WO2019227570A1 - 一种电子刹车飞轮片 - Google Patents
一种电子刹车飞轮片 Download PDFInfo
- Publication number
- WO2019227570A1 WO2019227570A1 PCT/CN2018/094172 CN2018094172W WO2019227570A1 WO 2019227570 A1 WO2019227570 A1 WO 2019227570A1 CN 2018094172 W CN2018094172 W CN 2018094172W WO 2019227570 A1 WO2019227570 A1 WO 2019227570A1
- Authority
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- WIPO (PCT)
- Prior art keywords
- frame
- diode chip
- electronic brake
- junction
- pins
- Prior art date
Links
- 239000004033 plastic Substances 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Definitions
- the invention relates to a brake flywheel, and in particular relates to an electronic brake flywheel with good instantaneous heat dissipation performance and less damage to the chip.
- the prior art brake flywheel has the following defects: (1) instantaneous heat dissipation is poor during use, and the chip is easily damaged; (2) the number of chips and pins is fixed, and the flexibility is poor.
- the object of the present invention is to provide an electronic brake flywheel, which has good instantaneous heat dissipation performance, is not easy to damage the chip, has flexibility, and has a wide application range.
- An electronic brake flywheel includes a first frame, a second frame, and at least one diode chip, and an end of the first frame is provided with at least one input terminal. At least one output pin is provided at an end of the second frame remote from the first frame; the at least one diode chip is disposed between the first frame and the second frame, and the diode chip has a P junction and N junction, the N junction of the diode chip is electrically connected to the second frame, and the P junction of the diode chip is electrically connected to the first frame through a jumper; the diode chip is packaged in the first frame and the second frame through a plastic package. on.
- the first frame and the second frame are both made of metal copper.
- the jumper is made of metal copper.
- the plastic package is made of epoxy resin material.
- diode chips which are arranged between the first frame and the second frame.
- the number of the input terminal pins and the output terminal pins are the same.
- the present invention has the beneficial effects that the present invention has good instantaneous heat dissipation performance, does not easily damage the chip, has flexibility, and has a wide application range.
- FIG. 1 is a schematic structural diagram of the present invention
- FIG. 2 is a plan view of an embodiment of the present invention.
- FIG. 3 is a top view of another embodiment of the present invention.
- an electronic brake flywheel includes a first frame 1, a second frame 2, and at least one diode chip 3.
- An end of the first frame 1 is provided with at least one input terminal pin 4.
- the end of the second frame 2 far from the first frame 1 is provided with at least one output terminal pin 5;
- the at least one diode chip 3 is disposed between the first frame 1 and the second frame 2, and the diode chip 3 has a P junction and an N junction.
- the N junction of the diode chip 3 is electrically connected to the second frame 2.
- the P junction of the diode chip 3 is electrically connected to the first frame 1 through a jumper 6.
- the diode chip 3 is connected through The plastic package 7 is packaged on the first frame 1 and the second frame 2.
- both the first frame 1 and the second frame 2 are made of metal copper; and the jumper 6 is made of metal copper.
- the input terminal pin 4 and the output terminal pin 5 are both made of metal copper and have an L-shaped structure.
- the plastic sealing body 7 is made of epoxy resin material, which has good plastic sealing performance and long service life.
- the invention has good instantaneous heat dissipation performance and is not easy to damage the chip.
- the difference from the above embodiment lies in that: there are four input terminal pins 4, which are equally spaced on the first frame 1; and the output terminal pins 5 There are four, equally spaced on the second frame 2. Therefore, the input terminal pins 4 and output terminal pins 5 in the present invention can be changed in quantity according to different usage requirements, thereby being more flexible and having a wider application range. Further, the number of the diode chips 3 in the present invention can be arranged according to actual needs.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
Abstract
一种电子刹车飞轮片,包括第一框架(1)、第二框架(2)以及至少一个二极管芯片(3),所述第一框架(1)的端部设置有至少一个输入端引脚(4),所述第二框架(2)远离第一框架(1)的端部设置有至少一个输出端引脚(5);所述至少一个二极管芯片(3)设置于第一框架(1)与第二框架(2)之间,所述二极管芯片(3)具有P结与N结,该二极管芯片(3)的N结电连接于第二框架(2)上,该二极管芯片(3)的P结通过跳线(6)电连接于第一框架(1)上;所述二极管芯片(3)通过塑封体(7)封装于第一框架(1)与第二框架(2)上。
Description
本发明涉及刹车飞轮片,尤其涉及了一种瞬间散热性能好、不易损坏芯片的电子刹车飞轮片。
现有技术中的刹车飞轮片存在一下缺陷:(1)在使用过程中瞬间散热性差,芯片容易损坏;(2)芯片与引脚的数量固定,灵活性差。
发明内容
针对现有技术存在的不足,本发明的目的就在于提供了一种电子刹车飞轮片,瞬间散热性能好,不易损坏芯片,具有灵活性,应用范围广。
为了实现上述目的,本发明采用的技术方案是这样的:一种电子刹车飞轮片,包括第一框架、第二框架以及至少一个二极管芯片,所述第一框架的端部设置有至少一个输入端引脚,所述第二框架远离第一框架的端部设置有至少一个输出端引脚;所述至少一个二极管芯片设置于第一框架与第二框架之间,所述二极管芯片具有P结与N结,该二极管芯片的N结电连接于第二框架上,该二极管芯片的P结通过跳线电连接于第一框架上;所述二极管芯片通过塑封体封装于第一框架与第二框架上。
作为一种优选方案,所述第一框架与第二框架均采用金属铜制成。
作为一种优选方案,所述跳线采用金属铜制成。
作为一种优选方案,所述塑封体采用环氧树脂材料制成。
作为一种优选方案,所述二极管芯片有两个,设置于第一框架与第二框架之间。
作为一种优选方案,所述输入端引脚与输出端引脚的数量相同。
作为一种优选方案,所述输入端引脚有三个,等间距分布在第一框架上;所述输出端引脚有三个,等间距分布在第二框架上。
作为一种优选方案,所述输入端引脚有四个,等间距分布在第一框架上;所述输出端引脚有四个,等间距分布在第二框架上。
与现有技术相比,本发明的有益效果:本发明瞬间散热性能好,不易损坏芯片,具有灵活性,应用范围广。
图1是本发明的结构示意图;
图2是本发明一种实施例的俯视图;
图3是本发明另一种实施例的俯视图。
下面结合具体实施例对本发明作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案,而不能以此来限制本发明的保护范围。
实施例:
如图1~2所示,一种电子刹车飞轮片,包括第一框架1、第二框架2以及至少一个二极管芯片3,所述第一框架1的端部设置有至少一个输入端引脚4,所述第二框架2远离第一框架1的端部设置有至少一个输出端引脚5;所述至少一个二极管芯片3设置于第一框架1与第二框架2之间,所述二极管芯片3具有P结与N结,该二极管芯片3的N结电连接于第二框架2上,该二极管芯片3的P结通过跳线6电连接于第一框架1上;所述二极管芯片3通过塑封体7封装于第一框架1与第二框架2上。
优选的,所述第一框架1与第二框架2均采用金属铜制成;所述跳线6采用金属铜制成。具体的,其中输入端引脚4、输出端引脚5均采用金属铜制成,为一L型结构。
优选的,所述塑封体7采用环氧树脂材料制成,塑封性能好,使用寿命长。
具体的,在本实施例中,所述二极管芯片3有两个,设置于第一框架1与第二框架2之间;所述输入端引脚4与输出端引脚5的数量相同;所述输入端引脚4有三个,等间距分布在第一框架1上;所述输出端引脚5有三个,等间距分布在第二框架2上。本发明瞬间散热性能好,不易损坏芯片。
作为一种优选的实施例,如图3所示,与上述实施例的区别在于:所述输入端引脚4有四个,等间距分布在第一框架1上;所述输出端引脚5有四个,等间距分布在第二框架2上。因此,本发明中的输入端引脚4、输出端引脚5可根据不同的使用需求进行数量的更换,从而更具有灵活性,适用范围更广。进一步的,本发明中的二极管芯片3的数量可以依据实际需求布局个数。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和变形,这些改进和变形也应视为本发明的保护范围。
Claims (8)
- 一种电子刹车飞轮片,其特征在于:包括第一框架、第二框架以及至少一个二极管芯片,所述第一框架的端部设置有至少一个输入端引脚,所述第二框架远离第一框架的端部设置有至少一个输出端引脚;所述至少一个二极管芯片设置于第一框架与第二框架之间,所述二极管芯片具有P结与N结,该二极管芯片的N结电连接于第二框架上,该二极管芯片的P结通过跳线电连接于第一框架上;所述二极管芯片通过塑封体封装于第一框架与第二框架上。
- 根据权利要求1所述的一种电子刹车飞轮片,其特征在于:所述第一框架与第二框架均采用金属铜制成。
- 根据权利要求1所述的一种电子刹车飞轮片,其特征在于:所述跳线采用金属铜制成。
- 根据权利要求1所述的一种电子刹车飞轮片,其特征在于:所述塑封体采用环氧树脂材料制成。
- 根据权利要求1所述的一种电子刹车飞轮片,其特征在于:所述二极管芯片有两个,设置于第一框架与第二框架之间。
- 根据权利要求5所述的一种电子刹车飞轮片,其特征在于:所述输入端引脚与输出端引脚的数量相同。
- 根据权利要求6所述的一种电子刹车飞轮片,其特征在于:所述输入端引脚有三个,等间距分布在第一框架上;所述输出端引脚有三个,等间距分布在第二框架上。
- 根据权利要求6所述的一种电子刹车飞轮片,其特征在于:所述输入端引脚有四个,等间距分布在第一框架上;所述输出端引脚有四个,等间距分布在第二框架上。
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CN201820831824.7 | 2018-05-31 | ||
CN201820831824.7U CN208189579U (zh) | 2018-05-31 | 2018-05-31 | 一种电子刹车飞轮片 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN202042516U (zh) * | 2011-04-25 | 2011-11-16 | 上海旭福电子有限公司 | 超薄贴装二极管smd的平角封装结构 |
US20120075816A1 (en) * | 2010-09-24 | 2012-03-29 | On Semiconductor Trading, Ltd. | Circuit device and method of manufacturing the same |
CN203826365U (zh) * | 2013-12-20 | 2014-09-10 | 常州星海电子有限公司 | 一种片式二极管 |
CN205508816U (zh) * | 2016-03-29 | 2016-08-24 | 上海美高森美半导体有限公司 | 塑封gbpc整流桥 |
CN106684065A (zh) * | 2016-09-07 | 2017-05-17 | 四川上特科技有限公司 | 一种集成式Mini整流桥新结构及其制作工艺 |
-
2018
- 2018-05-31 CN CN201820831824.7U patent/CN208189579U/zh active Active
- 2018-07-03 WO PCT/CN2018/094172 patent/WO2019227570A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120075816A1 (en) * | 2010-09-24 | 2012-03-29 | On Semiconductor Trading, Ltd. | Circuit device and method of manufacturing the same |
CN202042516U (zh) * | 2011-04-25 | 2011-11-16 | 上海旭福电子有限公司 | 超薄贴装二极管smd的平角封装结构 |
CN203826365U (zh) * | 2013-12-20 | 2014-09-10 | 常州星海电子有限公司 | 一种片式二极管 |
CN205508816U (zh) * | 2016-03-29 | 2016-08-24 | 上海美高森美半导体有限公司 | 塑封gbpc整流桥 |
CN106684065A (zh) * | 2016-09-07 | 2017-05-17 | 四川上特科技有限公司 | 一种集成式Mini整流桥新结构及其制作工艺 |
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