WO2020040184A1 - Composition d'assemblage - Google Patents

Composition d'assemblage Download PDF

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Publication number
WO2020040184A1
WO2020040184A1 PCT/JP2019/032597 JP2019032597W WO2020040184A1 WO 2020040184 A1 WO2020040184 A1 WO 2020040184A1 JP 2019032597 W JP2019032597 W JP 2019032597W WO 2020040184 A1 WO2020040184 A1 WO 2020040184A1
Authority
WO
WIPO (PCT)
Prior art keywords
fine particles
silver fine
silver
bonding composition
bonding
Prior art date
Application number
PCT/JP2019/032597
Other languages
English (en)
Japanese (ja)
Inventor
智文 渡辺
啓資 田中
Original Assignee
バンドー化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by バンドー化学株式会社 filed Critical バンドー化学株式会社
Priority to JP2019547736A priority Critical patent/JP6736782B2/ja
Publication of WO2020040184A1 publication Critical patent/WO2020040184A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Definitions

  • High-brightness lighting devices and light-emitting devices with light-emitting elements such as LEDs, and semiconductor devices with semiconductor elements that operate at high temperatures and with high efficiency called power devices, etc. tend to have high driving temperatures when using the devices. is there. Since the melting point of solder is lower than the driving temperature of these devices, it is not suitable for bonding light emitting elements such as LEDs, semiconductor chips, and the like. Furthermore, in recent years, lead-free bonding materials have been demanded from the viewpoint of environmental protection and the regulations of the "European Parliament and Council Directive on the Restriction of the Use of Specific Hazardous Substances in Electric and Electronic Equipment” (RoHS).
  • the present inventors have conducted intensive studies to achieve the above object, and as a result, through a step of firing at a relatively low temperature without applying pressure, excellent bonding strength, and a bonding material having excellent heat resistance reliability.
  • the present inventors have found that the above problem can be solved by the following constitution.
  • the primary amine has a boiling point of 300 ° C. or less, preferably 250 ° C. or less, from the viewpoint of easily detaching from the surface of silver fine particles even at a relatively low temperature.
  • the bonding composition of the present invention includes the first silver fine particles and the second silver fine particles as silver fine particles, thereby realizing firing at a relatively low temperature and firing after bonding.
  • the generation of cracks and voids in the consolidated body is suppressed, and a sintered body having a low porosity, a higher density, and excellent bonding strength can be obtained.
  • the average particle diameter of the second silver fine particles exceeds 550 nm
  • the bonding composition of the present invention when the bonding composition of the present invention is sandwiched between the members to be bonded, a gap is generated due to the metal particles having a large particle diameter, and the bonding strength is reduced. May decrease.
  • a preferred lower limit of the average particle size of the second metal particles is 240 nm, and a preferred upper limit is 450 nm.
  • the alcohol is a compound containing one or more OH groups in the molecular structure, and includes an aliphatic alcohol, a cyclic alcohol and an alicyclic alcohol, each of which may be used alone or in combination of two or more. Good. Further, a part of the OH group may be derived to an acetoxy group or the like as long as the effect of the present invention is not impaired.
  • the bonding composition of the present invention does not contain a polymer dispersant. This is because the polymer dispersant tends to remain in the bonding layer even after firing at a temperature of 300 ° C. or less, hinder sintering, and may adversely affect the bonding reliability.
  • the porosity of the bonding layer obtained by heating and baking the bonding composition of the present invention at 275 ° C. is preferably 10% or less. Further, it is preferable that the porosity of the bonding layer obtained by heating and firing at 275 ° C. without pressure is 10% or less. This is because, in such a state, from the viewpoint of heat resistance reliability, the crack progresses slowly with respect to strain due to a difference in linear expansion coefficient.
  • the thickener examples include clay minerals such as clay, bentonite and hectorite; for example, emulsions such as polyester emulsion resin, acrylic emulsion resin, polyurethane emulsion resin and blocked isocyanate; methyl cellulose, carboxymethyl cellulose, hydroxy Cellulose derivatives such as ethylcellulose, hydroxypropylcellulose and hydroxypropylmethylcellulose; polysaccharides such as xanthan gum and guar gum; and the like, each of which may be used alone or in combination of two or more.
  • clay minerals such as clay, bentonite and hectorite
  • emulsions such as polyester emulsion resin, acrylic emulsion resin, polyurethane emulsion resin and blocked isocyanate
  • methyl cellulose carboxymethyl cellulose, hydroxy Cellulose derivatives such as ethylcellulose, hydroxypropylcellulose and hydroxypropylmethylcellulose
  • polysaccharides such as xanthan gum
  • the surfactant is not particularly limited, and any one of an anionic surfactant, a cationic surfactant, and a nonionic surfactant can be used. Examples thereof include an alkylbenzene sulfonate, a quaternary ammonium salt, and the like. Is mentioned. Since the effect can be obtained with a small addition amount, a fluorine-based surfactant is preferable.
  • Silver oxalate is the simplest silver dicarboxylate, and the silver oxalate amine complex synthesized using silver oxalate is suitable for the synthesis of the silver fine particles of the present invention because the reduction proceeds in a short time at a low temperature. It is. Furthermore, when silver oxalate is used, by-products are not generated at the time of synthesis, and only carbon dioxide derived from oxalate ions is emitted out of the system, so that there is little labor for purification after the synthesis.
  • a dispersion liquid containing silver fine particles whose surface is coated with an organic protective component is allowed to stand for a certain period of time, and after removing the supernatant, a solvent (eg, water, methanol, (A mixed solvent of methanol / water, etc.), stirring the mixture, leaving the mixture to stand still for a certain period of time, and removing the supernatant liquid several times.
  • a solvent eg, water, methanol, (A mixed solvent of methanol / water, etc.
  • stirring the mixture leaving the mixture to stand still for a certain period of time, and removing the supernatant liquid several times.
  • other methods include a method of performing centrifugation instead of the above-mentioned standing, and a method of desalting with an ultrafiltration device or an ion exchange device.
  • the term “coating” is a concept that includes a case where the bonding composition is applied in a plane and a case where the bonding composition is applied (drawn) in a linear manner.
  • the shape of the coating film made of the bonding composition before being fired by heating can be a desired shape. Therefore, the shape of the sintered body (bonding layer) obtained by firing the bonding composition may be planar or linear.
  • These planar bonding layer and linear bonding layer may be continuous or discontinuous, and may include a continuous portion and a discontinuous portion.
  • Various methods can be used for applying the bonding composition to the members to be bonded, and examples thereof include dipping, screen printing, spraying, bar coating, spin coating, ink jet, dispenser, and pin transfer.
  • Method, stamping method, coating method using a brush, casting method, flexo method, gravure method, offset method, transfer method, hydrophilic / hydrophobic pattern method, syringe method, pin transfer, stencil printing and the like can be used.
  • the bonding composition of the present invention has a high solid content concentration, and thus can be suitably used for dispensers, pin transfer, and stencil printing.
  • ⁇ Preparation of bonding composition 1 g of each of the obtained silver fine particles A and silver fine particles B was measured, and 0.1 g of hexyl carbitol, 0.1 g of butyl carbitol acetate, and 0.01 g of linoseal acid were added thereto as a dispersion medium, followed by stirring and mixing. A bonding composition was obtained.
  • Example 8 The dodecylamine used in the preparation of the silver fine particles A and the silver fine particles B was not added, and the amounts of the silver fine particles A and the silver fine particles B used in the preparation of the bonding composition were as follows. Except that the fine particles B were changed to 0.8 g and the dispersion medium was changed to 0.05 g of hexyl carbitol, 0.05 g of butyl carbitol acetate, and 0.005 g of ricinoleic acid, the same procedure as in Example 5 was carried out. A composition was obtained. The evaluation test was performed in the same manner as in Example 5 except that the preliminary drying at 70 ° C. was not performed in the production of the laminate in the evaluation tests (2) and (3). The results obtained are shown in Table 1 below.
  • Example 4 In the preparation of the bonding composition, a bonding composition was prepared in the same manner as in Example 3 except that micro silver particles (average particle size: 2.5 ⁇ m) manufactured by Fukuda Metal Foil Powder Co., Ltd. were used as the silver fine particles B. Evaluation was performed in the same manner as in Example 3. The results obtained are shown in Table 2 below.
  • ⁇ Preparation of bonding composition 1.0 g of each of the obtained silver fine particles A and silver fine particles B was measured, and 0.1 g of hexyl carbitol, 0.1 g of butyl carbitol acetate, and 0.01 g of ricinoleic acid were added thereto as a dispersion medium, followed by stirring. By mixing, a bonding composition was obtained. An evaluation test was performed on the obtained bonding composition in the same manner as in Example 1. The results obtained are shown in Table 2 below.
  • the bonding composition according to Comparative Example 7 containing no unsaturated hydrocarbon (ricinoleic acid) in the dispersion medium was inferior in all of the bonding strength, the porosity, and the heat resistance reliability.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne une composition d'assemblage grâce à laquelle un assemblage peut être effectué sans pression même à une température relativement basse, et une excellente force d'assemblage et une excellente fiabilité résistante à la chaleur sont obtenues. La présente invention concerne une composition de jonction contenant des particules fines d'argent revêtues d'une amine primaire, et un milieu de dispersion, l'amine primaire ayant un nombre de carbones de 4 à 12 et un point d'ébullition de 300 °C ou moins, les particules fines d'argent comprenant des premières particules fines d'argent ayant un diamètre de particule moyen de 45 à 75 nm et des deuxièmes particules fines d'argent ayant un diamètre de particule moyen de 200 à 550 nm, et le milieu de dispersion comprenant un hydrocarbure insaturé.
PCT/JP2019/032597 2018-08-23 2019-08-21 Composition d'assemblage WO2020040184A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019547736A JP6736782B2 (ja) 2018-08-23 2019-08-21 接合用組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-156311 2018-08-23
JP2018156311 2018-08-23

Publications (1)

Publication Number Publication Date
WO2020040184A1 true WO2020040184A1 (fr) 2020-02-27

Family

ID=69593277

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/032597 WO2020040184A1 (fr) 2018-08-23 2019-08-21 Composition d'assemblage

Country Status (2)

Country Link
JP (1) JP6736782B2 (fr)
WO (1) WO2020040184A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210346949A1 (en) * 2018-09-03 2021-11-11 Osaka Soda Co., Ltd. Silver nanoparticles
WO2022009754A1 (fr) * 2020-07-06 2022-01-13 バンドー化学株式会社 Composition de liaison et procédé de formulation pour composition de liaison
JP7015415B1 (ja) * 2020-08-26 2022-02-02 バンドー化学株式会社 接合用組成物
WO2022190859A1 (fr) * 2021-03-09 2022-09-15 株式会社ダイセル Composition de dispersion contenant des nanoparticules métalliques

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016166948A1 (fr) * 2015-04-17 2016-10-20 バンドー化学株式会社 Composition de fines particules d'argent
WO2017006531A1 (fr) * 2015-07-08 2017-01-12 バンドー化学株式会社 Composition d'assemblage et procédé d'assemblage
WO2017038572A1 (fr) * 2015-08-31 2017-03-09 ハリマ化成株式会社 Pâte conductrice
JP2017111975A (ja) * 2015-12-16 2017-06-22 三菱マテリアル株式会社 接合材及び接合体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11081253B2 (en) * 2016-11-08 2021-08-03 Dowa Electronics Materials Co., Ltd. Silver particle dispersing solution, method for producing same, and method for producing conductive film using silver particle dispersing solution

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016166948A1 (fr) * 2015-04-17 2016-10-20 バンドー化学株式会社 Composition de fines particules d'argent
WO2017006531A1 (fr) * 2015-07-08 2017-01-12 バンドー化学株式会社 Composition d'assemblage et procédé d'assemblage
WO2017038572A1 (fr) * 2015-08-31 2017-03-09 ハリマ化成株式会社 Pâte conductrice
JP2017111975A (ja) * 2015-12-16 2017-06-22 三菱マテリアル株式会社 接合材及び接合体の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210346949A1 (en) * 2018-09-03 2021-11-11 Osaka Soda Co., Ltd. Silver nanoparticles
WO2022009754A1 (fr) * 2020-07-06 2022-01-13 バンドー化学株式会社 Composition de liaison et procédé de formulation pour composition de liaison
JP7025603B1 (ja) * 2020-07-06 2022-02-24 バンドー化学株式会社 接合用組成物の製造方法
JP7015415B1 (ja) * 2020-08-26 2022-02-02 バンドー化学株式会社 接合用組成物
WO2022044696A1 (fr) * 2020-08-26 2022-03-03 バンドー化学株式会社 Composition liante
CN115916431A (zh) * 2020-08-26 2023-04-04 阪东化学株式会社 接合用组合物
WO2022190859A1 (fr) * 2021-03-09 2022-09-15 株式会社ダイセル Composition de dispersion contenant des nanoparticules métalliques

Also Published As

Publication number Publication date
JP6736782B2 (ja) 2020-08-05
JPWO2020040184A1 (ja) 2020-09-10

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