CN110901184A - 一种电热一体板及制备方法 - Google Patents
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Abstract
本发明公开了一种电热一体板及制备方法,所述电热一体板包括保温基材、发热膜层和面层;发热膜层厚度在50nm~10μm之间;发热膜层方块电阻在10~1000Ω/□之间。发热膜层为氧化物或氧硫化物,发热膜层材料包括ZnOxS(1‑x)、InOxS(1‑x)、SnxIn(1‑x)O、ZnxMg(1‑x)O、ZnxAl(1‑x)O中的一种或几种。发热膜层为碳氧化合物,所述发热膜层材料包括SiOxC(1‑x)。发热膜层为碳氮化合物,所述发热膜层材料包括SiCxN(1‑x)。发热膜层表面两侧靠近边缘处附着有可导电的金属带作为供电电路。本发明涉及电热一体板不仅发热材料用量少,而且发热材料性能稳定,发热效率高,使用过程中发热功率稳定。
Description
技术领域
本发明涉及一种建材,具体涉及一种电热一体板及制备方法。
背景技术
目前我国南方冬季没有有效采暖措施,冬季寒冷潮湿;北方虽然有采暖措施,但采暖过程中对空气污染严重。随着环境污染和能源危机的日益严峻,国家目前正在大力推广煤改电,以便节能减排。但对于北方用户,集中供暖的方式使得用户在离开房屋时供暖设备依然在运行,能量损失严重;对于南方用户,目前缺少高效的采暖手段。
电热一体板是一款全新的采暖产品,通电后可发射5~15μm远红外线,5~15μm远红外线为生命光波,人体感应敏感且有具有红外理疗的作用,温暖舒适健康,能耗低,节能环保无污染。电热一体板采用一体化结构设计,集发热、保温和装饰三大功能于一体,安装方式多且安装灵活方便,可以用作室内地面、墙面以及屋顶。
本发明涉及电热一体板采用厚度小于10μm氧化物薄膜作为发热材料,不仅发热材料用量少,发热膜层生产成本低,而且采用氧化物作为发热材料,氧化物性能稳定,发热效率高,所以电热一体板使用寿命长,而且使用过程中发热功率稳定。
发明内容
本发明的目的在于提供一种电热一体板及制备方法,用以解决现有南方用户个体采暖或者北方用户集中供暖浪费能源的问题。
为解决上述技术问题,本发明采用如下技术方案:
一种电热一体板,所述电热一体板包括保温基材、发热膜层和面层;所述发热膜层厚度在50nm~10μm之间;所述发热膜层方块电阻在10~1000Ω/□之间。
优选的,上述发热膜层为氧化物或氧硫化物,所述发热膜层材料包括ZnOxS(1-x)、InOxS(1-x)、SnxIn(1-x)O、ZnxMg(1-x)O、ZnxAl(1-x)O中的一种或几种。
优选的,上述发热膜层为碳氧化合物,所述发热膜层材料包括SiOxC(1-x)。
优选的,上述发热膜层为碳氮化合物,所述发热膜层材料包括SiCxN(1-x)。
优选的,上述发热膜层上下两个表面设置有上绝缘防水层和下绝缘防水层;所述发热膜层表面两侧靠近边缘处附着有可导电的金属带作为供电电路,金属带与内置式电极电连接。
优选的,上述下绝缘防水层和上绝缘防水层材料为无机防水绝缘材料或有机防水绝缘材料;
所述无机防水绝缘材料包括陶瓷、瓷釉、玻璃、云母、石英和介电陶瓷;
所述有机防水绝缘材料包括聚酰亚胺、聚酰胺酰亚胺、聚酰亚胺、聚马来酰亚胺、聚二苯醚、改性环氧、不饱和聚酯和聚芳酰胺。
优选的,上述电热一体板还包括红外反射膜层,所述红外反射膜层可以位于基材和下绝缘防水层之间,所述红外反射层为含有金属的膜层。
优选的,上述保温基材的材料和尺寸满足抗压强度不小于10MPa,导热系数低于0.5W/(m·K)。
优选的,上述保温基材材料包括硅酸钙板、硅酸盐板、云母板、多孔陶瓷板和多孔陶瓷板中的一种或几种。
优选的,上述面层的材料莫氏硬度不小于3,耐磨性能不大于500mm3。
一种电热一体板的制备方法,包括如下步骤:
Step1:取保温基板,清洗干净并烘干;
Step2:在基材抛光表面采用真空镀膜法制备发热膜层,然后100~450℃退火10~120min;
Step3:在发热膜层表面设置金属导电带,并将金属导电带和内置电极电连接;
Step4:在发热膜层表面设置面层即完成低压电热板的制备。
本发明具有如下优点:
本发明的电热一体板及其制备方法,电热一体板采用厚度小于10μm氧化物薄膜作为发热材料,不仅发热材料用量少,发热膜层生产成本低,而且由于采用氧化物作为发热材料,氧化物性能稳定,发热效率高,所以电热一体板使用寿命长,而且使用过程中发热功率衰减小。
电热一体板采用真空镀膜制备发热膜层,不仅可以准确的控制发热膜层的厚度,而且真空镀膜可以精确控制发热材料的成分,可以有效对发热膜层的发热材料进行掺杂,一方面可以通过掺杂提高发热材料的红外线发射率,另一方面通过掺杂可以有效调节发热材料所发射红外线的波长进行,使电热一体板所发射红外线波长和人体吸收红外线相匹配。
附图说明
图1为本发明一种电热一体板的剖面图。
图2为本发明一种电热一体板的制备方法流程图。
图3为采用碳材料制作本发明电热一体板的发热膜层的测试结果。
图4为本发明采用氧化物制作发热膜层制作电热一体板的的测试结果。
图中:1.保温基底;2-1.红外反射膜层;2-2.下绝缘防水层;2-3.发热膜层;2-4.上绝缘防水层;3.面层;4.导电金属带。
具体实施方式
以下由特定的具体实施例说明本发明的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本发明的其他优点及功效。
须知,本说明书所附图式所绘示的结构、比例、大小等,均仅用以配合说明书所揭示的内容,以供熟悉此技术的人士了解与阅读,并非用以限定本发明可实施的限定条件,故不具技术上的实质意义,任何结构的修饰、比例关系的改变或大小的调整,在不影响本发明所能产生的功效及所能达成的目的下,均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时,本说明书中所引用的如“上”、“下”、“左”、右”、“中间”等的用语,亦仅为便于叙述的明了,而非用以限定本发明可实施的范围,其相对关系的改变或调整,在无实质变更技术内容下,当亦视为本发明可实施的范畴。
实施例1
参见图1,一种电热一体板,所述电热一体板包括保温基材1、发热膜层2-3和面层3;所述发热膜层2-3厚度在50nm~10μm之间;发热膜层方块电阻在10~1000Ω/□之间。
具体实施时,上述发热膜层2-3为氧化物或氧硫化物,所述发热膜层2-3材料包括ZnOxS(1-x)、InOxS(1-x)、SnxIn(1-x)O、ZnxMg(1-x)O、ZnxAl(1-x)O中的一种或几种。
具体实施时,上述发热膜层2-3为碳氧化合物,所述发热膜层2-3材料包括SiOxC(1-x)。
具体实施时,上述发热膜层2-3为碳氮化合物,所述发热膜层2-3材料包括SiCxN(1-x)。
具体实施时,上述发热膜层2-3下两个表面设置有上绝缘防水层2-4和下绝缘防水层2-2;所述发热膜层2-3表面两侧靠近边缘处附着有可导电的金属带4作为供电电路,金属带4与内置式电极电连接。
具体实施时,上述下绝缘防水层2-2和上绝缘防水层2-4材料为无机防水绝缘材料或有机防水绝缘材料;
所述无机防水绝缘材料包括陶瓷、瓷釉、玻璃、云母、石英和介电陶瓷;
所述有机防水绝缘材料包括聚酰亚胺、聚酰胺酰亚胺、聚酰亚胺、聚马来酰亚胺、聚二苯醚、改性环氧、不饱和聚酯和聚芳酰胺。
具体实施时,上述电热一体板还包括红外反射膜层2-1,所述红外反射膜层2-1位于基材1和下绝缘防水层2-2之间,所述红外反射层2-1为含有金属的膜层。
具体实施时,上述保温基材1的材料和尺寸满足抗压强度不小于10MPa,导热系数低于0.5W/(m·K)。
具体实施时,上述保温基材1材料包括硅酸钙板、硅酸盐板、云母板、多孔陶瓷板和多孔陶瓷板中的一种或几种。
具体实施时,上述面层3的材料莫氏硬度不小于3,耐磨性能不大于500mm3。
参见图2,一种电热一体板的制备方法,包括如下步骤:
Step1:取保温基板1,清洗干净并烘干;
Step2:可选的,在保温基板1抛光的表面制备下绝缘防水层2-2;
Step3:在下绝缘防水层2-2表面采用真空镀膜法制备发热膜层2-3,然后100~450℃退火10~120min;
Step4:在发热膜层2-3表面设置金属导电带4,并将金属导电带4和内置电极电连接;
Step5:可选的,在发热膜层2-3表面制备上绝缘防水层2-4;
Step6:在上绝缘防水层2-4表面设置面层即完成低压电热板的制备。
参见图3,测试按照GB/T7287-2008进行,电热一体板额定电压220V,额定功率100W,采用碳材料作为发热膜层的电热一体板测试结果。
参见图4,测试按照GB/T7287-2008进行,电热一体板额定电压220V,额定功率80W,采用氧化物作为发热膜层的电热一体板测试结果。
对比图3与图4中的测试结果,本发明的电热一体板及其制备方法,电热一体板采用厚度小于10μm氧化物薄膜作为发热材料,不仅发热材料用量少,发热膜层生产成本低,而且由于采用氧化物作为发热材料,氧化物性能稳定,发热效率高,所以电热一体板使用寿命长,而且使用过程中发热功率衰减小。
电热一体板采用真空镀膜制备发热膜层,可以准确的控制发热膜层的厚度,发热膜层厚度小于10μm,可以减小发热材料的用量,降低发热膜层成本。此外,真空镀膜后可以精确控制发热材料的成分,可以有效对发热膜层的发热材料进行掺杂,一方面可以通过掺杂提高发热材料的红外线发射率,另一方面通过掺杂可以有效调节发热材料所发射红外线的波长进行,使电热一体板所发射红外线波长和人体吸收红外线相匹配。
虽然,上文中已经用一般性说明及具体实施例对本发明作了详尽的描述,但在本发明基础上,可以对之作一些修改或改进,这对本领域技术人员而言是显而易见的。因此,在不偏离本发明精神的基础上所做的这些修改或改进,均属于本发明要求保护的范围。
Claims (10)
1.一种电热一体板,其特征在于:所述电热一体板包括保温基材(1)、发热膜层(2-3)和面层(3);所述发热膜层(2-3)厚度在50nm~10μm之间;所述发热膜层方块电阻在10~1000Ω/□之间。
2.根据权利要求1所述的一种电热一体板,其特征在于:所述发热膜层(2-3)为氧化物或氧硫化物,所述发热膜层(2-3)材料包括ZnOxS(1-x)、InOxS(1-x)、SnxIn(1-x)O、ZnxMg(1-x)O、ZnxAl(1-x)O中的一种或几种。
3.根据权利要求1所述的一种电热一体板,其特征在于:所述发热膜层(2-3)为碳氧化合物,所述发热膜层(2-3)材料包括SiOxC(1-x)。
4.根据权利要求1所述的一种电热一体板,其特征在于:所述发热膜层(2-3)为碳氮化合物,所述发热膜层(2-3)材料包括SiCxN(1-x)。
5.根据权利要求1所述的一种电热一体板,其特征在于,所述发热膜层(2-3)上下两个表面设置有上绝缘防水层(2-4)和下绝缘防水层(2-2);所述发热膜层(2-3)表面两侧靠近边缘处附着有可导电的金属导电带(4)作为供电电路,金属导电带(4)与内置式电极电连接。
6.根据权利要求1所述的一种电热一体板,其特征在于:所述下绝缘防水层(2-2)和上绝缘防水层(2-4)材料为无机防水绝缘材料或有机防水绝缘材料;
所述无机防水绝缘材料包括陶瓷、瓷釉、玻璃、云母、石英和介电陶瓷;
所述有机防水绝缘材料包括聚酰亚胺、聚酰胺酰亚胺、聚酰亚胺、聚马来酰亚胺、聚二苯醚、改性环氧、不饱和聚酯和聚芳酰胺。
7.根据权利要求1所述的一种电热一体板,其特征在于,所述电热一体板还包括红外反射膜层(2-1),所述红外反射膜层(2-1)位于基材(1)和下绝缘防水层(2-2)之间,所述红外反射膜层(2-1)为含有金属的膜层。
8.根据权利要求1所述的一种电热一体板,其特征在于,所述保温基材(1)满足抗压强度不小于10MPa,所述保温基材(1)包括硅酸钙板、硅酸盐板、云母板、多孔陶瓷板和多孔陶瓷板中的一种或几种。
9.根据权利要求1所述的一种电热一体板,其特征在于:所述面层(3)的材料莫氏硬度不小于3,耐磨性能不大于500mm3。
10.一种电热一体板的制备方法,其特征在于:所述一体板的制备过程包括如下步骤:
Step1:取保温基板(1),清洗干净并烘干;
Step2:在保温基板(1)抛光表面采用真空镀膜法制备发热膜层(2-3),然后100~450℃退火10~120min;
Step3:在发热膜层(2-3)表面设置金属导电带(4),并将金属导电带(4)和内置电极电连接;
Step4:在发热膜层(2-3)表面设置面层(3)即完成电热一体板的制备。
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