CN112119681B

CN112119681B - Support member arrangement determining device and support member arrangement determining method

Info

Publication number: CN112119681B
Application number: CN201880093350.3A
Authority: CN
Inventors: 藤本猛志
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2018-05-23
Filing date: 2018-05-23
Publication date: 2022-02-18
Anticipated expiration: 2038-05-23
Also published as: DE112018007151T5; CN112119681A; WO2019224930A1; JP6999254B2; JPWO2019224930A1

Abstract

Potential fields (F (1) to F (4)) obtained by setting the potential energy corresponding to the arrangement condition (C) for the virtual space (Sv) are generated for each of a plurality of arrangement conditions (C) that require different arrangement modes of the support pins (P) (step S104). Then, the position where the support pin (P) is disposed is determined based on the synthesized potential energy (F (C)) obtained by synthesizing the potential fields (F (1) to F (4)) of the plurality of disposition conditions (C). Therefore, the arrangement of the support pins (P) that appropriately satisfy each of the plurality of arrangement conditions (C) can be determined.

Description

Support member arrangement determining device and support member arrangement determining method

Technical Field

The present invention relates to a technique for determining the arrangement of a support member for supporting a substrate.

Background

In a printing machine, a component mounting machine, or the like, a support member such as a support pin is used to support a substrate to be subjected to a work (printing/component mounting). At this time, in order to properly perform work on the substrate, the arrangement of the support member becomes important. Therefore,

patent documents

1 and 2 disclose techniques for determining the arrangement of support members for supporting a substrate in a component mounter, by specifying the arrangement based on images representing components mounted on the upper and lower surfaces of the substrate.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 4452686

Patent document 2: japanese patent No. 4572262

Disclosure of Invention

Problems to be solved by the invention

However, the arrangement of the support member requires various conditions different from each other. For example, in a printer that prints solder on a substrate via a mask, it is required that a support member is arranged so as to be able to support the substrate at a position corresponding to a pattern of the mask. On the other hand, when an obstacle such as a component is present on the surface of the two surfaces of the substrate that contacts the support member, the support member needs to be disposed so as to avoid the obstacle. Further, since the above-described arrangement conditions are not necessarily satisfied simultaneously and completely, it is necessary to determine an appropriate arrangement of the support member while considering the arrangement conditions.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a technique for determining the arrangement of support members that can appropriately satisfy each of a plurality of arrangement conditions that require different arrangements of support members.

Means for solving the problems

The support member arrangement determination device according to the present invention includes: a calculation unit that sets a virtual space that virtually represents an actual space in which a support member that supports a substrate is disposed; and a storage unit that stores a plurality of arrangement conditions that require different arrangements of the support members, wherein the calculation unit generates arrangement condition potential energy information obtained by setting potentials for the virtual space according to the arrangement conditions for each arrangement condition, generates synthesized potential energy information obtained by synthesizing the arrangement condition potential energy information, and determines the position where the support member is arranged based on the synthesized potential energy information.

The support member arrangement determination method according to the present invention includes: setting a virtual space that virtually represents an actual space in which a support member that supports a substrate is disposed; generating arrangement condition potential energy information obtained by setting potential energy for the virtual space according to the arrangement condition for each of a plurality of arrangement conditions that require different arrangement modes of the support members; generating synthetic potential energy information obtained by synthesizing the potential energy information of each configuration condition; and determining a position at which the support member is arranged based on the synthetic potential energy information.

In the present invention (support member arrangement determining apparatus, support member arrangement determining method) configured as described above, arrangement condition potential energy information obtained by setting a potential according to an arrangement condition for a virtual space is generated for each of a plurality of arrangement conditions that require different arrangement forms of support members. Then, the position where the support member is arranged is determined based on the synthesized potential energy information obtained by synthesizing the plurality of arrangement condition potential energy information. Therefore, the arrangement of the support members that appropriately satisfy each of the plurality of arrangement conditions can be determined.

In addition, the support member arrangement determining device may be configured such that the computing unit sets a gravitational force acting to attract the support member at a position where the arrangement condition requires the arrangement of the support member. This allows the support member to be disposed in the vicinity of the location where the disposition condition is required.

In addition, the support member arrangement determining device may be configured such that the computing unit sets the repulsive force acting to separate the support member from the support member at a position where the arrangement condition prohibits the arrangement of the support member. This makes it possible to dispose the support member excluding a place where the disposition condition prohibits disposition.

In the support member arrangement determination device, the calculation unit may be configured to generate the synthesized potential energy information by adding a weight coefficient to the plurality of arrangement condition potential energy information. Thus, the arrangement of the support members that appropriately satisfy the plurality of arrangement conditions can be determined according to the priorities (weight coefficients) of the arrangement conditions.

The support member arrangement determination device may further include an operation unit that receives an input operation by an operator, and the calculation unit may generate the synthetic potential energy information by adding a weight coefficient according to the input operation. Thus, the arrangement of the support members that appropriately satisfy the plurality of arrangement conditions can be determined according to the priority indicated by the operator.

The support member arrangement determining device may be configured such that the computing unit determines that there is no interference between an obstacle provided on one of the two surfaces of the substrate, the surface being in contact with the support member, and the support member arranged at the position determined based on the synthesized potential energy information, and adjusts the position at which the support member is arranged when the interference occurs. This makes it possible to determine the arrangement of the support member while avoiding interference between the support member and the obstacle.

The support member arrangement determining device may be configured to determine the arrangement of a support member that supports a substrate on which solder is printed via a mask in a printer. In this configuration, the solder can be printed on the substrate while supporting the substrate by the appropriately arranged support member.

The support member arrangement determining device may be configured to determine the arrangement of the support members that support the substrate on which the components are mounted in the component mounting apparatus. In this configuration, the component can be mounted on the substrate while supporting the substrate by the appropriately arranged support member.

Effects of the invention

According to the present invention, it is possible to determine the arrangement of the support members that appropriately satisfies each of a plurality of arrangement conditions that require different arrangement modes of the support members.

Drawings

Fig. 1 is a front view schematically showing a printing press.

Fig. 2 is a block diagram showing an electrical configuration provided in the printer of fig. 1.

Fig. 3 is a perspective view schematically showing an example of arrangement of the support pin with respect to the elevating table.

Fig. 4 is a block diagram showing an example of an electrical configuration of a server computer for determining the arrangement of the support pins.

Fig. 5 is a table showing a plurality of arrangement conditions in which different arrangement modes are required for the support pins.

Fig. 6 is a flowchart showing an example of the support pin arrangement determination executed by the server computer.

Fig. 7 is a contour diagram showing an example of a potential field set according to a condition directly below a pattern.

Fig. 8 is a contour diagram showing an example of the potential field set according to the component avoidance condition.

Fig. 9 is a contour diagram showing an example of the potential field set according to the deflection suppressing condition.

Fig. 10 is a contour diagram showing an example of the potential field set according to the arrangement efficiency condition.

Fig. 11 is a diagram showing an example of a weighting factor used in synthesizing a potential field in a table format.

Fig. 12 is a contour diagram showing an example of the synthesized potential field.

Fig. 13 is a diagram schematically showing an example of the position adjustment of the support pin.

Fig. 14 is a partial front view schematically showing an example of the component mounting apparatus.

Detailed Description

Fig. 1 is a front view schematically showing a printer, and fig. 2 is a block diagram showing an electrical configuration provided in the printer of fig. 1. Fig. 1 and the following drawings appropriately show XYZ orthogonal coordinate axes in which the Z direction is a vertical direction and the X direction and the Y direction are horizontal directions. The printer 1 includes: a mask holding unit 2 for holding a mask M; a substrate holding unit 4 disposed below the mask M; and a squeegee unit 6 disposed above the mask M. The printing press 1 further includes: a main control Unit 10 including a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like; and a storage unit 11 configured by an HDD (Hard Disk Drive) or the like. Then, the main control portion 10 controls the

units

4 and 6 in accordance with the printing program stored in the storage portion 11, so that the substrate B is opposed to the mask M from below by the substrate holding unit 4, and the tip of the squeegee 61 of the squeegee unit 6 is slid in the X direction on the upper surface of the mask M. Thereby, the solder D supplied to the upper surface of the mask M is printed on the upper surface Bu of the substrate B via the pattern penetrating the mask M.

The printing press 1 includes a drive control unit 12 and a valve control unit 13 that control the operation of each movable unit, and the main control unit 10 controls the movable units of the

units

4 and 6 by the drive control unit 12 and the valve control unit 13. The printing press 1 further includes: a display unit 14 constituted by, for example, a liquid crystal display or the like; and an input unit 15 configured by an input device such as a keyboard or a mouse. Therefore, the operator can confirm the operating condition of the printing press 1 by confirming the display content of the display unit 14, or input an instruction to the printing press 1 by operating the input unit 15. The display unit 14 and the input unit 15 may be integrally formed by a touch panel.

The mask holding unit 2 includes a clamp member 21, and the mask M is detachably attached to the clamp member 21 via a frame 22 provided at a peripheral edge portion thereof. Thereby, the mask M having a flat plate shape is horizontally held by the mask holding unit 2. The mask M has a rectangular shape in plan view, and has a through hole (mask pattern) having a shape corresponding to the print pattern on the substrate B.

The substrate holding unit 4 is disposed below the mask M held by the mask holding unit 2, and functions to align the position of the substrate B with respect to the mask M. The substrate holding unit 4 includes: a pair of conveyors 41 that convey the substrate B; a substrate holding unit 42 for holding the substrate B received from the conveyor 41; and a movable table 43 having a flat plate shape for supporting the conveyor 41 and the substrate holding portion 42.

The pair of conveyors 41 are arranged in parallel to the Y direction with a space therebetween in the X direction, and support both ends of the substrate B in the X direction from below by the respective upper surfaces. The substrate holding unit 4 is provided with a conveyor driving unit M41 that drives the conveyors 41. When the conveyor driving unit M41 that has received the instruction from the drive control unit 12 drives each conveyor 41, each conveyor 41 conveys the substrate B in the Y direction and carries the substrate B in and out of the printer 1.

The substrate holding portion 42 includes a flat plate-shaped elevation table 421 and a slide support 422 slidable in the Z direction with respect to the movable table 43, and the elevation table 421 is supported by an upper end of the slide support 422. On the upper surface of the elevating table 421, a plurality of support pins P erected in the Z direction are arranged at intervals in the X direction and the Y direction. The substrate holding unit 42 is provided with a support driving unit M423, and the support driving unit M423 that receives a command from the drive control unit 12 moves up and down the slide support 422, thereby moving up and down the support pins P together with the up-and-down table 421. For example, when the conveyor 41 carries in the substrate B, the support driving unit M423 positions the upper end of each support pin P below the upper surface of the conveyor 41. When the conveyor 41 carries the substrate B directly above the support pins P, the support drive unit M423 raises the support pins P so that the upper ends of the support pins P protrude upward from the upper surface of the conveyor 41. Thereby, the upper ends of the support pins P push up the substrate B while contacting the lower surface Bd of the substrate B, and the substrate B is transferred from the upper surface of the conveyor 41 to the upper ends of the support pins P.

Further, the substrate holding portion 42 includes: a pair of clamp plates 424 disposed above the pair of conveyors 41 at an interval in the X direction; and a plate driving portion M424 that drives at least one of these clamping plates 424 in the X direction. The upper surface of each clamp plate 424 is a plane parallel to the X-direction and the Y-direction, and is located at the same height. The plate driving unit M424 adjusts the air supplied to the chucking plate 424 by opening and closing the valve in accordance with a command from the valve control unit 13. Thereby, the clamp plate 424 is driven in the X direction.

Then, the drive control unit 12 raises the substrate B on the support pin P between the pair of chucking plates 424, and the valve receiving the command from the valve control unit 13 operates to narrow the interval between the chucking plates 424, whereby the substrate B is chucked by the chucking plates 424 from the X direction (horizontal direction). Specifically, substrate height data indicating the driving amount of the support driving unit M423 for matching the height of the upper surface of the substrate B with the height of the upper surface of the chucking plate 424 is stored in the storage unit 11. The support driving unit M423 raises the substrate B by the rise width indicated by the substrate height data. At this time, in the process of raising the substrate B by the support driving portion M423, the plate driving portion M424 makes the interval between the pair of chucking plates 424 wider than the width of the substrate B in the X direction. When the substrate B is completely raised by the support driving unit M423, the plate driving unit M424 narrows the gap between the pair of chucking plates 424, and the substrate B is chucked from the X direction by the chucking plates 424. Thus, the substrate B is clamped by the clamp plate 424.

The substrate holding unit 4 further includes a table driving mechanism 44 that drives the movable table 43. The table drive mechanism 44 includes: an X-axis table 441; a Y-axis table 442 mounted on the upper surface of the X-axis table 441; an R-axis table 443 mounted on the upper surface of the Y-axis table 442; and a ball screw 444 for moving the movable table 43 up and down with respect to the R-axis table 443. The table drive mechanism 44 further has: an X-axis drive unit M441 that drives the X-axis table 441 in the X direction; a Y-axis driving unit M442 for driving the Y-axis table 442 in the Y direction; an R-axis driving unit M443 that drives the R-axis table 443 in the R direction (a rotation direction about an axis parallel to the Z direction); and a Z-axis drive unit M444 that drives the movable table 43 in the Z direction by rotating the ball screw 444. Therefore, the drive control unit 12 can drive the conveyor 41 and the substrate holding portion 42 disposed on the movable table 43 in the direction X, Y, Z, R by controlling the respective drive units M441 to M444. For example, when positioning the substrate B carried in with respect to the mask M, the position of the substrate B clamped by the clamp plate 424 by the drive control unit 12 is adjusted in the X, Y direction by the X, Y, R-axis drive units M441 to M443, and is adjusted in the Z direction by the Z-axis drive unit M444. Thereby, the upper surfaces of the chucking plate 424 and the substrate B are brought into contact with the lower surface of the mask M.

For example, as shown in fig. 3, the printing press 1 further includes a pin arranging unit 7 for arranging the support pins P on the elevating table 421. Here, fig. 3 is a perspective view schematically showing an example of arrangement of the support pin with respect to the elevating table. The pin arrangement unit 7 will be described with reference to fig. 1 to 3.

The pin arrangement unit 7 includes: a placement head 71; an X-axis drive unit M711 for driving the placement head 71 in the X direction; and a Y-axis drive unit M712 for driving the placement head 71 in the Y direction, wherein the drive control unit 12 moves the placement head 71 two-dimensionally in the XY direction by using the X-axis drive unit M711 and the Y-axis drive unit M712. The arrangement head 71 has a plurality of suction nozzles 72 arranged in parallel in the Y direction at intervals L, and the pin arrangement unit 7 has a Z-axis driving section M713 that individually drives the suction nozzles 72 in the Z direction. The drive control unit 12 then moves the respective nozzles 72 up and down by the Z-axis drive unit M713. In addition, the number of the suction nozzles 72 is not limited to two as illustrated in fig. 3. The interval L between the adjacent suction nozzles 72 can be determined as the distance between the centers of the suction nozzles 72.

The pin arrangement means 7 further includes a pin magazine 75 arranged on the side of the elevating table 421 in the X direction, and a large number of support pins P are stored in the pin magazine 75. In the pin reservoir 75, the support pins P stand in parallel in the Z direction and are arranged in parallel at an interval L in the Y direction. Further, the main control unit 10 can transfer the support pins P from the pin stocker 75 to the lifting table 421 or store the support pins P from the lifting table 421 to the pin stocker 75 by moving the arrangement head 71 between the pin stocker 75 and the lifting table 421.

The former action is performed, for example, as follows. The drive control unit 12 positions the arrangement head 71 above the pin stocker 75 by the X-axis drive unit M711 and the Y-axis drive unit M712, thereby causing the two suction nozzles 72 to face the two support pins P from above. Then, when the drive control unit 12 simultaneously lowers the suction nozzles 72 by the Z-axis drive unit M713 and contacts the support pins P, the valve control unit 13 supplies a negative pressure to the suction nozzles 72. Thus, after the two suction nozzles 72 suck the two support pins P, the drive control unit 12 raises the suction nozzles 72.

When the two support pins P are picked up from the pin stocker 75 by the two suction nozzles 72 in this way, the drive control unit 12 moves the arrangement head 71 upward of the elevating table 421 by using the X-axis drive unit M711 and the Y-axis drive unit M712, thereby causing the support pins P to face the target position of the elevating table 421 from above. Then, when the drive control unit 12 lowers the suction nozzle 72 by the Z-axis drive unit M713 and brings the support pin P into contact with the target position of the elevating table 421, the valve control unit 13 releases the negative pressure of the suction nozzle 72. Thus, when the support pin P is placed at the target position of the elevating table 421, the drive control unit 12 raises the suction nozzle 72.

At this time, when the target positions where the two support pins P are arranged in parallel at the interval L in the Y direction, the arrangement head 71 transfers the two support pins P to the lifting table 421 at the same time. In a case where this is not the case, the placement head 71 transfers one of the two support pins P to the lifting table 421, and then transfers the other support pin P to the lifting table 421.

The support pin P placed on the elevating table 421 is held by the elevating table 421 by a magnetic force. According to such a holding method, unlike the structure in which the support pins P are held by engaging the support pins P with the plurality of engaging holes arranged in a matrix, it is possible to realize free positioning in which the support pins P can be arranged at any position on the elevating table 421.

As described above, the support pins P are transferred from the pin stocker 75 to the lifting table 421. When the support pins P are stored in the elevating table 421 from the pin stocker 75, the operation is reversed. In the present embodiment, the arrangement of the support pins P on the elevating table 421 is determined by a server computer that manages the printing press 1.

Fig. 4 is a block diagram showing an example of an electrical configuration of a server computer for determining the arrangement of the support pins. The server computer 9 includes an arithmetic unit 91, a storage unit 92, a UI93, and a communication unit 94. The arithmetic unit 91 is a processor including a CPU and a RAM, and executes arithmetic processing for determining the arrangement of the support pins P. The storage unit 92 is formed of an HDD, and stores various data necessary for determining the arrangement of the support pins P. The UI93 receives input operations from the operator or displays various information to the operator. The communication unit 94 performs communication with an external device such as the printer 1.

In particular, the storage unit 92 stores a plurality of arrangement conditions C that require the support pins P to be arranged in different arrangement manners. Fig. 5 is a table showing a plurality of arrangement conditions in which different arrangement modes are required for the support pins. In the figure, as the plurality of arrangement conditions C, the pattern directly-below condition, the component-avoiding condition, the deflection-suppressing condition, and the arrangement efficiency condition are shown, and these arrangement conditions C are identified by the identification numbers I (═ 1, 2, 3, and 4).

The arrangement condition C in which the identification number I is 1, that is, the condition immediately below the pattern requires an arrangement manner in which the support pins P are arranged at positions immediately below the pattern of the mask M. The purpose is to suppress the occurrence of a gap between the mask M and the substrate B at the periphery of the pattern by supporting the substrate B with the support pins P directly below the pattern of the mask M, and to print a good pattern of solder D on the substrate B.

The arrangement condition C with the identification number I of 2, that is, the component avoidance condition requires an arrangement mode in which the support pins P are arranged so as to avoid the component E mounted on the lower surface Bd of the substrate B. The purpose of this is to prevent interference between the support pin P and the member E.

The arrangement condition C with the identification number I of 3, that is, the deflection suppressing condition, requires an arrangement form in which the support pins P are arranged at a position where the deflection of the substrate B becomes maximum before the support pins P are arranged in a predetermined arrangement. The purpose is to suppress the occurrence of a gap between the mask M and the substrate B by suppressing the flexure of the substrate B, and to print a good pattern of the solder D on the substrate B.

The arrangement condition C with the identification number I of 4, that is, the arrangement efficiency condition, requires an arrangement manner in which the plurality of support pins P are arranged in parallel in the Y direction at intervals L at which the plurality of suction nozzles 72 are arranged in the Y direction in the arrangement head 71. The purpose of this is to quickly place the support pins P, which are respectively sucked by the plurality of suction nozzles 72, on the elevating table 421 by the placement head 71.

Fig. 6 is a flowchart showing an example of the support pin arrangement determination executed by the server computer. The support pin arrangement determination is performed by the arithmetic unit 91 using a so-called potential field method. That is, the calculation unit 91 sets a virtual space Sv (fig. 7 to 10, 12) which virtually represents the actual space Sr (fig. 3) in which the support pins P are arranged. Then, the computing unit 91 generates the potential field F in the virtual space Sv by setting the attractive force Fa acting to attract the support pins P to the position where the arrangement of the support pins P is required, and setting the repulsive force Fb acting to separate the support pins P to the position where the arrangement of the support pins P is prohibited. Then, the calculation unit 91 virtually arranges the support pins P in the potential field F of the virtual space Sv and also determines the arrangement of the support pins P.

In step S101, it is determined whether or not the arrangement of the predetermined number of support pins P is completed. The predetermined number is set by, for example, an input operation of the UI93 by the operator. When the arrangement of the predetermined number of support pins P is not completed (no in step S101), the identification number I of the arrangement condition C is reset to zero (step S102), and the identification number I is incremented (step S103).

In step S104, a potential field F (1) corresponding to the arrangement condition C with the identification number I of 1, that is, the condition immediately below the pattern is set in the virtual space Sv (fig. 7). Fig. 7 is a contour diagram showing an example of a potential field set according to a condition directly below a pattern. In fig. 7, the X axis and the Y axis indicate the position in the X direction and the position in the Y direction, respectively, and the Z axis indicates the height of potential energy. The arithmetic unit 91 sets a gravitational potential Fa (a potential function of a downward projection) at the position (X, Y coordinates) of each pattern of the mask M in accordance with the requirement of the condition directly below the pattern. The gravitational potential Fa gradually decreases towards the position of the pattern of the mask M, where it has a constant lowest value. As a result, the potential field F (1) shown in fig. 7 is set.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (═ 4). Here, since the identification number I is 1, the determination in step S105 is no, and the identification number I is incremented in step S103.

In step S104, a potential field F (2) corresponding to the component avoidance condition, which is the arrangement condition C having the identification number I of 2, is set in the virtual space Sv (fig. 8). Fig. 8 is a contour diagram showing an example of the potential field set according to the component avoidance condition. The notation of fig. 8 is the same as that of fig. 7. The computing unit 91 sets the repulsive potential Fb (upward convex potential function) at the position (X, Y coordinates) of each member E attached to the lower surface Bd of the substrate B in accordance with the requirement of the member avoidance condition. The repulsive force Fb vertically increases at the end of the existing range of the member E and has a constant value within the existing range of the member E. In addition, the height of the potential energy within the existence range of the component E differs depending on the height of the component E, and the higher the component E is, the higher the potential energy is. As a result, the potential field F (2) shown in fig. 8 is set.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (═ 4). Here, since the identification number I is 2, the determination in step S105 is no, and the identification number I is incremented in step S103.

In step S104, a potential field F (3) corresponding to the arrangement condition C with the identification number I of 3, that is, the deflection suppression condition is set in the virtual space Sv (fig. 9). Fig. 9 is a contour diagram showing an example of the potential field set according to the deflection suppressing condition. The notation of fig. 9 is the same as that of fig. 7. The calculation unit 91 sets the gravitational potential Fa (downward convex potential function) at a position where the deflection of the substrate B is maximum before the support pins P are arranged in a predetermined arrangement, in accordance with the requirement of the deflection suppression condition. This gravitational potential Fa corresponds to a result of predicting the deflection of the substrate B before the support pins P are arranged, and has a lower potential at a position where the deflection of the substrate B is larger. As a result, the potential field F (3) shown in fig. 9 is set. In fig. 9, since the support pins P are not disposed at all, the potential field F (3) has a potential that gradually decreases as it moves away from the clamp member 21 that supports the substrate B, and has the lowest value at the center of the substrate B.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (═ 4). Here, since the identification number I is 3, the determination in step S105 is no, and the identification number I is incremented in step S103.

In step S104, a potential field F (4) corresponding to the arrangement condition C with the identification number I of 4, i.e., the arrangement efficiency condition is set in the virtual space Sv (fig. 10). Fig. 10 is a contour diagram showing an example of the potential field set according to the arrangement efficiency condition. The notation of fig. 10 is the same as that of fig. 7. The arithmetic unit 91 arranges a plurality of gravitational potentials Fa (downward convex potential functions) that gradually decrease toward the bottom in the X direction and in the Y direction in a matrix at intervals L in parallel in the X direction according to the requirement of the arrangement efficiency condition. As a result, the potential field F (4) shown in fig. 10 is set.

In step S105, it is determined whether or not the identification number I matches the maximum value Ix (═ 4). Here, since the identification number I is 4, it is determined as yes in step S105. Therefore, the process proceeds to step S106, and a weight coefficient W with respect to the potential fields F (1) to F (4) is acquired. Then, the potential fields F (1) to F (4) are synthesized by the weighting coefficients to calculate a synthesized potential field F (c) (step S107).

Fig. 11 is a diagram showing an example of a weighting factor used in synthesizing a potential field in a table format. As shown in fig. 11, the weight coefficient W suitable for each mode including a balance of giving priority to the quality of the solder D with respect to the print quality of the substrate B, giving priority to the time for shortening the time for arranging the support pins P on the elevating table 421, and not deviating to any one of them is stored in the storage unit 92.

The same weight coefficient W (5) is set in common for the potential fields F (2) and F (3) generated based on the component avoidance condition and the deflection suppression condition in each mode. In the mass-priority mode, the weight coefficient W (═ 10) of the potential field F (1) corresponding to the condition immediately below the pattern is larger than the weight coefficient W of the potential field F (4) corresponding to the arrangement efficiency condition, and the weight coefficients W (═ 5) of the potential fields F (2) and F (3) have a value therebetween (a value greater than 2 and smaller than 10). In the time-prioritized mode, the weight coefficient W (═ 10) of the potential field F (4) corresponding to the arrangement efficiency condition is larger than the weight coefficient W (═ 2) of the potential field F (1) corresponding to the condition immediately below the pattern, and the weight coefficients W (═ 5) of the potential fields F (2) and F (3) have a value therebetween (a value greater than 2 and smaller than 10). In the balanced mode, the weight coefficients W of the potential fields F (1) to F (4) are all 5 and equal to each other.

The operator can select one mode from the modes shown in fig. 11 by operating the UI 93. Then, in step S106, the weight coefficient W of the mode selected by the operator is acquired. Therefore, for example, when the quality priority mode is selected, in step S107, the following equation is used

F(C)＝10×F(1)+5×F(2)+5×F(3)+2×F(4)，

The resultant potential field f (c) is calculated. In this way, a synthesized potential field F (c) is obtained by synthesizing the potential fields F (1) to F (4) by weighting the potential fields F (1) to F (4) according to the weight coefficient W.

Fig. 12 is a contour diagram showing an example of the synthesized potential field. The notation of fig. 12 is the same as that of fig. 7. In step S108, it is determined whether or not a position having potential energy equal to or less than a threshold value exists in the synthesized potential field f (c). The threshold value is set by, for example, an input operation of the UI93 by the operator. In the case where there is no position having potential energy of the threshold value or less (in the case of no in step S108), the flow of fig. 6 is ended. On the other hand, when there is a position having a potential energy equal to or less than the threshold value, the support pin P is virtually disposed at the position having the lowest potential energy among the positions (step S109). At this time, when there are a plurality of positions where the potential energy is the lowest, the support pin P is virtually arranged at each of these positions.

Then, in step S110, it is confirmed that there is no interference between the support pins P virtually arranged in step S109 and the component E present on the lower surface Bd of the substrate B. If there is no interference (no in step S110), the process returns to step S101. On the other hand, when there is interference, the position of the support pin P is adjusted (step S111).

Fig. 13 is a diagram schematically showing an example of the position adjustment of the support pins, and the column "before adjustment" in the diagram shows a state in which the support pins P are virtually arranged in step S109, and the column "after adjustment" in the diagram shows a state in which the position of the support pins P is adjusted. In the state shown in the column "before adjustment", the flange of the support pin P interferes with the member E, and therefore it is determined in step S110 that there is interference. Therefore, in step S111, the position of the support pin P is moved by a distance Δ in a direction away from the member E. As a result, in the example shown in the column "after adjustment", the interference between the support pin P and the member E is eliminated.

After the position of the support pin P is adjusted in step S111, the process returns to step S110 to check whether or not the interference between the support pin P and the member E is eliminated. Then, steps S110 and S111 are repeated until interference is canceled, and then the process returns to step S101. Then, steps S101 to S111 are repeated until the virtual arrangement of the predetermined number of support pins P is completed (until yes in step S101), and the flow of fig. 6 is ended.

In the embodiment described above, potential fields F (1) to F (4) obtained by setting the potentials according to the arrangement conditions C for the virtual space Sv are generated for each of the plurality of arrangement conditions C for which different arrangements of the support pins P are required (step S104). Then, the position where the support pin P is disposed is determined based on the combined potential F (C) obtained by combining the potential fields F (1) to F (4) of the plurality of disposition conditions C. Therefore, the arrangement of the support pins P that appropriately satisfies each of the plurality of arrangement conditions C can be determined.

Further, a potential field F (1) is generated in which a potential energy corresponding to the condition C (1) directly below the pattern is set. Therefore, the substrate B can be supported by the support pins P in the vicinity of the pattern of the mask M. As a result, it is possible to print a good pattern of the solder D on the substrate B while suppressing the occurrence of a gap between the mask M and the substrate B at the periphery of the pattern.

Further, a potential field F (2) is generated in which the potential energy according to the component avoidance condition C (2) is set. Therefore, the interference between the support pin P and the member E can be prevented.

Further, a potential field F (3) is generated in which the potential energy corresponding to the deflection restraining condition C (3) is set. Therefore, the substrate B can be supported by the support pins P to suppress the substrate B from flexing. As a result, it is possible to print a good pattern of the solder D on the substrate B while suppressing the occurrence of a gap between the mask M and the substrate B.

Further, a potential field F (4) is generated in which a potential corresponding to the arrangement efficiency condition C (4) is set. Therefore, the arrangement head 71 can quickly place the support pins P sucked by the plurality of suction nozzles 72 on the elevating table 421.

Further, the calculation unit 91 sets the gravitational potential Fa at the position where the arrangement condition C requires the arrangement of the support pins P. This allows the support pin P to be disposed in the vicinity of the location where the disposition condition C requires disposition.

The calculation unit 91 sets the repulsive force Fb at a position where the arrangement of the support pins P is prohibited under the arrangement condition C. This makes it possible to dispose the support pins P without the place where the disposition condition C prohibits disposition.

Further, the computing unit 91 generates synthetic potential information by adding a weight coefficient W to the potential fields F (1) to F (4) of the plurality of arrangement conditions C (steps S106 and S107). Thus, the arrangement of the support pins P that appropriately satisfy the arrangement conditions C can be determined according to the priorities of the plurality of arrangement conditions C.

Further, UI93 is provided to receive an input operation by an operator, and arithmetic unit 91 generates synthesized potential field f (c) by adding weight coefficient W corresponding to the input operation to UI 93. Thus, the arrangement of the support pins P that appropriately satisfy the plurality of arrangement conditions C can be determined according to the priority indicated by the operator.

The computing unit 91 determines whether or not there is interference between the member E (obstacle) provided on the lower surface Bd of the two surfaces Bu and Bd of the substrate B, which is in contact with the support pin P, and the support pin P disposed at the position determined based on the composite potential field f (c) (step S110), and adjusts the position at which the support pin P is disposed when interference occurs (step S111). This makes it possible to determine the arrangement of the support pins P while avoiding interference between the support pins P and the member E.

The server computer 9 determines the arrangement of support pins P for supporting the substrate B on which the solder D is printed via the mask M in the printer 1. In this configuration, the solder D can be printed on the substrate B while supporting the substrate B by the support pins P arranged appropriately.

As described above, in the present embodiment, the server computer 9 corresponds to an example of the "support member arrangement determination means" of the present invention, the calculation unit 91 corresponds to an example of the "calculation unit" of the present invention, the storage unit 92 corresponds to an example of the "storage unit" of the present invention, the substrate B corresponds to an example of the "substrate" of the present invention, the support pin P corresponds to an example of the "support member" of the present invention, the actual space Sr corresponds to an example of the "actual space" of the present invention, the virtual space Sv corresponds to an example of the "virtual space" of the present invention, the arrangement condition C corresponds to an example of the "arrangement condition" of the present invention, the potential fields F (1) to F (4) correspond to examples of the "arrangement condition potential information" of the present invention, the combined potential field F (C) corresponds to an example of the "combined potential information" of the present invention, and the weight coefficient W corresponds to an example of the "weight coefficient" of the present invention, UI93 corresponds to an example of the "operation portion" of the present invention, lower surface Bd of substrate B corresponds to an example of the "surface in contact with the support member" of the present invention, component E corresponds to an example of the "obstacle" of the present invention, printer 1 corresponds to an example of the "printer" of the present invention, mask M corresponds to an example of the "mask" of the present invention, and solder D corresponds to an example of the "solder" of the present invention.

The present invention is not limited to the above-described embodiments, and various modifications may be made to the above-described embodiments without departing from the spirit of the invention. For example, all of the 4 placement conditions C illustrated in fig. 5 need not be used, and two or more placement conditions C may be selected from these placement conditions C and used.

Further, the potential field F may be generated using the arrangement condition C different from the arrangement condition C illustrated in fig. 5. For example, when the type of the substrate B to be printed is changed, the arrangement condition C requiring an arrangement mode in which the support pins P are preferentially arranged at positions capable of supporting both types of substrates B can be used.

The weighting factor W in the calculation of the synthesized potential field f (c) is not limited to the example of fig. 11, and may be variously modified.

The number of the nozzles 72 included in the placement head 71 is not limited to two, and may be one or three or more.

The server computer 9 may determine the arrangement of the support pins P supporting the substrate B in a device different from the printer 1 by executing the support pin arrangement determination in fig. 6. For example, the support pin arrangement determination may be performed to determine the arrangement of the support pins P in the component mounting machine shown in fig. 14. In this configuration, the component E can be mounted on the substrate B while supporting the substrate B by the support pins P arranged appropriately.

Fig. 14 is a partial front view schematically showing an example of the component mounting apparatus. In the component mounter 8, the substrate B carried in from the outside of the apparatus is stopped at a predetermined working position L (position of the substrate B shown in fig. 14), and is fixed and held by a fixing means (not shown). Then, when the head unit 81 completes mounting of the component E (lead component) to the substrate B fixed to the working position, the substrate B is carried out to the outside of the apparatus.

The component mounting apparatus 8 includes a support portion 83 for supporting the substrate B fixed to the working position from below. The support portion 83 supports the substrate B by bringing a plurality of support pins P, which are detachably disposed on the upper surface of a flat plate-shaped support plate 831 (push-up plate), into contact with the substrate B from below. This allows the component E to be mounted on the substrate B while firmly supporting the substrate B by the support pins P.

Description of the reference symbols

1 … printing press

8 … parts mounting machine

9 … Server computer (supporting member configuration determining device)

91 … arithmetic unit

92 … storage part

93 … UI (operation part)

B … base plate

Bu … Upper surface (one of two faces of base plate B)

Bd … lower surface (the other of the two surfaces of substrate B, the surface that contacts the support member)

C … configuration Condition

D … solder

E … parts (obstacle)

Potential fields (configuration condition potential energy information) of F (1) -F (4) …

F (C) … synthesized potential field (synthesized potential energy information)

Fa … gravitational potential

Repulsive force of Fb …

M … mask

P … supporting pin (supporting component)

Sr … actual space

Sv … virtual space

W … weight coefficient

Claims

1. A support member arrangement determination device includes:

a calculation unit that sets a virtual space that virtually represents an actual space in which a support member that supports a substrate is disposed; and

a storage unit for storing a plurality of arrangement conditions that require different arrangement modes of the support members,

the calculation unit generates arrangement condition potential energy information obtained by setting potential energy for the virtual space according to the arrangement conditions for each arrangement condition, generates synthesized potential energy information obtained by synthesizing the arrangement condition potential energy information, and determines a position where the support member is arranged based on the synthesized potential energy information,

the arithmetic unit sets a gravitational force acting to attract the support member at a position where the arrangement condition requires the arrangement of the support member,

the calculation unit sets a repulsive force acting to separate the support member from the support member at a position where the arrangement condition prohibits the arrangement of the support member,

the gravitational potential gradually decreases towards the location of the pattern of the mask, having a constant lowest value at the location of the pattern,

the repulsive potential increases vertically at the end of the range of presence of the component and has a constant value within the range of presence of the component,

the height of the potential energy within the range of the component varies depending on the height of the component.

2. A support member arrangement determination device includes:

the computing unit generates the synthesized potential energy information by adding a weight coefficient to each of the configuration condition potential energy information.

3. The support member arrangement determination device according to claim 2,

the support member arrangement determination device further includes an operation unit that receives an input operation by an operator,

the computing unit generates the synthetic potential energy information by adding the weight coefficient corresponding to the input operation.

4. The support member arrangement determination device according to any one of claims 1 to 3,

the computing unit determines whether or not there is interference between an obstacle provided on one of the two surfaces of the substrate, the obstacle being in contact with the support member, and the support member arranged at the position determined based on the synthetic potential energy information, and adjusts the position at which the support member is arranged when interference occurs.

5. The support member arrangement determination device according to any one of claims 1 to 3,

the support member arrangement determining device determines an arrangement of the support members that support the substrate printed with solder via a mask in a printer.

6. The support member arrangement determination device according to any one of claims 1 to 3,

the support member arrangement determining device determines an arrangement of the support members that support the substrate on which components are mounted in the component mounting machine.

7. A support member configuration determining method comprising:

setting a virtual space that virtually represents an actual space in which a support member that supports a substrate is disposed;

generating arrangement condition potential energy information obtained by setting potential energy for the virtual space according to the arrangement condition for each of a plurality of arrangement conditions that require different arrangement forms of the support member;

generating synthetic potential energy information obtained by synthesizing the potential energy information of each configuration condition; and

determining a position at which the support member is disposed based on the synthetic potential energy information,

setting a gravitational potential acting to attract the support member at a position where the arrangement condition requires the arrangement of the support member,

a repulsive force acting to separate the support member is set at a position where the arrangement condition prohibits the arrangement of the support member,