JP4952320B2 - Coating liquid application equipment - Google Patents

Coating liquid application equipment Download PDF

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JP4952320B2
JP4952320B2 JP2007072387A JP2007072387A JP4952320B2 JP 4952320 B2 JP4952320 B2 JP 4952320B2 JP 2007072387 A JP2007072387 A JP 2007072387A JP 2007072387 A JP2007072387 A JP 2007072387A JP 4952320 B2 JP4952320 B2 JP 4952320B2
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base
coating liquid
substrate
support
holder
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JP2008229492A (en
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秀樹 池内
佳久 東田
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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本発明は、塗液の塗布装置に関する。特に、プラズマディスプレイパネル(以下、「PDP」と略称することもある。)に代表されるディスプレイパネル、液晶用カラーフィルター(LCM)、光学フィルタ、プリント基板、半導体の塗液を塗布するような分野に使用可能であり、例えばPDP製造工程における、ガラス基板など被塗布対象物表面にストライプパターンを形成するにあたって好適に用いられる塗液の塗布装置に関するものである。   The present invention relates to a coating liquid coating apparatus. In particular, a display panel represented by a plasma display panel (hereinafter, also abbreviated as “PDP”), a liquid crystal color filter (LCM), an optical filter, a printed circuit board, a field where a semiconductor coating liquid is applied. For example, the present invention relates to a coating liquid coating apparatus suitably used for forming a stripe pattern on the surface of an object to be coated such as a glass substrate in a PDP manufacturing process.

一般にPDPは、前面板と背面板の間に形成された放電空間内で放電を生じさせることで、キセノンガスから波長147nmを中心とする紫外線を生じ、この紫外線が蛍光体を励起することによって表示が可能となる。R(赤)、G(緑)、B(青)に発光する蛍光体を塗り分けた放電セルを駆動回路によって発光させることにより、フルカラー表示に対応できる。   In general, a PDP generates discharge in a discharge space formed between a front plate and a back plate, thereby generating an ultraviolet ray centering on a wavelength of 147 nm from a xenon gas, and this ultraviolet ray excites a phosphor to enable display. It becomes. Full-color display can be supported by causing the drive circuit to emit light by separately emitting discharge cells in which phosphors emitting light of R (red), G (green), and B (blue) are separately applied.

このPDPには、電極が放電空間に露出している直流型(DC型)と、絶縁層で覆われている交流型(AC型)の2タイプがある。AC型は、表示電極/誘電体層/保護層を形成した前面ガラス板と、アドレス電極/誘電体層/リブ層/蛍光体層を形成した背面ガラス板とを貼り合わせ、ストライプ状あるいは格子状の隔壁で仕切られた放電空間内にHe-Xe、または、Ne-Xeの混合ガスを封入した構造を有している。R、G、Bの各蛍光体層は、粉末状の蛍光体粒子を主成分とする蛍光体ペーストが、背面板に形成された色毎に一方向に延びる隔壁により形成された凹部に充填されてなる。このような構造のものを高い生産性と高品質で製造するには、蛍光体を一定のパターン状に塗り分ける技術が重要となる。   There are two types of PDPs: a direct current type (DC type) in which electrodes are exposed in a discharge space, and an alternating current type (AC type) in which an electrode is covered with an insulating layer. For AC type, a front glass plate on which display electrodes / dielectric layers / protective layers are formed and a rear glass plate on which address electrodes / dielectric layers / rib layers / phosphor layers are formed are bonded together in a striped or grid shape He—Xe or Ne—Xe mixed gas is enclosed in the discharge space partitioned by the barrier ribs. In each of the phosphor layers of R, G, and B, a phosphor paste mainly composed of powdered phosphor particles is filled in recesses formed by barrier ribs extending in one direction for each color formed on the back plate. It becomes. In order to manufacture a product having such a structure with high productivity and high quality, a technique of coating phosphors in a certain pattern is important.

この種の塗布工程には、従来、スクリーン印刷が使用されていたが、近年においては、複数の吐出孔を有する口金を使用し、この口金を背面板と対向させ、相対的に移動させながら、蛍光体ペーストを凹部に充填する方法が検討、提案されている(特許文献1参照)。   Conventionally, screen printing has been used for this type of coating process, but in recent years, a base having a plurality of discharge holes is used, and the base is opposed to the back plate, while relatively moving, A method of filling the recess with the phosphor paste has been studied and proposed (see Patent Document 1).

この方法では、背面板と口金吐出孔出口との距離(以降、ギャップとする)は、数十μmから数百μm程度である。背面板の凹部に、複数の吐出孔から均一に蛍光体ペーストを充填するには、このギャップを全吐出孔で等しく、かつ、適切な範囲に設定する必要がある。ギャップが狭いと背圧によってペーストが出にくく、所望の吐出量を凹部に充填することができない。更に狭くなれば、ペーストが吐出孔周りに付着して塗布すらできなくなる。また、ギャップが広いと、吐出孔から出たペーストの柱状流が、口金と背面板の相対移動によって生じた随伴流の影響を受けてふらつき、凹部に塗布できなくなる。よってギャップは、全吐出孔均一に、かつ、適切な範囲に設定する必要がある。   In this method, the distance between the back plate and the base discharge hole outlet (hereinafter referred to as a gap) is about several tens of μm to several hundreds of μm. In order to uniformly fill the concave portion of the back plate with the phosphor paste from the plurality of discharge holes, it is necessary to set the gap to be equal to all discharge holes and within an appropriate range. If the gap is narrow, it is difficult for the paste to come out due to the back pressure, and the desired discharge amount cannot be filled in the recess. If it becomes narrower, the paste adheres to the periphery of the discharge hole and cannot be applied. Also, if the gap is wide, the columnar flow of the paste coming out of the ejection holes will fluctuate under the influence of the accompanying flow generated by the relative movement of the base and the back plate, and cannot be applied to the recesses. Therefore, it is necessary to set the gap in an appropriate range uniformly in all the discharge holes.

しかしながら、背面板は大型化する傾向にあり、それに伴い口金も長尺化され、背面板を載せるテーブルも大きくなり、口金と背面板のギャップを均一に保つのが難しくなっている。これは、口金の自重たわみによる変形が無視できなくなり、また、テーブルも自重たわみによる変形でその平面度が悪くなるためである。その結果、大型の背面板への蛍光体ペーストの塗布を精度良く行うことができないという問題があった。   However, the back plate tends to increase in size, the base is lengthened accordingly, the table on which the back plate is placed becomes large, and it is difficult to keep the gap between the base and the back plate uniform. This is because the deformation due to the self-weight deflection of the base cannot be ignored, and the flatness of the table also deteriorates due to the deformation due to the self-weight deflection. As a result, there is a problem that the phosphor paste cannot be accurately applied to the large back plate.

塗液供給側と被塗布部材との間隙を一定に保つ方法としては、上述のような多数の吐出孔を有する口金ではないが、たとえばスリットダイの保持手段を工夫し、スリットダイのスリットと基板表面との間のクリアランスを均一に保つ方法が提案されている(特許文献2)。具体的には、スリットダイをダイ支持部材に下から押し当て、ボルトをダイ支持部材の上方から挿入し、スリットダイをダイ支持部材に固定する方法が開示されている。   As a method of keeping the gap between the coating liquid supply side and the member to be coated constant, it is not a die having a large number of discharge holes as described above, but for example, a slit die holding means is devised so that the slit die slit and the substrate A method for maintaining a uniform clearance from the surface has been proposed (Patent Document 2). Specifically, a method is disclosed in which a slit die is pressed against a die support member from below, a bolt is inserted from above the die support member, and the slit die is fixed to the die support member.

しかしながら、特許文献2記載の方法では、まず、スリットダイをダイ支持部材に下から当接する際、スリットダイが1mを越える長尺物になると、スリットダイを水平な状態で当接することが難しい。その結果、スリットダイとダイ支持部材との当接面に隙間が開いた状態、かつ、その程度が左右異なる状態でボルトを締め付けることになる。そのためボルトが入らなくなったり、あるいは、当接面に隙間が開いた状態で固定されたりして、かえって精度良く支持できないという問題があった。またこの隙間は、スリットダイの交換の度にその程度が変わるため、スリットダイの取付精度に再現性がなく、よって、スリットダイと基板表面との間のクリアランスの精度も、交換の度に変わるという問題があった。また、スリットダイの撓み量は小さくできるものの、テーブルがその自重撓みで変形する場合には、スリットダイとテーブル間(基板間)のクリアランス精度が悪くなり、よって、テーブル自身の変形を小さくする技術が別途必要となる。   However, in the method described in Patent Document 2, first, when the slit die is brought into contact with the die support member from below, if the slit die becomes a long object exceeding 1 m, it is difficult to contact the slit die in a horizontal state. As a result, the bolt is tightened in a state where a gap is opened on the contact surface between the slit die and the die support member, and the degree of the difference is left and right. For this reason, there is a problem that the bolt cannot be inserted or it is fixed with a gap on the contact surface, so that it cannot be supported with high accuracy. In addition, since the degree of this gap changes every time the slit die is replaced, the slit die mounting accuracy is not reproducible. Therefore, the accuracy of the clearance between the slit die and the substrate surface also changes with each replacement. There was a problem. In addition, although the amount of deflection of the slit die can be reduced, when the table is deformed by its own weight, the clearance accuracy between the slit die and the table (between the substrates) is deteriorated, and therefore the technology for reducing the deformation of the table itself. Is required separately.

さらに、特許文献3には、スリットダイを保持するための保持部の剛性を高めずに、クリアランスを均一にする技術が開示されている。その保持部は、横断面図で見ればL字型をしており、スリットダイは腰掛けるように保持される。   Furthermore, Patent Document 3 discloses a technique for making the clearance uniform without increasing the rigidity of the holding portion for holding the slit die. The holding part is L-shaped in a cross-sectional view, and the slit die is held so as to be seated.

しかしながらこの方法では、まず、スリットダイを片持ちで支えることになり、支えていない方向にスリットダイが倒れやすい。この倒れを防ぐためには、スリットダイの長手軸方向に回転機構を設けることもできるが、装置が複雑になり、装置コストがアップする。また、事前にその倒れを見込んで、その保持部の係止面を傾けておくこともできるが、品種変更でスリットダイの長さ、重量が変わり、前倒れの程度も変わる。よって、この回転角度の事前調整は、品種変更の度に調整が必要となり、煩わしい。また、保持部はスリットダイを片持ちで支える構造であるため剛性が低く、塗布中の動作や、塗布の前にスリットダイを基板面に近づけるための上下方向の動作で保持部とスリットダイが振動し、横段などの塗布欠点が発生しやすい。更に、塗布の前にはスリット部をクリーニング装置、例えばゴムロールに布を巻いたようなものをスリット部に押し当てて摺動させ、クリーニングすることが一般的であるが、ゴムロールをスリット部に押し当てた際、保持部は剛性がないために変形し、スリットダイが逃げる。それにより、ゴムロールとスリット部の長手方向に面圧ムラが生じ、きれいにクリーニングできず、塗布欠点が発生しやすい。
特開平10−27543号公報 特開2003−282394号公報 特開2001−259500号公報
However, in this method, first, the slit die is supported in a cantilever manner, and the slit die is likely to fall down in a direction in which it is not supported. In order to prevent this collapse, a rotation mechanism can be provided in the longitudinal axis direction of the slit die, but the apparatus becomes complicated and the apparatus cost increases. In addition, the locking surface of the holding portion can be tilted in anticipation of the tipping in advance, but the length and weight of the slit die change with the change of product type, and the degree of tipping down also changes. Therefore, this prior adjustment of the rotation angle requires adjustment every time the product type is changed, and is troublesome. In addition, since the holding part has a structure that supports the slit die in a cantilevered manner, the rigidity is low, and the holding part and the slit die are moved during the application or in the vertical direction to bring the slit die close to the substrate surface before application. Vibration and application defects such as horizontal steps are likely to occur. In addition, before application, it is common to clean the slit part by pressing it against a cleaning device, for example, a rubber roll with a cloth wound around the slit part. When applied, the holding part is deformed due to lack of rigidity, and the slit die escapes. As a result, surface pressure unevenness occurs in the longitudinal direction of the rubber roll and the slit portion, and clean cleaning cannot be performed, and application defects are likely to occur.
Japanese Patent Laid-Open No. 10-27543 JP 2003-282394 A JP 2001-259500 A

本発明は、上記に鑑みてなされたものであって、口金を装着したときのホルダー全体としての剛性を容易に高めることができ、口金の取付け、取り外しを繰り返しても、口金と口金ホルダーを定位置に精度良く、再現性良く固定でき、口金と基板間のギャップを口金全長に渡って均一に設定、維持し易く、塗液を高品位に塗布することが容易な塗液の塗布装置を提供する。   The present invention has been made in view of the above, and can easily increase the rigidity of the entire holder when the base is mounted, and the base and the base holder can be defined even when the base is repeatedly attached and detached. Providing a coating liquid application device that can be fixed with high accuracy and reproducibility, and the gap between the base and the substrate can be set and maintained uniformly over the entire length of the base, making it easy to apply coating liquid with high quality. To do.

上記目的を達成するために、本発明に係る塗布装置は、基板を固定するテーブルと、基板に塗液を塗布する口金と、口金を基板に対面して支持する口金ホルダーと、テーブルと口金とを3次元的に相対移動させる移動手段とを備えた塗布装置であって、前記口金ホルダーは、口金の長手方向に関して、中央位置および該中央位置から口金の長手方向両端に向かって等間隔に離れた少なくとも2箇所の位置に、口金を下方から支持する支持部を有し、かつ、該支持部のうち前記少なくとも2箇所の位置にある支持部のみに、口金をホルダーに固定する固定手段を有する。   In order to achieve the above object, a coating apparatus according to the present invention includes a table for fixing a substrate, a base for applying a coating solution to the substrate, a base holder for supporting the base facing the substrate, a table and a base. And a moving means for moving the base in a three-dimensional manner, wherein the base holder is spaced apart at equal intervals in the longitudinal direction of the base from the central position and from the central position toward both ends of the base in the longitudinal direction. In addition, there are support portions that support the base from below at at least two positions, and a fixing means that fixes the base to the holder only at the support portions at the at least two positions of the support portions. .

また、前記口金は、口金の長手方向の長さをL、口金の中央位置から前記少なくとも2箇所の位置までの距離をLSとした時、LとLSが次式を満足することが好ましい。   Further, when the length of the base in the longitudinal direction of the base is L and the distance from the central position of the base to the at least two positions is LS, it is preferable that L and LS satisfy the following formula.

0.25≦LS/L≦0.50 (1)
また、前記口金ホルダーは、それぞれ長手方向が前記口金の長手方向と平行で、幅方向が前記口金の高さ方向と平行になるように、かつ、互いに対向するように配された2枚の板状部と、該2枚の板状部の間に、該板状部に交差するように配された、前記支持部を有する口金保持部とを有することが好ましい。
0.25 ≦ LS / L ≦ 0.50 (1)
In addition, the base holder has two plates arranged such that the longitudinal direction thereof is parallel to the longitudinal direction of the base, the width direction thereof is parallel to the height direction of the base, and facing each other. It is preferable to have a base part and a base holding part having the support part arranged so as to intersect the plate part between the two plate parts.

また、前記口金は、前記支持部と接する載置部を有し、前記固定手段は、該載置部を貫通し、かつ前記支持部に締結されるボルトであることが好ましい。   Moreover, it is preferable that the said base has a mounting part which contacts the said support part, and the said fixing means is a volt | bolt penetrated through this mounting part and fastened to the said support part.

また、前記少なくとも2箇所の位置にある支持部は前記載置部との接触面が円であり、その中央をボルトが貫通することが好ましい。   Moreover, it is preferable that the contact part with the said mounting part is a circle | round | yen, and a volt | bolt penetrates the center in the support part in the said at least 2 position.

本発明は、口金ホルダーが、口金の長手方向に関して、中央位置および該中央位置から口金の長手方向両端に向かって等間隔に離れた少なくとも2箇所の位置に、口金を下方から支持する支持部を有するので、広幅口金でも口金ホルダーに装填しやすく、かつ、口金の載置部を口金ホルダーの支持部材に確実に当接させることができる。そのため、口金を交換しても、口金と口金ホルダーを絶えず定位置に、精度良く固定できる。これより、口金と基板間のギャップを口金全長に渡って絶えず均一に維持でき、塗液を高品位に塗布することができる。   The present invention provides a support unit for supporting the base from below at a central position and at least two positions spaced apart from the central position toward both ends of the base in the longitudinal direction with respect to the longitudinal direction of the base. Therefore, even a wide base can be easily loaded into the base holder, and the mounting portion of the base can be reliably brought into contact with the support member of the base holder. Therefore, even if the base is replaced, the base and the base holder can be fixed at a fixed position with high accuracy. Thus, the gap between the die and the substrate can be constantly maintained over the entire length of the die, and the coating liquid can be applied with high quality.

また、口金をその長手方向に関して対称に支えているので、口金が捻れることを防ぐこともでき、これより、口金と基板間のギャップを均一にするための支持部材の高さの調整が、ギャップ調整に直接的に効き、調整しやすい。   In addition, since the base is supported symmetrically with respect to its longitudinal direction, it is possible to prevent the base from being twisted, and from this, adjustment of the height of the support member to make the gap between the base and the substrate uniform, It works directly on gap adjustment and is easy to adjust.

更に、支持部のうち中央から等間隔に離れた少なくとも2箇所の支持部のみで口金をホルダーに固定するので、口金は口金ホルダーの変形の影響を受けがたく、口金と基板間のギャップを口金全幅において均一に維持しやすく、塗液を高品位に塗布することが容易になる。   In addition, since the base is fixed to the holder by only at least two support parts that are equidistant from the center of the support part, the base is not easily affected by the deformation of the base holder, and the gap between the base and the substrate is limited. It is easy to maintain the entire width uniformly, and it becomes easy to apply the coating liquid with high quality.

本発明の塗液の塗布装置は、基板を固定するテーブルと、基板に塗液を塗布する口金と、口金を基板に対面して支持するための口金ホルダーと、テーブルと口金とを3次元的に相対移動させる移動手段とを備えるもので、たとえば、プラズマディスプレイパネル用部材における蛍光体塗布工程に特に好ましく適用することができるものである。すなわち、赤、緑、青の3種類のいずれかの色に発光する蛍光体粉末を含む蛍光体ペーストをプラズマディスプレイパネル用基板に塗布する際に好適に用いることができる。   The coating liquid coating apparatus of the present invention includes a table for fixing a substrate, a base for applying the coating liquid to the substrate, a base holder for supporting the base facing the substrate, and a table and the base in a three-dimensional manner. For example, and can be applied particularly preferably to a phosphor coating step in a member for a plasma display panel. That is, it can be suitably used when a phosphor paste containing phosphor powder that emits light in any one of the three colors of red, green, and blue is applied to a substrate for a plasma display panel.

図1に、本発明の一実施態様に係る塗液の塗布装置の概略斜視図を示し、図2に、口金ホルダーの詳細図を示す。図2(a)は正面図、(b)は上面図、(c)は口金2を外した時の口金ホルダーの上面図、(d)は縦断面図であり、(e)はB−Bでの断面図であり、(f)は固定手段を有する支持部のC−C断面図である。   FIG. 1 shows a schematic perspective view of a coating liquid coating apparatus according to an embodiment of the present invention, and FIG. 2 shows a detailed view of a base holder. 2A is a front view, FIG. 2B is a top view, FIG. 2C is a top view of the base holder when the base 2 is removed, FIG. 2D is a longitudinal sectional view, and FIG. (F) is CC sectional drawing of the support part which has a fixing means.

これら図に示すように、本発明において口金ホルダー1は、口金2の長手方向に関して、中央位置および該中央位置から口金2の長手方向両端に向かって等間隔に離れた少なくとも2箇所の位置に、口金2を下方から支持する支持部3を有している。   As shown in these figures, in the present invention, the base holder 1 is in a central position with respect to the longitudinal direction of the base 2 and at at least two positions spaced from the central position toward both ends in the longitudinal direction of the base 2 at equal intervals. It has a support portion 3 that supports the base 2 from below.

ここで、口金2を支える支持部3の位置は、一般的に口金2の撓みが極力小さくなる位置であることが好ましい。そのため、特に長尺の口金2に対しては、支持部と支持部の間隔を極力狭くし、つまり、口金2の長手方向に沿って支持部を多数設ければよいと考えるのが一般的である。ここで気を付けなければならないことは、各支持部の高さのばらつきを数μm程度に抑え、支持部が口金2に均一に接触するようにすることである。各支持部の高さが不揃いで、口金2に接触しない支持部がある場合、かえって口金2のたわみが大きくなることがある。そのために口金ホルダー1や各支持部の高さを高精度に仕上げる必要があるが、1mを越える長尺の口金の場合、口金ホルダーも長尺となり、支持部の高さばらつきを数μmに抑える加工は非常に難しい。そこで支持部の高さを調整可能にしておくこともできるが、その場合、支持部の数が多ければ調整作業が極めて繁雑になり、好ましくない。従って、口金ホルダーの支持部の数は少ない方が好ましく、2点で支持することが考えられる。   Here, it is preferable that the position of the support portion 3 that supports the base 2 is generally a position where the deflection of the base 2 is minimized. Therefore, especially for the long base 2, it is generally considered that the distance between the support portions is made as narrow as possible, that is, it is only necessary to provide a large number of support portions along the longitudinal direction of the base 2. is there. What should be noted here is that the variation in the height of each support portion is suppressed to about several μm so that the support portion contacts the base 2 uniformly. When the height of each support part is uneven and there is a support part that does not contact the base 2, the deflection of the base 2 may be increased. Therefore, it is necessary to finish the base holder 1 and the height of each supporting part with high precision. However, in the case of a base having a length exceeding 1 m, the base holder is also long, and the height variation of the supporting part is suppressed to several μm. Processing is very difficult. Therefore, the height of the support portion can be adjusted, but in that case, if the number of support portions is large, the adjustment work becomes extremely complicated, which is not preferable. Therefore, it is preferable that the number of support portions of the base holder is small, and it is conceivable to support at two points.

一方、口金ホルダー1は塗布機の構造上、両端で支持されることが多く、よってその自重で撓み、口金ホルダー1の中央が下がる傾向にある。これより、支持部の口金2との当接面も口金ホルダー中央に向かって傾く傾向にあり、この状態で口金2を搭載した場合、口金側の対支持部当接面が、支持部の口金2との当接面に倣うことになる。すなわち、口金2も撓み、その中央が下がることになる。よって2点で支えた場合は、口金2も口金ホルダー1と共に撓むことになり、口金2と基板4のギャップのバラツキが大きくなる。   On the other hand, the base holder 1 is often supported at both ends due to the structure of the coating machine, and therefore tends to be bent by its own weight and the center of the base holder 1 is lowered. Accordingly, the contact surface of the support portion with the base 2 also tends to be inclined toward the center of the base holder, and when the base 2 is mounted in this state, the contact surface on the side of the base is the base portion of the support portion. 2 is followed. That is, the base 2 is also bent and its center is lowered. Therefore, when it is supported at two points, the base 2 also bends together with the base holder 1, and the gap between the base 2 and the substrate 4 becomes large.

そこで本発明においては、口金2の支持部3を、口金ホルダーの、口金の長手方向に関して中央位置および中央位置から口金の長手方向両端に向かって等間隔に離れた少なくとも2箇所の位置に設ける。これにより、口金ホルダー1の撓み量を予め測定しておき、中央位置にある支持部3の高さをその撓み分、もしくはそれ以上、上に上げておけば、たとえ口金ホルダー1が撓んでも、口金2が撓むことはない。   Therefore, in the present invention, the support portions 3 of the base 2 are provided at the center position of the base holder and at at least two positions that are equally spaced from the central position toward both ends of the base in the longitudinal direction of the base. Thus, if the amount of bending of the base holder 1 is measured in advance and the height of the support portion 3 at the center is raised above that amount of deflection or more, even if the base holder 1 is bent. The base 2 will not bend.

なお、中央位置とは、口金2の長手方向中心から、口金長さの±10%の範囲のことであり、複数の支持部のうちの一つが実質的に中央にあればよい。つまり、口金長さが1mの場合、口金2の中心から±10cmの範囲に支持部を設ければ同様の効果が得られる。また、等間隔とは、中央位置に設けられた支持部以外の複数の支持部の、該中央位置に設けられた支持部からの距離の差が、口金長さの±10%以内であることをいい、該中央位置に設けられた支持部からの距離が実質的に等間隔であればよい。   The center position means a range of ± 10% of the length of the base from the center in the longitudinal direction of the base 2, and one of the plurality of support portions may be substantially in the center. That is, when the base length is 1 m, the same effect can be obtained by providing a support portion within a range of ± 10 cm from the center of the base 2. In addition, the equal interval means that the difference in distance between the plurality of support portions other than the support portion provided at the central position from the support portion provided at the central position is within ± 10% of the base length. The distance from the support portion provided at the central position may be substantially equal.

そして、本発明において、支持部3は口金2を下方から支持するものである。したがって、口金2を一旦載置した後に固定することができ、長尺の口金2を保持させる場合であっても、口金交換、取付作業毎に取付精度がばらつくことは少なく、精度良く、再現性良く、口金2を取り付けることができる。   And in this invention, the support part 3 supports the nozzle | cap | die 2 from the downward direction. Accordingly, the base 2 can be fixed after being placed once, and even when the long base 2 is held, the mounting accuracy does not vary every time the base is replaced or mounted, and the reproducibility is high. Well, the base 2 can be attached.

本発明において、口金2は、口金ホルダー1に固定する。そのため、口金ホルダー1の支持部3のうち、口金長手方向の中央位置から長手方向両端に向かって等間隔に離れた少なくとも2箇所の位置に設けられた支持部3bは、口金2を口金ホルダー1に固定する固定手段を有する。口金2の支持部3bへの固定は、口金2を支持部3bへ上から押さえるように固定するのが好ましい。これより、口金2を支持部3へ載せた時と同じ状態(精度)で口金2を固定することができる。その固定手段としてはクランプやボルトがあるが、簡単な構成、つまり安価で、確実に固定できるボルトが好ましい。ボルトを、口金2の載置部5を貫通させて支持部に挿入し、締結する。さらに、ボルトの軸と支持部の中心軸を合わせることが好ましい。これにより、ボルトの締結力が支持部と載置部に均一に伝わり、支持部と載置部とを確実に接触させることができる。   In the present invention, the base 2 is fixed to the base holder 1. For this reason, among the support portions 3 of the base holder 1, the support portions 3 b provided at at least two positions spaced at equal intervals from the central position in the longitudinal direction of the base toward the both ends in the longitudinal direction. It has a fixing means to fix to. The base 2 is preferably fixed to the support portion 3b so that the base 2 is pressed onto the support portion 3b from above. Thus, the base 2 can be fixed in the same state (accuracy) as when the base 2 is placed on the support portion 3. The fixing means includes a clamp and a bolt, but a simple configuration, that is, a bolt that is inexpensive and can be fixed securely is preferable. The bolt is inserted into the support portion through the mounting portion 5 of the base 2 and fastened. Furthermore, it is preferable to match the axis of the bolt with the central axis of the support portion. Thereby, the fastening force of the bolt is uniformly transmitted to the support portion and the placement portion, and the support portion and the placement portion can be reliably brought into contact with each other.

一方、中央の支持部3aにおいては口金2を固定せずに、口金2をただ載せておくことが好ましい。なぜなら、支持部や口金の載置部には、加工精度や取付精度で若干の傾きが生じており、その支持部に口金を押さえ込むようにして固定すると、その若干の傾きに口金が倣い、変形してしまう。特に口金の中央の高さの変化は、即、口金と基板のギャップ精度に現れる、つまり敏感なところである。よって、中央の支持部は固定せずに、ただ載せておくのが好ましい。   On the other hand, it is preferable that the base 2 is simply placed on the central support portion 3 a without fixing the base 2. This is because the support part and the mounting part of the base have a slight inclination in terms of processing accuracy and mounting accuracy. When the base is pressed against the support part and fixed, the base follows the slight inclination and deforms. Resulting in. In particular, the change in the height of the center of the base immediately appears in the gap accuracy between the base and the substrate, that is, it is sensitive. Therefore, it is preferable that the central support is not fixed and is simply placed.

このように、全支持部のうち中央から等間隔に離れた少なくとも2箇所の支持部3bのみで口金2を口金ホルダー1に固定することで、口金2をしっかり固定しつつも、口金2は口金ホルダー1の変形の影響を受けがたく、口金2と基板4間のギャップを口金全幅において均一に維持できる。また、口金2をしっかり固定することができるので、口金2が塗布時にがたついたりずれたりすることも防ぐことができる。更にこの固定により、口金2と口金ホルダー1が一体となり、口金ホルダー1の剛性も更に上がるため、塗布時に振動が発生するのをさらに防ぐことができ、振動起因の塗布ムラも防ぐことができる。このようなことから、本発明によれば、塗液を高品位に塗布することができる。   As described above, the base 2 is firmly fixed to the base holder 1 by fixing the base 2 to the base holder 1 only by at least two support portions 3b that are equidistantly spaced from the center of all the support portions. The gap between the base 2 and the substrate 4 is not affected by the deformation of the holder 1 and can be maintained uniformly over the entire width of the base. Further, since the base 2 can be firmly fixed, it is possible to prevent the base 2 from being shaken or displaced during application. Further, by this fixing, the base 2 and the base holder 1 are integrated, and the rigidity of the base holder 1 is further increased, so that it is possible to further prevent vibration during application and to prevent uneven application due to vibration. Therefore, according to the present invention, the coating liquid can be applied with high quality.

支持部3bの位置は、口金2の長手方向の長さをL、口金2の中央位置から前記少なくとも2箇所の位置までの距離をLSとした時、LとLSが、0.25≦LS/L≦0.50の関係を満たすことが好ましく、これにより、口金2の中央の撓み量含め、口金2の長手方向全域に渡って撓み量を小さくすることができる。   The position of the support portion 3b is such that L and LS are 0.25 ≦ LS / where L is the length in the longitudinal direction of the base 2 and LS is the distance from the central position of the base 2 to the at least two positions. It is preferable to satisfy the relationship of L ≦ 0.50, so that the amount of bending can be reduced over the entire length direction of the base 2 including the amount of bending at the center of the base 2.

そして、本発明においては、中央から等間隔に離れた少なくとも2箇所の支持部3bは、1組設けるだけでもよいが、さらに振動を抑えるという観点からは、2組以上設けてもよい。この場合、中央位置の支持部3a以外の支持部が全て上記関係式を満足するように設けることが好ましい。上記関係式を満足するような位置にある支持部3bに口金2を固定しても、口金2の撓みに対する影響が少なく、つまり、ここの支持部3bで口金2を固定することは撓みに対して鈍感であるため、口金2と基板4とのギャップ精度に大きな影響を与えることはない。   In the present invention, only one set of at least two support portions 3b separated from the center at equal intervals may be provided, but two or more sets may be provided from the viewpoint of further suppressing vibration. In this case, it is preferable that all support portions other than the support portion 3a at the center position are provided so as to satisfy the above relational expression. Even if the base 2 is fixed to the support portion 3b in a position satisfying the above relational expression, the influence on the bending of the base 2 is small. In other words, fixing the base 2 with the support portion 3b here prevents the bending. Therefore, the gap accuracy between the base 2 and the substrate 4 is not greatly affected.

続いて、図3に口金中央の支持部3aの一実施態様を示す。(a)は、図2(a)のA−A断面図であり、(b)は、支持部3aのD−D断面図である。支持部3aと口金の載置部5とは、両者が平面であればその2つの平面が均一に接触することは難しく、よってそれら面のどこかが触っていることになる。何故なら、支持部や載置部の面の加工精度が良くなければお互いが均一に接触せず、また、支持部や載置部の取付け、組立精度が良くなければ接触面が傾いたりして接触面積や接触位置が変わる。つまり、口金をどの位置で支持しているかわからないのである。これにより、支持部の高さを調整しても、調整代が読めない、あるいは調整が鈍くなってしまうことがある。またこの問題は、塗布装置1台につき、複数の口金がある場合に顕著に現れる。何故なら、口金毎に載置部の取付精度が異なるためであり、口金毎に支持部と載置部の接触位置が異なるためである。よって、図3のように、支持部3aおよび口金の載置部5の一方に突出部を設け(もしくは曲面とし)、両者を点状に接触させ、支持部と載置部の接触面積をできるだけ小さくするのが好ましい。これにより、支持部と載置部の接触位置が所望する小さな範囲に収まり、接触位置のばらつきを最小に抑えることができる。よって、複数の口金がある場合でも、支持部と載置部が接触する位置はどの口金でもほぼ同じ位置となり、均一なギャップを形成することが容易になる。   Next, FIG. 3 shows an embodiment of the support portion 3a at the center of the base. (A) is AA sectional drawing of Fig.2 (a), (b) is DD sectional drawing of the support part 3a. If the support portion 3a and the base mounting portion 5 are both flat, it is difficult for the two planes to be in uniform contact with each other, and therefore somewhere in the plane is touched. This is because if the processing accuracy of the surface of the support part and the mounting part is not good, they will not contact each other uniformly, and if the mounting and assembly precision of the support part and the mounting part are not good, the contact surface may be inclined. The contact area and contact position change. In other words, it is not known at which position the base is supported. Thereby, even if the height of the support portion is adjusted, the adjustment allowance may not be read or the adjustment may become dull. In addition, this problem becomes prominent when there are a plurality of caps per coating apparatus. This is because the mounting accuracy of the mounting portion is different for each base, and the contact position of the support portion and the mounting portion is different for each base. Therefore, as shown in FIG. 3, a protruding portion is provided on one of the support portion 3a and the base mounting portion 5 (or a curved surface), and the two are brought into contact with each other in a dot shape so that the contact area between the support portion and the mounting portion can be as much as possible. It is preferable to make it smaller. Thereby, the contact position of a support part and a mounting part is settled in the desired small range, and the dispersion | variation in a contact position can be suppressed to the minimum. Therefore, even when there are a plurality of bases, the positions where the support part and the mounting part come into contact are almost the same in any base, and it is easy to form a uniform gap.

さらに、図4に支持部3aの別の実施態様を示すが、このように、支持部3aおよび口金の載置部5が口金の短手方向に線状に接触していても、上記と同様の効果を得ることができる。   Further, FIG. 4 shows another embodiment of the support portion 3a. As described above, even when the support portion 3a and the base mounting portion 5 are in linear contact with each other in the short direction of the base, the same as described above. The effect of can be obtained.

また、図2(e)と(f)には載置部を固定する支持部3bの一実施態様を示しているが、支持部3bは載置部との接触面が円、つまり線状であり、その中央をボルトが貫通することが好ましく、これより、固定と接触面積を小さくことが両立でき、高精度に口金を支持、固定することができる。
支持部3a,3bは、図2(e)(f)、図3、図4に示すようにそれぞれ高さを微調整できるようにしておくのが好ましい。例えば、口金ホルダーの支持部3と口金保持部8との間に厚さ数μm〜数十μmの薄板9を介在させることで調整することができる。支持部3は、基板4を固定するテーブル7面を基準に高さと傾きを調整しておく。特に中央の支持部3aは、口金2を口金ホルダー1に搭載し、テーブル7面と口金2の吐出孔が開口した面(口金面)との間の距離を測定しながら、調整することが好ましい。
FIGS. 2E and 2F show an embodiment of the support portion 3b for fixing the placement portion. The support portion 3b has a circular contact surface with the placement portion, that is, a linear shape. Yes, it is preferable that the bolt penetrates through the center. From this, the fixing and the contact area can both be reduced, and the base can be supported and fixed with high accuracy.
It is preferable that the support portions 3a and 3b can be finely adjusted in height as shown in FIGS. 2 (e), 2 (f), 3 and 4. For example, it can be adjusted by interposing a thin plate 9 having a thickness of several μm to several tens of μm between the support portion 3 of the base holder and the base holding portion 8. The support unit 3 adjusts the height and inclination with reference to the surface of the table 7 on which the substrate 4 is fixed. In particular, the central support 3a is preferably adjusted by mounting the base 2 on the base holder 1 and measuring the distance between the surface of the table 7 and the surface (base surface) where the discharge holes of the base 2 are opened. .

基板は近年大型化する傾向にあり、基板を載せるテーブルも大きくなるが、テーブルの平面度を更に高精度に仕上げるには限界があり、仮にできたとしても多大なコストアップに繋がる。かつ、口金も長尺化され、口金と基板のギャップを均一に保つのが難しい。しかしながら、上記のような調整構造を具備していることで、塗布装置のテーブル面の平面度の傾向に合わせて、口金面の真直度を調整することができる。つまり、口金面の真直度を、口金2の中央に位置する支持部3aの高さで調整することができる。例えば、テーブル7の平面度傾向が、中央が若干凹んでいるようなものであれば、中央の支持部をその分下げればよい。これより、口金2とテーブル7のギャップを口金2の長手方向に均一に設定することができる。   In recent years, the size of the substrate tends to increase, and the table on which the substrate is placed becomes larger. However, there is a limit to finishing the flatness of the table with higher accuracy, and even if it can be done, it leads to a great cost increase. In addition, the base is lengthened, and it is difficult to keep the gap between the base and the substrate uniform. However, by including the adjustment structure as described above, the straightness of the die surface can be adjusted in accordance with the tendency of the flatness of the table surface of the coating apparatus. That is, the straightness of the base surface can be adjusted by the height of the support portion 3 a located at the center of the base 2. For example, if the flatness tendency of the table 7 is such that the center is slightly recessed, the center support portion may be lowered accordingly. Thus, the gap between the base 2 and the table 7 can be set uniformly in the longitudinal direction of the base 2.

また、口金2の載置部5の高さ、つまり、図2(e)に示すように、載置部5の支持部3a、3bと接触する面と吐出孔が開口した口金面との距離Hは、口金ごとに予め調整しておけば、1台の塗布装置に対して口金が複数ある場合でも、ばらつきを吸収できる。そのために、載置部5はボルトで口金に締結固定するようにして、取り外しができるようにしておくことが好ましい。厚さの異なる載置部をいくつか揃えておき、それらを選別して組み込むことで調整することができる。また、載置部5と口金本体との間(図2(f)のGの部分)に厚さ数μm〜数十μmの薄板を介在させることで載置部5の高さを調整することもできる。   Further, the height of the mounting portion 5 of the base 2, that is, as shown in FIG. 2E, the distance between the surface of the mounting portion 5 that contacts the support portions 3 a and 3 b and the base surface where the discharge holes are opened. If H is adjusted in advance for each base, variation can be absorbed even when there are a plurality of bases for one coating apparatus. Therefore, it is preferable that the mounting portion 5 be fastened and fixed to the base with a bolt so that it can be removed. It is possible to make adjustments by preparing several mounting parts having different thicknesses and selecting and mounting them. Moreover, the height of the mounting part 5 is adjusted by interposing a thin plate having a thickness of several μm to several tens of μm between the mounting part 5 and the base body (G portion in FIG. 2 (f)). You can also.

さらに、口金ホルダーの剛性が口金の剛性に比べて低いと、口金の撓み量を支持部の高さで調整しようとしても、口金ホルダーが変形してしまい、支持部で口金を支えることができず、調整できない。また、変形によって、調整が鈍くなってしまう。よって、本発明においては、図2〜図4に示すように、口金ホルダー1を、長手方向が前記口金の長手方向と平行で、幅方向が前記口金の高さ方向と平行になるように、かつ、互いに対向するように配された2枚の板状部10と、該2枚の板状部の間に、該板状部に交差するように配された、支持部を有する口金保持部8とで構成し、この2枚の板状部の間に口金2を装填するようすることが好ましい。これにより、口金ホルダー1の断面2次モーメントは大きくなり、剛性を高めることができ、口金ホルダー1の自重たわみを小さくすることができる。その結果、口金の撓み量を支持部の高さで精度良く調整することができる。   Furthermore, if the rigidity of the base holder is low compared to the rigidity of the base, the base holder will be deformed and it will not be possible to support the base by the support part, even if the amount of flexure of the base is adjusted by the height of the support part. Cannot adjust. Further, the adjustment becomes dull due to the deformation. Therefore, in the present invention, as shown in FIGS. 2 to 4, the base holder 1 is arranged so that the longitudinal direction is parallel to the longitudinal direction of the base and the width direction is parallel to the height direction of the base. In addition, two plate-like portions 10 arranged so as to face each other, and a base holding portion having a support portion arranged so as to intersect the plate-like portion between the two plate-like portions 8 and the base 2 is preferably loaded between the two plate-like portions. Thereby, the cross-sectional secondary moment of the base holder 1 is increased, the rigidity can be increased, and the deflection of the weight of the base holder 1 can be reduced. As a result, the amount of bending of the base can be accurately adjusted with the height of the support portion.

次に、本発明に係る塗液の塗布装置の全体構成を説明する。   Next, the overall configuration of the coating liquid coating apparatus according to the present invention will be described.

図1において、基板4はテーブル7の上に載置され、テーブル7に設けた吸着装置(図示略)により吸着して固定される。なお、基板4には塗布領域68がある。テーブル7は、その中心を軸として、回転を可能とするθ軸部材(図示しない)により支持されている。このθ軸部材は、X軸駆動部12上に設けられたリニアガイド11a、11bなどで構成されたY軸駆動部11に搭載され、テーブル7がリニアガイド11a、11bに沿って機台13のY軸方向に移動するとともに、θ軸部材を中心として回動する。X軸駆動部12は、機台13上に設けられたリニアガイド12a、12bなどによって構成され、テーブル7がリニアガイド12a、12bに沿って機台13のX軸方向に移動する。これらX軸駆動部12およびY軸駆動部11は互いに直交するように調整されている。X軸駆動部12は、基板4に塗液を塗布するための、口金2と基板4の相対移動手段であって、塗布動作においてはテーブル7をX軸方向に移動させる。   In FIG. 1, the substrate 4 is placed on a table 7 and is sucked and fixed by a suction device (not shown) provided on the table 7. The substrate 4 has a coating area 68. The table 7 is supported by a θ-axis member (not shown) that can rotate around the center. The θ-axis member is mounted on a Y-axis drive unit 11 constituted by linear guides 11a and 11b provided on the X-axis drive unit 12, and the table 7 is mounted on the machine base 13 along the linear guides 11a and 11b. It moves in the Y-axis direction and rotates around the θ-axis member. The X-axis drive unit 12 includes linear guides 12a and 12b provided on the machine base 13, and the table 7 moves in the X-axis direction of the machine base 13 along the linear guides 12a and 12b. These X-axis drive unit 12 and Y-axis drive unit 11 are adjusted to be orthogonal to each other. The X-axis drive unit 12 is a relative moving means for applying the coating liquid to the substrate 4 between the base 2 and the substrate 4, and moves the table 7 in the X-axis direction in the application operation.

機台13の中央部上方には、X軸駆動部12によって移動するテーブル7が通過するように門型の支持台14が、X軸と直交する形で設けられている。支持台14の下流側(図面における奥側)には、リニアガイド15a、15bによって構成されたZ軸駆動部15が設けられている。口金ホルダー1は、その両端がリニアガイド15a、15bによって支持され、リニアガイド15a、15bに沿ってテーブル7の面に対して垂直方向に移動する。口金ホルダー1には塗液を吐出する口金2が、機台13のY軸方向中央を基準にして取り付けられる。   Above the center of the machine base 13, a gate-shaped support base 14 is provided in a shape perpendicular to the X axis so that the table 7 moved by the X axis drive unit 12 passes. On the downstream side (back side in the drawing) of the support base 14, a Z-axis drive unit 15 configured by linear guides 15 a and 15 b is provided. Both ends of the base holder 1 are supported by linear guides 15a and 15b, and move in a direction perpendicular to the surface of the table 7 along the linear guides 15a and 15b. A base 2 for discharging the coating liquid is attached to the base holder 1 with reference to the center of the machine base 13 in the Y-axis direction.

ここで、本発明に係る装置に用いられる口金について説明する。

図5は、図1に示した口金2のY方向における縦断面図を示しており、図6は口金2のX方向における縦断面図を示している。口金2は、塗液55を溜める塗液溜め部52と、塗液55を吐出する吐出開口部53と、塗液溜め部52に塗液55を供給するための塗液供給口54を有する。吐出開口部53は、口金2の幅方向に直線状に配列された複数の吐出孔56からなる。塗液供給口54は、塗液溜め部52に挿入された、パイプ57の先端に開口した孔である。また、図1の支持台14の口金上方には、塗液溜め部52の塗液の液面高さを検出するための液面センサ58が取り付けられており、液面高さを計測することができるように構成されている。
口金は、塗布領域68のサイズに合わせて選択されるが、本実施形態においては塗布領域68に形成された全ての溝(凹部)に対して1回の塗布動作で塗液を付与できるよう、溝に対応した数、ピッチで吐出孔が略一直線状に配列されている。すなわち、本実施形態は、プラズマディスプレイの背面板に塗液を付与する装置であり、口金2はR、G、Bのいずれかの蛍光体粉末を含んだ塗液が塗布される溝に対応した数、ピッチで吐出孔を有している。
口金2には、塗液を供給するための配管が接続され、この配管の反対側先端部には、塗液の供給をコントロールする開閉バルブ41を介して塗液タンク43が接続される。塗液タンク43には所定圧力の気体圧力源44が配管を介して接続されている。また、口金2には、吐出孔から塗液を吐出させるための気体圧力を供給する配管が接続され、この配管の反対側先端部は気体圧力の切換バルブ42を介して所望圧力の気体圧力源44に接続されている。切換バルブ42は三方弁であり、塗液溜め部52、気体圧力源44にそれぞれ接続されるほか、切り換えることで大気に開放されるように構成されている。
口金2への塗液供給は、切換バルブ42を大気開放にした状態で開閉バルブ41を開くことにより行い、塗液溜め部52の上部に空間を残す形で塗液を所定量供給する。続いて、塗液の吐出は切換バルブ42を気体圧力源44に切り換えて、この空間に気体圧力を供給することにより行われる。
基板への塗布工程は、口金2の塗液溜め部52に塗液を供給する工程と、塗布領域に塗液を塗布する工程を有し、それらをたとえば交互に繰り返す。塗布領域に塗液を塗布する工程では、一回の工程で、塗液溜め部52内の塗液のうち一部(所定量)を使って塗布領域1面に塗布する。これにより、塗液溜め部52内の液面高さ(吐出孔から液面までの距離)は一定高さ下降するため、次の塗液供給工程で塗液を所定量供給(補給)し、液面を所定の高さ(塗液量)にする。
そして、支持台14の上流側(図面における手前側)の側面には、基板4の塗布領域68の位置を計測する第1の位置センサとしてカメラ21、23が取り付けられ、かつ、塗布領域68の基準溝の位置を計測する第2の位置センサとしてカメラ22が取り付けられている。これらのカメラは、それぞれ、支持台14のY軸方向に独立して移動可能となるように、XおよびZ軸方向の微調整機構を介してY1搬送部24、Y3搬送部26、Y2搬送部25に取り付けられている。このY1〜Y3搬送部は、リニアガイド14a、14bによって構成され、カメラ21,22,23は、Y軸方向に移動した場合においてもテーブル面からの高さが一定になるよう構成されている。また、各カメラはモニタテレビに接続され視野の画像を表示できるように構成されている。
Here, a base used in the apparatus according to the present invention will be described.

FIG. 5 shows a longitudinal sectional view in the Y direction of the base 2 shown in FIG. 1, and FIG. 6 shows a longitudinal sectional view in the X direction of the base 2. The base 2 has a coating liquid reservoir 52 for storing the coating liquid 55, a discharge opening 53 for discharging the coating liquid 55, and a coating liquid supply port 54 for supplying the coating liquid 55 to the coating liquid reservoir 52. The discharge opening 53 is composed of a plurality of discharge holes 56 arranged linearly in the width direction of the base 2. The coating liquid supply port 54 is a hole that is inserted into the coating liquid reservoir 52 and opens at the tip of the pipe 57. Further, a liquid level sensor 58 for detecting the liquid level of the coating liquid in the coating liquid reservoir 52 is attached above the base of the support base 14 in FIG. 1, and the liquid level is measured. It is configured to be able to.
The base is selected in accordance with the size of the application region 68. In the present embodiment, the coating liquid can be applied to all the grooves (concave portions) formed in the application region 68 by a single application operation. The discharge holes are arranged in a substantially straight line with the number and pitch corresponding to the grooves. That is, this embodiment is an apparatus for applying a coating liquid to the back plate of a plasma display, and the base 2 corresponds to a groove to which a coating liquid containing any one of R, G, and B phosphor powder is applied. It has discharge holes at several pitches.
A pipe for supplying a coating liquid is connected to the base 2, and a coating liquid tank 43 is connected to an opposite end portion of the pipe through an open / close valve 41 that controls the supply of the coating liquid. A gas pressure source 44 having a predetermined pressure is connected to the coating liquid tank 43 via a pipe. Further, a pipe for supplying a gas pressure for discharging the coating liquid from the discharge hole is connected to the base 2, and a distal end portion on the opposite side of the pipe is connected to a gas pressure source having a desired pressure via a gas pressure switching valve 42. 44. The switching valve 42 is a three-way valve, and is connected to the coating liquid reservoir 52 and the gas pressure source 44, respectively, and is configured to be opened to the atmosphere by switching.
Supply of the coating liquid to the base 2 is performed by opening the opening / closing valve 41 with the switching valve 42 opened to the atmosphere, and a predetermined amount of coating liquid is supplied in a form that leaves a space above the coating liquid reservoir 52. Subsequently, the discharge of the coating liquid is performed by switching the switching valve 42 to the gas pressure source 44 and supplying the gas pressure to this space.
The application process to the substrate includes a process of supplying the coating liquid to the coating liquid reservoir 52 of the base 2 and a process of applying the coating liquid to the application region, which are repeated alternately, for example. In the step of applying the coating liquid to the application region, a part (predetermined amount) of the coating liquid in the coating liquid reservoir 52 is applied to the surface of the application region in one step. Thereby, since the liquid level in the coating liquid reservoir 52 (distance from the discharge hole to the liquid level) is lowered by a certain height, a predetermined amount of coating liquid is supplied (supplemented) in the next coating liquid supply step, The liquid level is set to a predetermined height (coating liquid amount).
Cameras 21 and 23 are attached to the side surface on the upstream side (front side in the drawing) of the support base 14 as first position sensors for measuring the position of the application region 68 of the substrate 4. A camera 22 is attached as a second position sensor for measuring the position of the reference groove. These cameras can be moved independently in the Y-axis direction of the support base 14 via the fine adjustment mechanisms in the X and Z-axis directions, respectively, through the Y1 transport unit 24, the Y3 transport unit 26, and the Y2 transport unit. 25 is attached. The Y1 to Y3 transport units are configured by linear guides 14a and 14b, and the cameras 21, 22, and 23 are configured to have a constant height from the table surface even when moved in the Y-axis direction. Each camera is connected to a monitor television and configured to display an image of the field of view.

さらに、本実施形態においては、コンピュータなどにて構成される制御部31と、サーボモーターなどで構成される移動駆動部34が設けられている。制御部31は、移動制御部33を有し、移動制御部33は移動駆動部34を介して塗布装置の動作を制御し、基板4と口金2とを、X方向に相対移動させる。また制御部31は、塗布条件を入力表示するタッチパネル部を備えた供給制御部32を有し、口金2への塗液の供給、口金からの塗液の吐出を制御する。
続いて、塗液を塗布する基板について説明する。図7は、基板4を上から見た一例を示す図である。基板4には塗布領域68がある。塗布領域68のそれぞれには、塗布方向にのびる直線状のリブ35が全面に渡り所定間隔で形成され、リブの間に溝(凹部)を形成している。なお、図示しないが、背面板としての基板の輝度向上、消費電力低減といった性能向上のためには、該リブ間に溝を分断する横リブを形成してもよい。塗布領域68の四隅付近には、基板面に形成されたリブパターンとの位置関係を示すアライメントマークA1〜A4が設けられている。このアライメントマークは、塗布領域のリブパターンを形成するときに一緒に作成される。これにより、リブパターンとアライメントマークの位置関係が精度良く形成される。アライメントマークは、A1とA3を結ぶ直線がリブのパターンと平行になるように、また、A1とA2を結ぶ直線がリブのパターンと直交するように設けられる。そして、本実施形態においては、基準溝位置(基準凹部)を各塗布領域の中央の溝位置(凹部)とする。アライメントマークの間隔XA,YAおよび各塗液塗布溝の基準溝とアライメントマークの距離Ysは基板情報として制御部31に与える。
次に、この基板と口金との位置合わせについて説明する。図8は、上述の装置に上述の基板を配置した状態を示す部分上面図(a)および部分正面図(b)である。X軸駆動部12の上流側端面には、口金2の位置を検出する位置センサとしてカメラ27が、機台のY軸方向中央の位置に取り付けられている。また、口金2のそれぞれの下面(吐出孔面)には、一列に並べられた吐出孔の中央近傍に、基板の基準溝(基準凹部)と位置あわせする基準吐出孔の位置を示すマークMが付されている。従って、X軸を操作することにより、カメラ27によって口金2の基準孔の位置を計測し、それぞれのX軸、Y軸座標を記憶させる。
Furthermore, in the present embodiment, a control unit 31 configured by a computer or the like and a movement drive unit 34 configured by a servo motor or the like are provided. The control unit 31 includes a movement control unit 33. The movement control unit 33 controls the operation of the coating apparatus via the movement driving unit 34, and relatively moves the substrate 4 and the base 2 in the X direction. The control unit 31 includes a supply control unit 32 having a touch panel unit for inputting and displaying the application conditions, and controls the supply of the coating liquid to the base 2 and the discharge of the coating liquid from the base.
Next, the substrate on which the coating liquid is applied will be described. FIG. 7 is a diagram illustrating an example of the substrate 4 as viewed from above. The substrate 4 has a coating area 68. In each of the application regions 68, linear ribs 35 extending in the application direction are formed at predetermined intervals over the entire surface, and grooves (concave portions) are formed between the ribs. Although not shown, horizontal ribs that divide the grooves may be formed between the ribs in order to improve performance such as improving the luminance of the substrate as the back plate and reducing power consumption. In the vicinity of the four corners of the coating region 68, alignment marks A1 to A4 indicating the positional relationship with the rib pattern formed on the substrate surface are provided. This alignment mark is created together when the rib pattern of the application area is formed. Thereby, the positional relationship between the rib pattern and the alignment mark is formed with high accuracy. The alignment mark is provided so that the straight line connecting A1 and A3 is parallel to the rib pattern, and the straight line connecting A1 and A2 is orthogonal to the rib pattern. In the present embodiment, the reference groove position (reference recess) is set to the center groove position (recess) of each application region. The alignment mark intervals XA and YA and the distance Ys between the reference groove of each coating liquid application groove and the alignment mark are given to the control unit 31 as substrate information.
Next, the alignment between the substrate and the base will be described. FIG. 8 is a partial top view (a) and a partial front view (b) showing a state in which the above-described substrate is arranged in the above-described apparatus. A camera 27 as a position sensor for detecting the position of the base 2 is attached to the upstream end face of the X-axis drive unit 12 at the center position in the Y-axis direction of the machine base. In addition, on each lower surface (discharge hole surface) of the base 2, a mark M indicating the position of the reference discharge hole to be aligned with the reference groove (reference recess) of the substrate is provided in the vicinity of the center of the discharge holes arranged in a row. It is attached. Therefore, by operating the X axis, the position of the reference hole of the base 2 is measured by the camera 27, and the respective X axis and Y axis coordinates are stored.

そして、基板4においては、機台13のY軸方向中央を基準にしてあらかじめ基板情報に基づき位置決めしたカメラ21、23の位置に、テーブルのX軸を操作して下流側2個のアライメントマークA1、A2を移動させ、各々の位置を計測する。さらに、カメラ22により基板の基準溝のY軸方向の位置を計測する。なお、カメラ21,22,23,27の相対位置情報はあらかじめ制御部31に与えておく。こうして求めた口金2の基準吐出孔の位置座標と、塗布領域68の基準溝位置座標を基に、テーブルのY軸、θ軸を動作させて、各塗布領域において基板と口金各々の相対位置合わせを行う。
このように、Y軸方向において、塗布領域の基準溝を中央に、そして口金の基準孔も中央にすることで、基板4の歪みや口金2の加工精度による位置ずれ誤差を半減でき、塗布領域68に形成された全ての溝中心に対向して、口金2の吐出孔を位置合わせできる。
続いて塗布動作について説明する。塗布を開始する場合は、まず、口金2の塗液溜め部内に塗液を供給する。塗液の供給は前述したように図1の切換バルブ42を大気開放にした状態で開閉バルブ41を開いて、所定の量に達するまで供給する。次に、基板搭載に移る。この動作は口金2内への塗液供給と並行して行うことが可能で、そうすることで口金2への塗液供給の待ち時間を少なくすることができる。
テーブル7を上流側端部に移動する。Y軸およびθ軸は中央ゼロの位置でテーブル面のほぼ中央に外部移載機により塗布する基板4を搭載し、塗布方向にのびるリブがテーブルのX軸方向とほぼ平行となる状態にして吸着固定する。外部移載機は例えば多軸のロボットを用い、ロボットのアームで基板4をテーブル7上部に横持ちする。テーブル7には複数の昇降可能なピンを設け、このピンを上昇して基板を受け取り、アームを退避させてピンを下降することにより基板をテーブル面に受け取る。
In the substrate 4, the two alignment marks A 1 on the downstream side are operated by manipulating the X axis of the table at the positions of the cameras 21 and 23 which are previously positioned based on the substrate information with respect to the center in the Y axis direction of the machine base 13. , A2 is moved, and each position is measured. Further, the position of the reference groove of the substrate in the Y-axis direction is measured by the camera 22. The relative position information of the cameras 21, 22, 23, and 27 is given to the control unit 31 in advance. Based on the position coordinates of the reference ejection holes of the base 2 and the reference groove position coordinates of the application area 68 thus obtained, the Y axis and the θ axis of the table are operated to align the substrate and the base in each application area. I do.
In this way, in the Y-axis direction, by making the reference groove of the application region in the center and the reference hole of the base in the center, the positional deviation error due to the distortion of the substrate 4 and the processing accuracy of the base 2 can be halved. The discharge holes of the base 2 can be aligned so as to face all the groove centers formed in 68.
Next, the application operation will be described. When starting the application, first, the coating liquid is supplied into the coating liquid reservoir of the base 2. As described above, the coating liquid is supplied until the opening / closing valve 41 is opened with the switching valve 42 in FIG. Next, it moves to substrate mounting. This operation can be performed in parallel with the supply of the coating liquid into the base 2, whereby the waiting time for supplying the coating liquid to the base 2 can be reduced.
The table 7 is moved to the upstream end. The Y-axis and θ-axis are at the center zero position, and the substrate 4 to be coated by an external transfer machine is mounted almost at the center of the table surface. Fix it. For example, a multi-axis robot is used as the external transfer machine, and the substrate 4 is held horizontally on the table 7 by the robot arm. The table 7 is provided with a plurality of pins that can be raised and lowered, and the pins are raised to receive the substrate, and the arms are retracted and the pins are lowered to receive the substrate on the table surface.

次に、塗布領域68に塗液55を塗布する動作に入る。まず、基板位置決めを行う。テーブル7を移動させて、塗布領域68のアライメントマークA1、A2をカメラ21、23の視野に入れる。次に、カメラ21の視野中心を基準にアライメントマークA1のX、Y方向のずれ量を求める。また、カメラ23の視野中心からアライメントマークA2のX、Y方向のずれ量を求める。この2つのX軸方向のずれ量とアライメントマークの間隔YAから基板の傾きと、傾きを修正したときのアライメントマークA1の移動量を求める。算出した結果に応じ、テーブルのθ軸を回転して基板の傾きを修正し、X、Y軸を移動してカメラ21の視野中心にアライメントマークA1を位置合わせする。
この時点で、カメラ22の視野内には塗布領域68の塗液塗布溝の基準溝が観測されるので、溝の中心位置を判断し、テーブル7のY軸を移動することで、口金2の基準孔と塗布領域68の塗液塗布溝の基準溝中心とのY軸方向の位置を合わせる。
位置決めが終わると塗液の塗布動作に移る。口金2の塗液溜め部内への塗液供給が完了していることを確認し(未完の場合は待つ)、テーブル7のX軸を塗布領域68の位置決め位置から下流方向に予めプログラムした速度で移動させる。X軸座標が、あらかじめ設定された塗液吐出位置になったら口金2から塗液を吐出し、吐出停止位置になれば吐出を停止する。この塗液の吐出および停止は、図1に示した切換バルブ42により行う。これで塗布領域68への塗液55の塗布が終了したことになる。なお、塗布が終わった口金を基板から離間させることで、吐出孔周辺の残存塗液が基板面に付着するのを防止できる。
塗布を終了すると、基板排出に移る。基板4の排出はテーブル7を下流端に移動し、吸着した基板4を解除し、ピンを上昇して移載機により取り出す。移載機は上流側の基板搬入と下流側の排出専用に各1台配置することで、基板排出中に次に塗布する基板が準備できるので、基板搬入から排出までの時間を短縮することができる。基板4を排出した時点で一連の動作が終了する。連続して基板4に塗布する場合には、上記塗液供給から開始する。
なお、上述した態様は、口金を固定し、テーブル(基板)を移動することで塗液を基板に塗布する態様であったが、口金を移動し、テーブル(基板)を固定することで塗液を基板に塗布しても同様の効果が得られる。
Next, the operation of applying the coating liquid 55 to the application region 68 is started. First, substrate positioning is performed. The table 7 is moved, and the alignment marks A1 and A2 in the application area 68 are placed in the field of view of the cameras 21 and 23. Next, the amount of displacement of the alignment mark A1 in the X and Y directions is obtained with reference to the center of the field of view of the camera 21. Further, the amount of deviation of the alignment mark A2 in the X and Y directions is obtained from the center of the field of view of the camera 23. The inclination of the substrate and the amount of movement of the alignment mark A1 when the inclination is corrected are obtained from these two X-axis direction deviation amounts and the alignment mark interval YA. According to the calculated result, the tilt of the substrate is corrected by rotating the θ axis of the table, and the X and Y axes are moved to align the alignment mark A1 with the center of the visual field of the camera 21.
At this time, since the reference groove of the coating liquid application groove in the application region 68 is observed in the field of view of the camera 22, the center position of the groove is determined and the Y axis of the table 7 is moved, thereby The Y-axis direction positions of the reference hole and the reference groove center of the coating liquid application groove in the application region 68 are aligned.
When positioning is completed, the operation moves to the coating operation of the coating liquid. Confirm that the coating liquid supply into the coating liquid reservoir of the base 2 has been completed (wait if not completed), and set the X axis of the table 7 at a speed programmed in advance downstream from the positioning position of the coating area 68. Move. When the X-axis coordinate reaches a preset coating liquid discharge position, the coating liquid is discharged from the base 2 and when the X-axis coordinate reaches the discharge stop position, the discharge is stopped. The discharge and stop of the coating liquid are performed by the switching valve 42 shown in FIG. This completes the application of the coating liquid 55 to the application area 68. In addition, it can prevent that the residual coating liquid around a discharge hole adheres to a substrate surface by separating the nozzle | cap | die after application | coating finished from the board | substrate.
When the application is finished, the substrate is discharged. For discharging the substrate 4, the table 7 is moved to the downstream end, the adsorbed substrate 4 is released, the pins are lifted and taken out by the transfer machine. By placing one transfer machine exclusively for upstream substrate carry-in and downstream discharge, the next substrate to be coated can be prepared during substrate discharge, so the time from substrate carry-in to discharge can be shortened. it can. A series of operations ends when the substrate 4 is discharged. In the case of continuously applying to the substrate 4, the above-described coating liquid supply is started.
In addition, although the aspect mentioned above was an aspect which apply | coats a coating liquid to a board | substrate by fixing a nozzle | cap | die and moving a table | surface (board | substrate), it moves a nozzle | cap | die and fixes a coating liquid by fixing a table | surface (board | substrate). The same effect can be obtained even if it is applied to the substrate.

<実施例1>
図1,2に示す口金ホルダー、塗布装置を用いて、口金の吐出孔が開口している面の真直度を測定した。
<Example 1>
The straightness of the surface where the discharge holes of the die are open was measured using the die holder and the coating apparatus shown in FIGS.

口金は長さが990mmであり、口金の支持部は、図2(c)に示すように、まず口金の長手方向の中央に2個(各板状部に1個ずつ)、中央位置から口金の長手方向の各両端に向かって277mm離れた箇所に4個(各板状部のそれぞれの位置に1個ずつ)の、計6個設置した。(LS/L=0.28)
かつ、両端に向かって277mm離れた箇所の支持部では、支持部と口金とを固定するために、図2(e)(f)のように、M8のボルトが口金の載置部を貫通して、支持部に締結されるようにした。
The base has a length of 990 mm. As shown in FIG. 2 (c), the base has two bases in the longitudinal direction of the base (one for each plate-like part), and the base from the center position. A total of 6 pieces (one at each position of each plate-like portion) were installed at locations separated by 277 mm toward both ends in the longitudinal direction. (LS / L = 0.28)
And in the support part of the location 277mm away toward both ends, in order to fix a support part and a nozzle | cap | die, as shown to FIG.2 (e) (f), the bolt of M8 penetrates the mounting part of a nozzle | cap | die. And fastened to the support.

口金の中央位置の支持部は、図3(a)(b)のように、口金の載置部と接触する部分は先端が尖って点で接触するようにした。   As shown in FIGS. 3 (a) and 3 (b), the support portion at the center position of the base was made to come into contact at a point with a pointed tip at the portion contacting the base of the base.

口金を口金ホルダーへ搭載し、ボルトで固定した後、口金の吐出孔が開口している吐出孔面の真直度を測定した。真直度は、市販の精密高さ測定器『ミツトヨ製 574シリーズ ハイトマチック HDF−N』を用いて、塗布機のテーブル面から吐出孔面までの距離を、口金の長手方向の片方の端部から7mm入ったところを1点目として、そこから等間隔(61mm)で計17点で測定した。そして、両端の測定点(1点目と17点目)を基準(ゼロ)とした時、他の測定点において最も大きな値を真直度とした。   After mounting the base on the base holder and fixing with a bolt, the straightness of the discharge hole surface where the discharge hole of the base is open was measured. Straightness is measured using the commercially available precision height measuring instrument “Mitutoyo 574 Series Heightmatic HDF-N” to determine the distance from the table surface of the coating machine to the discharge hole surface from one end in the longitudinal direction of the die. The place where 7 mm was entered was taken as the first point, and measurements were made at a total of 17 points at equal intervals (61 mm). Then, when the measurement points (first and 17th points) at both ends were used as the reference (zero), the largest value at the other measurement points was taken as the straightness.

なお、各支持部の口金の載置部と接触する部分の高さは、あらかじめ、口金が口金ホルダーに搭載されていない状態でテーブル基準で測定、調整されており、その高さのばらつきが20μm以内に入るよう、口金ホルダーの支持部と口金保持部との間に薄板を設け、調整されている。   In addition, the height of the portion of each support portion that comes into contact with the mounting portion of the base is measured and adjusted in advance in a state where the base is not mounted on the base holder, and the variation in the height is 20 μm. A thin plate is provided and adjusted between the support part of the base holder and the base holding part so as to fall within the range.

結果、真直度は6μmで、口金面とテーブル面の間隔は、口金中央付近が一番広い傾向になった。   As a result, the straightness was 6 μm, and the distance between the base surface and the table surface tended to be widest near the center of the base.

また、一旦口金を口金ホルダーから降ろし、再度上記と同様に口金を口金ホルダーに搭載し、真直度を測定したところ、5μmで、上記と同様、口金中央付近が一番広い傾向になった。   Also, once the base was lowered from the base holder, the base was mounted on the base holder again in the same manner as described above, and the straightness was measured. As a result, it was found that the vicinity of the center of the base was the widest at 5 μm.

更に、上記口金と同サイズの、別の口金を口金ホルダーに搭載し、上記と同様に真直度を測定したところ、3μmで、口金面とテーブル面の間隔は、口金中央付近が一番狭い傾向になった。   Furthermore, when another base of the same size as the above base was mounted on the base holder and the straightness was measured in the same manner as described above, the distance between the base surface and the table surface tends to be the narrowest at 3 μm. Became.

以上より、口金の取り付け、取り外しを繰り返しても口金を再現性よく固定できることがわかる。   From the above, it can be seen that the base can be fixed with good reproducibility even when the attachment and removal of the base are repeated.

<比較例1>
口金中央の支持部を、口金をボルト固定できる支持部とし、口金をボルト固定した以外は実施例1と同様にしたところ、真直度は14μmで、口金面とテーブル面の間隔は、口金中央付近が一番狭い傾向になった。
<Comparative Example 1>
The support part in the center of the base is a support part that can fix the base with bolts, and is the same as in Example 1 except that the base is fixed with bolts. The straightness is 14 μm, and the distance between the base surface and the table surface is near the center of the base Became the narrowest trend.

また、一旦口金を口金ホルダーから降ろし、再度上記と同様に口金を口金ホルダーに搭載し、真直度を測定したところ、16μmで、上記と同様、口金中央付近が一番狭い傾向になった。   Also, once the base was lowered from the base holder, the base was mounted on the base holder again in the same manner as described above, and the straightness was measured. As a result, it was found that the vicinity of the center of the base was the narrowest at 16 μm.

更に、上記口金と同サイズの、別の口金を口金ホルダーに搭載し、上記と同様に真直度を測定したところ、21μmで、口金面とテーブル面の間隔は、口金中央付近が一番狭い傾向になった。   Furthermore, when another base of the same size as the base is mounted on the base holder and the straightness is measured in the same manner as described above, the distance between the base surface and the table surface tends to be the narrowest at 21 μm. Became.

<実施例2>
口金の中央位置から口金の長手方向の各両端に向かって475mm離れた箇所に4個(各板状部のそれぞれの位置に1個ずつ)支持部を設置した(LS/L=0.48)以外は、実施例1と同様にしたところ、真直度は4μmで、口金面とテーブル面の間隔は、口金中央と口金の端の中間付近が一番狭い傾向になった。
<Example 2>
Four support portions (one at each position of each plate-like portion) were installed at locations 475 mm away from the center position of the base toward each end in the longitudinal direction of the base (LS / L = 0.48). Otherwise, the straightness was 4 μm, and the distance between the base surface and the table surface tended to be the narrowest in the middle of the base and the end of the base.

また、一旦口金を口金ホルダーから降ろし、再度上記と同様に口金を口金ホルダーに搭載し、真直度を測定したところ、5μmで、上記と同様、口金中央と口金の端の中間付近が一番狭い傾向になった。   Also, once the base is lowered from the base holder, the base is mounted on the base holder again in the same manner as above, and the straightness is measured. As a result, the middle of the base and the end of the base are narrowest at 5 μm. It became a trend.

更に、上記口金と同サイズの、別の口金を口金ホルダーに搭載し、上記と同様に真直度を測定したところ、3μmで、上記と同様、口金中央と口金の端の中間付近が一番狭い傾向になった。   Furthermore, when another base of the same size as the above base was mounted on the base holder and the straightness was measured in the same manner as above, it was 3 μm, and the center between the center of the base and the end of the base was the narrowest as above. It became a trend.

<比較例2>
口金中央の支持部を、口金をボルト固定できる支持部とし、口金をボルト固定した以外は実施例2と同様にしたところ、真直度は20μmで、口金面とテーブル面の間隔は、口金中央付近が一番狭い傾向になった。
<Comparative example 2>
The support part in the center of the base is a support part that can fix the base with bolts, and is the same as in Example 2 except that the base is fixed with bolts. The straightness is 20 μm, and the distance between the base surface and the table surface is near the center of the base Became the narrowest trend.

また、一旦口金を口金ホルダーから降ろし、再度上記と同様に口金を口金ホルダーに搭載し、真直度を測定したところ、22μmで、上記と同様、口金中央付近が一番狭い傾向になった。   Further, once the base was lowered from the base holder, the base was mounted on the base holder again in the same manner as described above, and the straightness was measured. As a result, it was found that the vicinity of the center of the base was the narrowest at 22 μm.

更に、上記口金と同サイズの、別の口金を口金ホルダーに搭載し、上記と同様に真直度を測定したところ、19μmで、口金面とテーブル面の間隔は、口金中央付近が一番狭い傾向になった。   Furthermore, when another base having the same size as the above base was mounted on the base holder and the straightness was measured in the same manner as described above, the distance between the base surface and the table surface tends to be the narrowest at 19 μm. Became.

<実施例3>
口金の中央位置から口金の長手方向の各両端に向かって220mm離れた箇所に4個(各板状部のそれぞれの位置に1個ずつ)支持部を設置した(LS/L=0.22)以外は、実施例1と同様にしたところ、真直度は9μmで、口金面とテーブル面の間隔は、口金の端が一番狭い傾向になった。
<Example 3>
Four support portions (one at each position of each plate-like portion) were installed at locations away from the center position of the base by 220 mm toward each end in the longitudinal direction of the base (LS / L = 0.22). Otherwise, the straightness was 9 μm and the distance between the base surface and the table surface tended to be the narrowest at the end of the base.

また、一旦口金を口金ホルダーから降ろし、再度上記と同様に口金を口金ホルダーに搭載し、真直度を測定したところ、8μmで、上記と同様、口金の端が一番狭い傾向になった。   Further, once the base was lowered from the base holder, the base was mounted on the base holder again in the same manner as above, and the straightness was measured. As a result, the end of the base tended to be the narrowest at 8 μm.

更に、上記口金と同サイズの、別の口金を口金ホルダーに搭載し、上記と同様に真直度を測定したところ、7μmで、上記と同様、口金の端が一番狭い傾向になった。   Furthermore, when another base having the same size as the base was mounted on the base holder and the straightness was measured in the same manner as described above, the end of the base tended to be the narrowest at 7 μm.

<比較例3>
一方の板状部に付いている支持部3個を取り外し、特許文献3のように口金を片持ちで支持し、口金をボルト固定した以外は、実施例2と同様にしたところ、口金は支持していない方向に倒れたため口金面が傾き、真直度の測定はできなかった。
<Comparative Example 3>
In the same manner as in Example 2, except that the three support portions attached to one plate-like portion were removed and the base was cantilevered as in Patent Document 3, and the base was bolted, the base was supported. The cap face was tilted because it fell in the direction that was not, and the straightness could not be measured.

本発明は、プラズマディスプレイパネルの塗布装置に限らず、液晶用カラーフィルター(LCM)の塗布装置などにも応用することができ、その応用範囲がこれらに限られるものではない。   The present invention can be applied not only to a plasma display panel coating apparatus but also to a liquid crystal color filter (LCM) coating apparatus, and the scope of application is not limited thereto.

本発明の一実施態様に係る塗液の塗布装置の概略斜視図である。1 is a schematic perspective view of a coating liquid coating apparatus according to an embodiment of the present invention. 図1に示した口金ホルダーの拡大図である。FIG. 2 is an enlarged view of the base holder shown in FIG. 1. 図1に示した口金中央の支持部の一実施態様の拡大図である。It is an enlarged view of one embodiment of the support part in the base shown in FIG. 図1に示した口金中央の支持部の別の実施態様の拡大図である。It is an enlarged view of another embodiment of the support part of the nozzle | cap | die center shown in FIG. 図1に示した口金のY方向断面図である。It is a Y direction sectional view of a mouthpiece shown in FIG. 図1に示した口金のX方向断面図である。FIG. 2 is a cross-sectional view of the base shown in FIG. 1 in the X direction. 図1の装置に搭載された基板の上面図である。It is a top view of the board | substrate mounted in the apparatus of FIG. 図1の装置の部分拡大図である。It is the elements on larger scale of the apparatus of FIG.

符号の説明Explanation of symbols


1 口金ホルダー
2 口金
3(a、b) 支持部
4 基板
5 載置部
7 テーブル
8 口金保持部
9 薄板
10 板状部
11 Y軸駆動部
11a、11b リニアガイド
12 X軸駆動部
12a,12b リニアガイド
13 機台
14 支持台
14a,14b リニアガイド
15 Z軸駆動部
15a,15b リニアガイド
21 カメラ
22 カメラ
23 カメラ
24 Y1搬送部
25 Y2搬送部
26 Y3搬送部
27 カメラ
31 制御部
32 供給制御部
33 移動制御部
34 移動駆動部
35 リブ
41 開閉バルブ
42 切換バルブ
43 塗液タンク
44 気体圧力源
52 塗液溜め部
53 吐出開口部
54 塗液供給口
55 塗液
56 吐出孔
57 パイプ
58 液面センサ
68 塗布領域

DESCRIPTION OF SYMBOLS 1 Base holder 2 Base 3 (a, b) Support part 4 Substrate 5 Placement part 7 Table 8 Base holding part 9 Thin plate 10 Plate-like part 11 Y-axis drive part 11a, 11b Linear guide 12 X-axis drive part 12a, 12b Linear Guide 13 Machine base 14 Support bases 14a and 14b Linear guide 15 Z-axis drive parts 15a and 15b Linear guide 21 Camera 22 Camera 23 Camera 24 Y1 transport part 25 Y2 transport part 26 Y3 transport part 27 Camera 31 Control part 32 Supply control part 33 Movement control unit 34 Movement drive unit 35 Rib 41 Open / close valve 42 Switching valve 43 Coating liquid tank 44 Gas pressure source 52 Coating liquid reservoir 53 Discharge opening 54 Coating liquid supply port 55 Coating liquid 56 Discharge hole 57 Pipe 58 Liquid level sensor 68 Application area

Claims (4)

基板を固定するテーブルと、前記基板に塗液を塗布する口金と、前記口金を前記基板に対面させて支持する口金ホルダーと、前記テーブルと前記口金とを3次元的に相対移動させる移動手段とを備えた塗布装置であって、
前記口金ホルダーは、前記口金の長手方向に関して、中央位置および前記中央位置から前記口金の長手方向両端に向かって等間隔に離れた少なくとも2箇所の位置に、前記口金を下方から支持する支持部を有し、
かつ、前記支持部のうち前記少なくとも2箇所の位置にある支持部に、前記口金をホルダーに固定する固定手段を有し、
前記口金ホルダーは、それぞれ長手方向が前記口金の長手方向と平行で、幅方向が前記口金の高さ方向と平行になるように、かつ、互いに対向するように配された2枚の板状部と、前記2枚の板状部の間に、前記板状部に交差するように配された、前記支持部を有する口金保持部とを有する、塗液の塗布装置。
A table for fixing the substrate, and the base for applying the coating liquid to the substrate, and the cap holder that supports so as to face the die to the substrate, and moving means for relatively moving the said said table mouthpiece three-dimensionally A coating apparatus comprising:
The mouthpiece holder, in the longitudinal direction of the die, the at least two locations positioned spaced at equal intervals from the center position and the center position in the longitudinal ends of the die, the supporting portion supporting the cap from below Have
And a support portion at the location of the at least two locations of the support portion has a fixing means for fixing the ferrule to the holder,
Each of the base holders has two plate-like portions arranged such that the longitudinal direction thereof is parallel to the longitudinal direction of the base, the width direction thereof is parallel to the height direction of the base, and facing each other. And a base holding part having the support part, which is arranged so as to intersect the plate-like part between the two plate-like parts .
口金の長手方向の長さをL、口金の中央位置から前記少なくとも2箇所の位置までの距離をLSとした時、LとLSが次式を満足する、請求項1に記載の塗液の塗布装置。
0.25≦LS/L≦0.50 (1)
Application of the coating liquid according to claim 1, wherein L and LS satisfy the following formula, where L is the length in the longitudinal direction of the base and LS is the distance from the central position of the base to the at least two positions. apparatus.
0.25 ≦ LS / L ≦ 0.50 (1)
前記口金は、前記支持部と接する載置部を有し、前記固定手段は、該載置部を貫通し、かつ前記支持部に締結されるボルトである、請求項1〜2のいずれかに記載の塗液の塗布装置。 The mouthpiece, the has a mounting portion in contact with the supporting portion, the fixing means, through the the placing portion, and a bolt which is fastened to the support part, in any one of claims 1-2 The coating liquid coating apparatus as described. 前記少なくとも2箇所の位置にある支持部は前記載置部との接触面が円であり、その中央をボルトが貫通する、請求項3に記載の塗液の塗布装置。 4. The coating liquid coating apparatus according to claim 3 , wherein the at least two support portions have a circular contact surface with the placement portion, and a bolt passes through the center thereof. 5.
JP2007072387A 2007-03-20 2007-03-20 Coating liquid application equipment Expired - Fee Related JP4952320B2 (en)

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