JP2006249572A - Evaporation source assembly and vapor deposition apparatus using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an evaporation source assembly and a vapor deposition apparatus using the same. <P>SOLUTION: An external housing 50 comprises a guide 80a constituting an evaporation source assembly 30, and the extension line of the guide has a shield 8 heading toward the same point, and the through-holes of nozzle sections possessed by evaporation sources 60, 70 constituting the evaporation source assembly are inclined by a prescribed angle to guide the vapor deposition materials discharged from the respective evaporation sources in such a manner that the vapor deposition materials are vapor-deposited in the same regions of the substrates for vapor deposition, and thereby the thin films having the uniform roughness are formed and the thin films having a uniform thickness can be formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an evaporation source assembly and an evaporation apparatus, and more particularly, to an evaporation source assembly and an evaporation apparatus having a plurality of evaporation sources capable of forming a uniform thin film (evaporating source assembly and deposition having the same).

  In recent years, with the advance of the advanced information era, the demand for consumers to obtain quick and accurate information has increased, and development of display devices that are light, thin, portable, and fast in information processing speed has been progressing rapidly. It has been. Among them, the organic electroluminescent element is a self-luminous type in which a voltage is applied to an organic film including an organic light emitting layer to recombine electrons and holes in the organic light emitting layer to generate light. Therefore, a backlight such as an LCD is not required, and it is lightweight and thin, and the process can be simplified. The response speed is at the same level as CRT, and it is attracting attention as a next generation display due to low voltage driving, high luminous efficiency, and wide viewing angle.

  Here, the organic film is classified into a low molecular organic electroluminescent device and a polymer organic electroluminescent device depending on the material of the organic light emitting layer.

  The polymer type organic electroluminescent device has a tomographic structure composed of an organic light emitting layer between an anode and a cathode, or a double structure including a hole transport layer. The electroluminescent device can be manufactured, and the organic film can be formed by wet coating, so that it can be manufactured under normal pressure, and the cost of the production process can be reduced. is there.

  On the other hand, the low molecular weight organic electroluminescent device is formed of a multilayered low molecular weight organic film having different functions between the anode and the cathode, and is doped so that charge accumulation does not occur. Since the adjustment can be made by substituting the substance having a source, the stability of the device is excellent. Further, since the low molecular type organic film is mainly formed by vapor deposition, the organic film due to the organic solvent can be prevented from being damaged, and the lifetime of the element can be prevented from being reduced.

  In the case of manufacturing a thin film for forming a low molecular weight organic material in a vacuum, a shadow mask pattern having an opening having a shape to be formed is aligned in front of the substrate to form an organic layer on the substrate. An organic thin film having a required shape can be formed on the substrate by depositing a material.

  Here, in the case of forming the organic film layer or the electrode layer of the organic electroluminescent device by vacuum deposition as described above, a vapor deposition apparatus having a plurality of evaporation sources for simultaneously vapor-depositing one or two or more substances. Is required.

  In this case, the organic material emitted from a plurality of evaporation sources is not uniformly mixed with the substrate, or a thin film having a uniform thickness is not formed. It may decrease. Here, as the substrate becomes larger, it becomes more difficult to form a uniform thin film.

  Patent Document 1 discloses an evaporation region adjusting device for simultaneous vapor deposition using a plurality of evaporation sources 1 and for uniformly mixed thin film deposition.

  FIG. 1 illustrates a vapor deposition apparatus having a plurality of evaporation sources according to the prior art in more detail.

Referring to FIG. 1, the region adjustment plate 2 is provided between the evaporation sources, and the size of the opening 0 of the housing 3 that houses the evaporation source is controlled to thereby deposit the vapor discharged from the evaporation source. It is proposed that a uniform thin film can be formed on the deposition target substrate (S) by limiting the discharge direction of the substance. However, in the above patent, it is not easy to control the size of the region adjusting plate 2 and the opening 0 that limit the direction of the vapor deposition material discharged from the evaporation source.
Korean Patent Registration No. 071595

  The object of the present invention has been devised to solve the above-mentioned problems of the prior art, and the present invention uniformly applies a vapor deposition material emitted from a plurality of evaporation sources to the same region of the deposition substrate. Another object of the present invention is to provide an evaporation source assembly capable of forming a thin film and a vapor deposition apparatus using the same.

  One aspect of the present invention for solving the technical problem is to provide an evaporation source assembly. The evaporation source assembly includes an outer housing sorted as at least two or more cells that are at least partially open. Each evaporation source is located inside each cell. In this case, a shield having a guide connected to the outer housing is provided on both sides of the opening of each cell, and an extension line of the guide is directed to the same point. Accordingly, the vapor deposition material discharged from each of the evaporation sources can be irradiated on the same surface of the deposition target substrate.

  Here, it is preferable that at least one of the evaporation sources is inclined at a predetermined angle with respect to the ground. In this case, it is more preferable that the evaporation source is such that the opening from which the vapor deposition material is discharged is directed to the same point on the deposition target substrate.

  The evaporation sources may have the same deposition material. Alternatively, at least one of the evaporation sources has a deposition material for forming a thin film on one surface of the deposition substrate, and at least one other evaporation source is different from the deposition material for inclusion in the thin film. May have an agent.

  In order to solve the technical problem, another aspect of the present invention provides an evaporation source assembly. The evaporation source assembly includes an outer housing that is at least partially opened and is classified as at least two cells. Each evaporation source is located inside each cell.

  Each of the evaporation sources includes a storage part in which a part similar to the opening direction of the cell is opened, a body connected to the opened part of the storage part, and a nozzle part having a through-hole penetrating the body. A housing surrounding the nozzle part and the storage part, and a heating part interposed between the housing and the nozzle part, and the through-hole forming the nozzle part has a predetermined opening with respect to the housing. It is tilted at an angle.

  Here, it is preferable that the through holes forming the nozzle portions of the respective evaporation sources are aligned with the same point on the evaporation target substrate.

  The outer housing may include a shield having a guide toward the deposition target substrate on both sides of the opening of each cell. In this case, it is preferable that at least one of the guides of the respective shields is inclined at a predetermined angle so that an extension line thereof is directed to the same point.

  In order to solve the technical problem, another aspect of the present invention provides a deposition apparatus including the evaporation source assembly.

  The present invention provides an evaporation source assembly that deposits with at least two evaporation sources, and the deposition material discharged from each of the evaporation sources is deposited on the same region of the deposition substrate, thereby achieving uniform roughness. A thin film having a uniform thickness can be formed.

  As a result, uniform characteristics can be obtained, and a more stable element can be manufactured.

  Hereinafter, an evaporation source assembly and a deposition apparatus using the same according to the present invention will be described in detail with reference to the drawings. The embodiments described below are provided as examples to enable those skilled in the art to fully understand the idea of the present invention. Therefore, the present invention is not limited to the embodiments described below, and may be embodied in other forms. In the drawings, the size and thickness of the device are sometimes exaggerated for convenience. Throughout the specification, the same reference numbers represent the same components.

  FIG. 2 is a view for explaining a vapor deposition apparatus according to an embodiment of the present invention.

  Referring to FIG. 2, the deposition apparatus 10 according to an embodiment of the present invention includes at least one chamber 20 that forms a body of the deposition apparatus 10 and at least one for spraying particles of a deposition material on one surface of the deposition substrate (S). The evaporation source assembly 30 has the evaporation source assembly 30 and the evaporation source assembly transfer means 40 capable of moving the evaporation source assembly 30 in a direction perpendicular to the ground.

  The inside of the chamber 20 is maintained in a vacuum state by a vacuum pump (not shown). An evaporation source assembly transfer means 40 capable of moving the evaporation source assembly 30 in a direction perpendicular to the ground is provided inside the chamber 20 to move the evaporation source assembly 30 in the vapor deposition direction.

  The transfer means 40 of the evaporation source assembly is a vertical transfer device suitable for use in the chamber 20 maintained in a vacuum, and can adjust the moving speed of the evaporation source assembly 30 according to process conditions.

  On the other hand, the deposition target substrate (S) positioned inside the chamber 20 is positioned in a substantially vertical direction for deposition of a deposition material.

  A mask pattern (M) for determining the shape of the vapor deposition material to be deposited is provided on the entire surface of the deposition substrate (S), that is, between the evaporation source assembly 30 and the deposition substrate (S). Accordingly, the vapor deposition material evaporated from the evaporation source 30 is deposited on the deposition target substrate (S) through the mask pattern (M) so that a thin film having a predetermined shape can be formed on the deposition target substrate (S).

  On the other hand, the evaporation source assembly 30 includes at least two evaporation sources, stores a deposition material to be deposited on the deposition target substrate (S) in the chamber 20, and heats the stored deposition material. After evaporation, the thin film can be formed on the deposition target substrate (S) by spraying it onto the deposition target substrate (S). Here, the deposition material is also an organic film forming material or an electrode forming material of the organic electroluminescence device.

  FIG. 3 is a perspective view of an evaporation source assembly 30 having two evaporation sources according to an embodiment of the present invention. Although this embodiment will be described with reference to an evaporation source assembly having two evaporation sources, the present invention is not limited thereto, and the evaporation source assembly may have three or more evaporation sources.

  Referring to FIG. 3, the evaporation source assembly 30 according to the embodiment of the present invention includes a first evaporation source 60 and a second evaporation source 70 in an outer housing 50.

  The external housing 50 is preferably a cooling plate as a support for supporting the evaporation sources 60 and 70 in order to prevent heat generated from the evaporation source from being conducted to the outside. Here, the cooling plate can cool the heat inside the evaporation source using a refrigerant.

  Here, the outer housing 50 includes a shield 80 including a guide 80a that guides a deposition direction of the deposition material to an inlet from which the deposition material is injected from the evaporation source. Accordingly, it is possible to prevent the deposition material released from the evaporation source from being reflected by the shield and contaminating the evaporation source assembly. In addition, in the case where the evaporation material can have a width that can be radiated and has at least two evaporation sources as in the present invention, a region for evaporation from the respective evaporation sources to the substrate is always present. As a result, a uniform thin film can be formed on the substrate, and a shadow effect can be reduced.

  Here, the shield 80 can be separated and replaced independently of the outer housing 50. In addition, the shield 80 is preferably made of a stainless steel material that is sanded so that it does not fall again after the deposition material adheres to the surface. Accordingly, it is possible to prevent the substance adsorbed on the shield from being dropped and deposited on the deposition target substrate during the deposition process.

  On the other hand, the first evaporation source 60 and the second evaporation source 70 may have the same deposition material, and a thin film having a uniform thickness can be formed on the deposition substrate while moving vertically. In particular, it is effective for the application of large substrates.

  On the other hand, the first evaporation source 60 and the second evaporation source 70 may have different vapor deposition materials. Therefore, since two deposition materials are mixed and deposited on the deposition substrate (S) during the deposition process, the thin film formed on the deposition substrate can have a uniform roughness. That is, the first evaporation source 60 is an evaporation source that injects a deposition material that forms a thin film on one surface of the deposition target substrate. In contrast, the second evaporation source 70 is an evaporation source in which an additive for improving the characteristics of the thin film is included in the thin film.

  As described above, in the evaporation source assembly having a plurality of evaporation sources, in order to form a uniform thin film, the evaporation material radiated from each evaporation source is guided to irradiate the same point of the evaporation target substrate. Is preferred. Thereby, a thin film having a uniform thickness and a uniform roughness can be formed.

  4 and 5 are cross-sectional views taken along the line II ′ of the evaporation source assembly of FIG. 3 according to an embodiment of the present invention, so that the deposition material is irradiated to the same point of the deposition substrate (S). It is a figure for demonstrating embodiment to guide. Here, although not shown in the figure, each of the evaporation sources stores a vapor deposition material, and injects the vapor deposition material by connecting a part of the storage part opened to the part of the storage part opened. A nozzle portion, a housing surrounding the nozzle portion and the storage portion, and a heating portion interposed between the nozzle portion and the housing.

  Referring to FIG. 4, in the evaporation source assembly of the present invention, the outer housing 50 is located, and the outer housing is divided into two cells each having an opening that is at least partially opened. The first evaporation source 60 is fixed by the support table 90, and the second evaporation source 70 is fixed by the support table 100 in the second cell 50b.

  The outer housing 50 includes a shield 80 having a guide 80a located in each cell. In this case, the guides 80a located in the respective cells are inclined at a predetermined angle with respect to the horizontal direction of the outer housing 50. The extension lines of the guides 80a located in the respective cells are connected to the deposition target substrate ( It is preferable to match with the same point of S). Accordingly, the vapor deposition materials discharged from the respective evaporation sources according to the guidance of the guide 80a can be deposited on the same region (a) of the deposition target substrate (S). In this case, the guide 80a is not inclined at a predetermined angle with respect to the horizontal direction of the outer housing, or even if the guide 80a is inclined, the extension lines of the guides 80a located in the respective cells do not match. If this is the case, the vapor deposition material cannot be deposited at the same point on the deposition target substrate (S), and a uniform thin film cannot be formed.

  In addition, the width of the deposition material discharged from the evaporation source can be controlled by adjusting the width between the guides 80a located in any one of the plurality of cells. Accordingly, it is possible to block the vapor deposition material discharged from the respective evaporation sources from being deposited on the area to be removed from the same area (a) of the deposition target substrate by the shield. Therefore, the vapor deposition material discharged from each of the evaporation sources can be more precisely deposited on the same region (a) of the deposition target substrate.

  The shield 80 can be separated and replaced independently of the outer housing 50. As a result, when the shield 80 is contaminated, it can be easily assembled and used again by being replaced or detached. Further, since the shield 80 can be easily separated and replaced, various forms can be used during alignment so that the vapor deposition material discharged from the respective evaporation sources is deposited on the same region of the deposition target substrate (S). It is possible to easily control while changing the shield 80 having.

  Here, the shield 80 is preferably made of a stainless steel material that is sanded so that it does not fall again after the deposition material adheres to the surface. Accordingly, during the vapor deposition process, it is possible to prevent the vapor deposition material from dropping from the shield 80 and being deposited on the deposition target substrate, thereby forming a uniform thin film.

  On the other hand, the first evaporation source 60 and the second evaporation source 70 may have the same deposition material, and a uniform thin film can be deposited on the substrate while moving vertically.

  Alternatively, the first evaporation source 60 and the second evaporation source 70 have different vapor deposition materials, and two vapor deposition materials are mixed and vapor deposited on the deposition target substrate (S) during the vapor deposition process. Can do. That is, the first evaporation source 60 is an evaporation source having an evaporation material for forming a thin film formed on one surface of the evaporation target substrate (S). In contrast, the second evaporation source 70 is an evaporation source having an additive to be included in the thin film in order to improve the properties of the thin film.

  The outer housing 50 is composed of a cooling plate for preventing the heat released from the evaporation source located inside using the refrigerant from being released to the outside.

  Further, as shown in FIG. 5, the deposition material emitted from the two evaporation sources is deposited on the same region of the deposition target substrate, and the angle of at least one of the two evaporation sources is adjusted. More preferably, the evaporation source is configured such that the opening from which the vapor deposition material is discharged is directed to the same point (a ′) of the substrate. This makes it easier to control the direction of the vapor deposition material released from the evaporation source.

  In this case, the angle of the evaporation source can be adjusted by the angle adjusting means. The angle adjusting means may use angle adjusting supports 90 and 100. If you look closely, the first evaporation source 60 is fixed to an angle adjustment support base 90 composed of a first support base 90a and a second support base 90b having different heights on both sides thereof, so that the first evaporation source is predetermined. The vapor deposition direction of the vapor deposition material discharged from the first evaporation source can be changed by adjusting the angle.

  Further, the second evaporation source 70 is fixed by an angle adjusting support base 100 composed of a first support base 100a and a second support base 100b having different heights on both sides thereof, whereby the second evaporation source is set at a predetermined angle. The vapor deposition direction of the vapor deposition material discharged from the second evaporation source can be changed by adjusting.

  Here, as described above, the angle of at least one evaporation source is adjusted, or the angle of two evaporation sources is adjusted so that the evaporation source is directed to the same point (a ′) of the deposition target substrate (S). As a result, the vapor deposition material released from each evaporation source can be more precisely deposited on the same region (a) of the deposition target substrate (S).

  FIG. 6 is a cross-sectional view taken along line II ′ of the evaporation source assembly of FIG. 3 according to another embodiment of the present invention, and guides the deposition material to irradiate the same point on the deposition target substrate (S). It is a figure for demonstrating a form. In this case, the present invention is limited to an evaporation source assembly including two cells and two evaporation sources in each cell. However, the evaporation source assembly includes three or more cells and a plurality of cells. It can have an evaporation source.

  Referring to FIG. 6, the evaporation source assembly of the present invention includes an outer housing 100 separated by a first cell 100a and a second cell 100b. A first evaporation source 200 is located in the first cell 100a, and a second evaporation source 300 is located in the second cell 100b.

  The evaporation sources 200 and 300 store a deposition material, and store portions 210 and 310 that are partially opened, and nozzles that eject the evaporated deposition material connected to the opened portions of the storage portions 210 and 310. Parts 220 and 320, housings 230 and 330 that surround the storage parts 210 and 310 and the nozzle parts 220 and 320, and heating that is interposed between the storage parts 210 and 310 and the housings 230 and 330. It has a structure having a part.

  The nozzles 220 and 320 spray the vapor deposition material particles evaporated from the storage unit 310 onto one surface of the deposition substrate (S) that is substantially upright, and the deposition material particles are sprayed onto the deposition substrate. (S) Plays the role of determining the form of vapor deposition and distribution on one surface.

  In this case, the nozzle portions 220 and 320 include bodies 221 and 321 constituting the nozzle portion and through holes 222 and 322 penetrating the body. Here, the vapor deposition material evaporated from the storage units 210 and 310 through the through holes 222 and 322 forming the nozzle unit is discharged toward the outside, that is, the deposition substrate (S). Here, the through holes 222 and 322 may be inclined at a predetermined angle with respect to the housings 230 and 330. In this case, the deposition direction of the deposition material released from the evaporation source can be adjusted by the inclination of the through hole. In this case, it is more preferable that the through holes 222 and 322 of the respective nozzle portions provided in the respective evaporation sources are directed to one point of the evaporation target substrate. Accordingly, it is possible to guide the deposition material released from each evaporation source to the deposition target substrate (S) so that it can be deposited in the same region (b), thereby forming a uniform thin film.

  Further, the nozzles 220 and 320 may be made of graphite having excellent thermal conductivity, or an equivalent thereof, but the material is not limited in the present invention. In addition, the nozzles 220 and 320 may be controlled so that the organic substances in the storage units 210 and 310 can be uniformly evaporated because the form of the deposited material particles can be adjusted according to the opened form. Can do.

  The storage units 210 and 310 generally include a crucible as a part for storing a deposition material to be deposited on the deposition substrate (S). The storage units 210 and 310 may be made of graphite having excellent thermal conductivity or an equivalent thereof, but the material is not limited in the present invention.

  In order to prevent a cluster type deposition material from flying from the storage units 210 and 310, the storage unit may further include an anti-jumping film located on an adjacent region of the opened surface of the storage unit or in the body of the nozzle unit. Can do.

  The housings 220 and 330 surround the storage unit 310 and isolate the storage unit 310 from the external environment.

  The heating units 240 and 340 are interposed between the storage units 210 and 310 and the housings 230 and 330 to heat the vapor deposition material stored in the storage unit 310.

  The evaporation sources 200 and 300 may further include internal heat reflecting plates 250 and 350 attached to the inner walls of the housings 230 and 330. The internal heat reflection plates 250 and 350 reflect heat generated by the heating units 240 and 340 to increase the thermal efficiency of the heating units 240 and 340.

  In addition, the evaporation sources 200 and 300 may further include heat blocking means 260 and 360 attached to the outer surfaces of the nozzle units 220 and 320. The heat blocking means 260 and 360 prevent heat from being released through the nozzle portions 220 and 320 and affecting the deposition target substrate (S).

  Here, the first evaporation source 200 and the second evaporation source 300 may have the same vapor deposition material, and deposit a uniform thin film on the deposition substrate (S) while moving vertically. Can do. Alternatively, the first evaporation source 200 and the second evaporation source 300 may have different deposition materials, and two deposition materials may be mixed and deposited on the deposition target substrate during the deposition process.

  Here, by further including a shield 270 having a guide located in the cell of each evaporation source, as described above, the evaporation direction and the evaporation width of the evaporation material discharged from each of the evaporation sources is adjusted, It can be guided more elaborately so that the deposition material can be deposited in the same area of the deposition substrate.

  As a result, the vapor deposition materials released from the respective evaporation sources are deposited in the same vapor deposition region (b) of the deposition target substrate through through holes inclined at a predetermined angle with respect to the horizontal direction of the housing. . In this case, a uniform thin film can be formed by moving the deposition target substrate or the evaporation source assembly.

  Although the foregoing has been described with reference to preferred embodiments of the invention, those skilled in the art will recognize that the invention may be practiced without departing from the spirit and scope of the invention as set forth in the appended claims. Various modifications and changes can be made to the invention.

  The present invention can be used in the manufacture of organic electroluminescent displays.

It is a figure for demonstrating the vapor deposition apparatus using several evaporation sources as a prior art. It is a figure for demonstrating the vapor deposition apparatus by embodiment of this invention. 1 is a perspective view of an evaporation source assembly having two evaporation sources according to an embodiment of the present invention; FIG. 4 is a cross-sectional view taken along the line II ′ of the evaporation source assembly of FIG. 3 according to an exemplary embodiment of the present invention to explain an embodiment in which a deposition material is guided to irradiate the same spot on a deposition target substrate. 4 is a cross-sectional view taken along the line II ′ of the evaporation source assembly of FIG. 3 according to an exemplary embodiment of the present invention to explain an embodiment in which a deposition material is guided to irradiate the same spot on a deposition target substrate. 3 is a cross-sectional view taken along the line II ′ of the evaporation source assembly of FIG. 3 according to another embodiment of the present invention to explain an embodiment in which a deposition material is guided to irradiate the same spot on a deposition target substrate. is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Deposition apparatus 20: Chamber 30: Evaporation source assembly 40: Evaporation source assembly transfer means 60, 200: 1st evaporation source 70, 300: 2nd evaporation source 80: Shield
90, 100: Angle adjustment support base 220, 320: Nozzle part 221, 321: Through hole

Claims (11)

An outer housing that is at least partially open and sorted by at least two cells;
Each evaporation source located inside each of the cells,
An evaporation source assembly, wherein the evaporation source assembly is located on both sides of the opening of each cell, is connected to the outer housing, includes a shield having a guide, and an extended line of the guide is directed to the same point.   The evaporation source assembly according to claim 1, wherein at least one of the evaporation sources is inclined at a predetermined angle with respect to the ground.   The evaporation source assembly according to claim 2, wherein the evaporation source has an opening through which a deposition material is discharged directed to the same point on the deposition target substrate.   The evaporation source assembly of claim 1, wherein the evaporation source comprises a similar deposition material.   At least one of the evaporation sources has a deposition material for forming a thin film formed on one surface of the deposition target substrate, and the other at least one evaporation source is different from the deposition material for inclusion in the thin film. The evaporation source assembly according to claim 1, further comprising an additive. An outer housing comprising at least two or more cells that are at least partially open;
Each evaporation source located inside each of the cells,
Each of the evaporation sources has a reservoir that is partially opened in the same direction as the cell opening;
A nozzle part comprising a body connected to the opened part of the storage part and a through hole penetrating the body;
A housing that surrounds the nozzle part and the storage part;
A heating part interposed between the housing and the nozzle part,
The evaporation source assembly according to claim 1, wherein the through hole forming the nozzle portion is inclined at a predetermined angle with respect to a horizontal direction of the housing.   The evaporation source assembly according to claim 6, wherein each of the through holes forming the nozzle portion of the evaporation source is directed to the same point on the deposition target substrate.   The evaporation source assembly according to claim 6, wherein the outer housing includes shields provided on both sides of the opening of each cell and provided with a guide toward the deposition target substrate.   9. The evaporation source assembly according to claim 8, wherein at least one of the guides of each shield is inclined at a predetermined angle such that an extension line thereof is directed to the same point.   At least one of the evaporation sources has a deposition material for forming a thin film on one surface of the substrate to be deposited, and at least one other evaporation source is an additive different from the deposition material for inclusion in the thin film. The evaporation source assembly according to claim 6, comprising:   A vapor deposition apparatus comprising the evaporation source assembly according to claim 1.