WO2020056941A1 - Oled显示装置 - Google Patents

Oled显示装置 Download PDF

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Publication number
WO2020056941A1
WO2020056941A1 PCT/CN2018/120736 CN2018120736W WO2020056941A1 WO 2020056941 A1 WO2020056941 A1 WO 2020056941A1 CN 2018120736 W CN2018120736 W CN 2018120736W WO 2020056941 A1 WO2020056941 A1 WO 2020056941A1
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Prior art keywords
layer
display device
oled display
inorganic
thickness
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PCT/CN2018/120736
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English (en)
French (fr)
Inventor
赵振宇
李辉
黄漭
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/315,638 priority Critical patent/US10840477B2/en
Publication of WO2020056941A1 publication Critical patent/WO2020056941A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present application relates to the field of display technology, and in particular, to an OLED display device.
  • OLED Organic light-emitting diodes
  • the biggest problem that restricts the development of OLED devices is the short life of OLED devices.
  • the main reason is that the material of the electrode layer and the light-emitting layer constituting the OLED device is very sensitive to water vapor and oxygen in the atmosphere, and the device performance is weakened by water and oxygen erosion.
  • the prior art thin film package usually uses a sandwich structure with multiple organic layers and inorganic layers overlapping. The barrier properties of the inorganic layer and the stress characteristics of the organic layer are used. Therefore, a barrier layer is required to limit the film formation range of the organic layer for inkjet printing. In order to completely cover the organic layer with the inorganic layer and prevent outside water and oxygen from entering the OLED device through the organic layer with poor barrier performance.
  • the organic ink when an organic layer is prepared by inkjet printing during the thin film encapsulation process of the existing OLED display device, the organic ink overflows the barrier layer due to the excessive ink jet volume, which leads to the interconnection of the organic ink inside and outside the barrier layer. , Making the organic layer beyond the coverage of the inorganic layer, further causing the risk of failure of the OLED display device due to the invasion of external water and oxygen along the organic layer.
  • the inkjet volume was too large when the organic layer was prepared by inkjet printing technology, causing the organic ink to overflow the barrier layer, causing the organic ink inside and outside the barrier layer to communicate with each other, and the organic layer exceeded the inorganic layer.
  • the coverage of the layer further causes the risk of failure of the OLED display device due to the intrusion of external water and oxygen along the overflowing organic layer.
  • the present application provides an OLED display device, which can isolate the connection between the organic layer inside the barrier layer and the organic layer overflowing from the barrier layer, so as to solve the existing OLED display device.
  • the organic ink overflows the barrier layer due to the excessive ink jet volume, which leads
  • the organic ink inside and outside the barrier layer communicates with each other, causing the organic layer to exceed the coverage of the inorganic layer, which further causes technical problems that external water and oxygen invade along the organic layer and cause the OLED device to fail.
  • the present application provides an OLED display device, including a flexible substrate, a TFT layer on the flexible substrate, an OLED light-emitting layer on the TFT layer, a barrier layer on the TFT layer, and an encapsulation layer;
  • the encapsulation layer covers the barrier layer.
  • a portion of the encapsulation layer located outside the barrier layer includes a first inorganic layer and a second inorganic layer.
  • the portion of the encapsulation layer located on the surface of the barrier layer is disposed on the first inorganic layer.
  • a protective layer is provided, and the protective layer completely covers the barrier layer; the hydrophobicity of the protective layer is greater than that of the first inorganic layer.
  • the material of the protective layer is simple silicon.
  • the material of the first inorganic layer is one or more of silicon nitride, silicon dioxide, aluminum oxide, titanium dioxide, and zirconium dioxide, or any two or more of them. combination.
  • a material of the second inorganic layer is the same as a material of the first inorganic layer.
  • a portion of the encapsulation layer located inside the barrier layer includes the first inorganic layer, the organic layer, and the second inorganic layer which are disposed in a stack.
  • the thickness of the organic layer is greater than the thickness of the first inorganic layer, and the thickness of the second inorganic layer is the same as the thickness of the first inorganic layer.
  • the thickness of the barrier layer is smaller than the thickness of the organic layer, and the thickness of the barrier layer is greater than the thickness of the first inorganic layer.
  • the organic layer is formed on the first inorganic layer by an inkjet printing process.
  • the organic ink used in the inkjet printing process is composed of the following components: enoate organics, enoic organics, and photopolymerization initiators.
  • the present application also provides an OLED display device including a flexible substrate, a TFT layer on the flexible substrate, an OLED light-emitting layer on the TFT layer, a barrier layer on the TFT layer, and an encapsulation layer;
  • the encapsulation layer covers the barrier layer, a portion of the encapsulation layer located outside the barrier layer includes a first inorganic layer and a second inorganic layer, and a portion of the first inorganic layer located on a surface of the barrier layer.
  • a protective layer is provided, and the protective layer completely covers the barrier layer.
  • the material of the protective layer is simple silicon.
  • the material of the first inorganic layer is one or more of silicon nitride, silicon dioxide, aluminum oxide, titanium dioxide, and zirconium dioxide, or any two or more of them. combination.
  • a material of the second inorganic layer is the same as a material of the first inorganic layer.
  • a portion of the encapsulation layer located inside the barrier layer includes the first inorganic layer, the organic layer, and the second inorganic layer which are disposed in a stack.
  • the thickness of the organic layer is greater than the thickness of the first inorganic layer, and the thickness of the second inorganic layer is the same as the thickness of the first inorganic layer.
  • the thickness of the barrier layer is smaller than the thickness of the organic layer, and the thickness of the barrier layer is greater than the thickness of the first inorganic layer.
  • the organic layer is formed on the first inorganic layer by an inkjet printing process.
  • the organic ink used in the inkjet printing process is composed of the following components: enoate organics, enoic organics, and photopolymerization initiators.
  • the beneficial effect of the present application is that the OLED display device provided in the present application adds a protective layer on the packaging organic layer barrier layer to isolate the organic layer inside the barrier layer from the organic layer overflowing from the barrier layer, thereby effectively avoiding external water Oxygen enters the OLED display device through the overflowing organic layer, which reduces the risk of oxidation of the devices inside the OLED display device and further increases the life of the OLED display device.
  • FIG. 1 is a schematic diagram of overflow of an organic layer of a package in a conventional OLED display device.
  • FIG. 2 is a schematic structural diagram of an OLED display device of the present application.
  • This application is directed to the existing OLED display device. Due to the excessive ink jet volume, the organic ink overflows the barrier layer, which causes the organic ink inside and outside of the barrier layer to communicate with each other, which makes the organic layer beyond the coverage of the inorganic layer, and further causes external water and oxygen to overflow the organic
  • this embodiment can solve this defect.
  • FIG. 1 it is a schematic diagram of an organic layer overflow in a conventional OLED display device.
  • the existing OLED display device includes a flexible substrate 10, a TFT layer 20 disposed on the flexible substrate 10, an OLED light emitting layer 30 disposed on the TFT layer 20, and an OLED layer 20 disposed on the TFT layer 20.
  • the barrier layer 40 and the encapsulation layer 50; the encapsulation layer 50 includes a first inorganic layer 51, an organic layer 52, and a second inorganic layer 53 disposed in a stacked manner.
  • the barrier layer 40 When preparing the encapsulation layer 50, due to the sealing characteristics of the first inorganic layer 51 and the second inorganic layer 53, and the stress characteristics of the second inorganic layer 53, the barrier layer 40 needs to be used to limit the The film formation range of the organic layer 52 is such that the second inorganic layer 53 completely covers the organic layer 52 and prevents external water and oxygen from entering the OLED display device through the organic layer 52 which has poor barrier performance.
  • the organic ink When the ink jet volume of the organic ink used in preparing the organic layer 52 is excessive or too fast, the organic ink overflows the barrier layer 40. Due to the influence of the surface tension of the liquid, The organic inks communicate with each other, which causes the organic layer 52 to exceed the coverage of the first inorganic layer 51, thereby forming an external water and oxygen intrusion channel, which further causes the OLED display device to fail.
  • FIG. 2 is a schematic structural diagram of an OLED display device of the present application, including a flexible substrate 10, a TFT layer 20 on the flexible substrate 10, an OLED light emitting layer 30 on the TFT layer 20, and a TFT layer 20 An upper barrier layer 40 and an encapsulation layer 50;
  • the encapsulation layer 50 covers the barrier layer 40, and a portion of the encapsulation layer 50 located outside the barrier layer 40 includes a first inorganic layer 51 and a second inorganic layer 53, and a portion located on a surface of the barrier layer 40.
  • a protective layer 60 is provided on the first inorganic layer 51, the protective layer 60 completely covers the barrier layer 40, and a portion of the encapsulation layer 50 located inside the barrier layer 40 includes the first inorganic layer 51, The organic layer 52 and the second inorganic layer 53.
  • the preparation method of the OLED display device of the present application is as follows:
  • a clean glass substrate is provided.
  • a flexible substrate 10 is coated on the surface of the glass substrate.
  • the material of the flexible substrate 10 is a polyimide film, and the flexible substrate 10 is a wear-resistant transparent plastic film.
  • a TFT layer 20 is prepared on the flexible substrate 10 through a yellow light process, and the TFT layer 20 is an inorganic film layer; and then an OLED light emitting layer 30 is prepared on the TFT layer 20 by vacuum evaporation.
  • the OLED light-emitting layer 30 includes a blue sub-pixel region light-emitting layer, a green sub-pixel region light-emitting layer, and a red sub-pixel region light-emitting layer.
  • a barrier layer 40 is prepared on the surface of the TFT layer 20.
  • a first inorganic layer 51 is deposited on the OLED light emitting layer 30, and the first inorganic layer 51 covers the barrier layer 40.
  • the material of the first inorganic layer 51 is one or more of silicon nitride, silicon dioxide, aluminum oxide, titanium dioxide, and zirconium dioxide, or a combination of any two or more.
  • the first inorganic layer 51 is For a hydrophilic film, the thickness of the first inorganic layer 51 is preferably 0.1 to 2 micrometers, for example, 1 micrometer.
  • the first inorganic layer 51 is preferably made by a plasma enhanced chemical vapor deposition method or an atomic layer deposition method.
  • the plasma enhanced chemical vapor deposition method uses a microwave or radio frequency to ionize a gas containing atoms of a thin film to form a plasma locally, and the plasma is highly chemically active and easily reacts, thereby depositing a desired on a substrate film.
  • the atomic layer deposition method is a method in which substances can be plated layer by layer on the surface of a substrate in the form of a single atomic film.
  • a protective layer 60 is then deposited on a portion of the first inorganic layer 51 located on the surface of the barrier layer 40.
  • the protective layer 60 completely covers the barrier layer 40.
  • the hydrophobicity of the protective layer 60 is greater than that of the first inorganic layer 51.
  • the material of the protective layer 60 is elemental silicon.
  • the organic layer 52 is deposited on the surface of the first inorganic layer 51.
  • the side wall of the organic layer 52 located at the boundary between the display area and the non-display area is blocked by the blocking layer 40.
  • the blocking layer 40 restricts the flow area of the organic layer 52.
  • the organic layer 52 is formed on the first inorganic layer 51 by an inkjet printing process.
  • the organic ink used in the inkjet printing process is composed of the following components: enoate organics, enoic organics And photopolymerization initiator.
  • the thickness of the organic layer 52 is greater than the thickness of the first inorganic layer 51, and is preferably 1 to 10 micrometers, such as 5 micrometers.
  • the thickness of the barrier layer 40 is smaller than the thickness of the organic layer 52, and the thickness of the barrier layer 40 is greater than the thickness of the first inorganic layer 51, preferably 3 micrometers.
  • the second inorganic layer 53 is then deposited on the surface of the organic layer 52.
  • the second inorganic layer 53 passes over the barrier layer 205 and covers the protective layer 60.
  • the material of the second inorganic layer 53 is the same as the material of the first inorganic layer 51; the thickness of the second inorganic layer 53 is the same as the thickness of the first inorganic layer 51, preferably 0.1 to 2 microns, 1 micron; manufactured by plasma enhanced chemical vapor deposition or atomic layer deposition.
  • a portion of the second inorganic layer 53 located inside the barrier layer 40 covers the organic layer 52, and a portion of the second inorganic layer 53 located outside the barrier layer 40 covers the protective layer 60 and the first An inorganic layer 51, and the second inorganic layer 204 and the first inorganic layer 51 are directly connected in a peripheral area, so that the organic layer 52 is sealed in two inorganic layers, preventing water and oxygen from penetrating into the Organic layer 52.
  • the material of the protective layer 60 has excellent hydrophobicity, which makes the barrier layer 40 inside and outside.
  • the organic inks each shrink and disconnect, thereby effectively avoiding the problem of external water and oxygen entering the OLED display device by overflowing the organic layer 52.
  • the protective layer 60's excellent waterproof performance makes it not Will become a channel of water and oxygen erosion.
  • the beneficial effect of the present application is that the OLED display device provided in the present application adds a protective layer on the packaging organic layer barrier layer to isolate the organic layer inside the barrier layer from the organic layer overflowing from the barrier layer, thereby effectively avoiding external water Oxygen enters the OLED display device through the overflowing organic layer, which reduces the risk of oxidation of the devices inside the OLED display device and further increases the life of the OLED display device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种OLED显示装置，包括柔性衬底、TFT层、OLED发光层、阻挡层以及封装层；其中，所述封装层覆盖所述阻挡层，所述封装层位于所述阻挡层外侧的部分包括第一无机层和第二无机层，位于所述阻挡层表面的部分所述第一无机层上设置有防护层，所述防护层完全覆盖所述阻挡层。

Description

OLED显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种OLED显示装置。
 背景技术
有机发光二极管(Organic light-emitting diodes，OLED)器件因具有自发光、响应速度快、驱动电压低、对比度高、广色域、发光效率高等显著优点而被广泛应用在手机屏幕、电脑显示器等领域。
目前制约OLED器件发展的最大问题是OLED器件的寿命较短，其主要原因是构成OLED器件的电极层和发光层材料对大气中的水汽及氧气非常敏感，受到水氧侵蚀后造成器件性能衰弱。现有技术的薄膜封装通常采用三明治结构，多重有机层无机层相重叠，利用的是无机层的阻绝特性与有机层的应力特性，故需使用阻挡层限制喷墨打印的有机层的成膜范围，以便无机层完全覆盖有机层，防止外界水氧通过阻绝性能较差的有机层侵入OLED器件。但因为有机墨水材料的液体特性，存在着有机材料溢出阻挡层并溢出无机层覆盖范围并使外界水氧沿溢出有机层侵入导致OLED器件失效的风险。
综上所述，现有的OLED显示装置，在进行薄膜封装制程中通过喷墨打印技术制备有机层时，由于喷墨量过多致使有机墨水溢出阻挡层，导致阻挡层内外的有机墨水相互连通，使有机层超出无机层覆盖范围，进一步导致外界水氧沿溢出有机层侵入导致OLED显示装置失效的风险。
 技术问题
现有的OLED显示装置，在进行薄膜封装制程中通过喷墨打印技术制备有机层时喷墨量过多，致使有机墨水溢出阻挡层，导致阻挡层内外的有机墨水相互连通，使有机层超出无机层覆盖范围，进一步导致外界水氧沿溢出有机层侵入导致OLED显示装置失效的风险。
 技术解决方案
本申请提供一种OLED显示装置，能够隔绝阻挡层内有机层与阻挡层外溢出的有机层的联系，以解决现有的OLED显示装置，由于喷墨量过多致使有机墨水溢出阻挡层，导致阻挡层内外的有机墨水相互连通，使有机层超出无机层覆盖范围，进一步导致外界水氧沿溢出有机层侵入导致OLED器件失效的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种OLED显示装置，包括柔性衬底、位于所述柔性衬底上的TFT层、位于所述TFT层上的OLED发光层、位于所述TFT层上的阻挡层以及封装层；其中，所述封装层覆盖所述阻挡层，所述封装层位于所述阻挡层外侧的部分包括第一无机层和第二无机层，位于所述阻挡层表面的部分所述第一无机层上设置有防护层，所述防护层完全覆盖所述阻挡层；所述防护层的疏水性大于所述第一无机层的疏水性。
在本申请实施例所提供的OLED显示装置中，所述防护层的材料为单质硅。
在本申请实施例所提供的OLED显示装置中，所述第一无机层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
在本申请实施例所提供的OLED显示装置中，所述第二无机层的材料与所述第一无机层的材料相同。
在本申请实施例所提供的OLED显示装置中，所述封装层位于所述阻挡层内侧的部分包括层叠设置的所述第一无机层、有机层以及所述第二无机层。
在本申请实施例所提供的OLED显示装置中，所述有机层的厚度大于所述第一无机层的厚度，所述第二无机层的厚度与所述第一无机层的厚度相同。
在本申请实施例所提供的OLED显示装置中，所述阻挡层的厚度小于所述有机层的厚度，所述阻挡层的厚度大于所述第一无机层的厚度。
在本申请实施例所提供的OLED显示装置中，所述有机层通过喷墨打印工艺形成于所述第一无机层上。
在本申请实施例所提供的OLED显示装置中，所述喷墨打印工艺中所使用的有机墨水由如下组分组成：烯酸酯类有机物、烯酸类有机物及光聚合引发剂。
本申请还提供一种OLED显示装置，包括柔性衬底、位于所述柔性衬底上的TFT层、位于所述TFT层上的OLED发光层、位于所述TFT层上的阻挡层以及封装层；其中，所述封装层覆盖所述阻挡层，所述封装层位于所述阻挡层外侧的部分包括第一无机层和第二无机层，位于所述阻挡层表面的部分所述第一无机层上设置有防护层，所述防护层完全覆盖所述阻挡层。
在本申请实施例所提供的OLED显示装置中，所述防护层的材料为单质硅。
在本申请实施例所提供的OLED显示装置中，所述第一无机层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
在本申请实施例所提供的OLED显示装置中，所述第二无机层的材料与所述第一无机层的材料相同。
在本申请实施例所提供的OLED显示装置中，所述封装层位于所述阻挡层内侧的部分包括层叠设置的所述第一无机层、有机层以及所述第二无机层。
在本申请实施例所提供的OLED显示装置中，所述有机层的厚度大于所述第一无机层的厚度，所述第二无机层的厚度与所述第一无机层的厚度相同。
在本申请实施例所提供的OLED显示装置中，所述阻挡层的厚度小于所述有机层的厚度，所述阻挡层的厚度大于所述第一无机层的厚度。
在本申请实施例所提供的OLED显示装置中，所述有机层通过喷墨打印工艺形成于所述第一无机层上。
在本申请实施例所提供的OLED显示装置中，所述喷墨打印工艺中所使用的有机墨水由如下组分组成：烯酸酯类有机物、烯酸类有机物及光聚合引发剂。
 有益效果
本申请的有益效果为：本申请所提供的OLED显示装置，在封装有机层阻挡层上增加一层防护层，使阻挡层内有机层与阻挡层外溢出的有机层隔绝，从而有效避免外界水氧通过溢出的有机层进入OLED显示装置，降低了OLED显示装置内部的器件被氧化的风险，进一步提高了OLED显示装置寿命。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有的OLED显示装置中封装有机层溢出示意图。
图2为本申请OLED显示装置结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有的OLED显示装置，由于喷墨量过多致使有机墨水溢出阻挡层，导致阻挡层内外的有机墨水相互连通，使有机层超出无机层覆盖范围，进一步导致外界水氧沿溢出有机层侵入导致OLED显示装置失效的技术问题，本实施例能够解决该缺陷。
如图1所示，为现有的OLED显示装置中封装有机层溢出示意图。其中，现有的OLED显示装置包括柔性衬底10、设置于所述柔性衬底10上的TFT层20、设置于所述TFT层20上的OLED发光层30、设置于所述TFT层20上的阻挡层40和封装层50；所述封装层50包括层叠设置的第一无机层51、有机层52以及第二无机层53。
在制备所述封装层50时，由于所述第一无机层51和所述第二无机层53的密封特性以及所述第二无机层53的应力特性，需要使用所述阻挡层40限制所述有机层52的成膜范围，以便所述第二无机层53完全覆盖所述有机层52，防止外界水氧通过阻绝性能较差的所述有机层52侵入所述OLED显示装置。
当制备所述有机层52时所使用的有机墨水的喷墨量过多或过快时，所述有机墨水溢出所述阻挡层40，由于液体的表面张力影响，所述阻挡层40的内外的所述有机墨水相互连通，导致所述有机层52超出所述第一无机层51的覆盖范围，从而形成外界水氧侵入通道，进一步致使OLED显示装置失效。
如图2为本申请OLED显示装置结构示意图，包括柔性衬底10、位于所述柔性衬底10上的TFT层20、位于所述TFT层20上的OLED发光层30、位于所述TFT层20上的阻挡层40以及封装层50；
其中，所述封装层50覆盖所述阻挡层40，所述封装层50位于所述阻挡层40外侧的部分包括第一无机层51和第二无机层53，位于所述阻挡层40表面的部分所述第一无机层51上设置有防护层60，所述防护层60完全覆盖所述阻挡层40，所述封装层50位于所述阻挡层40内侧的部分包括所述第一无机层51、有机层52以及所述第二无机层53。
本申请OLED显示装置的制备方法如下：
首先提供一干净的玻璃基板，在所述玻璃基板的表面上涂布柔性衬底10，所述柔性衬底10的材料为聚酰亚胺膜，所述柔性衬底10为耐磨透明塑料薄膜；之后在所述柔性衬底10上通过黄光工艺制备出TFT层20，所述TFT层20为一无机膜层；然后通过真空蒸镀在所述TFT层20上制备OLED发光层30，所述OLED发光层30包括蓝色子像素区域发光层、绿色子像素区域发光层以及红色子像素区域发光层。之后，在所述TFT层20上的表面制备阻挡层40。
然后，在所述OLED发光层30上沉积第一无机层51，所述第一无机层51覆盖所述阻挡层40。其中，所述第一无机层51的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合，所述第一无机层51为亲水性薄膜，所述第一无机层51的厚度优选为0.1~2微米，例如1微米；所述第一无机层51优选采用等离子体增强化学气相沉积法或原子层沉积法工艺制作。其中等离子体增强化学气相沉积法是借助微波或射频等使含有薄膜组成原子的气体电离，在局部形成等离子体，而等离子体化学活性很强，很容易发生反应，从而在基板上沉积出所期望的薄膜。而原子层沉积法是一种可以将物质以单原子膜形式一层一层的镀在基板表面的方法。
在所述OLED发光层30的表面上沉积出第一无机层51后，接着在位于阻挡层40表面的部分所述第一无机层51上沉积一层防护层60。所述防护层60完全覆盖所述阻挡层40，所述防护层60的疏水性大于所述第一无机层51的疏水性，所述防护层60的材料为单质硅。
接着在第一无机层51表面上沉积出所述有机层52。所述有机层52位于显示区域与非显示区域交界的侧壁被所述阻挡层40挡住，所述阻挡层40限制了所述有机层52的流动区域。
所述有机层52是通过喷墨打印工艺形成于所述第一无机层51上，所述喷墨打印工艺中所使用的有机墨水由如下组分组成：烯酸酯类有机物、烯酸类有机物及光聚合引发剂。所述有机层52的厚度大于所述第一无机层51的厚度，优选为1~10微米，例如5微米。
其中，所述阻挡层40的厚度小于所述有机层52的厚度，所述阻挡层40的厚度大于所述第一无机层51的厚度，优选为3微米。
在所述第一无机层51上沉积出所述有机层52后，接着在所述有机层52的表面上沉积所述第二无机层53。所述第二无机层53越过所述阻挡层205并覆盖所述防护层60。
所述第二无机层53的材料与所述第一无机层51的材料相同；所述第二无机层53的厚度与所述第一无机层51的厚度相同，优选为0.1~2微米，例如1微米；采用等离子体增强化学气相沉积法或原子层沉积法工艺制作。位于所述阻挡层40内侧的部分所述第二无机层53覆盖所述有机层52，位于所述阻挡层40外侧的部分所述第二无机层53覆盖所述防护层60以及所述第一无机层51，且所述第二无机层204与所述第一无机层51在周边区域直接相连，从而将所述有机层52密封于两层无机层内，防止水氧从周边区域渗入所述有机层52。
本申请通过在所述阻挡层40上增加所述防护层60，当所述有机墨水溢出所述阻挡层40时，因为所述防护层60所用材质优异的疏水性，使所述阻挡层40内外的所述有机墨水各自收缩并断开联系，从而有效避免外界水氧通过溢出所述有机层52进入所述OLED显示装置的问题，同时，所述防护层60本身优秀的防水性能使其本身不会成为水氧侵蚀通道。
本申请的有益效果为：本申请所提供的OLED显示装置，在封装有机层阻挡层上增加一层防护层，使阻挡层内有机层与阻挡层外溢出的有机层隔绝，从而有效避免外界水氧通过溢出的有机层进入OLED显示装置，降低了OLED显示装置内部的器件被氧化的风险，进一步提高了OLED显示装置寿命。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种OLED显示装置，其中，包括：
    柔性衬底；
    TFT层，位于所述柔性衬底上；
    OLED发光层，位于所述TFT层上；
    阻挡层，位于所述TFT层上；
    封装层，所述封装层覆盖所述阻挡层，所述封装层位于所述阻挡层外侧的部分包括第一无机层和第二无机层；
    其中，位于所述阻挡层表面的部分所述第一无机层上设置有防护层，所述防护层完全覆盖所述阻挡层；所述防护层的疏水性大于所述第一无机层的疏水性。
  2. 根据权利要求1所述的OLED显示装置，其中，所述防护层的材料为单质硅。
  3. 根据权利要求1所述的OLED显示装置，其中，所述第一无机层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
  4. 根据权利要求3所述的OLED显示装置，其中，所述第二无机层的材料与所述第一无机层的材料相同。
  5. 根据权利要求1所述的OLED显示装置，其中，所述封装层位于所述阻挡层内侧的部分包括层叠设置的所述第一无机层、有机层以及所述第二无机层。
  6. 根据权利要求5所述的OLED显示装置，其中，所述有机层的厚度大于所述第一无机层的厚度，所述第二无机层的厚度与所述第一无机层的厚度相同。
  7. 根据权利要求5所述的OLED显示装置，其中，所述阻挡层的厚度小于所述有机层的厚度，所述阻挡层的厚度大于所述第一无机层的厚度。
  8. 根据权利要求5所述的OLED显示装置，其中，所述有机层通过喷墨打印工艺形成于所述第一无机层上。
  9. 根据权利要求8所述的OLED显示装置，其中，所述喷墨打印工艺中所使用的有机墨水由如下组分组成：烯酸酯类有机物、烯酸类有机物及光聚合引发剂。
  10. 一种OLED显示装置，其中，包括：
    柔性衬底；
    TFT层，位于所述柔性衬底上；
    OLED发光层，位于所述TFT层上；
    阻挡层，位于所述TFT层上；
    封装层，所述封装层覆盖所述阻挡层，所述封装层位于所述阻挡层外侧的部分包括第一无机层和第二无机层；
    其中，位于所述阻挡层表面的部分所述第一无机层上设置有防护层，所述防护层完全覆盖所述阻挡层。
  11. 根据权利要求10所述的OLED显示装置，其中，所述防护层的材料为单质硅。
  12. 根据权利要求10所述的OLED显示装置，其中，所述第一无机层的材料为氮化硅、二氧化硅、三氧化二铝、二氧化钛以及二氧化锆等以上一种或任意二种以上的组合。
  13. 根据权利要求12所述的OLED显示装置，其中，所述第二无机层的材料与所述第一无机层的材料相同。
  14. 根据权利要求10所述的OLED显示装置，其中，所述封装层位于所述阻挡层内侧的部分包括层叠设置的所述第一无机层、有机层以及所述第二无机层。
  15. 根据权利要求14所述的OLED显示装置，其中，所述有机层的厚度大于所述第一无机层的厚度，所述第二无机层的厚度与所述第一无机层的厚度相同。
  16. 根据权利要求14所述的OLED显示装置，其中，所述阻挡层的厚度小于所述有机层的厚度，所述阻挡层的厚度大于所述第一无机层的厚度。
  17. 根据权利要求14所述的OLED显示装置，其中，所述有机层通过喷墨打印工艺形成于所述第一无机层上。
  18. 根据权利要求17所述的OLED显示装置，其中，所述喷墨打印工艺中所使用的有机墨水由如下组分组成：烯酸酯类有机物、烯酸类有机物及光聚合引发剂。
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