WO2019157824A1

WO2019157824A1 - Vapor deposition device

Info

Publication number: WO2019157824A1
Application number: PCT/CN2018/107603
Authority: WO
Inventors: 姜亮
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2018-02-13
Filing date: 2018-09-26
Publication date: 2019-08-22
Also published as: CN108239752A

Abstract

Disclosed is a vapor deposition device, comprising: an evaporator source, comprising a housing (101, 201), a nozzle (102, 213) being provided at the top of the housing (101, 201); and a first limiting plate (103, 203) and a second limiting plate (104, 204) for limiting a vapor deposition angle of the nozzle (102, 213). The first limiting plate (103, 203) and the second limiting plate (104, 204) respectively form an included angle with a surface of the housing (101, 201) after rotation, and the vapor deposition angle of the nozzle (102, 213) can be varied by adjusting the included angles so as to adapt to the changes in the vapor deposition angle on the inner side of the limiting plate caused by an increase in depth resulting from material deposition.

Description

Evaporation equipment

Technical field

The present invention relates to the field of display panel manufacturing, and more particularly to an evaporation apparatus.

Background technique

Organic Light-Emitting Diode (OLED) is the most promising new display device with its advantages of self-illumination, solid state, high contrast and flexibility. At present, a vacuum injection technique is commonly used in the industry to prepare a hole injection layer, an air transport layer, a light-emitting layer, an electron transport layer, and the like of an OLED device.

Evaporation is a process in which a vapor deposition material is placed in a vacuum to evaporate or sublime into a vapor composed of atoms, molecules or atomic groups, which is condensed on a surface of a workpiece or a substrate to form a film. Heating and plating the evaporation material onto the substrate is called vacuum evaporation, or vacuum coating. The vacuum coating process is widely used in the manufacturing process of display panels.

The vapor deposition apparatus of the prior art generally includes an evaporation source, a nozzle disposed at the top of the evaporation source, and a limiting plate disposed at the top of the evaporation source, the limiting plate is configured to block the evaporation material of the partial region, and limit the evaporation angle of the evaporation material; However, limiting the surface of the plate for a long time will deposit a certain thickness of material, resulting in an increase in the thickness of the limiting plate, resulting in a change in the evaporation angle, which will cause a change in the thickness of the film to affect the stability of the product performance. The film layer of the doping material, the change of the evaporation angle will cause the film formation area to change and affect the co-steaming doping effect; in addition, when the material deposition on the limiting plate is thick, there is a risk of material shedding, and the falling material will cause vacuum. The amount of waste particles in the chamber increases, and the material that is detached may fall into the nozzle and cause a plug hole.

In summary, the prior art vapor deposition apparatus is used to limit the nozzle evaporation angle limiting plate. After long-term use, a thick material layer is deposited on the surface, and an increase in the thickness of the inner side of the limiting plate changes the vapor deposition angle of the nozzle. Affects the evaporation effect.

technical problem

The invention provides an evaporation device, which comprises a limiting plate capable of changing an angle. By changing the angle of the limiting plate, the evaporation angle change caused by the thickness increase of the material inside the limiting plate can be adapted to maintain the theoretical vapor deposition angle of the nozzle. .

Technical solution

In order to solve the above problems, the technical solution provided by the present invention is as follows:

The invention provides an evaporation device comprising:

An evaporation source, comprising a casing, and an evaporation chamber disposed in the casing, wherein the evaporation chamber is provided with an evaporation material;

a nozzle disposed at a top of the housing and connected to the evaporation chamber; and

a limiting plate set disposed at a top of the housing for limiting an evaporation angle of the nozzle; the limiting plate set includes a first limiting plate and a second limiting plate symmetrically disposed, the nozzle being located at the first Between the limiting plate and the second limiting plate;

a first rotating shaft is disposed in the first limiting plate, the first rotating shaft is connected to the first rotating driving device; the second limiting plate is provided with a second rotating shaft, and the second rotating shaft is connected to the second rotating driving Device

Wherein, the first limiting plate and the second limiting plate respectively form an angle with the surface of the casing after being rotated, and the evaporation angle of the nozzle can be changed by adjusting the angle of the angle to adapt to the inner side of the limiting plate The change in vapor deposition angle caused by the increase in thickness due to material deposition;

The end faces of the first limiting plate and the second limiting plate have a regular triangular shape.

According to a preferred embodiment of the present invention, the pivot point of the first rotating shaft coincides with the center point of the end surface of the first limiting plate, and the pivot point of the second rotating shaft is opposite to the center point of the end surface of the second limiting plate coincide.

According to a preferred embodiment of the present invention, a first gap is disposed between the bottom of the first limiting plate and the surface of the housing, and a second portion is disposed between the bottom of the second limiting plate and the surface of the housing. Void.

According to a preferred embodiment of the invention, the first gap and the second gap have the same height and are lower than the height of the nozzle.

According to a preferred embodiment of the present invention, one end of the housing is provided with a first supporting device, and the other end of the housing is provided with a second supporting device;

The first supporting device includes a first fixing plate disposed on an end surface of the casing, and a first supporting plate and a second supporting plate disposed at a top end of the fixing plate, and the top of the first supporting plate is opened a first through hole, a second through hole is formed in a top of the second support plate;

The second supporting device includes a second fixing plate disposed on the other end surface of the housing, and a third supporting plate and a fourth supporting plate disposed on the top end of the second fixing plate, the third supporting a third through hole is defined in the top of the plate, and a fourth through hole is formed in the top of the fourth supporting plate;

One end of the first rotating shaft is disposed in the first through hole, and the other end of the first rotating shaft is disposed in the second through hole;

One end of the second rotating shaft is disposed in the third through hole, and the other end of the second rotating shaft is disposed in the fourth through hole.

According to a preferred embodiment of the present invention, the first rotary driving device and the second rotary driving device are disposed on the surface of the first fixing plate or the surface of the second fixing plate;

The torque output end of the first rotary driving device is connected to the end of the first rotating shaft, and the torque output end of the second rotary driving device is connected to the end of the second rotating shaft.

According to a preferred embodiment of the present invention, the portions of the first rotating shaft extending from the first limiting plate are respectively disposed as a first threaded section and a second threaded section, and the first threaded section is screwed with the first a nut, the second thread segment is screwed with a second nut;

The first support plate is located between the end surface of the first limiting plate and the first nut, and the third support plate is located between the other end surface of the first limiting plate and the second nut;

a portion of the second rotating shaft extending from the second limiting plate is respectively disposed as a third threaded section and a fourth threaded section, and the third threaded section is screwed with a third nut, the fourth threaded section a fourth nut is connected to the upper screw;

The second support plate is located between the end surface of the second limiting plate and the third nut, and the fourth support plate is located between the other end surface of the second limiting plate and the fourth nut.

The invention also provides another evaporation apparatus comprising:

Wherein, the first limiting plate and the second limiting plate respectively form an angle with the surface of the casing after being rotated, and the evaporation angle of the nozzle can be changed by adjusting the angle of the angle to adapt to the inner side of the limiting plate The change in vapor deposition angle caused by an increase in thickness due to material deposition.

According to a preferred embodiment of the present invention, the end faces of the first limiting plate and the second limiting plate are rectangular.

According to a preferred embodiment of the present invention, the casing has a rectangular parallelepiped shape, and the long sides of the first limiting plates, the long sides of the second limiting plates, and the long sides of the casing are parallel to each other.

Beneficial effect

The invention has the beneficial effects that the evaporation device provided by the invention has an adjustable angle limiting plate compared with the prior art, and the angle of the evaporation plate can be changed by adjusting the angle between the limiting plate and the evaporation source to adapt to the limitation. The change of the vapor deposition angle caused by the increase of the thickness of the inner side of the plate due to the deposition of the material solves the prior art evaporation apparatus, the limiting plate for limiting the vapor deposition angle of the nozzle, and the thicker material layer is deposited on the surface after long-term use, limiting The increase in the thickness of the inner side of the plate changes the vapor deposition angle of the nozzle, which in turn affects the technical problem of the vapor deposition effect.

DRAWINGS

In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the drawings to be used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description are merely inventions. For some embodiments, other drawings may be obtained from those of ordinary skill in the art without departing from the drawings.

1 is a schematic structural view of a vapor deposition apparatus provided by the present invention;

2 is another schematic structural view of an evaporation apparatus provided by the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following description of the various embodiments is provided to illustrate the specific embodiments of the invention. Directional terms mentioned in the present invention, such as [upper], [lower], [previous], [post], [left], [right], [inside], [outside], [side], etc., are merely references Attach the direction of the drawing. Therefore, the directional terminology used is for the purpose of illustration and understanding of the invention. In the figures, structurally similar elements are denoted by the same reference numerals.

The invention is directed to the evaporation device of the prior art, and the limiting plate for limiting the evaporation angle of the nozzle. After long-term use, the surface will deposit a thick material layer, and the increase of the thickness inside the limiting plate will change the evaporation angle of the nozzle, thereby affecting the steaming. The technical problem of the plating effect can be solved by this embodiment.

As shown in FIG. 1 , the vapor deposition apparatus provided by the present invention includes an evaporation source, and the evaporation source includes a casing 101, an evaporation chamber disposed in the casing 101, and a nozzle disposed at the top of the casing 101. 102 and the first limiting plate 103 and the second limiting plate 104 are symmetrical.

a chamber is disposed in the evaporation chamber, and a vapor deposition material is disposed in the crucible, and the outer surface of the crucible is provided with a heating wire for heating the evaporation material; and a plurality of nozzles 102 are disposed on the top of the housing 101, And a plurality of the nozzles 102 are arranged in a line to form a linear evaporation; the bottom of the nozzle 102 is in communication with the evaporation chamber for uniformly distributing the material heated and vaporized in the evaporation chamber on the substrate. The surface is condensed to form a metal film layer. When the substrate is evaporated, a mask is disposed between the substrate and the nozzle 102 to deposit material in a designated area of the substrate.

The shape of the housing 101 is a rectangular parallelepiped, and the long sides of the first limiting plate 103, the long sides of the second limiting plate 104, and the long sides of the housing 101 are parallel to each other; the first limiting plate 103 a first rotating shaft 105 is disposed, the first rotating shaft 105 is disposed in the first limiting plate 103, and both ends of the first rotating shaft 105 protrude from an end surface of the first limiting plate 103; A second rotating shaft 106 is disposed in the second limiting plate 104. The second rotating shaft 106 is disposed in the second limiting plate 104. Both ends of the second rotating shaft 106 extend beyond the end surface of the second limiting plate 104. And the end of the first rotating shaft 105 is connected to the first rotating driving device, and the end of the second rotating shaft 106 is connected to the second rotating driving device; the first rotating driving device, the second rotation The driving device is a micro motor, and the micro motor is connected with a control system for outputting a torque to rotate the first rotating shaft 105 and the second rotating shaft 106, thereby causing the first limiting plate 103 and the The second limiting plate 104 is rotated by a certain angle to change the evaporation of the nozzle 102. . Generally, the first limiting plate 103 and the second limiting plate 104 are symmetrically rotated, that is, the first limiting plate 103 and the second limiting plate 104 are rotated by the same angle in opposite directions.

The first limiting plate 103 and the second limiting plate 104 respectively rotate to form an angle with the surface of the casing 101, and the angle of vaporization a of the nozzle 102 can be changed by adjusting the angle of the angle to adapt to The vapor deposition angle a caused by an increase in thickness due to material deposition on the inside of the restriction plate is changed.

The nozzle 102 is located between the first limiting plate 103 and the second limiting plate 104; the connecting line between the nozzle 102 and the top end of any limiting plate is a first connecting line, the nozzle 102 and the limiting plate The bottom end connecting line is a second connecting line, the first connecting line and the second connecting closed line are a third connecting line, and the first connecting line, the second connection, and the third connection a triangular plane formed by the line, perpendicular to the surface of the casing 101 and the surface of the limiting plate, the evaporation angle a of the nozzle 102 refers to a clamp between the first connecting line and the second connecting line angle.

The first rotating shaft 105 and the long side of the first limiting plate 103 are parallel to each other, and the pivot point of the first rotating shaft 105 is located at the center of the end surface of the first limiting plate 103, that is, the supporting point is located at the first limit The center of the plate 103 facilitates the balance of the first limiting plate 103 to prevent the one side of the first limiting plate 103 from being affected by gravity for a long time, thereby causing the angular displacement of the limiting plate, and the accuracy of the evaporation angle a cannot be ensured; The second rotating shaft 106 and the long side of the second limiting plate 104 are parallel to each other, and the pivot point of the second rotating shaft 106 is located at the center of the end surface of the second limiting plate 104, and the second rotating shaft 106 is disposed at a position The effect is the same as the position setting effect of the first rotating shaft 105, and details are not described herein. For another example, the pivot point of the first rotating shaft 105 may also be offset from the center of the end surface of the first limiting plate 103.

a first gap is disposed between a bottom of the first limiting plate 103 and a surface of the casing 101, and a second gap is disposed between a bottom of the second limiting plate 104 and a surface of the casing 101; The plate has a certain thickness, and during the rotation of the limiting plate, an edge of the bottom of the limiting plate may interfere with the surface of the casing 101, thereby hindering the normal rotation of the limiting plate, and thus, the bottom of the limiting plate and the surface of the casing 101 Separating to solve the above defects; however, in order to prevent the material ejected by the nozzle 102 from leaking from the first gap and the second gap, the height of the first gap and the second gap is smaller than The height of the nozzle 102.

As shown in FIG. 2, the housing 201 is further provided with a first portion for fixing the first limiting plate 203, the second limiting plate 204, the first rotating driving device and the second rotating driving device. A support device and a second support device. A nozzle 213 is disposed between the first limiting plate 203 and the second limiting plate 204.

The first supporting device includes a first fixing plate 208 disposed on an end surface of the casing 201, and a first supporting plate 209 and a second supporting plate 210 disposed at a top end of the first fixing plate 208; The first fixing plate 208 is fixedly disposed on the end surface of the casing 201 by a vacuum screw; the first supporting plate 209, the second supporting plate 210 and the first fixing plate 208 are integrally formed, and the first support The plate 209 is disposed adjacent to one end of the first fixing plate 208, and the second supporting plate 210 is disposed adjacent to the other end of the first fixing plate 208.

a first through hole is defined in the top of the first supporting plate 209, and a second through hole is defined in the top of the second supporting plate 210. One end of the first rotating shaft 205 is disposed in the first through hole. The other end of the first rotating shaft 205 is disposed in the second through hole; the portions of the first rotating shaft 205 extending from the first limiting plate 203 are respectively disposed as a first thread segment and a second thread segment The first thread segment is screwed with a first nut 211, and the second thread segment is screwed with a second nut 212.

The second supporting device includes a second fixing plate 214 disposed on the other end surface of the housing 201, and a third supporting plate 215 and a fourth supporting plate 216 disposed at the top end of the second fixing plate 214; The second fixing plate 214 is fixedly disposed on the end surface of the casing 201 by a vacuum screw; the third supporting plate 215, the fourth supporting plate 216 and the second fixing plate 214 are integrally formed, and the The third support plate 215 is disposed adjacent to one end of the second fixed plate 214, and the fourth support plate 216 is disposed adjacent to the other end of the second fixed plate 214.

a third through hole is defined in the top of the third supporting plate 215, and a fourth through hole is defined in the top of the fourth supporting plate 216. One end of the second rotating shaft 206 is disposed in the third through hole. The other end of the second rotating shaft 206 is disposed in the fourth through hole; the portions of the second rotating shaft 206 extending from the second limiting plate 204 are respectively disposed as a third thread segment and a fourth thread segment. The third thread segment is screwed with a third nut, and the fourth thread segment is screwed with a fourth nut.

The first support plate 209 is located between the end surface of the first limiting plate 203 and the first nut 211, and the third support plate 215 is located at the other end surface of the first limiting plate 203 and the first The second support plate 210 is located between the end surface of the second limiting plate 204 and the third nut, and the fourth support plate 216 is located at the second limiting plate 204. Between the end surface and the fourth nut; by fastening the first nut 211, the second nut 212, the third nut and the fourth nut, the two ends of the limiting plate are clamped by the supporting plate Thereby, the limiting plate is fixed, and the vapor deposition angle formed by the limiting plate and the nozzle 202 is maintained.

The first rotary driving device and the second rotary driving device are disposed on a surface of the first fixing plate 208 or the surface of the second fixing plate 214; a torque output end of the first rotating driving device is connected to the first An end of the rotating shaft 205, the torque output end of the second rotary driving device is connected to the end of the second rotating shaft 206.

In the above, the present invention has been disclosed in the above preferred embodiments, but the preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various modifications without departing from the spirit and scope of the invention. The invention is modified and retouched, and the scope of the invention is defined by the scope defined by the claims.

Claims

An evaporation apparatus comprising:

An evaporation source, comprising a casing, and an evaporation chamber disposed in the casing, wherein the evaporation chamber is provided with an evaporation material;

a nozzle disposed at a top of the housing and connected to the evaporation chamber; and

a limiting plate set disposed at a top of the housing for limiting an evaporation angle of the nozzle; the limiting plate set includes a first limiting plate and a second limiting plate symmetrically disposed, the nozzle being located at the first Between the limiting plate and the second limiting plate;

a first rotating shaft is disposed in the first limiting plate, the first rotating shaft is connected to the first rotating driving device; the second limiting plate is provided with a second rotating shaft, and the second rotating shaft is connected to the second rotating driving Device

Wherein, the first limiting plate and the second limiting plate respectively form an angle with the surface of the casing after being rotated, and the evaporation angle of the nozzle can be changed by adjusting the angle of the angle to adapt to the inner side of the limiting plate The change in vapor deposition angle caused by an increase in thickness due to material deposition.

The end faces of the first limiting plate and the second limiting plate have a regular triangular shape.
The vapor deposition apparatus according to claim 1, wherein a pivot point of the first rotating shaft coincides with an end point center point of the first limiting plate, and a pivot point of the second rotating shaft and the second limiting plate The center points of the end faces coincide.
The vapor deposition apparatus according to claim 2, wherein a first gap is provided between a bottom of the first restricting plate and the surface of the casing, and a bottom of the second restricting plate and the surface of the casing A second gap is provided between them.
The vapor deposition apparatus according to claim 3, wherein the first gap and the second gap have the same height and are lower than a height of the nozzle.
The vapor deposition apparatus according to claim 1, wherein

One end of the housing is provided with a first supporting device, and the other end of the housing is provided with a second supporting device;

The first supporting device includes a first fixing plate disposed on an end surface of the casing, and a first supporting plate and a second supporting plate disposed at a top end of the fixing plate, and the top of the first supporting plate is opened a first through hole, a second through hole is formed in a top of the second support plate;

The second supporting device includes a second fixing plate disposed on the other end surface of the housing, and a third supporting plate and a fourth supporting plate disposed on the top end of the second fixing plate, the third supporting a third through hole is defined in the top of the plate, and a fourth through hole is formed in the top of the fourth supporting plate;

One end of the first rotating shaft is disposed in the first through hole, and the other end of the first rotating shaft is disposed in the second through hole;

One end of the second rotating shaft is disposed in the third through hole, and the other end of the second rotating shaft is disposed in the fourth through hole.
The vapor deposition apparatus according to claim 5, wherein

The first rotation driving device and the second rotation driving device are disposed on the surface of the first fixing plate or the surface of the second fixing plate;

The torque output end of the first rotary driving device is connected to the end of the first rotating shaft, and the torque output end of the second rotary driving device is connected to the end of the second rotating shaft.
The vapor deposition apparatus according to claim 6, wherein

a portion of the first rotating shaft extending from the first limiting plate is respectively disposed as a first thread segment and a second thread segment, and the first thread segment is screwed with a first nut, the second thread segment a second nut is connected to the upper screw;

The first support plate is located between the end surface of the first limiting plate and the first nut, and the third support plate is located between the other end surface of the first limiting plate and the second nut;

a portion of the second rotating shaft extending from the second limiting plate is respectively disposed as a third threaded section and a fourth threaded section, and the third threaded section is screwed with a third nut, the fourth threaded section a fourth nut is connected to the upper screw;

The second support plate is located between the end surface of the second limiting plate and the third nut, and the fourth support plate is located between the other end surface of the second limiting plate and the fourth nut.
An evaporation apparatus comprising:

An evaporation source, comprising a casing, and an evaporation chamber disposed in the casing, wherein the evaporation chamber is provided with an evaporation material;

a nozzle disposed at a top of the housing and connected to the evaporation chamber; and

a limiting plate set disposed at a top of the housing for limiting an evaporation angle of the nozzle; the limiting plate set includes a first limiting plate and a second limiting plate symmetrically disposed, the nozzle being located at the first Between the limiting plate and the second limiting plate;

a first rotating shaft is disposed in the first limiting plate, the first rotating shaft is connected to the first rotating driving device; the second limiting plate is provided with a second rotating shaft, and the second rotating shaft is connected to the second rotating driving Device

Wherein, the first limiting plate and the second limiting plate respectively form an angle with the surface of the casing after being rotated, and the evaporation angle of the nozzle can be changed by adjusting the angle of the angle to adapt to the inner side of the limiting plate The change in vapor deposition angle caused by an increase in thickness due to material deposition.
The vapor deposition apparatus according to claim 1, wherein end faces of said first restricting plate and said second restricting plate are rectangular.
The vapor deposition apparatus according to claim 9, wherein the casing has a rectangular parallelepiped shape, and a long side of the first restricting plate, a long side of the second restricting plate, and a long side of the casing are parallel to each other .
The vapor deposition apparatus according to claim 10, wherein a pivot point of the first rotating shaft coincides with an end point center point of the first limiting plate, and a pivot point of the second rotating shaft and the second limiting plate The center points of the end faces coincide.
The vapor deposition apparatus according to claim 11, wherein a first gap is provided between a bottom of the first restricting plate and the surface of the casing, and a bottom of the second restricting plate and the surface of the casing A second gap is provided between them.
The vapor deposition apparatus according to claim 12, wherein the first gap and the second gap have the same height and are lower than a height of the nozzle.
The vapor deposition apparatus according to claim 10, wherein

One end of the housing is provided with a first supporting device, and the other end of the housing is provided with a second supporting device;

The first supporting device includes a first fixing plate disposed on an end surface of the casing, and a first supporting plate and a second supporting plate disposed at a top end of the fixing plate, and the top of the first supporting plate is opened a first through hole, a second through hole is formed in a top of the second support plate;

The second supporting device includes a second fixing plate disposed on the other end surface of the housing, and a third supporting plate and a fourth supporting plate disposed on the top end of the second fixing plate, the third supporting a third through hole is defined in the top of the plate, and a fourth through hole is formed in the top of the fourth supporting plate;

One end of the first rotating shaft is disposed in the first through hole, and the other end of the first rotating shaft is disposed in the second through hole;

One end of the second rotating shaft is disposed in the third through hole, and the other end of the second rotating shaft is disposed in the fourth through hole.
The vapor deposition apparatus according to claim 14, wherein

The first rotation driving device and the second rotation driving device are disposed on the surface of the first fixing plate or the surface of the second fixing plate;

The torque output end of the first rotary driving device is connected to the end of the first rotating shaft, and the torque output end of the second rotary driving device is connected to the end of the second rotating shaft.
The vapor deposition apparatus according to claim 15, wherein

a portion of the first rotating shaft extending from the first limiting plate is respectively disposed as a first thread segment and a second thread segment, and the first thread segment is screwed with a first nut, the second thread segment a second nut is connected to the upper screw;

The first support plate is located between the end surface of the first limiting plate and the first nut, and the third support plate is located between the other end surface of the first limiting plate and the second nut;

a portion of the second rotating shaft extending from the second limiting plate is respectively disposed as a third threaded section and a fourth threaded section, and the third threaded section is screwed with a third nut, the fourth threaded section a fourth nut is connected to the upper screw;

The second support plate is located between the end surface of the second limiting plate and the third nut, and the fourth support plate is located between the other end surface of the second limiting plate and the fourth nut.