WO2019178782A1 - 一种显示屏及其制备方法、移动终端 - Google Patents

一种显示屏及其制备方法、移动终端 Download PDF

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Publication number
WO2019178782A1
WO2019178782A1 PCT/CN2018/079890 CN2018079890W WO2019178782A1 WO 2019178782 A1 WO2019178782 A1 WO 2019178782A1 CN 2018079890 W CN2018079890 W CN 2018079890W WO 2019178782 A1 WO2019178782 A1 WO 2019178782A1
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Prior art keywords
layer
hole
display screen
cathode
forming
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PCT/CN2018/079890
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English (en)
French (fr)
Inventor
贺虎
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2018/079890 priority Critical patent/WO2019178782A1/zh
Priority to CN201880091330.2A priority patent/CN111868930A/zh
Publication of WO2019178782A1 publication Critical patent/WO2019178782A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details

Definitions

  • the present application relates to the field of communications technologies, and in particular, to a display screen, a method for fabricating the same, and a mobile terminal.
  • Full-screen display has become the development trend of current mobile screen display technology. However, due to the space reserved for the front camera in the display area of the screen, current manufacturers are unable to produce a full-screen mobile phone in the true sense.
  • the prior art uses a boring type scheme to provide a front camera on the front panel of the mobile phone.
  • the boring type scheme refers to dig a small hole 02 in the mobile phone screen 01 and set the camera 03 inside the small hole 02.
  • the area other than the small hole 02 on the screen 01 can be used for the mobile phone to perform a graphical user interface (GUI) display, for example, can be used to display information, images, and various menus provided by the mobile phone to the user.
  • GUI graphical user interface
  • the mobile phone screen can mainly include a liquid crystal display (LCD) screen and an organic light emitting display OLED display.
  • the OLED display usually adopts an organic luminescent material as the luminescent layer, can realize self-luminescence, and has the advantages of low power consumption and fast reaction speed, and thus has received more and more attention.
  • a cross-sectional view of the OLED display 01 as shown in FIG. 2 can be obtained according to the section line 001 shown in FIG.
  • 011 denotes a common layer made of an organic material, the common layer including a plurality of layers such as a cathode layer, an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer, etc.
  • 012 Indicates an encapsulation layer
  • 013 denotes a transparent substrate. Since the organic material easily absorbs substances such as moisture and gas, in the small hole 02 shown in FIG. 2, harmful substances such as moisture in the air and harmful gases (for example, oxygen) (indicated by circles in FIG.
  • the common layer 011 enters the inside of the OLED display 01, thereby causing problems such as darkening of the illuminating pixels of the OLED display 01, affecting the performance and service life of the OLED display 01 and the mobile phone, although in the preparation of the mobile terminal, the OLED display
  • the screen 01 covers the glass cover 04, but harmful substances still enter the display 01, which affects the display effect of the display.
  • the present application provides a display screen, a preparation method thereof, and a mobile terminal, which are used to improve the light transmission effect of the light transmission area of the display screen.
  • a display screen includes a stacked transparent substrate, a thin film transistor layer, an anode layer, a light emitting layer, and a cathode layer disposed on the transparent substrate and stacked in a direction away from the transparent substrate. And an encapsulation film layer covering the cathode layer; when specifically forming a transparent region of the display region, the layer structure of the display layer having poor transmittance or opacity is removed, and the specific manner is adopted.
  • a first hole is disposed on the thin film transistor layer, the anode layer, the light emitting layer and the cathode layer, and the first holes on the thin film transistor layer, the anode layer, the light emitting layer and the cathode layer are perpendicular to the first plane Projecting at least partially overlapping, the first plane being a surface of the transparent substrate facing the thin film transistor layer; wherein a portion where each of the first holes overlap forms a transparent region as described above, and a seal for improving the formed light-transmitting region performance.
  • the encapsulation film layer covers at least a sidewall of the first hole on the cathode layer.
  • the transparent region in the present application includes only a transparent substrate and a layer having a relatively good light transmissive effect, compared with the transparent region of the display screen in the prior art except the substrate and the encapsulation layer.
  • the transparent area of the display screen disclosed in the present application reduces the arrangement of the layer structure, thereby improving the transmittance of light, reducing the loss of light when penetrating the transparent area, and improving the structure.
  • the light transmission effect of the display is also encapsulation film layer encapsulates the gap between the layers on the sidewall of the first hole, thereby improving the waterproof oxygen erosion effect of the display screen.
  • the number of the first holes may be plural, and specifically, the number of the first holes on the cathode layer is two or more. Wherein, when the number of the first holes provided in the cathode layer is plural, the number of the corresponding other layers is also plural, and corresponds one-to-one with the first holes on the cathode layer.
  • the shape and size of the two holes and the two holes may be the same or different, in one
  • the two or more first holes on the cathode layer are different in shape and/or size. Thereby, different light transmitting regions can be formed.
  • the first aperture may be located at a different location on the cathode layer, and in a particular arrangement, the first aperture on the cathode layer is located on top of the cathode layer.
  • the display screen comprises the thin film transistor layer, the anode layer, the light emitting layer and the cathode layer
  • the first holes on the thin film transistor layer, the anode layer, the light emitting layer and the cathode layer are connected to form a second hole.
  • the structure is adopted, only the transparent substrate and the encapsulation film layer are included in the light-transmitting region, thereby improving the light-transmitting effect of the light-transmitting region of the display screen.
  • the first holes of the layer structure are disposed in a common center line, and the size of one hole of each layer is uniform, or the first hole is away from the transparent substrate. The size is gradually reduced. This facilitates the packaging of the encapsulation film layer.
  • the transparent substrate and the encapsulation film layer are provided with a third hole communicating with the second hole. Further, the number of layers of the layer structure in the light-transmitting region is reduced, and the light-transmitting effect is further improved.
  • the display screen further includes other layer structures, specifically: further comprising a hole injection layer and a hole transport layer disposed between the anode layer and the light emitting layer, and disposed in the An electron transport layer and an electron injection layer between the cathode layer and the light emitting layer.
  • the layer structure located in the light-transmitting region further includes several layer structures arranged as described above.
  • At least one of the hole transport layer, the hole injection layer, the electron transport layer, and the electron injection layer is provided with a fourth hole, and the fourth hole is in the first plane
  • the vertical projection overlaps at least partially with the first apertures on the thin film transistor layer, the anode layer, the luminescent layer, and the cathode layer. The layer structure in the transparent area is reduced.
  • the hole transport layer, the hole injection layer, the electron transport layer, and the electron injection layer are respectively provided with a fourth hole, the hole transport layer, the hole injection layer, and the electron transport layer. And a fourth hole on the electron injection layer communicates with the first hole on the thin film transistor layer, the anode layer, the light emitting layer and the cathode layer to form a fifth hole. A more progressive one reduces the layer structure of the transparent area.
  • the transparent substrate and the encapsulation film layer are provided with a third hole communicating with the fifth hole.
  • a more progressive one reduces the layer structure of the transparent area and improves the light transmission effect of the transparent area of the display screen.
  • the transparent substrate is a flexible transparent substrate or a glass substrate. Thereby a flexible display or a rigid display can be formed.
  • a method of fabricating a display screen comprising the steps of:
  • Forming a cathode layer by a double evaporation process on the light-emitting layer forming a first portion of the cathode layer by a first vapor deposition, forming a second portion of the cathode layer by a second vapor deposition, and Forming a first hole in the splicing portion of the portion and the second portion;
  • An encapsulation film layer is prepared on the cathode layer, and the encapsulation film layer covers sidewalls of the first holes on the cathode layer.
  • the transparent region in the present application includes only a transparent substrate and a layer having a relatively good light transmissive effect, compared with the transparent region of the display screen in the prior art except the substrate and the encapsulation layer.
  • the transparent area of the display screen disclosed in the present application reduces the arrangement of the layer structure, thereby improving the transmittance of light, reducing the loss of light when penetrating the transparent area, and improving the structure.
  • the light transmission effect of the display is also encapsulation film layer encapsulates the gap between the layers on the sidewall of the first hole, thereby improving the waterproof oxygen erosion effect of the display screen.
  • the preparation method further includes: forming a hole injection layer by vapor deposition on the prepared anode layer;
  • An electron injecting layer was formed on the prepared electron transporting layer, and the cathode layer was prepared on the electron injecting layer.
  • the layer structure in the transparent region can be reduced, and the light transmissive effect of the transparent region can be improved.
  • the cathode layer is formed by specifically preparing the process by two vapor deposition processes or a layer structure of the hole injection layer, the hole transport layer, the electron injection layer, and the electron transport layer, wherein the first portion is formed by vapor deposition of a first mask; wherein the first mask is disposed a first rectangular shielding plate blocking the position of the second portion, the first rectangular shielding plate being connected with a first protrusion for shielding the position of the first hole or the fourth hole;
  • Forming the second portion by vapor deposition of a second mask wherein the second mask is provided with a second rectangular shielding plate that blocks the position of the first portion, and the second rectangular shielding plate is connected for a second protrusion that blocks the position of the first or fourth hole.
  • the process of forming a cathode layer or a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer by a double evaporation process is specifically:
  • Forming the first portion by vapor deposition of a first mask wherein the first mask is provided with a first rectangular shielding plate that blocks the position of the second portion, and the first rectangular shielding plate is connected for a first protrusion that blocks the position of the first hole or the fourth hole;
  • the layer structure is formed by two vapor deposition
  • the first portion formed by the first vapor deposition and the second portion formed by the second vapor deposition overlap at the splicing portion.
  • a thin film transistor layer, an anode layer and a light emitting layer are prepared on a transparent substrate; and a first hole is formed when the thin film transistor layer, the anode layer and the light emitting layer are evaporated; specifically:
  • the thin film transistor layer, the anode layer and the light emitting layer are sequentially formed on the transparent substrate through the third mask; wherein the third mask is provided with a plate-like structure that blocks the position of the first hole.
  • the preparation method further includes forming a second through hole penetrating the first hole or the fourth hole on the transparent substrate and the package film layer. A more progressive one reduces the layer structure of the transparent region, thereby improving the light transmission effect of the transparent region.
  • a mobile terminal comprising the display screen of any of the above.
  • the transparent region in the present application includes only a transparent substrate and a layer having a relatively good light transmissive effect, compared with the transparent region of the display screen in the prior art except the substrate and the encapsulation layer.
  • the transparent area of the display screen disclosed in the present application reduces the arrangement of the layer structure, thereby improving the transmittance of light, reducing the loss of light when penetrating the transparent area, and improving the structure.
  • the light transmission effect of the display is also encapsulation film layer encapsulates the gap between the layers on the sidewall of the first hole, thereby improving the waterproof oxygen erosion effect of the display screen.
  • FIG. 1 is a schematic structural view of a display screen in the prior art
  • Figure 2 is a cross-sectional view of Figure 1;
  • FIG. 3 is a schematic structural diagram of a display screen provided by the present application.
  • Figure 4 is a front elevational view of the mobile terminal provided by the present application.
  • Figure 5 is a cross-sectional view taken along line A-A of Figure 4.
  • FIG. 6 is a schematic structural diagram of a third mask provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a first mask according to an embodiment of the present application.
  • 7b is a top plan view of a first portion after evaporation using a first mask according to an embodiment of the present application
  • Figure 7c is a cross-sectional view taken along line B-B of Figure 7b;
  • Figure 7d is a cross-sectional view taken at C-C in Figure 7b;
  • FIG. 8 is a schematic structural diagram of a second mask provided by an embodiment of the present application.
  • 8b is a top plan view of a second portion after evaporation using a second mask according to an embodiment of the present application.
  • Figure 8c is a cross-sectional view taken along line B'-B' of Figure 8b;
  • Figure 8d is a cross-sectional view taken at C'-C' in Figure 8b;
  • FIG. 9 is a schematic structural view of a cathode layer prepared by using a first mask and a second mask according to an embodiment of the present application.
  • FIG. 10 is a schematic structural view of a first mask of an array provided by the present application.
  • FIG. 11 is a schematic structural view of a second mask of the array provided by the present application.
  • 12a to 12c are flow charts of preparing a cathode layer according to an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of another first mask according to an embodiment of the present application.
  • 13b is a top plan view of a first portion after evaporation using a first mask according to an embodiment of the present application
  • Figure 13c is a cross-sectional view taken at H-H in Figure 13b;
  • Figure 13d is a cross-sectional view taken along line I-I of Figure 13b;
  • FIG. 14 is a schematic structural diagram of another second mask according to an embodiment of the present application.
  • 14b is a top plan view of a second portion after evaporation using a second mask according to an embodiment of the present application
  • Figure 14c is a cross-sectional view taken at H'-H' in Figure 14b;
  • Figure 14d is a cross-sectional view taken at I'-I' in Figure 14b;
  • FIG. 15 is a schematic structural diagram of another first mask according to an embodiment of the present application.
  • FIG. 15b is a schematic structural diagram of another second mask according to an embodiment of the present application.
  • FIG. 16 is a schematic structural diagram of a first mask according to an embodiment of the present application.
  • 16b is a schematic structural diagram of a second mask provided by an embodiment of the present application.
  • FIG. 17 is an exploded perspective view of another display screen according to an embodiment of the present disclosure.
  • Figure 18 is a cross-sectional view of another display screen according to an embodiment of the present application.
  • FIG. 19 is a cross-sectional view of another display screen according to an embodiment of the present application.
  • Figure 20 is a cross-sectional view of another display screen provided by the present application.
  • 21a to 21c are flowcharts showing the preparation of another display screen provided by the present application.
  • FIG. 22 is a schematic structural diagram of a mobile terminal according to an embodiment of the present disclosure.
  • the common layer 011 made of an organic material easily enters the inside of the OLED display 01, thereby causing the OLED of the OLED display 01.
  • a problem such as dimming affects the performance and service life of the OLED display 01 and the mobile phone.
  • the embodiment of the present application provides a display screen.
  • the display screen is an Organic Light-Emitting Diode (OLED) display.
  • OLED displays are typically made of a thin coating of organic luminescent material and a glass substrate that emits light when current is passed through. Therefore, compared with the LCD screen, the OLED display can be thinner and has a larger viewing angle, which can save power consumption of the terminal.
  • the OLED display provided by the embodiment of the present application may be an OLED display screen commonly used in the prior art, and may be a display screen of various different classification methods in the prior art, for example, an active driving type ( Active matrix OLED (AMOLED) and passive matrix OLED (PMOLED); and, for example, may include a rigid OLED display and a flexible OLED display.
  • AMOLED Active matrix OLED
  • PMOLED passive matrix OLED
  • the substrate of the display screen is a flexible transparent substrate, such as a substrate prepared from a polyimide material.
  • the transparent substrate may be a glass substrate. In both displays, the flexible OLED display can be bent and has good flexibility.
  • the OLED display can also be an integrated touch display Y-OCTA and a non-integrated touch display such as YOUM.
  • Y-OCTA refers to the way to integrate the touch sensor directly into the display panel in the OLED display manufacturing process
  • the non-integrated touch display refers to the film-type touch on the display panel of the OLED display. The way the sensor is controlled. It should be understood that the above is merely a list of several specific OLED display screens, and all of the OLED display screens known in the prior art are included in the display screen in the embodiment of the present application.
  • the transparent area provided by the display screen 100 in the embodiment of the present application corresponds to the camera 200 or other photosensitive components (such as laser sensors, etc.) on the mobile terminal.
  • the camera 200 takes the camera 200 as an example, refer to FIG. 3 and FIG. 4 together, wherein FIG. 3 shows a schematic diagram of cooperation between the display screen 100 and the camera 200, and FIG. 4 shows the AA of FIG. Cutaway view.
  • the camera 200 is located below the display screen 100, and the lens of the camera 200 is located in a lower region of the transparent area so that external light can be illuminated into the lens through the transparent area.
  • the display screen 100 includes the following layers: a transparent substrate, a thin film transistor layer (not shown), an anode layer, a light emitting layer, a cathode layer, and an encapsulating film layer.
  • the thin film transistor layer, the anode layer, the light emitting layer, the cathode layer, and the encapsulating film layer are arranged in a direction away from the transparent substrate.
  • the cathode layer, the anode layer and the thin film transistor layer cooperate to drive the illuminating pixels in the luminescent layer to emit light.
  • the transparent area is disposed in the display area of the display screen 100, such as at a position in the middle of the display screen 100 or in the vicinity of the middle.
  • the layer structure of the display screen 100 is separated by several layers of light transmissive or opaque, so that the remaining layer structure forms a counterbore for the display screen 100.
  • a transparent area is formed in the display area.
  • the display panel shown in FIG. 5 includes a transparent substrate 10, a thin film transistor layer 20, an anode layer 30, a light-emitting layer 40, a cathode layer 50, and an encapsulation film layer 60 as an example.
  • a transparent substrate 10 a transparent substrate 10
  • a thin film transistor layer 20 an anode layer 30, a light-emitting layer 40, a cathode layer 50, and an encapsulation film layer 60 as an example.
  • the transparent region since the light transmissive properties of the thin film transistor layer 20, the anode layer 30, the light emitting layer 40, and the cathode layer 50 are poor, the thin film transistor layer 20, the anode layer 30, the light emitting layer 40, and the cathode layer 50 are provided.
  • the first surface is an a-plane as shown in FIG. 5, and the surface is a side of the transparent substrate 10 facing the thin film transistor layer 20.
  • the display screen structure includes a thin film transistor layer 20, an anode layer 30, an luminescent layer 40, and a cathode layer 50.
  • the first holes 71 on the thin film transistor layer 20, the anode layer 30, the light-emitting layer 40, and the cathode layer 50 communicate to form the second holes 70, and the connected portions correspond to the transparent regions on the display screen.
  • the first holes 71 of the above-mentioned several layers are coaxially arranged and have the same shape and size.
  • the second hole 70 formed at this time is a through hole; or the direction away from the transparent substrate 10 is adopted.
  • the size of the first hole 71 is gradually increased, so that the side wall forming the second hole 70 has a slope to facilitate the encapsulation of the encapsulation film layer 60.
  • the elliptical dotted line in Fig. 5 is an auxiliary line indicating the position of the hole.
  • the encapsulating film layer 60 covers at least the sidewall of the first hole 71 on the cathode layer 50 when the encapsulating film layer 60 is disposed.
  • the encapsulation film layer 60 covers the sidewall of the second hole 70.
  • the structure of the transparent region in the display screen disclosed in the embodiment of the present application includes the encapsulation film layer 60 and the transparent substrate 10.
  • the thin film transistor layer 20, the anode layer 30, and the cathode layer 50 are all cut off in the transparent region, thereby reducing the layer structure of the transparent region and improving the light transmission effect of the transparent region.
  • the thin film transistor layer 20, the anode layer 30 and the light emitting layer 40 are prepared by using a third mask 700, which is a high precision metal mask (FMM).
  • the structure is as shown in FIG. 6.
  • the FMM may specifically be a pattern mask. Therefore, when preparing the thin film transistor layer, the anode layer and the light-emitting layer, the pattern corresponding to the first hole may be adopted.
  • the mask is set to a solid plate-like structure 701, and a first hole is formed when the thin film transistor 20, the anode layer 30, and the light-emitting layer 40 in FIG. 5 are prepared.
  • the specific preparation of the thin film transistor 20, the anode layer 30 and the luminescent layer 40 can be formed by sputtering, etching, etc., which are common in the prior art, and will not be described in detail herein.
  • the cathode layer is prepared, as shown in FIGS. 7a to 9, first, it is to be noted that, in the schematic diagram of preparing the cathode layer shown in FIGS. 7a to 9, the cathode layer is prepared on the carrier substrate 400. The example is illustrated. When the display screen is formed, the cathode layer can be directly formed on the light-emitting layer in the same manner as the preparation method shown in Figs. 7a to 9 . Referring first to Figures 7a and 8a, wherein Figure 7a shows the structure of the first mask 300 and Figure 8a shows the structure of the second mask. When the cathode layer is specifically prepared, first, the first mask plate 300 is used for vapor deposition.
  • the first mask plate 300 is correspondingly provided with the hollow structure 303 corresponding to the first portion 51, and the first mask plate 300 is provided with a shielding portion.
  • the first rectangular shielding plate 301 of the second partial position is connected to the first rectangular shielding plate 301 for blocking the position of the first hole 71.
  • the first portion 51 of the cathode layer is vapor-deposited on the right side region on the carrier substrate 400, and the first hole 71 is formed at a position where the first protrusion 302 is blocked, which is formed for convenience of understanding.
  • the structure of the first portion 51 corresponds to the structure in FIG. 7c and FIG. 7d in conjunction with the auxiliary line in FIG.
  • FIG. 7c the cross-sectional view shown in FIG. 7c is a cross-sectional view at BB. Therefore, in cross-section, the cross-sectional line is cut through the first hole 71, and EE, DD in FIG. 7c corresponds to the first hole 71.
  • the second masking is performed by using the second mask 500 as shown in FIG. 8a.
  • the second mask 52 is disposed on the second mask 500.
  • the hollow structure 503 is provided with a second rectangular shielding plate 501 that blocks the position of the first portion, and the second rectangular shielding plate 501 is connected with a second protrusion 502 for shielding the position of the first hole.
  • the second portion 52 is formed on the left side of the carrier substrate by the hollow structure 503, and the position where the second protrusion 502 is blocked overlaps with the portion of the first projection that is blocked in FIG. 8a, thereby A first hole 71 is formed.
  • FIGS. 8c and 8d are corresponding to the auxiliary line in FIG. 8b, wherein B'-B', C'-C' are cross-sectional lines, E' -E', D'-D' is the boundary line of the first hole in the vertical direction; as shown in Fig. 8c, the cross-sectional view shown in Fig. 8c is a cross-sectional view at B'-B', and therefore, in the cross-sectional view The cross-sectional line cuts through the first hole, and D'-D' and E'-E' in Fig. 8c correspond to the boundary line of the first hole; the cross-sectional structure as shown in Fig. 8d, C'-C' The section line is not cut through the first hole, and therefore, the first portion and the second portion 52 are formed integrally.
  • FIG. 9 is a schematic view showing the structure of the cathode layer formed by the above two vapor deposition. It can be seen from FIG. 9 that a layered structure having a hole can be directly formed on the carrier substrate by two vapor deposition. As shown in FIG. 9, the hole formed is a rectangular hole, and of course, the hole formed can also be other shapes. , such as round, oval. As can be seen by the description of FIG. 7a to FIG. 8, the cathode layer includes two portions, a first portion 51 and a second portion 52, and the first hole 71 is located at the splicing portion of the first portion 51 and the second portion 52, and the formed portion The position of the two holes 70 is as shown in FIG.
  • FIG. 22 is a schematic structural diagram of the mobile terminal.
  • the first hole 71 is located at the top of the cathode layer, and the top portion is the touch layer of the cathode layer away from the mobile terminal.
  • One end. 7a and 8a, the first mask 300 and the second mask 500 are opposite structures, that is, the first mask 300 in FIG. 7a is blocked on the left side, and the right side is hollowed out.
  • the second mask plate 500 in the 8a is hollowed out on the left side, and the right side is shielded, and the first mask plate 300 and the second mask plate 500 are respectively provided with opposite first protrusions 302 and second protrusions 502; The portions of the first protrusion 302 and the second protrusion 502 are overlapped. Thus, after two vapor depositions, a layer structure having a hole can be formed.
  • the cathode layer preparation method described above can also be used to directly form the cathode layer 50 on the light-emitting layer 40, so that the cathode layer 50 is also provided with the light-emitting layer 40, the anode layer 30, and the like.
  • the first hole 71 of the layer forms a second hole 70 extending through the above layers.
  • the first mask 300 and the second mask 500 provided by the embodiments of the present application may also be arranged in an array manner, as shown in FIG. 10 and FIG. 11 , wherein FIG. 10 shows The structure of the first mask plate arrayed, and FIG. 11 shows the structure of the second mask plate arranged in the array.
  • the embodiment of the present application provides a cathode layer preparation method as shown in FIGS. 12a to 12c. As shown in FIGS. 12a to 12c, the example shown in FIG. 12a is exemplified by vapor-depositing a cathode layer onto a carrier substrate 400.
  • the first mask 300 is placed above the carrier substrate 400, and is evaporated by the evaporation source 600 located above the first mask 300, because the first mask 300 and the carrier substrate 400 are There is a certain distance between them, and the evaporation source 600 itself has a certain angle, so when the material is deposited on the carrier substrate 400, there will be some material evaporation and a certain angle.
  • the first portion 51 and the second portion 52 are overlapped at the splicing. Thereby improving the uniformity of the thickness and improving the display effect of the display. After the first portion 51 is vapor-deposited, as shown in FIG.
  • a second vapor deposition is performed through the second mask 500, and after the second vapor deposition, the second portion 52 is formed, and the second portion is vapor-deposited.
  • the second portion 52 overlaps with the first portion 51.
  • the specific overlapping width is the width of the inclined portion formed by the first portion 51 and the second portion 52 during evaporation, as shown by the two broken lines in FIG. 12b.
  • the region is such that a layer of cathode is formed as shown in Figure 12c.
  • the specific splicing of the first portion and the second portion may be formed according to different manners, or may be formed by the left-right splicing method as shown in FIG. 7b and FIG. 8b, or may be as shown in FIG. 13a to FIG. 14d.
  • the method of forming the upper and lower splicing is formed, and the preparation manners shown in FIGS. 13a to 14d are similar to those of the preparation methods shown in FIGS. 7a to 9, and are only briefly described herein, wherein FIG. 13a and FIG. 14a show Another structure of the first mask 300 and the second mask 500 is obtained, and in particular, as in the fabrication of the first portion, as shown in FIGS. 13b to 13d, the first portion located below is first prepared.
  • auxiliary lines in FIGS. 13b to 13d can refer to the auxiliary in the above-mentioned FIG. 7b to FIG. 7d. Line description. The description of the auxiliary lines in FIGS. 14b to 14d can be described with reference to the auxiliary lines in FIGS. 8b to 8d, and will not be described in detail herein.
  • a mask structure as shown in Figs. 15a and 15b can also be employed.
  • the first mask plate 300 is provided with a first rectangular shielding plate 301 for blocking the position of the second portion, and the first rectangular shielding plate 301 is connected with a first protrusion 302 for shielding the position of the first hole, and
  • the first mask plate 300 is provided with a hollow structure corresponding to the first portion; as shown in FIG. 15b, the second mask plate 500 is provided with a second rectangular shielding plate 501 for blocking the first portion position and the first hole.
  • shielding is performed by the first mask 300.
  • the position corresponding to the second portion and the first hole is blocked by the first mask. 300 is blocked, only the first portion is formed, and after the evaporation is completed, the shielding is performed by the second mask 500. Due to the shielding of the second rectangular shielding plate 501, the corresponding positions of the first portion and the first hole are blocked, and the evaporation is performed. Forming a second portion; and in two evaporations, the positions of the first holes are respectively blocked by the first protrusions 302 and the second rectangular shielding plate 501, so that the material is not evaporated at the first holes to form a hole Structure.
  • the display may be performed as needed, and either a first hole or two or more may be provided.
  • a hole, and in the specific preparation of the first hole, the shape and size of the first hole may be the same or different, as shown in FIG. 22, FIG. 22 shows the structure of the mobile terminal, in FIG. 22, the first The number of the holes 71 is three, and the size and shape of the first holes 71 on both sides are different, and the size and shape of the first holes 71 in the middle are different from the shape and size of the first holes 71 on both sides. .
  • FIG. 16a shows the structure of the first mask 300
  • FIG. 16b shows the structure of the second mask 500.
  • FIG. 16a and FIG. 16b can be regarded as a modification of FIG. 15a and FIG. 15b, wherein the number of the first protrusions 302 shown in FIG. 16a is two, corresponding to the first holes.
  • the first protrusion 302 may be disposed on the first mask 300 or the second mask 500, specifically It can be set according to actual needs and will not be described in detail here.
  • two or more first holes are provided on the cathode layer, the corresponding thin film transistor layer, the anode layer and the light-emitting layer are correspondingly provided with two or more first holes, thereby forming two One or more transparent areas.
  • the encapsulating film layer 60 when the encapsulating film layer 60 encapsulates other devices of the display panel, the encapsulating film layer 60 encapsulates the respective layers described above and covers the sidewalls of the first holes 71.
  • the first hole 71 described above is a transparent region on the display screen.
  • the transparent region in the present application includes a layer including a substrate and an encapsulation film layer 60, and the cathode layer 50 is removed.
  • the cathode layer 50 since the cathode layer 50 is a metal material, it has strong reflection in this region, and thus has a large influence on the transmittance.
  • the technical solution disclosed in the present application reduces the layer structure of the transparent region of the display screen compared with the structure in the cathode layer 50 in addition to the transparent region of the display screen in the prior art, in addition to the substrate and the encapsulation film layer 60.
  • the light transmittance is improved, the loss of light when penetrating the transparent region is reduced, and the light transmission effect of the display screen is improved.
  • the encapsulation film layer 60 encapsulates the gap between the layers on the sidewall of the second hole 70, thereby improving the waterproof oxygen erosion effect of the display screen.
  • the display panel including the transparent substrate, the thin film transistor layer, the anode layer, the light-emitting layer, and the cathode layer has been described as an example. It should be understood that the display screen provided by the embodiment of the present application may further include other layer structures.
  • the display panel 1 shown in FIG. 17 may include a polarizer 11, an encapsulation film layer 12, an organic self-luminous layer 13, and a transparent substrate 14.
  • the polarizer 11 can be used to improve the contrast and reduce the influence of the reflection of the display screen on the contrast when the external light is irradiated onto the display screen;
  • the encapsulation film layer 12 can be used to protect the organic self-luminous layer 13 and have High light transmittance;
  • the organic self-luminous layer 13 is mainly used for self-luminescence of the display screen;
  • the transparent substrate 14 can be used for carrying the upper organic light-emitting layer 13. Specifically, referring to FIG.
  • the organic self-luminous layer 13 may include a common layer 131 , a light emitting layer 132 , an anode layer 133 , and a thin film transistor layer 134 .
  • the common layer 131 is usually made of an organic material, and thus may also be referred to as a common organic layer.
  • the common layer 131 may specifically include a cathode 1311, an electron injection layer (EIL) 1312, an electron transfer layer (ETL) 1313, a hole transfer layer (HTL) 1314, and an empty layer. Hole injection layer (HIL) 1315.
  • the light emitting layer 132 may include red light emitting pixels (R), green light emitting pixels (G), and blue light emitting pixels (B).
  • the common layer 131 can be used to cooperate with the anode layer 133 and the thin film transistor layer 134 to drive the luminescent pixels in the luminescent layer 132 to emit light. It should be noted that the structure shown above is only an exemplary description of the OLED screen, and the OLED screen may have other structures.
  • the upper layer of the polarizer 11 may further include a cover plate or the like.
  • the cathode layer 1311, the electron injection layer 1312, the electron transport layer 1313, the hole transport layer 1314, and the hole injection layer 1315 may be referred to as a common layer 131, and the preparation method thereof is the same as that of the cathode layer 1311. Therefore, in the preparation of the other layers of the common layer 131, the method of preparing the cathode layer described above can be referred to.
  • the electron injecting layer 1312, the electron transporting layer 1313, the hole transporting layer 1314, and the hole injecting layer 1315 are used, since the above layers have a certain light transmissivity, when forming a transparent region, Some of them may be retained, or all of them may be retained.
  • the electron injecting layer 1312, the electron transporting layer 1313, the hole transporting layer 1314, and the hole injecting layer 1315 are specifically prepared, as shown in FIG. 19, the electron injecting layer 1312, the electron transporting layer 1313, the hole transporting layer 1314, and the hole are formed.
  • At least one layer of the injection layer 1315 is provided with a fourth hole 72, and the vertical projection of the fourth hole 72 in the first plane at least partially with the first hole 71 on the thin film transistor layer, the anode layer, the light emitting layer and the cathode layer overlapping.
  • the fourth hole 72 is prepared on any one of the electron injection layer 1312, the electron transport layer 1313, the hole transport layer 1314, and the hole injection layer 1315, the mask layer corresponding to the cathode layer described above may be used for preparation.
  • the structure that blocks the position of the first hole can be changed to a structure that blocks the position of the fourth through hole.
  • a fourth hole 72 is provided in each of the layers of the electron injecting layer 1312, the electron transporting layer 1313, the hole transporting layer 1314, and the hole injecting layer 1315. And when disposed, the fourth hole 72 communicates with the first hole 71 to form a fifth hole 73. It should be understood that, in addition to the structure in which the layers of the common layer 131 shown in FIG. 19 are cut in the transparent region, a partially-retained electron injecting layer 1312, an electron transporting layer 1313, a hole transporting layer 1314, and a hole injecting layer may be employed.
  • any one or several layers of structure in 1315 In the preparation of each layer structure, if the lower layer is a suspended pore structure, the layer structure in the transparent region is sequentially depressed to form a structure as shown in FIG. A structure in which the first holes 71 are formed only on the cathode layer 1311 of the common layer 131 is shown in FIG. 18, at this time, under the electron injection layer 1312, the electron transport layer 1313, the hole transport layer 1314, and the hole injection layer 1315.
  • the first hole 71 is deposited in the thin film transistor layer 134, the anode layer 133, and the light emitting layer 132, and a counterbore 74 is formed on the display screen.
  • the elliptical lines in Figs. 18 and 19 are auxiliary lines for indicating the position of the holes.
  • the structure involved is only the transparent substrate 10 and the encapsulation film layer 60, in order to further improve the light transmission effect of the transparent region.
  • a third hole may be disposed, and the third hole is in communication with the second hole and the fifth hole.
  • the structure shown in FIG. 20 when the third hole is formed, the structure is as shown in FIG. 20: the third hole 75 is in communication with the second hole 70, and the third hole 75 is bored in the encapsulating film layer 60 and transparent.
  • the substrate 10 On the substrate 10.
  • the center lines of the second hole 70 and the third hole 75 are the same center line, and the diameters of the second hole 70 and the third hole 75 may be the same or different, as shown in FIG.
  • the diameters of the second holes 70 and the third holes 75 are set differently.
  • a first hole is formed in the thin film transistor layer 20, the anode layer 30, the light-emitting layer 40, and the cathode layer 50, and the first hole communicates to form the second hole 70, And the encapsulation film layer 60 encapsulates the sidewall of the second hole 70. Thereafter, as shown in FIG.
  • the transparent substrate 10 and the portion of the encapsulation film layer 60 in the transparent region are cut away, that is, the third hole 75 is formed in the encapsulation film layer 60, thereby forming a structure as shown in FIG. 21c.
  • the structure shown in Fig. 20 it can be clearly seen that there is no layer structure in the transparent region. Therefore, compared with the display screen shown in FIG. 3, a through hole penetrating through the entire display screen is formed through the second hole 70 and the third hole 75 provided, and the light is not required to be worn when the light passes through the transparent region to the device. Layer structure. The light loss is further reduced, and the light transmission effect of the transparent region is improved.
  • the display screen may further include other layer structures such as a polarizer, a buffer layer, a heat dissipation layer or a cover plate.
  • layer structures such as a polarizer, a buffer layer, a heat dissipation layer or a cover plate.
  • the several layer structures listed above are the same as the layer structure in the prior art when set, and corresponding holes are also provided in the specific preparation, and the laser numerical cutting (computer numerical control) can be performed when the holes are specifically formed. , CNC) grinding, cutter wheel processing, etc., the above processing methods are common in the prior art, and will not be described in detail here.
  • the preparation method comprises the following steps:
  • Step 001 preparing a thin film transistor layer, an anode layer, and a light-emitting layer on a transparent substrate; and forming a first hole when vapor-depositing the thin film transistor layer, the anode layer, and the light-emitting layer;
  • the thin film transistor layer, the anode layer and the light emitting layer are specifically prepared, the thin film transistor layer, the anode layer and the light emitting layer are sequentially formed on the transparent substrate through the third mask; wherein the third mask is provided with the first hole The plate structure of the location.
  • the method of preparing the thin film transistor layer, the anode layer, and the light-emitting layer described above in the display screen structure can be combined. And the vertical projections of the first holes of the formed layers on the first side of the transparent substrate at least partially overlap.
  • Step 002 forming a cathode layer by a double evaporation process on the light-emitting layer; forming a first portion of the cathode layer by a first vapor deposition, forming a second portion of the cathode layer by a second vapor deposition, and Forming a first hole in the splicing portion of the first portion and the second portion;
  • the method of preparing the cathode layer described in the above-mentioned display screen structure can be combined with FIGS. 5 to 20. And the vertical projections of the first holes of the formed layers on the first side of the transparent substrate at least partially overlap such that the first holes of the layers communicate to form the second holes.
  • the first portion formed by the first vapor deposition and the second portion formed by the second vapor deposition are overlapped at the splicing portion.
  • Step 003 preparing an encapsulation film layer on the cathode layer, and the encapsulation film layer covers a sidewall of the first hole on the cathode layer.
  • the encapsulation film layer encapsulates the thin film transistor layer, the anode layer, the luminescent layer and the cathode layer, and the encapsulation film layer covers the sidewall of the second hole.
  • Step 004 forming a third hole, and the third hole is in communication with the second hole.
  • the display panel further includes an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer
  • a hole injection layer and a hole transport layer are formed on the anode layer.
  • a light-emitting layer is prepared.
  • an electron transport layer and an electron injection layer are formed on the light-emitting layer, and then the cathode layer in step 002 is prepared on the electron injection layer.
  • the electron injecting layer, the electron transporting layer, the hole transporting layer, and the hole injecting layer are specifically prepared, at least one layer structure in the electron injecting layer, the electron transporting layer, the hole transporting layer, and the hole injecting layer may be The fourth hole is formed, thereby reducing the layer structure of the transparent region.
  • the transparent region includes only the substrate and the encapsulation film layer, and includes a common layer in addition to the substrate and the encapsulation layer in the transparent region of the display screen in the prior art.
  • the transparent area of the display screen disclosed in the present application reduces the layer structure, thereby improving the transmittance of light, reducing the loss of light when penetrating the transparent area, and improving the transparency of the display. Light effect.
  • the encapsulation film layer encapsulates the gap between the layers on the sidewall of the hole, thereby improving the waterproof oxygen erosion effect of the display screen.
  • the embodiment of the present application further provides a mobile terminal.
  • the mobile terminal includes the display screen of any of the above.
  • the mobile terminal can be a common mobile terminal such as a mobile phone or a tablet computer, and the display screen used therein is in the display screen prepared by the above process, wherein three layers are arranged on the cathode layer of the display screen.
  • a hole 71, the first hole 71 is located at the top of the cathode layer, that is, at the top of the display screen, together with the layer structure shown in FIG. 5, the transparent region includes only the transparent substrate and the encapsulation film layer.
  • the transparent area of the display screen disclosed in the present application reduces the arrangement of the layer structure, thereby improving the light, compared to other structures in the common layer including the transparent area of the display screen in the prior art, in addition to the substrate and the encapsulation layer.
  • the penetration rate reduces the loss of light when it penetrates the transparent area and improves the light transmission effect of the display.
  • the encapsulation film layer encapsulates the gap between the layers on the sidewall of the hole, thereby improving the waterproof oxygen erosion effect of the display screen.

Abstract

本申请公开了提供了一种显示屏及其制备方法、移动终端，该显示屏包括：层叠的透明基板、薄膜晶体管层、阳极层、发光层、共通层以及封装膜层；共通层包括至少一层层结构，并且针对每层层结构，其包括拼接的第一部分及第二部分。在制备显示屏时，在薄膜晶体管层、阳极层、发光层及共通层上形成贯通的第一孔或第四孔，并且在共通层上形成第一孔或第四孔时，第一孔或第四孔位于每层层结构上的第一部分及第二部分的拼接处。在本申请中的透明区域其包括的层仅为基板以及封装膜层，减少了透明区域层结构的设置，进而提高了光线的穿透率，降低了光线在穿透透明区域时的损耗，提高了显示屏的透光效果。并且在上述方案中，封装膜层封装了第一孔或第四孔侧壁上各层之间的间隙，从而提高了显示屏的防水氧侵蚀效果。

Description

一种显示屏及其制备方法、移动终端 技术领域
本申请涉及通信技术领域，尤其涉及一种显示屏及其制备方法、移动终端。
背景技术
全屏显示已成为目前手机屏幕显示技术的发展趋势。但由于要在屏幕的显示区域为前置摄像头预留空间，因而当前各制造厂商还无法生产出真正意义上的全屏手机。
例如，现有技术采用一种挖孔型方案在手机前面板上设置前置摄像头。参见图1，挖孔型方案是指在手机屏幕01中挖一个小孔02，并将摄像头03设置于小孔02的内部。这样，屏幕01上除小孔02以外的区域都可以用于手机进行图形用户界面(graphical user interface，GUI)显示，例如可以用于显示手机提供给用户的信息、图像以及各种菜单等。
手机屏幕主要可以包括液晶显示(liquid crystal display，LCD)屏幕和有机发光显示OLED显示屏。其中，OLED显示屏通常采用有机发光材料作为发光层，可以实现自发光，且具有耗电低、反应速度快等优点，因而得到了越来越多的关注。
对于OLED显示屏来说，当采用图1所示的挖孔型方案时，根据图1所示的剖面线001可以得到如图2所示的OLED显示屏01的剖面图。在图2中，011表示采用有机材料制作的共通层(common layer)，该共通层包含多层，如阴极层、电子注入层、电子传输层、空穴注入层、空穴传输层等，012表示封装膜层(encapsulation layer)，013表示透明基板(substrate)。由于有机材料容易吸收水分、气体等物质，因而在图2所示的小孔02中，空气中的水分、有害气体(例如氧气)等有害物质(图2中以圆圈表示)容易通过有机材料制作的共通层011进入OLED显示屏01的内部，从而导致OLED显示屏01的发光像素变暗等问题，影响OLED显示屏01和手机的性能和使用寿命，虽然在制备移动终端时，会在OLED显示屏01覆盖玻璃盖板04，但是仍然会存在有害物质进入到显示屏01内，影响到显示屏的显示效果。
发明内容
本申请提供一种显示屏及其制备方法、移动终端，用以提高显示屏透光区域的透光效果。
第一方面，提供了一种显示屏，该显示屏包括层叠的透明基板，设置在所述透明基板上且沿远离所述透明基板方向层叠的薄膜晶体管层、阳极层、发光层及阴极层，以及覆盖在所述阴极层上的封装膜层；在具体形成显示区的透明区域时，将显示屏的层结构中透光性较差或不透光的几层层结构祛除，具体采用的方式为：所述薄膜晶体管层、阳极层、发光层及阴极层上分别设置有第一孔，且所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔在第一平面的垂直投影至少部分重叠，所述第一平面为所述透明基板朝向所述薄膜晶体管层的表面；其中，各个第一孔重叠的部分形成了上述的透明区域，并且为了提高形成的透光区域的密封性能。所述封装膜层至少覆盖所述 阴极层上的第一孔的侧壁。
通过上述描述可以看出，在本申请中的透明区域其包括的层仅为透明基板以及透光效果比较好的层，相比与现有技术中显示屏的透明区域除基板以及封装膜层外还包括共通层中的其他结构来说，本申请公开的显示屏的透明区域减少了层结构的设置，进而提高了光线的穿透率，降低了光线在穿透透明区域时的损耗，提高了显示屏的透光效果。并且在上述方案中，封装膜层封装了第一孔侧壁上各层之间的间隙，从而提高了显示屏的防水氧侵蚀效果。
在具体设置第一孔的个数时，第一孔的个数可以为多个，具体为：所述阴极层上的第一孔的个数为两个或两个以上。其中，在阴极层上设置的第一孔的个数为多个时，对应的其他各层的个数也为多个，且与阴极层上的第一孔一一对应。
对于第一孔的形状来说，在阴极层上的第一孔的个数为两个及两个以上时，两个及两个第一孔的形状或大小可以相同，也可以不同，在一个具体的实施方式中，所述阴极层上的两个或两个以上的第一孔的形状不同和/或大小不同。从而可以形成不同的透光区域。
在具体设置第一孔的位置时，第一孔可以位于阴极层的不同位置，在一个具体的设置方案中，所述阴极层上的第一孔位于所述阴极层的顶部。
在一个具体的实施方案中，显示屏包含上述的薄膜晶体管层、阳极层、发光层及阴极层时，所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔连通形成第二孔。采用该结构时，在透光区域仅包含透明基板以及封装膜层从而提高了显示屏的透光区域的透光效果。
在具体设置薄膜晶体管层、阳极层、发光层及阴极层时，上述层结构的第一孔共中心线设置，并且各层的一孔的大小一致，或者沿远离透明基板的方向，第一孔的尺寸逐渐缩小。从而方便了封装膜层的封装。
在一个具体的实施方案中，所述透明基板及所述封装膜层上设置有与所述第二孔连通的第三孔。更进一步的减少了透光区域中的层结构的层数，更进一步的提高了透光效果。
在一个具体的实施方案中，显示屏还包括其他层结构，具体为：还包括设置在所述阳极层及所述发光层之间的空穴注入层及空穴传输层，以及设置在所述阴极层及所述发光层之间的电子传输层及电子注入层。此时，位于透光区域中的层结构中还包括了上述设置的几层层结构。
在一个具体的实施方案中，所述空穴传输层、空穴注入层、电子传输层及电子注入层中至少一层上设置有第四孔，且所述第四孔在所述第一平面的垂直投影至少部分与所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔重叠。减少了透明区域中的层结构。
在一个具体的实施方案中，所述空穴传输层、空穴注入层、电子传输层及电子注入层上分别设置有第四孔，所述空穴传输层、空穴注入层、电子传输层及电子注入层上的第四孔与所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔连通形成第五孔。更进步一的减少了透明区域的层结构。
在一个具体的实施方案中，所述透明基板及所述封装膜层上设置有与所述第五孔连通的第三孔。更进步一的减少透明区域的层结构，提高显示屏的透明区域的透光效 果。
在一个具体的实施方案中，所述透明基板为柔性透明基板或玻璃基板。从而可以形成柔性显示屏或刚性显示屏。
第二方面，提供了一种显示屏的制备方法，该制备方法包括以下步骤：
在透明基板上制备薄膜晶体管层、阳极层及发光层；并且在蒸镀所述薄膜晶体管层、阳极层及发光层时分别形成第一孔；
在发光层上通过两次蒸镀的工艺形成阴极层；并通过第一次蒸镀形成该阴极层的第一部分，通过第二次蒸镀形成该阴极层的第二部分，且在所述第一部分及第二部分的拼接处形成第一孔；
在所述阴极层上制备封装膜层，且所述封装膜层覆盖所述阴极层上的第一孔的侧壁。
通过上述描述可以看出，在本申请中的透明区域其包括的层仅为透明基板以及透光效果比较好的层，相比与现有技术中显示屏的透明区域除基板以及封装膜层外还包括共通层中的其他结构来说，本申请公开的显示屏的透明区域减少了层结构的设置，进而提高了光线的穿透率，降低了光线在穿透透明区域时的损耗，提高了显示屏的透光效果。并且在上述方案中，封装膜层封装了第一孔侧壁上各层之间的间隙，从而提高了显示屏的防水氧侵蚀效果。
该制备方法还包括：在制备的所述阳极层上蒸镀形成空穴注入层；
在制备的空穴注入层上制备形成空穴传输层；所述发光层制备在所述空穴传输层上；
在制备的发光层上蒸镀形成电子传输层；
在制备的电子传输层上蒸镀形成电子注入层，所述阴极层制备在所述电子注入层上。
在具体制备所述空穴注入层、空穴传输层、电子注入层及电子传输层中的至少一层层结构采用两次蒸镀的方式形成该层结构；并通过第一次蒸镀形成该层结构的第一部分，通过第二次蒸镀形成该层结构的第二部分，且在所述第一部分及第二部分的拼接处形成第四孔。从而可以减少在透明区域的层结构，更进步一的提高透明区域的透光效果。
在具体通过两次蒸镀形成上述的各层结构时，可以采用不同的掩膜板来制备，如在一个具体的实施方案中，在具体制备所述通过两次蒸镀的工艺形成阴极层或空穴注入层、空穴传输层、电子注入层及电子传输层中的一层层结构时，通过第一掩膜板蒸镀形成所述第一部分；其中，所述第一掩膜板上设置有遮挡所述第二部分位置的第一矩形遮挡板，所述第一矩形遮挡板连接有用于遮挡所述第一孔或第四孔位置的第一凸起；
通过第二掩膜板蒸镀形成所述第二部分；其中，所述第二掩膜板上设置有遮挡所述第一部分位置的第二矩形遮挡板，所述第二矩形遮挡板连接有用于遮挡所述第一孔或第四孔位置的第二凸起。
在另一个具体的实施方案中，所述通过两次蒸镀的工艺形成阴极层或空穴注入层、空穴传输层、电子注入层及电子传输层中的一层层结构，具体为：
通过第一掩膜板蒸镀形成所述第一部分；其中，所述第一掩膜板上设置有遮挡所 述第二部分位置的第一矩形遮挡板，所述第一矩形遮挡板连接有用于遮挡所述第一孔或第四孔位置的第一凸起；
通过第二掩膜板蒸镀形成所述第二部分；其中，所述第二掩膜板上设置有遮挡所述第一部分位置及所述第一孔或第四孔位置的第二矩形遮挡板。
在两次蒸镀形成层结构时，通过第一次蒸镀形成的第一部分与通过第二次蒸镀形成的第二部分在拼接处搭接。从而提高了层结构的均匀度，降低了拼接处对显示屏的影响。
在具体制备时，透明基板上制备薄膜晶体管层、阳极层及发光层；并且在蒸镀所述薄膜晶体管层、阳极层及发光层时形成第一孔；具体为：
通过第三掩膜板依次在透明基板上形成所述薄膜晶体管层、阳极层及发光层；其中，所述第三掩膜板上设置有遮挡所述第一孔位置的板状结构。
该制备方法还包括：在所述透明基板与所述封装膜层上形成与第一孔或第四孔贯通的第二通孔。更进步一的减少了透明区域的层结构，进而提高了透明区域的透光效果。
第三方面，提供了一种移动终端，该移动终端包括上述任一项所述的显示屏。
通过上述描述可以看出，在本申请中的透明区域其包括的层仅为透明基板以及透光效果比较好的层，相比与现有技术中显示屏的透明区域除基板以及封装膜层外还包括共通层中的其他结构来说，本申请公开的显示屏的透明区域减少了层结构的设置，进而提高了光线的穿透率，降低了光线在穿透透明区域时的损耗，提高了显示屏的透光效果。并且在上述方案中，封装膜层封装了第一孔侧壁上各层之间的间隙，从而提高了显示屏的防水氧侵蚀效果。
附图说明
图1为现有技术中的显示屏的结构示意图；
图2为图1的剖视图；
图3为本申请提供的一种显示屏的结构示意图；
图4为本申请提供的移动终端的正视图；
图5为图4中A-A处的剖视图；
图6为本申请实施例提供的第三掩膜板的结构示意图；
图7a为本申请实施例提供的第一掩膜板的结构示意图；
图7b为本申请实施例采用第一掩膜板蒸镀后的第一部分俯视图；
图7c为图7b中B-B处的剖视图；
图7d为图7b中的C-C处的剖视图；
图8a为本申请实施例提供的第二掩膜板的结构示意图；
图8b为本申请实施例采用第二掩膜板蒸镀后的第二部分俯视图；
图8c为图8b中B′-B′处的剖视图；
图8d为图8b中的C′-C′处的剖视图；
图9为本申请实施例提供的采用第一掩膜板及第二掩膜板制备的阴极层的结构示意图；
图10为本申请提供的阵列的第一掩膜板的结构示意图；
图11为本申请提供的阵列的第二掩膜板的结构示意图；
图12a～图12c为本申请实施例提供的阴极层的制备流程图；
图13a为本申请实施例提供的另一种第一掩膜板的结构示意图；
图13b为本申请实施例采用第一掩膜板蒸镀后的第一部分俯视图；
图13c为图13b中H-H处的剖视图；
图13d为图13b中的I-I处的剖视图；
图14a为本申请实施例提供的另一种第二掩膜板的结构示意图；
图14b为本申请实施例采用第二掩膜板蒸镀后的第二部分俯视图；
图14c为图14b中H′-H′处的剖视图；
图14d为图14b中的I′-I′处的剖视图；
图15a为本申请实施例提供的另一种第一掩膜板的结构示意图；
图15b为本申请实施例提供的另一种第二掩膜板的结构示意图；
图16a为本申请实施例提供的第一掩膜板的结构示意图；
图16b为本申请实施例提供的第二掩膜板的结构示意图；
图17为本申请实施例提供的另一种显示屏的分解示意图；
图18为本申请实施例提供的另一种显示屏的剖视图；
图19为本申请实施例提供的另一种显示屏的剖视图；
图20为本申请提供的另一种显示屏的剖视图；
图21a～图21c为本申请提供的另一种显示屏的制备流程图；
图22为本申请实施例提供的移动终端的结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了解决空气中的水分、有害气体(例如氧气)等有害物质(图2中以圆圈表示)容易通过有机材料制作的共通层011进入OLED显示屏01的内部，从而导致OLED显示屏01的发光像素变暗等问题，影响OLED显示屏01和手机的性能和使用寿命的问题，本申请实施例提供了一种显示屏。该显示屏为有机发光二极管(Organic Light-Emitting Diode,OLED)显示屏。
为了方便理解本申请实施例提供的显示屏，首先对OLED显示屏的结构进行说明。OLED显示屏通常采用较薄的有机发光材料涂层和玻璃基板制成，当有电流通过时，有机发光材料自身就会发光。所以相比于LCD屏幕，OLED显示屏可以更薄，可视角度更大，能够节省所在终端的耗电量。
首先需要说明的是，本申请实施例提供的OLED显示屏可以为现有技术中常见的OLED显示屏，其可以为现有技术中多种不同的分类方式的显示屏，例如，主动驱动式(active matrix OLED，AMOLED)和被动驱动式(passive matrix OLED，PMOLED)；再例如，可以包括刚性(rigid)OLED显示屏和柔性OLED显示屏。具体区分在于显示屏的基板的材质上，在为柔性OLED显示屏时，显示屏的基板为柔性透明基板，如聚酰亚胺材料制备的基板。在显示屏为刚性显示屏时，该透明基板可以为玻璃基板。 在两种显示屏中，柔性OLED显示屏可以弯折且具有较好的柔韧性。OLED显示屏还可以为一体型触摸式显示屏Y-OCTA和非一体式触摸显示屏，例如YOUM等。其中，Y-OCTA是指在OLED显示屏制作工序中，将触控传感器直接集成到显示面板中的方式；非一体式触摸显示屏是指，在OLED显示屏的显示面板上贴合薄膜型触控传感器的方式。应当理解的是，上述仅仅是列举了几种具体的OLED显示屏，在本申请实施例中的显示屏中包含现有技术中已知的所有OLED显示屏。
而对于本申请实施例显示屏100设置的透明区域，其对应移动终端上的摄像头200或其他感光组件(如激光传感器等)。为了方便理解，以摄像头200为例，一并参考图3及图4，其中，其中，图3示出了在显示屏100与摄像头200的配合示意图，图4示出了图3中AA处的剖视图。如图4中所示，摄像头200位于显示屏100的下方，并且摄像头200的镜头位于透明区域的下方区域，以便于外部光线能够穿过透明区域照射到镜头内。
在本申请实施例中，如图3中所示，显示屏100包括以下几层结构：透明基板、薄膜晶体管层(图中未示出)、阳极层、发光层、阴极层以及封装膜层。在具体层叠设置时，薄膜晶体管层、阳极层、发光层、阴极层以及封装膜层沿远离透明基板的方向排列。其中的阴极层、阳极层和薄膜晶体管层配合，以驱动发光层中的发光像素发光。
在具体设置透明区域时，一并参考图3及图5，该透明区域设置显示屏100的显示区域内，如在显示屏100的中间位置或者中间附近的位置。在具体形成透明区域时，将显示屏100的层结构中，透光性较差或不透光的几层层结构祛除，从而使得剩下几层层结构形成一个沉孔，以在显示屏100的显示区域内形成透明区域。
为了方便描述，以图5中所示的显示屏包含透明基板10、薄膜晶体管层20、阳极层30、发光层40、阴极层50及封装膜层60为例进行说明。在设置透明区域时，由于薄膜晶体管层20、阳极层30、发光层40及阴极层50的透光性能较差，因此，在薄膜晶体管层20、阳极层30、发光层40及阴极层50上分别形成第一孔71，在具体设置不同层的第一孔71时，薄膜晶体管层20、阳极层30、发光层40、阴极层50的第一孔71在第一平面的垂直投影至少部分重叠，该第一面如图5中所示的a面，该面为透明基板10朝向薄膜晶体管层20的一面，在显示屏结构包含薄膜晶体管层20、阳极层30、发光层40、阴极层50时，薄膜晶体管层20、阳极层30、发光层40、阴极层50上的第一孔71连通形成第二孔70，且连通的部分对应显示屏上的透明区域。在一个具体的实施方案中，上述几层结构上的第一孔71同轴设置，且形状及大小一致，此时形成的第二孔70为一个直通孔；或者采用沿远离透明基板10的方向上，第一孔71的尺寸逐渐增大，从而使得形成第二孔70的侧壁具有一个斜坡，以方便封装膜层60进行封装。其中，图5中的椭圆形虚线为标示孔位置的辅助线。
如图5中所示，在第二孔70贯穿薄膜晶体管层20、阳极层30、发光层40以及阴极层50时，第二孔70的侧壁上不可避免的会出现层结构之间的缝隙。为了避免杂质进入到缝隙中，在设置封装膜层60时，封装膜层60至少覆盖阴极层50上的第一孔71的侧壁。在采用如图5所示的结构时，封装膜层60覆盖第二孔70的侧壁。继续参考图5，该封装膜层60覆盖第二孔70时，形成一个倒置的几字形结构，封装膜层60的竖直部分覆盖在第二孔70的侧壁上，并且封装膜层60覆盖第二孔70底部外露的透 明基板10。从而使得基板10与各层结构之间，以及各个相邻的层结构之间的缝隙均被封装膜层60封装，避免外界杂质进入到显示屏内部，从而提高了显示屏的防水氧侵蚀效果，进而提高了显示屏在使用时的显示效果。
通过上述描述可以看出，在本申请实施例公开的显示屏中对透明区域的结构包含封装膜层60及透明基板10。而将薄膜晶体管层20、阳极层30及阴极层50在透明区域均被切除掉，从而减少了透明区域的层结构，提高透明区域的透光效果。
在具体减少层结构时，其中的薄膜晶体管层20、阳极层30以及发光层40采用第三掩膜板700制备，该第三掩膜板700为高精度金属掩膜板(fine metal mask，FMM)制作，其结构如图6所示，该FMM具体可以为图案掩膜板(pattern mask)，因此，在制备上述薄膜晶体管层、阳极层及发光层时，可以通过将第一孔对应的pattern mask设置成实心的板状结构701，即可制备如图5中的薄膜晶体管20、阳极层30及发光层40时形成第一孔。具体的制备薄膜晶体管20、阳极层30及发光层40可以采用现有技术中常见的溅射、刻蚀等方式形成，在此不再详细赘述。
而在阴极层进行制备时，如图7a～图9所示，首先需要说明的是，在图7a～图9中所示的制备阴极层的示意图中，以阴极层制备在承载基板400上为例进行示例说明的。在形成显示屏时，可以直接将阴极层形成在发光层上，其形成方式与图7a～图9所示的制备方式相同。首先参考图7a及图8a，其中，图7a示出了第一掩膜板300的结构，图8a示出了第二掩膜板的结构。在具体制备阴极层时，首先使用第一掩膜板300进行蒸镀，该第一掩膜板300上对应设置第一部分51对应的镂空结构303，并且第一掩膜板300上设置有遮挡所述第二部分位置的第一矩形遮挡板301，第一矩形遮挡板301连接用于遮挡第一孔71位置的第一凸起302。在蒸镀时，如图7b所示，在承载基板400上的右侧区域蒸镀形成阴极层的第一部分51，并且第一凸起302遮挡的位置形成第一孔71，为了方便理解形成的第一部分51的结构，结合附图7b中的辅助线来对应图7c及图7d中的结构，其中，B-B、C-C为剖视线，E-E、D-D为第一孔71在竖直方向上的边界线；如图7c所示，图7c示出的剖视图为B-B处的剖视图，因此，在剖视时，剖视线切过第一孔71，如图7c中的E-E、D-D对应的为第一孔71的边界线；如图7d所示的剖视结构，C-C剖视线未剖过第一孔71，因此，该第一部分51在图7d中的左侧直接到达E-E处。
在第一次蒸镀完成后，采用如图8a所示的第二掩膜板500进行第二蒸镀，如图8a～图8b所示，第二掩膜板500上设置第二部分52对应的镂空结构503，并且设置有遮挡第一部分位置的第二矩形遮挡板501，该第二矩形遮挡板501连接有用于遮挡第一孔位置的第二凸起502。在蒸镀时，如图8b所示，通过镂空结构503在承载基板的左侧形成第二部分52，并且第二凸起502遮挡的位置与图8a中第一凸起遮挡的部分重叠，从而形成第一孔71。为了方便理解形成的第二部分52的结构，结合附图8b中的辅助线来对应图8c及图8d中的结构，其中，B′-B′、C′-C′为剖视线，E′-E′、D′-D′为第一孔在竖直方向上的边界线；如图8c所示，图8c示出的剖视图为B′-B′处的剖视图，因此，在剖视时，剖视线切过第一孔，如图8c中的D′-D′、E′-E′对应的为第一孔的边界线；如图8d所示的剖视结构，C′-C′剖视线未剖过第一孔，因此，第一部分及第二部分52形成一个整体。
一并参考图9，图9示出了采用上述两次蒸镀后形成的阴极层的结构示意图。由 图9可以看出，通过两次蒸镀可以在承载基板上直接形成一个带孔的层结构，如图9中，形成的孔为一个矩形孔，当然还形成的孔还可以为其他的形状，如圆形、椭圆形。通过结合图7a～图8的描述可以看出，阴极层包括两部分，第一部分51及第二部分52，并且第一孔71位于第一部分51及第二部分52的拼接处，且形成的第二孔70的设置位置如图3所示，第二孔70在屏幕上的位置可以是屏幕显示区域的中心线上，也可以不在屏幕的中心线上，比如在屏幕显示区域的左上方或右上方。或者还可以采用如图22中所示，图22示出了移动终端的结构示意图，在图22中，第一孔71位于阴极层的顶部，该顶部为阴极层远离移动终端的触控按键的一端。对比图7a及图8a可以看出，第一掩膜板300及第二掩膜板500是一个相对的结构，即图7a中的第一掩膜板300左侧遮挡，右侧镂空，而图8a中的第二掩膜板500左侧镂空，右侧遮挡，并且第一掩膜板300及第二掩膜板500分别设置了相对的第一凸起302及第二凸起502；在遮挡时，第一凸起302及第二凸起502遮挡的部分重叠。从而在两次蒸镀后，能够形成一个带孔的层结构。
在制备如图5所示的显示屏时，也可采用上述的阴极层制备方法，在发光层40上直接制备形成阴极层50，从而使得形成阴极层50也具备发光层40、阳极层30等层的第一孔71，从而形成一个贯通上述各层的第二孔70。
此外，在制备显示屏时，通常采用制备一个大的屏幕，该屏幕包括多个阵列设置的显示屏。该屏幕制备完成后，再切割成一个个独立的显示屏。为了适应这种制备方式，本申请实施例提供的第一掩膜板300及第二掩膜板500也可以采用阵列的方式排列，如图10及图11所示，其中，图10示出了阵列排列的第一掩膜板的结构，图11示出了阵列排列的第二掩膜板的结构。
此外，由于阴极层的层结构中采用第一部分及第二部分采用拼接的方式形成，极易出现形成的层结构厚度不均匀的情况。而如果形成的层结构厚度不均匀，会造成显示屏性能下降，甚至会造成在其上的OLED微腔设计出现变异。为了避免出现上述情况，在本申请实施例提供如图12a～图12c所示的阴极层制备方法。如图12a～图12c所示，图12a示出的示例采用将阴极层蒸镀到承载基板400上为例进行的说明。在蒸镀时，通过第一掩膜板300位于承载基板400的上方，并且通过位于第一掩膜板300上方的蒸镀源600进行蒸镀，由于第一掩膜板300和承载基板400之间存在一定的间距，而且蒸镀源600的本身存在一定角度，因此当材料沉积在承载基板400上会造成镂空之外会有一定的材料蒸镀，且具有一定的角度。为了改善形成的层结构厚度的均一性，在本申请中的阴极层的层结构中，第一部分51及第二部分52在拼接处搭接。从而改善厚度的均一性，提高显示屏的显示效果。在蒸镀完第一部分51后，如图12b所示，通过第二掩膜板500进行第二次蒸镀，在第二次蒸镀后，形成第二部分52，且在蒸镀第二部分52时，第二部分52与第一部分51部分搭接，具体的搭接宽度为第一部分51及第二部分52在蒸镀时形成倾斜区域的宽度，如图12b中的两条虚线所示的区域，从而使得形成的如图12c所示的一层阴极层。
针对阴极层来说，第一部分及第二部分的具体拼接可以根据不同的方式形成，既可以采用如图7b及图8b所示的左右拼接的方式形成，也可以采用如图13a～图14d所示的上下拼接的方式形成，在图13a～图14d中示出的制备方式与图7a～图9所示的制备方式相近似，在此仅对其简单描述，其中，图13a及图14a示出了另外的一种第一 掩膜板300及第二掩膜板500的结构，并且在具体时，如第一部分的制作，如图13b～图13d所示，首先制备出位于下方的第一部分，之后，如图14b及图14d所示，通过第二掩膜板500制备出位于上方的第二部分，其中，图13b～图13d中的辅助线可以参考上述图7b～图7d中的辅助线描述。图14b～图14d中的辅助线描述可以参考图8b～图8d中的辅助线描述，在此不再详细的赘述。
作为图13a及图14a的一种变形结构，还可以采用如图15a及图15b所示的掩膜板结构。如图15a所示，第一掩膜板300上设置有遮挡第二部分位置的第一矩形遮挡板301，第一矩形遮挡板301连接有用于遮挡第一孔位置的第一凸起302，并且第一掩膜板300上设置有与第一部分对应的镂空结构；如图15b所示，第二掩膜板500上设置有遮挡第一部分位置及第一孔的第二矩形遮挡板501。在第一次蒸镀时，通过第一掩膜板300进行遮挡，由于第一矩形遮挡板301以及第一凸起302的遮挡，第二部分以及第一孔对应的位置被第一掩膜板300遮挡住，只形成第一部分，并且在蒸镀完后，通过第二掩膜板500进行遮挡，由于第二矩形遮挡板501的遮挡，第一部分及第一孔对应的位置被遮挡，蒸镀形成第二部分；并且在两次蒸镀时，第一孔的位置分别被第一凸起302及第二矩形遮挡板501遮挡，从而不会在第一孔处蒸镀上材料，形成一个孔状结构。
此外，对于阴极层上的第一孔的个数来说，即对于透明区域的个数，可以根据需要进行显示，既可以采用设置一个第一孔，也可以设置两个或两个以上的第一孔，并且在具体制备第一孔时，该第一孔的形状及大小可以相同，也可以不同，如图22所示，图22示出了移动终端的结构，在图22中，第一孔71的个数为三个，且位于两侧的第一孔71的大小及形状不同，位于中间的第一孔71的大小与形状与位于两侧的第一孔71的形状及大小均不同。以两个第一孔71为例，在具体制备时，如图16a及图16b所示，图16a示出了第一掩膜板300的结构，图16b示出了第二掩膜板500的结构。该图16a及图16b可以视为是图15a及图15b的一个变形，其中，图16a示出的第一凸起302的个数为两个，分别对应第一孔。应当理解的是，在采用图16a及图16b所示的掩膜板结构时，第一凸起302的既可以设置在第一掩膜板300也可以设置在第二掩膜板500上，具体的，可以根据实际的需要进行设置，在此不再详细描述。此外，对于在阴极层上设置有两个或两个以上的第一孔时，对应的薄膜晶体管层、阳极层及发光层也对应设置有两个或两个以上的第一孔，从而形成两个或两个以上的透明区域。
通过上述描述可以看出，在本申请中的实施例中，在封装膜层60封装显示屏其他器件时，封装膜层60封装上述的各个层，并且覆盖第一孔71的侧壁。上述的第一孔71即为显示屏上的透明区域，通过上述描述可以看出，在本申请中的透明区域其包括的层包括基板以及封装膜层60，去掉了阴极层50。而对于去掉的阴极层50来说，由于阴极层50是金属材料，因此在该区域有较强的反光，因此对穿透率的影响较大。因此，本申请公开的技术方案相比与现有技术中显示屏的透明区域除基板以及封装膜层60外还包括阴极层50中的结构来说，减少了显示屏的透明区域的层结构，进而提高了光线的穿透率，降低了光线在穿透透明区域时的损耗，提高了显示屏的透光效果。并且在上述方案中，封装膜层60封装了第二孔70侧壁上各层之间的间隙，从而提高了显示屏的防水氧侵蚀效果。
在上述描述中，仅仅对显示屏包含透明基板、薄膜晶体管层、阳极层、发光层及 阴极层为例进行了描述。应当了解的是，本申请实施例提供的显示屏还可以包括其他的层结构。
如图17所示，图17示出的显示屏1可以包括偏光片(polarizer)11、封装膜层12、有机自发光层13和透明基板14。其中，偏光片11可以用于提高对比度，降低当外界光线照射到显示屏时，由于显示屏的反射作用而对对比度产生的影响；封装膜层12可以用于保护有机自发光层13，且具有高透光率；有机自发光层13主要用于显示屏的自发光；透明基板14可以用于承载上层的有机自发光层13。具体的，参见图18，有机自发光层13可以包括共通层131、发光层132、阳极层(anode)133和薄膜晶体管层134。一并参考图18及图19所示，共通层131通常采用有机材料制作而成，因而也可以称为有机共通层(common organic layer)。共通层131具体可以包括阴极(cathode)1311、电子注入层(electron injection layer，EIL)1312、电子传输层(electron transfer layer，ETL)1313、空穴传输层(hole transfer layer，HTL)1314和空穴注入层(hole injection layer，HIL)1315。发光层132可以包括红色发光像素(R)、绿色发光像素(G)和蓝色发光像素(B)。共通层131可以用于与阳极层133和薄膜晶体管层134配合，以驱动发光层132中的发光像素发光。需要说明的是，上述所示的结构仅是OLED屏幕的一种示例性说明，OLED屏幕还可以具有其它结构，例如，在偏光片11的上层还可以包括盖板等。
由上述描述可以看出，阴极层1311、电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315可以称为共通层131，其制备方法与阴极层1311的制备方法相同，因此，在制备共通层131的其它层时，可以参考上述描述的制备阴极层的方法。当然，应当理解的时，电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315时，由于上述几层具有一定的透光性，因此，可以在形成透明区域时，对其中的一部分保留，或者全部保留均可以。在具体制备电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315时，如图19所示，电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315时上至少一层设置有第四孔72，该第四孔72在第一平面的垂直投影至少部分与所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔71重叠。在电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315上任意一层制备第四孔72时，可以采用上述描述的阴极层对应的掩膜板进行制备，只需将遮挡第一孔位置的结构，更改为遮挡第四通孔位置的结构即可。
对于显示屏上的孔结构，下面结合附图详细的举例说明。如图19所示，在图19所示的结构中，电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315时每层分别设置第四孔72。并且在设置时第四孔72与第一孔71连通形成第五孔73。应当理解的是，除了图19所示的共通层131的各层在透明区域切除的结构外，还可以采用部分保留电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315中的其中任意一层或几层结构。在制备各层结构时，若下层为悬空的孔结构，则该透明区域中的层结构依次下沉，形成如图18所示的结构。在图18中示出了仅在共通层131的阴极层1311上形成第一孔71的结构，此时，电子注入层1312、电子传输层1313、空穴传输层1314和空穴注入层1315下沉到薄膜晶体管层134、阳极层133、发光层132上的第一孔71内，并在显示屏上形成一个沉孔74。其中，在图18及图19 中的椭圆形线为用于标示孔位置的辅助线。
此外，继续参考图5及图19，由图5及图19可以看出，在透明区域中，涉及到的结构仅仅为透明基板10以及封装膜层60，为了进一步的改善透明区域的透光效果，在具体设置时，可以在设置第三孔，该第三孔与第二孔及第五孔连通。以图5所示的结构为例，在形成第三孔时，其结构如图20所示：第三孔75与第二孔70连通，且第三孔75穿设在封装膜层60以及透明基板10上。在具体设置时，该第二孔70及第三孔75的中心线为同一中心线，并且第二孔70及第三孔75的直径可以采用相同也可以采用不同，如图20中所示的第二孔70与第三孔75的直径采用不同的方式设置。但是无论采用上述的哪种方式，在制备时，如图21a，在薄膜晶体管层20、阳极层30、发光层40及阴极层50上形成第一孔，第一孔连通形成第二孔70，并且封装膜层60对第二孔70的侧壁进行封装。之后如图21b所示，切除位于透明区域中的透明基板10及封装膜层60部分，即在封装膜层60上开设第三孔75，从而形成如图21c所示的结构。在图20所示的结构中，可以明显的看出，位于透明区域没有层结构。因此，相比与图3所示的显示屏，通过设置的第二孔70及第三孔75形成一个将整个显示屏穿透的通孔，在光线穿过透明区域照射到器件时，无需穿过层结构。更进一步的降低了光的损耗，提高了透明区域的透光效果。
应当理解的是，在上述实施例中，仅仅示出了常见的显示屏中的层结构，该显示屏中还可以包括其他的层结构，如偏光片、缓冲层、散热层或盖板等结构，上述列举的几种层结构在设置时与现有技术中的层结构相同，并且在具体制备时，也开设了对应的孔，在具体形成孔时，可以通过激光切割、数控(computer numerical control，CNC)研磨，刀轮加工等方式加工形成，上述加工方式均为现有技术中常见的加工方式在此不再详细赘述
为了方便理解本申请实施例提供的上述显示屏的结构，下面结合其制备方法对其再次进行描述。
该制备方法包括以下步骤：
步骤001：在透明基板上制备薄膜晶体管层、阳极层及发光层；并且在蒸镀所述薄膜晶体管层、阳极层及发光层时分别形成第一孔；
在具体制备薄膜晶体管层、阳极层及发光层时，通过第三掩膜板依次在透明基板上形成薄膜晶体管层、阳极层及发光层；其中，第三掩膜板上设置有遮挡第一孔位置的板状结构。可以结合上述在显示屏结构中描述的薄膜晶体管层、阳极层及发光层的制备方法。并且在形成的各层的第一孔在透明基板上的第一面上的垂直投影至少部分重叠。
步骤002：在发光层上通过两次蒸镀的工艺形成阴极层；并通过第一次蒸镀形成该阴极层的第一部分，通过第二次蒸镀形成该阴极层的第二部分，且在所述第一部分及第二部分的拼接处形成第一孔；
具体的，在制备阴极层的结构时，可以结合附图5～图20以及上述在显示屏结构中描述的阴极层的制备方法。并且在形成的各层的第一孔在透明基板上的第一面上的垂直投影至少部分重叠，从而使得各层的第一孔连通形成第二孔。
此外，为了提高两次蒸镀时的效果，在具体两次蒸镀时，通过第一次蒸镀形成的第一部分与通过第二次蒸镀形成的第二部分在拼接处搭接。
步骤003：在所述阴极层上制备封装膜层，且所述封装膜层覆盖所述阴极层上的第一孔的侧壁。
具体的，在封装膜层封装时，该封装膜层包裹上述的薄膜晶体管层、阳极层、发光层以及阴极层，并且封装膜层覆盖第二孔的侧壁。
步骤004：形成第三孔，且第三孔与第二孔连通。
在显示屏还包括电子注入层、电子传输层、空穴传输层和空穴注入层时，在形成步骤001中的阳极层后，在阳极层上制备形成空穴注入层和空穴传输层。之后再制备发光层，在形成发光层后，在发光层上制备电子传输层及电子注入层，之后再在电子注入层上制备步骤002中的阴极层。并且在具体制备电子注入层、电子传输层、空穴传输层和空穴注入层时，可以在电子注入层、电子传输层、空穴传输层和空穴注入层中的至少一层层结构上形成第四孔，从而减少透明区域的层结构，具体可以参考上述中对显示屏结构的描述部分，在此不再详细赘述。
在采用上述工艺制备而成后的显示屏中，透明区域其包括的层仅为基板以及封装膜层，相比与现有技术中显示屏的透明区域除基板以及封装膜层外还包括共通层中的其他结构来说，本申请公开的显示屏的透明区域减少了层结构的设置，进而提高了光线的穿透率，降低了光线在穿透透明区域时的损耗，提高了显示屏的透光效果。并且在上述方案中，封装膜层封装了孔侧壁上各层之间的间隙，从而提高了显示屏的防水氧侵蚀效果。
此外，本申请实施例还提供了一种移动终端，如图22所示，该移动终端包括上述任一项的显示屏。其中，该移动终端可以为手机、平板电脑等常见的移动终端，并且其采用的显示屏在采用上述工艺制备而成后的显示屏中，其中，该显示屏的阴极层上设置了三个第一孔71，该第一孔71位于阴极层的顶部，即显示屏的顶部，一并参考图5中所示的层结构，该透明区域其包括的层仅为透明基板以及封装膜层，相比与现有技术中显示屏的透明区域除基板以及封装膜层外还包括共通层中的其他结构来说，本申请公开的显示屏的透明区域减少了层结构的设置，进而提高了光线的穿透率，降低了光线在穿透透明区域时的损耗，提高了显示屏的透光效果。并且在上述方案中，封装膜层封装了孔侧壁上各层之间的间隙，从而提高了显示屏的防水氧侵蚀效果。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (20)

  1. 一种显示屏，其特征在于，包括：透明基板，设置在所述透明基板上且沿远离所述透明基板方向层叠的薄膜晶体管层、阳极层、发光层及阴极层，以及覆盖在所述阴极层上的封装膜层；其中，所述薄膜晶体管层、阳极层、发光层及阴极层上分别设置有第一孔，且所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔在第一平面的垂直投影至少部分重叠，其中，所述第一平面为所述透明基板朝向所述薄膜晶体管层的表面；
    所述封装膜层至少覆盖所述阴极层上的第一孔的侧壁。
  2. 如权利要求1所述的显示屏，其特征在于，所述阴极层上的第一孔的个数为两个或两个以上。
  3. 如权利要求2所述的显示屏，其特征在于，所述阴极层上的两个或两个以上的第一孔的形状不同和/或大小不同。
  4. 如权利要求1～3任一项所述的显示屏，其特征在于，所述阴极层上的第一孔位于所述阴极层的顶部。
  5. 如权利要求1～4任一项所述的显示屏，其特征在于，所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔连通形成第二孔。
  6. 如权利要求5所述的显示屏，其特征在于，所述透明基板及所述封装膜层上设置有与所述第二孔连通的第三孔。
  7. 如权利要求1～4任一项所述的显示屏，其特征在于，还包括设置在所述阳极层及所述发光层之间的空穴注入层及空穴传输层，以及设置在所述阴极层及所述发光层之间的电子传输层及电子注入层。
  8. 如权利要求7所述的显示屏，其特征在于，所述空穴传输层、空穴注入层、电子传输层及电子注入层中至少一层上设置有第四孔，且所述第四孔在所述第一平面的垂直投影至少部分与所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔重叠。
  9. 如权利要求8所述的显示屏，其特征在于，所述空穴传输层、空穴注入层、电子传输层及电子注入层上分别设置有第四孔，所述空穴传输层、空穴注入层、电子传输层及电子注入层上的第四孔与所述薄膜晶体管层、阳极层、发光层及阴极层上的第一孔连通形成第五孔。
  10. 如权利要求9所述的显示屏，其特征在于，所述透明基板及所述封装膜层上设置有与所述第五孔连通的第三孔。
  11. 如权利要求1～10任一项所述的显示屏，其特征在于，所述透明基板为柔性透明基板或玻璃基板。
  12. 一种如权利要求1所述的显示屏的制备方法，其特征在于，包括以下步骤：
    在透明基板上制备薄膜晶体管层、阳极层及发光层；并且在蒸镀所述薄膜晶体管层、阳极层及发光层时分别形成第一孔；
    在发光层上通过两次蒸镀的工艺形成阴极层；并通过第一次蒸镀形成该阴极层的第一部分，通过第二次蒸镀形成该阴极层的第二部分，且在所述第一部分及第二部分的拼接处形成第一孔；
    在所述阴极层上制备封装膜层，且所述封装膜层覆盖所述阴极层上的第一孔的侧 壁。
  13. 如权利要求12所述的制备方法，其特征在于，还包括：在制备的所述阳极层上蒸镀形成空穴注入层；
    在制备的空穴注入层上制备形成空穴传输层；所述发光层制备在所述空穴传输层上；
    在制备的发光层上蒸镀形成电子传输层；
    在制备的电子传输层上蒸镀形成电子注入层，所述阴极层制备在所述电子注入层上。
  14. 如权利要求13所述的制备方法，其特征在于，在制备所述空穴注入层、空穴传输层、电子注入层及电子传输层中的至少一层层结构采用两次蒸镀的方式形成该层结构；并通过第一次蒸镀形成该层结构的第一部分，通过第二次蒸镀形成该层结构的第二部分，且在所述第一部分及第二部分的拼接处形成第四孔。
  15. 如权利要求14所述的制备方法，其特征在于，所述通过两次蒸镀的工艺形成阴极层或空穴注入层、空穴传输层、电子注入层及电子传输层中的一层层结构，具体为：
    通过第一掩膜板蒸镀形成所述第一部分；其中，所述第一掩膜板上设置有遮挡所述第二部分位置的第一矩形遮挡板，所述第一矩形遮挡板连接有用于遮挡所述第一孔或第四孔位置的第一凸起；
    通过第二掩膜板蒸镀形成所述第二部分；其中，所述第二掩膜板上设置有遮挡所述第一部分位置的第二矩形遮挡板，所述第二矩形遮挡板连接有用于遮挡所述第一孔或第四孔位置的第二凸起。
  16. 如权利要求14所述的制备方法，其特征在于，所述通过两次蒸镀的工艺形成阴极层或空穴注入层、空穴传输层、电子注入层及电子传输层中的一层层结构，具体为：
    通过第一掩膜板蒸镀形成所述第一部分；其中，所述第一掩膜板上设置有遮挡所述第二部分位置的第一矩形遮挡板，所述第一矩形遮挡板连接有用于遮挡所述第一孔或第四孔位置的第一凸起；
    通过第二掩膜板蒸镀形成所述第二部分；其中，所述第二掩膜板上设置有遮挡所述第一部分位置及所述第一孔或第四孔位置的第二矩形遮挡板。
  17. 如权利要求12～16任一项所述的制备方法，其特征在于，通过第一次蒸镀形成的第一部分与通过第二次蒸镀形成的第二部分在拼接处搭接。
  18. 如权利要求12～16任一项所述的制备方法，其特征在于，所述在透明基板上制备薄膜晶体管层、阳极层及发光层；并且在蒸镀所述薄膜晶体管层、阳极层及发光层时形成第一孔；具体为：
    通过第三掩膜板依次在透明基板上形成所述薄膜晶体管层、阳极层及发光层；其中，所述第三掩膜板上设置有遮挡所述第一孔位置的板状结构。
  19. 如权利要求12～18任一项所述的制备方法，其特征在于，还包括：在所述透明基板与所述封装膜层上形成与第一孔或第四孔贯通的第二通孔。
  20. 一种移动终端，其特征在于，包括如权利要求1～11任一项所述的显示屏。
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