WO2020003491A1

WO2020003491A1 - Support member placement assistance device, printer, printing system, and support member placement assistance method

Info

Publication number: WO2020003491A1
Application number: PCT/JP2018/024796
Authority: WO
Inventors: 猛志藤本
Original assignee: ヤマハ発動機株式会社
Priority date: 2018-06-29
Filing date: 2018-06-29
Publication date: 2020-01-02
Also published as: JP7032009B2; JPWO2020003491A1

Abstract

Inspection-related information I related to print inspection for inspecting the quality of a solder D printed on a substrate B is acquired. Also, the placement mode of a backup pin P that supports the substrate B is calculated according to the inspection-related information I. As a result, when placing the backup pin P that supports the substrate B, it is possible to lighten the burden on the worker examining the placement mode of the backup pin P.

Description

Support member arrangement support device, printing machine, printing system, support member arrangement support method

{Circle around (1)} The present invention relates to a technique for arranging a support member for supporting a substrate on which a paste is printed.

Conventionally, in a printing machine that prints a paste such as solder on a substrate via a mask pattern, a supporting member is used to support the substrate. Further, in Patent Literature 1, when a mounting failure is continued as a result of inspecting a board on which components are mounted on solder printed on the board, an error is reported and an operator is required to review the arrangement of the support member. The required technology is described.

JP 2013-031114 A

However, the above technique merely reports an error, so the operator has to consider the arrangement of the support members by himself. Therefore, when arranging the support members, the burden on the operator was great.

The present invention has been made in view of the above problems, and has as its object to provide a technique capable of reducing a burden on an operator when arranging a support member for supporting a substrate.

The support member placement assisting device according to the present invention relates to an inspection related to a print inspection that determines the quality of a paste printed at a print target position by paste printing that prints a paste at a print target position on a substrate via a mask pattern. An acquisition unit for acquiring information, and a calculation unit for calculating an arrangement mode of a support member that supports the substrate during execution of paste printing, according to the inspection-related information.

The support member placement assisting method according to the present invention relates to an inspection-related method related to a print inspection that determines the quality of a paste printed at a print target position by paste printing in which a paste is printed at a print target position on a substrate via a mask pattern. The method includes a step of acquiring information and a step of calculating an arrangement mode of a support member that supports the substrate during execution of paste printing, according to the inspection-related information.

According to the present invention configured as described above (the support member arrangement assisting device and the support member arrangement assisting method), inspection-related information related to the print inspection for inspecting the quality of the paste printed on the substrate is acquired. Then, the arrangement mode of the support member that supports the substrate is calculated according to the inspection-related information. As a result, when arranging the support member that supports the substrate, it is possible to reduce the burden on the operator who examines the arrangement of the support member.

In the print inspection, an allowable range of a measured value obtained by measuring the state of the paste is set for the print target position, and whether or not the measured value of the paste printed at the print target position is within the allowable range. Whether the paste is good or bad is determined based on the information, and the obtaining unit may configure the support member arrangement support device so as to obtain the allowable range as the inspection-related information. With this configuration, it is possible to appropriately calculate the arrangement of the support members according to the allowable range used as a criterion for the quality determination in the print inspection.

The support member arrangement support device may be configured such that the measured value includes at least one of the area of the paste in plan view, the height of the paste from the substrate, and the volume of the paste. With this configuration, the arrangement of the support members can be appropriately calculated according to at least one of the area, height, and volume of the paste.

Further, the calculation unit, as the allowable range set for the print target position included in the placement target range of the support member is narrower, so that the number of support members per unit area to be arranged in the placement target range is increased. The support member arrangement support device may be configured to calculate the arrangement mode. With such a configuration, it is possible to securely support the range in which the print target portion having a narrow allowable range used in the print inspection exists by the support member.

In addition, the support member placement support device is provided with a display corresponding to the number of support members per unit area to be placed in the placement target range, attached to the placement target range, and further provided with a user interface for indicating an arrangement mode to an operator. You may comprise. With such a configuration, the worker can refer to the arrangement mode shown on the user interface when examining the arrangement of the support members. Therefore, the burden on the worker can be reduced.

The obtaining unit obtains a determination result that the print inspection determines the quality of the paste printed at the printing target position, and the calculation unit determines that the defective printing is the printing target position at which the paste indicating that the determination result is defective is printed. The support member arrangement support device may be configured to calculate the arrangement mode according to the position. With such a configuration, the arrangement of the support members can be appropriately calculated according to the print target position where the paste is determined to be defective in the print inspection.

In addition, the calculation unit may configure the support member arrangement support device so as to determine that the support member is arranged at the defective printing position in the calculation of the arrangement mode. In such a configuration, the support member is added to the print target position where the paste is determined to be defective by the print inspection, and the subsequent paste printing can be performed, so that the reprint of the paste print defect can be suppressed.

Further, the arithmetic unit determines an arrangement mode so as to satisfy an interference prevention condition of separating the two support members from each other by separating the positions of the two adjacent support members by a predetermined closest interval or more. A support member arrangement support device may be configured. With such a configuration, it is possible to prevent two adjacent support members from interfering with each other.

Further, when the interval between the arrangement position of the support member already arranged and the defective printing position is smaller than the closest interval, the calculation unit calculates the virtual position passing through the arrangement position and the defective printing position in calculating the arrangement mode. On a straight line, the support member placement assisting device is determined to add a support member to a position on the opposite side of the placement position with respect to the defective printing position, and the distance from the placement position is the closest distance. You may comprise. In such a configuration, a support member is added to the vicinity of the print target position where the paste is determined to be defective by the print inspection, and subsequent paste printing can be executed, thereby suppressing repetition of paste print defects. it can.

In the case where there are a plurality of defective printing positions where the support member cannot be arranged while satisfying the interference prevention condition, the calculation unit supports the geometrical center of the plurality of defective printing positions in the calculation of the arrangement mode. The support member arrangement support device may be configured to determine that a member is to be added. In such a configuration, a support member is added to the vicinity of the print target position where the paste is determined to be defective by the print inspection, and subsequent paste printing can be executed, thereby suppressing repetition of paste print defects. it can.

In addition, the calculation unit has a plurality of defective printing positions where the support member cannot be arranged while satisfying the interference prevention condition, and the geometric center of gravity of the plurality of defective printing positions and the arrangement of the already arranged support members are present. When the interval between the positions is less than the closest interval, in the calculation of the arrangement mode, on a virtual straight line passing through the arrangement position and the geometric centroid, the position on the opposite side of the arrangement position with respect to the geometric centroid, The support member arrangement support device may be configured so as to determine that the support member is to be added at a position where the distance from the arrangement position is the closest distance. In such a configuration, a support member is added to the vicinity of the print target position where the paste is determined to be defective by the print inspection, and subsequent paste printing can be executed, thereby suppressing repetition of paste print defects. it can.

Further, an alarm for notifying the operator of the error is further provided, and the arithmetic unit configures the support member arrangement support device to notify the error of the error when the support member cannot be added to satisfy the interference prevention condition. You may. With this configuration, it is possible to notify the worker that the layout of the support member needs to be reviewed.

The arithmetic unit includes a mask holding unit that holds the mask with respect to the substrate, and a squeegee that executes paste printing in which a paste is printed at a print target position on the substrate through a pattern of the mask by sliding the squeegee on the mask. The support member placement assisting device may be configured such that the support member is placed in the placement head of the printing press including the unit and the placement head that places the support member that supports the substrate in accordance with the arrangement mode. With such a configuration, the support members can be automatically arranged in accordance with the arrangement mode calculated by the calculation unit, and the burden on the operator can be further reduced.

The printing press according to the present invention includes a mask holding unit that holds a mask on a substrate, and a squeegee that slides on the mask to perform paste printing that prints paste at a print target position on the substrate via a mask pattern. A squeegee unit to be executed and the above-described support member arrangement support device are provided. Therefore, when arranging the support member that supports the substrate, it is possible to reduce the burden on the operator who examines the arrangement of the support member.

A printing system according to the present invention executes a paste printing machine for performing paste printing for printing a paste on a print target position on a substrate via a pattern of a mask, and performs a print inspection for determining whether or not the paste printed on the print target position is good. And a support member arrangement support device as described above. Therefore, when arranging the support member that supports the substrate, it is possible to reduce the burden on the operator who examines the arrangement of the support member.

According to the present invention, it is possible to reduce a burden on an operator when arranging a support member for supporting a substrate.

FIG. 1 is a front view schematically showing a printing machine. FIG. 2 is a block diagram showing an electrical configuration of the printing press shown in FIG. 1. FIG. 4 is a perspective view schematically showing an example of the arrangement of backup pins with respect to a lifting table. FIG. 2 is a plan view schematically illustrating an example of a substrate on which solder is printed by the printing machine in FIG. 1. FIG. 2 is a block diagram illustrating an example of a printing system including the printing machine in FIG. 1. FIG. 2 is a block diagram showing an example of an electrical configuration of a server computer. 9 is a flowchart showing a first method for determining an arrangement mode of a backup pin. FIG. 8 is a plan view schematically showing an example of the content of a calculation executed according to the flowchart of FIG. 7. FIG. 8 is a plan view schematically showing an example of the content of a calculation executed according to the flowchart of FIG. 7. 9 is a flowchart illustrating a second method for determining an arrangement mode of a backup pin. FIG. 11 is a diagram schematically showing conditions to be satisfied in determining the arrangement of backup pins according to the flowchart of FIG. 10. FIG. 11 is a plan view schematically showing an example of an arrangement of backup pins determined according to the flowchart of FIG. 10.

FIG. 1 is a front view schematically showing a printing press, and FIG. 2 is a block diagram showing an electrical configuration of the printing press shown in FIG. In FIG. 1 and the following drawings, XYZ orthogonal coordinate axes in which the Z direction is a vertical direction and the X direction and the Y direction are horizontal directions are appropriately shown. The printing press 1 includes a mask holding unit 2 for holding a mask M, a substrate holding unit 4 arranged below the mask M, and a squeegee unit 6 arranged above the mask M. Further, the printing press 1 includes a main control unit 10 including a CPU (Central Processing Unit) and a RAM (Random Access Memory) and a storage unit 11 including a HDD (Hard Disk Drive). The main control unit 10 controls the

units

4 and 6 according to the printing program stored in the storage unit 11, so that the substrate B is opposed to the mask M from below by the substrate holding unit 4 and the squeegee 61 of the squeegee unit 6 is Is slid in the X direction on the upper surface of the mask M. Thereby, the solder D supplied to the upper surface of the mask M is printed on the upper surface Bu of the substrate B via the pattern penetrating the mask M.

Further, the printing press 1 includes a drive control unit 12 and a valve control unit 13 for controlling the operation of each movable unit, and the main control unit 10 controls the movable units of the

units

4 and 6 by the drive control unit 12 and the valve control unit 13. Control. Further, the printing press 1 includes a display unit 14 configured by, for example, a liquid crystal display, and an input unit 15 configured by input devices such as a keyboard and a mouse. Therefore, the operator can check the operation status of the printing press 1 by checking the display contents of the display unit 14, and can input a command to the printing press 1 by operating the input unit 15. Note that the display unit 14 and the input unit 15 may be integrally configured by a touch panel.

The mask holding unit 2 has a clamp member 21, and the mask M is detachably attached to the clamp member 21 via a frame 22 provided on the periphery thereof. Thereby, the mask M having a flat plate shape is horizontally held by the mask holding unit 2. The mask M has a rectangular shape in a plan view, and has a through hole (mask pattern) having a shape corresponding to a print pattern on the substrate B.

The substrate holding unit 4 is disposed below the mask M held by the mask holding unit 2 and has a function of adjusting the position of the substrate B with respect to the mask M. The substrate holding unit 4 includes a pair of conveyors 41 for transporting the substrate B, a substrate holding unit 42 for holding the substrate B received from the conveyor 41, and a flat movable table 43 for supporting the conveyor 41 and the substrate holding unit 42. And

(4) The pair of conveyors 41 are arranged in parallel in the Y direction with a space in the X direction, and support both ends in the X direction of the substrate B on the upper surfaces thereof from below. Further, the substrate holding unit 4 is provided with a conveyor driving unit M41 for driving the conveyors 41. When the conveyor driving unit M41 receives a command from the drive control unit 12 and drives each of the conveyors 41, each of the conveyors 41 conveys the substrate B in the Y direction and carries in or unloads the substrate B with respect to the printing press 1. I do.

(4) The substrate holding section 42 has a lifting table 421 having a flat plate shape and a sliding column 422 slidable in the Z direction with respect to the movable table 43. The lifting table 421 is supported on the upper end of the sliding column 422. A plurality of backup pins P erected in the Z direction are arranged on the upper surface of the elevating table 421 at intervals in the X and Y directions, and the elevating table 421 has the backup pins P as support members placed thereon. Functions as a mounting table. Further, a backup drive unit M423 is provided in the substrate holding unit 42. The backup drive unit M423, which has received a command from the drive control unit 12, raises and lowers the slide column 422, thereby connecting the backup pins P together with the lifting table 421. Raise and lower. For example, when the substrate B is carried into the conveyor 41, the backup drive unit M423 positions the upper end of each backup pin P below the upper surface of the conveyor 41. Then, when the conveyor 41 carries the substrate B directly above the backup pin P, the backup drive unit M423 raises the backup pin P, thereby protruding the upper end of the backup pin P upward from the upper surface of the conveyor 41. Thus, the substrate B is pushed up while the upper end of the backup pin P contacts the lower surface Bd of the substrate B, and the substrate B is transferred from the upper surface of the conveyor 41 to the upper end of each backup pin P.

In addition, the substrate holding unit 42 includes a pair of clamp plates 424 arranged at intervals above the pair of conveyors 41 in the X direction, and a plate driving unit M424 that drives at least one of the clamp plates 424 in the X direction. Having. The upper surface of each clamp plate 424 is a plane parallel to the X direction and the Y direction, and is located at the same height. The plate driving unit M424 adjusts the air supplied to the clamp plate 424 by opening and closing the valve according to a command from the valve control unit 13. As a result, the clamp plate 424 is driven in the X direction.

Then, the drive control unit 12 raises the substrate B on the backup pin P to a position between the pair of clamp plates 424, and the valve that receives a command from the valve control unit 13 operates to reduce the distance between the clamp plates 424. Thus, the substrate B is clamped by the clamp plates 424 in the X direction (horizontal direction). Specifically, the storage unit 11 stores the substrate height data indicating the driving amount of the backup driving unit M423 that matches the height of the upper surface of the substrate B with the height of the upper surface of the clamp plate 424. Then, the backup drive unit M423 raises the substrate B by the raising width indicated by the substrate height data. At this time, while the substrate B is being lifted by the backup driving unit M423, the plate driving unit M424 makes the interval between the pair of clamp plates 424 wider than the width of the substrate B in the X direction. When the lifting of the substrate B by the backup driving unit M423 is completed, the plate driving unit M424 narrows the interval between the pair of clamp plates 424, and sandwiches the substrate B between the clamp plates 424 in the X direction. Thus, the substrate B is clamped by the clamp plate 424.

Furthermore, the substrate holding unit 4 has a table driving mechanism 44 for driving the movable table 43. The table driving mechanism 44 includes an X-axis table 441, a Y-axis table 442 mounted on the upper surface of the X-axis table 441, an R-axis table 443 mounted on the upper surface of the Y-axis table 442, and an R-axis table 443. A ball screw 444 for moving the movable table 43 up and down. Further, the table driving mechanism 44 moves the X-axis table 441 in the X direction, the Y-axis driving section M442 that drives the Y-axis table 442 in the Y direction, and the R-axis table 443 in the R direction ( An R-axis drive unit M443 that drives in a rotation direction about an axis parallel to the Z direction) and a Z-axis drive unit M444 that drives the movable table 43 in the Z direction by rotating a ball screw 444. Therefore, the drive control unit 12 can drive the conveyor 41 and the substrate holding unit 42 arranged on the movable table 43 in the X, Y, Z, and R directions by controlling the drive units M441 to M444. For example, when positioning the loaded substrate B with respect to the mask M, the drive control unit 12 determines the position of the substrate B clamped by the clamp plate 424 by the X, Y, and R axis driving units M441 to M443. Adjustment in the Y direction and adjustment in the Z direction by the Z axis drive unit M444. Thereby, the upper surfaces of the clamp plate 424 and the substrate B contact the lower surface of the mask M.

(3) The printing press 1 further includes a pin arrangement unit 7 for arranging the backup pins P on the lifting table 421 as exemplified in FIG. Here, FIG. 3 is a perspective view schematically showing an example of the arrangement of the backup pins with respect to the lifting table. The pin arrangement unit 7 will be described with reference to FIGS.

The pin placement unit 7 includes a placement head 71, an X-axis drive unit M711 that drives the placement head 71 in the X direction, and a Y-axis drive unit M712 that drives the placement head 71 in the Y direction. Moves the placement head 71 two-dimensionally in the X and Y directions by the X-axis drive unit M711 and the Y-axis drive unit M712. The placement head 71 has a plurality of suction nozzles 72 arranged in parallel in the Y direction at intervals C. The pin placement unit 7 drives the suction nozzles 72 individually in the Z direction. M713. Then, the drive control unit 12 moves each suction nozzle 72 up and down by the Z-axis drive unit M713. The number of suction nozzles 72 is not limited to two illustrated in FIG.

The pin arrangement unit 7 further has a pin stocker 75 arranged on the side of the lifting table 421 in the X direction, and stores a large number of backup pins P in the pin stocker 75. In the pin stocker 75, the backup pins P stand upright in the Z direction, and are arranged at intervals C in the Y direction. Then, the main control unit 10 moves the placement head 71 between the pin stocker 75 and the elevating table 421 to transfer the backup pin P from the pin stocker 75 to the elevating table 421 or to move the backup pin P from the elevating table 421 to the pin stocker 75. The backup pin P can be stored.

For example, the former operation is performed as follows. The drive control unit 12 causes the two suction nozzles 72 to face the two backup pins P from above by positioning the placement head 71 above the pin stocker 75 by the X-axis drive unit M711 and the Y-axis drive unit M712. . Then, when the drive control unit 12 simultaneously lowers the suction nozzles 72 by the Z-axis drive unit M713 to contact the backup pins P, the valve control unit 13 applies a negative pressure to the suction nozzles 72. As a result, when the two backup pins P are sucked by the two suction nozzles 72, the drive control unit 12 raises the suction nozzles 72.

When the two backup pins P are picked up from the pin stocker 75 by the two suction nozzles 72 in this way, the drive control unit 12 moves the placement head 71 to the elevation table 421 by the X-axis drive unit M711 and the Y-axis drive unit M712. By moving the backup pin P upward, the backup pin P is opposed to the target position of the lifting table 421 from above. Then, when the drive control unit 12 lowers the suction nozzle 72 by the Z-axis drive unit M713 to bring the backup pin P into contact with the target position of the lifting table 421, the valve control unit 13 releases the negative pressure of the suction nozzle 72. Thus, when the backup pin P is placed at the target position on the lifting table 421, the drive control unit 12 raises the suction nozzle 72.

At this time, when the target positions where the two backup pins P are to be arranged are arranged in parallel in the Y direction at an interval C, the placement head 71 transfers the two backup pins P to the lifting table 421 at the same time. Otherwise, the placement head 71 transfers one backup pin P of the two backup pins P to the lifting table 421 and then transfers the other backup pin P to the lifting table 421. .

(4) The backup pins P placed on the lifting table 421 are held on the lifting table 421 by magnetic force. According to such a holding mode, unlike the configuration in which the backup pin P is held by engaging the backup pin P with a plurality of engagement holes arranged in a matrix, the backup pin P A free location, such as being able to be placed at a position, can be realized.

As described above, the backup pins P are transferred from the pin stocker 75 to the lifting table 421. When the backup pins P are stored in the lifting table 421 from the pin stocker 75, the reverse operation is performed.

FIG. 4 is a plan view schematically showing an example of a substrate on which solder is printed by the printing machine in FIG. As shown in the figure, a plurality of print target positions Lt (for example, electrodes such as lands) are provided on the upper surface Bu of the substrate B, and a pattern corresponding to each print target position Lt is provided on the mask M. Vacant. Then, the printing press 1 slides the squeegee 61 on the upper surface of the mask M while supporting the lower surface Bd of the substrate B contacting the mask M from below with the backup pin P. The solder printing is performed to print the solder D on each print target position Lt on the upper surface Bu. At this time, if the arrangement of the backup pins P is improper, a gap is generated between the mask M and the substrate B at the periphery of the print target position Lt, and the solder D cannot be printed well on the print target position Lt. Therefore, in the present embodiment, the arrangement of the backup pins P is calculated based on the inspection-related information used in the print inspection for inspecting the solder D printed on the board B. Subsequently, this point will be described.

FIG. 5 is a block diagram showing an example of a printing system including the printing machine shown in FIG. As shown in the drawing, a printing system S includes the above-described printing machine 1, inspection machine 8, and server computer 9. The inspection machine 8 is what is called SPI (Solder Paste Inspection), and inspects the quality of the solder D printed on the board B by the printing machine 1 (print inspection). The inspection machine 8 determines the quality of the solder D based on whether or not a measurement value obtained by measuring a volume related to the volume of the solder D printed on the substrate B satisfies the allowable range Ia. The amount related to the volume of the solder D includes at least one of the area of the solder D in plan view (in other words, the area of the solder D as viewed from the direction normal to the upper surface Bu of the board B) and the height of the solder D from the board B. The allowable range Ia is defined by an upper limit value and a lower limit value of the ratio to the target value. For example, if the upper limit value is 150% and the lower limit value is 50%, the target value is 0.5 to 1.5 times the target value. If the measured value falls within the allowable range Ia, the solder D is determined to be good. Otherwise, the solder D is determined to be defective. In particular, in the inspection machine 8, an operator sets an allowable range Ia for each of the plurality of print target positions Lt. Therefore, the operator performs management such as setting a narrow allowable range Ia for the print target position Lt that requires accuracy, and setting a wide allowable range Ia for the print target position Lt that does not require accuracy. it can. The determination result Ib of the quality of the solder D is stored in the inspection machine 8 for each print target position Lt.

FIG. 6 is a block diagram showing an example of the electrical configuration of the server computer. The server computer 9 includes a calculation unit 91, a storage unit 92, a UI 93, and a communication unit 94. The arithmetic unit 91 is a processor including a CPU and a RAM, and executes an arithmetic process for determining an arrangement mode of the backup pin P. The storage unit 92 is configured by an HDD, and stores various data necessary for determining the arrangement mode of the backup pins P. The UI 93 accepts an input operation of an operator and displays various information on the screen for the operator. The communication unit 94 performs communication with external devices such as the printing press 1 and the inspection device 8.

In particular, the arithmetic unit 91 receives the permissible range Ia used in the print inspection as the inspection-related information I from the inspection device 8 by the communication unit 94 and stores it in the storage unit 92. Then, the calculation unit 91 calculates the arrangement mode of the backup pins P according to the allowable range Ia set for each print target position Lt.

FIG. 7 is a flowchart showing a first method for determining the arrangement mode of the backup pins, and FIGS. 8 and 9 are plan views schematically showing examples of the contents of calculations executed according to the flowchart of FIG. The flowchart in FIG. 7 is executed by the arithmetic processing of the arithmetic unit 91 of the server computer 9 before the solder printing in the printing press 1 is started. Also, in FIG. 9, the backup pins P are shown through the board B. However, the backup pins P are actually arranged on the lower side of the board B and are hidden by the board B.

In step S101, the allowable range Ia set for each print target position Lt is acquired from the inspection machine 8 as the inspection-related information I and stored in the storage unit 92, as described above. In step S102, an arrangement target range Ap of the backup pin P is set for the substrate B as shown in FIG. Specifically, the arrangement target range is provided so as to include a plurality of print target positions Lt which are provided adjacent to each other within a region equal to or less than a predetermined reference area and have the same allowable range Ia set for each. Ap is set. For the print target position Lt that does not satisfy the condition, the arrangement target range Ap is set for one print target position Lt.

In step S103, a pin arrangement density indicating the number of backup pins P arranged per unit area is determined for each arrangement target range Ap. In other words, the pin arrangement density is determined according to the allowable range Ia set for the backup pin P included in the arrangement target range Ap, and the pin arrangement density is set such that the pin arrangement density increases as the allowable range Ia decreases. Is determined.

In step S104, the arrangement mode determined in step S103 is displayed on the UI 93. For example, the placement target range Ap having a high pin placement density is displayed in red, and the placement target range Ap having a low pin placement density is displayed in blue, and the placement target range Ap is displayed while being colored according to the pin placement density. be able to. With this, the operator confirms the pin arrangement density of each arrangement target range Ap displayed on the screen of the UI 93, and arranges the backup pins P in each arrangement target range Ap as illustrated in FIG. Input operation.

Then, in step S105, the location of the backup pin P input in step S104 is transmitted from the server computer 9 to the printing press 1. Thereby, the printing press 1 can arrange the backup pin P by the arrangement head 71 at the received arrangement position.

In the embodiment configured as described above, the inspection-related information I (allowable range Ia) related to the print inspection for inspecting the quality of the solder D printed on the board B is acquired. Then, the arrangement mode (pin arrangement density) of the backup pins P supporting the substrate B is calculated according to the inspection-related information I. As a result, when arranging the backup pins P that support the substrate B, it is possible to reduce the burden on the operator who examines the arrangement of the backup pins P.

In the printing inspection, an allowable range Ia of a measured value obtained by measuring the state of the solder D is set for the print target position Lt, and the measured value of the solder D printed at the print target position Lt is set to the allowable range Ia. It is determined whether the solder D is good or not based on whether it is within the range. Then, the communication unit 94 acquires the allowable range Ia as the inspection-related information I. With such a configuration, the arrangement of the backup pins P can be appropriately calculated according to the allowable range Ia used as a criterion for quality determination in the print inspection.

In the print inspection, the measured value is set so as to include at least one of the area of the solder D and the height of the solder D from the board B in a plan view (in other words, viewed from the normal direction of the upper surface Bu of the board B). Can be obtained. With such a configuration, the arrangement of the backup pins P can be appropriately calculated according to at least one of the area and the height of the solder D.

In addition, the arithmetic unit 91 determines that the smaller the allowable range Ia set for the printing target position Lt included in the placement target range Ap of the backup pin P is, the smaller the backup pin P per unit area to be placed in the placement target range Ap is. The arrangement mode is calculated so that the number increases. In such a configuration, the backup pin P can firmly support the range in which the print target position Lt having the narrow allowable range Ia used in the print inspection exists.

The UI 93 is provided with a display (color-coded display) corresponding to the number of backup pins P per unit area to be arranged in the arrangement target range Ap to the arrangement target range Ap, and showing an arrangement mode of the backup pins P to the operator. Have been. In such a configuration, the worker can refer to the arrangement mode shown in the UI 93 when examining the arrangement of the backup pins P. Therefore, the burden on the worker can be reduced.

FIG. 10 is a flowchart showing a second method of determining the arrangement of the backup pins, and FIG. 11 is a diagram schematically showing conditions to be satisfied in determining the arrangement of the backup pins according to the flowchart of FIG. FIG. 12 is a plan view schematically showing an example of the arrangement of the backup pins determined according to the flowchart of FIG. The flowchart of FIG. 10 is executed by the arithmetic processing of the arithmetic unit 91 of the server computer 9 in parallel with the period in which the printing machine 1 executes the printing of the same pattern of solder D on the planned number of boards B to be produced. Also, in FIG. 12, the backup pins P are shown through the board B in plan view, but are actually hidden below the board B because the backup pins P are arranged below the board B.

In step S201, it is determined whether or not the solder printing in the printing press 1 has been completed for the planned number of substrates B to be printed and the printing has been completed. If the printing is completed (“YES” in step S201), the process in the flowchart of FIG. 10 is ended. On the other hand, if the printing is not completed (“NO” in step S201), The process proceeds to step S202.

In step S202, it is confirmed whether or not the inspection-related information I has been received from the inspection machine 8. That is, the printing machine 1 unloads the board B on which the solder D is printed to the inspection machine 8, and the inspection machine 8 checks the quality of the solder D of the board B carried in from the printing machine 1, and checks the determination result Ib. The information is transmitted to the server computer 9 as the related information I. If the reception of the test-related information I is not confirmed (“NO” in step S202), the process returns to step S201, while the reception of the test-related information I is confirmed (“YES” in step S202). In this case, the process proceeds to step S203.

In step S203, it is confirmed whether or not there is a defective printing position Ln (FIG. 12) in which the printed solder D is determined to be defective among the plurality of printing target positions Lt provided on the substrate B. . Then, when the existence of the defective printing position Ln is not confirmed (in the case of “NO” in the step S203), the process returns to the step S201, while the existence of the defective printing position Ln is confirmed (in the case of “YES” in the step S203). In this case, the process proceeds to step S204.

In step S204, it is determined whether the same print target position Lt has been determined to be the defective print position Ln a predetermined number of times (two or more times) in succession. Specifically, the arithmetic unit 91 counts the number of times that the printing position is determined to be the defective printing position Ln continuously for each printing target position Lt, and confirms in step S204 based on the count value. . Then, if the number of times continuously determined to be the defective printing position Ln is less than the predetermined number (“NO” in step S204), the process returns to step S201, while the number of times continuously determined to be the defective printing position Ln is increased. If it is the predetermined number of times, the count value for the print target position Lt is reset to zero, and the process proceeds to step S205.

In step S205, a position at which the backup pin P is added is calculated based on the defective printing position Ln in which the solder D is determined to be defective a predetermined number of times in succession. The addition of the backup pin P is determined so as to satisfy the interference prevention condition shown in FIG. Here, the interference prevention condition requires that the two backup pins P be separated from each other by arranging the arrangement positions Lp, Lp of the two adjacent backup pins P at least the closest interval T. The arrangement position Lp (XY coordinates) of the backup pin P is given by the geometric center of gravity of the upper end Pt of the backup pin P in contact with the lower surface Bd of the substrate B.

Next, an example in which the arrangement position Lp of the backup pin P to be added to a BGA (Ball Grid Array) in which a plurality of print target positions Lt (lands) are arranged in a matrix will be described with reference to FIG. FIG. 12 shows defective printing positions Ln (XY coordinates) determined to be defective a predetermined number of times in succession. In each of the modes 1 to 5, a backup is performed for a case where the occurrence status of the defective printing position Ln is different. The situation before and after the addition of the pin P is shown.

In mode 1, as shown in the column “before addition”, the distance between the arrangement position Lp of the backup pin P already arranged and the defective printing position Ln is longer than the closest interval T. Therefore, it is determined that the backup pin P is to be added to the defective print position Ln, as shown in the column “after addition”. That is, the arrangement position Lp of the backup pin P to be added coincides with the defective printing position Ln.

In the second mode, two defective printing positions Ln have occurred, as shown in the column “before addition”. Since the distance between these defective printing positions Ln is less than the closest interval T, it is not possible to arrange the backup pins P at each of these defective printing positions Ln while satisfying the interference prevention condition. Thus, as shown in the column “after addition”, it is determined that the backup pin P is added to the geometric center of gravity (XY coordinates) of the two defective printing positions Ln. That is, the arrangement position Lp of the backup pin P to be added coincides with the geometric center of gravity of the two defective printing positions Ln.

In the third mode, three defective print positions Ln are generated as shown in the column “before addition”. Since the distance between any one of the defective printing positions Ln and the other defective printing position Ln is less than the closest interval T, the backup pin P is provided at each of these defective printing positions Ln while satisfying the interference prevention condition. Can not be placed. Therefore, as shown in the column “after addition”, it is determined that the backup pin P is added to the geometric center of gravity (XY coordinates) of the three defective printing positions Ln. That is, the arrangement position Lp of the backup pin P to be added coincides with the geometric center of gravity of the three defective printing positions Ln.

In mode 4, as shown in the column “before addition”, the distance between the already-arranged position Lp of the backup pin P and the defective printing position Ln is less than the closest interval T, so that the interference prevention condition is set. The backup pin P cannot be added to the defective printing position Ln while satisfying the condition. Therefore, as shown in the column of “after addition”, the following conditions are set on the virtual straight line Vl passing through the arrangement position Lp of the already arranged backup pin P and the defective print position Ln. On the other hand, the backup pin P is located on the opposite side of the arrangement position Lp of the already arranged backup pin P. Decide to add. In mode 4, a virtual circle Vc whose diameter is the closest interval T is also shown.

In the mode 5, as shown in the "before addition" column, three defective printing positions Ln have occurred. Since the distance between any one of the defective printing positions Ln and the other defective printing position Ln is less than the closest interval T, the backup pin P is provided at each of these defective printing positions Ln while satisfying the interference prevention condition. Can not be placed. Moreover, since the distance between the geometric center of gravity G and the arrangement position Lp of the already arranged backup pin P is less than the closest interval T, the backup pin P cannot be added as in mode 3. Therefore, as shown in the column of "after addition", on the virtual straight line Vl which passes through the following conditions, the arrangement position Lp of the already arranged backup pin P, and the geometric center G of the three defective printing positions Ln. A position opposite to the arrangement position Lp of the already arranged backup pins P with respect to the geometric center of gravity G; a position satisfying a distance from the already arranged backup pins P by the closest distance T (XY coordinates) ) Is determined to add a backup pin P. In mode 5, a virtual circle Vc whose diameter is the closest interval T is also shown.

As described above, in step S205, based on the determination result Ib for the preceding board B on which the solder D has been printed first, the arrangement of the backup pins P supporting the succeeding board B on which the solder D is to be printed thereafter is changed. It is determined. Then, in step S206, the server computer 9 transmits a pin addition command to the printing press 1 to add the backup pin P to the arrangement position Lp calculated in step S205. Thereby, the printing press 1 can add the backup pin P by the placement head 71 according to the received pin addition command. In addition, the printing machine 1 executes the addition of the backup pins P in parallel with the work of carrying in the next board B while carrying out the printed board B to the inspection machine 8.

In the embodiment configured as described above, the inspection-related information I (determination result Ib) related to the print inspection for inspecting the quality of the solder D printed on the board B is obtained. Then, the arrangement mode of the backup pins P supporting the substrate B (the arrangement position Lp of the additional backup pins P) is calculated according to the inspection-related information I. As a result, when arranging the backup pins P that support the substrate B, it is possible to reduce the burden on the operator who examines the arrangement of the backup pins P.

{Circle around (4)} The communication unit 94 obtains a determination result Ib in which the print inspection determines the quality of the solder D printed at the print target position Lt. Then, the calculation unit 91 calculates the arrangement of the backup pins P according to the defective print position Ln, which is the print target position Lt where the solder D whose determination result Ib is defective is printed. With such a configuration, the arrangement of the backup pins P can be appropriately calculated according to the print target position Lt at which the solder D is determined to be defective in the print inspection.

(4) In calculating the backup pin P, the calculation unit 91 places the backup pin P at the defective printing position Ln (mode 1). In such a configuration, the backup pin P is added to the defective printing position Ln, and the subsequent solder printing can be executed, and the printing failure of the solder D can be prevented from recurring.

In addition, the arithmetic unit 91 sets the positions of the two backup pins P such that the two backup pins P are separated from each other by separating the positions of the two backup pins P by a predetermined closest interval T or more. The arrangement mode is determined. With such a configuration, it is possible to prevent two adjacent backup pins P from interfering with each other.

If the interval between the arrangement position Lp of the backup pin P already arranged and the defective printing position Ln is less than the closest interval T, the arithmetic unit 91 performs the backup pin P Is calculated. That is, on the virtual straight line Vl that passes through the arrangement position Lp of the backup pins P already arranged and the defective print position Ln, it is a position opposite to the arrangement position Lp with respect to the defective print position Ln. It is determined that the backup pin P is added at a position where the distance from the position Lp is the closest distance T. In such a configuration, the backup pin P is added to the vicinity of the print target position Lt where the solder D is determined to be defective by the print inspection, and the subsequent solder printing can be executed. Can be suppressed.

Further, when there are a plurality of defective printing positions Ln in which the backup pins P cannot be arranged while satisfying the interference prevention condition, the calculating unit 91 calculates the plurality of defective printing positions Ln in the calculation of the backup pins P. It is determined that the backup pin P is added to the geometric center of gravity G (modes 2 and 3). In such a configuration, the backup pin P is added to the vicinity of the print target position Lt where the solder D is determined to be defective by the print inspection, and the subsequent solder printing can be executed. Can be suppressed.

In addition, the arithmetic unit 91 has a plurality of defective printing positions Ln where the backup pins P cannot be arranged while satisfying the interference prevention condition, and the geometrical center G of the plurality of defective printing positions Ln and the already arranged geometric centroids G. If the interval between the backup pin P and the arrangement position Lp of the backup pin P is less than the closest interval T, the arrangement of the backup pin P is calculated as shown in Mode 5. In other words, on a virtual straight line Vl passing through the arrangement position Lp of the backup pin P already arranged and the geometric center G of the plurality of defective printing positions Ln, a position opposite to the arrangement position Lp with respect to the geometric center G. It is determined that the backup pin P is added at a position where the distance from the arrangement position Lp is the closest distance T. In such a configuration, the backup pin P is added to the vicinity of the print target position Lt where the solder D is determined to be defective by the print inspection, and the subsequent solder printing can be executed. Can be suppressed.

The arithmetic unit also transmits a pin addition command to the printing press 1, and causes the placement head 71 of the printing press 1 to place the backup pin P according to the placement mode indicated by the pin addition command (step S206). With such a configuration, the backup pins P can be automatically arranged according to the arrangement mode calculated by the arithmetic unit 91, and the burden on the operator can be further reduced.

As described above, in the present embodiment, the server computer 9 corresponds to an example of the “supporting member arrangement assisting device” of the present invention, the communication unit 94 corresponds to an example of the “acquiring unit” of the present invention, and the arithmetic unit 91 corresponds to the The UI 93 corresponds to an example of the “user interface” of the present invention, the examination-related information I corresponds to an example of the “test-related information” of the present invention, and the allowable range Ia corresponds to an example of the “operation section” of the present invention. The determination result Ib corresponds to an example of the “determination result” of the present invention, the substrate B corresponds to an example of the “substrate” of the present invention, and the print target position Lt corresponds to an example of the “allowable range” of the present invention. The defective printing position Ln corresponds to an example of the “defective printing position” of the present invention, the backup pin P corresponds to an example of the “supporting member” of the present invention, The closest interval T corresponds to an example of the “nearest interval” of the present invention. , The virtual straight line Vl corresponds to an example of the “virtual straight line” of the present invention, the mask M corresponds to an example of the “mask” of the present invention, the solder D corresponds to an example of the “paste” of the present invention, 1 corresponds to an example of the “printing machine” of the present invention, the mask holding unit 2 corresponds to an example of the “mask holding unit” of the present invention, and the squeegee unit 6 corresponds to an example of the “squeegee unit” of the present invention. , The squeegee 61 corresponds to an example of the “squeegee” of the present invention, the placement head 71 corresponds to an example of the “placement head” of the present invention, and the printing system S corresponds to an example of the “printing system” of the present invention.

The present invention is not limited to the above embodiment, and various changes can be made to the above described one without departing from the spirit of the present invention. For example, if the backup pin P cannot be added so as to satisfy the interference prevention condition by any of the above modes 1 to 5, the calculation unit 91 may notify the UI 93 (alarm) of the error. With such a configuration, it is possible to notify the worker that the layout of the backup pins P needs to be reviewed.

{Circle around (1)} The first method and the second method of determining the arrangement mode of the backup pins may be executed in combination. That is, before the printing of the solder D on the planned number of substrates B is started, the arrangement of the backup pins P is determined by the first method, and after the printing is started, the backup pins P are switched by the second method. Can be added.

The arrangement of the backup pins P may not be performed automatically by the arrangement head 71 but may be performed manually by an operator.

The above-described function of the arithmetic unit 91 of the server computer 9 may be implemented in the main control unit 10 of the printing press 1, and the main control unit 10 may execute an operation for determining the arrangement of the backup pins P. In such a configuration, the main control unit 10 corresponds to the “acquisition unit” and the “calculation unit” of the present invention.

{Circle around (2)} In the second method for determining the arrangement mode of the backup pins, step S204 may be omitted, and if the defective printing position Ln is confirmed, the process may proceed to step S205.

Further, in the above example, the inspection machine 8 measures the area and height of the solder D as a quantity related to the volume of the solder D. However, the volume of the solder D is directly measured, and the measured value of the volume is within an allowable range. The quality of the solder D may be determined based on whether or not the condition is satisfied.

DESCRIPTION OF SYMBOLS 1 ... Printing machine 2 ... Mask holding unit 6 ... Squeegee unit 61 ... Squeegee 71 ... Arrangement head 9 ... Server computer (support member arrangement support apparatus)
91: operation unit 93: UI (user interface)
94 ... communication unit (acquisition unit)
B: Substrate D: Solder (paste)
I: inspection-related information Ia: allowable range Ib: determination result Lt: print target position Ln: defective print position M: mask P: backup pin (support member)
S: printing system T: closest interval Vl: virtual straight line

Claims

An acquisition unit that acquires inspection-related information related to print inspection that determines pass / fail of the paste printed at the print target position by paste printing that prints a paste at a print target position on a substrate via a pattern of a mask;
A support member arrangement support device comprising: an operation unit that calculates an arrangement mode of a support member that supports the substrate when the paste printing is performed, according to the inspection-related information.
In the print inspection, an allowable range of a measured value obtained by measuring the state of the paste is set for the print target position, and the measured value of the paste printed at the print target position is within the allowable range. The quality of the paste is determined based on whether or not
The support member arrangement support device according to claim 1, wherein the acquisition unit acquires the allowable range as the inspection-related information.
The support member arrangement support device according to claim 2, wherein the measured value includes at least one of an area of the paste in a plan view, a height of the paste from the substrate, and a volume of the paste.
The calculation unit is configured such that the narrower the allowable range set for the printing target position included in the placement target range of the support member, the greater the number of the support members per unit area to be placed in the placement target range. The support member arrangement support device according to claim 2, wherein the arrangement mode is calculated so that the arrangement mode is determined.
The support according to claim 4, further comprising: a user interface that gives an indication corresponding to the number of the support members per unit area to be arranged in the arrangement target range to the arrangement target range and indicates the arrangement mode to an operator. Member placement support device.
The obtaining unit obtains a determination result in which the print inspection determines the quality of the paste printed at the print target position,
The support according to any one of claims 1 to 5, wherein the calculation unit calculates the arrangement mode according to a defective print position that is the print target position where the paste indicating that the determination result is defective is printed. Member placement support device.
7. The support member arrangement support device according to claim 6, wherein the calculation unit determines that the support member is arranged at the defective printing position in the calculation of the arrangement mode. 8.
The arithmetic unit determines the arrangement mode so as to satisfy an interference prevention condition that the two support members are separated from each other by separating a position of two adjacent support members by a predetermined closest interval or more. 7. The support member arrangement support device according to 6.
The calculation unit may be configured to calculate the arrangement position and the defective print in the calculation of the arrangement mode when an interval between the arrangement position of the support member that is already arranged and the defective print position is smaller than the closest interval. It is determined that the support member is to be added to a position on the virtual straight line passing through the position and on the opposite side of the arrangement position with respect to the defective printing position, and the distance from the arrangement position is the closest distance. The support member arrangement assisting device according to claim 8.
The calculating unit may calculate the geometric configuration of the plurality of defective printing positions in the calculation of the arrangement mode when there are a plurality of defective printing positions where the support member cannot be arranged while satisfying the interference prevention condition. The support member arrangement assistance device according to claim 8, wherein it is determined that the support member is added to a center of gravity.
The arithmetic unit includes a plurality of defective printing positions where the support member cannot be disposed while satisfying the interference prevention condition. When the interval between the member and the arrangement position is smaller than the closest distance, in the calculation of the arrangement mode, on the virtual straight line passing through the arrangement position and the geometric center of gravity, the arrangement position with respect to the geometric center of gravity. 9. The support member arrangement support device according to claim 8, wherein it is determined that the support member is to be added to a position on the opposite side of the above and where the distance from the arrangement position is the closest distance.
An alarm that informs the operator of an error is further provided.
The support member arrangement support device according to any one of claims 8 to 11, wherein the arithmetic unit causes the alarm to notify an error when the support member cannot be added so as to satisfy the interference prevention condition.
The arithmetic unit executes a mask holding unit that holds a mask with respect to a substrate and paste printing that prints a paste at a print target position on the substrate via a pattern of the mask by sliding a squeegee on the mask. 13. The support member according to the arrangement mode, wherein the support member is arranged on the arrangement head of a printing press including a squeegee unit that performs the operation and an arrangement head that arranges a support member that supports the substrate. 3. The support member arrangement support device according to claim 1.
A mask holding unit for holding a mask with respect to the substrate,
By sliding a squeegee on the mask, a squeegee unit that executes paste printing to print a paste at a print target position on the substrate via the pattern of the mask,
A printing press, comprising: the support member arrangement support device according to claim 1.
A printing machine that performs paste printing for printing paste at a print target position on a substrate via a pattern of a mask;
An inspection machine that executes a print inspection to determine the quality of the paste printed at the print target position,
A printing system comprising: the support member arrangement support device according to any one of claims 1 to 13.
A step of obtaining inspection-related information related to a print inspection that determines the quality of the paste printed at the print target position by paste printing that prints a paste at a print target position on a substrate via a pattern of a mask;
Calculating the arrangement mode of the support member that supports the substrate when the paste printing is performed, according to the inspection-related information.