JP7022824B2 - Backup member setting device - Google Patents

Description

This specification relates to a backup member setting device.

As shown in Patent Document 1, there are two types of backup pins (backup members), soft pins and hard pins.
Further, as one type of the backup member setting device, the one shown in Patent Document 2 is known. As shown in Patent Document 2, the backup member setting device requires that the support portion (backup member) of the backup device be mounted with a bending prevention support portion for preventing the substrate from bending and a high-precision mounting. The position of the support part of the backup device is specified and determined while setting it to one of the specific part support parts that support the parts. Further, the backup member setting device prohibits the determination of the support portion position if the position of the support portion is within the region where the support portion interferes with the component on the support surface.

International Publication No. WO2014 / 136212 International Publication No. WO2004 / 103054

In the position setting of the backup member described in Patent Document 2 described above, there is a problem that it is not easy to appropriately set the support positions of the two types of backup members described in Patent Document 1 for each type. ..

In view of such circumstances, the present specification is a backup member setting device capable of appropriately setting the support position of the backup member for each type of backup member even if the backup device includes a plurality of types of backup members. To disclose.

The present specification sets the backup member in a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. In the backup member setting device, the backup member is removable from the facing surface of the backup plate facing the support surface of the substrate, supports the support surface of the substrate, and has a predetermined force as a shaft. When applied along the direction, the first member supporting the substrate in a state of not being deformed along the axial direction, and when the predetermined force is applied along the axial direction. It is composed of a second member that supports the substrate in a state of being contracted along the axial direction, and the backup member setting device is at a predetermined support position of the substrate supported by the backup member. The setting of the predetermined support position of the backup member on the substrate and the predetermined support position of the substrate based on the related component information which is the information of the component and / or the substrate information which is the information of the substrate. Disclosed is a backup member setting device including a selection unit that automatically selects the backup member that supports the above from the first member and the second member.
Further, the present specification describes the backup member in a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. A backup member setting device to be set, wherein the backup member is removable from the facing surface of the backup plate facing the support surface of the substrate, supports the support surface of the substrate, and has a predetermined force. When is applied along the axial direction, the first member that supports the substrate in a state where it is not deformed along the axial direction, and when the predetermined force is applied along the axial direction. In addition, the backup member setting device is composed of a second member that supports the substrate in a state of being contracted along the axial direction, and the backup member setting device is a predetermined support of the substrate supported by the backup member. The predetermined support position of the substrate is based on the component information including the information about the component mounted on the component mounting surface and the information about the component mounted on the support surface as the information of the component related to the position. Disclosed is a backup member setting device including a selection unit that automatically selects the backup member that supports each of the first member and the second member.
Further, the present specification describes the backup member in a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. A backup member setting device to be set, wherein the backup member is removable from the facing surface of the backup plate facing the support surface of the substrate, supports the support surface of the substrate, and has a predetermined force. When is applied along the axial direction, the first member that supports the substrate in a state where it is not deformed along the axial direction, and when the predetermined force is applied along the axial direction. In addition, the backup member setting device is composed of a second member that supports the substrate in a state of being contracted along the axial direction, and the backup member setting device is a predetermined support of the substrate supported by the backup member. Based on the component information which is the information of the component and / or the substrate information which is the information of the substrate related to the position, the backup member which supports the predetermined support position of the substrate, respectively, is the first member and the backup member. The substrate information includes a selection unit selected from the second member, and the substrate information includes the amount of bending of the substrate when the predetermined support position of the substrate of the backup member is pressed by a predetermined force. The selection unit discloses a backup member setting device that selects the backup member as the first member when the deflection amount is larger than the determination deflection amount.

Further, the present specification describes the backup member of a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. A backup member setting device to be set, wherein the backup member is removable from the facing surface of the backup plate facing the support surface of the substrate, supports the support surface of the substrate, and has a predetermined force. When is applied along the axial direction, the first member that supports the substrate in a state where it is not deformed along the axial direction, and when the predetermined force is applied along the axial direction. The backup member setting device is composed of a second member that supports the substrate in a state of being contracted along the axial direction, and the backup member setting device uses the backup member in the substrate. The substrate supported by the selection unit that selects the support position and either the first member or the second member by the input of the worker and the backup member selected by the input of the worker. The backup member that supports the support position of the substrate based on the component information that is the information of the component and / or the substrate information that is the information of the substrate, which is related to the support position of the first member, is the first member. Also disclosed is a backup member setting device including a determination unit that automatically determines whether or not the second member has been correctly selected.
Further, the present specification describes the backup member of a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. A backup member setting device to be set, wherein the backup member is removable from the facing surface of the backup plate facing the support surface of the substrate, supports the support surface of the substrate, and has a predetermined force. When is applied along the axial direction, the first member that supports the substrate in a state where it is not deformed along the axial direction, and when the predetermined force is applied along the axial direction. It is composed of a second member that supports the substrate in a state of being contracted along the axial direction, and the backup member setting device is the first member or the first member of the backup member to be used. The component mounting as information on the component related to the support position of the substrate supported by the backup member selected by the operator's input and the selection unit that selects one of the two components by the operator's input. The backup member that supports the support position of the substrate, respectively, is the first member and the first member based on the component information including the information about the component mounted on the surface and the information about the component mounted on the support surface. Disclosed is a backup member setting device including a determination unit that automatically determines whether or not a second member has been correctly selected.

According to the backup member setting device described above, the selection unit determines the predetermined support position of the backup member on the substrate based on the component information and / or the substrate information related to the predetermined support position of the substrate supported by the backup member. And the backup member that supports the predetermined support position of the substrate is automatically selected from the first member and the second member. Further, the selection unit includes component information including information on the component mounted on the component mounting surface and information on the component mounted on the support surface as information on the component related to the predetermined support position of the substrate supported by the backup member. It is also possible to automatically select a backup member that supports a predetermined support position of the substrate from the first member and the second member. Further, the selection unit uses the backup member as the first member to support the predetermined support position of the substrate based on the component information and / or the substrate information related to the predetermined support position of the substrate supported by the backup member. It can also be selected from the second member. In this way, the support position of the backup member can be automatically set for each type of backup member. Therefore, even if the backup device includes a plurality of types of backup members, the backup member setting device can appropriately perform the support position of the backup member for each type of backup member.

Further, according to the backup member setting device described above, the selection unit selects the support position of the backup member on the substrate and either the first member or the second member by input of the operator for the backup member to be used. do. Further, the determination unit supports the backup member of the board based on the component information and / or the board information related to the support position of the board supported by the backup member selected by the input of the operator. Automatically determines whether or not the member is correctly selected from the first member and the second member. Further, the selection unit can also select either the first member or the second member for the backup member to be used by the input of the operator. Further, the determination unit includes information on the parts mounted on the component mounting surface and components mounted on the support surface as information on the components related to the support position of the board supported by the backup member selected by the input of the operator. It is also possible to automatically determine whether or not the backup member that supports the support position of the substrate is correctly selected from the first member and the second member based on the component information including the information related to the above. As described above, in the backup member setting device, even if the support position of the backup member is manually set by the operator for each type of backup member, the operator can use the backup member based on the determination result by the determination unit. Can be selected correctly. Therefore, even if the backup device includes a plurality of types of backup members, the backup member setting device can appropriately perform the support position of the backup member for each type of backup member.

It is a top view which shows the component mounting machine 10 to which a backup member setting device is applied. It is sectional drawing which includes the backup apparatus 30 shown in FIG. It is a block diagram which shows the component mounting machine 10 shown in FIG. It is a block diagram which shows the host computer 70 shown in FIG. It is a top view which shows an example of the basic support positions P1-P9 of a substrate S. It is a top view which shows the basic support position P1-P9, the change support position P2a, P4a, P6a, P9a, the component Xaa, Xab, Xac, Xad on the support surface Sa side, and the component Xba on the component mounting surface Sb side. It is a flowchart which shows the program executed by the host computer 70 shown in FIG. It is a block diagram which shows the modification of the host computer 70 shown in FIG. It is a top view of the substrate S which shows the 1st range Aa, the 2nd range Ab, and the pin prohibition range Ac. It is a flowchart which shows the program executed by the host computer 70 shown in FIG. It is a flowchart which shows the program executed by the host computer 70 shown in FIG.

Hereinafter, the component mounting machine 10 to which the backup member setting device is applied will be described.

As shown in FIG. 1, the component mounting machine 10 is a so-called double track conveyor type component mounting machine, and has a base 11. The component mounting machine 10 includes a board transfer device 20, a backup device 30, a component supply device 40, a component transfer device 50, and a control device 60. The plurality of component mounting machines 10 are arranged side by side to form a component mounting line. As shown in FIG. 1, the component mounting machine 10 is connected to a host computer 70 (a backup member setting device). The host computer 70 supervises and controls the operation of each component mounting machine 10, and also supervises and manages each component mounting machine 10.

The substrate transfer device 20 conveys the substrate S along the X-axis direction (see FIG. 1), which is a predetermined direction. The backup device 30 positions and fixes the transferred board S in cooperation with the board transfer device 20. The component supply device 40 supplies components (for example, electronic components) provided on one side (or both sides) of the substrate transfer device 20 and mounted on the substrate S. The component transfer device 50 is arranged above these devices 20, 30, 40 and sucks and holds the parts supplied by the component supply device 40 by the suction nozzle 55, and sucks and holds the parts on the substrate transfer device 20. It is automatically mounted on the substrate S that is positioned and supported by.

The substrate transfer device 20 is a so-called double track conveyor system, and includes first and second conveyors 21 and 22 assembled in parallel with each other on a base 11.

As shown in FIG. 1, the first conveyor 21 includes first and second guide rails 21a and 21b, which are a pair of guide rails. The first and second guide rails 21a and 21b are extended along the first direction (X-axis direction), which is the direction (transport direction) for transporting the substrate S, and the second direction orthogonal to the first direction. They can move relative to each other along (Y-axis direction).

The first and second guide rails 21a and 21b are arranged so as to face each other in parallel and guide the substrate S in the transport direction. As shown in FIG. 2, locking portions 21a1,21b1 projecting inward are provided at the upper ends of the first and second guide rails 21a and 21b in the longitudinal direction (transportation direction), respectively. ing. In the first conveyor 21, first and second conveyor belts 21c and 21d provided in parallel with each other directly below the first and second guide rails 21a and 21b are arranged side by side. The first and second conveyor belts 21c and 21d support the substrate S and convey the substrate S in the conveying direction.

The first guide rail 21a and the first conveyor belt 21c of the first conveyor 21 are mainly attached to an elongated first mounting frame 21e extending along the X-axis direction, as shown in FIG. Both ends of the first mounting frame 21e are fixed to the base 11 via a pair of fixed support frames 21f. Further, the second guide rail 21b and the second conveyor belt 21d of the first conveyor 21 are attached to an elongated second mounting frame 21g extending along the X-axis direction. Both ends of the second mounting frame 21g are fixed to a pair of sliders 21k that can move on the pair of rails 12 fixed to the base 11 via the pair of moving support frames 21h. The rail 12 extends along the X-axis direction.

As a result, the second guide rail 21b moves along the Y-axis direction together with the second conveyor belt 21d directly underneath, and is positioned and fixed. Therefore, the first conveyor 21 can change the conveyor width (width in the Y-axis direction) corresponding to the substrate width (board width in the Y-axis direction) of the substrate S to be conveyed. The first and second mounting frames 21e and 21g are attached with first and second support plates 21i and 21j that abut and support the lower surfaces of the first and second conveyor belts 21c and 21d, respectively.

As shown in FIG. 1, the second conveyor 22 includes the first and second guide rails 22a and 22b, which are a pair of guide rails, like the first conveyor 21. The first and second guide rails 22a and 22b are extended along the first direction (X-axis direction), which is the direction (transport direction) for transporting the substrate S, and the second direction orthogonal to the first direction. They can move relative to each other along (Y-axis direction). The first and second guide rails 22a and 22b can move along the Y-axis direction like the second guide rail 21b of the first conveyor 21. In this way, the first and second guide rails 22a and 22b move along the Y-axis direction together with the first and second conveyor belts (not shown) directly underneath, and are positioned and fixed. Therefore, the second conveyor 22 can change the conveyor width (width in the Y-axis direction) corresponding to the substrate width (board width in the Y-axis direction) of the substrate S to be conveyed.

As shown in FIGS. 1 and 2, the base 11 is provided with a backup device 30 that pushes up and clamps (positioning and supports) the substrate S transported to a predetermined mounting position by the substrate transport device 20. The backup device 30 supports the substrate S from the support surface Sa on the opposite side of the component mounting surface Sb on which the component is mounted when the component is mounted on the substrate S conveyed by the pair of guide rails 21a and 21b. The backup device 30 includes a board support unit 31 that supports the board S and an elevating device 32 that raises and lowers the board support unit 31.

The board support unit 31 includes a backup plate 31a and a plurality of backup pins 31b. The backup plate 31a can reciprocate relatively while facing the support surface Sa of the substrate S. The backup plate 31a is formed, for example, in the shape of a square plate. The backup pin 31b is a plurality of backup members that can be attached to and detached from the facing surface 31a1 of the backup plate 31a facing the support surface Sa of the substrate S and support the support surface Sa of the substrate S. For example, a magnet is provided at the lower portion (base) of the backup pin 31b, and the backup pin 31b can be attached to and detached from the facing surface 31a1 by a magnetic force.

The backup pin 31b is composed of a hard type backup pin (shown in FIG. 2) whose tip is made of a relatively hard member (for example, a metal member) and a member whose tip is relatively soft (for example, a rubber member). It consists of soft type backup pins (not shown).

As shown in FIG. 2, the backup pin 31b is composed of a first member (hereinafter, may be referred to as a hard pin) 31b1 and a second member (hereinafter, may be referred to as a soft pin) 31b2. That is, the backup pin 31b is composed of two types, a first member 31b1 and a second member 31b2.

The first member 31b1 supports the substrate S in a state where it is not deformed along the axial direction when a predetermined force is applied along the axial direction. The first member 31b1 is a hard type backup pin whose tip portion 31b1a is made of a relatively hard member (for example, a metal member). The tip portion 31b1a contacts and supports the substrate S. The tip portion 31b1a is provided with a held portion (engaged portion) held by a holding portion (engaged portion) of a holding nozzle (not shown) of the component transfer device 50 described later.

The second member 31b2 supports the substrate S in a state of being contracted along the axial direction when the predetermined force is applied along the axial direction. The second member 31b2 is a soft type backup pin whose tip portion 31b2a is made of a relatively soft member (for example, a rubber member). The tip portion 31b2a contacts and supports the substrate S. The second member 31b2 further includes a tip portion 31b2b. Similar to the tip portion 31b1a, the tip portion 31b2b is provided with a held portion (engaged portion) held by the holding portion (engaging portion) of the holding nozzle (not shown) of the component transfer device 50 described later. ing.
The tip of the second member 31b2 is configured in the same manner as the tip 31b1a of the first member 31b1, and a member that can be deformed in the axial direction is provided at a portion between the tip and the base. May be good.

The substrate support unit 31 is composed of a square backup plate having a large number of holes formed on the upper surface thereof and a backup pin (backup member) that stands upright in the holes so as to support the substrate S. You may do so.

The elevating device 32 is composed of, for example, an air cylinder, and includes a rod 32a to which the four corners of the backup plate 31a are detachably assembled, and a cylinder body 32b for advancing and retreating the rod 32a.

The backup device 30 configured in this way holds the substrate support unit 31 in a lowered position (indicated by a two-dot chain line in FIG. 2) when the components are not mounted. On the other hand, when the components are mounted, that is, when the board S is transported to a predetermined mounting position by the board transport device 20 and stopped (shown by a solid line in FIG. 1; shown by a two-dot chain line in FIG. 2). The backup device 30 raises the substrate support unit 31 by the elevating device 32, pushes up the substrate S from below, and holds the substrate S in the ascending position (shown by the solid line in FIG. 2). Then, when the mounting of the components is completed, the backup device 30 lowers the board support unit 31 to the lowering position by the elevating device 32.

As shown in FIG. 1, the component mounting machine 10 has a component supply device 40 arranged on one side (or both sides) of the board transfer device 20. The parts supply device 40 is formed by arranging a large number of detachable parts supply cassettes 41 in parallel. The parts supply cassette 41 includes a main body 41a, a supply reel 41b provided at the rear of the main body 41a, and a parts take-out portion 41c provided at the tip of the main body 41a. Parts are enclosed in the supply reel 41b at a predetermined pitch, and an elongated tape (not shown) is wound and held. The component supply cassette 41 pulls out the tape at a predetermined pitch and sequentially feeds the components to the component extraction unit 41c. The parts supply device 40 is not only a cassette type but also a tray type in which parts are arranged on a tray.

As shown in FIG. 1, the component mounting machine 10 is provided with a component transfer device 50 above the substrate transfer device 20 (toward the front of the paper). The component transfer device 50 is, for example, an XY robot type. The component transfer device 50 includes a first frame 51 extending along the Y-axis direction, a second frame 52 extending along the X-axis direction, a support base 53, a mounting head 54, and a cylindrical suction nozzle 55. And an image pickup device 56.

The first frame 51 is provided on the base 11 so as to be movable along the X-axis direction. The second frame 52 is provided in the first frame 51 so as to be movable along the Y-axis direction. The support base 53 is detachably provided on the second frame 52. The mounting head 54 is provided on the support base 53 so as to be able to move up and down along the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction. The suction nozzle 55 is provided so as to project downward from the mounting head 54. The lower end of the suction nozzle 55 sucks and holds the component and releases the component held by suction. The image pickup device 56 captures the substrate S and the backup pin 31b from above, and the captured image data is output to the control device 60.

In the component transfer device 50, the suction nozzle 55 can be replaced with a holding nozzle (not shown) that holds the backup pin 31b. The holding nozzle has a holding portion (engaging portion) for holding the backup pin 31b, and the holding portion holds the backup pin 31b detachably.

Further, the base 11 is provided with an image pickup device 13. The image pickup device 13 monitors the state of the parts sucked by the suction nozzle 55, and the image data showing the state of the parts monitored by the image pickup device 13 is output to the control device 60.

The control device 60 has a microcomputer (not shown), and the microcomputer includes an input / output interface, a CPU, a RAM, and a ROM (all of which are not shown) connected via a bus. The CPU executes a predetermined program to control the mounting of electronic components on the board, and creates backup pin coordinate data and planting sequence data of the backup device 30 of the component mounting machine 10. The RAM temporarily stores variables necessary for executing the program, and the ROM stores the program.

An input device 61, a communication device 62, a storage device 63, a board transfer device 20, a backup device 30, a component supply device 40, a component transfer device 50, and an output device 64 are connected to the control device 60. The input device 61 is operated by an operator to input commands, data, and the like necessary for mounting the board. The communication device 62 is for communicating with other devices, and is connected to the host computer 70 via the LAN 15. The storage device 63 includes a system program that controls the entire device, a control program that controls each element of the device individually on the system program, a separate production program for the component mounting machine transmitted from the host computer 70, and a backup. It stores pin coordinate data (all information), created backup pin coordinate data, and planting sequence data (all data are information dedicated to the component mounting machine). The output device 64 displays status information, warnings, coordinate data of created backup pins, planting sequence data, and the like of the component mounting machine 10.

As shown in FIG. 4, the host computer 70 includes a control device 71, and the communication device 73 connected to the control device 71 is connected to the component mounting machine 10 and the board design CAD system (not shown) via the LAN 15. It is connected. The control device 71 has a microcomputer (not shown), and the microcomputer includes an input / output interface, a CPU, a RAM, and a ROM (all of which are not shown) connected via a bus. The CPU executes a program corresponding to the flowchart shown in FIG. 7 to select a support position / type (pin type) of the backup pin 31b of the backup device 30. That is, the host computer 70 has a function as a backup member setting device. The RAM temporarily stores variables necessary for executing the program, and the ROM stores the program.

An input device 72, a display device (output device) 74, and a rewritable storage device 75 are connected to the control device 71. The input device 72 is operated by an operator to input necessary information, data, and the like. The display device 74 displays various states related to control. In addition, another output unit (printing unit) may be provided in place of the display device 74 (or together with the display device 74).

The storage device 75 is centrally managed by the CAD data of the board acquired from the CAD system for board design, the production program created based on the CAD data, the backup pin coordinate data, the backup pin planting sequence data, and the host computer 70. It stores line configuration data, board information (described later), etc. of each component mounting line. The CAD data of the board includes the ID of the component to be mounted, the component type, and the mounting position (XY coordinates).

The control device 71 includes an acquisition unit 71a, a basic support position calculation unit 71b, and a selection unit 71c. The acquisition unit 71a acquires component information which is component information and / or board information which is information of the substrate S from the input device 72 and / and the storage device 75.

Specifically, the component information includes the component type, the height of the component, and the mounting position of the support surface component. The part type is the type of part. The component type is, for example, a press-fitted component type that is a type of a component (for example, a connector) that is press-fitted into the substrate S, a specific component that requires high-precision positioning (for example, QFP, SOP, BGA, CSP, etc.). There is a specific part type that is a type of (parts with a narrow terminal pitch). The support surface component mounting position is the position of the component mounted on the support surface Sa of the substrate S. The support surface component mounting position indicates a range corresponding to the contour of the component. The support surface component mounting position is indicated by, for example, XY coordinates.

The substrate information includes the amount of deflection of the substrate S at a predetermined position of the substrate S, through-hole information, and the size of the substrate S (vertical / horizontal length, thickness; hereinafter, may be referred to as the substrate size). The amount of bending of the substrate S at a predetermined position of the substrate S is the amount of bending of the substrate S when the predetermined support position of the substrate S of the backup pin 31b is pressed with a predetermined force. The predetermined force is, for example, a pressing force required for mounting a component by the component transfer device 50 on the substrate S. The amount of deflection of the substrate S may be obtained by experiment or by simulation. The through-hole information is the position coordinates and the hole diameter of the through-hole Ss.

The basic support position calculation unit 71b calculates the basic support position, which is the basic position (initial position) of the support position that supports the substrate S, from the board information input from the acquisition unit 71a, particularly the board size. For example, the basic support position calculation unit 71b calculates a plurality of points (XY coordinates) set in a matrix at predetermined intervals with the center of the substrate S as the origin as the basic support position including the origin. Specifically, as shown in FIG. 5, the basic support position is positions P1-P9. Note that FIG. 6 shows the basic support positions P1-P9, the modified support positions P2a, P4a, P6a, P9a, the parts Xaa, Xab, Xac, Xad on the support surface Sa side, and the parts Xba on the component mounting surface Sb side. There is.

The selection unit 71c provides backup pins 31b that support the predetermined support positions of the substrate S, respectively, based on the component information and / or the substrate information related to the predetermined support positions of the substrate S supported by the backup pins 31b. Select from the first member 31b1 and the second member 31b2.

Specifically, the selection unit 71c inputs the basic support position from the basic support position calculation unit 71b, and for each basic support position P1-P9, the backup pin 31b that supports the basic support positions P1-P9 is first. Select from the member 31b1 and the second member 31b2.

More specifically, the selection unit 71c first selects the backup pin 31b at the basic support position as the second member 31b2. That is, first, the backup pins 31b of all the basic support positions P1-P9 are selected for the second member 31b2. After that, the selection unit 71c changes the backup pin 31b at the basic support position to the first member 31b1 or maintains it in the second member 31b2 according to the following conditions.

When the basic support position is within the press-fitting range A1, that is, when the component type related to the basic support position is the press-fitting component type, the selection unit 71c selects the backup pin 31b of the basic support position as the first member 31b1. do. The press-fitting range A1 is set to a range wider than the contour range of the part Xba, which is a press-fitting component type, by a predetermined distance. For example, since the basic support positions P7-P9 are within the press-fitting range A1, the backup pin 31b is selected (changed) as the first member 31b1. Since the basic support position P9 overlaps with the support surface component mounting position of the component Xaa, the tip of the backup pin 31b interferes with the component Xaa at that position, so the position is changed to the changed support position P9a which is the support surface component non-mounting position. It is preferable to do so. According to this, when the component Xba, which is a press-fitting component type, is press-fitted into the substrate S, it is possible to prevent the substrate S (product substrate) from bending or warping.

Further, when the amount of bending at the basic support position is larger than the determined amount of bending, the selection unit 71c selects the backup pin 31b at the basic support position as the first member 31b1. For example, the amount of bending at the basic support positions P1, P4, P7 is larger than the determined bending amount. The amount of bending at the basic support positions P2, P3, P5, P6, P8, P9 is smaller than the determined bending amount. Therefore, the backup pins 31b of the basic support positions P1, P4, and P7 are selected (changed) as the first member 31b1. Since the basic support position P4 overlaps with the support surface component mounting position of the component Xad, the tip of the backup pin 31b interferes with the component Xad at that position, so the position is changed to the changed support position P4a which is the support surface component non-mounting position. It is preferable to do so. The backup pin 31b of the basic support positions P2, P3, P5, P6, P8, P9 may be the second member 31b2. According to this, it is possible to prevent the substrate S (product substrate) from bending or warping due to its own weight.

When the basic support position, which is a predetermined support position of the substrate S of the backup pin 31b, does not overlap with the support surface component mounting position, the selection unit 71c selects the backup pin 31b at the basic support position as the first member 31b1. .. For example, since the basic support position P5 does not overlap with the support surface component mounting position, the backup pin 31b is selected (changed) as the first member 31b1. According to this, the place where there is no pre-attached part of the support surface Sa can be supported by the first member 31b1. Therefore, when the component is mounted on the substrate S, it is possible to prevent the substrate S (product substrate) from bending or warping.

When the basic support position, which is the predetermined support position of the substrate S of the backup pin 31b, overlaps with the support surface component mounting position, and the height of the component is smaller than the determination height, the selection unit 71c is at the basic support position. The backup pin 31b is selected as the second member 31b2. For example, since the basic support position P3 overlaps with the support surface component mounting position of the component Xab and the height of the component Xab is smaller than the determination height, the backup pin 31b is selected (maintained) as the second member 31b2. According to this, the place where the basic support position has the pre-attached part of the support surface Sa can be supported by the second member 31b2. Therefore, when the component is mounted on the substrate S, it is possible to prevent the substrate S (product substrate) from bending or warping.

When the basic support position, which is the predetermined support position of the substrate S of the backup pin 31b, overlaps with the support surface component mounting position, and the height of the component is larger than the determination height, the selection unit 71c is at the basic support position. Select to prohibit the use of the backup pin 31b. For example, since the basic support position P2 overlaps with the support surface component mounting position of the component Xac and the height of the component Xac is larger than the determination height, it is selected to prohibit the use of the backup pin 31b of the basic support position P2. .. Since the use of the backup pin 31b is prohibited, the basic support position P2 is set to the changed support position P2a, which is the support surface component mounting position (support surface component mounting position (component height is smaller than the determination height)). It is preferable to change it. At this time, the backup pin 31b may be either the first member 31b1 or the second member 31b2. According to this, even if the basic support position can support the place where the pre-attached component of the support surface Sa is located by the second member 31b2, if the height of the component is larger than the determination height, the backup pin 31b Is prohibited. Therefore, the tip of the backup pin 31b can be evenly brought into contact with the substrate S. Therefore, when the component is mounted on the substrate S, it is possible to prevent the substrate S (product substrate) from bending or warping.

Further, the selection unit 71c selects to prohibit the use of the backup pin 31b at the basic support position when the basic support position, which is the predetermined support position of the substrate S of the backup pin 31b, overlaps with the through hole position. Is preferable. For example, the basic support position P6 overlaps with the position of the through hole Ss. At this time, it is preferable that the predetermined support position of the substrate S of the backup pin 31b is provided at the changed support position P6a, which is a position separated by a predetermined distance from the through-hole position (the basic support position). At this time. If the changed support position P6a is within the support surface component mounting position, the backup pin 31b is selected (changed) as the second member 31b2. If the changed support position P6a is within the support surface component non-mounting position, the backup pin 31b is selected (changed) as the first member 31b1. According to this, the support position of the backup pin 31b can be set to a position that does not overlap with the through-hole position.

Further, when the basic support position, which is a predetermined support position of the substrate S of the backup pin 31b, overlaps with the position of the specific component type on the component mounting surface Sb side, the selection unit 71c uses the backup pin 31b at the basic support position. It is preferable to select the first member 31b1. According to this, it is possible to support the specific component so that the specific component does not shift in position due to an impact at the time of mounting.

The selection unit 71c may move the initially set basic support position of the backup pin 31b to set a new support position (changed support position) and set the pin type of the backup pin 31b. For example, when the basic support position is within the press-fitting range A1 and is within the support surface component mounting position, it is within a predetermined range from the basic support position, is within the press-fitting range A1, and is within the support surface component mounting position. The new position, which is, may be set as the change support position. At this time, the backup pin 31b is selected as the first member 31b1. The support surface component non-mounting position is a position on the support surface Sa where the component is not mounted.

Further, when the amount of deflection of the basic support position is larger than the determined amount of deflection and is within the support surface component mounting position, a new position within a predetermined range from the basic support position and the support surface component unmounted position is set. It may be set as a change support position. At this time, the backup pin 31b is selected as the first member 31b1.

In this way, the control device 71 can automatically and reliably select the support position, pin type, and pin arrangement prohibition of the backup pin 31b.

Further, the operation of the control device 71 of the host computer 70, which is the backup member setting device described above, will be described with reference to the flowchart shown in FIG.

In step S102, the control device 71 acquires component information which is component information and / or board information which is information of the substrate S from the input device 72 and / and the storage device 75 by the processing of the acquisition unit 71a described above. .. The control device 71 is a basic support position (initial position) which is a basic position (initial position) of the support position for supporting the board S from the board information acquired by the above-mentioned processing of the basic support position calculation unit 71b in step S104, particularly the board size. Is calculated.

In step S106-124, the control device 71 supports the predetermined support position of the substrate S based on the component information and / or the substrate information related to the predetermined support position of the substrate S supported by the backup pin 31b. The backup pin 31b to be used is selected from the first member 31b1 and the second member 31b2.

In step S106, the control device 71 selects the backup pin 31b at the basic support position as the second member 31b2 (soft pin, soft type).

When the basic support position is not within the support surface component mounting position and is within the press-fitting range A1, the control device 71 determines “NO” or “YES” in steps S108 and 110, and backs up the basic support position. The pin 31b is selected (set) as the first member 31b1 (hard pin, hard type) (step S112).

When the basic support position is not within the support surface component mounting position, the press-fitting range A1, and the deflection amount of the basic support position is larger than the determination deflection amount, the control device 71 "NO" in steps S108, 110, 114. , "NO", "YES", and the backup pin 31b at the basic support position is selected (set) as the first member 31b1 (hard pin, hard type) (step S112).

When the basic support position is not within the support surface component mounting position, the press-fitting range A1, and the deflection amount of the basic support position is equal to or less than the determination deflection amount, the control device 71 is set in steps S108, 110, 114. It is determined as "NO", "NO", "NO", and the backup pin 31b at the basic support position is selected (maintained) as the second member 31b2 (soft pin, soft type).

When the basic support position is within the support surface component mounting position and within the press-fitting range A1, the control device 71 determines “YES” or “YES” in steps S108 and 116, and determines the support position as the basic support. The backup pin 31b is selected (set) as the first member 31b1 (hard pin, hard type) while changing from the position to the change support position (step S124).

In the control device 71, when the basic support position is within the support surface component mounting position, not within the press-fitting range A1, and the deflection amount of the basic support position is larger than the determination deflection amount, "YES" in steps S108, 116, 118. , "NO", "YES", the support position is changed from the basic support position to the change support position, and the backup pin 31b is selected (set) as the first member 31b1 (step S124).

In the control device 71, the basic support position is within the support surface component mounting position, not within the press-fitting range A1, the deflection amount of the basic support position is less than or equal to the determination deflection amount, and the component height is smaller than the determination height ( If it is low), it is determined as "YES", "NO", "NO", "YES" in steps S108, 116, 118, 120, and the backup pin 31b at the basic support position is used as the second member 31b2 (soft pin, Select (maintain) as a soft type).

In the control device 71, the basic support position is within the support surface component mounting position, the press-fitting range is not within A1, the deflection amount of the basic support position is less than or equal to the determination deflection amount, and the component height is larger than the determination height ( If it is high), it is determined as "YES", "NO", "NO", "NO" in steps S108, 116, 118, 120, and the placement of the backup pin 31b at the basic support position is prohibited (step S122). ..

Then, in step S126, the control device 71 determines the support position and pin type of the backup pin 31b selected as described above, displays them on the display device 74, and displays the backup pin data for each component mounting machine 10 as a component. It may be transmitted to the mounting machine 10.

According to the backup member setting device (host computer 70) described above, the selection unit 71c is a substrate based on component information and / or substrate information related to a predetermined support position of the substrate S supported by the backup pin 31b. A backup pin 31b that supports each of the predetermined support positions of S is selected from the first member 31b1 and the second member 31b2. In this way, the support position of the backup pin 31b can be automatically set for each type of backup pin 31b. Therefore, the backup member setting device (control device 71) can appropriately perform the support position of the backup pin 31b for each type of the backup pin 31b even if the backup device 30 includes a plurality of types of backup pins 31b. ..

Further, since the backup pin 31b to be used can be correctly selected and the substrate S can be appropriately supported by the backup pin 31b when mounting the component, it is possible to reduce the number of defective substrates.

Next, a modified example of the host computer 70 (backup member setting device) will be described with reference to FIG.

The control device 71 includes an acquisition unit 71d1, a calculation unit 71d2, a display control unit 71d3, a setting unit 71d4, and a determination unit 71e. The selection unit 71d is composed of an acquisition unit 71d1, a calculation unit 71d2, a display control unit 71d3, and a setting unit 71d4. An input device 72, a communication device 73, a display device (output device) 74, and a storage device 75 are connected to the control device 71.

The selection unit 71d selects either the first member 31b1 or the second member 31b2 for the backup pin 31b to be used by the input of the operator. The selection unit 71d includes a calculation unit 71d2, a display control unit 71d3, and a setting unit 71d4.

The acquisition unit 71d1 acquires component information and / or board information from the input device 72 and / and the storage device 75 by the processing of the acquisition unit 71a described above.

The calculation unit 71d2 is a first range Aa (hereinafter referred to as a hard pin support range) which is a range of support positions of the substrate S supported by the first member 31b1 based on the component information and / or the board information input from the acquisition unit 71d1. The second range Ab (hereinafter, may be referred to as a soft pin support range), which is the range of the support position of the substrate S supported by the second member 31b2, is calculated.

As shown in FIG. 9, the first range Aa is composed of a press-fitting range Aa1, a bending suppressing range Aa2, and a support surface component non-mounting position Aa3. The press-fitting range Aa1 is defined in the same manner as the press-fitting range A1 described above. The deflection suppression range Aa2 is a range in which the amount of deflection of the substrate S (described above) when the substrate S is pressed at an arbitrary location with a predetermined force is larger than the above-mentioned determination deflection amount. The support surface component non-mounting position Aa3 is a position (range) of the support surface Sa on which the component is not mounted.

As shown in FIG. 9, the second range Ab is composed of the support surface component mounting position Ab1. The support surface component mounting position Ab1 is a position (range) on the support surface Sa on which the component is mounted.

Note that FIG. 9 also shows the pin prohibition range Ac. The pin prohibition range Ac includes the position (range corresponding to the position) Ac1 of the part whose component height is higher than the determination height, and the through hole position (range corresponding to the position) Ac2.

The display control unit 71d3 displays the board S on the display device 74 including the first range Aa and the second range Ab calculated by the calculation unit 71d2 (see FIG. 9). The display control unit 71d3 can also display the pin prohibition range Ac.

The setting unit 71d4 is set by the operator by designating the arrangement positions of the first member 31b1 and the second member 31b2 on the substrate S displayed on the display device 74 by the display control unit 71d3. That is, the operator specifies (selects) the placement positions of the first member 31b1 and the second member 31b2 with reference to the displayed first range Aa, second range Ab, and pin prohibition range Ac. ..

The setting unit 71d4 can store the selection pin information, which is the information of the backup pin 31b selected by the input of the operator, in the storage device 75. The selection pin information is the selection support position (XY coordinates) which is the support position of the selected backup pin 31b, and the selection pin type which is the selected pin type.

The determination unit 71e supports each backup pin that supports the support position of the board S based on the component information and / or the board information related to the support position of the board supported by the backup pin 31b selected by the input of the operator. It is determined whether or not 31b is correctly selected from the first member 31b1 and the second member 31b2. The determination unit 71e determines whether or not the backup pin 31b selected by the selection unit 71d is correctly set from the first member 31b1 and the second member 31b2 based on the component information and / or the board information. ..

The determination unit 71e acquires the selection pin information (selection support position, selection pin type), and when the pin type corresponding to the selection support position and the selection pin type match based on the component information and / or the board information, the above Judge that the selection is correct. On the other hand, when the pin type corresponding to the selected support position and the selected pin type do not match, the determination unit 71e determines that the above selection is incorrect.

Further, the operation of the control device 71 of the host computer 70, which is the backup member setting device described above, will be described with reference to the flowcharts shown in FIGS. 10 and 11.

In step S202, the control device 71 acquires component information and / or board information from the input device 72 and / or the storage device 75 by the processing of the acquisition unit 71d1 described above.

In step S204-208, the control device 71 calculates the first range Aa by the processing of the calculation unit 71d2 described above. In step S210, the control device 71 calculates the second range Ab by the processing of the calculation unit 71d2 described above. Further, in step S212, the control device 71 sets the pin prohibition range Ac to the position of the component whose component height is higher than the determination height (range corresponding to the position) Ac1 and the through-hole position (range corresponding to the position). Calculated from Ac2.

In step S214, the control device 71 displays the first range Aa, the second range Ab, and the pin prohibition range Ac on the display device 74 by the processing of the display control unit 71d3 described above. In step S216, the control device 71 has the first member 31b1 and the second member 31b2 designated by the operator on the substrate S displayed on the display device 74 by the display control unit 71d3 by the processing of the setting unit 71d4 described above. The placement position of is set as the support position. In step S216, the control device 71 stores the selection pin information, which is the information of the backup pin 31b selected by the input of the operator, in the storage device 75.

In this way, the control device 71 can select (manually select) the support position, pin type, and pin arrangement prohibition of the backup pin 31b by the input of the operator.

Further, the control device 71 acquires the selection pin information selected as described above from the storage device 75 in step S250.

Then, in step S252-268, the control device 71 has component information and / or board information related to the support position of the board supported by the backup pin 31b selected by the input of the operator by the determination unit 71e described above. Based on the above, it is determined whether or not the backup pin 31b that supports the support position of the substrate S is correctly selected from the first member 31b1 and the second member 31b2.

More specifically, when the selection support position is within the press-fitting range Aa1 and the selection pin type is a hard type, the control device 71 determines “YES” or “YES” in steps S252 and 254. Judgment and display that the selection pin type for the selection support position is correct (step S256). On the other hand, when the selected support position is within the press-fitting range Aa1 and the selected pin type is a soft type, the control device 71 determines “YES” or “NO” in steps S252 and 254, and the selected support position is selected. It is determined and displayed that the selection pin type for is incorrect (step S258).

When the deflection amount of the selected support position is larger than the determination deflection amount and the selection pin type is a hard type, the control device 71 determines "YES" or "YES" in steps S260 and 254, and the selection support position is selected. It is determined and displayed that the selection pin type for is correct (step S256). On the other hand, when the deflection amount of the selection support position is larger than the determination deflection amount and the selection pin type is a soft type, the control device 71 determines "YES" or "NO" in steps S252 and 254 and selects. It is determined and displayed that the selection pin type for the support position is incorrect (step S258).

When the selected support position is not within the support surface component mounting position and the selection pin type is a hard type, the control device 71 determines “NO” or “YES” in steps S262 and 254, and selects the support position. It is determined and displayed that the selection pin type for is correct (step S256). On the other hand, when the selected support position is not within the support surface component mounting position and the selection pin type is a soft type, the control device 71 determines “NO” or “NO” in steps S262 and 254 and selects. It is determined and displayed that the selection pin type for the support position is incorrect (step S258).

When the selected support position is within the support surface component mounting position and the height of the component at the selected support position is smaller than the determination height and the selection pin type is a soft type, the control device 71 steps. In S262, 264, and 266, it is determined that "YES", "YES", and "YES", and it is determined and displayed that the selection pin type for the selection support position is correct (step S256). On the other hand, when the selected support position is within the support surface component mounting position and the height of the component at the selected support position is smaller than the determination height, and the selection pin type is a hard type, the control device 71 , "YES", "YES", and "NO" are determined in steps S262, 264, and 266, and it is determined and displayed that the selection pin type for the selection support position is incorrect (step S258).

When the selected support position is within the support surface component mounting position and the height of the component at the selected support position is larger than the determination height, the control device 71 sets "YES" and "NO" in steps S262 and 264. Judgment is made, and it is determined and displayed that the selected support position is within the pin prohibition range (step S268).

Further, according to the backup member setting device (host computer 70), the selection unit 71d selects either the first member 31b1 or the second member 31b2 for the backup pin 31b to be used by the input of the operator. Further, the determination unit 71e supports the support position of the substrate S based on the component information and / or the substrate information related to the support position of the substrate S supported by the backup pin 31b selected by the input of the operator. It is determined whether or not the backup pin 31b to be backed up is correctly selected from the first member 31b1 and the second member 31b2. As described above, even if the support position of the backup pin 31b is manually set by the operator for each type of the backup pin 31b, the backup member setting device is based on the determination result by the determination unit 71e. Can correctly select (reselect) backup members. Therefore, even if the backup device 30 includes a plurality of types of backup pins 31b, the backup member setting device can appropriately perform the support position of the backup pin 31b for each type of the backup pin 31b.

Further, since the backup pin 31b to be used can be correctly selected and the substrate S can be appropriately supported by the backup pin 31b when mounting the component, it is possible to reduce the number of defective substrates.

The backup member setting device described above was the host computer 70, but the control device 60 of the component mounting machine 10 may be the backup member setting device.

10 ... component mounting machine, 21a, 21b ... pair of guide rails, 30 ... backup device, 31a ... backup plate, 31a1 ... facing surface, 31b ... backup member (backup pin), 31b1 ... first member, 31b2 ... second member , 60 ... Control device, 70 ... Backup member setting device (host computer), 71c, 71d ... Selection unit, 71d2 ... Calculation unit, 71d3 ... Display control unit, 71d4 ... Setting unit, 71e ... Judgment unit, S ... Board, Sb ... component mounting surface, Sa ... support surface, X-axis direction ... first direction, Y-axis direction ... second direction.

Claims (10)

A backup member setting device that sets the backup member in a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. There,
The backup member is
Detachable from the facing surface of the backup plate facing the supporting surface of the substrate and supporting the supporting surface of the substrate.
and,
When a predetermined force is applied along the axial direction, the first member that supports the substrate in a state of not being deformed along the axial direction and the predetermined force are applied along the axial direction. It is composed of a second member that supports the substrate in a state of being contracted along the axial direction when the substrate is formed.
The backup member setting device is based on the component information which is the information of the component and / or the substrate information which is the information of the substrate , which is related to a predetermined support position of the substrate supported by the backup member. The setting of the predetermined support position of the backup member and the selection of the backup member for supporting the predetermined support position of the substrate from the first member and the second member are automatically performed. Backup member setting device including the selection unit implemented in . A backup member setting device that sets the backup member in a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. There,
The backup member is
Detachable from the facing surface of the backup plate facing the supporting surface of the substrate and supporting the supporting surface of the substrate.
and,
When a predetermined force is applied along the axial direction, the first member that supports the substrate in a state of not being deformed along the axial direction and the predetermined force are applied along the axial direction. It is composed of a second member that supports the substrate in a state of being contracted along the axial direction when the substrate is formed.
The backup member setting device mounts information on the component mounted on the component mounting surface and mounting on the support surface as information on the component related to a predetermined support position of the substrate supported by the backup member. A selection unit that automatically selects the backup member that supports the predetermined support position of the substrate from the first member and the second member based on the component information including the information about the component. Backup member setting device including. A backup member setting device that sets the backup member in a backup device including a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. There,
The backup member is
Detachable from the facing surface of the backup plate facing the supporting surface of the substrate and supporting the supporting surface of the substrate.
and,
When a predetermined force is applied along the axial direction, the first member that supports the substrate in a state of not being deformed along the axial direction and the predetermined force are applied along the axial direction. It is composed of a second member that supports the substrate in a state of being contracted along the axial direction when the substrate is formed.
The backup member setting device is based on the component information which is the information of the component and / or the substrate information which is the information of the substrate, which is related to a predetermined support position of the substrate supported by the backup member. Includes a selection unit that selects the backup member that supports each of the predetermined support positions from the first member and the second member.
The substrate information includes the amount of bending of the substrate when the predetermined support position of the substrate of the backup member is pressed by a predetermined force.
The selection unit is a backup member setting device that selects the backup member as the first member when the amount of deflection is larger than the determined amount of deflection . The component information includes a component type that is a type of the component.
The selection unit of claim 1 -claim 3 selects the backup member as the first member when the component type is a press-fitting component type which is the type of the component to be press-fitted into the substrate. The backup member setting device according to any one of the items . The component information includes a support surface component mounting position which is a position of the component mounted on the support surface of the substrate.
The selection unit selects the backup member as the first member when the predetermined support position of the substrate of the backup member does not overlap with the support surface component mounting position. The backup member setting device according to any one of the items. The component information includes a support surface component mounting position, which is the position of the component mounted on the support surface of the substrate, and the height of the component.
When the predetermined support position of the substrate of the backup member overlaps with the support surface component mounting position and the height of the component is smaller than the determination height, the selection unit uses the backup member as the second support member. The backup member setting device according to any one of claims 1 to 4 , which is selected as a member. The selection unit prohibits the use of the backup member when the predetermined support position of the substrate of the backup member overlaps with the support surface component mounting position and the height of the component is larger than the determination height. The backup member setting device according to claim 6 , wherein the backup member setting device is selected. A backup member setting device that sets the backup member of a backup device provided with a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. There,
The backup member is
Detachable from the facing surface of the backup plate facing the supporting surface of the substrate and supporting the supporting surface of the substrate.
and,
When a predetermined force is applied along the axial direction, the first member that supports the substrate in a state of not being deformed along the axial direction and the predetermined force are applied along the axial direction. It is composed of a second member that supports the substrate in a state of being contracted along the axial direction when the substrate is formed.
The backup member setting device is
With respect to the backup member to be used, a selection unit that selects the support position of the backup member on the substrate and either the first member or the second member by input of an operator.
The said, based on the component information which is the information of the component and / or the board information which is the information of the substrate, which is related to the support position of the substrate supported by the backup member selected by the input of the operator. A backup member including a determination unit that automatically determines whether or not the backup member that supports the support position of the substrate is correctly selected from the first member and the second member. Setting device. A backup member setting device that sets the backup member of a backup device provided with a plurality of backup members that support the board from a support surface opposite to the component mounting surface on which the component is mounted when the component is mounted on the board. There,
The backup member is
Detachable from the facing surface of the backup plate facing the supporting surface of the substrate and supporting the supporting surface of the substrate.
and,
When a predetermined force is applied along the axial direction, the first member that supports the substrate in a state of not being deformed along the axial direction and the predetermined force are applied along the axial direction. It is composed of a second member that supports the substrate in a state of being contracted along the axial direction when the substrate is formed.
The backup member setting device is
A selection unit that selects either the first member or the second member of the backup member to be used by input of an operator, and a selection unit.
As information on the component related to the support position of the substrate supported by the backup member selected by the input of the operator, information on the component mounted on the component mounting surface and mounting on the support surface. It is automatically determined whether or not the backup member that supports the support position of the substrate is correctly selected from the first member and the second member based on the component information including the information about the component. A backup member setting device including a determination unit determined by. The selection unit
Based on the component information which is the information of the component and / or the substrate information which is the information of the substrate, the first range which is the range of the support position of the substrate supported by the first member and / or the second member. A calculation unit that calculates a second range, which is a range of support positions of the substrate supported by
A display control unit that displays the substrate on the display device including the first range and the second range calculated by the calculation unit.
A setting unit for designating and setting the arrangement position of the first member and the second member on the substrate displayed by the display control unit is included.
The determination unit determines whether or not the backup member set by the setting unit is correctly set from the first member and the second member based on the component information and / or the substrate information. The backup member setting device according to claim 8 .

Images