CN107530727A - Viscous fluid feedway and element fixing apparatus - Google Patents
Viscous fluid feedway and element fixing apparatus Download PDFInfo
- Publication number
- CN107530727A CN107530727A CN201580078955.1A CN201580078955A CN107530727A CN 107530727 A CN107530727 A CN 107530727A CN 201580078955 A CN201580078955 A CN 201580078955A CN 107530727 A CN107530727 A CN 107530727A
- Authority
- CN
- China
- Prior art keywords
- scraper plate
- viscous fluid
- limiting unit
- light
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/04—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades
- B05C11/041—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades characterised by means for positioning, loading, or deforming the blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/04—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades
- B05C11/044—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades characterised by means for holding the blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating Apparatus (AREA)
Abstract
The viscous fluid feedway (1) possesses：For viscous fluid extend plate (2), slided in a manner of the viscous fluid on plate is flattened scraper plate (3), for scraper plate set scraper plate maintaining part (5) and detect the presence of set scraper plate scraper plate test section (8).
Description
Technical field
The present invention relates to viscous fluid feedway and element fixing apparatus.
Background technology
Conventionally, there is known the viscous fluid feedway of the viscous fluid such as supply solder flux, soldering paste.Such viscous fluid supplies
To device for example disclosed in U.S. Patent No. 6293317.
In U.S. Patent No. 6293317, following viscous fluid feedway is disclosed, it possesses：For viscous fluid
The substrate of extension；The container (scraper plate) slided in a manner of the viscous fluid on substrate is flattened；And container is remained into energy
The sliding part enough slided.
Prior art literature
Patent document
Patent document 1：U.S. Patent No. 6293317
The content of the invention
Invent problem to be solved
However, due in conventional viscous fluid feedway as U.S. Patent No. 6293317, Wu Fajian
Measure whether container (scraper plate) is kept by sliding part, therefore the problem of setting for being difficult to prevent to forget container is such be present.If
It is not provided with supplying viscous fluid in the case of container, then viscous fluid is spilt into device.
The present invention is made to solve above-mentioned such problem, and it is an object of the present invention to provide can
Prevent from forgetting the viscous fluid feedway and element fixing apparatus of the setting of scraper plate.
For solving the technical scheme of problem
The viscous fluid feedway of the first technical scheme of the present invention possesses：The plate that extends for viscous fluid, with by plate
On the mode flattened of the viscous fluid scraper plate slided, the scraper plate maintaining part that is set for scraper plate and detect the presence of scraper plate be set
Scraper plate test section.
In the viscous fluid feedway of the first technical scheme of the present invention, as described above, being detected the presence of by setting
The scraper plate test section of scraper plate is set, can prevent from forgetting the setting of scraper plate.Thereby, it is possible to suppress because being not provided with the state of scraper plate
It is lower to supplement viscous fluid and cause viscous fluid to be spilt into device.
In the viscous fluid feedway of above-mentioned first technical scheme, it is preferred that scraper plate maintaining part includes limiting unit,
Movement of the limiting unit limiting scraper on the direction parallel with the pressing direction to plate, scraper plate test section are configured to, and detection is
It is no that scraper plate is set and the movement of scraper plate whether is limited by limiting unit.By so forming, due to that can prevent forgetting limiting unit
Mobile limitation to scraper plate, therefore the feelings for causing scraper plate to be separated with plate to the limitation of scraper plate because forgetting limiting unit can be suppressed
Condition.
In which case it is preferable that scraper plate test section includes light-projecting portion and light accepting part, scraper plate maintaining part includes switching
Portion, switching part switching arrival of the light from light-projecting portion towards light accepting part, switching part are configured to, limited according to by limiting unit
The releasing state that the limitation of movement of the restriction state and limiting unit of the movement of scraper plate to scraper plate is released from, switching come from light-projecting portion
Light towards light accepting part arrival.By so forming, the light from light-projecting portion is set to pass through, be blocked by switching part or instead
Penetrate, so as to easily detect whether to set scraper plate and whether be in restriction state.
In the structure that above-mentioned scraper plate maintaining part includes switching part, it is preferred that be configured to, in the limitation of switching limiting unit
When state is with releasing state, switch arrival of the light from light-projecting portion towards light accepting part by making switching part mobile.Pass through this
Sample is formed, due to that linkedly can move switching part with releasing state with switching restriction state using limiting unit, therefore can
According to restriction state with releasing state, easily switch arrival of the light from light-projecting portion towards light accepting part by switching part.
In which case it is preferable that scraper plate maintaining part also includes supporting limiting unit into the rotational support as that can rotate
Portion, it is configured to, by make limiting unit be contacted with rotation support portion and in the feelings of restriction state in the case of releasing state
The mode for making limiting unit be separated with rotation support portion under condition moves limiting unit, and moves switching part.By so forming, lead to
Rotation restrictor is crossed, the limitation of movement of the limiting unit to scraper plate easily can be subjected to on/off.Further, since being capable of basis
Restriction state with release state change limiting unit relative to rotation support portion distance, therefore can easily make switching part according to
State moves.
In the structure that above-mentioned scraper plate maintaining part includes limiting unit, it is preferred that the viscous fluid feedway also has
It is standby to be connected with limiting unit and produce pressing force generation mechanism of the scraper plate to the pressing force of plate, it is configured to, is detected by scraper plate
In the case that portion detects to be limited the movement of scraper plate by limiting unit, pressing force is produced by pressing force generation mechanism.By so
Form, due to pressing force can be applied in the state of the movement of scraper plate is limited by limiting unit, therefore can be reliably to scraping
Plate assigns pressing force.Further, since do not produced in the case where limitation of the limiting unit to scraper plate is carried out into on/off by pressing force
Mechanism produces pressing force, so as to easily move limiting unit, therefore easily can lead to by the limitation to scraper plate/
It is disconnected.
In the viscous fluid feedway of above-mentioned first technical scheme, it is preferred that the viscous fluid feedway
The supplement portion to plate supplement viscous fluid is also equipped with, in the case where not detecting to be provided with scraper plate by scraper plate test section, no
Viscous fluid is supplemented from supplement portion.By so forming, due to supplementing viscous fluid, therefore energy in the case where being provided with scraper plate
Enough suppress viscous fluid to spill into device.
The element fixing apparatus of the second technical scheme of the present invention possesses：Installation portion to substrate installation elements and to member
Part supplies the viscous fluid supply unit of viscous fluid, and viscous fluid supply unit includes：For viscous fluid extend plate, with by plate
The mode flattened of the viscous fluid scraper plate slided, the scraper plate maintaining part that is set for scraper plate and detect the presence of scraping for scraper plate be set
Plate test section.
In the element fixing apparatus of the second technical scheme of the present invention, as described above, detecting the presence of setting by setting
The scraper plate test section of scraper plate, it can prevent from forgetting the setting of scraper plate.Thereby, it is possible to provide a kind of to possess viscous fluid supply unit
Element fixing apparatus, the viscous fluid supply unit can suppress because being not provided with causing supplementing viscous fluid in the state of scraper plate
Viscous fluid is spilt into device.
Invention effect
In the present invention, it can prevent from forgetting the setting of scraper plate.
Brief description of the drawings
Fig. 1 is the top view of the outline for the element fixing apparatus for representing the first embodiment of the present invention.
Fig. 2 is for illustrating showing for a series of installation action of the element fixing apparatus of the first embodiment of the present invention
It is intended to.
Fig. 3 is the stereogram for the welding flux feeding device for representing the first embodiment of the present invention.
Fig. 4 is the stereogram of the scraper plate for the welding flux feeding device for representing the first embodiment of the present invention.
Fig. 5 is the stereogram of the drive mechanism of the scraper plate for the welding flux feeding device for representing the first embodiment of the present invention.
Fig. 6 is the side view of the state after the scraper plate for the welding flux feeding device for representing the first embodiment of the present invention is limited
Figure.
Fig. 7 is the state after the limitation of the scraper plate for the welding flux feeding device for representing the first embodiment of the present invention is released from
Side view.
Fig. 8 is the side view for representing not configure the state of the scraper plate of the welding flux feeding device of the first embodiment of the present invention
Figure.
Fig. 9 is the stereogram for the welding flux feeding device for representing second embodiment of the present invention.
Figure 10 is the stereogram of the scraper plate for the welding flux feeding device for representing second embodiment of the present invention.
Figure 11 is the side of the state after the scraper plate for the welding flux feeding device for representing second embodiment of the present invention is limited
View.
Figure 12 is the shape after the limitation of the scraper plate for the welding flux feeding device for representing second embodiment of the present invention is released from
The side view of state.
Embodiment
Hereinafter, based on brief description of the drawings embodiments of the present invention.
[first embodiment]
(structure of element fixing apparatus)
Reference picture 1 and Fig. 2, illustrate the construction of the element fixing apparatus 100 of the first embodiment of the present invention.
Element fixing apparatus 100 is bare chip (semiconductor wafer) C can be taken out from the wafer W that forms of cutting and to substrate
On S mounting surface installation and by electronic component supplied from belt feeder 13a (so-called potted element) etc. to substrate S
Mounting surface on the so-called compound element fixing apparatus installed.In addition, bare chip C is one of " element " of the invention
Example.
As shown in figure 1, the element fixing apparatus 100 possesses 12, two base station 10, control unit 11, conveyer chip components
13, two installation portions 14 of supply unit, wafer keep workbench 15, taking-up portion 16, component recognition camera 17, fixed camera 18
And wafer incorporating section 19.In addition, it is provided with welding flux feeding device 1 in element fixing apparatus 100.In addition, welding flux feeding device 1 is
One example of " the viscous fluid feedway " and " viscous fluid supply unit " of the present invention.
Control unit 11 is configured to, uniformly the action in each portion of control element erecting device 100.Specifically, control unit
11 are configured to, and carry out conveyer 12, chip component supply unit 13, installation portion 14, wafer and keep workbench 15, taking-up portion 16, member
The action control of part identification camera 17, fixed camera 18, wafer incorporating section 19 and welding flux feeding device 1 etc..Control unit
11, based on the output signal from position detection units such as the encoders of drive motor for being built in above-mentioned each portion, carry out each portion
Action control.In addition, control unit 11, which has, carries out various cameras (component recognition camera 17 and fixed camera 18)
Shooting control and the function of image recognition.
Conveyer 12 is configured to, and substrate S-phase is moved into and taken out of for predetermined installation exercise position.In addition, conveying
Machine 12 includes a pair of the conveyor tracks extended in X direction and the detent mechanism (not shown) that substrate S is positioned to precalculated position.
Thus, the carrying substrate S, and predetermined installation exercise position is fixed in substrate S positioning in X direction of conveyer 12.
Two chip component supply units 13 are respectively arranged on the both ends of the nearby side (Y1 directions side) of element fixing apparatus 100.
Tape feeder 13a has been arranged side-by-side in X direction in chip component supply unit 13.Each tape feeder 13a intermittently sends out load
Band, and the electronic component in carrier band is supplied to predetermined component feeding position.
Installation portion 14 is configured to, by the electronic component supplied from chip component supply unit 13 and wafer W bare chip C to
Substrate S is installed.Specifically, installation portion 14 by XY travel mechanisms support for can in the horizontal direction (XY directions) in conveyer 12
The top movement of (substrate S).Installation portion 14 has multiple (two) the suction nozzle 14a (reference picture 2) configured in X direction.
In addition, installation portion 14 is configured to, adsorbed by suction nozzle 14a from taking-up portion 16 from the wafer W bare chip C taken out and to
Installed on substrate S.In addition, installation portion 14 is configured to, the electronic component supplied by suction nozzle 14a absorption by tape feeder 13a
And to installing on substrate S.
Wafer keeps workbench 15 to be configured to, and in precalculated position, support is received by being put into unloading device (not shown) from wafer
Receive portion 19 pull-out wafer W.
Taking-up portion 16 is configured to, and takes out bare chip C from wafer W and joins to installation portion 14.In addition, taking-up portion 16 is by pre-
(XY directions) keeps the top position of workbench 15 to move to fixed driver element in wafer in the horizontal direction.In addition, taking-up portion 16
Including 4 head wafer 16a.
Head wafer 16a is configured to, and can be rotated around X-axis, and can move (lifting) along the vertical direction.In addition, head wafer
16a is configured to, and can adsorb bare chip C.That is, taking-up portion 16 is configured to, and adsorbs and takes out by supporting rod part by head wafer 16a
The bare chip C of jack-up (not shown), and bare chip C is inverted (flip-chip), in predetermined delivery position by bare chip C to peace
Dress portion 14 (suction nozzle 14a) joins.
Component recognition camera 17 is configured to, and before the bare chip C from wafer W is taken out, shooting is as taking-up object
Bare chip C.In addition, component recognition camera 17 is located at the framework shared with taking-up portion 16.In addition, component recognition camera 17
By predetermined driver element, (XY directions) keeps the top position of workbench 15 to move in wafer in the horizontal direction.
Fixed camera 18 is arranged on base station 10 and in the movable area of installation portion 14.Fixed camera 18 is configured to,
From the electronic component of the suction nozzle 14a absorption of downside shooting attached portion 14 (including bare chip C).
Wafer incorporating section 19 is configured to, and can house the more pieces of wafer W that cutting forms.Wafer W bare chip C e.g. exists
The bare chip of flip-chip installation formed with projection on electrode.In this case, bare chip C is with (the installation of projection forming face
Face) mode upward is pasted on laminar wafer and is kept.
Welding flux feeding device 1 is set to transfer (coating) solder flux to bare chip C projection.Specifically, weld
Agent feeding device 1 supplies solder flux in a manner of solder flux is extended on plate 2 compared with unfertile land.Also, the suction nozzle 14a of attached portion 14 inhales
Attached bare chip C and the flux contacts to extend.Thus, solder flux is needed on bare chip C projection.In addition, solder flux is for connecing
The good mode of the wettability of the solder of conjunction is applied to bare chip C projection.
(explanation of component mounting operation)
Next, reference picture 2, illustrate the installation action of the electronic component based on element fixing apparatus 100.
As shown in Fig. 2 in the case where wafer W bare chip C is installed to substrate S, first, taken out by taking-up portion 16
The bare chip C of mounting object, and the head wafer 16a absorption in taking-up portion 16 keeps bare chip C.Head wafer 16a is rotated and made naked
Chip C inverts (flip-chip), and bare chip C is configured in predetermined delivery position.Correspondingly, the suction nozzle of installation portion 14
14a drops to handing-over height and position above delivery position and adsorbs bare chip C.
After bare chip C has been adsorbed, installation portion 14 moves to the top of welding flux feeding device 1.The suction nozzle of installation portion 14
14a drops to transfer height and position, and solder flux is transferred (coating) in bare chip C projection forming face.Then, installation portion 14 is with logical
The mode for crossing the top of fixed camera 18 moves, and is taken by the projection forming face for the bare chip C that suction nozzle 14a is adsorbed.Thus,
Carry out bad judgement, the identification of absorption position deviation of bare chip C projection forming face.In addition, transfer action and shooting are dynamic
There is also the situation of reversed order for work.That is, the state before for transfer can be shot the feelings of (image recognition) well
Under condition, first implement shooting action.
After the picture is taken, installation portion 14 moves to the substrate S kept by conveyer 12 top, and suction nozzle 14a is in predetermined peace
Setting height(from bottom) position is dropped to above holding position, bare chip C is loaded (installation) on substrate S.
In addition, in the case of installation tape feeder 13a (reference picture 1) feed element, installation portion 14 supplies to belt
The top movement of glassware 13a predetermined element extracting position.Also, suction nozzle 14a declines and takes out electronic component.Then, pacify
Dress portion 14 moves in a manner of by the top of fixed camera 18, is clapped by the lower surface of the suction nozzle 14a electronic components adsorbed
Take the photograph.Also, installation portion 14 moves to substrate S top.Then, suction nozzle 14a declines, and electronic component is loaded (installation) in substrate
On S.In addition, bare chip C by individually be accommodated in carrier band and from tape feeder 13a supply in the case of, be fed from belt
After device 13a takes out bare chip C, implement transfer and shooting as illustrated in fig. 2, then to mounting (installation) naked core on substrate S
Piece C.
(structure of welding flux feeding device)
3~Fig. 8 of reference picture, illustrate the construction of the welding flux feeding device 1 of the first embodiment of the present invention.
As shown in figure 3, welding flux feeding device 1 possess plate 2, scraper plate 3, abutment portion 4, scraper plate maintaining part 5, solder flux discharge unit 6,
Sensor 7 and scraper plate test section 8.In addition, solder flux discharge unit 6 is an example in " supplement portion " of the invention.
Plate 2 includes recess 21.As shown in figure 4, scraper plate 3 includes a pair of scraping plate parts 31, a pair of wall portions 32, a pair of plate-shaped portion
33rd, pair of sliding direction banking pin 34 and a pair of pressing portion 35.As shown in figure 5, abutment portion 4 include motor 41, band 42 and
Plate location division 43.As shown in figure 4, scraper plate maintaining part 5 includes direct of travel limiting unit 51, pressing direction limiting unit 52, linking part
53rd, rotation support portion 54, plunger portion 55 and cylinder 56.As shown in figure 3, scraper plate test section 8 includes light-projecting portion 8a and light accepting part
8b.In addition, pressing direction limiting unit 52 is an example of " limiting unit " of the invention, cylinder 56 is " pressing force of the invention
One example of generation mechanism ".
As shown in figure 4, pressing direction limiting unit 52 has scraper plate sticking department 521, rotational support recess 522, plunger engaging
Hole 523, plunger connecting hole 524 and block pin 525.Air pressure generating unit 561 and adjuster 562 are connected with cylinder 56.This
Outside, the example that pin 525 is " switching part " of the invention is blocked.Section is provided with the outside of pressing direction limiting unit 52 substantially
The action bars of L-shaped, the action bars form the operating portion of operator on top.
As shown in figure 3, plate 2 is configured to extend for solder flux.Plate 2 is formed as along the A direction parallel with the glide direction of scraper plate 3
Extension.The recess 21 of plate 2 is recessed predetermined depth.Thus, solder flux is extended with substantially uniform height in recess 21.
As shown in figure 3, scraper plate 3 is configured to, slided in a manner of the solder flux on plate 2 is flattened.Specifically, the structure of scraper plate 3
Turn into, moved up in the state of being contacted to B directions (B2 directions) pressing with plate 2 in A directions (A1 directions and A2 directions)
It is dynamic.As shown in figure 4, the scraping plate part 31 of scraper plate 3 is provided with a pair in A1 directions and A2 directions.A pair of scraping plate parts 31 by located at
A pair of wall portions 32 at the both ends in the orthogonal horizontal direction in A directions link.That is, a pair of scraping plate parts 31 and a pair of wall portions 32 are with frame
Shape links.Scraping plate part 31 is configured to, and is done the solder flux on the plate 2 on direct of travel (A1 directions or A2 directions) by sliding
It is flat.
Plate-like portion 33 is respectively arranged on the outside of a pair of wall portions 32.Glide direction banking pin is respectively equipped with a pair of plate-shaped portion 33
34 and pressing portion 35.Glide direction banking pin 34 is arranged to protrude laterally from plate-like portion 33.The structure of glide direction banking pin 34
Turn into, abutted with the direct of travel limiting unit 51 of scraper plate maintaining part 5, the power in glide direction (direct of travel) is transmitted to scraper plate 3.
Pressing portion 35 is arranged to protrude laterally from plate-like portion 33.Pressing portion 35 is configured to, the pressing with scraper plate maintaining part 5
Direction limiting unit 52 engages, and the power (pressing force) in pressing direction (B2 directions) is transmitted to scraper plate 3.
As shown in figure 3, abutment portion 4 is configured to, plate 2 is provided with, and scraper plate 3 is moved via scraper plate maintaining part 5.Specifically
Ground is said, as shown in figure 5, band 42 is driven by the motor 41 of abutment portion 4.Band 42 abuts with scraper plate maintaining part 5 and makes scraper plate maintaining part 5
Moved up in A side.In addition, plate 2 is positioned by the plate location division 43 of abutment portion 4, plate 2 is arranged at abutment portion 4.
Scraper plate maintaining part 5 is provided with scraper plate 3.Specifically, scraper plate maintaining part 5 is configured to keep scraper plate 3.Scraper plate is kept
Portion 5 is configured to, limiting scraper 3 with the movement on the parallel B directions in pressing direction, and limiting scraper 3 with direct of travel
Movement on (glide direction) parallel A directions.
The direct of travel limiting unit 51 of scraper plate maintaining part 5 is configured to, and limiting scraper 3 is in the A direction parallel with glide direction
On movement.Direct of travel limiting unit 51 is provided with a pair in a manner of opposite in the horizontal direction orthogonal with A directions.That is,
Direct of travel limiting unit 51 is provided with a pair in a manner of clipping scraper plate 3.In addition, direct of travel limiting unit 51 is fixed on base portion
5a.In addition, direct of travel limiting unit 51 has upper direction (B1 directions) open shape of slit.In direct of travel limiting unit 51
The glide direction banking pin 34 of scraper plate 3 is clipped at shape of slit.Also, glide direction banking pin 34 by A directions with row
Enter direction limiting unit 51 to abut and movement of the limiting scraper 3 (glide direction banking pin 34) in glide direction.Thus, scraper plate is protected
Hold portion 5 to move up in A side, so as to which scraper plate 3 also moves up (slip) in A side.
Pressing direction limiting unit 52 is configured to, and limiting scraper 3 is in B direction (the B1 side parallel with the pressing direction to plate 2
To) on movement.Pressing direction limiting unit 52 is provided with a pair in a manner of opposite in the horizontal direction orthogonal with A directions.
That is, pressing direction limiting unit 52 is provided with a pair in a manner of clipping scraper plate 3.
In addition, pressing direction limiting unit 52 is provided separately from direct of travel limiting unit 51.In addition, in the limitation of pressing direction
In the state of the limitation in portion 52 is released from, scraper plate 3 is moved and is removed on B directions (B1 directions).In addition, pressing direction limitation
Portion 52 is configured to, relative to mobile, the shifting of limiting scraper 3 on B directions (above-below direction) along A directions (horizontal direction) of scraper plate 3
It is dynamic.Specifically, a pair of pressing direction limiting units 52 are interconnected by linking part 53.In addition, the pressing quilt of direction limiting unit 52
The support of rotation support portion 54 is to rotate.Also, pressing direction limiting unit 52 is configured to, in being with rotation support portion 54
The heart rotates and scraper plate sticking department 521 is moved along A directions, so as to lock scraper plate 3 (movement on limitation B1 directions).In addition, by
The connecting portion 53 of direction limiting unit 52 is pressed in a pair to link, therefore when the pressing direction limiting unit 52 for making a side is moved along A directions
When dynamic, the pressing direction limiting unit 52 of the opposing party similarly moves along A directions.
The scraper plate sticking department 521 of pressing direction limiting unit 52 is configured to, and engages with the pressing portion 35 of scraper plate 3, limiting scraper 3
Movement in directionb, and transmit pressing force to scraper plate 3.In the top ends engaged with pressing portion 35 of scraper plate sticking department 521
Divide formed with the size and inclined rake 521a (reference picture 6) changed along A directions on B directions.In addition, pressing direction limitation
The scraper plate sticking department 521 in portion 52 is configured to, and is moved in pressing portion 35 and locks scraper plate 3 (movement on limitation B directions).
The rotational support recess 522 for pressing direction limiting unit 52 is formed as otch in a manner of being rotated supporting part 54 and support
Shape.Pressing direction limiting unit 52 is configured to, and in the case where relieving the locking (relieving the limitation on B directions) of scraper plate 3, turns
Dynamic support recess 522 contacts with rotation support portion 54.That is, the feelings of locking of the pressing direction limiting unit 52 to scraper plate 3 are being relieved
Under condition, pressing direction limiting unit 52 is rotated centered on rotation support portion 54.On the other hand, it is locked in scraper plate 3 and (limits B
Direction) in the case of, rotational support recess 522 separates on B directions (B1 directions) with rotation support portion 54.
The plunger connecting hole 523 and plunger connecting hole 524 for pressing direction limiting unit 52 are configured to, and block with plunger portion 55
Close, suppress pressing the moving (rotation) along A directions of direction limiting unit 52.That is, scraper plate 3 is limited in pressing direction limiting unit 52 to exist
In the case of movement on B directions, plunger portion 55 engages with plunger connecting hole 523, and limitation pressing direction limiting unit 52 is in A directions
On movement.In addition, in the case where pressing direction limiting unit 52 relieves the limitation of the movement of scraper plate 3 in directionb, plunger
Portion 55 engages with plunger connecting hole 524, movement of the limitation pressing direction limiting unit 52 on A directions.
Here, in the first embodiment, block side of the pin 525 in a pair of pressing direction limiting units 52 and be provided with two
It is individual.Block the upside (B1 directions side) that pin 525 is configured at linking part 53 at predetermined spaced intervals.Block pin 525 to be configured to, cut
Bring from light-projecting portion 8a light (visible ray or infrared light) towards light accepting part 8b arrival.Specifically, pin 525 is blocked to form
For, make light (visible ray either infrared light) from light-projecting portion 8a towards light accepting part 8b by or be blocked.That is, pin 525 is blocked
It is configured to, it is right according to the restriction state for the movement that scraper plate 3 is limited by pressing direction limiting unit 52 and pressing direction limiting unit 52
The releasing state that the limitation of the movement of scraper plate 3 is released from, switches arrival of the light from light-projecting portion 8a towards light accepting part 8b.
Specifically, when the restriction state of switching pressing direction limiting unit 52 is with releasing state, by making to block pin 525
Move and switch arrival of the light from light-projecting portion 8a towards light accepting part 8b.That is, by with make in the case of releasing state by
Pressure direction limiting unit 52 contacts with rotation support portion 54 and makes pressing direction limiting unit 52 in the case of restriction state with turning
The mode that dynamic supporting part 54 separates moves pressing direction limiting unit 52, and makes to block pin 525 and move.
As shown in fig. 6, be pressed in scraper plate 3 in the case that direction limiting unit 52 locks (movement on B directions is limited),
Light from light-projecting portion 8a reaches light accepting part 8b by blocking the gap between pin 525 and linking part 53.As shown in fig. 7,
In the case that locking of the pressing direction limiting unit 52 to scraper plate 3 is released from (limitation of the movement on B directions is released from), to haul oneself willingly into
The light portion 8a light pin 525 that is blocked blocks and does not reach light accepting part 8b.That is, direction limiting unit 52, light-projecting portion are pressed by rotating
8a light can not be by blocking the gap between pin 525 and linking part 53.As shown in figure 8, in the case where being not provided with scraper plate 3,
Light from the light-projecting portion 8a pin 525 that is blocked blocks and does not reach light accepting part 8b.That is, by the way that turning for direction limiting unit 52 will be pressed
Dynamic support recess 522 is configured to contact with rotation support portion 54, and light-projecting portion 8a light can not be by blocking pin 525 and linking part 53
Between gap.
Cylinder 56 is configured to, and is connected with pressing direction limiting unit 52, and produce pressing force of the scraper plate 3 to plate 2.Specifically
Say, cylinder 56 is configured to, and will link the linking part 53 for pressing direction limiting unit 52 and is exerted a force to direction (B2 directions) is pressed.Cylinder 56
It is configured to, by pressing the air pressure of generating unit 561 to be driven to produce the pressing force of scraper plate 3 based on air.Pressed and produced by air
Air pressure is adjusted to desired pressure via adjuster 562 caused by life portion 561.That is, adjusted by operating adjuster 562
Pressing force of the whole scraper plate 3 to plate 2.For example, the viscosity information of the solder flux based on coating adjusts pressing force.
Solder flux discharge unit 6 is configured to, by solder flux to supplying on plate 2.Specifically, solder flux discharge unit 6 is configured to, by solder flux
Supplied to the inframe formed by the scraping plate part 31 and wall portion 32 of scraper plate 3.
Sensor 7 is configured to, and determines the amount of the solder flux of the inframe of scraper plate 3.Sensor 7 is for example including ultrasonic sensor.
In addition, in the first embodiment, scraper plate test section 8 is configured to, detects the presence of and scraper plate 3 is set.Specifically, scrape
Plate test section 8 is configured to, detect whether set scraper plate 3 and whether by press direction limiting unit 52 limit (locking) scraper plate 3
It is mobile.That is, as shown in fig. 6, being pressed in scraper plate 3 in the case that direction limiting unit 52 locks (movement on B directions is limited),
Light-projecting portion 8a light is detected by light accepting part 8b.Thus, the state that scraper plate 3 is locked by scraper plate maintaining part 5 is detected.Also,
In the case where scraper plate 3 is locked (being limited in directionb), the pressing force based on cylinder 56 is produced.Namely based on light accepting part 8b
Testing result, in the case of locked state, drive cylinder 56 and produce pressing force.In addition, in scraper plate 3 in B directions
On limitation be released from (locking is released from) in the case of, do not produce the pressing force based on cylinder 56.In addition, examined by scraper plate
Survey portion 8 is not detected in the case of being provided with scraper plate 3, does not supplement (supply) solder flux from solder flux discharge unit 6.
Furthermore it is possible to it is, based on light accepting part 8b testing result, light-projecting portion 8a light to be can't detect by light accepting part 8b
In the case of, that is, be not provided with scraper plate 3 or even if there is provided scraper plate 3 it is also unlocked in the case of, even if element fixing apparatus
100 are in automatic operating and make the opportunity that scraper plate 3 moves up in A side by the driving of motor 41, also not drive motor
41, but maintain the state stopped.Or Ke Yishi, pass through light accepting part when the automatic operating of element fixing apparatus 100 stops
In the case that 8b can't detect light-projecting portion 8a light, even if being pressed the automatic operating for starting element fixing apparatus 100
The operation such as switch, automatic operating will not also start.And then Ke Yishi, it can't detect light-projecting portion 8a's by light accepting part 8b
In the case of light, the warning that abnormality is carried out in monitor (not shown) etc. is shown.
(effect of first embodiment)
In the first embodiment, following such effect can be obtained.
In the first embodiment, can as described above, detecting the presence of the scraper plate test section 8 for setting scraper plate 3 by setting
Prevent from forgetting the setting of scraper plate 3.Thereby, it is possible to suppress because be not provided with the state of scraper plate 3 supplement solder flux cause solder flux to
Spilt in device.
In addition, in the first embodiment, scraper plate test section 8 is configured to, detect whether to set scraper plate 3 and whether by by
Pressure direction limiting unit 52 limits the movement of scraper plate 3.Thereby, it is possible to prevent from forgetting to press shifting of the direction limiting unit 52 to scraper plate 3
Dynamic limitation, therefore can suppress because forgetting to cause scraper plate 3 to separate with plate 2 pressing limitation of the direction limiting unit 52 to scraper plate 3.
In addition, in the first embodiment, pin 525 will be blocked and be configured to, limited according to by pressing direction limiting unit 52
The releasing state that the limitation of the restriction state of the movement of scraper plate 3 and movement of the pressing direction limiting unit 52 to scraper plate 3 is released from, cuts
Bring the arrival from light-projecting portion 8a light towards light accepting part 8b.Thus, pass through the light from light-projecting portion 8a by blocking pin 525
Or be blocked, so as to easily detect whether to set scraper plate 3 and whether be in restriction state.
In addition, in the first embodiment, make when the restriction state of switching pressing direction limiting unit 52 is with releasing state
Block pin 525 to move, so as to switch arrival of the light from light-projecting portion 8a towards light accepting part 8b.Thereby, it is possible to make to block pin 525
Linkedly moved with releasing state with switching restriction state by pressing direction limiting unit 52, thus can according to restriction state and
Releasing state, easily switch arrival of the light from light-projecting portion 8a towards light accepting part 8b by blocking pin 525.
In addition, in the first embodiment, by make pressing direction limiting unit 52 in the case of releasing state with turning
Dynamic supporting part 54 contacts and made in the case of restriction state the side that pressing direction limiting unit 52 separates with rotation support portion 54
Formula moves pressing direction limiting unit 52, and makes to block pin 525 and move.Thus, direction limiting unit 52 is pressed by rotating, can
The limitation for pressing movement of the direction limiting unit 52 to scraper plate 3 is easily subjected to on/off.Further, since can be according to limitation shape
State presses distance of the direction limiting unit 52 relative to rotation support portion 54 with releasing state change, therefore can be easily according to shape
State, which makes to block pin 525, to be moved.
In addition, in the first embodiment, detecting to be limited by pressing direction limiting unit 52 by scraper plate test section 8
In the case of the movement of scraper plate 3, pressing force is produced using cylinder 56.Thus, due to can be by pressing direction limiting unit 52
Limit and apply pressing force in the state of the movement of scraper plate 3, therefore reliably can assign pressing force to scraper plate 3.Further, since
By not producing the pressing based on cylinder 56 in the case where will press limitation of the direction limiting unit 52 to scraper plate 3 and carry out on/off
Power and move easily pressing direction limiting unit 52, therefore can easily will to the limitation of scraper plate 3 carry out on/off.
In addition, in the first embodiment, in the case where not detecting to be provided with scraper plate 3 by scraper plate test section 8, no
Solder flux is supplemented from solder flux discharge unit 6.Thus, due to supplementing solder flux in the case where being provided with scraper plate 3, therefore solder flux can be suppressed
Spilt into device.
[second embodiment]
9~Figure 12 of reference picture, illustrate the welding flux feeding device 200 of second embodiment of the present invention.In second implementation
It is different from the above-mentioned first embodiment of the structure provided with a scraper plate test section 8 in mode, illustrate that being provided with two scraper plates detects
Portion 241 and the structure of scraper plate test section 242.
(structure of welding flux feeding device)
As shown in figure 9, welding flux feeding device 200 possesses plate 210, scraper plate 220, scraper plate maintaining part 230, scraper plate test section
241 and scraper plate test section 242.In addition, welding flux feeding device 200 is " viscous fluid feedway " of the invention and " glued
One example of property fluid supply unit ".
Plate 210 includes recess 211.As shown in Figure 10, scraper plate 220 includes a pair of scraping plate parts 221, a pair of linking parts 222, one
To plate-like portion 223, pair of sliding direction banking pin 224 and a pair of pressing portion 225.Scraper plate maintaining part 230 includes direct of travel
Limiting unit 231, pressing direction limiting unit 232, spring 233 and abutting part 234.As shown in figure 9, scraper plate test section 241 includes
Light-projecting portion 241a and light accepting part 241b.Scraper plate test section 242 includes light-projecting portion 242a and light accepting part 242b.In addition, abutting part 234
It is an example of " switching part " of the invention.
Plate 210 is configured to extend for solder flux.Plate 210 is formed as, and prolongs along the A direction parallel with the glide direction of scraper plate 220
Stretch.The recess 211 of plate 210 is recessed predetermined depth.Thus, solder flux is extended with substantially uniform height in recess 211.In addition,
Plate 210 is configured to, and is moved on A directions (A1 directions and A2 directions).
Scraper plate 220 is configured to, and is slided in a manner of the solder flux on plate 210 is flattened.Specifically, by scraper plate 220 to B
In the state of the pressing of direction (B2 directions), plate 210 moves on A directions (A1 directions and A2 directions).That is, scraper plate 220 is relative
Relatively moved on A directions in plate 210.As shown in Figure 10, the scraping plate part 221 of scraper plate 220 is on A1 directions and A2 directions
It is provided with a pair.A pair of scraping plate parts 221 are linked by a pair of linking parts 222 at the both ends on the direction orthogonal with A directions.
In addition, it is provided with weir portion 221a (reference picture 11) at the both ends of scraping plate part 221.Thereby, it is possible to suppress solder flux when sliding scraper plate 220
From the end leakage of scraping plate part 221.Scraping plate part 221 is configured to, will be relative by relatively moving and sliding relative to plate 210
Direct of travel (A1 directions or A2 directions) on plate 210 on solder flux flatten.
Plate-like portion 223 is respectively arranged on the outside of a pair of linking parts 222.Glide direction is respectively equipped with a pair of plate-shaped portion 223
Banking pin 224 and pressing portion 225.Glide direction banking pin 224 is arranged to protrude laterally from plate-like portion 223.Glide direction
Banking pin 224 is configured to, and is abutted with the direct of travel limiting unit 231 of scraper plate maintaining part 230, the glide direction of limiting scraper 220
Movement on (direct of travel).
Pressing portion 225 is arranged to protrude laterally from plate-like portion 223.Pressing portion 225 is configured to, with scraper plate maintaining part 230
Pressing direction limiting unit 232 engage, to scraper plate 220 transmit pressing direction (B2 directions) on power (pressing force).
Scraper plate maintaining part 230 is provided with scraper plate 220.Specifically, scraper plate maintaining part 230 is configured to keep scraper plate 220.
Scraper plate maintaining part 230 is configured to, movement of the limiting scraper 220 on the B direction parallel with pressing direction, and limiting scraper
220 movement on the A direction parallel with glide direction (relative direct of travel).Scraper plate maintaining part 230 is fixed on A directions
In predetermined position.Specifically, scraper plate maintaining part 230 is configured to, and maintaining part 230b will not be relative to pedestal 230a in A directions
Moved in (horizontal direction).On the other hand, maintaining part 230b is configured to, mobile to B1 directions (top) relative to pedestal 230a.
The direct of travel limiting unit 231 of scraper plate maintaining part 230 is configured to, and limiting scraper 220 is in the A parallel with glide direction
Movement on direction.Direct of travel limiting unit 231 is provided with one in a manner of opposite in the horizontal direction orthogonal with A directions
It is right.That is, direct of travel limiting unit 231 is provided with a pair in a manner of clipping scraper plate 220.In addition, direct of travel limiting unit 231 is solid
Due to pedestal 230a.In addition, direct of travel limiting unit 231 has top (B1 directions) open shape of slit.In direct of travel
The glide direction banking pin 224 of scraper plate 220 is clipped at the shape of slit of limiting unit 231.Also, glide direction banking pin 224 is logical
Cross and abutted on A directions with direct of travel limiting unit 231 and limiting scraper 220 (glide direction banking pin 224) is in glide direction
On movement.
Pressing direction limiting unit 232 is configured to, and limiting scraper 220 is in the B direction parallel with the pressing direction to plate 210
Movement on (B1 directions).Pressing direction limiting unit 232 is provided with a manner of opposite in the horizontal direction orthogonal with A directions
A pair.That is, pressing direction limiting unit 232 is provided with a pair in a manner of clipping scraper plate 220.
In addition, pressing direction limiting unit 232 is provided separately from direct of travel limiting unit 231.In addition, in pressing direction limit
In the state of the limitation in portion 232 processed is released from, scraper plate 220 is moved and is removed on B directions (B1 directions).In addition, pressing side
It is configured to limiting unit 232, is moved in parallel relative to scraper plate 220 along A directions (horizontal direction), limiting scraper 220 is to B1 directions
The movement of (top).
In pressing direction limiting unit 232 with the tip portion that pressing portion 225 engages formed with along the change B directions of A directions
Size and inclined rake 232a.In addition, pressing direction limiting unit 232 is configured to, it is moved in pressing portion 225 and locks
Scraper plate 220 (movement on limitation B directions).I.e., as shown in figure 11, it is pressed direction limiting unit 232 in scraper plate 220 and locks (limit
Make the movement on B directions) in the case of, maintaining part 230b (abutting part 234) lifts from pedestal 230a.
Spring 233 is configured to, and is connected with pressing direction limiting unit 232, and produce pressing force of the scraper plate 220 to plate 210.
Specifically, spring 233 is configured to, by with the maintaining part 230b that abuts of pressing direction limiting unit 232 to pressing direction (B2 side
To) force.
Here, in this second embodiment, abutting part 234 is configured to abut with pedestal 230a.In addition, abutting part 234 is set
In maintaining part 230b bottom (B2 directions side).In addition, abutting part 234 is configured to, it is (visible to switch the light from light-projecting portion 241a
Light or infrared light) towards light accepting part 241b arrival.Specifically, abutting part 234 is configured to, and makes from light-projecting portion 241a directions
Light accepting part 241b light (visible ray either infrared light) by or be blocked.That is, abutting part 234 is configured to, according to by pressing
Direction limiting unit 232 limits restriction state and movement of the pressing direction limiting unit 232 to scraper plate 220 of the movement of scraper plate 220
The releasing state that is released from of limitation, switch arrival of the light from light-projecting portion 241a towards light accepting part 241b.
Specifically, when the restriction state of switching pressing direction limiting unit 232 is with releasing state, by making abutting part
234 move and switch arrival of the light from light-projecting portion 241a towards light accepting part 241b.
As shown in figure 11, the feelings that direction limiting unit 232 locks (movement on B directions is limited) are pressed in scraper plate 220
Under condition, light-projecting portion 241a light is detected by light accepting part 241b.That is, by maintaining part 230b (abutting part 234) from pedestal 230a
Lift and make the light from light-projecting portion 241a by the gap between abutting part 234 and pedestal 230a and reach light accepting part 241b.
Thus, the state that scraper plate 220 is locked by scraper plate maintaining part 230 is detected.On the other hand, as shown in figure 12, scraper plate 220 not by
In the case that pressing direction limiting unit 232 locks (limitation of the movement on B directions is released from), by light accepting part 241b detections not
To light-projecting portion 241a light.That is, abutted by maintaining part 230b (abutting part 234) with pedestal 230a, from light-projecting portion 241a's
Light abutting portion 234 is blocked and is not reached light accepting part 241b.
In addition, in this second embodiment, scraper plate test section 241 is configured to, detects the presence of and scraper plate 220 is set.Specifically
Say, whether scraper plate test section 241 is configured to, detect whether to set scraper plate 220 and limited (locking) by pressing direction limiting unit 232
The movement of scraper plate 220.
Scraper plate test section 242 is configured to, and detects the presence of and sets scraper plate 220.Specifically, as shown in figure 9, being scraped being provided with
In the case of plate 220, light-projecting portion 242a light is can't detect by light accepting part 242b.That is, the light from light-projecting portion 242a is scraped
Plate 220 blocks and does not reach light accepting part 242b.On the other hand, in the case where being not provided with scraper plate 220, light accepting part 242b is passed through
Detect light-projecting portion 242a light.That is, the light from light-projecting portion 242a is not blocked and reaches light accepting part 242b.
Furthermore it is possible to be, in the case where scraper plate test section 242 is not detected by the setting of scraper plate 220, or based on by
In the case that light portion 242b testing result can't detect light-projecting portion 242a light by light accepting part 242b, even if element installation dress
Putting 100 and being in automatic operating makes the opportunity that scraper plate 3 relatively moves up in A side by the movement of plate 210, does not also make
It is moved, but maintains the state stopped.Or can be, as long as when the automatic operating of element fixing apparatus 100 stops
The situation of above-mentioned such detection state is generated, even if then being pressed the automatic fortune for starting element fixing apparatus 100
The operation such as switch turned, automatic operating will not also start.And then Ke Yishi, in the case of above-mentioned detection state, not shown
Monitor etc. carry out the warning of abnormality and show.
In addition, the other structures of second embodiment are identical with above-mentioned first embodiment.
(effect of second embodiment)
In this second embodiment, following such effect can be obtained.
In this second embodiment, it is identical with first embodiment, detect the presence of the scraper plate that scraper plate 220 is set by setting
Test section 241 and scraper plate test section 242, it can prevent from forgetting the setting of scraper plate 220.Thereby, it is possible to suppress because being not provided with
Solder flux is supplemented in the state of scraper plate 220 and causes solder flux to be spilt into device.
In addition, other effects of second embodiment are identical with above-mentioned first embodiment.
(variation)
In addition, embodiment of disclosure is all in all respects example, the interior of limitation invention is not considered as
Hold.The scope of the present invention is represented by claims, rather than represented by the explanation of above-mentioned embodiment, and it includes
With having altered (variation) in claims identical meaning and scope.
For example, in above-mentioned first embodiment and second embodiment, show and apply the viscous fluid of the present invention
Coating apparatus is applied to the example of flux coating device, but the invention is not limited in this.Can also be by the viscous flow of the present invention
Body applying device is applied to the device of the viscous fluid beyond coating solder flux.For example, it is also possible to the viscous fluid of the present invention is applied
Coating apparatus is applied to the device of the viscous fluids such as solder-coating, silver paste.
In addition, in above-mentioned first embodiment and second embodiment, show that flip-chip installation has projection
Bare chip example, but the invention is not limited in this.For example, it is also possible to apply the present invention to PoP (package on
package：Packaging body lamination) installation has a case that the potted element of BGA (ball grid array).In addition, both can be by the present invention
Element fixing apparatus be applied to flip chip devices, can also be applied to installation from tape feeder, pallet supply element
Element fixing apparatus.
In addition, in the above-described first embodiment, show that the pressing force generation mechanism as the present invention has used cylinder
Example, but the invention is not limited in this.In the present invention, as pressing force generation mechanism, such as liquid can also be used
Cylinder pressure, solenoid, linear motor etc..
In addition, in the above-described first embodiment, the example that adjuster has been used as pressing force adjustment mechanism is shown,
But the invention is not limited in this.In the present invention, as pressing force adjustment mechanism, such as hand-operated valve, electricity can also be used
Magnet valve, pressure changeable mechanism, current control division, servo controller etc..
In addition, in above-mentioned first embodiment and second embodiment, show from the top of scraper plate and supply solder flux
The example of the structure of (viscous fluid), but the invention is not limited in this.In the present invention, can also be under scraper plate
The plate of side sets discharge unit and supplies viscous fluid.
In addition, in above-mentioned first embodiment and second embodiment, show that scraper plate test section passes through light accepting part
Light of the detection from light-projecting portion is so as to detect the example of the structure of the presence or absence of scraper plate and restriction state, but the present invention not office
It is limited to this.In the present invention, scraper plate test section can also use the member beyond light usually to detect the presence or absence of scraper plate and limitation shape
State.For example, scraper plate test section can also detect the presence or absence of scraper plate and restriction state using sound (ultrasonic wave), electric wave.Separately
Outside, scraper plate test section can also detect the presence or absence of scraper plate and restriction state using mechanical switch.In addition, scraper plate test section was both
The sensor of transmission-type can be used, the sensor of reflection-type can also be used.
In addition, in the above-described first embodiment, the example for blocking pin as switching part there is provided two is shown, but
It is that the invention is not limited in this.In the present invention, can both be set by blocking pin by one, can also set more than 3.In addition,
Light from light-projecting portion can also be blocked by the part in addition to pin is blocked.
Description of reference numerals
1st, 200 welding flux feeding devices (viscous fluid feedway, viscous fluid supply unit)
2nd, 210 plate
3rd, 220 scraper plate
5th, 230 scraper plate maintaining part
6 solder flux discharge units (supplement portion)
8th, 241,242 scraper plate test section
8a, 241a, 242a light-projecting portion
8b, 241b, 242b light accepting part
14 installation portions
52nd, 232 pressing direction limiting unit (limiting unit)
54 rotation support portions
56 cylinders (pressing force generation mechanism)
100 element fixing apparatus
234 abutting parts (switching part)
525 block pin (switching part)
C bare chips (element)
S substrates
Claims (8)
1. a kind of viscous fluid feedway, possesses：
The plate to extend for viscous fluid；
The scraper plate slided in a manner of the viscous fluid on the plate is flattened；
The scraper plate maintaining part set for the scraper plate；And
Detect the presence of the scraper plate test section that the scraper plate is set.
2. viscous fluid feedway according to claim 1, wherein,
The scraper plate maintaining part includes limiting unit, and the limiting unit limits the scraper plate parallel with the pressing direction to the plate
Movement on direction,
The scraper plate test section is configured to, and detects whether to set the scraper plate and the shifting of the scraper plate whether is limited by limiting unit
It is dynamic.
3. viscous fluid feedway according to claim 2, wherein,
The scraper plate test section includes light-projecting portion and light accepting part,
The scraper plate maintaining part includes switching part, switching part switching the arriving towards the light accepting part of the light from the light-projecting portion
Reach,
The switching part is configured to, according to the restriction state for the movement that the scraper plate is limited by the limiting unit and the limitation
The releasing state that the limitation of movement of the portion to the scraper plate is released from, switches the light from the light-projecting portion towards the light accepting part
Arrival.
4. viscous fluid feedway according to claim 3, wherein,
It is configured to, when switching the restriction state of the limiting unit and releasing state, is switched by making the switching part mobile
Arrival of the light from the light-projecting portion towards the light accepting part.
5. viscous fluid feedway according to claim 4, wherein,
The scraper plate maintaining part also includes the limiting unit supporting rotation support portion as that can rotate,
It is configured to, by make the limiting unit contact and limit with the rotation support portion in the case of releasing state
The mode for making the limiting unit be separated with the rotation support portion in the case of state moves the limiting unit, and makes described cut
Change portion's movement.
6. the viscous fluid feedway according to any one of claim 2~5, wherein,
The viscous fluid feedway is also equipped with that pressing of the scraper plate to the plate is connected and produced with the limiting unit
The pressing force generation mechanism of power,
It is configured to, in the case where detecting to limit the movement of the scraper plate by the limiting unit by the scraper plate test section,
Pressing force is produced by the pressing force generation mechanism.
7. according to viscous fluid feedway according to any one of claims 1 to 6, wherein,
The viscous fluid feedway is also equipped with the supplement portion to plate supplement viscous fluid,
It is configured to, in the case where not detecting to be provided with the scraper plate by the scraper plate test section, not from the supplement portion
Supplement viscous fluid.
8. a kind of element fixing apparatus, possesses：
To the installation portion of substrate installation elements；And
To the viscous fluid supply unit of the component feeding viscous fluid,
The viscous fluid supply unit includes：
The plate to extend for viscous fluid；
The scraper plate slided in a manner of the viscous fluid on the plate is flattened；
The scraper plate maintaining part set for the scraper plate；And
Detect the presence of the scraper plate test section that the scraper plate is set.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2015/061994 WO2016170573A1 (en) | 2015-04-20 | 2015-04-20 | Viscous fluid feeding apparatus and component mounting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107530727A true CN107530727A (en) | 2018-01-02 |
| CN107530727B CN107530727B (en) | 2019-07-26 |
Family
ID=57144456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580078955.1A Active CN107530727B (en) | 2015-04-20 | 2015-04-20 | Viscous fluid feedway and element fixing apparatus |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6450455B2 (en) |
| KR (1) | KR102000008B1 (en) |
| CN (1) | CN107530727B (en) |
| DE (1) | DE112015006471T5 (en) |
| TW (1) | TWI584883B (en) |
| WO (1) | WO2016170573A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112119681A (en) * | 2018-05-23 | 2020-12-22 | 雅马哈发动机株式会社 | Support member arrangement determining device and support member arrangement determining method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6806877B2 (en) * | 2017-02-27 | 2021-01-06 | ヤマハ発動機株式会社 | Component mounting device |
| CN114953595A (en) * | 2022-05-17 | 2022-08-30 | 亳州市裕同印刷包装有限公司 | Scraper mechanism and edge scraping equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001302134A (en) * | 2000-04-18 | 2001-10-31 | Mitsubishi Electric Corp | Maintenance operation device for elevator |
| JP2007290288A (en) * | 2006-04-26 | 2007-11-08 | Shibaura Mechatronics Corp | Apparatus for forming paste film |
| JP2013078433A (en) * | 2011-10-03 | 2013-05-02 | Panasonic Corp | Monitoring device, and program |
| JP2013152061A (en) * | 2012-01-26 | 2013-08-08 | Mitsubishi Electric Corp | Heating cooker |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3885348B2 (en) * | 1998-03-31 | 2007-02-21 | ブラザー工業株式会社 | Stamp production equipment |
| US6293317B1 (en) | 1999-04-12 | 2001-09-25 | Esec Trading Sa | Method and device for the application of a liquid substance |
| JP5076922B2 (en) * | 2008-01-25 | 2012-11-21 | 株式会社日立プラントテクノロジー | Solder ball printing device |
| TW201010862A (en) * | 2008-09-03 | 2010-03-16 | Horng Terng Automation Co Ltd | Scraper device with auto-sensing function |
| JP6156869B2 (en) * | 2013-06-27 | 2017-07-05 | Ｊｕｋｉオートメーションシステムズ株式会社 | Position detection apparatus, substrate manufacturing apparatus, position detection method, and substrate manufacturing method |
| JP6378829B2 (en) * | 2015-04-20 | 2018-08-22 | ヤマハ発動機株式会社 | Viscous fluid supply device and component mounting device |
-
2015
- 2015-04-20 KR KR1020177027653A patent/KR102000008B1/en active IP Right Grant
- 2015-04-20 CN CN201580078955.1A patent/CN107530727B/en active Active
- 2015-04-20 WO PCT/JP2015/061994 patent/WO2016170573A1/en active Application Filing
- 2015-04-20 DE DE112015006471.0T patent/DE112015006471T5/en active Pending
- 2015-04-20 JP JP2017513843A patent/JP6450455B2/en active Active
-
2016
- 2016-02-04 TW TW105103851A patent/TWI584883B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001302134A (en) * | 2000-04-18 | 2001-10-31 | Mitsubishi Electric Corp | Maintenance operation device for elevator |
| JP2007290288A (en) * | 2006-04-26 | 2007-11-08 | Shibaura Mechatronics Corp | Apparatus for forming paste film |
| JP2013078433A (en) * | 2011-10-03 | 2013-05-02 | Panasonic Corp | Monitoring device, and program |
| JP2013152061A (en) * | 2012-01-26 | 2013-08-08 | Mitsubishi Electric Corp | Heating cooker |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112119681A (en) * | 2018-05-23 | 2020-12-22 | 雅马哈发动机株式会社 | Support member arrangement determining device and support member arrangement determining method |
| CN112119681B (en) * | 2018-05-23 | 2022-02-18 | 雅马哈发动机株式会社 | Support member arrangement determining device and support member arrangement determining method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107530727B (en) | 2019-07-26 |
| KR20170125910A (en) | 2017-11-15 |
| KR102000008B1 (en) | 2019-07-15 |
| JPWO2016170573A1 (en) | 2017-11-16 |
| TW201637727A (en) | 2016-11-01 |
| JP6450455B2 (en) | 2019-01-09 |
| WO2016170573A1 (en) | 2016-10-27 |
| DE112015006471T5 (en) | 2017-12-28 |
| TWI584883B (en) | 2017-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI579935B (en) | A flip chip bonding device | |
| US7712652B2 (en) | Component mounting apparatus and component mounting method | |
| CN105850232B (en) | Distributing equipment with substrate converter system and clamping system and the method for distributing cohesive material on substrate | |
| US9146196B2 (en) | Automated fillet inspection system with closed loop feedback and methods of use | |
| US20050045914A1 (en) | Flip chip device assembly machine | |
| CN107530727B (en) | Viscous fluid feedway and element fixing apparatus | |
| KR102403569B1 (en) | Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly | |
| US8152049B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
| CN103687467A (en) | Electronic component mounting device | |
| KR101682318B1 (en) | Terminal junction apparatus | |
| KR100639149B1 (en) | Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same | |
| KR101569180B1 (en) | Apparatus for Bonding Products | |
| TWI590875B (en) | Viscous fluid supply device and component mounting device | |
| JP5608829B1 (en) | Component mounting equipment | |
| TW201530685A (en) | Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus | |
| KR20140141436A (en) | semiconductor chip bonding apparatus and method using the same | |
| KR20110034769A (en) | Ball mount apparatus applying flux to substrate and ball mount method thereof | |
| JP4949114B2 (en) | Connection material coating apparatus and semiconductor device manufacturing method | |
| JP2003110234A (en) | Conductive ball mounting apparatus | |
| US20140048586A1 (en) | Innovative Multi-Purpose Dipping Plate | |
| KR101413545B1 (en) | Substrate convey method and substrate convey device | |
| Ee et al. | Innovative solutions to enhance the legacy equipments towards" one generation ahead" in flip chip BGA 0.8 mm ball pitch technology | |
| Manessis et al. | Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |