JP6999254B2 - Support member placement determination device, support member placement determination method - Google Patents

Description

The present invention relates to a technique for determining the arrangement of support members that support a substrate.

In a printing machine, a component mounting machine, or the like, a support member such as a backup pin is used to support a substrate to be operated (printing / component mounting). At this time, in order to properly execute the work on the substrate, the arrangement of the support member is important. Therefore, Patent Documents 1 and 2 show a technique for determining the arrangement of support members that support a substrate in a component mounting machine by designating images showing components mounted on the upper surface and the lower surface of the substrate.

Japanese Patent No. 4452686 Japanese Patent No. 4572262

However, various conditions different from each other are required for the arrangement of the support members. For example, in a printing machine that prints solder on a substrate via a mask, it is required to arrange a support member so that the substrate can be supported at a position corresponding to the pattern of the mask. On the other hand, when an obstacle such as a component exists on the surface of both sides of the substrate that the support member comes into contact with, it is required to avoid the obstacle and arrange the support member. Since these arrangement conditions cannot always be satisfied simultaneously and completely, it is necessary to determine an appropriate arrangement of the support members while considering each arrangement condition.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of determining the arrangement of support members appropriately satisfying each of a plurality of arrangement conditions for requesting arrangement modes of support members different from each other. And.

The support member arrangement determination device according to the present invention includes a calculation unit that sets a virtual space that virtually represents the real space in which the support members that support the substrate are arranged, and a plurality of arrangement conditions for obtaining different arrangement modes of the support members. A storage unit that stores Information is generated and the position to place the support member is determined based on the synthetic potential information.

The method for determining the arrangement of support members according to the present invention includes a step of setting a virtual space that virtually represents the real space in which the support members that support the substrate are arranged, and a plurality of arrangement conditions for obtaining different arrangement modes of the support members. For each, the process of generating the placement condition potential information in which the potential is set according to the placement condition for the virtual space, the process of generating the synthetic potential information by synthesizing each placement condition potential information, and the process of generating the synthetic potential information are supported based on the synthetic potential information. It includes a step of determining a position for arranging the members.

In the present invention configured as described above (support member arrangement determination device, support member arrangement determination method), each of the plurality of arrangement conditions for obtaining different arrangement modes of the support members corresponds to the arrangement conditions with respect to the virtual space. Placement condition potential information with potential is generated. Then, the position where the support member is arranged is determined based on the combined potential information obtained by synthesizing the plurality of arrangement condition potential information. Therefore, it is possible to determine the arrangement of the support members that appropriately satisfies each of the plurality of arrangement conditions.

Further, the calculation unit may configure the support member arrangement determination device so as to set an attractive force potential that acts to attract the support member to a position where the arrangement condition requires the arrangement of the support member. This makes it possible to arrange the support member in the vicinity of the place where the arrangement condition requires the arrangement.

Further, the arithmetic unit may configure the support member arrangement determination device so as to set a repulsive force potential that acts to move the support member away from the position where the arrangement condition prohibits the arrangement of the support member. This makes it possible to place the support member outside the place where the placement condition prohibits the placement.

Further, the arithmetic unit may configure a support member arrangement determination device so as to generate synthetic potential information by adding weighting coefficients to a plurality of arrangement condition potential information. Thereby, it is possible to determine the arrangement of the support members appropriately satisfying the priorities (weighting factors) of the plurality of arrangement conditions.

Further, an operation unit that accepts an input operation by the operator may be further provided, and the calculation unit may configure a support member arrangement determination device so as to generate synthetic potential information with a weighting coefficient corresponding to the input operation. Thereby, it is possible to determine the arrangement of the support members appropriately satisfying the plurality of arrangement conditions according to the priority indicated by the operator.

Further, the arithmetic unit determines whether or not there is interference between the obstacle provided on the surface of both sides of the substrate that the support member contacts, and the support member arranged at the position determined based on the synthetic potential information, and the interference occurs. In some cases, the support member arrangement determination device may be configured so as to adjust the position where the support member is arranged. Thereby, it is possible to determine the arrangement of the support member while avoiding the interference between the support member and the obstacle.

Further, the support member arrangement determination device may be configured so as to determine the arrangement of the support member that supports the substrate on which the solder is printed via the mask in the printing machine. In such a configuration, it is possible to print solder on the substrate while supporting the substrate by an appropriately arranged support member.

Further, the support member arrangement determination device may be configured so as to determine the arrangement of the support member that supports the substrate on which the component is mounted in the component mounting machine. In such a configuration, it is possible to mount a component on the substrate while supporting the substrate by an appropriately arranged support member.

According to the present invention, it is possible to determine the arrangement of the support members that appropriately satisfies each of the plurality of arrangement conditions for obtaining the arrangement modes of the support members that are different from each other.

Front view schematically showing a printing machine. FIG. 3 is a block diagram showing an electrical configuration included in the printing machine of FIG. 1. The perspective view which shows typically the arrangement example of the backup pin with respect to the elevating table. A block diagram showing an example of the electrical configuration of a server computer that determines the placement of backup pins. The figure which shows the plurality of arrangement conditions which ask the backup pin for the arrangement mode different from each other in a table format. A flowchart showing an example of a backup pin placement decision performed by a server computer. A contour diagram showing an example of a potential field set according to the conditions directly under the pattern. A contour diagram showing an example of a potential field set according to a component avoidance condition. A contour diagram showing an example of a potential field set according to the deflection suppression condition. A contour diagram showing an example of a potential field set according to the placement efficiency condition. The figure which shows an example of the weighting coefficient used when synthesizing a potential field in a table format. A contour diagram showing an example of a synthetic potential field. The figure which shows an example of the position adjustment of a backup pin schematically. A partial front view schematically showing an example of a component mounting machine.

FIG. 1 is a front view schematically showing a printing machine, and FIG. 2 is a block diagram showing an electrical configuration included in the printing machine of FIG. In FIG. 1 and the following figures, XYZ orthogonal coordinate axes with the Z direction as the vertical direction and the X and Y directions as the horizontal directions are appropriately shown. The printing machine 1 includes a mask holding unit 2 for holding the mask M, a substrate holding unit 4 arranged below the mask M, and a squeegee unit 6 arranged above the mask M. Further, the printing machine 1 includes a main control unit 10 composed of a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like, and a storage unit 11 composed of an HDD (Hard Disk Drive) and the like. Then, the main control unit 10 controls each of the units 4 and 6 according to the print program stored in the storage unit 11, so that the substrate holding unit 4 faces the substrate B to the mask M from below and the squeegee unit 6 is squeezed 61. The tip of the mask M is slid on the upper surface of the mask M in the X direction. As a result, the solder D supplied to the upper surface of the mask M is printed on the upper surface Bu of the substrate B via the pattern penetrating the mask M.

Further, the printing machine 1 includes a drive control unit 12 and a valve control unit 13 that control the operation of each movable unit, and the main control unit 10 is a movable unit of the units 4 and 6 by the drive control unit 12 and the valve control unit 13. To control. Further, the printing machine 1 includes a display unit 14 composed of, for example, a liquid crystal display and the like, and an input unit 15 composed of an input device such as a keyboard and a mouse. Therefore, the operator can check the operating status of the printing machine 1 by checking the display contents of the display unit 14, and can input a command to the printing machine 1 by operating the input unit 15. The display unit 14 and the input unit 15 may be integrally configured by a touch panel.

The mask holding unit 2 has a clamp member 21, and the mask M is detachably attached to the clamp member 21 via a frame 22 provided on the peripheral portion thereof. As a result, the mask M having a flat plate shape is horizontally held by the mask holding unit 2. This mask M has a rectangular shape in a plan view and has a through hole (mask pattern) having a shape corresponding to a printing pattern on the substrate B.

The substrate holding unit 4 is arranged below the mask M held by the mask holding unit 2 and has a function of aligning the position of the substrate B with respect to the mask M. The substrate holding unit 4 is a flat plate-shaped movable table 43 that supports a pair of conveyors 41 that convey the substrate B, a substrate holding portion 42 that holds the substrate B received from the conveyor 41, and the conveyor 41 and the substrate holding portion 42. And have.

The pair of conveyors 41 are arranged in parallel in the Y direction with an interval in the X direction, and both ends of the substrate B in the X direction are supported from below on their respective upper surfaces. Further, the substrate holding unit 4 is provided with a conveyor driving unit M41 for driving these conveyors 41. Then, when the conveyor drive unit M41 receiving a command from the drive control unit 12 drives each conveyor 41, each conveyor 41 conveys the substrate B in the Y direction and executes loading or unloading of the substrate B to the printing machine 1. do.

The substrate holding portion 42 has a flat plate-shaped elevating table 421 and a slide column 422 that can slide in the Z direction with respect to the movable table 43, and the elevating table 421 is supported by the upper end of the slide column 422. On the upper surface of the elevating table 421, a plurality of backup pins P erected in the Z direction are arranged at intervals in the X direction and the Y direction. Further, the board holding unit 42 is provided with a backup drive unit M423, and the backup drive unit M423 that receives a command from the drive control unit 12 raises and lowers the slide column 422 to raise and lower the backup pin P together with the elevating table 421. Raise and lower. For example, when the board B of the conveyor 41 is carried in, the backup drive unit M423 positions the upper end of each backup pin P below the upper surface of the conveyor 41. Then, when the conveyor 41 carries the substrate B directly above the backup pin P, the backup drive unit M423 raises the backup pin P so that the upper end of the backup pin P protrudes upward from the upper surface of the conveyor 41. As a result, the upper end of the backup pin P pushes up the substrate B while in contact with the lower surface Bd of the substrate B, and the substrate B is delivered from the upper surface of the conveyor 41 to the upper end of each backup pin P.

Further, the substrate holding portion 42 includes a pair of clamp plates 424 arranged above the pair of conveyors 41 at intervals in the X direction, and a plate driving portion M424 for driving at least one of these clamp plates 424 in the X direction. Have. The upper surface of each clamp plate 424 is a plane parallel to the X and Y directions and is located at the same height. The plate drive unit M424 adjusts the air supplied to the clamp plate 424 by opening and closing the valve in response to a command from the valve control unit 13. As a result, the clamp plate 424 is driven in the X direction.

Then, the drive control unit 12 raises the substrate B on the backup pin P between the pair of clamp plates 424, and the valve receiving the command from the valve control unit 13 operates to narrow the distance between the clamp plates 424. As a result, the substrate B is clamped by these clamp plates 424 from the X direction (horizontal direction). Specifically, the storage unit 11 stores the substrate height data indicating the driving amount of the backup drive unit M423 that matches the height of the upper surface of the substrate B with the height of the upper surface of the clamp plate 424. Then, the backup drive unit M423 raises the substrate B by the ascending width indicated by the substrate height data. At this time, while the backup drive unit M423 is ascending the substrate B, the plate drive unit M424 makes the distance between the pair of clamp plates 424 wider than the width of the substrate B in the X direction. Then, when the ascent of the substrate B by the backup drive unit M423 is completed, the plate drive unit M424 narrows the distance between the pair of clamp plates 424 and sandwiches the substrate B from the X direction by these clamp plates 424. In this way, the substrate B is clamped by the clamp plate 424.

Further, the substrate holding unit 4 has a table driving mechanism 44 for driving the movable table 43. The table drive mechanism 44 is attached to the X-axis table 441, the Y-axis table 442 attached to the upper surface of the X-axis table 441, the R-axis table 443 attached to the upper surface of the Y-axis table 442, and the R-axis table 443. On the other hand, it has a ball screw 444 that raises and lowers the movable table 43. Further, the table drive mechanism 44 drives the X-axis drive unit M441 that drives the X-axis table 441 in the X direction, the Y-axis drive unit M442 that drives the Y-axis table 442 in the Y direction, and the R-axis table 443 in the R direction ( It has an R-axis drive unit M443 that drives in a rotation direction about an axis parallel to the Z direction) and a Z-axis drive unit M444 that drives the movable table 43 in the Z direction by rotating the ball screw 444. Therefore, the drive control unit 12 can drive the conveyor 41 and the substrate holding unit 42 arranged on the movable table 43 in the X, Y, Z, and R directions by controlling the drive units M441 to M444. For example, when positioning the carried-in substrate B with respect to the mask M, the drive control unit 12 sets the position of the substrate B clamped to the clamp plate 424 by the XYR axis drive units M441 to M443. -Adjust in the Y direction and adjust in the Z direction by the Z-axis drive unit M444. As a result, the upper surfaces of the clamp plate 424 and the substrate B each come into contact with the lower surface of the mask M.

Further, the printing machine 1 has a pin arrangement unit 7 for arranging the backup pin P on the elevating table 421, for example, as illustrated in FIG. Here, FIG. 3 is a perspective view schematically showing an example of arrangement of backup pins with respect to the elevating table. The pin arrangement unit 7 will be described with reference to FIGS. 1 to 3.

The pin arrangement unit 7 has an arrangement head 71, an X-axis drive unit M711 for driving the arrangement head 71 in the X direction, and a Y-axis drive unit M712 for driving the arrangement head 71 in the Y direction. Moves the arrangement head 71 two-dimensionally in the XY direction by the X-axis drive unit M711 and the Y-axis drive unit M712. The arrangement head 71 has a plurality of suction nozzles 72 arranged in parallel in the Y direction with an interval L, and the pin arrangement unit 7 is a Z-axis drive unit that individually drives these suction nozzles 72 in the Z direction. It has M713. Then, the drive control unit 12 raises and lowers each suction nozzle 72 by the Z-axis drive unit M713. The number of suction nozzles 72 is not limited to the two illustrated in FIG. Further, the distance L between the adjacent suction nozzles 72 can be obtained as the distance between the centers of the suction nozzles 72.

Further, the pin arrangement unit 7 has a pin stocker 75 arranged on the side of the elevating table 421 in the X direction, and a large number of backup pins P are stocked in the pin stocker 75. In this pin stocker 75, each backup pin P stands parallel to the Z direction and is arranged parallel to the Y direction at intervals L. Then, the main control unit 10 moves the arrangement head 71 between the pin stocker 75 and the elevating table 421 to transfer the backup pin P from the pin stocker 75 to the elevating table 421, or from the elevating table 421 to the pin stocker 75. The backup pin P can be stored.

For example, the former operation is executed as follows. In the drive control unit 12, the arrangement head 71 is positioned above the pin stocker 75 by the X-axis drive unit M711 and the Y-axis drive unit M712, so that the two suction nozzles 72 face the two backup pins P from above. .. Then, when the drive control unit 12 simultaneously lowers the suction nozzles 72 by the Z-axis drive unit M713 and brings them into contact with the backup pin P, the valve control unit 13 applies a negative pressure to the suction nozzles 72. As a result, when the two backup pins P are sucked by the two suction nozzles 72, the drive control unit 12 raises these suction nozzles 72.

In this way, when the two backup pins P are picked up from the pin stocker 75 by the two suction nozzles 72, the drive control unit 12 raises and lowers the head 71 by the X-axis drive unit M711 and the Y-axis drive unit M712. By moving it upward, the backup pin P faces the target position of the elevating table 421 from above. Then, when the drive control unit 12 lowers the suction nozzle 72 by the Z-axis drive unit M713 to bring the backup pin P into contact with the target position of the elevating table 421, the valve control unit 13 releases the negative pressure of the suction nozzle 72. As a result, when the backup pin P is placed at the target position of the elevating table 421, the drive control unit 12 raises the suction nozzle 72.

At this time, when the target positions for arranging the two backup pins P are arranged in parallel in the Y direction at intervals L, the arrangement head 71 simultaneously transfers the two backup pins P to the elevating table 421. If this is not the case, the arrangement head 71 transfers one backup pin P of the two backup pins P to the elevating table 421 and then transfers the other backup pin P to the elevating table 421. ..

The backup pin P placed on the elevating table 421 is held on the elevating table 421 by magnetic force. According to such a holding mode, unlike the configuration in which the backup pin P is held by engaging the backup pin P with a plurality of engaging holes arranged in a matrix, the backup pin P is arbitrarily placed on the elevating table 421. It is possible to realize a free location such as being able to place it at the position of.

As described above, the backup pin P is transferred from the pin stocker 75 to the elevating table 421. Further, when the backup pin P is stored in the elevating table 421 from the pin stocker 75, the reverse operation of the above is executed. Then, in the present embodiment, the server computer that manages the printing machine 1 determines the arrangement of the backup pin P on the elevating table 421.

FIG. 4 is a block diagram showing an example of an electrical configuration of a server computer that determines the arrangement of backup pins. The server computer 9 includes a calculation unit 91, a storage unit 92, a UI 93, and a communication unit 94. The arithmetic unit 91 is a processor composed of a CPU and RAM, and executes arithmetic processing for determining the arrangement of backup pins P. The storage unit 92 is composed of an HDD and stores various data necessary for determining the arrangement of the backup pin P. The UI 93 accepts an operator's input operation and displays various information to the operator. Further, the communication unit 94 executes communication with an external device such as the printing machine 1.

In particular, the storage unit 92 stores a plurality of arrangement conditions C that require the backup pins P to be arranged in different arrangement modes. FIG. 5 is a diagram showing in a table format a plurality of arrangement conditions for requesting backup pins to have different arrangement modes. In the figure, as a plurality of placement conditions C, a pattern direct condition, a component avoidance condition, a bending suppression condition, and a placement efficiency condition are shown, and these placement conditions C are identified by an identification number I (= 1, 2, 3, 4). Will be done.

The arrangement condition C of the identification number I = 1, that is, the condition directly under the pattern requires an arrangement mode in which the backup pin P is arranged at a position directly under the pattern of the mask M. This is because the substrate B is supported by the backup pin P directly under the pattern of the mask M, so that a gap is suppressed between the mask M and the substrate B at the peripheral edge of the pattern, and a good solder D pattern is obtained. The purpose is to print on the substrate B.

The arrangement condition C of the identification number I = 2, that is, the component avoidance condition requires an arrangement mode in which the backup pin P is arranged while avoiding the component E mounted on the lower surface Bd of the substrate B. This is intended to prevent interference between the backup pin P and the component E.

The arrangement condition C of the identification number I = 3, that is, the deflection suppression condition requires an arrangement mode in which the backup pin P is arranged at the position where the deflection of the substrate B is maximized in the state before the backup pin P to be arranged is arranged. .. The purpose of this is to suppress the formation of a gap between the mask M and the substrate B by suppressing the bending of the substrate B, and to print a good solder D pattern on the substrate B.

The arrangement condition C of the identification number I = 4, that is, the arrangement efficiency condition is an arrangement mode in which a plurality of backup pins P are arranged in parallel in the Y direction at an interval L in which a plurality of suction nozzles 72 are arranged in the Y direction in the arrangement head 71. Request. The purpose of this is to quickly place the backup pin P that the arrangement head 71 sucks on each of the plurality of suction nozzles 72 on the elevating table 421.

FIG. 6 is a flowchart showing an example of the backup pin arrangement determination executed by the server computer. This backup pin arrangement determination is executed by the arithmetic unit 91 using the so-called potential method. That is, the arithmetic unit 91 sets a virtual space Sv (FIGS. 7 to 10, 12) that virtually indicates the real space Sr (FIG. 3) in which the backup pin P is arranged. Then, the calculation unit 91 sets the attractive force potential Fa that acts to attract the backup pin P to the position where the arrangement of the backup pin P is required, while the repulsive force potential Fb that acts to keep the backup pin P away from the backup pin. By setting the position where the arrangement of P is prohibited, the potential field F is generated in the virtual space Sv. Then, the arithmetic unit 91 determines the arrangement of the backup pin P while virtually arranging the backup pin P in the potential field F of the virtual space Sv.

In step S101, it is determined whether or not the arrangement of the predetermined number of backup pins P has been completed. This predetermined number is set, for example, by an operator input operation to the UI 93. When the placement of the predetermined number of backup pins P is not completed (when “NO” in step S101), the identification number I of the placement condition C is reset to zero (step S102), and the identification number I is changed. It is incremented (step S103).

In step S104, the placement condition C of the identification number I = 1, that is, the potential field F (1) (FIG. 7) corresponding to the condition directly under the pattern is set for the virtual space Sv. FIG. 7 is a contour diagram showing an example of a potential field set according to the conditions directly under the pattern. In FIG. 7, the X-axis and the Y-axis indicate the position in the X-direction and the position in the Y-direction, respectively, and the Z-axis indicates the height of the potential. The calculation unit 91 sets the attractive potential Fa (the downwardly convex potential function) at the position (XY coordinates) of each pattern of the mask M in response to the request of the condition directly under the pattern. This gravitational potential Fa gradually decreases toward the position of the pattern of the mask M and has a constant minimum value at the position of the pattern. As a result, the potential field F (1) shown in FIG. 7 is set.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (= 4). Here, since the identification number I = 1, it is determined as "NO" in step S105, and the identification number I is incremented in step S103.

In step S104, the placement condition C of the identification number I = 2, that is, the potential field F (2) (FIG. 8) corresponding to the component avoidance condition is set for the virtual space Sv. FIG. 8 is a contour diagram showing an example of a potential field set according to a component avoidance condition. The notation in FIG. 8 is similar to that in FIG. The calculation unit 91 sets the repulsive force potential Fb (upwardly convex potential function) at the position (XY coordinates) of each component E mounted on the lower surface Bd of the substrate B in response to the request of the component avoidance condition. This repulsive force potential Fb increases vertically at the end of the existence range of the component E and has a constant value in the existence range of the component E. The height of the potential in the existing range of the component E varies depending on the height of the component E, and the higher the component E, the higher the potential. As a result, the potential field F (2) shown in FIG. 8 is set.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (= 4). Here, since the identification number I = 2, it is determined as "NO" in step S105, and the identification number I is incremented in step S103.

In step S104, the placement condition C of the identification number I = 3, that is, the potential field F (3) (FIG. 9) corresponding to the bending suppression condition is set for the virtual space Sv. FIG. 9 is a contour diagram showing an example of a potential field set according to the deflection suppressing condition. The notation in FIG. 9 is similar to that in FIG. The calculation unit 91 sets the gravitational potential Fa (the downwardly convex potential function) at the position where the deflection of the substrate B is maximized in the state before the backup pin P to be arranged is arranged in response to the request of the deflection suppression condition. do. This gravitational potential Fa corresponds to the result of predicting the bending of the substrate B before arranging the backup pin P, and the position where the bending of the substrate B is large has a lower potential. As a result, the potential field F (3) shown in FIG. 9 is set. In FIG. 9, since the backup pin P is not arranged at all, the potential field F (3) has a potential to gradually decrease as it moves away from the clamp member 21 that supports the substrate B, and the substrate B has a potential to gradually decrease. It has the lowest value at the position of the center of.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (= 4). Here, since the identification number I = 3, it is determined as "NO" in step S105, and the identification number I is incremented in step S103.

In step S104, the placement condition C of the identification number I = 4, that is, the potential field F (4) (FIG. 10) corresponding to the placement efficiency condition is set for the virtual space Sv. FIG. 10 is a contour diagram showing an example of a potential field set according to the arrangement efficiency condition. The notation in FIG. 10 is similar to that in FIG. The calculation unit 91 arranges the gravitational potential Fa (a downwardly convex potential function) that gradually decreases toward the bottom in the X direction and the Y direction while keeping an interval L parallel to the X direction in response to the request of the arrangement efficiency condition. Arrange multiple pieces in a matrix. As a result, the potential field F (4) shown in FIG. 10 is set.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (= 4). Here, since the identification number I = 4, it is determined as "YES" in step S105. Therefore, the process proceeds to step S106, and the weighting coefficients W for the potential fields F (1) to F (4) are acquired. Then, the combined potential field F (C) is calculated by synthesizing the potential fields F (1) to F (4) with this weighting coefficient (step S107).

FIG. 11 is a diagram showing an example of a weighting coefficient used when synthesizing a potential field in a table format. As shown in FIG. 11, quality priority is given to the print quality of the solder D on the substrate B, time priority is given to shorten the time for arranging the backup pin P on the elevating table 421, and a balance that is not biased to any of these. The weighting coefficient W suitable for each mode of is stored in the storage unit 92.

The same weighting factor W (= 5) is set in common to each mode for the potential fields F (2) and F (3) generated based on the component avoidance condition and the deflection suppression condition. In the quality priority mode, the weight coefficient W (= 10) of the potential field F (1) corresponding to the condition directly under the pattern is larger than the weight coefficient W of the potential field F (4) corresponding to the arrangement efficiency condition, and the potential field F The weighting factor W (= 5) of (2) and F (3) is a value between them (a value larger than 2 and smaller than 10). In the time priority mode, the weighting coefficient W (= 10) of the potential field F (4) corresponding to the arrangement efficiency condition is larger than the weighting coefficient W (= 2) of the potential field F (1) corresponding to the condition directly under the pattern. , The weighting coefficient W (= 5) of the potential fields F (2) and F (3) is a value between them (a value larger than 2 and smaller than 10). In the balanced mode, the weighting factors W of each potential field F (1) to F (4) are all 5, and are equal to each other.

The operator can select one of the modes shown in FIG. 11 by operating the UI 93. Then, in step S106, the weighting coefficient W of the mode selected by the operator is acquired. Therefore, for example, when the quality priority mode is selected, in step S107, the following equation F (C) = 10 × F (1) + 5 × F (2) + 5 × F (3) + 2 × F (4). )
The synthetic potential field F (C) is calculated based on. In this way, the combined potential field F (C) obtained by synthesizing the potential fields F (1) to F (4) by weighting the potential fields F (1) to F (4) according to the weighting coefficient W is obtained. ..

FIG. 12 is a contour diagram showing an example of a synthetic potential field. The notation in FIG. 12 is similar to that in FIG. In step S108, it is determined whether or not there is a position having a potential equal to or lower than the threshold value in the synthetic potential field F (C). This threshold value is set, for example, by an operator input operation for UI93. When there is no position having a potential equal to or lower than the threshold value (when “NO” in step S108), the flowchart of FIG. 6 ends. On the other hand, when there is a position having a potential equal to or lower than the threshold value, the backup pin P is virtually arranged at the position having the lowest potential among these positions (step S109). At this time, if there are a plurality of positions where the potential is the lowest, the backup pin P is virtually arranged at each of these positions.

Then, in step S110, it is confirmed whether or not the backup pin P virtually arranged in step S109 interferes with the component E existing on the lower surface Bd of the substrate B. If there is no interference (in the case of "NO" in step S110), the process returns to step S101. On the other hand, if there is interference, the position of the backup pin P is adjusted (step S111).

FIG. 13 is a diagram schematically showing an example of the position adjustment of the backup pin, and in the “Before adjustment” column of the figure, the state in which the backup pin P is virtually arranged in step S109 is shown in the figure. In the "after adjustment" column of, the state in which the position of the backup pin P has been adjusted is shown. In the state shown in the "Before adjustment" column, since the flange of the backup pin P interferes with the component E, it is determined in step S110 that there is interference. Therefore, in step S111, the position of the backup pin P is moved away from the component E by a distance Δ. As a result, in the example shown in the "after adjustment" column, the interference between the backup pin P and the component E is eliminated.

When the position of the backup pin P is adjusted in step S111, the process returns to step S110 to confirm whether or not the interference between the backup pin P and the component E has been eliminated. Then, when steps S110 and S111 are repeated until the interference is eliminated, the process returns to step S101. Then, when steps S101 to S111 are repeated until the virtual arrangement of a predetermined number of backup pins P is completed (until "YES" is obtained in step S101), the flowchart of FIG. 6 ends.

In the embodiment described above, the potential fields F (1) to which the potential corresponding to the arrangement condition C is set for the virtual space Sv for each of the plurality of arrangement conditions C for obtaining the arrangement modes of the backup pins P different from each other. F (4) is generated (step S104). Then, the position where the backup pin P is arranged is determined based on the combined potential F (C) obtained by synthesizing the potential fields F (1) to F (4) of each of the plurality of arrangement conditions C. Therefore, it is possible to determine the placement of the backup pin P that appropriately satisfies each of the plurality of placement conditions C.

Further, a potential field F (1) in which the potential corresponding to the condition directly under the pattern C (1) is set is generated. Therefore, the substrate B can be supported by the backup pin P in the vicinity of the pattern of the mask M. As a result, it is possible to suppress the formation of a gap between the mask M and the substrate B at the peripheral edge of the pattern, and to print a good solder D pattern on the substrate B.

Further, a potential field F (2) in which the potential corresponding to the component avoidance condition C (2) is set is generated. Therefore, it is possible to prevent interference between the backup pin P and the component E.

Further, a potential field F (3) in which the potential corresponding to the deflection suppression condition C (3) is set is generated. Therefore, the backup pin P can support the substrate B and suppress the bending of the substrate B. As a result, it is possible to suppress the formation of a gap between the mask M and the substrate B, and to print a good solder D pattern on the substrate B.

Further, a potential field F (4) in which the potential corresponding to the arrangement efficiency condition C (4) is set is generated. Therefore, the backup pin P that the arrangement head 71 sucks on each of the plurality of suction nozzles 72 can be quickly placed on the elevating table 421.

Further, the calculation unit 91 sets the gravitational potential Fa at a position where the arrangement condition C requires the arrangement of the backup pin P. This makes it possible to arrange the backup pin P in the vicinity of the place where the arrangement condition C requires the arrangement.

Further, the calculation unit 91 sets the repulsive force potential Fb at a position where the arrangement condition C prohibits the arrangement of the backup pin P. As a result, the backup pin P can be arranged by removing the place where the arrangement condition C prohibits the arrangement.

Further, the calculation unit 91 adds a weighting coefficient W to the potential fields F (1) to F (4) of each of the plurality of arrangement conditions C to generate synthetic potential information (steps S106 and S107). This makes it possible to determine the placement of the backup pins P that appropriately satisfy these according to the priority of the plurality of placement conditions C.

Further, a UI 93 that accepts an input operation by the operator is provided, and the calculation unit 91 generates a synthetic potential field F (C) by adding a weighting coefficient W corresponding to the input operation to the UI 93. Thereby, it is possible to determine the arrangement of the backup pins P that appropriately satisfy the plurality of arrangement conditions C according to the priority indicated by the operator.

Further, the calculation unit 91 is located at a position determined based on the component E (obstacle) provided on the lower surface Bd in contact with the backup pin P and the synthetic potential field F (C) among the double-sided Bu and Bd of the substrate B. It is determined whether or not there is interference with the arranged backup pin P (step S110), and if interference occurs, the position where the backup pin P is arranged is adjusted (step S111). Thereby, the arrangement of the backup pin P can be determined while avoiding the interference between the backup pin P and the component E.

Further, the server computer 9 determines the arrangement of the backup pin P that supports the substrate B on which the solder D is printed via the mask M in the printing machine 1. In such a configuration, it is possible to print the solder D on the substrate B while supporting the substrate B by an appropriately arranged backup pin P.

As described above, in the present embodiment, the server computer 9 corresponds to an example of the "support member arrangement determining device" of the present invention, the calculation unit 91 corresponds to an example of the "calculation unit" of the present invention, and the storage unit 92 corresponds to the present invention. The substrate B corresponds to an example of the "board" of the present invention, the backup pin P corresponds to an example of the "support member" of the present invention, and the real space Sr corresponds to the present invention. Corresponds to an example of the "real space" of the present invention, the virtual space Sv corresponds to an example of the "virtual space" of the present invention, the arrangement condition C corresponds to an example of the "arrangement condition" of the present invention, and the potential field F (1). ) To F (4) correspond to an example of the "arrangement condition potential information" of the present invention, the synthetic potential field F (C) corresponds to an example of the "synthetic potential information" of the present invention, and the weight coefficient W corresponds to. The UI93 corresponds to an example of the "operation unit" of the present invention, and the lower surface Bd of the substrate B corresponds to an example of the "surface on which the support member contacts" of the present invention. , Part E corresponds to an example of the "obstacle" of the present invention, printing machine 1 corresponds to an example of the "printing machine" of the present invention, mask M corresponds to an example of the "mask" of the present invention, and solder. D corresponds to an example of the "solder" of the present invention.

The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-mentioned one without departing from the spirit of the present invention. For example, it is not necessary to use all of the four arrangement conditions C illustrated in FIG. 5, and two or more of these arrangement conditions C may be selected and used.

Further, the potential field F may be generated by using an arrangement condition C different from the arrangement condition C exemplified in FIG. For example, when changing the type of the substrate B to be printed, the arrangement condition C that requires an arrangement mode such that the backup pin P is preferentially arranged at a position that can support both of the two types of substrates B may be used. ..

Further, the weighting coefficient W when obtaining the synthetic potential field F (C) is not limited to the example of FIG. 11, and can be changed in various ways.

Further, the number of suction nozzles 72 included in the arrangement head 71 is not limited to the above two, and may be one or three or more.

Further, the server computer 9 can also execute the backup pin arrangement determination of FIG. 6 in order to determine the arrangement of the backup pin P that supports the substrate B in a device different from the printing machine 1. For example, in order to determine the arrangement of the backup pin P in the component mounting machine shown in FIG. 14, the backup pin arrangement determination can be executed. In such a configuration, it is possible to mount the component E on the substrate B while supporting the substrate B by an appropriately arranged backup pin P.

FIG. 14 is a partial front view schematically showing an example of a component mounting machine. In the component mounting machine 8, the substrate B carried in from the outside of the apparatus is stopped at a predetermined working position L (the position of the substrate B shown in FIG. 14), and is fixed and held by the fixing means (not shown). Then, when the head unit 81 completes the attachment of the component E (lead component) to the substrate B fixed at the working position, the substrate B is carried out to the outside of the device.

The component mounting machine 8 includes a backup unit 83 that supports the substrate B fixed at the working position from below. The backup unit 83 supports the substrate B by abutting a plurality of backup pins P detachably arranged on the upper surface of the flat plate-shaped backup plate 831 (push-up plate) against the substrate B from below. This makes it possible to mount the component E on the substrate B while firmly supporting the substrate B by the backup pin P.

1 ... Printing machine 8 ... Parts mounting machine 9 ... Server computer (support member placement determination device)
91 ... Calculation unit 92 ... Storage unit 93 ... UI (Operation unit)
B ... Substrate Bu ... Top surface (one of both sides of substrate B)
Bd ... Bottom surface (the other side of both sides of the substrate B, the surface with which the support member contacts)
C ... Arrangement conditions D ... Solder E ... Parts (obstacles)
F (1) to F (4) ... Potential field (placement condition potential information)
F (C) ... Synthetic potential field (synthetic potential information)
Fa ... Gravitational potential Fb ... Repulsive force potential M ... Mask P ... Backup pin (support member)
Sr ... Real space Sv ... Virtual space W ... Weight coefficient

Claims (8)

An arithmetic unit that sets a virtual space that virtually represents the real space in which the support members that support the board are placed,
A storage unit for storing a plurality of arrangement conditions for obtaining arrangement modes of the support members different from each other is provided.
The calculation unit generates placement condition potential information for which potentials are set for the virtual space according to the placement conditions for each placement condition, and adds a weighting coefficient to each placement condition potential information. A support member placement determination device that generates synthetic potential information obtained by synthesizing each placement condition potential information and determines a position in which the support member is placed based on the synthetic potential information. It also has an operation unit that accepts input operations by the operator.
The support member arrangement determining device according to claim 1 , wherein the calculation unit adds the weighting coefficient according to the input operation to generate the combined potential information. The calculation unit determines whether or not there is interference between an obstacle provided on the surface of both sides of the substrate that the support member contacts, and the support member arranged at a position determined based on the synthetic potential information. The support member arrangement determination device according to any one of claims 1 and 2 , wherein the position where the support member is arranged is adjusted when interference occurs. The support member arrangement determining device according to any one of claims 1 to 3 , which determines the arrangement of the support member that supports the substrate on which solder is printed via a mask in a printing machine. The support member arrangement determining device according to any one of claims 1 to 3 , which determines the arrangement of the support member that supports the substrate on which the component is mounted in the component mounting machine. An arithmetic unit that sets a virtual space that virtually represents the real space in which the support members that support the board are placed,
A storage unit that stores a plurality of arrangement conditions for obtaining arrangement modes of the support members that are different from each other.
Equipped with
The calculation unit sets an attractive force potential that acts to attract the support member to a position where the arrangement condition requires the arrangement of the support member, while the support is provided at a position where the arrangement condition prohibits the arrangement of the support member. The repulsive force potential that acts to move the member away is set, and the placement condition potential information in which the potential is set according to the placement condition for the virtual space is generated for each placement condition, and the placement condition potential information is generated. The synthetic potential information is generated, and the position where the support member is placed is determined based on the synthetic potential information.
The gravitational potential gradually decreases toward the position of the pattern of the mask and has a constant minimum value at the position of the pattern.
The repulsive force potential increases vertically at the end of the existing range of the component and has a constant value in the existing range of the component, and the height of the potential in the existing range of the component differs depending on the height of the component. Determining device. The process of setting a virtual space that virtually represents the real space where the support members that support the board are placed,
A step of generating placement condition potential information in which potentials are set according to the placement conditions for the virtual space for each of a plurality of placement conditions for obtaining placement modes of the support members that are different from each other.
A step of generating synthetic potential information by synthesizing the potential information of each arrangement condition, and
A step of determining a position for arranging the support member based on the synthetic potential information is provided.
The gravitational potential that acts to attract the support member to the position where the arrangement condition requires the arrangement of the support member is set, while the support member is moved away from the position where the arrangement condition prohibits the arrangement of the support member. The repulsive force potential to act is set, and the above-mentioned placement condition potential information is generated.
The gravitational potential gradually decreases toward the position of the pattern of the mask and has a constant minimum value at the position of the pattern.
The repulsive force potential increases vertically at the end of the existing range of the component and has a constant value in the existing range of the component, and the height of the potential in the existing range of the component differs depending on the height of the component. How to decide. The process of setting a virtual space that virtually represents the real space where the support members that support the board are placed,
A step of generating placement condition potential information in which potentials are set according to the placement conditions for the virtual space for each of a plurality of placement conditions for obtaining placement modes of the support members that are different from each other.
A step of adding a weighting coefficient to each arrangement condition potential information and generating synthetic potential information by synthesizing each arrangement condition potential information, and
A method for determining a support member arrangement, comprising a step of determining a position for arranging the support member based on the synthetic potential information.

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