WO2020015205A1

WO2020015205A1 - Vapor deposition device

Info

Publication number: WO2020015205A1
Application number: PCT/CN2018/109645
Authority: WO
Inventors: 张瑞军; 伍丰伟; 王松
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2018-07-20
Filing date: 2018-10-10
Publication date: 2020-01-23
Also published as: CN109023253A

Abstract

A vapor deposition device, comprising: a vacuum cavity (10) for placing a substrate to be vapor-deposited (70); a plurality of anti-sticking plates (20) provided in the vacuum cavity (10), the plurality of anti-sticking plates (20) being spliced to form an accommodating space (20a) having an opening (20b), wherein the opening (20b) is opposite to the substrate to be vapor-deposited (70); an adhesion cavity (30) provided in the accommodating space (20a), the adhesion cavity (30) being provided with an evaporation port (30a) opposite to the opening (20b); and an evaporation source (40) provided in the adhesion cavity (30), the evaporation source (40) being opposite to the evaporation port (30a) and used for evaporating an organic functional material, so that the organic functional material is formed into a film on the substrate to be vapor-deposited (70), wherein an inner surface of the adhesion cavity (30) close to the evaporation source (40) is a rough surface. Also disclosed is a vapor deposition device.

Description

Evaporation equipment

Technical field

The present disclosure relates to the technical field of panel evaporation processes, and more particularly, to an evaporation device.

Background technique

Organic Light-Emitting Diode (OLED for short) has the characteristics of self-luminous, thin, easy to realize flexible display, etc. It is a new generation display technology with good development prospects. At present, in the OLED panel manufacturing process, OLED evaporation technology is often used for the production of various functional films.

The general principle of OLED vapor deposition technology is: storing the OLED organic material and the substrate to be vaporized in a vacuum environment, heating the organic material to evaporate or sublimate the organic material, and evaporating to form a film on the surface of the vaporized substrate. At present, mass production vapor deposition machines generally use point source or line source evaporation in a vacuum environment, and the utilization rate of organic materials is less than 20%. Most organic materials are formed on the anti-sticking plate in the chamber of the anti-vaporizing machine. The board needs to be replaced and cleaned regularly. On the one hand, when most organic materials are formed on the anti-sticking plate, the cleaning of the anti-sticking plate requires a large number of chemical reaction cleaning, which is expensive to clean, the cleaned materials increase pollution, and it is difficult to recycle; It also caused waste of materials. Therefore, how to reduce the film formation of organic materials on the anti-plate is an urgent problem for the industry.

technical problem

In order to solve the shortcomings of the prior art, a vapor deposition device capable of reducing the evaporation range of the material to reduce the film formation of the material on the anti-plate is provided.

Technical solutions

In order to achieve the above-mentioned object, the present disclosure adopts the following technical solution: The present disclosure provides a vapor deposition device, including: a vacuum cavity for placing a substrate to be vapor-deposited; and a plurality of anti-plates disposed in the vacuum cavity. The splicing plates are spliced to form a receiving space with an opening, wherein the opening is opposite to the substrate to be vapor-deposited; an adhesive cavity is disposed in the receiving space, and the adhesive cavity has an An evaporation port opposite to the opening; and an evaporation source disposed in the adhesion cavity, the evaporation source is opposite to the evaporation port and is used to evaporate the organic functional material so that the organic functional material is on the substrate to be evaporated Film formation, wherein the inner surface of the adhesion cavity near the evaporation source is a rough surface.

Preferably, the adhesion cavity is detachably mounted on the anti-boarding plate.

Preferably, the inner surface of the adhesion cavity is provided with a protrusion.

Preferably, the shape of the convex cross-sectional shape is any one of a triangle, a trapezoid, and a sector.

Preferably, a monitoring port is provided on the adhesion cavity, and the monitoring port is used to connect a film thickness sensor.

Preferably, the adhesion cavity includes a plurality of side plates provided around the evaporation source and a top plate disposed opposite to the evaporation source, the plurality of side plates are detachably mounted on the anti-sticking plate, and the evaporation The port is located on the top plate.

Preferably, the evaporation source includes a crucible and a heater. The crucible is provided with a spray port, the spray port is directly opposite the evaporation port, and the heater is used to heat the crucible.

Preferably, the evaporation device further includes a magnetic force adjustment device, which is disposed above the substrate to be evaporated, and the magnetic force adjustment device is used to attach a mask plate to the substrate to be evaporated. On the surface to be evaporated.

Preferably, the magnetic force adjusting device includes a magnetic force plate, a control mechanism, and a mounting frame, the control mechanism is used to control the movement of the magnetic force plate, the mounting frame is disposed opposite to the magnetic force plate, and the mounting frame is used for Place the mask.

The present disclosure also provides a vapor deposition apparatus including:

Vacuum cavity

A plurality of anti-plates are disposed in the vacuum cavity, and the plurality of anti-plates are spliced to form an accommodation space with an opening;

An adhesion cavity is disposed in the accommodation space, and the adhesion cavity has an evaporation port opposite to the opening;

An evaporation source is disposed in the adhesion cavity, and the evaporation source is opposite to the evaporation port.

Preferably, a protrusion is provided on the inner surface of the adhesion cavity.

Preferably, the evaporation device further includes a magnetic force adjustment device, which is disposed above the substrate to be evaporated, and the magnetic force adjustment device is used to attach a mask plate to the substrate to be evaporated. On the surface.

Beneficial effect

The evaporation equipment disclosed in the present disclosure can reduce the evaporation source by setting an adhesion cavity in the vacuum cavity, setting the evaporation source in the adhesion cavity, and opening an evaporation port on the position of the adhesion cavity facing the evaporation source. The evaporation range reduces the formation of organic functional materials on the anti-sticking film, improves the utilization rate of materials, and facilitates the recycling of materials.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a vapor deposition apparatus according to an embodiment of the present disclosure.

FIG. 2A is a partially enlarged view at A in FIG. 1.

FIG. 2B is another enlarged view of part A in FIG. 1.

Embodiments of the invention

In order to make the objectives, technical solutions, and advantages of the disclosure more clear, the disclosure is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the disclosure, and are not used to limit the disclosure.

As shown in FIG. 1, an evaporation apparatus according to an embodiment of the present disclosure includes a vacuum cavity 10, a plurality of anti-plates 20, an adhesion cavity 30, and an evaporation source 40. Among them, a plurality of anti-blocking plates 20 are disposed in the vacuum cavity 10, and a plurality of anti-blocking plates 20 are spliced to surround a receiving space 20a, an adhesion cavity 30 is disposed in the receiving space 20a, and an evaporation source 40 is disposed in the adhesion cavity 30. The evaporation source 40 is used for heating and evaporating the organic functional material, so that the organic functional material is formed on the substrate 70 to be evaporated. An evaporation port 30a is provided on the adhesion cavity 30 directly opposite the evaporation source 40, and an opening 20b is provided on the anti-plate facing the evaporation port 30a in the plurality of anti-plates 20, and the opening 20b is directly opposite the evaporation port 30a. In this way, the organic functional material evaporated by the evaporation source 40 passes through the evaporation port 30a and the opening 20b in this order and forms a film on the substrate 70 to be evaporated. The evaporation source 40 is set in the adhesion cavity 30 to reduce the evaporation range. As shown by the dashed line in FIG. 1, the relative positions of the evaporation opening 30 a and the opening 20 b can be set so that the organic functional materials can be concentrated from the evaporation. The port 30a is sprayed onto the substrate 70 to be vapor-deposited, reducing the formation of organic functional materials on the anti-sticking plate 20, and improving the utilization rate of the organic functional materials.

Specifically, as a preferred embodiment, the shape of the vacuum chamber 10 is a rectangular parallelepiped, at least one of the plurality of anti-blocking plates 20 is disposed opposite the evaporation source 40, and the remaining anti-blocking plates 29 are disposed in the vacuum chamber 10. Inner surface. Wherein, the opening 20 b is located on the impact prevention plate 20 provided opposite to the evaporation source 40.

Among them, a plurality of anti-plates 20 may be integrated or detachable. In other embodiments, the number of the blocking plates 20 may be other. Of course, in other embodiments, the shape of the blocking plate 20 may also be designed into other shapes. For example, the blocking plate 20 disposed opposite to the evaporation source 40 is a flat plate, and the blocking plate 20 disposed on the inner surface of the vacuum chamber 10 The shape is a curved plate.

Further, the adhesion cavity 30 is detachably mounted on the anti-sticking plate 20. As a preferred embodiment, the adhesion cavity 30 includes a plurality of side plates 31 provided around the evaporation source 40 and a top plate 32 opposite to the evaporation source 40. The plurality of side plates 31 are detachably mounted on the anti-plate 20, and the evaporation port 30a is located at Top plate 32. Further, a first through hole is provided on the bottom surface of the vacuum chamber 10, and a second through hole is provided on the anti-plate 20 located on the bottom surface of the vacuum chamber 10. The evaporation equipment further includes a screw, and the screw passes through the first through in order. Holes and second through holes to fix several side plates 31.

As a preferred embodiment, the shape of the adhesion cavity 30 is preferably a rectangular parallelepiped, the number of the side plates 31 is four, the four side plates 31 are vertically connected end to end, and the size of the adhesion cavity 30 is 30cm * 12cm * 20cm. The evaporation source 40 includes a crucible 41 and a heater 42. The crucible 41 is used to contain organic functional materials, and the heater 42 is used to heat the crucible 41. The crucible has a feeding port and a spraying port 41a. The spraying port 41a is directly opposite to the evaporation port 30a. The spraying port 41a is used to spray the organic functional material evaporated to a gaseous state. The size of the evaporation port 30a is larger than that of the crucible.

Further, the inner surface of the adhesion cavity 30 near the evaporation source 40 is provided with a protrusion 30c, so that the inner surface is a rough surface with unevenness, which is beneficial to the recovery of organic functional materials. As a preferred embodiment, as shown in FIGS. 2A and 2B, the shape of the cross-sectional shape of the protrusion 30 c is any one of a triangle, a trapezoid, and a sector.

As a preferred embodiment, the material of the adhesion cavity 30 is preferably stainless steel, and the material of the anti-sticking plate 20 is preferably stainless steel.

Specifically, the evaporation device further includes a film thickness sensor 50. A monitoring port 30 b is opened on the adhesion cavity 30, and the monitoring port 30 b is used to connect the film thickness sensor 50. As a preferred embodiment, the monitoring port 30b is disposed on the top plate 32. Further, as a preferred embodiment, a film thickness sensor 50 is disposed in the monitoring port 30b, and the film thickness sensor 50 is configured to detect a thickness of a film formed by an organic functional material on the substrate 70 to be vapor-deposited. The type of the film thickness sensor 50 is a crystal plate sensor.

Specifically, the evaporation device further includes a magnetic adjustment device 60, which is disposed above the substrate 70 to be vapor-deposited, and the magnetic adjustment device 60 is used to attach the mask plate 80 to the substrate to be vapor-deposited. On the surface. At the same time, the magnetic adjustment device 60 can also control the movement of the substrate to be vaporized 70 and adjust the substrate 70 to be vaporized to an appropriate position, so as to facilitate the film formation of organic functional materials on the substrate 70 to be vaporized.

As a preferred embodiment, the magnetic adjustment device 60 includes a magnetic plate 61, a control mechanism 62, and a mounting frame 63. The control mechanism 62 is used to control the movement of the magnetic plate 61. The mounting frame 63 is disposed opposite the magnetic plate 61, and the mounting frame 63 is used for placing Mask 板 80. In the actual evaporation process, the substrate to be evaporated 70 is disposed between the mask plate 80 and the magnetic plate 61. The material of the mask plate 80 is a magnetically permeable material. Under the action of the magnetic plate 61, the mask plate 80 is tightly attached. Laminating on the surface to be vapor-deposited of the substrate 70 to be vapor-deposited to ensure the stability of the mask plate 80 during the vapor-deposition process. Of course, in other embodiments, the material of the mounting frame 63 is a magnetically conductive material. The mask plate 80 is placed on the mounting frame 63. The substrate to be evaporated 70 is disposed between the mask plate 80 and the magnetic plate 61, and the magnetic plate 61 is adsorbed. The mounting frame 63 allows the mask plate 80 to closely adhere to the surface to be vapor-deposited of the substrate 70 to be vapor-deposited.

Further, the evaporation device further includes a cold plate 90, which is disposed on a surface of the magnetic plate 61 facing the substrate 70 to be evaporated. In the actual evaporation process, the cold plate 90 is attached to the surface of the substrate to be evaporated 70 opposite to the surface to be evaporated. The cold plate 90 has a cooling gaseous organic functional material, so that the organic functional material is formed on the surface to be evaporated. membrane. As a preferred embodiment, the cold plate 90 is a water-cooled plate.

The specific embodiments of the present disclosure have been described in detail above. Although some embodiments have been shown and described, those skilled in the art should understand that without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims and their equivalents. In the case of these embodiments, modifications and improvements can be made to these embodiments, and these modifications and improvements should also be within the protection scope of the present disclosure.

Claims

An evaporation equipment includes:

A vacuum cavity for placing a substrate to be evaporated;

A plurality of anti-plates are disposed in the vacuum cavity, and the plurality of anti-plates are spliced to form a receiving space with an opening, wherein the openings are opposite to the substrate to be vapor-deposited;

An adhesion cavity is disposed in the accommodation space, and the adhesion cavity has an evaporation port opposite to the opening; and

An evaporation source is disposed in the adhesion cavity. The evaporation source is opposite to the evaporation port and is used to evaporate the organic functional material so that the organic functional material forms a film on the substrate to be evaporated. The adhesion cavity The inner surface of the body near the evaporation source is a rough surface.
The vapor deposition apparatus according to claim 1, wherein the adhesion cavity is detachably mounted on the anti-sticking plate.
The vapor deposition apparatus according to claim 1, wherein the inner surface of the adhesion cavity is provided with a protrusion.
The vapor deposition apparatus according to claim 3, wherein a shape of a cross-sectional shape of the protrusion is any one of a triangle, a trapezoid, and a sector.
The vapor deposition device according to claim 1, wherein the adhesion cavity is provided with a monitoring port, and the monitoring port is used to connect a film thickness sensor.
The vapor deposition apparatus according to claim 2, wherein the adhesion cavity includes a plurality of side plates disposed around the evaporation source and a top plate disposed opposite to the evaporation source, and the plurality of side plates are detachably mounted on the evaporation source. The anti-board, the evaporation port is located on the top plate.
The vapor deposition apparatus according to claim 1, wherein the evaporation source includes a crucible and a heater, and the crucible is provided with an ejection port, the ejection port is directly opposite the evaporation port, and the heater is used to heat the crucible.
The vapor deposition device according to claim 1, wherein the vapor deposition device further comprises a magnetic force adjustment device, the magnetic force adjustment device is disposed above the substrate to be vapor-deposited, and the magnetic force adjustment device is used to make a mask plate It is attached to the surface to be vapor-deposited of the substrate to be vapor-deposited.
The vapor deposition apparatus according to claim 8, wherein the magnetic force adjusting device comprises a magnetic plate, a control mechanism, and a mounting frame, the control mechanism is used to control the movement of the magnetic plate, and the mounting frame and the magnetic plate Opposingly, the mounting bracket is used to place the mask plate.
An evaporation equipment includes:

Vacuum cavity

A plurality of anti-plates are disposed in the vacuum cavity, and the plurality of anti-plates are spliced to form an accommodation space with an opening;

An adhesion cavity is disposed in the accommodation space, and the adhesion cavity has an evaporation port opposite to the opening;

An evaporation source is disposed in the adhesion cavity, and the evaporation source is opposite to the evaporation port.
The vapor deposition apparatus according to claim 10, wherein the adhesion cavity is detachably mounted on the anti-sticking plate.
The vapor deposition apparatus according to claim 10, wherein a protrusion is provided on an inner surface of the adhesion cavity.
The vapor deposition apparatus according to claim 12, wherein the shape of the convex cross-sectional shape is any one of a triangle, a trapezoid, and a sector.
The vapor deposition device according to claim 10, wherein the adhesion cavity is provided with a monitoring port, and the monitoring port is used to connect a film thickness sensor.
The vapor deposition apparatus according to claim 11, wherein the adhesion cavity includes a plurality of side plates disposed around the evaporation source and a top plate disposed opposite to the evaporation source, and the plurality of side plates are detachably mounted on the evaporation source. The anti-board, the evaporation port is located on the top plate.
The vapor deposition apparatus according to claim 10, wherein the evaporation source includes a crucible and a heater, and the crucible is provided with an ejection port, the ejection port is directly opposite the evaporation port, and the heater is used for heating the crucible.
The vapor deposition device according to claim 10, wherein the vapor deposition device further comprises a magnetic force adjustment device, the magnetic force adjustment device is disposed above the substrate to be vapor-deposited, and the magnetic force adjustment device is used to attach a mask plate On the surface to be evaporated of the substrate to be evaporated.
The vapor deposition apparatus according to claim 17, wherein the magnetic force adjusting device comprises a magnetic force plate, a control mechanism, and a mounting frame, the control mechanism is used to control the movement of the magnetic force plate, and the mounting frame and the magnetic force plate Opposingly, the mounting bracket is used to place the mask plate.