CN112640049A - 基板、基板的检测装置及切割方法 - Google Patents
基板、基板的检测装置及切割方法 Download PDFInfo
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- CN112640049A CN112640049A CN201880093887.XA CN201880093887A CN112640049A CN 112640049 A CN112640049 A CN 112640049A CN 201880093887 A CN201880093887 A CN 201880093887A CN 112640049 A CN112640049 A CN 112640049A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000001514 detection method Methods 0.000 title abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract 3
- 239000000463 material Substances 0.000 claims description 47
- 230000008569 process Effects 0.000 claims description 12
- 238000001704 evaporation Methods 0.000 claims description 11
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
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- 230000000717 retained effect Effects 0.000 description 2
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- 238000007738 vacuum evaporation Methods 0.000 description 2
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- 230000037303 wrinkles Effects 0.000 description 2
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- ZTLUNQYQSIQSFK-UHFFFAOYSA-N n-[4-(4-aminophenyl)phenyl]naphthalen-1-amine Chemical compound C1=CC(N)=CC=C1C(C=C1)=CC=C1NC1=CC=CC2=CC=CC=C12 ZTLUNQYQSIQSFK-UHFFFAOYSA-N 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明涉及显示技术领域，公开了一种基板、基板的检测装置及切割方法。该基板包括多个间隔设置的第一区域，相邻的第一区域之间设有标记，标记用于在第一条件下产生引导切割的指示。该用于基板的检测装置包括用于捕获指示的获取模块和提供第一条件的发射源，所述发射源包括能激发标记发光的光源。该基板的切割方法包括，在基板的表面上形成标记；在第一条件下使标记产生引导切割的指示；以及捕获所述指示，根据所述指示对基板进行切割。本发明所提供的基板及其检测装置和切割方法使切割位置定位更精确，提高了切割精度和良率。
Description
PCT国内申请，说明书已公开。
Claims (27)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/086088 WO2019213853A1 (zh) | 2018-05-09 | 2018-05-09 | 基板、基板的检测装置及切割方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112640049A true CN112640049A (zh) | 2021-04-09 |
Family
ID=68467206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880093887.XA Pending CN112640049A (zh) | 2018-05-09 | 2018-05-09 | 基板、基板的检测装置及切割方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112640049A (zh) |
| WO (1) | WO2019213853A1 (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6025212A (en) * | 1995-07-31 | 2000-02-15 | Micron Technology, Inc. | Method for attaching semiconductor dice to lead-on-chip leadframes |
| US20030079583A1 (en) * | 1996-02-21 | 2003-05-01 | Akira Funakoshi | Substrate cutting method and substrate cutting apparatus |
| CN102709199A (zh) * | 2011-03-28 | 2012-10-03 | 华东科技股份有限公司 | 包覆基板侧边的模封阵列处理方法 |
| CN105336732A (zh) * | 2015-10-16 | 2016-02-17 | 厦门市三安光电科技有限公司 | 半导体器件及其制备方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101992261B1 (ko) * | 2012-11-14 | 2019-06-24 | 엘지디스플레이 주식회사 | 표시소자용 메탈마스크, 및 이를 이용한 유기전계발광 표시소자 및 그 제조방법 |
-
2018
- 2018-05-09 CN CN201880093887.XA patent/CN112640049A/zh active Pending
- 2018-05-09 WO PCT/CN2018/086088 patent/WO2019213853A1/zh active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6025212A (en) * | 1995-07-31 | 2000-02-15 | Micron Technology, Inc. | Method for attaching semiconductor dice to lead-on-chip leadframes |
| US20030079583A1 (en) * | 1996-02-21 | 2003-05-01 | Akira Funakoshi | Substrate cutting method and substrate cutting apparatus |
| CN102709199A (zh) * | 2011-03-28 | 2012-10-03 | 华东科技股份有限公司 | 包覆基板侧边的模封阵列处理方法 |
| CN105336732A (zh) * | 2015-10-16 | 2016-02-17 | 厦门市三安光电科技有限公司 | 半导体器件及其制备方法 |
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| Publication number | Publication date |
|---|---|
| WO2019213853A1 (zh) | 2019-11-14 |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
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Application publication date: 20210409 |