WO2020029638A1 - 发声器件及该发声器件的制造方法 - Google Patents

发声器件及该发声器件的制造方法 Download PDF

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Publication number
WO2020029638A1
WO2020029638A1 PCT/CN2019/088072 CN2019088072W WO2020029638A1 WO 2020029638 A1 WO2020029638 A1 WO 2020029638A1 CN 2019088072 W CN2019088072 W CN 2019088072W WO 2020029638 A1 WO2020029638 A1 WO 2020029638A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
inner edge
circuit board
flexible circuit
outer edge
Prior art date
Application number
PCT/CN2019/088072
Other languages
English (en)
French (fr)
Inventor
令狐荣林
肖波
Original Assignee
瑞声声学科技(深圳)有限公司
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Publication of WO2020029638A1 publication Critical patent/WO2020029638A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/20—Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/207—Shape aspects of the outer suspension of loudspeaker diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the invention relates to the field of electroacoustic transduction, in particular to a sound generating device and a method for manufacturing the sound generating device.
  • Flexible printed flexible circuit board (Flexible Printed Circuit Board, FPC board for short) is made of flexible polyester film or polyimide insulating substrate, combined with wiring formed by etching on copper foil, and has high reliability. Excellent flexibility. It can be freely bent, rolled, and folded, and can be arbitrarily arranged according to the requirements of space layout, and can be moved and retracted in three dimensions, thereby achieving the integration of component assembly and wire connection.
  • the use of the FPC board can greatly reduce the volume of the sounding device, which is suitable for the development of the sounding device in the direction of high density, miniaturization and high reliability. Therefore, FPC boards have been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, handheld computers, digital cameras and other fields or products.
  • the advantages and disadvantages of the flexible circuit board are located under the sound film.
  • the sound emitting device works, there is a phase difference between the sound film folding ring and the force arm of the flexible circuit board, and the sound film folding ring will interfere with the force arm of the flexible circuit board. Noise is produced.
  • a first aspect of the present invention provides a sound generating device including a vibration system, a magnetic circuit system, and a housing for housing the vibration system and the magnetic circuit system.
  • the vibration system includes A first diaphragm fixed to the housing, a voice coil provided below the first diaphragm to drive the first diaphragm to generate sound, and a voice coil provided below the voice coil and fixed to the housing and elastically supported
  • the elastic support of the voice coil, the elastic support includes a flexible circuit board connected to the voice coil, and a second diaphragm fixed under the flexible circuit board
  • the housing includes a basin frame, The elastic support member is fixed to the basin frame, and the flexible circuit board is fixedly attached to the second diaphragm.
  • the flexible circuit board and the second diaphragm are bonded together to form an integrated structure through thermosetting adhesive.
  • the flexible circuit board includes a first inner edge glued to the voice coil, a first outer edge glued to the basin frame, and a connection between the first inner edge and the first outer Edge of the beam.
  • the second diaphragm includes a second inner edge fixedly attached to the first inner edge, a second outer edge fixedly attached to the first outer edge, and a connection to the second An inner edge and the second outer edge of the folded ring portion, and the folded ring portion is fixedly attached to the beam.
  • the second inner edge and the second outer edge are coplanar, and the folded ring portion is a recessed structure from a plane where the second inner edge is located away from the first diaphragm.
  • the first inner edge is coplanar with the first outer edge, and the projection of the beam on the plane on which the first inner edge is located is in the shape of a letter, a C shape, or an S shape.
  • a method for manufacturing a sounding device as described in the foregoing includes the following steps:
  • Step S110 Provide a flexible circuit board and a diaphragm.
  • the flexible circuit board includes a first inner edge, a first outer edge, and a beam connecting the first inner edge and the first outer edge.
  • the first The outer edge is coplanar with the first inner edge, and the projection of the beam on the plane on which the first inner edge is located is in the shape of a letter, C or S;
  • the diaphragm includes a second inner edge and a second outer Edge, and a folded ring portion connecting the second inner edge and the second outer edge, the second inner edge and the second outer edge are coplanar, and the folded ring portion is from the second inner edge
  • the plane where the edge is located is recessed in a direction away from the first diaphragm;
  • Step S120 apply a thermosetting adhesive on the flexible circuit board
  • Step S130 attach the first inner edge to the second inner edge, and at the same time attach the first outer edge to the second outer edge;
  • Step S140 preliminary forming the elastic support under a lower temperature environment
  • Step S150 applying heat and pressure so that the flexible circuit board and the diaphragm are completely bonded together to form the elastic support member;
  • Step S160 Install the elastic support member into the sound generating device.
  • the ambient temperature in the step S140 is 110 ° C-120 ° C
  • the ambient temperature in the step S150 is 160 ° C-180 ° C.
  • the sound generating device of the present invention includes an elastic support member including a flexible circuit board connected to the voice coil and a second diaphragm fixed under the flexible circuit board.
  • the elastic support member The flexible circuit board is fixed to the basin frame and fixed to the second diaphragm.
  • the flexible circuit board and the second diaphragm in the present invention are attached and fixed to form an integrated structure. In this way, when the height of the sounding device is constant, the vibration space of the second diaphragm can be saved and the Xmax range of the product can be increased; At the same time, the assembly process improves the pure sound yield of the product.
  • FIG. 1 is a perspective view of a sound generating device in an embodiment of the present invention
  • FIG. 2 is an exploded view of a sound generating device in an embodiment of the present invention
  • FIG. 3 is a cross-sectional view of the sound generating device shown in FIG. 1 along the AA direction;
  • FIG. 4 is an enlarged view at B in FIG. 3; FIG.
  • FIG. 5 is a schematic structural diagram of removing a sounding device in an embodiment of the present invention.
  • FIG. 6 is a perspective view of a flexible circuit board in an embodiment of the present invention.
  • FIG. 7 is a perspective view of a second diaphragm in an embodiment of the present invention.
  • FIG. 8 is a flowchart of a method for manufacturing an elastic support member according to an embodiment of the present invention.
  • the first aspect of the present invention relates to a sound emitting device 100 including a vibration system 110, a magnetic circuit system 120, and A housing 130 that houses the vibration system 110 and the magnetic circuit system 120.
  • the vibration system 110 includes a first diaphragm 111 fixed to the casing 130, a voice coil 112 provided below the first diaphragm 111 to drive the first diaphragm 111 to vibrate and emit sound, and a sound coil 112 provided on the sound
  • the elastic support 113 of the voice coil 112 is fixed to the casing 130 below and elastically supports the voice coil 112.
  • the elastic supporting member 113 includes a flexible circuit board 113a connected to the voice coil 112, and a second diaphragm 113b fixed below the flexible circuit board 113a.
  • the housing 130 includes a basin frame 131.
  • the elastic support member 113 is fixed to the basin frame 131, and the flexible circuit board 113a and the second diaphragm 113b are fixed and fixed.
  • the elastic supporting member 113 includes a flexible circuit board 113a connected to the voice coil 112 and a second diaphragm 113b fixed below the flexible circuit board 113a.
  • the elastic support The piece 113 is fixed to the basin frame 131, and the flexible circuit board 113a and the second diaphragm 113b are fixed to each other.
  • the flexible circuit board 113a and the second diaphragm 113b are fixed together to form an integrated structure. In this way, when the height of the sounding device 100 is constant, the vibration space of the second diaphragm 113b can be saved and the product can be improved. Xmax range; reduce the assembly process and improve the pure sound yield of the product.
  • the flexible circuit board 113a may be integrated with the second diaphragm 113b by thermosetting adhesive to form an integrated structure. That is, when the elastic supporting member 113 is formed, the flexible circuit board 113a may be formed on the outer surface of the flexible circuit board 113a. After coating the thermosetting adhesive, the second diaphragm 113b is placed on the flexible circuit board 113a. The applied thermosetting adhesive can be used to form the flexible circuit board 113a and the second diaphragm when the second diaphragm 113b is hot-pressed. The film 113b is glued into one body, thereby simplifying the manufacturing process of the elastic support member 113, reducing the manufacturing cost, and improving economic benefits.
  • thermosetting adhesive in addition to the above-mentioned elastic supporting member 113, in addition to the flexible circuit board 113a and the second diaphragm 113b can be bonded to form an integrated structure through thermosetting adhesive, other bonding methods can also be adopted.
  • the flexible circuit board 113 a includes a first inner edge 113 a 1 that is glued to the voice coil 112, a first outer edge 113 a 2 that is glued to the basin frame 131, and a first An inner edge 113a1 and a cross beam 113a3 of the first outer edge 113a2.
  • the provided cross beam 113a3 can play a role of conducting the voice coil 112 and an external flexible circuit board.
  • the second diaphragm 113 b includes a second inner edge 113 b 1 that is fixedly attached to the first inner edge 113 a 1 and a second outer edge that is fixed and fixed to the first outer edge 113 a 2.
  • An edge 113b2 and a folded ring portion 113b3 connecting the second inner edge 113b1 and the second outer edge 113b2, and the folded ring portion 113b3 is fixedly attached to the cross beam 113a3.
  • the sound generating device 100 in this embodiment by fixing the folded ring portion 113b3 and the cross beam 113a3, can effectively solve the pure sound caused by the collision between the folded ring portion 113b3 and the cross beam 113a3 when the existing product vibrates. Problems, so that the sound emission performance of the sound emission device 100 can be improved.
  • the second inner edge 113b1 and the second outer edge 113b2 are coplanar, and the folded ring portion 113b3 is far away from the first plane from the plane where the second inner edge 113b1 is located.
  • the direction of the diaphragm 111 is recessed.
  • the first inner edge 113 a 1 and the first outer edge 113 a 2 are coplanar, and the projection of the beam 113 a 3 on the plane where the first inner edge 113 a 1 is located is in the shape of a letter and a C shape. Or S-shaped.
  • the projection of the beam 113a3 on the plane on which the first inner edge 113a1 is located may also take other shapes, and may be designed according to the specific use situation.
  • the flexible circuit board 113a may be provided with a plurality of the beams 113a3, for example, two, three, or other numbers of the beams 113a3, and the specific number of the beams 113a3 required may be determined according to a specific usage scenario.
  • the two elastic support members 113 are arranged symmetrically. Specifically, as shown in FIG. 1, the two elastic support members 113 may be symmetrically disposed in a long axis direction of the sound emitting device 100 On both sides.
  • the magnetic circuit system 120 includes a lower clamping plate 121 connected to the basin frame 131, and a main magnetic steel 122, a pole core 123, and The secondary magnetic steels 124 are symmetrically disposed on both sides of the primary magnetic steel 122. Among them, a magnetic gap S1 is formed between the secondary magnetic steel 124 and the main magnetic steel 122, and the above-mentioned voice coil 112 is inserted in the magnetic gap S1.
  • the lower splint 121 and the basin frame 131 together form a receiving space S2 for receiving the vibration system 110 and the magnetic circuit system 120.
  • the housing 130 also includes an upper clamp plate 132 disposed on a side of the auxiliary magnetic steel 124 facing away from the lower clamp plate 121, that is, the auxiliary magnetic steel 124 is sandwiched between the upper clamp plate 132 and the lower clamp plate 121.
  • the upper clamp plate 132 is fixed to the basin frame 131.
  • the sound emitting device 100 may further include a structure such as a dome 140 covered above the first diaphragm 111.
  • a method S100 for manufacturing a sounding device described in the foregoing includes the following steps:
  • S110 Provide a flexible circuit board and a diaphragm.
  • the structure of the provided flexible circuit board may refer to FIG. 5 together.
  • the flexible circuit board 113a includes a first inner edge 113a1, a first outer edge 113a2, and a first inner edge 113a1.
  • the beam 113a3 and the first outer edge 113a2, the first outer edge 113a2, and the first inner edge 113a1 are coplanar.
  • the specific structure of the provided diaphragm can be referred to FIG. 1 together.
  • the diaphragm is the structure of the second diaphragm shown in FIG. 6, which includes a second inner edge 113b1, a second outer edge 113b2, and a connection unit.
  • the second inner edge 113b1 and the second outer edge 113b2 of the folded ring portion 113b3, the second inner edge 113b1 and the second outer edge 113b2 are coplanar, and the second folded edge portion 113b3 is from the second The plane where the inner edge 113 b 1 is located is recessed in a direction away from the first diaphragm 111.
  • thermosetting adhesive can be applied to the flexible circuit board by a manual or a machine.
  • the lower temperature used may be determined according to actual needs.
  • the elastic support may be initially formed at an ambient temperature of 110 ° C to 120 ° C.
  • the elastic support may be formed at other temperatures. At some ambient temperatures, the elastic support is initially formed.
  • the elastic supporting member 113 is fixed to the basin frame 131, and one side of the flexible circuit board 113a is fixedly connected to the voice coil 112.
  • the flexible circuit board and the diaphragm can be completely bonded and integrated at an ambient temperature of 160 ° C. to 180 ° C. to form the elastic supporting member.
  • the flexible circuit board and the diaphragm can also be completely bonded and integrated at other ambient temperatures to form the elastic support.
  • the ambient temperature in this step should be greater than the ambient temperature in step S140.
  • a flexible circuit board and the second diaphragm are bonded and fixed by a thermosetting adhesive to form an integrated structure.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明提供一种发声器件及该发声器件的制造方法，包括振动系统、磁路系统、以及用于收容振动系统和磁路系统的壳体，振动系统包括固定于壳体的第一振膜、设于第一振膜下方驱动第一振膜振动发声的音圈以及设于音圈下方固定于壳体并弹性支撑音圈的弹性支撑件，弹性支撑件包括与音圈连接的柔性电路板、以及固接于柔性电路板下方的第二振膜，壳体包括盆架，弹性支撑件固定于盆架，柔性电路板与第二振膜贴合固定。本发明中的柔性电路板与第二振膜贴合固定，形成一体结构，这样，在发声器件高度一定的情况下，可以节省第二振膜的振动空间，提高产品的Xmax范围；减少装配工序同时提升产品纯音良率。

Description

发声器件及该发声器件的制造方法 技术领域
本发明涉及电声换能领域，特别地涉及一种发声器件以及该发声器件的制造方法。
 背景技术
柔性印刷柔性电路板(Flexible Printed Circuit Board，简称FPC板)采用柔性的聚脂薄膜或聚酰亚胺等绝缘基材，结合通过蚀刻在铜箔上形成的线路而制成，具有高度可靠性，绝佳挠曲性。它可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化。利用FPC板可大大缩小发声器件的体积，适用发声器件向高密度、小型化、高可靠方向发展的需要。因此，FPC板在航天、军事、移动通讯、手提电脑、计算机外设、掌上电脑、数字相机等领域或产品上得到了广泛的应用。
 技术问题
现有技术中，柔性电路板的利弊位于音膜下方，发声器件工作时，音膜折环与柔性电路板的力臂存在相位差，音膜折环会与柔性电路板的力臂干涉，从而产生杂音。
 技术解决方案
为了解决上述问题，本发明的第一方面，提供了一种发声器件，包括振动系统、磁路系统、以及用于收容所述振动系统和所述磁路系统的壳体，所述振动系统包括固定于所述壳体的第一振膜、设于所述第一振膜下方驱动所述第一振膜振动发声的音圈以及设于所述音圈下方固定于所述壳体并弹性支撑所述音圈的弹性支撑件，所述弹性支撑件包括与所述音圈连接的柔性电路板、以及固接于所述柔性电路板下方的第二振膜，所述壳体包括盆架，所述弹性支撑件固定于所述盆架所述柔性电路板与所述第二振膜贴合固定。
作为一种改进，所述柔性电路板与所述第二振膜通过热固胶贴合形成一体结构。
作为一种改进，所述柔性电路板包括与所述音圈胶合连接的第一内缘、与所述盆架胶合连接的第一外缘以及连接所述第一内缘和所述第一外缘的横梁。
作为一种改进，所述第二振膜包括与所述第一内缘贴合固定的第二内缘、与所述第一外缘贴合固定的第二外缘、以及连接所述第二内缘与所述第二外缘的折环部，所述折环部与所述横梁贴合固定。
作为一种改进，所述第二内缘和所述第二外缘共面，所述折环部为自所述第二内缘所在平面向远离所述第一振膜的方向凹陷结构。
作为一种改进，所述第一内缘与所述第一外缘共面，所述横梁在所述第一内缘所在平面上的投影呈一字形、C形或者S形。
作为一种改进，所述横梁有多个。
作为一种改进，所述弹性支撑件有两个且对称设置。
本发明的第二方面，提供了一种前文记载的发声器件的制造方法，该方法包括如下步骤：
步骤S110、提供一柔性电路板和一个振膜，所述柔性电路板包括第一内缘、第一外缘以及连接所述第一内缘和所述第一外缘的横梁，所述第一外缘和所述第一内缘共面，所述横梁在所述第一内缘所在平面上的投影呈一字形、C形或者S形；所述振膜包括第二内缘、第二外缘、以及连接所述第二内缘与所述第二外缘的折环部，所述第二内缘和所述第二外缘共面，所述折环部为自所述第二内缘所在平面向远离所述第一振膜的方向凹陷结构；
步骤S120、在所述柔性电路板上涂覆热固胶；
步骤S130、将所述第一内缘贴附在所述第二内缘上，同时将所述第一外缘贴附在所述第二外缘上；
步骤S140、在较低温度环境下使所述弹性支撑件初步成型；
步骤S150、加热加压，使得所述柔性电路板与所述振膜完全粘合成一体，形成所述弹性支撑件；
步骤S160、将所述弹性支撑件安装入所述发声器件中。
作为一种改进，所述步骤S140中环境温度为110℃-120℃，所述步骤S150中环境温度为160℃-180℃。
 有益效果
本发明的有益效果是：本发明的发声器件，其弹性支撑件包括与所述音圈连接的柔性电路板、以及固接于所述柔性电路板下方的第二振膜，所述弹性支撑件固定于所述盆架，所述柔性电路板与所述第二振膜贴合固定。本发明中的柔性电路板与所述第二振膜贴合固定，形成一体结构，这样，在发声器件高度一定的情况下，可以节省第二振膜的振动空间，提高产品的Xmax范围；减少装配工序同时提升产品纯音良率。
 附图说明
图1为本发明实施例中的发声器件的立体图；
图2为本发明实施例中的发声器件的分解图；
图3为图1中所示的发声器件沿AA方向的剖视图；
图4为图3中B处的放大图；
图5为本发明实施例中发声器件去除的结构示意图；
图6为本发明实施例中柔性电路板的立体图；
图7为本发明实施例中第二振膜的立体图；
图8为本发明实施例中弹性支撑件的制造方法的流程图。
 本发明的实施方式
下面通过具体实施方式结合附图1至附图7对本发明作进一步详细说明，以便能够更好地理解本发明的方案以及其各方面的优点。在以下的实施例中，提供以下具体实施方式的目的是便于对本申请公开内容更清楚透彻的理解，而不是对本发明的限制。其中上、下、左、右等指示方位的字词仅是针对所示结构在对应附图中位置而言。
如图1、图2、图3、图4和图5所示，本发明的第一方面，涉及一种发声器件100，所述发声器件100包括振动系统110、磁路系统120、以及用于收容所述振动系统110和所述磁路系统120的壳体130。所述振动系统110包括固定于所述壳体130的第一振膜111、设于所述第一振膜111下方驱动所述第一振膜111振动发声的音圈112以及设于所述音圈112下方固定于所述壳体130并弹性支撑所述音圈112的弹性支撑件113。其中，所述弹性支撑件113包括与所述音圈112连接的柔性电路板113a、以及固接于所述柔性电路板113a下方的第二振膜113b，所述壳体130包括盆架131，所述弹性支撑件113固定于所述盆架131，所述柔性电路板113a与所述第二振膜113b贴合固定。
本实施例中的发声器件100，其弹性支撑件113包括与所述音圈112连接的柔性电路板113a、以及固接于所述柔性电路板113a下方的第二振膜113b，所述弹性支撑件113固定于所述盆架131，所述柔性电路板113a与所述第二振膜113b贴合固定。本实施例中的柔性电路板113a与所述第二振膜113b贴合固定，形成一体结构，这样，在发声器件100高度一定的情况下，可以节省第二振膜113b的振动空间，提高产品的Xmax范围；减少装配工序同时提升产品纯音良率。
具体地，所述柔性电路板113a可以与所述第二振膜113b通过热固胶贴合形成一体结构，也就是说，在制作形成弹性支撑件113时，可以在柔性电路板113a的外表面涂覆热固胶，之后，将第二振膜113b放置到柔性电路板113a上，所涂覆的热固胶，可以在第二振膜113b热压成型时将柔性电路板113a与第二振膜113b胶合为一体，从而可以简化弹性支撑件113的制作工艺，降低制作成本，提高经济效益。
当然，上述的弹性支撑件113除了可以通过热固胶将柔性电路板113a与第二振膜113b贴合形成一体结构以外，还可以采用其他的一些粘结方式。
如图2和图6所示，所述柔性电路板113a包括与所述音圈112胶合连接的第一内缘113a1、与所述盆架131胶合连接的第一外缘113a2以及连接所述第一内缘113a1和所述第一外缘113a2的横梁113a3，所设置的横梁113a3可以起到将音圈112与外接柔性电路板的导通作用。
如图2和图7所示，所述第二振膜113b包括与所述第一内缘113a1贴合固定的第二内缘113b1、与所述第一外缘113a2贴合固定的第二外缘113b2、以及连接所述第二内缘113b1与所述第二外缘113b2的折环部113b3，所述折环部113b3与所述横梁113a3贴合固定。本实施例中的发声器件100，通过将折环部113b3与所述横梁113a3贴合固定，可以有效解决现有的产品震动时，折环部113b3与所述横梁113a3的相互撞击带来的纯音问题，从而可以提高发声器件100的发声性能。
如图2和图7所示，所述第二内缘113b1和所述第二外缘113b2共面，所述折环部113b3为自所述第二内缘113b1所在平面向远离所述第一振膜111的方向凹陷结构。
如图2和图6所示，所述第一内缘113a1与所述第一外缘113a2共面，所述横梁113a3在所述第一内缘113a1所在平面上的投影呈一字形、C形或者S形。当然，该横梁113a3在所述第一内缘113a1所在平面上的投影还可以呈其他形状，可以根据具体使用情况进行设计。
如图2和图6所示，为了进一步有效解决现有的产品震动时，折环部113b3与所述横梁113a3的相互撞击带来的纯音问题，从而可以提高发声器件100的发声性能，所述柔性电路板113a可以设置有多个所述横梁113a3，例如，两个、三个或者其他数量的横梁113a3，可以根据具体使用场景进行确定所需要的横梁113a3的具体数量。
如图2和图6所示，所述弹性支撑件113有两个且对称设置，具体地，如图1所示，两个所述弹性支撑件113可以对称设置在发声器件100的长轴方向的两侧。
此外，如图2和图3所示，所述磁路系统120包括与所述盆架131连接的下夹板121、以及依次设于所述下夹板121上的主磁钢122、极芯123以及对称设置在主磁钢122两侧的副磁钢124。其中，副磁钢124与主磁钢122之间具有磁间隙S1，上述的音圈112便插置在该磁间隙S1中。所述下夹板121和所述盆架131共同围成收容所述振动系统110和所述磁路系统120的收容空间S2。此外，壳体130还包括上夹板132，该上夹板132设置在副磁钢124背离下夹板121的一侧，也就是说，副磁钢124夹设在上夹板132与下夹板121之间，所述上夹板132与所述盆架131固定。
此外，如图2和图3所示，发声器件100还可以包括盖设在第一振膜111上方的球顶140等结构。
如图8所示，本发明的第二方面，提供了一种前文记载的发声器件的制造方法S100，该方法包括如下步骤：
S110、提供一柔性电路板和一个振膜。
具体地，在本步骤中，所提供的柔性电路板的结构可以一并参考图5，所述柔性电路板113a包括第一内缘113a1、第一外缘113a2以及连接所述第一内缘113a1和所述第一外缘113a2的横梁113a3，所述第一外缘113a2、与所述第一内缘113a1共面。所提供的振膜的具体结构可以一并参考图1，该振膜即为图6中所示的第二振膜的结构，其包括第二内缘113b1、第二外缘113b2、以及连接所述第二内缘113b1与所述第二外缘113b2的折环部113b3，所述第二内缘113b1和所述第二外缘113b2共面，所述折环部113b3为自所述第二内缘113b1所在平面向远离所述第一振膜111的方向凹陷结构。
S120、在所述柔性电路板上涂覆热固胶。
具体地，在本步骤中，可以通过人工或者机器的方式在柔性电路板上涂覆热固胶。
S130、将所述第一内缘贴附在所述第二内缘上，同时将所述第一外缘贴附在所述第二外缘上。
S140、在较低温度环境下使所述弹性支撑件初步成型。
具体地，在本步骤中，所采用的较低温度可以根据实际需要进行确定，例如，可以在环境温度为110℃-120℃下使得所述弹性支撑件初步成型，当然，也可以在其他的一些环境温度下使得所述弹性支撑件初步成型。
S150、加热加压，使得所述柔性电路板与所述振膜完全粘合成一体，形成所述弹性支撑件113。
S160、将所述弹性支撑件安装入所述发声器件中。
具体地，将所述弹性支撑件113固定于所述盆架131，且柔性电路板113a的一侧与所述音圈112固定连接。
具体地，在本步骤中，可以在环境温度为160℃-180℃下，使得所述柔性电路板与所述振膜完全粘合成一体，形成所述弹性支撑件。当然，根据实际需要，还可以在其他环境温度下使得所述柔性电路板与所述振膜完全粘合成一体，形成所述弹性支撑件。但是，该步骤中的环境温度应当大于步骤S140中的环境温度。
本实施例中的弹性支撑件的制作方法S100，其将柔性电路板与所述第二振膜通过热固胶进行贴合固定，形成一体结构，这样，在发声器件高度一定的情况下，可以节省第二振膜的振动空间，提高产品的Xmax范围；减少装配工序同时提升产品纯音良率。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (10)

  1. 一种发声器件，包括振动系统、磁路系统、以及用于收容所述振动系统和所述磁路系统的壳体，其特征在于，所述振动系统包括固定于所述壳体的第一振膜、设于所述第一振膜下方驱动所述第一振膜振动发声的音圈以及设于所述音圈下方固定于所述壳体并弹性支撑所述音圈的弹性支撑件，所述弹性支撑件包括与所述音圈连接的柔性电路板、以及固接于所述柔性电路板下方的第二振膜，所述壳体包括盆架，所述弹性支撑件固定于所述盆架，所述柔性电路板与所述第二振膜贴合固定。
  2. 根据权利要求1所述的发声器件，其特征在于，所述柔性电路板与所述第二振膜通过热固胶贴合形成一体结构。
  3. 根据权利要求2所述的发声器件，其特征在于，所述柔性电路板包括与所述音圈胶合连接的第一内缘、与所述盆架胶合连接的第一外缘以及连接所述第一内缘和所述第一外缘的横梁。
  4. 根据权利要求3所述的发声器件，其特征在于，所述第二振膜包括与所述第一内缘贴合固定的第二内缘、与所述第一外缘贴合固定的第二外缘、以及连接所述第二内缘与所述第二外缘的折环部，所述折环部与所述横梁贴合固定。
  5. 根据权利要求4所述的发声器件，其特征在于，所述第二内缘和所述第二外缘共面，所述折环部为自所述第二内缘所在平面向远离所述第一振膜的方向凹陷结构。
  6. 根据权利要求3所述的发声器件，其特征在于，所述第一内缘与所述第一外缘共面，所述横梁在所述第一内缘所在平面上的投影呈一字形、C形或者S形。
  7. 根据权利要求3所述的发声器件，其特征在于，所述横梁有多个。
  8. 根据权利要求1所述的发声器件，其特征在于，所述弹性支撑件有两个且对称设置。
  9. 一种如权利要求1-8中任意权利要求所述的发声器件的制造方法，该方法包括如下步骤：
    步骤S110、提供一柔性电路板和一个振膜，所述柔性电路板包括第一内缘、第一外缘以及连接所述第一内缘和所述第一外缘的横梁，所述第一外缘与所述第一内缘共面，所述横梁在所述第一内缘所在平面上的投影呈一字形、C形或者S形；所述振膜包括第二内缘、第二外缘、以及连接所述第二内缘与所述第二外缘的折环部，所述第二内缘和所述第二外缘共面，所述折环部为自所述第二内缘所在平面向远离所述第一振膜的方向凹陷结构；
    步骤S120、在所述柔性电路板上涂覆热固胶；
    步骤S130、将所述第一内缘贴附在所述第二内缘上，同时将所述第一外缘贴附在所述第二外缘上；
    步骤S140、在较低温度环境下使所述弹性支撑件初步成型；
    步骤S150、加热加压，使得所述柔性电路板与所述振膜完全粘合成一体，形成所述弹性支撑件；
    步骤S160、将所述弹性支撑件安装入所述发声器件中。
  10. 根据权利要求9中所述的发声器件的制造方法，其特征在于，所述步骤S140中环境温度为110℃-120℃，所述步骤S150中环境温度为160℃-180℃。
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