JP2023084755A - Component mounting device - Google Patents

Abstract

To provide a component mounting device which can easily detect an abnormality of a backup pin with a simple structure.MEANS FOR SOLVING THE PROBLEM: A component mounting device 1 comprises: a backup pin 50 which backs up a substrate P from the lower side; a plate which is provided with a plurality of support parts that can support the backup pin 50; a camera which images the backup pin 50 supported by the support parts from the upper side; and a control unit 30. The backup pin 50 includes a contact part 53 which can be in contact with the support parts. The backup pin 50 includes a first mark 55A and a second mark 55B which are arranged at different positions in the vertical direction and can be recognized by the camera from the upper side. The control unit 30 acquires a first image by imaging the first mark 55A of the backup pin 50 supported by the support parts by the camera, acquires a second image by imaging the second mark 55B of the backup pin 50 supported by the support parts by the camera, and determines whether or not there is an abnormality in the backup pin 50 by measuring the inclination of the backup pin 50 on the basis of the first image and the second image.SELECTED DRAWING: Figure 9

Description

The present disclosure relates to a component mounting apparatus.

2. Description of the Related Art A component mounting apparatus that mounts components on a board includes a backup device that supports the board from below in order to prevent the board from bending when components are mounted on the board. As such a backup device, the one disclosed in Japanese Patent Laying-Open No. 2019-140228 (Patent Document 1 below) is conventionally known. The backup device described in Patent Document 1 includes a plurality of backup pins, an upper plate provided with a plurality of pin insertion holes into which the backup pins are inserted, a touch panel arranged below the upper plate, and a control unit. . The touch panel can detect the backup pin inserted into the pin insertion hole. The control unit can determine whether the backup pin is erected at the proper position from the detection result of the touch panel.

JP 2019-140228 A

In the above configuration, it is necessary to provide the backup device with a touch panel in order to obtain the position information of the backup pin, which may complicate the configuration of the backup device.

A component mounting apparatus according to the present disclosure is a component mounting apparatus that mounts a component on a board, and includes: a backup pin that backs up the board from below; a plate provided with a plurality of support portions capable of supporting the backup pin; a camera that captures an image of the backup pin supported by a portion from above; It has a first mark and a second mark which are arranged at different positions and can be recognized by the camera from above, respectively, and the control unit controls the first mark of the backup pin supported by the support unit to the A first image is obtained by imaging with a camera, a second image is obtained by imaging the second mark of the backup pin supported by the support portion with the camera, and the first image and the second image are obtained. The component mounting apparatus determines whether or not there is an abnormality in the backup pin by measuring the inclination of the backup pin based on two images.

Advantageous Effects of Invention According to the present disclosure, it is possible to provide a component mounting apparatus that can easily detect an abnormality in a backup pin with a simple configuration.

FIG. 1 is a plan view of a component mounting apparatus according to Embodiment 1. FIG. FIG. 2 is a side view of the component mounting apparatus. FIG. 3 is a perspective view of the backup device. FIG. 4 is a schematic side view of the backup device, showing cross sections of the contact portion, the upper plate, and the lower plate. FIG. 5 is a diagram showing the electrical configuration of the component mounting apparatus. 6A and 6B are diagrams for explaining a first image and a second image acquired by imaging the backup pin shown in FIG. FIG. 7 is a schematic side view of the backup pin in a tilted state, showing cross sections of the upper and lower plates. FIG. 8 is a diagram for explaining a first image and a second image acquired by imaging the backup pin shown in FIG. FIG. 9 is a flowchart showing backup pin abnormality determination processing. It is a perspective view showing a backup pin according to another embodiment.

[Description of Embodiments of the Present Disclosure]
First, embodiments of the present disclosure are enumerated and described.

(1) A component mounting apparatus according to the present disclosure is a component mounting apparatus that mounts components on a board, and includes a backup pin that backs up the board from below, and a plate provided with a plurality of support portions capable of supporting the backup pin. a camera for capturing an image of the backup pin supported by the support from above; and a control unit, the backup pin includes a contact portion capable of coming into contact with the support, and the backup pin is configured to: It has a first mark and a second mark which are arranged at different positions in the vertical direction and which can be recognized by the camera from above, respectively, and the control unit controls the first mark of the backup pin supported by the support unit. A first image is obtained by imaging a mark with the camera, a second image is obtained by imaging the second mark of the backup pin supported by the support portion with the camera, and the first image is obtained. and determining whether or not there is an abnormality in the backup pin by measuring the inclination of the backup pin based on the second image.

According to such a configuration, the first mark and the second mark are provided at different positions in the vertical direction of the backup pin. , it is possible to measure the inclination of the backup pin and determine whether or not the backup pin has an abnormality. Therefore, it is possible to detect an abnormality of the backup pin with a simple configuration in which the first mark and the second mark are provided on the backup pin.
Here, the case where the backup pin is abnormal includes, for example, the case where a foreign object is sandwiched between the contact portion and the plate, the case where the backup pin itself is bent, and the like.

(2) It is preferable that the support portion is a hole edge portion of a through hole into which the backup pin can be inserted.

According to such a configuration, the backup pin can be supported by the edge of the through hole provided in the plate.

(3) The control unit calculates a first reference position, which is a center position of the backup pin captured in the first image, from the first image, and calculates the backup pin captured in the second image from the second image. calculating a second reference position that is the center position of the pin; calculating the inclination of the backup pin from the positional deviation amount between the first reference position and the second reference position; It is preferable to determine that the backup pin has an abnormality when it is larger than the above.

According to such a configuration, the first reference position is calculated from the first image, the second reference position is calculated from the second image, and the inclination of the backup pin is calculated from the positional deviation amount between the first reference position and the second reference position. can be calculated. Abnormality of the backup pin can be detected by comparing the amount of positional deviation with the threshold value.

(4) Preferably, the camera is a substrate imaging camera for recognizing the position of the substrate, and the substrate imaging camera is vertically movable.

According to such a configuration, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the first mark can be adjusted, and the first image can be satisfactorily captured. Also, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the second mark can be adjusted, and the second image can be captured satisfactorily.

(5) The plate may be arranged at a support position when backing up the substrate, and the plate may be movable above the support position.

With such a configuration, the plate can be moved upward from the support position, so by appropriately setting the height of the plate, the distance between the camera and the first mark can be adjusted, and the first image can be obtained satisfactorily. It can be imaged. Also, by appropriately setting the height of the plate, the distance between the camera and the second mark can be adjusted, and the second image can be captured satisfactorily.

(6) The component mounting apparatus of the present disclosure further includes a notification unit, and when it is determined that the backup pin has an abnormality, the control unit causes the notification unit to cause the backup pin to be displaced to the support unit. It is preferable to notify the operator of the impossibility.

With such a configuration, the operator can immediately correct the failure of the backup pin. As a result, it is possible to prevent production from being started in a state where the backup pin is abnormal.

(7) Preferably, the component mounting apparatus of the present disclosure further includes a display unit, and when it is determined that the backup pin has an abnormality, the control unit causes the display unit to display the position of the backup pin. .

According to such a configuration, it is possible for the operator to easily confirm the abnormality of the backup pin.

(8) The component mounting apparatus of the present disclosure further includes a display section, and when it is determined that the backup pin has an abnormality, the control section controls the other of the plurality of support sections instead of the support section. When it is set in advance that the backup pin can be arranged on the other supporting portion, it is preferable that the display portion displays the position of the other supporting portion.

According to such a configuration, when an abnormality is detected due to foreign matter being caught between the contact portion and the plate, the backup pin can be arranged on another support portion. Therefore, it is possible to omit the work of removing the foreign matter.

[Details of the embodiment of the present disclosure]
Embodiments of the present disclosure will be described below. The present disclosure is not limited to these examples, but is indicated by the scope of the claims, and is intended to include all modifications within the meaning and scope of equivalents of the scope of the claims.

<Embodiment 1>
Embodiment 1 will be described with reference to FIGS. 1 to 9. FIG. In the following description, the left-right direction in FIG. 1 is called the X-axis direction, the up-down direction in FIG. 2 is called the Y-axis direction, and the up-down direction in FIG. 2 is called the Z-axis direction. In real space, the positive direction in the Z-axis direction is upward. In the following description, the right side of FIG. 1 is called the upstream side, and the left side of the drawing is called the downstream side. Also, in the following description, the reference numerals in the drawings may be omitted except for some of the same constituent members.

[overall structure]
Embodiment 1, as shown in FIG. 1, illustrates a component mounting apparatus 1 that mounts a component E such as an electronic component on a substrate P such as a printed circuit board. The component mounting apparatus 1 includes a base 10, a transport conveyor 11, a head unit 12, a head transport section 13, a backup device 20 (see FIG. 2), two component imaging cameras 15, a board imaging camera 16 (an example of a camera), a tape It includes a component supply device 3, a control unit 30 shown in FIG. 5, an operation unit 31, and the like.

The base 10 has a square shape in plan view and has a flat upper surface. A rectangular frame indicated by a two-dot chain line in FIG. Although not shown in FIG. 1, below the working position A is a backup device 20 (see FIG. 2), which will be described later.

The transport conveyor 11 carries the board P from the upstream side in the X-axis direction to the work position A, and carries out the board P on which the component E is mounted at the work position A to the downstream side. The transport conveyor 11 includes a pair of conveyor belts 11A and 11B that are driven to circulate in the X-axis direction, a conveyor drive motor 42 (see FIG. 5) that drives the conveyor belts 11A and 11B, and the like. The upper conveyor belt 11A in the drawing is movable in the Y-axis direction, and the interval between the two conveyor belts 11A and 11B can be adjusted according to the width of the substrate P.

The head unit 12 rotates a plurality of (here, five) mounting heads 17 around an axis and raises and lowers them in the axial direction. The configuration of the head unit 12 will be described later.
The head transport section 13 transports the head unit 12 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head transport section 13 includes a beam 13A supporting the head unit 12 so as to be reciprocable in the X-axis direction, a pair of Y-axis guide rails 13B supporting the beam 13A so as to be reciprocable in the Y-axis direction, and the head unit 12. and an X-axis servomotor 38 for reciprocating the beam 13A in the X-axis direction, and a Y-axis servomotor 39 for reciprocating the beam 13A in the Y-axis direction.

The two component imaging cameras 15 are provided between the two tape component supply devices 3 arranged in the X-axis direction. The component imaging camera 15 is for capturing an image of the component E sucked by the mounting head 17 from below and recognizing the position and orientation of the component E, and is arranged with the imaging surface facing upward. .

A board imaging camera 16 is provided in the head unit 12 . The substrate imaging camera 16 is for imaging fiducial marks (not shown) attached to the substrate P and recognizing their positions, and is arranged with its imaging surface facing downward.
Further, in this embodiment, the substrate imaging camera 16 is a camera that images first marks 55A and second marks 55B of the backup pin 50, which will be described later.

The tape component supply devices 3 are arranged in two locations in the X-axis direction on both sides of the conveyer 11 in the Y-axis direction, for a total of four locations. A plurality of feeders 3A are attached to these tape component supply devices 3 so as to be aligned side by side in the X-axis direction. Each feeder 3A is a so-called tape feeder, and includes a reel (not shown) on which a component tape containing a plurality of components E is wound, and an electric tape delivery device for pulling out the component tape from the reel. , the parts E are supplied one by one from the part supply position provided at the end on the conveyer 11 side.

Here, the tape component supply device 3 will be described as an example of the component supply device, but the component supply device may be a so-called tray feeder that supplies a tray on which components E are placed, or a semiconductor wafer. It may be something to do.

[Head unit]
As shown in FIG. 2, the head unit 12 according to this embodiment is a so-called in-line type, in which a plurality of mounting heads 17 are arranged side by side in the X-axis direction. The head unit 12 also includes a Z-axis servomotor 40 (see FIG. 5) for individually raising and lowering these mounting heads 17 and an R-axis servomotor 41 (see FIG. 5) for simultaneously rotating these mounting heads 17 around the axis. ), etc. are provided.

Each mounting head 17 sucks and releases the component E, and has a nozzle shaft 17A and a suction nozzle 17B detachably attached to the lower end of the nozzle shaft 17A. Negative pressure and positive pressure are supplied to the suction nozzle 17B from an air supply device (not shown) through the nozzle shaft 17A. The suction nozzle 17B sucks the component E by being supplied with a negative pressure, and releases the component E by being supplied with a positive pressure.

Here, an in-line type head unit 12 will be described as an example, but the head unit 12 may be, for example, a so-called rotary head in which a plurality of mounting heads 17 are arranged on a circumference.

[Backup device]
As shown in FIG. 2, the backup device 20 backs up the board P when the component E is mounted on the board P. As shown in FIG. Specifically, before the board P is carried into the work position A, the backup device 20 is moved to a position where the upper end (more specifically, the upper end of the backup pin 50) is below the conveyor belts 11A and 11B. descending. When the substrate P is carried into the working position A, the backup device 20 is raised, and the substrate P is lifted by the plurality of backup pins 50 . As a result, the substrate P is supported from below by the backup device 20 . In other words, the substrate P is backed up.

As shown in FIG. 3, the backup device 20 includes a plurality of backup pins 50, an upper plate 22 (an example of a plate), a lower plate 23 arranged below the upper plate 22, four supports 25, and the lower plate 23. A lifting mechanism 26 and the like are provided.

[Backup pin]
FIG. 4 schematically shows part of the backup device 20. As shown in FIG. As shown in FIG. 4 , the backup pin 50 includes a cylindrical large-diameter portion 51 , a cylindrical small-diameter portion 52 extending downward from the lower end of the large-diameter portion 51 , and a flange-like portion extending from the lower end of the large-diameter portion 51 . It has a protruding contact portion 53 and a reduced diameter portion 54 extending upward from the upper end of the large diameter portion 51 . The reduced-diameter portion 54 has a truncated cone shape whose radial dimension decreases toward the top. An annular magnet 53</b>A is embedded in the lower surface of the contact portion 53 to attract the contact portion 53 to the upper plate 22 .

[1st mark, 2nd mark]
A band-shaped first mark 55A and a second mark 55B having a predetermined width in the vertical direction are provided on the outer peripheral surface of the reduced diameter portion 54 (not shown in FIGS. 2 and 3). The first mark 55A and the second mark 55B are arranged at different positions in the vertical direction, and in this embodiment, the second mark 55B is positioned above the first mark 55A. The first mark 55A and the second mark 55B are colored so that they can be recognized from above by the board imaging camera 16 .

[Upper plate, through hole]
The upper plate 22 is a flat metal member. As shown in FIG. 3, a plurality of through-holes 24 are formed in a matrix in the upper plate 22 so as to penetrate in the plate thickness direction. As shown in FIG. 4 , the inner diameter of the through hole 24 is larger than the outer diameter of the small diameter portion 52 of the backup pin 50 and smaller than the outer diameter of the contact portion 53 . In the upper plate 22, the periphery of the through hole 24 (in other words, the edge of the through hole 24) restricts the descent of the backup pin 50. As shown in FIG. Here, the hole edge portion of the through hole 24 is an example of the support portion.

The lower plate 23 is a plate-like member, and is connected to the upper plate 22 via pillars 25 rising from the four corners.

As shown in FIG. 2, the elevating mechanism 26 includes a plurality of ball screws 26A extending downward from the lower plate 23, ball nuts 26B screwed to the respective ball screws 26A, an elevating motor 43, the ball nuts 26B and the elevating motor 43. It has a belt 26C and the like that is wrapped around. When the lifting motor 43 is rotated, the ball nut 26B rotates via the belt 26C, and the ball screw 26A moves up and down. As a result, the backup device 20 moves up and down.

As shown in FIG. 4, the backup pin 50 has the small diameter portion 52 inserted into the through hole 24 from above, and the lower surface of the contact portion 53 contacts the hole edge of the through hole 24 of the upper plate 22, thereby further Descent is restricted. When the bottom surface of the contact portion 53 contacts the hole edge of the through hole 24 , the magnet 53A embedded in the bottom surface of the contact portion 53 is attracted to the upper surface of the metallic top plate 22 . Thereby, the vertical position of the backup pin 50 is fixed by the magnet 53A.

The normal position of the backup pin 50 on the upper plate 22 differs for each type of substrate P. As shown in FIG. This is because the positions at which the substrate P should be supported by the backup pins 50 differ depending on the size of the substrate P, the position of the portion where the component E is mounted, and the like. Here, among the plurality of through holes 24, those arranged at regular positions are referred to as regular through holes 24A.

Also, depending on the substrate P to be produced, the backup pin 50 to be erected in one regular through-hole 24A may be arranged in another through-hole 24 different from the regular through-hole 24A. In this embodiment, the alternative through-holes 24B that can be substituted for the regular through-holes 24A are set in this way. Here, the hole edge portion of the alternative through-hole 24B is an example of another support portion.

For example, as shown in FIG. 3, for the regular through-hole 24A arranged at the left end and the rear end of the upper plate 22, an alternative through-hole 24B is provided adjacent to the front of the regular through-hole 24A. There are cases. In this case, even if the backup pin 50 cannot be erected in the regular through hole 24A for some reason, the backup pin 50 can be quickly rearranged by erecting the backup pin 50 in the alternative through hole 24B instead. can be done.

[Electrical Configuration of Component Mounting Device]
As shown in FIG. 5, the component mounting apparatus 1 includes a control section 30 and an operation section 31. As shown in FIG. The control unit 30 includes an arithmetic processing unit 32, a motor control unit 33, a storage unit 34, an image processing unit 35, an external input/output unit 36, a feeder communication unit 37, and the like.

The arithmetic processing unit 32 includes a CPU, ROM, RAM, etc., and controls each unit of the component mounting apparatus 1 by executing a control program stored in the ROM. Note that the arithmetic processing unit 32 may include an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or the like instead of the CPU or in addition to the CPU.

The motor control unit 33 controls each motor such as an X-axis servomotor 38, a Y-axis servomotor 39, a Z-axis servomotor 40, an R-axis servomotor 41, a conveyor drive motor 42, and an elevating motor 43 under the control of the arithmetic processing unit 32. to rotate.

Various data are stored in the storage unit 34 . The various data include information on the number of boards P to be produced and types, information on the mounting coordinates and mounting angles of the components E, information on the mounting order of the components E, and the like.
Further, the storage unit 34 stores normal position data representing the positions of the normal through holes 24A in which the backup pins 50 are to be erected for each type of the board P. As shown in FIG. The normal position data is created in advance and stored in the storage unit 34 before the production of the substrate P is started.
Further, alternative position data representing the positions of alternative through-holes 24B in which the backup pins 50 can be arranged are stored in advance in the storage unit 34 for each type of substrate P instead of the regular positions.

The image processing unit 35 is configured to receive image signals output from the component imaging camera 15 and the board imaging camera 16, and generates a digital image based on the output image signals.
The external input/output unit 36 is a so-called interface, and is configured to receive detection signals output from various sensors 44 provided on the main body of the component mounting apparatus 1 . Also, the external input/output unit 36 is configured to control the operation of various actuators 45 based on control signals output from the arithmetic processing unit 32 .

The feeder communication unit 37 is connected to the feeder 3A and controls the feeder 3A in an integrated manner.
The operation unit 31 includes a display unit 31A such as a liquid crystal display, and an input unit 31B such as a touch panel, keyboard, and mouse. An operator can operate the operation unit 31 to perform various settings. In this embodiment, the display section 31A is an example of a notification section.

[Determination of Backup Pin Abnormality]
Determination of abnormality of the backup pin 50 will be described with reference to FIG. As shown in FIG. 7, some foreign matter 56 (for example, an electronic component) may be on the upper surface of the upper plate 22 . In that case, the backup pin 50 arranged on the upper plate 22 may be tilted due to the foreign matter 56 being caught between the contact portion 53 of the backup pin 50 and the hole edge portion of the through hole 24 of the upper plate 22 . There is

If the backup pin 50 is tilted, there is a risk that the backup pin 50 will hit the component E or the printed wiring mounted on the lower surface of the board P and damage them. Further, if the backup pin 50 is tilted, when the component E is mounted on the upper surface of the substrate P, there is a possibility that the original position where the component E should be mounted and the position where the component E is actually mounted may deviate. Further, if the backup pin 50 is tilted, the upper end of the backup pin 50 will not be in contact with the lower surface of the substrate P, and the substrate P may be bent at that portion.

In addition to the case where the backup pin 50 is tilted due to the foreign matter 56 being sandwiched between the contact portion 53 and the upper plate 22, for example, when the backup pin 50 itself is bent, the same operation as described above can be performed. things can happen.

In the component mounting apparatus 1 according to the present embodiment, the controller 30 controls the board imaging camera 16 to image the first marks 55A and the second marks 55B from above, and based on the obtained image, the inclination of the backup pins 50 is detected. to measure. This makes it possible to detect an abnormality of the backup pin 50 including a foreign object 56 sandwiched between the contact portion 53 and the upper plate 22, deformation of the backup pin 50, and the like.
The detection of abnormality in the backup pin 50 by the control unit 30 will be described in detail below.

[1st image, 2nd image]
The control unit 30 captures the first mark 55A of the backup pin 50 inserted into the through hole 24 of the upper plate 22 from above by the substrate imaging camera 16 to obtain a first image, and captures the second mark 55B from above. to obtain a second image. Before imaging the first mark 55</b>A, the control unit 30 appropriately sets the height of the upper plate 22 using the lifting mechanism 26 . During production of the board P, the upper plate 22 is arranged in the supporting position (see FIG. 2), so that the board imaging camera 16 can take an excellent image of the upper surface of the board P. FIG. In this embodiment, the lifting mechanism 26 can move the upper plate 22 above the support position. Therefore, the first mark 55A can be raised to the height position of the upper surface of the substrate P at the time of production, and the first mark 55A can be satisfactorily imaged by the substrate imaging camera 16. FIG. By adjusting the height of the upper plate 22 by the elevating mechanism 26 in the same manner as described above, the second mark 55B can be satisfactorily imaged by the substrate imaging camera 16 before imaging the second mark 55B.

[First reference position, second reference position, displacement amount]
Based on the first image, the controller 30 calculates a first reference position, which is the center position of the backup pin 50 shown in the first image in the horizontal plane (XY plane). Then, based on the second image, the control unit 30 calculates a second reference position, which is the central position in the horizontal plane of the backup pin 50 shown in the second image.
The control unit 30 calculates the positional deviation amount between the first reference position and the second reference position. The amount of misalignment can be used as a measure of the tilt of the backup pin 50 . The control unit 30 determines that the backup pin 50 is abnormal when the amount of positional deviation is larger than a preset threshold value.

[Determination when the backup pin is not tilted]
FIG. 6 shows a first image 61 (left part of FIG. 6) and a second image 62 (center part of FIG. 6) of the backup pin 50 shown in FIG. A combined composite image 63 (right part of FIG. 6) is shown. The backup pin 50 shown in FIG. 4 is properly erected relative to the top plate 22 and is not tilted. Therefore, as shown in FIG. 6, the first mark 55A shown in the first image 61 and the second mark 55B shown in the second image 62 are circular, and the center positions of the respective circles are the first reference position 64 and the second mark 55B. A second reference position 65 is set.
Since the first reference position 64 and the second reference position 65 overlap in the synthesized image 63 and the amount of positional deviation is zero, the control unit 30 determines that the backup pin 50 is not tilted, and the backup pin 50 is normal. judge not.

[Determination when the backup pin is tilted]
FIG. 8 shows a first image 71 (left part of FIG. 8) and a second image 72 (center part of FIG. 8) of the backup pin 50 shown in FIG. A merged composite image 73 (right part of FIG. 8) is shown. A foreign object 56 is sandwiched between the contact portion 53 of the backup pin 50 and the upper plate 22 shown in FIG. Therefore, as shown in FIG. 8, the widths of the belt-shaped portions of the first mark 55A shown in the first image 71 and the second mark 55B shown in the second image 72 are not constant. Here, the XY coordinate center position of the outer edge of the first mark 55A is defined as a first reference position 74, and the XY coordinate center position of the outer edge of the second mark 55B is defined as a second reference position 75.
In the synthesized image 73, the first reference position 74 and the second reference position 75 are shifted in the X-axis direction, so the controller 30 calculates the positional shift amount dX having a finite size. When the positional deviation amount dX is larger than the threshold, the control unit 30 determines that the backup pin 50 is tilted and determines that the backup pin 50 has an abnormality.

On the other hand, when the positional deviation amount dX is equal to or less than the threshold, the controller 30 determines that the backup pin 50 is normal. Here, the threshold value is set within a range that does not cause damage or bending of the substrate P as described above when the substrate P is backed up. Therefore, even when the amount of positional deviation dX has a finite magnitude and the inclination of the backup pin 50 is not zero, the controller 30 determines that there is no abnormality if the amount of positional deviation dX is equal to or less than the threshold value. there is

When the control unit 30 determines that the backup pin 50 is abnormal, the display unit 31A displays an error message indicating that the backup pin 50 cannot be inserted into the through hole 24, thereby indicating that the backup pin 50 is abnormal. Notify the operator.
Further, the control unit 30 causes the display unit 31A to display the position of the backup pin 50 having an abnormality. As a result, the operator can immediately recognize which backup pin 50 out of the plurality of backup pins 50 arranged on the upper plate 22 has an abnormality. Therefore, it becomes easier for the operator to confirm whether the backup pin 50 is abnormal.

When it is determined that the backup pin 50 is abnormal, the operator usually needs to perform at least the work of pulling out the backup pin 50 from the regular through hole 24A and the work of rearranging the backup pin 50 in the regular through hole 24A. There is For example, if a foreign object 56 is caught between the contact portion 53 and the upper plate 22, the foreign object 56 is removed after the backup pin 50 is pulled out from the regular through hole 24A, and the backup pin 50 is allowed to pass through the regular through hole. Relocate to hole 24A.
Also, if the backup pin 50 is deformed, a new backup pin 50 is rearranged in the regular through hole 24A. If the regular through hole 24A is damaged, the upper plate 22 is replaced with a new one, and the backup pin 50 is rearranged.

Further, when an alternative through-hole 24B to replace the regular through-hole 24A is set, the control unit 30, when determining that the backup pin 50 has an abnormality, displays the position of the alternative through-hole 24B on the display unit 31A. display. Therefore, the operator can quickly recognize the position of the alternative through-hole 24B in which the backup pin 50 can be erected.

When the alternative through-hole 24B is set as described above and the position of the alternative through-hole 24B is notified to the operator by the control unit 30, the operator's subsequent rearrangement work of the backup pin 50 may be facilitated. . For example, if the malfunction of the backup pin 50 is caused by a foreign object 56 being caught between the contact portion 53 and the upper plate 22, the operator pulls out the backup pin 50 from the normal through hole 24A, and then the display on the display portion 31A is displayed. , the backup pin 50 can be erected in the alternate through hole 24B to complete the repositioning operation. That is, it is not necessary to remove the foreign matter 56 from the edge of the regular through hole 24A.
In addition, if the regular through-hole 24A is damaged, the backup pin 50 can be quickly rearranged by using the alternative through-hole 24B without replacing the upper plate 22 .

[Backup pin abnormality determination process flow]
Next, with reference to FIG. 9, the flow of abnormality determination processing of the backup pin 50 by the control unit 30 will be described. This process is performed on the backup pins 50 erected in the regular through holes 24A of the upper plate 22 by the operator before starting the production of the substrates P. As shown in FIG.

The control unit 30 takes an image of the first mark 55A of the backup pin 50 arranged in the regular through hole 24A with the board imaging camera 16 to obtain a first image (S10). The controller 30 calculates a first reference position based on the first image (S20).

The control unit 30 takes an image of the second mark 55B of the backup pin 50 arranged in the regular through hole 24A with the board imaging camera 16 to obtain a second image (S30). The controller 30 calculates a second reference position based on the second image (S40).

The controller 30 calculates the positional deviation amount between the calculated first reference position and the second reference position (S50). If the amount of positional deviation is equal to or less than the preset threshold value (S60: NO), the controller 30 determines that there is no abnormality in the backup pin 50 (S70).
As described above, when the abnormality determination process is performed for the backup pin 50 shown in FIG. 4, the process proceeds from S60 to S70, and the abnormality determination process ends. In this case, since the backup pin 50 is normally erected, the production of the board P is started.

On the other hand, if the positional deviation amount is larger than the threshold (S60: YES), the control unit 30 determines that the backup pin 50 is tilted and determines that the backup pin 50 has an abnormality (S80).
As described above, the abnormality determination process is performed on the backup pin 50 shown in FIG. 7, and when the positional deviation amount dX in FIG. 8 is larger than the threshold value, the process proceeds from S60 to S80. If the positional deviation amount dX is equal to or less than the threshold, the process proceeds from S60 to S70 in the same manner as described above, and the abnormality determination process ends.

When it is determined that the backup pin 50 is abnormal, the control section 30 notifies the operator of the error by displaying an error message on the display section 31A (S90). In addition, the control unit 30 causes the display unit 31A to display the position of the backup pin 50 having an abnormality (S100), thereby facilitating the confirmation work of the backup pin 50 by the operator.

If the substitute through-hole 24B that replaces the regular through-hole 24A is not set for the backup pin 50 determined to be abnormal (S110: NO), the abnormality determination process ends. In this case, the operator rearranges the backup pins 50 .

On the other hand, if the alternative through-hole 24B that replaces the regular through-hole 24A is set in advance (S110: YES), the control unit 30 displays the position of the alternative through-hole 24B on the display unit 31A (S120). The determination process ends. When the alternative through-hole 24B is set, the operator may be able to quickly complete the rearrangement work of the backup pin 50 as described above.

When it is determined that there is an abnormality in the backup pin 50, the abnormality determination process ends, and the backup pin 50 is rearranged by the operator, the abnormality determination process is executed again by the control unit 30 (from S10). When it is determined that there is no abnormality in the abnormality determination process (S70), production of the substrate P is started.

[Effects of Embodiment 1]
As described above, the component mounting apparatus 1 of Embodiment 1 is a component mounting apparatus 1 that mounts a component E on a substrate P, and is capable of supporting the backup pins 50 that back up the substrate P from below and the backup pins 50 . An upper plate 22 (plate) provided with a plurality of support portions, a substrate imaging camera 16 (camera) that captures an image of the backup pins 50 supported by the support portions from above, and a control portion 30, and the backup pins 50 are , and a contact portion 53 capable of coming into contact with the support portion. The backup pin 50 is arranged at different positions in the vertical direction, and has a first mark 55A and a second mark 55A which can be recognized from above by the board imaging camera 16, respectively. 55B, and the control unit 30 obtains a first image by imaging the first mark 55A of the backup pin 50 supported by the support portion with the board imaging camera 16, and the backup pin 50 supported by the support portion. The second mark 55B is imaged by the substrate imaging camera 16 to obtain a second image, and the inclination of the backup pin 50 is measured based on the first image and the second image. Determine whether or not there is

According to such a configuration, the first mark 55A and the second mark 55B are provided at different positions in the vertical direction of the backup pin 50, so that the first image in which the first mark 55A is captured and the second mark 55B are captured. Based on the obtained second image, the inclination of the backup pin 50 can be measured, and it can be determined whether or not the backup pin 50 has an abnormality. Therefore, the abnormality of the backup pin 50 can be detected with a simple configuration in which the backup pin 50 is provided with the first mark 55A and the second mark 55B.

In Embodiment 1, the support portion is the edge of the through hole 24 into which the backup pin 50 can be inserted.

With such a configuration, the backup pin 50 can be supported by the edge of the through hole 24 provided in the upper plate 22 .

In the first embodiment, the control unit 30 calculates the first reference position, which is the center position of the backup pin 50 captured in the first image from the first image, and calculates the center position of the backup pin 50 captured in the second image from the second image. A second reference position, which is the central position, is calculated, the inclination of the backup pin 50 is calculated from the positional deviation amount between the first reference position and the second reference position, and if the positional deviation amount is larger than a preset threshold value, , it is determined that the backup pin 50 is abnormal.

According to such a configuration, the first reference position is calculated from the first image, the second reference position is calculated from the second image, and the positional deviation amount of the backup pin 50 is calculated from the positional deviation amount between the first reference position and the second reference position. The slope can be calculated. Abnormality of the backup pin 50 can be detected by comparing the amount of positional deviation with the threshold value.

In Embodiment 1, the upper plate 22 is arranged at the support position when backing up the substrate P, and the upper plate 22 is movable above the support position.

According to such a configuration, the upper plate 22 can be moved upward from the supporting position, so by appropriately setting the height of the upper plate 22, the distance between the board imaging camera 16 and the first mark 55A can be adjusted. and the first image can be captured satisfactorily. Also, by appropriately setting the height of the upper plate 22, the distance between the board imaging camera 16 and the second mark 55B can be adjusted, and the second image can be satisfactorily captured.

The component mounting apparatus 1 of Embodiment 1 further includes a display section 31A (annunciation section), and when it is determined that the backup pin 50 has an abnormality, the control section 30 causes the display section 31A to indicate the backup pin to the through hole 24. The operator is notified that placement of 50 is not possible.

With such a configuration, the operator can immediately correct the abnormality of the backup pin 50 . As a result, it is possible to prevent production from being started in a state where the backup pin 50 is abnormal.

In the first embodiment, when it is determined that the backup pin 50 is abnormal, the control section 30 causes the display section 31A to display the position of the backup pin 50 .

According to such a configuration, it is possible for the operator to easily check whether the backup pin 50 is abnormal.

In the first embodiment, when it is determined that the backup pin 50 has an abnormality, the control unit 30 arranges the backup pin 50 in the alternate through-hole 24B of the plurality of through-holes 24 instead of the regular through-hole 24A. When it is preset that it is possible, the position of the alternative through-hole 24B is displayed on the display section 31A.

According to such a configuration, when an abnormality is detected due to the foreign matter 56 being caught between the contact portion 53 and the upper plate 22, the backup pin 50 can be arranged in the alternative through hole 24B. Therefore, the work of removing the foreign matter 56 can be omitted.

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described in the above description and drawings, and the following embodiments are also included in the technical scope disclosed in this specification.

(1) In the above-described embodiment, by changing the height of the upper plate 22 by the lifting mechanism 26, the first marks 55A and the second marks 55B provided at different heights on the backup pin 50 can be satisfactorily imaged. However, it is not limited to this. For example, a board imaging camera for imaging the first mark and the second mark may be configured to be vertically movable. According to such a configuration, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the first mark can be adjusted, and the first image can be satisfactorily captured. Also, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the second mark can be adjusted, and the second image can be captured satisfactorily.

(2) In the above embodiment, the height of the upper plate 22 when imaging the first mark 55A is different from the height of the upper plate 22 when imaging the second mark 55B. Although the imaging and the imaging of the second mark 55B are performed separately, the configuration is not limited to this. For example, the plate may be set to a height at which both the first mark and the second mark can be satisfactorily imaged by the camera, and then the first mark and the second mark may be imaged at once. In such a configuration, the first image and the second image are one image similar to the synthesized image in the above embodiment, but the same effects as in the above embodiment are achieved.

(3) In the above embodiment, the first mark 55A and the second mark 55B are provided by coloring the reduced diameter portion 54, but the first mark and the second mark are formed by surface treatment or shape processing on the backup pin. It may be constituted so as to be recognizable by the camera by applying such as.

(4) In the above embodiment, the first marks 55A and the second marks 55B are provided along the entire circumference of the outer peripheral surface of the diameter-reduced portion 54. It may be provided in part.
(5) In the above embodiment, the first mark 55A and the second mark 55B were provided on the outer peripheral surface of the reduced diameter portion 54 with a space therebetween. The 1st mark 155A and the 2nd mark 155B may be provided on the outer peripheral surface of the diameter-reduced portion 54 so as to form one band. In other words, the outer peripheral surface of the diameter-reduced portion 54 may be colored in a band shape over the entire circumference, and the lower end portion of the colored portion may be the first mark 155A and the upper end portion may be the second mark 155B. .

(6) In the above embodiment, the backup pin 50 has the reduced diameter portion 54, and the reduced diameter portion 54 is provided with the first mark 55A and the second mark 55B. The aspect of the portion where the second mark 55B is provided is not limited to the diameter-reduced portion 54 . It is sufficient that the first mark and the second mark are arranged at different positions in the vertical direction and can be recognized from above by a camera such as a board imaging camera. For example, the backup pin may not have a reduced diameter portion, and the first mark may be provided on the upper surface of the contact portion, and the second mark may be provided on the upper end surface of the backup pin.

(7) In the above embodiment, the first reference position and the second reference position were the center positions of the backup pins 50 shown in the first image and the second image, respectively. can adopt any position from which the inclination of the backup pin can be calculated based on these.
(8) In the above embodiment, the display unit 31A is used as an example of a notification unit that notifies the operator of an error.

(9) In the above embodiment, the board imaging camera 16 is used as the camera for imaging the first mark 55A and the second mark 55B. good.
(10) In the above-described embodiment, the operation of placing the backup pin 50, removing the abnormal backup pin 50, and removing the foreign matter 56 are performed by the operator. may be configured to be automatically performed by
(11) In the above embodiment, the vertical position of the backup pin 50 is fixed by the magnet 53A, but the magnet may be omitted.

(12) In the above embodiment, the upper plate 22 is provided with the hole edges of the plurality of through holes 24 as an example of the plurality of support portions. It may be a flat surface and the backup pin may be supported by the plate only by the magnetic force of the magnet.

DESCRIPTION OF SYMBOLS 1... Component mounting apparatus, 3... Tape component supply apparatus, 3A... Feeder, 10... Base, 11... Conveyance conveyor, 11A... Conveyor belt, 12... Head unit, 13... Head conveyance part, 13A... Beam, 13B...Y Axis guide rail 15 Component imaging camera 16 Board imaging camera (an example of camera) 17 Mounting head 17A Nozzle shaft 17B Suction nozzle 20 Backup device 22 Upper plate (an example of plate) 23 Lower plate 24 Through hole 24A Regular through hole 24B Substitute through hole 25 Strut 26 Lifting mechanism 26A Ball screw 26B Ball nut 26C Belt 30 Control unit 31 Operation unit 31A Display unit (an example of notification unit) 31B Input unit 32 Arithmetic processing unit 33 Motor control unit 34 Storage unit 35 Image processing unit 36 External input/output unit 37 Feeder communication unit 38 X-axis servomotor 39 Y-axis servomotor 40 Z-axis servomotor 41 R-axis servomotor 42 Conveyor drive motor 43 Lifting motor 44 Sensors, 45 Actuators 50, 150 Backup pin 51 Large diameter portion 52 Small diameter portion 53 Contact portion 53A Magnet 54 Reduced diameter portion 55A, 155A First mark 55B, 155B Second mark 56 Foreign matter 61, 71 First image 62, 72 Second image 63, 73 Combined image 64, 74 First reference position 65, 75 Second reference position A Work position, E...part, P...board, dX...positional deviation amount

Claims (8)

A component mounting apparatus for mounting components on a substrate,
a backup pin that backs up the substrate from below;
a plate provided with a plurality of support portions capable of supporting the backup pin;
a camera that captures an image of the backup pin supported by the support from above;
a control unit;
The backup pin includes a contact portion that can contact the support portion,
The backup pin has a first mark and a second mark that are arranged at different positions in the vertical direction and that can be recognized by the camera from above,
The control unit acquires a first image by imaging the first mark of the backup pin supported by the support unit with the camera,
Acquiring a second image by imaging the second mark of the backup pin supported by the support portion with the camera;
A component mounting apparatus that determines whether or not there is an abnormality in the backup pin by measuring the inclination of the backup pin based on the first image and the second image. 2. The component mounting apparatus according to claim 1, wherein said support portion is a hole edge portion of a through hole into which said backup pin can be inserted. The control unit calculates a first reference position, which is a center position of the backup pin reflected in the first image, from the first image,
calculating a second reference position, which is the center position of the backup pin shown in the second image, from the second image;
calculating an inclination of the backup pin from a positional deviation amount between the first reference position and the second reference position;
3. The component mounting apparatus according to claim 1, wherein it is determined that said backup pin is abnormal when said amount of positional deviation is greater than a preset threshold value. The camera is a board imaging camera for recognizing the position of the board,
4. The component mounting apparatus according to claim 1, wherein said board imaging camera is vertically movable. The plate is arranged at a supporting position when backing up the substrate,
5. The component mounting apparatus according to claim 1, wherein said plate is movable above said support position. Further equipped with a notification unit,
6. When it is determined that the backup pin is abnormal, the controller notifies the operator that the backup pin cannot be placed on the support part by the notification unit. The component mounting apparatus according to any one of 1. Furthermore, it has a display unit,
7. The component mounting apparatus according to any one of claims 1 to 6, wherein, when it is determined that said backup pin is abnormal, said control section causes said display section to display the position of said backup pin. Furthermore, it has a display unit,
When it is determined that the backup pin has an abnormality, the control unit is preset to be able to arrange the backup pin on another support portion among the plurality of support portions instead of the support portion. 8. The component mounting apparatus according to any one of claims 1 to 7, wherein the display section displays the position of the other support section when the other support section is mounted.

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