WO2019184815A1 - 拾音控制组件及线控耳机 - Google Patents

拾音控制组件及线控耳机 Download PDF

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Publication number
WO2019184815A1
WO2019184815A1 PCT/CN2019/079247 CN2019079247W WO2019184815A1 WO 2019184815 A1 WO2019184815 A1 WO 2019184815A1 CN 2019079247 W CN2019079247 W CN 2019079247W WO 2019184815 A1 WO2019184815 A1 WO 2019184815A1
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Prior art keywords
pickup
sound
control assembly
ring
sound collecting
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PCT/CN2019/079247
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English (en)
French (fr)
Inventor
连红涛
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维沃移动通信有限公司
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Publication of WO2019184815A1 publication Critical patent/WO2019184815A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups

Definitions

  • the present disclosure relates to the field of electronic technologies, and in particular, to a sound pickup control component and a wire control earphone.
  • wire-controlled headphones has become very common, bringing great convenience and good experience to people's work, study and entertainment life.
  • the wire-controlled earphones in the related art generally adopt a sound pickup control component that integrates a microphone (microphone) module and a control module for voice collection and audio control.
  • the sound pickup control assembly generally includes a housing 10, a microphone module 12, and portions of the circuit board 14.
  • the housing 10 encloses an assembly cavity 10a, and the microphone module 12 and the circuit board 14 are disposed in the assembly cavity 10a.
  • a control switch 100 and a sound collecting hole 102 are provided on the casing 10, and the surface of the fitting cavity 10a also forms a sound collecting ring 104 around the sound collecting hole 102.
  • the microphone module 12 is disposed on one side surface of the circuit board 14 and extends into the pickup ring 104 to form a relatively closed sound collecting space 10b.
  • the diaphragm of the microphone module 12 can be oscillated and converted into an electrical signal to be transmitted to the mobile phone end.
  • the surface of the pickup ring 104 is fitted to the surface of the circuit board 14, which causes the pickup ring 104 including the sound pickup space 10b.
  • the internal space is completely isolated from the other areas of the assembly chamber 10a.
  • the user may occasionally continuously block the sound collecting hole 102 when using the wire-controlled earphone, and the pressure inside the sound collecting space 10b may change rapidly, causing the diaphragm of the microphone module 12 to vibrate and generate an electrical signal.
  • the mobile terminal resulting in a misoperation or an abnormal state.
  • the embodiment of the present disclosure provides a sound pickup control component and a wire control earphone to solve the problem that the camera has a large offset.
  • an embodiment of the present disclosure provides a sound pickup control assembly including a housing, a microphone module, and a circuit board;
  • a sound collecting hole is disposed on the casing, and the casing includes a fitting cavity, and a surface of the fitting cavity is provided with a sound collecting ring surrounding the sound collecting hole;
  • the microphone module and the circuit board are both disposed in the assembly cavity, and the microphone module is disposed on one side surface of the circuit board, and the microphone module extends into the pickup ring, Forming a sound collecting space between the end surface of the microphone module facing the sound collecting hole and the sound collecting ring;
  • the pickup ring includes a sound pickup section and a support section, the support section is in contact with a surface of the circuit board, and the support section is provided with a plurality of communication portions, the communication portion is to be connected to the sound pickup ring Internal and external communication.
  • the pickup segment is a portion of the pickup ring that participates in the sound collection space, and the support segment is not picked up on the pickup ring.
  • the segment is away from the portion of the side of the pickup hole.
  • the communication portion is a notch, and the notch extends from the end of the support portion away from the pickup segment toward the pickup segment.
  • the communication portions are evenly distributed along the circumferential direction of the support section.
  • the communication portion is symmetrically disposed with respect to an axial center of the support segment.
  • the communication portion is disposed along a length direction of the casing.
  • the housing includes an upper case and a lower case connected to each other, and the upper case is provided with a control switch, and the sound collecting hole and the sound collecting ring are disposed at the same Describe the shell.
  • the surface of the casing surrounded by the pickup ring has a sinking structure that is recessed away from the sound collecting space.
  • the sinking structure is disposed around the sound collecting hole.
  • an embodiment of the present disclosure provides a wire-controlled earphone including the sound pickup control component.
  • the sound pickup control assembly disclosed in the embodiment of the present disclosure can maintain the communication state of the internal space surrounded by the pickup ring and other regions of the assembly cavity while forming the sound collection space by the communication portion provided on the support section, thereby reducing the continuous seal
  • the variation of the internal pressure of the sound collecting space caused by the sound hole is blocked, thereby effectively preventing the false vibration of the diaphragm and causing an erroneous operation or an abnormal state.
  • FIG. 1 is a front elevational view of a sound pickup control assembly disclosed in the background art of the present disclosure and an embodiment
  • FIG. 2 is a rear perspective view of the sound collection control assembly disclosed in the background art of the present disclosure
  • FIG. 3 is a view showing the internal structure of a lower case of a housing disclosed in the background art of the present disclosure
  • FIG. 4 is a side cross-sectional view of a sound pickup control assembly disclosed in the background art of the present disclosure
  • FIG. 5 is a view showing the internal structure of a lower case of a housing according to an embodiment of the present disclosure
  • FIG. 6 is a side cross-sectional view of a sound pickup control assembly disclosed in an embodiment of the present disclosure.
  • 10-casing 10a-assembly cavity, 10b-pickup space, 100-control switch, 102-pickup hole, 104-pound ring, 104a-pickup section, 104b-support section, 104c-communication section, 106 - upper casing, 108-lower casing, 108a-surface, 108b-sinking structure, 12-microphone module, 14-board.
  • the embodiment of the present disclosure discloses a wire-controlled earphone that performs voice collection and audio control through a sound pickup control component.
  • the sound pickup control assembly includes a housing 10, a microphone module 12, and a circuit board 14.
  • the housing 10 includes a mounting cavity 10a for placing the microphone module 12 and the circuit board 14.
  • the housing 10 can be assembled from several independent parts. The simpler way is to divide the housing 10 into two parts, an upper case 106 and a lower case 108.
  • the case 106 and the lower case 108 are fastened together to form a mounting cavity 10a, and the microphone module 12 and the circuit board 14 are both disposed in the mounting cavity 10a.
  • the upper casing 106 is provided with a control switch 100, and the lower casing 108 is provided with a sound collecting hole 102.
  • the control switch 100 can be integrally provided with the upper casing 106 for aesthetic reasons and to save manufacturing processes.
  • a pickup ring 104 is formed around the sound collecting hole 102 at the surface of the fitting cavity 10a.
  • the pickup ring 104 is integrally provided with the lower case 108 and extends from the lower case 108 toward the surface 108a of the fitting cavity 10a toward the inside of the fitting cavity 10a.
  • the microphone module 12 is disposed on one side surface of the circuit board 14 and extends into the sound collecting ring 104.
  • the microphone module 12 faces the end surface 12a of the sound collecting hole 102, and the sound collecting ring 104 is located at the end surface 12a and the sound collecting hole 102.
  • the portion between the portion and the surface 108a form a relatively closed sound collecting space 10b.
  • the portion of the pickup ring 104 that participates in the sound collection space 10b is referred to as the pickup section 104a, and the portion of the pickup ring 104 that is located on the side of the pickup section 104a away from the sound collection hole 102 is called a support. Segment 104b.
  • the inner diameter of the support section 104b is slightly larger than the outer circumference of the microphone module, and the two are in a clearance fit. Thus, there is a 0.05-0.1 mm between the microphone module 12 and the support section 104b. gap.
  • One end of the support section 104b remote from the sound pickup section 104a is attached to the surface of the circuit board 14 to stabilize the position of the microphone module 12.
  • a plurality of communication portions 104c are opened on the support portion 104b, and these communication portions 104c communicate the inside and outside of the pickup ring 104.
  • the sound collecting space 10b can maintain the communication state with the other regions of the mounting cavity 10a through the gap between the microphone module 12 and the support section 104b and the communicating portion 104c, thereby reducing the continuous blocking of the sound collecting hole 102.
  • the variation range of the internal pressure of the sound collecting space 10b effectively prevents the diaphragm of the microphone module 12 from being erroneously vibrated, resulting in an erroneous operation or an abnormal state.
  • the communication portion 104c may be a through-hole structure passing through the support portion 104b, but since the thickness of the sound collection control assembly itself is thin, the size of the pickup ring 104 and the support portion 104b is smaller, and thus the through hole is opened. It is more difficult. Therefore, it is preferable to provide the communication portion 104c as a notch that extends from the end of the support section 104b away from the pickup section 104a toward the pickup section 104a. Since the notch is open on one side, the processing is simple, and since it is far from the pickup section 104a, the influence on the sound collecting space 10b is also small.
  • the communicating portion 104c is preferably evenly distributed along the circumferential direction of the support portion 104b, so that the air pressure can be more dispersed and the pressure of the sound collecting space 10b can be quickly balanced.
  • a manner in which the communication portion 104c is symmetrical with respect to the axial center of the support portion 104b is a preferable embodiment.
  • the housing 10 since the pickup control components are generally elongated, the housing 10 also has an elongated structure which allows the pickup ring 104 to have a large space in the longitudinal direction of the housing 10, and There will be only a small space in the width direction. Therefore, at this time, it is preferable to arrange the communication portion along the longitudinal direction of the casing 10 to ensure a more smooth flow of the gas.
  • the present embodiment in order to further reduce the magnitude of the change in the pressure inside the sound collecting space 10b, the present embodiment also processes the surface of the casing 10 surrounded by the pickup ring 104, that is, the surface 108a, on the surface 108a.
  • a sinking structure 108b recessed away from the sound collecting space 10b is provided. The presence of such a sinking structure 108b reduces the partial thickness of the casing 10, and the space left by the cut portion becomes a part of the sound collecting space 10b, so that the internal volume of the sound collecting space 10b can be increased in this way.
  • reduce the pressure change In order to share the pressure change.
  • the sinking structure 108b is preferably disposed around the sound collecting hole 102, that is, a counterbore structure is formed, which is convenient for manufacturing.
  • the center of the counterbore structure and the center of the sound collecting hole 102 may coincide or be offset to accommodate different structural requirements.
  • the sound pickup control module of the wire-controlled earphone provided by the embodiment of the present disclosure can reduce the variation range of the internal pressure of the sound collecting space 10b caused by continuously blocking the sound collecting hole 102, thereby effectively preventing the false vibration of the diaphragm and causing misoperation. Or abnormal state.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Telephone Set Structure (AREA)
  • Headphones And Earphones (AREA)

Abstract

本公开公开了一种拾音控制组件及线控耳机。拾音控制组件包括壳体、麦克风模组以及线路板；在壳体上设置有拾音孔，且壳体包括一装配腔，装配腔的表面设置有围绕拾音孔的拾音环；麦克风模组与线路板均设置在装配腔内，且麦克风模组设置在线路板的一侧表面，麦克风模组伸入拾音环内，麦克风模组朝向拾音孔的端面与拾音环之间形成拾音空间；拾音环包括拾音段以及支撑段，支撑段与线路板的表面贴合，且支撑段上开设有若干连通部，连通部将拾音环的内外连通。线控耳机包括所述的拾音控制组件。

Description

拾音控制组件及线控耳机
相关申请的交叉引用
本申请主张在2018年3月28日在中国提交的中国专利申请No.201810265201.2的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及电子技术领域，尤其涉及一种拾音控制组件及线控耳机。
背景技术
线控耳机的使用已经十分普遍，给人们的工作、学习及娱乐生活带来了极大的便利和良好的体验。
相关技术中的线控耳机普遍采用将麦克风(麦克)模组与控制模组相集成的拾音控制组件进行语音采集以及音频控制。如图1至图4所示，拾音控制组件通常包括壳体10、麦克风模组12以及线路板14几部分。其中，壳体10围成一个装配腔10a，麦克风模组12与线路板14均设置在装配腔10a内。并且，在壳体10上设置有控制开关100以及拾音孔102，同时装配腔10a的表面还围绕拾音孔102形成拾音环104。麦克风模组12设置在线路板14的一侧表面，并伸入拾音环104内，从而形成一个相对封闭的拾音空间10b。外界的声音由拾音孔102进入到拾音空间10b后能够促使麦克风模组12的振膜发生振颤，并转换为电信号传入手机端。
然而，相关技术中在将麦克风模组12装配入拾音环104后，拾音环104的表面会与线路板14的表面贴合，这样会导致包括拾音空间10b在内的拾音环104的内部空间与装配腔10a的其它区域完全隔绝。而用户在使用线控耳机时可能会偶然地连续封堵拾音孔102，此时拾音空间10b内部的压力会快速变化，引起麦克风模组12的振膜发生误振动并产生电信号传入手机端，从而导致误操作或异常状态。
发明内容
本公开实施例提供一种拾音控制组件及线控耳机，以解决摄像头偏位较大的问题。
本公开实施例采用下述技术方案：
第一方面，本公开实施例提供了一种拾音控制组件，包括壳体、麦克风模组以及线路板；
在壳体上设置有拾音孔，且所述壳体包括一装配腔，所述装配腔的表面设置有围绕所述拾音孔的拾音环；
所述麦克风模组与所述线路板均设置在所述装配腔内，且麦克风模组设置在所述线路板的一侧表面，所述麦克风模组伸入所述拾音环内，所述麦克风模组朝向所述拾音孔的端面与所述拾音环之间形成拾音空间；
所述拾音环包括拾音段以及支撑段，所述支撑段与所述线路板的表面贴合，且所述支撑段上开设有若干连通部，所述连通部将所述拾音环的内外连通。
优选地，前述的拾音控制组件中，所述拾音段为所述拾音环上参与围成所述拾音空间的部分，所述支撑段为所述拾音环上未与所述拾音段远离所述拾音孔的一侧的部分。
优选地，前述的拾音控制组件中，所述连通部为缺口，所述缺口由所述支撑段远离所述拾音段的一端向所述拾音段延伸。
优选地，前述的拾音控制组件中，所述连通部沿所述支撑段的周向均匀分布。
优选地，前述的拾音控制组件中，所述连通部相对于所述支撑段的轴心对称设置。
优选地，前述的拾音控制组件中，所述连通部沿所述壳体的长度方向设置。
优选地，前述的拾音控制组件中，所述壳体包括相互连接的上壳以及下壳，所述上壳上设置有控制开关，所述拾音孔以及所述拾音环均设置在所述下壳上。
优选地，前述的拾音控制组件中，所述壳体被所述拾音环包围的所述表面具有朝远离所述拾音空间凹陷的下沉结构。
优选地，前述的拾音控制组件中，所述下沉结构围绕所述拾音孔设置。
第二方面，本公开实施例提供了一种线控耳机，包括所述的拾音控制组件。
本公开实施例采用的上述至少一个技术方案能够达到以下有益效果：
本公开实施例公开的拾音控制组件能够通过设置在支撑段上的连通部在形成拾音空间的同时保持被拾音环包围的内部空间与装配腔的其它区域的连通状态，减低因连续封堵拾音孔而造成的拾音空间内部压力的变化幅度，从而有效避免振膜发生误振动而导致误操作或异常状态。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为本公开背景技术以及实施例公开的拾音控制组件的正面外观视图；
图2为本公开背景技术以及实施例公开的拾音控制组件的背面外观视图；
图3为本公开背景技术公开的壳体的下壳内部结构视图；
图4为本公开背景技术公开的拾音控制组件的侧剖视图；
图5为本公开实施例公开的壳体的下壳内部结构视图；
图6为本公开实施例公开的拾音控制组件的侧剖视图。
附图标记说明：
10-壳体、10a-装配腔、10b-拾音空间、100-控制开关、102-拾音孔、104-拾音环、104a-拾音段、104b-支撑段、104c-连通部、106-上壳、108-下壳、108a-表面、108b-下沉结构、12-麦克风模组、14-线路板。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合本公开具体实施例及相应的附图对本公开技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有 其他实施例，都属于本公开保护的范围。
以下结合附图，详细说明本公开各实施例提供的技术方案。
本公开实施例公开了一种线控耳机，该线控耳机通过拾音控制组件进行语音采集以及音频控制。如图1、图2、图5以及图6所示，拾音控制组件包括壳体10、麦克风模组12以及线路板14。壳体10包括一个装配腔10a，用于放置麦克风模组12以及线路板14。其中，为了便于麦克风模组12以及线路板14的放置，壳体10可以由几个独立的部分组装形成，较为简便的方式是将壳体10分为上壳106以及下壳108两部分，上壳106以及下壳108扣合在一起围成一个装配腔10a，麦克风模组12与线路板14均设置在装配腔10a内。
上壳106上设置有控制开关100，而在下壳108上则设置拾音孔102，为了美观以及节约制造工艺，控制开关100可以与上壳106一体设置。并且，在装配腔10a的表面围绕拾音孔102还会形成拾音环104。拾音环104与下壳108一体设置，并由下壳108朝向装配腔10a的表面108a向装配腔10a的内部延伸。麦克风模组12设置在线路板14的一侧表面，并伸入拾音环104内，麦克风模组12朝向拾音孔102的端面12a、拾音环104位于该端面12a与拾音孔102之间的部分以及表面108a三者形成一个相对封闭的拾音空间10b。外界的声音由拾音孔102进入到拾音空间10b后能够促使麦克风模组12的振膜发生振颤，并转换为电信号由线控耳机的控制线传入手机端。
上述结构中，拾音环104参与围成拾音空间10b的部分被称之为拾音段104a，而拾音环104上位于拾音段104a远离拾音孔102一侧的部分称之为支撑段104b。为了便于麦克风模组12伸入，支撑段104b的内径尺寸会略大于麦克风模组的外周尺寸，二者呈间隙配合，这样，麦克风模组12与支撑段104b之间会存在0.05-0.1mm的间隙。
支撑段104b远离拾音段104a的一端与线路板14的表面贴合，以稳定麦克风模组12的位置。同时，在支撑段104b上开设有若干连通部104c，这些连通部104c将拾音环104的内外连通。这样，拾音空间10b能够通过麦克风模组12与支撑段104b之间的间隙以及连通部104c始终保持与装配腔10a的其他区域的连通状态，从而减低因连续封堵拾音孔102而造成的拾音空间10b 内部压力的变化幅度，有效避免麦克风模块12的振膜发生误振动而导致误操作或异常状态。
在本实施例中，连通部104c可以是穿过支撑部104b的通孔结构，但由于拾音控制组件自身厚度较薄，拾音环104以及支撑段104b的尺寸更小，因此开设通孔的难度较大。因此，优选将连通部104c设置为由支撑段104b远离拾音段104a的一端向拾音段104a延伸的缺口。缺口由于一侧敞开，因此加工简便，并且由于其距离拾音段104a较远，对拾音空间10b的影响也较小。
连通部104c最好沿支撑段104b的周向均匀分布，这样能够使气压更为分散，快速平衡拾音空间10b的压力。其中，连通部104c相对于支撑段104b的轴心对称的方式是较为优选的方案。并且，由于通常情况下拾音控制组件均呈长条形，因此壳体10也呈长条形结构，这种结构使得拾音环104在壳体10长度方向上具有较大的空间，而在宽度方向上则会只具有较小的空间。因此，此时最好将连通部沿着壳体10的长度方向设置，以保证气体能够更为畅通的流通。
如图5和图6所示，为了进一步减低拾音空间10b内部的气压变化幅度，本实施例还对壳体10被拾音环104包围的表面，也就是表面108a进行加工，在表面108a上设置了朝远离拾音空间10b凹陷的下沉结构108b。这种下沉结构108b的存在削减了壳体10的局部厚度，而被削减的部分所留出的空间则成为拾音空间10b的一部分，因此通过这种方式能够增加拾音空间10b的内部体积，从而分摊气压变化，减低气压变化幅度。下沉结构108b最好围绕拾音孔102设置，也就是形成沉孔结构，这样便于制造。沉孔结构与拾音孔102的中心可以重合，也可以相对偏移，以适应不同的结构需求。
本公开实施例所提供的线控耳机的拾音控制组件能够减低因连续封堵拾音孔102而造成的拾音空间10b内部压力的变化幅度，从而有效避免振膜发生误振动而导致误操作或异常状态。
本公开上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本公开的实施例而已，并不用于限制本公开。对于本领域 技术人员来说，本公开可以有各种更改和变化。凡在本公开的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本公开的权利要求范围之内。

Claims (10)

  1. 一种拾音控制组件，包括壳体、麦克风模组以及线路板；
    在壳体上设置有拾音孔，且所述壳体包括一装配腔，所述装配腔的表面设置有围绕所述拾音孔的拾音环；
    所述麦克风模组与所述线路板均设置在所述装配腔内，且麦克风模组设置在所述线路板的一侧表面，所述麦克风模组伸入所述拾音环内，所述麦克风模组朝向所述拾音孔的端面与所述拾音环之间形成拾音空间；
    所述拾音环包括拾音段以及支撑段，所述支撑段与所述线路板的表面贴合，且所述支撑段上开设有若干连通部，所述连通部将所述拾音环的内外连通。
  2. 根据权利要求1所述的拾音控制组件，其中，所述拾音段为所述拾音环上参与围成所述拾音空间的部分，所述支撑段为所述拾音环上未与所述拾音段远离所述拾音孔的一侧的部分。
  3. 根据权利要求1或2所述的拾音控制组件，其中，所述连通部为缺口，所述缺口由所述支撑段远离所述拾音段的一端向所述拾音段延伸。
  4. 根据权利要求1或2所述的拾音控制组件，其中，所述连通部沿所述支撑段的周向均匀分布。
  5. 根据权利要求4所述的拾音控制组件，其中，所述连通部相对于所述支撑段的轴心对称设置。
  6. 根据权利要求1或2所述的拾音控制组件，其中，所述连通部沿所述壳体的长度方向设置。
  7. 根据权利要求1或2所述的拾音控制组件，其中，所述壳体包括相互连接的上壳以及下壳，所述上壳上设置有控制开关，所述拾音孔以及所述拾音环均设置在所述下壳上。
  8. 根据权利要求1或2所述的拾音控制组件，其中，所述壳体被所述拾音环包围的所述表面具有朝远离所述拾音空间凹陷的下沉结构。
  9. 根据权利要求8所述的拾音控制组件，其中，所述下沉结构围绕所述拾音孔设置。
  10. 一种线控耳机，包括权利要求1至9任一项所述的拾音控制组件。
PCT/CN2019/079247 2018-03-28 2019-03-22 拾音控制组件及线控耳机 WO2019184815A1 (zh)

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