WO2019214277A1 - 光源固定基板、光源散热机构以及投影仪 - Google Patents

光源固定基板、光源散热机构以及投影仪 Download PDF

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Publication number
WO2019214277A1
WO2019214277A1 PCT/CN2019/070533 CN2019070533W WO2019214277A1 WO 2019214277 A1 WO2019214277 A1 WO 2019214277A1 CN 2019070533 W CN2019070533 W CN 2019070533W WO 2019214277 A1 WO2019214277 A1 WO 2019214277A1
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WIPO (PCT)
Prior art keywords
light source
fixing substrate
heat
source fixing
mounting
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PCT/CN2019/070533
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English (en)
French (fr)
Inventor
朱习剑
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深圳光峰科技股份有限公司
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Publication of WO2019214277A1 publication Critical patent/WO2019214277A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings

Definitions

  • the present invention relates to the field of projector technologies, and in particular, to a light source fixed substrate, a light source heat dissipation mechanism, and a projector.
  • Micro projectors also known as portable projectors, make the traditional large-scale projectors compact, portable, miniaturized, entertaining, and practical, making projection technology closer to life and entertainment, and have broad application prospects.
  • the total power of the system is large. How to design a product with low noise and low surface temperature is a big difficulty. Therefore, the heat dissipation design of the system is a big challenge. At the same time, due to the size of the heat dissipation module, the existing micro projector is difficult to further reduce the volume of the projector under the premise of ensuring heat dissipation performance.
  • Another object of the present invention is to provide a light source heat dissipation mechanism which is characterized by excellent heat dissipation performance and small volume.
  • Another object of the present invention is to provide a projector which can greatly reduce the volume of the projector while ensuring heat dissipation performance by providing the above-described heat dissipating mechanism.
  • a projector light source fixing substrate the light source fixing substrate includes a bottom surface, a top surface, and a first side surface connected between the bottom surface and the top surface, the bottom surface is opposite to the top surface, the light source
  • the fixed substrate is provided with at least one mounting hole for inserting the heat conducting member, the mounting hole forming an inlet for the heat conducting member to be inserted through the first side.
  • the mounting hole is a through hole, and an axis of the mounting hole is parallel to the bottom surface.
  • the top surface is provided with a mounting slot for mounting a circuit board.
  • a through hole is disposed in the mounting groove, and the through hole penetrates the bottom surface.
  • the mounting holes are at least two, and at least two of the mounting holes are distributed on both sides of the mounting slot.
  • the light source heat dissipating mechanism comprises: the light source fixing substrate, the heat conducting member and the heat dissipating device, wherein one end of the heat conducting member is inserted into the mounting hole, and the other end is exposed from the inlet, the heat dissipating device and the heat dissipating device One end of the heat conducting member exposing the inlet is connected.
  • the heat dissipation device includes a plurality of heat dissipation fins, and each of the heat dissipation fins is connected to the heat conduction member, and a predetermined gap is formed between the adjacent heat dissipation fins.
  • a projector comprising: the light source fixing substrate, a light source, a circuit board, and a heat dissipating device, wherein the light source is detachably mounted on the light source fixing substrate; the circuit board is disposed on the top surface and electrically connected to the light source Connecting, one end of the heat conducting member is inserted into the mounting hole, and the other end is exposed from the inlet, and the heat dissipating device is connected to an end of the heat conducting member exposing the inlet.
  • the top surface is provided with a mounting groove for mounting a circuit board, and the circuit board is received in the mounting groove.
  • a through hole is disposed in the mounting groove, the through hole penetrating through the bottom surface, and a pin of the light source extends into the through hole and is electrically connected to the circuit board.
  • the beneficial effects of the invention include: by installing a mounting hole on the fixed substrate of the light source, and assembling the heat conducting member for heat dissipation through the mounting hole, the component is reduced on the one hand, the volume is saved, and the space for further volume reduction is left. Therefore, it can be applied to projectors, lasers, and other devices that use a light source to fix a substrate.
  • the light source fixed substrate is connected with the heat conductive member, the heat can be directly transferred, and the heat transfer efficiency is improved, which is more favorable for heat dissipation.
  • the volume of the light source heat dissipating mechanism can be greatly reduced.
  • the projector having the heat dissipating mechanism achieves the effect of further reducing the volume while ensuring the heat dissipation effect.
  • FIG. 1 is a schematic structural view of a light source fixing substrate according to an embodiment of the present invention.
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 3 is a schematic structural view of a heat dissipating mechanism in a projector according to an embodiment of the present invention
  • FIG. 4 is a schematic structural view of a heat dissipation mechanism in a projector according to an embodiment of the present invention at a second viewing angle;
  • FIG. 5 is a schematic structural view of a heat dissipating mechanism in a projector according to an embodiment of the present invention
  • FIG. 6 is a schematic structural diagram of a heat dissipation fin in a projector according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a projector according to an embodiment of the present invention in an assembled state.
  • the terms “middle”, “upper”, “lower”, “front”, “back”, “vertical”, “inside”, “outside”, etc. indicate the orientation or The positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is conventionally placed when the invention product is used, for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device. Or the components must have a particular orientation, are constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention. Moreover, the terms “first”, “second”, “third”, and the like are used merely to distinguish a description, and are not to be construed as indicating or implying a relative importance.
  • horizontal simply means that its direction is more horizontal than “vertical”, and does not mean that the structure must be completely horizontal, but may be slightly inclined.
  • connection should be understood broadly, and may be, for example, a fixed connection or a
  • the connection is disassembled or connected integrally; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
  • the embodiment provides a light source fixing substrate 100.
  • the light source fixing substrate 100 is a plate structure, and can be applied to a micro projector or the like.
  • the light source fixing substrate 100 is made of a metal material or a metal alloy material, such as aluminum, aluminum alloy, etc.
  • the light source fixing substrate 100 is made of copper.
  • the light source fixing substrate 100 includes a bottom surface 101 , a first side surface 102 , a top surface 103 , and a second side surface (not shown).
  • the bottom surface 101 is opposite to the top surface 103
  • the first side surface 102 is connected to the first side surface 102 .
  • the first side surface 102 is opposite to the second side surface.
  • the bottom surface 101 is used to mount the light source 400, and the installation manner includes, but is not limited to, welding, screwing, snapping, and the like.
  • bottom surface and top surface in the present disclosure are only used to distinguish the description, and are not used to define a specific orientation or position thereof, for example, the positions of the bottom surface 101 and the top surface 103 are not specifically directed downward or upward.
  • the bottom surface 101 may also be located above the top surface 103.
  • the light source fixing substrate 100 is provided with a mounting hole 110.
  • the mounting hole 110 may be a through hole or a blind hole.
  • the mounting hole 110 forms an inlet 105 through which the heat conducting member is inserted through the first side surface 102, and the mounting hole 110 penetrates through the mounting hole 110.
  • the heat-conducting member here refers to a component for conducting heat outward, wherein the heat-conducting member may be tubular, rod-shaped and other shapes, and the material of the heat-conducting member may be metal or other materials.
  • the axis of the mounting hole 110 is parallel to the bottom surface 101. It should be understood that the "parallel” described in the present disclosure is not particularly limited to the two objects being in an absolute parallel state, including two objects being substantially parallel. . The “vertical” is not particularly limited to the fact that the two objects are in an absolute vertical state, including the state in which the two objects are substantially vertical.
  • the number of the mounting holes 110 may be one, two or more, and may be set according to specific heat dissipation requirements. As a preferred embodiment, when the number of the mounting holes 110 is two or more, all It is more preferable that the axes of the mounting holes 110 are parallel to each other, so that the assembly of the heat conducting member 200 and the heat sink 300 is facilitated.
  • the mounting holes 110 are two, and the axes of the two mounting holes 110 are parallel to each other, and the two mounting holes 110 respectively penetrate the first side 102 and the second side.
  • the cross section herein refers to a cutting plane perpendicular to the axial direction of the mounting hole 110. According to the actual assembly requirements, it can be matched with the heat conductive member 200.
  • the cross-sectional shape of the mounting hole 110 may be designed to be circular, that is, the mounting hole 110 is a circular hole.
  • the cross-sectional shape of the mounting hole 110 may be designed to be elliptical.
  • the mounting hole 110 has an oblong cross section, that is, the mounting hole 110 is an oblong hole (waist hole).
  • the light source fixing substrate 100 In order to further enable the light source fixing substrate 100 to be applied, it is adapted to other components and further miniaturization of the structure, for example, to an electrical component such as the circuit board 500.
  • the top surface 103 is further provided with a mounting groove 120 for accommodating the mounting circuit board 500. Therefore, the shape of the mounting groove 120 is configured to be compatible with the corresponding circuit board 500, wherein the circuit Plate 500 is an element for powering and controlling the light source.
  • the mounting groove 120 is a substantially strip-shaped groove, and both ends of the mounting groove 120 respectively penetrate the first side surface 102 and the second side surface.
  • the extending direction of the mounting slot 120 is parallel to the axial direction of the mounting hole 110.
  • This arrangement is advantageous for the light source to fix the substrate to mount the light source, especially when the light source is multiple, multiple light sources. It can be arranged along the axial direction of the mounting hole 110 to facilitate heat dissipation. It should be understood that in other embodiments, the extending direction of the mounting groove 120 need not be limited, and it may extend in any direction according to actual use requirements.
  • the mounting slot 120 is disposed in the middle of the light source fixing substrate 100, and the two mounting holes 110 are distributed on both sides of the axis of the mounting slot 120.
  • This arrangement has the following advantages: The holes 110 are evenly distributed, and after being assembled with the heat conductive member 200, the uniform heat dissipation effect can be achieved, the heat dissipation efficiency is improved, and the light source fixing substrate 100 is prevented from being locally overheated.
  • the number of the mounting holes 110 is more than two. In this case, the plurality of mounting holes 110 may be evenly distributed on both sides of the axis of the mounting groove 120 in a similar manner.
  • the mounting groove 120 is provided with a through hole 130, and the through hole 130 communicates with the mounting groove 120 and penetrates The bottom surface 101, in some embodiments, the through hole 130 extends through the bottom surface with its axis perpendicular to the bottom surface.
  • the number of the through holes 130 is set according to the number of the light sources 400.
  • each of the light sources 400 is provided with two pins 410 for electrical connection. Therefore, a preferred embodiment is to provide the through holes 130 with the pins of the light source 400. 410 form of cooperation.
  • the through hole 130 is a circular hole, and the diameter of the through hole 130 is slightly larger than the width of the mounting groove 120, and the through hole 130 can simultaneously supply all of the light source 400.
  • Pin 410 passes through.
  • the two through holes 130 are disposed in the mounting groove 120, and the two through holes 130 are disposed at a certain distance.
  • the light source fixing substrate 100 provided in this embodiment can be applied to the micro projector 10 and other devices that need to be provided with the light source fixing substrate 100. Since the structure of the light source fixing substrate 100 can be directly assembled with the heat conductive member 200, and installed by The slot 120 houses the circuit board 500, which does not require the provision of additional components for connection to the heat conductive member 200, so that the volume of the pico projector 10 can be further reduced while maintaining good heat dissipation performance.
  • the projector 10 includes a light source fixing substrate 100, a heat conductive member 200, a heat sink 300, a light source 400, and a circuit board 500, based on the above-described light source fixing substrate 100.
  • the light source fixing substrate 100, the heat conducting member 200, and the heat dissipating device 300 are connected to form a heat dissipating mechanism 20, and the heat generated by the light source is transmitted outward.
  • the light source 400 is detachably mounted on the bottom surface 101 of the power supply fixed substrate 100, and the circuit board 500 is disposed in the mounting groove 120 of the top surface 103.
  • FIG. 3 to FIG. 5 show the structure of the heat dissipation mechanism 20, the light source 400 and the circuit board 500 of the projector 10 in this embodiment. It should be understood that the projector 10 further Other components, such as the outer casing, are not shown in the drawings, and are not shown in the drawings. Those skilled in the art can refer to the prior art, and no further details are provided herein.
  • the heat dissipation mechanism 20 includes a light source fixing substrate 100, a heat conductive member 200, and a heat dissipation device 300.
  • the structure of the light source fixing substrate 100 is referred to the foregoing portion.
  • One end of the heat conducting member 200 extends from the inlet 105 into the mounting hole 110 to be connected to the light source fixing substrate 100, and the other end is connected to the heat sink 300 to function as heat conduction.
  • the heat conducting member 200 is used to transfer the heat on the light source fixing substrate 100 to the heat sink 300.
  • the heat conducting member 200 is a heat pipe, and its shape is matched with the oblong mounting hole 110 of the light source fixing substrate 100, and the cross section thereof is Oblong.
  • the number of the heat conducting members 200 is two, and the two heat conducting members 200 are in one-to-one correspondence with the two mounting holes 110.
  • the heat conducting member 200 protrudes from the inlet 105 of the first side surface 102 into the mounting hole 110 and is fixed.
  • the fixing manner of the heat conducting member 200 and the mounting hole 110 includes, but is not limited to, a screw connection, a snap connection, an interference fit, and the like.
  • the heat conductive member 200 extends into the mounting hole 110 and is fixed to the light source fixing substrate 100. .
  • the heat conducting member 200 may be a solid and/or hollow structure. When the heat conducting member 200 is a hollow structure, the inside thereof may also be filled with other heat conductive materials.
  • the heat dissipating device 300 includes a plurality of stacked heat dissipating fins 310.
  • the structure of the heat dissipating fins 310 is as shown in FIG. 6.
  • the heat dissipating fins 310 are in the shape of a square plate and are made of a material with high heat conduction efficiency, such as aluminum. , copper, etc.
  • the heat dissipating fins 310 are provided with connecting holes 320.
  • the connecting holes 320 are used for the heat conducting members 200 to pass through. Therefore, the number of the connecting holes 320 is the same as the number of the heat conducting members 200. In this embodiment, the number of the heat conducting members 200 is the same.
  • connection holes 320 The number of the connection holes 320 is two, and the axes of the two connection holes 320 are perpendicular to the heat dissipation fins 310.
  • the two heat conducting members 200 respectively extend into the connecting holes 320 and are connected to the heat dissipating fins 310, and the connecting manner is preferably welding.
  • the structure of the heat dissipation fins 310 shown in FIG. 6 is only an example. In other embodiments, the heat dissipation fins 310 may be circular, elliptical, oblong, and the like.
  • the position of the connection hole 310 provided thereon can also be changed according to the specific application environment.
  • the number of the connection holes 310 can also be adjusted correspondingly according to the number of the heat conductive members 200.
  • the projections of the plurality of heat dissipation fins 310 on the plane perpendicular to the heat conductive member 200 coincide with each other.
  • This arrangement minimizes the volume of the heat dissipation device, and is further advantageous for further reducing the volume of the projector 10.
  • the heat dissipation fins 310 in the same heat dissipation device 300 do not have to adopt the same structure.
  • rectangular and circular heat dissipation fins are used at the same time, and the stacking manners do not have to be parallel or remain the same. spacing.
  • Each of the heat dissipation fins 310 is connected to the heat conductive member 200 and is substantially parallel to each other.
  • the adjacent heat dissipation fins 310 have a gap therebetween, and the gap is preset according to the heat conduction requirement.
  • the number of the heat dissipation fins 310 is set according to the heat dissipation requirement, for example, 5 blocks, 10 blocks, etc., and the gap distance of the adjacent heat dissipation fins 310 may be, for example, 0.5 mm to 1 cm.
  • the number of the heat dissipating devices 300 may be multiple, for example, a part of the heat conducting member 200 is passed out of the second side, and a heat dissipating device 300 is connected to the portion of the heat conducting member 200 that passes through the second side to achieve more. Good heat dissipation.
  • the light source 400 may be a gas discharge light source 400, an LED light source 400 or a laser light source 400.
  • the light source 400 is a laser light source 400.
  • the light source 400 includes two pins 410, and the pins 410 are made of a conductor for the circuit.
  • the board 500 is electrically connected.
  • the circuit board 500 is used to supply power to the light source 400 and control the light source 400.
  • the circuit board 500 is disposed in the mounting slot 120 and is integrally received in the mounting slot 120.
  • the light source 400 is disposed on the bottom surface 101, and the pin 410 of the light source 400 extends into the through hole. 130 is electrically coupled to circuit board 500.
  • the circuit board 500 can also be only partially accommodated in the mounting groove 120.
  • the size of the circuit board 500 in the length direction is larger than that of the light source fixing substrate 100.
  • the length of the mounting slot 120, at this point, a portion of the circuit board 500 can extend out of the mounting slot 120.
  • the heat generated by the light source 400 and the circuit board 500 is transmitted to the light source fixing substrate 100, and then transmitted to the heat dissipation fins 310 of the heat dissipation device 300 through the heat conduction member 200, through the heat dissipation fins.
  • the heat is scattered outwardly by the 310. Since the fixed substrate of the heat conductive member 200 is not required to be added to the light source fixing substrate 100, and the circuit board is 500 times accommodated in the light source fixing substrate 100, the additional volume is not required, thereby further reducing the micro projector. At the same time, the heat transfer efficiency is further improved because the heat on the light source fixing substrate 100 is directly transmitted to the heat conductive member 200. Based on the above technical effects, the projector 10 provided in the present embodiment further realizes miniaturization of the structure.

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Abstract

一种光源固定基板（100）、光源散热机构（20）以及投影仪（10），属于投影仪技术领域。光源固定基板（100）包括底面（101）、顶面（103）以及相接于底面（101）和顶面（103）之间的第一侧面（102），底面（101）与顶面（103）相对，光源固定基板（100）设置有至少一个用于插接导热件（200）的安装孔（110），安装孔（110）贯穿第一侧面（102）形成供导热件（200）插入的入口（105）。应用该光源固定基板（100）的光源散热机构（20）可以在保证散热效果的前提下减小体积，并使得应用光源固定基板（100）的投影仪（10）进一步缩小体积，利于投影仪（10）的小型化。

Description

光源固定基板、光源散热机构以及投影仪 技术领域
本发明涉及投影仪技术领域，具体涉及一种光源固定基板、光源散热机构以及投影仪。
背景技术
微型投影仪又称便携式投影机，其把传统庞大的投影机精巧化、便携化、微小化、娱乐化、实用化，使投影技术更加贴近生活和娱乐，具有广泛的应用前景。
对高亮度的微型投影仪来说，其系统总功率较大，如何设计出低噪声、低表面温度的产品是一大难点，所以，系统的散热设计是一大挑战。与此同时，受限于散热模组的尺寸，现有的微型投影仪在保证散热性能的前提下难以进一步减小投影仪的体积。
发明内容
本发明的目的在于提供一种光源固定基板，其具有优良的热传导结构。
本发明的另一目的在于提供一种光源散热机构，其具有散热性能优异且体积小的特点。
本发明的另一目的在于提供一种投影仪，其通过设置上述的散热机构，在保证散热性能的情况下大幅减小了投影仪体积。
本发明的实施例是这样实现的：
一种投影仪光源固定基板，所述光源固定基板包括底面、顶面以及相接于所述底面和所述顶面之间的第一侧面，所述底面与所述顶面相对，所 述光源固定基板设置有至少一个用于插接导热件的安装孔，所述安装孔贯穿所述第一侧面形成供所述导热件插入的入口。
在本发明的一部分实施例中，所述安装孔为通孔，所述安装孔的轴线与所述底面平行。
在本发明的一部分实施例中，所述顶面设置有用于安装电路板的安装槽。
在本发明的一部分实施例中，所述安装槽内设置有通孔，所述通孔贯穿所述底面。
在本发明的一部分实施例中，所述安装孔为至少两个，至少两个所述安装孔分布于所述安装槽的两侧。
一种光源散热机构，包括：上述的光源固定基板、导热件以及散热装置，所述导热件的一端插接于所述安装孔内，另一端从所述入口露出，所述散热装置与所述导热件的露出所述入口的一端连接。
在本发明的一部分实施例中，所述散热装置包括多块散热鳍片，每块所述散热鳍片与所述导热件连接，相邻的所述散热鳍片之间具有预设的间隙。
一种投影仪，包括：上述的光源固定基板、光源、电路板以及散热装置，所述光源可拆卸安装于所述光源固定基板；所述电路板设置于所述顶面并与所述光源电连接，所述导热件的一端插接于所述安装孔内，另一端从所述入口露出，所述散热装置与所述导热件的露出所述入口的一端连接。
在本发明的一部分实施例中，所述顶面设置有用于安装电路板的安装槽，所述电路板被收纳于所述安装槽。
在本发明的一部分实施例中，所述安装槽内设置有通孔，所述通孔贯穿所述底面，所述光源的引脚伸入所述通孔并与所述电路板电连接。
本发明的有益效果包括：通过在光源固定基板上设置安装孔，通过安装孔与用于散热的导热件进行装配，一方面减少了零部件，节省了体积空间，留出了进一步缩小体积的空间，因此，可以应用于投影仪、激光器以及其他使用光源固定基板的设备上。当光源固定基板与导热件连接后，可以直接传热，传热效率提高，更利于散热。
利用上述的光源固定基板，与导热件以及散热装置进行装配后，可以大幅减小光源散热机构的体积。具有该散热机构的投影仪，达到了在保证散热效果的前提下进一步减小体积的效果。
本发明的其他特征和优点将在随后的说明书阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明实施例而了解。本发明的目的和其他优点可通过在所写的说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
为了更清楚地说明本发明实施方式的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本发明的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1是本发明实施例提供的光源固定基板的结构示意图；
图2是图1中沿A-A线的剖面图；
图3是本发明实施例提供的投影仪中散热机构在第一视角下的结构示意图；
图4是本发明实施例提供的投影仪中散热机构在第二视角下的结构示意图；
图5是本发明实施例提供的投影仪中散热机构在第三视角下的结构 示意图；
图6是本发明实施例提供的投影仪中散热鳍片的结构示意图；
图7是本发明实施例提供的投影仪在组装状态时的结构示意图。
附图标记：10-投影仪；20-散热机构；100-光源固定基板；101-底面；102-第一侧面；103-顶面；105-入口；110-安装孔；120-安装槽；130-通孔；200-导热件；300-散热装置；310-散热鳍片；320-连接孔；400-光源；410-引脚；500-电路板。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本发明实施例的组件可以以各种不同的配置来布置和设计。
因此，以下对在附图中提供的本发明的实施例的详细描述并非旨在限制要求保护的本发明的范围，而是仅仅表示本发明的选定实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
在本发明的描述中，需要说明的是，术语“中部”、“上”、“下”、“前”、“后”、“竖直”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，或者是该发明产品使用时惯常摆放的 方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”等仅用于区分描述，而不能理解为指示或暗示相对重要性。
此外，术语“水平”、“竖直”等术语并不表示要求部件绝对水平或悬垂，而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平，并不是表示该结构一定要完全水平，而是可以稍微倾斜。
在本发明的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“连通”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
实施例
请一并参阅图1和图2，本实施例提供一种光源固定基板100，该光源固定基板100为板式结构，其可以应用于微型投影仪等设备。该光源固定基板100由金属材料或金属合金材料制成，如铝、铝合金等，本实施例中，光源固定基板100由铜制成。
请继续参阅图1，光源固定基板100包括底面101、第一侧面102、顶面103以及第二侧面(图未示)，其中，底面101与顶面103相对设置，第一侧面102相接于底面101和顶面103之间，第一侧面102与第二侧面相对。其中底面101用于安装光源400，安装方式包括但不限于焊接、螺纹连接、卡接等。
应当理解，本公开文本中的“底面”、“顶面”仅用于区分说明，不用于限定其特定朝向或位置，例如底面101和顶面103的位置并不特指朝 下或朝上，当光源固定基板100翻转时，底面101也可以位于顶面103上方。
光源固定基板100上设置有安装孔110，该安装孔110可以是通孔或盲孔，本实施例中，安装孔110贯穿第一侧面102形成供导热件插入的入口105，同时安装孔110贯穿第二侧面。此处的导热件是指：用于向外传导热量的零部件，其中、导热件可以是管状、棒状以及其他的形状，导热件的材质可以是金属以及其他材质。
在一些实施方式中，安装孔110的轴线与底面101平行，应当理解，本公开文本中所述的“平行”并不特定限定于两对象为绝对的平行状态，包括两对象为大致平行的状态。所述的“垂直”也不特定限定于两物体为绝对的垂直状态，包括两对象为大致垂直的状态。
安装孔110的数量可以是一个、两个或者两个以上，根据具体的散热需求进行设置即可，作为一种优选的实施方式，当安装孔110的数量为两个或两个以上时，所有的安装孔110的轴线呈相互平行的状态是更为适宜的，这样便于与导热件200以及散热装置300进行装配连接。
本实施例中，安装孔110为两个，且两个安装孔110的轴线相互平行，两个安装孔110均分别贯穿第一侧面102和第二侧面。对于安装孔110的横截面设计，此处的横截面是指垂直于安装孔110的轴线方向的剖切面。根据实际的装配需求，与导热件200匹配即可。例如：当导热件200为圆管或圆棒形状时，安装孔110的横截面形状可以设计为圆形，即安装孔110为圆孔。当导热件200为椭圆形管时，对应的，安装孔110的横截面形状可以设计为椭圆形。本实施例中，作为一种示例，安装孔110的横截面为长圆形，即安装孔110为长圆孔(腰型孔)。
为了进一步的使光源固定基板100在应用时，与其他元件适配并进而实现结构的小型化，例如与电路板500等电学元器件进行适配。
本实施例中，顶面103还设置有安装槽120，安装槽120用于容纳安装电路板500，因此，安装槽120的形状被配置为与对应的电路板500适配的结构，其中，电路板500是用于为供电以及控制光源的元件。本实施例中，安装槽120为大致的条形槽，且安装槽120的两端分别贯穿第一侧面102和第二侧面。
本实施例中，作为一种示例，安装槽120的延伸方向与安装孔110的轴线方向平行，这种设置方式，利于光源固定基板安装光源，尤其是，当光源为多个时，多个光源可以沿安装孔110的轴线方向排布，利于散热。应当理解，在其他实施方式中，安装槽120的延伸方向不需限定，根据实际的使用需要，其可以沿任意方向延伸。
作为一种较为优选的实施方式，本实施例中，安装槽120设置于光源固定基板100的中部，两个安装孔110分布于安装槽120的轴线两侧，这样的设置方式具有以下优点：安装孔110分布较为均匀，在与导热件200进行装配后，可以达到均匀散热的效果，提高散热效率，防止光源固定基板100局部过热。
在一些实施方式中，安装孔110的数量多于两个，此时，也可以采用类似的方式将多个安装孔110均匀分布于安装槽120的轴线两侧。
在光源固定基板100使用时，安装于安装槽120内的电路板500需要与光源400电连接，因此，为了方便装配，安装槽120内设置有通孔130，通孔130连通安装槽120并且贯穿底面101，在一些实施方式中，通孔130以其轴线垂直于底面的方式贯穿底面。通孔130的数量根据光源400的数量进行设置，通常每个光源400设置有2个用于电连接的引脚410，因此较为优选的实施方式是将通孔130设置成与光源400的引脚410配合的形式。
本实施例中，作为一种示例：参阅图1和图2，通孔130为圆形孔， 且通孔130的直径略大于安装槽120的宽度，该通孔130可同时供光源400的所有引脚410穿过。其中，安装槽120内设置有两个通孔130，两个通孔130间隔一定距离设置。
本实施例中提供的光源固定基板100可以应用于微型投影仪10以及其他的需要设置光源固定基板100的设备中，由于该光源固定基板100的结构可以直接与导热件200进行装配，且通过安装槽120容纳电路板500，其不需要设置额外的元件，用于与导热件200进行连接，因此可以进一步降低微型投影仪10的体积，同时保持良好的散热性能。
基于上述的光源固定基板100，本实施例还提供一种投影仪10，投影仪10包括光源固定基板100、导热件200、散热装置300、光源400以及电路板500。其中，光源固定基板100、导热件200以及散热装置300连接形成散热机构20，将包括光源产生的热量向外传递。光源400可拆卸的安装于电源固定基板100的底面101，电路板500设置于顶面103的安装槽120内。
请一并参阅图3、图4、图5，图3-图5中示出了本实施例中投影仪10的散热机构20、光源400以及电路板500的结构，应当理解，投影仪10还包括外壳等其他部件，由于投影仪10的其他零件不属于本发明的重点，图中均未示出，本领域技术人员参考现有技术即可实现，在此不做赘述。
具体地，散热机构20包括光源固定基板100、导热件200以及散热装置300，其中光源固定基板100的结构参阅前述部分。导热件200的一端从入口105伸入安装孔110与光源固定基板100连接，另一端与散热装置300连接，起到热量传导的作用。
导热件200用于将光源固定基板100上的热量传递给散热装置300，本实施例中，导热件200为热管，其形状与光源固定基板100的长圆形安 装孔110匹配，其横截面为长圆形。导热件200的数量为两个，两个导热件200与两个安装孔110一一对应，装配时，导热件200从第一侧面102的入口105伸入安装孔110并形成固定。应当理解，导热件200与安装孔110的固定方式包括但不限于螺纹连接、卡接、过盈配合等，本实施例中，导热件200伸入安装孔110内并与光源固定基板100焊接固定。
导热件200可以是实心和/或中空结构，当导热件200选用中空式结构时，其内部还可以填充其他导热材料。
散热装置300包括多块层叠的散热鳍片310，散热鳍片310的结构如图6所示，本实施例中，散热鳍片310为方形板状，由热传导效率高的材料制成，如铝、铜等。散热鳍片310上设置有连接孔320，连接孔320用于供导热件200穿过，因此连接孔320的数量与导热件200的数量相同，本实施例中，同导热件200的数量相同，连接孔320的数量为两个，且两个连接孔320的轴线均垂直于散热鳍片310。装配时，两个导热件200分别伸入连接孔320内并与散热鳍片310连接，连接方式优选为焊接。
应当理解，图6中示出的散热鳍片310的结构仅是一种示例，在其他的实施方式中，散热鳍片310可以是圆形、椭圆形、长圆形等其他各种形状，其上设置的连接孔310的位置也可以根据具体的应用环境进行改变。连接孔310的数量也可以根据导热件200的数量进行相应调整。
本实施例中，多块散热鳍片310在与导热件200垂直的平面上的投影相互重合，这种设置方式最大限度的减小了散热装置的体积，更利于进一步缩小投影仪10体积。应当理解，同一散热装置300中的散热鳍片310并不必须采用相同结构，例如：同一散热装置300中，同时选用矩形、圆形的散热鳍片，层叠方式也不必须保持相互平行或保持相同间距。
每块散热鳍片310均与导热件200连接并呈相互大致平行的状态，相邻的散热鳍片310之间具有间隙，该间隙根据热量传导的需求进行预设。 散热鳍片310的数量根据散热的需求进行设置，例如5块、10块等，相邻散热鳍片310的间隙距离例如可以是0.5mm-1cm等。
在一些实施方式中，散热装置300的数量可以为多个，例如将导热件200的一部分穿出第二侧面，在导热件200的穿出第二侧面的部分连接一散热装置300，以达到更好的散热效果。
光源400可以是气体放电光源400、LED光源400或激光光源400，本实施例中，光源400为激光光源400，光源400包括两根引脚410，引脚410由导体制成，用于与电路板500电连接。
电路板500用于为光源400供电并控制光源400，电路板500设置于安装槽120内，并整体容纳于安装槽120内，光源400设置于底面101，光源400的引脚410伸入通孔130并与电路板500电连接在一起。
在其他实施方式中，根据电路板500以及光源固定基板100的尺寸大小，电路板500也可以只部分的容纳于安装槽120内，例如：电路板500在长度方向上的尺寸大于光源固定基板100的安装槽120的长度，此时，电路板500的一部分可以伸出安装槽120。
本实施例提供的投影仪10在工作时，光源400以及电路板500产生的热量传递至光源固定基板100上，再通过导热件200传递至散热装置300的散热鳍片310上，通过散热鳍片310将热量向外散射，由于不需要在光源固定基板100只上增加导热件200的固定基板，同时电路板500倍容纳于光源固定基板100内，无需额外占用体积，因此进一步降低了微型投影仪10的体积，同时，由于光源固定基板100上的热量直接传导至导热件200，传热的效率也进一步提高，基于上述技术效果，本实施例提供的投影仪10进一步实现了结构的小型化。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精 神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种光源固定基板，其特征在于，所述光源固定基板包括底面、顶面以及相接于所述底面和所述顶面之间的第一侧面，所述底面与所述顶面相对，所述光源固定基板设置有至少一个用于插接导热件的安装孔，所述安装孔贯穿所述第一侧面形成供所述导热件插入的入口。
  2. 根据权利要求1所述的光源固定基板，其特征在于，所述安装孔为通孔，所述安装孔的轴线与所述底面平行。
  3. 根据权利要求1所述的光源固定基板，其特征在于，所述顶面设置有用于安装电路板的安装槽。
  4. 根据权利要求3所述的光源固定基板，其特征在于，所述安装槽内设置有通孔，所述通孔贯穿所述底面。
  5. 根据权利要求3所述的光源固定基板，其特征在于，所述安装孔为至少两个，至少两个所述安装孔分布于所述安装槽的两侧。
  6. 一种光源散热机构，其特征在于，包括：
    权利要求1-5任一项所述的投影仪光源固定基板；
    导热件，所述导热件的一端插接于所述安装孔内，另一端从所述入口露出，以及；
    散热装置，所述散热装置与所述导热件的露出所述入口的一端连接。
  7. 根据权利要求6所述的光源散热机构，其特征在于，所述散热装置包括多块层叠的散热鳍片，每块所述散热鳍片与所述导热件连接，相邻的所述散热鳍片之间具有预设的间隙。
  8. 一种投影仪，其特征在于，包括：
    权利要求1所述的投影仪光源固定基板；
    光源，所述光源可拆卸安装于所述光源固定基板的所述底面；
    电路板，所述电路板设置于所述顶面并与所述光源电连接；
    导热件，所述导热件的一端插接于所述安装孔内，另一端从所述入口 露出，以及；
    散热装置，所述散热装置与所述导热件的露出所述入口的一端连接。
  9. 根据权利要求8所述的投影仪，其特征在于，所述顶面设置有用于安装电路板的安装槽，所述电路板被收纳于所述安装槽。
  10. 根据权利要求9所述的投影仪，其特征在于，所述安装槽内设置有通孔，所述通孔贯穿所述底面，所述光源的引脚伸入所述通孔并与所述电路板电连接。
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