CN109023253A - Evaporated device - Google Patents

Evaporated device Download PDF

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Publication number
CN109023253A
CN109023253A CN201810800950.0A CN201810800950A CN109023253A CN 109023253 A CN109023253 A CN 109023253A CN 201810800950 A CN201810800950 A CN 201810800950A CN 109023253 A CN109023253 A CN 109023253A
Authority
CN
China
Prior art keywords
cavity
plate
evaporation
evaporated device
mouth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810800950.0A
Other languages
Chinese (zh)
Inventor
张瑞军
伍丰伟
王松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201810800950.0A priority Critical patent/CN109023253A/en
Priority to PCT/CN2018/109645 priority patent/WO2020015205A1/en
Publication of CN109023253A publication Critical patent/CN109023253A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks

Abstract

The invention discloses a kind of evaporated devices, comprising: vacuum cavity;It is several to prevent plate, it is set in the vacuum cavity, several accommodation spaces for preventing plate splicing to be formed with opening;Stick cavity, be set in the accommodation space, it is described stick on cavity have and the opposite evaporation mouth of the opening;Evaporation source, be set to it is described stick in cavity, the evaporation source is opposite with the evaporation mouth.A kind of evaporated device disclosed by the invention, stick cavity by being arranged in vacuum cavity, evaporation source is set to and is sticked in cavity, and evaporation mouth is opened up on sticking cavity face evaporation source position, it can reduce the evaporation range of evaporation source, it reduces organic functional material to form a film on preventing plate, improves stock utilization, while being conducive to the recycling of material.

Description

Evaporated device
Technical field
The present invention relates to panels, and process technique field is deposited, more specifically to a kind of evaporated device.
Background technique
Organic Light Emitting Diode (Organic Light-Emitting Diode, abbreviation OLED) has self-luminous, frivolous, The features such as being easily achieved Flexible Displays is a kind of display technology of new generation with good development prospect.At present in oled panel In processing procedure, through the production for carrying out each functional film layer frequently with OLED evaporation coating technique.
The general principles of OLED evaporation coating technique are as follows: OLED organic material and deposited substrate are deposited under vacuum environment, Organic material is heated, so that organic material is evaporated or is distilled, and be deposited to deposited substrate surface aggregation and form a film.Volume production is deposited at present Machine generally uses point source or line source evaporation mode under vacuum environment, and organic material utilization rate is lower than 20%, the organic material of the overwhelming majority Material all prevent on plate in evaporator cavity by film forming, prevents that plate need to be regularly replaced and be cleaned.
On the one hand, when most of organic material all forms a film when preventing on plate, prevent that the cleaning of plate needs a large amount of chemistry Product reaction cleaning, cleans expensive, to wash out material increasing pollution, and recovery difficult is big;On the other hand material is also resulted in Waste.Therefore how to reduce organic material and form a film on preventing plate is industry urgent problem.
Summary of the invention
In order to solve the shortcomings of the prior art, it one kind is provided can reduce material evaporation range and prevented with reducing material The evaporated device to form a film on plate.
In order to achieve the above purpose, present invention employs the following technical solutions:
A kind of evaporated device, comprising:
Vacuum cavity;
It is several to prevent plate, it is set in the vacuum cavity, several appearances for preventing plate splicing to be formed with opening Receive space;
Stick cavity, be set in the accommodation space, it is described stick on cavity have and the opposite evaporation of the opening Mouthful;
Evaporation source, be set to it is described stick in cavity, the evaporation source is opposite with the evaporation mouth.
Preferably, it is described stick cavity and be removably installed in described prevent on plate.
Preferably, the cavity inner surface that sticks is provided with protrusion.
Preferably, the shape of the cross sectional shape of the protrusion be triangle, it is trapezoidal, fan-shaped in any one.
Preferably, the cavity that sticks is equipped with monitoring mouth, and the monitoring mouth is for connecting film thickness sensor.
Preferably, it is described stick cavity include around the evaporation source setting several side plates and with the evaporation source phase To the top plate of setting, several side plates be removably installed in it is described prevent on plate, the evaporation mouth is located on the top plate.
Preferably, the evaporation source includes crucible and heater, jet port is offered on the crucible, the jet port is just To the evaporation mouth, the heater is for heating the crucible.
Preferably, the evaporated device further includes being set to the intracorporal mechanical arm of the vacuum chamber, connecting with the mechanical arm The magnetic board connect and the mounting rack being oppositely arranged with the magnetic board, the mechanical arm is for controlling magnetic board side vertically Upward movement, the mounting rack is for carrying mask plate, and the magnetic board is for adsorbing the mask plate, so that described Mask plate is attached on the surface to be deposited of substrate to be deposited.
Preferably, the evaporated device further includes cold plate, the cold plate be set to the magnetic board and the mask plate it Between, the substrate to be deposited is set between the cold plate and the mask plate.
The utility model has the advantages that a kind of evaporated device disclosed by the invention, sticks cavity by being arranged in vacuum cavity, will evaporate Source, which is set to, sticks in cavity, and opens up evaporation mouth on sticking cavity face evaporation source position, can reduce the steaming of evaporation source Range is sent out, organic functional material is reduced and forms a film on preventing plate, improve stock utilization, while being conducive to the recycling of material.
Detailed description of the invention
Fig. 1 is the sectional view of the evaporated device of the embodiment of the present invention.
Fig. 2A is the partial enlarged view in Fig. 1 at A.
Fig. 2 B is another partial enlarged view in Fig. 1 at A.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to It is of the invention in limiting.
As shown in Figure 1, the evaporated device of embodiment according to the present invention includes vacuum cavity 10, several prevents plate 20, glutinous Attached cavity 30 and evaporation source 40.Wherein, several to prevent that plate 20 is set in vacuum cavity 10, and it is several prevent plate 20 splicing to enclose At an accommodation space 20a, stick cavity 30 and be set in accommodation space 20a, evaporation source 40, which is set to, to be sticked in cavity 30, is steamed 40 are risen for heating and evaporating organic functional material, so that organic functional material forms a film on substrate 70 to be deposited.
Stick and offer evaporation mouth 30a on cavity 30 on the position of face evaporation source 40, it is several prevent in plate 20 with evaporation Mouth 30a face prevents offering opening 20b, opening 20b and evaporation mouth 30a face on plate, is evaporated the evaporation of source 40 in this way Organic functional material sequentially pass through evaporation mouth 30a and opening 20b after form a film on substrate 70 to be deposited.By by evaporation source 40 Setting is being sticked in cavity 30, to reduce evaporation range, as shown in phantom in fig. 1, can pass through setting evaporation mouth 30a and opening It is reduced so that organic functional material is more intensively sprayed from evaporation mouth 30a to substrate 70 to be deposited the relative position of 20b Organic functional material forms a film on preventing plate 20, improves the utilization rate of organic functional material.
Specifically, as a preferred embodiment, the shape of vacuum cavity 10 is cuboid, several to prevent in plate 20 at least One piece is prevented that plate 20 is oppositely arranged with evaporation source 40, remaining prevents that plate 29 is set to the inner surface of vacuum cavity 10.Wherein, it opens Mouth 20b is located to be prevented on plate 20 with what evaporation source 40 was oppositely arranged.
Wherein, several to prevent that can be integral structure between plate 20 is also possible to detachable structure.In other embodiment party In formula, prevent that the quantity of plate 20 can be other.Certainly in other embodiments, prevent that the shape of plate 20 is also designed to Other shapes are set to preventing for 10 inner surface of vacuum cavity for example, preventing that plate 20 is plate with what evaporation source 40 was oppositely arranged The shape of plate 20 is arc panel.
Further, stick cavity 30 and be removably installed in and prevent on plate 20.As a preferred embodiment, stick cavity 30 It is removable including several side plates 31 being arranged around evaporation source 40 and the top plate 32 being oppositely arranged with evaporation source 40, several side plates 31 It is installed on unloading and prevents on plate 20, evaporation mouth 30a is located on top plate 32.Further, it is offered on the bottom surface of vacuum cavity 10 First through hole prevents offering the second through-hole on plate 20 positioned at 10 bottom surface of vacuum cavity, and evaporated device further includes screw, spiral shell Adjusting screw sequentially passes through first through hole and the second through-hole with several side plates 31 of fixation.
As a preferred embodiment, stick the cuboid-type that is preferably shaped to of cavity 30, the quantity of side plate 31 is four, four The vertical connection of 31 head and the tail of side plate, the size for sticking cavity 30 is 30cm*12cm*20cm.Evaporation source 40 includes crucible 41 and heating Device 42, crucible 41 are used for heating crucible 41 for holding organic functional material, heater 42.Wherein, crucible have feed inlet and Jet port 41a, jet port 41a face evaporation mouth 30a, jet port 41a flash to gaseous organic functional material for spraying, steam The size for sending out mouth 30a is greater than the jet port 41a of crucible.
Further, sticking the inner surface setting protrusion 30c of cavity 30, such inner surface is rough rough surface, Be conducive to the recycling of organic functional material.As a preferred embodiment, as shown in Figure 2 A and 2 B, the section shape of the protrusion 30c The shape of shape be triangle, it is trapezoidal, fan-shaped in any one.
As a preferred embodiment, the material for sticking cavity 30 is preferably stainless steel, prevents the preferred stainless steel of the material of plate 20.
Specifically, evaporated device further includes film thickness sensor 50, sticks and offers monitoring mouth 30b on cavity 30, monitors mouth 30b is for connecting film thickness sensor 50.As a preferred embodiment, monitoring mouth 30b is set on top plate 32.Further, as Preferred embodiment, film thickness sensor 50 are arranged in monitoring mouth 30b, and film thickness sensor 50 exists for detecting organic functional material The thickness of the film of formation on substrate 70 to be deposited.The type of film thickness sensor 50 is crystal-vibration-chip sensor.
Specifically, the evaporated device further includes the mechanical arm 61 being set in vacuum cavity 10, connect with mechanical arm Magnetic board 62 and the mounting rack 63 being oppositely arranged with magnetic board 60, mechanical arm 61 is for controlling on 62 vertical direction of magnetic board Mobile, mounting rack 63 is for carrying mask plate 80, and magnetic board 62 is for adsorbing mask plate 80, so that mask plate 80 is attached at On the surface to be deposited of substrate 70 to be deposited.
During practical vapor deposition, substrate 70 to be deposited is set between mask plate 80 and magnetic board 62, the material of mask plate 80 Material is permeability magnetic material, and under the suction-operated of magnetic board 61, mask plate 80 closely fits in the to be deposited of substrate 70 to be deposited Surface guarantees the stability of mask plate 80 during vapor deposition.Certainly in other embodiments, the material of mounting rack 63 is magnetic conduction Material, mask plate 80 are placed on mounting rack 63, and substrate 70 to be deposited is set between mask plate 80 and magnetic board 61, magnetic board 61 absorption mounting racks 63, so that mask plate 80 closely fits on the surface to be deposited of substrate 70 to be deposited.
Further, evaporated device further includes cold plate 90, and cold plate 90 is set between magnetic board 62 and mask plate 80, wait steam Plated substrate 70 is set between cold plate 90 and mask plate 80.During practical vapor deposition, cold plate 90 fits in substrate 70 to be deposited On the surface opposite with surface to be deposited, cold plate 90 has cooling gaseous organic functional material so that organic functional material to Vapor deposition forms a film on surface.As a preferred embodiment, cold plate 90 uses water-cooled plate.
A kind of evaporated device disclosed by the invention sticks cavity by being arranged in vacuum cavity, evaporation source is set to Stick in cavity, and open up evaporation mouth on sticking cavity face evaporation source position, can reduce the evaporation range of evaporation source, subtract Few organic functional material forms a film on preventing plate, improves stock utilization, while being conducive to the recycling of material.
A specific embodiment of the invention is described in detail above, although having show and described some implementations Example, it will be understood by those skilled in the art that defined by the claims and their equivalents of the invention not departing from It in the case where principle and spirit, can modify to these embodiments and perfect, these are modified and improve also should be in the present invention Protection scope in.

Claims (9)

1. a kind of evaporated device characterized by comprising
Vacuum cavity (10);
It is several to prevent plate (20), it is set in the vacuum cavity (10), it is described several to prevent that plate (20) splicing has to be formed The accommodation space (20a) of opening (20b);
Stick cavity (30), be set in the accommodation space (20a), it is described stick on cavity (30) have and the opening (20b) opposite evaporation mouth (30a);
Evaporation source (40), be set to it is described stick in cavity (30), the evaporation source (40) and the evaporation mouth (30a) are opposite.
2. evaporated device according to claim 1, which is characterized in that the cavity (30) that sticks is removably installed in institute It states and prevents on plate (20).
3. evaporated device according to claim 1 or 2, which is characterized in that described cavity (30) inner surface that sticks is provided with Raised (30c).
4. evaporated device according to claim 3, which is characterized in that the shape of cross sectional shape of the protrusion (30c) is Triangle, it is trapezoidal, fan-shaped in any one.
5. evaporated device according to claim 1, which is characterized in that described stick cavity (30) are equipped with monitoring mouth (30b), the monitoring mouth (30b) is for connecting film thickness sensor (50).
6. evaporated device according to claim 2, which is characterized in that described stick cavity (30) include around the evaporation Several side plates (31) of source (40) setting and the top plate (32) being oppositely arranged with the evaporation source (40), several side plates (31) be removably installed in it is described prevent on plate (20), the evaporation mouth (30a) is located on the top plate (32).
7. evaporated device according to claim 1, which is characterized in that the evaporation source (40) includes crucible (41) and heating Device (42) offers jet port (41a) on the crucible (41), evaporation mouth (30a) described in jet port (41a) face, institute Heater (42) are stated for heating the crucible (41).
8. evaporated device according to claim 1, which is characterized in that the evaporated device further includes being set to the vacuum It mechanical arm (61), the magnetic board (62) being connect with the mechanical arm in cavity (10) and is oppositely arranged with the magnetic board Mounting rack (63), the mechanical arm (61) are used to control the movement on the magnetic board (62) vertical direction, the mounting rack (63) for carrying mask plate (80), the magnetic board (62) is for adsorbing the mask plate (80), so that the exposure mask Plate (80) is attached on the surface to be deposited of substrate to be deposited (70).
9. evaporated device according to claim 8, which is characterized in that the evaporated device further includes cold plate (90), described Cold plate (90) is set between the magnetic board (62) and the mask plate (80), and the substrate (70) to be deposited is set to described Between cold plate (90) and the mask plate (80).
CN201810800950.0A 2018-07-20 2018-07-20 Evaporated device Pending CN109023253A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201810800950.0A CN109023253A (en) 2018-07-20 2018-07-20 Evaporated device
PCT/CN2018/109645 WO2020015205A1 (en) 2018-07-20 2018-10-10 Vapor deposition device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810800950.0A CN109023253A (en) 2018-07-20 2018-07-20 Evaporated device

Publications (1)

Publication Number Publication Date
CN109023253A true CN109023253A (en) 2018-12-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810800950.0A Pending CN109023253A (en) 2018-07-20 2018-07-20 Evaporated device

Country Status (2)

Country Link
CN (1) CN109023253A (en)
WO (1) WO2020015205A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109930112A (en) * 2019-04-15 2019-06-25 湖畔光电科技(江苏)有限公司 A kind of vapor deposition cavity body structure
CN110184569A (en) * 2019-07-03 2019-08-30 江苏万新光学有限公司 The coating machine of electron gun baffle is adjusted in a kind of band
CN111663102A (en) * 2019-03-05 2020-09-15 陕西坤同半导体科技有限公司 Evaporation equipment and evaporation process

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Publication number Priority date Publication date Assignee Title
CN1638032A (en) * 2003-12-26 2005-07-13 精工爱普生株式会社 Thin film formation method and apparatus. method of manufacturing organic electroluminescence device,
JP2008223102A (en) * 2007-03-14 2008-09-25 Seiko Epson Corp Vapor deposition apparatus and vapor deposition method
CN103237916A (en) * 2010-12-03 2013-08-07 夏普株式会社 Deposition apparatus and recovery apparatus
CN204417579U (en) * 2014-12-30 2015-06-24 上海天马有机发光显示技术有限公司 A kind of evaporation coating device
CN205999474U (en) * 2016-09-19 2017-03-08 京东方科技集团股份有限公司 Vacuum deposition apparatus
CN106637073A (en) * 2016-10-14 2017-05-10 深圳市华星光电技术有限公司 Vacuum evaporation device
CN107287559A (en) * 2017-06-22 2017-10-24 深圳市华星光电技术有限公司 OLED evaporated devices and its Antisticking

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1638032A (en) * 2003-12-26 2005-07-13 精工爱普生株式会社 Thin film formation method and apparatus. method of manufacturing organic electroluminescence device,
JP2008223102A (en) * 2007-03-14 2008-09-25 Seiko Epson Corp Vapor deposition apparatus and vapor deposition method
CN103237916A (en) * 2010-12-03 2013-08-07 夏普株式会社 Deposition apparatus and recovery apparatus
CN204417579U (en) * 2014-12-30 2015-06-24 上海天马有机发光显示技术有限公司 A kind of evaporation coating device
CN205999474U (en) * 2016-09-19 2017-03-08 京东方科技集团股份有限公司 Vacuum deposition apparatus
CN106637073A (en) * 2016-10-14 2017-05-10 深圳市华星光电技术有限公司 Vacuum evaporation device
CN107287559A (en) * 2017-06-22 2017-10-24 深圳市华星光电技术有限公司 OLED evaporated devices and its Antisticking

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111663102A (en) * 2019-03-05 2020-09-15 陕西坤同半导体科技有限公司 Evaporation equipment and evaporation process
CN109930112A (en) * 2019-04-15 2019-06-25 湖畔光电科技(江苏)有限公司 A kind of vapor deposition cavity body structure
CN110184569A (en) * 2019-07-03 2019-08-30 江苏万新光学有限公司 The coating machine of electron gun baffle is adjusted in a kind of band
CN110184569B (en) * 2019-07-03 2024-04-02 江苏万新光学有限公司 Coating machine with adjustable electron gun baffle

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Application publication date: 20181218

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