CN104404451A - Evaporation source and evaporation device - Google Patents
Evaporation source and evaporation device Download PDFInfo
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- CN104404451A CN104404451A CN201410784050.3A CN201410784050A CN104404451A CN 104404451 A CN104404451 A CN 104404451A CN 201410784050 A CN201410784050 A CN 201410784050A CN 104404451 A CN104404451 A CN 104404451A
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- vapor deposition
- deposition source
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- winding density
- length direction
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Abstract
The invention discloses an evaporation source and an evaporation device, wherein a heating element which is distributed in the length direction of the evaporation source is arranged in the evaporation source; the heating element comprises a plurality of heating parts which are connected in series; the thermal power of the heating parts, corresponding to both ends in the length direction, of the evaporation source is bigger than that of the heat part arranged at the middle position, in the length direction, of the evaporation source. According to the invention, the thermal power of the heating parts arranged at both ends of the evaporation source is bigger than the heating part arranged at the middle position, so that heat loss at the two ends of the evaporation source can be compensated, the temperature in the evaporation source can be distributed more uniformly, the consumption rate of an evaporation material is more uniform, the service cycle of the evaporation source is prolonged.
Description
Technical field
The present invention relates to display equipment manufacturing technology field, particularly relate to a kind of vapor deposition source and evaporation coating device.
Background technology
The vapor deposition source used in existing Organic Light Emitting Diode (OLED) evaporation coating device mainly contains point source and line source two kinds, point-type vapor deposition source due to volume little, be mainly used in experiment line and early stage volume production line, line style vapor deposition source, owing to can control the homogeneity of thickness preferably, is widely used.
At present, the distribution of the heater wire in line style vapor deposition source all adopts equally spaced mode, and as shown in fig. 1, the heater wire 12 in vapor deposition source 11 is with uniform density distribution.But along with the size of vapor deposition source 11 is done larger and larger, this mode can make its each spot temperature differ greatly.This is because the heat loss at vapor deposition source 11 two ends is larger than the heat loss in mid-way, therefore causes temperature distributing disproportionation even.In the line style vapor deposition source of big size, the difference of medium temperature and two ends temperature even can reach 30 DEG C-40 DEG C, and this for volume production, can shorten the life cycle of evaporation coating device by making the wear rate of deposition material uneven.
In order to reach the homogeneity of temperature distribution, existing a kind of solution arranges some heater wires at the other multi-parallel in the two ends of line style vapor deposition source, but this solution can increase risk and the complicacy of production management.
Summary of the invention
The object of the present invention is to provide a kind of vapor deposition source and evaporation coating device, to make the temperature distribution of vapor deposition source more even, thus extend the life cycle of vapor deposition source.
For solving the problems of the technologies described above, as first aspect of the present invention, a kind of vapor deposition source is provided, the heating member distributed along its length is provided with in described vapor deposition source, described heating member comprises the heating part of multiple series connection, and the thermal power corresponding to the heating part of the end positions of the length direction of described vapor deposition source is greater than the thermal power of the heating part in the mid-way of the length direction corresponding to described vapor deposition source.
Preferably, described heating part is coil, and the winding density corresponding to the coil of the end positions of described vapor deposition source is greater than the winding density of the coil in the mid-way corresponding to described vapor deposition source.
Preferably, the end positions of winding density from the mid-way of described vapor deposition source to described vapor deposition source of multiple described coil increases gradually.
Preferably, multiple described coil is about the centrosymmetry of the length direction of described vapor deposition source.
Preferably, be disposed with multiple coil from the center of the length direction of described vapor deposition source to any one end, and in adjacent two coils, the winding density near the coil of end is 1.5 times of the winding density by paracentral coil.
Preferably, be disposed with from the center of the length direction of described vapor deposition source to any one end the first coil, the second coil ..., N coil, wherein, N be greater than zero natural number, further, the winding density of described N coil is (N+1) × 0.5 times of the winding density of described first coil.
Preferably, multiple described coil is made by same conductive and forms integral structure.
Preferably, described vapor deposition source also comprises crucible, and described heating member is for heating described crucible, and described crucible is for placing deposition material.
As second aspect of the present invention, also provide a kind of evaporation coating device, described evaporation coating device comprises above-mentioned vapor deposition source provided by the present invention.
Preferably, described evaporation coating device also comprises the reflector be arranged on outside described vapor deposition source two ends, and the plane of reflection of described reflector is arranged towards described vapor deposition source.
The thermal power being arranged on the heating part of vapor deposition source end positions in the present invention is larger than the thermal power of the heating part being arranged on mid-way, therefore, it is possible to compensate the heat loss at vapor deposition source two ends, make the temperature distribution in vapor deposition source more even, thus make deposition material wear rate evenly, extend the life cycle of vapor deposition source.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for specification sheets, is used from explanation the present invention, but is not construed as limiting the invention with embodiment one below.
Fig. 1 is the schematic diagram of vapor deposition source in prior art;
Fig. 2 is one of schematic diagram of the vapor deposition source that the embodiment of the present invention provides;
Fig. 3 is the schematic diagram two of the vapor deposition source that the embodiment of the present invention provides.
In the accompanying drawings, 11: vapor deposition source of the prior art; 12: heater wire; 21: the vapor deposition source in the present invention; 22: heating member; 220: heating part; 23: reflector.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.Should be understood that, embodiment described herein, only for instruction and explanation of the present invention, is not limited to the present invention.
First the present invention provides a kind of vapor deposition source, as shown in Figure 2.Be provided with the heating member 22 distributed along its length in described vapor deposition source 21, heating member 22 comprises the heating part 220 of multiple series connection.Wherein, the thermal power of the heating part 220 in the mid-way of the length direction corresponding to vapor deposition source 21 is greater than corresponding to the thermal power of the heating part 220 of the end positions of the length direction of vapor deposition source 21.Such as in fig. 2, a, b, c represent the length of corresponding heating part 220 respectively.So, length is that the thermal power of the heating part 220 of a is greater than the thermal power that length is the heating part 220 of c.
The thermal power being arranged on the heating part 220 of vapor deposition source 21 end positions in the present invention is larger than the thermal power of the heating part 220 being arranged on mid-way, therefore, it is possible to compensate the heat loss at vapor deposition source 21 two ends, make the temperature distribution in vapor deposition source 21 more even, thus make deposition material wear rate evenly, the deposition material in mid-way in vapor deposition source 21 can not be caused to exhaust, and end positions deposition material also remains more situation, thus extend the life cycle of vapor deposition source 21.Further, the heating part 220 in the present invention is arranged in series, and compared with prior art, does not need to be arranged in parallel extra heating member at the two ends of vapor deposition source 21, can simplify the structure of vapor deposition source, be convenient to carry out management and control in process of production, reduces management and control risk and complicacy.
In the present invention, heating member 22 can be made up of resistance wire.Such as, heating member 22 can be the resistive heater that metallic substance is made, and the heat transfer efficiency of metal is higher, is well suited for the heating member 22 for the manufacture of vapor deposition source 21.
Particularly, heating part 220 is coil, that is, heating member 22 comprises the coil of multiple series connection.Winding density corresponding to the coil of the end positions of vapor deposition source 21 is greater than the winding density of the coil in the mid-way corresponding to vapor deposition source 21.Further, the end positions of winding density from the mid-way of vapor deposition source 21 to vapor deposition source 21 of multiple described coil increases gradually.
For Fig. 2, when heating part 220 is coil, a, b, c represent the length of each section of coil respectively.That is, length is the winding density that the winding density of the coil of a is greater than that length is the coil of b, and length is the winding density that the winding density of the coil of b is greater than that length is the coil of c.
Heating part 220 is set to coil be not only convenient to manufacture, and accurately can controls the winding density of every section of coil, thus accurately control the thermal power in different heating portion 220.
Further, multiple described coil is about the centrosymmetry of the length direction of vapor deposition source 21.As shown in Figure 2, the coil of length to be the coil of b and length be a is arranged in the coil zygomorphy that length is c.When using vapor deposition source 21 to heat, this being symmetrical arranged can make the distribution of its internal heat and temperature more even, the deposition material in mid-way in vapor deposition source 21 can not be caused to exhaust, and end positions deposition material also remains more situation, thus extend the life cycle of vapor deposition source 21.
Further, compared with prior art, the present invention, without the need to additionally increasing the quantity of heating member 22, only needs the winding density regulating each section of coil, can reach the object making homogeneous temperature distribution in vapor deposition source 21, reduce risk and the complicacy of production management.
As the first embodiment of the present invention, multiple coil is disposed with to any one end from the center of the length direction of vapor deposition source 21, further, in adjacent two coils, the winding density near the coil of end is 1.5 times of the winding density by paracentral coil.
As the second embodiment of the present invention, be disposed with from the center of the length direction of vapor deposition source 21 to any one end the first coil, the second coil ..., N coil, wherein, N be greater than zero natural number, further, the winding density of described N coil is (N+1) × 0.5 times of the winding density of described first coil.
That is, if the winding density that hypothesis is positioned at the first coil of center is 1, so the winding density of the second coil is 1.5, and the winding density of tertiary winding is 2, by that analogy.
It should be noted that, the present invention is not limited to above two kinds of embodiments.When carrying out evaporation process, comprehensively can determine the concrete winding density of each section of coil according to the boiling characteristics of the material of the concrete size of vapor deposition source 21, heating member 22 and material to be deposited, the difference of the temperature in vapor deposition source 21 end positions and mid-way can be controlled below 1% in theory.
In the present invention, multiple coil can be connected according to after respective winding density manufacture respectively, or multiple coil is made by same conductive and forms integral structure again, only need the winding density making corresponding position different.That is, heating member 22 in the present invention can be an overall coil, this coil is wound around more loose in the mid-way of vapor deposition source 21, be wound around closeer in the end positions of vapor deposition source 21, by adjusting the winding density of this coil at different positions, just can realize the even heat in vapor deposition source 21 is distributed.Multiple coil is made as the manufacturing process that integral structure can simplify heating member 22, is convenient to production management and control.
Further, vapor deposition source 21 also comprises crucible, and heating member 22 is for heating described crucible, and described crucible is for placing deposition material.Usually, deposition material is uniformly distributed along the length direction of vapor deposition source 21, therefore, when the temperature distribution in vapor deposition source 21 is more even, the wear rate of deposition material in each position can be made more even, thus make vapor deposition source 21 have longer life cycle.
Present invention also offers a kind of evaporation coating device, described evaporation coating device comprises above-mentioned vapor deposition source provided by the present invention.As mentioned above, evaporation coating device provided by the present invention due to heat and temperature distribution more even, therefore there is longer life cycle.
Preferably, as shown in Figure 3, described evaporation coating device also comprises the reflector 23 be arranged on outside vapor deposition source 21 two ends, and the plane of reflection of reflector 23 is arranged towards vapor deposition source 21.The partial heat scattered and disappeared in vapor deposition source 21 both sides can reflect back by reflector 23, to reduce the calorific loss of vapor deposition source 21 both sides, improves the homogeneity of temperature distribution in described evaporation coating device further.
Be understandable that, the illustrative embodiments that above embodiment is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a vapor deposition source, the heating member distributed along its length is provided with in described vapor deposition source, it is characterized in that, described heating member comprises the heating part of multiple series connection, and the thermal power corresponding to the heating part of the end positions of the length direction of described vapor deposition source is greater than the thermal power of the heating part in the mid-way of the length direction corresponding to described vapor deposition source.
2. vapor deposition source according to claim 1, is characterized in that, described heating part is coil, and the winding density corresponding to the coil of the end positions of described vapor deposition source is greater than the winding density of the coil in the mid-way corresponding to described vapor deposition source.
3. vapor deposition source according to claim 2, is characterized in that, the winding density of the multiple described coil end positions from the mid-way of described vapor deposition source to described vapor deposition source increases gradually.
4. vapor deposition source according to claim 3, is characterized in that, multiple described coil is about the centrosymmetry of the length direction of described vapor deposition source.
5. vapor deposition source according to claim 4, it is characterized in that, be disposed with multiple coil from the center of the length direction of described vapor deposition source to any one end, and, in adjacent two coils, the winding density near the coil of end is 1.5 times of the winding density by paracentral coil.
6. vapor deposition source according to claim 4, it is characterized in that, be disposed with from the center of the length direction of described vapor deposition source to any one end the first coil, the second coil ..., N coil, wherein, N be greater than zero natural number, further, the winding density of described N coil is (N+1) × 0.5 times of the winding density of described first coil.
7. vapor deposition source as claimed in any of claims 2 to 6, is characterized in that, multiple described coil is made by same conductive and forms integral structure.
8. vapor deposition source as claimed in any of claims 1 to 6, is characterized in that, described vapor deposition source also comprises crucible, and described heating member is for heating described crucible, and described crucible is for placing deposition material.
9. an evaporation coating device, is characterized in that, comprises the vapor deposition source in claim 1 to 8 described in any one.
10. evaporation coating device according to claim 9, is characterized in that, described evaporation coating device also comprises the reflector be arranged on outside described vapor deposition source two ends, and the plane of reflection of described reflector is arranged towards described vapor deposition source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410784050.3A CN104404451A (en) | 2014-12-16 | 2014-12-16 | Evaporation source and evaporation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410784050.3A CN104404451A (en) | 2014-12-16 | 2014-12-16 | Evaporation source and evaporation device |
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| CN104404451A true CN104404451A (en) | 2015-03-11 |
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| CN201410784050.3A Pending CN104404451A (en) | 2014-12-16 | 2014-12-16 | Evaporation source and evaporation device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105908129A (en) * | 2016-06-27 | 2016-08-31 | 京东方科技集团股份有限公司 | Organic material evaporation equipment and method |
| WO2017114367A1 (en) * | 2015-12-31 | 2017-07-06 | 中国建材国际工程集团有限公司 | Heater device for heating crucible, operation method therefor and crucible for containing and heating material to be evaporated or sublimated |
| CN108531866A (en) * | 2018-05-02 | 2018-09-14 | 昆山国显光电有限公司 | Linear evaporation source and vaporising device |
| CN109371367A (en) * | 2018-11-26 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Evaporation coating device |
| US20220178013A1 (en) * | 2018-08-28 | 2022-06-09 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Evaporation source |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004091858A (en) * | 2002-08-30 | 2004-03-25 | Toyota Industries Corp | Vacuum evaporation system and method for manufacturing evaporated film-applied product |
| CN1831185A (en) * | 2005-03-07 | 2006-09-13 | 三星Sdi株式会社 | Evaporate source module and vapor deposited apparatus using thereof |
| CN1924080A (en) * | 2005-08-30 | 2007-03-07 | 三星Sdi株式会社 | Heater and vapor deposition source having the same |
| CN1333104C (en) * | 2004-01-14 | 2007-08-22 | 应用材料股份有限两合公司 | Vaporization equipment for material sublimation |
| CN101990583A (en) * | 2008-04-11 | 2011-03-23 | 东芝三菱电机产业系统株式会社 | Heat equalizer |
| CN103849837A (en) * | 2014-03-24 | 2014-06-11 | 四川虹视显示技术有限公司 | Evaporation source device |
| JP2014189878A (en) * | 2013-03-28 | 2014-10-06 | Hitachi High-Technologies Corp | Vapor deposition apparatus |
| CN104178734A (en) * | 2014-07-21 | 2014-12-03 | 京东方科技集团股份有限公司 | Evaporation coating device |
-
2014
- 2014-12-16 CN CN201410784050.3A patent/CN104404451A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004091858A (en) * | 2002-08-30 | 2004-03-25 | Toyota Industries Corp | Vacuum evaporation system and method for manufacturing evaporated film-applied product |
| CN1333104C (en) * | 2004-01-14 | 2007-08-22 | 应用材料股份有限两合公司 | Vaporization equipment for material sublimation |
| CN1831185A (en) * | 2005-03-07 | 2006-09-13 | 三星Sdi株式会社 | Evaporate source module and vapor deposited apparatus using thereof |
| CN1924080A (en) * | 2005-08-30 | 2007-03-07 | 三星Sdi株式会社 | Heater and vapor deposition source having the same |
| CN101990583A (en) * | 2008-04-11 | 2011-03-23 | 东芝三菱电机产业系统株式会社 | Heat equalizer |
| JP2014189878A (en) * | 2013-03-28 | 2014-10-06 | Hitachi High-Technologies Corp | Vapor deposition apparatus |
| CN103849837A (en) * | 2014-03-24 | 2014-06-11 | 四川虹视显示技术有限公司 | Evaporation source device |
| CN104178734A (en) * | 2014-07-21 | 2014-12-03 | 京东方科技集团股份有限公司 | Evaporation coating device |
Non-Patent Citations (1)
| Title |
|---|
| 谷智等: "《材料制备原理与技术》", 31 December 2013 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017114367A1 (en) * | 2015-12-31 | 2017-07-06 | 中国建材国际工程集团有限公司 | Heater device for heating crucible, operation method therefor and crucible for containing and heating material to be evaporated or sublimated |
| EP3399068A4 (en) * | 2015-12-31 | 2019-12-04 | China Triumpf International Engineering Co. Ltd. | Heater device for heating crucible, operation method therefor and crucible for containing and heating material to be evaporated or sublimated |
| CN105908129A (en) * | 2016-06-27 | 2016-08-31 | 京东方科技集团股份有限公司 | Organic material evaporation equipment and method |
| CN108531866A (en) * | 2018-05-02 | 2018-09-14 | 昆山国显光电有限公司 | Linear evaporation source and vaporising device |
| US20220178013A1 (en) * | 2018-08-28 | 2022-06-09 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Evaporation source |
| CN109371367A (en) * | 2018-11-26 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Evaporation coating device |
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Application publication date: 20150311 |
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