WO2020019148A1 - 散热结构及散热结构的制造方法 - Google Patents

散热结构及散热结构的制造方法 Download PDF

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Publication number
WO2020019148A1
WO2020019148A1 PCT/CN2018/096779 CN2018096779W WO2020019148A1 WO 2020019148 A1 WO2020019148 A1 WO 2020019148A1 CN 2018096779 W CN2018096779 W CN 2018096779W WO 2020019148 A1 WO2020019148 A1 WO 2020019148A1
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WO
WIPO (PCT)
Prior art keywords
bottom plate
hole
sticker
shaft tube
magnetically permeable
Prior art date
Application number
PCT/CN2018/096779
Other languages
English (en)
French (fr)
Inventor
余强
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2018/096779 priority Critical patent/WO2020019148A1/zh
Priority to CN201880038334.4A priority patent/CN110770447A/zh
Publication of WO2020019148A1 publication Critical patent/WO2020019148A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/002—Details, component parts, or accessories especially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/60—Mounting; Assembling; Disassembling
    • F04D29/62—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/60—Mounting; Assembling; Disassembling
    • F04D29/62—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
    • F04D29/624—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
    • F04D29/626—Mounting or removal of fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the field of heat dissipation technology, and in particular, to a heat dissipation structure and a method for manufacturing the same.
  • a magnetic permeable member is often provided to limit the position of the rotor of the heat dissipation structure when the rotor is stopped, so as to activate the rotor when the rotor is started.
  • the magnetically permeable member is usually made integrally with the bottom plate of the heat-dissipating structure.
  • the process is usually one-time molding using a mold, that is, a groove for placing the magnetically permeable member is firstly placed on the mold, and the magnetically permeable member is placed Inside the groove, make the bottom plate.
  • This process has the following problems: due to the small size of the magnetically permeable member, it is inconvenient and time-consuming to manually place the groove in the mold, and if a magnetically permeable member is placed into the groove using a jig or automated equipment, the magnetically permeable member is easily treated. It needs to be put in many times if it is brought out by the equipment or automation equipment, resulting in complicated process and reduced efficiency.
  • the present application provides a heat dissipation structure, which does not need to be integrated into a magnetic conductive member when manufacturing a base plate, and has a simple process and can improve efficiency.
  • an embodiment of the present application provides a heat dissipation structure including a magnetic conductive member and a bottom plate.
  • the bottom plate is provided with a shaft tube, and the bottom plate is provided with through holes, and the through holes are distributed in the shaft tube.
  • the through hole accommodates the magnetically permeable member, and a sticker is attached to a surface of the bottom plate facing away from the shaft tube, the sticker covers the through hole, and the magnetically permeable member is fixed to the sticker.
  • the sticker includes an adhesive layer, and the adhesive layer is attached to the bottom plate and the magnetic conductive member.
  • the magnetically permeable member is in a clearance fit, a transition fit, or an interference fit with the through hole.
  • the magnetic conductive member includes a bonding surface, the bonding surface is grooved to form an uneven structure, and the bonding surface is bonded to the adhesive layer.
  • the magnetically permeable member includes a main body portion and a positioning portion, the main body portion is used for pasting with the sticker, and the positioning portion is provided at an end portion of the main body portion facing away from a surface for pasting. And the positioning portion protrudes from a surface of the main body portion facing the inner wall of the through hole, and the positioning portion is configured to be attached to a surface of the bottom plate facing away from the sticker, so that the main body portion
  • the depth of the first through hole is the same as the thickness of the bottom plate.
  • the number of the through holes opened on the bottom plate is two or more, and the two or more through holes are evenly arranged in the circumferential direction of the shaft tube, and each of the through holes is provided in the through hole.
  • a circuit board and a fan wheel are mounted on the shaft tube, the circuit board is provided with a plurality of coil structures along the circumferential direction of the shaft tube, the fan wheel is rotatably connected to the shaft tube, and the The fan wheel is provided with a plurality of permanent magnets having the same number of the coil structure, and the number of the magnetic conductive members is not the same as the number of the permanent magnets. After the fan wheel is stopped, the position of the permanent magnets and The projections of the positions of the magnetically permeable members in a direction perpendicular to the bottom plate do not coincide.
  • a circuit board and a fan wheel are mounted on the shaft tube, the circuit board is provided with a plurality of coil structures along the circumferential direction of the shaft tube, the fan wheel is rotatably connected to the shaft tube, and the The fan wheel is provided with a plurality of permanent magnets having the same number of the coil structure, and the number of the magnetic conductive members is the same as the number of the permanent magnets. After the fan wheel is stopped, the position of the permanent magnets is the same as that of the permanent magnets.
  • an embodiment of the present application further provides a method for manufacturing a heat dissipation structure, including the following steps:
  • a sticker is attached to a surface of the bottom plate facing away from the shaft tube, and the sticker covers the through hole;
  • a magnetically permeable member is placed in the through hole, and the magnetically permeable member and the sticker are pasted and fixed.
  • the step of manufacturing the bottom plate is made of a mold, and the mold includes an end surface, and a protrusion is provided on the end surface, and the protrusion is used to form the through hole.
  • the size of the protrusion is set so that the through hole and the magnetic conductive member formed by the protrusion are clearance fit, transition fit, or interference. Cooperate.
  • the sticker includes an adhesive layer, and the adhesive layer is attached to the bottom plate, and a gap fit is made between the through hole and the magnetic conductive member, so that the magnetic conductive member and There is a first gap between the inner walls of the through holes, and when the magnetic conductive member is accommodated in the space of the through holes:
  • the magnetically permeable member is provided with a bonding surface, a groove is formed on the bonding surface to form an uneven structure, and the bonding surface is bonded to the sticker.
  • the magnetic permeable member includes a main body portion and a positioning portion, and the main body portion and the sticker are pasted, and the positioning portion is provided at an end portion of the main body portion facing away from a surface for pasting. And the positioning portion protrudes from the surface of the main body portion facing the inner wall of the through hole, and the positioning portion and the surface of the bottom plate facing away from the sticker are attached to make the main body portion extend
  • the depth of entering the through hole is the same as the thickness of the bottom plate.
  • the method further includes the following steps: the number of the through holes opened on the bottom plate is two or more, and the two or more through holes are evenly arranged in the circumferential direction of the shaft tube, and each The through holes are provided with the magnetic conductive members, and each of the magnetic conductive members is fixed with the sticker.
  • the method further includes the steps of: installing a circuit board and a fan wheel on the shaft tube, the circuit board is provided with a plurality of coil structures along the circumferential direction of the shaft tube, and the fan wheel and the shaft tube rotate Connected, and the fan wheel is provided with a plurality of permanent magnets with the same number of the coil structure, the number of the magnetically permeable members and the number of the permanent magnets are not the same, and after the fan wheel stops, the The projection of the position of the permanent magnet and the position of the magnetically permeable member in a direction perpendicular to the bottom plate does not coincide.
  • the method further includes the steps of: installing a circuit board and a fan wheel on the shaft tube, the circuit board is provided with a plurality of coil structures along the circumferential direction of the shaft tube, and the fan wheel and the shaft tube rotate Connected, and the fan wheel is provided with a plurality of permanent magnets having the same number of the coil structure, the number of the magnetic conductive members is the same as the number of the permanent magnets, and after the fan wheel is stopped, the permanent magnets The position of the magnet coincides with the projection of the position of the magnetically permeable member in a direction perpendicular to the base plate, but the position of the magnetically permeable member and the position of the coil on the circuit board are in a direction perpendicular to the base plate The projections do not coincide.
  • a through hole is provided on the base plate, and the magnetic conductive member is accommodated.
  • the magnetic conductive member is fixed by using a sticker. Compared with the prior art, the magnetic conductive member does not need to be integrated into a single body when the base plate is manufactured. The efficiency is improved, and the use of stickers to fix the magnetically permeable member realizes the reuse of the functions of the stickers and reduces the cost.
  • FIG. 1 is a schematic perspective view of a heat dissipation structure provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a complete external appearance of a heat dissipation structure provided by an embodiment of the present application.
  • FIG. 3 is a schematic plan view of the heat dissipation structure of FIG. 1.
  • FIG. 4 is a schematic rear structural view of the heat dissipation structure of FIG. 3.
  • FIG. 5a is a schematic plan view of a sticker provided in an embodiment of the present application.
  • 5b is a schematic cross-sectional structure diagram of the sticker of FIG. 5a.
  • FIG. 6a is a schematic cross-sectional structure diagram of affixing a sticker to a bottom plate according to an embodiment of the present application.
  • FIG. 6b is a schematic diagram of a partially enlarged structure at A in an embodiment of FIG. 6a.
  • FIG. 6c is a schematic diagram of a partially enlarged structure at A in another embodiment of FIG. 6a.
  • FIG. 6d is a schematic diagram of a partially enlarged structure at A in another embodiment of FIG. 6a.
  • FIG. 6e is a schematic diagram of a partially enlarged structure at A in another embodiment of FIG. 6a.
  • FIG. 6f is a schematic diagram of a partially enlarged structure at A in another embodiment of FIG. 6a.
  • FIG. 7 is a schematic diagram of a three-dimensional structure of a mold according to an embodiment of the present application.
  • a component when a component is called “fixed to” another component, it may be directly on another component or a centered component may exist. When a component is considered to be “connected” to another component, it can be directly connected to another component or a centered component may exist at the same time.
  • an embodiment of the present application provides a heat dissipation structure, including a magnetically permeable member (refer to the first magnetically permeable member 21) and a bottom plate 10.
  • the bottom plate 10 is provided with a shaft tube 12, and the bottom plate 10
  • a through hole (refer to the first through hole 131) is provided on the upper side, and the through holes are distributed around the shaft tube 12.
  • the through holes receive the magnetic conductive member, and the bottom plate 10 faces away from the shaft tube 12.
  • a sticker 30 is affixed to the surface, the sticker 30 covers the through hole, and the magnetic conductive member is fixed to the sticker 30 by paste.
  • the magnetically permeable member is fixed and fixed by a sticker.
  • the process is simple, and The efficiency is improved, and the magnetically permeable member is fixed by the sticker 30, thereby realizing the function reuse of the sticker 30 and reducing the cost.
  • the heat dissipation structure of this embodiment further includes a side wall 11, which is disposed on a peripheral edge of the plane of the bottom plate 10 and encloses with the bottom plate 10 to form a receiving cavity 101.
  • the receiving cavity 101 is provided with an air inlet. 14 and outlet 111.
  • the shaft tube 12 is used for mounting a circuit board (not shown) and the fan wheel 50.
  • a plurality of coil structures (not shown) are provided along the circumferential direction of the shaft tube on the circuit board to form a stator.
  • the fan wheel 50 and the shaft tube 12 are connected in rotation, and the connection position is located at the center 51 of the fan wheel.
  • a plurality of permanent magnets (not shown) are provided on the fan wheel 50 along the circumferential direction of the fan wheel center 51 to form a rotor. The number is the same as the number of coils.
  • the fan wheel 50 is provided with a plurality of blades 52 along the periphery, and the plurality of blades rotate with the fan wheel 50 to drive the air in the receiving chamber 101.
  • the air flows from the air inlet 14 to the air outlet 111, taking away heat and realizing heat dissipation. .
  • the magnetizer can generate magnetic force with the permanent magnets on the fan wheel 50, so that under the action of the magnetic force, the fan wheel 50 can be quickly stopped and stopped at a preset position.
  • the preset position after the rotor stops is a position where the projections of the permanent magnet and the coil perpendicular to the bottom plate 10 do not coincide.
  • a protruding limiting structure 15 is provided on the bottom plate 10, and the distance between the limiting structure 15 and the shaft tube 12 is greater than the distance between the through hole and the shaft tube 12. Further, enabling the circuit board to cover the through hole is equivalent to restricting the magnetic conductive member in the through hole, and further strengthening the stability of the magnetic conductive member fixed in the through hole.
  • limiting structures 15 In one embodiment, please refer to FIG. 3.
  • limiting structures 15 which are a first limiting structure 151, a second limiting structure 152, a third limiting structure 153, and The fourth limiting structure 154, the first limiting structure 151, the second limiting structure 152, the third limiting structure 153, and the fourth limiting structure 154 are disposed in the circumferential direction of the shaft tube 12, and are preferably uniformly disposed.
  • a limiting structure 151, a second limiting structure 152, a third limiting structure 153, and a fourth limiting structure 154 are enclosed to form a clamping space for receiving a circuit board.
  • the circuit board is in the first limiting structure 151, The second limiting structure 152, the third limiting structure 153, and the fourth limiting structure 154 are fixed under the action of snapping.
  • the shape of the circuit board is not limited.
  • the preferred circuit board is circular as a whole.
  • the first limiting structure 151, the second limiting structure 152, the third limiting structure 153, and the fourth limiting structure 154 are respectively latched on the circuit board.
  • one or more protrusions may be provided in the circumferential direction of the circuit board, and the one or more protrusions may be snapped into the side wall of any one or more limiting structures to limit the circuit. The rotation of the plate.
  • the structure of the fan wheel 50 and the shaft tube 12 and the connection structure between them can adopt the existing technology, and bearings can be used to reduce friction, and the detailed structure will not be described repeatedly.
  • the air inlet 14 of the heat dissipation structure of the present application is disposed on the bottom plate 10, and the air inlet 14 is disposed at a position farther from the shaft tube 12 than the through hole. In this way, the circuit board above the through hole can be avoided and the flow path of the wind can be reduced. Obstacles make the intake more smooth.
  • Air inlet 144, fifth air inlet 145, and sixth air inlet 146, first air inlet 141, second air inlet 142, third air inlet 143, fourth air inlet 144, fifth air inlet 145, and sixth air inlet 146 They are sequentially arranged along the circumferential direction of the shaft tube 12, and are preferably uniformly arranged and spaced apart from a plurality of limiting structures 15.
  • the shapes of the first air inlet 141, the second air inlet 142, the third air inlet 143, the fourth air inlet 144, the fifth air inlet 145, and the sixth air inlet 146 are not limited.
  • the first air inlet 141 and the first air inlet The shapes of the four air inlets 144 are substantially the same, and the two can be respectively disposed at an angle of 180 ° in the circumferential direction of the shaft tube 12; the shapes of the second air inlet 142 and the sixth air inlet 146 are substantially the same, and the two can be relatively
  • the extensions between the first air inlet 141, the shaft tube 12 and the fourth air inlet 144 are arranged symmetrically in a straight line.
  • the shapes of the third air inlet 143 and the fifth air inlet 145 are substantially the same.
  • the two can be opposite to the first air inlet 141 and the shaft tube.
  • the extension between 12 and the fourth air inlet 144 is arranged symmetrically in a straight line.
  • the size of the first air inlet 141 in the radial direction of the shaft tube 12 is larger than that of the second air inlet 142 and the third air inlet 143, that is, the first air inlet 141 is closer to the shaft tube 12, and the purpose of such setting is to In order to provide a wire connected to the circuit board, the wire extends from the first air inlet 141 into the receiving cavity 101 and is connected to the circuit board.
  • the fourth air inlet 144 is substantially the same as the first air inlet 141 to balance the air inlet volume of the first air inlet 141.
  • the setting of other air inlets is also based on this principle.
  • the air outlets 111 of the heat dissipation structure of the present application are provided on the side wall 11, and the bottom plate 10 may have a rectangular structure.
  • the side walls 11 surround the three sides of the bottom plate 10. In other words, the air outlets 111 are provided on the four sides of the bottom plate 10. There is no side wall 11 on one of the edges.
  • the shape of the inner wall of the side wall 11 can be set as a circular arc transition structure, so that the shape of the receiving cavity 101 is approximately a volute, which facilitates the flow of air.
  • the side wall 11 is also provided with a mounting hole 16 that penetrates the bottom plate 10, the side wall 11 and the top cover 40 (see FIG. 2).
  • the specific structure of the top cover 40 will be described in the following embodiments, and will not be described here. (More details), the mounting hole 16 is used to cooperate with a connecting member (not shown) to integrally install the heat dissipation structure to a device (such as an electronic computer, a drone, etc.) that needs to dissipate heat.
  • the mounting hole 16 is not limited to a through hole or a thread. Structures such as holes and connectors are not limited to structures such as screws and rivets.
  • the mounting hole 16 may include a plurality of mounting holes. In one embodiment, please refer to FIG. 3.
  • the mounting hole 16 includes a first mounting hole 161, a second mounting hole 162, a third mounting hole 163, and a fourth mounting hole 164.
  • the mounting holes are respectively provided on the four corners of the side wall 11.
  • at least two connecting members can be fixed through the two mounting holes on the opposite corners.
  • the four connecting members are all Pass through the mounting holes on the four corners of the side wall 11 and connect and fix them.
  • weight reduction holes 17 can also be provided in the side wall 11.
  • the weight reduction holes 17 are provided adjacent to the mounting holes 16.
  • weight reduction holes are provided on the basis of ensuring the structural strength of the side wall 11.
  • the size of 17 is as large as possible to reduce the weight of the side wall 11 as much as possible, so that the heat dissipation structure as a whole is lightened.
  • the weight reduction hole 17 preferably penetrates only the side wall 11 and does not penetrate the bottom plate 10 and the top cover 40, so that the entire heat dissipation structure has a complete and uniform appearance. Multiple weight reduction holes 17 may be provided. In one embodiment, please refer to FIG. 3.
  • the weight reduction holes 17 include a first weight reduction hole 171, a second weight reduction hole 172, a third weight reduction hole 173, and a fourth weight reduction. Holes 174 and fifth weight reduction holes 175.
  • the above five weight reduction holes are respectively arranged at four corners on the side wall 11.
  • the shape of the five weight reduction holes can be designed according to the structure of the side wall 11, referring to the prior art. It is also possible to not repeat them here.
  • the outer wall of the side wall 11 is further provided with a latching portion 18.
  • the latching portion 18 is used for cooperative connection with the buckle 42 on the cover plate 40, so that the cover plate 40 is latched on the side wall 11, so that the cover plate 40 It is integrated with the side wall 11 and the bottom plate 10.
  • the plurality of latching portions 18 may include a plurality. In one embodiment, please refer to FIG. 3.
  • the plurality of latching portions include a first latching portion 181, a second latching portion 182, a third latching portion 183, and a fourth card.
  • the connecting portion 184 wherein the first locking portion 181 and the fourth locking portion 184 are respectively disposed on the outer wall of the side wall 11 on two adjacent sides of the air outlet 111, and the second locking portion 182 and the third locking portion 183 are respectively disposed on the outer wall of the side wall 11 opposite to the air outlet 111, and the above-mentioned four clamping parts are arranged at intervals to make the force on the cover plate 40 uniform, and can be more firmly integrated with the side wall 11 .
  • the shape of the cover plate 40 corresponds to the bottom plate 10 and is used to cover the side wall 11 so that the receiving cavity 101 forms a complete cavity including the air inlet 14 and the air outlet 111.
  • the cover 40 is also provided with a secondary air inlet 41.
  • the auxiliary air inlet 41 is substantially circular and is disposed in the outer circumferential direction of the fan wheel 50 to increase the amount of air entering the accommodating cavity 101 and improve the heat dissipation effect.
  • the edge of the cover plate 40 is provided with a latch 42 corresponding to the latching portion 18 on the side wall 11. The latch 42 cooperates with the latching portion 18 to fix the cover 40 on the side wall 11.
  • a wire groove 19 is further provided on the surface of the bottom plate 10 facing away from the side wall 11.
  • the wire groove 19 is used for accommodating wires, so that the wires connected to the circuit board are stored in the wire groove 19 to avoid The lead is not stored and affects the work of other components.
  • One end of the wire groove 19 communicates with the first air inlet 141, and the other end extends to the edge of the bottom plate 10.
  • the wire groove 19 can extend along a straight line as a whole, and the extending direction can be extended to a corner of the bottom plate 10 away from the air outlet 111, so that when the wire is accommodated in the wire groove 19, there is a long distance from the air outlet 111 , Will not interfere with the wind, of course, the hot air flowing out of the air outlet 111 will not blow on the wire and cause the wire to be heated and damaged.
  • the sticker 30 includes a body 32 and an adhesive layer 33 which are arranged in a stack, and the body 32 is provided to the adhesive layer 33.
  • the adhesive layer 33 is attached to the base plate 10 and the magnetically permeable member, so that the sticker 30 can be stuck on the base plate 10 and the magnetically permeable member is fixed.
  • the adhesive on the adhesive layer 33 can flow relative to the body 32.
  • the adhesive is milky or liquid and has viscosity, and can be completely same with the surface of the base plate 10 and the magnetically permeable member. The fit is better.
  • the sticker 30 may be an existing label paper.
  • the sticker 30 is further provided with a label pattern 31.
  • the label pattern 31 is disposed on the side of the body 32 facing away from the adhesive layer 33, and the label pattern 31 may be Text or graphics to identify product specifications, parameters, models, etc. For example, if the label pattern 31 is "3004 fan", it indicates a type of miniature DC fan.
  • the label pattern 31 may have different shapes according to different heat dissipation structures, which is not limited herein.
  • the sticker 30 can be used to fix the magnetically permeable member, so that the overall structure of the heat dissipation structure is stable, and the sticker 30 is used to stick and fix the sticker, thereby achieving the sticker
  • the function of 30 is reused, that is, the sticker 30 is used for both identifying the product and fixing the magnetically permeable member. There is no need to additionally design the structure of the fixed magnetically permeable member, which reduces the cost.
  • the magnetically permeable member is in a clearance fit, a transition fit, or an interference fit with the through hole.
  • the following uses the first magnetically permeable member 21 and the first through hole 131 as examples. It should be understood that the first magnetically permeable member 21 is an embodiment of the magnetically permeable member, and the first through hole 131 is an embodiment of the through hole. .
  • FIG. 6a and FIG. 6b When the first magnetically permeable member 21 and the first through hole 131 are clearance fit or transition fit (when the fitting relationship is clearance fit), the first through hole 131 is against the first The magnetically permeable member 21 does not have a fixing function, and the first magnetically permeable member 21 is fixed by the adhesive connection of the adhesive layer 33 of the sticker 30.
  • the inner wall of the first through hole 131 can also have a fixed effect on the first magnetically permeable member 21
  • the function makes the fixed part of the first magnetically permeable member 21 rely on the inner wall of the first through hole 131 and the other part depends on the adhesive layer 33 of the sticker 30, which can strengthen the fixing effect on the first magnetically permeable member 21.
  • FIG. 6c There is a first gap between the first magnetically permeable member 21 and the inner wall of the first through hole 131, and the adhesive of the adhesive layer 33 flows and fills all of the adhesive. Mentioned inside the first gap.
  • the adhesive of the adhesive layer 33 flows into the space of the first gap to form the first filling portion 331.
  • the surface area connecting the first magnetically permeable member 21 and the adhesive layer 33 is increased, the adhesion force between the first magnetically permeable member 21 and the adhesive layer 33 is increased, and the fixing effect of the first magnetically permeable member 21 is improved.
  • first gap and the second gap may exist at the same time, and then the first filling portion 331 and the second filling portion 332 exist simultaneously.
  • the first filling portion 331 extends from the adhesive layer 33, and the extended size is preferably larger than a half of the thickness of the bottom plate 10.
  • the first filling portion 331 may extend to be flush with the surface of the bottom plate 10 facing away from the adhesive layer 33. In this way, the best paste effect on the first magnetically permeable member 21 can be achieved.
  • the first magnetically permeable member 21 includes a bonding surface, the bonding surface is slotted to form a zigzag shape, and the zigzag surface is bonded to the adhesive layer 33.
  • the surface area of the first magnetically permeable magnet 21 and the adhesive layer 33 can be increased, and the connection effect between the adhesive layer 33 and the first magnetically permeable member 21 can be enhanced.
  • the embodiment is basically the same as the embodiment in FIG. 6d, except that the surface of the first magnetically permeable member 21 is grooved to form a step shape, and the first magnetically permeable member 21 and the adhesive can also be increased.
  • the bonding surface area of the layer 33 enhances the connection effect between the adhesive layer 33 and the first magnetically permeable member 21.
  • the uneven surface structure such as a zigzag shape or a step shape is provided on the bonding surface to increase the surface area of the bonding surface, which is used to enhance the bonding area with the adhesive layer 33 and increase Interacting adhesive force improves the paste effect. It is understandable that there may be other similar structures with different bumps, which are not enumerated here.
  • the thickness of the first magnetic guide 21 may be the same as the thickness of the base plate 10, and the first magnetic guide 21 is arranged flush with the base plate 10, that is, the upper surface of the first magnetic guide 21 is flat with the upper surface of the base plate 10. And the lower surface of the first magnet 21 is flush with the lower surface of the base plate 10 so that the lower surface of the base plate 10 forms a continuous surface so that the circuit board can be set In order to be closer to the position of the bottom plate 10, the circuit board and the bottom plate 10 are closely attached to each other under extreme conditions, so that the overall thickness of the heat dissipation structure can be made thinner to meet the requirements of the thin heat dissipation structure.
  • the first magnetically permeable member 21 includes a first main body portion 211 and a first positioning portion 212.
  • the first main body portion 211 is configured to be pasted with the sticker 30.
  • a first positioning portion 212 is provided at an end of the first body portion 211 facing away from a surface for pasting, and the first positioning portion 212 faces the first through hole 131 from the first body portion 211.
  • the surface of the inner wall protrudes and extends, and the first positioning portion 212 is configured to be attached to the surface of the bottom plate 10 facing away from the sticker 30 so that the first main body portion 211 extends into the first through hole 131.
  • the depth is the same as the thickness of the bottom plate 10.
  • the first positioning portion 212 can form a shoulder or step structure when the first magnetically permeable member 21 is inserted into the first through hole 131, so as to position the first body portion 211 to extend into the first through hole 131.
  • the depth dimension of a through hole 131 meets installation requirements.
  • the lower surface of the first magnetically permeable member 21, that is, the surface of the first positioning portion 212 facing away from the first body portion 211 is not flush with the surface of the bottom plate 10 on which the shaft tube 12 is disposed.
  • the bottom plate 10 is further provided with at least a second through hole 132.
  • the second through hole 132 and the first through hole 131 are in the shaft tube 12.
  • the second through holes 132 are uniformly arranged in the circumferential direction, and the second magnetic conductive member 22 is received.
  • the second magnetic conductive member 22 is fixed to the sticker 30.
  • the number of through holes is 2 or more, so that the number of magnetically permeable members is 2 or more integers, magnetic connection with multiple permanent magnets on the rotor can be achieved. .
  • the number of magnetically permeable members is different from the number of permanent magnets.
  • the number of permanent magnets is three and the number of magnetically permeable members is two.
  • the permanent magnets are stopped after the rotor is stopped.
  • the projection of the position of the magnetically permeable member in the direction perpendicular to the bottom plate 10 does not coincide, but there is a certain included angle, which can realize the limitation of the position of the permanent magnet.
  • the number of permanent magnets is the same as the number of magnetically permeable members.
  • the position of the permanent magnets and the position of the magnetically permeable members coincide with each other in a direction perpendicular to the bottom plate 10 after power-off.
  • the projections of the positions of the coils on the circuit board in a direction perpendicular to the bottom plate 10 do not coincide to balance the force of the rotor, and when the power is started, the coils can apply a circumferential magnetic force to the permanent magnet to rotate it.
  • the position of the magnetically permeable member coincides with the coil
  • the position of the permanent magnet also coincides with the coil. After the current is applied, the coil only exerts an axial force on the permanent magnet, which makes it difficult to rotate the rotor.
  • the bottom plate is provided with at least a third through hole 133 and a fourth through hole 134. That is, the number of through holes formed in the bottom plate 10 is more than four. An even number, the four or more even numbers of through holes are evenly arranged in the circumferential direction of the shaft tube, and each of the through holes is provided with a magnetic conductive member, and each of the magnetic conductive members is connected to the The sticker 30 is fixed. Generally speaking, if the number of permanent magnets on the rotor is more than 4 even numbers, then more than 4 even number of magnetically permeable members are provided to better correspond to the permanent magnets, which can strengthen the limit effect on the permanent magnets.
  • the number of the magnets is two, that is, the first magnet 21 and the second magnet 22 are described as an example.
  • the first magnetizer 21 and the second magnetizer 22 are disposed on a side of the circuit board facing away from the fan wheel 50, that is, the circuit board covers the first magnetizer 21 and the second magnetizer 22.
  • the first and second magnets 21 and 22 have magnetic permeability and can generate magnetic force with two or more permanent magnets on the rotor. When the circuit board is not energized, the magnetic attraction of the two or more permanent magnets on the rotor and the first and second magnets 21 and 22 makes the position of the rotor limited, and the rotor always maintains a relatively fixed position. It will not stop at any position.
  • the permanent magnet on the rotor is coincident with the projection of the coil position on the stator in a direction perpendicular to the bottom plate 10. Because the magnetic force of the coil on the permanent magnet is axial, instead of Circumferential, which is not conducive to the start of the rotor.
  • the circuit board is energized, because the circuit board is disposed closer to the fan wheel 50 than the first and second magnets 21 and 22, the magnetic force generated by the coil on the stator has a stronger effect on the force of the permanent magnets of the rotor than the first.
  • the first and second magnets 21 and 22 are larger and can overcome the force between the permanent magnet and the first and second magnets 21 and 22 to drive the rotor to rotate.
  • first and second magnets 21 and 22 also have a magnetic force on the permanent magnets on the rotor, the magnetic force is attractive, and the rotor can be pulled so that it does not move away from the bottom plate 10 on the shaft tube 12 Move in the direction.
  • the bottom plate 10 and the side wall 11 are made of non-metallic materials, such as plastic, and the magnetic conductive member is iron and related magnetic conductive materials.
  • the materials of other structures are not limited.
  • the bottom plate 10 by making the bottom plate 10, forming a through hole at the same time, and then attaching the sticker 30, and accommodating the magnetic conductive member in the through hole, so that the magnetic conductive member and the sticker 30 are fixed and fixed.
  • the base plate 10 does not need to be integrated into a magnetically permeable member, and the process is simple and can improve efficiency.
  • the use of the sticker 30 to fix the magnetically permeable member enables the reuse of the functions of the sticker 30 and reduces the cost.
  • the following description is made by making the first through hole 131 and the first magnetic conductive member 21 as an example.
  • the first through hole 131 is an embodiment of the through hole
  • the first magnetic conductive member 21 is an embodiment of the magnetic conductive member.
  • the step of manufacturing the bottom plate 10 is made of a mold 60.
  • the mold 60 includes an end surface 61, and a first protrusion 621 is provided on the end surface 61.
  • the first protrusion 621 is used for The first through hole 131 is formed.
  • the bottom plate 10 may be made of plastic material, and the process of making the bottom plate 10 by the mold 60 may be an injection molding process.
  • the bottom plate 10, the first through hole 131, and the shaft tube 12 can be manufactured by a one-piece molding process; or the bottom plate 10 and the first through hole 131 are integrated into one body, and the shaft tube 12 is manufactured by subsequent processes; or the bottom plate 10 and the shaft The tube 12 is integrally formed, and the first through hole 131 is made by a subsequent process.
  • the size of the first through hole 131 is set so that the first through hole 131 and the first through hole 131 formed by the first protrusion 621 are formed.
  • a magnetically permeable member 21 is a clearance fit, a transition fit, or an interference fit.
  • the sticker 30 includes a body 32 and an adhesive layer 33 which are arranged in a stack, the adhesive layer 33 is attached to the bottom plate 10, and the adhesive on the adhesive layer 33 can be opposite to the The body 32 flows, and a clearance fit is made between the first through hole 131 and the first magnetically permeable member 21 so that there is a first gap between the first magnetically permeable member 21 and an inner wall of the first through hole 131.
  • a gap when the first magnetically permeable member 21 is accommodated in the space of the first through hole 131, the first magnetically permeable member 21 and the sticker 30 are pressed to make the adhesive layer 33 The viscose flows and fills the space of the first gap.
  • the first magnetically permeable member 21 includes a first body portion 211 and a first positioning portion 212.
  • the first body portion 211 and the sticker 30 are pasted, and the first positioning portion 212 is attached.
  • An end portion of the first main body portion 211 facing away from a surface for pasting, and the first positioning portion 212 protrudes from a surface of the first main body portion 211 facing an inner wall of the first through hole 131.
  • the thickness of 10 is the same.
  • the method further includes the following steps: the number of the through holes opened on the bottom plate 10 is two or more, and the two or more through holes are uniformly arranged in the circumferential direction of the shaft tube, and each Each of the through holes is provided with the magnetic conductive member, and each of the magnetic conductive members is fixedly attached to the sticker 30.
  • the number of protrusions provided on the mold 60 is also two or more.
  • the embodiment shown in FIG. 7 shows that the number of protrusions is four, that is, second protrusions 622 and third protrusions are also provided. From the 623 and the fourth protrusion 624, the centers of the opposite end faces of the 4 protrusions are evenly arranged.
  • the 4 protrusions can form 4 through holes in the base plate 10 (corresponding to the first through holes 131, the second through holes 132, The third through hole 133 and the fourth through hole 134) can accommodate four magnetically permeable members.
  • the method further includes the steps of: mounting a circuit board and a fan wheel 50 on the shaft tube 12, and the circuit board is provided with a plurality of coil structures along a circumferential direction of the shaft tube 12;
  • the shaft tube 12 is rotatably connected, and the fan wheel 50 is provided with a plurality of permanent magnets having the same number of the coil structure.
  • the number of the magnetic conductive members is different from the number of the permanent magnets.
  • the method further includes the steps of: mounting a circuit board and a fan wheel 50 on the shaft tube 12, and the circuit board is provided with a plurality of coil structures along a circumferential direction of the shaft tube 12;
  • the shaft tube 12 is rotatably connected, and the fan wheel 50 is provided with a plurality of permanent magnets having the same number of the coil structure, and the number of the magnetic conductive members is the same as the number of the permanent magnets.
  • the position of the permanent magnet coincides with the projection of the position of the magnetically permeable member in a direction perpendicular to the bottom plate 10, but the position of the magnetically permeable member and the position of the coil on the circuit board The projections in a direction perpendicular to the bottom plate 10 do not coincide.

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Abstract

本申请提供一种散热结构及其制造方法，该散热结构包括导磁件和底板，所述底板上设有轴管，所述底板上开设有通孔，所述通孔分布在所述轴管的周围，所述通孔容纳所述导磁件，所述底板背向所述轴管的表面粘贴有贴纸，所述贴纸覆盖所述通孔，所述导磁件与所述贴纸粘贴固定。本申请相对于现有技术，在制作底板时不需要将导磁件制作形成一体，工艺简单，能提升效率，而利用贴纸固定导磁件，实现了贴纸的功能复用，降低了成本。

Description

散热结构及散热结构的制造方法 技术领域
本申请涉及散热技术领域，具体涉及一种散热结构及散热结构的制造方法。
背景技术
现有的散热结构中，常常设置导磁件用来限定散热结构的转子停止时的位置，以便于启动时激活转子。现有的散热结构中，导磁件通常是与散热结构的底板制作为一体，其工艺通常为采用模具一次成型，即在模具上先设置放置导磁件的凹槽，将导磁件放入凹槽内，再制作底板。此工艺存在以下问题：由于导磁件尺寸小，手工放置入模具的凹槽不便，耗时长，而如果采用治具或者自动化设备将导磁件放入凹槽时，导磁件又容易被治具或者自动化设备带出来，需要多次重复放入，导致工艺复杂，效率降低。
发明内容
为解决上述技术问题，本申请提供一种散热结构，在制作底板时不需要将导磁件制作形成一体，工艺简单，能提升效率。
第一方面，本申请实施例提供一种散热结构，包括导磁件和底板，所述底板上设有轴管，所述底板上开设有通孔，所述通孔分布在所述轴管的周围，所述通孔容纳所述导磁件，所述底板背向所述轴管的表面粘贴有贴纸，所述贴纸覆盖所述通孔，所述导磁件与所述贴纸粘贴固定。
一种实施例中，所述贴纸包括粘胶层，所述粘胶层与所述底板和所述导磁件贴合。
一种实施例中，所述导磁件与所述通孔间隙配合、过渡配合或过盈配合。
一种实施例中，所述导磁件与所述通孔的内壁之间具有第一间隙，所述粘胶层的粘胶填充所述第一间隙。
一种实施例中，所述导磁件包括贴合面，所述贴合面开槽形成凹凸不平的结构，所述贴合面与所述粘胶层贴合。
一种实施例中，所述导磁件包括主体部和定位部，所述主体部用于与所述贴纸粘贴，所述定位部设于所述主体部背向用于粘贴的表面的端部，且所述定位部自所述主体部面对所述通孔的内壁的表面突出延伸，所述定位部用于与所述底板背向所述贴纸的表面贴合，以使所述主体部伸入所述第一通孔的深度与所述底板的厚度相同。
一种实施例中，所述底板上开设的所述通孔的数量为2个以上，所述2个以上通孔在所述轴管周向上均布设置，每个所述通孔内均设有所述导磁件，每个所述导磁件均与所述贴纸粘贴固定。
一种实施例中，所述轴管上安装有电路板和扇轮，所述电路板沿所述轴管周向设有多个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量不相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影不重合。
一种实施例中，所述轴管上安装有电路板和扇轮，所述电路板沿所述轴管周向设有多 个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影重合，但所述导磁件的位置与所述电路板上的线圈的位置在垂直于所述底板的方向上的投影不重合。
第二方面，本申请实施例还提供一种散热结构的制造方法，包括如下步骤：
制作底板，所述底板上形成通孔和轴管；
在所述底板背向所述轴管的表面贴设贴纸，所述贴纸覆盖所述通孔；
在所述通孔内容置导磁件，且使得所述导磁件与所述贴纸粘贴固定。
一种实施例中，所述制作底板的步骤采用模具制成，所述模具包括一端面，在所述端面上设置凸起，所述凸起用于形成所述通孔。
一种实施例中，在制作所述通孔时，设置所述凸起的尺寸，以使所述凸起所形成的所述通孔和所述导磁件为间隙配合、过渡配合或过盈配合。
一种实施例中，所述贴纸包括粘胶层，所述粘胶层与所述底板贴合，制作所述通孔与所述导磁件之间为间隙配合，使得所述导磁件与所述通孔的内壁之间具有第一间隙，在将所述导磁件容纳于所述通孔的空间内时：
按压所述导磁件和所述贴纸，以使所述粘胶层的粘胶填充至所述第一间隙。
一种实施例中，所述导磁件设有贴合面，在所述贴合面开槽以形成凹凸不平的结构，并将所述贴合面与所述贴纸贴合。
一种实施例中，所述导磁件包括主体部和定位部，将所述主体部与所述贴纸粘贴，将所述定位部设于所述主体部背向用于粘贴的表面的端部，且所述定位部自所述主体部面对所述通孔的内壁的表面突出延伸，将所述定位部与所述底板背向所述贴纸的表面贴合，以使所述主体部伸入所述通孔的深度与所述底板的厚度相同。
一种实施例中，还包括如下步骤：在所述底板上开设的所述通孔的数量为2个以上，所述2个以上通孔在所述轴管周向上均布设置，每个所述通孔内均设有所述导磁件，每个所述导磁件均与所述贴纸粘贴固定。
一种实施例中，还包括如下步骤：在所述轴管上安装电路板和扇轮，所述电路板沿所述轴管周向设有多个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量不相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影不重合。
一种实施例中，还包括如下步骤：在所述轴管上安装电路板和扇轮，所述电路板沿所述轴管周向设有多个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影重合，但所述导磁件的位置与所述电路板上的线圈的位置在垂直于所述底板的方向上的投影不重合。
本申请通过设置在底板上设置通孔，并容纳导磁件，通过贴纸将导磁件粘贴固定，相对于现有技术，在制作底板时不需要将导磁件制作形成一体，工艺简单，能提升效率，而 利用贴纸固定导磁件，实现了贴纸的功能复用，降低了成本。
附图说明
图1是本申请实施例提供的一种散热结构的立体结构示意图。
图2是本申请实施例提供的一种散热结构的完整外观立体结构示意图。
图3是图1的散热结构的平面结构示意图。
图4是图3的散热结构后视结构示意图。
图5a是本申请实施例提供的贴纸的平面结构示意图。
图5b是图5a的贴纸的剖面结构示意图。
图6a是本申请实施例提供的贴纸与底板贴合的剖视结构示意图。
图6b是图6a的一种实施例中A处的局部放大结构示意图。
图6c是图6a的另一种实施例中A处的局部放大结构示意图。
图6d是图6a的另一种实施例中A处的局部放大结构示意图。
图6e是图6a的另一种实施例中A处的局部放大结构示意图。
图6f是图6a的另一种实施例中A处的局部放大结构示意图。
图7是本申请实施例提供的模具的立体结构示意图。
具体实施例
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参考图1和图2，本申请实施例提供一种散热结构，包括导磁件(参考第一导磁件21)和底板10，所述底板10上设有轴管12，所述底板10上开设有通孔(参考第一通孔131)，所述通孔分布在所述轴管12的周围，所述通孔容纳所述导磁件，所述底板10背向所述轴管12的表面粘贴有贴纸30，所述贴纸30覆盖所述通孔，所述导磁件与所述贴纸30粘贴固定。
通过设置在底板10上设置通孔，并容纳导磁件，通过贴纸将导磁件粘贴固定，相对于现有技术，在制作底板10时不需要将导磁件制作形成一体，工艺简单，能提升效率，而利 用贴纸30固定导磁件，实现了贴纸30的功能复用，降低了成本。
本实施例的散热结构还包括侧墙11，所述侧墙11设置于所述底板10的平面的周缘，并与底板10共同围合形成一容纳腔101，所述容纳腔101设有入风口14和出风口111。
本实施例中，轴管12用于安装电路板(图未示)和扇轮50。电路板上沿轴管周向设置有多个线圈结构(图未示)，形成定子。扇轮50与轴管12为转动连接，连接的位置位于扇轮的中心51，扇轮50上沿扇轮中心51周向设置有多个永磁体(图未示)，形成转子，其中永磁体的数量与线圈的数量相同。当电路板通电后，电流流经线圈结构，线圈产生磁场，与永磁体的磁场产生磁力作用，从而驱动扇轮50转动。扇轮50上沿周缘设有多个叶片52，多个叶片随扇轮50转动，带动容纳腔101内的空气流动，空气从入风口14流动到出风口111，带走热量，实现散热的功能。
在电路板断电后，导磁体能与扇轮50上的永磁体产生磁力作用，从而在磁力的作用下，能快速的使扇轮50停转，并停在预设的位置。本实施例中，转子停转后的预设位置为永磁体与线圈在垂直于底板10上的投影不重合的位置。在电路板再次通电后，由于导磁体已使得扇轮停在预设位置，电路板上的线圈与扇轮上的永磁体产生的磁力包含沿轴管12周向上的拉力，从而快速的激活扇轮转动，使得导磁体实现激活启动的功能。
电路板安装在轴管12上后，需使得电路板固定，因此，在底板10上设有突出的限位结构15，限位结构15与轴管12的距离比通孔到轴管12的距离更远，使得电路板可以覆盖通孔，相当于对通孔内的导磁件产生限制的作用，进一步加强导磁件固定在通孔内的稳固程度。限位结构15为多个，一种实施例中，请参考图3，限位结构15为4个，分别为第一限位结构151、第二限位结构152、第三限位结构153和第四限位结构154，第一限位结构151、第二限位结构152、第三限位结构153和第四限位结构154设置在轴管12的周向上，优选为均布设置，第一限位结构151、第二限位结构152、第三限位结构153和第四限位结构154围合形成一卡接空间，用于容纳电路板，电路板在第一限位结构151、第二限位结构152、第三限位结构153和第四限位结构154的卡接作用下被固定。电路板的形状不限定，优选的电路板整体呈圆形，第一限位结构151、第二限位结构152、第三限位结构153和第四限位结构154分别卡接在电路板的周缘上。为了加强电路板的固定效果，电路板的周向上还可设有一个或多个凸起，该一个或多个凸起可与任意一个或多个限位结构的侧壁卡接，以限定电路板的转动。
扇轮50与轴管12的结构以及它们之间的连接结构可采用现有技术，并可使用轴承以减少摩擦，具体的结构不再赘述。
本申请的散热结构的入风口14设置在底板10上，入风口14设置在比通孔更远离轴管12的位置，这样设置，可避开通孔上方的电路板，减少风的流道的阻碍，使得进风更为顺畅。入风口14可设置为多个，一种实施例中，请参考图3，入风口14设为6个，包括第一入风口141、第二入风口142、第三入风口143、第四入风口144、第五入风口145和第六入风口146，第一入风口141、第二入风口142、第三入风口143、第四入风口144、第五入风口145和第六入风口146沿轴管12周向依次设置，优选为均布设置，且与多个限位结构15间隔设置。第一入风口141、第二入风口142、第三入风口143、第四入风口144、第五入风口145和第六入风口146的形状不限，优选的，第一入风口141和第四入风口144 的形状大致相同，两者可分别设置在轴管12的周向的180°夹角的位置；第二入风口142和第六入风口146的形状大致相同，两者可相对第一入风口141、轴管12和第四入风口144之间的延伸直线对称设置，第三入风口143和第五入风口145的形状大致相同，两者可相对第一入风口141、轴管12和第四入风口144之间的延伸直线对称设置。其中，第一入风口141在轴管12的径向的上的尺寸比第二入风口142和第三入风口143更大，即第一入风口141更靠近轴管12，这样设置的目的是为了设置与电路板连接的导线，导线从第一入风口141伸入容纳腔101内，与电路板连接。为了使得上述多个入风口的进风量在轴管12周向上呈规律，避免进风量差异大造成容纳腔101内的空气流动的紊乱，造成扇轮50受到额外的力矩而导致振动，影响散热结构的可靠性，设置与第一入风口141大致相同的第四入风口144，以平衡第一入风口141的进风量。同理，其他的入风口的设置也是基于此原理。
本申请的散热结构的出风口111设置于侧墙11上，底板10可呈矩形结构，侧墙11环绕在底板10的三条边，换而言之，出风口111设置于底板10的4条边的一条边上，该条边上没有设置侧墙11。此外，侧墙11的内壁的形状可以设置为圆弧形过渡的结构，使得容纳腔101的形状大致呈蜗壳状，便于空气的流动。
在侧墙11上还设有安装孔16，安装孔16贯穿底板10、侧墙11和顶盖40(见图2，顶盖40的具体结构在下述实施例中将进行描述，此处不再赘述)，安装孔16用于与连接件(图未示)配合，以将散热结构整体安装到需要散热的设备(例如电子计算机、无人机等)上，安装孔16不限于通孔或螺纹孔等结构，连接件不限于螺钉、铆钉等结构。安装孔16可包括多个，一种实施例中，请参考图3，安装孔16包括第一安装孔161、第二安装孔162、第三安装孔163和第四安装孔164，上述4个安装孔分别设置在侧墙11上的4个角落上，在安装时，至少设置2个连接件穿过对角上的2个安装孔即可连接固定，当然，优选的是4个连接件均穿过侧墙11的4个角落上的安装孔并连接固定。
为轻量化散热结构，在侧墙11上还可设置减重孔17，减重孔17设置在安装孔16的相邻的位置，在保证侧墙11的结构强度的基础上，设置减重孔17的尺寸尽可能的大，以尽可能的减轻侧墙11的重量，以使散热结构整体实现轻量化。减重孔17优选为仅贯穿侧墙11，而不贯穿底板10和顶盖40，这样可以使得散热结构整体具有完整统一的外观。减重孔17可设置多个，一种实施例中，请参考图3，减重孔17包括第一减重孔171、第二减重孔172、第三减重孔173、第四减重孔174和第五减重孔175，上述5个减重孔分别设置在侧墙11上的4个角落上，5个减重孔的形状可根据侧墙11的结构进行设计，参考现有技术也可，在此不再赘述。
在侧墙11的外壁上还设有卡接部18，卡接部18用于与盖板40上的卡扣42配合连接，以使盖板40卡接在侧墙11上，使得盖板40和侧墙11及底板10形成整体。卡接部18可包括多个，一种实施例中，请参考图3，多个卡接部包括第一卡接部181、第二卡接部182、第三卡接部183和第四卡接部184，其中第一卡接部181和第四卡接部184分别设置于出风口111的相邻的两侧的侧墙11的外壁上，第二卡接部182和第三卡接部183分别设置于与出风口111相对的侧墙11的外壁上，上述4个卡接部之间间隔设置，以使盖板40上各处受力均匀，能更稳固的与侧墙11形成整体。
盖板40的形状与底板10对应，用于盖合在侧墙11上，使得容纳腔101形成包括入风 口14和出风口111的完整腔室，盖板40上还设有副入风口41，副入风口41大致呈圆形且设置在扇轮50外周方向，用于增加容纳腔101的入风量，提升散热效果。盖板40的边缘设有与侧墙11上的卡接部18对应的卡扣42，卡扣42与卡接部18配合以将盖板40固定在侧墙11上。
请参考图4，一种实施例中，在底板10背向侧墙11的表面还设有线槽19，线槽19用于容纳导线，使得与电路板连接的导线被收纳在线槽19内，避免导线没有收纳而影响其他部件的工作。线槽19一端与第一入风口141联通，另一端延伸至底板10的边缘。线槽19整体可以沿直线延伸，延伸方向可以为延伸至底板10远离出风口111的一侧的角落上，如此可以使得导线收纳在线槽19内时，与出风口111之间具有较远的距离，不会干扰出风，当然，出风口111处流出的热风也不会吹到导线上而造成导线受热而损坏。
请参考图5a和图5b，并结合图1和图6a，一种实施例中，所述贴纸30包括层叠设置的本体32和粘胶层33，所述本体32提供给所述粘胶层33附着的基底，所述粘胶层33与所述底板10和所述导磁件贴合，使得贴纸30能够粘贴在底板10上，并对导磁件进行粘贴固定。
本实施例中，所述粘胶层33上的粘胶能够相对所述本体32流动，换而言之，粘胶呈乳状或液态，具有粘性，可以与底板10和导磁件的表面完全的贴合，粘贴效果更好。
本实施例中，贴纸30可以为现有的标签纸，贴纸30上还设有标签图案31，具体的，标签图案31设置于本体32背向粘胶层33的一侧，标签图案31可以为文字或图形，用以标识产品规格、参数、型号等。例如，标签图案31为“3004风扇”则表示一种微型直流风扇的型号。当然，标签图案31根据不同的散热结构可以具有不同的形状，在此不做限制。
由此可知，本实施例通过使用贴纸30来固定导磁件，使得导磁件能稳定的容纳在通孔内，使得散热结构的整体结构稳定，并且，贴纸30用以粘贴固定，实现了贴纸30的功能复用，即贴纸30既用以标识产品，又用以固定导磁件，不需要额外再设计固定导磁件的结构，降低了成本。
一种实施例中，所述导磁件与所述通孔间隙配合、过渡配合或过盈配合。
下面以第一导磁件21和第一通孔131为例说明，应当理解，第一导磁件21是导磁件的一种实施例，第一通孔131是通孔的一种实施例。
本实施例中，请参考图6a和图6b，当第一导磁件21与第一通孔131为间隙配合或过渡配合(当配合关系为间隙配合时)，第一通孔131对第一导磁件21没有固定作用，第一导磁件21的固定全部依靠贴纸30的粘胶层33的粘贴连接。当第一导磁件21与第一通孔131为过渡配合(当配合关系为过盈配合时)或过盈配合时，第一通孔131的内壁还可对第一导磁件21具有固定作用，使得第一导磁件21的固定部分依靠第一通孔131的内壁，另一部分依靠贴纸30的粘胶层33，能加强对第一导磁件21的固定效果。
一种实施例中，请参考图6c，所述第一导磁件21与所述第一通孔131的内壁之间具有第一间隙，所述粘胶层33的粘胶流动并填充至所述第一间隙内。图6c示出的实施例中，粘胶层33的粘胶流动到第一间隙的空间内，形成第一填充部331。使得第一导磁件21与粘胶层33连接的表面面积增大，增大了第一导磁件21与粘胶层33之间的粘贴力，提升了第一导磁件21的固定效果。由于第一通孔131和第一导磁件21为周向上的配合，第一间 隙的范围最小为0，即第一导磁件21的一侧表面与第一通孔131的内壁贴合，另一侧具有间隙，为便于说明，另一侧的间隙定义为第二间隙，则当第一间隙为0时，第二间隙必然具有容纳空间，此时粘胶层33的粘胶填充到第二间隙的空间内，形成第二填充部332，同样可以提升第一导磁件21的粘贴效果。当然，第一间隙和第二间隙可同时存在，则同时存在第一填充部331和第二填充部332。第一填充部331自粘胶层33延伸，延伸的尺寸优选的为大于二分之一底板10厚度，当然，第一填充部331可以延伸至与底板10背向粘胶层33的表面平齐，如此可以达到最好的对第一导磁件21的粘贴效果。
请参考图6d，一种实施例中，所述第一导磁件21包括贴合面，所述贴合面开槽形成锯齿形，所述锯齿形表面与所述粘胶层33贴合。通过设置锯齿形的表面，使得第一导磁体21与粘胶层33贴合的表面积增大，可以增强粘胶层33与第一导磁件21的连接效果。
请参考图6e，一种实施例中，与图6d实施例基本相同，不同的是，所述第一导磁件21表面开槽形成台阶形，同样可以增大第一导磁体21与粘胶层33的贴合表面积，增强粘胶层33与第一导磁件21的连接效果。
上述图6d和图6e的实施例中，通过在贴合面上开设锯齿形或台阶形等凹凸不平的结构，增加贴合面的表面积，用于增强与粘胶层33的粘贴面积，增大互相作用的粘贴力，提升粘贴效果。可以理解的，还可以有其他类似的凹凸不同的结构可选，在此不再枚举。
上述各实施例中，第一导磁体21的厚度可以与底板10的厚度相同，且第一导磁体21与底板10平齐设置，即第一导磁体21的上表面与底板10的上表面平齐，并均用于与粘胶层33贴合，第一导磁体21的下表面与底板10的下表面平齐，以使底板10的下表面形成一直的表面，以使电路板能被设置为更靠近底板10的位置，极限情况下，电路板与底板10贴合设置，如此可以使得散热结构整体的厚度更薄，满足薄型散热结构的要求。
一种实施例中，请参考图6f，所述第一导磁件21包括第一主体部211和第一定位部212，所述第一主体部211用于与所述贴纸30粘贴，所述第一定位部212设于所述第一主体部211背向用于粘贴的表面的端部，且所述第一定位部212自所述第一主体部211面对所述第一通孔131的内壁的表面突出延伸，所述第一定位部212用于与所述底板10背向所述贴纸30的表面贴合，以使所述第一主体部211伸入所述第一通孔131的深度与所述底板10的厚度相同。通过设置第一定位部212，能使得在安装第一导磁件21进入第一通孔131时，第一定位部212形成轴肩或者台阶结构，以用于定位第一主体部211伸入第一通孔131的深度尺寸满足安装要求。本实施例中，第一导磁件21的下表面，即第一定位部212背向第一主体部211的表面与底板10设置轴管12的表面非平齐设置。当然，在其他实施例中，也可以在底板10设置轴管12的表面上开设台阶形的槽，第一定位部212可放置在该台阶形槽内，使得第一定位部212背向第一主体部211的表面与底板10设置轴管12的表面平齐。
一种实施例中，请参考图1和图3，所述底板10上至少还开设有第二通孔132，所述第二通孔132与所述第一通孔131在所述轴管12周向上均布设置，所述第二通孔132容纳有第二导磁件22，所述第二导磁件22与所述贴纸30粘贴固定。本实施例中，通过至少开设第二通孔，即通孔的数量为2个以上，使得导磁件的数量为2个以上的整数个，可以实现与转子上的多个永磁体的磁力连接。一种实施例中，导磁件的数量与永磁体的数量不相 同，例如永磁体的数量为3个，而导磁件的数量为2个，则断电时，转子停转后，永磁体的位置与导磁件的位置在垂直于底板10的方向上的投影不重合，而是有一定夹角，可以实现对永磁体的位置限定。一种实施例中，永磁体的数量与导磁件的数量相同，断电后永磁体的位置与导磁件的位置在垂直于底板10的方向上的投影重合，但导磁件的位置与电路板上的线圈的位置在垂直于所述底板10的方向上的投影不重合，以使转子受力平衡，且在通电启动时，线圈能对永磁体施加周向的磁力而使其转动，避免导磁件的位置与线圈重合时，永磁体的位置也与线圈重合，通电后线圈只对永磁体有轴向上的力，造成转子的转动困难。
一种实施例中，请参考图1和图3，所述底板上至少开设有第三通孔133和第四通孔134，即所述底板10上开设的通孔的数量为4个以上的偶数个，所述4个以上的偶数个通孔在所述轴管12周向上均布设置，每个所述通孔内均设有导磁件，每个所述导磁件均与所述贴纸30粘贴固定。一般而言，转子上的永磁体的数量为4个以上的偶数个，则设置4个以上的偶数个导磁件，以更好的与永磁体对应，可加强对永磁体的限位效果。
以导磁体的数量为2个，即第一导磁体21和第二导磁体22为例说明。第一导磁体21和第二导磁体22设置于电路板背向扇轮50的一侧，即电路板覆盖在第一导磁体21和第二导磁体22上。第一导磁体21和第二导磁体22具有导磁性能，可以与转子上的2个以上的永磁体产生磁力作用。在电路板未通电时，转子上的2个以上的永磁体与第一导磁体21和第二导磁体22的磁力的吸引作用，使得转子的位置被限定，转子始终保持相对固定的位置，而不会停在任意位置，例如转子上的永磁体停在与定子上的线圈位置在垂直于底板10方向上的投影重合，由于再通电时线圈对永磁体的磁力为轴向上的，而不是周向的，从而不利于转子的启动。而在电路板通电后，由于电路板设置在比第一导磁体21和第二导磁体22更靠近扇轮50的位置，定子上的线圈产生的磁力对转子的永磁体的力的作用比第一导磁体21和第二导磁体22更大，可以克服永磁体与第一导磁体21和第二导磁体22之间的力，从而驱动转子转动。与此同时，由于第一导磁体21和第二导磁体22也具有对转子上的永磁体的磁力，该磁力为吸引力，可以拉动转子而使其不会在轴管12上向远离底板10的方向移动。
本申请中，底板10和侧墙11为非金属材质，例如塑料，导磁件为铁及相关的导磁材料，其他的结构的材质不做限定。
请参考图7，并结合图1和图2，本申请实施例还提供一种散热结构的制造方法，包括如下步骤：制作底板10，形成通孔和轴管12；在所述底板10背向所述轴管12的表面贴设贴纸30，所述贴纸10覆盖所述通孔；在所述通孔内容置导磁件，且使得所述导磁件与所述贴纸30粘贴固定。
本实施例中，通过制作底板10，同时制作形成通孔，再贴贴纸30，并将导磁件容纳于通孔内，使得导磁件与贴纸30粘贴固定，相对于现有技术，在制作底板10时不需要将导磁件制作形成一体，工艺简单，能提升效率，而利用贴纸30固定导磁件，实现了贴纸30的功能复用，降低了成本。
下面以制作第一通孔131和第一导磁件21为例进行说明，第一通孔131是通孔的一种实施例，第一导磁件21是导磁件的一种实施例。
一种实施例中，所述制作底板10的步骤采用模具60制成，所述模具60包括一端面 61，在所述端面61上设置第一凸起621，所述第一凸起621用于形成所述第一通孔131。
本实施例中，底板10可以为塑料材质，模具60制作底板10的工艺可以为注塑工艺。底板10、第一通孔131和轴管12可以为一次一体成型工艺制作而成；或者底板10与第一通孔131为一体成型，轴管12为后续工艺制作而成；或者底板10与轴管12为一体成型，第一通孔131为后续工艺制作而成。
一种实施例中，在制作所述第一通孔131时，设置所述第一通孔131的尺寸，以使所述第一凸起621形成的所述第一通孔131和所述第一导磁件21为间隙配合、过渡配合或过盈配合。
一种实施例中，所述贴纸30包括层叠设置的本体32和粘胶层33，所述粘胶层33与所述底板10贴合，所述粘胶层33上的粘胶能够相对所述本体32流动，制作所述第一通孔131与所述第一导磁件21之间为间隙配合，使得所述第一导磁件21与所述第一通孔131的内壁之间具有第一间隙，在将所述第一导磁件21容纳于所述第一通孔131的空间内时，按压所述第一导磁件21和所述贴纸30，以使所述粘胶层33的粘胶流动并填充至所述第一间隙的空间内。
一种实施例中，所述第一导磁件21设有贴合面，在所述第一导磁件21的贴合面开槽以形成凹凸不平的结构，如锯齿形或台阶形，并将所述贴合面与所述贴纸30的粘胶层33贴合。
一种实施例中，所述第一导磁件21包括第一主体部211和第一定位部212，将所述第一主体部211与所述贴纸30粘贴，将所述第一定位部212设于所述第一主体部211背向用于粘贴的表面的端部，且所述第一定位部212自所述第一主体部211面对所述第一通孔131的内壁的表面突出延伸，将所述第一定位部212与所述底板10背向所述贴纸30的表面贴合，以使所述第一主体部211伸入所述第一通孔131的深度与所述底板10的厚度相同。
一种实施例中，还包括如下步骤：在所述底板10上开设的所述通孔的数量为2个以上，所述2个以上通孔在所述轴管12周向上均布设置，每个所述通孔内均设有所述导磁件，每个所述导磁件均与所述贴纸30粘贴固定。
本实施例中，模具60上设置的凸起的数量也为2个以上，例如图7所示实施例示出了凸起的数量为4个，即还设置了第二凸起622、第三凸起623和第四凸起624，4个凸起相对端面的中心均布设置，4个凸起可在底板10上形成4个通孔(分别对应第一通孔131、第二通孔132、第三通孔133和第四通孔134)，可容纳4个导磁件。
一种实施例中，还包括如下步骤：在所述轴管12上安装电路板和扇轮50，所述电路板沿所述轴管12周向设有多个线圈结构，所述扇轮50与所述轴管12转动连接，且所述扇轮50上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量不相同，所述扇轮50停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板10的方向上的投影不重合。
一种实施例中，还包括如下步骤：在所述轴管12上安装电路板和扇轮50，所述电路板沿所述轴管12周向设有多个线圈结构，所述扇轮50与所述轴管12转动连接，且所述扇轮50上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量相同，所述扇轮50停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板 10的方向上的投影重合，但所述导磁件的位置与所述电路板上的线圈的位置在垂直于所述底板10的方向上的投影不重合。
以上对本申请实施例所提供的一种散热结构及散热结构的制造方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (18)

  1. 一种散热结构，其特征在于，包括导磁件和底板，所述底板上设有轴管，所述底板上开设有通孔，所述通孔分布在所述轴管的周围，所述通孔容纳所述导磁件，所述底板背向所述轴管的表面粘贴有贴纸，所述贴纸覆盖所述通孔，所述导磁件与所述贴纸粘贴固定。
  2. 如权利要求1所述的散热结构，其特征在于，所述贴纸包括粘胶层，所述粘胶层与所述底板和所述导磁件贴合。
  3. 如权利要求1或2所述的散热结构，其特征在于，所述导磁件与所述通孔间隙配合、过渡配合或过盈配合。
  4. 如权利要求3所述的散热结构，其特征在于，所述导磁件与所述通孔的内壁之间具有第一间隙，所述粘胶层的粘胶填充所述第一间隙。
  5. 如权利要求2至4任一项所述的散热结构，其特征在于，所述导磁件包括贴合面，所述贴合面开槽形成凹凸不平的结构，所述贴合面与所述粘胶层贴合。
  6. 如权利要求1至5任一项所述的散热结构，其特征在于，所述导磁件包括主体部和定位部，所述主体部用于与所述贴纸粘贴，所述定位部设于所述主体部背向用于粘贴的表面的端部，且所述定位部自所述主体部面对所述通孔的内壁的表面突出延伸，所述定位部用于与所述底板背向所述贴纸的表面贴合，以使所述主体部伸入所述第一通孔的深度与所述底板的厚度相同。
  7. 如权利要求1至6任一项所述的散热结构，其特征在于，所述底板上开设的所述通孔的数量为2个以上，所述2个以上通孔在所述轴管周向上均布设置，每个所述通孔内均设有所述导磁件，每个所述导磁件均与所述贴纸粘贴固定。
  8. 如权利要求7所述的散热结构，其特征在于，所述轴管上安装有电路板和扇轮，所述电路板沿所述轴管周向设有多个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量不相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影不重合。
  9. 如权利要求7所述的散热结构，其特征在于，所述轴管上安装有电路板和扇轮，所述电路板沿所述轴管周向设有多个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影重合，但所述导磁件的位置与所述电路板上的线圈的位置在垂直于所述底板的方向上的投影不重合。
  10. 一种散热结构的制造方法，其特征在于，包括如下步骤：
    制作底板，所述底板上形成通孔和轴管；
    在所述底板背向所述轴管的表面贴设贴纸，所述贴纸覆盖所述通孔；
    在所述通孔内容置导磁件，且使得所述导磁件与所述贴纸粘贴固定。
  11. 如权利要求10所述的散热结构的制造方法，其特征在于，所述制作底板的步骤采用模具制成，所述模具包括一端面，在所述端面上设置凸起，所述凸起用于形成所述通孔。
  12. 如权利要求11所述的散热结构的制造方法，其特征在于，在制作所述通孔时，设 置所述凸起的尺寸，以使所述凸起所形成的所述通孔和所述导磁件为间隙配合、过渡配合或过盈配合。
  13. 如权利要求10至12任一项所述的散热结构的制造方法，其特征在于，所述贴纸包括粘胶层，所述粘胶层与所述底板贴合，制作所述通孔与所述导磁件之间为间隙配合，使得所述导磁件与所述通孔的内壁之间具有第一间隙，在将所述导磁件容纳于所述通孔的空间内时：
    按压所述导磁件和所述贴纸，以使所述粘胶层的粘胶填充至所述第一间隙。
  14. 如权利要求10至13任一项所述的散热结构的制造方法，其特征在于，所述导磁件设有贴合面，在所述贴合面开槽以形成凹凸不平的结构，并将所述贴合面与所述贴纸贴合。
  15. 如权利要求10至14任一项所述的散热结构的制造方法，其特征在于，所述导磁件包括主体部和定位部，将所述主体部与所述贴纸粘贴，将所述定位部设于所述主体部背向用于粘贴的表面的端部，且所述定位部自所述主体部面对所述通孔的内壁的表面突出延伸，将所述定位部与所述底板背向所述贴纸的表面贴合，以使所述主体部伸入所述通孔的深度与所述底板的厚度相同。
  16. 如权利要求10至15任一项所述的散热结构的制造方法，其特征在于，还包括如下步骤：
    在所述底板上开设的所述通孔的数量为2个以上，所述2个以上通孔在所述轴管周向上均布设置，每个所述通孔内均设有所述导磁件，每个所述导磁件均与所述贴纸粘贴固定。
  17. 如权利要求16所述的散热结构的制造方法，其特征在于，还包括如下步骤：
    在所述轴管上安装电路板和扇轮，所述电路板沿所述轴管周向设有多个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量不相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影不重合。
  18. 如权利要求16所述的散热结构的制造方法，其特征在于，还包括如下步骤：
    在所述轴管上安装电路板和扇轮，所述电路板沿所述轴管周向设有多个线圈结构，所述扇轮与所述轴管转动连接，且所述扇轮上设有与所述线圈结构数量相同的多个永磁体，所述导磁件的数量与所述永磁体的数量相同，所述扇轮停转后，所述永磁体的位置与所述导磁件的位置在垂直于所述底板的方向上的投影重合，但所述导磁件的位置与所述电路板上的线圈的位置在垂直于所述底板的方向上的投影不重合。
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