thickness of 50 μm on the surface of the first insulating and waterproof film layer, and the heating film layer uses nano-carbon crystals and tourmaline fine powder as heating materials;

(7) A UV printing surface layer is used on the surface of the second insulating and waterproof film layer, and the thickness of the surface layer is 0.5 mm, and the self-heating integrated board is completed.

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Example 12, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 10 mm, the thickness of the infrared reflective film layer 2 is 100 μm, the thickness of the first insulating waterproof film layer 3 is 300 μm, the thickness of the heating film layer 4 is 50 μm, the thickness of the second insulating waterproof film layer 5 is 300 μm, and the surface layer 6 The thickness is 0.5mm.

The test results showed that the proportion of 89% of the input power was converted into infrared rays with a wavelength of 5-15 microns.

Example 13

(1) Take a 30cm × 30cm wall rock plate as a thermal insulation substrate, the thickness of the substrate is 12mm, and one bottom surface is polished, cleaned and dried.

(2) Manually brush a layer of two-component polyurethane insulation paint on the polished surface of the substrate as the first insulating waterproof film layer, and the thickness of the polyurethane insulation paint is 200 μm.

(3) preparing a 300 μm-thick heating film layer on the surface of the first insulating and waterproof film layer by screen printing, and the heating film layer uses graphite and far-infrared ceramic powder as a heating material;

(4) Paste the conductive aluminum tape on the surface of the heating film layer that is close to the edge 8mm on both sides, and the aluminum bandwidth is 10mm, and electrically connect the conductive aluminum tape to the built-in electrode on the side of the substrate;

(5) preparing the second insulating and waterproof film layer on the surface of the heat-generating film layer in the same manner as in step (3);

(6) Roll 1 mm thick epoxy coating on the surface of the second insulating and waterproof film layer, and dry it at 80 ° C for 5 hours to cure, and the self-heating integrated board is prepared.

Please refer to FIG. 7, which shows a self-heating integrated board prepared according to the method of Embodiment 13 and includes a substrate 1, a first insulating and waterproof film layer 3, a heating film layer 4, and a second insulating and waterproof film layer 5. , The surface layer 6 and the conductive metal strip 7, wherein the heat-preserving substrate 1, the first insulating and waterproof film layer 3, the heating film layer 4, the second insulating and waterproof film layer 5, and the surface layer 6 are sequentially arranged to form an integrated structure. The thickness of the substrate 1 is 12 mm, the thickness of the first insulating and waterproof film layer 3 is 200 μm, the thickness of the heating film layer 4 is 300 μm, the thickness of the second insulating and waterproof film layer 5 is 200 μm, and the thickness of the surface layer 6 is 1 mm.

The test results show that 85% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Example 14

(1) Take a 30cm × 30cm wall rock plate as a thermal insulation substrate, the thickness of the substrate is 5mm, and one side of the substrate is polished, cleaned and dried, and the polished surface of the substrate is waterproofed with a waterproof emulsion.

(2) A 500 μm-thick aluminum film is prepared as an infrared reflecting film layer on the polished surface of the substrate by evaporation after cleaning;

(3) Spray a layer of polyesterimine insulation paint on the surface of the infrared reflective film layer as the first insulating and waterproof film layer, and the thickness of the insulating and waterproof film layer is 50 μm.

(4) preparing a heating film layer with a thickness of 200 μm by screen printing on the surface of the first insulating and waterproof film layer, and the heating film layer uses carbon black and tourmaline fine powder as a heating material;

(5) Paste the conductive aluminum tape on the surface of the heating film layer that is close to the edge 8mm on both sides, and the aluminum bandwidth is 10mm, and electrically connect the conductive copper tape and the wire introduced from the back of the slate board;

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Example 14, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 5 mm, the thickness of the infrared reflective film layer 2 is 300 μm, the thickness of the first insulating waterproof film layer 3 is 50 μm, the thickness of the heating film layer 4 is 200 μm, the thickness of the second insulating waterproof film layer 5 is 50 μm, and the surface layer 6 The thickness is 3mm.

The test results showed that the proportion of 79% of the input power was converted into infrared rays with a wavelength of 5-15 microns.

Example 15

(1) A 30cm × 30cm silicon-calcium plate is used as a thermal insulation substrate with a thickness of 12mm, and one bottom surface is polished, cleaned and dried, and the polished surface of the substrate is waterproofed with a waterproof emulsion.

(2) Paste 80 μm aluminum foil on the polished surface of the substrate as the infrared reflective film layer after cleaning;

(3) A two-component polyurethane insulating layer is manually set on the surface of the infrared reflective film layer as the first insulating waterproof film layer, and the thickness of the polyurethane insulating paint is 100 μm.

(4) a 50 μm heating film is laminated on the surface of the first insulating and waterproof film layer, and the heating film layer uses graphene and tourmaline fine powder as a heating material;

(6) Laminate the second insulating and waterproof film layer on the surface of the heating film layer in the same manner as in step (3);

(7) A 0.5 mm thick epoxy coating layer is laminated on the surface of the second insulating and waterproof film layer, and dried at 80 ° C. for 5 hours to be cured, thereby completing the preparation of the self-heating integrated board.

Please refer to FIG. 6, which shows a self-heating integrated board prepared according to the method of Example 15, which includes a substrate 1, an infrared reflective film layer 2, a first insulating and waterproof film layer 3, a heating film layer 4, and a second Insulating and waterproofing film layer 5, surface layer 6, and conductive metal strip 7, among which heat-preserving substrate 1, infrared emitting film layer 2, first insulating and waterproof film layer 3, heating film layer 4, second insulating and waterproof film layer 5, and surface layer 6 Arranged in sequence to form a monolithic structure. The thickness of the substrate 1 is 12 mm, the thickness of the infrared reflective film layer 2 is 80 μm, the thickness of the first insulating waterproof film layer 3 is 100 μm, the thickness of the heating film layer 4 is 50 μm, the thickness of the second insulating waterproof film layer 5 is 100 μm, and the surface layer 6 The thickness is 0.5mm.

The test results show that the proportion of 91% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Example 16

(1) Take a 30cm × 30cm silicon-calcium plate as a heat-insulating substrate, the substrate thickness is 8mm, and one bottom surface is polished, cleaned and dried.

(2) Manually apply a layer of two-component polyurethane insulation paint as the first insulating and waterproof film layer. The thickness of the polyurethane insulation paint is 100 μm.

(3) a screen printing method is used to prepare a heating film layer with a thickness of 500 μm on the surface of the first insulating and waterproof film layer; the heating film layer uses nano-carbon crystals and far-infrared ceramics as heating materials;

(6) A UV printing surface layer is used on the surface of the second insulating and waterproof film layer, and the thickness of the surface layer is 50 μm, which completes the preparation of the self-heating integrated board.

Please refer to FIG. 7, which shows a self-heating integrated board prepared according to the method of Example 16, which includes a substrate 1, a first insulating and waterproof film layer 3, a heating film layer 4, a second insulating and waterproof film layer 5, The surface layer 6 and the conductive metal strip 7, wherein the thermal insulation substrate 1, the first insulating and waterproof film layer 3, the heating film layer 4, the second insulating and waterproof film layer 5, and the surface layer 6 are sequentially arranged to form an integrated structure. The thickness of the substrate 1 is 8 mm, the thickness of the first insulating waterproof film layer 3 is 100 μm, the thickness of the heating film layer 4 is 500 μm, the thickness of the second insulating waterproof film layer 5 is 100 μm, and the thickness of the surface layer 6 is 50 μm.

The test results show that 90% of the input power is converted into infrared rays with a wavelength of 5-15 microns.

Examples 17-20 illustrate methods for preparing a directional heat transfer integrated plate. A typical method for preparing the directional heat transfer integrated plate includes:

The source of carbon microcrystals used to construct the carbon microcrystal film of the present invention is commercially available; for descriptions of its further properties, refer to CN106084989A, CN107949081A, CN208241914U.

The conductive tape can be selected from copper wire / tape, copper foil, aluminum foil and other materials.

For the corresponding performance test, refer to the JGT 286-2010 standard, but the output power radiation ratio is calculated according to the measured value of the surface layer.

Example 17

A method for preparing a directional heat transfer integrated plate includes:

Take a piece of 12mm thick wooden board, and polish and polish the back surface (non-decorative surface) so that the surface roughness is 0.7 micron. Take the waterproof coating PI to prepare the first waterproof layer uniformly by scraping on the back of the tile. The thickness after curing is 1 micron, covered with a self-adhesive PET film over the first waterproof layer after curing to form a weather-resistant insulating layer with a thickness of 1 micron, and then screen-printed the low-resistance nano-carbon microcrystals (resistance 10 -300Ω / □) coated on the insulation layer with a thickness of 220 microns, and then implanted with a conductive copper strip, dried at 120 degrees Celsius to remove the solvent, and on this basis, the nano-carbon nanocrystalline material with medium resistance was prepared layer by layer. (Resistance value is 300-1000Ω / □, thickness is 150 microns), and then the solvent is removed by drying, and on the basis of this, nano carbon microcrystalline materials with medium resistance (resistance value greater than 1000Ω / □, thickness is 110 microns) ), Then dried to remove the solvent, and baked at 180 degrees Celsius to form a carbon microcrystalline layer, and then covered it with a PET layer, and then deposited an aluminum film on the PET by a magnetron sputtering method to a thickness of 0.8 μm. A sealing waterproof layer (material As the PI, a thickness of 1 micron) and the wear layer (made of aluminum, a thickness of 0.1mm). Finally, a directional heat-conducting integrated sheet with a surface heating ratio of 92% was prepared. In the entire heating process, radiant heating is the main component, accounting for 92%, supplemented by conduction and convection heating, and the heating material body is provided with a current introduction point, and the carbon microcrystalline film is electrically connected through conductive charging.

Please refer to FIG. 8, which shows a heating board prepared according to the method of Example 17, which includes a substrate 1, a waterproof layer 2, an insulating layer 3, an electrothermal conversion layer 4, an insulating reflective layer 5, a heat insulating layer 6, The sealing layer 7, the second waterproof layer 8, the wear-resistant layer 9, and the lead wires 10 drawn out.

Example 18

A method for preparing a directional heat transfer integrated plate includes:

1) Take a 10mm thick rock plate as the substrate, and polish and clean the surface so that the surface roughness is 0.8 microns;

5) Apply low-resistance nano-carbon microcrystals (resistance value: 10-300Ω / □) on the insulation layer by screen printing method, its thickness is 100 microns, and dry-removing the solvent at 120 ° C to obtain low-resistance Carbon microcrystalline layer

6) Implanted conductive aluminum tape;

7) Preparation of nano-carbon nanocrystalline materials with medium resistance (resistance value: 300-1000Ω / □, thickness: 200 microns), and then drying to remove the solvent;

8) Preparation of high-resistance nano-carbon microcrystalline material (resistance value greater than 1000Ω / □, thickness of 200 microns), and then drying to remove the solvent, and baking at 180 degrees Celsius to form a carbon microcrystalline layer;

9) Form a sealing waterproof layer (the material is PET, the thickness is 10 microns) and the surface layer (the material is silicon oxide, the thickness is 0.1mm). Finally, a directional heat conduction integrated sheet with a surface layer radiant heat transfer ratio of 92% was prepared. In the entire heating process, radiant heating is dominant, accounting for 92%, supplemented by conduction and convection heating, and a current introduction point is provided on the heating material body, and the carbon microcrystalline layer is electrically connected through conductive charging.

Please refer to FIG. 9, which shows a heating board prepared according to the method of Embodiment 18, which includes a substrate 1, a first waterproof sealing layer 2, a heat-reflecting layer 3, an insulating layer 4, an electrothermal conversion layer 5, a first Two sealing waterproof layers 6, surface layers 7, and lead wires 8 are drawn out.

Example 19

A method for preparing a directional heat transfer integrated plate includes:

1) Take a 11mm thick rock wall board as the substrate, and polish and clean the surface so that the surface roughness is 0.8 microns;

5) Apply low-resistance nano-carbon microcrystals (resistance value: 10-300Ω / □) on the insulation layer by screen printing method, the thickness is 220 microns, and the solvent is dried at 120 degrees Celsius to get low resistance. Carbon microcrystalline layer

6) Implanted conductive aluminum tape;

7) Prepare nano carbon microcrystalline materials with medium resistance (resistance value is 300-1000Ω / □, thickness is 180 microns), and then dry to remove the solvent;

8) Preparation of high-resistance nano-carbon microcrystalline material (resistance value greater than 1000Ω / □, thickness is 150 microns), and then drying to remove the solvent, and baking at 180 degrees Celsius to form a carbon microcrystalline layer;

9) Form a sealing waterproof layer (the material is PET, the thickness is 10 microns) and the surface layer (the material is infrared ceramics, the thickness is 0.1mm). Finally, a directional heat conduction integrated sheet with a surface layer radiant heat transfer ratio of 90% was prepared. In the entire heating process, radiant heating is the main part, accounting for 90%, supplemented by conduction and convection heating, and the heating material body is provided with a current introduction point, and the carbon microcrystalline layer is electrically connected through conduction.

Please refer to FIG. 10, which illustrates a heating board prepared according to the method of Embodiment 17, which includes a substrate 1, a first waterproof sealing layer 2, a heat-reflecting layer 3, an insulating layer 4, an electrothermal conversion layer 5, a first Two sealing waterproof layers 6, surface layers 7, and lead wires 8 are drawn out.

Example 20

A method for preparing a directional heat transfer integrated plate includes:

1) Take a 10mm thick rock wall board as the substrate, and polish and polish the surface so that the surface roughness is 0.8 microns;

2) The first waterproof coating is scraped on the polished surface of the substrate, and its thickness is 30 microns after curing;

4) An insulating layer is prepared on the heat-reflecting layer, and its thickness is 9 microns;

6) Implanted conductive aluminum tape;

9) Form a sealing waterproof layer (the material is PET, the thickness is 10 microns) and the surface layer (the material is infrared ceramics, the thickness is 0.1mm). Finally, a directional heat conduction integrated sheet with a surface layer radiant heat transfer ratio of 89% was prepared. In the entire heating process, radiant heating is the main method, accounting for 89%, supplemented by conduction and convection heating, and the heating material body is provided with a current introduction point, and the carbon microcrystalline layer is electrically connected through conduction.

Please refer to FIG. 10, which shows a heating board prepared according to the method of Example 20, which includes a substrate 1, a first waterproof sealing layer 2, a heat-reflecting layer 3, an insulating layer 4, an electrothermal conversion layer 5, a first Two sealing waterproof layers 6, surface layers 7, and lead wires 8 are drawn out.

Embodiment 21 Referring to FIG. 11, an integrated electrothermal board includes an insulating substrate 1, a heating film layer 2-3, and a surface layer 3; the thickness of the heating film layer 2-3 is between 50 nm and 10 μm. The square resistance of the heating film is between 10 ~ 1000Ω / □.

In specific implementation, the heating film layer 2-3 is an oxide or an oxysulfide. The material of the heating film layer 2-3 includes ZnO _x S _(1-x) , InO _x S _(1-x) , and Sn _x In. _{One or more of (1-x)} O, Zn _x Mg _(1-x) O, and Zn _x Al _(1-x) O.

In specific implementation, the heat-generating film layer 2-3 is a oxycarbon compound, and the material of the heat-generating film layer 2-3 includes SiO _x C _(1-x) .

In specific implementation, the heating film layer 2-3 is a carbonitride, and the material of the heating film layer 2-3 includes SiC _x N _(1-x) .

In specific implementation, an upper insulating waterproof layer 2-4 and a lower insulating waterproof layer 2-2 are provided on the two lower surfaces of the heating film layer 2-3; The conductive metal strip 4 is used as a power supply circuit, and the metal strip 4 is electrically connected to a built-in electrode.

In specific implementation, the materials of the above lower insulating waterproof layer 2-2 and the upper insulating waterproof layer 2-4 are inorganic waterproof insulating materials or organic waterproof insulating materials;

In specific implementation, the above-mentioned electrothermal integrated board further includes an infrared reflective film layer 2-1. The infrared reflective film layer 2-1 is located between the substrate 1 and the lower insulating and waterproof layer 2-2. The infrared reflective layer 2-1 It is a metal-containing film layer.

In specific implementation, the material and size of the heat-preserving substrate 1 satisfy a compressive strength of not less than 10 MPa and a thermal conductivity of less than 0.5 W / (m · K).

In specific implementation, the material of the above-mentioned thermal insulation substrate 1 includes one or more of calcium silicate board, silicate board, mica board, porous ceramic board, and porous ceramic board.

In specific implementation, the material of the surface layer 3 has a Mohs hardness of not less than 3 and abrasion resistance of not more than 500 mm ³ .

Referring to FIG. 12, a method for preparing an integrated electrothermal board includes the following steps:

Step1: Take the insulation substrate 1, clean it and dry it;

Step2: Optionally, prepare a lower insulating and waterproof layer 2-2 on the polished surface of the heat-preserving substrate 1.

Step3: Prepare the heating film layer 2-3 on the surface of the lower insulation and waterproof layer 2-2 by vacuum coating method, and then anneal at 100 ～ 450 ℃ for 10 ～ 120min;

Step4: Set a metal conductive tape 4 on the surface of the heating film layer 2-3, and electrically connect the metal conductive tape 4 and the built-in electrode;

Step5: Optionally, prepare an insulating and waterproof layer 2-4 on the surface of the heating film layer 2-3;

Step6: A surface layer is provided on the surface of the upper insulation waterproof layer 2-4 to complete the preparation of the low-voltage electric heating plate.

Refer to Table 1. The test was conducted in accordance with GB / T7287-2008. The test result of the electrothermal integrated board with a rated voltage of 220V and a rated power of 100W using carbon material as the heating film layer.

Table 1 Test results of the electrothermal integrated board using carbon material as the heating film layer

老化时间/hAging time / h	24twenty four	3636	4848	6060	7272	8484	9696	108108	120120
额定功率/WRated power / W	100100	100100	100100	100100	100100	100100	100100	100100	100100
实测功率/WMeasured power / W	97.997.9	96.596.5	94.394.3	93.293.2	92.492.4	91.691.6	90.790.7	89.989.9	89.289.2
功率衰减率/％Power attenuation rate /%	2.12.1	3.53.5	5.75.7	6.86.8	7.67.6	8.48.4	9.39.3	10.110.1	10.810.8

Referring to Table 2, the test was conducted in accordance with GB / T7287-2008. The test results of the integrated electric heating board with a rated voltage of 220V and a rated power of 80W and the use of oxides as the heating film layer.

Table 2 Test results of the electrothermal integrated board using oxide as the heating film layer

Comparing the test results in Table 1 and Table 2, the integrated electrothermal board and the preparation method thereof according to the present invention adopt an oxide film having a thickness of less than 10 μm as a heating material, which not only uses a small amount of heating material, but also has a low production cost of the heating film layer. And because the oxide is used as a heating material, the performance of the oxide is stable and the heating efficiency is high, so the service life of the integrated electrothermal board is long, and the heating power attenuation is small during use.

The electrothermal integrated board adopts vacuum plating to prepare the heating film layer, which can accurately control the thickness of the heating film layer. The thickness of the heating film layer is less than 10 μm, which can reduce the amount of heating material and reduce the cost of the heating film layer. In addition, after vacuum coating, the composition of the heating material can be accurately controlled, and the heating material of the heating film layer can be effectively doped. On the one hand, the infrared emission rate of the heating material can be improved by doping, and on the other hand, the heating can be effectively adjusted by doping. The wavelength of the infrared radiation emitted by the material is made to match the wavelength of the infrared radiation emitted by the electrothermal integrated board with the infrared absorption of the human body.

Embodiments 22 to 25 relate to a heat-generating building material. See FIG. 13, which is a structural diagram of the heat-generating building material. The heat-generating building material in the figure is composed of a heat-insulating layer, a heat-generating layer, and an air-purifying surface layer provided in order from bottom to top.

In a preferred embodiment of the present invention, an insulating and waterproof layer may be further provided between each of the heat-preserving layer, the heat-generating layer, and the air-purifying surface layer.

Example 22

Follow these steps to prepare a heating building material.

1) Take a 5cm thick insulation layer from the foamed ceramics of the insulation substrate, make a reserved terminal hole on the side of the insulation layer, and bury the joint.

2) On the surface of the thermal insulation layer, an epoxy waterproof glass fiber cloth is used to prepare an insulating waterproof layer with electrodes, the thickness of the waterproof layer is 200 μm, and the electrodes are connected to the previously buried joints.

3) A carbon paste heating layer is printed on the insulating and waterproof layer in a manner of curing at 150 ° C for 30 minutes, and the thickness of the heating layer is 1000 μm.

4) An epoxy waterproof glass fiber cloth is used on the heating layer to prepare an insulating waterproof layer.

5) An air purification surface layer is prepared on the insulation waterproof layer prepared in step 4). The specific steps are: mixing 1000 g of non-fired ceramic powder and 200 g of tourmaline powder and adding 300 g of water to stir uniformly, and coating the surface of the insulation waterproof layer. After being left for 24 hours, it was cured to form a surface layer with a thickness of 0.1 mm.

Example 23

Follow these steps to prepare a heating building material.

1) Take a thermal insulation substrate foamed polyurethane to make a 0.5cm thick thermal insulation layer, make a reserved terminal hole on the side of the thermal insulation layer, and bury the joint.

2) On the surface of the thermal insulation layer, an unsaturated resin glass fiber cloth is used to prepare an insulating waterproof layer with electrodes. The thickness of the waterproof layer is 500 μm, and the electrodes are connected to the previously buried joints.

3) A carbon paste heat-generating layer is printed on the insulating and waterproof layer in a manner of curing for 40 minutes at 130 ° C., and the thickness of the heat-generating layer is 1000 μm.

4) An unsaturated resin glass fiber cloth is used on the heat-generating layer to prepare an insulating waterproof layer with a thickness of 500 μm.

5) An air purification surface layer is prepared on the insulation and waterproof layer prepared in step 4). The specific steps are: mixing 1000 g of non-fired ceramic powder and 100 g of anion powder and adding 300 g of water to stir uniformly, and coating on the surface of the insulation and waterproof layer. After standing for 24 hours, it was cured to form a surface layer, and the thickness of the surface layer was 1 mm.

Example 24

Follow these steps to prepare a heating building material.

1) Take a thermal insulation substrate foamed cement to make a 10cm thick thermal insulation layer, punch a reserved terminal hole on the side of the thermal insulation layer, and bury the joint.

2) On the surface of the thermal insulation layer, use pet to prepare an insulating waterproof layer, and the thickness of the waterproof layer is 1 μm.

3) A carbon paste heat-generating layer is printed on the insulating and waterproof layer in a manner of curing at 170 ° C. for 20 minutes, and the thickness of the heat-generating layer is 10 μm.

4) Laminate copper foil on both ends of the carbon paste as electrodes, and then connect with the reserved electrode joints.

5) Use pet to prepare an insulating and waterproof layer with a thickness of 1 μm on the heating layer.

6) An air purification surface layer is prepared on the insulating and waterproof layer prepared in step 5). The specific steps are: mixing 1000 g of non-fired ceramic powder and 10 g of nano-TiO ₂ powder and adding 300 g of water to stir uniformly, and coating the insulating and waterproof layer. The surface is cured after being left for 24 hours to form a surface layer, and the thickness of the surface layer is 10 mm.

Example 25

Follow these steps to prepare a heating building material.

1) Take insulation substrate foam glass to make a 6cm-thick insulation layer, make a reserved terminal hole on the side of the insulation layer, and bury the joint.

3) A carbon paste heating layer is printed on the insulating and waterproof layer in a manner of curing at 170 ° C. for 20 minutes, and the thickness of the heating layer is 800 μm.

4) A 200 μm thick insulating and waterproof layer is prepared on the heating layer using pet.

5) An air purification surface layer is prepared on the insulation and waterproof layer prepared in step 4). The specific steps are that 1000 g of non-fired ceramic powder and 250 g of water are stirred and uniformly coated on the surface of the insulation and waterproof layer. After being left for 24 hours, the surface is cured to form a surface. Layer, the thickness of the surface layer is 5mm; subsequently, 200g of six-ring stone powder and 30g of water are evenly mixed, coated on the surface of the surface layer, and left to solidify, that is, the surface of the surface layer is cured again to obtain an air purification layer and the thickness of the air purification layer It was 200 μm.

Comparative example

The heat-generating building material was prepared according to the procedure of Example 22, with the difference that no air purification material was added in step 5).

Determination of mechanical properties

The mechanical strength test was performed on the building materials in Examples 22-25 (corresponding to samples 1-4 in Table 3) and Comparative Example 1 (sample 5) by using the test methods specified in the national standard. See Table 3 for specific test items and results.

Table 3 Test results of mechanical properties

Determination of thermal insulation performance

GB / T10294-2008 was used to determine the thermal insulation performance of the building materials prepared in Examples 22-25 and Comparative Example 1, and the results are shown in Table 4.

Table 4 Thermal insulation performance test results

样品编号Sample serial number	导热系数w/(m·K)Thermal conductivity w / (m · K)
11	0.090.09
22	0.120.12

33	0.080.08
44	0.090.09
55	0.090.09
检测依据testing base	GB/T10294-2008GB / T10294-2008

Determination of air purification performance

JC / T2040-2010 was used to determine the air purification performance of the building materials prepared in Examples 22-25 and Comparative Example 1, and the results are shown in Table 5.

Table 5 Test results of air purification performance

样品编号Sample serial number	负离子诱生量个/(S·cm ²) Negative ion induction amount / (S · cm ² )
11	10051005
22	11201120
33	988988
44	10761076
55	00
检测依据testing base	JC/T2040-2010JC / T2040-2010

It can be seen from the above examples and comparative examples that the heat-generating building materials of the present application comply with national standards in terms of various physical and chemical indicators, and can significantly play a role in purifying air.

Example 26

14-16, a heating integrated board, the heating integrated board includes a substrate 1, a heating layer 2, a metal current carrying bar 3, and a wear-resistant water blocking layer 4 in order from top to bottom;

Substrate 1 is glass;

The abrasion-resistant water-blocking layer 4 is prepared by the following raw materials in parts by weight: 100 parts of modified epoxy resin, 50 parts of water-based polyurethane emulsion, 3 parts of basalt powder, 12 parts of silicon micropowder, 20 parts of garnet powder, and flame retardant 1 Parts, 1 part of imidazole curing agent, 0.5 parts of hydroxypropyl methyl cellulose, 0.05 parts of hydroxypropyl methyl cellulose, and 15 parts of deionized water;

Modified epoxy resin is prepared by the following methods:

S1. Dissolve 120g of epoxy resin 6101 in ethyl acetate, heat to 50 ° C, add 7g of silane coupling agent KH550 and 20g of ethyl orthosilicate, stir at high speed, discharge after constant temperature reaction for 5h, add 3g of methyltris Ethoxysilane, after stirring well, remove the solvent under reduced pressure to obtain an emulsion;

S2. The improved Hummers method is used to prepare graphene oxide, which specifically includes the following steps:

S21. Weigh 10g of natural graphite powder, 4g of potassium persulfate, and 10g of phosphorus pentoxide, add it to a three-necked flask containing 24mL sulfuric acid under stirring, first react in a constant temperature water bath at 60 ° C for 3h, and then three-necked The flask was transferred to a 25 ° C constant temperature water bath for 5 hours, suction filtered, and washed with ion water to neutrality, and dried in air to obtain pre-oxidized graphite;

S22. Weigh lg of pre-oxidized graphite, add it to a three-necked flask containing 25 mL of sulfuric acid under stirring, and put it in an ice-water bath. After the pre-oxidized graphite is completely dissolved, add 3 g of potassium permanganate and react for 2 h. Then, the three-necked flask was transferred to a constant temperature water bath at 35 ° C for 40 minutes. Finally, deionized water was added, and the reaction was continued at 35 ° C for 1 hour. Finally, 30% H ₂ O _{2 was} added dropwise so that no more gas was generated and the solution became Bright yellow. Centrifuge while hot and filter and wash with neutral 5% hydrochloric acid and deionized water. After the final precipitate was subjected to ultrasonic vibration for 1 h, it was poured into a petri dish and dried at 90 ° C for 24 h to obtain flake graphite oxide.

S3. 1g of graphene oxide obtained in step S2, 3g of nano-alumina, and 1g of nano-zinc oxide are milled and mixed uniformly by a ball mill; add to the emulsion obtained in step S1, stir and mix well, add 0.5g of antimony trioxide and 2g Nickel oxide was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.

The heating layer 2 is a conductive far-infrared heating material, and is uniformly printed on the substrate 1 by screen printing;

The heating layer 2 is prepared from nano-carbon crystal powder, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: 1g of turpentine alcohol and 10g of ethyl cellulose are mixed, and the slurry is heated at 70 ° C in a water bath environment for 5 hours to obtain slurry 0.2g of nano-carbon crystal powder is added and mixed uniformly, and 1-20 layers of nano-carbon crystal colloid film are prepared on the weather-resistant insulating layer by screen printing process, and placed horizontally under normal temperature and pressure for 10 hours to prepare a heating layer 2.

A cross-sectional area of the metal current carrying bar 3 is 1 mm ² ; the metal current carrying bar 3 is laid in a length direction.

The metal current-carrying strips 3 are bonded to the heat-generating layer 2 and are located on both sides of the heat-generating layer 2. The metal current-carrying strips 3 on both sides are respectively connected to a power source.

A method for preparing a heat-generating integrated board includes the following steps:

S1. Polishing: polishing the back surface of the substrate 1;

S2. Coating the heating layer 2: coating nano carbon crystals on the back surface of the substrate 1 by a screen printing method;

S3. Pave metal current-carrying strips 3: Pave metal flow-carrying strips 3 of different cross-sectional areas on the heating layer 2 in a length direction or a width direction, and both ends are connected to the connection plug 5;

S4. Coating abrasion-resistant and water-blocking layer 4: Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 1 μm. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.

Example 27

The substrate 1 is a particle board;

The abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 150 parts of modified epoxy resin, 100 parts of water-based polyurethane emulsion, 10 parts of basalt powder, 17 parts of silicon micropowder, 30 parts of garnet powder, and flame retardant 2 Parts, 2 parts of organic acid anhydride curing agent, 1 part of AT-70 thickener, 0.1 parts of 5-chloro-2-methyl-4 isothiazolin-3-one, and 20 parts of deionized water;

Modified epoxy resin is prepared by the following methods:

S1. Dissolve 120g of epoxy resin 6101 in ethanol, heat to 70 ° C, add 10g of silane coupling agent KH792 and 25g of ethyl orthosilicate, stir at high speed, discharge after constant temperature reaction for 5h, add 5g of methyl triethoxylate Silane, after stirring well, remove the solvent under reduced pressure to obtain an emulsion;

S3. Mill 3g of graphene oxide obtained in step S2, 5g of nano-alumina, and 3g of nano-zinc oxide through a ball mill and mix them uniformly; add to the emulsion obtained in step S1, stir and mix well, add 1.5g of antimony trioxide and 5g Nickel oxide was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.

The heating layer 2 is prepared from carbon nanotubes, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: mixing 1 g of turpentine alcohol and 10 g of ethyl cellulose, and heating the mixture in a 70 ° C water bath environment for 5 hours to obtain a slurry. Add 0.1g of carbon nanotubes at room temperature to mix and grind them uniformly. Prepare 1-20 layers of nanometer carbon crystal colloid film on the weather-resistant insulation layer by screen printing process, and place them horizontally for 10 hours at normal temperature and pressure to prepare a heating layer 2.

A cross-sectional area of the metal current carrying bar 3 is 2 mm ² ; the metal current carrying bar 3 is laid in a width direction.

S1. Polishing: polishing the back surface of the substrate 1;

S2. Coating the heating layer 2: coating nano carbon crystals on the back surface of the substrate 1 by a coating method;

S3. Pave metal current-carrying strip 3: Pave metal flow-carrying strips 3 of different cross-sectional areas on the heating layer 2 in a length direction or a width direction, and both ends are welded to the wires 5;

S4. Coating abrasion-resistant and water-blocking layer 4: Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 1 mm. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.

Example 28

Substrate 1 is an inorganic fireproof board;

The abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 110 parts of modified epoxy resin, 60 parts of water-based polyurethane emulsion, 4 parts of basalt powder, 13 parts of fine silicon powder, 22 parts of garnet powder, and 1.2 of flame retardant 1.2 Parts, 1.1 parts of amine curing agent, 0.6 parts of organic bentonite, 0.06 parts of 2-methyl-4isothiazolin-3-one, and 16 parts of deionized water;

Modified epoxy resin is prepared by the following methods:

S1. Dissolve 120g of epoxy resin 6101 in toluene, raise the temperature to 55 ° C, add 8g of silane coupling agent KH-602 and 22g of ethyl orthosilicate, stir at high speed, discharge after constant temperature reaction for 5h, add 4g of methyltrioxane Ethoxysilane, after stirring well, remove the solvent under reduced pressure to obtain an emulsion;

S3. 2g of graphene oxide obtained in step S2, 4g of nano-alumina, and 2g of nano-zinc oxide are milled and mixed uniformly by a ball mill; added to the emulsion obtained in step S1, stirred and mixed uniformly, and added 1g of antimony trioxide and 3g of oxide Nickel was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.

The heating layer 2 is a conductive far-infrared heating material, and is uniformly printed on the substrate 1 by a printing method;

The heating layer 2 is prepared from barium titanate, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: mixing 1 g of turpentine alcohol and 10 g of ethyl cellulose, and heating the mixture in a water bath at 70 ° C. for 5 h to obtain a slurry. 0.5g of barium titanate was added at room temperature to mix and grind uniformly. A screen printing process was used to prepare 1-20 layers of nanometer carbon crystal colloid film on the weather-resistant insulating layer, and it was left to stand horizontally at normal temperature and pressure for 10 hours to prepare a heating layer 2.

The cross-sectional area of the metal current-carrying strip 3 is 1.5 mm ² ; the metal current-carrying strip 3 is paved in the longitudinal direction.

S1. Polishing: polishing the back surface of the substrate 1;

S4. Coating abrasion-resistant and water-blocking layer 4: Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 5 mm. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.

Example 29

The substrate 1 is a wood plastic board;

The abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 140 parts of modified epoxy resin, 90 parts of water-based polyurethane emulsion, 8 parts of basalt powder, 15 parts of silicon fine powder, 28 parts of garnet powder, and 1.8 parts of flame retardant 1.8 Parts, 1.8 parts of imidazole curing agent, 0.4 parts of xanthan gum, 0.5 parts of hydroxyethyl cellulose, 0.08 parts of 2-methyl-4isothiazolin-3-one, and 19 parts of deionized water;

Modified epoxy resin is prepared by the following methods:

S1. Dissolve 120g of epoxy resin 6101 in acetonitrile, raise the temperature to 65 ° C, add 9g of silane coupling agent WD-50 and 24g of ethyl orthosilicate, stir at high speed, discharge after constant temperature reaction for 5h, add 4g of methyltris Ethoxysilane, after stirring well, remove the solvent under reduced pressure to obtain an emulsion;

S3. 4g of graphene oxide obtained in step S2, 4g of nano-alumina, and 2g of nano-zinc oxide are milled and mixed uniformly by a ball mill; added to the emulsion obtained in step S1, stirred and mixed uniformly, and added 1g of antimony trioxide and 4g of oxide Nickel was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.

The heating layer 2 is prepared from graphene, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: 1 g of turpentine alcohol and 10 g of ethyl cellulose are mixed, and stirred and heated in a 70 ° C water bath environment for 5 hours to obtain a slurry, room temperature 0.3g of graphene was added and mixed uniformly, and 1 to 20 nano-carbon crystal colloid films were prepared on the weather-resistant insulating layer by a screen printing process, and the layer was left horizontally at normal temperature and pressure for 10 hours to obtain a heating layer 2.

The cross-sectional area of the metal current-carrying strip 3 is 0.6 mm ² ; the metal current-carrying strip is paved in the width direction.

S1. Polishing: polishing the back surface of the substrate 1;

S4. Coating abrasion-resistant and water-blocking layer 4: Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 0.5 mm. After curing, the heat-generating body is made. Board; the two heat-generating integrated boards are connected through a connection plug 5; the connection plugs 5 of the heat-generating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.

Example 30

Substrate 1 is a fiberboard;

The abrasion-resistant and water-blocking layer 4 is prepared by the following raw materials in parts by weight: 125 parts of modified epoxy resin, 70 parts of water-based polyurethane emulsion, 6 parts of basalt powder, 15 parts of silicon fine powder, 25 parts of garnet powder, and 1.5 of flame retardant Parts, 1.4 parts of amine curing agent, 0.7 parts of polyacrylamide, 0.07 parts of 5-chloro-2-methyl-4 isothiazolin-3-one, and 17 parts of deionized water;

Modified epoxy resin is prepared by the following methods:

S1. Dissolve 120g of epoxy resin 6101 in pyridine, heat up to 60 ° C, add 7g of silane coupling agent SI900 and 20g of ethyl orthosilicate, stir at high speed, discharge after constant temperature reaction for 5h, add 5g of methyl triethoxylate Silane, after stirring well, remove the solvent under reduced pressure to obtain an emulsion;

S3. 2g of graphene oxide obtained in step S2, 5g of nano-alumina, and 2g of nano-zinc oxide are milled and mixed uniformly by a ball mill; added to the emulsion obtained in step S1, stirred and mixed uniformly, and added 1g of antimony trioxide and 3g of oxide Nickel was stirred at high speed for 1 hour, and polyamide was added for rapid stirring for 2 minutes to obtain a modified epoxy resin.

The heating layer 2 is prepared from lanthanum chromate, silicon carbide, turpentine alcohol and ethyl cellulose, and specifically includes the following steps: 1 g of turpentine alcohol and 10 g of ethyl cellulose are mixed, and the mixture is heated under stirring in a water bath at 70 ° C. for 5 h to obtain Add 0.3g of lanthanum chromate and 0.4g of silicon carbide to the slurry at room temperature and mix uniformly. Use screen printing to prepare 1-20 layers of nano-carbon crystal colloid film on the weather-resistant insulation layer, and place it horizontally for 10 hours at normal temperature and pressure. Prepared heat-generating layer 2.

The cross-sectional area of the metal current-carrying strip 3 is 0.3 mm ² ; the metal current-carrying strip 3 is laid in a length direction.

S1. Polishing: polishing the back surface of the substrate 1;

S4. Coating abrasion-resistant and water-blocking layer 4: Coating a layer of abrasion-resistant and water-blocking layer 4 on the heating layer 2 on which the metal current-carrying strip 3 is laid, with a thickness of 30 μm. After curing, the heat-generating integrated board is prepared. ; The two heating integrated boards are connected through a connection plug 5, and the connection plugs 5 of the heating integrated boards at both ends are connected to a power source, and the connection plug 5 has a conductive function.

Example 31

On the basis of Example 30, a heat storage layer was provided between the heat generating layer 2 and the substrate 1.

Example 32

On the basis of Example 30, a heat storage layer is provided between the heat generating layer 2 and the base material 1 and the metal current carrying bar 3 and the wear-resistant water blocking layer 4.

Test example 33

The temperature of the surface of the board at different times was measured using the heat-generating integrated board prepared in Examples 26-32 of the present invention and similar products on the market. The results are shown in Table 6.

Table 6 Surface temperature measurement results

Zh	实施例1Example 1	实施例2Example 2	实施例3Example 3	实施例4Example 4	实施例5Example 5	实施例6Example 6	实施例7Example 7	市售Commercially available
2min2min	4747	4949	5151	5151	4848	4545	4646	22twenty two
5min5min	4949	5050	5050	5252	5050	5151	5252	3535
10min10min	5050	5252	5252	5454	5252	5353	5454	4242
30min30min	5252	5151	5353	5555	5151	5454	5656	4949
60min60min	5353	5353	5454	5454	5454	5555	5555	5353
2h2h	5454	5555	5555	5252	5656	5555	5555	5757
6h6h	5656	5656	5454	5353	5555	5555	5555	4545
12h12h	5555	5454	5656	5757	5454	5555	5555	3939
24h24h	5757	5858	5656	5656	5757	5555	5555	3737

As can be seen from the above table, the heat-generating integrated board prepared in the embodiment of the present invention has good thermal conductivity, fast thermal conductivity, rapid heating, and rapid temperature rise within 2 minutes, which is significantly better than similar products on the market; Continuous working for 24 hours (or even longer) has little change in temperature stability, while similar products on the market have a noticeable temperature drop and thermal insulation is unstable. In the embodiment in which the heat storage layer is added, the thermal insulation performance is more stable.

Test example 2

Performance tests were performed on the heat-generating integrated boards prepared in Examples 26-32 of the present invention and similar products on the market. The results are shown in Table 7.

Table 7 Performance test results

As can be seen from the above table, the heat-generating integrated board prepared in Examples 26-32 of the present invention has good thermal conductivity, fast thermal conductivity, good chemical resistance, wear resistance, superior mechanical properties, and long service life. Good application prospects.

Compared with the prior art, the present invention adopts a thin film integration technology to coat a building decoration material with a normal temperature curing function on an electrothermal conversion layer, so that ordinary building decoration materials (floor, tile, wallpaper, etc.) can be converted to external radiation Integrated material of infrared and heat source, without changing the appearance and texture of the original building materials, thus changing the existing heating method;

In the present invention, commercially available ordinary building materials are selected, and the back surface (non-decorative surface) is polished and polished to sequentially prepare the electrothermal conversion and the surface layer. Finally, a radiant heating integrated sheet is prepared. The edge of the heating material is provided with a current introduction point, and the thermal energy converted from electrical energy is mainly radiant heating, supplemented by conduction and convection heating to heat the room, thereby achieving long-term uniform heating and safe technical effects;

The multi-mesh structure on the screen printing plate of the present invention allows the conductive heating material and paste to pass through the porous structure of the screen under the action of a squeegee, so as to obtain one or more uniform heating layers on the substrate layer, thereby A heat-generating layer with good thermal conductivity and uniform heat conduction is obtained. The invention uses a carbon-based material or a non-carbon material to prepare a heat-generating layer. The heat-generating layer is in direct contact with a metal current carrying bar and has good electrical conductivity. The heat is radiated into the room in the form of infrared rays, so as to have a good effect of heating and keeping warm, and its heat storage layer can further play a role in keeping warm;

The following example relates to a heat generating component and a method for manufacturing the same.

As shown in FIG. 17, which is a schematic structural diagram of a heating component provided in the present application, it can be understood that each film layer in FIG. 16 is only used to show its position connection relationship, and the thickness of each film layer cannot be as shown in FIG. 16. Proportions are obtained.

The heating component includes a surface layer 1, an upper bearing layer 2, a heating layer 3, a lower bearing layer 4 and a base layer 5 which are arranged in a vertical direction (Z) and stacked in order from top to bottom, wherein:

The surface layer 1 may be a floor or a floor tile formed by slurry curing. The slurry may be an inorganic material or an organic material, for example, it may be a cured mother liquor, which may include a silicone emulsion, a silicate aqueous solution, and a polyurethane emulsion. One or more of polyacrylic acid emulsion and high molecular polymer emulsion containing carbon-fluorine bond. The slurry may further include a cementing agent MgO, and a water-soluble magnesium salt blending agent MgCl ₂ · 6H ₂ O. The above slurry may further include one or more of Ca (OH) ₂ or CaO, and silicon oxide. The surface layer 1 can also be made of organic materials, such as UV glue. Preferably, the above-mentioned surface layer 1 is formed by printing the UV adhesive onto the upper carrying layer 2 by using a 3D printer and being cured, so as to have a certain abrasion resistance.

On the upper and lower surfaces of the heating layer 3, an upper bearing layer 2 and a lower bearing layer 4 are respectively provided. The upper bearing layer 2 and the lower bearing layer 4 are made of an insulating and waterproof material, so that the good insulation and resistance of the heating layer 3 can be guaranteed. Humidity. Among them, the insulating and waterproof material is a composite of a matrix material and a reinforcing material, wherein the matrix material includes synthetic resin, rubber, and ceramic, and the reinforcing material includes glass fiber, boron fiber, aramid fiber, silicon carbide fiber, asbestos fiber, and whiskers. Preferably, the insulating and waterproof material is made of epoxy resin glass fiber cloth and / or unsaturated resin glass fiber cloth, so that the upper load-bearing layer 2 and the lower load-bearing layer 4 have the characteristics of good weather resistance and high temperature resistance.

It should be noted that the upper bearing layer 2 and the lower bearing layer 4 are each provided with at least one layer. Since the upper bearing layer 2 is closer to the surface layer 1, preferably, the lower bearing layer 4 may be provided as one layer, and the upper bearing layer 4 The layer 2 is provided at least two layers, so that the waterproof effect of the upper bearing layer 2 is better.

The heating layer 3 and the lower carrier layer 4 are provided with conductive elements 61 at both ends. The heating layer 3 is made of a conductive heating material. The conductive heating material has a liquid and solid state or a semi-solid and solid state. In the liquid or semi-solid state, the conductive heat-generating material is attached to the conductive element 61 and the lower supporting layer 4, and the conductive heat-generating material is fixedly connected to the conductive element 61 and the lower supporting layer 4 respectively after curing. This application solves the problem by attaching a conductive heating material in a liquid or semi-solid form to the conductive element 61 and the lower bearing layer 4 so that the conductive heating material is fixedly connected to the conductive element 61 and the lower bearing layer 4 respectively after curing, thereby solving the problem. It solves the problem of the unreliable connection between the conductive element and the heating layer of the existing heating component, thereby avoiding the situation that the two may have a virtual connection and sparking; at the same time, the contact resistance between the conductive heating material and the conductive element 61 is reduced, thereby Reduced risk of fire.

Specifically, the contact resistance between the heat generating layer 3 and the conductive element 61 formed by curing the conductive heat generating material is 7.5 ohms. Within this range, the risk of fire from the heat generating layer 3 and the conductive element 61 is greatly reduced.

Further, along the vertical direction (Z), the top surface of the conductive element 61 is flush with the top surface of the lower carrier layer 4 (see FIG. 17), and then the conductive heating material in a liquid or semi-solid state is attached to the conductive surface. On the element 61 and the lower carrier layer 4, the conductive heating material can be better adhered to the conductive element 61 and the lower carrier layer 4 (that is, a dense connection), which can also conduct electricity (compared to the soft connection in the prior art). The contact resistance between the heating material and the conductive element 61 is reduced to 7.5 ohms, thereby reducing the risk of fire.

It should be noted that the conductive heating material provided in the present application is preferably a slurry (because the slurry has a liquid and solid state or a semi-solid and solid state), it can be understood that the liquid, semi-solid and solid states involved in this application are From the perspective of fluid mechanics (or flow), for example, when the solid phase component in a fluid is higher than a preset value, it can be called a semi-solid state, and when it is lower than the preset value, it can be called a liquid state. It can even be understood that: there is an overlapping part between the liquid and the semi-solid, this application intends to show that the liquid and the semi-solid are in a state in which there is a flow relative to the solid. The above slurry may be, for example, a carbon slurry or a graphene slurry, and other metal powders or metal oxides may be blended in the slurry of the two. The conductive element 61 may be a metal foil, for example, a copper foil, an aluminum foil, or the like, which is not specifically limited herein.

It can be understood that, in the prior art, the heat generating layer may include many kinds of conductive heat generating materials, for example, it may be one of carbon black heat material, graphene heat material, metal heat material, polymer heat material, and semiconductor heat material, or Several. However, most of the aforementioned conductive heating materials and conductive elements 61 (such as copper foil) are connected by conductive glue, or the conductive element 61 is laminated on the conductive heating material, and these connection methods are separate connections (that is, soft connections are used). Way), it cannot effectively form a unified whole, so there is a risk of unreliable connection. In the present application, a conductive heating material in a liquid or semi-solid form is attached to the conductive element 61 and the lower supporting layer 4 so that the conductive heating material is fixedly connected to the conductive element 61 and the lower supporting layer 4 respectively after curing, so that Solved the problem of unreliable connection mentioned above.

Further, when the conductive heating material is in a liquid or semi-solid state, the conductive heating material is attached to the conductive element 61 and the lower supporting layer 4 by printing or coating. The printing methods include, but are not limited to, lithographic printing, gravure printing, letterpress printing, and stencil printing (ie, screen printing), and the coating methods include, but are not limited to, brush coating, wiping coating, blade coating, and spray coating. The above types of printing and coating are all within the protection scope of the present application, and are not specifically limited herein.

Preferably, the conductive heating material is carbon paste, and the conductive element 61 is copper foil; the carbon paste is attached to the copper foil and the lower carrier layer 4 by screen printing, and the carbon paste is cured with the copper foil and the lower carrier layer 4 respectively after curing. Fixed connection, thus realizing a reliable fixed connection between the conductive heating material and the conductive element 61. It can be understood that the carbon paste includes carbon black and resin. The carbon black is formed by bonding the resin to the carbon paste. Of course, the carbon paste may be doped with other conductive materials, such as graphene, metal powder, or metal oxide.

The conductive element 61 is disposed between the heating layer 3 and the lower supporting layer 4. When the conductive heating material is in a liquid or semi-solid state, the conductive heating material is attached to the conductive element 61 and the lower supporting layer 4, that is, the lower supporting layer 4 not only plays a role In order to support the conductive heating material, it also plays a waterproof role to facilitate the curing of the conductive heating material. The conductive heat-generating material is fixedly connected to the conductive element 61 and the lower bearing layer 4 respectively after curing, so as to achieve the assembly molding of the heat-generating layer 3, the lower bearing layer 4 and the conductive element 61.

The base layer 5 may be selected from paper, fiberboard, wood board, cement board, ceramic tile, or marble, that is, the base layer 5 only plays a role of carrying other film layer structures, and the specific types thereof are not specifically limited in this application.

In the horizontal direction (X), the base layer 5 is provided with a mounting groove 51. The mounting groove 51 is used for mounting a connecting element 62 (such as an electrode) electrically connected to the conductive element 61. In the vertical direction (Z), the base layer 5 and the bottom The bearing layer 4 is provided with a mounting hole 52 that communicates with the mounting groove 51. The mounting hole 52 is used to pass through a wire 63 that is electrically connected to the conductive element 61 and the connection element 62 respectively. Multiple heating components can be spliced to each other, that is, multiple heating components are connected in series and / or in parallel to the external power source through the connecting element 62, so that if one of the heating components is damaged, it will not affect the normal operation of the other heating components. .

The installation manner of the installation groove 51 and the installation hole 52 greatly improves the space utilization ratio of the heating component, and does not affect the splicing of the heating component. It can be understood that the splicing method of the heating component is preferably a splicing method of plugging, but the plugging and unplugging structure is not shown in this application, but it does not mean that this splicing method is not.

The present application also provides a method for preparing a heating element. Referring to FIG. 18, the heating element is preferably prepared by using the manufacturing method, and specifically includes the following steps:

S1. At least one lower bearing layer 4 is provided on the base layer 5, and conductive elements 61 are respectively provided at both ends of the lower bearing layer 4:

Specifically, grooves and holes are formed in the base layer 5 (that is, installation grooves 51 and installation holes 52 are opened), and the upper surface of the base layer 5 is cleaned and polished; the lower carrier layer 4 (using epoxy glass fiber cloth and / or Unsaturated resin glass fiber cloth) is set on the base layer 5, so as to ensure better weather resistance, high temperature resistance, insulation and humidity resistance of the heating component; finally, the conductive element 61 (such as copper foil) is set to the lower bearing layer 4 and put it into a vacuum laminator for vacuum lamination.

S2. Laminate the base layer 5, the lower carrier layer 4, and the conductive element 61:

Specifically, first, the vacuum degree of the laminator is less than the first preset pressure of 100 Pa, and then a second preset pressure of 0.5 MPa is applied to the surfaces of the base layer 5, the lower bearing layer 4, and the conductive element 61, and the base layer 5, The lower carrier layer 4 and the conductive element 61 begin to heat; then, when the temperature rises to a preset temperature of 140 ° C, the conditions of the preset temperature and the second preset pressure are maintained for a period of time; finally, the heating is stopped and the temperature is reduced to room temperature. Take the base layer 5, the lower carrier layer 4, and the conductive element 61 out of the laminator for use; after lamination, the top surface of the conductive element 61 is flush with the top surface of the lower carrier layer 4, so it is convenient to attach the conductive heating material to the conductive layer. The element 61 and the lower carrier layer 4 are on. After testing, the contact resistance between the formed conductive heating material and the conductive element 61 can be reduced to 7.5 ohms, and it can be said that almost no ignition will occur.

S3. The heating layer 3 is formed on the conductive element 61 and the lower supporting layer 4:

The heat-generating layer 3 is made of a conductive heat-generating material, and the conductive heat-generating material has a liquid and solid state or a semi-solid and solid form; wherein the conductive heat-generating material is attached to the conductive element 61 and On the lower supporting layer 4, the conductive heating material is cured, so that the heating layer 3 is fixedly connected to the conductive element 61 and the lower supporting layer 4, respectively.

Further, the conductive heating material in a liquid or semi-solid form is attached to the conductive element 61 and the lower supporting layer 4 by printing or coating.

Specifically, a stencil with a preset aperture is used to print a conductive heating material (such as a carbon paste) in a liquid or semi-solid form onto the lower supporting layer 4 and the conductive element 61.

S4. Set at least one upper supporting layer 2 on the conductive heating material:

Two upper supporting layers 2 (using epoxy glass fiber cloth and / or unsaturated resin glass fiber cloth) are provided on the conductive heat-generating material, and the whole is placed in a vacuum laminator for vacuum lamination.

S5. Laminate the base layer 5, the lower bearing layer 4, the conductive element 61, the conductive heating material, and the upper bearing layer 2:

Specifically, first, the vacuum degree of the laminator is less than 100 Pa of the first preset pressure, and then a second preset pressure is applied on the surface of the base layer 5, the lower bearing layer 4, the conductive element 61, the conductive heating material, and the upper bearing layer 2. 0.5 MPa, and start heating the base layer 5, the lower bearing layer 4, the conductive element 61, the conductive heating material and the upper bearing layer 2. Then, when the temperature rises to a preset temperature of 140 ° C, the preset temperature and the second The condition of the preset pressure is maintained for a period of time; finally, the heating is stopped and the temperature is lowered to room temperature, and the base layer 5, the lower bearing layer 4, the conductive element 61, the conductive heating material and the upper bearing layer 2 are taken out of the laminator for use.

S6. Set the surface layer 1 on the upper bearing layer 2:

Specifically, a 3D printer is used to print an inorganic material or an organic material (such as UV glue) onto the upper carrier layer 2, and after curing, the final finished product of the heating component is formed.

In summary, the method for preparing a heating element provided in the present application has the same beneficial effect as the heating element described above, that is, by attaching a conductive heating material in a liquid form to the conductive element 61, the conductive heating material is cured. It is fixedly connected to the conductive element 61, thereby solving the problem of unreliable connection between the conductive element and the heating layer of the existing heating component.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention and not limiting. Although the present invention has been described in detail with reference to the embodiments, those of ordinary skill in the art should understand that modifications or equivalent replacements of the technical solutions of the present invention shall not depart from the spirit and scope of the technical solutions of the present invention, which should be covered by the present invention. Within the scope of the claims.

Claims

The invention relates to a heating building material used in the construction field. The heating building material is a new product based on heat radiation and heat conduction. The film structure of the product includes a substrate, a heat insulation layer, a reflection layer, and heat radiation from bottom to top. Layer, and an enamel finish layer;

The substrate is a common building material bearing material, including cement-based boards, tiles, and marble;

The thermal insulation layer is attached to a substrate;

The heating radiation layer is attached on the reflective layer;

The facing layer is covered on the heat radiation layer;

The decorative layer has a transmittance of not less than 30% in the infrared band (0.8-15 μm).
The heating building material according to claim 1, wherein the material of the heat insulation layer is porous material, foam material, and fiber material, including asbestos, glass fiber, and aerogel felt.
The heating building material according to claim 1, wherein the reflective layer comprises a gold, silver, nickel, aluminum film, and a polyester or polyimide film with a metal film layer.
The heating building material according to claim 1, wherein the heat radiation layer comprises a heat radiation material, a conductive material, and an insulating material. The heating radiation layer heating material includes graphite, graphene, nano-carbon, special ink, polymer conductive film, the heating radiation layer conductive material includes copper wire, copper foil, or nano-silver paste, and the insulating material is preferably PET polymer. Ester film, PCT, PE.
The heating building material according to claim 1, wherein the thickness of the enamel finish layer is 1 μm to 5 mm.
A method for preparing a heating building material according to any one of 1-5, including the following steps:

1) The substrate is cleaned, and a heat insulation layer, a reflection layer and a heat radiation layer are sequentially attached from bottom to top;

2) The upper surface of the heat radiation layer is cleaned;

3) Finally, a layer of enamel finish is coated on the heat radiation layer. After curing at room temperature, a light, thin, uniform, and thermally conductive finish is formed.
The method according to claim 6, wherein the method for preparing the ceramic glaze layer in step 3) comprises a 3D printing method, a spray method, a spray method, a slurry method, and a screen printing method.
An integrated heat transfer plate, characterized in that the integrated heat transfer plate includes a conductive tape, a first insulating layer, an electrothermal conversion layer, and a second insulating layer, the conductive belt is connected to the electrothermal conversion layer, and the first An insulating layer, an electrothermal conversion layer, and a second insulating layer are stacked in order; the contact resistance of the electrothermal conversion layer and the electrically conductive connection is not higher than 900Ω, and the average square resistance of the electrothermal conversion layer is 11-5000Ω / □.
The integrated heat transfer plate according to claim 8, wherein the thickness of the electrothermal conversion layer is 1-800 μm.
The integrated heat transfer plate according to claim 8, wherein the raw materials for preparing the electrothermal conversion layer include low-resistance carbon microcrystals having a resistance value of 10-300Ω / □, and medium resistances having a resistance value of 300-1000Ω / □ One or more of carbon microcrystals and high-resistance carbon microcrystals having a resistance value of 1000Ω / □ or more.
The integrated heat transfer plate according to claim 10, wherein the mass ratio of the low-resistance carbon microcrystals having a resistance value of 10-300Ω / □ in the raw materials for preparing the electrothermal conversion layer is not less than 30%.
The integrated heat transfer plate according to claim 8, wherein the square resistance of the electric-to-heat conversion layer gradually increases or increases along a direction away from the conductive strip toward the center line.
The integrated heat transfer plate according to claim 8, wherein at least 60% of the input power is radiated with infrared rays having a wavelength of 5-20 microns according to the input power of the power source.
The method for preparing a heat transfer integrated plate according to any one of claims 8-13, comprising:

1) Provide a ground and polished substrate as the substrate, and modify the substrate;

2) A carbon microcrystalline layer having a resistance value of 11-5000Ω / □ is formed on the substrate, and then dried; the carbon microcrystalline layer is a low-resistance carbon containing a resistance value of 10-300Ω / □ One or more of microcrystals, medium-resistance carbon microcrystals with a resistance value of 300-1000Ω / □, and high-resistance carbon microcrystals with a resistance value of 1000Ω / □ or more;

3) A carbon microcrystalline region with a contact resistance of not higher than 90Ω is formed on the carbon microcrystalline layer, and a conductive band is provided.
The method for preparing a heat transfer integrated plate according to any one of claims 8-13, comprising:

1) Provide a ground and polished substrate as the substrate, and modify the substrate;

2) forming a plurality of carbon microcrystalline regions with different resistance values on the substrate, and the square resistance of the carbon microcrystalline regions gradually increases or gradient increases away from the electrode near the center line, and then the carbon microcrystalline regions are dried to obtain the carbon microcrystalline regions. Crystal layer

3) Provide a conductive tape.
A self-heating integrated board, characterized in that the self-heating integrated board includes a substrate, a first insulating waterproof film layer, a heating film layer, a second insulating waterproof film layer, a surface layer, and an electrode,

The substrate includes a polished surface;

The first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer are sequentially stacked on the polished surface;

The electrode is disposed on a substrate and is electrically connected to the heating film layer;

The total thickness of the first insulating and waterproofing film layer, the heating film layer, the second insulating and waterproofing film layer and the surface layer is 0.01-5 mm.
The self-heating integrated board according to claim 16, wherein the material of the surface layer comprises an epoxy resin layer, an ultraviolet curing adhesive layer, a ceramic coating layer, a cement layer, a ceramic layer, a glass layer, a marble layer, and granite One or more of the layers.
The self-heating integrated board according to claim 16, wherein the self-heating integrated board further comprises an infrared reflective film layer, and the infrared reflective film layer is located between the polished surface and the first insulating and waterproof film layer.
The self-heating integrated board according to claim 16, wherein the self-heating integrated board further comprises a wear-resistant layer, and the wear-resistant layer is disposed on the surface layer.
The self-heating integrated board according to claim 16, wherein the first insulating waterproof film layer and the second insulating waterproof film layer comprise an organic heat-resistant insulating material and / or an inorganic heat-resistant insulating material, and the organic heat-resistant insulating material The thermal insulation material includes one or more of polyethylene terephthalate, polyimide, polyamideimide, polymaleimide, polydiphenyl ether, and polytetrafluoroethylene. The inorganic heat-resistant insulating material includes one or more of quartz, mica, glass, and ceramic.
The self-heating integrated board according to claim 16, wherein the heating film layer comprises one or more of a carbon material, tourmaline and far-infrared ceramic.
The self-heating integrated board according to claim 18, wherein the infrared reflective layer comprises a metal film layer, and the thickness of the metal film layer is 0.05 μm to 500 μm.
The self-heating integrated board according to claim 16, wherein the compressive strength of the substrate is not less than 10 MPa, and the thermal conductivity is less than 0.12 W / (m · K).
The self-heating integrated board according to claim 16, wherein at least 55% of the input power is radiated with infrared rays having a wavelength of 1-20 μm according to a power input power meter.
A method for preparing a self-heating integrated board according to any one of claims 16 to 24, comprising:

1) Provide a substrate and polish one surface of the substrate;

2) An infrared reflective film layer, a first insulating and waterproof film layer, and a heating film layer are sequentially stacked or formed on the polished surface, and then a guide bar is provided on the heating film layer, and the guide bar and the electrode are formed. After being connected, a second insulating and waterproof film layer and a surface layer are sequentially stacked or formed on the heating film layer.
An directional heat transfer integrated plate, characterized in that: the directional heat transfer integrated plate includes a surface layer, a conductive tape, an electrothermal conversion layer, a heat-reflecting layer, a first sealing layer and a second sealing layer, the surface layer, The first sealing layer, the electrothermal conversion layer, the heat-reflecting layer, and the second sealing layer are stacked in this order, and the transmittance of the surface layer to infrared rays having a wavelength of 5-18 microns is not less than 20%;

The total thickness of the electrothermal conversion layer, the heat-reflecting layer, and the sealing layer is 10-800 microns.
The directional heat transfer integrated plate according to claim 26, wherein the directional heat transfer integrated plate comprises a substrate, and a roughness of one surface of the substrate is not greater than 0.8 micrometer.
The directional heat transfer integrated plate according to claim 26, wherein the directional heat transfer integrated plate includes at least a waterproof layer, and the waterproof layer is located between the base material and the electrothermal conversion layer; or the sealing layer Waterproof rating is greater than IP67.
The directional integrated heat transfer plate according to claim 26 or 28, wherein the directional integrated heat transfer plate includes an insulating layer, and the insulating layer is laminated on the electrothermal conversion layer; or the resistance of the sealing layer More than 20MΩ.
The directional heat transfer integrated plate according to claim 26, wherein the raw materials for preparing the electrothermal conversion layer include low-resistance carbon microcrystals having a resistance value of 10-300Ω / □, and medium-resistance values of 300-1000Ω / □ One or more of carbon-blocking microcrystals and high-resistance carbon microcrystals having a resistance value of 1000 Ω / □ or more.
The directional heat transfer integrated plate according to claim 30, wherein the mass ratio of the low-resistance carbon microcrystals having a resistance value of 10-300Ω / □ in the raw materials for preparing the electrothermal conversion layer is not less than 30%.
The directional heat transfer integrated board according to claim 26, wherein the square resistance of the electric-to-heat conversion layer gradually increases or increases along a direction away from the conductive strip toward the center line.
The directional heat transfer integrated board according to claim 26, wherein the heat-reflective layer includes a metal and a dielectric film layer, and the thickness of the metal film layer is 0.05 μm to 100 μm.
The directional heat transfer integrated board according to claim 26, wherein at least 55% of the input power is output from the surface layer with infrared radiation having a wavelength of 5-20 microns according to the power input power meter.
A method for preparing a directional heat transfer integrated plate according to any one of claims 26 to 34, comprising:

1) Provide a polished substrate as a substrate and modify the substrate;

2) Build or stack a heat-reflective layer and an electrothermal conversion film on the modified substrate, and set a conductive tape on the electrothermal conversion layer, and then stack or build the first sealing layer and surface layer on the conductive tape; or after modification A heat-reflecting layer, an insulating layer, and an electrothermal conversion film are constructed or stacked on the substrate of the substrate, and a conductive tape is provided on the electrothermal conversion layer, and then a first sealing layer and a surface layer are stacked or constructed on the conductive tape.
The method according to claim 35, wherein the heat-reflective reflective layer is prepared by depositing a metal dielectric reflective film on PET by a magnetron sputtering method.
The method according to claim 35, wherein the step 2) comprises a step of constructing or stacking a second sealing layer on the modified substrate.
An integrated electric heating plate, characterized in that the integrated electric heating plate includes a heat-preserving substrate (1), a heating film layer (2-3) and a surface layer (3); 50nm ~ 10μm; the sheet resistance of the heating film layer is between 10 ~ 1000Ω / □.
The integrated electrothermal board according to claim 38, wherein the heating film layer (2-3) is an oxide or an oxysulfide, and the material of the heating film layer (2-3) includes ZnO x S One or more of (1-x) , InO x S (1- x) , Sn x In (1-x) O, Zn x Mg (1-x) O, Zn x Al (1-x) O Species.
The integrated electrothermal board according to claim 38, wherein the heating film layer (2-3) is a oxycarbon compound, and the material of the heating film layer (2-3) includes SiO x C (1- x) .
The integrated electrothermal board according to claim 38, wherein the heating film layer (2-3) is a carbonitride compound, and the material of the heating film layer (2-3) comprises SiC x N (1- x) .
An integrated electrothermal board according to claim 38, wherein the upper and lower surfaces of the heating film layer (2-3) are provided with an upper insulating waterproof layer (2-4) and a lower insulating waterproof layer (2- 2); a conductive metal conductive tape (4) is attached as a power supply circuit on both sides of the surface of the heating film layer (2-3) near the edge, and the metal conductive tape (4) is electrically connected to the built-in electrode.
The integrated electrothermal board according to claim 38, characterized in that the material of the lower insulation waterproof layer (2-2) and the upper insulation waterproof layer (2-4) is an inorganic waterproof insulation material or an organic waterproof insulation material;

The inorganic waterproof insulating material includes ceramic, enamel, glass, mica, quartz, and dielectric ceramic;

The organic waterproof insulating material includes polyimide, polyamideimide, polyimide, polymaleimide, polydiphenyl ether, modified epoxy, unsaturated polyester, and polyaramide.
The integrated electrothermal board according to claim 38, wherein the integrated electrothermal board further comprises an infrared reflective film layer (2-1), and the infrared reflective film layer (2-1) is located on the substrate (1) ) And the lower insulating and waterproof layer (2-2), the infrared reflective film layer (2-1) is a metal-containing film layer.
The electric-heating integrated board according to claim 38, wherein the heat-preserving substrate (1) meets a compressive strength of not less than 10 MPa, and the heat-preserving substrate (1) comprises a calcium silicate board and a silicate One, or several types of plate, mica plate, porous ceramic plate.
The integrated electrothermal board according to claim 38, wherein the material of the surface layer (3) has a Mohs hardness of not less than 3 and an abrasion resistance of not more than 500 mm 3 .
A method for preparing an electrothermal integrated board is characterized in that the manufacturing process of the integrated board includes the following steps:

1) Take the thermal insulation substrate (1), clean it and dry it;

2) A vacuum coating method is used to prepare a heat-generating film layer (2-3) on the polished surface of the heat-preserving substrate (1), followed by annealing at 100-450 ° C for 10-120 minutes;

3) A metal conductive tape (4) is provided on the surface of the heating film layer (2-3), and the metal conductive tape (4) and the built-in electrode are electrically connected;

4) A surface layer (3) is provided on the surface of the heating film layer (2-3) to complete the preparation of the integrated electrothermal board.
A heat-generating building material, characterized in that the heat-generating building material includes a heat-insulating layer, a heat-generating layer, and an air purification surface layer connected from bottom to top, and the air purification surface layer contains 1 to 40% by weight of air purification material, In the heating state, the amount of induced air negative ions is more than 1000 / (S · c㎡).
The heat-generating building material according to claim 48, wherein the air purification surface layer contains an air purification material, the air purification material is a negative ion release material and / or a photocatalyst material, wherein the negative ion release material is natural Inorganic mineral materials and / or synthetic materials.
The heat-generating building material according to claim 49, wherein the natural inorganic mineral material is at least one selected from the group consisting of tourmaline, hexalith, opal, ice-ice, gemstone, seagull, and vermiculite.
The heat-generating building material according to claim 49, wherein the synthetic material is anion powder.
The heating building material according to claim 49, wherein the photocatalyst material is selected from the group consisting of nano-TiO 2 , nano-ZnO, nano-CdS, nano-WO 3 , nano-Fe 2 O 3 , nano-PbS, nano-SnO 2 , nano-ZnS, At least one of nano SrTiO 3 and nano SiO 2 .
The exothermic building material according to claim 48, wherein the air purification material is uniformly distributed in the air purification surface layer in the form of particles, and the particle size of the air purification material is 0.01-100 μm.
The heat-generating building material according to claim 48, wherein the air purification surface layer is composed of an air purification material layer and an air purification material layer, and the air purification material layer is located on a surface of the surface layer.
The heat-generating building material according to claim 54, wherein the thickness of the surface layer is 0.1 to 10 mm, and the thickness of the air purification material layer is 1 to 500 μm.
The heat-generating building material according to claim 48, wherein the heat insulation layer is made of a porous or fibrous heat insulation material.
The heat-generating building material according to claim 56, wherein the thickness of the heat-insulating layer is 0.1 to 10 cm.
The heat-generating building material according to claim 48, wherein a material of the heat-generating layer is selected from at least one of carbon black, graphene, carbon fiber, and metal wire.
The heat-generating building material according to claim 48, wherein an insulating and waterproof layer is further provided between the heat-generating layer and the air purification surface layer.
The heat-generating building material according to claim 48, wherein an insulation waterproof layer is also provided between the heat-insulating layer and the heat-generating layer.
The heat-generating building material according to claim 59, wherein the thickness of the insulating and waterproof layer is 1 to 500 μm.
The method for preparing a heat-generating building material according to any one of claims 48 to 61, wherein the method comprises the following steps:

1) Obtaining a thermal insulation layer, setting a reserved wiring hole on the side of the thermal insulation layer and burying an electrode joint;

2) forming a heat generating layer above the heat insulation layer;

3) The material for preparing the air purification surface layer is mixed with a solvent, coated on the heating layer, and left to cure.
The method according to claim 62, further comprising: providing an insulating and waterproof layer between the heat-insulating layer and the heat-generating layer.
The method according to claim 62, further comprising: providing an insulating and waterproof layer between the heat generating layer and the air purification surface layer.
A heat-generating integrated plate, characterized in that the heat-generating integrated plate comprises a substrate, a heat-generating layer, a metal current-carrying strip, and a wear-resistant water-blocking layer in order from bottom to top;

The heating layer is a conductive far-infrared heating material, and the heating material is disposed on a substrate;

The metal current-carrying strips are connected to the heating layer and are located on both sides of the heating layer, and the metal current-carrying strips on both sides are respectively connected to the power supply;

The abrasion-resistant and water-blocking layer is prepared by solidifying a liquid material.
The heat-generating integrated board according to claim 65, wherein the abrasion-resistant and water-blocking layer is prepared by the following raw materials in parts by weight: 100 to 150 parts of modified epoxy resin, and 50 to 100 parts of water-based polyurethane emulsion. 3 to 10 parts of basalt powder, 12 to 17 parts of silicon fine powder, 20 to 30 parts of garnet powder, 1 to 2 parts of flame retardant, 1 to 2 parts of curing agent, 0.5 to 1 part of thickener, 0.05 to preservative 0.1 parts and 15-20 parts of deionized water.
The heat-generating integrated board according to claim 66, wherein the preparation steps of the modified epoxy resin are:

S1. Dissolve the epoxy resin 6101 in an organic solvent, raise the temperature to 50-70 ° C, add the silane coupling agent with amino group and ethyl orthosilicate, stir at high speed, and discharge after constant temperature reaction for 5 hours. Add methyl triethyl Oxysilane, after stirring well, remove the solvent under reduced pressure to obtain an emulsion;

S2. Preparation of graphene oxide by improved Hummers method;

S3. Mill and mix the graphene oxide, nano-alumina, and nano-zinc oxide prepared in step S2 by a ball mill; add to the emulsion obtained in step S1, stir and mix well, add antimony trioxide and nickel oxide, and stir at high speed for 1 h Add polyamide and stir quickly for 2min to obtain modified epoxy resin;

The epoxy resin 6101, an amino-containing silane coupling agent, orthosilicate, methyltriethoxysilane, graphene oxide, nano-alumina, nano-zinc oxide, antimony trioxide, and nickel oxide The mass ratio is 120: (7 to 10): (20 to 25): (3 to 5): (1 to 3): (3 to 5): (1 to 3): (0.5 to 1.5): (2 ~ 5); the amino-containing silane coupling agent is selected from KH550, KH792, KH-602, WD-50, KBM-603, SI900, Z-6121, Z-6020, GF95, and SI902; The organic solvent is selected from one or more of ethyl acetate, acetone, dichloroethane, acetonitrile, ethanol, methanol, toluene, and pyridine.
The heating integrated board according to claim 66, wherein the curing agent is selected from the group consisting of imidazole-based curing agents, organic acid anhydride curing agents, and amine-based curing agents; and the thickener is selected from carboxymethyl Cellulose, hydroxyethyl cellulose, methyl cellulose, hydroxypropyl methyl cellulose, sodium polyacrylate, organic bentonite, polyacrylamide, guar gum, xanthan gum, ZW raw powder, AT-70 Thickener, PR-328 thickener, TD-01 thickener, HEUR series polyurethane associative thickener, Rheoagent GC-2440 thickener, GD-8201 coating special thickener, DH series thickener And CH-718 series of one or more of thickening and thickening agents; the preservative is selected from 1,2 benzoisothiazolin-3-one, 2-methyl-4 isothiazolin-3-one One or more of 5-chloro-2-methyl-4isothiazolin-3-one and 2-methyl-4isothiazolin-3-one.
The heat-generating integrated board according to claim 65, wherein the material for preparing the heat-generating layer comprises a conductive heat-generating material, turpentine alcohol, and ethyl cellulose.
The heating integrated board according to claim 69, wherein the conductive heating material comprises nano-carbon crystal powder, graphene, carbon fiber, carbon nanotube, expanded graphite, lanthanum chromate, silicon carbide, molybdenum silicide, and titanium One or more combinations of barium acid.
The heat-generating integrated board according to claim 65, wherein the metal current-carrying strip can adapt to the requirements of different currents and voltages by changing the cross-sectional area of the metal current-carrying strip; The requirements for use are two lengthwise or widthwise paving methods.
The heat-generating integrated board according to claim 65, wherein the surface and the periphery of the heat-generating layer are covered with an insulating and waterproof film, so that it has the functions of insulation and waterproof.
The heat-generating integrated board according to claim 65, further comprising a heat storage layer, the heat storage layer being disposed between the heat-generating layer and the base material and / or the metal current-carrying strip and the abrasion-resistant and water-blocking layer.
A method for preparing a heat-generating integrated plate according to claims 65-73, comprising the steps of: after polishing and grinding the back surface of the substrate, applying a printing or coating method to the substrate to polish the substrate Surface, metal current carrying bars of different cross-sectional areas are laid on the heating layer in the length direction or width direction, and the two ends are connected to the connection plug; then the surface of the heating layer and the metal current carrying bar is coated with a wear-resistant water blocking layer The thickness is 1 μm to 5 mm. After curing, the heating integrated board is prepared; the two heating integrated boards are connected through a connection plug, and the connection plug has a conductive function.
A heat-generating component, comprising a heat-generating layer (3) and a lower carrying layer (4) disposed below the heat-generating layer (3), and conductive elements ( 61), the heating layer (3) is made of a conductive heating material, and the conductive heating material has a liquid and solid state or a semi-solid and solid form;

When the conductive heat-generating material is in a liquid or semi-solid state, the conductive heat-generating material is attached to the conductive element (61) and the lower supporting layer (4). The conductive element (61) and the lower supporting layer (4) are fixedly connected.
The heat-generating component according to claim 75, wherein the contact resistance between the heat-generating layer (3) and the conductive element (61) formed by curing the conductive heat-generating material does not exceed 900 ohms.
The heat-generating component according to claim 75, wherein, when the conductive heat-generating material is in a liquid or semi-solid state, the conductive heat-generating material is attached to the conductive element (61) and the conductive element by printing or coating. Said on the lower bearing layer (4).
The heat-generating component according to claim 75, wherein the conductive heat-generating material includes carbon paste and graphene paste, and the conductive element (61) includes copper foil, aluminum foil, and silver foil.
The heat-generating component according to claim 75, characterized in that, in a vertical direction (Z), a top surface of the conductive element (61) is flush with a top surface of the lower bearing layer (4).
The heat generating component according to claim 75, further comprising an upper bearing layer (2), the upper bearing layer (2) being disposed above the heat generating layer (3) in a vertical direction (Z);

The upper bearing layer (2) and the lower bearing layer (4) are both made of an insulating and waterproof material.
The heat-generating component according to claim 80, wherein the insulating and waterproof material is made of a composite of a base material and a reinforcing material;

The base material includes synthetic resin, rubber, and ceramic, and the reinforcing material includes glass fiber, boron fiber, aramid fiber, silicon carbide fiber, asbestos fiber, and whiskers.
The heat generating component according to claim 80, further comprising a base layer (5) and a surface layer (1), in a vertical direction (Z), the surface layer (1), the upper carrying layer ( 2) The heating layer (3), the lower supporting layer (4), and the base layer (5) are sequentially stacked from top to bottom.
A method for preparing a heat generating component, comprising the steps of:

The heating layer (3) is formed on the conductive element (61) and the lower supporting layer (4), the conductive element (61) is arranged on both ends of the lower supporting layer (4), and the heating layer (3) Made of a conductive heat-generating material that has a liquid and solid state or a semi-solid and solid form; wherein,

When the conductive heating material is in a liquid or semi-solid state, the conductive heating material is attached to the conductive element (61) and the lower supporting layer (4), and then the conductive heating material is cured to The heating layer (3) formed by curing the conductive heating material is fixedly connected to the conductive element (61) and the lower carrying layer (4), respectively.
The preparation method according to claim 83, wherein before the step of forming the heating layer (3) on the conductive element (61) and the lower supporting layer (4), the method further comprises the step of:

Providing at least one lower supporting layer (4) on a base layer (5), and providing the conductive elements (61) at both ends of the lower supporting layer (4);

The base layer (5), the lower supporting layer (4), and the conductive element (61) are laminated.
The preparation method according to claim 84, wherein the step of forming the heating layer (3) on the conductive element (61) and the lower supporting layer (4) comprises:

The conductive heating material in a liquid or semi-solid form is attached to the conductive element (61) and the lower supporting layer (4) by printing or coating.
The preparation method according to claim 85, wherein after the step of forming the heating layer (3) on the conductive element (61), the method further comprises the step of:

Providing at least one upper carrying layer (2) on the conductive heating material;

The base layer (5), the lower supporting layer (4), the conductive element (61), the conductive heating material and the upper supporting layer (2) are laminated and formed.
The method according to claim 86, characterized in that the base layer (5), the lower supporting layer (4), the conductive element (61), the conductive heating material and the upper bearing After layer (2) is laminated, it further comprises the steps:

A surface layer (1) is provided on the upper bearing layer (2).