WO2019213853A1 - 基板、基板的检测装置及切割方法 - Google Patents

基板、基板的检测装置及切割方法 Download PDF

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Publication number
WO2019213853A1
WO2019213853A1 PCT/CN2018/086088 CN2018086088W WO2019213853A1 WO 2019213853 A1 WO2019213853 A1 WO 2019213853A1 CN 2018086088 W CN2018086088 W CN 2018086088W WO 2019213853 A1 WO2019213853 A1 WO 2019213853A1
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Prior art keywords
substrate
cutting
mark
indication
luminescent material
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English (en)
French (fr)
Inventor
林盈妃
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to CN201880093887.XA priority Critical patent/CN112640049A/zh
Priority to PCT/CN2018/086088 priority patent/WO2019213853A1/zh
Publication of WO2019213853A1 publication Critical patent/WO2019213853A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a substrate, a substrate detecting device, and a cutting method.
  • a conventional display device such as a liquid crystal display (LCD) device, a plasma display device (PDP), an organic light emitting diode (OLED) display device, or the like is formed by performing an overall process on a display panel mother board and then cutting and separating.
  • LCD liquid crystal display
  • PDP plasma display device
  • OLED organic light emitting diode
  • Embodiments of the present invention provide a substrate, a substrate detecting device, and a cutting method, which can solve the problem that the cutting accuracy is not high when the substrate is cut.
  • a substrate comprising a plurality of spaced apart first regions, the adjacent first regions being provided with indicia for creating an indication of guiding the cut under the first condition.
  • the indication includes a lighting indication
  • the substrate is a display panel motherboard
  • the first area is a display area
  • the mark is disposed in a non-display area between adjacent display areas.
  • the indicia comprises a dicing street provided with a layer of luminescent material.
  • a detecting device for the above substrate comprising an acquiring module for capturing the indication, and further comprising an emitting source that provides a first condition.
  • the emission source includes a light source that excites the marker illumination.
  • the acquisition module includes a camera module for capturing an image of a substrate, and a control center connecting the emission source and the camera module.
  • the present invention also provides a method of substrate cutting comprising: forming a mark on a surface of a substrate; causing the mark to generate an indication of guiding the cut under the first condition; and capturing the indication, cutting the substrate according to the indication.
  • the indicia comprises a layer of luminescent material forming a scribe line. Instructing the indicia to initiate the cutting under the first condition comprises: exciting the layer of emissive material by the light source to cause the layer of emissive material to illuminate.
  • the present invention can effectively guide the cutting device by marking the indication generated under the first condition, so that the cutting position is positioned more accurately, and the cutting precision and the yield are improved.
  • FIG. 1 is a schematic structural view of a substrate according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural view of a mask used for a substrate vapor deposition mark according to a first embodiment of the present invention
  • FIG. 3 is a schematic structural view of a substrate detecting apparatus according to a second embodiment of the present invention.
  • FIG. 4 is a schematic view showing changes in marks of a flexible substrate before and after wrinkles appear in a third embodiment of the present invention.
  • FIG. 5 is a flow chart of a substrate cutting method according to a fourth embodiment of the present invention.
  • FIG. 6 is a flow chart of a capture indication in a substrate cutting method according to a fourth embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a substrate 100 according to a first embodiment of the present invention.
  • the substrate 100 includes a plurality of spaced apart first regions 102 with a mark 106 disposed between adjacent first regions 102 for creating an indication of guiding the cut under the first condition.
  • the substrate 100 is a display panel mother board
  • the first area 102 is a display area
  • the mark 106 is disposed in the non-display area 104 between the adjacent display areas 102
  • the mark 106 includes a cut track.
  • the first regions 102 may have only one row, in which case the indicia 106 are parallel to the dicing streets disposed between the first regions 102.
  • the first regions 102 may also be arranged in an array, and the indicia 106 may be arranged along the contour of the circumference of the first region 102.
  • the cutting device cuts the display panel motherboard along the mark 106 to form a plurality of separated first regions 102.
  • the first area 102 may include an effective display area (AA) for subsequently forming a display panel product; the mark 106 may be disposed in the second area 104 in the X direction, the Y direction, or the X, Y interlaced direction.
  • the second area 104 is a non-display area.
  • each of the first regions 102 is identical in shape and size, and the indicia 106 disposed along the contour of the first region 102 is in a straight line.
  • the width of the mark 106 on the surface of the substrate 100 is between 1 and 100 mm.
  • the shape and size of each of the first regions 102 may be determined according to the final display panel product, that is, the shape and size of the first regions 102 may also be inconsistent, and the marks along the contours around the first region 102 may be arranged.
  • the shape of 106 is other curves or polylines.
  • the indicia 106 located in the non-display area 104 can produce a corresponding indication under the first condition.
  • the mark 106 can be a layer of luminescent material, such as a layer of photoluminescent material, and the corresponding first condition is, for example, ultraviolet light.
  • the position of the mark 106 of the display panel mother board realizes illumination.
  • the cutting device detects the identification mark 106, determines a cutting path of the display panel mother board based on the detected range of the markings 106, and performs laser cutting along the cutting path to form a plurality of separated first regions 102.
  • the first condition and its corresponding indication are not limited herein, as long as the corresponding indication can be realized under the first condition.
  • the material is marked as being illuminable under the excitation of infrared light.
  • the first condition is an infrared light source, and the corresponding indication is that the light is emitted under the infrared light source;
  • the mark may be a reflective material, and the first condition is visible field illumination, corresponding Indicated as reflected light produced by the light-reflecting substance under illumination of the light field;
  • the mark may be an electroluminescent material, the first condition being an electric field, the corresponding indication being that the electroluminescent material emits light under the action of an electric field; and, for example, labeled as a magnetic material
  • the first condition is a non-magnetic field environment, and the corresponding indication is a magnetic line of force generated by the magnetic material in a non-magnetic field environment.
  • the apparatus for detecting the indication 106 may, for example, select an automatic optical
  • the luminescent material is vapor-deposited on the surface of the substrate 100 by the mask 200 shown in FIG. 2 to form a mark 106 for guiding cutting, and the mark 106 includes a dicing street.
  • FIG. 2 it is a schematic structural view of a mask 200 used for the vapor deposition mark 106 of the substrate 100 according to the first embodiment of the present invention. Specifically, taking the substrate 100 as a display panel motherboard, the mask 200 includes a plurality of openings 202, and the shape of the opening 202 corresponds to the shape and size of the cutting lane of the display panel motherboard to be vapor-deposited.
  • the luminescent material passes through the respective openings 202 and is deposited on the display panel mother board to be vapor-deposited to form the marks 106.
  • the layer of vapor deposited luminescent material has a width between 1 and 100 mm at the surface of the scribe line.
  • the specific vapor deposition process is a conventional means by those skilled in the art and will not be described herein.
  • the manner in which the luminescent material layer is formed is not limited, such as by inkjet. Printing, coating, transfer, etc.
  • the marking material 106 is formed by vapor-depositing the luminescent material that can be excited by the light source on the surface of the display panel mother board, so that the cutting area of the display panel mother board is clear and complete, and is not easily affected by processes such as external processes and environment, and is improved. The precision of the cut.
  • the present invention is formed with a mark 106 that can produce a guide cutting indication under the first condition, so that the cutting device can cut the substrate 100 along the cutting instruction, which is not only efficient, but also ensures cutting precision.
  • FIG. 3 is a schematic structural diagram of a detecting apparatus 300 for the above substrate 100 according to a second embodiment of the present invention.
  • the detection device 300 includes an acquisition module 304 for capturing an indication 106 and an emission source 302 providing a first condition.
  • the emission source 302 includes a light source capable of exciting the illumination of the marker 106.
  • the acquisition module 304 includes a camera module 306 for capturing an image of the substrate 100, and a control center 308 connecting the emission source 302 and the camera module 306.
  • the detection light source 302 of the detector is, for example, an ultraviolet light source.
  • the wavelength of the ultraviolet light source is 365 nm
  • the camera module 306 is a camera capable of acquiring an image of the substrate 100.
  • the control center 308 is connected to the ultraviolet light source and the camera to control the light source and process the image of the collected substrate 100.
  • control center 308 controls the ultraviolet light source to illuminate the display panel motherboard of the above embodiment, and after acquiring the image of the display panel motherboard, the camera transmits the image to the control center 308 through the signal transmission device.
  • the control center 308 compares the acquired image with the reference image to detect the scribe line covered by the ultraviolet luminescent material.
  • the reference image refers to an image of the display panel motherboard prior to evaporation of the photoluminescent material layer.
  • the control center 308 can also directly identify the scribe lines that display the illumination in the master image without having to contrast with the reference image.
  • the detecting device 300 is not only an automatic optical detector, but any other device capable of detecting the corresponding mark 106 by the light source is not limited thereto.
  • the detecting device 300 for the substrate 100 provided by the present invention can also detect whether the substrate 100 has wrinkles according to the mark 106.
  • FIG. 4 is a schematic diagram of the change of the mark 106 before and after the wrinkles of the substrate 100 according to the third embodiment of the present invention.
  • the lengths of the marks 106 on the substrate 100 in the lateral and longitudinal directions are L1 and L2, respectively.
  • the mark 106 will also have wrinkles, that is, L1 and L2 of the mark 106 change correspondingly, which is smaller than the preset value.
  • the camera module 306 of the detecting device 300 of the substrate 100 sends it to the control center 308, and the control center 308 sets the parameters of the captured mark 106, namely L1 and L2, with The parameters of the marker 106 are compared and analyzed.
  • the control center 308 determines that the substrate 100 has wrinkles.
  • the detecting device 300 can also be connected to a cutting device, such as a laser cutting device. After detecting the mark 106, the control center 308 guides the laser cutting device to cut the display panel mother board along the mark 106, and finally cuts the display panel mother board into multiple pieces. The separated first region 102.
  • the display panel mother board can be cut using a laser or a diamond cutter is used, and the cutting manner is not limited herein.
  • the detecting device 300 of the substrate 100 provided by the above embodiment can illuminate the corresponding luminescent material layer on the scribe line by the light source, and can accurately position the scribe line. And when the substrate 100 is a flexible material, it can be determined whether the substrate 100 has wrinkles by comparing the width of the mark 106 in the lateral direction and the longitudinal direction with a preset value.
  • FIG. 5 is a flowchart of a method for cutting a substrate 100 according to a fourth embodiment of the present invention.
  • the specific cutting method can be achieved by the following steps:
  • a luminescent material is evaporated on the surface of the dicing street, and the luminescent material includes, but is not limited to, a photoluminescent material, such as 8-hydroxyquinoline aluminum (ALq3), N, N'-diphenyl-N, N'-(1-Naphthyl)-1,1'-biphenyl-4,4'-diamine (NPB).
  • the luminescent material layer for example, is deposited on the surface of the scribe line by the mask 200 of the first embodiment to form the mark 106.
  • the mask 200 includes a plurality of openings 202 having a shape corresponding to the shape and size of the dicing streets of the display panel motherboard to be vapor-deposited.
  • the luminescent material passes through the respective openings 202 and is deposited on the dicing streets corresponding to the display panel mother boards to be evaporated to form the marks 106.
  • the specific vapor deposition process is a conventional means by those skilled in the art and will not be described herein.
  • the layer of vapor deposited luminescent material has a width between 1 and 100 mm at the surface of the scribe line.
  • the light source 302 of the automatic optical detector is set as an ultraviolet light source, and under the irradiation of ultraviolet light, the ultraviolet luminescent material layer on the dicing street of the display panel mother board is excited to emit light, so that the display panel mother board needs The position of the cut produces an indication of illumination.
  • step S403. Capture the instruction of step S402, and cut the substrate 100 according to the instruction.
  • FIG. 6 is a flowchart of the capture indication in the cutting method of the substrate 100 according to the fourth embodiment of the present invention.
  • the control center 308 of the detecting device acquires the image of the substrate 100; S432, the control center 308 compares the acquired image with the reference image, S433, and detects the coverage of the luminescent material layer.
  • the cutting lane ie the marking 106.
  • reference image refers to an image of the display panel motherboard prior to evaporation of the photoluminescent material layer.
  • the control center 308 After detecting the scribe line covered by the luminescent material layer, the control center 308 directs the cutting device to cut the display panel motherboard along the indicia 106. It can be understood that the present embodiment can use a laser to cut the display panel mother board or use a diamond cutter, and the cutting manner is not limited herein.
  • the luminescent material forming the mark remains on the cutting edge and can be selectively removed or retained without affecting the subsequent process.
  • the luminescent material after cutting can be retained.
  • the direct cutting of the present invention forms a cutting path without It is necessary to form a cutting path by using a cutter wheel, thereby preventing a foreign matter from being cut in the cutting path when the cutting wheel is cut, resulting in poor cutting.
  • the marking of the present invention is formed by vapor-depositing a luminescent material, and the forming process thereof can be integrated in the manufacturing process of the display region on the substrate without separately designing the process, thereby improving the overall manufacturing efficiency and saving the manufacturing cost.
  • the marking of the present invention can effectively avoid the problem of missing marks due to the process.
  • the marking formed by evaporating the luminescent material is more precise, and the overall cutting accuracy can be improved.
  • the captured mark can be compared with the parameters of the preset mark by the detecting device of the substrate to determine whether the substrate has wrinkles.

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Abstract

本发明涉及显示技术领域，公开了一种基板、基板的检测装置及切割方法。该基板包括多个间隔设置的第一区域，相邻的第一区域之间设有标记，标记用于在第一条件下产生引导切割的指示。该用于基板的检测装置包括用于捕获指示的获取模块和提供第一条件的发射源，所述发射源包括能激发标记发光的光源。该基板的切割方法包括，在基板的表面上形成标记；在第一条件下使标记产生引导切割的指示；以及捕获所述指示，根据所述指示对基板进行切割。本发明所提供的基板及其检测装置和切割方法使切割位置定位更精确，提高了切割精度和良率。

Description

基板、基板的检测装置及切割方法 技术领域
本发明涉及显示技术领域，尤其涉及一种基板、基板的检测装置及切割方法。
背景技术
现有的显示装置例如液晶显示(LCD)装置、等离子体显示装置(PDP)、有机发光二极管(OLED)显示装置等，均是在显示面板母板上进行整体工艺制作后再切割分离。然而，现有技术中对于如何引导切割并没有给出很好的解决办法，影响了切割精度。
发明内容
本发明的实施方式提供了一种基板、基板的检测装置及切割方法，能够解决基板切割时切割精度不高的问题。
一种基板，包括多个间隔设置的第一区域，相邻的第一区域之间设有标记，标记用于在第一条件下产生引导切割的指示。所述指示包括发光指示，所述基板为显示面板母板，所述第一区域为显示区域，标记设于相邻显示区域之间的非显示区域。所述标记包括切割道，所述切割道表面设置有发光材料层。
一种用于上述基板的检测装置，所述检测装置包括用于捕获所述指示的获取模块，还包括提供第一条件的发射源。所述发射源包括能激发标记发光的光源。所述获取模块包括用于捕获基板图像的摄像模组，以及连接所述发射源和所述摄像模组的控制中心。
本发明还提供了一种基板切割的方法，包括：在基板的表面上形成标记；在第一条件下使标记产生引导切割的指示；以及捕获所述指示，根据所述指示 对基板进行切割。所述标记包括形成切割道的发光材料层。在第一条件下使标记产生引导切割的指示，包括：通过光源激发发光材料层，使发光材料层发光。
由于采用上述技术方案，本发明通过标记在第一条件下产生的指示，可以有效地引导切割装置，使切割位置定位更精确，提高了切割精度和良率。
附图说明
下列附图用于结合具体实施方式详细说明本发明的各个实施方式。应当理解，附图中示意出的各元件并不代表实际的大小及比例关系，仅是为了清楚说明而示意出来的示意图，不应理解成对本发明的限制。
图1是本发明第一实施例提供的基板的结构示意图；
图2是本发明第一实施例提供的基板蒸镀标记所用的掩膜板的结构示意图；
图3是本发明第二实施例提供基板检测装置的结构示意图；
图4是本发明第三实施例提供的柔性基板出现褶皱前后标记变化的示意图；
图5是本发明第四实施例提供的基板切割方法的流程图；
图6是本发明第四实施例提供的基板切割方法中捕获指示的流程图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合多个实施方式及附图，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施方式仅仅用以解释本发明，并不用于限定本发明。并且，各附图中所显示的内容不代表本发明各元件的实际比例关系，仅做示意。
请参阅图1，其是本发明第一实施例提供的基板100的结构示意图。基板100包括多个间隔设置的第一区域102，相邻的第一区域102之间设有标记106，该标记106用于在第一条件下产生引导切割的指示。具体地，本实施例中基板 100为显示面板母板，第一区域102为显示区域，标记106设于相邻显示区域102之间的非显示区域104，标记106包括切割道。第一区域102可以仅有一排，此时标记106为平行设于各第一区域102之间的切割道。可选地，第一区域102也可以呈阵列式排布，标记106可以沿着第一区域102的周围轮廓布置。在显示面板母板完成整体工艺制作后，切割装置沿标记106对显示面板母板进行切割，可以形成多个分离的第一区域102。
具体地，第一区域102可以包括后续用于形成显示面板产品的有效显示区域(Active Area，AA)；标记106可沿X方向、Y方向、或X、Y交错的方向设置于第二区域104，第二区域104为非显示区域。
在本实施例中，各个第一区域102形状和大小一致，沿第一区域102周围轮廓布置的标记106呈直线。较佳地，标记106在基板100表面的宽度在1-100mm之间。当然，在其他实施例中，各个第一区域102的形状和大小可以根据最终的显示面板产品来决定，即第一区域102的形状和大小也可以不一致，沿第一区域102周围轮廓布置的标记106的形状为其它曲线或折线。
位于非显示区域104的标记106在第一条件下可产生相应的指示。具体的，标记106可为一层发光材料层，例如光致发光材料层，相应的第一条件例如为紫外光照射。在显示面板母板完成整体工艺制作进入切割制程时，在紫外光的照射下，显示面板母板的标记106位置实现发光。切割装置检测识别出标记106，根据检测到的标记106的范围确定显示面板母板的切割路径，沿切割路径进行激光切割以形成多个分离的第一区域102。
此处对第一条件及其相应的指示不作限制，只要在第一条件下可实现相应的指示即可。例如，标记为可在红外光的激发下发光的材料，第一条件为红外光光源，相应的指示为在红外光光源下发光；标记可为反光物质，第一条件为可见光场照射，相应的指示为反光物质在光场照射下产生的反射光；标记可为电致发光材料，第一条件为电场，相应的指示为电致发光材料在电场的作用下发光；又例如，标记为磁性材料，第一条件为非磁场环境，相应的指示为磁性材料在非磁场环境下产生的磁力线。检测指示106的装置例如可以选择自动光 学检测仪等，在此不作限制。
此处，发光材料通过图2所示的掩膜板200蒸镀在基板100表面而形成引导切割的标记106，标记106包括切割道。如图2所示，其是本发明第一实施例提供的基板100蒸镀标记106所用的掩膜板200的结构示意图。具体地，以基板100为显示面板母板为例，掩膜板200包括多个开口202，开口202的形状与待蒸镀显示面板母板的切割道的形状和尺寸对应。在进行真空蒸镀时，发光材料穿过各个开口202，沉积于对应待蒸镀的显示面板母板，以形成标记106。较佳地，蒸镀的发光材料层在切割道表面的宽度在1-100mm之间。具体的蒸镀工序为本领域技术人员惯用手段，在此不再赘述。
除了本实施例提供的利用蒸镀使发光材料覆盖显示面板母板表面形成标记106之外，其他能达到相同效果的方法同样适用，在此对发光材料层的形成方式不作限制，比如通过喷墨打印、涂布、转印等方式。
本实施例通过将能够被光源所激发的发光材料蒸镀在显示面板母板表面上形成标记106，使显示面板母板的切割区域清晰完整，且不易受外部制程等工艺以及环境影响，提高了切割的精度。
相比于现有技术，本发明形成有在第一条件下可产生引导切割指示的标记106，使得切割装置可沿着切割指示对基板100进行切割，不仅效率高，且可确保切割精度。
请参阅图3，其是本发明第二实施例提供的用于上述基板100的检测装置300的结构示意图。该检测装置300包括用于捕获指示106的获取模块304和提供第一条件的发射源302。发射源302包括能激发标记106发光的光源，获取模块304包括用于捕获基板100图像的摄像模组306，以及连接所述发射源302和所述摄像模组306的控制中心308。
具体地，本实施例以自动光学检测仪为例来说明该检测装置300的工作原理。如图3所示，该检测仪的检测光源302例如为紫外光光源，优选的，例如紫外光源的波长为365nm，摄像模组306为能采集基板100图像的摄像头。控制中心308连接紫外光光源与摄像头，对光源进行控制，并对采集到的基板100 的图像进行处理。
具体地，控制中心308控制紫外光光源照射上述实施例的显示面板母板，摄像头在获取到显示面板母板的图像后，通过信号传输装置将该图像发送至控制中心308。控制中心308将获取的图像与参考图像进行对比，检测出紫外发光材料所覆盖的切割道。可以理解的是，参考图像是指显示面板母板在蒸镀光致发光材料层之前的图像。通过分析亮度，控制中心308也可以直接识别出显示母板图像中的发光的切割道，而无需与参考图像对比。
值得注意的是，检测装置300不仅为自动光学检测仪，其他任何能够通过光源来检测相应标记106的装置都包括在内，在此并不以此为限。
当基板100为柔性材料时，本发明提供的用于上述基板100的检测装置300，还能够根据标记106来检测基板100是否出现褶皱。具体请参阅图4，其是本发明第三实施例提供的基板100出现褶皱前后标记106变化的示意图。如a1所示，标记106在基板100上横向和纵向的长度分别为L1和L2。如a2所示，当基板100出现褶皱时，标记106也随之会产生褶皱，即标记106的L1和L2相应变化，小于预设值。基板100的检测装置300的摄像模组306在捕获到基板100上的标记106后，会将其发送至控制中心308，控制中心308将捕获到的标记106的参数，即L1和L2，与预设的标记106的参数进行对比和分析，当L1和L2的数值小于预定的数值，控制中心308判断该基板100产生了褶皱。
检测装置300还可与切割装置，如激光切割装置连接，在检测到标记106后，控制中心308引导激光切割装置沿标记106对显示面板母板进行切割，最终将显示面板母板切割为多个分离的第一区域102。本实施例可以使用激光对显示面板母板进行切割，或者使用金刚石刀具，在此对切割方式不进行限制。
上述实施例提供的基板100的检测装置300，通过光源激发切割道上相应的发光材料层发光，能够非常精确的定位切割道的位置。并且当基板100为柔性材料时，可以通过检测标记106在横向和纵向上宽度，与预设值对比后判断基板100是否发生了褶皱。
请参阅图5，其是本发明第四实施例提供的基板100切割方法的流程图。 具体切割方法可通过如下步骤实现：
S401、在基板100的表面上形成标记106；
本实施例中，在切割道表面蒸镀一层发光材料，发光材料包括但不限于光致发光材料，例如为8-羟基喹啉铝(ALq3)、N,N‘-二苯基-N,N’-(1-萘基)-1,1‘-联苯-4,4’-二胺(NPB)。该发光材料层，例如通过实施例一所述的掩膜板200蒸镀在切割道位置表面以形成标记106。具体的，掩膜板200包括多个开口202，开口202的形状与待蒸镀显示面板母板的切割道的形状和尺寸对应。在进行真空蒸镀时，发光材料穿过各个开口202，沉积在对应待蒸镀的显示面板母板的切割道上面，以形成标记106。具体的蒸镀工序为本领域技术人员惯用手段，在此不再赘述。较佳地，蒸镀的发光材料层在切割道表面的宽度在1-100mm之间。
除了本实施例提供的利用蒸镀使发光材料覆盖显示面板母板的切割道之外，其他能达到相同效果的方法同样适用，例如，通过喷墨打印、涂布、转印等方式，在此对发光材料层的形成方式不作限制。
S402、在第一条件下使标记106产生引导切割的指示；
本实施例中，将自动光学检测仪的光源302设定为紫外光源，在紫外光的照射下，显示面板母板的切割道上的紫外发光材料层被激发而发光，从而在显示面板母板需要切割的位置产生发光指示。
S403、捕获步骤S402的指示，根据指示对基板100进行切割。
具体的，此处参阅图6，其是本发明第四实施例提供的基板100的切割方法中捕获指示的流程图。在摄像模组306拍摄到基板100的图像后，S431，检测装置的控制中心308获取基板100的图像；S432，控制中心308对比获取的图像与参考图像，S433，检测出发光材料层所覆盖的切割道，即标记106。
可以理解的是，参考图像是指显示面板母板在蒸镀光致发光材料层之前的图像。
在检测出发光材料层所覆盖的切割道后，控制中心308引导切割装置沿标记106对显示面板母板进行切割。可以理解的是，本实施例可以使用激光对显 示面板母板进行切割，或者使用金刚石刀具，在此对切割方式不进行限制。
在切割之后，切割边缘仍会残留有形成标记的发光材料，可选择性地去除或保留，并不影响后续的制程。优选地，可以保留切割后的发光材料。
相比于采用先形成切割标记，然后沿着切割标记采用切割刀轮形成切割道，最后再用激光沿着切割道切割的方式来说，本发明的直接通过标记的方式形成切割道，而不需要用切割刀轮来形成切割道，因而可防止在切割刀轮切割时切割路径有异物导致切割不良的情况。并且，本发明的标记是通过蒸镀发光材料形成的，其形成过程可集成在基板上的显示区域的制造过程中，而无需单独设计制程，可提升整体的制作效率，节省制作成本。另外，本发明的标记可有效避免由于工艺制程所导致的标记缺失问题。进一步地，通过蒸镀发光材料所形成的标记的精度更高，可提升整体的切割精度。此外，当基板为柔性材料时，可通过基板的检测装置将捕获到的标记与预设的标记的参数进行对比后，判断基板是否出现褶皱。
以上所述仅为本发明的较佳实施方式而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (27)

  1. 一种基板，包括多个间隔设置的第一区域，其特征在于，相邻的第一区域之间设有标记，所述标记用于在第一条件下产生引导切割的指示。
  2. 如权利要求1所述的基板，其特征在于，所述指示包括发光指示。
  3. 如权利要求1所述的基板，其特征在于，所述基板为显示面板母板。
  4. 如权利要求1所述的基板，其特征在于，所述第一区域为显示区域，标记设于相邻显示区域之间的非显示区域。
  5. 如权利要求1所述的基板，其特征在于，所述标记包括切割道。
  6. 如权利要求5所述的基板，其特征在于，所述标记包括形成切割道的发光材料层。
  7. 如权利要求6所述的基板，其特征在于，所述发光材料层为光致发光材料层。
  8. 如权利要求1所述的基板，其特征在于，所述第一条件为紫外光照射。
  9. 如权利要求5所述的基板，其特征在于，所述切割道的宽度在1-100mm之间。
  10. 如权利要求6所述的基板，其特征在于，所述发光材料层通过掩膜板蒸镀在基板切割道表面而形成标记。
  11. 如权利要求10所述的基板，其特征在于，所述掩膜板具有与切割道位置对应设置的开口。
  12. 一种用于权利要求1-11任一项的基板的检测装置，其特征在于，所述检测装置包括用于捕获所述指示的获取模块。
  13. 如权利要求12所述的基板的检测装置，其特征在于，所述检测装置还包括提供第一条件的发射源。
  14. 如权利要求13所述的基板的检测装置，其特征在于，所述发射源包括能激发标记发光的光源。
  15. 如权利要求13所述基板的的检测装置，其特征在于，所述获取模块包括用于获取基板图像的摄像模组，以及连接所述发射源和所述摄像模组的控制中心。
  16. 如权利要求14所述的基板的检测装置，其特征在于，所述光源包括紫外光光源。
  17. 如权利要求15所述的基板的检测装置，其特征在于，所述控制中心对所述发射源进行控制，并处理所述摄像模组采集到的所述基板的图像。
  18. 如权利要求17所述的基板的检测装置，其特征在于，所述控制中心处理所述基板的图像包括：对比所述获取的图像与参考图像，检测出所述标记的位置。
  19. 如权利要求18所述的基板的检测装置，其特征在于，所述参考图像为基板在设置标记之前的图像。
  20. 一种基板切割的方法，其特征在于，
    在基板的表面上形成标记；
    在第一条件下使标记产生引导切割的指示；
    捕获所述指示，根据所述指示对基板进行切割。
  21. 如权利要求20所述的基板切割的方法，其特征在于，所述标记包括形成切割道的发光材料层。
  22. 如权利要求21所述的基板切割的方法，其特征在于，所述在第一条件下 使标记产生引导切割的指示，包括：通过光源激发所述发光材料层，使所述发光材料层发光。
  23. 如权利要求22所述的基板切割的方法，其特征在于，所述光源包括紫外光源。
  24. 如权利要求21所述的基板切割的方法，其特征在于，所述在基板的表面上形成标记，包括：通过蒸镀的方式在所述基板的表面上形成所述发光材料层。
  25. 如权利要求21所述的基板切割的方法，其特征在于，所述捕获所述指示，包括：
    获取所述基板的图像，对比所述获取的图像与参考图像，检测出所述发光材料层所覆盖的切割道。
  26. 如权利要求25所述的基板切割的方法，其特征在于，所述参考图像为基板在设置所述发光材料层之前的图像。
  27. 如权利要求22所述的基板切割的方法，其特征在于，所述发光材料层在切割之后残留在基板上。
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