JPWO2020003491A1 - Support member placement support device, printing machine, printing system, support member placement support method - Google Patents

Abstract

Inspection-related information I related to the print inspection for inspecting the quality of the solder D printed on the substrate B is acquired. Then, the arrangement mode of the backup pin P that supports the substrate B is calculated according to the inspection-related information I. As a result, when arranging the backup pin P that supports the substrate B, it is possible to reduce the burden on the operator who examines the arrangement mode of the backup pin P.

Description

The present invention relates to a technique for arranging a support member that supports a substrate on which the paste is printed.

Conventionally, in a printing machine that prints a paste such as solder on a substrate via a mask pattern, a support member is used to support the substrate. Further, in Patent Document 1, as a result of inspecting a board on which components are mounted on solder printed on the board, if mounting defects are continuous, an operator is notified of an error and a worker so as to review the arrangement of support members. The technology required for is described.

Japanese Unexamined Patent Publication No. 2013-038114

However, since the above technique only notifies an error, the operator has to consider the arrangement mode of the support member by himself / herself. Therefore, the burden on the operator is heavy when arranging the support member.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of reducing the burden on an operator when arranging a support member for supporting a substrate.

The support member placement support device according to the present invention prints a paste at a print target position on a substrate via a mask pattern. Inspection related to a print inspection for determining the quality of a paste printed at a print target position by paste printing. It includes an acquisition unit for acquiring information and a calculation unit for calculating an arrangement mode of a support member that supports the substrate during execution of paste printing according to inspection-related information.

The support member placement support method according to the present invention is related to an inspection related to a print inspection for determining the quality of the paste printed at the print target position by paste printing in which the paste is printed at the print target position on the substrate via the mask pattern. It includes a step of acquiring information and a step of calculating an arrangement mode of a support member that supports the substrate at the time of executing paste printing according to inspection-related information.

In the present invention configured as described above (support member placement support device, support member placement support method), inspection-related information related to a print inspection for inspecting the quality of the paste printed on the substrate is acquired. Then, the arrangement mode of the support member that supports the substrate is calculated according to the inspection-related information. As a result, when arranging the support member that supports the substrate, it is possible to reduce the burden on the operator who examines the arrangement mode of the support member.

In the print inspection, the allowable range of the measured value obtained by measuring the state of the paste is set for the print target position, and whether or not the measured value of the paste printed at the print target position is within the allowable range. The quality of the paste is determined based on the above, and the acquisition unit may configure the support member arrangement support device so as to acquire the permissible range as inspection-related information. In such a configuration, the arrangement mode of the support member can be appropriately calculated according to the permissible range used as a criterion for determining the quality of the print inspection.

Further, the support member arrangement support device may be configured so that the measured value includes at least one of the area of the paste, the height of the paste from the substrate, and the volume of the paste in a plan view. In such a configuration, the arrangement mode of the support member can be appropriately calculated according to at least one of the area, height and volume of the paste.

Further, in the calculation unit, the narrower the permissible range set for the print target position included in the arrangement target range of the support member, the larger the number of support members per unit area to be arranged in the arrangement target range. The support member placement support device may be configured so as to calculate the placement mode. With such a configuration, it is possible to firmly support the range where the print target portion having a narrow allowable range used in the print inspection exists by the support member.

Further, the support member placement support device is provided so as to further provide a user interface for indicating the placement mode to the operator by attaching a display according to the number of support members per unit area to be placed in the placement target range to the placement target range. It may be configured. In such a configuration, the operator can refer to the arrangement mode shown in the user interface when considering the arrangement of the support member. Therefore, it is possible to reduce the burden on the worker.

In addition, the acquisition unit acquires a judgment result in which the print inspection determines whether the paste printed at the print target position is good or bad, and the calculation unit obtains a defective print which is the print target position where the paste indicating that the judgment result is defective is printed. The support member placement support device may be configured so as to calculate the placement mode according to the position. With such a configuration, the arrangement mode of the support member can be appropriately calculated according to the print target position where the paste is determined to be defective in the print inspection.

Further, the calculation unit may configure the support member arrangement support device so as to determine that the support member is arranged at the defective printing position in the calculation of the arrangement mode. In such a configuration, a support member can be added to the print target position determined by the print inspection as the paste is defective, and subsequent paste printing can be executed, and the recurrence of the paste printing defect can be suppressed.

Further, the calculation unit determines the arrangement mode so as to satisfy the interference prevention condition that the two support members are separated from each other by separating the positions of the two adjacent support members by a predetermined closest interval or more. A support member arrangement support device may be configured. In such a configuration, it is possible to prevent two adjacent support members from interfering with each other.

Further, when the distance between the arrangement position of the support member already arranged and the defective printing position is less than the closest interval, the calculation unit virtually passes through the arrangement position and the defective printing position in the calculation of the arrangement mode. A support member placement support device is provided so as to determine that the support member is to be added at a position on a straight line opposite to the placement position with respect to the defective printing position and the distance from the placement position is the closest interval. It may be configured. In such a configuration, a support member can be added in the vicinity of the print target position determined by the print inspection as the paste is defective, and subsequent paste printing can be executed, and the recurrence of the paste printing defect can be suppressed. it can.

Further, when there are a plurality of defective printing positions in which the support member cannot be arranged while satisfying the interference prevention condition, the calculation unit supports the geometric center of gravity of the plurality of defective printing positions in the calculation of the arrangement mode. The support member placement support device may be configured to determine that additional members will be added. In such a configuration, a support member can be added in the vicinity of the print target position determined by the print inspection as the paste is defective, and subsequent paste printing can be executed, and the recurrence of the paste printing defect can be suppressed. it can.

In addition, the calculation unit has a plurality of defective printing positions in which the support members cannot be arranged while satisfying the interference prevention conditions, and the geometric centers of gravity of the plurality of defective printing positions and the arrangement of the support members already arranged are present. When the distance from the position is less than the closest distance, it is the position opposite to the geometric center of gravity on the virtual straight line passing through the placement position and the geometric center of gravity in the calculation of the placement mode. The support member placement support device may be configured so that the support member is determined to be added at a position where the distance from the placement position is the closest interval. In such a configuration, a support member can be added in the vicinity of the print target position determined by the print inspection as the paste is defective, and subsequent paste printing can be executed, and the recurrence of the paste printing defect can be suppressed. it can.

Further, an alarm for notifying the operator of an error is further provided, and the calculation unit configures a support member placement support device so as to notify the alarm of the error when the support member cannot be added so as to satisfy the interference prevention condition. You may. With such a configuration, it is possible to notify the operator that it is necessary to review the arrangement mode of the support member.

In addition, the calculation unit executes a mask holding unit that holds the mask with respect to the substrate and a squeegee that prints the paste at the printing target position of the substrate via the mask pattern by sliding the squeegee on the mask. A support member arrangement support device may be configured so that the support member is arranged in the arrangement head of the printing machine including the unit and the arrangement head for arranging the support member that supports the substrate according to the arrangement mode. In such a configuration, the support members can be automatically arranged according to the arrangement mode calculated by the calculation unit, and the burden on the operator can be further reduced.

The printing machine according to the present invention performs paste printing in which a mask holding unit that holds a mask with respect to a substrate and a squeegee are slid on the mask to print a paste at a printing target position on the substrate via a mask pattern. The squeegee unit to be executed and the above-mentioned support member placement support device are provided. Therefore, when arranging the support member that supports the substrate, it is possible to reduce the burden on the operator who examines the arrangement mode of the support member.

The printing system according to the present invention executes a printing machine that executes paste printing that prints a paste at a print target position on a substrate via a mask pattern, and a print inspection that determines the quality of the paste printed at the print target position. The inspection machine and the above-mentioned support member arrangement support device are provided. Therefore, when arranging the support member that supports the substrate, it is possible to reduce the burden on the operator who examines the arrangement mode of the support member.

According to the present invention, it is possible to reduce the burden on the operator when arranging the support member that supports the substrate.

The front view which shows typically the printing machine. FIG. 3 is a block diagram showing an electrical configuration included in the printing press of FIG. The perspective view which shows typically the arrangement example of the backup pin with respect to the elevating table. FIG. 5 is a plan view schematically showing an example of a substrate on which solder is printed by the printing machine of FIG. 1. The block diagram which shows an example of the printing system which includes the printing machine of FIG. A block diagram showing an example of an electrical configuration of a server computer. The flowchart which shows the 1st method which determines the arrangement mode of the backup pin. FIG. 5 is a plan view schematically showing an example of a calculation content executed according to the flowchart of FIG. 7. FIG. 5 is a plan view schematically showing an example of a calculation content executed according to the flowchart of FIG. 7. The flowchart which shows the 2nd method of determining the arrangement mode of the backup pin. FIG. 5 is a diagram schematically showing conditions to be satisfied in determining an arrangement mode of backup pins according to the flowchart of FIG. FIG. 5 is a plan view schematically showing an example of an arrangement mode of backup pins determined according to the flowchart of FIG.

FIG. 1 is a front view schematically showing a printing machine, and FIG. 2 is a block diagram showing an electrical configuration included in the printing machine of FIG. In FIG. 1 and the following figures, XYZ orthogonal coordinate axes with the Z direction as the vertical direction and the X and Y directions as the horizontal directions are appropriately shown. The printing machine 1 includes a mask holding unit 2 for holding the mask M, a substrate holding unit 4 arranged below the mask M, and a squeegee unit 6 arranged above the mask M. Further, the printing machine 1 includes a main control unit 10 composed of a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like, and a storage unit 11 composed of an HDD (Hard Disk Drive) and the like. Then, the main control unit 10 controls each of the units 4 and 6 according to the printing program stored in the storage unit 11, so that the substrate holding unit 4 faces the substrate B to the mask M from below and the squeegee 61 of the squeegee unit 6 The tip of the mask M is slid on the upper surface of the mask M in the X direction. As a result, the solder D supplied to the upper surface of the mask M is printed on the upper surface Bu of the substrate B via a pattern penetrating the mask M.

Further, the printing machine 1 includes a drive control unit 12 and a valve control unit 13 that control the operation of each movable unit, and the main control unit 10 is a movable unit of the units 4 and 6 by the drive control unit 12 and the valve control unit 13. To control. Further, the printing machine 1 includes, for example, a display unit 14 composed of a liquid crystal display or the like, and an input unit 15 composed of an input device such as a keyboard or a mouse. Therefore, the operator can check the operating status of the printing machine 1 by checking the display contents of the display unit 14, and can input a command to the printing machine 1 by operating the input unit 15. The display unit 14 and the input unit 15 may be integrally configured by a touch panel.

The mask holding unit 2 has a clamp member 21, and the mask M is detachably attached to the clamp member 21 via a frame 22 provided on the peripheral edge thereof. As a result, the mask M having a flat plate shape is horizontally held by the mask holding unit 2. The mask M has a rectangular shape in a plan view, and has a through hole (mask pattern) having a shape corresponding to a printing pattern on the substrate B.

The substrate holding unit 4 is arranged below the mask M held by the mask holding unit 2 and has a function of aligning the position of the substrate B with respect to the mask M. The substrate holding unit 4 includes a pair of conveyors 41 that convey the substrate B, a substrate holding portion 42 that holds the substrate B received from the conveyor 41, and a flat plate-shaped movable table 43 that supports the conveyor 41 and the substrate holding portion 42. And have.

The pair of conveyors 41 are arranged in parallel in the Y direction with an interval in the X direction, and both ends of the substrate B in the X direction are supported from below on their respective upper surfaces. Further, the substrate holding unit 4 is provided with a conveyor driving unit M41 for driving these conveyors 41. Then, when the conveyor drive unit M41 that receives the command from the drive control unit 12 drives each conveyor 41, each conveyor 41 conveys the substrate B in the Y direction and executes loading or unloading of the substrate B to the printing machine 1. To do.

The board holding portion 42 has a flat plate-shaped elevating table 421 and a slide column 422 that can slide in the Z direction with respect to the movable table 43, and the elevating table 421 is supported by the upper end of the slide column 422. A plurality of backup pins P erected in the Z direction are arranged on the upper surface of the elevating table 421 with an interval in the X direction and the Y direction, and the backup pin P which is a support member is placed on the elevating table 421. Functions as a mounting table. Further, the board holding unit 42 is provided with a backup drive unit M423, and the backup drive unit M423 that receives a command from the drive control unit 12 raises and lowers the slide column 422 to move the backup pin P together with the elevating table 421. Raise and lower. For example, when the substrate B of the conveyor 41 is carried in, the backup drive unit M423 positions the upper end of each backup pin P below the upper surface of the conveyor 41. Then, when the conveyor 41 carries the substrate B directly above the backup pin P, the backup drive unit M423 raises the backup pin P so that the upper end of the backup pin P protrudes upward from the upper surface of the conveyor 41. As a result, the upper end of the backup pin P pushes up the substrate B while contacting the lower surface Bd of the substrate B, and the substrate B is delivered from the upper surface of the conveyor 41 to the upper end of each backup pin P.

Further, the substrate holding portion 42 includes a pair of clamp plates 424 arranged above the pair of conveyors 41 at intervals in the X direction, and a plate driving portion M424 for driving at least one of these clamp plates 424 in the X direction. Has. The upper surface of each clamp plate 424 is a plane parallel to the X and Y directions and is located at the same height. The plate drive unit M424 adjusts the air supplied to the clamp plate 424 by opening and closing the valve in response to a command from the valve control unit 13. As a result, the clamp plate 424 is driven in the X direction.

Then, the drive control unit 12 raises the substrate B on the backup pin P between the pair of clamp plates 424, and the valve that receives the command from the valve control unit 13 operates to narrow the distance between the clamp plates 424. As a result, the substrate B is clamped by these clamp plates 424 from the X direction (horizontal direction). Specifically, the storage unit 11 stores the substrate height data indicating the driving amount of the backup drive unit M423 that matches the height of the upper surface of the substrate B with the height of the upper surface of the clamp plate 424. Then, the backup drive unit M423 raises the substrate B by the amount of increase indicated by the substrate height data. At this time, while the backup drive unit M423 is raising the substrate B, the plate drive unit M424 makes the distance between the pair of clamp plates 424 wider than the width of the substrate B in the X direction. Then, when the ascent of the substrate B by the backup drive unit M423 is completed, the plate drive unit M424 narrows the distance between the pair of clamp plates 424 and sandwiches the substrate B from the X direction by these clamp plates 424. In this way, the substrate B is clamped by the clamp plate 424.

Further, the substrate holding unit 4 has a table driving mechanism 44 for driving the movable table 43. The table drive mechanism 44 is attached to the X-axis table 441, the Y-axis table 442 attached to the upper surface of the X-axis table 441, the R-axis table 443 attached to the upper surface of the Y-axis table 442, and the R-axis table 443. On the other hand, it has a ball screw 444 that raises and lowers the movable table 43. Further, the table drive mechanism 44 drives the X-axis drive unit M441 that drives the X-axis table 441 in the X direction, the Y-axis drive unit M442 that drives the Y-axis table 442 in the Y direction, and the R-axis table 443 in the R direction ( It has an R-axis drive unit M443 that drives in a rotation direction centered on an axis parallel to the Z direction) and a Z-axis drive unit M444 that drives the movable table 43 in the Z direction by rotating the ball screw 444. Therefore, the drive control unit 12 can drive the conveyor 41 and the substrate holding unit 42 arranged on the movable table 43 in the X, Y, Z, and R directions by controlling the drive units M441 to M444. For example, when positioning the carried-in substrate B with respect to the mask M, the drive control unit 12 sets the position of the substrate B clamped on the clamp plate 424 by the XYR axis drive units M441 to M443. -Adjust in the Y direction and adjust in the Z direction by the Z-axis drive unit M444. As a result, the upper surfaces of the clamp plate 424 and the substrate B each come into contact with the lower surface of the mask M.

Further, the printing machine 1 has a pin arrangement unit 7 for arranging the backup pin P on the elevating table 421, for example, as illustrated in FIG. Here, FIG. 3 is a perspective view schematically showing an example of arrangement of backup pins with respect to the elevating table. The pin arrangement unit 7 will be described with reference to FIGS. 1 to 3.

The pin arrangement unit 7 has an arrangement head 71, an X-axis drive unit M711 for driving the arrangement head 71 in the X direction, and a Y-axis drive unit M712 for driving the arrangement head 71 in the Y direction. Moves the arrangement head 71 two-dimensionally in the XY directions by the X-axis drive unit M711 and the Y-axis drive unit M712. The arrangement head 71 has a plurality of suction nozzles 72 arranged in parallel in the Y direction with an interval C, and the pin arrangement unit 7 is a Z-axis drive unit that individually drives these suction nozzles 72 in the Z direction. It has M713. Then, the drive control unit 12 raises and lowers each suction nozzle 72 by the Z-axis drive unit M713. The number of suction nozzles 72 is not limited to the two illustrated in FIG.

Further, the pin arrangement unit 7 has a pin stocker 75 arranged on the side of the elevating table 421 in the X direction, and a large number of backup pins P are stocked in the pin stocker 75. In the pin stocker 75, each backup pin P stands parallel to the Z direction and is arranged parallel to the Y direction at intervals C. Then, the main control unit 10 moves the arrangement head 71 between the pin stocker 75 and the elevating table 421 to transfer the backup pin P from the pin stocker 75 to the elevating table 421, or from the elevating table 421 to the pin stocker 75. The backup pin P can be stored.

For example, the former operation is executed as follows. The drive control unit 12 causes the two suction nozzles 72 to face the two backup pins P from above by locating the arrangement head 71 above the pin stocker 75 by the X-axis drive unit M711 and the Y-axis drive unit M712. .. Then, when the drive control unit 12 simultaneously lowers these suction nozzles 72 by the Z-axis drive unit M713 and brings them into contact with the backup pin P, the valve control unit 13 applies negative pressure to the suction nozzles 72. As a result, when the two backup pins P are sucked by the two suction nozzles 72, the drive control unit 12 raises these suction nozzles 72.

In this way, when the two backup pins P are picked up from the pin stocker 75 by the two suction nozzles 72, the drive control unit 12 raises the head 71 by the X-axis drive unit M711 and the Y-axis drive unit M712 on the elevating table 421. By moving it upward, the backup pin P faces the target position of the elevating table 421 from above. Then, when the drive control unit 12 lowers the suction nozzle 72 by the Z-axis drive unit M713 to bring the backup pin P into contact with the target position of the elevating table 421, the valve control unit 13 releases the negative pressure of the suction nozzle 72. As a result, when the backup pin P is placed at the target position of the elevating table 421, the drive control unit 12 raises the suction nozzle 72.

At this time, when the target positions for arranging the two backup pins P are arranged parallel to the Y direction at an interval C, the arrangement head 71 simultaneously transfers the two backup pins P to the elevating table 421. If this is not the case, the arrangement head 71 transfers one backup pin P of the two backup pins P to the elevating table 421 and then transfers the other backup pin P to the elevating table 421. ..

The backup pin P placed on the elevating table 421 is held on the elevating table 421 by magnetic force. According to such a holding mode, unlike the configuration in which the backup pin P is held by engaging the backup pin P with a plurality of engaging holes arranged in a matrix, the backup pin P is arbitrarily placed on the elevating table 421. It is possible to realize a free location that can be placed at the position of.

As described above, the backup pin P is transferred from the pin stocker 75 to the elevating table 421. Further, when the backup pin P is stored in the elevating table 421 from the pin stocker 75, the reverse operation of the above is executed.

FIG. 4 is a plan view schematically showing an example of a substrate on which solder is printed by the printing machine of FIG. 1. As shown in the figure, a plurality of print target positions Lt (for example, electrodes such as lands) are provided on the upper surface Bu of the substrate B, and the mask M has a pattern corresponding to each print target position Lt. Vacant. Then, the printing machine 1 supports the lower surface Bd of the substrate B that comes into contact with the mask M from below by the backup pin P, and slides the squeegee 61 onto the upper surface of the mask M to allow the substrate B to pass through the mask M. Solder printing is performed to print the solder D at each print target position Lt on the upper surface Bu. At this time, if the backup pin P is improperly arranged, a gap is generated between the mask M and the substrate B at the periphery of the print target position Lt, and the solder D cannot be printed well at the print target position Lt. Therefore, in the present embodiment, the arrangement mode of the backup pin P is calculated based on the inspection-related information used in the printing inspection for inspecting the solder D printed on the substrate B. Next, this point will be described.

FIG. 5 is a block diagram showing an example of a printing system including the printing machine of FIG. As shown in the figure, the printing system S includes the above-mentioned printing machine 1, inspection machine 8, and server computer 9. The inspection machine 8 is a so-called SPI (Solder Paste Inspection), and inspects the quality of the solder D printed on the substrate B by the printing machine 1 (printing inspection). The inspection machine 8 determines the quality of the solder D based on whether or not the measured value obtained by measuring the amount of the solder D printed on the substrate B with respect to the volume satisfies the permissible range Ia. The quantity relating to the volume of the solder D includes at least one of the area of the solder D (in other words, viewed from the normal direction of the upper surface Bu of the substrate B) and the height of the solder D from the substrate B in a plan view. Further, the allowable range Ia is defined by the upper limit value and the lower limit value of the ratio to the target value. For example, if the upper limit value is 150% and the lower limit value is 50%, the allowable range Ia is 0.5 to 1.5 times the target value. If the measured value falls within the permissible range Ia, the solder D is determined to be good, and if not, the solder D is determined to be defective. In particular, in the inspection machine 8, the allowable range Ia is set by the operator for each of the plurality of print target positions Lt. Therefore, the operator executes management such as setting a narrow allowable range Ia for the print target position Lt that requires accuracy, and setting a wide allowable range Ia for the print target position Lt that does not require accuracy. it can. The quality determination result Ib of the solder D is stored in the inspection machine 8 for each print target position Lt.

FIG. 6 is a block diagram showing an example of the electrical configuration of the server computer. The server computer 9 includes a calculation unit 91, a storage unit 92, a UI 93, and a communication unit 94. The arithmetic unit 91 is a processor composed of a CPU and RAM, and executes arithmetic processing for determining the arrangement mode of the backup pin P. The storage unit 92 is composed of an HDD, and stores various data necessary for determining the arrangement mode of the backup pin P. The UI 93 accepts the input operation of the worker and displays various information on the screen to the worker. Further, the communication unit 94 executes communication with external devices such as the printing machine 1 and the inspection machine 8.

In particular, the calculation unit 91 receives the permissible range Ia used in the print inspection as inspection-related information I from the inspection machine 8 by the communication unit 94 and stores it in the storage unit 92. Then, the calculation unit 91 calculates the arrangement mode of the backup pin P according to the permissible range Ia set for each print target position Lt.

FIG. 7 is a flowchart showing a first method of determining a backup pin arrangement mode, and FIGS. 8 and 9 are plan views schematically showing an example of a calculation content executed according to the flowchart of FIG. 7. The flowchart of FIG. 7 is executed by the arithmetic processing of the arithmetic unit 91 of the server computer 9 before starting the solder printing on the printing machine 1. Further, in FIG. 9, the backup pin P is shown through the substrate B, but since the backup pin P is actually arranged under the substrate B, it is hidden by the substrate B.

In step S101, as described above, the permissible range Ia set for each print target position Lt is acquired from the inspection machine 8 as inspection-related information I and stored in the storage unit 92. In step S102, as shown in FIG. 8, the arrangement target range Ap of the backup pin P is set with respect to the substrate B. Specifically, the arrangement target range is provided so as to include a plurality of print target positions Lt that are provided adjacent to each other in an area equal to or less than a predetermined reference area and have the same allowable range Ia set for each. Ap is set. Further, for the print target position Lt that does not satisfy such a condition, the arrangement target range Ap is set for one print target position Lt.

In step S103, the pin arrangement density indicating the number of backup pins P to be arranged per unit area is determined for each arrangement target range Ap. That is, the pin arrangement density is determined according to the allowable range Ia set for the backup pin P included in the arrangement target range Ap, and the arrangement target range Ap is such that the narrower the allowable range Ia is, the higher the pin arrangement density is. The pin placement density for is determined.

In step S104, the arrangement mode determined in step S103 is displayed on the UI 93. For example, the placement target range Ap having a high pin placement density is displayed in red, and the placement target range Ap having a low pin placement density is displayed in blue, so that the placement target range Ap is displayed while being color-coded according to the pin placement density. be able to. As a result, the operator confirms the pin arrangement density of each arrangement target range Ap displayed on the screen of UI93, and arranges the backup pin P in each arrangement target range Ap as illustrated in FIG. You can perform input operations.

Then, in step S105, the arrangement position of the backup pin P input in step S104 is transmitted from the server computer 9 to the printing machine 1. As a result, the printing machine 1 can arrange the backup pin P at the received arrangement position by the arrangement head 71.

In the embodiment configured as described above, the inspection-related information I (allowable range Ia) related to the print inspection for inspecting the quality of the solder D printed on the substrate B is acquired. Then, the arrangement mode (pin arrangement density) of the backup pins P supporting the substrate B is calculated according to the inspection-related information I. As a result, when arranging the backup pin P that supports the substrate B, it is possible to reduce the burden on the operator who examines the arrangement mode of the backup pin P.

Further, in the print inspection, the allowable range Ia of the measured value obtained by measuring the state of the solder D is set with respect to the print target position Lt, and the measured value of the solder D printed at the print target position Lt is the allowable range Ia. The quality of the solder D is determined based on whether or not it is inside. Then, the communication unit 94 acquires the permissible range Ia as the inspection-related information I. In such a configuration, the arrangement mode of the backup pin P can be appropriately calculated according to the permissible range Ia used as a criterion for determining the quality of the print inspection.

Further, in the print inspection, the measured value is measured so as to include at least one of the area of the solder D (in other words, the area of the solder D as viewed from the normal direction of the upper surface Bu of the substrate B) and the height of the solder D from the substrate B in a plan view. Can be obtained. In such a configuration, the arrangement mode of the backup pin P can be appropriately calculated according to at least one of the area and height of the solder D.

Further, in the calculation unit 91, the narrower the allowable range Ia set for the print target position Lt included in the arrangement target range Ap of the backup pin P, the narrower the backup pin P per unit area to be arranged in the arrangement target range Ap. The arrangement mode is calculated so that the number is large. In such a configuration, the backup pin P can firmly support the range in which the print target position Lt having a narrow permissible range Ia used in the print inspection exists.

Further, the UI 93 is provided with a display (color-coded display) corresponding to the number of backup pins P per unit area to be arranged in the arrangement target range Ap, and the arrangement mode of the backup pins P is shown to the operator. Has been done. In such a configuration, the operator can refer to the arrangement mode shown in the UI 93 when considering the arrangement of the backup pin P. Therefore, it is possible to reduce the burden on the worker.

FIG. 10 is a flowchart showing a second method of determining the arrangement mode of the backup pins, and FIG. 11 is a diagram schematically showing the conditions to be satisfied in determining the arrangement mode of the backup pins according to the flowchart of FIG. FIG. 12 is a plan view schematically showing an example of a backup pin arrangement mode determined according to the flowchart of FIG. The flowchart of FIG. 10 is executed by the arithmetic processing of the arithmetic unit 91 of the server computer 9 in parallel with the period during which the printing machine 1 prints the solder D of the same pattern on the planned number of boards B to be produced. Further, in FIG. 12, the backup pin P is shown through the substrate B in a plan view, but since the backup pin P is actually arranged under the substrate B, it is hidden by the substrate B.

In step S201, it is determined whether or not the solder printing on the printing machine 1 is completed on the planned number of boards B to be produced and the printing is completed. Then, when the printing is completed (when "YES" in step S201), the flowchart of FIG. 10 is terminated, while when the printing is not completed (when "NO" in step S201), the flowchart is terminated. , Step S202.

In step S202, it is confirmed whether or not the inspection-related information I is received from the inspection machine 8. That is, the printing machine 1 carries out the substrate B on which the solder D is printed to the inspection machine 8, and when the inspection machine 8 determines the quality of the solder D of the substrate B carried in from the printing machine 1, the determination result Ib is inspected. It is transmitted to the server computer 9 as related information I. If the reception of the inspection-related information I is not confirmed (“NO” in step S202), the process returns to step S201, while the reception of the inspection-related information I is confirmed (“YES” in step S202). In the case), the process proceeds to step S203.

In step S203, it is confirmed whether or not there is a defective print position Ln (FIG. 12) in which the printed solder D is determined to be defective among the plurality of print target positions Lt provided on the substrate B. .. Then, when the existence of the defective print position Ln is not confirmed (when “NO” in step S203), the process returns to step S201, while when the existence of the defective print position Ln is confirmed (“YES” in step S203). In the case), the process proceeds to step S204.

In step S204, it is confirmed whether the same print target position Lt is determined to be the defective print position Ln consecutively for a predetermined number of times (two or more times). Specifically, the calculation unit 91 counts the number of times continuously determined to be the defective print position Ln for each print target position Lt, and confirms in step S204 based on this count value. .. If the number of times that the defective print position Ln is continuously determined is less than the predetermined number (when “NO” in step S204), the process returns to step S201, while the number of times that the defective print position Ln is continuously determined is If the number of times is predetermined, the count value for the corresponding print target position Lt is reset to zero, and then the process proceeds to step S205.

In step S205, the position where the backup pin P is added is calculated based on the defective printing position Ln in which the solder D is determined to be defective for a predetermined number of times in a row. The addition of the backup pin P is determined so as to satisfy the interference prevention condition shown in FIG. Here, the interference prevention condition requires that the two backup pins P be separated from each other by leaving the arrangement positions Lp and Lp of the two adjacent backup pins P at the closest interval T or more. The arrangement position Lp (XY coordinates) of the backup pin P is given by the geometric center of gravity of the upper end Pt of the backup pin P in contact with the lower surface Bd of the substrate B.

Subsequently, with reference to FIG. 12, an example of determining the arrangement position Lp of the backup pin P to be added to the BGA (Ball Grid Array) in which a plurality of print target positions Lt (lands) are arranged in a matrix will be described. In FIG. 12, defective print position Ln (XY coordinates) determined to be defective in a predetermined number of times is shown, and in each column of modes 1 to 5, backup is performed when the occurrence status of the defective print position Ln is different. The situation before and after adding the pin P is shown.

In mode 1, as shown in the “Before addition” column, the distance between the already arranged backup pin P arrangement position Lp and the defective print position Ln is more than the closest distance T. Therefore, as shown in the "after addition" column, it is determined that the backup pin P is added to the defective print position Ln. That is, the arrangement position Lp of the backup pin P to be added and the defective printing position Ln coincide with each other.

In mode 2, two defective print positions Ln are generated as shown in the “Before addition” column. Since the distance between these defective printing positions Ln is less than the closest interval T, it is not possible to arrange backup pins P at each of these defective printing positions Ln while satisfying the interference prevention condition. Therefore, as shown in the "after addition" column, it is determined that the backup pin P is added to the geometric center of gravity (XY coordinates) of the two defective print positions Ln. That is, the arrangement position Lp of the backup pin P to be added and the geometric center of gravity of the two defective print positions Ln coincide with each other.

In mode 3, as shown in the “Before addition” column, three defective print positions Ln are generated. Since the distance between any one of these defective printing positions Ln and the other defective printing position Ln is less than the closest contact interval T, backup pins P are placed on each of these defective printing positions Ln while satisfying the interference prevention condition. Cannot be placed. Therefore, as shown in the "after addition" column, it is determined that the backup pin P is added to the geometric center of gravity (XY coordinates) of the three defective print positions Ln. That is, the arrangement position Lp of the backup pin P to be added coincides with the geometric center of gravity of the three defective print positions Ln.

In mode 4, as shown in the “Before addition” column, the distance between the already placed backup pin P placement position Lp and the defective print position Ln is less than the closest interval T, so that the interference prevention condition is set. It is not possible to add the backup pin P to the defective print position Ln while satisfying. Therefore, as shown in the "after addition" column, the following conditions: -On the virtual straight line Vl passing between the already placed backup pin P placement position Lp and the defective print position Ln-The defective print position Ln On the other hand, the backup pin P is placed at a position (XY coordinates) that is opposite to the position Lp of the backup pin P that has already been placed and that is separated from the already placed backup pin P by the closest interval T. Decide to add. In mode 4, a virtual circle Vc whose diameter is the closest interval T is also described.

In mode 5, as shown in the “Before addition” column, three defective print positions Ln are generated. Since the distance between any one of these defective printing positions Ln and the other defective printing position Ln is less than the closest contact interval T, backup pins P are placed on each of these defective printing positions Ln while satisfying the interference prevention condition. Cannot be placed. Moreover, since the distance between these geometric centers of gravity G and the arrangement position Lp of the backup pin P that has already been arranged is less than the closest interval T, it is not possible to add the backup pin P as in mode 3. Therefore, as shown in the "after addition" column, on the virtual straight line Vl passing through the following conditions: the arrangement position Lp of the backup pin P already arranged and the geometric center of gravity G of the three defective printing positions Ln. Yes ・ The position opposite to the placement position Lp of the backup pin P that has already been placed with respect to the geometric center of gravity G ・ The position that satisfies the closest distance T from the backup pin P that has already been placed (XY coordinates) ) To add a backup pin P. In mode 5, a virtual circle Vc whose diameter is the closest interval T is also described.

As described above, in step S205, based on the determination result Ib for the preceding substrate B on which the solder D is printed first, the arrangement mode of the backup pin P supporting the subsequent substrate B on which the solder D is to be printed later is arranged. It is determined. Then, in step S206, the server computer 9 transmits a pin addition command to the printing press 1 so as to add the backup pin P to the arrangement position Lp calculated in step S205. As a result, the printing machine 1 can add the backup pin P by the arrangement head 71 according to the received pin addition command. The printing machine 1 adds the backup pin P in parallel with the work of carrying in the next board B while carrying out the printed board B to the inspection machine 8.

In the embodiment configured as described above, the inspection-related information I (determination result Ib) related to the print inspection for inspecting the quality of the solder D printed on the substrate B is acquired. Then, the arrangement mode of the backup pin P that supports the substrate B (the arrangement position Lp of the backup pin P to be added) is calculated according to the inspection-related information I. As a result, when arranging the backup pin P that supports the substrate B, it is possible to reduce the burden on the operator who examines the arrangement mode of the backup pin P.

Further, the communication unit 94 acquires the determination result Ib in which the print inspection determines the quality of the solder D printed at the print target position Lt. Then, the calculation unit 91 calculates the arrangement mode of the backup pin P according to the defective print position Ln which is the print target position Lt on which the solder D indicating that the determination result Ib is defective is printed. In such a configuration, the arrangement mode of the backup pin P can be appropriately calculated according to the print target position Lt in which the solder D is determined to be defective in the print inspection.

In addition, the calculation unit 91 arranges the backup pin P at the defective print position Ln in the calculation of the backup pin P (mode 1). In such a configuration, the backup pin P can be added to the defective printing position Ln to execute the subsequent solder printing, and it is possible to suppress the recurrence of the printing defect of the solder D.

Further, the calculation unit 91 sets the backup pins P so as to satisfy the interference prevention condition that the two backup pins P are separated from each other by separating the positions of the two adjacent backup pins P by a predetermined closest interval T or more. The arrangement mode is determined. In such a configuration, it is possible to prevent two adjacent backup pins P from interfering with each other.

Further, when the interval between the arrangement position Lp of the backup pin P already arranged and the defective print position Ln is less than the closest interval T, the calculation unit 91 determines the backup pin P as shown in mode 4. The arrangement mode of is calculated. That is, it is a position opposite to the defective printing position Ln on the virtual straight line Vl passing through the arrangement position Lp and the defective printing position Ln of the backup pin P that has already been arranged, and is the arrangement. It is determined that the backup pin P is added at the position where the distance from the position Lp is the closest distance T. In such a configuration, a backup pin P can be added in the vicinity of the print target position Lt determined to be defective in the solder D by the print inspection, and subsequent solder printing can be executed, and the printing defect of the solder D reoccurs. Can be suppressed.

Further, when there are a plurality of defective print positions Ln in which the backup pin P cannot be arranged while satisfying the interference prevention condition, the calculation unit 91 calculates the backup pin P when the plurality of defective print positions Ln are calculated. It is determined that the backup pin P is added to the geometric center of gravity G of (modes 2 and 3). In such a configuration, a backup pin P can be added in the vicinity of the print target position Lt determined to be defective in the solder D by the print inspection, and subsequent solder printing can be executed, and the printing defect of the solder D reoccurs. Can be suppressed.

Further, the calculation unit 91 has a plurality of defective print positions Ln in which the backup pin P cannot be arranged while satisfying the interference prevention condition, and is already arranged with the geometric center of gravity G of the plurality of defective print positions Ln. When the distance between the backup pin P and the arrangement position Lp of the backup pin P is less than the closest interval T, the arrangement mode of the backup pin P is calculated as shown in the mode 5. That is, on the virtual straight line Vl passing through the arrangement position Lp of the backup pin P already arranged and the geometric center of gravity G of the plurality of defective printing positions Ln, the position opposite to the arrangement position Lp with respect to the geometric center of gravity G. Therefore, it is determined that the backup pin P is added at a position where the distance from the arrangement position Lp is the closest distance T. In such a configuration, a backup pin P can be added in the vicinity of the print target position Lt determined to be defective in the solder D by the print inspection, and subsequent solder printing can be executed, and the printing defect of the solder D reoccurs. Can be suppressed.

Further, the calculation unit transmits a pin addition command to the printing machine 1 to cause the arrangement head 71 of the printing machine 1 to arrange the backup pin P according to the arrangement mode indicated by the pin addition command (step S206). In such a configuration, the backup pin P can be automatically arranged according to the arrangement mode calculated by the calculation unit 91, and the burden on the operator can be further reduced.

As described above, in the present embodiment, the server computer 9 corresponds to an example of the "support member arrangement support device" of the present invention, the communication unit 94 corresponds to an example of the "acquisition unit" of the present invention, and the arithmetic unit 91 corresponds to the present invention. The UI 93 corresponds to an example of the "user interface" of the present invention, the inspection-related information I corresponds to an example of the "inspection-related information" of the present invention, and the permissible range Ia corresponds to an example of the "calculation unit" of the present invention. The determination result Ib corresponds to an example of the "judgment result" of the present invention, the substrate B corresponds to an example of the "substrate" of the present invention, and the print target position Lt corresponds to an example of the "allowable range" of the present invention. Corresponding to an example of the "printing target position" of the present invention, the defective printing position Ln corresponds to an example of the "defective printing position" of the present invention, and the backup pin P corresponds to an example of the "support member" of the present invention. The closest interval T corresponds to an example of the "closest interval" of the present invention, the virtual straight line Vl corresponds to an example of the "virtual straight line" of the present invention, and the mask M corresponds to an example of the "mask" of the present invention. , Solder D corresponds to an example of the "paste" of the present invention, the printing machine 1 corresponds to an example of the "printing machine" of the present invention, and the mask holding unit 2 corresponds to an example of the "mask holding unit" of the present invention. However, the squeegee unit 6 corresponds to an example of the "squeegee unit" of the present invention, the squeegee 61 corresponds to an example of the "squeegee" of the present invention, and the arrangement head 71 corresponds to an example of the "arrangement head" of the present invention. , The printing system S corresponds to an example of the "printing system" of the present invention.

The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, if the backup pin P cannot be added so as to satisfy the interference prevention condition by any of the above modes 1 to 5, the calculation unit 91 may notify the UI 93 (alarm) of an error. In such a configuration, it is possible to notify the operator that it is necessary to review the arrangement mode of the backup pin P.

Further, the first method and the second method for determining the arrangement mode of the backup pins may be combined and executed. That is, before starting the printing of the solder D on the planned production number of substrates B, the arrangement mode of the backup pin P is determined by the first method, and after the start of the printing, the backup pin P is transferred by the second method. Can be added.

Further, the backup pin P may not be arranged automatically by the arrangement head 71, but may be manually executed by an operator.

Further, the above-mentioned function of the calculation unit 91 of the server computer 9 may be mounted on the main control unit 10 of the printing machine 1, and the main control unit 10 may execute an operation for determining the arrangement mode of the backup pins P. In such a configuration, the main control unit 10 corresponds to the “acquisition unit” and the “calculation unit” of the present invention.

Further, in the second method of determining the arrangement mode of the backup pin, step S204 may be omitted, and if a defective print position Ln is confirmed, the process may proceed to step S205 as it is.

Further, in the above example, the inspection machine 8 measures the area and height of the solder D as the quantity related to the volume of the solder D, but the volume of the solder D is directly measured and the measured value of the volume is within the permissible range. The quality of the solder D may be determined based on whether or not the condition is satisfied.

1 ... Printing machine 2 ... Mask holding unit 6 ... Squeegee unit 61 ... Squeegee 71 ... Placement head 9 ... Server computer (support member placement support device)
91 ... Calculation unit 93 ... UI (user interface)
94 ... Communication department (acquisition department)
B ... Substrate D ... Solder (paste)
I ... Inspection-related information Ia ... Allowable range Ib ... Judgment result Lt ... Printing target position Ln ... Defective printing position M ... Mask P ... Backup pin (support member)
S ... Printing system T ... Closest interval Vl ... Virtual straight line

Claims (16)

An acquisition unit that acquires inspection-related information related to a print inspection that determines the quality of the paste printed at the print target position by paste printing that prints the paste at the print target position of the substrate via the mask pattern.
A support member arrangement support device including a calculation unit that calculates an arrangement mode of a support member that supports the substrate when the paste printing is executed according to the inspection-related information. In the print inspection, an allowable range of measured values obtained by measuring the state of the paste is set with respect to the print target position, and the measured value of the paste printed at the print target position is within the allowable range. The quality of the paste is determined based on whether or not the paste is used.
The support member arrangement support device according to claim 1, wherein the acquisition unit acquires the permissible range as the inspection-related information. The support member placement support device according to claim 2, wherein the measured value includes at least one of the area of the paste, the height of the paste from the substrate, and the volume of the paste in a plan view. In the calculation unit, the narrower the allowable range set for the print target position included in the arrangement target range of the support member, the larger the number of the support members per unit area to be arranged in the arrangement target range. The support member placement support device according to claim 2 or 3, wherein the placement mode is calculated so as to be. The support according to claim 4, further comprising a user interface for indicating the arrangement mode to the operator by attaching a display corresponding to the number of the support members per unit area to be arranged in the arrangement target range to the arrangement target range. Member placement support device. The acquisition unit acquires a determination result in which the print inspection determines the quality of the paste printed at the print target position.
The support according to any one of claims 1 to 5, wherein the calculation unit calculates the arrangement mode according to the defective printing position, which is the printing target position on which the paste indicating that the determination result is defective is printed. Member placement support device. The support member arrangement support device according to claim 6, wherein the calculation unit determines to arrange the support member at the defective printing position in the calculation of the arrangement mode. The claim that the calculation unit determines the arrangement mode so as to satisfy the interference prevention condition that the two support members are separated from each other by separating the positions of the two adjacent support members by a predetermined closest interval or more. The support member arrangement support device according to 6. When the distance between the arrangement position of the support member already arranged and the defective printing position is less than the closest interval, the calculation unit calculates the arrangement mode and finds the arrangement position and the defective printing. It is determined that the support member is added to a position on the virtual straight line passing through the position, which is opposite to the defective printing position and whose distance from the placement position is the closest distance. The support member arrangement support device according to claim 8. When the calculation unit has a plurality of defective printing positions in which the support member cannot be arranged while satisfying the interference prevention condition, the geometry of the plurality of defective printing positions is calculated in the calculation of the arrangement mode. The support member placement support device according to claim 8, wherein the support member is determined to be added to the center of gravity. The calculation unit has a plurality of defective printing positions in which the support member cannot be arranged while satisfying the interference prevention condition, and the geometric center of gravity of the plurality of defective printing positions and the already arranged support. When the distance from the arrangement position of the member is less than the closest interval, the arrangement position is relative to the geometric center of gravity on a virtual straight line passing between the arrangement position and the geometric center of gravity in the calculation of the arrangement mode. The support member arrangement support device according to claim 8, wherein the support member is added to a position opposite to the position of the above, and the distance from the arrangement position is the closest interval. With additional alarms to notify workers of errors
The support member arrangement support device according to any one of claims 8 to 11, wherein the calculation unit notifies the alarm of an error when the support member cannot be added so as to satisfy the interference prevention condition. The calculation unit executes paste printing in which a mask holding unit that holds a mask with respect to a substrate and a squeegee are slid on the mask to print a paste at a printing target position on the substrate via the mask pattern. One of claims 1 to 12, wherein the support member is arranged in the arrangement head of a printing machine including an arrangement head for arranging a support member for supporting the substrate, depending on the arrangement mode. The support member placement support device according to. A mask holding unit that holds the mask against the board,
A squeegee unit that executes paste printing by sliding a squeegee on the mask to print a paste at a printing target position on the substrate through the pattern of the mask.
A printing machine including the support member arrangement support device according to any one of claims 1 to 13. A printing machine that performs paste printing that prints paste at the printing target position on the board via the mask pattern,
An inspection machine that executes a print inspection to determine the quality of the paste printed at the print target position, and
A printing system including the support member arrangement support device according to any one of claims 1 to 13. A process of acquiring inspection-related information related to a printing inspection for determining the quality of the paste printed at the printing target position by past printing, which prints the paste at the printing target position of the substrate via a mask pattern, and
A support member arrangement support method including a step of calculating an arrangement mode of a support member that supports the substrate at the time of executing the paste printing according to the inspection-related information.

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