WO2019218148A1 - 衬垫、覆晶薄膜及柔性装置 - Google Patents

衬垫、覆晶薄膜及柔性装置 Download PDF

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Publication number
WO2019218148A1
WO2019218148A1 PCT/CN2018/086861 CN2018086861W WO2019218148A1 WO 2019218148 A1 WO2019218148 A1 WO 2019218148A1 CN 2018086861 W CN2018086861 W CN 2018086861W WO 2019218148 A1 WO2019218148 A1 WO 2019218148A1
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WIPO (PCT)
Prior art keywords
pad
sub
flexible
circuit board
flip chip
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PCT/CN2018/086861
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English (en)
French (fr)
Inventor
杜利剑
李文辉
刘佳豪
叶桂卿
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201880093893.5A priority Critical patent/CN112449721A/zh
Priority to PCT/CN2018/086861 priority patent/WO2019218148A1/zh
Publication of WO2019218148A1 publication Critical patent/WO2019218148A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a pad, a flip chip, and a flexible device.
  • the display panel involves a preparation process in which two devices are connected by hot pressing. Currently, a gasket is used to connect the two devices during the thermocompression bonding process, but under normal conditions, the device is thermally expanded at a high temperature, resulting in a final thermal expansion. The offset between the connected devices is not correct, which affects the precision of the display panel.
  • the present invention provides a gasket capable of reducing the offset of the device due to thermal expansion during the thermocompression bonding process.
  • the specific technical solutions are as follows.
  • a pad disposed on the device for electrical connection with other devices, the pad comprising a plurality of sub-pad sets, the plurality of sub-pad sets being spaced apart in a first direction; the sub-liner The pad set includes a plurality of sub-pads, a plurality of the sub-pads being spaced apart in a second direction; the first direction intersecting the second direction.
  • the sub-pad is a conductive pad.
  • the present invention also provides a flip chip comprising a substrate, the substrate is provided with a binding zone, the binding zone is provided with a pad, the pad comprises a plurality of sub-pad sets, a plurality of The sub-pad sets are spaced apart in a first direction; the sub-pad set includes a plurality of sub-pads, and the plurality of sub-pads are spaced apart in a second direction; the first direction and the first The two directions intersect.
  • the flip chip comprises a driving chip electrically connected to the pad.
  • the substrate includes a first surface and a second surface opposite the first surface, and the substrate is provided with a through hole penetrating the first surface and the second surface.
  • each of the sub-pads covers one of the through holes; and each of the sub-pads is electrically connected to the driving chip through the through holes through a connecting line.
  • the connecting line intersects the orthographic projection of the sub-pad in a direction perpendicular to the substrate.
  • the connecting line is connected to an end of the sub-pad.
  • the connecting line is connected to a middle portion of the sub-pad.
  • the nth sub-pad is offset from the n-1th sub-pad by a predetermined distance in the first direction, where n is An integer greater than one.
  • the nth subpad is shorter than the n-1th subpad by a predetermined length, wherein n is an integer greater than 1.
  • the present invention also provides a flexible device comprising the flip chip of claims 6-14, the flexible device further comprising a flexible panel, the flexible panel being coupled to the flip chip.
  • the flexible panel comprises an organic electroluminescent display device, a first flexible layer and a panel connection pad, and the organic electroluminescent display device and the panel connection pad are disposed on opposite sides of the first flexible layer
  • the flexible panel is connected to the pad in the flip chip by the panel connection pad, and the panel connection pad is matched with the pad.
  • the first flexible layer is provided with a first through hole
  • the panel connection pad covers the first through hole
  • the panel connection pad passes through the first through hole and the The organic electroluminescent display device is electrically connected.
  • the flexible device further comprises a flexible circuit board component, the flexible circuit board component being coupled to the flip chip.
  • the flexible circuit board component comprises a circuit board, a second flexible layer and a circuit board connection pad, and the circuit board and the circuit board connection pad are disposed on opposite sides of the second flexible layer, the flexibility A circuit board component is coupled to the pad in the flip chip by the circuit board connection pad, the circuit board connection pad being adapted to the pad.
  • the second flexible layer is provided with a second through hole
  • the circuit board connection pad covers the second through hole
  • the circuit board connection pad passes through the second through hole through the second connection line
  • the circuit board is electrically connected.
  • the invention has the beneficial effects that the gasket provided on the device of the invention can be used to reduce the offset of the gasket due to thermal expansion during the thermocompression bonding process with other devices, so that the interface between the device and other devices is more accurate, and the electricity is improved. Sexual connection performance.
  • FIG. 1 is a schematic structural view of a gasket according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view showing the displacement of the sub-pads in the horizontal direction when they are arranged in the horizontal direction according to the first embodiment of the present invention.
  • FIG. 3 is a schematic view showing the displacement of the sub-pads in the horizontal direction and the vertical direction according to the first embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a flip chip according to a second embodiment of the present invention.
  • FIG. 5 is a cross-sectional structural view of a flip chip according to a second embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a connection line according to a second embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of another connection line according to a second embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a flexible device according to a third embodiment of the present invention.
  • FIG. 9 is a schematic structural view of a panel connection pad according to a third embodiment of the present invention.
  • FIG. 10 is a schematic diagram of a connection structure between a panel connection pad and a first connection line according to a third embodiment of the present invention.
  • FIG. 11 is a schematic diagram of another connection structure between a panel connection pad and a first connection line according to a third embodiment of the present invention.
  • FIG. 12 is a schematic structural diagram of a circuit board connection pad according to a third embodiment of the present invention.
  • FIG. 13 is a schematic diagram of a connection structure between a circuit board connection pad and a second connection line according to a third embodiment of the present invention.
  • FIG. 14 is a schematic diagram of another connection structure between a circuit board connection pad and a second connection line according to a third embodiment of the present invention.
  • references to "an embodiment” herein mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the invention.
  • the appearances of the phrases in various places in the specification are not necessarily referring to the same embodiments, and are not exclusive or alternative embodiments that are mutually exclusive. Those skilled in the art will understand and implicitly understand that the embodiments described herein can be combined with other embodiments.
  • a first embodiment of the present invention provides a pad 10 disposed on a device 120 for electrical connection with other devices.
  • the pad 10 includes a plurality of sub-pad sets 100, and the plurality of The sub-pad sets 100 are spaced apart in the first direction A.
  • the sub-pad set 100 includes a plurality of sub-pads 110, a plurality of the sub-pads 110 are spaced apart in a second direction B, the first direction A intersecting the second direction B.
  • the spacer 10 disposed on the device 120 is used in the thermocompression bonding process with other devices, the offset of the substrate 10 due to thermal expansion can be reduced, and the interface between the device 120 and other devices can be more accurate, and the electrical connection effect can be improved.
  • the device 120 may be a flexible panel, a flexible circuit board component, etc., or a rigid device capable of thermally expanding at high temperatures.
  • thermocompression bonding is performed on the substrate provided with the spacer 10, wherein the spacer 10 includes 100 sub-pads 110 having a width of 1 mm and the sub-pad 110 The length is 10 mm, wherein the substrate is an organic material substrate, and thermal expansion occurs during hot pressing. As shown in FIG.
  • 100 sub-pads 110 are arranged in the horizontal direction (first direction A), assuming that the distance of each sub-pad 110 in the horizontal direction due to thermal expansion during the hot pressing is 0.02 mm, then The 100 sub-pads 110 will produce a displacement of 2 mm, which is equivalent to the fact that the two sub-pads 110 will be completely removed from the original position, and thus cannot correspond to other pads or connection points connected thereto, resulting in poor connection.
  • the influence is that the displaced sub-pad 110a is shown by a broken line in FIG. In one embodiment of the present invention, as shown in FIG.
  • 100 subpads 110 are divided into 20 subpad groups 100, wherein the subpad groups 100 are arranged in a horizontal direction (first direction A), each pad group 100 includes five sub-pads 110 arranged in the vertical direction (second direction B).
  • first direction A first direction A
  • second direction B second direction B
  • the horizontal direction is Since the horizontal displacement due to the hot pressing is reduced, the width or length of one sub-pad 110 is not reached, and the electrical connection performance is not affected.
  • the lateral arrangement means that the longer sides of the sub-pads (edges having a length of 10 mm) are arranged in a lateral direction, and the length of the sub-pads 110 is 10 mm, which produces a level.
  • the displacement has a smaller influence on the electrical connection performance with respect to the length 10 mm of the sub-pad 110 itself, wherein the displaced sub-pad 110b is shown by a broken line in FIG. While there is thermal expansion in the vertical direction, only five sub-pads 110 are arranged in the vertical direction, and the displacement in the vertical direction after hot pressing is also small, which is for the sub-pad 110 having a width of 1 mm. In other words, it does not affect the electrical performance connection effect.
  • the sub-pad 110 is laterally disposed, that is, the longitudinal direction of the sub-pad 110 is set in the horizontal direction.
  • the width and length of the sub-pad 110 in the present invention are not limited to the numerical values exemplified above.
  • the first direction A and the second direction B are not limited to the horizontal direction and the vertical direction, and may be an acute angle setting having an included angle of less than 90°, and the displacement deviation effect after the hot pressing may also be reduced.
  • subpad 110 is a conductive pad.
  • the angle between the first direction A and the second direction B is 90°.
  • a second embodiment of the present invention provides a flip chip 20 comprising a substrate 2100.
  • the substrate 2100 is provided with a bonding region 2200, and the bonding region 2200 is provided with a spacer.
  • the pad 2300 includes a plurality of sub-pad sets 2310, and the plurality of sub-pad sets 2310 are spaced apart in the first direction A.
  • the sub-pad set 2310 includes a plurality of sub-pads 2311 that are spaced apart in the second direction B.
  • the first direction A intersects the second direction B.
  • the bonding region 2200 is a region for connecting the flip chip 20 to other devices.
  • the flip chip 20 is thermocompression bonded with other devices, the flip chip 20 is more accurately connected to other devices due to the presence of the spacer 2300, and the spacer 2300 in this embodiment is in the process of thermocompression bonding.
  • the advantageous effects are the same as those of the spacer 10 in the first embodiment, and the above description can be referred to.
  • subpad 2311 is a conductive pad.
  • the angle between the first direction A and the second direction B is 90°.
  • the substrate 2100 is one of a polyethersulfone resin, a polycarbonate, a polyimide, a polyethylene terephthalate, a polyethylene naphthalate, and a fiber reinforced composite. Or a variety.
  • the flip chip 20 further includes a driver chip 2400 electrically coupled to the pad 2300. It can be understood that the driving chip 2400 is disposed on the side of the substrate 2100 opposite to the pad 2300.
  • the substrate 2100 includes a first surface 2110 and a second surface 2120 opposite the first surface 2110, the substrate 2100 being provided with a through hole 2130 extending through the first surface 2110 and the second surface 2120.
  • the pad 2300 is connected to the driving chip 2400 through the connecting hole 2140 through the through hole 2130.
  • each sub-pad 2311 covers a through hole 2130.
  • Each of the sub-pads 2311 is electrically connected to the driving chip 2400 through the connecting holes 2140 through the through holes 213.
  • the length of the connecting line 2140 can be determined according to actual product conditions. It can be understood that when the connection line 2140 is electrically connected to the driving chip 2400 through the through hole 2130, the partial connection line 2140 passes through the through hole 2130, and is connected to the driving chip 2400 on the side of the flip chip 20, where the side is Refers to the side of the flip chip 20 opposite the side on which the spacer 2300 is located.
  • the connecting line 2140 intersects the sub-pad 2311 in an orthographic projection perpendicular to the direction of the substrate 2100. That is to say, the connecting line 2140 intersects with the direction in which the sub-pad 2311 is laterally arranged.
  • This structure can simplify the connection line structure and avoid the arrangement of the sub-pad 2311 in the first direction A and the second direction B. This causes a problem of the connection line crossing between the sub-pad groups 2310.
  • connection line 2140 is coupled to the end 2312 of the subgasket 2311. That is, the through hole 2130 is disposed at a position where the base 2100 corresponds to the end portion 2312 of the sub pad 2311.
  • the connection line 2140 is taken out from the end portion 2312 of the sub-pad 2311, and is drawn out from the middle portion of the sub-pad 2311, thereby avoiding the problem of electrical interference caused by the concentrated accumulation of the connection lines.
  • connecting line 2140 can also be connected to the middle portion 2313 of the sub-pad 2311.
  • the nth subpad 2311 is offset from the n-1th subpad 2311 by a predetermined distance in the first direction A, where n is greater than 1 The integer.
  • n is greater than 1 The integer.
  • electrical interference is avoided. It can be understood that the sub-pad 2311 is shifted to the right by a predetermined distance from the bottom to the top in the vertical direction (the second direction B) in the same group of sub-pad groups 2310. The preset distance is at least greater than the width of one connecting line 2410.
  • the nth subpad 2311 is shorter than the n-1th subpad 2311 by a predetermined length, where n is an integer greater than one. It can be understood that one end portion 2312a of the adjacent sub-pad 2311 can be aligned, and then the other end portion 2312b of the adjacent sub-pad 2311 is different from each other by a predetermined degree so that the adjacent sub-pad 2311
  • the connecting lines 2410 do not cross to avoid electrical interference.
  • the partial sub-pad 2311 may be disposed such that the adjacent sub-pads 2311 are offset from each other by a predetermined distance, and the other portion of the sub-pad 2311 is disposed such that the lengths of the adjacent sub-pads 2311 are different by a preset distance.
  • the combination of the two methods can also achieve the problem of avoiding the intersection of the connecting lines 2410.
  • a third embodiment of the present invention provides a flexible device 30 including the flip chip 20 in the second embodiment described above, and a flexible panel 3100, wherein the flexible device 3100 The panel 3100 is connected to the flip chip 20.
  • the flexible panel 3100 includes a first flexible layer 3110, an organic electroluminescent display device 3120, and a panel connection pad 3200.
  • the organic electroluminescent display device 3120 and the panel connection pad 3200 are disposed on the first flexible layer 3120.
  • the flexible panel 3100 is connected to the pad 2300 in the flip chip 20 through the panel connection pad 3200, wherein the panel connection pad 3200 is adapted to the pad 2300.
  • the first flexible layer 3110 includes a third surface 3111, the third surface 3111 includes a first binding region 3112 (see FIG. 9), and the panel connection pad 3200 is disposed on the first binding region 3112, and It is electrically connected to the organic electroluminescent display device 3120.
  • the panel connection pad 3200 includes a plurality of panel sub-connection pad sets 3210, and a plurality of panel sub-connection pad sets 3210 are spaced apart in the first direction A.
  • the panel sub-connecting pad set 3210 includes a plurality of panel sub-connecting pads 3211, and the plurality of panel sub-connecting pads 3211 are spaced apart in the second direction B.
  • the first direction A intersects the second direction B.
  • the angle between the first direction and the second direction is 90°.
  • the first direction is a horizontal direction and the second direction is a vertical direction.
  • the panel sub-connect pads 3211 are electrically conductive pads.
  • the electrical connection between the two can be made more precise, and the offset effect due to thermal expansion during the thermocompression bonding process is reduced.
  • the beneficial effects of the panel connection pad 3200 reference may be made to the pad 2300 in the first embodiment.
  • the first flexible layer 3110 is provided with a first through hole 3112, the panel connection pad 3200 covers the first through hole 3112, and the panel connection pad 3200 is worn through the first connection line 3113.
  • the first through hole 3112 is electrically connected to the organic electroluminescence display device 3120.
  • each panel sub-connection pad 3211 covers a first through hole 3112, and the panel sub-connection pad 3211 passes through the first through hole 3112 through the first connection line 3113.
  • the electroluminescent display device 3120 is electrically connected.
  • the first through hole 3112 allows the partial connection line to be located on the back side of the organic electroluminescent display device 3120 to reduce the connection line on the side where the spacer 2300 is located, simplifying the wiring structure.
  • each of the panel sub-connection pads 3211 is electrically coupled to the organic electroluminescent display device 3120 via a first connection line 3113 and a first connection line 3113 that passes through the first via 3112.
  • the length of the first connection line 3113 can be determined according to actual product conditions.
  • the first connection line 3113 intersects the front subprojection of the panel sub-connection pads 3211 in a direction perpendicular to the first flexible layer 3110. This structure can simplify the connection line structure and avoid the problem of the first connection line 3113 crossing between the panel sub-connection pads 3211 due to the arrangement of the panel sub-connection pads 3211 in the first direction A and the second direction B.
  • the first connection line 3113 is coupled to the end 3212 of the panel sub-connection pad 3211. It is also possible to connect in the middle of the panel sub-connection pad 3211.
  • the nth panel sub-connecting pad 3211 is offset to the right in the first direction A with respect to the n-1th panel sub-connecting pad 3211. Distance, where n is an integer greater than one. This arrangement makes it possible for the first connection lines 3113 not to cross and avoid electrical interference.
  • the preset distance is at least the width of one first connection line 3113.
  • the nth panel sub-connecting pad 3211 is shorter than the n-1th panel sub-connecting pad 3211 by a predetermined length, where n is An integer greater than one.
  • the partial panel sub-connection pads 3211 may be disposed such that adjacent panel sub-connection pads 3211 are offset from each other by a predetermined distance, and the other portion of the panel sub-connection pads 3211 are disposed such that the lengths of adjacent panel sub-connection pads 3211 are different.
  • the preset distance and the combination of the two methods can also achieve the problem of avoiding the intersection of the first connecting lines 3113.
  • the flexible panel 3100 includes a first dielectric layer 3130 disposed on a side of the organic electroluminescent display device 3120 away from the first flexible layer 3110, it being understood that
  • the organic electroluminescent display device 3130 may be a buffer layer or an insulating layer for protecting the organic electroluminescent display device 3120 when it is a buffer layer, and for avoiding the organic electroluminescence display when it is an insulating layer.
  • Device 3120 is subject to other external electrical interference.
  • the first flexible layer 3110 is a polyether sulfone resin, a polycarbonate, a polyimide, a polyethylene terephthalate, a polyethylene naphthalate, and a fiber reinforced composite. One or more.
  • the flexible device further includes a flexible circuit board component 3300 that is coupled to the flip chip 20.
  • the flexible circuit board component 3300 includes a second flexible layer 3310, a circuit board device 3320, and a circuit board connection pad 3400, and the circuit board device 3320 and the circuit board connection pad 3400 are disposed opposite the second flexible layer 3310.
  • the flexible circuit board component 3300 is connected to the pad 2300a in the flip chip 20 through the circuit board connection pad 3400, and the circuit board connection pad 3400 is fitted to the pad 2300a.
  • a liner 2300a for connection to the flexible circuit board component 3300 is included in the flip chip 20, wherein the spacer 2300 and the spacer 2300a are disposed opposite to each other on the same side of the substrate, and the spacer 2300a is aligned with the spacer 2300.
  • pad 2300a is adapted to the structure of circuit board connection pad 3400 to match circuit board connection pad 3400 to pad 2300a.
  • the substrate 2100 in the flip chip 20 is provided with a through hole 2130a corresponding to the spacer 2300a, and the flexible circuit board member 3300 is connected to the flip chip 20 through the through hole 2130a.
  • the second flexible layer 3310 includes a fourth surface 3311, the fourth surface 3311 includes a second binding region 3312, and the circuit board connection pad 3400 is disposed in the second binding region.
  • the circuit board connection pad 3400 includes a plurality of circuit board sub-connect pad sets 3410, and the plurality of circuit board sub-connection pad sets 3410 are spaced apart in the first direction A.
  • the circuit board sub-pad set 3410 includes a plurality of circuit board sub-connection pads 3411, and the plurality of circuit board sub-connection pads 3411 are spaced apart in the second direction B.
  • the first direction A intersects the second direction B.
  • the angle between the first direction and the second direction is 90°.
  • the first direction is a horizontal direction and the second direction is a vertical direction.
  • circuit board sub-connect pads 3411 are electrically conductive pads.
  • the second flexible layer 3310 is provided with a second through hole 3312, the circuit board connection pad 3400 covers the second through hole 3312, and the circuit board connection pad 3400 passes through the second connection line 3313.
  • the second through hole 3312 is electrically connected to the circuit board device 3320. It is used to reduce the electrical connection lines of the flexible circuit board component 3300 and the flip chip 20, and simplifies the circuit fabrication process.
  • each of the circuit board sub-connect pads 3411 is electrically coupled to the circuit board device 3320 through the second via 3313 through the second connection line 3313.
  • the length of the second connecting line 3313 can be determined according to actual product conditions.
  • the second connection line 3313 intersects the circuit board sub-connect pads 3411 in an orthogonal projection in a direction perpendicular to the second flexible layer 3310.
  • This structure can simplify the connection line structure and avoid the problem of the second connection line 3313 crossing between the board sub-connection pads 3411 due to the arrangement of the board sub-connection pads 3411 in the first direction A and the second direction B.
  • the second connection line 3313 is coupled to the end 3412 of the circuit board sub-connect pad 3411. It is also possible to connect in the middle of the board sub-connection pad 3411.
  • the nth circuit board sub-connecting pad 3411 is offset to the right in the first direction A with respect to the n-1th circuit board sub-connecting pad 3411. Distance, where n is an integer greater than one. This arrangement makes it possible for the second connection lines 3313 not to cross and avoid electrical interference.
  • the nth circuit board sub-connecting pad 3411 is shorter than the n-1th circuit board sub-connecting pad 3411 by a predetermined length, where n is An integer greater than one.
  • circuit board sub-connecting pads 3411 may be disposed such that adjacent circuit board sub-connecting pads 3411 are offset from each other by a predetermined distance, and another part of the circuit board sub-connecting pads 3411 is disposed such that the lengths of adjacent circuit board sub-connecting pads 3411 are different.
  • the preset distance and the combination of the two methods can also achieve the problem of avoiding the intersection of the second connecting lines 3313.
  • the second flexible layer 3310 is a polyether sulfone resin, a polycarbonate, a polyimide, a polyethylene terephthalate, a polyethylene naphthalate, and a fiber reinforced composite. One or more.
  • the flexible circuit board component 3300 is configured to receive an external electrical signal, process the external electrical signal to form a drive signal, and transmit the drive signal to the flip chip 20, and the flip chip 20 drives the flexible panel 3100 to operate. Since the connection manner provided by the present invention is adopted between the flexible circuit board member 3300, the flip chip 20, and the flexible panel 3100, the electrical signal connection effect can be improved, so that the transmission of the electrical signals of the above three is more stable.

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Abstract

一种衬垫(10)，设于器件上，用于与其他器件的电连接，衬垫包括多个子衬垫组(100)，多个子衬垫组在第一方向上间隔排列；子衬垫组包括多个子衬垫(110)，多个子衬垫在第二方向上间隔排列；第一方向与第二方向相交。还提供一种覆晶薄膜(20)和一种柔性装置。将设于器件上的衬垫用于与其他器件在热压接过程中能够减少衬垫因热膨胀产生偏移影响，使器件与其他器件的对接更准确，提高电性连接性能。

Description

衬垫、覆晶薄膜及柔性装置 技术领域
本发明涉及显示技术领域，具体涉及一种衬垫、覆晶薄膜及柔性装置。
背景技术
随着显示技术的发展，柔性显示面板逐步被应用在显示技术领域，由于柔性显示面板具有超薄、质量轻、耐用、尺寸大、设计自由、可收卷等优点，近年来，柔性显示技术取得巨大进步，被广泛应用于显示产品上。显示面板涉及将两种器件通过热压来连接的制备工艺，目前在热压接过程中会采用衬垫来连接两种器件，但在通常情况下器件在高温下热压会产生热膨胀，导致最终连接的器件之间发生偏移，对接不准，从而影响显示面板的精密度。
发明内容
有鉴于此，本发明提供一种在热压接过程中能够减少器件因热膨胀产生偏移影响的衬垫。具体技术方案如下。
一种衬垫，设于器件上，用于与其他器件的电连接，所述衬垫包括多个子衬垫组，多个所述子衬垫组在第一方向上间隔排列；所述子衬垫组包括多个子衬垫，多个所述子衬垫在第二方向上间隔排列；所述第一方向与所述第二方向相交。
优选的，所述子衬垫为导电衬垫。
本发明还提供一种覆晶薄膜，所述覆晶薄膜包括基底，所述基底设置有绑定区，所述绑定区设置有衬垫，所述衬垫包括多个子衬垫组，多个所述子衬垫组在第一方向上间隔排列；所述子衬垫组包括多个子衬垫，多个所述子衬垫在 第二方向上间隔排列；所述第一方向与所述第二方向相交。
优选的，所述覆晶薄膜还包括与所述衬垫电连接的驱动芯片。
优选的，所述基底包括第一表面以及与所述第一表面相对的第二表面，所述基底设置有贯穿所述第一表面以及所述第二表面的贯孔。
优选的，每个所述子衬垫覆盖一个所述贯孔；每个所述子衬垫通过连接线路穿过所述贯孔与所述驱动芯片电连接。
优选的，所述连接线路与所述子衬垫在垂直于所述基底方向上的正投影交叉。
优选的，所述连接线路连接于所述子衬垫的端部。
优选的，所述连接线路连接于所述子衬垫的中部。
优选的，在同一组所述子衬垫组中，第n个所述子衬垫相对于第n-1个所述子衬垫在所述第一方向上偏移预设距离，其中n为大于1的整数。
优选的，在同一组所述子衬垫组中，第n个所述子衬垫比第n-1个所述子衬垫短预设长度，其中n为大于1的整数。
本发明还提供一种柔性装置，所述柔性装置包括如权利要求6-14所述的覆晶薄膜，所述柔性装置还包括柔性面板，所述柔性面板与所述覆晶薄膜连接。
优选的，所述柔性面板包括有机电致发光显示器件、第一柔性层和面板连接垫，所述有机电致发光显示器件和所述面板连接垫设置在所述第一柔性层相对的两侧，所述柔性面板通过所述面板连接垫与所述覆晶薄膜中的所述衬垫连接，所述面板连接垫与所述衬垫相适配。
优选的，所述第一柔性层开设有第一贯孔，所述面板连接垫覆盖所述第一贯孔，所述面板连接垫通过第一连接线路穿过所述第一贯孔与所述有机电致发光显示器件电连接。
优选的，所述柔性装置还包括柔性电路板部件，所述柔性电路板部件与所 述覆晶薄膜连接。
优选的，所述柔性电路板部件包括电路板、第二柔性层和电路板连接垫，所述电路板和所述电路板连接垫设置在所述第二柔性层相对的两侧，所述柔性电路板部件通过所述电路板连接垫与所述覆晶薄膜中的所述衬垫连接，所述电路板连接垫与所述衬垫相适配。
优选的，所述第二柔性层开设有第二贯孔，所述电路板连接垫覆盖所述第二贯孔，所述电路板连接垫通过第二连接线路穿过所述第二贯孔与所述电路板电连接。
本发明的有益效果：将本发明设于器件上的衬垫用于与其他器件在热压接过程中能够减少衬垫因热膨胀产生偏移影响，使器件与其他器件的对接更准确，提高电性连接性能。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明第一实施例提供的一种衬垫的结构示意图。
图2为本发明第一实施例提供的子衬垫在水平方向排列时在热压过程的位移示意图。
图3为本发明第一实施例提供的子衬垫在水平方向和垂直方向排列时在热压过程的位移示意图。
图4为本发明第二实施例提供的一种覆晶薄膜的结构示意图。
图5为本发明第二实施例提供的一种覆晶薄膜的剖面结构示意图。
图6为本发明第二实施例提供的一种连接线路的结构示意图。
图7为本发明第二实施例提供的另一种连接线路的结构示意图。
图8为本发明第三实施例提供的一种柔性装置的结构示意图。
图9为本发明第三实施例提供的面板连接垫的结构示意图。
图10为本发明第三实施例提供的面板连接垫与第一连接线路之间的一种连接结构示意图。
图11为本发明第三实施例提供的面板连接垫与第一连接线路之间的另一种连接结构示意图。
图12为本发明第三实施例提供的电路板连接垫的结构示意图。
图13为本发明第三实施例提供的电路板连接垫与第二连接线路之间的一种连接结构示意图。
图14为本发明第三实施例提供的电路板连接垫与第二连接线路之间的另一种连接结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的说明书和权利要求书及所述附图中的术语“第一”、“第二”等是用于区别不同对象，而不是用于描述特定顺序。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、 产品或设备固有的其它步骤或单元。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参阅图1，本发明第一实施例提供一种衬垫10，设于器件120上，用于与其他器件的电连接，所述衬垫10包括多个子衬垫组100，多个所述子衬垫组100在第一方向A上间隔排列。所述子衬垫组100包括多个子衬垫110，多个所述子衬垫110在第二方向B上间隔排列，所述第一方向A与所述第二方向B相交。将设于器件120上的衬垫10用于与其他器件在热压接过程时，能够减少衬底10因热膨胀产生的偏移，使器件120与其他器件的对接更准确，提高电性连接效果。可以理解的是，器件120可以是柔性面板、柔性电路板元件等，也可以是在高温下能够发生热膨胀效果的刚性器件。
下面举例说明本发明第一实施例的有益效果。请参阅图2和图3，假设，在设有衬垫10的基板上进行热压接，其中衬垫10包括100个子衬垫110，子衬垫110的宽度为1毫米，子衬垫110的长度为10毫米，其中基板为有机材料基板，在热压过程能会发生热膨胀。如图2所示，100个子衬垫110沿水平方向(第一方向A)排列，假设在热压过程中，基板因热膨胀造成每个子衬垫110向水平方向移动的距离为0.02毫米，那么所述100个子衬垫110就会产生2毫米的位移，相当于将出现两个子衬垫110完全移出原来的位置，进而不能同与之相连接的其他衬垫或者连接点相对应，造成连接不良的影响，其中，位移后的子衬垫110a如图2中虚线所示。本发明的一个实施例中，如图3所示，100个子衬垫110分成20个子衬垫组100，其中子衬垫组100在水平方向 (第一方向A)上排列，每个衬垫组100中包括在垂直方向(第二方向B)上排列的5个子衬垫110，在同样的热压过程中，由于在水平方向上相当于只排列了20个子衬垫110，所以在水平方向上因为热压而产生的水平位移减小，没有达到一个子衬垫110的宽度或者长度，不会影响电连接性能。再者由于子衬垫110采用横向排列，横向排列是指将子衬垫较长的边(长度为10毫米的边)采用横向排列，子衬垫110的长度为10毫米，其所产生的水平位移相对与子衬垫110的本身长度10毫米来说，对电连接性能影响更小，其中，位移后的子衬垫110b如图3中虚线所示。而在垂直方向上虽然也有热压膨胀，但是在垂直方向上仅有5个子衬垫110排列，热压后在垂直方向上产生的位移也较小，这对于宽度为1毫米的子衬垫110来说，不影响电性能连接效果。
可以理解的是，上述举例说明中，是将子衬垫110横向设置的，即将子衬垫110的长度方向设置在水平方向上。
可以理解的是，本发明中的子衬垫110的宽度和长度不限于上述举例说明的数值。第一方向A和第二方向B不限于水平方向和垂直方向，还可以是呈夹角小于90°的锐角设置，同样可以减少热压后的位移偏差影响。
进一步的实施例中，子衬垫110为导电衬垫。
进一步的实施例中，第一方向A与第二方向B的夹角为90°。
请参阅图4，本发明第二实施例提供一种覆晶薄膜20，所述覆晶薄膜20包括基底2100，所述基底2100设置有绑定区2200，所述绑定区2200设置有衬垫2300，衬垫2300包括多个子衬垫组2310，多个子衬垫组2310在第一方向A上间隔排列。子衬垫组2310包括多个子衬垫2311，多个子衬垫2311在第二方向B上间隔排列。第一方向A与所述第二方向B相交。可以理解的是，其中绑定区2200为用于将覆晶薄膜20与其他器件连接的区域。上述覆晶薄膜20在与其他器件进行热压接时，由于衬垫2300的存在，使得覆晶薄膜20与 其他器件连接更精确，在该实施例中的衬垫2300在热压接过程中的有益效果同第一实施例中的衬垫10一样，可参考上述说明。
进一步的实施例中，子衬垫2311为导电衬垫。
进一步的实施例中，第一方向A与第二方向B的夹角为90°。
在进一步的实施例中，基底2100为聚醚砜树脂、聚碳酸酯、聚亚酰胺、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯和纤维增强复合材料中的一种或多种。
请参阅图5，在进一步的实施例中，覆晶薄膜20还包括与衬垫2300电连接的驱动芯片2400。可以理解的是，驱动芯片2400设置在基底2100与衬垫2300相对的一侧。
在进一步的实施例中，基底2100包括第一表面2110以及与第一表面2110相对的第二表面2120，基底2100设置有贯穿第一表面2110以及第二表面2120的贯孔2130。其中衬垫2300通过连接线路2140穿过贯孔2130与驱动芯片2400连接。
请参阅图5和图6，在进一步的实施例中，每个子衬垫2311覆盖一个贯孔2130。每个子衬垫2311通过连接线路2140穿过贯孔213与驱动芯片2400电连接。可以理解的是，连接线路2140的长短可根据实际产品情况来定。可以理解的是，连接线路2140穿过贯孔2130与驱动芯片2400电连接时，部分连接线路2140穿过贯孔2130后，在覆晶薄膜20一侧连接至驱动芯片2400，这里的一侧即指覆晶薄膜20上与衬垫2300所在一侧相对的一侧。
在进一步的实施例中，连接线路2140与子衬垫2311在垂直于基底2100方向上的正投影交叉。也就说，连接线路2140与子衬垫2311横向排列的方向相交叉，这种结构可以简化连接线路结构，避免因为子衬垫2311在第一方向A和第二方向B两个方向上排列设置而造成子衬垫组2310之间的连接线路交 叉问题。
在进一步的实施例中，连接线路2140连接于子衬垫2311的端部2312。也就是说贯孔2130设置在基底2100对应子衬垫2311的端部2312的位置。将连接线路2140从子衬垫2311的端部2312引出，相较于全部从子衬垫2311的中部引出，可避免连接线路集中堆积而导致电性干扰问题。
可以理解的是，连接线路2140也可以连接于子衬垫2311的中部2313。
在进一步的实施例中，在同一组子衬垫组2310中，第n个子衬垫2311相对于第n-1个子衬垫2311在第一方向A上偏移预设距离，其中n为大于1的整数。以使相邻的子衬垫2311的连接线路2410不交叉，避免电性干扰。可以理解的是，在同一组子衬垫组2310中在垂直方向上(第二方向B)从下至上依次将子衬垫2311向右偏移预设距离。其中预设距离至少大于一条连接线路2410的宽度。
请参阅图7，在进一步的实施例中，在同一组子衬垫组2310中，第n个子衬垫2311比第n-1个子衬垫2311短预设长度，其中n为大于1的整数。可以理解的是，可将相邻的子衬垫2311的一个端部2312a对齐，那么相邻子衬垫2311的另一个端部2312b之间相差预设程度，以使相邻的子衬垫2311的连接线路2410不交叉，避免电性干扰。
可以理解的是，可以部分子衬垫2311设置成相邻的子衬垫2311相互错开偏移预设距离，另一部分子衬垫2311设置成相邻的子衬垫2311的长度相差预设距离，两种方式结合，同样可以达到避免连接线路2410的交叉的问题。
请参阅图8、图9和图10，本发明第三实施例提供一种柔性装置30，所述柔性装置30包括上述第二实施例中的覆晶薄膜20，还包括柔性面板3100，其中柔性面板3100与覆晶薄膜20连接。
在进一步的实施例中，柔性面板3100包括第一柔性层3110、有机电致发 光显示器件3120和面板连接垫3200，有机电致发光显示器件3120和面板连接垫3200设置在第一柔性层3120相对的两侧，柔性面板3100通过面板连接垫3200与覆晶薄膜20中的衬垫2300连接，其中面板连接垫3200与衬垫2300相适配。
在进一步的实施例中，第一柔性层3110包括第三表面3111，第三表面3111包括第一绑定区3112(参阅图9)，面板连接垫3200设置在第一绑定区3112上，且与有机电致发光显示器件3120电连接。面板连接垫3200(参阅图9)包括多个面板子连接垫组3210，多个面板子连接垫组3210在第一方向A上间隔排列。面板子连接垫组3210包括多个面板子连接垫3211，多个面板子连接垫3211在第二方向B上间隔排列。第一方向A与第二方向B相交。进一步的实施例中，第一方向与第二方向的夹角为90°。进一步的实施例中，第一方向为水平方向，第二方向为垂直方向。
进一步的实施例中，面板子连接垫3211为导电衬垫。
通过面板连接垫3200和衬垫2300将柔性面板3100与覆晶薄膜20连接，可以使两者电性连接更精确，减少两者热压接过程中因热膨胀产生偏移影响。其中面板连接垫3200的有益效果的说明可参考第一实施例中的衬垫2300。
请再次参阅图8，在进一步的实施例中，第一柔性层3110开设有第一贯孔3112，所述面板连接垫3200覆盖第一贯孔3112，面板连接垫3200通过第一连接线路3113穿过第一贯孔3112与有机电致发光显示器件3120电连接。
请参阅图8和图10，在进一步的实施例中，每个面板子连接垫3211覆盖一个第一贯孔3112，面板子连接垫3211通过第一连接线路3113穿过第一贯孔3112与有机电致发光显示器件3120电连接。通过第一贯孔3112可以使得部分连接线路位于有机电致发光显示器件3120背面从而减少衬垫2300所在一侧的连接线路，简化线路结构。
在进一步的实施例中，每个面板子连接垫3211通过第一连接线路3113与穿过第一贯孔3112的第一连接线路3113与有机电致发光显示器件3120电连接。其中，第一连接线路3113的长短可根据实际产品情况来定。
在进一步的实施例中，第一连接线路3113与面板子连接垫3211在垂直于第一柔性层3110方向上的正投影交叉。这种结构可以简化连接线路结构，避免因为面板子连接垫3211在第一方向A和第二方向B两个方向上排列设置而造成面板子连接垫3211之间的第一连接线路3113交叉问题。
在进一步的实施例中，第一连接线路3113连接于面板子连接垫3211的端部3212。也可以连接在于面板子连接垫3211的中部。
在进一步的实施例中，在同一个面板子连接垫组3210中，第n个面板子连接垫3211相对于第n-1个面板子连接垫3211在第一方向A上向右偏移预设距离，其中n为大于1的整数。这样设置可以使第一连接线路3113不交叉，避免电性干扰。其中预设距离至少为一个第一连接线路3113的宽度。
请参阅图11，在进一步的实施例中，在同一个面板子连接垫组3210中，第n个面板子连接垫3211比第n-1个面板子连接垫3211短预设长度，其中n为大于1的整数。
可以理解的是，可以部分面板子连接垫3211设置成相邻的面板子连接垫3211相互错开偏移预设距离，另一部分面板子连接垫3211设置成相邻的面板子连接垫3211的长度相差预设距离，两种方式结合，同样可以达到避免第一连接线路3113的交叉的问题。
请参阅图8，在进一步的实施例中，柔性面板3100包括第一介质层3130，第一介质层3130设置在有机电致发光显示器件3120远离第一柔性层3110的一侧，可以理解的是，有机电致发光显示器件3130可以为缓冲层或者绝缘层，当为缓冲层时，用于对有机电致发光显示器件3120起保护作用，当为绝缘层 时，用于避免有机电致发光显示器件3120受其他外界电性干扰。
在进一步的实施例中，第一柔性层3110为聚醚砜树脂、聚碳酸酯、聚亚酰胺、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯和纤维增强复合材料中的一种或多种。
请再次参阅图8，在进一步的实施例中，所述柔性装置还包括柔性电路板部件3300，柔性电路板部件3300与覆晶薄膜20连接。
在进一步的实施例中，柔性电路板部件3300包括第二柔性层3310、电路板器件3320和电路板连接垫3400，电路板器件3320和电路板连接垫3400设置在第二柔性层3310相对的两侧，柔性电路板部件3300通过电路板连接垫3400与覆晶薄膜20中的衬垫2300a连接，电路板连接垫3400与衬垫2300a相适配。
可以理解的是，在覆晶薄膜20中包括用于与柔性电路板部件3300连接的衬垫2300a，其中衬垫2300和衬垫2300a相对设置在基底的同一侧,衬垫2300a与衬垫2300相类似，衬垫2300a根据电路板连接垫3400的结构做适应性调整，以使电路板连接垫3400与衬垫2300a相适配。
还可以理解的是，覆晶薄膜20中的基底2100上开设有对应于衬垫2300a的贯孔2130a,柔性电路板部件3300通过贯孔2130a与覆晶薄膜20连接。
请参阅图8和图12，在进一步的实施例中，第二柔性层3310包括第四表面3311，第四表面3311包括第二绑定区3312，电路板连接垫3400设置在第二绑定区3312上，且与电路板器件3320电连接。电路板连接垫3400包括多个电路板子连接垫组3410，多个电路板子连接垫组3410在第一方向A上间隔排列。电路板子连接垫组3410包括多个电路板子连接垫3411，多个电路板子连接垫3411在第二方向B上间隔排列。第一方向A与第二方向B相交。进一步的实施例中，第一方向与第二方向的夹角为90°。进一步的实施例中，第 一方向为水平方向，第二方向为垂直方向。
进一步的实施例中，电路板子连接垫3411为导电衬垫。
请参阅图8，在进一步的实施例中，第二柔性层3310中开设有第二贯孔3312，电路板连接垫3400覆盖第二贯孔3312，电路板连接垫3400通过第二连接线3313路贯穿第二贯孔3312与电路板器件3320电连接。用以减少柔性电路板部件3300与覆晶薄膜20的电连接线路，简化线路制作工艺。
请参阅图8和图13，在进一步的实施例中，每个电路板子连接垫3411通过第二连接线路3313穿过第二贯孔3312与电路板器件3320电连接。其中，第二连接线路3313的长短可根据实际产品情况来定。
在进一步的实施例中，第二连接线路3313与电路板子连接垫3411在垂直于第二柔性层3310方向上的正投影交叉。这种结构可以简化连接线路结构，避免因为电路板子连接垫3411在第一方向A和第二方向B两个方向上排列设置而造成电路板子连接垫3411之间的第二连接线路3313交叉问题。
在进一步的实施例中，第二连接线路3313连接于电路板子连接垫3411的端部3412。也可以连接在于电路板子连接垫3411的中部。
在进一步的实施例中，在同一个电路板子连接垫组3410中，第n个电路板子连接垫3411相对于第n-1个电路板子连接垫3411在第一方向A上向右偏移预设距离，其中n为大于1的整数。这样设置可以使第二连接线路3313不交叉，避免电性干扰。
请参阅图14，在进一步的实施例中，在同一个电路板子连接垫组3410中，第n个电路板子连接垫3411比第n-1个电路板子连接垫3411短预设长度，其中n为大于1的整数。
可以理解的是，可以部分电路板子连接垫3411设置成相邻的电路板子连接垫3411相互错开偏移预设距离，另一部分电路板子连接垫3411设置成相邻 的电路板子连接垫3411的长度相差预设距离，两种方式结合，同样可以达到避免第二连接线路3313的交叉的问题。
在进一步的实施例中，第二柔性层3310为聚醚砜树脂、聚碳酸酯、聚亚酰胺、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯和纤维增强复合材料中的一种或多种。
柔性电路板部件3300用于接受外部电信号，并将外部电信号加工处理形成驱动信号，并将驱动信号传递给覆晶薄膜20，覆晶薄膜20驱动柔性面板3100工作。由于柔性电路板部件3300、覆晶薄膜20和柔性面板3100三者之间采用本发明设置的连接方式，能够提高电信号连接效果，从而使上述三者的电信号的传输更稳定。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (17)

  1. 一种衬垫，设于器件上，用于与其他器件的电连接，其特征在于，所述衬垫包括多个子衬垫组，多个所述子衬垫组在第一方向上间隔排列；所述子衬垫组包括多个子衬垫，多个所述子衬垫在第二方向上间隔排列；所述第一方向与所述第二方向相交。
  2. 如权利要求1所述的衬垫，其特征在于，所述子衬垫为导电衬垫。
  3. 一种覆晶薄膜，其特征在于，所述覆晶薄膜包括基底，所述基底设置有绑定区，所述绑定区设置有衬垫，所述衬垫包括多个子衬垫组，多个所述子衬垫组在第一方向上间隔排列；所述子衬垫组包括多个子衬垫，多个所述子衬垫在第二方向上间隔排列；所述第一方向与所述第二方向相交。
  4. 如权利要求3所述的覆晶薄膜，其特征在于，所述覆晶薄膜还包括与所述衬垫电连接的驱动芯片。
  5. 如权利要求4所述的覆晶薄膜，其特征在于，所述基底包括第一表面以及与所述第一表面相对的第二表面，所述基底设置有贯穿所述第一表面以及所述第二表面的贯孔。
  6. 如权利要求5所述的覆晶薄膜，其特征在于，每个所述子衬垫覆盖一个所述贯孔；每个所述子衬垫通过连接线路穿过所述贯孔与所述驱动芯片电连接。
  7. 如权利要求6所述的覆晶薄膜，其特征在于，所述连接线路与所述子衬垫在垂直于所述基底方向上的正投影交叉。
  8. 如权利要求6所述的覆晶薄膜，其特征在于，所述连接线路连接于所述子衬垫的端部。
  9. 如权利要求5所述的覆晶薄膜，其特征在于，所述连接线路连接于所述子衬垫的中部。
  10. 如权利要求3所述的覆晶薄膜，其特征在于，在同一组所述子衬垫组中，第n个所述子衬垫相对于第n-1个所述子衬垫在所述第一方向上偏移预设距离，其中n为大于1的整数。
  11. 如权利要求3所述的覆晶薄膜，其特征在于，在同一组所述子衬垫组中，第n个所述子衬垫比第n-1个所述子衬垫短预设长度，其中n为大于1的整数。
  12. 一种柔性装置，其特征在于，所述柔性装置包括如权利要求3-11任一项所述的覆晶薄膜，所述柔性装置还包括柔性面板，所述柔性面板与所述覆晶薄膜连接。
  13. 如权利要求12所述的柔性装置，其特征在于，所述柔性面板包括有机电致发光显示器件、第一柔性层和面板连接垫，所述有机电致发光显示器件和所述面板连接垫设置在所述第一柔性层相对的两侧，所述柔性面板通过所述面板连接垫与所述覆晶薄膜中的所述衬垫连接，所述面板连接垫与所述衬垫相适配。
  14. 如权利要求13所述的柔性装置，其特征在于，所述第一柔性层开设有第一贯孔，所述面板连接垫覆盖所述第一贯孔，所述面板连接垫通过第一连接线路穿过所述第一贯孔与所述有机电致发光显示器件电连接。
  15. 如权利要求12所述的柔性装置，其特征在于，所述柔性装置还包括柔性电路板部件，所述柔性电路板部件与所述覆晶薄膜连接。
  16. 如权利要求15所述的柔性装置，其特征在于，所述柔性电路板部件包括电路板、第二柔性层和电路板连接垫，所述电路板和所述电路板连接垫设置在所述第二柔性层相对的两侧，所述柔性电路板部件通过所述电路板连接垫与所述覆晶薄膜中的所述衬垫连接，所述电路板连接垫与所述衬垫相适配。
  17. 如权利要求16所述的柔性装置，其特征在于，所述第二柔性层开设 有第二贯孔，所述电路板连接垫覆盖所述第二贯孔，所述电路板连接垫通过第二连接线路穿过所述第二贯孔与所述电路板器件电连接。
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CN107300793A (zh) * 2017-06-30 2017-10-27 厦门天马微电子有限公司 显示面板及显示装置
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CN107578731A (zh) * 2016-07-05 2018-01-12 三星显示有限公司 显示设备
CN107300793A (zh) * 2017-06-30 2017-10-27 厦门天马微电子有限公司 显示面板及显示装置

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