WO2020024181A1 - Dispositif d'affichage et son procédé de préparation - Google Patents
Dispositif d'affichage et son procédé de préparation Download PDFInfo
- Publication number
- WO2020024181A1 WO2020024181A1 PCT/CN2018/098124 CN2018098124W WO2020024181A1 WO 2020024181 A1 WO2020024181 A1 WO 2020024181A1 CN 2018098124 W CN2018098124 W CN 2018098124W WO 2020024181 A1 WO2020024181 A1 WO 2020024181A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- color filter
- substrate
- display device
- layer
- filter unit
- Prior art date
Links
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 230000004888 barrier function Effects 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 40
- 229920002120 photoresistant polymer Polymers 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000011159 matrix material Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 17
- 239000003086 colorant Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000001914 filtration Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000417 polynaphthalene Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
Definitions
- the present invention relates to the field of display technology, and in particular, to a display device and a manufacturing method thereof.
- OLED display devices are more and more widely used because of their advantages such as high contrast, high brightness, self-luminescence, and low power consumption.
- OLED display devices usually use red, green and blue sub-pixels to display color images.
- the sub-pixels are prepared by using a fine metal mask (FMM), however, the manufacturing process using such a mask is relatively complicated and difficult to manufacture.
- FMM fine metal mask
- Embodiments of the present invention provide a display device and a method for manufacturing the same, which can reduce the difficulty of process fabrication.
- the specific technical solution is described below.
- a display device includes a first substrate, a color filter layer disposed on the first substrate, and a light emitting layer, and light emitted from the light emitting layer passes through the color filter layer to form colored light.
- the display device further includes a second substrate and a barrier layer.
- the second substrate is disposed on a side of the color filter layer away from the first substrate and covers the color filter layer. On a side of the second substrate away from the color filter layer.
- the color filter layer includes a plurality of color filter units.
- the plurality of color filter units include a red filter unit, a green filter unit, and a blue filter unit.
- the color filter layer further includes a plurality of black matrices, and each black matrix is disposed between two adjacent color filter units.
- a method for manufacturing a display device includes the following steps: providing a first substrate; forming a plurality of spaced black matrices on the first substrate; forming a color filter unit between adjacent black matrices to form a color Filter layer.
- the forming the color filter unit between the adjacent black matrices includes: forming a color photoresist connected to the black matrix on the first substrate, and then modifying the color photoresist Patterning is performed to form the color filter unit.
- the color filter unit includes a first color filter unit and a second color filter unit with different colors. When the second color filter unit is formed, the first color filter that has been manufactured is formed first. Color photoresist of the unit, and then patterning the color photoresist to form the second color filter unit.
- the color photoresist connected to the first color filter unit is flush with the top surface of the first color filter unit.
- the second color filter unit when forming the second color filter unit, there is a height difference between the color photoresist connected to the first color filter unit and the top surface of the first color filter unit.
- the display device and the preparation method provided by the present invention do not need to use FMM to prepare sub-pixels, it can reduce the process difficulty and improve the process yield, and can be applied to large-size, high-resolution display devices to meet the needs of flexible lightness .
- FIG. 1 is a schematic structural diagram of a display device according to a first embodiment of the present invention.
- FIG. 2 is a schematic structural diagram of a display device according to a second embodiment of the present invention.
- FIG. 3 is a flowchart of a method for manufacturing a display device according to a third embodiment of the present invention.
- FIG. 4 is a schematic diagram of a method for forming a black matrix on a first substrate according to a third embodiment of the present invention.
- FIG. 5 is a flowchart of a method for forming a black matrix on a first substrate according to a third embodiment of the present invention.
- FIG. 6 is a schematic diagram of a method for forming a blue filter unit on a first substrate according to a third embodiment of the present invention.
- FIG. 7 is a flowchart of a method for forming a blue filter unit on a first substrate according to a third embodiment of the present invention.
- FIG. 8 is a schematic diagram of a color filter layer on a first substrate provided by a third embodiment of the present invention.
- FIG. 9 is a schematic diagram of a method for sequentially forming a second substrate and a barrier layer on a display device according to a third embodiment of the present invention.
- FIG. 1 is an OLED display device 100 according to a first embodiment of the present invention.
- the display device 100 includes a first substrate 102, a color filter layer 103 disposed on the first substrate 102, and a light emitting layer 107. Light emitted from the light emitting layer 107 passes through the color filter layer 103 to form colored light.
- the display device 100 further includes a second substrate 104, which is disposed on a side of the color filter layer 103 away from the first substrate 102 and covers the color filter layer 103; a barrier layer 105 is disposed on the second substrate 104 away from One side of the color filter layer 103.
- the first substrate 102 is disposed on a rigid substrate 101.
- the rigid substrate 101 is a transparent glass substrate for supporting the first substrate 102.
- the color filter layer 103 includes a plurality of adjacent and spaced-apart color filter units, and specifically includes a red filter unit 113a, a green filter unit 113b, and a blue filter unit 113c.
- Each color filter unit is formed by patterning a photoresist material.
- the photoresist material forming the color filter unit includes, but is not limited to, resin, which can play a role of color filtering, and also has high flexibility.
- the flexibility of the material of the color filter unit is the same as or close to that of the first substrate 102, so as to better protect the color filter unit.
- the color filter layer 103 further includes a black matrix 123a, and the black matrix 123a is disposed between two adjacent color filter units.
- the black matrix 123a is made of a highly light-shielding material, and may be, for example, a resin material or a metal material doped with a light-shielding substance.
- the function of the black matrix 123a is to increase the contrast during display and to avoid color mixing.
- the thickness of the black matrix 123a is less than or equal to the thickness of the color filter unit.
- the flexibility of the material of the black matrix 123a is consistent with or close to that of the first substrate 102, so that the color filter layer 103 has flexibility and is suitable for a flexible display screen.
- the second substrate 104 serves as a flattening layer of the color filter layer 103, and both of the second substrate 104 and the first substrate 102 are transparent and flexible substrates.
- the materials of the first substrate 102 and the second substrate 104 include metal substrates, organic polymer substrates, and metal oxide substrates.
- Organic polymer substrates such as polyethylene terephthalate, polyethersulfone, and polynaphthalene are preferred.
- the first substrate 102 and the second substrate 104 are polyimide resin or modified polyimide resin.
- the blocking layer 105 is disposed on a side of the second substrate 104 away from the color filter layer 103 and is used to block external water and oxygen and protect the internal structure of the display device 100.
- the barrier layer 105 is an inorganic material selected from an oxide, a nitride, an oxynitride, or a fluoride.
- the barrier layer 105 includes a plurality of silicon dioxide and silicon nitride layers that are alternately stacked.
- the display device 100 further includes a thin film transistor array 106 and a packaging layer 108.
- the thin film transistor array 106 is disposed on a side of the color filter layer 103 away from the rigid substrate 101, and the encapsulation layer 108 covers the light emitting layer 107.
- the material of the encapsulation layer 108 includes a plurality of organic and inorganic layers that are alternately stacked to isolate external water and oxygen.
- the light emitted by the light-emitting layer 107 will pass through the thin-film transistor array 106, the color filter layer 103, and the hard substrate 101 in order, and finally be received by the observer, displaying red, green, and blue light, thereby realizing full-color display.
- the light emitting layer 107 includes a white light emitting layer. It can be understood that, in other embodiments, the light emitting layer 107 may also be a red, green, and blue three-color independent light emitting unit.
- FIG. 2 is an OLED display device 200 according to a second embodiment of the present invention.
- the display device 200 includes a hard substrate 201, a thin film transistor array 206 is disposed on the hard substrate 201, and a light emitting layer 207 is disposed on a side of the thin film transistor array 206 away from the hard substrate 201.
- the first substrate 202 is disposed on a side of the light emitting layer 207 away from the thin film transistor array 206, and the color filter layer 202 and the second substrate 204 are sequentially stacked on the first substrate 202.
- the second substrate 204 is used as a flat layer of the color filter layer 203.
- the first substrate 202 and the second substrate 204 are both flexible PI substrates.
- the flexibility of the color filter layer 203 is the same as that of the two substrates. Flexible approach.
- the light emitting layer 207 in this embodiment is a white light emitting layer.
- the white light emitting layer emits white light after being excited.
- the white light passes through the color filter layer 202 and displays three colors of red, green, and blue, respectively, and finally the display device 200 is fully colored.
- the display device 200 further includes a barrier layer 205 disposed on a side of the second substrate 204 away from the color filter layer 203; and a packaging layer 208 disposed on a side of the barrier layer 205 away from the second substrate 204 to strengthen the display device.
- the protection of 200 improves the abrasion resistance of the display device 200 and prolongs its service life.
- the display device in the above embodiment directly prepares the color filter unit on a flexible substrate, which makes the display device display screen provided by the present invention The overall thickness becomes thin.
- the color filter layer of the present invention uses a material having flexibility close to that of the first substrate and the second substrate, so that the structure can be applied to a flexible display screen.
- FIG. 3 is a flowchart of a method for preparing a display device according to a third embodiment of the present invention, including the following steps: S1, providing a first substrate; S2, forming a plurality of spaced black matrices on the first substrate; S3 , Forming a color filter unit between adjacent black matrices to form a color filter layer.
- the first substrate 102 in step S1 in this embodiment is disposed on a rigid substrate 101.
- the rigid substrate 101 is preferably a transparent glass substrate.
- the first substrate 102 is a flexible PI (polyimide) layer.
- the transparent PI layer is formed on the glass substrate by spraying, and then the PI layer is thermally baked to harden it. It can be understood that other methods capable of forming the PI layer on the hard substrate 101 are also applicable, for example, slit coating, spin coating, and the like.
- Step S2 includes forming a plurality of spaced black matrices on the first substrate.
- FIG. 4 and FIG. 5 are schematic diagrams and flowcharts of a method for forming a black matrix 123a on a first substrate 102 according to a third embodiment of the present invention.
- step S301 as shown in 3a in FIG. 4, the first substrate 102 is cleaned.
- the PI substrate is cleaned. This cleaning step is a method commonly used by those skilled in the art, and details are not described herein.
- step S302 as shown in 3b in FIG. 4, a black photoresist is coated on the PI substrate by a spin coating method to form a black photoresist layer 123.
- step S303 the black photoresist layer 123 formed in the previous step is dried in a vacuum, and the black photoresist layer 123 is baked and cooled.
- Steps S304 and S305 as shown in 3c and 3d in FIG. 4, under the mask of a fixed interval, the black photoresist layer 123 is irradiated with an exposure machine, and then developed with a developing solution to form a black matrix. Patterned black matrix precursor.
- step S306 as shown at 3e in FIG. 4, the black matrix precursor is dried to form a black matrix 123a.
- Step S3 includes forming a color filter unit between adjacent black matrices, and finally forming a color filter layer.
- the color filter unit includes a first color filter unit and a second color filter unit of different colors.
- the color photoresist is patterned to form a second color filter unit.
- FIG. 6 and FIG. 7 are a schematic diagram and a flowchart of a method for forming a color filter unit on the first substrate 102 according to the third embodiment of the present invention.
- step S311 as shown in 4a in FIG. 6, the PI substrate is cleaned.
- step S312 as shown in 4b in FIG.
- a blue photoresist is coated on the PI substrate by a spin coating method to form a blue photoresist layer 113.
- the blue photoresist layer 113 is dried in a vacuum, and baked and cooled.
- the same operation is performed to form a green filter unit 113b and a red filter unit 113a on the PI substrate.
- the invention does not limit the preparation sequence of each color filter unit.
- the color photoresist connected to the first color filter unit is flush with the top surface of the first color filter unit. That is, the thickness of each color filter unit is the same.
- the thicknesses of the blue filter unit, the green filter unit, and the red filter unit are the same.
- the method for manufacturing a display device provided by the present invention further includes a case where the thicknesses of the color filter units are inconsistent. As shown in FIG. 8, the color filter layer 103 of the display device is formed through the above steps.
- the red filter unit 113a, the green filter unit 113b, the blue filter unit 113c, and the black matrix 123a of the color filter layer are all negative photoresists.
- the molecular bonds of the negative photoresist will be cross-linked due to the irradiation of light, and it is not easy to be washed away. Therefore, in the yellow light process, the part masked by the photomask, because there is no cross-linking between the molecules, will be dissolved in Wash off the developer.
- the color filter unit can also be prepared by other methods, such as spray coating.
- the black matrix 123a is formed on the first substrate 102, and then the red, green, and blue photoresist materials are accurately sprayed by using the inkjet method. In the corresponding color block area, this method omits the process of exposure and development.
- a common metal mask (Common Metal Mask) is used to prepare a color filter unit.
- the solution of this solution is simple, and the production difficulty is compared with that of using a fine metal mask to vaporize each sub-pixel Greatly reduced and reduced production costs.
- this solution overcomes the problem that the yield of the display device decreases due to the need for alignment adjustment when the sub-pixels are evaporated using a fine metal mask.
- the method for preparing a display device further includes step S4: forming a second substrate 104, that is, a PI layer, on the color filter layer 103.
- the second PI layer is used to flatten the color filter layer 103 described above, and the preparation method is the same as that of the first PI layer. It can be sprayed, slit coated, and spin coated, and then baked to harden. Since the flexibility of the first substrate, the second substrate, and the color filter layer is the same, the color filter layer can be applied to a flexible display device.
- the method for manufacturing a display device further includes step S5: forming a barrier layer 105 on the second substrate 104.
- the barrier layer 105 is used to block the intrusion of water and oxygen from the outside and protect the internal structure of the display device.
- the barrier layer 105 is an inorganic material selected from an oxide, a nitride, an oxynitride, or a fluoride, and is formed on the second substrate 104 by a deposition method.
- the barrier layer 105 includes a plurality of silicon dioxide and silicon nitride layers that are alternately stacked.
- the red, green, and blue light emitting layer layers of the existing organic electroluminescence (OLED) display device need to be deposited by FMM during the preparation process.
- high resolution requires very high alignment accuracy during evaporation, which makes alignment difficult.
- FMM evaporation is used, the probability of foreign objects in the preparation process increases, which reduces the yield of thin film packaging.
- a color filter layer is fabricated on a flexible substrate by means of photolithography or spray coating, thereby avoiding the use of FMM, which can meet the manufacturing process of large-sized display devices and the lightness and thinness of display devices Demand.
Abstract
La présente invention se rapporte au champ technique de l'affichage, et concerne ainsi un dispositif d'affichage, le dispositif d'affichage comprenant un premier substrat ; une couche de filtrage de couleur qui est disposée sur le premier substrat ; et une couche électroluminescente, la lumière émise par la couche électroluminescente formant de la lumière de couleur après avoir traversé la couche de filtrage de couleur. Le dispositif d'affichage comprend en outre un deuxième substrat et une couche de barrière, le deuxième substrat étant disposé sur un côté de la couche de filtrage de couleur qui est éloigné du premier substrat et recouvrant la couche de filtrage de couleur. La présente invention concerne en outre un procédé de préparation d'un substrat d'affichage, dont les étapes consistent : à réaliser un premier substrat ; à former une pluralité de matrices noires qui sont espacées sur le premier substrat ; et à former des unités de filtrage de couleur des matrices noires adjacentes et à former une couche de filtrage de couleur. Le dispositif d'affichage et son procédé de préparation selon la présente invention peuvent réduire la difficulté de traitement de dispositifs d'affichage à DELO de grande taille et améliorer le rendement de traitement de dispositifs d'affichage à DELO, et sont adaptés à des dispositifs d'affichage à haute résolution et flexibles.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2018/098124 WO2020024181A1 (fr) | 2018-08-01 | 2018-08-01 | Dispositif d'affichage et son procédé de préparation |
CN201880094164.1A CN112640117A (zh) | 2018-08-01 | 2018-08-01 | 显示器件及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2018/098124 WO2020024181A1 (fr) | 2018-08-01 | 2018-08-01 | Dispositif d'affichage et son procédé de préparation |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020024181A1 true WO2020024181A1 (fr) | 2020-02-06 |
Family
ID=69230486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/098124 WO2020024181A1 (fr) | 2018-08-01 | 2018-08-01 | Dispositif d'affichage et son procédé de préparation |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112640117A (fr) |
WO (1) | WO2020024181A1 (fr) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102938411A (zh) * | 2011-06-28 | 2013-02-20 | 希百特股份有限公司 | 具有混合结构的全彩色有源矩阵型有机发光显示器 |
CN104395375A (zh) * | 2013-06-26 | 2015-03-04 | 东丽株式会社 | 聚酰亚胺前体、聚酰亚胺、使用了它们的柔性基板、滤色器及其制造方法以及柔性显示器件 |
CN107073914A (zh) * | 2014-09-30 | 2017-08-18 | 东丽株式会社 | 显示器用支承基板、使用其的滤色片及其制造方法、有机el元件及其制造方法以及柔性有机el显示器 |
CN107492564A (zh) * | 2016-06-10 | 2017-12-19 | 三星显示有限公司 | 显示设备及其制备方法 |
CN107667441A (zh) * | 2015-06-03 | 2018-02-06 | 东友精细化工有限公司 | 柔性滤色器、包括该柔性滤色器的柔性有机发光显示设备及其制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108336112A (zh) * | 2018-01-30 | 2018-07-27 | 上海瀚莅电子科技有限公司 | 一种彩色滤光片及其制备方法、显示面板 |
-
2018
- 2018-08-01 CN CN201880094164.1A patent/CN112640117A/zh active Pending
- 2018-08-01 WO PCT/CN2018/098124 patent/WO2020024181A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102938411A (zh) * | 2011-06-28 | 2013-02-20 | 希百特股份有限公司 | 具有混合结构的全彩色有源矩阵型有机发光显示器 |
CN104395375A (zh) * | 2013-06-26 | 2015-03-04 | 东丽株式会社 | 聚酰亚胺前体、聚酰亚胺、使用了它们的柔性基板、滤色器及其制造方法以及柔性显示器件 |
CN107073914A (zh) * | 2014-09-30 | 2017-08-18 | 东丽株式会社 | 显示器用支承基板、使用其的滤色片及其制造方法、有机el元件及其制造方法以及柔性有机el显示器 |
CN107667441A (zh) * | 2015-06-03 | 2018-02-06 | 东友精细化工有限公司 | 柔性滤色器、包括该柔性滤色器的柔性有机发光显示设备及其制作方法 |
CN107492564A (zh) * | 2016-06-10 | 2017-12-19 | 三星显示有限公司 | 显示设备及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112640117A (zh) | 2021-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6987228B2 (ja) | 有機発光ダイオード表示装置及びその製造方法 | |
US9064822B2 (en) | Organic electroluminescent device and method of manufacturing the same | |
CN104166265B (zh) | 一种彩色滤光片基板及其制备方法、有机发光显示面板、显示装置 | |
WO2016004698A1 (fr) | Dispositif d'affichage delo et son procédé de fabrication, dispositif d'affichage et plaque de masquage de dépôt par évaporation | |
US7947518B2 (en) | Method for forming electronic devices by using protecting layers | |
CN108963100A (zh) | 彩膜基板及其制作方法、显示面板 | |
WO2019127685A1 (fr) | Procédé de fabrication de panneau d'affichage, panneau d'affichage et dispositif d'affichage | |
JPH0945477A (ja) | 発光素子及びその製造方法 | |
US10991884B2 (en) | Mask plate, OLED display substrate, display device and manufacturing method thereof | |
KR102003269B1 (ko) | 광학 필터의 제조 방법 및 광학 필터를 구비하는 유기 발광 표시 장치의 제조 방법 | |
US11502274B2 (en) | Display substrate and preparation method thereof, and display apparatus | |
CN111933670A (zh) | 一种显示基板及其制备方法、显示装置 | |
WO2016187987A1 (fr) | Panneau d'affichage et son procédé de fabrication, et dispositif d'affichage | |
JP2010272300A (ja) | 有機el表示装置の製造方法 | |
US11145836B2 (en) | OLED display device and manufacturing method for the same | |
JP2003272872A (ja) | 自己発光表示装置 | |
TWI609211B (zh) | 顯示裝置 | |
CN107785401B (zh) | 彩膜基板的制作方法、彩膜基板及显示面板 | |
WO2020024181A1 (fr) | Dispositif d'affichage et son procédé de préparation | |
KR20080003079A (ko) | 유기발광소자 및 그 제조방법 | |
WO2020199308A1 (fr) | Dispositif électroluminescent organique et son procédé de fabrication | |
EP4131353A1 (fr) | Dispositif d'affichage et procédé de fabrication associé | |
JP2007220431A (ja) | 多色発光デバイス及びその製造方法 | |
WO2021223298A1 (fr) | Structure d'agencement de pixels de delo, panneau d'affichage delo, et procédé de fabrication pour panneau d'affichage | |
US10763458B2 (en) | Manufacturing method of color filter substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18928681 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18928681 Country of ref document: EP Kind code of ref document: A1 |