WO2019237915A1 - Carte de commande électronique à haute intégration et appareil électrique - Google Patents

Carte de commande électronique à haute intégration et appareil électrique Download PDF

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Publication number
WO2019237915A1
WO2019237915A1 PCT/CN2019/088851 CN2019088851W WO2019237915A1 WO 2019237915 A1 WO2019237915 A1 WO 2019237915A1 CN 2019088851 W CN2019088851 W CN 2019088851W WO 2019237915 A1 WO2019237915 A1 WO 2019237915A1
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WO
WIPO (PCT)
Prior art keywords
highly integrated
substrate
control board
board according
compressor
Prior art date
Application number
PCT/CN2019/088851
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English (en)
Chinese (zh)
Inventor
甘弟
冯宇翔
Original Assignee
广东美的制冷设备有限公司
美的集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201820918456.XU external-priority patent/CN209181195U/zh
Priority claimed from CN201810606829.4A external-priority patent/CN110594988A/zh
Priority claimed from CN201821791662.5U external-priority patent/CN208806253U/zh
Priority claimed from CN201811288813.XA external-priority patent/CN109300883B/zh
Priority claimed from CN201822277624.4U external-priority patent/CN209562922U/zh
Priority claimed from CN201811645539.7A external-priority patent/CN109413846A/zh
Application filed by 广东美的制冷设备有限公司, 美的集团股份有限公司 filed Critical 广东美的制冷设备有限公司
Publication of WO2019237915A1 publication Critical patent/WO2019237915A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present application relates to the field of electrical appliance manufacturing, and in particular, to a highly integrated electrical control board and electrical appliances.
  • the air-conditioning electronic control is mainly composed of MCU (micro-control unit), fan IPM (intelligent power module), compressor IPM, PFC (power factor correction) circuit, and corresponding PFC current protection circuit, PFC sampling and IPM sampling amplifier circuit.
  • MCU micro-control unit
  • fan IPM intelligent power module
  • compressor IPM compressor IPM
  • PFC power factor correction
  • PFC sampling and IPM sampling amplifier circuit corresponding PFC current protection circuit
  • PFC sampling and IPM sampling amplifier circuit are operated on the electric control board.
  • MCU control implementation the fan IPM and compressor IPM are respectively composed of 6 IGBT (insulated gate bipolar transistor) switching devices, 6 FRD (high-voltage phaser) and corresponding drive ICs.
  • the PFC circuit consists of a rectifier bridge, an inductor, a capacitor and
  • the PFC switch part (driving IC, IGBT, FRD, diode) is composed of a corresponding sampling resistor in the fan IPM, compressor IPM and PFC circuits.
  • the existing electrical control design is to install and install all circuit structures on a single-layer printed circuit board, that is, the circuit structure is installed on the same surface of the printed circuit board to form an electrical control board.
  • the above circuit structure includes a strong electric component and a weak electric component.
  • the strong electric component is usually separated from the weak electric component, and the isolation of the strong and weak electric components needs to increase the area of the electric control board to achieve , Further increasing the area of the electrical control board, and causing the signal lines connected between the MCU and power devices such as IPM to grow, and there is a hidden danger of cross-talk during operation.
  • the components such as the fan IPM and compressor IPM in the circuit structure generate high heat.
  • the design of the electronic control board also needs to consider the heat dissipation factor, which further increases the area of the electronic control board.
  • the large area of the electric control board severely limits the process of miniaturization of the electric control and affects the development of miniaturization of the electric appliance.
  • This application is intended to at least partially alleviate or solve at least one of the problems mentioned above.
  • the present application proposes a highly integrated electrical control board.
  • the highly integrated electric control board includes: a base; a strong electric element and a weak electric element, the strong electric element and the weak electric element are arranged on the base, and the strong electric element and the weak electric element are perpendicular to the The substrates are oppositely arranged. Therefore, the highly integrated electrical control board can realize the isolation of strong and weak electrical components, effectively reduce the strong and weak electrical interference, and can effectively reduce the area of the highly integrated electrical control board, while having good heat dissipation performance.
  • the substrate is a printed circuit board
  • the strong electric component is disposed on the front of the printed circuit board.
  • the strong electric component includes a highly integrated IPM, and the highly integrated IPM integrates a fan IPM and Compressor IPM, the weak current component is disposed on the back of the printed circuit board, the weak current component includes an MCU, a PFC sampling amplifier circuit, an IPM sampling amplifier circuit, and a PFC current protection circuit, and the weak current component is highly integrated with the The IPM is electrically connected.
  • the highly integrated electric control board has at least one of the following advantages: it has an effective area, is conducive to the miniaturization of the electric control, and has a low cost; it can realize the isolation of strong and weak electrical components and can effectively reduce the strong and weak electrical Interference; with good heat dissipation performance.
  • the highly integrated IPM includes a half-packaged substrate and a circuit structure disposed on a front surface of the substrate, and the half-packaged substrate is fixed to the printed circuit board through a direct plug-in pin. on.
  • the half-packaging encapsulation layer wraps the circuit structure and the front side of the substrate, and exposes the back side of the substrate. Therefore, the heat dissipation capability of the highly integrated IPM can be improved, so that the highly integrated electronic control board has good heat dissipation performance.
  • the highly integrated IPM further integrates a PFC circuit, a sampling resistor, and a thermistor, and the PFC circuit includes a rectifier bridge and a PFC switch section. Therefore, the highly integrated IPM has a higher integration degree, reduces the area of the highly integrated electric control board, and is beneficial to miniaturization of the electric control.
  • the highly integrated electronic control board further includes a PFC capacitor and a PFC inductor, and the PFC capacitor and the PFC inductor are disposed on a front surface of the printed circuit board. Therefore, the area of the printed wiring board can be effectively used, which is beneficial to the miniaturization of the highly integrated electronic control board.
  • the orthographic projection of the MCU on the printed circuit board is located within a range of the orthographic projection of the highly integrated IPM on the printed circuit board.
  • the printed circuit board is provided with a via hole, and the weak electrical component and the highly integrated IPM are electrically connected through the via hole.
  • the electrical connection between the weak current component and the highly integrated IPM can be achieved, and the signal transmission distance between the above components is short, which effectively prevents interference from entering the signal path.
  • the printed circuit board has a plurality of heat dissipation holes, and the heat dissipation holes are located in a region corresponding to the highly integrated IPM and are arranged around the MCU.
  • the heat dissipation hole is beneficial for diffusing the heat generated by the highly integrated IPM to the outside, thereby improving the heat dissipation performance of the highly integrated electronic control board.
  • a copper layer is disposed in the heat dissipation hole.
  • the thermal conductivity of copper is strong, so the heat dissipation performance of the highly integrated electrical control board can be further improved.
  • tin metal is disposed in the copper layer. Therefore, the heat dissipation performance of the highly integrated electronic control board can be further improved.
  • the base includes a first substrate and a second substrate, the first substrate and the second substrate are opposite to each other, and the ferroelectric element is disposed on the first substrate near the second substrate.
  • the strong electric element includes a highly integrated IPM, the highly integrated IPM integrates a compressor IPM and a fan IPM, and the weak electric element is disposed on the second substrate near a first substrate.
  • the weak current element includes an MCU, the strong current element is electrically connected to the weak current element, and a packaging material is filled between the first substrate and the second substrate.
  • the highly integrated electrical control board is provided with two layers of upper and lower substrates, a strong electric component is disposed on a first substrate, a weak electric component is disposed on a second substrate, and a packaging material is filled between the first and second substrates, thereby achieving The upper and lower layers are completely separated by strong and weak electricity.
  • the electrical connection between the controllers and the short signal transmission distance between the MCU and the highly integrated IPM are conducive to simplifying the layout and routing of the electrical control board, and can effectively avoid interference in the signal path and interference from strong electricity to weak electricity. Therefore, the highly integrated electrical control board of the present application has higher long-term reliability, longer service life, and lower manufacturing cost.
  • a PFC circuit is further disposed on the first substrate, and the PFC circuit includes a rectifier bridge and a PFC switch portion. Therefore, the integration degree of the highly integrated electronic control board can be further improved, thereby further reducing its manufacturing cost.
  • the first substrate is further provided with a sampling resistor and a bootstrap capacitor. Therefore, the integration degree of the highly integrated electronic control board can be further improved, thereby further reducing its manufacturing cost.
  • the highly integrated electrical control board further includes: a first pin group, a second pin group, and a third pin group, the first pin group and the second pin group
  • the first pin group, the second pin group, and the third pin group are disposed on the other side of the highly integrated electric control board.
  • Each pin group includes multiple pins. Therefore, the strong and weak electric pins in the highly integrated electric control board are completely separated, and the work is more stable.
  • the pins in the first pin group and the pins in the second pin group are electrically connected to the highly integrated IPM.
  • the pins in the third pin group are electrically connected to the MCU. Therefore, the strong and weak electric pins in the highly integrated electric control board are completely separated, and the work is more stable.
  • the highly integrated electronic control board further includes: a bracket, the bracket is adapted to fix the first substrate and the second substrate.
  • the first substrate is a metal substrate. Therefore, the heat dissipation of the strong electric components on the first substrate can be further facilitated, thereby further improving the reliability and service life of the highly integrated electric control board.
  • the second substrate is an FR-4 board. Therefore, the manufacturing cost of the highly integrated electronic control board can be further reduced.
  • the encapsulation material includes silica gel and / or polyurethane. This can further facilitate the electrical isolation and protection of the strong and weak electrical components in the module, thereby further improving the reliability and service life of the highly integrated electrical control board.
  • the highly integrated IPM (ie, the integrated air-conditioning controller) includes: a substrate; a device layer formed on the substrate, and the device layer includes: disposed on the substrate The rectifier bridge; the PFC switch portion disposed on the substrate and connected to the rectifier bridge, wherein the PFC switch portion includes a PFC switch tube and a PFC diode; and the driver is disposed above the substrate
  • a compressor driving circuit of a compressor wherein the compressor driving circuit includes first to sixth switching tubes and first to sixth fast recovery diodes connected in parallel with the first to sixth switching tubes;
  • the highly integrated IPM ie, integrated air-conditioning controller
  • IPM integrated air-conditioning controller
  • the PFC switch includes a SiC MOSFET (SiC metal-oxide semiconductor field effect transistor), a SiC IGBT, or a GaN-based HEMT (High Electron Mobility Transistor) device, and the PFC diode is made of Si ⁇ ⁇ Control devices.
  • SiC MOSFET SiC metal-oxide semiconductor field effect transistor
  • SiC IGBT SiC IGBT
  • GaN-based HEMT High Electron Mobility Transistor
  • the first to sixth switching transistors include SiC, MOSFET, SiC, or GaN HEMT devices, and the first to sixth fast recovery diodes are devices made of Si materials.
  • the first to sixth reverse conducting IGBTs are devices made of Si material.
  • the rectifier bridge, the PFC switch part, the compressor driving circuit, the fan driving circuit, the compressor control chip and the fan control chip are connected by a metal wire and a metal. Jumpers are connected.
  • the highly integrated IPM (that is, the integrated air-conditioning controller) is a DIP package (Dual In-line Package).
  • a bottom of the substrate is exposed outside the DIP package.
  • the components in the rectifier bridge, the PFC switch part, the compressor driving circuit, and the fan driving circuit are bare chips, and the compressor control chip and the fan control chip All are die.
  • the first heat dissipation plate has a heat dissipation fold.
  • the filling layer includes a high thermal conductivity DIP encapsulant.
  • the present application proposes an electrical appliance.
  • the electric appliance includes the highly integrated electric control board described above. Therefore, the electric appliance has all the features and advantages of the highly-integrated electric control board described above, and is not repeated here.
  • the size of the electric appliance is small, which meets the development requirements of miniaturization of the electric appliance, and has good performance.
  • the electrical appliance may be an air conditioner, a washing machine, a refrigerator, or an induction cooker.
  • the air conditioner, the washing machine, the refrigerator, or the induction cooker by adopting the highly integrated electric control board of the above embodiment, the space occupied by the electric control board can be effectively reduced, and the electric control board has higher reliability and longer service life.
  • FIG. 1 shows a schematic structural diagram of a highly integrated electric control board according to an embodiment of the present application
  • FIG. 2 shows a top view of a highly integrated IPM according to an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of a highly integrated IPM according to an embodiment of the present application.
  • FIG. 5 shows a schematic structural diagram of a highly integrated electric control board according to an embodiment of the present application
  • FIG. 6 shows a top view of a highly integrated electronic control board according to an embodiment of the present application
  • FIG. 7 shows a top view of a highly integrated electrical control board according to another embodiment of the present application.
  • FIG. 8 shows a schematic structural diagram of a highly integrated electric control board according to an embodiment of the present application.
  • FIG. 9 shows a schematic diagram of electrical connections between pins in a first pin group and a second pin group in a highly integrated electrical control board according to an embodiment of the present application
  • FIG. 10 shows a schematic diagram of the electrical connection of the third pin group in the highly integrated electrical control board according to an embodiment of the present application
  • FIG. 11 is a schematic structural view of a highly integrated electric control board according to an embodiment of the present application from another perspective;
  • FIG. 12 is a schematic structural view of a highly integrated electric control board according to an embodiment of the present application from another perspective;
  • FIG. 13 is a schematic structural view of a highly integrated electronic control board according to an embodiment of the present application from another perspective;
  • FIG. 14 shows a block diagram of a highly integrated IPM according to an embodiment of the present application.
  • FIG. 15 shows a schematic circuit diagram of a power module according to a specific embodiment of the present application.
  • 16 is a schematic cross-sectional structure diagram of a power module according to a specific embodiment of the present application.
  • FIG. 17 shows a block diagram of a highly integrated IPM according to a specific embodiment of the present application.
  • FIG. 18 shows a block diagram of an air conditioner according to an embodiment of the present application.
  • the present application proposes a highly integrated electrical control board.
  • the highly integrated electric control board includes a base, a strong electric element, and a weak electric element, wherein the strong electric element and the weak electric element are disposed on the base, and the strong electric element and the weak electric element are in a direction perpendicular to the base Relative settings. Therefore, the highly integrated electrical control board can realize the isolation of strong and weak electrical components, effectively reduce the strong and weak electrical interference, and can effectively reduce the area of the highly integrated electrical control board, while having good heat dissipation performance.
  • the existing electronic control board includes a printed circuit board 100 and a circuit structure, and the circuit structures are all disposed on the same surface of the printed circuit board 100.
  • the circuit structure includes: MCU 410, PFC circuit 300, PFC sampling amplifier circuit and IPM sampling amplifier circuit 420, PFC current protection circuit 430, compressor IPM 500 and fan IPM 600. Because the above circuit structures are all disposed on the same side of the printed circuit board, the occupied area is large, which results in a larger area of the electric control board.
  • the above circuit structure includes strong electric components (for example, compressor IPM 500 and fan IPM 600) and weak electric components (for example, MCU 410, PFC sampling amplifier circuit and IPM sampling amplifier circuit 420, and PFC current protection circuit 430).
  • strong and weak electrical interference usually the strong and weak electrical components are set up, and the isolation of the strong and weak electrical components needs to increase the area of the electrical control board to further increase the area of the electrical control board, and cause MCU and IPM, etc.
  • the signal lines connected between the power devices grow, and there is a hidden danger of crosstalk during operation.
  • components such as the fan IPM 600 and compressor IPM 500 in the circuit structure generate severe heat during operation.
  • the design of the electronic control board also needs to consider the heat dissipation factor, which further increases the area of the electronic control board.
  • the large area of the electric control board severely limits the process of miniaturization of the electric control and affects the development of miniaturization of the electric appliance.
  • the strong electric element and the weak electric element in the highly integrated electric control board are oppositely disposed in a direction perpendicular to the substrate.
  • the strong electric component and the weak electric component can be respectively located on the front and back sides of the base (as shown in FIG. 1), or the base includes two substrates, and the strong electric component and the weak electric component are located on the two substrates and are oppositely disposed. (As shown in Figure 8).
  • the strong and weak electric components can be completely separated, the strong and weak electric interference can be effectively reduced, and the area of the highly integrated electric control board can be effectively reduced, while having good heat dissipation performance.
  • the strong electric component and the weak electric component may be respectively located on the front and back sides of the base.
  • the highly integrated electric control board includes a base, a strong electric component, and a weak electric component 400.
  • the substrate may be a printed circuit board 100, that is, the highly integrated electric control board includes the printed circuit board 100, a strong electric component, and a weak electric component 400.
  • the strong electric component is disposed on the front of the printed circuit board 100, and the strong electric component includes a highly integrated IPM. 200, highly integrated IPM 200 integrates fan IPM and compressor IPM (refer to Figure 2).
  • the weak current component 400 is located on the back of the printed circuit board 100.
  • the weak current component 400 includes MCU 410, PFC sampling amplifier circuit and IPM sampling amplifier circuit 420, and The PFC current protection circuit 430, and the weak current component 400 is electrically connected to the highly integrated IPM 200 (electrically connected traces are not shown in the figure). Therefore, the highly integrated electric control board has at least one of the following advantages: it has an effective area, is conducive to the miniaturization of the electric control, and has a low cost; it can realize the isolation of strong and weak electrical components and can effectively reduce the strong and weak electrical Interference; with good heat dissipation performance.
  • the strong and weak electric components on the electric control board are relatively speaking.
  • the power of the strong electric component is higher, the passing current is higher, the heat is higher and the frequency is lower, and the power of the weak electric component is higher.
  • PFC circuit, intelligent power module, etc. are strong electric components
  • micro control units are weak electric components.
  • the highly integrated electronic control board integrates structures such as highly integrated IPM, MCU, PFC sampling amplifier circuit, IPM sampling amplifier circuit, and PFC current protection circuit.
  • the strong integrated IPM is located on one side of the printed circuit board
  • the weak current MCU, PFC sampling amplifier circuit and IPM sampling amplifier circuit, and the PFC current protection circuit are located on the other side of the printed circuit board.
  • the design of the double-layer printed circuit board It can realize the complete separation of strong and weak electric components, reduce strong and weak interference and signal interference, and can significantly reduce the area of highly integrated electric control board, which is conducive to the process of miniaturization of electric control.
  • the highly integrated IPM 200 includes a half-packaged substrate 210, and a circuit structure 220 (as shown in FIG. 3) provided on the front surface of the substrate 210, and a half-packaged substrate 210.
  • the in-line pins 10 are fixed on the printed circuit board 100 (as shown in FIG. 1), that is, the highly integrated IPM is a DIP package. As a result, the heat dissipation performance of the highly integrated IPM can be improved.
  • the highly integrated IPM 200 integrates the compressor IPM and the fan IPM, and the compressor IPM and the fan IPM are disposed on the front surface of the substrate 210.
  • the compressor IPM includes a compressor power switch section 510 and a drive IC 50A, among which the compressor power switch section 510 includes 6 IGBTs 30B and 6 FRD 40B.
  • the compressor's drive IC 50A integrates a PFC switch section 340 Drive circuit.
  • the fan IPM includes a fan power switch part 610 and a driving IC 50B. Among them, the fan power switch part 610 includes 6 IGBTs 30C and 6 FRD 40C. Therefore, the highly integrated IPM has a high degree of integration.
  • the highly integrated IPM may further integrate a PFC circuit, a sampling resistor 60 and a thermistor 70, and the above-mentioned components are disposed on the front surface of the substrate 210.
  • the PFC circuit includes a PFC rectifier bridge 330 and a PFC switch section 340, wherein the PFC rectifier bridge 330 includes four diodes 20A, and the PFC switch section 340 includes a diode 20B, an IGBT 30A, and an FRD 40A.
  • the sampling resistor 60 includes a PFC sampling resistor 60A, a compressor sampling resistor 60B, and a fan sampling resistor 60C.
  • the thermistor 70 is used to detect the temperature inside the highly integrated IPM.
  • the pins 10 of the highly integrated IPM may be separated by strong and weak electrical methods.
  • the pin 10 includes a weak electric pin 10A and a strong electric pin 10B, and the highly integrated IPM is fixed on the printed circuit board through the in-line pin 10, so that the strong and weak electric elements can be prevented from affecting each other. Therefore, the highly integrated IPM has a high degree of integration, which can reduce the area of the highly integrated electric control board, which is beneficial to the process of miniaturization of electric control.
  • the structure of the fan IPM, the compressor IPM, and the PFC circuit is integrated to form a highly integrated IPM.
  • the highly integrated IPM adopts a semi-encapsulated structure, and the highly integrated IPM is disposed on the front of the printed circuit board.
  • the MCU, the PFC sampling amplifier circuit and the IPM sampling amplifier circuit and the PFC current protection circuit are arranged on the back of the printed circuit board, so that the highly integrated IPM can reduce the area of the highly integrated electronic control board and increase the height
  • the heat dissipation performance of the integrated electric control board, and the strong and weak electric components are arranged in layers, which can further reduce the area of the highly integrated electric control board, which is beneficial to the miniaturization of the electric control, and can realize the isolation of the strong and weak electric components, effectively reducing Interference from strong and weak electricity.
  • the highly integrated IPM 200 includes a half-packaged substrate 210, a circuit structure 220, and a packaging layer 230.
  • the substrate 210 may be an aluminum substrate.
  • the circuit structure 220 is disposed on the front surface of the substrate 210.
  • the circuit structure 220 includes the integrated components described above, for example, compressor IPM, fan IPM, PFC circuit, etc., and the encapsulation layer 230 wraps the circuit structure 220 and The front surface of the substrate 210 and the rear surface of the substrate 210 are exposed. Therefore, the heat dissipation capability of the highly integrated IPM can be improved, so that the highly integrated electronic control board has good heat dissipation performance.
  • the highly-integrated IPM is packaged in a plastic package, so that the packaging layer formed by the plastic package can perform electrical isolation and protection.
  • the encapsulation layer 230 may be formed of a resin.
  • the encapsulation layer 230 may be formed of a thermosetting resin or a thermoplastic resin, so that the encapsulation layer may have a good quality. Sealing effect.
  • the highly integrated IPM uses a semi-encapsulated double-insertion in-line packaging structure, which has good heat dissipation performance, and greatly improves the integration degree and reliability of the IPM, reduces costs, and reduces The area of the integrated electronic control board.
  • the highly integrated electronic control board may further include a PFC capacitor 310 and a PFC inductor 320, and the PFC capacitor 310 and the PFC inductor 320 and the highly integrated IPM 200 are both disposed on a printed circuit board. 100A on the front. Due to the large volume of the PFC capacitor and the PFC inductor in the PFC circuit, setting the PFC capacitor and the PFC inductor outside the highly integrated IPM can prevent the volume of the highly integrated IPM from being too large, so that the area of the printed circuit board can be effectively used. Conducive to the miniaturization of this highly integrated electronic control board.
  • the MCU 410, the PFC sampling amplifier circuit and the IPM sampling amplifier circuit 420, and the PFC current protection circuit 430 are all disposed on the back 100B of the printed circuit board.
  • the orthographic projection of MCU 410 on printed circuit board 100 is located within the range of orthographic projection of highly integrated IPM 200 on printed circuit board 100, that is, the MCU 410 and highly integrated The position of IPM 200 corresponds.
  • the MCU and the highly integrated IPM are respectively disposed on the back and front of the printed circuit board, and the relative arrangement can shorten the signal between the two Transmission distance, which can effectively avoid interference into the signal path.
  • the printed circuit board 100 is provided with a via (not shown in the figure), and the weak electrical component 400 and the highly integrated IPM 200 are electrically connected through the via.
  • the electrical connection between the weak current component and the highly integrated IPM can be achieved, and the signal transmission distance between the above components is short, which effectively prevents interference from entering the signal path.
  • the printed circuit board 100 performs double-sided wiring (not shown in the figure), and the wiring connects the highly integrated IPM200 and the weak current component 400 through the above-mentioned vias, thereby realizing the use function of the highly integrated electronic control board.
  • the fixation of the highly integrated IPM 200 and the weak current component 400 on both sides of the printed circuit board 100 and the electrical connection on both sides of the printed circuit board 100 can be achieved by wave soldering.
  • a highly integrated electric control board in which the strong and weak electric components are arranged in layers can be obtained.
  • the printed circuit board 100 has a plurality of heat dissipation holes 80, which are located in a region corresponding to the highly integrated IPM 200 and are arranged around the MCU 410.
  • the heat dissipation holes are beneficial for diffusing the heat generated by the highly integrated IPM to the outside, thereby further improving the heat dissipation performance of the highly integrated electronic control board.
  • a copper layer may be further disposed in the heat dissipation hole 80.
  • the thermal conductivity of copper is strong, so the heat dissipation performance of the highly integrated electrical control board can be further improved.
  • tin metal may be further provided in the copper layer. Therefore, the heat dissipation performance of the highly integrated electronic control board can be further improved.
  • the base may further include two substrates, and the strong electric component and the weak electric component are respectively located on the two substrates and are oppositely disposed.
  • the highly integrated electric control board includes a base, a strong electric component 1000, a weak electric component 400, and a packaging material.
  • the base includes a first substrate 110 and a second substrate 120, that is, the highly integrated electrical control board includes the first substrate 110, the second substrate 120, the strong electric component 1000, the weak electric component 400, and a packaging material.
  • the two substrates 120 are opposite to each other; a strong electric component 1000 is disposed on a surface of the first substrate 110 close to the second substrate 120.
  • the strong electric component 1000 includes a highly integrated IPM 200, and the highly integrated IPM 200 integrates a compressor IPM and a fan IPM
  • the weak electric component 400 is disposed on a surface of the second substrate 120 close to the first substrate 110, and the weak electric component 400 includes a micro control unit (ie, MCU) 410; a sealing material is filled between the first substrate 110 and the second substrate 120.
  • MCU micro control unit
  • the upper and lower layers of the substrate are provided, and the strong electrical components are disposed on the first substrate, the weak electrical components are disposed on the second substrate, and the package is filled between the first and second substrates. Material, thereby achieving complete strong and weak electrical separation of the upper and lower layers.
  • the electrical connection between the controllers and the short signal transmission distance between the MCU and the highly integrated IPM are conducive to simplifying the layout and routing of the electrical control board, and can effectively avoid interference in the signal path and interference from strong electricity to weak electricity. Therefore, the highly integrated electronic control board of the present application has higher long-term reliability, longer service life, and lower manufacturing cost.
  • the first substrate 110 is further provided with a rectifier bridge and a power factor correction device (not shown in the drawings).
  • the highly integrated IPM can be further integrated.
  • PFC circuit PFC circuit includes rectifier bridge and power factor correction device (ie PFC switch part).
  • the rectifier bridge and the power factor correction device By integrating the rectifier bridge and the power factor correction device on the first substrate 110, the area required for the substrate can be further reduced.
  • the rectifier bridge and the IPM may be respectively set on the power factor correction device.
  • Both sides; or the rectifier bridge and IPM are set around the power factor correction device. This can further facilitate the power factor correction device to evenly transmit the emitted heat to the heat dissipation substrate (the first substrate), reduce the temperature field non-uniformity of the heat dissipation substrate, accelerate the heat exchange between the heat dissipation substrate and the outside world, and further It is beneficial to reduce the maximum temperature inside the module and increase the reliability and life of the module.
  • the first substrate 110 is further provided with a sampling resistor and a bootstrap capacitor.
  • the highly integrated IPM can further integrate the sampling resistor and bootstrap capacitor.
  • a device or a high-voltage component such as a sampling resistor and a bootstrap capacitor (not shown in the figure) that generate large heat on the first substrate 110 on the upper layer, it is possible to ensure that the upper and lower layers are completely separated from each other, thereby further Increase module reliability and life.
  • the setting positions of the sampling resistor and the bootstrap capacitor are not particularly limited, as long as it can avoid or reduce the impact of heat from other highly heat-generating devices, those skilled in the art can choose according to actual needs.
  • the second substrate 120 further includes a weak electrical component such as a peripheral circuit adapted to the MCU.
  • a weak electrical component such as a peripheral circuit adapted to the MCU.
  • the weak current components such as the MCU and its peripheral circuits
  • the second substrate 120 can be double-sidedly routed, vias can be distributed on both sides of the second substrate 120 for pins to pass through, and wave soldering is used to realize the second substrate 120 and the first substrate 110. Fixed and electrical connections.
  • each of the strong electric components in the first substrate 110 may implement a semi-encapsulated structure by using a potting method. Due to the relatively concentrated heat source in the module after the high integration, the semi-encapsulated structure of each component can directly contact the heat sink and the substrate with high thermal conductivity, thereby improving the heat dissipation ability.
  • the highly integrated electrical control of the present application further includes a first pin group, a second pin group, and a third pin group.
  • the first pin group and the second pin group are disposed on one side of the highly integrated electric control board, and the third pin group is disposed on the other side of the highly integrated electric control board.
  • the first pin group and the second pin group Both and the third pin group include multiple pins.
  • the first pin group includes a plurality of first pins 700
  • the second pin group includes a plurality of second pins 800
  • the third pin group includes a plurality of third pins 900.
  • the pins in the first pin group and the pins in the second pin group are electrically connected to the highly integrated intelligent power module 200. That is, the plurality of pins 700 and the plurality of pins 800 are connected to the highly integrated intelligent power module 200.
  • the bonding wire 15 can be used to connect the pin 700, the pin 800, and the first substrate 110, so that the pin 700, the pin 800, and the highly integrated intelligent power module 200 on the first substrate 110 are electrically connected, and Pin 700 is used as the signal transmission pin between the MCU and the highly integrated intelligent power module, and there is no electrical connection between pin 700 and the electrical control; pin 800 is used as the power pin of the highly integrated module.
  • the pin 800 may include a rectifier bridge part pin, a PFC input and output pin, a DC bus voltage input pin, a compressor UVW three output pin, and a fan UVW three output pin.
  • the pin 800 is not electrically connected to the second substrate 120 under the highly integrated module.
  • the pins in the third pin group are electrically connected to the micro control unit 410. That is, a plurality of pins 900 are connected to the micro control unit 410.
  • the bonding wire 15 can be used to connect the pin 900 and the second substrate 120, so that the pin 900 is electrically connected to the micro control unit 410 on the second substrate 120, and the pin 900 is applied between the electric control board For signal transmission, there is no binding wire connection between pin 900 and highly integrated intelligent power module 200.
  • the highly integrated electrical control board sets the first and third pins on one side of the highly integrated electrical control board, and sets the second pin on the other side of the highly integrated electrical control board.
  • the strong and weak pins in the electric control board can be completely separated by adopting the electrical connection relationship of the pins as described above, so that the highly integrated electric control board has higher reliability and service life.
  • a copper foil 27 may be provided at a corresponding contact portion of the pins. For example, as shown in FIGS.
  • the copper foil 27 may be provided at a contact portion between the first pin 700 and the second substrate 120, a contact portion between the second pin 800 and the external electric control board 34, and a third pin 900. A contact portion with the second substrate 120 and the external electrical control board 34.
  • the highly integrated electronic control board of the present application further includes a bracket 91.
  • the bracket 91 is adapted to fix the first substrate 110 and the second substrate 120.
  • the specific shape of the bracket 91 is not particularly limited, as long as the first substrate 110 and the second substrate 120 opposite to each other can be fixed.
  • FIGS. 11 to 13 wherein FIG. 11 is a side view of the highly integrated electric control board, FIG. 12 is a front view of the highly integrated electric control board, and FIG.
  • the bracket 91 may be a frame-shaped bracket
  • the first substrate 110 may be fixed in the frame-shaped bracket 91
  • the second substrate may be fixed in the lower portion of the bracket 91.
  • the first pin group, the second pin group, and Each pin portion in the third pin group is embedded in a side wall of the bracket 91. Therefore, while ensuring the overall structure of the highly integrated electric control board, the area of the electric control board and the volume of the corresponding heat sink can be further reduced, and the electric control cost can be reduced.
  • the material of the first substrate 110 is not particularly limited, and those skilled in the art may select according to actual needs.
  • the first substrate 110 is a metal substrate, such as aluminum, copper, or the like.
  • aluminum substrate or a copper substrate with excellent thermal conductivity it can be further beneficial.
  • the heat dissipation of the high-power-consumption and strong-current elements on the first substrate 110 is set, thereby further improving its reliability and service life.
  • the material of the second substrate 120 is not particularly limited, and those skilled in the art may select according to actual needs.
  • the second substrate 120 is mainly provided with a weak power component (such as an MCU and its peripheral circuits) with lower power consumption.
  • the second substrate 120 may use an FR4 board. Therefore, the manufacturing cost of the highly integrated electronic control board is lower.
  • the specific type of the packaging material is not particularly limited, as long as it can effectively isolate and protect each element on the first substrate 110 and the second substrate 120.
  • the encapsulant may include silicone and / or polyurethane.
  • the existing integration method is usually to install the rectifier bridge, PFC switch, compressor IPM, and fan IPM on the PCB board with their respective pins.
  • This integration method leads to the entire electrical control board when the components work The temperature will rise, which may cause the performance of the electronic control board to decline, or shorten the life of some components, which will affect the reliability of the electronic control board.
  • the highly integrated IPM 200 (ie, integrated air-conditioning controller) includes: a substrate 1, a device layer 2, and a filling layer 3.
  • the device layer 2 is formed on the substrate 1, and the device layer 2 includes: a rectifier bridge 21 disposed on the substrate 1; and a PFC switch portion 22 disposed on the substrate 1 and connected to the rectifier bridge 21, wherein the PFC
  • the switch section 22 includes a PFC switch tube and a PFC diode; a compressor drive circuit 23 (ie, a compressor power switch section) provided on the substrate 1 to drive the compressor, wherein the compressor drive circuit 23 includes first to sixth switch tubes And first to sixth fast recovery diodes connected in parallel with the first to sixth switching tubes; a fan driving circuit 24 (ie, a fan power switch part) provided on the substrate 1 to drive the fan, and the fan driving circuit 24 includes first to sixth Six reverse conducting IGBTs; a compressor control chip 25 (ie, a compressor drive IC) that drives the compressor drive circuit 23, the compressor control chip 25 is disposed on the substrate 1 and is connected to the compressor drive circuit 23; and a fan drive circuit 24 fan control chip 26 (ie, fan driving IC), the fan control chip
  • the highly integrated IPM ie, integrated air-conditioning controller
  • the positional relationship between other devices in the highly integrated electronic control board (such as MCUs) and the highly integrated IPM is not particularly limited. .
  • the strong electric component and the weak electric component may be separately disposed.
  • the strong electric component (including the highly integrated IPM) and the weak electric component can be set on the front and back of the printed circuit board, respectively, or strong electric components (including highly integrated IPM) and weak electric components (such as MCU) can be respectively arranged on the first substrate and the second substrate, and are oppositely arranged .
  • the microcontroller 28 ie MCU
  • the microcontroller 28 is arranged on the substrate 1, and the microcontroller 28 is on the same layer as the rectifier bridge 21, the PFC switch section 22, the compressor control chip 25, the compressor drive circuit 23, the fan drive circuit 24, and the fan control chip 26 Set, and the microcontroller 28 is connected to the compressor control chip 25 and the fan control chip 26, and the filling layer 3 simultaneously covers and surrounds the rectifier bridge 21, the PFC switch section 22, the compressor control chip 25, the compressor drive circuit 23, and the fan The driving circuit 24, the fan control chip 26, and the microcontroller 28.
  • the mains power rectified by the rectifier bridge 21 becomes DC power, which can provide the working voltage to the PFC switch section 22, the compressor drive circuit 23, and the fan drive circuit 24, so that the highly integrated IPM 200 (That is, the integrated air-conditioning controller) can work normally;
  • the PFC switch section 22 can perform power factor correction according to the rectified current, that is, to compensate for the switching power loss caused by the phase difference between the current and the voltage, and improve the power factor of the electrical equipment That is to improve the efficient use of electricity by the highly integrated IPM 200 (ie, integrated air-conditioning controller).
  • the compressor driving circuit 23 is connected to the compressor in the air conditioner, and can drive the compressor to work.
  • the fan driving circuit 24 is connected to the fan in the air conditioner and can drive the fan to work.
  • the compressor control chip 25 can control the compressor driving circuit 23 to output a driving signal to drive the compressor to work;
  • the fan control chip 26 can control the fan driving circuit 24 to output a driving signal to drive the fan through the driving signal.
  • the first heat dissipation plate 31 formed on the filling layer 3 and the second heat dissipation plate 32 formed under the substrate 1 may be an aluminum substrate with high thermal conductivity.
  • the surface of the first heat radiating plate 31 has folds to facilitate heat exchange with the outside world.
  • the surface of the second heat radiating plate 32 formed under the substrate 1 is flat and easy to install an additional heat sink.
  • the material filled in the filling layer 3 is a high thermal conductivity material.
  • the filling layer 3 provides an insulating environment for the circuit on the one hand, and quickly transfers the heat emitted by the device layer 2 through the filling material to the second heat dissipation plate 32 under the substrate 1.
  • the rectifier bridge 21, the PFC switch section 22, the compressor driving circuit 23, and the fan driving circuit 24 on the device layer 2 may be disposed on one side of the device layer 2 to form a power device area, that is, a power module, and a compressor control chip 24
  • the fan control chip 25 may be disposed on another layer of the device layer 2 to form a control device area, that is, a control module.
  • FIG. 15 is a circuit schematic diagram of a power module according to a specific embodiment of the present application.
  • the power module includes a rectifier bridge 21, a PFC switch section 22, a compressor drive circuit 23, and a fan drive circuit 24, wherein the rectifier bridge 21 includes a diode 11, a diode 12, a diode 13, and a diode 14; a PFC switch section 22 includes PFC switch 221, PFC diode 222, PFC switch driver 223; compressor drive circuit 23 includes first to sixth switch transistors 311 to 316, first to sixth fast recovery diodes 321 to 326, and compressor IPM drive 33 Fan drive circuit 24 includes first to sixth reverse conducting IGBTs 411 to 416 and fan IPM drive 43.
  • the power module can reduce the area of the outdoor air-conditioning control board.
  • the components selected for the power module are purchased for packaging production, further reducing manufacturing costs.
  • the air conditioner can further control the compressor and the fan according to the difference between the actual cooling effect and the target temperature, that is, the highly integrated IPM 200 (that is, the integrated air-conditioning controller) can be separately compressed by the microcontroller.
  • the machine control chip 25 and the fan control chip 26 send control instructions.
  • the compressor control chip 25 and the fan control chip 26 receive the control instructions, the compressor drive circuit 23 and the fan drive circuit 24 are controlled to work.
  • the compressor drive circuit 23 The drive signal is output, the compressor is driven by the drive signal and the fan drive circuit 24 outputs the drive signal, and the fan is driven by the drive signal. Therefore, the microcontroller can quickly respond to and control the output adjustment of the compressor and the fan to improve the user experience.
  • the PFC switching tube 221 includes a SiC MOSFET, a SiC IGBT, or a GaN HEMT device, and the PFC diode 222 is a device made of Si material.
  • the first to sixth switching transistors 311 to 316 include SiC, MOSFET, SiC, or GaN HEMT devices, and the first to sixth fast recovery diodes 321 to 326 are devices made of Si materials. .
  • the PFC switching tube 221 and the first to sixth switching tubes 311 to 316 as a SiC MOSFET, SiC IGBT, or a GaN HEMT device, the switching speed of a device made of SiC or GaN material is used.
  • the advantage of fast can reduce the switching loss of the power module, and help save energy, and effectively reduce the heating of the power module.
  • the manufacturing cost of the power module can be reduced.
  • the first to sixth reverse conducting IGBTs 411 to 416 are devices made of Si material.
  • the first to sixth reverse conducting IGBTs 411 to 416 in the fan driving circuit 24 can be designed as Si material devices to reduce the size of the power module and reduce the power based on the characteristics of small fan output current and low power consumption.
  • the module size can further solve the problems of poor heat dissipation and high heat generation of the power module.
  • a metal wire and a metal jumper are connected between the rectifier bridge 21, the PFC switch section 22, the compressor driving circuit 23, the fan driving circuit 24, the compressor control chip 25 and the fan control chip 26. Connected.
  • the power module may include a rectifier bridge 21, a PFC switch portion 22, a compressor driving circuit 23, and a fan driving circuit 24 fabricated on the same heat dissipation substrate 1.
  • the power module structure includes a substrate The second heat dissipation plate 32 below 1, the filling layer 3, the insulation layer 52, the metal wire 53, the bare wafer 54, the metal bonding wire 55, the high thermal conductivity DIP packaging material 56, and the first heat dissipation formed on the filling layer 3.
  • the insulating layer 52 is in close contact with the surface of the second heat sink 32 formed under the substrate 1.
  • the metal wire 53 is located on the surface of the insulating layer 52.
  • the bare chip 54 is connected to the rectifier bridge 21, the PFC switch portion 22, the compressor driving circuit 23, The chip related to the fan driving circuit 24.
  • the bare chip 54 is affixed to the surface of the metal wire 53.
  • the metal bonding wire 55 electrically connects the bare chip 54 and the metal wire 53.
  • the high thermal conductivity DIP packaging material 56 is filled in the filling layer 3 and formed in the filling layer 3.
  • the first heat dissipation plate 31 is connected to the high thermal conductivity DIP packaging material 56.
  • the metal binding wire 55 can form a small radian, so that the thickness of the highly thermally conductive plastic sealing material 56 is reduced, thereby increasing the heat dissipation speed on the front of the module.
  • the highly integrated IPM ie, integrated air-conditioning controller
  • the highly integrated IPM may be a DIP package.
  • the components such as the rectifier bridge 2, the PFC switch section 22, the compressor drive circuit, the fan drive circuit, the compressor control chip, and the fan control chip in the internal circuit can be performed by using a DIP package form (e.g., plastic encapsulation or glue).
  • the package is filled to protect the internal circuit of the highly integrated IPM (ie, integrated air-conditioning controller).
  • the bottom of the substrate 1 is exposed outside the DIP package.
  • the bottom of the substrate 1 is exposed outside the DIP package and can have a larger contact area with the outside world, so as to facilitate heat dissipation of the highly integrated IPM (ie, integrated air-conditioning controller).
  • IPM integrated air-conditioning controller
  • the components in the rectifier bridge 21, the PFC switch section 22, the compressor driving circuit 23, and the fan driving circuit 24 are all bare chips, and the compressor control chip 25 and the fan control chip 26 are both Die.
  • the components selected for the power module are bare chips and are mounted on the same heat dissipation substrate 1 to facilitate The power module dissipates heat and improves the performance and reliability of the highly integrated IPM (ie, integrated air-conditioning controller).
  • the first heat dissipation plate 31 has a heat dissipation fold 571.
  • the surface of the first heat dissipation plate 31 formed on the filling layer 3 has heat dissipation folds 571, which can increase the surface area of the first heat dissipation plate 31, thereby speeding up heat exchange with the outside world, thereby accelerating heat dissipation of the device layer 2.
  • the filling layer 3 includes a DIP packaging material with high thermal conductivity.
  • the filling layer 3 may be a 70-150um thick high thermal conductivity DIP packaging material.
  • the highly thermally conductive DIP packaging material is used to protect the copper wiring 53, the bare chip 54, and the metal bonding wire 55 of the power module from mechanical and moisture damage on the one hand, and on the other hand, is used to dissipate heat from the device layer 2 Quickly transferred to the first heat sink 31.
  • the highly integrated IPM ie, integrated air-conditioning controller
  • two layers of heat dissipation plates are provided for double-sided heat dissipation to solve the problem caused by the high integration of the highly integrated IPM (ie, integrated air-conditioning controller).
  • the problem of large heat generation of the power module of the power module further improves the reliability of the highly integrated IPM (ie, integrated air-conditioning controller).
  • the present application proposes an electrical appliance.
  • the electric appliance includes the highly-integrated electric control board described above. Therefore, the appliance has all the features and advantages of the highly-integrated electric control board described above, and details are not described herein again.
  • the size of the appliance is small, which meets the development requirements of miniaturization of the appliance.
  • the electric appliance may be an air conditioner, a washing machine, a refrigerator, an induction cooker, and the like, and the highly integrated electric control board in the electric appliance can implement the functions of the highly integrated electric control board described in the previous section. Therefore, the space occupied by the electric control board can be effectively reduced, so that the above-mentioned electrical appliances all have the advantages of smaller volume, meet the development requirements of miniaturization of electrical appliances, and have higher reliability and longer service life.
  • FIG. 18 is a schematic block diagram of an air conditioner according to an embodiment of the present application.
  • the air conditioner 2000 includes the highly-integrated IPM 200 (ie, an integrated air-conditioning controller) described above.
  • the highly integrated IPM ie, integrated air-conditioning controller
  • two-layer heat sinks are provided for double-sided heat dissipation to solve the problem due to the highly integrated IPM (ie, integrated air-conditioning control).
  • the problem of high heat generation of the power module caused by the high integration of the device thereby improving the reliability of the highly integrated IPM (ie, integrated air-conditioning controller).

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structure Of Printed Boards (AREA)
  • Inverter Devices (AREA)

Abstract

L'invention concerne une carte de commande électronique à haute intégration et un appareil électrique. La carte de commande électronique à haute intégration comprend : un substrat ; et un élément électrique fort et un élément électrique faible, l'élément électrique fort et l'élément électrique faible étant situés sur le substrat, et l'élément électrique fort et l'élément électrique faible étant opposés l'un à l'autre dans une direction perpendiculaire au substrat.
PCT/CN2019/088851 2018-06-13 2019-05-28 Carte de commande électronique à haute intégration et appareil électrique WO2019237915A1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
CN201820918456.XU CN209181195U (zh) 2018-06-13 2018-06-13 空调器和集成式空调控制器
CN201820918456.X 2018-06-13
CN201810606829.4 2018-06-13
CN201810606829.4A CN110594988A (zh) 2018-06-13 2018-06-13 空调器和集成式空调控制器
CN201821791662.5 2018-10-31
CN201821791662.5U CN208806253U (zh) 2018-10-31 2018-10-31 高集成电控板和电器
CN201811288813.X 2018-10-31
CN201811288813.XA CN109300883B (zh) 2018-10-31 高集成电控板和电器
CN201822277624.4 2018-12-29
CN201822277624.4U CN209562922U (zh) 2018-12-29 2018-12-29 高集成电控板及电器
CN201811645539.7A CN109413846A (zh) 2018-12-29 2018-12-29 高集成电控板及电器
CN201811645539.7 2018-12-29

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EP4175153A4 (fr) * 2020-06-29 2023-12-06 Daikin Industries, Ltd. Dispositif onduleur

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JPH11112111A (ja) * 1997-10-02 1999-04-23 Hitachi Aic Inc プリント配線板
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CN208240659U (zh) * 2018-06-13 2018-12-14 广东美的制冷设备有限公司 高集成智能功率模块及空调器
CN109300883A (zh) * 2018-10-31 2019-02-01 广东美的制冷设备有限公司 高集成电控板和电器
CN109413846A (zh) * 2018-12-29 2019-03-01 广东美的制冷设备有限公司 高集成电控板及电器
CN208806253U (zh) * 2018-10-31 2019-04-30 广东美的制冷设备有限公司 高集成电控板和电器

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Publication number Priority date Publication date Assignee Title
JPH11112111A (ja) * 1997-10-02 1999-04-23 Hitachi Aic Inc プリント配線板
CN202059609U (zh) * 2011-04-26 2011-11-30 浙江绍兴苏泊尔生活电器有限公司 电磁炉用电路板结构
CN203251517U (zh) * 2013-05-15 2013-10-23 安波电机(宁德)有限公司 一种具有集成设计的调速电机控制器
CN208240659U (zh) * 2018-06-13 2018-12-14 广东美的制冷设备有限公司 高集成智能功率模块及空调器
CN109300883A (zh) * 2018-10-31 2019-02-01 广东美的制冷设备有限公司 高集成电控板和电器
CN208806253U (zh) * 2018-10-31 2019-04-30 广东美的制冷设备有限公司 高集成电控板和电器
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EP4175153A4 (fr) * 2020-06-29 2023-12-06 Daikin Industries, Ltd. Dispositif onduleur

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