WO2019200877A1 - 一种散热构件及散热构件的制造方法 - Google Patents

一种散热构件及散热构件的制造方法 Download PDF

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Publication number
WO2019200877A1
WO2019200877A1 PCT/CN2018/111977 CN2018111977W WO2019200877A1 WO 2019200877 A1 WO2019200877 A1 WO 2019200877A1 CN 2018111977 W CN2018111977 W CN 2018111977W WO 2019200877 A1 WO2019200877 A1 WO 2019200877A1
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Prior art keywords
heat
plate
plastic
manufacturing
vacuum chamber
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PCT/CN2018/111977
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English (en)
French (fr)
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段海涛
郑凯
丁智成
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南昌黑鲨科技有限公司
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Publication of WO2019200877A1 publication Critical patent/WO2019200877A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles

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  • the present invention relates to the field of heat sinks for smart terminals, and more particularly to a method for manufacturing a heat dissipating member and a heat dissipating member.
  • thermal conductivity materials are mainly metallic materials such as copper, aluminum, silver, and the like.
  • the metal material has a high density and a high expansion coefficient.
  • the thermal conductivity of silver, copper, and aluminum is 430 W/mK, 400 W/mK, 238 W/mK, respectively), so With the improvement of the main frequency of intelligent terminal chips, intelligent terminal manufacturers urgently need to find a solution to improve hardware cooling.
  • the injection molding of the plastic injection molding of the soaking plate is a manufacturing method of the heat dissipating member used in the existing intelligent terminal.
  • the manufacturing process adopted by the manufacturing process still has defects, and the heating plate and the plastic insert are generated when the injection molding is performed.
  • the pipe problem is easy to cause problems such as poor dimensional change of the soaking plate expansion, poor water circulation, and reduced uniform heat efficiency and water leakage.
  • the object of the present invention is to provide a method for manufacturing a novel heat dissipating member, which can effectively solve the problem of rising tubes generated when a heat equalizing plate and a plastic insert are injection molded, provide more optimized heat dissipation capability, and reduce the intelligent terminal.
  • the temperature difference between the front and the back improves the user experience.
  • the invention discloses a heat dissipating member, which is disposed in the body of the smart terminal and coupled with at least one heating element;
  • the heat dissipating member comprises a heat equalizing plate and a plastic
  • the heat equalizing plate and the plastic are injection molded in an insert mold.
  • the heat equalizing plate comprises a welded connection top plate and a bottom plate;
  • the bottom plate is provided with a recess, and a vacuum chamber is formed between the top plate and the bottom plate.
  • the vacuum chamber is filled with a liquid heat transfer medium
  • the inner wall of the vacuum chamber is a capillary channel structure
  • the side wall of the vacuum chamber is further provided with a pipe member with an auxiliary material.
  • the invention discloses a manufacturing method of a heat dissipating member which is made of a heat equalizing plate and a plastic.
  • the manufacturing method comprises the following steps:
  • the tube is sealed to form the heat dissipating member.
  • the step of manufacturing a heat equalizing plate having a vacuum chamber further comprises:
  • the top plate and the bottom plate are welded to form the heat equalizing plate having the vacuum chamber.
  • the vacuum chamber has an inner wall comprising the capillary channel structure.
  • the method further comprises:
  • the heat equalizing plate and the plastic insert are molded by melting and solidification of the plastic.
  • a glue space is provided on the joint of the insert mold and the pipe member; and the insert mold is further provided with a rubber structure.
  • the metal plate comprises a copper plate and/or a copper alloy plate;
  • the auxiliary material comprises one or more of a polyester film, a rubber stopper and a rubber strip;
  • the liquid heat transfer medium comprises water, acetone or ethanol. .
  • the plastic comprises polycarbonate, polycarbonate and polyacrylonitrile alloy, polyamide, polymethyl methacrylate, glass fiber polycarbonate composite, polypropylene, glass fiber nylon composite, polyphenylene sulfide One or more of them.
  • the heat dissipating member provided by the invention is injection molded by the heat equalizing plate and the plastic insert, and the heat dissipating capacity of the soaking plate is superimposed with the heat resistance of the plastic, which can significantly improve the heat dissipating effect of the heat dissipating member, and is fast for the chip in the intelligent terminal. Cool down and reduce the temperature difference between the front and the back of the smart terminal;
  • the invention forms the soaking plate and the plastic insert before injecting the liquid heat transfer medium into the soaking plate, thereby effectively solving the problem of rising tube generated when the heat equalizing plate and the plastic insert are injection molded;
  • the heat dissipation capability of the heat dissipating member is effectively enhanced by the gasification endothermic principle of the liquid heat transfer medium; in addition, the liquid heat transfer medium is condensed and liquefied. After that, the capillary channel structure can be returned to the evaporation heat source again, so that the heat can be repeatedly recovered in the vacuum chamber;
  • FIG. 1 is a schematic view showing the structure of a heat dissipating member applied to an intelligent terminal in accordance with an embodiment of the present invention
  • FIG. 2 is a plan view of a heat dissipating member in accordance with an embodiment of the present invention
  • Figure 3 is a plan view of a heat equalizing plate in accordance with an embodiment of the present invention.
  • the heat dissipating member provided by the present invention can be disposed in the body of the smart terminal, and is coupled to at least one heat generating component (for example, a chip of the smart terminal), and the coupling manner can be that the heat dissipating member is in close contact with the heat generating component, and is thermally conducted by conduction, or It is an air gap between the two, which is heat-conducting by means of air conduction, that is, as long as the heat-dissipating member and the heat-generating member can conduct heat to each other in a relative position, they are all coupled.
  • the heat dissipating member can function well for cooling and cooling.
  • the smart terminal provided with the heat dissipating member of the present invention has a front-to-back surface temperature difference of 1-3 ° C which is smaller and more uniform than that of a general heat dissipating member during operation.
  • FIG. 1 and FIG. 2 it is a schematic structural view of a heat dissipating member provided in accordance with the present invention applied to a smart terminal and a top view of the heat dissipating member.
  • the heat dissipating member disclosed in the present invention comprises a soaking plate 1 and a plastic 2, which are injection molded from the soaking plate 1 and the plastic 2 in an insert mold.
  • the heat equalizing plate 1 includes a top plate and a bottom plate that are welded together.
  • the top plate and the bottom plate are respectively formed by stamping two metal plates.
  • the metal material used for the metal plate includes, but is not limited to, copper, copper alloy, aluminum, silver, etc., and a copper plate or a copper alloy plate is preferred in this embodiment. It can be understood that the stamping shape of the top plate and the bottom plate of the present invention is not particularly limited and can be set according to actual needs.
  • a recess is formed in the bottom plate stamped from the metal sheet. Wherein, the inner wall of the groove is filled with metal powder, and after sintering, a capillary channel structure is formed.
  • the top plate and the bottom plate are provided with a groove on one side of the bottom plate, and a vacuum chamber is formed between the top plate and the bottom plate.
  • the vacuum chamber has a liquid heat transfer medium, and the inner wall of the vacuum chamber has a capillary channel. Structure.
  • the liquid heat transfer medium includes, but is not limited to, water, acetone, ethanol, etc., and can be specifically selected in combination with the degree of heat resistance of the hardware in the environmental system in which the heat equalizing plate 1 is located.
  • a tube member 11 is further disposed on the outer side of the vacuum chamber, and the tube member 11 is sealed with an auxiliary material to prevent the internal liquid heat transfer medium from overflowing.
  • the liquid heat transfer medium can also be injected into the vacuum chamber from the outside through the tube member 11. Further, the vacuum chamber can be evacuated through the tube member 11 to ensure a seamless connection between the top plate and the bottom plate.
  • the present invention also provides a method for manufacturing the heat dissipating member, which specifically includes the following steps:
  • a heat equalizing plate 1 having a vacuum chamber is fabricated.
  • the specific steps of manufacturing the heat equalizing plate 1 include stamping two metal sheets into the top and bottom plates of the heat equalizing plate 1, respectively.
  • the metal material used for the metal sheet includes, but is not limited to, copper, copper alloy, aluminum, silver, etc., and copper or copper alloy is preferred in this embodiment.
  • the specific shape of the top plate and the bottom plate of the present invention is not particularly limited, and may be set according to actual needs.
  • a metal plate may preferably be punched into a bottom plate having a recess. Thereafter, the stamped top and bottom plates are cleaned to remove grease stains on the top and bottom surfaces.
  • the surfaces of the top plate and the bottom plate may be sandblasted to remove residual impurities such as surface rust and hair on the top plate and the bottom plate. Further, the surface of the top plate and the bottom plate may be subjected to secondary cleaning to ensure that the surface thereof is dry and clean, so as not to affect its thermal conductivity.
  • the metal substrate may be filled with a metal powder, preferably a metallic copper powder.
  • the filling mode is not limited, and the corresponding filling mode can be selected according to actual production conditions.
  • the top plate After sintering, the top plate is joined to the bottom plate by means of a welded joint to form a heat equalizing plate 1 as shown in FIG.
  • the soaking plate 1 obtained after welding has a vacuum chamber, and the inner wall of the vacuum chamber has a capillary channel structure formed by sintering metal powder. .
  • a tube member 11 is further disposed on the side wall of the vacuum chamber to subsequently inject the liquid heat transfer medium from the outside of the heat equalizing plate 1 into the vacuum chamber and pump Vacuum treatment.
  • the heat equalizing plate 1 and the plastic 2 are injection molded in an insert mold.
  • the specific steps include the following: loading the previously manufactured heat equalizing plate 1 into the insert mold and fixing it to the working position of the insert mold, and then injecting the plastic 2 at the joint of the insert mold and the heat equalizing plate 1.
  • plastic 2 includes but is not limited to polycarbonate, polycarbonate and polyacrylonitrile alloy, polyamide, polymethyl methacrylate, glass fiber polycarbonate composite, polypropylene, glass fiber nylon composite, poly benzene Sulfur, etc. After the plastic 2 is melted, cooled, and solidified, the insert molding is performed with the heat equalizing plate 1.
  • a glue is provided on the joint mold of the embodiment and the tube 11 of the heat equalizing plate 1 in the embodiment.
  • the space is further provided with an encapsulation structure in the insert mold, so that the plastic 2 can be further prevented from entering the vacuum chamber while ensuring the firmness of the insert molding.
  • the pipe member 11 can be opened after the heat equalizing plate 1 and the plastic 2 are injection molded in an insert mold, that is, the above two steps can be mutually expected under different working effects. change.
  • the vacuum chamber inside the tube 11 of the heat equalizing plate 1 is evacuated, and it is confirmed that there is no weld gap, and the liquid heat transfer medium is injected.
  • the order of vacuuming and injecting the liquid heat transfer medium is not particularly limited, that is, the liquid heat transfer medium may be first vacuumed or injected, or the liquid heat transfer medium may be injected first and then evacuated.
  • the liquid heat transfer medium in this embodiment includes, but is not limited to, water, acetone, ethanol, etc., and can be specifically selected in combination with the degree of heat resistance of the hardware in the environmental system used by the heat equalizing plate 1.
  • auxiliary material includes, but not limited to, polyester film, rubber stopper, rubber strip, etc., or the use of auxiliary materials is eliminated, and the pipe is directly welded and sealed to save the process.
  • the heat dissipating member manufactured according to the above steps comprises two parts of the heat equalizing plate 1 and the plastic 2 .
  • the liquid heat transfer medium in the vacuum chamber of the heat equalizing plate 1 starts to generate endothermic gasification after being heated in a low vacuum environment.
  • the heat energy is absorbed and the volume is rapidly expanded, and the liquid medium heat medium is rapidly filled.
  • the entire cavity allows for rapid cooling down.
  • Condensation occurs when the heat in the environment dissipates, that is, when the liquid heat transfer medium in the gas phase comes into contact with a relatively cold operating environment.
  • the condensed phenomenon releases the heat absorbed during the gasification, and the condensed liquid heat transfer medium is returned to the heat source by the capillary channel structure on the inner wall of the vacuum chamber, and the operation will be repeated in the vacuum chamber. .
  • the heat dissipating member prepared by the manufacturing method of the present invention can absorb heat and cool by the liquid heat transfer medium in the vacuum chamber, and at the same time, achieve better heat insulation effect by means of plastic.
  • the manufacturing method provided by the present invention is injection molded with the plastic insert before the soaking plate is injected into the liquid heat transfer medium, the problem of rising tube generated when the heat equalizing plate and the plastic insert are injected can be effectively avoided, and the heat dissipating member is further optimized. Cooling effect to improve the user experience.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明提供了一种散热构件及散热构件的制造方法，散热构件设置于智能终端本体内，与至少一个发热元件耦合，提供传导散热降温的作用；散热构件包括一均热板与塑胶；均热板与塑胶于一嵌件模具中注塑成型。散热构件由均热板与塑胶制成，制造方法包括如下步骤：制造一具有真空腔体的均热板；于真空腔体的侧壁上设置一管件；将均热板与塑胶在一嵌件模具中注塑成型；通过管件对真空腔体抽真空并注入液态传热介质；密封管件，以制成散热构件。上述散热构件以及制造方法能够有效解决均热板与塑胶嵌件注塑时产生的涨管问题，提供更为优化的散热能力，缩小智能终端前后面的温差，改善用户的使用体验。

Description

一种散热构件及散热构件的制造方法 技术领域
本发明涉及智能终端散热装置领域，尤其涉及一种散热构件及散热构件的制造方法。
背景技术
随着智能终端技术的飞速发展，智能终端芯片的主频越来越高，从而导致智能终端的使用过程中容易产生大量的热量，而过大的热量往往会影响用户的舒适感，甚至还可能会烧坏智能终端中的硬件。
通常，大部分厂商解决散热问题的方法都是在架构方面采用高导热材料。传统的导热材料主要是金属材料，如铜、铝、银等。但是，金属材料密度大，膨胀系数高，在要求高导热效率的场合尚无法满足使用要求(如银、铜、铝的导热系数分别为430W/m.K，400W/m.K，238W/m.K)，所以随着智能终端芯片主频的提升，智能终端厂商亟需寻求一种改善硬件散热的方案。
均热板塑胶嵌件注塑为现有智能终端所采用的一种散热构件的制造方法，然而目前该制造工艺所采用的制造工艺尚存有缺陷，均热板与塑胶嵌件注塑时会产生涨管问题，从而容易导致均热板膨胀尺寸变化不良、水循环不畅导致均热效率下降以及漏水等问题。
为此，需要提供一种新型散热构件及散热构件的制造方法，能够有效解决均热板与塑胶嵌件注塑时产生的涨管问题，提供更为优化的散热能力，缩小智能终端前后面的温差，改善用户的使用体验。
发明内容
为了克服上述技术缺陷，本发明的目的在于提供一种新型散热构件的制造方法，能够有效解决均热板与塑胶嵌件注塑时产生的涨管问题，提供更为优化的散热能力，缩小智能终端前后面的温差，改善用户的使用体验。
本发明公开了一种散热构件，所述散热构件设置于智能终端本体内，与至少一个发热元件耦合；
所述散热构件包括一均热板与塑胶；
所述均热板与塑胶于一嵌件模具中注塑成型。
优选地，所述均热板包括焊接连接的顶板和底板；
所述底板设有一凹槽，于所述顶板和底板之间形成一真空腔体。
优选地，所述真空腔体内装有液态传热介质；
所述真空腔体的内壁呈毛细通道结构体；
所述真空腔体的侧壁上进一步设有一封有辅助材料的管件。
本发明公开了一种散热构件的制造方法，所述散热构件由均热板与塑胶制成，所述制造方法包括如下步骤：
制造一具有真空腔体的均热板；
于所述真空腔体的侧壁上设置一管件；
将所述均热板与所述塑胶在一嵌件模具中注塑成型；
通过所述管件对所述真空腔体抽真空并注入液态传热介质；
密封所述管件，以制成所述散热构件。
优选地，制造一具有真空腔体的均热板的步骤中进一步包括：
将两块金属板片分别冲压制成一顶板和一设有凹槽的底板；
于所述凹槽中填充金属粉末；
烧结所述金属粉末，于所述底板的凹槽上形成毛细通道结构体；
焊接接合所述顶板与所述底板，形成具有所述真空腔体的所述均热板。
优选地，所述真空腔体具有包含所述毛细通道结构体的内壁。
优选地，将所述均热板与所述塑胶在一嵌件模具中注塑成型的步骤中，进一步包括：
将所述均热板固定于所述嵌件模具中；
于所述嵌件模具与所述均热板的连接处注入塑胶；
通过所述塑胶的熔融、固化，所述均热板与所述塑胶嵌件成型。
优选地，所述嵌件模具上与所述管件的衔接处设有一封胶空间；所述嵌件模具内还设有一封胶结构。
优选地，所述金属板包括铜板和/或铜合金板；所述辅助材料包括聚脂薄膜，橡胶塞，胶条中的一种或多种；所述液态传热介质包括水、丙酮或乙醇。
优选地，所述塑胶包括聚碳酸酯，聚碳酸酯和聚丙烯腈合金，聚酰胺，聚甲基丙烯酸甲酯，玻璃纤维聚碳酸酯复合材料，聚丙烯，玻璃纤维尼龙复合材料，聚苯硫中的一种或多种。
采用了上述技术方案后，与现有技术相比，具有以下有益效果：
1.本发明提供的散热构件中由均热板与塑胶嵌件注塑成型，均热板的散热能力与塑胶的阻热能力叠加，能够显著提升散热构件的散热效果，为智能终端中的芯片快速降温，减少智能终端前后面的温差；
2.本发明在向均热板注入液态传热介质前将均热板与塑胶嵌件成型，从而能够有效解决均热板与塑胶嵌件注塑时产生的涨管问题；
3.通过具有毛细通道结构体内壁的真空腔体以及注入的液态传热介质，借由液态传热介质的气化吸热原理，有效增强散热构件的散热能力；此外，液态传热介质冷凝液化后，可再次通过毛细通道结构体回到蒸发热源处，从而能够在真空腔体中实现周而复始地散热；
4.进一步改善用户体验，为用户提供更为优化的散热效果。
附图说明
图1为符合本发明实施例中的一种散热构件应用于智能终端中的结构示 意图；
图2为符合本发明实施例中的一种散热构件的俯视图；
图3为符合本发明实施例中的均热板的俯视图。
附图标记：
1-均热板；11-管件
2-塑胶。
具体实施方式
以下结合附图与具体实施例进一步阐述本发明的优点。
本发明所提供的散热构件可设置于智能终端机体中，与至少一个发热元件耦合(例如，智能终端的芯片)，耦合的方式可以是散热构件与发热构件紧贴，通过传导方式导热，亦或是两者间具有空气间隙，通过空气传导的方式导热，也就是说，只要散热构件与发热构件在相对位置下可互相导热，均属于耦合的设置方式。当智能终端的芯片在长时间使用过程中发热发烫时，该散热构件能够很好的起到散热降温的作用。由于，本发明中的散热构件由均热板1与塑胶2嵌件注塑成型，故，相比于仅使用均热板散热的散热构件，能够展现更为优化的散热效果。设置有本发明中的散热构件的智能终端，其运行时的前后表面温差相比于一般散热构件更小更均热1-3℃。
如图1、图2所示，为根据本发明所提供的散热构件应用于智能终端的结构示意图以及散热构件的俯视图。如图所示，本发明公开的散热构件包括一均热板1与塑胶2，由均热板1与塑胶2在一嵌件模具中注塑成型。
均热板1包括焊接连接的顶板和底板。其中，顶板和底板分别由两块金属板冲压成型制得。金属板所采用的金属材料包括但不限于铜、铜合金、铝、银等，本实施例中优选铜板或铜合金板。可以理解的是，本发明对顶板和底板的冲压形状没有特别的限制，可根据实际需求设置。优选地，由金属板冲压成型的底板内设有一凹槽。其中，凹槽内壁填充有金属粉末，经烧结后形 成毛细通道结构体。顶板与底板设有凹槽的一面焊接固定，由此，焊接连接后的顶板与底板之间形成了一真空腔体，真空腔体内具有液态传热介质，且该真空腔体的内壁呈毛细通道结构体。可以理解的是，液态传热介质包括但不限于水、丙酮、乙醇等，具体可结合均热板1所在的环境体系中的硬件耐热程度作相应的选择。在真空腔体的外侧还进一步设有一管件11，该管件11已封有辅助材料，从而避免内部的液态传热介质溢出。通过该管件11还可以从外部将液态传热介质注入真空腔体，此外，还可以通过该管件11对真空腔体抽真空，以确保顶板与底板之间的无缝连接。
进一步地，本发明还提供了该散热构件的制造方法，具体包括如下步骤：
首先，制造一具有真空腔体的均热板1。制造均热板1的具体步骤包括：将两块金属板片分别冲压制成均热板1的顶板和底板。优选地，金属板片所采用的金属材料包括但不限于铜、铜合金、铝、银等，本实施例中优选铜或铜合金。可以理解的是，本发明对顶板和底板的具体形状没有特别的限制，可根据实际需求设置。本实施例中，可优选将一金属板冲压成具有一凹槽的底板。其后，将冲压制得的顶板和底板进行清洗，以除去顶板和底板表面的油脂污垢。进一步地，还可对顶板和底板的表面进行喷砂处理，以去除顶板和底板的表面锈痕、毛头等残留杂质。进一步地，还可对顶板和底板的表面进行二次清洗，确保其表面干燥、清洁，以免影响其导热性。
清洗完成后，可于底板的凹槽中填充金属粉末，优选金属铜粉末。本实施例中未对填充方式进行限制，可根据实际生产情况选用相应的填充方式。本实施例中可优选采用一喷涂设备将金属粉末喷洒至底板的凹槽内壁上，其后，对所填充的金属粉末进行烧结，从而在底板的凹槽内壁上形成毛细通道结构体。
烧结后，进一步通过焊接连接的方式将顶板与底板接合，从而形成如图3所示的均热板1。其中，由于顶板与底板设有凹槽的一面接合，故，焊接后所得到的均热板1内具有一真空腔体，且该真空腔体的内壁具有烧结金属 粉末而成的毛细通道结构体。
制得一包含真空腔体的均热板1后，进一步，在该真空腔体的侧壁上设置一管件11，以便后续从均热板1的外部向真空腔体内注入液态传热介质以及抽真空处理。
完成管件11的设置后，将均热板1与塑胶2在一嵌件模具中注塑成型。具体步骤包括如下：在嵌件模具内装入先前制造完成的均热板1，并固定于嵌件模具的工作位置，其后在嵌件模具与均热板1的连接处注入塑胶2。其中，塑胶2包括但不限于聚碳酸酯，聚碳酸酯和聚丙烯腈合金，聚酰胺，聚甲基丙烯酸甲酯，玻璃纤维聚碳酸酯复合材料，聚丙烯，玻璃纤维尼龙复合材料，聚苯硫等。经塑胶2的熔融、冷却、固化后即与均热板1实现嵌件成型。需要注意的是，为避免塑胶2在熔融状态下通过均热板1的管件11流入真空腔体，本实施例中的嵌件模具上与均热板1的管件11的衔接处设有一封胶空间，并且在嵌件模具内还进一步设有封胶结构，从而在确保嵌入成型的牢固性的同时能够进一步有效防止塑胶2进入真空腔体。
可以理解的是，上述两步骤中，管件11可以在均热板1与塑胶2在一嵌件模具中注塑成型后再开设，也就是说，上述两步骤在不同的工作效果期望下，可互换。
嵌入成型后，通过均热板1的管件11对其内的真空腔体抽真空，确认不存在焊接缝隙，并注入液态传热介质。本实施例中，对抽真空和注入液态传热介质的顺序并无特别限制，即既可以先抽真空再注入液态传热介质，也可以先注入液态传热介质再抽真空。优选地，本实施例中的液态传热介质包括但不限于水、丙酮、乙醇等，具体可结合均热板1所使用的环境体系中的硬件耐热程度作相应的选择。
最后，采用辅助材料密封管件11，以防止真空腔体内的液态传热介质从管件11向外流出，从而完成散热构件的制造。其中，辅助材料的选择包括但不限于聚脂薄膜，橡胶塞，胶条等，或是取消辅助材料的使用，直接对管 件焊接密封，以节省工艺流程。
根据上述步骤制造完成的散热构件包含均热板1和塑胶2两部分。其中，均热板1中真空腔体里的液态传热介质在低真空度的环境中受热后开始产生吸热气化，此时，吸收热能并且体积迅速膨胀，气相的液态传热介质迅速充满整个腔体，从而能够快速实现全面降温。当环境中的热量散去，即气相的液态传热介质接触到一个比较冷的操作环境时便会产生凝结的现象。借由凝结的现象释放出在气化时吸收的热量，凝结后的液态传热介质会借由真空腔体内壁上的毛细通道结构体再回到热源处，此运作将在真空腔体内周而复始进行。
因此，根据本发明制造方法所制得的散热构件，既能通过真空腔体内的液态传热介质吸热降温，同时又能借助塑胶实现较好的隔热效果。此外，由于本发明提供的制造方法在均热板注入液态传热介质前先和塑胶嵌件注塑成型，能够有效避免均热板与塑胶嵌件注塑时产生的涨管问题，进一步优化散热构件的散热效果，改善用户的使用体验。
应当注意的是，本发明的实施例有较佳的实施性，且并非对本发明作任何形式的限制，任何熟悉该领域的技术人员可能利用上述揭示的技术内容变更或修饰为等同的有效实施例，但凡未脱离本发明技术方案的内容，依据本发明的技术实质对以上实施例所作的任何修改或等同变化及修饰，均仍属于本发明技术方案的范围内。

Claims (10)

  1. 一种散热构件，其特征在于，
    所述散热构件设置于智能终端本体内，与至少一个发热元件耦合；
    所述散热构件包括一均热板与塑胶；
    所述均热板与塑胶于一嵌件模具中注塑成型。
  2. 如权利要求1所述的散热构件，其特征在于，
    所述均热板包括焊接连接的顶板和底板；
    所述底板设有一凹槽，于所述顶板和底板之间形成一真空腔体，所述真空腔体内设有液态传热介质，所述液态传热介质气化后凝结以散热。
  3. 如权利要求2所述的散热构件，其特征在于，
    所述真空腔体的内壁呈毛细通道结构体；
    所述真空腔体的侧壁上进一步设有一封有辅助材料的管件。
  4. 一种散热构件的制造方法，其特征在于，
    所述散热构件由均热板与塑胶制成，所述制造方法包括如下步骤：
    制造一具有真空腔体的均热板；
    于所述真空腔体的侧壁上设置一管件；
    将所述均热板与所述塑胶在一嵌件模具中注塑成型；
    通过所述管件对所述真空腔体抽真空并注入液态传热介质；
    密封所述管件，以制成所述散热构件。
  5. 如权利要求4所述的制造方法，其特征在于，
    制造一具有真空腔体的均热板的步骤中进一步包括：
    将两块金属板片分别冲压制成一顶板和一设有凹槽的底板；
    于所述凹槽中填充金属粉末；
    烧结所述金属粉末，于所述底板的凹槽上形成毛细通道结构体；
    焊接接合所述顶板与所述底板，形成具有所述真空腔体的所述均热板。
  6. 如权利要求5所述的制造方法，其特征在于，
    所述真空腔体具有包含所述毛细通道结构体的内壁。
  7. 如权利要求4所述的制造方法，其特征在于，
    将所述均热板与所述塑胶在一嵌件模具中注塑成型的步骤中，进一步包括：
    将所述均热板固定于所述嵌件模具中；
    于所述嵌件模具与所述均热板的连接处注入塑胶；
    通过所述塑胶的熔融、固化，所述均热板与所述塑胶嵌件成型。
  8. 如权利要求7所述的制造方法，其特征在于，
    所述嵌件模具上与所述管件的衔接处设有一封胶空间；
    所述嵌件模具内还设有一封胶结构。
  9. 如权利要求4所述的制造方法，其特征在于，
    所述金属板包括铜板和/或铜合金板；
    所述辅助材料包括聚脂薄膜，橡胶塞，胶条中的一种或多种；
    所述液态传热介质包括水、丙酮或乙醇。
  10. 如权利要求1所述的制造方法，其特征在于，
    所述塑胶包括聚碳酸酯，聚碳酸酯和聚丙烯腈合金，聚酰胺，聚甲基丙烯酸甲酯，玻璃纤维聚碳酸酯复合材料，聚丙烯，玻璃纤维尼龙复合材料，聚苯硫中的一种或多种。
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