WO2019237637A1 - Module de puissance intelligent hautement intégré et dispositif électrique - Google Patents

Module de puissance intelligent hautement intégré et dispositif électrique Download PDF

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Publication number
WO2019237637A1
WO2019237637A1 PCT/CN2018/112733 CN2018112733W WO2019237637A1 WO 2019237637 A1 WO2019237637 A1 WO 2019237637A1 CN 2018112733 W CN2018112733 W CN 2018112733W WO 2019237637 A1 WO2019237637 A1 WO 2019237637A1
Authority
WO
WIPO (PCT)
Prior art keywords
power
module
control
driving chip
pfc
Prior art date
Application number
PCT/CN2018/112733
Other languages
English (en)
Chinese (zh)
Inventor
刘东子
冯宇翔
Original Assignee
广东美的制冷设备有限公司
美的集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810610733.5A external-priority patent/CN110601549A/zh
Priority claimed from CN201810610942.XA external-priority patent/CN110601552A/zh
Priority claimed from CN201810618247.8A external-priority patent/CN110601554A/zh
Application filed by 广东美的制冷设备有限公司, 美的集团股份有限公司 filed Critical 广东美的制冷设备有限公司
Publication of WO2019237637A1 publication Critical patent/WO2019237637A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the fan power driving chip and the fan power module are packaged as an integrated chip.
  • the highly-integrated intelligent power module further includes a packaging case for packaging the mounting substrate, the first heat dissipation layer, the first insulation layer, the control module, the rectifier bridge, the PFC power switch module, and a plurality of power modules. .
  • a power switch module 30, configured to correct the DC power output by the rectifier bridge 20;
  • a control module 10 configured to output a control signal
  • the mounting substrate 100 may be implemented by using a circuit board made of materials such as a PCB board, a lead frame, cardboard, a half-glass fiberboard, and a glass fiber board, and the shape of the mounting substrate 100 may be integrated in a highly integrated intelligent power module.
  • the specific positions and sizes of the control module 10, the rectifier bridge 20, the power switch module 30 and the plurality of power modules 40 on the mounting substrate 100 may be determined in a square shape, but are not limited to a square shape.
  • the control module 10, the rectifier bridge 20, the power switch module 30, and multiple power modules 40 can be arranged on one mounting substrate 100 to be integrated into a highly integrated intelligent power module, or can be divided into two mounting substrates. After 100, it is encapsulated into a whole through the encapsulation material.
  • the application can shorten the control module 10 and the rectifier bridge 20, the power switch module 30, and multiple modules without wires.
  • the above functional modules are integrated on a mounting substrate 100, which can improve the integration degree of the integrated intelligent power modules and achieve multiple Loads, such as integrated drive control of fans and compressors, reduce the size of the electronic control board and facilitate installation.
  • the components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced.
  • the control module 10 drives the power switch module 30 to correct the DC voltage output by the rectifier bridge 20 and outputs the corrected DC voltage to the control module 10 to provide a stable operating voltage for the control module 10.
  • the DC power source after power factor correction is also performed. It is output to each power module 40, and a corresponding control signal is output to the control module 10, so as to control a plurality of power modules 40 to drive the corresponding load.
  • the arrangement positions of the rectifier bridge 20, the power switch module 30, and the plurality of power modules 40 on the second board surface 120 are merely exemplary, and are not used to limit the three.
  • the position relationship that is, in the actual application process, a person skilled in the art can adaptively adjust the positions of the three according to actual needs, and the control module 10, the rectifier bridge 20, the power switch module 30, and a plurality of power modules 40
  • the number of components can be one or more, and the number shown in FIG. 1 is also not used for the number of components in the circuit module.
  • the control module 10 includes an MCU, a PFC driving chip 11, a fan power driving chip 12, and a compressor power driving chip 13.
  • the first control end of the MCU and the The signal input terminals of the PFC drive chip 11 are connected; the second control terminals of the MCU are connected to the signal input terminals of the fan power drive chip 12 one-to-one; the third control terminals of the MCU are connected to all The signal input terminals of the compressor power driving chip 13 are connected one-to-one correspondingly; the output terminals of the fan power driving chip 12 are connected one-to-one correspondingly to the controlled ends of the fan driving power module 40; A plurality of output terminals of the compressor power driving chip 13 and a plurality of controlled terminals of the compressor driving power module 40 are connected one to one correspondingly.
  • the first heat dissipation layer 60A may be located inside the packaging case 70 or at least partially exposed outside the packaging case 70.
  • the rectification is performed.
  • the heat generated by the bridge 20, the power switch module 30, and the plurality of power modules 40 is conducted to the first heat dissipation layer 60A through the first insulation layer 50A, and then to the package housing 70 through the first heat dissipation layer 60A, and then passes through the package housing.
  • 70 conducts heat to the air, and accelerates the heat dissipation rate of the rectifier bridge 20, the power switch module 30, and the multiple power modules 40.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Rectifiers (AREA)

Abstract

L'invention concerne un module de puissance intelligent hautement intégré et un dispositif électrique. Le module de puissance intelligent hautement intégré comprend : un pont redresseur (20) destiné à être connecté à une source d'alimentation en courant alternatif et à redresser la source d'alimentation en courant alternatif en une source d'alimentation en courant continu ; un module de commande (10) pour délivrer en sortie un premier signal de commande et un second signal de commande ; un module de commutation de puissance (30) pour fonctionner selon le premier signal de commande, de telle sorte qu'un circuit PFC composé correspondant effectue une correction de facteur de puissance sur la source d'alimentation en courant continu ; une pluralité de modules de puissance (40) pour attaquer des charges correspondantes en vue d'un fonctionnement selon le second signal de commande et la source d'alimentation en courant continu à facteur de puissance corrigé ; et un substrat de montage (100), le module de commande (10), le pont redresseur (20), le module de commutation de puissance (30) et la pluralité de modules de puissance (40) étant intégrés sur le substrat de montage (100). L'invention résout le problème selon lequel, lorsqu'un panneau de commande électrique utilise une pluralité de composants discrets, il existe un grand nombre de composants, ce qui conduit à un assemblage compliqué d'un climatiseur, et la consommation d'énergie de ce dernier est élevée, et la chaleur émise est également importante, ce qui ne permet pas d'obtenir un rendement thermique élevé du climatiseur et de profiter de l'économie d'énergie du climatiseur.
PCT/CN2018/112733 2018-06-13 2018-10-30 Module de puissance intelligent hautement intégré et dispositif électrique WO2019237637A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201810610733.5 2018-06-13
CN201810610942.X 2018-06-13
CN201810610733.5A CN110601549A (zh) 2018-06-13 2018-06-13 高集成智能功率模块及电器设备
CN201810618247.8 2018-06-13
CN201810610942.XA CN110601552A (zh) 2018-06-13 2018-06-13 高集成智能功率模块及电器设备
CN201810618247.8A CN110601554A (zh) 2018-06-13 2018-06-13 高集成智能功率模块及电器设备

Publications (1)

Publication Number Publication Date
WO2019237637A1 true WO2019237637A1 (fr) 2019-12-19

Family

ID=68842732

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/112733 WO2019237637A1 (fr) 2018-06-13 2018-10-30 Module de puissance intelligent hautement intégré et dispositif électrique

Country Status (1)

Country Link
WO (1) WO2019237637A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202111629U (zh) * 2011-06-30 2012-01-11 山东朗进科技股份有限公司 智能变频模块
US20130093296A1 (en) * 2011-10-18 2013-04-18 Steven Peter Camilleri Methods and apparatus for reducing size and costs of motor controllers for electric motors
CN105444329A (zh) * 2014-07-31 2016-03-30 上海三菱电机·上菱空调机电器有限公司 空调、空调用变频控制基板及其切换方法
CN206160388U (zh) * 2016-10-27 2017-05-10 广东美的制冷设备有限公司 空调器及空调器的控制板
CN107131561A (zh) * 2017-06-12 2017-09-05 广东美的暖通设备有限公司 空调器及其的电控板、空调器中电控板的防护工艺

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202111629U (zh) * 2011-06-30 2012-01-11 山东朗进科技股份有限公司 智能变频模块
US20130093296A1 (en) * 2011-10-18 2013-04-18 Steven Peter Camilleri Methods and apparatus for reducing size and costs of motor controllers for electric motors
CN105444329A (zh) * 2014-07-31 2016-03-30 上海三菱电机·上菱空调机电器有限公司 空调、空调用变频控制基板及其切换方法
CN206160388U (zh) * 2016-10-27 2017-05-10 广东美的制冷设备有限公司 空调器及空调器的控制板
CN107131561A (zh) * 2017-06-12 2017-09-05 广东美的暖通设备有限公司 空调器及其的电控板、空调器中电控板的防护工艺

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