WO2020013046A1 - Jauge de contrainte, module de capteur et mécanisme de palier - Google Patents

Jauge de contrainte, module de capteur et mécanisme de palier Download PDF

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Publication number
WO2020013046A1
WO2020013046A1 PCT/JP2019/026450 JP2019026450W WO2020013046A1 WO 2020013046 A1 WO2020013046 A1 WO 2020013046A1 JP 2019026450 W JP2019026450 W JP 2019026450W WO 2020013046 A1 WO2020013046 A1 WO 2020013046A1
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WIPO (PCT)
Prior art keywords
strain gauge
resistance
resistor
sensor module
pair
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PCT/JP2019/026450
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English (en)
Japanese (ja)
Inventor
英司 美齊津
重之 足立
寿昭 浅川
厚 北村
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ミネベアミツミ株式会社
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Publication of WO2020013046A1 publication Critical patent/WO2020013046A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C19/00—Bearings with rolling contact, for exclusively rotary movement
    • F16C19/52—Bearings with rolling contact, for exclusively rotary movement with devices affected by abnormal or undesired conditions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C41/00—Other accessories, e.g. devices integrated in the bearing not relating to the bearing function as such
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

Definitions

  • the present invention relates to a strain gauge, a sensor module, and a bearing mechanism.
  • strain gauges that are attached to an object to be measured and detect strain of the object to be measured are known.
  • the strain gauge includes a resistor for detecting strain, and the resistor is formed on a base made of, for example, an insulating resin.
  • the present invention has been made in view of the above points, and has as its object to provide a strain gauge that can accurately detect strains in a plurality of directions.
  • the strain gauge has a flexible base material and a plurality of resistance portions formed linearly on one side of the base material, and each of the resistance portions intersects on the same plane. Are electrically connected to each other.
  • FIG. 2 is a plan view illustrating a strain gauge according to the first embodiment. It is a sectional view (the 1) which illustrates the strain gauge concerning a 1st embodiment.
  • FIG. 2 is a cross-sectional view (part 2) illustrating the strain gauge according to the first embodiment.
  • FIG. 9 is a schematic view illustrating a sensor module according to a second embodiment.
  • FIG. 9 is a schematic view illustrating a method for using the sensor module according to the second embodiment. It is a top view which illustrates the strain gauge concerning a 3rd embodiment.
  • FIG. 14 is a schematic view illustrating a sensor module according to a fourth embodiment. It is a perspective view which illustrates the bearing mechanism concerning 5th Embodiment. It is sectional drawing which illustrates the bearing mechanism which concerns on 5th Embodiment.
  • FIG. 1 is a plan view illustrating a strain gauge according to the first embodiment.
  • FIG. 2 is a cross-sectional view illustrating the strain gauge according to the first embodiment, and shows a cross section taken along line AA in FIG.
  • the strain gauge 1 has a base material 10, a resistor 30 (resistors 31 and 32), and terminals 41, 42, 43 and 44.
  • the side of the substrate 10 where the resistor 30 is provided is on the upper side or one side, and the side where the resistor 30 is not provided is the lower side or the other side. Side.
  • the surface of each part on which the resistor 30 is provided is defined as one surface or upper surface, and the surface on which the resistor 30 is not provided is defined as the other surface or lower surface.
  • the strain gauge 1 can be used upside down, or can be arranged at any angle.
  • the plan view refers to viewing the target from the normal direction of the upper surface 10a of the base material 10
  • the planar shape refers to the shape of the target viewed from the normal direction of the upper surface 10a of the base material 10.
  • the base material 10 is an insulating member serving as a base layer for forming the resistor 30 and the like, and has flexibility.
  • the thickness of the base material 10 is not particularly limited and can be appropriately selected depending on the purpose. For example, the thickness can be about 5 ⁇ m to 500 ⁇ m. In particular, it is preferable that the thickness of the base material 10 be 5 ⁇ m to 200 ⁇ m, since the strain sensitivity error of the resistor 30 can be reduced.
  • the substrate 10 is made of, for example, PI (polyimide) resin, epoxy resin, PEEK (polyetheretherketone) resin, PEN (polyethylene naphthalate) resin, PET (polyethylene terephthalate) resin, PPS (polyphenylene sulfide) resin, polyolefin resin, and the like. From an insulating resin film. Note that a film refers to a member having a thickness of about 500 ⁇ m or less and having flexibility.
  • the substrate 10 may be formed from, for example, an insulating resin film containing a filler such as silica or alumina.
  • the base material 10 is made of SiO 2 , ZrO 2 (including YSZ), Si, Si 2 N 3 , and Al 2 O 3 (including sapphire). , ZnO, and perovskite ceramics (CaTiO 3 , BaTiO 3 ).
  • the resistor 30 is a thin film formed on the base material 10 in a predetermined pattern, and is a sensing part that undergoes a strain and undergoes a resistance change.
  • the resistor 30 may be formed directly on the upper surface 10a of the substrate 10 or may be formed on the upper surface 10a of the substrate 10 via another layer.
  • the resistor 30 includes the resistance portions 31 and 32. That is, the resistor 30 is a general term for the resistor portions 31 and 32, and is referred to as the resistor 30 when it is not necessary to particularly distinguish the resistor portions 31 and 32. In FIG. 1, for convenience, the resistance portions 31 and 32 are shown in a satin pattern.
  • the resistance portion 31 is a thin film formed on the upper surface 10a of the base material 10 in a straight line with the longitudinal direction directed in the X direction.
  • the resistance part 32 is a thin film formed linearly with the longitudinal direction directed in the Y direction.
  • the resistance part 31 and the resistance part 32 are electrically connected to each other at right angles on the same plane.
  • the resistance part 31 and the resistance part 32 can be patterned so as to intersect at a substantially central part in each longitudinal direction, for example.
  • the resistor 30 can be formed of, for example, a material containing Cr (chromium), a material containing Ni (nickel), or a material containing both Cr and Ni. That is, the resistor 30 can be formed from a material containing at least one of Cr and Ni.
  • a material containing Cr for example, a Cr mixed-phase film is given.
  • a material containing Ni for example, Cu—Ni (copper nickel) is given.
  • Ni—Cr nickel chrome
  • the Cr mixed phase film is a film in which Cr, CrN, Cr 2 N and the like are mixed.
  • the Cr mixed phase film may contain unavoidable impurities such as chromium oxide.
  • the thickness of the resistor 30 is not particularly limited and can be appropriately selected depending on the purpose.
  • the thickness can be about 0.05 ⁇ m to 2 ⁇ m.
  • the thickness of the resistor 30 be 0.1 ⁇ m or more, since the crystallinity of the crystal constituting the resistor 30 (for example, the crystallinity of ⁇ -Cr) is improved.
  • the thickness of the resistor 30 be 1 ⁇ m or less, since cracks in the film and warpage from the substrate 10 due to internal stress of the film constituting the resistor 30 can be reduced.
  • the width of the resistor 30 is not particularly limited and can be appropriately selected depending on the purpose. For example, the width can be about 0.1 ⁇ m to 1000 ⁇ m (1 mm).
  • the stability of the gauge characteristics can be improved by using ⁇ -Cr (alpha chromium), which is a stable crystal phase, as a main component.
  • ⁇ -Cr alpha chromium
  • the gauge factor of the strain gauge 1 is 10 or more, and the gauge factor temperature coefficient TCS and the resistance temperature coefficient TCR are within the range of ⁇ 1000 ppm / ° C. to +1000 ppm / ° C. It can be.
  • the main component means that the target substance occupies 50% by mass or more of all the substances constituting the resistor.
  • the resistor 30 contains ⁇ -Cr at 80% by weight. It is preferable to include the above.
  • ⁇ -Cr is Cr having a bcc structure (body-centered cubic lattice structure).
  • the terminal portion 41 extends from one end of the resistor portion 31 and is formed in a substantially circular shape with a wider width than the resistor portion 31 in plan view.
  • the terminal portion 43 extends from the other end of the resistor portion 31 and is formed in a substantially circular shape with a wider width than the resistor portion 31 in a plan view.
  • the terminal portions 41 and 43 are a pair of electrodes for outputting a change in the resistance value of the resistance portion 31 caused by the strain to the outside, and for example, a flexible substrate for external connection, a lead wire, or the like is joined.
  • the upper surfaces of the terminal portions 41 and 43 may be covered with a metal having better solderability than the terminal portions 41 and 43.
  • the resistance part 31 and the terminal parts 41 and 43 are represented by different reference numerals for convenience, they can be integrally formed of the same material in the same step.
  • the planar shape of the terminal portions 41 and 43 is not limited to a circular shape, and may be a rectangular shape or the like.
  • the terminal portion 42 extends from one end of the resistor portion 32, and is formed in a substantially circular shape with a wider width than the resistor portion 32 in a plan view.
  • the terminal portion 44 extends from the other end of the resistor portion 32, and is formed in a substantially circular shape with a wider width than the resistor portion 32 in a plan view.
  • the terminal portions 42 and 44 are a pair of electrodes for outputting a change in the resistance value of the resistance portion 32 caused by the strain to the outside, and for example, a flexible board for external connection, a lead wire, or the like is joined.
  • the upper surfaces of the terminal portions 42 and 44 may be covered with a metal having better solderability than the terminal portions 42 and 44.
  • the resistance part 32 and the terminal parts 42 and 44 are represented by different reference numerals for convenience, they can be integrally formed of the same material in the same step.
  • the planar shape of the terminal portions 42 and 44 is not limited to a circular shape, but may be a rectangular shape or the like.
  • a cover layer 60 (insulating resin layer) may be provided on the upper surface 10a of the base material 10 so as to cover the resistor 30 and expose the terminal portions 41 to 44.
  • the provision of the cover layer 60 can prevent the resistor 30 from being mechanically damaged. Further, by providing the cover layer 60, the resistor 30 can be protected from moisture and the like. Note that the cover layer 60 may be provided so as to cover the entire portion except for the terminal portions 41 to 44.
  • the cover layer 60 can be formed from, for example, an insulating resin such as a PI resin, an epoxy resin, a PEEK resin, a PEN resin, a PET resin, a PPS resin, and a composite resin (for example, a silicone resin or a polyolefin resin).
  • the cover layer 60 may contain a filler or a pigment.
  • the thickness of the cover layer 60 is not particularly limited and can be appropriately selected depending on the purpose. For example, the thickness can be about 2 ⁇ m to 30 ⁇ m.
  • the resistance section 31 can detect the strain in the X direction as a change in the resistance value, and output the change from the terminal sections 41 and 43, which are a pair of electrodes. Further, the resistance section 32 can detect the strain in the Y direction as a change in the resistance value and output the change from the terminal sections 42 and 44 which are a pair of electrodes.
  • the resistance part 31 and the resistance part 32 are orthogonal to each other on the same plane as shown in FIG. 1, and the resistance part 31 and the resistance part 32 are formed linearly and are on the same plane. It is only necessary to cross at. In this case, the resistance part 31 and the resistance part 32 can detect the respective strains in the longitudinal direction.
  • the resistance part 31 can be formed linearly with the longitudinal direction directed in the X direction
  • the resistance part 32 can be formed linearly with the longitudinal direction inclined at 45 degrees to the X direction.
  • the strain in the direction different from the longitudinal direction of the resistance parts 31 and 32 can be calculated.
  • the base material 10 is prepared, and the planar resistor 30 and the terminal portions 41 to 44 shown in FIG. 1 are formed on the upper surface 10a of the base material 10.
  • the materials and thicknesses of the resistor 30 and the terminals 41 to 44 are as described above.
  • the resistor 30 and the terminal portions 41 to 44 can be integrally formed of the same material.
  • the resistor 30 and the terminal portions 41 to 44 can be formed by, for example, forming a film by a magnetron sputtering method using a material capable of forming the resistor 30 and the terminal portions 41 to 44 as a target, and patterning the film by photolithography.
  • the resistor 30 and the terminal portions 41 to 44 may be formed by a reactive sputtering method, an evaporation method, an arc ion plating method, a pulse laser deposition method, or the like instead of the magnetron sputtering method.
  • a film thickness of about 1 nm to 100 nm is formed on the upper surface 10a of the base material 10 by, for example, a conventional sputtering method. It is preferable to form the functional layer by vacuum deposition. After forming the resistor 30 and the terminals 41 to 44 on the entire upper surface of the functional layer, the functional layer is patterned by photolithography together with the resistor 30 and the terminals 41 to 44 into the planar shape shown in FIG.
  • the functional layer refers to a layer having a function of promoting crystal growth of at least the upper layer of the resistor 30.
  • the functional layer preferably further has a function of preventing the resistor 30 from being oxidized by oxygen or moisture contained in the substrate 10 and a function of improving the adhesion between the substrate 10 and the resistor 30.
  • the functional layer may further have another function.
  • the insulating resin film constituting the base material 10 contains oxygen and moisture, especially when the resistor 30 contains Cr, Cr forms a self-oxidized film, so that the functional layer has a function of preventing oxidation of the resistor 30. Providing is effective.
  • the material of the functional layer is not particularly limited as long as it has a function of promoting the crystal growth of the resistor 30 as the upper layer, and can be appropriately selected depending on the purpose.
  • Cr chromium
  • Ti Titanium
  • V vanadium
  • Nb niobium
  • Ta tantalum
  • Ni nickel
  • Y yttrium
  • Zr zirconium
  • Hf hafnium
  • Si silicon
  • C carbon
  • Zn Zinc
  • Cu copper
  • Bi bismuth
  • Fe iron
  • Mo mobdenum
  • W tungsten
  • Ru ruthenium
  • Rh Rhodium
  • Re rhenium
  • Os osmium
  • Ir Selected from the group consisting of iridium), Pt (platinum), Pd (palladium), Ag (silver), Au (gold), Co (cobalt), Mn (manganese), and Al (aluminum)
  • iridium platinum
  • Pt platinum
  • Examples of the above alloy include FeCr, TiAl, FeNi, NiCr, CrCu and the like.
  • Examples of the above compound include TiN, TaN, Si 3 N 4 , TiO 2 , Ta 2 O 5 , and SiO 2 .
  • the functional layer can be formed, for example, by a conventional sputtering method using a material capable of forming the functional layer as a target and introducing an Ar (argon) gas into the chamber.
  • Ar argon
  • the functional layer is formed while the upper surface 10a of the substrate 10 is etched with Ar, so that the effect of improving the adhesion can be obtained by minimizing the amount of the functional layer formed.
  • the functional layer may be formed by another method.
  • the upper surface 10a of the base material 10 is activated by plasma treatment using Ar or the like to obtain an adhesion improving effect, and thereafter, the functional layer is formed into a vacuum by a magnetron sputtering method. May be used.
  • the combination of the material of the functional layer and the material of the resistor 30 and the terminals 41 to 44 is not particularly limited and can be appropriately selected depending on the purpose.
  • the resistor 30 and the terminal portions 41 to 44 can be formed by a magnetron sputtering method using a raw material capable of forming a Cr mixed phase film as a target and introducing an Ar gas into the chamber.
  • the resistor 30 and the terminal portions 41 to 44 may be formed by a reactive sputtering method by introducing an appropriate amount of nitrogen gas together with Ar gas into a chamber using pure Cr as a target.
  • the growth surface of the Cr mixed phase film is defined by the functional layer made of Ti, and a Cr mixed phase film having ⁇ -Cr as a main component, which has a stable crystal structure, can be formed.
  • the gauge characteristics are improved by diffusing Ti constituting the functional layer into the Cr mixed phase film.
  • the gauge factor of the strain gauge 1 can be 10 or more, and the gauge factor temperature coefficient TCS and the resistance temperature coefficient TCR can be in the range of ⁇ 1000 ppm / ° C. to +1000 ppm / ° C.
  • the Cr mixed phase film may include Ti or TiN (titanium nitride).
  • the functional layer made of Ti has a function of promoting the crystal growth of the resistor 30 and a function of preventing the resistor 30 from being oxidized by oxygen or moisture contained in the base material 10. , And all the functions of improving the adhesion between the substrate 10 and the resistor 30.
  • Ta, Si, Al, or Fe is used instead of Ti as the functional layer.
  • the crystal growth of the resistor 30 can be promoted, and the resistor 30 having a stable crystal phase can be manufactured.
  • the stability of the gauge characteristics can be improved.
  • the material constituting the functional layer diffuses into the resistor 30, the gauge characteristics of the strain gauge 1 can be improved.
  • a cover layer 60 that covers the resistor 30 and exposes the terminal portions 41 to 44 is provided on the upper surface 10a of the base material 10, so that the strain gauge 1 Is completed.
  • the cover layer 60 is formed, for example, by laminating a thermosetting insulating resin film in a semi-cured state on the upper surface 10a of the base material 10 so as to cover the resistor 30 and expose the terminal portions 41 to 44, and then cure by heating. It can be made by making.
  • the cover layer 60 is formed by applying a liquid or paste-like thermosetting insulating resin to the upper surface 10a of the base material 10 so as to cover the resistor 30 and expose the terminal portions 41 to 44, and then heat to cure the resin. It may be produced.
  • the strain gauge 1 has a cross-sectional shape shown in FIG.
  • the layer indicated by reference numeral 20 is a functional layer.
  • the plane shape of the strain gauge 1 when the functional layer 20 is provided is the same as that in FIG.
  • the resistance portions 31 and 32 are each formed in a straight line, intersect on the same plane, and are mutually conductive.
  • the strain gauge 1 can realize a multiaxial gauge capable of detecting strain in two directions.
  • strain gauge 1 when detecting strain in two directions, for example, two strain gauges are manufactured and both are stacked so that their grid directions cross each other. The measurement error occurred due to the difference in the position of the strain gauges in the stacking direction.
  • the strain gauge 1 since the resistance portions 31 and 32 are simultaneously patterned on the same surface, the manufacturing process can be simplified, and a measurement error due to a displacement or the like can be suppressed.
  • the size can be reduced as compared with a structure in which a plurality of strain gauges are attached. As a result, it can be easily attached to a desired measurement position.
  • the sensitivity of the resistance value to the strain is greater than when the resistor 30 is formed of Cu—Ni or Ni—Cr. (The amount of change in the resistance value of the resistor 30 for the same strain) is greatly improved.
  • the sensitivity of the resistance value to the strain is about 5 to 10 times that in the case where the resistor 30 is formed of Cu—Ni or Ni—Cr. . Therefore, by forming the resistor 30 from a Cr mixed-phase film, it is possible to accurately detect distortion.
  • FIG. 4 is a schematic view illustrating the sensor module according to the second embodiment.
  • the strain gauge 1 (see FIGS. 1 and 2) is simplified, and only the terminals 41 to 44 are shown.
  • the sensor module 5 includes a strain gauge 1 and a selection circuit 2.
  • the selection circuit 2 includes, for example, switches SW 1 and SW 2 , input terminals I 1 to I 4 , output terminals O 1 and O 2 , a control terminal CNT, and power supply terminals VDD and VSS (positive terminal and negative terminal).
  • An IC having the following.
  • the power supply terminals VDD and VSS are supplied with power of a predetermined voltage from outside the sensor module 5.
  • the control terminal CNT and the output terminals O 1 and O 2 can be electrically connected to the outside of the sensor module 5.
  • the selection circuit 2 can be mounted on the upper surface 10a side or the lower surface 10b side of the base material 10 of the strain gauge 1, for example.
  • the input terminals I 1 and I 3 are connected to terminal portions 41 and 43 which are a pair of electrodes of the resistance portion 31.
  • the input terminals I 2 and I 4 are connected to terminal portions 42 and 44 which are a pair of electrodes of the resistance portion 32.
  • Switches SW 1 and SW 2 is a switch that is switched in conjunction in accordance with the H / L signal externally input to the control terminal CNT.
  • SW 1 connects the input terminal I 1 and the output terminal O 1
  • SW 2 connects the input terminal I 3 and the output terminal O 2 ( FIG. 4).
  • the output terminals O 1 and O 2 are connected to the terminal portions 41 and 43 which are a pair of electrodes of the resistance portion 31, and the resistance value of the resistance portion 31 can be measured via the output terminals O 1 and O 2.
  • SW 1 when the L signal is input from the outside to the control terminal CNT, SW 1 is connected to an input terminal I 2 and the output terminal O 1, SW 2 connects the input terminal I 4 and output terminal O 2.
  • the output terminals O 1 and O 2 are connected to the terminals 42 and 44 which are a pair of electrodes of the resistor 32, and the resistance of the resistor 32 can be measured via the output terminals O 1 and O 2.
  • FIG. 5 is a schematic view illustrating a method for using the sensor module according to the second embodiment.
  • the sensor module 5 can be connected to a measurement unit 7 arranged outside the sensor module 5.
  • the measuring unit 7 includes a bridge circuit 71, an analog front end unit 72, and a control unit 73.
  • the bridge circuit 71 includes fixed resistances R 1 , R 2 , and R 3 on three sides, and the other side is connected to output terminals O 1 and O 2 of the selection circuit 2 of the sensor module 5.
  • a DC voltage V is applied between a pair of diagonal points of the bridge circuit 71. With this configuration, an analog voltage corresponding to the distortion of the resistor 31 or 32 selected by the selection circuit 2 is output between the other pair of diagonal points of the bridge circuit 71.
  • the voltage output from the bridge circuit 71 is input to the analog front end unit 72.
  • connection between the strain gauge 1 and the bridge circuit 71 is a one-gauge two-wire system, but is not limited to this.
  • the analog front-end unit 72 includes, for example, an amplifier, an analog / digital conversion circuit (A / D conversion circuit), an external communication function (for example, a serial communication function such as I 2 C).
  • the analog front end unit 72 may include a temperature compensation circuit.
  • the analog front end unit 72 may be formed as an IC, or may be formed of individual components.
  • the voltage output from the bridge circuit 71 is amplified by an amplifier, converted to a digital signal by an A / D conversion circuit, and output.
  • the analog front end unit 72 includes a temperature compensation circuit, a temperature-compensated digital signal is output.
  • Control unit 73 receives the H signal or L signal to the control terminal CNT of the selection circuit 2 of the sensor module 5, it is possible to switch the switch SW 1 and SW 2.
  • the control unit 73 can be configured to include, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a main memory, and the like.
  • control unit 73 can be realized by reading a program recorded in a ROM or the like into the main memory and executing the program by the CPU.
  • part or all of the control unit 73 may be realized only by hardware.
  • control unit 73 may be physically constituted by a plurality of devices or the like.
  • the H signal or the L signal is input from the outside to the control terminal CNT of the selection circuit 2 of the sensor module 5, it is possible to switch the switch SW 1 and SW 2 of the selection circuit 2.
  • the resistance value of the resistance part 31 and the resistance value of the resistance part 32 of the strain gauge 1 can be selectively measured. That is, the strain in the X direction and the strain in the Y direction can be selectively measured.
  • ⁇ Third embodiment> an example of a strain gauge in which the direction of strain detection is increased compared to the first embodiment will be described.
  • the description of the same components as those in the above-described embodiment may be omitted.
  • FIG. 6 is a plan view illustrating a strain gauge according to the third embodiment.
  • the sectional shape of the strain gauge according to the third embodiment is the same as that of FIG. Referring to FIG. 6, strain gauge 1A is different from strain gauge 1 (see FIGS. 1 and 2) in that the number of pairs of a resistor and a pair of terminals is increased from two to four. That is, the strain gauge 1A is a multiaxial gauge capable of detecting strain in four directions.
  • the resistor 30A is a thin film formed in a predetermined pattern on the base material 10, and is a sensing portion that undergoes a strain and undergoes a resistance change.
  • the resistor 30A may be formed directly on the upper surface 10a of the substrate 10, or may be formed on the upper surface 10a of the substrate 10 via another layer.
  • the material, thickness, manufacturing method, and the like of the resistor 30A can be the same as those of the resistor 30.
  • the resistor 30A includes the resistor portions 31, 32, 33, and. That is, the resistor 30A is a general term for the resistors 31, 32, 33, and 34, and is referred to as the resistor 30A unless it is necessary to particularly distinguish the resistors 31, 32, 33, and 34. In FIG. 6, 31, 32, 33, and 34 are shown in a satin pattern for convenience.
  • the resistance portion 31 is a thin film formed on the upper surface 10a of the base material 10 in a straight line with the longitudinal direction directed in the X direction.
  • the resistance part 32 is a thin film formed linearly with the longitudinal direction directed in the Y direction.
  • Resistor 33, the upper surface 10a of the substrate 10, the longitudinal angle theta 1 with the X direction is a thin film formed in a linear shape in a direction to be -45 degrees.
  • Resistor 34, the upper surface 10a of the substrate 10, the longitudinal angle theta 2 between the X-direction is a thin film formed in a linear shape in a direction to be +45 degrees.
  • the counterclockwise direction is defined as a positive angle.
  • the resistance portions 31, 32, 33, and 34 cross each other on the same plane and are electrically connected to each other.
  • the resistance portions 31, 32, 33, and 34 can be patterned, for example, so as to intersect at a substantially central portion in each longitudinal direction. That is, the resistance portions 31, 32, 33, and 34 are each formed in a straight line, cross each other on the same plane, and are electrically connected to each other, and the angle between adjacent resistance portions is 45 degrees.
  • the terminal portion 45 extends from one end of the resistor portion 33 and is formed in a substantially circular shape with a wider width than the resistor portion 33 in a plan view.
  • the terminal portion 47 extends from the other end of the resistor portion 33 and is formed in a substantially circular shape with a wider width than the resistor portion 33 in a plan view.
  • the terminal portions 45 and 47 are a pair of electrodes for outputting a change in the resistance value of the resistance portion 33 caused by the strain to the outside, and for example, a flexible board or a lead wire for external connection is joined.
  • the upper surfaces of the terminal portions 45 and 47 may be covered with a metal having better solderability than the terminal portions 45 and 47.
  • the resistor 33 and the terminals 45 and 47 have different reference numerals for convenience, they can be integrally formed of the same material in the same step.
  • the planar shape of the terminal portions 45 and 47 is not limited to a circular shape, but may be a rectangular shape or the like.
  • the terminal portion 46 extends from one end of the resistor portion 34, and is formed in a substantially circular shape with a wider width than the resistor portion 34 in plan view.
  • the terminal portion 48 extends from the other end of the resistor portion 34, and is formed in a substantially circular shape with a wider width than the resistor portion 34 in a plan view.
  • the terminal portions 46 and 48 are a pair of electrodes for outputting a change in the resistance value of the resistance portion 34 caused by the strain to the outside, and for example, a flexible board or a lead wire for external connection is joined.
  • the upper surfaces of the terminal portions 46 and 48 may be covered with a metal having better solderability than the terminal portions 46 and 48.
  • the resistor 34 and the terminals 46 and 48 have different reference numerals for convenience, they can be integrally formed of the same material in the same step.
  • the planar shape of the terminal portions 46 and 48 is not limited to a circular shape, but may be a rectangular shape or the like.
  • a cover layer 60 (insulating resin layer) may be provided on the upper surface 10a of the base material 10 so as to cover the resistor 30A and expose the terminal portions 41 to 48.
  • the cover layer 60 By providing the cover layer 60, it is possible to prevent the resistor 30A from being mechanically damaged. Further, by providing the cover layer 60, the resistor 30A can be protected from moisture and the like. Note that the cover layer 60 may be provided so as to cover the entire portion except for the terminal portions 41 to 48.
  • the resistance section 31 can detect the strain in the X direction as a change in the resistance value and output it from the terminal sections 41 and 43 that are a pair of electrodes. Further, the resistance section 32 can detect the strain in the Y direction as a change in the resistance value and output the change from the terminal sections 42 and 44 which are a pair of electrodes.
  • the resistor unit 33 can detect the strain in the direction forming angle theta 1 with the X direction is -45 ° as a change in resistance value, and outputs from the terminals 45 and 47 are a pair of electrodes.
  • the resistor 34 may be an angle theta 2 between the X direction is detected as a change in resistance strain direction the +45 degrees and output from the terminal unit 46 and 48 is a pair of electrodes.
  • the resistance portions 31, 32, 33, and 34 are each formed in a straight line, intersect on the same plane, and are electrically connected to each other, and form an angle between the adjacent resistance portions. Is 45 degrees. Accordingly, by sequentially connecting the resistance units 31, 32, 33, and 34 to the bridge circuit, the resistance units 31, 32, 33, and 34 are changed based on the change in the resistance value of the resistance units 31, 32, 33, and 34. And 34 can be detected in the longitudinal direction. Further, the magnitude and direction of the main strain can be known by calculation based on the detection results of the strains of the resistance portions 31, 32, 33, and. Other effects are the same as those of the first embodiment.
  • FIG. 7 is a schematic view illustrating the sensor module according to the fourth embodiment.
  • the strain gauge 1A (see FIG. 6) is simplified, and only the terminals 41 to 48 are shown.
  • the sensor module 5A has a strain gauge 1A and a selection circuit 2A.
  • Selection circuit 2A for example, the switch SW 1 and SW 2, the input terminals I 1 ⁇ I 8, and the output terminals O 1 and O 2, and control terminals CNT 1 and CNT 2, the power supply terminals VDD and VSS (positive terminal And a negative electrode terminal).
  • the power supply terminals VDD and VSS are supplied with power of a predetermined voltage from outside the sensor module 5A.
  • the control terminals CNT 1 and CNT 2 and the output terminals O 1 and O 2 can be electrically connected to the outside of the sensor module 5A.
  • the selection circuit 2A can be mounted, for example, on the upper surface 10a side or the lower surface 10b side of the base material 10 of the strain gauge 1A.
  • the input terminals I 1 and I 5 are connected to the terminal portions 41 and 43 are a pair of electrodes of the resistance portion 31.
  • the input terminals I 2 and I 6 are connected to terminal portions 42 and 44 which are a pair of electrodes of the resistance portion 32.
  • the input terminals I 3 and I 7 are connected to terminal portions 45 and 47 which are a pair of electrodes of the resistance portion 33.
  • the input terminals I 4 and I 8 are connected to terminal portions 46 and 48 which are a pair of electrodes of the resistance portion 34.
  • Switches SW 3 and SW 4 are switches for switching in conjunction in accordance with the combination of the H / L signal externally input to the control terminal CNT 1 and CNT 2.
  • SW 3 connects the input terminal I 1 to the output terminal O 1
  • SW 4 connects to the input terminal I 5 and connects the output terminal O 2 (the state shown in FIG. 7).
  • the output terminals O 1 and O 2 are connected to the terminal portions 41 and 43 which are a pair of electrodes of the resistance portion 31, and the resistance value of the resistance portion 31 can be measured via the output terminals O 1 and O 2.
  • SW 3 connects the input terminal I 2 to the output terminal O 1
  • SW 4 connects the input terminal I 6 and connects the output terminal O 2.
  • the output terminals O 1 and O 2 are connected to the terminals 42 and 44 which are a pair of electrodes of the resistor 32, and the resistance of the resistor 32 can be measured via the output terminals O 1 and O 2.
  • SW 3 connects the input terminal I 3 to the output terminal O 1
  • SW 4 connects to the input terminal I 7 and connecting the output terminal O 2.
  • the output terminals O 1 and O 2 are connected to the terminal portions 45 and 47 which are a pair of electrodes of the resistance portion 33, and the resistance value of the resistance portion 33 can be measured via the output terminals O 1 and O 2.
  • SW 3 connects the input terminal I 4 to the output terminal O 1
  • SW 4 connects the input terminal I 8 and connects the output terminal O 2.
  • the output terminals O 1 and O 2 are connected to the terminal portions 46 and 48 which are a pair of electrodes of the resistance portion 34, and the resistance value of the resistance portion 34 can be measured via the output terminals O 1 and O 2.
  • control unit 73 controls the control terminals CNT 1 and CNT 2 selection circuit 2A, which is the same as the method described with reference to FIG.
  • the combination of H / L signal externally input to the control terminal CNT 1 and CNT 2 of selecting circuits 2A sensor module 5A it is possible to switch the switch SW 3 and SW 4 of the selection circuit 2A.
  • the resistance value of the resistance part 31, the resistance value of the resistance part 32, the resistance value of the resistance part 33, and the resistance value of the resistance part 34 of the strain gauge 1A can be selectively measured. That is, it is possible to selectively measure the strain in the X direction, the strain in the Y direction, and the strain in a direction in which the angle formed with the X direction is ⁇ 45 degrees.
  • FIG. 8 is a perspective view illustrating a bearing mechanism according to the fifth embodiment.
  • FIG. 9 is a cross-sectional view illustrating a bearing mechanism according to the fifth embodiment.
  • the bearing mechanism 100 includes a rotating shaft 110 (shaft), a bearing 120 (bearing), and the strain gauge 1.
  • the rotating shaft 110 is rotatably supported by a bearing 120.
  • the strain gauge 1 is attached to a side wall of the bearing 120.
  • the strain gauge 1 is a two-axis gauge, a vibration component in a direction perpendicular to the rotation axis 110 and a vibration component in the direction of the rotation axis 110 can be simultaneously detected. As a result, more accurate life prediction of the bearing 120 is possible.
  • a strain gauge 1A can be used instead of the strain gauge 1. If the bearing mechanism 100 is unbalanced, it tends to vibrate in the direction perpendicular to the rotating shaft 110, and if the alignment is not correct, vibration occurs in the direction of the rotating shaft 110.
  • vibration Since vibration has a characteristic in the direction of occurrence depending on the type of abnormality, it is preferable to measure the vibration in each of three directions: vertical, horizontal, and axial.
  • strain gauge 1A By using the strain gauge 1A, it is possible to simultaneously detect vibrations in three directions, so that the ability to isolate vibration sources can be greatly improved.
  • the bearing mechanism 100 by attaching the strain gauge 1 or 1A to the side wall of the bearing 120 and detecting the vibration of the bearing 120, it is possible to accurately detect the abnormal mode of the vibration generated in the bearing 120. it can.
  • the sensor module 5 or 5A may be used instead of the strain gauge 1 or 1A.
  • the bridge circuit 71 may be incorporated in the sensor module 5 or 5A.
  • the bridge circuit 71 and the analog front end unit 72 may be incorporated in the sensor module 5 or 5A.
  • the bridge circuit 71 and the analog front end unit 72 can be integrated into an IC and mounted on the upper surface 10a or the lower surface 10b of the base material 10.
  • the number of resistance portions is not limited to two or four, and may be three or five or more.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Rolling Contact Bearings (AREA)

Abstract

Cette jauge de contrainte comprend un matériau de base flexible et une pluralité de parties de résistance qui sont formées linéairement sur un côté du matériau de base. Les parties de résistance se croisent l'une avec l'autre sur un même plan et sont électriquement connectées l'une à l'autre.
PCT/JP2019/026450 2018-07-12 2019-07-03 Jauge de contrainte, module de capteur et mécanisme de palier WO2020013046A1 (fr)

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JP2018-132478 2018-07-12
JP2018132478A JP2020008527A (ja) 2018-07-12 2018-07-12 ひずみゲージ、センサモジュール、軸受機構

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WO2022019024A1 (fr) * 2020-07-21 2022-01-27 ヤマハ株式会社 Capteur biométrique

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JP7456883B2 (ja) 2020-07-31 2024-03-27 ミネベアミツミ株式会社 転がり軸受ホルダユニット
JP7456333B2 (ja) * 2020-09-04 2024-03-27 株式会社豊田中央研究所 変形センサ

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JP7516947B2 (ja) 2020-07-21 2024-07-17 ヤマハ株式会社 生体センサ

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