WO2020024974A1 - 电路板组件、显示装置及其制造方法 - Google Patents

电路板组件、显示装置及其制造方法 Download PDF

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Publication number
WO2020024974A1
WO2020024974A1 PCT/CN2019/098562 CN2019098562W WO2020024974A1 WO 2020024974 A1 WO2020024974 A1 WO 2020024974A1 CN 2019098562 W CN2019098562 W CN 2019098562W WO 2020024974 A1 WO2020024974 A1 WO 2020024974A1
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WIPO (PCT)
Prior art keywords
flat cable
flexible flat
circuit board
board
display device
Prior art date
Application number
PCT/CN2019/098562
Other languages
English (en)
French (fr)
Inventor
容其贵
黄音
赵留帅
Original Assignee
京东方科技集团股份有限公司
高创(苏州)电子有限公司
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Priority to US16/642,442 priority Critical patent/US11350527B2/en
Publication of WO2020024974A1 publication Critical patent/WO2020024974A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/64—Constructional details of receivers, e.g. cabinets or dust covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the technical field of display devices, and particularly to the arrangement of circuit boards within a display device, and also to a method of manufacturing a display device.
  • the existing LCD TV usually includes a main board (also referred to as a TV main board or a TV main board) and a logic board.
  • a main board also referred to as a TV main board or a TV main board
  • a logic board there are generally two ways of setting the logic board.
  • the first method is to integrate the logic board on the TV motherboard, but this method will increase the area of the TV motherboard and also limit the output mode of the TV motherboard, so that the TV motherboard must be customized, so it can only support the corresponding one. This kind of screen restricts the scope of application of the TV motherboard.
  • the second method is to make the logic board as an independent board card, and then fix the logic board on the display panel of the LCD TV, but fixing the logic board to the display panel will occupy the space of the display panel and increase the area of the display panel.
  • an additional low-voltage differential signal (Low Differential Signaling, also called LVDS) DuPont line is needed to connect the TV motherboard to pass the LVDS signal. Either way, it will increase the cost of LCD TVs.
  • LVDS Low Differential Signaling
  • a circuit board assembly including: a first circuit board, the first circuit board including a first surface and a second surface opposite to the first surface, the first surface A first connector is disposed on a first surface of the circuit board; a second circuit board includes a first surface and a second surface opposite to the first surface; A second connection member is provided on the two surfaces; wherein the first connection member and the second connection member are configured to be directly connected to each other in cooperation; wherein, when the first connection member and the second connection member When the connectors are directly connected together, the circuit board assembly forms a stacked structure in which the first surface of the first circuit board and the second surface of the second circuit board are opposed to each other.
  • the first connection member is a pin, and the second connection member is a socket; or the first connection member is a socket, and the second connection member is a pin.
  • the second connection member is disposed on a second surface of the second circuit board in a surface-mount form.
  • a plurality of components are provided on at least one of the first surface and the second surface of the second circuit board, and the components are all chip components, and all are A surface mount form is provided on the at least one surface.
  • a display device including the circuit board assembly as described above.
  • the first circuit board is a main board
  • the second circuit board is a logic board
  • the first connection member and the second connection member are configured to be connected between the main board and the main board.
  • the low-voltage differential signals are transmitted between the logic boards.
  • the first connection member is a DuPont pin header
  • the second connection member is a corresponding socket
  • the logic board is a timing control circuit board.
  • the display device further includes an X-coordinate circuit board; a first flat surface of the logic board is provided with a flexible flat cable holder, and the flexible flat cable holder is connected with the flexible flat cable through a flexible flat cable. Signal interface connection of X coordinate circuit board.
  • the flexible flat cable is only adjacent to the first surface of the main board with respect to the main board.
  • the flexible flat cable includes between the two ends thereof at least one slit extending along a length direction of the flexible flat cable.
  • the flexible flat cable line starts from the flexible flat cable holder with the first of the motherboard
  • the surfaces are adjacent and extend to the edge of the motherboard along a first direction away from the signal interface, and the flexible flat cable passes around the motherboard at the edge and is adjacent to the second surface of the motherboard And it extends along a second direction opposite to the first direction.
  • the flexible flat cable is surrounded by a heat-shrinkable sleeve and a metal foil.
  • the flexible flat cable holder is provided on a first surface of the logic board in a surface mount form.
  • the display device is a liquid crystal television, a plasma television, or a tablet computer.
  • a method for manufacturing the above display device comprising the steps of: directly connecting the logic board to the main board to form the circuit board assembly; using the flexible flat
  • the cable connects the flexible flat cable socket of the logic board with the signal interface of the X-coordinate circuit board.
  • the step of using the flexible flat cable to connect the flexible flat cable holder of the logic board to the signal interface of the X-coordinate circuit board includes: connecting the flexible flat cable To the flexible flat cable holder; extending the flexible flat cable to the edge of the motherboard adjacent to the first surface of the motherboard; and leaving the flexible flat cable from the motherboard from the edge , Extend and connect to the signal interface.
  • At least one gap extending along a length direction of the flexible flat cable is formed between both ends of the flexible flat cable.
  • the step of using the flexible flat cable to connect the flexible flat cable holder of the logic board to the signal interface of the X-coordinate circuit board includes: connecting the flexible flat cable To the flexible flat cable holder; making the flexible flat cable line adjacent to the first surface of the main board and extending to the first edge of the main board along a first direction away from the signal interface; making the A flexible flat cable bypasses the first edge, is adjacent to the second surface of the main board, and extends to a second edge of the main board in a second direction opposite to the first direction; and A flexible flat cable exits the motherboard from the second edge, extends and connects to the signal interface.
  • the flexible flat cable is surrounded by a heat shrinkable sleeve and a metal foil.
  • FIG. 1 is a schematic diagram schematically showing a connection relationship between components in a display device in the prior art
  • FIG. 2 is a schematic diagram schematically showing a connection relationship between components in a display device according to an exemplary embodiment of the present disclosure
  • FIG. 3 is a schematic perspective view of the main board shown in FIG. 2, which shows a first connection member provided on the main board;
  • FIG. 4 is a schematic perspective view of the logic board shown in FIG. 2, in which a second connection member provided on the logic board is shown;
  • FIG. 5 schematically illustrates a circuit board assembly formed when the main board and the logic board shown in FIG. 2 are directly connected together;
  • FIG. 6 schematically illustrates a surface of the logic board shown in FIG. 2 on which a flexible flat cable holder is provided;
  • FIG. 7 schematically illustrates a connection manner of a logic board and an X-coordinate circuit board according to an exemplary embodiment of the present disclosure
  • FIG. 8 schematically illustrates another connection manner of a logic board and an X-coordinate circuit board according to an exemplary embodiment of the present disclosure
  • FIG. 9 schematically illustrates, in a flowchart form, a method for manufacturing a display device according to an exemplary embodiment of the present disclosure
  • FIG. 10 schematically illustrates a method for connecting a flexible flat cable socket of a logic board to a signal interface of an X-coordinate circuit board by using a flexible flat cable in the method shown in FIG. 9 in a flowchart form;
  • FIG. 11 schematically illustrates another way of connecting the flexible flat cable socket of the logic board with the signal interface of the X-coordinate circuit board by using the flexible flat cable in the method shown in FIG. 9 in the form of a flowchart.
  • first the terms “first,” “second,” etc. may be used herein to describe various elements, components and / or sections, these elements, components and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component or part from another element, component or part. Accordingly, a first element, component, or section discussed below can also be referred to as a second or third element, component, or section without departing from the teachings of the present disclosure.
  • steps included in the methods described in this disclosure are all exemplary, and they do not necessarily have to be performed in the listed order, but one or more of these steps may be performed in a different order or simultaneously according to the actual situation .
  • the described method may include other additional steps.
  • the LCD TV 1 includes a TV main board 01, a TV logic board 02, a TV X coordinate circuit board 03 (also referred to as an X-PCB board or an X-board board), and a TV display panel 04.
  • the TV logic board 02 is an independent board card, so it generally needs to be fixed on the TV display panel 04.
  • the TV logic board 02 and the TV main board 01 are connected through an LVDS DuPont line in order to transmit LVDS signals.
  • the TV logic board 02 and the TV X-coordinate circuit board 03 on the TV display panel 04 are connected by a flexible flat cable (Flexible Flat Cable, also called FFC) wire, so as to transmit minilvds signals. It is easy to understand that fixing the TV logic board 02 to the TV display panel 04 will occupy the area of the TV display panel 04, resulting in having to increase the area of the TV display panel 04.
  • the TV logic board 12 requires additional LVDS DuPont Cable to connect the TV motherboard 01, these all increase the cost of the LCD TV.
  • the display device according to an exemplary embodiment of the present disclosure may be a liquid crystal television, a plasma television, a tablet computer, or the like.
  • the display device 10 includes a main board 11, a logic board 12, an X-coordinate circuit board 15, and a display panel 17, wherein the main board 11 and the logic board 12 form a circuit board assembly 20 having a stacked structure.
  • the logic board 12 constituting the circuit board assembly 20 is also connected to the X coordinate circuit board 15 through a flexible flat cable so as to transmit minilvds signals.
  • the motherboard 11 in the display device 10 shown in FIG. 2 is schematically shown in a perspective view.
  • the main board 11 includes a first surface 11-1 and a second surface 11-2 that are opposite to each other, and various types required for the main board 11 may be disposed on at least one of the first surface 11-1 and the second surface 11-2. Components and multiple circuit traces.
  • the first surface 11-1 of the main board 11 is provided with a first connector 13 for directly connecting the main board 11 and the logic board 12 to form a circuit board assembly 20.
  • a logic board 12 in the display device 10 shown in FIG. 2 is schematically shown in a perspective view.
  • the logic board 12 also includes a first surface 12-1 and a second surface 12-2 that are opposite to each other, wherein at least one of the first surface 12-1 and the second surface 12-2 may be provided with the logic board 12 Of various components and multiple circuit traces.
  • the second surface 12-2 of the logic board 12 is provided with a second connecting member 14.
  • the second connection member 14 is provided to cooperate with the first connection member 13 so that the second connection member 14 can be directly connected to the first connection member 13 so as to form the circuit board assembly 20.
  • the first connection member 13 may be a pin or a socket
  • the second connection member 14 may be a corresponding socket or a pin.
  • the first connector 13 and the second connector 14 are configured to transmit a low-voltage differential signal between the main board 11 and the logic board 12.
  • FIG. 5 it schematically illustrates a circuit board formed when the main board 11 and the logic board 12 shown in FIG. 2, FIG. 3, and FIG. 4 are directly connected together through the first connection member 13 and the second connection member 14.
  • Component 20 In the formed circuit board assembly 20, the main board 11 and the logic board 12 form a stacked structure, in which the first surface 11-1 of the main board 11 and the second surface 12-2 of the logic board 12 are opposed to each other, thereby making full use of The three-dimensional space of the main board 11 is reduced, the area occupied by the main board 11 when the logic board 12 is integrated on the main board 11, and the area occupied by the display panel 17 when the logic board 12 is fixed on the display panel 17 are reduced.
  • first connecting member 13 may also be provided on the other surface of the motherboard 11, and similarly, the second connecting member 14 may also be provided on the other surface of the logic board 12, as long as the first connecting member 13 and the second The connecting member 14 can be directly connected so that the motherboard 11 and the logic board 12 form a circuit board assembly with a stacked structure.
  • the exemplary embodiments of the present disclosure do not limit the specific structures, types, sizes, and the like of the main board 11 and the logic board 12.
  • the main board 11 may be a television main board
  • the logic board 12 may be a timing controller (TCON) circuit board.
  • the exemplary embodiments of the present disclosure also do not limit the specific structures, types, sizes, and the like of the first connecting member 13 and the second connecting member 14, as long as the first connecting member 13 and the second connecting member 14 can be directly connected, thereby
  • the main board 11 and the logic board 12 can be formed into a circuit board assembly 20 having a stacked structure.
  • the first connecting member 13 may be a DuPont header (also referred to as an LVDS header), and the second connecting member 14 may be a socket (also referred to as an LVDS socket) that cooperates with the DuPont header; or, the first The connecting member 13 may be an LVDS socket, and the second connecting member 14 may be an LVDS pin that cooperates with the LVDS socket.
  • the first connector 13 is an LVDS header and the second connector 14 is an LVDS socket that cooperates with the LVDS header, that is, the first surface 11-1 of the motherboard 11 is provided with LVDS.
  • the LVDS socket is provided on the second surface 12-2 of the logic board 12 with a pin header, the LVDS header is inserted into the LVDS socket, so that the electrical connection between the main board 11 and the logic board 12 can be achieved, thereby enabling the transmission of LVDS signals. It saves the LVDS DuPont line required when the logic board is connected to the motherboard in the prior art, thereby reducing the cost of the display device.
  • the exemplary embodiment of the present disclosure does not limit the specific manner in which the LVDS socket is disposed on the surface of the logic board 12.
  • the LVDS socket in order to optimize the structure, is generally manufactured on the surface of the logic board 12 in the form of surface mount using surface mount technology.
  • the display device 10 Compared with the prior art, the display device 10 according to the exemplary embodiment of the present disclosure provides a first connector 13 on the first surface 11-1 of the main board 11, and a second surface 12-2 of the logic board 12.
  • a second connector 14 is provided on the main board 11 and the logic board 12 is connected by the direct connection between the first connector 13 and the second connector 14, so that the main board 11 and the logic board 12 form the first of the main board 11.
  • the area occupied by 11 and the area occupied by the display panel 17 when the logic board 12 is fixed on the display panel 17 are reduced, thereby saving the cost of the display device.
  • first connector 13 and the second connector 14 are configured to transmit low-voltage differential signals, when the first connector 13 and the second connector 14 are connected, low voltage can be transmitted between the main board 11 and the logic board 12
  • the differential signal eliminates the LVDS DuPont line required for transmitting low-voltage differential signals between the logic board and the motherboard in the prior art, thereby further saving the cost of the display device.
  • the logic board 12 and the main board 11 are detachable, when the main board 11 is equipped with a standard screen (also referred to as a norm screen), the logic board 12 may not be provided on the main board 11, so the logic board can be replaced. 12 is removed from the motherboard 11; when the motherboard 11 is equipped with a non-sequential control screen (also called a TCONLESS screen), the logic board 12 can be installed on the motherboard 11. Through such a setting, the motherboard 11 can be compatible with a norm screen and a TCONLESS screen, thereby expanding the applicable range of the motherboard 11.
  • a standard screen also referred to as a norm screen
  • TCONLESS screen non-sequential control screen
  • the display device 10 further includes an X-coordinate circuit board 15, and the logic board 12 constituting the circuit board assembly 20 may be connected to the X-coordinate circuit board 15 through a flexible flat cable for transmission minilvds signal.
  • the first surface 12-1 of the logic board 12 is provided with a flexible flat cable holder 16. It should be understood, however, that it is also possible to arrange the flexible flat cable holder 16 on other surfaces of the logic board 12, such as the second surface 12-2. In some exemplary embodiments of the present disclosure, the flexible flat cable holder 16 is manufactured on the surface of the logic board 12 in a surface-mounting form using surface-mount technology.
  • FIG. 7 shows two connection methods for connecting the flexible flat cable holder 16 and the signal interface of the X coordinate circuit board 15 by using the flexible flat cable 18. .
  • the first connection method is shown in FIG. 7.
  • the flexible flat cable 18 starts from the flexible flat cable holder 16, first adjacent to the first surface 11-1 of the main board 11 and along the signal interface facing away from the X-coordinate circuit board 15.
  • the first direction extends to an edge of the main board 11, and then the flexible flat cable 18 passes around the edge of the main board 11, and is then adjacent to the second surface 11-2 of the main board 11 and opposite to the first direction.
  • the second direction extends to the other edge of the main board 11.
  • the flexible flat cable 18 leaves the main board 11 from this edge of the main board 11, and finally extends and connects to the signal interface of the X coordinate circuit board 15.
  • an ordinary flexible flat cable 18 may be used.
  • the flexible flat cable line 18 is too close to the power line of the display device, interference prevention processing may be performed on the flexible flat cable line 18 in some exemplary embodiments of the present disclosure. It is easily understood that the flexible flat cable 18 may be processed by any suitable anti-interference treatment measures known in the art. In some exemplary embodiments according to the present disclosure, the flexible flat cable 18 may be surrounded by a heat-shrinkable sleeve and / or metal foil (such as, but not limited to, aluminum foil) so as to ensure the power of the flexible flat cable 18 and the display device. Insulation between the wires, and elimination of electromagnetic interference from the power line to the flexible flat cable 18.
  • a heat-shrinkable sleeve and / or metal foil such as, but not limited to, aluminum foil
  • the second connection method is shown in FIG. 8.
  • the flexible flat cable 18 extends only adjacent to the first surface 11-1 of the main board 11.
  • the flexible flat cable 18 starts from the flexible flat cable holder 16 and extends adjacent to the first surface 11-1 of the main board 11 to the left edge of the main board 11, and then the flexible flat cable 18 exits from the left side of the main board 11.
  • the flexible flat cable 18 needs to be bent and twisted.
  • the flexible flat cable 18 needs to be manufactured by a slitting process, that is, it may be in a suitable manner between the two ends of the flexible flat cable 18 (for example, but not (Limited to, cutting) to form at least one slit extending along its length direction, so that the portion of the flexible flat cable wire 18 between its two ends forms at least two strands of cable extending along its length direction.
  • the flexible flat cable 18 produced by the slit cutting process can be easily bent and twisted, thereby facilitating the connection of the flexible flat cable 18 between the flexible flat cable holder 16 and the signal interface of the X coordinate circuit board 15. It should be pointed out that the number and formation positions of the gaps can be selected according to actual needs.
  • the power cable in the flexible flat cable 18 may be separated from other signal lines so as to form a single strand of cable, or the flexible flat cable 18 may be located at both ends thereof.
  • the sections are divided into multiple cables each having an equal number of signal lines.
  • a distance between signal lines constituting the flexible flat cable 18 is smaller at both ends of the flexible flat cable 18 and at a middle portion of the flexible flat cable 18 It is large, and such a structure is advantageous for slitting the flexible flat cable 18.
  • the main board 11 may include multiple circuit traces and multiple components
  • the logic board 12 may also include multiple circuit traces and multiple chip components.
  • a plurality of chip components on the main board 11 and the logic board 12 adopt their smallest packages as much as possible, and plug-in components such as sockets and pins also adopt a chip package, so that the structure and The optimization of layout and routing reduces the size of the logic board 12.
  • the plurality of chip components on the logic board 12 are all surface-mounted on the first surface 12-1 and the second surface 121-2 by using a surface-mount technology. That is, a double-sided patch structure is adopted, which can further reduce the size of the logic board 12.
  • the reference size of the logic board 12 may be set to 40 cm ⁇ 22 cm based on the size of the surrounding space of the LVDS sockets on the multiple motherboards 11.
  • the exemplary embodiments of the present disclosure are not limited thereto.
  • FIG. 9 schematically illustrates a method 100 for manufacturing a display device 10 according to an exemplary embodiment of the present disclosure in the form of a flowchart.
  • the exemplary embodiment of the present disclosure does not limit the specific type of the display device as long as it includes the main board 11 and the logic board 12.
  • the display device according to an exemplary embodiment of the present disclosure may be a liquid crystal television, a plasma television, a tablet computer, or the like.
  • the method 100 includes the following steps:
  • FIG. 10 schematically illustrates a step of connecting a flexible flat cable socket of a logic board with a signal interface of an X-coordinate circuit board using a flexible flat cable in step 120 of the method 100. Way.
  • step 120 may include the following steps:
  • the flexible flat cable 18 when the method shown in FIG. 10 is adopted, the flexible flat cable 18 may be manufactured by a slit cutting process, so that the flexible flat cable 18 can be easily bent and twisted, thereby It is convenient to connect the flexible flat cable 18 between the flexible flat cable holder 16 and the signal interface of the X coordinate circuit board 15.
  • FIG. 11 schematically illustrates another step of connecting a flexible flat cable socket of a logic board to a signal interface of an X-coordinate circuit board by using a flexible flat cable in step 120 of the method 100. a method.
  • step 120 may include the following steps:
  • S121 ′ a flexible flat cable socket 16 connecting the flexible flat cable 18 to the logic board 12;
  • the flexible flat cable 18 is adjacent to the first surface 11-1 of the main board 11 and extends to the first edge of the main board 11 in a first direction away from the signal interface of the X coordinate circuit board 15;
  • the flexible flat cable 18 is passed around the first edge, is adjacent to the second surface 11-2 of the main board 11, and extends to the second side of the main board 11 in a second direction opposite to the first direction. Edges; and
  • the flexible flat cable 18 may be subjected to anti-interference processing (for example, heat shrink tubing and / or metal foil (for example but not It is limited to that the aluminum foil) surrounds the flexible flat cable 18) in order to ensure the insulation between the flexible flat cable 18 and the power line of the display device, and to eliminate the electromagnetic interference of the power line to the flexible flat cable 18.
  • anti-interference processing for example, heat shrink tubing and / or metal foil (for example but not It is limited to that the aluminum foil) surrounds the flexible flat cable 18) in order to ensure the insulation between the flexible flat cable 18 and the power line of the display device, and to eliminate the electromagnetic interference of the power line to the flexible flat cable 18.

Abstract

一种电路板组件（20）、显示装置（10）及其制造方法（100）。显示装置（10）包括主板（11）、逻辑板（12）、X坐标电路板（15）和显示面板（17），其中主板（11）和逻辑板（12）形成具有叠置结构的电路板组件（20），逻辑板（12）通过柔性扁平电缆线与X坐标电路板（15）连接。主板（11）包括第一表面（11-1）和与第一表面（11-1）相反的第二表面（11-2），主板（11）的第一表面（11-1）上设置有第一连接件（13）；逻辑板（12）包括第一表面（12-1）和与第一表面（12-1）相反的第二表面（12-2），逻辑板（12）的第二表面（12-2）上设置有第二连接件（14）；其中，第一连接件（13）和第二连接件（14）配置成可以彼此配合地直接连接在一起。当第一连接件（13）与第二连接件（14）直接连接在一起时，电路板组件（20）形成主板（11）的第一表面（11-1）与逻辑板（12）的第二表面（12-2）彼此相对的叠置构造。

Description

电路板组件、显示装置及其制造方法
相关申请
本申请要求申请日为2018年8月1日、申请号为201821236099.5、名称为“一种显示装置”的中国专利申请的优先权，该中国专利申请的整体内容通过引用的方式被合并于此。
技术领域
本公开涉及显示装置的技术领域，尤其是涉及显示装置内的电路板的布置，以及还涉及显示装置的制造方法。
背景技术
随着人们生活水平的不断提高，诸如液晶电视之类的显示装置已经广泛地出现在人们的生活中。现有的液晶电视中通常包括主板(也称为电视主板或TV主板)和逻辑板，其中，逻辑板的设置方式一般有以下两种方式。第一种方式是将逻辑板集成在电视主板上，但这种方式会增加电视主板的面积，而且还限制了电视主板的输出方式，使得电视主板必须是定制款，因此只能支持对应的一种屏，从而限制了电视主板的适用范围。第二种方式是将逻辑板制成独立的板卡，然后将逻辑板固定在液晶电视的显示面板上，但是将逻辑板固定在显示面板上会占用显示面板的空间，增加显示面板的面积，同时还需要额外的低压差分信号(Low Voltage Differential Signaling，也称作LVDS)杜邦线来连接电视主板以传递LVDS信号。无论哪一种方式，都会增加液晶电视的成本。
发明内容
根据本公开的一个方面，提供了一种电路板组件，其包括：第一电路板，所述第一电路板包括第一表面和与所述第一表面相反的第二表面，所述第一电路板的第一表面上设置有第一连接件；第二电路板，所述第二电路板包括第一表面和与所述第一表面相反的第二表面，所述第二电路板的第二表面上设置有第二连接件；其中，所述第一连接件和所述第二连接件配置成可以彼此配合地直接连接在一起；其中， 当所述第一连接件与所述第二连接件直接连接在一起时，所述电路板组件形成所述第一电路板的第一表面与所述第二电路板的第二表面彼此相对的叠置构造。
根据本公开的一些示例性实施例，所述第一连接件为排针，所述第二连接件为插座；或者所述第一连接件为插座，所述第二连接件为排针。
根据本公开的一些示例性实施例，所述第二连接件以表面贴装的形式设置在所述第二电路板的第二表面上。
根据本公开的一些示例性实施例，所述第二电路板的第一表面和第二表面中的至少一个表面上设置有多个元器件，所述元器件都是片状元器件，并且都以表面贴装的形式设置在所述至少一个表面上。
根据本公开的另一个方面，提供了一种显示装置，其包括如上所述的电路板组件。
根据本公开的一些示例性实施例，所述第一电路板是主板，所述第二电路板是逻辑板，所述第一连接件和所述第二连接件配置成在所述主板和所述逻辑板之间传输低压差分信号。
根据本公开的一些示例性实施例，所述第一连接件是杜邦排针，所述第二连接件是对应的插座。
根据本公开的一些示例性实施例，所述逻辑板是时序控制电路板。
根据本公开的一些示例性实施例，所述显示装置还包括X坐标电路板；所述逻辑板的第一表面设置有柔性扁平电缆座，所述柔性扁平电缆座通过柔性扁平电缆线与所述X坐标电路板的信号接口连接。
根据本公开的一些示例性实施例，从所述柔性扁平电缆座到所述信号接口，相对于所述主板，所述柔性扁平电缆线仅与所述主板的第一表面相邻。
根据本公开的一些示例性实施例，所述柔性扁平电缆线在其两端之间包括沿所述柔性扁平电缆线的长度方向延伸的至少一条缝隙。
根据本公开的一些示例性实施例，从所述柔性扁平电缆座到所述信号接口，相对于所述主板，所述柔性扁平电缆线从所述柔性扁平电缆座开始与所述主板的第一表面相邻并且沿着背离所述信号接口的第一方向延伸到所述主板的边缘，所述柔性扁平电缆线在所述边缘处绕过所述主板，与所述主板的第二表面相邻并且沿着与所述第一方向相 反的第二方向延伸。
根据本公开的一些示例性实施例，所述柔性扁平电缆线经由热缩套管和金属箔包围。
根据本公开的一些示例性实施例，所述柔性扁平电缆座以表面贴装的形式设置在所述逻辑板的第一表面上。
根据本公开的一些示例性实施例，所述显示装置是液晶电视、等离子电视或者平板电脑。
根据本公开的一个方面，提供了一种用于制造上述显示装置的方法，其包括以下步骤：将所述逻辑板直接连接到所述主板，以形成所述电路板组件；利用所述柔性扁平电缆线将所述逻辑板的柔性扁平电缆座与所述X坐标电路板的信号接口连接。
根据本公开的一些示例性实施例，利用所述柔性扁平电缆线将所述逻辑板的柔性扁平电缆座与所述X坐标电路板的信号接口连接的步骤包括：将所述柔性扁平电缆线连接到所述柔性扁平电缆座；使所述柔性扁平电缆线与所述主板的第一表面相邻地延伸到所述主板的边缘；以及使所述柔性扁平电缆线从所述边缘离开所述主板，延伸并连接到所述信号接口。
根据本公开的一些示例性实施例，在所述柔性扁平电缆线的两端之间形成沿其长度方向延伸的至少一条缝隙。
根据本公开的一些示例性实施例，利用所述柔性扁平电缆线将所述逻辑板的柔性扁平电缆座与所述X坐标电路板的信号接口连接的步骤包括：将所述柔性扁平电缆线连接到所述柔性扁平电缆座；使所述柔性扁平电缆线与所述主板的第一表面相邻并且沿着背离所述信号接口的第一方向延伸到所述主板的第一边缘；使所述柔性扁平电缆线绕过所述第一边缘，与所述主板的第二表面相邻并且沿着与所述第一方向相反的第二方向延伸到所述主板的第二边缘；以及使所述柔性扁平电缆线从所述第二边缘离开所述主板，延伸并且连接到所述信号接口。
根据本公开的一些示例性实施例，用热缩套管和金属箔包围所述柔性扁平电缆线。
附图说明
下面将结合附图对本公开的示例性具体实施方式进行详细的描述， 以便能够对本公开要解决的问题、上述以及其他目的、特征和优点具有更加充分的认识和理解，附图中：
图1为示意性地显示了现有技术的一种显示装置中各部件间连接关系的示意图；
图2为示意性地显示了根据本公开的示例性实施例的一种显示装置中各部件间连接关系的示意图；
图3为图2所示的主板的示意性立体图，其中示出了设置在主板上的第一连接件；
图4为图2所示的逻辑板的示意性立体图，其中示出了设置在逻辑板上的第二连接件；
图5示意性地示出了图2所示的主板和逻辑板直接连接在一起时形成的电路板组件；
图6示意性地示出了图2所示的逻辑板的设置有柔性扁平电缆座的表面；
图7示意性地示出了根据本公开的示例性实施例的逻辑板与X坐标电路板的一种连接方式；
图8示意性地示出了根据本公开的示例性实施例的逻辑板与X坐标电路板的另一种连接方式；
图9以流程图的形式示意性地示出了根据本公开的示例性实施例的一种用于制造根据本公开的显示装置的方法；
图10以流程图的形式示意性地示出了图9所示的方法中利用柔性扁平电缆线将逻辑板的柔性扁平电缆座与X坐标电路板的信号接口连接的一种方式；以及
图11以流程图的形式示意性地示出了图9所示的方法中利用柔性扁平电缆线将逻辑板的柔性扁平电缆座与X坐标电路板的信号接口连接的另一种方式。
要理解的是，附图的目的在于对本公开的示例性实施例进行说明，因此其不必按照比例绘制。此外，贯穿全部附图，相同或者相似的部分、部件和/或元件由相同的附图标记指示。
具体实施方式
下面将结合说明书附图，对根据本公开的示例性实施例进行详细 的描述。
将理解的是，尽管术语“第一”、“第二”等在本文中可用来描述各种元件、部件和/或部分，但是这些元件、部件和/或部分不应当由这些术语限制。这些术语仅用来将一个元件、部件或部分与另一个元件、部件或部分相区分。因此，下面讨论的第一元件、部件或部分也可以被称为第二或第三元件、部件或部分而不偏离本公开的教导。
本文中使用的术语仅用于描述特定实施例的目的，并且不意图限制本公开。如本文中使用的，单数形式“一个”、“一”和“该”旨在也包括复数形式，除非上下文清楚地另有指示。还要理解的是，术语“包括”和/或“包含”当在本说明书中使用时，是指所述及的特征、整体、步骤、操作、元件和/或部件的存在，但不排除一个或多个其他特征、整体、步骤、操作、元件、部件和/或其群组的存在或者添加一个或多个其他特征、整体、步骤、操作、元件、部件和/或其群组。此外，本文中出现的术语“和/或”包括相关联的列出项目中的一个或多个的任意和全部组合。
将理解的是，当元件被描述为“连接到另一个元件”或“耦合到另一个元件”时，其可以直接连接到另一个元件或直接耦合到另一个元件，或者可以存在中间元件。相反，当元件被描述为“直接连接到另一个元件”或“直接耦合到另一个元件”时，没有中间元件存在。
除非另有定义，本文中使用的所有术语(包括技术术语和科学术语)具有与本公开所属领域的普通技术人员所通常理解的相同含义。还要理解的是，诸如那些在通常使用的字典中定义的之类的术语应当被解释为具有与其在相关领域和/或本说明书上下文中的含义相一致的含义，并且将不在理想化或过于正式的意义上进行解释，除非本文中明确地如此定义。
需要说明的是，在本申请的说明书的描述中，参考表述“一个实施例”、“一些实施例”、“示例性实施例”、“具体示例”、或“一些示例”等的描述，意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。因此，在本文中，针对上述表述的示意性描述不必仅针对相同的实施例或示例。而是，所描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下， 本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
本公开中描述的方法所包括的步骤都是示例性的，它们不一定必须按照所列出的顺序执行，而是这些步骤中的一个或多个根据实际情况可以以不同的顺序或者同时被执行。此外根据实际情况，所描述的方法还可以包括其他的附加步骤。
为了清楚目的，本公开所属领域公知的某些技术、结构、材料未被详细描述，以避免使本申请变得冗长。
参见图1，其示意性地示出了根据现有技术的液晶电视中1各部件的连接关系，其中，箭头线既表示了这些部件之间的连接关系，同时也示出了这些部件之间的信号传递。该液晶电视1包括电视主板01、电视逻辑板02、电视X坐标电路板03(也称X-PCB板或X-board板)和电视显示面板04。电视逻辑板02为独立的板卡，因此一般需要被固定在电视显示面板04上。电视逻辑板02与电视主板01通过LVDS杜邦线来连接，以便传递LVDS信号。此外，电视逻辑板02还与电视显示面板04上的电视X坐标电路板03通过柔性扁平电缆(Flexible Flat Cable，也称作FFC)线来连接，以便传输mini lvds信号。容易理解的是，电视逻辑板02被固定在电视显示面板04上会占用电视显示面板04的面积，导致不得不增大电视显示面板04的面积，此外还导致电视逻辑板12需要额外的LVDS杜邦线来连接电视主板01，这些都增加了液晶电视的成本。
图2至图8示意性地示出了根据本公开的示例性实施例的显示装置的各个方面。本公开的示例性实施例对显示装置的具体类型不作限定，只要其包含有主板11和逻辑板12便可。作为非限制性示例，根据本公开的示例性实施例的显示装置可以是液晶电视、等离子电视或者平板电脑等等。
参见图2，其示意性地示出了根据本公开的示例性实施例的显示装置10中各部件的连接关系。所述显示装置10包括主板11、逻辑板12、X坐标电路板15和显示面板17，其中，主板11和逻辑板12形成具有叠置结构的电路板组件20。构成电路板组件20的逻辑板12还通过柔性扁平电缆线与X坐标电路板15连接，以便传输mini lvds信号。
现在转向图3，其以立体图的形式示意性地示出了图2所示的显示 装置10中的主板11。主板11包括彼此相反的第一表面11-1和第二表面11-2，其中，第一表面11-1和第二表面11-2中的至少一个表面上可以设置主板11所需的各种元器件和多根电路迹线。如图3所示，主板11的第一表面11-1上设置有第一连接件13，用于将主板11与逻辑板12直接连接，以便形成电路板组件20。
参见图4，其以立体图的形式示意性地示出了图2所示的显示装置10中的逻辑板12。逻辑板12同样包括彼此相反的第一表面12-1和第二表面12-2，其中，第一表面12-1和第二表面12-2中的至少一个表面上可以设置逻辑板12所需的各种元器件和多根电路迹线。如图4所示，逻辑板12的第二表面12-2上设置有第二连接件14。第二连接件14设置成与第一连接件13相互配合，使得第二连接件14能够直接连接到第一连接件13，以便形成电路板组件20。在本公开的一些示例性实施例中，第一连接件13可以是排针或插座，并且第二连接件14可以是对应的插座或排针。此外，在本公开的一些示例性实施例中，第一连接件13和第二连接件14被配置为可在主板11与逻辑板12之间传输低压差分信号。
参见图5，其示意性地示出了图2、图3、图4中所示的主板11和逻辑板12通过第一连接件13和第二连接件14直接连接在一起时形成的电路板组件20。在所形成的电路板组件20中，主板11和逻辑板12形成叠置的结构，其中主板11的第一表面11-1和逻辑板12的第二表面12-2彼此相对，由此充分利用了主板11的立体空间，减少了当逻辑板12集成在主板11上时对主板11的面积占用，以及减少了当逻辑板12固定在显示面板17上时对显示面板17的面积占用。容易理解的是，第一连接件13也可以设置在主板11的其他表面上，类似地，第二连接件14也可以设置在逻辑板12的其他表面上，只要第一连接件13和第二连接件14能够直接连接以使主板11和逻辑板12形成具有叠置结构的电路板组件便可。
要指出的是，本公开的示例性实施例对主板11和逻辑板12的具体结构、类型和尺寸等均不作限定。作为非限制性示例，主板11可以是电视主板，逻辑板12可以是时序控制(timing controller，TCON)电路板。此外，本公开的示例性实施例对第一连接件13和第二连接件14的具体结构、类型和尺寸等也不作限定，只要第一连接件13和第二 连接件14可以直接连接，从而将主板11和逻辑板12形成具有叠置结构的电路板组件20便可。作为非限制性示例，第一连接件13可以为杜邦排针(也称LVDS排针)，第二连接件14可以为与该杜邦排针配合的插座(也称LVDS座)；或者，第一连接件13可以为LVDS座，第二连接件14可以为与该LVDS座配合的LVDS排针。
继续参见图3和图4，当第一连接件13为LVDS排针，第二连接件14为与该LVDS排针配合的LVDS座时，即主板11的第一表面11-1上设置有LVDS排针且逻辑板12的第二表面12-2上设置有LVDS座时，LVDS排针插入LVDS座中，从而可实现主板11和逻辑板12的电连接，由此使得能够传输LVDS信号，因而节省了现有技术中逻辑板与主板连接时需要的LVDS杜邦线，从而减少了显示装置的成本。本公开的示例性实施例对于将LVDS座设置在逻辑板12的表面上的具体方式不做限定。在本公开的一些示例性实施例中，为了结构的优化，LVDS座一般采用表面贴装技术以表面贴装的形式制作在逻辑板12的表面上。
相较于现有技术，根据本公开的示例性实施例提供的显示装置10通过在主板11的第一表面11-1上设置第一连接件13，在逻辑板12的第二表面12-2上设置第二连接件14，以及利用第一连接件13和第二连接件14的直接连接所实现的主板11和逻辑板12的连接，使主板11和逻辑板12形成了主板11的第一表面11-1与逻辑板12的第二表面12-2彼此相对的叠置的电路板组件20，从而充分利用了主板11的立体空间，减少了当逻辑板12集成在主板11上时对主板11的面积占用，以及减少了当逻辑板12固定在显示面板17上时对显示面板17的面积占用，从而节省了显示装置的成本。此外，由于第一连接件13与第二连接件14被配置为可以传输低压差分信号，因而当第一连接件13和第二连接件14连接时，主板11与逻辑板12之间可以传输低压差分信号，由此省去了现有技术中逻辑板与主板间传输低压差分信号时需要的LVDS杜邦线，从而进一步节省了显示装置的成本。
需要说明的是，由于逻辑板12与主板11是可拆开的，因而当主板11搭配标准屏(也称为norm屏)时，由于主板11上不需要设置逻辑板12，因而可以将逻辑板12从主板11上拆掉；而当主板11搭配无时序控制屏(也称为TCONLESS屏)时，则可以将逻辑板12安装在 主板11上。通过这样的设置，使得主板11可以兼容norm屏和TCONLESS屏，从而扩大了主板11的适用范围。
返回参考图2，根据本公开的示例性实施例的显示装置10还包括X坐标电路板15，构成电路板组件20的逻辑板12可通过柔性扁平电缆线与X坐标电路板15连接，以便传输mini lvds信号。
参见图5、图6以及继续参见图2，逻辑板12的第一表面12-1设置有柔性扁平电缆座16。然而要理解的是，将柔性扁平电缆座16设置在逻辑板12的其他表面上，例如第二表面12-2上，也是可能的。在本公开的一些示例性实施例中，柔性扁平电缆座16采用表面贴装技术以表面贴装的形式制作在逻辑板12的表面上。
参见图7、图8以及继续参见图2、图5和图6，其示出了利用柔性扁平电缆线18将柔性扁平电缆座16与X坐标电路板15的信号接口相连接的两种连接方式。
第一种连接方式如图7所示，柔性扁平电缆线18从柔性扁平电缆座16开始，首先与主板11的第一表面11-1相邻并且沿着背离X坐标电路板15的信号接口的第一方向延伸到主板11的一个边缘，然后柔性扁平电缆线18绕过主板11的该边缘，随后与主板11的第二表面11-2相邻并且与沿着与所述第一方向相反的第二方向延伸到主板11的另一个边缘，柔性扁平电缆线18从主板11的这个边缘处离开主板11，并最终延伸且连接到X坐标电路板15的信号接口。这种连接方式中使用普通的柔性扁平电缆线18即可。然而，由于柔性扁平电缆线18过于靠近显示装置的电源线，因而在本公开的一些示例性实施例中可以对柔性扁平电缆线18进行防干扰处理。容易理解的是，可以采用本领域公知的任何合适的防干扰处理措施对柔性扁平电缆线18进行处理。在根据本公开的一些示例性实施例中，可以利用热缩套管和/或金属箔(例如但不限于，铝箔)包围柔性扁平电缆线18，以便确保柔性扁平电缆线18与显示装置的电源线之间的绝缘，以及消除电源线对柔性扁平电缆线18的电磁干扰。
第二种连接方式如图8所示，相对于主板11而言，柔性扁平电缆线18仅与主板11的第一表面11-1相邻地延伸。例如，柔性扁平电缆线18从柔性扁平电缆座16开始，与主板11的第一表面11-1相邻地延伸到主板11的左侧边缘，随后柔性扁平电缆线18从主板11的左侧出 线，最终延伸且连接到X坐标电路板15的信号接口。但是，这种连接方式中需要对柔性扁平电缆线18进行弯曲扭转。因而，在本公开的一些示例性实施例中，柔性扁平电缆线18需要采用分条切割工艺制作，也就是说，可以在柔性扁平电缆线18的两端之间也合适的方式(例如但不限于，切割)形成沿其长度方向延伸的至少一条缝隙，由此使得柔性扁平电缆线18的位于其两端之间的部分形成沿其长度方向延伸的至少两股线缆。采用分条切割工艺制作的柔性扁平电缆线18能够容易地进行弯曲和扭转，从而便于将柔性扁平电缆线18连接在柔性扁平电缆座16与X坐标电路板15的信号接口之间。需要指出的是，缝隙的数量和形成位置可以根据实际需要来加以选择。作为非限制性的示例，可以将柔性扁平电缆线18中的电源线与其他信号线分离，以使其形成单独的一股线缆，或者也可以将柔性扁平电缆线18的位于其两端之间的部分分成各自具有相等数目信号线的多股线缆。此外，在根据本公开的一些示例性实施例中，构成柔性扁平电缆线18的各信号线之间的间距在柔性扁平电缆线18的两端处较小而在柔性扁平电缆线18的中间部分则较大，这样的结构有利于对柔性扁平电缆线18进行分条切割。
要指出的是，主板11上可以包括多根电路迹线和多个元器件，逻辑板12上也可以包括多根电路迹线和多个片状元器件。在本公开的一些示例性实施例中，主板11和逻辑板12上的多个片状元器件尽可能采用其最小封装，插座、插针等插件元件也采用贴片封装，由此可以实现结构和布局布线的优化，减小逻辑板12的尺寸。在本公开的一些示例性实施例中，逻辑板12上的多个片状元器件均采用表面贴装技术以表面贴装的形式设置在第一表面12-1和第二表面121-2上，即采用双面贴片结构，这样可以进一步减小逻辑板12的尺寸。在本公开的一些示例性实施例中，基于多个主板11上LVDS插座的周围空间大小，可以将逻辑板12的参考尺寸设置为40cm×22cm。但是，本公开的示例性实施例并不局限于此。
现在参见图9并且继续参见图2至图8，图9以流程图的形式示意性地示出了根据本公开的示例性实施例的一种用于制造根据本公开的显示装置10的方法100。如前面已经说明的，本公开的示例性实施例对显示装置的具体类型不作限定，只要其包含有主板11和逻辑板12便可。作为非限制性示例，根据本公开的示例性实施例的显示装置可 以是液晶电视、等离子电视或者平板电脑等等。
方法100包括以下步骤：
S110：将逻辑板12直接连接到主板11，以形成电路板组件20；以及
S120：利用柔性扁平电缆线18将逻辑板12的柔性扁平电缆座16与X坐标电路板15的信号接口连接。
参见图10并且结合参见图8和图9，图10示意性地示出了方法100的步骤120中利用柔性扁平电缆线将逻辑板的柔性扁平电缆座与X坐标电路板的信号接口连接的一种方式。
如图10所示，步骤120可以包括以下步骤：
S121：将柔性扁平电缆线18连接到逻辑板12的柔性扁平电缆座16；
S122：使柔性扁平电缆线18与主板11的第一表面11-1相邻地延伸到主板11的边缘；以及
S123：使柔性扁平电缆线18从所述边缘离开主板11，延伸并连接到X坐标电路板15的信号接口。
在本公开的一些示例性实施例中，当采用图10所示的方法时，柔性扁平电缆线18可以采用分条切割工艺制作，以使柔性扁平电缆线18能够容易地进行弯曲和扭转，从而便于将柔性扁平电缆线18连接在柔性扁平电缆座16与X坐标电路板15的信号接口之间。
参见图11并且结合参见图7和图9，图11示意性地示出了方法100的步骤120中利用柔性扁平电缆线将逻辑板的柔性扁平电缆座与X坐标电路板的信号接口连接的另一种方式。
如图11所示，步骤120可以包括以下步骤：
S121′：将柔性扁平电缆线18连接到逻辑板12的柔性扁平电缆座16；
S122′：使柔性扁平电缆线18与主板11的第一表面11-1相邻并且沿着背离X坐标电路板15的信号接口的第一方向延伸到主板11的第一边缘；
S123′：使柔性扁平电缆线18绕过所述第一边缘，与主板11的第二表面11-2相邻并且沿着与所述第一方向相反的第二方向延伸到主板11的第二边缘；以及
S124′：使柔性扁平电缆线18从所述第二边缘离开主板11，延伸并且连接到X坐标电路板15的信号接口。
在本公开的一些示例性实施例中，当采用图11所示的方法时，可以对柔性扁平电缆线18进行防干扰处理(例如，可以利用热缩套管和/或金属箔(例如但不限于，铝箔)包围柔性扁平电缆线18)，以便确保柔性扁平电缆线18与显示装置的电源线之间绝缘，以及消除电源线对柔性扁平电缆线18的电磁干扰。
以上描述仅为对本公开的示例性实施例的描述以及对其所运用的技术原理的说明。本领域技术人员应当理解，本公开所涉及的范围并不局限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征在不违背技术原理的情况下进行任意组合而形成的其它技术方案。此外，本领域的普通技术人员可以在不脱离本公开的精神的前提下对所描述的本公开的示例性实施例进行各种改动和变型，这些改动和变型也应视为落在本公开的范围之内。因此，本公开的保护范围应以所附权利要求的范围为准。

Claims (20)

  1. 一种电路板组件，其包括：
    第一电路板，所述第一电路板包括第一表面和与所述第一表面相反的第二表面，所述第一电路板的第一表面上设置有第一连接件；
    第二电路板，所述第二电路板包括第一表面和与所述第一表面相反的第二表面，所述第二电路板的第二表面上设置有第二连接件；
    其中，所述第一连接件和所述第二连接件配置成可以彼此配合地直接连接在一起；
    其中，当所述第一连接件与所述第二连接件直接连接在一起时，所述电路板组件形成所述第一电路板的第一表面与所述第二电路板的第二表面彼此相对的叠置构造。
  2. 根据权利要求1所述的电路板组件，其中，
    所述第一连接件为排针，所述第二连接件为插座；或者
    所述第一连接件为插座，所述第二连接件为排针。
  3. 根据权利要求1所述的电路板组件，其中，所述第二连接件以表面贴装的形式设置在所述第二电路板的第二表面上。
  4. 根据权利要求1所述的显示装置，其中，所述第二电路板的第一表面和第二表面中的至少一个表面上设置有多个元器件，所述元器件都是片状元器件，并且都以表面贴装的形式设置在所述至少一个表面上。
  5. 一种显示装置，其包括根据权利要求1至4中任一项所述的电路板组件。
  6. 根据权利要求5所述的显示装置，其中，所述第一电路板是主板，所述第二电路板是逻辑板，所述第一连接件和所述第二连接件配置成在所述主板和所述逻辑板之间传输低压差分信号。
  7. 根据权利要求6所述的显示装置，其中，所述第一连接件是杜邦排针，所述第二连接件是对应的插座。
  8. 根据权利要求6所述的显示装置，其中，所述逻辑板是时序控制电路板。
  9. 根据权利要求6所述的显示装置，其中：
    所述显示装置还包括X坐标电路板；
    所述逻辑板的第一表面设置有柔性扁平电缆座，所述柔性扁平电缆座通过柔性扁平电缆线与所述X坐标电路板的信号接口连接。
  10. 根据权利要求9所述的显示装置，其中，从所述柔性扁平电缆座到所述信号接口，相对于所述主板，所述柔性扁平电缆线仅与所述主板的第一表面相邻。
  11. 根据权利要求10所述的显示装置，其中，所述柔性扁平电缆线在其两端之间包括沿所述柔性扁平电缆线的长度方向延伸的至少一条缝隙。
  12. 根据权利要求9所述的显示装置，其中，从所述柔性扁平电缆座到所述信号接口，相对于所述主板，所述柔性扁平电缆线从所述柔性扁平电缆座开始与所述主板的第一表面相邻并且沿着背离所述信号接口的第一方向延伸到所述主板的边缘，所述柔性扁平电缆线在所述边缘处绕过所述主板，与所述主板的第二表面相邻并且沿着与所述第一方向相反的第二方向延伸。
  13. 根据权利要求12所述的显示装置，其中，所述柔性扁平电缆线由热缩套管和金属箔包围。
  14. 根据权利要求9所述的显示装置，其中，所述柔性扁平电缆座以表面贴装的形式设置在所述逻辑板的第一表面上。
  15. 根据权利要求5至14中任一项所述的显示装置，其中，所述显示装置是液晶电视、等离子电视或者平板电脑。
  16. 一种用于制造根据权利要求9所述的显示装置的方法，其包括以下步骤：
    将所述逻辑板直接连接到所述主板，以形成所述电路板组件；
    利用所述柔性扁平电缆线将所述逻辑板的柔性扁平电缆座与所述X坐标电路板的信号接口连接。
  17. 根据权利要求16所述的方法，其中，利用所述柔性扁平电缆线将所述逻辑板的柔性扁平电缆座与所述X坐标电路板的信号接口连接的步骤包括：
    将所述柔性扁平电缆线连接到所述柔性扁平电缆座；
    使所述柔性扁平电缆线与所述主板的第一表面相邻地延伸到所述主板的边缘；以及
    使所述柔性扁平电缆线从所述边缘离开所述主板，延伸并连接到 所述信号接口。
  18. 根据权利要求17所述的方法，其中，在所述柔性扁平电缆线的两端之间形成沿其长度方向延伸的至少一条缝隙。
  19. 根据权利要求16所述的方法，其中，利用所述柔性扁平电缆线将所述逻辑板的柔性扁平电缆座与所述X坐标电路板的信号接口连接的步骤包括：
    将所述柔性扁平电缆线连接到所述柔性扁平电缆座；
    使所述柔性扁平电缆线与所述主板的第一表面相邻并且沿着背离所述信号接口的第一方向延伸到所述主板的第一边缘；
    使所述柔性扁平电缆线绕过所述第一边缘，与所述主板的第二表面相邻并且沿着与所述第一方向相反的第二方向延伸到所述主板的第二边缘；以及
    使所述柔性扁平电缆线从所述第二边缘离开所述主板，延伸并且连接到所述信号接口。
  20. 根据权利要求19所述的方法，其中，用热缩套管和金属箔包围所述柔性扁平电缆线。
PCT/CN2019/098562 2018-08-01 2019-07-31 电路板组件、显示装置及其制造方法 WO2020024974A1 (zh)

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