CN210817829U - Soldering bit for removing DIP device - Google Patents
Soldering bit for removing DIP device Download PDFInfo
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- CN210817829U CN210817829U CN201921755152.7U CN201921755152U CN210817829U CN 210817829 U CN210817829 U CN 210817829U CN 201921755152 U CN201921755152 U CN 201921755152U CN 210817829 U CN210817829 U CN 210817829U
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Abstract
The utility model relates to a flatiron field specifically is a soldering iron that is used for DIP device to demolish, including heating the core, still include: the soldering bit body is connected with the heating core and used for avoiding damage to the PCB substrate and the device bonding pad in the device dismounting process; the soldering bit welding part is arranged on the soldering bit body and matched with the DIP device; deposit the tin recess, both sides end at soldering bit welded part all has the setting, make soldering tin stay because of its surface tension, use this to make DIP device solder joint soldering tin be fully heated and melt, the special design of depositing the tin recess part can make soldering tin and DIP encapsulation device solder joint fully contact, make soldering tin melt completely, simultaneously because the soldering bit body is for according to DIP device size design, all solder joints can melt simultaneously, then can easily take off DIP encapsulation device, it just becomes light many just to clear up through-hole soldering tin again, also avoid traditional approach to clear up the not thorough damage to the pad of soldering tin, through-hole and PCB cause.
Description
Technical Field
The utility model relates to a flatiron field specifically is a soldering bit that is used for DIP device to demolish.
Background
Airborne electronic products have attributes such as small product quantity, many varieties, high value, operational reliability and the like, and when a faulty electronic product is maintained, a device packaged by a DIP (dual in-line package) is frequently required to be replaced. In the process of detaching and welding the device, the damage to a PCB (printed circuit board) pad, a through hole and a substrate is required to be reduced as much as possible so as to ensure the reliability of a repaired product. The method for removing the DIP packaging device is a tin suction method, and can be divided into two methods according to different tin suction tools, wherein firstly, the tin suction tool without a heating function is used for removing, namely, the tin in a corresponding through hole is sucked by the tin suction tool at the moment that a soldering iron is used for heating a soldering point; and secondly, a tin suction tool with a heating function is used, the specific method is that after the temperature is set, the tin suction nozzle is directly aligned to a pin of a corresponding device, and after a welding spot is melted, a switch of the tin suction tool is started, so that the welding spot cleaning work in the through hole can be completed.
The method has some defects in the dismounting operation of the DIP device of the onboard electronic product. Firstly, in PCBA electronic component production process, the pin can contact with the through hole wall after the assembly of DIP class device, consequently uses to inhale tin instrument and can't clear away pin and through hole wall contact department soldering tin completely, leads to this pin can't thoroughly separate with the pore wall. Generally, the number of pins of the DIP device is more than 14, when a small amount of soldering tin is adhered to the hole wall of each pin, the whole DIP device is difficult to remove, even if the device is removed, the hole wall of the through hole is damaged, the soldering tin cannot completely fill the pin through hole after the hole wall is damaged, and the strength of the pin and the working reliability of a product can be reduced. Secondly, when the tin suction tool is used for cleaning the soldering tin in the through hole, repeated operation is sometimes needed for several times to achieve the best state, and the risk that the soldering pad is heated to fall off exists due to repeated heating of the soldering pad, so that sometimes the damage cannot be repaired.
Disclosure of Invention
In order to solve the problem, the utility model provides a soldering bit that is used for DIP device to demolish.
A soldering tip for DIP device removal, comprising a heating core, further comprising:
the soldering bit body is connected with the heating core and used for avoiding damage to the PCB substrate and the device bonding pad in the device dismounting process;
the soldering bit welding part is arranged on the soldering bit body and matched with the DIP device;
the tin storage groove is formed in the two side ends of the welding part of the soldering bit, so that soldering tin is reserved due to surface tension of the soldering tin, and the soldering tin of the welding spot of the DIP device is fully heated and melted.
The length of the soldering bit body is the same as that of the DIP device body, and the length can be designed according to the length of the DIP device body.
The width of the soldering bit body is larger than that of the DIP device body.
The width of the tin storage groove is the same as that of a through hole of the PCB, and the depth of the tin storage groove is 0.5-1mm greater than the length of the pins of the DIP device extending out of the PCB.
The bottom of the tin storage groove is an arc-shaped surface.
The utility model has the advantages that: the special design of depositing tin groove part can make soldering tin and DIP encapsulation device solder joint fully contact, makes soldering tin melt completely, simultaneously because the soldering bit body is for according to DIP device size design, all solder joints can melt simultaneously, can easily take off DIP encapsulation device then, clears up through-hole soldering tin again and just becomes easily many, also avoids traditional approach to clear up the damage that soldering tin thoroughly caused pad, through-hole and PCB.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic side view of the present invention;
fig. 3 is a schematic top view of the present invention.
Detailed Description
In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, and the utility model is further explained below.
As shown in fig. 1 to 3, a soldering iron tip for DIP device removal includes a heating core 1, and further includes:
the soldering bit body 2 is connected with the heating core 1 and used for avoiding damage to a PCB substrate and a device bonding pad in the device dismounting process;
the soldering bit welding part 3 is arranged on the soldering bit body 2 and is matched with the DIP device;
and a tin storage groove 4 is formed in both side ends of the soldering iron head welding part 3, so that soldering tin is retained due to surface tension of the soldering tin, and the soldering tin of the welding spot of the DIP device is fully heated and melted.
The special design of depositing tin groove part can make soldering tin and DIP encapsulation device solder joint fully contact, makes soldering tin melt completely, simultaneously because the soldering bit body is for according to DIP device size design, all solder joints can melt simultaneously, can easily take off DIP encapsulation device then, clears up through-hole soldering tin again and just becomes easily many, also avoids traditional approach to clear up the damage that soldering tin thoroughly caused pad, through-hole and PCB.
The length of the soldering bit body 2 is the same as that of the DIP device body, and the length can be designed according to the length of the DIP device body.
The soldering bit body 2 can rapidly and reliably finish the removal of the DIP device, and cannot damage a PCB substrate, a device bonding pad and a pin through hole.
The width of the soldering bit body 2 is larger than that of the DIP device body.
The width of the tin storage groove 4 is the same as that of a through hole of the PCB, and the depth of the tin storage groove 4 is 0.5-1mm greater than the length of a pin of the DIP device extending out of the PCB.
The bottom of the tin storage groove 4 is an arc-shaped surface.
The utility model discloses a use method: according to the required size of demolising the DIP device, select appropriate size the soldering bit body 2, set up the flatiron temperature, 2 two rows of tin recesses 4 of depositing of soldering bit body fully contact with two rows of solder joints of DIP device, soldering bit body 2 stop 2-3s at the solder joint, wait that all solder joints melt, can practical tweezers class instrument easily take off the DIP device from DIP device body face.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and what is described in the specification are the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and these changes and modifications are intended to fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A soldering iron for DIP device removal, comprising a heating core (1), characterized in that: further comprising:
the soldering bit body (2) is connected with the heating core (1) and is used for avoiding damage to the PCB substrate and the device bonding pad in the device dismounting process;
the soldering bit welding part (3) is arranged on the soldering bit body (2) and is matched with the DIP device;
and the tin storage grooves (4) are arranged at the two side ends of the soldering iron head welding part (3), so that the soldering tin is retained due to the surface tension of the soldering tin, and the soldering tin of the welding spot of the DIP device is fully heated and melted.
2. A soldering tip for DIP device removal according to claim 1, wherein: the length of the soldering bit body (2) is the same as that of the DIP device body, and the length can be designed according to the length of the DIP device body.
3. A soldering tip for DIP device removal according to claim 1, wherein: the width of the soldering bit body (2) is larger than that of the DIP device body.
4. A soldering tip for DIP device removal according to claim 1, wherein: the width of the tin storage groove (4) is the same as that of a through hole of the PCB, and the depth of the tin storage groove is 0.5-1mm greater than the length of a pin of the DIP device extending out of the PCB.
5. A soldering tip for DIP device removal according to claim 1, wherein: the bottom of the tin storage groove (4) is an arc-shaped surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921755152.7U CN210817829U (en) | 2019-10-18 | 2019-10-18 | Soldering bit for removing DIP device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921755152.7U CN210817829U (en) | 2019-10-18 | 2019-10-18 | Soldering bit for removing DIP device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210817829U true CN210817829U (en) | 2020-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921755152.7U Active CN210817829U (en) | 2019-10-18 | 2019-10-18 | Soldering bit for removing DIP device |
Country Status (1)
| Country | Link |
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| CN (1) | CN210817829U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116851986A (en) * | 2023-09-05 | 2023-10-10 | 微网优联科技(成都)有限公司 | Efficient welding device and method for camera module and PCB |
-
2019
- 2019-10-18 CN CN201921755152.7U patent/CN210817829U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116851986A (en) * | 2023-09-05 | 2023-10-10 | 微网优联科技(成都)有限公司 | Efficient welding device and method for camera module and PCB |
| CN116851986B (en) * | 2023-09-05 | 2023-11-21 | 微网优联科技(成都)有限公司 | Efficient welding device and method for camera module and PCB |
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