WO2020029645A1 - 发声器件 - Google Patents

发声器件 Download PDF

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Publication number
WO2020029645A1
WO2020029645A1 PCT/CN2019/088089 CN2019088089W WO2020029645A1 WO 2020029645 A1 WO2020029645 A1 WO 2020029645A1 CN 2019088089 W CN2019088089 W CN 2019088089W WO 2020029645 A1 WO2020029645 A1 WO 2020029645A1
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WO
WIPO (PCT)
Prior art keywords
basin frame
flexible circuit
circuit board
voice coil
sounding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/088089
Other languages
English (en)
French (fr)
Inventor
宋威
吴树文
陈致远
张帆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2020029645A1 publication Critical patent/WO2020029645A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Definitions

  • the utility model relates to the field of electro-acoustic transduction, in particular to a sound-emitting device.
  • Flexible printed flexible circuit board (Flexible Printed Circuit Board, FPC board for short) is made of flexible polyester film or polyimide insulating substrate, combined with wiring formed by etching on copper foil, and has high reliability. Excellent flexibility. It can be freely bent, rolled, and folded, and can be arbitrarily arranged according to the requirements of space layout, and can be moved and retracted in three dimensions, thereby achieving the integration of component assembly and wire connection.
  • the use of the FPC board can greatly reduce the volume of the sounding device, which is suitable for the development of the sounding device in the direction of high density, miniaturization and high reliability. Therefore, FPC boards have been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, handheld computers, digital cameras and other fields or products.
  • the present invention provides a sound emitting device, which includes a flexible circuit board, a basin frame, a diaphragm housed in the basin frame, and a voice coil that drives the diaphragm to vibrate.
  • the flexible circuit board includes a connection portion housed in the basin frame and an extension portion extending from the connection portion to the outside of the basin frame, the voice coil is electrically connected to the connection portion, and the flexible circuit board further includes A first pad electrically connected to the voice coil on the upper surface of the connection portion and a second pad located on the upper surface of the extension portion; the extension portion is folded relative to the connection portion, and The lower surface of the extension portion is fitted to the basin frame.
  • the extension portion is fitted to the basin frame after being folded 180 degrees.
  • the flexible circuit board is a single panel.
  • extension portion and the basin frame are adhered and integrated by glue.
  • the sound generating device includes two flexible circuit boards disposed symmetrically on both sides of the basin frame.
  • a first pad and a second pad are provided on each of the flexible circuit boards.
  • the beneficial effect of the utility model is that the sound generating device of the utility model is fitted with the basin frame after folding the extension of the flexible circuit board, and the two coils on the same side surface of the flexible circuit board are used to connect the voice coil and the sound generating device
  • the external device can not use double-panel, thus reducing the cost of the sounding device.
  • FIG. 1 is an exploded view of a sound generating device in an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a flexible circuit board in an embodiment of the present invention.
  • FIG. 3 is a perspective view of a partial structure of a sounding device in an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the extended portion after being folded in the embodiment of the present invention.
  • the sound emitting device 100 includes a flexible circuit board 110, a basin frame 120, a diaphragm 130 housed in the basin frame 120, and a voice coil 140 driving the diaphragm 130 to vibrate.
  • the flexible circuit board 110 includes a connection portion 111 received in the basin frame 120 and an extension portion 11 extending from the connection portion 111 to the outside of the basin frame 120.
  • the voice coil 140 is electrically connected to the connection portion 111.
  • the flexible circuit board 110 further includes a first pad 151 electrically connected to the voice coil 140 on the upper surface of the connection portion 111 and a second pad 152 on the upper surface of the extension portion 112.
  • the extension portion 112 is folded relative to the connection portion 111, and the lower surface of the extension portion 112 is in contact with the basin frame 120.
  • the solder joint 141 of the voice coil 140 is correspondingly connected to the first pad 151.
  • the first pads 151 and the second pads 152 can face different directions. Two pads located on the same side surface of the flexible circuit board connect the external equipment of the voice coil and the sound emitting device, which reduces the cost of the flexible circuit board, and further reduces the cost of the sound emitting device.
  • the extending portion 112 is folded 180 degrees to be attached to the basin frame 120 through glue.
  • a generating device as shown in FIG. 5 is formed.
  • the first pad 151 faces the upper surface of the sound generating device
  • the second pad 152 faces the lower surface of the sound generating device.
  • the sound generating device includes two flexible circuit boards 110 symmetrically disposed on both sides of the basin frame 120.
  • Each flexible circuit board 110 is provided with a first pad 151 and a second pad 152.
  • the sound generating device of the present invention is fitted to the basin frame after folding the extension of the flexible circuit board, and the two coils located on the same side surface of the flexible circuit board are used to connect the For external equipment, the flexible circuit board can use a single panel instead of a dual panel, which reduces the cost of the sounding device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本实用新型提供一种发声器件，所述发声器件包括柔性电路板、盆架、收容于所述盆架内的振膜以及驱动所述振膜振动的音圈，所述柔性电路板包括收容于所述盆架内的连接部和由所述连接部延伸至所述盆架外的延伸部，所述音圈与所述连接部电连接，所述柔性电路板还包括与位于所述连接部的上表面与所述音圈电连接的第一焊盘和位于所述延伸部的上表面的第二焊盘；所述延伸部相对于所述连接部翻折，且所述延伸部的下表面与所述盆架贴合。该发声器件通过将柔性电路板的延伸部翻折后与盆架贴合，使用位于柔性电路板同一侧表面的两个焊盘连接音圈和发声器件的外接设备，可以不使用双面板，因而降低了发声器件的成本。

Description

发声器件 技术领域
本实用新型涉及电声换能领域，特别地涉及一种发声器件。
 背景技术
柔性印刷柔性电路板(Flexible Printed Circuit Board，简称FPC板)采用柔性的聚脂薄膜或聚酰亚胺等绝缘基材，结合通过蚀刻在铜箔上形成的线路而制成，具有高度可靠性，绝佳挠曲性。它可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化。利用FPC板可大大缩小发声器件的体积，适用发声器件向高密度、小型化、高可靠方向发展的需要。因此，FPC板在航天、军事、移动通讯、手提电脑、计算机外设、掌上电脑、数字相机等领域或产品上得到了广泛的应用。
 技术问题
现有技术中，FPC板应用到发声器件时，FPC板上与音圈电连接的焊盘与发声器件外接焊盘不在同一侧，这样，FPC板往往需要使用双面板设计，与音圈连接的焊盘与发声器件外接焊盘通过过孔导通，但是双面板价格较高。
 技术解决方案
为了解决上述问题，本实用新型提供了一种发声器件，所述发声器件包括柔性电路板、盆架、收容于所述盆架内的振膜以及驱动所述振膜振动的音圈，所述柔性电路板包括收容于所述盆架内的连接部和由所述连接部延伸至所述盆架外的延伸部，所述音圈与所述连接部电连接，所述柔性电路板还包括与位于所述连接部的上表面与所述音圈电连接的第一焊盘和位于所述延伸部的上表面的第二焊盘；所述延伸部相对于所述连接部翻折，且所述延伸部的下表面与所述盆架贴合。
作为一种改进，所述延伸部翻折180度后与所述盆架贴合。
作为一种改进，所述柔性电路板为单面板。
作为一种改进，所述延伸部与所述盆架通过胶水粘贴合为一体。
作为一种改进，所述发声器件包括对称设置在所述盆架两侧的两个柔性电路板。
作为一种改进，每个所述柔性电路板上均设置有第一焊盘和第二焊盘。
 有益效果
本实用新型的有益效果是：本实用新型的发声器件通过将柔性电路板的延伸部翻折后与盆架贴合，使用位于柔性电路板同一侧表面的两个焊盘连接音圈和发声器件的外接设备，可以不使用双面板，因而降低发声器件的成本。
 附图说明
图1为本实用新型实施例中的发声器件的分解图；
图2为本实用新型实施例中的柔性电路板的结构示意图；
图3为本实用新型实施例中的发声器件部分结构的立体图；
图4为本实用新型实施例中延伸部翻折前示意图；
图5为本实用新型实施例中延伸部翻折后示意图。
 本发明的实施方式
下面通过具体实施方式结合附图1至附图4对本实用新型作进一步详细说明，以便能够更好地理解本实用新型的方案以及其各方面的优点。在以下的实施例中，提供以下具体实施方式的目的是便于对本申请公开内容更清楚透彻的理解，而不是对本实用新型的限制。其中上、下、左、右等指示方位的字词仅是针对所示结构在对应附图中位置而言。
如图1所示，本实用新型实施例提供的发声器件100包括柔性电路板110、盆架120、收容于盆架120内的振膜130以及驱动振膜130振动的音圈140。如图2所示，柔性电路板110包括收容于盆架120内的连接部111和由连接部111延伸至盆架120外的延伸部11。如图1和图3所示，音圈140与连接部111电连接。如图2所示，柔性电路板110还包括与位于连接部111的上表面与音圈140电连接的第一焊盘151和位于延伸部112的上表面的第二焊盘152。如图4所示，延伸部112相对于连接部111翻折，且延伸部112的下表面与盆架120贴合。
如图1和图2所示，音圈140的焊点141与第一焊盘151对应连接。在延伸部112翻折并与盆架120贴合后，在柔性电路板110为单面板时，第一焊盘151和第二焊盘152可以朝向不同的方向，不必使用双面板，即可以使位于柔性电路板同一侧表面的两个焊盘连接音圈和发声器件的外接设备，降低了柔性电路板的成本，进而降低了发声器件的成本。
如图4和图5所示，在本实用新型实施例中，延伸部112翻折180度后通过胶水与盆架120贴合。按照如图4中箭头所示的方向翻折延伸部112，并将延伸部112与盆架120贴合后，形成如图5所示的发生器件。其中，第一焊盘151朝向发声器件的上表面，第二焊盘152朝向发声器件的下表面。
如图2和图3所示，发声器件包括对称设置在盆架120两侧的两个柔性电路板110。每个柔性电路板110上均设置有一个第一焊盘151和一个第二焊盘152。
与现有技术相比，本实用新型的发声器件通过将柔性电路板的延伸部翻折后与盆架贴合，使用位于柔性电路板同一侧表面的两个焊盘连接音圈和发声器件的外接设备，柔性电路板可以选用单面板而非双面板，降低了发声器件的成本。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (6)

  1. 一种发声器件，所述发声器件包括柔性电路板、盆架、收容于所述盆架内的振膜以及驱动所述振膜振动的音圈，所述柔性电路板包括收容于所述盆架内的连接部和由所述连接部延伸至所述盆架外的延伸部，所述音圈与所述连接部电连接，其特征在于，
    所述柔性电路板还包括与位于所述连接部的上表面与所述音圈电连接的第一焊盘和位于所述延伸部的上表面的第二焊盘；
    所述延伸部相对于所述连接部翻折，且所述延伸部的下表面与所述盆架贴合。
  2. 根据权利要求1所述的发声器件，其特征在于，所述延伸部翻折180度后与所述盆架贴合。
  3. 根据权利要求2所述的发声器件，其特征在于，所述柔性电路板为单面板。
  4. 根据权利要求3所述的发声器件，其特征在于，所述延伸部与所述盆架通过胶水粘贴合为一体。
  5. 根据权利要求1至4任一项所述的发声器件，其特征在于，所述发声器件包括对称设置在所述盆架两侧的两个柔性电路板。
  6. 根据权利要求5所述的发声器件，其特征在于，每个所述柔性电路板上均设置有第一焊盘和第二焊盘。
PCT/CN2019/088089 2018-08-09 2019-05-23 发声器件 Ceased WO2020029645A1 (zh)

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CN201821284904.1U CN208638674U (zh) 2018-08-09 2018-08-09 发声器件
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CN208638674U (zh) * 2018-08-09 2019-03-22 瑞声科技(新加坡)有限公司 发声器件
WO2024168644A1 (zh) * 2023-02-16 2024-08-22 瑞声光电科技(常州)有限公司 柔性电路板及多功能发声装置

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CN208638674U (zh) * 2018-08-09 2019-03-22 瑞声科技(新加坡)有限公司 发声器件

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