WO2020052051A1 - Integrated clamp and welding method for 5g sfp encapsulation type optical transceiver module welding - Google Patents

Integrated clamp and welding method for 5g sfp encapsulation type optical transceiver module welding Download PDF

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Publication number
WO2020052051A1
WO2020052051A1 PCT/CN2018/115502 CN2018115502W WO2020052051A1 WO 2020052051 A1 WO2020052051 A1 WO 2020052051A1 CN 2018115502 W CN2018115502 W CN 2018115502W WO 2020052051 A1 WO2020052051 A1 WO 2020052051A1
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WO
WIPO (PCT)
Prior art keywords
welding
soldering
optical transceiver
transceiver module
board
Prior art date
Application number
PCT/CN2018/115502
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French (fr)
Chinese (zh)
Inventor
赵关宝
施伟明
徐虎
孙权
吴贝佳
Original Assignee
江苏亨通光网科技有限公司
江苏亨通光电股份有限公司
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Application filed by 江苏亨通光网科技有限公司, 江苏亨通光电股份有限公司 filed Critical 江苏亨通光网科技有限公司
Publication of WO2020052051A1 publication Critical patent/WO2020052051A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/087Soldering or brazing jigs, fixtures or clamping means

Definitions

  • the present invention relates to the technical field of optical device manufacturing, and in particular to an integrated fixture for welding a 5G SFP package-type optical transceiver module.
  • the present invention also provides a welding method using the fixture for welding.
  • the rate will reach 10-100 times that of 4G networks.
  • base stations must use optical modules to achieve service functions, so the demand for optical modules in 5G will be far. More than 4G demand for optical modules.
  • the core components in 5G base stations and 5G transmission equipment are 8G and 100G SFP packaged optical modules.
  • the main packaging form of common 5G optical transceiver modules is SFP. This type of packaging covers multiple scenarios from multi-mode to single-mode, from dual-fiber bidirectional to single-fiber bidirectional.
  • pin header and OSA are separately welded from PCBA, low yield, difficult to repair, easy to damage the optical module, even scrapped, workers are not good on the base when clamping PCBA, welding Pass rate is low.
  • the present invention provides an integrated fixture for welding of 5G SFP packaged optical transceiver modules, which improves the production qualification rate of 5G SFP packaged optical transceiver modules by more than 10%, and reduces the production cycle by 90%.
  • the above makes the welding operation convenient, the welding performance is reliable, and the fixture processing is simple and convenient.
  • An integrated fixture for welding a 5G SFP package-type optical transceiver module is characterized in that it includes a working base, and a soft board welding part and an optical device welding part are respectively arranged on the working base.
  • the soft board welding part is used for pre-fixing and pre-welding the PCB circuit board and the PCB soft board
  • the optical device welding part is a semi-finished device completed by the soft board welding part, light
  • the device is soldered into a complete 5G SFP packaged optical transceiver module device.
  • the working base is made of aluminum alloy material, which can make the device and the ground conduct;
  • the soft plate welding part specifically includes a welding operation table and a welding combination jig, and the welding combination jig specifically includes a pair of reversible pressure plates, and the welding operation table is located on the front end of the work base in the longitudinal direction.
  • an inner recessed hole is provided in the center of the welding operation table, the inner recessed hole is communicated to the front end surface of the working base, and an elevating support seat is provided in the inner recessed hole.
  • a pressure plate is provided on each side of the end position, and the convex end of the first double spring is fixedly connected to the length central area of each pressure plate.
  • the bottom of the first double spring is provided with a tightness adjusting device.
  • the lower end surface of the inner end in the length direction of the pressure plate presses the PCB circuit board and the PCB flexible board to be welded, and a sliding long groove is formed between the two sides of the lifting support base and the side wall of the recessed hole.
  • the width distance is a fixed value, which allows components to be welded of different lengths and heights to be placed on the welding operation table for welding;
  • the welding operation table can perform single-sided welding or double-sided welding
  • a second double spring perpendicular to the upper end surface of the lifting support base is respectively provided around the lifting support base, and corresponding tightness adjusting devices are respectively provided at the bottoms of the four second double springs, which are located at the same position.
  • the input end of the tightness adjustment device on the side is set by a connecting shaft transmission, the connecting shafts on both sides are connected to the input gear through an intermediate transmission gear, the output gear is sleeved on a retractable input shaft, and the inner end of the input shaft
  • An axial spring is provided, and a portion of the front surface of the input shaft exposed on the working base is provided with a radial side protrusion, and the radial side protrusion is clamped in a large-diameter card groove of a circumferential ring cloth in a locked state.
  • each second double spring can be accurately obtained according to the position of the radial side convex card installed in the large-diameter card slot, to ensure that the tightness is adjusted in time, and the reasonable force of the components to be welded is ensured;
  • the input shaft is pressed so that the radial side projection is retracted under the action of the axial spring, and then the input shaft is rotated to align the radial side projection with the large diameter to be set.
  • the welding part of the optical device includes a welding abutment located at a rear end in the length direction of the working abutment, the welding abutment is provided with at least one set of recessed positioning holes of a corresponding model, and the center of the welding abutment
  • An upper bump is provided, and support rods are respectively fixed on both sides of the welding abutment, and the length direction of each support rod is arranged in parallel along the length direction of the working abutment, and the cross section of each support rod is It is a right-angled triangle structure in which the right-angled sides of the two support rods are arranged on the upper end face, and the oblique sides of the two support rods are arranged opposite to each other, so that the surfaces of the two support rods and the welding abutment are formed.
  • a guide groove closed from the bottom up, which ensures that the position of the device is accurate and reliable;
  • the welding base is provided with two sets of recessed positioning holes of corresponding models to ensure the universality of the two signal products;
  • the lower end of the front part of the working abutment is provided with a plug-in slot structure, which can be used for convenient plug-in and pull-out inside the automatic welding equipment, realizes the automation of welding overturning, and reduces the impact of welding quality originally caused by overturning .
  • a welding method for welding a 5G SFP package-type optical transceiver module which is characterized in that: a PCB circuit board and a PCB flexible board are pre-fixed and pre-welded at a flexible board welding part, and then the flexible board is The semi-finished components and optical components completed in the welding part are welded into the complete 5G SFP packaged optical transceiver module device.
  • the receiving component and the transmitting component are respectively installed in a flexible board, and the flexible board has a wiring surface facing upward for component welding.
  • a welding integrated fixture for a 5G SFP package type optical transceiver module is welded using a single piece of plate with high hardness, light weight and high electrical conductivity, and the clamping provided on the work base
  • the mechanism is used in conjunction with the welding operation table on which the weldment is placed; it is integrated with the welding part of the flexible board and the welding part of the optical device, and combined with the insertion slot can be used for convenient insertion and extraction inside the automatic welding equipment, and realizes the automation of welding flip. It reduces the impact of welding quality caused by overturning, simplifies the operation of workers, requires very little manual operation, requires less skilled workers and operating technology, guarantees the quality of welding products, and improves welding efficiency And the degree of automation.
  • another feature of the present invention is that it can protect the 5G SFP package type optical devices from damage caused by electrostatic problems to the greatest extent.
  • the light-emitting integrated sub-module of the present invention has a compact structure and integrated molding, which can effectively reduce manufacturing costs.
  • using this integrated welding method shortens the welding time, only needs one tenth of the conventional test time, and improves the welding efficiency.
  • the invention improves the quality and reliability of the 5G SFP package type optical transceiver module.
  • Great effect shortened the product launch cycle;
  • it increased the production qualification rate of 5 G SFP package optical transceiver modules by more than 10%, and the production cycle was reduced by more than 90%.
  • the welding operation is convenient, the welding performance is reliable, and the fixture processing is simple and convenient.
  • FIG. 1 is a schematic perspective structural view of an integrated fixture according to the present invention
  • An integrated fixture for welding a 5G SFP package-type optical transceiver module as shown in FIG. 1: It includes a working base 1, a flexible board welding part 2 and an optical device welding part 3 are respectively arranged on the working base The upper positions of the two ends of the stage 1 in the length direction.
  • the flexible board welding part 2 is used for pre-fixing and pre-welding the PCB circuit board and the flexible PCB.
  • the optical device welding part 3 is a semi-finished device and an optical device completed by the flexible board welding part 2. Welding becomes a complete 5G SFP package type optical transceiver module device.
  • the working base 1 is made of aluminum alloy material, which can make the device and the ground conduct;
  • the soft plate welding part 2 specifically includes a welding operation table 4, a welding combination jig, and the welding combination jig specifically includes a pair of reversible pressure plates 5,
  • the welding operation table 5 is located at the upper end surface of the longitudinal front end of the work base 1,
  • the center of the operation table 4 is provided with a recessed hole 6 which is communicated to the front end surface of the working base 1.
  • the recessed hole 6 is provided with a lifting support 7 and both sides of the rear end position of the recessed hole 6
  • a pressing plate 5 is respectively provided, and the convex end of the first double spring 8 is fixedly connected to the central area of the length of each pressing plate 5.
  • the bottom of the first double spring 8 is provided with an elasticity adjusting device 9 (belonging to the existing mature structure, Only shown in the figure), the lower end surfaces of the inner ends in the length direction of the two pressing plates 5 are pressed with the PCB circuit board and the flexible PCB to be welded, and a sliding long groove is formed between the two sides of the lifting support base 7 and the side wall of the recessed hole 6. 10.
  • the width distance of the inner recessed hole 6 is a fixed value, which allows components to be welded of different lengths and heights to be placed on the welding operation table for welding;
  • the pressure plate 5 is pressed and opened by the lever principle, which respectively drives the inner and outer ends of the length of the pressure plate 5 to complete the pressure plate attachment and opening action; [0039]
  • the welding operation table 4 can perform single-sided welding or double-sided welding;
  • second double springs 11 perpendicular to the upper end surface of the lifting support base 7 are respectively provided, and the bottoms of the four second double springs 11 are respectively provided with corresponding tightness adjusting devices (not shown in the figure).
  • the input ends of the tightness adjustment devices on the same side are set through the connecting shaft 12 and the connecting shafts 12 on both sides are connected to the input gear through intermediate transmission gears (the mechanical transmission is a mature transmission technology, not shown in the figure)
  • the output gear is sleeved on the retractable input shaft 13.
  • the inner end of the input shaft 13 is provided with an axial spring.
  • the front surface of the input shaft 13 exposed on the working base is provided with radial side protrusions 131.
  • the side convex 131 is clamped in the large-diameter card slot 14 of the circumferential ring cloth. According to the position of the radial side convex 131 is snapped in the large-diameter card slot 14, the tightness of each second double spring 11 can be accurately obtained to ensure timely Adjust the tightness to ensure the reasonable stress of the components to be welded;
  • the input shaft 13 is pressed so that the radial side projection 131 is retracted under the action of the axial spring, and then the input shaft 13 is rotated to align the radial side projection 131 as required.
  • the large-diameter card slot 14 is set, and then the input shaft 13 is loosened, so that the radial side of the input shaft 131 is convex in the large-diameter card slot 14 corresponding to the axial spring;
  • the optical device welding portion 3 includes a welding base 15 located at the rear end in the length direction of the work base 1.
  • the welding base 15 is provided with at least one set of recessed positioning holes of a corresponding model, and the center of the welding base 15 is provided with an upper
  • the bumps 16 and the support base 15 are respectively fixed with support rods 17 on both sides, and the length direction of each support rod 17 is arranged in parallel along the length direction of the work base 15.
  • the cross section of each support rod 17 is a right triangle In the structure, one of the two supporting rods 17 is arranged at the upper end side, and the oblique sides of the two supporting rods 17 are arranged opposite to each other, so that the surfaces of the two supporting rods 17 and the welding base 15 form a bottom-up guide.
  • the slot 18 and the guide slot 18 ensure that the position of the device is accurate and reliable.
  • T046 holes 19 and T056 holes 20 are for optical transmission and reception for 5G SFP package types.
  • the device size is customized, which ensures the universality of the integrated fixture for the two types of products;
  • the lower end of the front part of the work base 1 is provided with a plug slot structure 21, which can be used for convenient plugging inside the automatic welding equipment, realizes the automation of welding flip, and reduces the impact of the welding quality originally caused by the flip. .
  • a soldering method for soldering a 5G SFP packaged optical transceiver module First, a PCB circuit board and a PCB The flexible board is pre-fixed and pre-welded in the flexible board welding part, and then the semi-finished device and optical device completed in the flexible board welding part are welded in the optical device welding part to become a complete 5G SFP packaged optical transceiver module device
  • the receiving component and the transmitting component are respectively mounted on a flexible board, and the flexible board has a wiring surface facing upward for component welding.
  • the time, direction and speed of removing the soldering iron head determines the quality of the welding point.
  • the correct method is to slow down and then fast. Remove the soldering iron head and move it in a 45 ° angle direction to clean the soldering iron head in time. ;
  • solder joint has a special gloss and good color; there should be no obvious defects such as unevenness, lightness and darkness in gloss, height and color. There should be no sharp points, lack of tin, or bead dirt on the solder joints. Welding requires one-time forming without warping or falling off.
  • the present invention patent is an integrated combination of a flexible board welding part and an optical device welding part, and combined with the insertion slot 15 can be used for convenient insertion and removal inside the automatic welding equipment, realizing the automation of welding flipping, and reducing the original caused by flipping.
  • the impact of welding quality simplifies the operation of workers, requires very little manual operation, requires less proficiency of workers and operating technology, guarantees the quality of welding products, improves welding efficiency and automation.
  • another feature of the present invention is that it can protect the 5G SFP package type optical device from damage caused by electrostatic problems to the greatest extent.
  • the light emitting integrated sub-module of the present invention has a compact structure and integrated molding, which can effectively reduce manufacturing costs.
  • this integrated welding method is used to shorten the welding time (only one tenth of the conventional test time) and improve the welding efficiency.
  • the invention improves the quality and reliability of the 5G SFP package type optical transceiver module. To a great effect, shorten the cycle of product launch.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

An integrated clamp for 5G SFP encapsulation type optical transceiver module welding, comprising a working table (1). A flexible board welding part (2) and an optical device welding part (3) are respectively disposed at the upper end positions of two ends in the length direction of the working table (1); the flexible board welding part (2) is used for pre-fixing and pre-welding a PCB and a flexible PCB; the optical device welding part (3) welds the semi-finished device and optical device completed by the flexible board welding part (2) into a complete 5G SFP encapsulation type optical transceiver module device. The clamp enables the production qualification rate of a 5G SFP encapsulation type optical transceiver module to be increased by 10% or more and the production cycle to be shortened by 90% or more, so that the welding operation is easy, the welding performance is reliable, and clamp processing is simple and easy.

Description

用于 5G SFP封装类光收发模块焊接的一体化夹具及焊接 方法  Integrated fixture and method for welding 5G SFP package optical transceiver module
技术领域  Technical field
[0001] 本发明涉及光器件制造的技术领域, 具体为一种用于 5G SFP封装类光收发模块 焊接的一体化夹具, 本发明还提供了使用该夹具进行焊接的焊接方法。  [0001] The present invention relates to the technical field of optical device manufacturing, and in particular to an integrated fixture for welding a 5G SFP package-type optical transceiver module. The present invention also provides a welding method using the fixture for welding.
背景技术  Background technique
[0002] 就目前 5G的规划来看, 速率会达到 4G网络的 10— 100倍, 在这种速率下, 基站 是必须采用光模块才能达到服务功能, 所以 5G对光模块的需求量将会远超过 4G 对光模块的需求量。 在 5G基站和 5G传输设备中的核心部件是 8G以及 100G SFP封 装类型光模块。 根据工信部数据, 全球 5G光模块市场规模总量达到 2000亿美元 。 常见的 5G光收发模块主要封装形式有为 SFP, 这种封装类型涵盖了从多模到单 模, 从双纤双向到单纤双向多个场景, 随着技术的进一步发展以及降成本和效 率的提高, 5见有 4G光收发模块的生产工艺: 排针和 OSA与 PCBA分开焊接、 良品率低、 返修困难易损坏光模块、 甚至报废、 工人装夹 PCBA时在底座上不 好装夹、 焊接合格率低。  [0002] According to the current 5G planning, the rate will reach 10-100 times that of 4G networks. At this rate, base stations must use optical modules to achieve service functions, so the demand for optical modules in 5G will be far. More than 4G demand for optical modules. The core components in 5G base stations and 5G transmission equipment are 8G and 100G SFP packaged optical modules. According to data from the Ministry of Industry and Information Technology, the total global 5G optical module market size has reached 200 billion US dollars. The main packaging form of common 5G optical transceiver modules is SFP. This type of packaging covers multiple scenarios from multi-mode to single-mode, from dual-fiber bidirectional to single-fiber bidirectional. With the further development of technology and the reduction of cost and efficiency, Improved, see the production process of 4G optical transceiver module: pin header and OSA are separately welded from PCBA, low yield, difficult to repair, easy to damage the optical module, even scrapped, workers are not good on the base when clamping PCBA, welding Pass rate is low.
[0003] 随着 5G技术的发展, 要求光模块的速度越来越高,成本越来越低, 灵敏度越来 越高。 然而满足这些特性的 5G光收发模块生产焊接与数量存在严重矛盾, 尤其 是大规模加工问题一直是 5G光收发模块高速率、 低成本产能的瓶颈。  [0003] With the development of 5G technology, the speed of optical modules is required to be higher and higher, the cost is lower and lower, and the sensitivity is getting higher and higher. However, there is a serious contradiction between the production welding and the quantity of 5G optical transceiver modules that meet these characteristics, especially the large-scale processing problem has been the bottleneck of high-speed, low-cost production capacity of 5G optical transceiver modules.
发明概述  Summary of invention
技术问题  technical problem
问题的解决方案  Problem solution
技术解决方案  Technical solutions
[0004] 针对上述问题, 本发明提供了一种用于 5G SFP封装类光收发模块焊接的一体化 夹具, 其使得 5G SFP封装类型光收发模块生产合格率提升 10%以上, 生产周期 缩减 90%以上, 使得焊接操作方便, 焊接性能可靠, 且夹具加工简单方便。 [0005] 一种用于 5G SFP封装类光收发模块焊接的一体化夹具, 其特征在于: 其包括一 工作基台, 一软板焊接部分与一光器件焊接部分分别布置于所述工作基台的长 度方向两端的上端位置, 所述软板焊接部分用于对 PCB电路板和 PCB软板进行预 固定和预焊接, 所述光器件焊接部分将所述软板焊接部分完成的半成品器件、 光器件焊接成为完整的 5G SFP封装类光收发模块器件。 [0004] In view of the above problems, the present invention provides an integrated fixture for welding of 5G SFP packaged optical transceiver modules, which improves the production qualification rate of 5G SFP packaged optical transceiver modules by more than 10%, and reduces the production cycle by 90%. The above makes the welding operation convenient, the welding performance is reliable, and the fixture processing is simple and convenient. [0005] An integrated fixture for welding a 5G SFP package-type optical transceiver module is characterized in that it includes a working base, and a soft board welding part and an optical device welding part are respectively arranged on the working base. At the upper ends of the two ends in the length direction, the soft board welding part is used for pre-fixing and pre-welding the PCB circuit board and the PCB soft board, and the optical device welding part is a semi-finished device completed by the soft board welding part, light The device is soldered into a complete 5G SFP packaged optical transceiver module device.
[0006] 其进一步特征在于: 所述工作基台为铝合金材质制作而成, 其可以使得器件和 地面进行导通;  [0006] It is further characterized in that: the working base is made of aluminum alloy material, which can make the device and the ground conduct;
[0007] 所述软板焊接部分具体包括焊接操作台、 焊接组合夹具, 所述焊接组合夹具具 体包括一对可翻转的压板, 所述焊接操作台位于所述工作基台的长度方向前端 的上端面, 所述焊接操作台的中心设置有内凹孔, 所述内凹孔连通至所述工作 基台的前端面, 所述内凹孔内设置有升降支承座, 所述内凹孔的后端位置的两 侧分别设置有一块压板, 每块压板的长度中心区域分别固接有第一双弹簧的外 凸端, 所述第一双弹簧的底部设置有松紧度调节装置, 两块所述压板的长度方 向内端的下端面压附待焊接的 PCB电路板和 PCB软板, 所述升降支承座的两侧和 所述内凹孔的侧壁间形成滑动长槽, 所述内凹孔的宽度距离为定值, 其使得不 同长度和高度的待焊接组件均可被放置于该焊接操作台上进行焊接;  [0007] The soft plate welding part specifically includes a welding operation table and a welding combination jig, and the welding combination jig specifically includes a pair of reversible pressure plates, and the welding operation table is located on the front end of the work base in the longitudinal direction. On the end face, an inner recessed hole is provided in the center of the welding operation table, the inner recessed hole is communicated to the front end surface of the working base, and an elevating support seat is provided in the inner recessed hole. A pressure plate is provided on each side of the end position, and the convex end of the first double spring is fixedly connected to the length central area of each pressure plate. The bottom of the first double spring is provided with a tightness adjusting device. The lower end surface of the inner end in the length direction of the pressure plate presses the PCB circuit board and the PCB flexible board to be welded, and a sliding long groove is formed between the two sides of the lifting support base and the side wall of the recessed hole. The width distance is a fixed value, which allows components to be welded of different lengths and heights to be placed on the welding operation table for welding;
[0008] 所述焊接操作台可进行单面焊接或双面焊接;  [0008] The welding operation table can perform single-sided welding or double-sided welding;
[0009] 所述升降支承座四周分别设置有垂直于所述升降支承座的上端面的第二双弹簧 , 四个所述第二双弹簧的底部分别设置有对应的松紧度调节装置, 位于同一侧 的所述松紧度调节装置的输入端通过连接轴传动设置, 两侧的连接轴分别通过 中间传动齿轮连接输入齿轮, 所述输出齿轮套装于可伸缩的输入转轴, 所述输 入转轴的内端设置有轴向弹簧, 所述输入转轴的外露于所述工作基台的前端面 部分设置有径向侧凸, 锁位状态下所述径向侧凸卡装于圆周环布的大径卡槽内 , 根据径向侧凸卡装于大径卡槽的位置可精确获得每根第二双弹簧的松紧度, 确保及时调整松紧度, 保证待焊接组件的合理受力;  [0009] A second double spring perpendicular to the upper end surface of the lifting support base is respectively provided around the lifting support base, and corresponding tightness adjusting devices are respectively provided at the bottoms of the four second double springs, which are located at the same position. The input end of the tightness adjustment device on the side is set by a connecting shaft transmission, the connecting shafts on both sides are connected to the input gear through an intermediate transmission gear, the output gear is sleeved on a retractable input shaft, and the inner end of the input shaft An axial spring is provided, and a portion of the front surface of the input shaft exposed on the working base is provided with a radial side protrusion, and the radial side protrusion is clamped in a large-diameter card groove of a circumferential ring cloth in a locked state. Inside, the tightness of each second double spring can be accurately obtained according to the position of the radial side convex card installed in the large-diameter card slot, to ensure that the tightness is adjusted in time, and the reasonable force of the components to be welded is ensured;
[0010] 需要调整第二双弹簧的松紧度时、 按压输入转轴, 使得径向侧凸在轴向弹簧的 作用下内缩, 之后转动输入转轴使得径向侧凸对准需要设定的大径卡槽, 之后 松开输入转轴, 使得输入转轴的径向侧凸在轴向弹簧的作用下卡装于对应位置 的大径卡槽内即可; [0010] When it is necessary to adjust the tightness of the second double spring, the input shaft is pressed so that the radial side projection is retracted under the action of the axial spring, and then the input shaft is rotated to align the radial side projection with the large diameter to be set. The slot, and then loosen the input shaft, so that the radial side of the input shaft is clamped in the corresponding position under the action of the axial spring Just inside the large diameter card slot;
[0011] 所述光器件焊接部分包括位于所述工作基台长度方向后端的焊接基台, 所述焊 接基台上设置有至少一组对应型号的下凹定位孔, 所述焊接基台的中心设置有 上凸块, 所述焊接基台的两侧分别固装有支撑杆, 每根所述支撑杆的长度方向 沿着所述工作基台的长度方向平行布置, 每根支撑杆的横截面为直角三角形结 构, 两根所述支撑杆的其中一直角边位于上端面布置, 两个所述支撑杆的斜边 分别相向布置, 使得两个所述支撑杆和所述焊接基台的表面形成自下而上收口 的导向槽, 所述导向槽确保器件的位置准确可靠;  [0011] The welding part of the optical device includes a welding abutment located at a rear end in the length direction of the working abutment, the welding abutment is provided with at least one set of recessed positioning holes of a corresponding model, and the center of the welding abutment An upper bump is provided, and support rods are respectively fixed on both sides of the welding abutment, and the length direction of each support rod is arranged in parallel along the length direction of the working abutment, and the cross section of each support rod is It is a right-angled triangle structure in which the right-angled sides of the two support rods are arranged on the upper end face, and the oblique sides of the two support rods are arranged opposite to each other, so that the surfaces of the two support rods and the welding abutment are formed. A guide groove closed from the bottom up, which ensures that the position of the device is accurate and reliable;
[0012] 优选地, 所述焊接基台上设置有两组对应型号的下凹定位孔, 确保对两种信号 产品的通用性;  [0012] Preferably, the welding base is provided with two sets of recessed positioning holes of corresponding models to ensure the universality of the two signal products;
[0013] 所述工作基台的前部的下端设置为插拔槽结构, 其可用于自动化焊接设备内部 进行便捷插拔, 实现了焊接翻转的自动化, 降低了原来由于翻转导致的焊接质 量的影响。  [0013] The lower end of the front part of the working abutment is provided with a plug-in slot structure, which can be used for convenient plug-in and pull-out inside the automatic welding equipment, realizes the automation of welding overturning, and reduces the impact of welding quality originally caused by overturning .
[0014] 一种用于 5G SFP封装类光收发模块焊接的焊接方法, 其特征在于: 首先将 PCB 电路板和 PCB软板在软板焊接部分进行预固定和预焊接, 之后将所述软板焊接部 分完成的半成品器件、 光器件在光器件焊接部分焊接成为完整的 5G SFP封装类 光收发模块器件。  [0014] A welding method for welding a 5G SFP package-type optical transceiver module, which is characterized in that: a PCB circuit board and a PCB flexible board are pre-fixed and pre-welded at a flexible board welding part, and then the flexible board is The semi-finished components and optical components completed in the welding part are welded into the complete 5G SFP packaged optical transceiver module device.
[0015] 其进一步特征在于:  [0015] It is further characterized by:
[0016] 通过手工将软板焊接的具体步骤如下:  [0016] The specific steps of welding the flexible board by hand are as follows:
[0017] 1、 戴上防静电手链, 将手链插入到工作台的接地点, 使手链与工作台的地相 连;  [0017] 1. Wear an anti-static bracelet, insert the bracelet into the ground point of the workbench, so that the bracelet is connected to the ground of the workbench;
[0018] 2、 打开电烙铁, 检查烙铁是否正常。 在烙铁正常工作的情况下调节电烙铁温 度到 360±20°C, 并清洁电烙铁头;  [0018] 2. Open the electric soldering iron and check whether the soldering iron is normal. When the soldering iron is working normally, adjust the temperature of the soldering iron to 360 ± 20 ° C, and clean the tip of the soldering iron;
[0019] 3、 将软板装配到对应型号的 PCB板上后, 将管脚剪到 2-6mm, 用镊子将软板 压到底, 之后加锡焊接;  [0019] 3. After assembling the flexible board to the PCB of the corresponding model, cut the pins to 2-6mm, press the flexible board to the end with tweezers, and then solder with tin;
[0020] 4、 焊接过程中要求焊点需要饱满且无拔尖, 无虚焊;  [0020] 4, the welding process requires full solder joints without tipping, no virtual welding;
[0021] 5、 目检模块焊点有无虚焊、 漏焊、 短路、 拔尖, 检查管脚顺序是否焊错, 在 确保无错的状态下转入下一道工序。 [0022] 通过光器件焊接部分焊接成产品的具体步骤如下: [0021] 5. Visually inspect the solder joints of the module for false soldering, missing soldering, short circuit, and tipping, check whether the order of the pins is wrong, and move to the next process under the condition of ensuring no errors. [0022] The specific steps of welding the product by welding the optical device are as follows:
[0023] 1、 将接收组件软板和发射组件软板分别焊接在 PCB后, 全铜板面朝上, 有布 线面朝下布置;  [0023] 1. After the soft board of the receiving module and the soft board of the transmitting module are respectively welded to the PCB, the all-copper board faces upward and the wiring plane faces downward;
[0024] 2、 将接收组件和发射组件分别装入软板上, 软板有布线面朝上进行组件焊接  [0024] 2. The receiving component and the transmitting component are respectively installed in a flexible board, and the flexible board has a wiring surface facing upward for component welding.
[0025] 3、 操作者按接插原则: 先小后大、 先轻后重、 先低后高、 先里后外将元器插 入 PCB板相应的焊盘孔内, 将 PCB板放入托盘转入焊接工序; [0025] 3. Operators follow the plug-in principle: first small, then large, light first, then heavy, low first, then high, inside and outside, insert the device into the corresponding pad hole of the PCB board, and place the PCB board in the tray. Transfer to welding process;
[0026] 4、 将烙铁头放在被焊件的焊盘上, 使焊点温度升高;  [0026] 4. Place the soldering iron head on the pad of the part to be soldered to increase the temperature of the solder joint;
[0027] 5、 用焊锡丝接触到焊接处, 熔化适量的焊料, 焊锡丝从烙铁头侧面加入; [0027] 5. Use a solder wire to contact the welding place, melt an appropriate amount of solder, and add the solder wire from the side of the soldering iron head;
[0028] 6、 从焊锡丝开始熔化数 3秒后, 先移开焊锡丝, 再移开电烙铁; [0028] 6. After several seconds from the beginning of melting of the solder wire, first remove the solder wire, and then remove the electric soldering iron;
[0029] 7、 焊点冷却后, 用斜口钳子将元器件的管脚剪掉, 剪去管脚的长度依结构图 的要求而定。  [0029] 7. After the solder joint is cooled, the pin of the component is cut off with diagonal pliers, and the length of the pin is determined according to the requirements of the structure drawing.
发明的有益效果  The beneficial effects of the invention
有益效果  Beneficial effect
[0030] 采用上述技术方案后, 用于 5G SFP封装类型光收发模块焊接一体化夹具采用一 整块硬度大、 重量轻、 导电率大的板材一次打磨成型, 且工作基台上设置的夹 紧机构, 与放置焊件的焊接操作台配合使用; 其通过软板焊接部分与光器件焊 接部分一体化组合, 与插拔槽结合可用于自动化焊接设备内部进行便捷插拔, 实现了焊接翻转的自动化, 降低了原来由于翻转导致的焊接质量的影响, 简化 了工人的操作, 只需极少的手动操作, 对工人的熟练度和操作技术要求较低, 保证了焊接产品的质量, 提高了焊接效率以及自动化程度。 与此同时, 本发明 的另一特点是可最大限度的保护 5G SFP封装类型光器件的因静电问题引起的损  [0030] After the above technical solution is adopted, a welding integrated fixture for a 5G SFP package type optical transceiver module is welded using a single piece of plate with high hardness, light weight and high electrical conductivity, and the clamping provided on the work base The mechanism is used in conjunction with the welding operation table on which the weldment is placed; it is integrated with the welding part of the flexible board and the welding part of the optical device, and combined with the insertion slot can be used for convenient insertion and extraction inside the automatic welding equipment, and realizes the automation of welding flip. It reduces the impact of welding quality caused by overturning, simplifies the operation of workers, requires very little manual operation, requires less skilled workers and operating technology, guarantees the quality of welding products, and improves welding efficiency And the degree of automation. At the same time, another feature of the present invention is that it can protect the 5G SFP package type optical devices from damage caused by electrostatic problems to the greatest extent.
[0031] 本发明这种光发射一体化次模块的结构紧凑, 一体化成型, 可以有效降低制作 成本。 同时采用这种一体化焊接的方法, 缩短了焊接时间, 只需常规测试时间 的十分之一, 提高了焊接效率, 本发明对 5G SFP封装类型光收发模块质量与可 靠性的提高, 起到了极大的作用, 缩短了产品投放市场的周期; 综上, 其使得 5 G SFP封装类型光收发模块生产合格率提升 10%以上, 生产周期缩减 90%以上, 使得焊接操作方便, 焊接性能可靠, 且夹具加工简单方便。 [0031] The light-emitting integrated sub-module of the present invention has a compact structure and integrated molding, which can effectively reduce manufacturing costs. At the same time, using this integrated welding method shortens the welding time, only needs one tenth of the conventional test time, and improves the welding efficiency. The invention improves the quality and reliability of the 5G SFP package type optical transceiver module. Great effect, shortened the product launch cycle; In summary, it increased the production qualification rate of 5 G SFP package optical transceiver modules by more than 10%, and the production cycle was reduced by more than 90%. The welding operation is convenient, the welding performance is reliable, and the fixture processing is simple and convenient.
对附图的简要说明  Brief description of the drawings
附图说明  BRIEF DESCRIPTION OF THE DRAWINGS
[0032] 图 1为本发明的一体化夹具的立体图结构示意简图;  [0032] FIG. 1 is a schematic perspective structural view of an integrated fixture according to the present invention;
[0033] 图中序号所对应的名称如下:  [0033] The names corresponding to the serial numbers in the figure are as follows:
[0034] 工作基台 1、 软板焊接部分 2、 光器件焊接部分 3、 焊接操作台 4、 压板 5、 内凹 孔 6、 升降支承座 7、 第一双弹簧 8、 松紧度调节装置 9、 滑动长槽 10、 第二双弹 簧 11、 连接轴 12、 输入转轴 13、 径向侧凸 131、 大径卡槽 14、 焊接基台 15、 上凸 块 16、 支撑杆 17、 导向槽 18、 T046孔 19、 T056孔 20、 插拔槽结构 21。  [0034] Work abutment 1, soft plate welding portion 2, optical device welding portion 3, welding operation table 4, pressure plate 5, recessed hole 6, lifting support base 7, first double spring 8, slackness adjusting device 9, Sliding long groove 10, second double spring 11, connecting shaft 12, input shaft 13, radial side protrusion 131, large diameter groove 14, welding base 15, upper bump 16, support rod 17, guide groove 18, T046 Hole 19, T056 hole 20, mating slot structure 21.
实施该发明的最佳实施例  The best embodiment for carrying out the invention
本发明的最佳实施方式  Best Mode of the Invention
[0035] 一种用于 5G SFP封装类光收发模块焊接的一体化夹具, 见图 1 : 其包括一工作 基台 1, 一软板焊接部分 2与一光器件焊接部分 3分别布置于工作基台 1的长度方 向两端的上端位置, 软板焊接部分 2用于对 PCB电路板和 PCB软板进行预固定和 预焊接, 光器件焊接部分 3将软板焊接部分 2完成的半成品器件、 光器件焊接成 为完整的 5G SFP封装类光收发模块器件。  [0035] An integrated fixture for welding a 5G SFP package-type optical transceiver module, as shown in FIG. 1: It includes a working base 1, a flexible board welding part 2 and an optical device welding part 3 are respectively arranged on the working base The upper positions of the two ends of the stage 1 in the length direction. The flexible board welding part 2 is used for pre-fixing and pre-welding the PCB circuit board and the flexible PCB. The optical device welding part 3 is a semi-finished device and an optical device completed by the flexible board welding part 2. Welding becomes a complete 5G SFP package type optical transceiver module device.
[0036] 工作基台 1为铝合金材质制作而成, 其可以使得器件和地面进行导通;  [0036] The working base 1 is made of aluminum alloy material, which can make the device and the ground conduct;
[0037] 软板焊接部分 2具体包括焊接操作台 4、 焊接组合夹具, 焊接组合夹具具体包括 一对可翻转的压板 5 , 焊接操作台 5位于工作基台 1的长度方向前端的上端面, 焊 接操作台 4的中心设置有内凹孔 6 , 内凹孔 6连通至所工作基台 1的前端面, 内凹 孔 6内设置有升降支承座 7 , 内凹孔 6的后端位置的两侧分别设置有一块压板 5, 每块压板 5的长度中心区域分别固接有第一双弹簧 8的外凸端, 第一双弹簧 8的底 部设置有松紧度调节装置 9 (属于现有成熟结构、 图中仅示意) , 两块压板 5的 长度方向内端的下端面压附待焊接的 PCB电路板和 PCB软板, 升降支承座 7的两 侧和内凹孔 6的侧壁间形成滑动长槽 10, 内凹孔 6的宽度距离为定值, 其使得不 同长度和高度的待焊接组件均可被放置于该焊接操作台上进行焊接;  [0037] The soft plate welding part 2 specifically includes a welding operation table 4, a welding combination jig, and the welding combination jig specifically includes a pair of reversible pressure plates 5, the welding operation table 5 is located at the upper end surface of the longitudinal front end of the work base 1, The center of the operation table 4 is provided with a recessed hole 6 which is communicated to the front end surface of the working base 1. The recessed hole 6 is provided with a lifting support 7 and both sides of the rear end position of the recessed hole 6 A pressing plate 5 is respectively provided, and the convex end of the first double spring 8 is fixedly connected to the central area of the length of each pressing plate 5. The bottom of the first double spring 8 is provided with an elasticity adjusting device 9 (belonging to the existing mature structure, Only shown in the figure), the lower end surfaces of the inner ends in the length direction of the two pressing plates 5 are pressed with the PCB circuit board and the flexible PCB to be welded, and a sliding long groove is formed between the two sides of the lifting support base 7 and the side wall of the recessed hole 6. 10. The width distance of the inner recessed hole 6 is a fixed value, which allows components to be welded of different lengths and heights to be placed on the welding operation table for welding;
[0038] 压板 5通过杠杆原理进行压附和打开, 其分别驱动压板 5长度的内端和外端即可 完成压板的压附和打开动作; [0039] 焊接操作台 4可进行单面焊接或双面焊接; [0038] The pressure plate 5 is pressed and opened by the lever principle, which respectively drives the inner and outer ends of the length of the pressure plate 5 to complete the pressure plate attachment and opening action; [0039] The welding operation table 4 can perform single-sided welding or double-sided welding;
[0040] 升降支承座 7四周分别设置有垂直于升降支承座 7的上端面的第二双弹簧 11, 四 个第二双弹簧 11的底部分别设置有对应的松紧度调节装置 (图中未画出) , 位 于同一侧的松紧度调节装置的输入端通过连接轴 12传动设置, 两侧的连接轴 12 分别通过中间传动齿轮连接输入齿轮 (该机械传动属于成熟传动技术、 图中未 画出) , 输出齿轮套装于可伸缩的输入转轴 13 , 输入转轴 13的内端设置有轴向 弹簧, 输入转轴 13的外露于工作基台的前端面部分设置有径向侧凸 131, 锁位状 态下径向侧凸 131卡装于圆周环布的大径卡槽 14内, 根据径向侧凸 131卡装于大 径卡槽 14的位置可精确获得每根第二双弹簧 11的松紧度, 确保及时调整松紧度 , 保证待焊接组件的合理受力;  [0040] Around the lifting support base 7, second double springs 11 perpendicular to the upper end surface of the lifting support base 7 are respectively provided, and the bottoms of the four second double springs 11 are respectively provided with corresponding tightness adjusting devices (not shown in the figure). (Out), the input ends of the tightness adjustment devices on the same side are set through the connecting shaft 12 and the connecting shafts 12 on both sides are connected to the input gear through intermediate transmission gears (the mechanical transmission is a mature transmission technology, not shown in the figure) The output gear is sleeved on the retractable input shaft 13. The inner end of the input shaft 13 is provided with an axial spring. The front surface of the input shaft 13 exposed on the working base is provided with radial side protrusions 131. The side convex 131 is clamped in the large-diameter card slot 14 of the circumferential ring cloth. According to the position of the radial side convex 131 is snapped in the large-diameter card slot 14, the tightness of each second double spring 11 can be accurately obtained to ensure timely Adjust the tightness to ensure the reasonable stress of the components to be welded;
[0041] 需要调整第二双弹簧 11的松紧度时、 按压输入转轴 13 , 使得径向侧凸 131在轴 向弹簧的作用下内缩, 之后转动输入转轴 13使得径向侧凸 131对准需要设定的大 径卡槽 14, 之后松开输入转轴 13 , 使得输入转轴 131的径向侧凸在轴向弹簧的作 用下卡装于对应位置的大径卡槽 14内即可;  [0041] When the tightness of the second double spring 11 needs to be adjusted, the input shaft 13 is pressed so that the radial side projection 131 is retracted under the action of the axial spring, and then the input shaft 13 is rotated to align the radial side projection 131 as required. The large-diameter card slot 14 is set, and then the input shaft 13 is loosened, so that the radial side of the input shaft 131 is convex in the large-diameter card slot 14 corresponding to the axial spring;
[0042] 光器件焊接部分 3包括位于工作基台 1长度方向后端的焊接基台 15, 焊接基台 15 上设置有至少一组对应型号的下凹定位孔, 焊接基台 15的中心设置有上凸块 16 , 焊接基台 15的两侧分别固装有支撑杆 17 , 每根支撑杆 17的长度方向沿着工作 基台 15的长度方向平行布置, 每根支撑杆 17的横截面为直角三角形结构, 两根 支撑杆 17的其中一直角边位于上端面布置, 两个支撑杆 17的斜边分别相向布置 , 使得两个支撑杆 17和焊接基台 15的表面形成自下而上收口的导向槽 18 , 导向 槽 18确保器件的位置准确可靠。  [0042] The optical device welding portion 3 includes a welding base 15 located at the rear end in the length direction of the work base 1. The welding base 15 is provided with at least one set of recessed positioning holes of a corresponding model, and the center of the welding base 15 is provided with an upper The bumps 16 and the support base 15 are respectively fixed with support rods 17 on both sides, and the length direction of each support rod 17 is arranged in parallel along the length direction of the work base 15. The cross section of each support rod 17 is a right triangle In the structure, one of the two supporting rods 17 is arranged at the upper end side, and the oblique sides of the two supporting rods 17 are arranged opposite to each other, so that the surfaces of the two supporting rods 17 and the welding base 15 form a bottom-up guide. The slot 18 and the guide slot 18 ensure that the position of the device is accurate and reliable.
[0043] 具体实施例中, 焊接基台上设置有两组对应型号的下凹定位孔, 分别 T046孔 1 9与 T056孔 20, T046孔 119与 T056孔 20是对针对 5G SFP封装类型光收发器件尺 寸定做, 其确保一体化夹具对两种型号产品的通用性;  [0043] In a specific embodiment, two sets of corresponding recessed positioning holes are provided on the welding base, respectively T046 holes 19 and T056 holes 20, T046 holes 119 and T056 holes 20 are for optical transmission and reception for 5G SFP package types. The device size is customized, which ensures the universality of the integrated fixture for the two types of products;
[0044] 工作基台 1的前部的下端设置为插拔槽结构 21, 其可用于自动化焊接设备内部 进行便捷插拔, 实现了焊接翻转的自动化, 降低了原来由于翻转导致的焊接质 量的影响。  [0044] The lower end of the front part of the work base 1 is provided with a plug slot structure 21, which can be used for convenient plugging inside the automatic welding equipment, realizes the automation of welding flip, and reduces the impact of the welding quality originally caused by the flip. .
[0045] 一种用于 5G SFP封装类光收发模块焊接的焊接方法: 首先将 PCB电路板和 PCB 软板在软板焊接部分进行预固定和预焊接, 之后将软板焊接部分完成的半成品 器件、 光器件在光器件焊接部分焊接成为完整的 5G SFP封装类光收发模块器件 [0045] A soldering method for soldering a 5G SFP packaged optical transceiver module: First, a PCB circuit board and a PCB The flexible board is pre-fixed and pre-welded in the flexible board welding part, and then the semi-finished device and optical device completed in the flexible board welding part are welded in the optical device welding part to become a complete 5G SFP packaged optical transceiver module device
[0046] 通过手工将软板焊接的具体步骤如下: [0046] The specific steps of welding the flexible board by hand are as follows:
[0047] 1、 戴上防静电手链, 将手链插入到工作台的接地点, 使手链与工作台的地相 连;  [0047] 1. Wear an anti-static bracelet, insert the bracelet into the ground point of the workbench, so that the bracelet is connected to the ground of the workbench;
[0048] 2、 打开电烙铁, 检查烙铁是否正常。 在烙铁正常工作的情况下调节电烙铁温 度到 360±20°C, 并清洁电烙铁头;  [0048] 2. Open the electric soldering iron and check whether the soldering iron is normal. When the soldering iron is working normally, adjust the temperature of the soldering iron to 360 ± 20 ° C, and clean the tip of the soldering iron;
[0049] 3、 将软板装配到对应型号的 PCB板上后, 将管脚剪到 2-6mm, 用镊子将软板 压到底, 之后加锡焊接;  [0049] 3. After assembling the flexible board to the PCB of the corresponding model, cut the pins to 2-6mm, press the flexible board to the end with tweezers, and then solder with tin;
[0050] 4、 焊接过程中要求焊点需要饱满且无拔尖, 无虚焊;  [0050] 4. The welding process requires that the solder joints be full and without tipping, and no virtual soldering;
[0051] 5、 目检模块焊点有无虚焊、 漏焊、 短路、 拔尖, 检查管脚顺序是否焊错, 在 确保无错的状态下转入下一道工序。  [0051] 5. Visually inspect the solder joints of the module for false soldering, missing soldering, short circuit, and tipping, check whether the order of the pins is wrong, and move to the next process under the condition of ensuring no errors.
[0052] 通过光器件焊接部分焊接成产品的具体步骤如下:  [0052] The specific steps of welding the product by welding the optical device are as follows:
[0053] 1、 将接收组件软板和发射组件软板分别焊接在 PCB后, 全铜板面朝上, 有布 线面朝下布置;  [0053] 1. After the receiving component soft board and the transmitting component soft board are respectively welded to the PCB, the all-copper board faces up and the wiring faces face down;
[0054] 2、 将接收组件和发射组件分别装入软板上, 软板有布线面朝上进行组件焊接  [0054] 2. The receiving component and the transmitting component are respectively mounted on a flexible board, and the flexible board has a wiring surface facing upward for component welding.
[0055] 3、 操作者按接插原则: 先小后大、 先轻后重、 先低后高、 先里后外将元器插 入 PCB板相应的焊盘孔内, 将 PCB板放入托盘转入焊接工序; [0055] 3. Operators follow the plug-in principle: first small, then large, light first, then heavy, low first, then high, inside and outside, insert the device into the corresponding pad hole of the PCB board, and place the PCB board in the tray. Transfer to welding process;
[0056] 4、 将烙铁头放在被焊件的焊盘上, 使焊点温度升高;  [0056] 4. Place the soldering iron head on the pad of the part to be soldered to increase the temperature of the solder joint;
[0057] 5、 用焊锡丝接触到焊接处, 熔化适量的焊料, 焊锡丝从烙铁头侧面加入; [0057] 5. Use a solder wire to contact the welding place, melt an appropriate amount of solder, and add the solder wire from the side of the soldering iron head;
[0058] 6、 从焊锡丝开始熔化数 3秒后, 先移开焊锡丝, 再移开电烙铁; [0058] 6. After several seconds from the beginning of melting of the solder wire, remove the solder wire first, and then remove the electric soldering iron;
[0059] 7、 焊点冷却后, 用斜口钳子将元器件的管脚剪掉, 剪去管脚的长度依结构图 的要求而定。  [0059] 7. After the solder joint is cooled, the pin of the component is cut off with diagonal pliers, and the length of the pin is determined according to the requirements of the structure drawing.
[0060] 焊接过程中, 移开烙铁头的时间、 方向和速度, 决定着焊接点的焊接质量, 正 确的方法是先慢后快, 烙铁头移开沿 45°角方向移动, 及时清理烙铁头;  [0060] During the welding process, the time, direction and speed of removing the soldering iron head determines the quality of the welding point. The correct method is to slow down and then fast. Remove the soldering iron head and move it in a 45 ° angle direction to clean the soldering iron head in time. ;
[0061] 焊点内部填 90%以上锡为合格品, 否则为虚焊不允许; [0062] 焊点有特殊的光泽和良好颜色; 在光泽和高度及颜色上不应有凹凸不平和明暗 等明显的缺陷。 焊点不应有拉尖、 缺锡、 锡珠污物等现象, 焊接要求一次成形 , 不要翘曲、 脱落。 [0061] Filling more than 90% of the tin inside the solder joint is a qualified product, otherwise false soldering is not allowed; [0062] The solder joint has a special gloss and good color; there should be no obvious defects such as unevenness, lightness and darkness in gloss, height and color. There should be no sharp points, lack of tin, or bead dirt on the solder joints. Welding requires one-time forming without warping or falling off.
[0063] 本发明专利通过软板焊接部分与光器件焊接部分一体化组合, 与插拔槽 15结合 可用于自动化焊接设备内部进行便捷插拔, 实现了焊接翻转的自动化, 降低了 原来由于翻转导致的焊接质量的影响, 简化了工人的操作, 只需极少的手动操 作, 对工人的熟练度和操作技术要求较低, 保证了焊接产品的质量, 提高了焊 接效率以及自动化程度。 与此同时, 本发明的另一特点是可最大限度的保护 5G SFP封装类型光器件的因静电问题引起的损坏。  [0063] The present invention patent is an integrated combination of a flexible board welding part and an optical device welding part, and combined with the insertion slot 15 can be used for convenient insertion and removal inside the automatic welding equipment, realizing the automation of welding flipping, and reducing the original caused by flipping. The impact of welding quality simplifies the operation of workers, requires very little manual operation, requires less proficiency of workers and operating technology, guarantees the quality of welding products, improves welding efficiency and automation. At the same time, another feature of the present invention is that it can protect the 5G SFP package type optical device from damage caused by electrostatic problems to the greatest extent.
[0064] 本发明这种光发射一体化次模块的结构紧凑, 一体化成型, 可以有效降低制作 成本。 同时采用这种一体化焊接的方法, 缩短了焊接时间 (只需常规测试时间 的十分之一) , 提高了焊接效率, 本发明对 5G SFP封装类型光收发模块质量与 可靠性的提高, 起到了极大的作用, 缩短了产品投放市场的周期。  [0064] The light emitting integrated sub-module of the present invention has a compact structure and integrated molding, which can effectively reduce manufacturing costs. At the same time, this integrated welding method is used to shorten the welding time (only one tenth of the conventional test time) and improve the welding efficiency. The invention improves the quality and reliability of the 5G SFP package type optical transceiver module. To a great effect, shorten the cycle of product launch.
[0065] 以上对本发明的具体实施例进行了详细说明, 但内容仅为本发明创造的较佳实 施例, 不能被认为用于限定本发明创造的实施范围。 凡依本发明创造申请范围 所作的均等变化与改进等, 均应仍归属于本专利涵盖范围之内。  [0065] The specific embodiments of the present invention have been described in detail above, but the content is only the preferred embodiments created by the present invention, and cannot be considered to limit the implementation scope of the invention creation. All equal changes and improvements made in accordance with the scope of the present invention shall still fall within the scope of this patent.

Claims

权利要求书 Claim
[权利要求 1] 一种用于 5G SFP封装类光收发模块焊接的一体化夹具, 其特征在于  [Claim 1] An integrated fixture for welding a 5G SFP package optical transceiver module, characterized in that
: 其包括一工作基台, 一软板焊接部分与一光器件焊接部分分别布置 于所述工作基台的长度方向两端的上端位置, 所述软板焊接部分用于 对 PCB电路板和 PCB软板进行预固定和预焊接, 所述光器件焊接部分 将所述软板焊接部分完成的半成品器件、 光器件焊接成为完整的 5G SFP封装类光收发模块器件。  : It comprises a working base, a flexible board soldering part and an optical device soldering part are respectively arranged at the upper end positions of both ends of the working base in the longitudinal direction, and the flexible board soldering part is used for PCB circuit board and PCB soft The board is pre-fixed and pre-welded, and the optical device welding part welds the semi-finished device and the optical device completed by the soft board welding part into a complete 5G SFP packaged optical transceiver module device.
[权利要求 2] 如权利要求 1所述的一种用于 5G SFP封装类光收发模块焊接的一体化 夹具, 其特征在于: 所述工作基台为铝合金材质制作而成。  [Claim 2] The integrated fixture for welding a 5G SFP packaged optical transceiver module according to claim 1, wherein the working base is made of an aluminum alloy material.
[权利要求 3] 如权利要求 1所述的一种用于 5G SFP封装类光收发模块焊接的一体化 夹具, 其特征在于: 所述软板焊接部分具体包括焊接操作台、 焊接组 合夹具, 所述焊接组合夹具具体包括一对可翻转的压板, 所述焊接操 作台位于所述工作基台的长度方向前端的上端面, 所述焊接操作台的 中心设置有内凹孔, 所述内凹孔连通至所述工作基台的前端面, 所述 内凹孔内设置有升降支承座, 所述内凹孔的后端位置的两侧分别设置 有一块压板, 每块压板的长度中心区域分别固接有第一双弹簧的外凸 端, 所述第一双弹簧的底部设置有松紧度调节装置, 两块所述压板的 长度方向内端的下端面压附待焊接的 PCB电路板和 PCB软板, 所述升 降支承座的两侧和所述内凹孔的侧壁间形成滑动长槽, 所述内凹孔的 宽度距离为定值。 [Claim 3] The integrated fixture for welding the 5G SFP package optical transceiver module according to claim 1, characterized in that: the soft board welding part specifically comprises a welding operation table, a welding combination fixture, and The welding combination fixture specifically includes a pair of reversible pressure plates, the welding operation table is located at an upper end surface of a longitudinal end of the work base, and a center of the welding operation table is provided with an inner recessed hole, and the inner recessed hole A front end surface communicating with the working abutment is provided with a lifting support seat in the inner recessed hole, and a pressure plate is respectively arranged on both sides of the rear end position of the inner recessed hole, and the length central area of each pressure plate is fixed respectively. The outer convex end of the first double spring is connected, and the bottom of the first double spring is provided with a tightness adjusting device, and the lower end faces of the inner ends in the length direction of the two press plates are pressed with the PCB circuit board and the PCB flexible board to be welded A sliding long groove is formed between two sides of the lifting support seat and a side wall of the recessed hole, and the width distance of the recessed hole is a fixed value.
[权利要求 4] 如权利要求 3所述的一种用于 5G SFP封装类光收发模块焊接的一体化 夹具, 其特征在于: 所述焊接操作台可进行单面焊接或双面焊接。  [Claim 4] The integrated fixture for welding a 5G SFP package optical transceiver module according to claim 3, characterized in that: the welding operation table can perform single-sided welding or double-sided welding.
[权利要求 5] 如权利要求 3所述的一种用于 5G SFP封装类光收发模块焊接的一体化 夹具, 其特征在于: 所述升降支承座四周分别设置有垂直于所述升降 支承座的上端面的第二双弹簧, 四个所述第二双弹簧的底部分别设置 有对应的松紧度调节装置, 位于同一侧的所述松紧度调节装置的输入 端通过连接轴传动设置, 两侧的连接轴分别通过中间传动齿轮连接输 入齿轮, 所述输出齿轮套装于可伸缩的输入转轴, 所述输入转轴的内 端设置有轴向弹簧, 所述输入转轴的外露于所述工作基台的前端面部 分设置有径向侧凸, 锁位状态下所述径向侧凸卡装于圆周环布的大径 卡槽内。 [Claim 5] The integrated fixture for soldering a 5G SFP packaged optical transceiver module according to claim 3, characterized in that: four sides of the lifting support base are respectively provided with perpendicular to the lifting support base. The second double springs on the upper end face, and the bottoms of the four second double springs are respectively provided with corresponding slackness adjusting devices. The input ends of the slackness adjusting devices on the same side are driven by a connecting shaft. The connecting shaft is connected to the input gear through an intermediate transmission gear, and the output gear is sleeved on a retractable input shaft. An axial spring is provided at the end, and a radial side protrusion is provided on the front surface portion of the input shaft exposed from the working base. Inside the slot.
[权利要求 6] 如权利要求 1所述的一种用于 5G SFP封装类光收发模块焊接的一体化 夹具, 其特征在于: 所述光器件焊接部分包括位于所述工作基台长度 方向后端的焊接基台, 所述焊接基台上设置有至少一组对应型号的下 凹定位孔, 所述焊接基台的中心设置有上凸块, 所述焊接基台的两侧 分别固装有支撑杆, 每根所述支撑杆的长度方向沿着所述工作基台的 长度方向平行布置, 每根支撑杆的横截面为直角三角形结构, 两根所 述支撑杆的其中一直角边位于上端面布置, 两个所述支撑杆的斜边分 别相向布置, 使得两个所述支撑杆和所述焊接基台的表面形成自下而 上收口的导向槽。  [Claim 6] The integrated fixture for welding of 5G SFP packaged optical transceiver modules according to claim 1, characterized in that: the optical device soldering portion includes a rear end located in the length direction of the working base. A welding abutment, the welding abutment is provided with at least one set of recessed positioning holes of the corresponding model, the center of the welding abutment is provided with an upper projection, and two sides of the welding abutment are respectively fixed with support rods The length direction of each support rod is arranged in parallel along the length direction of the working abutment, the cross section of each support rod is a right-angled triangle structure, and the right-angled side of the two support rods is arranged on the upper end surface. The oblique sides of the two support rods are arranged opposite to each other, so that the surfaces of the two support rods and the welding abutment form a bottom-up guide groove.
[权利要求 7] 如权利要求 1所述的一种用于 5G SFP封装类光收发模块焊接的一体化 夹具, 其特征在于: 所述工作基台的前部的下端设置为插拔槽结构。  [Claim 7] The integrated fixture for welding a 5G SFP package optical transceiver module according to claim 1, characterized in that: the lower end of the front part of the working base is provided with a slot structure.
[权利要求 8] 一种用于 5G SFP封装类光收发模块焊接的焊接方法, 其特征在于: 首先将 PCB电路板和 PCB软板在软板焊接部分进行预固定和预焊接, 之后将所述软板焊接部分完成的半成品器件、 光器件在光器件焊接部 分焊接成为完整的 5G SFP封装类光收发模块器件。 [Claim 8] A soldering method for soldering a 5G SFP packaged optical transceiver module, characterized in that: first, a PCB circuit board and a PCB flexible board are pre-fixed and pre-welded at a soldered portion of the flexible board, and then the said The semi-finished device and the optical device completed in the soldering part of the flexible board are welded into a complete 5G SFP package optical transceiver module device.
[权利要求 9] 如权利要求 1所述的一种用于 5G SFP封装类光收发模块焊接的焊接方 法, 其特征在于, 通过手工将软板焊接的具体步骤如下:  [Claim 9] The welding method for welding a 5G SFP package-type optical transceiver module according to claim 1, wherein the specific steps for manually soldering the flexible board are as follows:
1、 戴上防静电手链, 将手链插入到工作台的接地点, 使手链与工作 台的地相连;  1. Wear an anti-static bracelet, insert the bracelet into the grounding point of the workbench, and connect the bracelet with the ground of the workbench;
2、 打开电烙铁, 检查烙铁是否正常。 在烙铁正常工作的情况下调节 电烙铁温度到 360±20°C, 并清洁电烙铁头;  2. Turn on the soldering iron and check if the soldering iron is normal. Adjust the temperature of the electric iron to 360 ± 20 ° C and clean the tip of the electric iron when the iron is working normally;
3、 将软板装配到对应型号的 PCB板上后, 将管脚剪到 2-6mm, 用镊 子将软板压到底, 之后加锡焊接;  3. After assembling the soft board to the PCB of the corresponding model, cut the pins to 2-6mm, press the soft board to the end with tweezers, and then solder with tin;
4、 焊接过程中要求焊点需要饱满且无拔尖, 无虚焊;  4. During the welding process, the solder joints need to be full and without tipping, and no virtual soldering;
5、 目检模块焊点有无虚焊、 漏焊、 短路、 拔尖, 检查管脚顺序是否 焊错, 在确保无错的状态下转入下一道工序。 5. Visually inspect the solder joints of the module for false soldering, missing soldering, short circuit, and tipping, and check the order of the pins. Welding mistakes, move to the next process with no errors.
[权利要求 10] 如权利要求 1所述的一种用于 5G SFP封装类光收发模块焊接的焊接方 法, 其特征在于, 通过光器件焊接部分焊接成产品的具体步骤如下: [Claim 10] The welding method for welding a 5G SFP package-type optical transceiver module according to claim 1, wherein the specific steps of welding the product by welding the optical device are as follows:
1、 将接收组件软板和发射组件软板分别焊接在 PCB后, 全铜板面朝 上, 有布线面朝下布置; 1. After soldering the receiving component soft board and the transmitting component soft board to the PCB, the all-copper board faces up and the wiring faces face down;
2、 将接收组件和发射组件分别装入软板上, 软板有布线面朝上进行 组件焊接;  2. Put the receiving module and the transmitting module on the flexible board respectively. The flexible board has the wiring side facing up for component welding;
3、 操作者按接插原则: 先小后大、 先轻后重、 先低后高、 先里后外 将元器插入 PCB板相应的焊盘孔内, 将 PCB板放入托盘转入焊接工序  3, the operator according to the plug-in principle: small first, then large, light first, then heavy, low first, then high, first inside and then outside into the corresponding pad hole on the PCB board, the PCB board into the tray to solder Process
4、 将烙铁头放在被焊件的焊盘上, 使焊点温度升高; 4. Place the soldering iron tip on the pad of the part to be soldered to increase the temperature of the solder joint;
5、 用焊锡丝接触到焊接处, 熔化适量的焊料, 焊锡丝从烙铁头侧面 加入;  5. Use the solder wire to contact the soldering place, melt the proper amount of solder, and add the solder wire from the side of the soldering iron head;
6、 从焊锡丝开始熔化数 3秒后, 先移开焊锡丝, 再移开电烙铁; 6. After melting for 3 seconds from the beginning of the solder wire, remove the solder wire first, and then remove the electric soldering iron;
7、 焊点冷却后, 用斜口钳子将元器件的管脚剪掉, 剪去管脚的长度 依结构图的要求而定。 7. After the solder joints are cooled, use diagonal pliers to cut off the pins of the components. The length of the pins is determined according to the requirements of the structure drawing.
PCT/CN2018/115502 2018-09-10 2018-11-14 Integrated clamp and welding method for 5g sfp encapsulation type optical transceiver module welding WO2020052051A1 (en)

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