WO2020173413A1

WO2020173413A1 - Deposition-preventing assembly and vapor deposition device

Info

Publication number: WO2020173413A1
Application number: PCT/CN2020/076507
Authority: WO
Inventors: 金明洙; 曾利
Original assignee: 京东方科技集团股份有限公司; 绵阳京东方光电科技有限公司
Priority date: 2019-02-25
Filing date: 2020-02-25
Publication date: 2020-09-03
Also published as: CN109652773A; CN109652773B

Abstract

A deposition-preventing assembly (10), comprising a main deposition-preventing panel (11), at least a portion of a surface of the main deposition-preventing panel (11) being a concave surface (111), the concave surface (111) being configured to bear a vapor deposition material (12). Further provided is a vapor deposition device (200).

Description

Anti-wear components and evaporation equipment Cross reference to related applications

This application claims the priority of the Chinese patent application No. 201910137494.0 filed on February 25, 2019, and the content of the above-mentioned Chinese patent application is quoted here in full as a part of this application. Technical field

The embodiment of the present disclosure relates to an anti-sticking component and an evaporation device. Background technique

Organic electroluminescence (OLED) display devices have become the main reason for their advantages such as self-luminescence, wide viewing angle, high contrast, low power consumption, fast response speed, light weight, soft display, rollable screen, strong temperature adaptability, and simple manufacturing process. Research hotspots in the field of optoelectronic display technology.

Generally, OLEDs are made by evaporation process, and different organic materials or inorganic materials are deposited according to the requirements of different film layers to form organic light-emitting display devices. In the process of preparing the organic light emitting diode display device, the more critical technology is the coating of the light emitting layer. To realize the light emission of the light emitting layer, it is necessary to form a cathode and an anode to realize the conductive function. At present, a metal chamber is generally used to evaporate the cathode, and the cavity wall of the evaporation process chamber will be protected by an anti-sticking plate. The anti-sticking plate is used to block the unused evaporation material and prevent the unused evaporation material Adhere to the cavity wall of the evaporation process chamber, so as to prevent the unused evaporation material from damaging the parts in the evaporation equipment. Summary of the invention

At least one embodiment of the present disclosure provides an anti-attachment assembly, which includes: a main anti-attachment board, wherein at least a part of the surface of the main anti-attachment board is a concave surface, and the concave surface is configured to carry an evaporation material.

For example, in the anti-flood assembly provided by at least one embodiment of the present disclosure, the cross-sectional shape of the main anti-flood plate is an arc.

For example, in the anti-wear component provided by at least one embodiment of the present disclosure, the arc is a part of a circle, or the arc is a part of an ellipse.

For example, in the anti-flood assembly provided by at least one embodiment of the present disclosure, the main anti-flood plate has The surface on one side of the concave surface is provided with a first mesh layer.

For example, the anti-landing assembly provided by at least one embodiment of the present disclosure further includes a cooling component, wherein the cooling component is disposed on the side of the main anti-landing plate away from the concave surface, and is located on the main anti-landing plate At the edge.

For example, in the anti-touch assembly provided by at least one embodiment of the present disclosure, the cooling component includes a non-contact cooling component or a contact cooling component.

For example, in the anti-stroke assembly provided by at least one embodiment of the present disclosure, the cooling component includes a cooling medium, and the cooling medium includes a gas cooling medium or a liquid cooling medium.

For example, in the anti-stroke assembly provided by at least one embodiment of the present disclosure, the anti-stroke assembly includes at least two of the cooling components separated from each other.

For example, the anti-floating assembly provided by at least one embodiment of the present disclosure further includes an auxiliary anti-flooding plate, wherein the auxiliary anti-flooding plate is arranged on the side of the main anti-flooding plate with the concave surface, and the auxiliary The anti-landing board is configured to be at least partially located in the protection area of the main anti-landing board when the main anti-landing board is assisted.

For example, in the anti-impact assembly provided by at least one embodiment of the present disclosure, at least a part of the auxiliary anti-impact plate is driven by a motor to move into the protection area of the main anti-impact plate.

For example, in the anti-impact assembly provided by at least one embodiment of the present disclosure, the auxiliary anti-impact plate is a flat type anti-impact plate.

For example, in the anti-floating assembly provided by at least one embodiment of the present disclosure, a second mesh layer is provided on the surface of the side of the secondary anti-floating plate away from the main anti-floating plate.

At least one embodiment of the present disclosure further provides an evaporation device, including the anti-sticking component and an evaporation source described in any one of the above.

For example, in the evaporation equipment provided by at least one embodiment of the present disclosure, the surface of the main anti-landing plate opposite to the concave surface is convex toward the side facing away from the evaporation port of the evaporation source.

For example, the evaporation equipment provided by at least one embodiment of the present disclosure further includes a substrate to be evaporated, wherein the evaporation source evaporates the evaporation material onto the substrate to be evaporated, and the substrate to be evaporated is located at the substrate. Between the evaporation source and the anti-sticking component. Description of the drawings

In order to explain the technical solutions of the embodiments of the present disclosure more clearly, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present invention. It is not a limitation of the present invention.

Figure 1 is a schematic diagram of the structure of an anti-touch component and evaporation source;

Fig. 2 is a schematic structural diagram of an anti-touch assembly provided by an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of an anti-touch assembly provided by still another embodiment of the present disclosure;

4 is a schematic structural diagram of an anti-touch assembly provided by another embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of an anti-touch assembly provided by another embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of an evaporation equipment provided by an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of an evaporation equipment provided by another embodiment of the present disclosure; and FIG. 8 is a schematic structural diagram of an evaporation equipment provided by another embodiment of the disclosure. detailed description

To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

Unless otherwise defined, the technical or scientific terms used in the present disclosure shall have the usual meanings understood by those with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. "Include" or "include" and other similar words mean that the element or item appearing before the word covers the elements or items listed after the word and their equivalents, but does not exclude other elements or items. Similar words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right", etc. are only used to indicate the relative position relationship. When the absolute position of the described object changes, the relative position relationship may also change accordingly.

In the vapor deposition process, usually before performing the vapor deposition process on the substrate to be vapor-deposited, the evaporation source needs to be heated, and the temperature of the vapor deposition is unstable during the temperature rising process. If the evaporation material is formed on the substrate to be evaporated under the condition of unstable temperature, the evaporation material will adhere unevenly on the substrate to be evaporated, which will affect the uniformity of the deposited film. Therefore, it is necessary First, deposit this part of the evaporation material on the anti-coating plate, and then move the substrate to be evaporated above the evaporation source until the evaporation temperature is stable, so that the evaporation material is evaporated on the substrate to be evaporated. After the evaporation process is completed on the evaporation substrate, The evaporation substrate needs to be removed from above the evaporation source, and the evaporation source needs to be cooled down. Since the evaporation source still has a certain temperature, the evaporation material is still being evaporated. At this time, it is necessary to use an anti-slip plate This part of the vapor deposition material is carried to prevent the part of the vapor deposition material from adhering to the cavity wall of the vapor deposition process chamber and difficult to remove, thereby causing damage to the components in the vapor deposition equipment.

For example, Figure 1 is a schematic diagram of the structure of an anti-sticking component and an evaporation source. As shown in Figure 1, the surface of the anti-sticking component 01 is flat. When the evaporation material has a high density and the formed film layer is thick, the evaporation During the plating process, the evaporation material is easy to accumulate in the middle area of the anti-sticking component, resulting in uneven thickness of the deposited evaporation material, and the flat surface of the anti-sticking component 01 has a small load-bearing capacity for the evaporation material. After the component 01 is used for a short period of time, the evaporation material carried on it will appear peeling, which will affect the product quality, and the dropped evaporation material will easily block the evaporation port of the evaporation source, causing There is a risk of plugging in the evaporation port of the evaporation source. Therefore, it is necessary to stop the machine to replace the anti-stroke assembly 01 in a short time, which wastes production time and affects the production efficiency of the product.

The inventors of the present disclosure have discovered that the shape of the anti-stick component can be improved to make the accumulation of the vapor deposition material have a certain directionality. In this way, the vapor deposition material vaporized to the middle part of the anti-stick component will move toward the anti-stick component due to gravity. It flows along the edges of the component, thereby reducing the amount of evaporation material carried in the middle area of the anti-sticking component, reducing or avoiding the phenomenon of evaporation material falling from the middle area of the anti-sticking component, thereby reducing the evaporation material falling blockage The risk of evaporating the evaporation source.

For example, FIG. 2 is a schematic structural diagram of an anti-flood assembly provided by an embodiment of the present disclosure. As shown in FIG. 2, the anti-flood assembly 10 includes: a main anti-flood plate 11, wherein at least a Part of the surface is a concave surface 111, and the concave surface 111 is configured to carry the vapor deposition material 12.

For example, in the process of vapor deposition using an evaporation device including an anti-sticking component, the concave surface 111 of the main anti-sticking plate 11 faces the evaporation port of the evaporation source (for example, a crucible nozzle, not shown in FIG. 2) to prevent The evaporation port of the evaporation source (for example, the crucible nozzle) is blocked.

For example, as shown in FIG. 2, the cross-sectional shape of the main landing board 11 is arc.

It should be noted that the cross-section refers to the cross-section of the main anti-sticking plate 11 in the direction perpendicular to the horizontal plane when the anti-sticking component 10 is subjected to a normal evaporation process.

For example, when the cross-section of the main anti-landing plate 11 is arc-shaped, that is, the main anti-landing plate 11 as a whole forms a protrusion facing the evaporation port (for example, crucible nozzle) away from the evaporation source, so that the main anti-landing plate 11 faces the evaporation The evaporation port (for example, the crucible nozzle) of the source has a concave surface on one side, and this structure can reduce the difficulty of manufacturing the main anti-landing plate 11, thereby reducing the manufacturing cost of the main anti-landing plate 11.

For example, the arc is a part of a circle, or the arc is a part of an ellipse. For example, when the arc is a part of an ellipse, the surface area of the main landing plate 11 facing the evaporation port of the evaporation source can be further increased to better reduce the evaporation port of the main landing plate 11 facing the evaporation source. The accumulation amount of the evaporation material 12 formed in the middle part effectively reduces the risk of material peeling off the main anti-landing plate 11, thereby reducing the risk of plugging the evaporation port of the evaporation source.

It should be noted that the above-mentioned concave surface 111 may be a smooth arc surface, or may be a surface formed by a plurality of continuously or discontinuously distributed planes (for example, the plane is a rectangle, etc.).

For example, FIG. 3 is a schematic structural diagram of an anti-touch assembly provided by still another embodiment of the present disclosure. As shown in FIG. 3, the anti-landing component 10 includes a main anti-landing board 11 and a first mesh layer 13, and the first mesh layer 13 is provided on the surface of the main anti-landing board 11 on the side with the concave surface 111.

For example, at least part of the surface of the main anti-landing plate 11 is a concave surface 111, the first mesh layer 13 also has a concave surface 131, and the vapor deposition material 12 adheres to the concave surface 131 of the first mesh layer 13 and the first mesh In the mesh of the layer 13, in this way, the surface area of the main anti-landing plate 11 facing the evaporation port of the evaporation source can be further increased, so as to further increase the adhesion amount of the vaporized material 12 on the anti-landing assembly 10.

For example, the pores in the first mesh layer 13 can not only ensure that the vapor deposition material can enter the pores, but also can prevent the vapor deposition material from falling off slightly on the inner surface of the pores. In addition, the pores can also increase the area of the inner surface of the first mesh layer 13, thereby further increasing the area of the main anti-landing plate 11 for carrying the vapor deposition material.

It should be noted that while the first mesh layer 13 increases the surface area of the main landing plate 11 with the concave surface 111, it also increases the amount of vapor deposition material on the main landing plate 11 that can be accumulated. When the accumulation amount of the material 12 is the same, the main landing plate 11 provided with the first mesh layer 13 is less likely to peel off the material. That is, the first mesh layer 13 increases the area used to carry the evaporation material, thereby increasing the carrying capacity of the evaporation material. Therefore, the evaporation material will only appear after the anti-adhesion component 10 is used for a long time. The phenomenon of falling, thereby prolonging the replacement cycle of the anti-stripping component 10, thereby reducing the waste of production time, and reducing the impact on the production efficiency of the product.

For example, FIG. 4 is a schematic structural diagram of an anti-touch assembly provided by another embodiment of the present disclosure. As shown in FIG. 4, the anti-floating assembly 10 further includes a cooling component 14, wherein the cooling component 14 is arranged on the side of the main anti-flooding plate 11 away from the concave surface 111, and is located at the edge of the main anti-flooding plate 11, The cooling member 14 is configured to cool the edge of the main landing board 11.

It should be noted that after the cooling component 14 is installed on the main anti-impregnation plate 11, the material will accumulate in the lower temperature part, that is, the edge of the main anti-impact plate 11 corresponding to the cooling component 14, so as to further reduce evaporation. The accumulated thickness of the material 12 in the middle of the concave surface 111 of the main landing board 11. Relative to the main The vapor deposition material in the middle of the concave surface 111 of the anti-impact plate 11 is more likely to peel off the vapor deposition material 12 corresponding to the edge of the main anti-impact plate 11. In the subsequent use of the evaporation equipment including the anti-sticking assembly 10, the evaporation material peeled off the edge of the main anti-sticking plate 11 will not fall into the evaporation port of the evaporation source, causing the evaporation port of the evaporation source to be blocked, thereby Effectively reduce the risk of plugging in the evaporation port of the evaporation source.

For example, as shown in Fig. 4, the cooling component 14 includes a non-contact cooling component or a contact cooling component.

For example, the cooling component 14 includes a cooling medium, and the cooling medium includes a gas cooling medium or a liquid cooling medium.

For example, the non-contact cooling may be air cooling, etc., and the contact cooling may be semiconductor cooling, liquid cooling, or the like.

For example, the anti-slip assembly 10 includes at least two cooling components 14 separated from each other.

For example, as shown in FIG. 4, the anti-slip assembly 10 includes two cooling components 14. The embodiment of the present disclosure does not limit this.

It should be noted that the anti-sticking component 10 may also include only one cooling component 14, or the anti-sticking component 10 may also include three or more cooling components 14, or, it may also be in the anti-sticking component 10 Cooling parts 14 are arranged on the entire edge.

It should also be noted that when a plurality of cooling components 14 are provided to cool the edge of the main landing plate 11, the evaporation material 12 can be mainly located at the edge of the main landing plate 11, thereby effectively reducing evaporation. Risk of plugging in the evaporation port of the source.

For example, in one example, the cooling component 14 includes a cooling pipe, and the cooling pipe covers the main anti-landing plate 11. For example, the shape of the cooling pipeline is U-shaped, so that the edge of the main anti-landing plate 11 can be uniformly cooled.

For example, FIG. 5 is a schematic structural diagram of an anti-touch assembly provided by another embodiment of the present disclosure. As shown in FIG. 5, the anti-flood assembly 10 further includes a secondary anti-flood plate 15, which is provided on the side of the main anti-flood plate 11 with a concave surface 111, and the auxiliary anti-flood plate 15 is configured to At least a part of the auxiliary main landing board 11 is located in the protection area of the main landing board 11.

For example, the main protective plate 11 has a limited bearing capacity for the evaporation material. When the main protective plate 11 carries the evaporation material to a certain level, a new protective plate is needed to carry the continuously sprayed evaporation material.

For example, the auxiliary anti-impact plate 15 is a flat anti-impact plate, so that the auxiliary anti-impact plate 15 can be easily removed when the auxiliary anti-impact plate 15 is not needed; The landing board 15 moves to the protection area of the main landing board 11. For example, as shown in FIG. 5, at least a part of the auxiliary landing board 15 can be driven by the motor 18 to move into the protection area of the main landing board 15.

For example, the shape of the auxiliary anti-impact plate 15 is not limited to the above-mentioned planar shape, and the auxiliary anti-impact plate 15 may also have a concave surface, that is, the cross-sectional shape of the auxiliary anti-impact plate 15 may also be an arc shape.

For example, when the anti-sticking assembly 10 is used in an evaporation device, the auxiliary anti-sticking plate 15 can assist in shielding the evaporation port of the evaporation source. When the auxiliary anti-sticking plate 15 shields the evaporation port of the evaporation source, the auxiliary anti-sticking plate 15 can shield the evaporation port of the evaporation source. 15 is arranged on the side of the main anti-landing plate 11 facing the evaporation port of the evaporation source, and at least a part of the auxiliary anti-landing plate 15 is located in the protection area of the main anti-landing plate 11.

For example, the auxiliary landing guard plate 15 can block the peeling material falling from the main landing guard plate 11, so as to further prevent the peeled vapor deposition material from blocking the evaporation port of the evaporation source, so as to play a dual protection role.

For example, in one embodiment, a secondary landing board 15 may be provided on the side of each main landing board 11, and the secondary landing board 15 and its corresponding primary landing board 11 play a dual protective role, or One or more auxiliary landing boards 15 are arranged between two or more main landing boards 11, and when necessary, the auxiliary landing boards 15 are driven to the position that needs to be blocked by a motor, so that it is effective against the evaporation source. The evaporation port is shielded.

For example, the main anti-landing board 11 and the auxiliary landing board 15 may be hinged connection or snap connection. For example, as shown in FIG. 5, the surface of the side of the secondary landing board 15 away from the main landing board 11 is provided with a second mesh layer 16 which further increases the secondary landing board 15 The surface area of the surface on the side away from the main landing plate 11.

At least one embodiment of the present disclosure further provides a post-steaming device, the post-steaming device includes the anti-slip component and evaporation source provided in any of the above embodiments. For example, the anti-slip assembly is configured to prevent the evaporation port of the evaporation source from being blocked.

For example, FIG. 6 is a schematic structural diagram of an evaporation equipment provided by an embodiment of the present disclosure. As shown in FIG. 6, in the entire evaporation equipment 200, the side of the main landing prevention plate 11 facing the evaporation opening of the evaporation source 20 can be set as a concave surface, that is, the main landing prevention plate 11 has a side facing away from the evaporation source 20. The non-planar geometric configuration with convex side of the evaporation port. When the side of the main anti-landing plate 11 facing the evaporation port of the evaporation source 20 is concave, the surface area of the main anti-landing plate 11 facing the evaporation port (for example, the crucible nozzle) of the evaporation source 20 is increased, so that the unit time The accumulation amount of the vapor deposition material 12 formed by the vapor deposition material 12 in the middle of the evaporation port of the evaporation source 20 facing the main landing plate 11 is reduced, and after the vapor deposition gas is ejected from the vaporization port of the evaporation source 20, the gas adheres to The central part of the main landing board 11 can be turned to both sides of the main landing board 11 The edges flow and finally solidify on both sides of the main anti-landing plate 11, which further reduces the accumulation of the evaporation material 12 formed in the middle of the main anti-landing plate 11 facing the evaporation port of the evaporation source 20. The risk of material peeling off on the main landing plate 11 is reduced, thereby further reducing the risk of plugging of the evaporation port of the evaporation source 20.

It should be noted that, since the surface of the main landing prevention plate 11 facing the evaporation source 20 is a concave surface 111, the concave surface 111 increases the surface area of the main landing prevention plate 11 facing the evaporation source 20, so that Within a period of time, the accumulation amount of the evaporation material 12 formed in the middle area of the main anti-landing plate 11 on the side facing the evaporation source 20 is reduced, thereby effectively reducing the risk of peeling off the material on the main anti-landing plate 11, thereby reducing the evaporation source 20 Risk of plugging.

For example, as shown in Fig. 6, the cross-sectional shape of the main landing board 11 is an arc. When the cross-section of the main anti-landing plate 11 is arc-shaped, that is, when the main anti-landing plate 11 is integrally formed as a bulge facing away from the evaporation port (for example, a hanging nozzle) of the evaporation source 20, the main anti-landing plate 11 faces the evaporation The evaporation port (for example, crucible nozzle) of the source 20 has a concave surface on one side, and the concave structure can reduce the difficulty of manufacturing the main anti-landing plate 11, thereby reducing the manufacturing cost of the main anti-landing plate 11.

For example, the arc is a part of a circle, or the arc is a part of an ellipse. When the arc is part of an ellipse, the surface area of the main landing plate 11 facing the evaporation port of the evaporation source 20 can be further increased to better reduce the evaporation of the main landing plate 11 facing the evaporation source 20. The accumulation amount of the evaporation material 12 formed in the middle area of the opening can effectively reduce the risk of material peeling off the main anti-landing plate 11, thereby reducing the risk of plugging in the evaporation opening of the evaporation source 20.

For example, the concave surface 111 may be a smooth arc surface, or may be a surface composed of a plurality of continuously distributed or intermittently distributed planes (for example, the plane is rectangular, etc.).

For example, the anti-landing component 10 in the steaming device 200 includes a main anti-landing plate 11 and a first mesh layer 13, and the surface of the main anti-landing plate 11 on the side with the concave surface 111 is provided with the first mesh layer 13.

For example, at least part of the surface of the main anti-landing plate 11 in the vapor deposition equipment 200 is a concave surface 111, the first mesh layer 13 also has a concave surface 131, and the vapor deposition material 12 adheres to the concave surface 131 of the first mesh layer 13 In the middle and the mesh of the first mesh layer 13, this can further increase the surface area of the main anti-landing plate 11 facing the evaporation port of the evaporation source, so as to further increase the adhesion amount of the evaporation material 12 on the anti-adhesion component 10 .

For example, the pores in the first mesh layer 13 not only ensure that the vapor deposition material can enter the pores, but also prevent the vapor deposition material from falling when the vapor deposition material on the inner surface of the pores slightly drops. In addition, the pores can also increase the area of the inner surface of the first mesh layer 13, thereby further increasing The main anti-landing plate 11 is used to carry the area of the vapor deposition material.

It should be noted that while the first mesh layer 13 increases the surface area of the main landing plate 11 with the concave surface 111, it also increases the amount of vapor deposition material on the main landing plate 11 that can be accumulated. When the accumulation amount of the vapor deposition material 12 is the same, the main anti-landing plate 11 provided with the first mesh layer 13 is less likely to peel off the material. That is, the first mesh layer 13 increases the area for carrying the evaporation material, thereby increasing the carrying capacity of the evaporation material. Therefore, when the anti-sticking component 10 in the evaporation equipment 200 is used for a long time The post-evaporation material does not fall off, thereby prolonging the replacement cycle of the anti-corrosion component 10 in the evaporation equipment 200, thereby reducing the waste of production time and reducing the impact on the production efficiency of the product.

As shown in FIG. 6, the anti-floating assembly 10 in the vapor deposition equipment 200 further includes a cooling component 14, wherein the cooling component 14 is provided on the side of the main anti-floating plate 11 away from the concave surface 111, and is located on the main anti-floating plate 11 At the edge of 11, the cooling component 14 is configured to cool the edge of the main landing board 11.

It should be noted that after the cooling component 14 is installed on the main anti-impregnation plate 11, the material will accumulate in the lower temperature part, that is, at the edge of the main anti-impact plate 11 corresponding to the cooling component 14, so as to reduce the evaporation material 12 The accumulated thickness of the material in the middle of the concave surface 111 of the main landing board 11. That is, when a part of the material in the vapor deposition material 12 peels off, it is easier for the vapor deposition material 12 corresponding to the edge portion of the main landing plate 11 to correspond to the deposition material located in the middle area of the concave surface 111 of the main landing plate 11 Flaking. When the evaporation equipment 200 is used, the evaporation material peeled off from the edge of the main landing plate 11 will not fall into the evaporation port of the evaporation source 20 and cause the evaporation port of the evaporation source 20 to be clogged, thereby effectively reducing the evaporation source. There is a risk of plugging in the evaporation port of 20.

For example, the cooling component 14 includes a non-contact cooling component or a contact cooling component. The non-contact cooling may be air cooling or the like, and the contact cooling may be semiconductor cooling, liquid cooling, or the like.

For example, as shown in FIG. 6, the anti-slip assembly 10 includes two cooling components 14, which are not limited in the embodiment of the present disclosure.

It should also be noted that when a plurality of cooling components 14 are provided to cool the edge of the main anti-impact plate 11, the vapor deposition material 12 can be mainly located at the edge of the main anti-impact plate 11, which can effectively Reduce the risk of plugging in the evaporation port of the evaporation source.

For example, the cooling component 14 includes a cooling pipe, and the cooling pipe covers the main landing plate 11. For example, the shape of the cooling pipe is U-shaped, so that the main anti-landing plate 11 can be uniformly cooled.

For example, FIG. 7 is a schematic structural diagram of an evaporation equipment provided by still another embodiment of the present disclosure. As shown in FIG. 7, the anti-sticking assembly 10 in the vapor deposition equipment 200 further includes a secondary anti-sticking plate 15, which is arranged on the side of the main anti-sticking plate 11 with the concave surface 111, and the secondary anti-sticking plate The board 15 is configured to be at least partly located in the protection area of the main landing board 11 when the main landing board 11 is auxiliary.

For example, the auxiliary anti-impact plate 15 is a flat anti-impact plate, so that it is convenient to remove the auxiliary anti-impact plate 15 when the auxiliary anti-impact plate 15 is not needed. The board 15 moves into the protection area of the main landing board 11.

For example, the shape of the auxiliary anti-impact plate 15 is not limited to the above-mentioned flat type, the auxiliary anti-impact plate 15 may also have a concave surface, that is, the cross-sectional shape of the auxiliary anti-impact plate 15 may also be an arc shape.

For example, when the anti-sticking component 10 is used in an evaporation device, the auxiliary anti-sticking plate 15 can assist in shielding the evaporation port of the evaporation source. When the auxiliary landing prevention plate 15 shields the evaporation port of the evaporation source, the auxiliary landing prevention board 15 is provided on the side of the main landing prevention plate 11 facing the evaporation port of the evaporation source, and the auxiliary landing prevention board 15 is arranged on the auxiliary main At least a part of the anti-landing plate 11 is located in the protection area of the main anti-landing plate 11.

For example, a secondary landing board 15 may be provided on the side of each main landing board 11, and the secondary landing board 15 and its corresponding primary landing board 11 can play a dual protective role, or, on two or more One or more auxiliary landing boards 15 are arranged between the main anti-landing plates 11, and the motor 18 is used to drive the auxiliary landing boards 15 to a position that needs to be blocked when needed, so as to shield the evaporation port of the evaporation source.

For example, the main landing board 11 and the auxiliary landing board 15 may also be hinged or snapped. For example, as shown in FIG. 7, the surface of the side of the secondary landing board 15 away from the main landing board 11 is provided with a second mesh layer 16, and the second mesh layer 16 further increases the secondary landing board. The surface area of the surface of the side of 15 away from the main landing board 11.

For example, FIG. 8 is a schematic structural diagram of an evaporation equipment provided by another embodiment of the present disclosure. As shown in FIG. 8, the evaporation equipment 200 further includes a substrate 17 to be evaporated. The evaporation source 20 evaporates the evaporation material. On the substrate 17 to be evaporated, the substrate 17 to be evaporated is located between the evaporation source 20 and the anti-attachment component 10. For example, in the process of heating the evaporation source 20, the substrate 17 to be evaporated is first removed from directly above the evaporation source 20, and this part of the evaporation material is deposited on the anti-sticking assembly 10 until the evaporation temperature is stable Then, the substrate 17 to be evaporated is moved to directly above the evaporation source 20 so that the evaporation material is evaporated onto the substrate to be evaporated. After the evaporation process is completed on the substrate 17 to be evaporated, the substrate 17 to be evaporated needs to be removed from the evaporation source 20, and the evaporation source 20 needs to be cooled down. Since the evaporation source 20 still has a certain temperature, The evaporation material is still being evaporated. At this time, it is necessary to use the anti-sticking assembly 10 to carry the part of the evaporation material to prevent the part of the evaporation material from adhering to the parts of the evaporation equipment and difficult to remove. The parts in the evaporation equipment cause damage.

The anti-attachment component and evaporation equipment provided in at least one embodiment of the present disclosure have at least one of the following beneficial effects:

(1) The anti-sticking component provided by at least one embodiment of the present disclosure improves the shape of the anti-sticking component so that the accumulation of the vapor deposition material has a certain directionality, so that the vapor deposition material vaporized to the middle part of the anti-stick component Due to the action of gravity, it will flow to the edge of the anti-stick component, thereby reducing the amount of vapor deposition material carried in the middle area of the anti-stick component.

(2) The anti-sticking component provided by at least one embodiment of the present disclosure reduces or avoids the phenomenon that the evaporation material falls from the middle area of the anti-stick component, thereby reducing the risk of the evaporation material falling and blocking the evaporation port of the evaporation source .

The following points need to be explained:

(1) The drawings of the embodiments of the present invention only refer to the structures related to the embodiments of the present invention, and other structures can refer to the usual design.

(2) For clarity, in the drawings used to describe the embodiments of the present invention, the thicknesses of layers or regions are enlarged or reduced, that is, these drawings are not drawn according to actual scale. It can be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or "under" the other element. Or there may be intermediate elements.

(3) In the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other to obtain a new embodiment.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited to this, and the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An anti-attachment component, comprising: a main anti-attachment plate, wherein at least part of the surface of the primary anti-attachment plate is a concave surface, and the concave surface is configured to carry an evaporation material.

2. The anti-impact assembly according to claim 1, wherein the shape of the cross section of the main anti-impact plate is an arc.

3. The anti-wear component according to claim 2, wherein the arc shape is a part of a circle, or the arc shape is a part of an ellipse.

4. The anti-impact assembly according to any one of claims 1 to 3, wherein the surface of the main anti-impact plate on the side having the concave surface is provided with a first mesh layer.

5. The anti-sticking assembly according to any one of claims 1 to 4, further comprising a cooling component, wherein the cooling component is provided on a side of the main anti-sticking plate away from the concave surface, and is located Said the main guard against the edge of the board.

6. The anti-touch assembly according to claim 5, wherein the cooling component comprises a non-contact cooling component or a contact cooling component.

I. The anti-stroke assembly according to claim 5, wherein the cooling component includes a cooling medium, and the cooling medium includes a gas cooling medium or a liquid cooling medium.

8. The anti-sticking component according to any one of claims 5-7, wherein the anti-sticking component comprises at least two of the cooling components separated from each other.

9. The anti-floating assembly according to any one of claims 1 to 8, further comprising a secondary anti-floating board, wherein the auxiliary anti-floating board is provided on the side of the main anti-floating board having the concave surface , And the auxiliary landing board is configured to be at least partially located in the protection area of the main landing board when the main landing board is assisted.

10. The anti-impact assembly according to claim 9, wherein at least a part of the auxiliary anti-impact plate is driven by a motor to move into the protection area of the main anti-impact plate.

II. The anti-attachment assembly according to claim 9 or 10, wherein the auxiliary anti-attachment plate is a flat anti-attachment plate.

12. The anti-impact assembly according to any one of claims 9 to 11, wherein a second mesh layer is provided on the surface of the secondary anti-impact plate on the side away from the main anti-impact plate.

13. A post-steaming device, comprising the anti-sticking component according to any one of claims 1-12 and an evaporation source.

14. The evaporation apparatus according to claim 13, wherein the surface of the main anti-landing plate opposite to the concave surface is convex toward the side facing away from the evaporation port of the evaporation source.

15. The evaporation apparatus according to claim 13 or 14, further comprising a substrate to be evaporated, wherein the evaporation source evaporates the evaporation material onto the substrate to be evaporated, and the substrate to be evaporated is located at Between the evaporation source and the anti-sticking component.